CN113382618A - Liquid cooling plate radiator - Google Patents
Liquid cooling plate radiator Download PDFInfo
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- CN113382618A CN113382618A CN202110917203.7A CN202110917203A CN113382618A CN 113382618 A CN113382618 A CN 113382618A CN 202110917203 A CN202110917203 A CN 202110917203A CN 113382618 A CN113382618 A CN 113382618A
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- 239000007788 liquid Substances 0.000 title claims abstract description 224
- 238000001816 cooling Methods 0.000 title abstract description 29
- 239000000110 cooling liquid Substances 0.000 claims abstract description 125
- 230000017525 heat dissipation Effects 0.000 claims abstract description 100
- 238000000926 separation method Methods 0.000 claims abstract description 75
- 239000002826 coolant Substances 0.000 claims description 46
- 239000000758 substrate Substances 0.000 claims description 34
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000009826 distribution Methods 0.000 abstract description 18
- 230000000694 effects Effects 0.000 abstract description 15
- 238000000034 method Methods 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 238000010586 diagram Methods 0.000 description 7
- 230000008901 benefit Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a liquid cooling plate radiator, which comprises a radiator body, wherein a cooling liquid channel is formed in the radiator body and used for cooling liquid to flow circularly; the cooling liquid flow channel comprises a plurality of heat dissipation sub-flow channels, and then a liquid separation and flow guide unit is arranged at the end part of the heat dissipation sub-flow channel corresponding to the inflow of the cooling liquid and is used for separating the cooling liquid and then flowing into the heat dissipation sub-flow channels, so that the distribution uniformity of the cooling liquid in the direction perpendicular to the flowing direction is improved; the technical problem that in the circulating flowing process of the cooling liquid, the cooling uniformity is poor due to the fact that the cooling liquid is unevenly distributed in the width direction of the cooling sub-flow channel is solved, the situation that the temperature difference of a local chip on the force calculation plate is large is effectively avoided, the technical effect of improving the overall heat dissipation uniformity of the force calculation plate is achieved, the structure is simple, and the cost is saved.
Description
Technical Field
The invention relates to the technical field of liquid cooling heat dissipation, in particular to a liquid cooling plate radiator.
Background
More and more electronic devices are currently cooled by liquid.
In the prior art, a common liquid cooling heat dissipation method is to use a liquid cooling plate to dissipate heat, for example, a computation force plate with heat generating elements such as chips is attached to one or both sides of the liquid cooling plate, then cooling liquid flows into the liquid cooling plate from an inlet, flows through a cooling liquid flow channel and then flows out from an outlet, and thus the liquid cooling heat dissipation of the computation force plate is realized through the circular flow.
However, for objective reasons, such as the distribution of the cooling liquid flow channels to the chips on the force computing board, the width of the cooling liquid flow channels in the prior art is often wide, which results in that the cooling liquid cannot be uniformly separated in the width direction of the flow channels after flowing in, thereby adversely affecting the heat dissipation uniformity of the force computing board as a whole.
Disclosure of Invention
In view of at least one aspect of the above technical problems, an embodiment of the present application provides a liquid-cooled plate radiator, which includes a radiator body, a cooling liquid channel is formed inside the radiator body, and the cooling liquid channel is used for cooling liquid to flow circularly; the cooling liquid flow channel comprises a plurality of heat dissipation sub-flow channels, and then a liquid separation and flow guide unit is arranged at the end part of the heat dissipation sub-flow channel corresponding to the inflow of the cooling liquid and is used for separating the cooling liquid and then flowing into the heat dissipation sub-flow channels, so that the distribution uniformity of the cooling liquid in the direction perpendicular to the flowing direction is improved;
or, for the above-mentioned technical problem that, for example, when the width of the heat dissipation sub-flow channel is wide, the coolant often cannot spread in the width direction of the heat dissipation sub-flow channel in time in the process of flowing through the heat dissipation sub-flow channel, in this embodiment, the liquid separation and flow guide unit is arranged at the coolant inlet end of the heat dissipation sub-flow channel, and the liquid separation and flow guide unit can perform the functions of liquid separation and flow guide on the coolant, so that the problem of uneven distribution of the coolant in the width direction of the flow channel is effectively improved, and the heat dissipation uniformity of the entire computing force plate is further improved; the technical problem that in the circulating flowing process of the cooling liquid, the cooling uniformity is poor due to the fact that the cooling liquid is unevenly distributed in the width direction of the cooling sub-flow channel is solved, the situation that the temperature difference of a local chip on the force calculation plate is large is effectively avoided, the technical effect of improving the overall heat dissipation uniformity of the force calculation plate is achieved, the structure is simple, and the cost is saved.
The embodiment of the application provides a liquid cooling plate radiator, liquid cooling plate radiator includes:
a heat sink body;
the cooling liquid flow channel is formed inside the radiator body and is used for allowing cooling liquid to flow circularly;
the liquid separation and flow guide unit is arranged in the cooling liquid flow passage;
the cooling liquid flow channel comprises a plurality of heat dissipation sub-flow channels, the end part of each heat dissipation sub-flow channel, corresponding to the inflow of the cooling liquid, is provided with the liquid separation and flow guide unit, and the liquid separation and flow guide unit is used for enabling the cooling liquid to flow into the heat dissipation sub-flow channels in a split manner.
In one embodiment, a liquid separating tip is formed at one end of the liquid separating and guiding unit facing the cooling liquid, and a first liquid separating and guiding surface and a second liquid separating and guiding surface extend from the liquid separating tip and branch towards the flow direction of the cooling liquid.
In one embodiment, one end of the liquid dividing and guiding unit, which faces away from the cooling liquid, is formed with a guiding tip, which is formed by converging a third liquid dividing and guiding surface and the first liquid dividing and guiding surface, with respect to the flowing direction of the cooling liquid, wherein the third liquid dividing and guiding surface extends from the end of the second liquid dividing and guiding surface along the axial direction of the heat dissipation sub-flow channel.
In one embodiment, the cooling liquid flow passage is formed in a radial direction,
the cooling liquid flow channel corresponding to the liquid separation tip is divided into two branches with a first width and a second width,
the cooling liquid flow channel corresponding to the flow guiding tip is divided into two branches with a third width and a fourth width,
wherein a ratio of the first width to the second width is equal to a ratio of the third width to the fourth width.
In one embodiment, at a corner of the end of the heat dissipation sub-flow channel, the liquid separation tip protrudes from an area encompassed by an extension line of the side wall of the heat dissipation sub-flow channel.
In one embodiment, the heat dissipation sub-flow channels extend along a first direction, a plurality of the heat dissipation sub-flow channels are arranged side by side and connected in series to form the cooling liquid flow channel, the end parts of adjacent heat dissipation sub-flow channels are communicated through a communication sub-flow channel along a second direction, and the second direction is perpendicular to the first direction;
the liquid separation and flow guide unit comprises a liquid separation and flow guide column with a right-angled triangle-shaped section, wherein the first liquid separation and flow guide surface corresponds to the hypotenuse of the right-angled triangle, and the second liquid separation and flow guide surface and the third liquid separation and flow guide surface respectively correspond to two right-angled sides of the right-angled triangle.
In one embodiment, a plurality of fin units are further arranged on the heat dissipation sub-flow channel, and each fin unit comprises a plurality of fins;
wherein the fins of adjacent fin units are arranged in a staggered manner along the flow direction of the cooling liquid.
In one embodiment, the heat sink body has a first carrying surface and a second carrying surface opposite to each other, the first carrying surface and/or the second carrying surface is used for carrying liquid-cooled electronic equipment, and the liquid-cooled electronic equipment includes a plurality of heating elements arranged in an array; wherein,
a preset gap is formed between the adjacent fin units, and the preset gap is corresponding to the surface of the radiator body and avoids the heating element;
in the fin units, the adjacent fins are arranged side by side at a preset interval, and the adjacent fin units are arranged in a staggered mode at half of the preset interval.
In one embodiment, the heat sink body includes a first substrate and a second substrate, which are oppositely disposed, the first substrate is provided with a first groove, and the second substrate is provided with a second groove;
the first groove and the second groove are in mirror symmetry, a first liquid separation flow guide column is arranged in the first groove, a second liquid separation flow guide column is arranged in the second groove, and the first liquid separation flow guide column and the second liquid separation flow guide column are in mirror symmetry;
when the first substrate and the second substrate are oppositely buckled, the first groove and the second groove form the cooling liquid flow channel, and meanwhile, the first liquid dividing and flow guiding column and the second liquid dividing and flow guiding column form the liquid dividing and flow guiding unit.
In one embodiment, a liquid inlet and a liquid outlet are formed at two ends of the cooling liquid flow channel respectively on the end surface of the radiator body, the liquid inlet is provided with a liquid inlet joint, and the liquid outlet is provided with a liquid outlet joint;
along the depth direction of the first groove, the height of the first liquid separation diversion column is lower than the depth of the first groove;
along the depth direction of the second groove, the height of the second liquid separation diversion column is lower than the depth of the second groove.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
the embodiment of the application provides a liquid cooling plate radiator, which comprises a radiator body, wherein a cooling liquid flow passage is formed in the radiator body and is used for circulating and flowing cooling liquid; the cooling liquid flow channel comprises a plurality of heat dissipation sub-flow channels, and then a liquid separation and flow guide unit is arranged at the end part of the heat dissipation sub-flow channel corresponding to the inflow of the cooling liquid and is used for separating the cooling liquid and then flowing into the heat dissipation sub-flow channels, so that the distribution uniformity of the cooling liquid in the direction perpendicular to the flowing direction is improved;
or, for the above-mentioned technical problem that, for example, when the width of the heat dissipation sub-flow channel is wide, the coolant often cannot spread in the width direction of the heat dissipation sub-flow channel in time in the process of flowing through the heat dissipation sub-flow channel, in this embodiment, the liquid separation and flow guide unit is arranged at the coolant inlet end of the heat dissipation sub-flow channel, and the liquid separation and flow guide unit can perform the functions of liquid separation and flow guide on the coolant, so that the problem of uneven distribution of the coolant in the width direction of the flow channel is effectively improved, and the heat dissipation uniformity of the entire computing force plate is further improved; the technical problem that in the circulating flowing process of the cooling liquid, the cooling uniformity is poor due to the fact that the cooling liquid is unevenly distributed in the width direction of the cooling sub-flow channel is solved, the situation that the temperature difference of a local chip on the force calculation plate is large is effectively avoided, the technical effect of improving the overall heat dissipation uniformity of the force calculation plate is achieved, the structure is simple, and the cost is saved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic cross-sectional view of a heat sink body according to an embodiment of the present disclosure.
Fig. 2 is a schematic structural view of the heat sink body shown in fig. 1 at another angle.
Fig. 3 is another schematic structural diagram of the liquid separation and flow guide unit in the embodiment of the present application.
Fig. 4 is a partially enlarged view of fig. 1.
Fig. 5 is a schematic structural diagram of the liquid separation and flow guide unit in the embodiment of the present application.
Fig. 6 is a schematic diagram of an arrangement structure of adjacent fin units in the embodiment of the present application.
Fig. 7 is a schematic structural diagram of the fin units adjacent to each other in the embodiment of the present application, which are arranged in a staggered manner by half of the predetermined pitch, wherein the flow direction of the cooling liquid is perpendicular to the paper surface.
Fig. 8 is a schematic structural diagram of the heat dissipation sub-flow channel after the fin unit is installed in the embodiment of the present application.
Fig. 9 is a perspective structural view of the heating element in the embodiment of the present application, in which the predetermined gap is avoided.
Fig. 10 is a schematic structural view illustrating mirror symmetry of the first substrate and the second substrate in the embodiment of the present application.
Fig. 11 is a schematic structural view illustrating the first substrate and the second substrate being fastened to each other in the embodiment of the present application.
Fig. 12 is a schematic structural view of the liquid-cooled electronic device after the liquid-cooled plate heat sink is installed in the embodiment of the present application.
Fig. 13 is a schematic structural view of the first fluid diversion column and the second fluid diversion column in the embodiment of the present application, which are fastened together and have a gap in the middle.
Fig. 14 is a schematic structural view of the clinch stud in the embodiment of the present application.
Fig. 15 is a view illustrating a case where the coolant flow channel is divided into two branches corresponding to the liquid dividing tip and the flow guiding tip of fig. 3.
Fig. 16 is a view illustrating a case where the coolant flow channel is divided into two branches corresponding to the liquid dividing tip and the flow guiding tip of fig. 4.
Wherein, the reference numbers:
10-a radiator body, 11-a first substrate, 12-a second substrate, 13-a liquid inlet, 14-a liquid outlet, 15-a liquid inlet joint, 16-a liquid outlet joint, 17-a rivet pressing stud,
111-a first groove, 112-a first liquid separation diversion column,
121-a second groove, 122-a second liquid-dividing diversion column,
20-a cooling liquid flow passage, 21-a heat dissipation sub-flow passage, 22-a communicating sub-flow passage,
211-the side walls of the mould,
30-liquid separation diversion unit, 31-liquid separation tip, 32-diversion tip, 33-first liquid separation diversion surface, 34-second liquid separation diversion surface, 35-third liquid separation diversion surface,
40-fin unit, 41-fin, 42-predetermined pitch, 43-predetermined gap,
50-liquid-cooled electronics, 51-heating element,
x-a first direction, Y-a second direction, Z-a third direction,
a-the width of the communicating sub-flow passage, b-the first width, c-the third width, d-the width of the heat dissipation sub-flow passage, e-the length of the second liquid diversion guide surface along the flow direction of the cooling liquid,
m1-first branch, M2-second branch, M3-third branch, M4-fourth branch.
Detailed Description
For better understanding of the above technical solutions, the following will describe in detail exemplary embodiments of the present application with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present application, and not all embodiments of the present application, and it should be understood that the present application is not limited by the exemplary embodiments described herein.
Referring to fig. 1 to 5, an embodiment of the present application first discloses a liquid-cooled plate radiator, which includes a radiator body 10, a coolant flow channel 20, and a liquid-dividing and flow-guiding unit 30; a coolant flow passage 20 is formed inside the radiator body 10, and the coolant flow passage 20 is used for circulating and flowing coolant; the liquid-separating and flow-guiding unit 30 is arranged in the cooling liquid flow passage 20; the cooling liquid flow channel 20 includes a plurality of heat dissipation sub-flow channels 21, the liquid-separating and flow-guiding unit 30 is disposed at an end of the heat dissipation sub-flow channel 21 corresponding to the inflow of the cooling liquid, and the liquid-separating and flow-guiding unit 30 is used for allowing the cooling liquid to flow into the heat dissipation sub-flow channels 21 in a divided manner.
Overall, what conveniently understand, liquid cooling plate radiator carries out the liquid cooling heat dissipation to liquid cooling electronic equipment like this: the liquid-cooled electronic equipment needs to be attached to the liquid-cooled plate radiator, then, cooling liquid with lower temperature flows into the liquid-cooled plate radiator from the liquid inlet, and exchanges heat with the liquid-cooled electronic equipment while flowing through the cooling liquid channel, namely, the liquid-cooled electronic equipment is subjected to liquid-cooled heat dissipation, the cooling liquid with higher temperature after absorbing heat flows out of the liquid-cooled plate radiator from the liquid outlet and releases heat outside, and the liquid-cooled heat dissipation is realized through the circulating flow; in addition, the liquid-cooled electronic device is, for example, a force computing board, and a heat generating element such as a chip is disposed on the force computing board, and considering the distribution of the chips on the force computing board and the maximum absorption of heat generated by the chips, the width of the coolant flow channel is often wide, which results in that the coolant cannot be uniformly spread or spread in the width direction when flowing through the coolant flow channel, or the temperature distribution of the coolant is not uniform in a cross section perpendicular to the flow direction of the coolant, so that a local temperature difference of the chips is large.
In view of the above situation, in this embodiment, a cooling liquid channel for circulating cooling liquid is provided in the liquid cooling plate radiator, and the cooling liquid channel includes a plurality of heat dissipation sub-channels, which is convenient to understand, and the cooling liquid flowing through the heat dissipation sub-channels plays a main role in dissipating heat of the chip on the computation force plate; then, the end part of the heat dissipation sub-flow channel, corresponding to the inflow of the cooling liquid, is provided with the liquid distribution and flow guide unit, and the liquid distribution and flow guide unit can generate a flow distribution effect on the cooling liquid before the cooling liquid flows into the heat dissipation sub-flow channel, so that the uniformity of the distribution of the cooling liquid in the width direction of the heat dissipation sub-flow channel is promoted, the condition that the temperature difference of the local chip is larger is avoided, and the heat dissipation uniformity is improved.
It should be noted that, on one hand, please refer to fig. 1 and 2, for example, a plurality of heat dissipation sub-channels may be arranged side by side and then connected in series to form a cooling liquid channel, and the liquid separation and flow guide unit is required to be arranged at an end of the heat dissipation sub-channel corresponding to the inflow of the cooling liquid, and at this time, a plurality of the liquid separation and flow guide units are distributed at two ends of the heat sink body and are arranged at intervals at each end; or, on the other hand, it can be understood that the plurality of heat dissipation sub-channels are arranged side by side and then connected in parallel to form a cooling liquid channel, and the liquid distribution and flow guide unit is arranged at the end part of the heat dissipation sub-channel corresponding to the inflow of the cooling liquid, and at this time, the plurality of liquid distribution and flow guide units are distributed at one end of the radiator body. In addition, it is convenient to understand that, in order to achieve the effect of dividing the cooling liquid, the liquid-dividing and flow-guiding unit may be in various forms according to the layout of the plurality of heat dissipation sub-flow channels (see fig. 3, fig. 4, or fig. 5), which will be described in detail below and will not be described herein again.
The embodiment of the application provides a liquid cooling plate radiator, which comprises a radiator body, wherein a cooling liquid flow passage is formed in the radiator body and is used for circulating and flowing cooling liquid; the cooling liquid flow channel comprises a plurality of heat dissipation sub-flow channels, and then a liquid separation and flow guide unit is arranged at the end part of the heat dissipation sub-flow channel corresponding to the inflow of the cooling liquid and is used for separating the cooling liquid and then flowing into the heat dissipation sub-flow channels, so that the distribution uniformity of the cooling liquid in the direction perpendicular to the flowing direction is improved;
or, for the above-mentioned technical problem that, for example, when the width of the heat dissipation sub-flow channel is wide, the coolant often cannot spread in the width direction of the heat dissipation sub-flow channel in time in the process of flowing through the heat dissipation sub-flow channel, in this embodiment, the liquid separation and flow guide unit is arranged at the coolant inlet end of the heat dissipation sub-flow channel, and the liquid separation and flow guide unit can perform the functions of liquid separation and flow guide on the coolant, so that the problem of uneven distribution of the coolant in the width direction of the flow channel is effectively improved, and the heat dissipation uniformity of the entire computing force plate is further improved; the technical problem that in the circulating flowing process of the cooling liquid, the cooling uniformity is poor due to the fact that the cooling liquid is unevenly distributed in the width direction of the cooling sub-flow channel is solved, the situation that the temperature difference of a local chip on the force calculation plate is large is effectively avoided, the technical effect of improving the overall heat dissipation uniformity of the force calculation plate is achieved, the structure is simple, and the cost is saved.
In a possible embodiment, referring to fig. 1 and 3, relative to the flow direction of the cooling liquid, one end of the liquid separating and guiding unit 30 facing the cooling liquid is formed with a liquid separating tip 31, and the liquid separating and guiding unit 30 branches from the liquid separating tip 31 and extends with a first liquid separating and guiding surface 33 and a second liquid separating and guiding surface 34 towards the flow direction of the cooling liquid.
Specifically, this divide liquid water conservancy diversion unit to meet the one end of coolant liquid and be formed with and divide liquid pointed end to there are first branch liquid water conservancy diversion face and second branch liquid water conservancy diversion face from dividing the extension that liquid pointed end is the angle, like this, divide liquid water conservancy diversion face through two that extend from dividing the branch of liquid pointed end and can realize the reposition of redundant personnel effect to the coolant liquid.
It will be understood that fig. 1 and 3 are plan views, and the depth direction of the heat dissipation sub-flow channel (i.e. perpendicular to the plane of fig. 1 and 3) is set as the third direction Z, then the liquid dividing tip, the first liquid dividing guide surface and the second liquid dividing guide surface should extend along the third direction to form a wedge shape.
In an embodiment, with continued reference to fig. 1 and 3, the end of the liquid-dividing and guiding unit 30 facing away from the coolant is formed with a guiding tip 32 with respect to the flowing direction of the coolant, the guiding tip 32 is formed by converging a third liquid-dividing and guiding surface 35 and a first liquid-dividing and guiding surface 33, wherein the third liquid-dividing and guiding surface 35 extends from the end of the second liquid-dividing and guiding surface 34 along the axial direction of the heat-dissipating sub-flow channel 21.
Specifically, a diversion tip is formed at one end of the liquid-dividing diversion unit back to the cooling liquid, and a third liquid-dividing diversion surface and the first liquid-dividing diversion surface extend from the diversion tip at an angle; that is, the section of the liquid-separating and guiding unit perpendicular to the third direction is, for example, a triangle, the long side of the triangle corresponds to the first liquid-separating and guiding surface, and then the two short sides of the triangle correspond to the second liquid-separating and guiding surface and the third liquid-separating and guiding surface, respectively.
Like this, all set to a wedge pointed end and third branch liquid water conservancy diversion face along the axial direction extension of heat dissipation sub-runner through the both ends that will divide liquid water conservancy diversion unit, on the one hand, this branch liquid pointed end and the water conservancy diversion pointed end that are wedge do benefit to the reposition of redundant personnel and the water conservancy diversion of coolant liquid respectively, and on the other hand, the third branch liquid water conservancy diversion face extends along the axial direction of heat dissipation sub-runner and can guarantee can not form the vacuum region of coolant liquid at the income liquid end of heat dissipation sub-runner, has effectively improved the homogeneity of coolant liquid on heat dissipation sub-runner width.
It is convenient to understand that the angle between the first liquid dividing and guiding surface and the second liquid dividing and guiding surface, and the angle between the first liquid dividing and guiding surface and the third liquid dividing and guiding surface are limited by various specifications, such as the length of the liquid dividing and guiding unit, the width of the heat dissipation sub-flow channel, the size of the corner of the cooling liquid flow channel, and the like.
It is convenient to understand that the above embodiments describe the liquid separating tip and the flow guiding tip of the liquid separating and flow guiding unit respectively, and the shape between the liquid separating tip and the flow guiding tip should be determined according to actual needs (for example, the angle of the corner, etc.), for example, referring to fig. 1, when the corner is a right angle, the second liquid separating and flow guiding surface of the liquid separating and flow guiding unit is perpendicular to the third liquid separating and flow guiding surface, or referring to fig. 3, when the corner is an obtuse angle, the included angle between the second liquid separating and flow guiding surface of the liquid separating and flow guiding unit is an obtuse angle.
In addition, according to actual needs, at least the first liquid dividing guiding surface 33 and the second liquid dividing guiding surface 34 may be an arc-shaped guiding surface, for example, referring to fig. 5, in which case the two arc-shaped liquid dividing guiding surfaces forming the liquid dividing tip can also achieve the liquid dividing effect.
Generally speaking, the end of the heat dissipation sub-flow channel corresponding to the inflow of the cooling liquid is a corner of the cooling liquid flow channel, and the liquid separation and flow guide unit is arranged at the corner; moreover, the liquid separating tip of the liquid separating and guiding unit is to face the cooling liquid, and then the guiding tip of the liquid separating and guiding unit is to be positioned near the end face of the heat dissipating sub-runner, so that a better flow dividing effect can be generated, namely, the guiding tip of the liquid separating and guiding unit cannot excessively protrude into the heat dissipating sub-runner or excessively far away from the end face of the heat dissipating sub-runner, and the heat dissipating tip is convenient to understand, and because the surface of the radiator body corresponding to the guiding tip is usually not provided with a heating element, when the guiding tip excessively protrudes into the heat dissipating sub-runner, the heat dissipating area of the heat dissipating sub-runner corresponding to the surface of the radiator body can be reduced, and further the area of the radiator body on which the heating element can be installed is reduced; when the diversion tip is too far away from the end face of the discrete hot runner, the diversion tip cannot generate the diversion effect on the cooling liquid which is about to flow into the discrete hot runner.
In one embodiment, the coolant flow channel 20 corresponding to the liquid distribution tip 31 is divided into two branches of a first width and a second width, and the coolant flow channel 20 corresponding to the flow guide tip 32 is divided into two branches of a third width and a fourth width along the radial direction of the coolant flow channel, wherein the ratio of the first width to the second width is equal to the ratio of the third width to the fourth width.
As can be easily understood by referring to fig. 3 to 5, and fig. 15 and 16, at the corner of the coolant flow channel, the wedge-shaped liquid separation tip divides the coolant flow channel at the position thereof into a first branch M1 at the outer side and a second branch M2 at the inner side, and the widths of the first branch M1 and the second branch M2 are respectively the first width and the second width; similarly, the wedge-shaped flow guide tip divides the cooling liquid channel at the position of the wedge-shaped flow guide tip into a third branch M3 at the outer side and a fourth branch M4 at the inner side, and the widths of the third branch M3 and the fourth branch M4 are respectively a third width and a fourth width; wherein, the ratio of the widths of the first branch M1 and the second branch M2 is equal to the ratio of the widths of the third branch M3 and the fourth branch M4, that is, the ratio of the first width to the second width is equal to the ratio of the third width to the fourth width; that is, the liquid dividing tip and the flow guiding tip divide the coolant flow passage in the same proportion in the radial direction of the coolant flow passage (simultaneously radially inward or simultaneously radially outward), thereby ensuring the distribution uniformity of the coolant.
For example, referring to fig. 4, the liquid dividing tip divides the cooling liquid flow channel at the position thereof into an outer first branch M1 and an inner second branch M2, and the width ratio of the first branch M1 to the second branch M2 is 1/3, i.e., b/(a-b) =1/3, so that the liquid guiding tip also divides the cooling liquid flow channel at the position thereof (i.e., the heat dissipation sub-flow channel) into an outer third branch M3 and an inner fourth branch M4, and the width ratio of the third branch M3 to the fourth branch M4 is 1/3, i.e., c/(d-c) = 1/3.
In one embodiment, at the corner of the end of the heat dissipation sub-flow channel 21, the liquid separation tip 31 protrudes from the area encompassed by the extension line of the sidewall 211 of the heat dissipation sub-flow channel 21.
Please specifically refer to fig. 3 or fig. 4, where the dotted line in fig. 3 and fig. 4 is an extension line of the side wall of the heat dissipation sub-flow channel, which is convenient to understand, at the corner of the end of the heat dissipation sub-flow channel, the liquid separation tip of the liquid separation and flow guide unit should protrude out of the area included by the extension line of the side wall of the heat dissipation sub-flow channel; in other words, the liquid-separating tip of the liquid-separating and flow-guiding unit protrudes from the region included by the heat-dissipating sub-flow channel and the extension line thereof, and is not covered by the region, so that the cooling liquid can be ensured to be divided before flowing into the next heat-dissipating sub-flow channel.
For example, please refer to fig. 4, i.e., e + c is larger than d.
In one embodiment, the heat dissipation sub-flow channels 21 extend along a first direction X, a plurality of heat dissipation sub-flow channels 21 are arranged side by side and connected in series to form the cooling liquid flow channel 20, ends of adjacent heat dissipation sub-flow channels 21 are communicated with each other through a communication sub-flow channel 22 along a second direction Y, and the second direction Y is perpendicular to the first direction X; the liquid separation and diversion unit 30 includes a liquid separation and diversion column with a right triangle cross section, wherein the first liquid separation and diversion surface 33 corresponds to the hypotenuse of the right triangle, and the second liquid separation and diversion surface 34 and the third liquid separation and diversion surface 35 correspond to the two right-angled sides of the right triangle respectively.
In this embodiment, referring to fig. 1 and 4, in particular, one of the cooling liquid flow passages is generally configured as: the heat dissipation sub-flow channels extend in a linear manner along the first direction, the plurality of heat dissipation sub-flow channels are arranged side by side, and then the heads and the tails of the adjacent heat dissipation sub-flow channels are communicated through communicating sub-flow channels along the second direction; namely, the corner at the end part of the heat dissipation sub-flow passage is of a right-angle structure; at the moment, the section of the liquid separation flow guide column perpendicular to the third direction is a right-angled triangle, the hypotenuse of the right-angled triangle corresponds to the first liquid separation flow guide surface, and two right-angled sides of the right-angled triangle respectively correspond to the second liquid separation flow guide surface and the third liquid separation flow guide surface; in addition, two ends of the hypotenuse of the right triangle respectively correspond to a liquid separation tip and a flow guide tip, the liquid separation tip should protrude out of an area included by the heat dissipation sub-flow passage and the extension line of the heat dissipation sub-flow passage, the flow guide tip should be located near the end of the heat dissipation sub-flow passage, one right angle edge of the right triangle extends along the axial direction of the heat dissipation sub-flow passage, namely along the first direction, and the other right angle edge of the right triangle extends along the second direction; like this, this divide liquid water conservancy diversion post not only can realize the reposition of redundant personnel and the direction to the coolant liquid, can also guarantee not have the coolant liquid to be detained in right angle corner.
It is convenient to understand that the direction of the dotted arrow in fig. 1 to 5 indicates the flow direction of the cooling liquid.
The structure of the liquid inlet end of the heat dissipation sub-flow channel in the liquid cooling plate radiator of the present embodiment is described above, and the structure between the liquid inlet end and the liquid outlet end of the heat dissipation sub-flow channel will be described in detail below.
In a possible embodiment, a plurality of fin units 40 are further disposed on the heat dissipation sub-flow channel 21, and each fin unit 40 includes a plurality of fins 41; wherein the fins 41 of adjacent fin units 40 are arranged in a staggered manner in the flow direction of the cooling liquid.
Referring to fig. 6, 7 and 8, in order to increase the heat exchange area or the contact area with the cooling liquid, a plurality of fin units are disposed on the heat dissipation sub-flow channels in the present embodiment, and each fin unit includes a plurality of fins extending along the first direction X; and further, along the flowing direction of the cooling liquid, the fin units which are adjacent in the front and the back are arranged in a staggered mode.
That is, referring to fig. 7, the view is along the flowing direction of the cooling liquid, and the fin of the next fin unit corresponds to a certain position between two fins of the previous fin unit, which is convenient to understand, so that when the cooling liquid flows, the fin units staggered front and back can increase the disturbance of the cooling liquid in the heat dissipation sub-flow channel, thereby improving the intensity of convective heat transfer, enhancing the heat transfer effect between the cooling liquid and the fin, and improving the liquid cooling heat dissipation efficiency.
It is convenient to understand that the fin unit can adopt a snap-fit type fin or a folding type fin.
In one embodiment, the heat sink body 10 has a first carrying surface and a second carrying surface opposite to each other, the first carrying surface and/or the second carrying surface is used for carrying the liquid-cooled electronic device 50, and the liquid-cooled electronic device 50 includes a plurality of heating elements 51 arranged in an array; the adjacent fin units 40 have a predetermined gap 43 therebetween, the predetermined gap 43 faces the surface of the heat sink body 10 away from the heating element 51, the adjacent fins 41 are arranged side by side at a predetermined interval 42, and the adjacent fin units 40 are arranged at a position offset by half of the predetermined interval 42.
Specifically, referring to fig. 9, in the heat dissipation sub-flow channel, in order to ensure that the fin units staggered front and back generate disturbance to the cooling liquid, a predetermined gap 43 should be formed between adjacent fin units; moreover, the disturbance of the cooling liquid at the predetermined gap 43 may cause different cooling effects at the surface positions of the heat sink body corresponding to the predetermined gap and the fin, respectively, so that, in order to ensure uniformity of liquid-cooled heat dissipation of the liquid-cooled electronic apparatus, the predetermined gap 43 should avoid the heat generating element 51 on the liquid-cooled electronic apparatus, for example, no chip or the like should be disposed at the surface area of the liquid-cooled plate heat sink corresponding to the predetermined gap.
In addition, for the above-mentioned staggered arrangement of the fins of the adjacent fin units, specifically, for example, when the fins on the fin units are arranged side by side at the predetermined interval 42, the adjacent fin units may be arranged at a staggered arrangement of half the predetermined interval 42, that is, the view field is along the flow direction of the cooling liquid, and the fin of the subsequent fin unit corresponds to the middle position of the two fins of the previous fin unit, so that a better flow disturbing effect can be achieved.
In one possible embodiment, the heat sink body 10 includes a first substrate 11 and a second substrate 12 disposed opposite to each other, the first substrate 11 is provided with a first groove 111, and the second substrate 12 is provided with a second groove 121; the first groove 111 and the second groove 121 are in mirror symmetry, a first liquid separation diversion column 112 is arranged in the first groove 111, a second liquid separation diversion column 122 is arranged in the second groove 121, and the first liquid separation diversion column 112 and the second liquid separation diversion column 122 are in mirror symmetry; so that when the first substrate 11 and the second substrate 12 are oppositely buckled, the first groove 111 and the second groove 121 form the cooling liquid channel 20, and the first liquid-dividing flow-guiding column 112 and the second liquid-dividing flow-guiding column 122 form the liquid-dividing flow-guiding unit 30.
In this embodiment, referring to fig. 10 and 11, the heat sink body is formed by oppositely fastening the first substrate and the second substrate and then welding the first substrate and the second substrate, that is, the first groove on the first substrate and the second groove on the second substrate are arranged in mirror symmetry, so that when the two substrates are fastened, the two grooves form the cooling liquid channel.
Similarly, this divide liquid water conservancy diversion unit to divide liquid water conservancy diversion post and second to divide liquid water conservancy diversion post lock to form, promptly, first branch liquid water conservancy diversion post sets up at first recess, and the second divides liquid water conservancy diversion post to set up at the second recess, and two divide liquid water conservancy diversion posts and position all are mirror symmetry.
Compared with the prior art in which the radiator body is a monolithic entity and the cooling liquid channel is formed by extrusion and the like, the cooling liquid channel in the embodiment can be formed by punching the groove on the substrate and then buckling, so that the weight of the radiator body is greatly reduced, and the radiator is convenient to use.
In addition, the other surfaces of the first substrate and the second substrate, on which the grooves are not punched, are the bearing surfaces and are used for installing liquid-cooled electronic equipment, such as a force calculation plate and the like; specifically, please refer to fig. 12 and 14, a press-riveting stud 17 may be disposed on the bearing surface, and then the force calculation plate fixing hole is fixed on the press-riveting stud by a press-riveting screw.
In one embodiment, a liquid inlet 13 and a liquid outlet 14 are respectively formed at two ends of the cooling liquid flow channel 20 on an end surface of the heat sink body 10, the liquid inlet 13 is provided with a liquid inlet joint 15, and the liquid outlet 14 is provided with a liquid outlet joint 16; along the depth direction of the first groove 111, the height of the first liquid separation diversion column 112 is lower than the depth of the first groove 111; along the depth direction of the second groove 121, the height of the second diversion column 122 is lower than the depth of the second groove 121.
In this embodiment, in one aspect, referring to fig. 10 and 11, a liquid inlet and a liquid outlet are respectively formed at two ends of the cooling liquid flow channel, and the liquid inlet and the liquid outlet are formed on, for example, a side wall between two carrying surfaces of the heat sink body, and then a liquid inlet joint and a liquid outlet joint are respectively installed at the liquid inlet and the liquid outlet for connecting with an external pipeline.
On the other hand, referring to fig. 13, the heights of the first liquid-separating flow-guiding column and the second liquid-separating flow-guiding column are lower than the depths of the first groove and the second groove, so that when the two liquid-separating flow-guiding columns are buckled and butted, a gap is left between the two liquid-separating flow-guiding columns along the third direction, so that cooling liquid can flow through the gap, and the generation of large resistance to the flow of the cooling liquid is prevented.
The foregoing describes the general principles of the present application in conjunction with specific embodiments, however, it is noted that the advantages, effects, etc. mentioned in the present application are merely examples and are not limiting, and they should not be considered essential to the various embodiments of the present application. Furthermore, the foregoing disclosure of specific details is for the purpose of illustration and description and is not intended to be limiting, since the foregoing disclosure is not intended to be exhaustive or to limit the disclosure to the precise details disclosed.
The block diagrams of devices, apparatuses, systems referred to in this application are only given as illustrative examples and are not intended to require or imply that the connections, arrangements, configurations, etc. must be made in the manner shown in the block diagrams. These devices, apparatuses, devices, systems may be connected, arranged, configured in any manner, as will be appreciated by those skilled in the art. Words such as "including," "comprising," "having," and the like are open-ended words that mean "including, but not limited to," and are used interchangeably therewith. The words "or" and "as used herein mean, and are used interchangeably with, the word" and/or, "unless the context clearly dictates otherwise. The word "such as" is used herein to mean, and is used interchangeably with, the phrase "such as but not limited to".
It should also be noted that in the devices, apparatuses, and methods of the present application, the components or steps may be decomposed and/or recombined. These decompositions and/or recombinations are to be considered as equivalents of the present application.
The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the application to the form disclosed herein. While a number of exemplary aspects and embodiments have been discussed above, those of skill in the art will recognize that certain variations, modifications, alterations, additions and sub-combinations thereof are encompassed within the scope of the invention.
Claims (10)
1. A liquid-cooled panel heat sink, comprising:
a radiator body (10);
a coolant flow channel (20) formed inside the radiator body (10), the coolant flow channel (20) being used for circulating coolant;
the liquid separation and flow guide unit (30) is arranged in the cooling liquid flow channel (20);
the cooling liquid flow channel (20) comprises a plurality of heat dissipation sub-flow channels (21), the end part, corresponding to the inflow of the cooling liquid, of each heat dissipation sub-flow channel (21) is provided with the liquid separation and flow guide unit (30), and the liquid separation and flow guide unit (30) is used for enabling the cooling liquid to flow into the heat dissipation sub-flow channels (21) in a split mode.
2. The cold plate heat sink as recited in claim 1, wherein one end of said liquid separating and guiding unit (30) facing said cooling liquid is formed with a liquid separating tip (31) opposite to the flowing direction of said cooling liquid, and said liquid separating and guiding unit (30) is bifurcated from said liquid separating tip (31) and toward the flowing direction of said cooling liquid to form a first liquid separating and guiding surface (33) and a second liquid separating and guiding surface (34).
3. The liquid cold plate heat sink according to claim 2, wherein an end of the liquid dividing and guiding unit (30) facing away from the cooling liquid is formed with a guiding tip (32) with respect to a flowing direction of the cooling liquid, the guiding tip (32) is formed by a third dividing and guiding surface (35) and the first dividing and guiding surface (33) converging, wherein the third dividing and guiding surface (35) extends from an end of the second dividing and guiding surface (34) along an axial direction of the heat dissipating sub-flow channel (21).
4. A cold plate radiator according to claim 3, wherein, in the radial direction of said coolant flow channels (20),
the coolant flow channel (20) at the location corresponding to the dividing tip (31) is divided into two branches of a first width and a second width,
the coolant channel (20) at the location corresponding to the flow guide tip (32) is divided into two branches of a third width and a fourth width,
wherein a ratio of the first width to the second width is equal to a ratio of the third width to the fourth width.
5. A liquid-cooled plate radiator according to claim 3, wherein said dispensing tip (31) protrudes at the corner of the end of said heat-dissipating sub-flow channel (21) beyond the area encompassed by the extension of the side wall (211) of said heat-dissipating sub-flow channel (21).
6. A liquid cold plate heat sink according to claim 3, wherein said heat dissipating sub-flow channels (21) extend in a first direction, a plurality of said heat dissipating sub-flow channels (21) are arranged side by side and connected in series to form said cooling liquid flow channel (20), and ends of adjacent heat dissipating sub-flow channels (21) are connected by a connecting sub-flow channel (22) in a second direction, said second direction being perpendicular to said first direction;
the liquid separation and flow guide unit (30) comprises a liquid separation and flow guide column with a right-angled triangle-shaped cross section, wherein the first liquid separation and flow guide surface (33) corresponds to the hypotenuse of the right-angled triangle, and the second liquid separation and flow guide surface (34) and the third liquid separation and flow guide surface (35) correspond to two right-angled sides of the right-angled triangle respectively.
7. The liquid cold plate heat sink of claim 1, wherein a plurality of fin units (40) are further provided on said heat sink sub-flow passage (21), said fin units (40) comprising a plurality of fins (41);
wherein the fins (41) of adjacent fin units (40) are arranged in a staggered manner in the flow direction of the cooling liquid.
8. The liquid-cooled plate heat sink of claim 7, wherein the heat sink body (10) has opposing first and second bearing surfaces, the first and/or second bearing surfaces for bearing liquid-cooled electronic equipment (50), the liquid-cooled electronic equipment (50) comprising a plurality of heat generating elements (51) arranged in an array; wherein,
a predetermined gap (43) is formed between the adjacent fin units (40), and the predetermined gap (43) avoids the heating element (51) corresponding to the surface of the radiator body (10);
in the fin units (40), the adjacent fins (41) are arranged side by side at a predetermined interval (42), and the adjacent fin units (40) are arranged in a staggered manner at half of the predetermined interval (42).
9. The liquid cold plate heat sink of claim 1, wherein said heat sink body (10) comprises a first substrate (11) and a second substrate (12) disposed opposite to each other, said first substrate (11) having a first recess (111) disposed thereon, said second substrate (12) having a second recess (121) disposed thereon;
the first groove (111) and the second groove (121) are in mirror symmetry, a first liquid separation and flow guide column (112) is arranged in the first groove (111), a second liquid separation and flow guide column (122) is arranged in the second groove (121), and the first liquid separation and flow guide column (112) and the second liquid separation and flow guide column (122) are in mirror symmetry;
when the first substrate (11) and the second substrate (12) are oppositely buckled, the first groove (111) and the second groove (121) form the cooling liquid flow channel (20), and the first liquid separation flow guide column (112) and the second liquid separation flow guide column (122) form the liquid separation flow guide unit (30).
10. The liquid-cooled plate radiator of claim 9, wherein a liquid inlet (13) and a liquid outlet (14) are formed at two ends of the cooling liquid flow channel (20) on the end surface of the radiator body (10), respectively, the liquid inlet (13) is provided with a liquid inlet joint (15), and the liquid outlet (14) is provided with a liquid outlet joint (16);
the height of the first liquid diversion column (112) is lower than the depth of the first groove (111) along the depth direction of the first groove (111);
the height of the second diversion flow guiding column (122) is lower than the depth of the second groove (121) along the depth direction of the second groove (121).
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Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1892414A (en) * | 2005-07-04 | 2007-01-10 | 日本电气视象技术株式会社 | Once-through forced air-cooled heat sink for a projection display apparatus |
CN105392330A (en) * | 2015-11-11 | 2016-03-09 | 中冶南方(武汉)自动化有限公司 | Liquid heat dissipation structure for motor controller |
US20160327351A1 (en) * | 2012-11-19 | 2016-11-10 | Acer Incorporated | Fluid heat exchange apparatus |
CN205961666U (en) * | 2016-08-17 | 2017-02-15 | 杭州昆海信息技术有限公司 | Communication equipment |
CN106919236A (en) * | 2015-12-24 | 2017-07-04 | 上海航天科工电器研究院有限公司 | A kind of cold plate module cooling system |
CN207589406U (en) * | 2017-12-20 | 2018-07-06 | 上海奉天电子股份有限公司 | Vehicular charger heat dissipation waterway structure |
CN110690532A (en) * | 2019-10-24 | 2020-01-14 | 桑顿新能源科技(长沙)有限公司 | Liquid cooling plate |
CN210444699U (en) * | 2019-06-26 | 2020-05-01 | 上海磐动电气科技有限公司 | Direct current exchanger and radiating assembly thereof |
CN211054942U (en) * | 2019-12-10 | 2020-07-21 | 大明电子有限公司 | Vehicle-mounted charger capable of dissipating heat rapidly |
CN211240606U (en) * | 2019-12-20 | 2020-08-11 | 杭州中豪电动科技有限公司 | Motor control system cooling water route reposition of redundant personnel structure |
CN212380413U (en) * | 2020-04-16 | 2021-01-19 | 宁波普瑞均胜汽车电子有限公司 | High-power chip radiator of power module |
CN212659535U (en) * | 2020-07-15 | 2021-03-05 | 安徽祥博传热科技有限公司 | High-power semiconductor device high-efficiency liquid cooling plate |
CN213878204U (en) * | 2020-12-18 | 2021-08-03 | 欣旺达电动汽车电池有限公司 | Cooling structure and battery package |
-
2021
- 2021-08-11 CN CN202110917203.7A patent/CN113382618A/en active Pending
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1892414A (en) * | 2005-07-04 | 2007-01-10 | 日本电气视象技术株式会社 | Once-through forced air-cooled heat sink for a projection display apparatus |
US20160327351A1 (en) * | 2012-11-19 | 2016-11-10 | Acer Incorporated | Fluid heat exchange apparatus |
CN105392330A (en) * | 2015-11-11 | 2016-03-09 | 中冶南方(武汉)自动化有限公司 | Liquid heat dissipation structure for motor controller |
CN106919236A (en) * | 2015-12-24 | 2017-07-04 | 上海航天科工电器研究院有限公司 | A kind of cold plate module cooling system |
CN205961666U (en) * | 2016-08-17 | 2017-02-15 | 杭州昆海信息技术有限公司 | Communication equipment |
CN207589406U (en) * | 2017-12-20 | 2018-07-06 | 上海奉天电子股份有限公司 | Vehicular charger heat dissipation waterway structure |
CN210444699U (en) * | 2019-06-26 | 2020-05-01 | 上海磐动电气科技有限公司 | Direct current exchanger and radiating assembly thereof |
CN110690532A (en) * | 2019-10-24 | 2020-01-14 | 桑顿新能源科技(长沙)有限公司 | Liquid cooling plate |
CN211054942U (en) * | 2019-12-10 | 2020-07-21 | 大明电子有限公司 | Vehicle-mounted charger capable of dissipating heat rapidly |
CN211240606U (en) * | 2019-12-20 | 2020-08-11 | 杭州中豪电动科技有限公司 | Motor control system cooling water route reposition of redundant personnel structure |
CN212380413U (en) * | 2020-04-16 | 2021-01-19 | 宁波普瑞均胜汽车电子有限公司 | High-power chip radiator of power module |
CN212659535U (en) * | 2020-07-15 | 2021-03-05 | 安徽祥博传热科技有限公司 | High-power semiconductor device high-efficiency liquid cooling plate |
CN213878204U (en) * | 2020-12-18 | 2021-08-03 | 欣旺达电动汽车电池有限公司 | Cooling structure and battery package |
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