CN113388303A - Anti-shielding conductive coating applied to 5G consumer electronics equipment - Google Patents
Anti-shielding conductive coating applied to 5G consumer electronics equipment Download PDFInfo
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- CN113388303A CN113388303A CN202110742568.0A CN202110742568A CN113388303A CN 113388303 A CN113388303 A CN 113388303A CN 202110742568 A CN202110742568 A CN 202110742568A CN 113388303 A CN113388303 A CN 113388303A
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- silver
- conductive
- shielding
- conductive coating
- copper powder
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
- C09D5/10—Anti-corrosive paints containing metal dust
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention belongs to the field of coatings. An anti-shielding conductive coating applied to 5G consumer electronic equipment comprises the following components in percentage by mass: 10-40% of epoxy modified hydroxyl acrylic resin, 5-10% of aliphatic isocyanate curing agent, 10-20% of silver-coated copper powder, 0.1-1% of superconducting silver paste, 1-5% of persalt lithium salt conductive agent, 1-5% of rare earth modified nano superconducting inorganic material, 1-5% of high polymer conductive material and the balance of organic solvent. The paint has good base material adhesion, weather resistance, chemical resistance and corrosion resistance, less silver-coated copper powder consumption, low cost and stable and durable conductive performance of the conductive material.
Description
Technical Field
The invention belongs to the technical field of coatings, and particularly relates to an anti-shielding conductive coating applied to 5G consumer electronics equipment.
Background
The improvement of single machine usage and the upgrading of technical process promote the continuous growth of market space and the upgrading of 5G consumer electronic parts, the performances of 5G consumer electronic such as transmission rate, frequency, signal intensity and the like are remarkably improved, higher requirements are provided for the electromagnetic shielding and electric conduction performance of the 5G consumer electronic parts from a core chip to a radio frequency device and from the body material to an internal structure, and the electromagnetic shielding and electric conduction products present the development trends of diversification, process upgrading and single machine usage improvement.
The traditional shielding-proof conductive material is a metal conductor, different metals have different conductivities, the metal silver has the best conductivity, and copper and silver are used secondly. Gold is expensive and silver and copper are generally the conductive materials of choice. However, copper belongs to transition metal elements, has chemical properties and is very easy to oxidize at normal temperature in air, and particularly copper powder with large specific surface area has high oxidation speed. The oxidation mechanism of the copper powder is 2Cu + O22CuO or 4Cu + O2＝2Cu2O, the resulting copper oxide is not electrically conductive, which results in a substantial reduction in the conductive capacity of copper. Therefore, the copper-based metal powder is required to be used as a conductive medium, and the surface treatment is required. The copper powder is subjected to anti-oxidation treatment, a protective covering layer is formed on the surface of the copper powder, the covering layer is stable in property and not easy to oxidize, the copper powder can be prevented from contacting with corrosive media, the copper powder is prevented from being oxidized, and meanwhile, the material is ensured to have good conductivity in the using process. The copper powder is coated with the metallic silver, so that the material is not easy to oxidize and has good conductivity. The silver-coated copper powder serving as a traditional conductive material has high specific gravity, is not easy to disperse in a coating and is easy to settle. If the coating silver layer is damaged in the production and use processes, the copper powder is oxidized, and the conductivity of the material is reduced. The magnetic shielding conductive coating is obtained by adding a filler with magnetic shielding performance into the coating. The added filler has large particles and high filling density, the durability and stability of the conductive material are poor, and the prepared magnetic shielding conductive coating has poor mechanical property, conductivity and corrosion resistance.
Disclosure of Invention
The invention aims to solve the technical problem of providing an anti-shielding conductive coating applied to 5G consumer electronic equipment, which has good substrate adhesion, weather resistance, chemical resistance and corrosion resistance, small silver-coated copper powder consumption, low cost and stable and durable conductive performance of a conductive material.
The technical scheme of the invention is as follows:
an anti-shielding conductive coating applied to 5G consumer electronic equipment comprises the following components in percentage by mass: 10-40% of epoxy modified hydroxyl acrylic resin, 5-10% of aliphatic isocyanate curing agent, 10-20% of silver-coated copper powder, 0.1-1% of superconducting silver paste, 1-5% of persalt lithium salt conductive agent, 1-5% of rare earth modified nano superconducting inorganic material, 1-5% of high polymer conductive material and the balance of organic solvent.
Further, the silver content of the silver-coated copper powder is 1-5%. Compared with the silver-coated copper powder with high silver content, the silver-coated copper powder with low silver content has low production cost, but has poor oxidation resistance and conductivity.
Furthermore, the particle size of the superconducting silver paste is 20-50 nm. The superconducting silver paste adopts simple substance silver as a raw material, is processed into nano silver paste with small particle size by a nano dispersion technology, can well disperse nano silver ions in a polar solvent, has good stability, conductivity and corrosion resistance, and can endow the coating with extremely strong conductive effect by adding a small amount of the superconducting silver paste. After the coating is coated on a base material, the wettability of the coating on the base material can be improved through the quantum size effect and the surface effect of nano silver ions on a liquid-solid interface, and the base material adhesive force, the scratch resistance, the wear resistance, the impact resistance and the corrosion resistance of a paint film are improved.
Further, the lithium persalt salt conductive agent is formed by compounding a polymer and lithium aluminate in the presence of an anhydrous solvent. The perchlorate is an assistant with ion-conductive function, anion and cation are combined under the condition of no water or solvent, and the perchlorate exists in the state of solid salt, and has no ion conductivity when directly mixed with the mixture.
Further, the polymer is a Polyglycol (PAG). The polymer Polyglycol (PAG) and the high lithium aluminate are compounded to generate the conductive functional assistant with ion conductivity, cations of the high lithium aluminate are solvated by ether oxygen in the Polyglycol (PAG) to be dissociated, dissociated ions are in a state of easy movement through the molecular vibration of the Polyglycol (PAG), and the dissociated ions move to corresponding electrodes under the action of an external electric field to generate the ion conductivity. The mechanism is different from that of the conductive auxiliary agent of quaternary ammonium salt surfactant series, does not need water in the air to help ion conduction, and can ensure good conductivity under the condition of low humidity.
Further, the rare earth modified nano superconducting inorganic material is lanthanum modified nano silver-copper alloy powder. The silver-copper alloy powder is modified by rare earth lanthanum, has the characteristics of difficult oxidation, corrosion resistance, stable performance and good conductivity, prolongs the service life of the conductive coating, and enhances the anti-aging capability of the conductive coating.
Furthermore, the high molecular polymer conducting material is a polythiophene/multi-walled carbon nanotube composite material. The polythiophene/multi-walled carbon nanotube composite material can be stably and uniformly dispersed in the coating, is not easy to agglomerate, and has good electromagnetic property and high conductivity.
Further, the organic solvent comprises an aromatic hydrocarbon solvent and an ester solvent, the aromatic hydrocarbon solvent comprises benzene and xylene, and the ester solvent comprises ethyl acetate.
The invention has the following beneficial effects:
the selected epoxy modified hydroxyl acrylic resin contains strong-polarity ether bonds and hydroxyl groups, so that the base material adhesion, heat resistance, aging resistance, chemical resistance and corrosion resistance of the coating are improved, the durability and stability of the conductive material are improved, and the stability and durability of the magnetic shielding performance and the conductive performance of the coating are ensured. The conductive material with small particle size can be filled in the silver-coated copper powder gap with large particle size, plays a role of grafting a bridge, reduces the addition amount of the silver-coated copper powder, reduces the production cost and improves the conductivity of the coating. The organic conductive material and the polymer conductive material have good stability, and endow the coating with lasting and stable conductivity.
Detailed Description
The present invention will be described in detail with reference to examples, which are only preferred embodiments of the present invention and are not intended to limit the present invention.
The following table shows the formulation of 3 examples and 3 comparative examples of the anti-shielding conductive coating of the present invention applied to 5G consumer electronic devices (unit:%), prepared by mixing and stirring as conventional in the art:
the lithium persalt salt conductive agent is compounded by Polyglycol (PAG) and high lithium aluminate according to the mass ratio of 1: 10.
The performances of 3 examples and 3 comparative examples of the anti-shielding conductive coating of the invention were tested, and the test results are shown in the following table:
therefore, the coating disclosed by the invention has the advantages of good conductivity, heat resistance, chemical resistance and aging resistance, good adhesion to a base material and high impact strength.
In the embodiment 2, the silver-coated copper powder with low silver content is compounded with the organic conductive material and the polymer conductive material, so that the addition amount of the silver-coated copper powder is reduced, the conductive performance of the silver-coated copper powder is the same as that of the comparative example 2 with high silver content and high addition amount, the production cost of the silver-coated copper powder and the polymer conductive material is calculated, the silver price is about 5000 yuan/kg, the silver price of the silver-coated copper powder with 30% of silver content is about 2000 yuan/kg, the silver price of the silver-coated copper conductive powder with 5% of silver content is about 800 yuan/kg, and the cost of the embodiment 2 is reduced by 30% compared with that of the comparative example 2.
Claims (8)
1. An anti-shielding conductive coating applied to 5G consumer electronic equipment is characterized by comprising the following components in percentage by mass: 10-40% of epoxy modified hydroxyl acrylic resin, 5-10% of aliphatic isocyanate curing agent, 10-20% of silver-coated copper powder, 0.1-1% of superconducting silver paste, 1-5% of persalt lithium salt conductive agent, 1-5% of rare earth modified nano superconducting inorganic material, 1-5% of high polymer conductive material and the balance of organic solvent.
2. The shielding-proof conductive coating material as claimed in claim 1, wherein the silver content of the silver-coated copper powder is 1-5%.
3. The shielding-proof conductive paint of claim 1, wherein the particle size of the superconducting silver paste is 20-50 nm.
4. The shielding-proof conductive paint of claim 1, wherein the lithium persalt-type conductive agent is formed by compounding a polymer and lithium aluminate.
5. The anti-shielding conductive coating according to claim 4, wherein the polymer is a Polyglycol (PAG).
6. The shielding-proof conductive coating of claim 1, wherein the rare earth modified nano superconducting inorganic material is lanthanum modified nano silver copper alloy powder.
7. The shielding-proof conductive coating of claim 1, wherein the high molecular polymer conductive material is a polythiophene/multi-walled carbon nanotube composite.
8. The shielding-proof conductive paint as claimed in claim 1, wherein the organic solvent includes aromatic hydrocarbon solvent and ester solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110742568.0A CN113388303A (en) | 2021-07-01 | 2021-07-01 | Anti-shielding conductive coating applied to 5G consumer electronics equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110742568.0A CN113388303A (en) | 2021-07-01 | 2021-07-01 | Anti-shielding conductive coating applied to 5G consumer electronics equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113388303A true CN113388303A (en) | 2021-09-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110742568.0A Pending CN113388303A (en) | 2021-07-01 | 2021-07-01 | Anti-shielding conductive coating applied to 5G consumer electronics equipment |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114316775A (en) * | 2022-01-11 | 2022-04-12 | 佛山市高明绿色德化工有限公司 | PU (polyurethane) finish paint for fingerprint identification chip as well as preparation method and application method thereof |
Citations (4)
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|---|---|---|---|---|
| US20060145302A1 (en) * | 2004-12-30 | 2006-07-06 | Kim Sang J | Coating composition for electronic devices |
| CN102254584A (en) * | 2011-05-12 | 2011-11-23 | 中国科学院宁波材料技术与工程研究所 | General electronic paste based on graphene filler |
| CN103232799A (en) * | 2013-05-16 | 2013-08-07 | 佩特化工(上海)有限公司 | Conductive coating for electrode of capacitive inductor of intelligent touch screen and preparation method |
| CN108281761A (en) * | 2018-01-08 | 2018-07-13 | 悟墨（上海）智能科技有限公司 | A kind of nanocarbon/metal conducing composite material and its application |
-
2021
- 2021-07-01 CN CN202110742568.0A patent/CN113388303A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060145302A1 (en) * | 2004-12-30 | 2006-07-06 | Kim Sang J | Coating composition for electronic devices |
| CN102254584A (en) * | 2011-05-12 | 2011-11-23 | 中国科学院宁波材料技术与工程研究所 | General electronic paste based on graphene filler |
| CN103232799A (en) * | 2013-05-16 | 2013-08-07 | 佩特化工(上海)有限公司 | Conductive coating for electrode of capacitive inductor of intelligent touch screen and preparation method |
| CN108281761A (en) * | 2018-01-08 | 2018-07-13 | 悟墨（上海）智能科技有限公司 | A kind of nanocarbon/metal conducing composite material and its application |
Non-Patent Citations (1)
| Title |
|---|
| 方小牛等: "《生土类建筑保护技术与策略》", 28 February 2018, 同济大学出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114316775A (en) * | 2022-01-11 | 2022-04-12 | 佛山市高明绿色德化工有限公司 | PU (polyurethane) finish paint for fingerprint identification chip as well as preparation method and application method thereof |
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Application publication date: 20210914 |
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| RJ01 | Rejection of invention patent application after publication |