CN113363592A - Chip and battery integrated integration method and device - Google Patents
Chip and battery integrated integration method and device Download PDFInfo
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- CN113363592A CN113363592A CN202110638196.7A CN202110638196A CN113363592A CN 113363592 A CN113363592 A CN 113363592A CN 202110638196 A CN202110638196 A CN 202110638196A CN 113363592 A CN113363592 A CN 113363592A
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- 230000010354 integration Effects 0.000 title claims abstract description 8
- 238000007789 sealing Methods 0.000 claims abstract description 26
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- 239000002002 slurry Substances 0.000 claims abstract description 17
- 239000011248 coating agent Substances 0.000 claims abstract description 16
- 238000000576 coating method Methods 0.000 claims abstract description 16
- 239000011258 core-shell material Substances 0.000 claims abstract description 16
- 239000007774 positive electrode material Substances 0.000 claims abstract description 11
- 239000010405 anode material Substances 0.000 claims abstract description 9
- 238000001035 drying Methods 0.000 claims abstract description 9
- 239000007773 negative electrode material Substances 0.000 claims abstract description 9
- 238000007639 printing Methods 0.000 claims abstract description 9
- 239000007784 solid electrolyte Substances 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- -1 polyethylene Polymers 0.000 claims description 12
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 11
- 229910052744 lithium Inorganic materials 0.000 claims description 11
- 239000004698 Polyethylene Substances 0.000 claims description 6
- 229920000573 polyethylene Polymers 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 claims description 4
- 239000004819 Drying adhesive Substances 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000002203 sulfidic glass Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 3
- 238000004891 communication Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000003292 glue Substances 0.000 description 9
- 210000004027 cell Anatomy 0.000 description 8
- 230000001276 controlling effect Effects 0.000 description 8
- 230000006872 improvement Effects 0.000 description 8
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- 238000001291 vacuum drying Methods 0.000 description 6
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- 239000003792 electrolyte Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002227 LISICON Substances 0.000 description 2
- 239000006256 anode slurry Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910012305 LiPON Inorganic materials 0.000 description 1
- 239000002228 NASICON Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- QHGJSLXSVXVKHZ-UHFFFAOYSA-N dilithium;dioxido(dioxo)manganese Chemical compound [Li+].[Li+].[O-][Mn]([O-])(=O)=O QHGJSLXSVXVKHZ-UHFFFAOYSA-N 0.000 description 1
- 239000011267 electrode slurry Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
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- GELKBWJHTRAYNV-UHFFFAOYSA-K lithium iron phosphate Chemical compound [Li+].[Fe+2].[O-]P([O-])([O-])=O GELKBWJHTRAYNV-UHFFFAOYSA-K 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/058—Construction or manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/04—Construction or manufacture in general
- H01M10/0404—Machines for assembling batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/04—Construction or manufacture in general
- H01M10/0422—Cells or battery with cylindrical casing
- H01M10/0427—Button cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/058—Construction or manufacture
- H01M10/0585—Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/06—Electrodes for primary cells
- H01M4/08—Processes of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
- H01M4/139—Processes of manufacture
- H01M4/1391—Processes of manufacture of electrodes based on mixed oxides or hydroxides, or on mixtures of oxides or hydroxides, e.g. LiCoOx
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
- H01M4/139—Processes of manufacture
- H01M4/1397—Processes of manufacture of electrodes based on inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
- H01M50/519—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M6/00—Primary cells; Manufacture thereof
- H01M6/005—Devices for making primary cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M6/00—Primary cells; Manufacture thereof
- H01M6/14—Cells with non-aqueous electrolyte
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M6/00—Primary cells; Manufacture thereof
- H01M6/14—Cells with non-aqueous electrolyte
- H01M6/18—Cells with non-aqueous electrolyte with solid electrolyte
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M2004/026—Electrodes composed of, or comprising, active material characterised by the polarity
- H01M2004/028—Positive electrodes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Chemical & Material Sciences (AREA)
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- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Secondary Cells (AREA)
Abstract
The invention discloses a chip and battery integrated integration method, which comprises the steps of uniformly printing or coating anode material slurry on the surface of a chip conductive shell to form an anode film, and drying; the positive electrode film is covered with a diaphragm and a negative electrode material in sequence to form a sandwich structure of the battery; covering a battery core shell with a sealing ring on a base on the battery with a sandwich structure, and bonding an insulating hot melt adhesive at the contact position of the sealing ring and the chip conductive shell for fixation; and respectively connecting the positive and negative connecting wires to the PCB. In addition, the integrated equipment for the chip and the battery is disclosed, a current collector of a positive electrode material is omitted, the integral structure of the chip and the battery is optimized, the integrated flow line production of the chip and the battery is easy to realize, the production efficiency is improved, and meanwhile, the miniaturization of the device of the Internet of things is realized; and the power supply requirements of chips with different functions can be met.
Description
Technical Field
The invention relates to the technical field of battery manufacturing, in particular to a method and equipment for integrating a chip and a battery.
Background
Global climate change and the ever-increasing demand for energy have prompted the rapid development of green energy sources, particularly battery technology. A battery is generally composed of a positive electrode, a negative electrode, a separator, an electrolyte solution, and the like, and is a device that can convert chemical energy into electric energy. The battery has wide application field and plays a great role in various aspects of modern social life.
On the other hand, the development of the internet of things is accelerated by the arrival of 5G, huge impact is generated on a media network, a mobile network, a network of the internet of things and a data center, the world is moving into the era of the internet of things, and along with the gradual popularization of the technology of the internet of things, the battery requirements matched with the chip or the terminal of the internet of things are continuously increased. Different from the traditional electric appliance, the internet of things device is mostly applied to induction and wireless connection scenes, and needs to support signal quick connection between equipment at any time, and meanwhile, the internet of things device tends to be miniaturized and miniaturized, which brings new challenges to the structural design of chips and batteries.
Most of conventional devices of the internet of things are designed, manufactured and assembled separately, so that the miniaturization of the devices of the internet of things is not facilitated, and the development trend of intelligent high-speed manufacturing is more contradicted. In view of this, the chip and the battery need to be produced in an integrated flow line, so that the miniaturization of the internet of things device is realized while the production efficiency is improved.
Disclosure of Invention
In order to solve the problems in the prior art, the invention aims to provide a chip and battery integrated method and device, a battery for supplying power to a chip is continuously and uninterruptedly prepared on a chip conductive shell, the integrated flow line production of the chip and the battery is realized while the space of a PCB (printed circuit board) is maximally utilized, and the production efficiency is improved while the miniaturization and the miniaturization of devices of the internet of things are realized.
In order to achieve the purpose, the invention adopts the technical scheme that:
a chip and battery integrated integration method comprises the following steps:
step A, uniformly printing or coating the anode material slurry on the surface of the chip conductive shell to form an anode film, and drying;
step B, covering a diaphragm and a negative electrode material on the positive electrode film in sequence to form a battery sandwich structure;
step C, covering a battery core shell with a sealing ring on a base on the battery with a sandwich structure, and bonding an insulating hot melt adhesive on the contact part of the sealing ring and the chip conductive shell for fixation;
and D, respectively connecting the positive and negative connecting wires to the PCB.
As a further improvement of the invention, the thickness of the anode material slurry is 0.05-2000 microns, and the equipment for printing or coating the anode material slurry is one or more of a screen printer, a blind plate printer, a coating machine, an ink-jet printer, an injection valve dispenser and a screw valve dispenser.
As a further improvement of the invention, the temperature of the drying treatment in the step A is 60-110 ℃, and the time is 18-24 hours.
As a further improvement of the invention, the separator is a polyethylene separator, a polypropylene separator or a solid electrolyte.
As a further improvement of the present invention, the solid electrolyte is a polymer solid electrolyte, an oxide solid electrolyte or a sulfide solid electrolyte.
As a further improvement of the invention, the negative electrode material is metallic lithium, lithium titanate, graphite or silicon carbon.
As a further improvement of the invention, the hot melt adhesive is one or more of anaerobic adhesive, sealant, AB adhesive, UV adhesive, quick-drying adhesive, 340 glue and high-temperature-resistant glue.
The technical scheme adopted by the invention also comprises the following steps:
the utility model provides an integrated equipment of chip and battery, including PCB printed circuit board, the electrically conductive shell of chip, electric core body, electric core shell, the sealing washer, hot melt adhesive and connecting wire, electric core body is by anodal, battery "sandwich structure" that diaphragm and negative pole constitute in proper order, the diaphragm is located between anodal and the negative pole, anodal setting is outside the electrically conductive shell of chip, electric core shell lid fits on electric core body, be connected with the electrically conductive shell of chip through the sealing washer, the sealing washer is with the electrically conductive shell of chip, electric core shell's contact department is provided with the hot melt adhesive, fix through the hot melt adhesive, just, the negative pole connecting wire is connected with PCB printed circuit board respectively.
As a further improvement of the invention, the battery cell shell is made of stainless steel.
The invention has the beneficial effects that:
according to the method and the device for integrating the chip and the battery, disclosed by the invention, a current collector of a positive electrode material is omitted, the integral structure of the chip and the battery is optimized, the integrated flow line production of the chip and the battery is easy to realize, the production efficiency is improved, and meanwhile, the miniaturization of an internet of things device is realized; and the electrochemical performance of the anode is regulated and controlled by controlling various parameters of the anode material slurry and printing or spraying equipment, the power supply requirements of chips with different functions are met, and the applicability is improved.
Drawings
Fig. 1 is a schematic structural diagram of an integrated device of a chip and a battery in embodiment 7 of the present invention.
Reference numerals: 1-a PCB printed circuit board; 2-chip conductive shell; 3-positive electrode; 4-a separator; 5-negative pole; 6-cell shell; 7-sealing ring; 8-hot melt adhesive.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
The invention provides a chip and battery integrated integration method, which comprises the following steps:
A. uniformly printing or coating the positive electrode material slurry on the surface of the chip conductive shell to form a film with a certain shape and a certain thickness, and drying to obtain the chip conductive shell with the surface solidified with the positive electrode;
the apparatus for printing or coating the positive electrode material slurry may be a screen printer, a blind plate printer, a coater, an ink jet printer, a jet valve dispenser, a screw valve dispenser, etc., and is not limited to use of one or more of them. The slurry of the positive electrode material is uniformly applied to a thickness of 0.05 to 2000. mu.m, preferably 0.1. mu.m, 1. mu.m, 2. mu.m, 10. mu.m, 100. mu.m, 200. mu.m, 1000. mu.m, etc., but is not limited to the values listed above, and other values not listed above in the above numerical ranges are also applicable. The temperature for drying the chip conductive shell after coating the surface of the chip conductive shell with the positive electrode material slurry is 60-110 ℃, preferably 60 ℃, 65 ℃, 70 ℃, 75 ℃, 80 ℃, 85 ℃, 90 ℃, 95 ℃, 100 ℃ and the like, but the positive electrode material slurry is not limited to the enumerated values, and other non-enumerated values in the numerical value range are also applicable; the drying time is 18 to 24 hours, preferably 18 hours, 18.5 hours, 19 hours, 20 hours, 21 hours, 22 hours or 23 hours, but is not limited to the recited values, and other values not recited in the above numerical ranges are also applicable.
B. Covering the positive electrode in the step A with a diaphragm and a negative electrode material in sequence to form a battery 'sandwich structure';
the separator may be polyethylene separator, polypropylene separator, or solid electrolyte.
The solid electrolyte may be: polymer solid electrolytes such as PEO solid polymer, polycarbonate, polyalkoxy group, polymer lithium single ion conductor group, etc.; oxide solid electrolytes such as NASICON, LISICON, LiPON, and the like; sulfide solid electrolytes such as Thio-LISICON, LGPS, Li-aegyrodite, and the like.
The negative electrode material includes metallic lithium, lithium titanate, graphite, silicon carbon, and the like.
C. Covering a battery core shell with a sealing ring on a base on the battery with a sandwich structure, and bonding an insulating hot melt adhesive at the contact position of the sealing ring and the chip conductive shell for fixation;
wherein, the base of the battery cell shell is provided with a sealing ring or other insulating materials to prevent the short circuit of the battery; the 'cell shell with a sealing ring on the base' can be button cell cathode shells of different types. The insulating hot melt adhesive can adopt at least one or more of anaerobic adhesive, sealant, AB adhesive, UV adhesive, quick-drying adhesive, 340 glue and high-temperature-resistant glue.
D. And respectively connecting the positive and negative connecting wires to the PCB, respectively, welding the two ends of the wires to the positive and negative electrodes and the circuit board by welding, and performing plug-in and surface mount methods, so as to obtain the integrated device of the chip and the battery.
Example 1
The embodiment of the invention provides a chip and battery integrated method, which comprises the following steps:
step A1, uniformly coating positive electrode material slurry containing manganese dioxide on the surface of the chip conductive shell to form a square film through a blind plate printer, controlling the thickness to be 800 microns through the blind plate printer, and performing vacuum drying for 22 hours at 100 ℃ to obtain the chip conductive shell with the positive electrode plate solidified on the surface;
step B1, covering the positive pole piece in the step A1 with a polyethylene diaphragm soaked by electrolyte and a lithium piece negative pole material in sequence to form a battery sandwich structure;
step C1, covering a battery core shell with a sealing ring on the battery with the sandwich structure in the step B1, and fixing the battery core shell by applying anaerobic adhesive on the periphery;
and D1, respectively connecting the positive and negative connecting wires to the PCB to obtain the integrated device of the chip and the battery.
Example 2
The embodiment of the invention provides a chip and battery integrated method, which comprises the following steps:
step A2, uniformly spraying anode material slurry containing lithium cobaltate on the surface of the chip conductive shell to form a circular film through an ink-jet printer, controlling the thickness to be 10 microns through the ink-jet printer, and performing vacuum drying for 18 hours at 60 ℃ to obtain the chip conductive shell with the surface solidified with the anode plate;
step B2, covering the positive pole piece in the step A2 with a polyethylene diaphragm soaked by electrolyte and a silicon-carbon negative pole material in sequence to form a battery sandwich structure;
c2, covering and buckling a battery negative electrode shell on the battery sandwich structure in the step B2, and spraying high-temperature-resistant glue around the battery negative electrode shell for fixation;
and D2, respectively connecting the positive and negative connecting wires to the PCB, thus forming the integrated device of the chip and the battery.
Example 3
The embodiment of the invention provides a chip and battery integrated method, which comprises the following steps:
step A3, uniformly coating anode material slurry containing lithium iron phosphate on the surface of the chip conductive shell into a circular film through a screen printer, controlling the thickness to be 600 microns through a screen printer template, and performing vacuum drying for 21 hours at 90 ℃ to obtain the chip conductive shell with the surface solidified with the anode plate;
step B3, sequentially covering the positive pole piece in the step A3 with a polypropylene diaphragm soaked by electrolyte and a graphite negative pole material to form a battery sandwich structure;
c3, covering and buckling a battery negative electrode shell on the battery sandwich structure in the step B3, and sealing glue is applied to the periphery for fixation;
and D3, respectively connecting the positive and negative connecting wires to the PCB, thus forming the integrated device of the chip and the battery.
Example 4
The embodiment of the invention provides a chip and battery integrated method, which comprises the following steps:
step A4, uniformly spraying the anode slurry containing the ternary NMC on the surface of the conductive shell of the chip to form a square film through a jet valve dispenser, controlling the thickness to be 100 microns through dispensing amount, and carrying out vacuum drying for 19 hours at 70 ℃ to obtain an anode plate solidified on the surface of the conductive shell of the chip;
step B4, covering the anode sheet with solid electrolyte and lithium sheet cathode material to form a sandwich structure;
step C4, covering a battery core shell with a sealing ring on the base on the battery sandwich structure, and gluing AB glue on the periphery for fixation;
and D4, respectively connecting the positive and negative connecting wires to the PCB to obtain the chip-battery with integrated structure.
Example 5
The embodiment of the invention provides a chip and battery integrated method, which comprises the following steps:
step A5, uniformly spraying the ternary NCA-containing anode slurry on the surface of the chip conductive shell through a screw valve dispenser, controlling the thickness to be 200 microns through dispensing amount, and carrying out vacuum drying for 2 hours at 80 ℃ to obtain an anode plate solidified on the surface of the chip conductive shell;
step B5, covering the positive plate with electrolyte-soaked polyethylene diaphragm and lithium plate negative electrode material to form a sandwich structure;
step C5, covering a battery core shell with a sealing ring on the base on the battery with a sandwich structure, and coating quick-drying glue on the periphery for fixation;
and D5, respectively connecting the positive and negative connecting wires to the PCB to obtain the chip-battery with integrated structure.
Example 6
The embodiment of the invention provides a chip and battery integrated method, which comprises the following steps:
step A6, uniformly coating the positive electrode slurry containing lithium manganate on the surface of the chip conductive shell through a coating machine, controlling the thickness to be 1000 microns through the height of a scraper of the coating machine, and carrying out vacuum drying for 23 hours at 110 ℃ to obtain a positive electrode plate which is solidified on the surface of the chip conductive shell;
step B6, sequentially covering the positive plate with an electrolyte-soaked polypropylene diaphragm and a graphite negative electrode material to form a battery sandwich structure;
step C6, covering a battery core shell with a base provided with a sealing ring on the battery sandwich structure, and spraying high-temperature-resistant glue around the battery core shell for fixation;
and D6, respectively connecting the positive and negative connecting wires to the PCB to obtain the chip-battery with integrated structure.
Example 7
As shown in fig. 1, an embodiment of the present invention provides an integrated device of a chip and a battery, which can be manufactured by any one of the methods of embodiments 1 to 6, including: the battery comprises a PCB (printed circuit board) 1, a chip conductive shell 2, a battery cell body, a battery cell shell 6, a sealing ring 7, a hot melt adhesive 8 and a connecting wire, wherein the battery cell body is of a battery sandwich structure consisting of a positive electrode 3, a diaphragm 4 and a negative electrode 5 in sequence, the diaphragm is positioned between the positive electrode and the negative electrode, the positive electrode is arranged on the outer surface of the chip conductive shell, the battery cell shell covers the battery cell body and is connected with the chip conductive shell through the sealing ring, and preferably, the battery cell shell is made of stainless steel; the contact position of the sealing ring with the chip conductive shell and the cell shell is provided with hot melt adhesive, and the hot melt adhesive is used for fixing the sealing ring. The positive and negative connecting wires are respectively connected with the PCB so as to realize the integration of the chip and the battery.
According to the integration method and the device for the chip and the battery, provided by the invention, a current collector of a positive electrode material is omitted, the integral structure of the chip and the battery is optimized, the integrated flow line production of the chip and the battery is easy to realize, the production efficiency is improved, and the miniaturization of an internet of things device is realized; in addition, the electrochemical performance of the anode is regulated and controlled by controlling various parameters of the anode material slurry and printing or spraying equipment, and the power supply requirements of chips with different functions can be met.
In conclusion, upon reading the present detailed disclosure, those skilled in the art will appreciate that the foregoing detailed disclosure can be presented by way of example only, and not limitation. Those skilled in the art will appreciate that the present application is intended to cover various reasonable variations, adaptations, and modifications of the embodiments described herein, although not explicitly described herein. Such alterations, improvements, and modifications are intended to be suggested by this application and are within the spirit and scope of the exemplary embodiments of the application.
Finally, it should be understood that the embodiments of the application disclosed herein are illustrative of the principles of the embodiments of the present application. Other modified embodiments are also within the scope of the present application. Accordingly, the disclosed embodiments are presented by way of example only, and not limitation. Those skilled in the art may implement the present application in alternative configurations according to the embodiments of the present application. Thus, embodiments of the present application are not limited to those precisely described in the application.
Claims (9)
1. A chip and battery integrated integration method is characterized by comprising the following steps:
step A, uniformly printing or coating the anode material slurry on the surface of the chip conductive shell to form an anode film, and drying;
step B, covering a diaphragm and a negative electrode material on the positive electrode film in sequence to form a battery sandwich structure;
step C, covering a battery core shell with a sealing ring on a base on the battery with a sandwich structure, and bonding an insulating hot melt adhesive on the contact part of the sealing ring and the chip conductive shell for fixation;
and D, respectively connecting the positive and negative connecting wires to the PCB.
2. The method for integrating the chip and the battery into a whole according to claim 1, wherein the thickness of the positive electrode material slurry is 0.05-2000 microns, and the equipment for printing or coating the positive electrode material slurry is one or more of a screen printer, a blind plate printer, a coating machine, an ink jet printer, a jet valve dispenser and a screw valve dispenser.
3. The integrated method of chip and battery as claimed in claim 1, wherein the temperature of drying treatment in step A is 60-110 deg.C for 18-24 hours.
4. The method of claim 1, wherein the separator is a polyethylene separator, a polypropylene separator, or a solid electrolyte.
5. The integrated chip and battery method of claim 4, wherein the solid electrolyte is a polymer solid electrolyte, an oxide solid electrolyte or a sulfide solid electrolyte.
6. The integrated chip and battery method according to claim 1, wherein the negative electrode material is metallic lithium, lithium titanate, graphite or silicon carbon.
7. The method as claimed in claim 1, wherein the hot melt adhesive is one or more of anaerobic adhesive, sealant, AB adhesive, UV adhesive, quick-drying adhesive, 340 adhesive, and high temperature resistant adhesive.
8. The utility model provides an integrated equipment of chip and battery, a serial communication port, including PCB printed circuit board, the chip electrically conducts the shell, electric core body, the electricity core shell, the sealing washer, hot melt adhesive and connecting wire, electric core body is by anodal, diaphragm and negative pole constitute in proper order battery "sandwich structure", the diaphragm is located between anodal and negative pole, the positive pole sets up outside the electrically conductive shell of chip, electricity core shell lid fits on electric core body, be connected with the electrically conductive shell of chip through the sealing washer, the sealing washer is with the electrically conductive shell of chip, the contact department of electricity core shell is provided with the hot melt adhesive, fix through the hot melt adhesive, just, the negative pole connecting wire is connected with PCB printed circuit board respectively.
9. The integrated chip and battery device of claim 8, wherein the cell casing is made of stainless steel.
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