CN113347814B

CN113347814B - Shell, preparation method thereof and electronic equipment

Info

Publication number: CN113347814B
Application number: CN202110602738.5A
Authority: CN
Inventors: 陈奕君; 胡梦; 李聪
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-05-31
Filing date: 2021-05-31
Publication date: 2023-04-07
Anticipated expiration: 2041-05-31
Also published as: CN113347814A; CN116170984A

Abstract

The application provides a shell, a preparation method thereof and electronic equipment. The housing of the present application includes: the shell body comprises raw material components including inorganic powder, thermoplastic resin and a photoinduced expanding agent. The shell of this application has the weight lighter, higher hardness and wearability.

Description

Shell, preparation method thereof and electronic equipment

Technical Field

The application relates to the field of electronics, in particular to a shell, a preparation method of the shell and electronic equipment.

Background

Ceramics have a warm and moist hand feeling and a high gloss texture, and therefore, are often used as exterior structural members of high-end electronic device housings, middle frames, decorative parts, and the like. However, the ceramic has a high density, severe processing conditions, and high processing cost, so that the application is greatly limited, and therefore, a resin is added to the ceramic to reduce the processability of the ceramic, which, however, causes the hardness and wear resistance of the case to be greatly reduced.

Disclosure of Invention

In view of the above problems, embodiments of the present application provide a housing having light weight, high hardness, and wear resistance.

The embodiment of the application provides a casing, it includes:

the shell body comprises raw material components including inorganic powder, thermoplastic resin and a photoinduced expanding agent.

Based on the same inventive concept, the embodiment of the present application further provides a method for manufacturing a shell, where the shell includes a shell body, and the method includes:

mixing inorganic powder with thermoplastic resin, and molding to obtain a blank;

introducing a photo-swelling agent on the surface layer of the blank body; and

and (3) performing illumination to expand the volume of the photo-expansion agent to obtain the shell body.

Based on the same inventive concept, an embodiment of the present application further provides an electronic device, including:

a display component for displaying;

the shell of the embodiment of the application is provided with an accommodating space; and

and the circuit board assembly is arranged in the accommodating space, is electrically connected with the display assembly and is used for controlling the display assembly to display.

The shell body of the shell comprises the raw material components of inorganic powder, thermoplastic resin and a photoinduced expanding agent, wherein the thermoplastic resin enables the shell to have better processing performance and lighter weight; after the photoinduced expanding agent is irradiated by light, the photoinduced expanding agent in the shell body can expand in volume to generate internal stress and enable the molecules to be more compact, so that the hardness and the wear resistance of the shell body are improved, and the shell has higher hardness and wear resistance while having better processing performance and lighter weight.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a housing according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a housing according to another embodiment of the present application.

Fig. 3 is a schematic structural diagram of a housing according to another embodiment of the present application.

Fig. 4 is a schematic flow chart of a method for manufacturing a housing according to an embodiment of the present disclosure.

Fig. 5 is a schematic flow chart of a method for manufacturing a housing according to another embodiment of the present disclosure.

Fig. 6 is a schematic flow chart of a method for manufacturing a housing according to another embodiment of the present disclosure.

Fig. 7 is a schematic flow chart of a method for manufacturing a housing according to another embodiment of the present disclosure.

Fig. 8 is an exploded structure diagram of an electronic device according to an embodiment of the present application.

Fig. 9 is a circuit block diagram of an electronic device according to an embodiment of the present application.

Description of reference numerals:

100-case 600-electronic device

101-backplane 610-display assembly

103-side plate 601-containing space

10-housing body 630-circuit board assembly

11-first layer 631-processor

13-intermediate layer 633-memory

15-second layer 635-power supply

30-protective layer

Detailed Description

In order to make the technical solutions of the present application better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

It should be noted that, for convenience of description, like reference numerals denote like parts in the embodiments of the present application, and a detailed description of the like parts is omitted in different embodiments for the sake of brevity.

Ceramics have a warm and moist hand feeling and a high gloss texture, and therefore, are often used as exterior structural members of high-end electronic device housings, middle frames, decorative parts, and the like. However, the density of the ceramic is high, the manufactured electronic equipment appearance structural part is heavy, the pencil hardness is high, the electronic equipment appearance structural part is easy to crack, the processing difficulty is high, and in addition, the processing cost of the ceramic is high, so that the application of the ceramic is greatly limited. In order to improve the performance and cost of ceramics, in the related art, a thermoplastic resin and ceramic powder (inorganic powder) are mixed and injection molding is performed to obtain a housing of an electronic device, however, with injection molding, the content of the ceramic powder is difficult to reach more than 90%, and when the content of the ceramic powder exceeds 90% of the total weight of the ceramic and the thermoplastic resin, the fluidity of the thermoplastic resin/ceramic powder formed by mixing is poor, the resistance in the injection molding process is large, and the flow mark is obvious. Therefore, the content of the ceramic powder is generally less than 90% during injection molding, however, when the content of the ceramic powder is less than 90%, the hardness of the housing of the electronic device is low, the wear resistance is poor, and the life of the housing of the electronic device is reduced.

Referring to fig. 1, a housing 100 provided in the embodiment of the present application includes a housing body 10, and raw material components of the housing body 10 include inorganic powder, thermoplastic resin, and a photo-expansion agent.

Alternatively, the housing 100 of the present application may be an outer case, a middle frame, a decoration, and the like of an electronic device. The housing 100 of the embodiment of the present application may have a 2D structure, a 2.5D structure, a 3D structure, or the like.

Optionally, the housing 100 includes a bottom plate 101 and a side plate 103 connected to the bottom plate 101 in a bent manner.

The term "photo-swelling agent" as used herein refers to a material that expands in volume when exposed to light. Alternatively, the photo-swelling agent may undergo a molecular isomerization reaction (e.g., a cis-structure is changed to a trans-structure), a ring opening reaction, or the like to increase the molecular size of the photo-swelling agent under irradiation of light such as ultraviolet light, visible light, near infrared light, or the like, thereby causing the volume of the material to swell.

Optionally, in use, the casing 100 is first placed under a light source (e.g., ultraviolet light, visible light, or near infrared light) to illuminate, so that the volume of the photo-expansion agent in the casing body 10 expands. In other words, in use, the photo-expansive agent in the case body 10 of the case 100 is an expanded photo-expansive agent.

The raw material components of the shell body 10 of the shell 100 of the present application include inorganic powder, thermoplastic resin and a photo-expansion agent, and the thermoplastic resin enables the shell 100 to have good processability and light weight; after the photo-swelling agent is irradiated by light, the photo-swelling agent inside the shell body 10 expands in volume, generates internal stress and enables the molecular arrangement inside the shell body 10 to be more compact, so that the hardness and the wear resistance of the shell body 10 are improved, and the shell 100 has higher hardness and wear resistance while having better processing performance and lighter weight.

Referring to fig. 2, in some embodiments, the housing body 10 includes a first layer 11, an intermediate layer 13, and a second layer 15 sequentially stacked. The raw material components of the first layer 11 and the second layer 15 comprise inorganic powder, thermoplastic resin and a photoinduced expanding agent; the raw material components of the intermediate layer 13 include inorganic powder and thermoplastic resin. Add the light induced swelling agent in first layer 11 and second layer 15, intermediate layer 13 does not have the light induced swelling agent, after first layer 11 and second layer 15 pass through illumination, the volume expansion takes place for the light induced swelling agent in first layer 11 and the second layer 15, thereby make first layer 11 and second layer 15 produce tensile stress to intermediate layer 13 respectively, and receive intermediate layer 13's compressive stress, can make when casing body 10's hardness promotes like this, can not reduce casing body 10's toughness again, thereby make casing body 10 have higher hardness and higher toughness simultaneously.

Optionally, the content of the photo-expanding agent in the first layer 11 decreases from the surface of the first layer 11 remote from the intermediate layer 13 towards the surface of the first layer 11 close to the intermediate layer 13; therefore, after the housing body 10 is illuminated, the volume expansion degree of the photo-swelling agent in the first layer 11 gradually decreases from the surface of the first layer 11 away from the intermediate layer 13 to the surface of the first layer 11 close to the intermediate layer 13, so that relatively uniform stress distribution and enhanced hardness and wear resistance are realized in the first layer 11, and the situation that the compression stress of the layer (the surface of the first layer 11 away from the intermediate layer 13) and the tensile stress of the inner layer (the surface of the first layer 11 close to the intermediate layer 13) are too large in adjacent regions due to too large volume change difference, and the material fails if the intrinsic yield and the breaking strength of the material are exceeded can be avoided.

Optionally, the content of the photo-expanding agent in the second layer 15 decreases from the surface of the second layer 15 away from the intermediate layer 13 to the surface of the second layer 15 close to the intermediate layer 13; therefore, after the housing body 10 is illuminated, the volume expansion degree of the photo-swelling agent in the second layer 15 gradually decreases from the surface of the second layer 15 far away from the intermediate layer 13 to the surface of the second layer 15 near the intermediate layer 13, so that relatively uniform stress distribution and enhancement of hardness and wear resistance are realized in the second layer 15, and thus, it can be avoided that the compression stress of the layer (the surface of the second layer 15 far away from the intermediate layer 13) and the tensile stress of the inner layer (the surface of the second layer 15 near the intermediate layer 13) are too large due to too large volume change difference of adjacent regions, and if the volume change difference exceeds the intrinsic yield and breaking strength of the material, the material can be failed.

Optionally, the first layer 11, the intermediate layer 13 and the second layer 15 do not have phase interfaces therebetween. It should be understood that the first layer 11, the intermediate layer 13, and the second layer 15 have the same substrate, and the substrate is formed in the same process (e.g., injection molding). Therefore, the manufactured shell 100 has better integrity, is not easy to generate a layering phenomenon after long-time use, and has longer service life. The term "phase interface" refers herein to a transition zone of intimate contact between two phases of a substance, or the interface of a substance phase and a phase. The phase interface comprises five different interfaces of gas-liquid, gas-solid, liquid-liquid, liquid-solid and solid-solid.

Optionally, the thickness of the first layer 11 is 5% to 10% of the thickness of the housing body 10 in the stacking direction of the first layer 11, the intermediate layer 13 and the second layer 15; in particular, it may be, but is not limited to, 5%, 6%, 7%, 8%, 9%, 10%. When the thickness of the first layer 11 is too thin, the compressive stress generated by the first layer 11 is too small, so that the hardness of the shell body 10 is improved less, and when the thickness of the first layer 11 is too thick, the compressive stress generated by the first layer 11 is too large, so that the overall toughness of the shell body 10 is reduced, and in addition, when at least one of the compressive stress applied to the first layer 11, the compressive stress applied to the second layer 15, or the tensile stress applied to the intermediate layer 13 is greater than the limit of the compressive stress applied to the shell body 10, the internal defect, damage or fracture is generated on the first layer 11, the second layer 15, or the intermediate layer 13.

Optionally, the volume expansion rate of the photo-swelling agent is 10% to 100%, in other words, the volume of the photo-swelling agent after light irradiation is 1.1 times to 2 times of the volume before light irradiation. In other words, the volume of the photobulking agent after exposure to light expands by 10% to 100% as compared to the volume before exposure to light. Specifically, the volume expansion rate of the photo-swelling agent may be, but is not limited to, 10%, 20%, 30%, 40%, 50%, 60%, 70%, 80%, 90%, 100%, etc. If the volume expansion ratio of the photo-expansive agent is too small, the degree of expansion of the photo-expansive material in the housing body 10 is small and the internal stress is small after illumination, and the pencil hardness enhancement effect on the housing body 10 is not obvious, and if the volume expansion ratio of the photo-expansive agent is too large, the degree of expansion of the photo-expansive material in the housing body 10 is too large after illumination, and when at least one of the compressive stress applied to the first layer 11, the compressive stress applied to the second layer 15, or the tensile stress applied to the intermediate layer 13 is greater than the limit of the compressive stress applied to the housing body 10, the first layer 11, the second layer 15, or the intermediate layer 13 may have internal defects, damage, or fracture.

Alternatively, the photo-swelling agent may be, but is not limited to, one or more of a cis-azobenzene-containing group, a cinnamic acid-containing group, or a compound, derivative, polymer, mixture, or copolymer containing one or more of a spirochete-containing group.

Alternatively, the azobenzene group-containing compound may be, but is not limited to, azobenzene, derivatives of azobenzene, and the like. The azobenzene group-containing compound, derivative, polymer, mixture, copolymer or the like can undergo molecular isomerization reaction under the action of light, for example, the cis-structure is changed into the trans-structure, and when the azobenzene group is changed from the cis-structure to the trans-structure, the length of the azobenzene group is changed from 0.55nm to 0.90nm, so that volume expansion is caused. The molecular isomerization reaction equation of the compound containing the cis-azobenzene group is as follows:

alternatively, the cinnamic acid group containing copolymer may be, but is not limited to, one or more of a copolymer of acryloyl-cinnamoyl-ethylene glycol and butyl acrylate, a copolymer of acryloyl-cinnamoyl-ethylene glycol and hydroxyethyl methacrylate, and the like. The compound, derivative, polymer, mixture or copolymer of the copolymer containing the cinnamic acid group can generate ring-opening reaction under the action of light, thereby generating volume expansion. The ring-opening reaction equation for compounds containing cinnamic acid groups is as follows:

alternatively, the derivative containing a benzopyranophyll group may be, but is not limited to, a benzopyranolinone. The mixture containing the benzopyranophyll group can be, but is not limited to, a mixture of benzopyranolinum and polymethyl methacrylate. Under the action of light, the benzospiropyrantean group of compounds, derivatives, polymers, mixtures or copolymers containing the benzospiropyrantean group can generate ring-opening reaction, so that volume expansion is generated. The ring-opening reaction equation of the compound containing the benzospiropyrantel group is as follows:

optionally, the content of the photo-expanding agent is 0.005% to 0.15% by weight of the total weight of the case body 10. Specifically, it may be, but not limited to, 0.005%, 0.01%, 0.03%, 0.05%, 0.08%, 0.1%, 0.12%, 0.15%, etc. When the content of the photo-swelling agent is less than 0.005%, the degree of expansion of the photo-variable material in the housing body 10 after light irradiation is small, the internal stress is small, the pencil hardness enhancement effect on the housing body 10 is not obvious, and when the content of the photo-swelling agent is more than 0.15%, the degree of expansion of the photo-variable material in the housing body 10 after light irradiation is too large, and when at least one of the compressive stress applied to the first layer 11, the compressive stress applied to the second layer 15, or the tensile stress applied to the intermediate layer 13 is greater than the limit of the compressive stress applied to the housing body 10, the internal defect, damage, or fracture may occur in the first layer 11, the second layer 15, or the intermediate layer 13.

Optionally, the weight ratio of the inorganic powder to the thermoplastic resin is 1. Specifically, the weight ratio of the inorganic powder to the thermoplastic resin may be, but is not limited to, 1. When the content of the inorganic powder is too small, the wear resistance of the manufactured shell 100 is poor, the service life of the shell 100 is reduced, and meanwhile, the ceramic texture of the shell 100 is affected due to poor surface glossiness. When the content of the inorganic powder is too large, the housing body 10 is difficult to mold, and the manufactured housing 100 has poor toughness and is easily broken. When the weight ratio of the inorganic powder to the thermoplastic resin is 1 to 10, the prepared shell 100 has better ceramic texture and hand feeling, higher pencil hardness, higher toughness and is not easy to break.

Compared with a ceramic matrix prepared from thermosetting resin or thermosetting resin and thermoplastic resin, the shell body 10 is prepared from thermoplastic resin when the shell 100 of the embodiment of the application is prepared, so that the shell body 10 can be prepared in an injection molding manner, and the preparation cost of the shell body 10 is reduced; the ceramic substrate including the thermosetting resin cannot be prepared by injection molding and can only be prepared by other methods except injection molding, so that the preparation cost is high.

In some embodiments, the inorganic powder is an inorganic powder modified with a surfactant. The surface modifier is used for modifying the inorganic powder, so that the compatibility between the inorganic powder and the thermoplastic resin can be increased, the binding force between the inorganic powder and the thermoplastic resin is improved, the inorganic powder and the thermoplastic resin are mixed more uniformly, and the mixed system is more stable, so that the mechanical property of the shell body 10 is improved, and further the mechanical property of the shell 100 is improved.

Optionally, the inorganic powder may be, but is not limited to, a ceramic powder, and the ceramic powder includes one or more of alumina, silica, titania, silicon nitride, silicon, magnesia, chromium oxide, beryllium oxide, vanadium pentoxide, diboron trioxide, spinel, zinc oxide, calcium oxide, mullite, and barium titanate.

Alternatively, the surface modifier may be, but is not limited to, one or more of a silane coupling agent, a borate coupling agent, a titanate coupling agent. Alternatively, the addition amount of the surface modifier is 0.5% to 3% of the weight of the inorganic powder, and specifically, the addition amount of the surface modifier may be, but not limited to, 0.5%, 0.8%, 1.0%, 1.5%, 1.8%, 2.0%, 2.3%, 2.8%, 3.0%, and the like. When the addition amount of the surface modifier is less than 0.5%, the modification of the inorganic powder is incomplete, in other words, part of the inorganic powder is not modified, which affects the binding force between the inorganic powder and the thermoplastic resin, and when the addition amount of the surface modifier is more than 3%, excessive surface modifier molecules are deposited on the surface of the inorganic powder, so that the obtained inorganic powder is easy to agglomerate and is difficult to uniformly disperse in the thermoplastic resin, which is not beneficial to improving the mechanical performance of the shell 100.

Alternatively, the inorganic powder may be prepared by:

1) Dissolving the surface modifier in alcohol, water or alcohol-water mixed solvent, and mixing uniformly; and optionally, the alcohol may be, but is not limited to, ethanol, propanol, etc., and the present application is not particularly limited.

2) Adding inorganic powder, mixing at normal temperature, and drying to obtain inorganic powder.

Specifically, after the inorganic powder is added, the mixture can be placed at normal temperature, mixed by mechanical stirring or ultrasonic waves, and then dried by flash evaporation or in a vacuum drying oven at 60 ℃ to 80 ℃ to obtain the inorganic powder.

In some embodiments, the thermoplastic resin may be, but is not limited to, one or more of Polyphenylene sulfide (PPS), polysulfone (PSU), polyetherSulfone (PES), polyetherketone (PEK), polycarbonate, polyamide, and polymethyl methacrylate. When the thermoplastic resin is one or more of polyphenylene sulfide, polysulfone, polyethersulfone, or polyetherketone, after the housing body 10 is molded, the thermoplastic resin can be subjected to chain extension and crosslinking at a temperature higher than the melting temperature of the thermoplastic resin, so that the crystallinity and the crosslinking degree of the thermoplastic resin are improved, the inorganic powder can be better bound in a crosslinking network of the thermoplastic resin, the bonding force between the thermoplastic resin and the inorganic powder can be improved, and the pencil hardness and the toughness of the manufactured housing 100 can be improved.

In some embodiments, the raw material components of the housing body 10 further include a dispersant, and the dispersant is used to enable the thermoplastic resin and the inorganic powder to be more uniformly mixed, so that the mixed system is more stable. The dispersant may be, but is not limited to, liquid paraffin or the like. The amount of the dispersant added may be 2% to 6% by weight of the total weight of the thermoplastic resin and the inorganic powder, and specifically, may be, but is not limited to, 2%, 3%, 4%, 5%, 6%, and the like.

In some embodiments, the raw material composition of the housing body 10 further includes a plasticizer for enhancing the plasticity of the thermoplastic resin and the fluidity of the molten state, thereby reducing the processing temperature of the housing body 10 and improving the processability of the housing 100. The plasticizer may be, but is not limited to, dioctyl oxalate, and the amount of the plasticizer added may be 2% to 6% by weight, specifically, 2%, 3%, 4%, 5%, 6%, and the like, based on the total weight of the thermoplastic resin and the inorganic powder.

In some embodiments, the raw material components of the housing body 10 further include a pigment for providing the housing body 10 with a colored pattern or color, so that the housing 100 has a colored pattern or color, such as a pattern and color of a blue-and-white porcelain. By controlling the color and the ratio of the pigment, the housing body 10 can present different appearance effects, so that the housing 100 presents different appearance effects. Alternatively, the addition amount of the pigment may be 0.5% to 5% by weight of the total weight of the thermoplastic resin and the inorganic powder, and specifically, may be, but is not limited to, 0.5%, 1%, 2%, 3%, 4%, 5%, and the like.

Optionally, the thickness of the housing body 10 is 0.3mm to 1mm; specifically, the thickness of the case body 10 may be, but is not limited to, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, and the like. When the housing body 10 is too thin, the supporting and protecting functions cannot be well performed, the mechanical strength cannot well meet the requirements of the electronic device housing 100, and when the housing body 10 is too thick, the weight of the electronic device is increased, the hand feeling of the electronic device is affected, and the user experience is not good.

Alternatively, the surface roughness of the case body 10 is Ra 0.02 to Ra 0.08, and specifically, may be, but not limited to, ra 0.02, ra 0.03, ra 0.04, ra 0.05, ra 0.06, ra0.07, ra 0.08, or the like. If the roughness is too large, the ceramic texture of the shell 100 is affected, and if the roughness is too small, the process requirements are too strict, and the preparation cost is high.

Optionally, the pencil hardness of the housing body 10 is 2H to 9H; specifically, it may be, but not limited to, 2H, 3H, 4H, 5H, 6H, 7H, 8H, 9H, etc. When the hardness of the pencil of the casing body 10 is too small, the wear resistance of the manufactured casing 100 is poor, and the glossiness and the ceramic texture of the surface of the casing 100 are affected after the casing 100 is used for a period of time.

Referring to fig. 3, in some embodiments, the shell 100 of the embodiment of the present application further includes a protective layer 30, where the protective layer 30 is disposed on a surface of the shell body 10, and the protective layer 30 is used for preventing dirt and fingerprints, so as to improve the user experience of the shell 100.

In some embodiments, the water contact angle of the overcoat layer 30 is greater than 105 °, specifically, may be, but is not limited to, 106 °, 110 °, 115 °, 120 °, 125 °, 130 °, 140 °, 150 °, etc., and the greater the water contact angle, the better the anti-fingerprint effect of the overcoat layer 30.

Optionally, the protective layer 30 is light transmissive, and the optical transmittance of the protective layer 30 is greater than or equal to 80%, and specifically, may be, but is not limited to, 80%, 82%, 85%, 88%, 90%, 92%, 95%, 96%, 97%, and the like. The protective layer 30 has a high transmittance, so that the ceramic texture and grain color of the housing body 10 are not shielded, thereby affecting the appearance of the housing 100.

In some embodiments, the raw material component of the protective layer 30 may include, but is not limited to, one or more of perfluoropolyether, perfluoropolyether derivatives, and the like, and the protective layer 30 is formed by evaporating a glue solution composed of the raw material component of the protective layer 30 on the surface of the case body 10. The perfluoropolyether and the perfluoropolyether derivative have excellent fingerprint resistance and can play a good role in fingerprint resistance and stain resistance. Alternatively, the thickness of the protective layer 30 is 5nm to 20nm, and specifically, may be, but not limited to, 5nm, 6nm, 8nm, 10nm, 12nm, 14nm, 16nm, 18nm, 20nm, and the like. If the thickness of the protective layer 30 is too thin, the antifouling and fingerprint-proof effects cannot be achieved, and if the thickness of the protective layer 30 is too thick, the manufacturing cost of the housing 100 is increased, and the hand feeling of the housing 100 is also affected.

Referring to fig. 2 and fig. 4, an embodiment of the present application further provides a method for manufacturing the housing 100, and the method for manufacturing the housing 100 can be applied to manufacture the housing 100 of the above embodiments. The housing 100 includes a housing body 10, and the method of manufacturing the housing 100 includes:

s201, mixing inorganic powder with thermoplastic resin, and molding to obtain a blank.

Alternatively, the mixing may employ, but is not limited to, one or more of dry mixing and wet mixing. The term "dry mixing" as used herein refers to the manner in which the solid components are mixed by, for example, ball milling, sand milling, mechanical blending, and the like. The term "wet mixing" as used herein refers to the mixing of the solid components by, for example, ball milling, sanding, mechanical blending, etc., under the influence of water or other liquid.

Alternatively, the molding may be, but is not limited to, one or more of injection molding, high temperature compression molding, hot press molding, and the like.

Optionally, when the molding is injection molding, the injection molding temperature is Tm to Tm +80 ℃, where Tm is the melting temperature of the thermoplastic resin. The term "melting temperature" as used herein refers to the temperature at which the thermoplastic resin is fully converted from a high elastic state to a molten state. Specifically, the injection molding temperature may be, but is not limited to, tm +10 ℃, tm +20 ℃, tm +30 ℃, tm +40 ℃, tm +50 ℃, tm +60 ℃, tm +70 ℃, tm +80 ℃, and the like. When the injection molding temperature is too low, the viscosity of the thermoplastic resin is too high and the fluidity is poor, so that the prepared shell body 10 has obvious flow marks, an unattractive appearance, large porosity and low pencil hardness and toughness. When the injection molding temperature is too high, the thermoplastic resin may be partially decomposed, and the mechanical properties of the housing body 10 may be affected. In some embodiments, the temperature of the injection molding is 200 ℃ to 350 ℃, and specifically, may be, but is not limited to, 200 ℃, 220 ℃, 240 ℃, 250 ℃, 270 ℃, 290 ℃, 310 ℃, 330 ℃, 350 ℃, 360 ℃, and the like. In one embodiment, when the thermoplastic resin is polyphenylene sulfide having a Tm of 295 ℃, the injection molding temperature ranges from 300 ℃ to 360 ℃. The injection molding temperature of the present application refers to the temperature of the head of the injection molding machine.

In one embodiment, the thermoplastic resin is polyphenylene sulfide, and the injection molding is performed by gradually increasing the temperature in an injection molding machine in the following temperature ranges: the first temperature range is 270 ℃ to 290 ℃, the second temperature range is 290 ℃ to 310 ℃, the third temperature range is 310 ℃ to 330 ℃, the fourth temperature range is 330 ℃ to 350 ℃, and the head temperature is 330 ℃ to 350 ℃; temperature of the die: 160 ℃.

In this embodiment, the thermoplastic resin may be, but is not limited to, one or more of polyphenylene sulfide, polysulfone, polyethersulfone, polyetherketone, polycarbonate, polyamide, and polymethyl methacrylate.

For a detailed description of the inorganic powder and the thermoplastic resin, reference is made to the description of the corresponding parts of the above embodiments, which are not repeated herein.

When the raw material components of the housing body 10 further include one or more of a dispersant, a plasticizer, and a pigment, the step S201 further includes mixing the one or more of a dispersant, a plasticizer, and a pigment with the inorganic powder and the thermoplastic resin.

In some embodiments, after the mixing of the inorganic powder with the thermoplastic resin, before the molding; the method further comprises the following steps:

and (2) carrying out banburying granulation on the mixed inorganic powder and the thermoplastic resin, wherein the banburying granulation process is in a negative pressure state (in other words, a vacuum state) or an inert atmosphere, and the banburying granulation temperature is Tm to Tf, wherein Tf is the decomposition temperature of the thermoplastic resin, in other words, TF is the temperature at which the thermoplastic resin starts to decompose. The internal mixing is carried out at the temperature above the melting temperature of the thermoplastic resin, the thermoplastic resin is in a molten state, and the clustered inorganic powder can be well scattered in the internal mixing process, so that the inorganic powder can be more uniformly dispersed in the thermoplastic resin, and the mechanical property of the prepared shell 100 is improved. In addition, when the thermoplastic resin is subjected to banburying, the thermoplastic resin starts to melt and flow, and each molecular chain of the thermoplastic resin moves and is wound together to form a three-dimensional through network structure, so that the bonding force between molecules of the thermoplastic resin and between the thermoplastic resin and inorganic powder is increased, and meanwhile, the inorganic powder can be wrapped in the network structure formed by the thermoplastic resin, so that the hardness and the toughness of the formed shell body 10 are increased. The banburying process is in a negative pressure state, so that the thermoplastic resin can be better prevented from being oxidized, and in addition, in the banburying process, gas generated by side reaction can be better discharged, so that the gas generated by the side reaction is prevented from staying in a system to form air holes to influence the mechanical property of the prepared shell body 10.

In some embodiments, the temperature of the banburying granulation is 200 ℃ to 350 ℃, and specifically, may be, but is not limited to, 200 ℃, 220 ℃, 240 ℃, 250 ℃, 270 ℃, 290 ℃, 310 ℃, 330 ℃, 350 ℃ and the like. In one embodiment, when the thermoplastic resin is polyphenylene sulfide having a Tm of 295 ℃, the internal mixing granulation temperature ranges from 300 ℃ to 360 ℃.

Alternatively, the air pressure of the banburying process is less than 0.01MPa, and for example, it may be, but not limited to, 0.008MPa, 0.005MPa, 0.001MPa, 0.0008MPa, 0.0005MPa, 0.0001MPa, etc. The smaller the gas pressure in the banburying process, the less easily the thermoplastic resin is oxidized, and the more advantageously the discharge of the gas generated by the side reaction is facilitated, however, the smaller the gas pressure, the higher the requirements for the reaction equipment are, and the operational risk factor is increased. Furthermore, the banburying process may be carried out in an inert atmosphere, in other words, the banburying process is carried out under the protection of an inert gas such as nitrogen or argon.

Optionally, the banburying time is 2h to 12h, and specifically, may be, but is not limited to, 2h, 4h, 6h, 8h, 6h, 10h, 12h, and the like. If the banburying time is too short, the inorganic powder and the thermoplastic resin cannot be sufficiently mixed (the mixture is not uniform), and if the banburying time is too long, the mixing uniformity between the inorganic powder and the thermoplastic resin cannot be greatly changed.

And S202, introducing a photo-swelling agent into the surface layer of the blank body.

In some embodiments, the introducing a photo-expanding agent into the surface layer of the embryo body includes: and coating a photo-swelling agent solution on the surface of the blank body so that the photo-swelling agent enters the surface layer of the blank body.

Specifically, a photo-swelling agent is dissolved in a solvent to form a photo-swelling agent solution, and then the photo-swelling agent solution is sprayed, spin-coated, or coated on the surface of a blank, and then the blank is placed in a vacuum drying oven to be dried, for example: baking at any temperature below the boiling point of the solvent under the air pressure of less than 0.1Mpa for 12-24 h.

Alternatively, the mass concentration of the photo-swelling agent in the photo-swelling agent solution is 0.1mg/mL to 5mg/mL, and specifically, may be, but is not limited to, 0.1mg/mL, 0.5mg/mL, 1mg/mL, 2mg/mL, 3mg/mL, 4mg/mL, 5mg/mL, and the like, when the mass concentration of the photo-swelling agent in the photo-swelling agent solution is too small, the amount of the photo-swelling agent entering the surface layer of the embryo body is small, so that the improvement of pencil hardness and abrasion resistance of the shell 100 is insignificant, when the mass concentration of the photo-swelling agent in the photo-swelling agent solution is too large, the degree of swelling of the photo-material in the shell body 10 after light irradiation is too large, and when at least one of the compressive stress to which the first layer 11 is subjected, the compressive stress to the second layer 15, or the tensile stress to which the intermediate layer 13 is subjected to is greater than the limit of the compressive stress to which the shell body 10, the internal defect, damage or fracture of the intermediate layer 11, 15 or the intermediate layer 13 is generated.

Alternatively, the solvent may be, but is not limited to, one or more of ethanol, acetone, ethyl acetate, benzene, toluene, dichloromethane, and the like.

Optionally, after the photo-swelling agent solution is coated on the surface of the blank, the blank is placed for 1min to 5min, and then placed in a vacuum drying oven for drying, specifically, the placing time may be, but is not limited to, 1min, 2min, 3min, 4min, 5min, and the like. If the standing time is too short, the photo-expansion agent only stays on a very thin surface layer, and after illumination, the compressive stress generated by the first layer 11 and the second layer 15 is too small, so that the hardness of the prepared shell body 10 is improved slightly; the thickness of the photo-expanding agent entering the blank is thicker if the standing time is too long, the thickness of the first layer 11 and the second layer 15 in the formed shell body 10 is thicker, the compressive stress generated by the first layer 11 and the second layer 15 is too large, so that the overall toughness of the prepared shell body 10 is reduced, and in addition, when at least one of the compressive stress applied to the first layer 11, the compressive stress applied to the second layer 15 or the tensile stress applied to the intermediate layer 13 is greater than the limit of the compressive stress applied to the shell body 10, the internal defect, damage or fracture is generated on the first layer 11, the second layer 15 or the intermediate layer 13.

In other embodiments, the introducing a photo-expanding agent into the surface layer of the blank includes: and immersing the blank body into the photo-swelling agent solution so that the photo-swelling agent enters the surface layer of the blank body.

Specifically, a photo-swelling agent is dissolved in a solvent to form a photo-swelling agent solution, and then the embryo body is soaked in the photo-swelling agent solution and then placed in a vacuum drying oven to be dried, for example: baking at any temperature below the boiling point of the solvent under the air pressure of less than 0.1Mpa for 12-24 h. Alternatively, the solvent may be, but is not limited to, one or more of ethanol, acetone, ethyl acetate, benzene, toluene, dichloromethane, and the like.

Optionally, after soaking the embryo body in the photo-swelling agent solution for 1min to 5min, placing the embryo body in a vacuum drying oven for drying, specifically, the soaking time may be, but is not limited to, 1min, 2min, 3min, 4min, 5min, and the like. If the soaking time is too short, the photo-expansion agent only stays in a very thin layer of the surface layer, and after illumination, the compressive stress generated by the first layer 11 and the second layer 15 is too small, so that the hardness of the prepared shell body 10 is improved slightly; when the soaking time is too long, the thickness of the photo-swelling agent entering the blank is thick, the thickness of the first layer 11 and the second layer 15 in the formed shell body 10 is thick, the compressive stress generated by the first layer 11 and the second layer 15 is too large, so that the overall toughness of the prepared shell body 10 is reduced, and in addition, when at least one of the compressive stress applied to the first layer 11, the compressive stress applied to the second layer 15, or the tensile stress applied to the intermediate layer 13 is larger than the limit of the compressive stress applied to the shell body 10, the internal defect, damage or fracture is generated on the first layer 11, the second layer 15, or the intermediate layer 13.

Compared with a coating method, the introduction of the photo-swelling agent in a soaking manner can make the distribution of the photo-swelling agent on the surface of the blank more uniform, so that the overall mechanical property of the prepared shell body 10 is more uniform.

Compared with the method of introducing the photo-expanding agent in other ways, the photo-expanding agent in the case body 10 prepared in the embodiment of the present application is introduced by coating or soaking, so that the distribution of the photo-expanding agent in the case body 10 gradually decreases from the surface of the first layer 11 or the second layer 15 away from the intermediate layer 13 to the surface of the first layer 11 or the second layer 15 close to the intermediate layer 13, and the prepared case 100 has better surface pencil hardness and wear resistance.

In other embodiments, when the photo-expansion agent is liquid at normal temperature, the blank body can be directly soaked in the liquid photo-expansion agent; alternatively, the liquid photo-swelling agent is applied directly to the surface of the embryo body.

For the description of other features of the photo-swelling agent, please refer to the description of the corresponding parts of the above embodiments, and the description is omitted.

S203, performing light irradiation to expand the volume of the photo-expansion agent, thereby obtaining the housing body 10.

Specifically, ultraviolet light, visible light, near-infrared light, or the like is used to irradiate the embryo body with the photo-swelling agent introduced into the surface layer, so that the photo-swelling agent in the embryo body undergoes a molecular isomerization reaction, a ring opening reaction, or the like to increase the molecular size of the photo-swelling agent, thereby expanding the volume of the photo-swelling agent. The light source for the illumination may be, but is not limited to, ultraviolet light, visible light, near infrared light, and the like.

Optionally, the intensity of the illumination is 5m ² To 50W/m ² (ii) a In particular, it may be, but is not limited to, 5m ² 、10W/m ² 、15m ² 、20W/m ² 、25m ² 、30W/m ² 、35m ² 、40W/m ² 、45m ² 、50W/m ² And the like. If the light intensity is too low, the volume expansion rate of the photo-expansion agent is too small, the compressive stress generated in the prepared shell body 10 is too small, and the hardness of the shell body 10 is not obviously improved; if the light intensity is too high, the photo-expansion agent expands too fast, and the volume expansion rate of the photo-expansion agent is too large, which easily exceeds the limit of the pressure stress of the shell body 10, so that the prepared shell body 10 has internal defects, damages or fractures.

Optionally, the time of the illumination is 5S to 10min; specifically, it may be, but not limited to, 5S, 20S, 40S, 1min, 2min, 3min, 4min, 5min, 6min, 7min, 8min, 9min, 10min, etc. If the illumination time is too short, the volume expansion rate of the photo-expansion agent is too small, and the compressive stress generated in the prepared shell body 10 is too small, so that the hardness of the shell body 10 is not obviously improved; if the light irradiation time is too long, the volume expansion rate of the photo-expansion agent is too large, and the limit of the housing body 10 subjected to the compressive stress is easily exceeded, so that the manufactured housing body 10 has internal defects, damages, fractures, and the like.

According to the preparation method of the shell 100, the thermoplastic resin and the inorganic powder are adopted to prepare the blank, the photo-expansion agent is introduced into the surface layer of the blank, and the photo-expansion agent is subjected to volume expansion through illumination, so that the prepared shell 100 has the advantages of light weight, high-glossiness ceramic texture, low processing condition and low cost, and the shell 100 has higher hardness and wear resistance. Meanwhile, the photo-expansion agent is introduced after the blank is prepared, the base materials among the first layer 11, the middle layer 13 and the second layer 15 are the same, and the base materials are all formed in the same manufacturing process (such as in injection molding), so that no phase interface exists among the first layer 11, the middle layer 13 and the second layer 15, the shell 100 is better in integrity, and is not easy to generate a layering phenomenon after long-time use, and the shell has a longer service life.

Referring to fig. 2 and fig. 5 together, an embodiment of the present application further provides a method for manufacturing the housing 100, and the method for manufacturing the housing 100 can be applied to manufacture the housing 100 of the above embodiments. The housing 100 includes a housing body 10, and the method of manufacturing the housing 100 includes:

s301, mixing inorganic powder with thermoplastic resin to obtain a mixture;

when the raw material components of the housing body 10 further include one or more of a dispersant, a plasticizer, and a pigment, the step S301 further includes mixing the one or more of a dispersant, a plasticizer, and a pigment with the inorganic powder and the thermoplastic resin.

S302, banburying and granulating the mixture;

s303, performing injection molding to obtain a blank;

s304, introducing a photo-swelling agent into the surface layer of the blank;

s305, irradiating light to expand the volume of the photo-expansion agent;

for detailed descriptions of step S302 to step S305, refer to the descriptions of the corresponding parts of the above embodiments, which are not repeated herein.

And S306, carrying out warm isostatic pressing on the blank to obtain the shell body 10.

Specifically, the blank body is placed into a sheath, the sheath is vacuumized to remove gas adsorbed on the surface of the blank body, the inner space of the blank body and the sheath, the blank body is subjected to vacuum sealing, and the blank body is placed into a pressure container with a heating furnace for isostatic pressing after the vacuum sealing. Generally, the injection molding time is short, the thermoplastic resin molecular chains do not have sufficient time to move and intertwine with each other, the porosity of the formed blank is large, the improvement of the pencil hardness and the toughness of the manufactured shell body 10 is not facilitated, the blank is subjected to isostatic pressing, the chain segments in the thermoplastic resin molecular chains can have sufficient time to move, the compactness between the thermoplastic resin and the inorganic powder in the manufactured shell 100 can be improved, the elimination of air holes of a thermoplastic resin and inorganic powder system is facilitated, the acting force between the thermoplastic resin and the inorganic powder is enhanced, and therefore the mechanical properties of the shell 100, such as the pencil hardness, the toughness, the bending strength and the like, are improved.

Optionally, the temperature of the warm isostatic pressing ranges from Tg +20 ℃ to Tg +60 ℃, wherein Tg is the glass transition temperature of the thermoplastic resin. Specifically, the temperature of the warm isostatic pressing may range from, but is not limited to, tg +20 ℃, tg +30 ℃, tg +40 ℃, tg +50 ℃, tg +60 ℃, and the like. In this temperature range, the thermoplastic resin is in a high elastic state, the chain segment in the molecular chain of the thermoplastic resin can move, and meanwhile, the thermoplastic resin and the inorganic powder can be more compact under the action of pressure, which is helpful for eliminating the air holes of the thermoplastic resin and inorganic powder system, and enhancing the acting force between the thermoplastic resin and the inorganic powder, thereby improving the mechanical properties of the shell 100, such as pencil hardness, toughness, bending strength, and the like.

The term "glass transition temperature" herein refers to the temperature at which the thermoplastic resin is completely converted from a glassy state to a highly elastic state.

In some embodiments, the temperature of the warm isostatic press ranges from 80 ℃ to 300 ℃; specifically, the temperature may be, but not limited to, 80 ℃, 100 ℃, 120 ℃, 150 ℃, 180 ℃, 200 ℃, 230 ℃, 250 ℃, 280 ℃, 300 ℃ and the like. In one embodiment, when the thermoplastic resin is polyphenylene sulfide having a Tg of 95 ℃, the temperature of the warm isostatic press ranges from 115 ℃ to 155 ℃.

The pressure range of the warm isostatic pressing is 50MPa to 500MPa; specifically, it may be, but not limited to, 50MPa, 80MPa, 100MPa, 150MPa, 200MPa, 250MPa, 300MPa, 350MPa, 400MPa, 450MPa, 500MPa, etc. When the pressure is within this range, the movement of the segments in the molecular chain of the thermoplastic resin can be accelerated, so that the combination between the segments of the thermoplastic resin and between the molecules of the thermoplastic resin and the inorganic powder is further densified, and simultaneously, the elimination of the pores in the system is facilitated, and the hardness and toughness of the pencil of the manufactured shell body 10 are further improved, thereby improving the hardness and toughness of the pencil of the manufactured shell 100. When the pressure is too small, it is difficult to compact the thermoplastic resin and the inorganic powder, which is disadvantageous to the densification of the green body, and when the pressure is too large, it contributes little to the further densification of the green body, but is critical to the equipment.

Alternatively, the time of the warm isostatic pressing is 0.5h to 3h, and specifically, may be, but is not limited to, 0.5h, 0.8h, 1h, 1.2h, 1.5h, 2h, 3h, and the like. When the time of the warm isostatic pressing is too short, the chain segment of the molecular chain of the thermoplastic resin does not have enough time to move and deform, which is not beneficial to the densification between the thermoplastic resin and the inorganic powder, is not beneficial to eliminating the air holes of the thermoplastic resin and the inorganic powder system, and is also not beneficial to enhancing the acting force between the thermoplastic resin and the inorganic powder. When the time of the warm isostatic pressing is too long, the thermoplastic resin and the inorganic powder in the green body are difficult to be further densified, and the influence on the performance of the produced shell body 10 is small.

In some embodiments, after the housing body 10 is manufactured, the housing 100 is machined by computer numerical control precision machining (CNC machining) and polished to obtain the housing 100 conforming to the specifications of the electronic device.

Referring to fig. 2 and fig. 6, an embodiment of the present application further provides a method for manufacturing the housing 100, and the method for manufacturing the housing 100 can be applied to manufacture the housing 100 of the above embodiments. The housing 100 includes a housing body 10, and the method of manufacturing the housing 100 includes:

s401, mixing inorganic powder with thermoplastic resin to obtain a mixture;

in this embodiment, the thermoplastic resin is one or more of polyphenylene sulfide, polysulfone, polyethersulfone, and polyetherketone. For the description of other features, refer to the description of the corresponding parts of the above embodiments, and are not repeated herein.

S402, banburying and granulating the mixture;

s403, performing injection molding to obtain a blank;

s404, introducing a photo-swelling agent into the surface layer of the blank;

s405, irradiating light to enable the volume of the photo-swelling agent to expand;

s406, carrying out warm isostatic pressing on the blank;

for detailed descriptions of steps S402 to S406, refer to the descriptions of the corresponding parts of the above embodiments, which are not repeated herein.

S407, heat treatment is performed to obtain the housing body 10.

Alternatively, the blank subjected to the warm isostatic pressing treatment is placed in an air or oxygen atmosphere, and is subjected to a heat treatment at a high temperature and a high pressure to obtain the housing body 10.

Alternatively, the temperature of the heat treatment ranges from Tm to Tm +70 ℃, and specifically, may be, but is not limited to, tm +10 ℃, tm +20 ℃, tm +30 ℃, tm +35 ℃, tm +40 ℃, tm +45 ℃, tm +50 ℃, tm +55 ℃, tm +60 ℃, tm +65 ℃, tm +70 ℃ and the like. When the temperature is within this range, chain extension reaction occurs among molecules of the thermoplastic resin (e.g., polyphenylene sulfide), and in addition, oxidation crosslinking reaction occurs among molecules of the thermoplastic resin under the action of oxygen, so that the molecular weight and the crosslinking degree of the thermoplastic resin are improved, the inorganic powder can be better bound in a crosslinking network of the thermoplastic resin, the bonding force between the thermoplastic resin and the inorganic powder is favorably improved, and the pencil hardness and the toughness of the prepared shell 100 are further improved. Meanwhile, the temperature of the heat treatment is controlled below Tm +70 ℃, so that the occurrence of the chain extension reaction and the crosslinking reaction is not too fast, the crosslinking degree is controlled in a certain range, the crystallinity and the crosslinking degree of the thermoplastic resin in the formed shell body 10 are effectively controlled, and the toughness of the shell body 10 is not reduced due to the excessively high crosslinking degree.

In some embodiments, the temperature of the heat treatment is 100 ℃ to 360 ℃, and specifically, may be, but is not limited to, 100 ℃, 130 ℃, 150 ℃, 180 ℃, 200 ℃, 220 ℃, 240 ℃, 250 ℃, 270 ℃, 290 ℃, 310 ℃, 330 ℃, 360 ℃, and the like.

Taking polyphenylene sulfide (PPS) as an example of the thermoplastic resin, when the thermoplastic resin is polyphenylene sulfide (PPS), the temperature of the heat treatment ranges from 320 ℃ to 360 ℃; specifically, it may be, but not limited to, 320 ℃, 325 ℃, 330 ℃, 335 ℃, 340 ℃, 345 ℃, 350 ℃, 360 ℃ or the like. At this time, the main chemical reaction equation occurring between the molecular chains of the thermoplastic resin is as follows:

■chain extension

■Oxidative crosslinking

Optionally, the pressure of the heat treatment is 0Mpa to 100Mpa; specifically, it may be, but not limited to, 0MPa, 10MPa, 20MPa, 30MPa, 40MPa, 50MPa, 55MPa, 60MPa, 65MPa, 70MPa, 75MPa, 80MPa, 85MPa, 90MPa, 100MPa, etc. The pressure is favorable for maintaining the shape of the blank body, can accelerate the movement between the thermoplastic resin molecular chains, further densifys the combination between the thermoplastic resin molecular chains and between the thermoplastic resin molecules and the inorganic powder, and is favorable for further improving the pencil hardness and the toughness of the prepared shell body 10, thereby improving the pencil hardness and the toughness of the prepared shell 100.

Alternatively, the time of the heat treatment may range from 1h to 12h, and specifically, may be, but is not limited to, 1h, 2h, 3h, 4h, 5h, 6h, 7h, 8h, 9h, 10h, 11h, 12h, and the like. The heat treatment time is too short, the chain extension reaction and the crosslinking reaction degree of the thermoplastic resin are too low, and the toughness of the formed shell body 1010 is reduced; the long heat treatment time results in an excessively high degree of crosslinking of the thermoplastic resin, and the resulting housing body 10 has an excessively large brittleness and insufficient toughness.

It should be understood that the above-mentioned banburying granulation, injection molding, warm isostatic pressing and heat treatment can be performed at a certain temperature point of each temperature range, each stage can also be performed by gradually increasing the temperature in a temperature interval, and when the temperature satisfies the above-mentioned interval range, which manner is specifically adopted, the application is not limited specifically.

In some embodiments, after the housing body 10 is manufactured, the housing 100 is machined by Computer Numerical Control (CNC) machining, and surface grinding and polishing are performed to obtain the housing 100 conforming to the specifications of the electronic device.

Referring to fig. 2 and fig. 7, an embodiment of the present application further provides a method for manufacturing the housing 100, and the method for manufacturing the housing 100 can be applied to manufacture the housing 100 of the above embodiments. The shell 100 comprises a shell body 10 and a protective layer 30, wherein the protective layer 30 is arranged on the surface of the shell body 10, and the preparation method of the shell 100 comprises the following steps:

s501, mixing inorganic powder with thermoplastic resin to obtain a mixture;

in this embodiment, the thermoplastic resin is one or more of polyphenylene sulfide, polysulfone, polyethersulfone, and polyetherketone. For descriptions of other features, please refer to the description of the corresponding parts in the above embodiments, which is not repeated herein.

S502, banburying and granulating the mixture;

s503, performing injection molding to obtain a blank;

s504, introducing a photo-swelling agent into the surface layer of the blank;

s505, irradiating light to enable the volume of the photo-swelling agent to swell;

s506, carrying out warm isostatic pressing on the blank;

s507, heat treatment is performed to obtain the case body 10.

For detailed descriptions of steps S502 to S507, refer to the descriptions of the corresponding parts of the above embodiments, which are not repeated herein.

S508, forming the protective layer 30 on the surface of the housing body 10.

Specifically, a glue solution composed of one or more of raw material components of the protective layer 30, such as perfluoropolyether, perfluoropolyether derivatives, and the like, is evaporated on the surface of the case body 10 to form the protective layer 30. The protective layer 30 is used for anti-smudging and anti-fingerprint to improve the user experience of the housing 100.

The housing 100 produced in the examples of the present application is further described below by way of specific examples and comparative examples.

Examples 1 to 6

The case 100 of examples 1 to 6 was prepared by the following steps:

1) Respectively weighing modified alumina and polyphenylene sulfide in a weight ratio of 1;

2) Mixing the modified alumina and the polyphenylene sulfide to obtain a mixture;

3) Banburying and granulating the mixture at 330 ℃ under the protection of inert gas to obtain granules;

4) Performing injection molding on the granules at 350 ℃ to obtain a blank, wherein the thickness of the blank is 0.8mm;

5) Preparing a photo-swelling agent solution: dissolving a mixture of benzospiropyran indoline and polymethyl methacrylate in ethanol to obtain a photoinduced swelling solution, wherein: the mol content of the benzopyranoindoline is 5.1 percent of the total mol number of the benzopyranoindoline and the polymethyl methacrylate;

6) Soaking the embryo body of 4) in the photo-swelling agent solution of 5) for a period of time, and then carrying out vacuum drying in a vacuum drying oven at 55 ℃ for 24 hours to obtain four embryos containing the photo-swelling agent;

7) Irradiating the blank containing the photo-swelling agent by using ultraviolet light with the illumination intensity of 30W/m ² The illumination time is 5min;

8) Carrying out isostatic pressing on the blank body for 1 hour at 120 ℃ and under the pressure of 200 Mpa;

9) Heat treatment was performed at 330 ℃ for 3 hours to obtain the case 100.

Comparative example 1

The case of comparative example 1 was prepared by the following steps:

3) Carrying out banburying granulation on the mixture at 330 ℃ under the protection of inert gas to obtain granules;

5) Carrying out warm isostatic pressing on the blank at 120 ℃ and under the pressure of 200Mpa for 1 hour;

6) And carrying out heat treatment at 330 ℃ for 3h to obtain the shell.

The casing pencil hardness, abrasion resistance and ball drop height prepared in the above examples and comparative examples were tested by the following methods:

1) And (3) testing pencil hardness: GB/T6739-1996.

2) And (3) wear resistance test: the shell surface was rubbed until significant scratching was observed using the GB10810.5-2012 standard.

3) Falling ball impact test: making the shell into a flat sheet with the size of 150mm multiplied by 73mm multiplied by 0.8mm; the samples of the above-mentioned embodiment and comparative example were respectively supported on a jig (four sides of the case were each supported by a jig 3mm high, the middle was suspended), a stainless steel ball with a weight of 32g was freely dropped from a certain height onto the surface of the case to be measured, five points in the four corners and the center of the case were measured, each point was measured 5 times until the case was broken, and the height when the case was broken was the ball drop height. The higher the ball drop height, the more ductile the shell is, and the less likely it will crack.

The test results are shown in table 1 below.

TABLE 1 Molding of cases, pencil hardness and falling ball height of examples and comparative examples

As can be seen from table 1, when the concentrations of the photo-swelling agent solutions are the same, the longer the soaking time is, the higher the content of the photo-swelling agent in the obtained shell body is, and the thicker the thicknesses of the first layer and the second layer of the shell body are, the better the pencil hardness and the wear resistance of the obtained shell body are; when the content of the photo-expansion agent in the shell body is within a certain range, the toughness of the shell body cannot be reduced due to the increase of the content of the photo-expansion agent, but when the content of the photo-expansion agent in the shell body is increased to a certain degree, the toughness of the shell body is reduced, and therefore the content of the photo-expansion agent is controlled within a certain range. When the soaking time is the same and the concentrations of the photo-swelling agent solutions are different, the higher the concentration of the photo-swelling agent solution is, the thicker the thicknesses of the first layer 11 and the second layer 15 of the case body 10 are, and the better the pencil hardness and the wear resistance of the obtained case body are.

Referring to fig. 8, an embodiment of the present application further provides an electronic device 600, which includes: a display component 610 for displaying; in the housing 100 according to the embodiment of the present application, the housing 100 and the display module 610 enclose an accommodating space 601; and a circuit board assembly 630, wherein the circuit board assembly 630 is disposed in the accommodating space 601, electrically connected to the display assembly 610, and configured to control the display assembly 610 to display.

The electronic device 600 of the embodiment of the present application may be, but is not limited to, a portable electronic device such as a mobile phone, a tablet, a notebook, a desktop, a smart band, a smart watch, an electronic reader, and a game console.

For a detailed description of the housing 100, please refer to the description of the corresponding parts of the above embodiments, which is not repeated herein.

Alternatively, the display module 610 may be, but is not limited to, one or more of a liquid crystal display module, a light emitting diode display module (LED display module), a micro light emitting diode display module (micro LED display module), a sub-millimeter light emitting diode display module (MiniLED display module), an organic light emitting diode display module (OLED display module), and the like.

Referring also to fig. 9, optionally, the circuit board assembly 630 may include a processor 631, a memory 633 and a power supply 635. The processor 631 is electrically connected to the display assembly 610, the memory 633 and the power supply 635 respectively. The processor 631 is configured to control the display component 610 to display, and the memory 633 is configured to store program codes required by the processor 631 to run, program codes required by the processor 610 to control the display component 610, display contents of the display component 610, and the like. The power supply 635 is used for supplying power for the processor 631 to operate.

Alternatively, processor 631 comprises one or more general-purpose processors, wherein a general-purpose processor may be any type of device capable of Processing electronic instructions, including a Central Processing Unit (CPU), a microprocessor, a microcontroller, a main processor, a controller, an ASIC, and the like. The processor 631 is operative to execute various types of digitally stored instructions, such as software or firmware programs stored in the memory 633, which enable the computing device to provide a wide variety of services.

Alternatively, the Memory 633 may include a Volatile Memory (Volatile Memory), such as a Random Access Memory (RAM); the Memory 633 may also include a Non-volatile Memory (NVM), such as a Read-Only Memory (ROM), a Flash Memory (FM), a Hard Disk Drive (HDD), or a Solid-State Drive (SSD). The memory 633 may also comprise a combination of the above-mentioned kinds of memories.

Optionally, the power supply 635 may be, but is not limited to, a battery, a power supply circuit, and the like.

Reference herein to "an embodiment" or "an implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A housing, comprising:

the shell comprises a shell body, wherein the raw material components of the shell body comprise inorganic powder, thermoplastic resin and a photoinduced expanding agent; the weight content of the photo-swelling agent is 0.005-0.15% of the total weight of the shell body.

2. The shell according to claim 1, wherein the shell body comprises a first layer, a second layer and an intermediate layer, wherein the first layer and the second layer are sequentially stacked, the intermediate layer is arranged between the first layer and the second layer, and raw material components of the first layer and the second layer respectively comprise inorganic powder, thermoplastic resin and a photo-expansion agent; the raw material components of the middle layer comprise inorganic powder and thermoplastic resin.

3. The case of claim 2, wherein the amount of the photo-expansion agent in the first layer decreases from the surface of the first layer distal from the intermediate layer to the surface of the first layer proximal to the intermediate layer; the content of the photo-swelling agent in the second layer decreases from the surface of the second layer remote from the intermediate layer to the surface of the second layer close to the intermediate layer.

4. The housing of claim 3, wherein the thickness of the first layer is 5% to 10% of the thickness of the housing body in the direction of lamination of the first layer, the intermediate layer, and the second layer; the thickness of the second layer is 5% to 10% of the thickness of the housing body.

5. The case of claim 4, wherein the volume expansion of the photo-expanding agent is between 10% and 100%.

6. The housing of claim 5 wherein the photo-swelling agent is one or more of a compound, derivative, polymer, mixture or copolymer containing one or more of cis-azobenzene groups, cinnamic acid groups or benzo-spiropycnidium groups.

7. The housing according to any one of claims 1 to 6, wherein the weight ratio of the inorganic powder to the thermoplastic resin is 1.

8. The housing according to any one of claims 1 to 6, wherein the thermoplastic resin is one or more of polyphenylene sulfide, polysulfone, polyethersulfone, polyetherketone, polycarbonate, polyamide, and polymethylmethacrylate.

9. The shell according to any one of claims 1 to 6, wherein the inorganic powder is surface-modified by a surfactant, the inorganic powder comprises one or more of alumina, silica, titanium dioxide, silicon nitride, silicon, magnesium oxide, chromium oxide, beryllium oxide, vanadium pentoxide, diboron trioxide, spinel, zinc oxide, calcium oxide, mullite, and barium titanate, the surfactant comprises one or more of a silane coupling agent, a titanate coupling agent, and a borate coupling agent, and the weight of the surface modifier is 0.5% to 3% of the weight of the inorganic powder.

10. The housing according to any one of claims 1 to 6, further comprising:

the protective layer is arranged on the surface of the shell body and used for protecting the shell body, and the light transmittance of the protective layer is greater than or equal to 80%.

11. A method of making a housing, the housing comprising a housing body, the method comprising:

introducing a photo-swelling agent on the surface layer of the blank body; and

and (3) irradiating light to cause the volume expansion of the photo-expansion agent to obtain the shell body, wherein the weight content of the photo-expansion agent is 0.005-0.15% of the total weight of the shell body.

12. The method for preparing the shell according to claim 11, wherein the step of introducing the photo-swelling agent into the surface layer of the blank comprises:

coating a photo-swelling agent solution on the surface of the blank body so that the photo-swelling agent enters the surface layer of the blank body;

or

The introduction of the photo-swelling agent on the surface layer of the blank body comprises the following steps: and immersing the blank body into the photo-swelling agent solution so that the photo-swelling agent enters the surface layer of the blank body.

13. The method for manufacturing a housing according to claim 11, wherein the light source for illumination is ultraviolet light, visible light or near-infrared light; the intensity of the illumination is 5W/m ² To 50W/m ² And the illumination time is 5s to 10min.

14. The method of manufacturing a housing of claim 11, wherein the molding is injection molding at a temperature of Tm to Tm +80 ℃, wherein Tm is a melting temperature of the thermoplastic resin.

15. The method of making a housing of claim 11, wherein after said applying light, said method further comprises:

performing warm isostatic pressing, wherein the temperature of the warm isostatic pressing ranges from Tg +20 ℃ to Tg +60 ℃, and the pressure of the warm isostatic pressing ranges from 50MPa to 500MPa, wherein Tg is the glass transition temperature of the thermoplastic resin.

16. The method of manufacturing a housing of claim 15, wherein the thermoplastic resin is one or more of polyphenylene sulfide, polysulfone, polyethersulfone, and polyetherketone, and after the subjecting to warm isostatic pressing, the method further comprises:

and performing heat treatment at a temperature ranging from Tm to Tm +70 ℃, wherein Tm is the melting temperature of the thermoplastic resin.

17. The method of manufacturing a housing according to any one of claims 11 to 16, wherein after the mixing of the inorganic powder with the thermoplastic resin and before the molding; the method further comprises the following steps:

and carrying out banburying granulation on the mixed inorganic powder and the thermoplastic resin, wherein the banburying granulation process is in a negative pressure state or an inert atmosphere, and the banburying granulation temperature is Tm to Tf, wherein Tm is the melting temperature of the thermoplastic resin, and Tf is the decomposition temperature of the thermoplastic resin.

18. An electronic device, comprising:

a display component for displaying;

the housing of any one of claims 1 to 10, having an accommodating space; and