CN113324678B

CN113324678B - Temperature simulation device, method, computer equipment and storage medium

Info

Publication number: CN113324678B
Application number: CN202110592571.9A
Authority: CN
Inventors: 朱永球
Original assignee: Shenzhen Sensetime Technology Co Ltd
Current assignee: Shenzhen Sensetime Technology Co Ltd
Priority date: 2021-05-28
Filing date: 2021-05-28
Publication date: 2024-10-29
Anticipated expiration: 2041-05-28
Also published as: CN113324678A

Abstract

The present disclosure provides a temperature simulation apparatus, method, computer device, and storage medium, wherein the method includes: a temperature simulation part, a heat generation part and a temperature adjustment part; the heat generating component is connected with the temperature simulating component and the temperature adjusting component; the heat generating component is provided with a heat conducting substance; a heat generating part for transferring heat generated by itself to the heat conductive substance so that the heat conductive substance transfers the heat of itself to the temperature simulation part; and a temperature adjusting part for adjusting the heat transferred from the heat conductive material to the temperature simulating part to change or maintain the temperature of the temperature simulating part. According to the temperature simulation device, the temperature of the temperature simulation component is adjusted through the temperature adjustment component, so that the temperature simulation component can show different temperatures, temperature measurement objects in different temperature states can be simulated, the defect that temperature measurement verification cannot be carried out by using an object with abnormal body temperature in the prior art is overcome, and verification accuracy and integrity of verified human body temperature measurement equipment are improved.

Description

Temperature simulation device, method, computer equipment and storage medium

Technical Field

The present disclosure relates to the field of temperature processing technologies, and in particular, to a temperature simulation apparatus, a temperature simulation method, a computer device, and a storage medium.

Background

Due to the occurrence of public health events, more and more human body temperature measuring equipment is needed, and in order to judge the accuracy of the human body temperature measuring equipment, the human body temperature measuring equipment needs to be subjected to temperature measurement verification.

The existing method for verifying the temperature measurement of the human body temperature measurement equipment generally utilizes the human body to test, but the method is only suitable for the human body with normal body temperature, is not suitable for testing the human body with abnormal body temperature, but the human body with normal body temperature cannot show the temperature state of the human body with abnormal body temperature, so that the test incompleteness is caused, and the accuracy of the abnormal temperature test of the human body temperature measurement equipment cannot be ensured.

Disclosure of Invention

Embodiments of the present disclosure provide at least a temperature simulation apparatus, a temperature simulation method, a computer device, and a storage medium.

In a first aspect, an embodiment of the present disclosure provides a temperature simulation apparatus, including: a temperature simulation part, a heat generation part and a temperature adjustment part; the heat generating component is connected with the temperature simulation component and the temperature adjustment component; a heat-conducting substance is provided in the heat-generating component;

The heat generating part is used for generating heat and transmitting the generated heat to the heat conducting substance so that the heat conducting substance transmits the self heat to the temperature simulation part;

The temperature adjustment component is used for adjusting the heat transferred to the temperature simulation component by the heat conduction substance so as to change or maintain the temperature of the temperature simulation component, wherein the temperature of the temperature simulation component is used for representing the temperature of an object on which the temperature simulation component is installed.

In this aspect, the temperature of the temperature simulation component is adjusted by adjusting the heat transferred from the heat conduction material to the temperature simulation component through the temperature adjustment component, so that the temperature simulation component can show different temperatures, thereby simulating temperature measurement objects in different temperature states, overcoming the defect that the temperature measurement verification cannot be performed by using the object with abnormal body temperature in the prior art, and being beneficial to improving the verification accuracy and integrity of the verified human body temperature measurement equipment.

In an alternative embodiment, the temperature adjustment component includes a heat generating component and a temperature control component; the temperature control component is connected with the heat generating component and the temperature simulation component;

The temperature control part is used for controlling the heat transferred to the temperature simulation part by the heat generating part based on a preset temperature.

According to the embodiment, the temperature control part is used for controlling the heat transferred from the heat generating part to the temperature simulation part, so that the temperature measurement objects in different preset temperature states can be simulated, and the verification accuracy and the integrity of the verified human body temperature measurement equipment can be ensured.

In an alternative embodiment, the heat generating component includes a heating component and a heat conducting component; the thermally conductive substance is disposed in the thermally conductive member; the heating component is connected with the heat conduction component;

The heating component is used for generating heat and heating the heat conduction component by utilizing the generated heat;

The heat conduction member is used for conducting heat to the heat conduction substance to change or maintain the temperature of the heat conduction substance.

In this embodiment, the heat generated by the heating member can be efficiently transferred to the temperature simulation member by the heat conductive substance in the heat conductive member, and thus a temperature measurement object simulating different temperature states can be realized.

In an alternative embodiment, the heating element is an electrothermal film; the heat generating component further comprises a power source; the power supply is connected with the electrothermal film; the electrothermal film is arranged on the surface of the heat conduction component;

the power supply is used for supplying power to the electrothermal film so that the electrothermal film generates heat.

The embodiment adopts the electrothermal film to generate heat, so that not only can the heat conduction component be heated more efficiently and controllably, but also the weight of the heating component can be reduced.

In an alternative embodiment, the heat generating means further comprises a delivery means for delivering the heat conducting substance; the temperature simulation component is connected with the heat conduction component through the conveying component;

The conveying component is used for conveying the heat conduction substance into the temperature simulation component.

According to the embodiment, the heat conduction substance is conveyed to the inside of the temperature simulation component through the conveying component, so that the heating component, the heat conduction component and the temperature simulation component are separated, and only the temperature simulation component can be installed on a subject during use, so that the heating safety can be improved, and the installation convenience of the temperature simulation device can be improved.

In an alternative embodiment, the temperature control component includes a flow regulating component; the flow regulating component is arranged at a first preset position of the conveying component;

the flow regulating component is used for controlling the speed of the heat conduction substance in the conveying component entering the interior of the temperature simulation component.

The embodiment can control the heat transferred to the temperature simulation component more accurately by adjusting the transmission speed of the heat transfer substance through the flow adjustment component, thereby adjusting the temperature of the temperature simulation component more accurately.

In an alternative embodiment, the temperature adjustment component further comprises a temperature measurement component; the temperature control part further comprises a calculation part; the temperature measuring part is arranged at a second preset position of the conveying part;

The temperature measuring component is used for measuring a first temperature of the heat conduction substance after being heated by the heating component and a second temperature of the heat conduction substance before being heated by the heating component;

The calculating part is used for generating and sending a first control instruction to the flow regulating part based on the first temperature, the second temperature and the preset temperature, so that the flow regulating part controls the speed of the heat conduction substance in the conveying part entering the inside of the temperature simulation part based on the first control instruction.

In this embodiment, the heat emitted by the heat-conducting substance can be determined more accurately by using the temperature of the heat-conducting substance measured by the temperature measuring means, so that the temperature of the temperature simulating means can be determined, and the heat transferred to the temperature simulating means can be controlled more accurately by adjusting the speed of transfer of the heat-conducting substance based on this, so that the temperature of the temperature simulating means can be adjusted more accurately.

In an alternative embodiment, the delivery component includes a first delivery tube and a second delivery tube; the first guide pipe is connected with one end of the temperature simulation component and the first part of the heat conduction component; the second flow guide pipe is connected with the other end of the temperature simulation component and the second part of the heat conduction component; wherein the first portion is a portion of the heat conductive member from which the heat conductive substance heated by the heating member flows out; the second portion is a portion into which the heat conductive substance flows before being heated by the heating member;

The first flow guide pipe is used for conveying the heat conduction substance heated by the heating component into the temperature simulation component;

The second flow guide pipe is used for conveying the heat conduction substance flowing out from the inside of the temperature simulation component to the heat conduction component.

According to the embodiment, the first flow guide pipe and the second flow guide pipe can be used for efficiently conveying heat conduction substances and circulating the heat conduction substances in the temperature simulation part, so that heat can be efficiently transferred to the temperature simulation part.

In an alternative embodiment, the temperature measurement component includes a first temperature measurement component disposed on the first flow conduit and a second temperature measurement component disposed on the second flow conduit;

the first temperature measuring component is used for measuring a first temperature of the heat conduction substance after being heated by the heating component;

the second temperature measuring part is used for measuring a second temperature of the heat conduction substance before being heated by the heating part.

In this embodiment, the first temperature after heating and the second temperature before heating are measured, respectively, and the accuracy of the determined heat radiation amount can be improved, so that the accuracy of temperature control of the temperature simulation component can be improved.

In an alternative embodiment, the calculating means is further configured to generate and send a second control instruction to the heating means based on the first temperature, the second temperature and the preset temperature, so as to change the amount of heat generated by the heating means.

According to the embodiment, the accuracy of the determined heat dissipation capacity can be improved through the first temperature and the second temperature, so that an accurate second control instruction can be generated to change or maintain the temperature of the temperature simulation component, meanwhile, the automation degree of temperature adjustment can be improved, and the operation steps are reduced.

In an alternative embodiment, the calculating means is further configured to determine whether the preheating of the thermally conductive mass is completed based on a preset temperature, a first temperature, and a second temperature; and determining the temperature of the heat transfer substance based on the first temperature and the second temperature, and generating and transmitting the second control instruction to the heating part based on the temperature of the heat transfer substance and the preset temperature when the preheating of the heat transfer substance is completed.

According to the embodiment, after the heat conduction material is preheated, the temperature of the heat conduction material can be accurately determined based on the first temperature and the second temperature, and then an accurate second control instruction can be generated based on the accurate temperature of the heat conduction material and the preset temperature, so that the temperature of the temperature simulation component can be adjusted according to the preset temperature, and the accuracy of the simulated temperature of the temperature simulation component is improved.

In an alternative embodiment, the second control instruction includes a first sub-instruction;

The calculating component is further configured to generate and send the first sub-instruction to the heating component to control the heating component to increase the generated heat when the temperature of the thermally conductive material is lower than the preset temperature and the difference between the temperature of the thermally conductive material and the preset temperature exceeds a first preset range.

In this embodiment, when the temperature of the temperature simulation member is lower than the preset temperature by a large amount after the completion of the preheating of the heat transfer substance, the heat transferred to the temperature simulation member can be increased by controlling the heating member to increase the generated heat, thereby increasing the temperature in the temperature simulation member.

In an alternative embodiment, the first control instruction includes a second sub-instruction;

the calculating component is further configured to generate and send the second sub-instruction to the flow adjusting component to increase the speed of the heat conducting substance in the conveying component entering the inside of the temperature simulating component when the temperature of the heat conducting substance is lower than the preset temperature and the difference between the temperature of the heat conducting substance and the preset temperature exceeds a first preset range.

In this embodiment, when the temperature of the temperature simulating member is lower than the preset temperature by a large amount after the preheating of the heat conductive substance is completed, the heat transferred to the temperature simulating member can be increased by increasing the speed at which the heat conductive substance enters the inside of the temperature simulating member, thereby increasing the temperature in the temperature simulating member.

In an alternative embodiment, the second control instruction includes a third sub-instruction;

The calculating component is further configured to generate and send the third sub-instruction to the heating component to control the heating component to reduce the generated heat when the temperature of the thermally conductive material is higher than the preset temperature and the difference between the temperature of the thermally conductive material and the preset temperature exceeds a first preset range.

In this embodiment, when the temperature of the temperature simulation member is higher than the preset temperature by a large amount after the completion of the preheating of the heat transfer substance, the heat transferred to the temperature simulation member can be reduced by controlling the heating member to increase the reduced heat amount, thereby reducing the temperature inside the temperature simulation member.

In an alternative embodiment, the first control instruction includes a fourth sub-instruction;

The calculating component is further configured to generate and send the fourth sub-instruction to the flow adjusting component to reduce a speed of the heat conducting substance in the conveying component entering the inside of the temperature simulating component when the temperature of the heat conducting substance is higher than the preset temperature and a difference between the temperature of the heat conducting substance and the preset temperature exceeds a first preset range.

In this embodiment, when the temperature of the temperature simulation member is higher than the preset temperature by a large amount after the completion of the preheating of the heat conductive substance, the heat transferred to the temperature simulation member can be reduced by reducing the speed at which the heat conductive substance enters the inside of the temperature simulation member, thereby reducing the temperature in the temperature simulation member.

In an alternative embodiment, the calculating means is further configured to determine a difference between the average value of the first temperature and the second temperature and the preset temperature, and determine that the preheating of the thermally conductive material is completed if the difference between the average value and the preset temperature is within a second preset range and the difference between the first temperature and the second temperature is within a third preset range.

According to the embodiment, when the difference between the average value of the first temperature and the second temperature and the preset temperature is smaller, and the difference between the first temperature and the second temperature is also smaller, the preheating of the heat conduction substance can be determined, and after the preheating is completed, the temperature of the heat conduction substance can be accurately determined by utilizing the first temperature and the second temperature which are measured subsequently.

In an alternative embodiment, the first control instruction includes a fifth sub-instruction;

The calculating part is further configured to generate and send the fifth sub-instruction to the flow adjusting part to increase the speed of the heat conducting substance in the conveying part entering the inside of the temperature simulating part when the difference between the average value and the preset temperature is in a second preset range and the difference between the first temperature and the second temperature is not in a third preset range.

In this embodiment, when the preheating of the heat-conducting substance is not completed, the difference between the first temperature and the second temperature is larger, which means that the current temperature of the heat-conducting substance is lower, and at this time, by increasing the input speed of the heat-conducting substance, the amount of heat transferred to the heat-conducting substance can be increased, thereby being beneficial to reducing the difference between the first temperature and the second temperature, so as to achieve completion of preheating of the heat-conducting substance.

In an alternative embodiment, the second control instruction includes a sixth sub-instruction;

The calculating component is further configured to generate and send the sixth sub-instruction to the heating component to control the heating component to reduce the generated heat when the difference between the average value and the preset temperature is not within a second preset range and the average value is greater than the preset temperature.

In this embodiment, when the preheating of the heat conductive substance is not completed and the temperature of the temperature simulation member is more than the preset temperature, the heat transferred to the heat conductive substance can be reduced by controlling the heating member to reduce the generated heat, so that the temperature of the heat conductive substance is reduced and the completion of the preheating of the heat conductive substance is realized.

In an alternative embodiment, the second control instruction includes a seventh sub-instruction;

The calculating component is further configured to generate and send the seventh sub-instruction to the heating component to control the heating component to increase the generated heat when the difference between the average value and the preset temperature is not within a second preset range and the average value is smaller than the preset temperature.

In this embodiment, when the preheating of the heat-conducting substance is not completed and the temperature of the temperature simulation member is less than the preset temperature by a large amount, the heat transferred to the heat-conducting substance can be increased by increasing the heat generated by the heating member, thereby facilitating the completion of the preheating of the heat-conducting substance.

In an alternative embodiment, the flow regulating means comprises an air pump and/or an air pressure valve;

the air pump is used for adjusting the speed of the heat conduction substance entering the inside of the temperature simulation component;

The air pressure valve is used for adjusting the pressure in the conveying component.

In this embodiment, the air pump and the air pressure valve can effectively regulate the flow rate of the heat transfer material.

In a second aspect, an embodiment of the present disclosure further provides a temperature simulation method, including:

Acquiring the temperature of the temperature simulation component;

Adjusting the heat transferred to the temperature simulation member by the temperature adjustment member based on the acquired temperature to adjust the temperature of the temperature simulation member; wherein the temperature of the temperature simulating component characterizes the temperature of an object on which the temperature simulating component is mounted; the heat in the heat-conducting substance is transferred to the heat-conducting substance after the heat-generating component generates heat.

The foregoing objects, features and advantages of the disclosure will be more readily apparent from the following detailed description of the preferred embodiments taken in conjunction with the accompanying drawings.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for the embodiments are briefly described below, which are incorporated in and constitute a part of the specification, these drawings showing embodiments consistent with the present disclosure and together with the description serve to illustrate the technical solutions of the present disclosure. It is to be understood that the following drawings illustrate only certain embodiments of the present disclosure and are therefore not to be considered limiting of its scope, for the person of ordinary skill in the art may admit to other equally relevant drawings without inventive effort.

FIG. 1 is a schematic diagram of a first temperature simulation device according to an embodiment of the disclosure;

FIG. 2 is a schematic diagram of a second temperature simulation device according to an embodiment of the disclosure;

FIG. 3 illustrates a schematic structural view of a first heat generating component provided by an embodiment of the present disclosure;

FIG. 4 illustrates a schematic diagram of a second heat generating component provided by embodiments of the present disclosure;

FIG. 5 illustrates a schematic structural view of a third heat-generating component provided by an embodiment of the present disclosure;

FIG. 6 shows a schematic structural diagram of a temperature control component provided by an embodiment of the present disclosure;

Fig. 7 is a schematic structural diagram of a third temperature simulation device according to an embodiment of the present disclosure

FIG. 8 is a schematic diagram of a fourth temperature simulation apparatus according to an embodiment of the present disclosure;

FIG. 9 is a schematic flow chart of a temperature simulation method according to an embodiment of the disclosure;

Fig. 10 shows a schematic diagram of a computer device provided by an embodiment of the present disclosure.

Illustration of:

801-a heat-generating cover; 802-an air inlet interface; 803-an outlet duct; 804-an air outlet interface; 805-an air inlet pipe; 806-air pressure valve; 807-a heating assembly; 808-power supply; 809—a temperature control assembly; 810-an intake thermocouple; 811-an outlet thermocouple; 812-an extraction pump; 813-a protective box; 814-graphene electrothermal film.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is apparent that the described embodiments are only some embodiments of the present disclosure, but not all embodiments. The components of the embodiments of the present disclosure, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present disclosure provided in the accompanying drawings is not intended to limit the scope of the disclosure, as claimed, but is merely representative of selected embodiments of the disclosure. All other embodiments, which can be made by those skilled in the art based on the embodiments of this disclosure without making any inventive effort, are intended to be within the scope of this disclosure.

According to research, the conventional method for verifying the temperature measurement of the human body temperature measurement equipment generally utilizes a human body to test, but the method is generally only suitable for a human body with normal body temperature, is not suitable for testing a person with abnormal body temperature, but the human body with normal body temperature cannot show the temperature state of the human body with abnormal body temperature, so that the test is incomplete, and the accuracy of the human body temperature measurement equipment on abnormal temperature test cannot be ensured.

Based on the above study, the present disclosure provides a temperature simulation apparatus including: a temperature simulation part, a heat generation part and a temperature adjustment part; the heat generating component is connected with the temperature simulation component and the temperature adjustment component; a heat-conducting substance is provided in the heat-generating component; the heat generating part is used for generating heat and transmitting the generated heat to the heat conducting substance so that the heat conducting substance transmits the self heat to the temperature simulation part; the temperature adjustment component is used for adjusting the heat transferred to the temperature simulation component by the heat conduction substance so as to change or maintain the temperature of the temperature simulation component, wherein the temperature of the temperature simulation component is used for representing the temperature of an object on which the temperature simulation component is installed. According to the technical scheme, the temperature of the temperature simulation component is adjusted through the temperature adjustment component, so that the temperature simulation component can show different temperatures, temperature measurement objects in different temperature states can be simulated, the defect that temperature measurement verification cannot be carried out by using an object with abnormal body temperature in the prior art is overcome, and verification accuracy and integrity of verified human body temperature measurement equipment are improved.

The defects of the scheme are all results obtained by the inventor after practice and careful study, and therefore, the discovery process of the above problems and the solutions to the above problems set forth hereinafter by the present disclosure should be all contributions of the inventors to the present disclosure during the course of the present disclosure.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

For the convenience of understanding the present embodiment, a detailed description will be first made of a temperature simulation device disclosed in the embodiments of the present disclosure.

Firstly, it should be noted that the temperature simulation device provided by the embodiment of the present disclosure is suitable for any possible application scenario of temperature simulation, and is particularly suitable for an application scenario of simulating the temperature of a human body when detecting or testing the body temperature of the human body. In different application scenarios, the temperature simulation device provided by the embodiment of the disclosure can be modified or can be easily changed, or some technical features of the temperature simulation device can be replaced equivalently.

The temperature simulation device provided by the embodiment of the present disclosure will be described in detail below by taking an application scenario of simulating a human body temperature as an example.

Referring to fig. 1, a schematic structural diagram of a temperature simulation device 10 according to an embodiment of the disclosure is provided, where the temperature simulation device 10 includes: a temperature simulation unit 11, a heat generation unit 13, and a temperature adjustment unit 12, wherein the heat generation unit 13 is connected to the temperature simulation unit 11 and the temperature adjustment unit 12; the heat generating part 13 is provided with a heat conductive substance therein; the heat generating part 13 is for generating heat and transferring the generated heat to the heat conducting substance so that the heat conducting substance transfers its own heat to the temperature simulating part 11; a temperature adjustment part 12 for adjusting the heat transferred to the temperature simulation part 11 by the heat conductive substance to change or maintain the temperature of the temperature simulation part 11, wherein the temperature of the temperature simulation part 11 is used for representing the temperature of the object on which the temperature simulation part 11 is mounted.

In an application scene simulating the temperature of a human body, the temperature of the human body should be a temperature within a body temperature variation range where a living body of the human body is located (including the body temperature in a normal state of the human body and the body temperature in an abnormal state of the human body). The temperature simulation means 11 is for simulating an arbitrary temperature within a range of a change in body temperature in which a living body of a human body is located.

The temperature simulation part 11 may be mounted on a human body. The temperature simulation part 11 may be installed at any mountable position on the human body without affecting the life safety and health status of the human body, and in general, the temperature simulation part 11 may be installed on the skin surface of the human body, specifically, the temperature simulation part 11 may be installed at the forehead, wrist part, etc. of the human body for convenience of installation and measurement. The temperature simulation component 11 may be mounted in any feasible location for non-human subjects. The temperature simulation unit 11 may also be mounted on a non-human object, such as a human model.

The temperature of the temperature simulation component 11 is used to characterize the temperature of the object on which the temperature simulation component 11 is mounted. The temperature simulation component 11 may comprise at least one sub-component, each sub-component being mounted at a respective location of the object, the temperature of each sub-component being indicative of the temperature of the respective location. The shape, size, style, etc. of each sub-component may be set according to the installation position.

The temperature adjustment part 12 may adjust the temperature of the temperature simulation part 11 based on a preset temperature such that the temperature of the temperature simulation part 11 varies within a range of temperature variation in which the living body of the human body is located. Wherein the preset temperature is set manually, it is desirable that the temperature of the temperature simulating member 11 is reached in a steady state. When the temperature simulation part 11 includes a plurality of sub-parts, the temperature adjustment part 12 may adjust the temperatures of the sub-parts separately or simultaneously.

The temperature in the temperature simulation means 11 may originate from a source of heat generation and in one possible embodiment, in a schematic structural diagram of a second temperature simulation device as shown in fig. 2, the temperature adjustment means 12 may comprise temperature control means 21. The temperature control unit 21 is connected to the heat generating unit 13 and the temperature simulation unit 11.

The temperature control part 21 is used to control the amount of heat transferred from the heat generating part 13 to the temperature simulating part 11 based on a preset temperature.

The heat generated by the heat generating part 13 may be transferred to the temperature simulation part 11 by a predetermined transfer manner, and in one possible embodiment, in a first heat generating part structure schematic shown in fig. 3, the heat generating part 13 includes a heating part 131 and a heat conducting part 132; a heat conductive substance is provided in the heat conductive member 132; the heating member 131 is connected to the heat conduction member 132.

Specifically, the heating part 131 serves to generate heat and heat the heat conduction part 132 using the generated heat; a heat conducting member 132 for conducting heat to the heat conducting substance to change or maintain the temperature of the heat conducting substance. And a heat conductive substance for transferring heat of itself to the temperature simulation member 11 to change or maintain the temperature of the temperature simulation member 11.

The heat conductive material may be any type of material, including a gaseous heat conductive material (e.g., air, etc.), a solid heat conductive material (e.g., solid metal, etc.), and a liquid heat conductive material (e.g., liquid water, etc.), and in practice, an appropriate heat conductive material may be selected according to the specific conditions such as the use requirement of the temperature simulation apparatus 10, for example, in order to reduce the weight of the temperature simulation apparatus 10, a gaseous heat conductive material may be selected; for another example, in order to improve the heat transfer efficiency, a solid metal may be selected as the heat conductive substance. The heat conductive member 132 may be provided with different structures according to the form of the heat conductive substance. For example, for the gaseous heat conducting substance, the heat conducting member 132 may be configured in a tubular structure to enable the flow of the gaseous heat conducting substance in the heat conducting member 132 and heat conduction, and the material of the heat conducting member 132 may be selected according to the form of the heat conducting substance, the use requirement of the temperature simulation device 10, and the like, which is not particularly limited herein.

In the above embodiment, the structure of the heat generating member 13 is thinned, and the heat generating member 13 is connected to the heat conducting member 132 by the heating member 131, and the heat generating member 131 transfers the generated heat to the heat conducting member 132, and then the heat conducting member 132 transfers the heat to the heat conducting substance in the heat conducting assembly, and then the heat conducting substance transfers the heat of itself to the temperature simulating member 11, thereby realizing the transfer of the heat generated by the heat generating member 13 to the temperature simulating member 11.

In combination with the requirements of the use of the temperature simulation device 10, in one possible embodiment, the heating component 131 is an electrothermal film in the schematic structural diagram of the second heat generating component shown in fig. 4; the heat generating part 13 further includes a power source 133; the power supply 133 is connected with the electrothermal film; the electrothermal film is disposed on the surface of the heat conduction member 132; and a power supply 133 for supplying power to the electrothermal film so that the electrothermal film generates heat.

The embodiment is mainly suitable for the scene of requiring the temperature simulation device 10 to generate heat quickly and wearing portability, the electrothermal film is connected with the power supply 133, the power supply 133 can enable the electrothermal film to generate heat quickly, meanwhile, the electrothermal film has small weight and small influence on the total weight of the temperature simulation device 10, the temperature simulation device is suitable for wearing, and in the specific implementation process, the graphene electrothermal film can be used, but the material of the heating component 131 is not particularly limited. By disposing the electrothermal film on the surface of the heat conduction member 132, the heat generated by the electrothermal film can be quickly transferred to the heat conduction member 132.

In some possible embodiments, the heat conduction component 132 may be directly connected to the temperature simulation component 11, the heat conduction object in the heat conduction component 132 may directly transfer its own heat to the temperature simulation component 11, and in other possible embodiments, in order to wear lightweight or safe to use (the surface of the heat conduction component 132 is provided with an electrothermal film, and the electrothermal film is connected to the power source 133, and an electric shock hazard may occur), the heat conduction component 132 may not be directly connected to the temperature simulation component 11 (connected at a certain distance), and the temperature simulation component 11 is connected to the heat conduction component 132 through an intermediate component, so that the temperature simulation component 11 may be mounted on the subject, and the heat conduction component 132 is placed at a position far from the subject.

Thus, in the embodiment, in the schematic structural view of the third heat generating component shown in fig. 5, the heat generating component 13 may further include a conveying component 134 for conveying a heat conducting substance; the temperature simulation part 11 is connected with the heat conduction part 132 through the conveying part 134; and a conveying member 134 for conveying the heat conductive substance to the inside of the temperature simulation member 11.

The conveying member 134 may be provided according to a heat conductive substance, for example, for a gaseous heat conductive substance or a liquid heat conductive substance, and the conveying member 134 may be provided as a sealed conveying pipe through which the gaseous heat conductive substance carrying heat passes to the temperature simulating member 11 after the heat conductive member 132 conducts heat to the gaseous heat conductive substance, thereby achieving heat transfer to the temperature simulating member 11.

The temperature simulation member 11 is connected to the heat conduction member 132 by the conveying member 134, so that the heat conduction substance in the heat conduction member 132 can be conveyed to the inside of the temperature simulation member 11, and the heat conduction member 132 and the temperature simulation member 11 can be not directly connected. The length of the conveying member 134 is not preferably too long, because the too long conveying member 134 makes the distance of conveying the heat conductive substance from the heat conductive member 132 to the temperature simulating member 11 too long, which not only results in a slow heat transfer process, but also may result in a large heat loss during the conveying process. The conveying member 134 may be made of a material having good sealing property and high heat insulating ability, but an excessively long conveying member 134 may cause problems such as increased cost, waste of material, and the like. The length of the conveying member 134 is not too short, and the conveying member 134 cannot ensure that the connection length of the heat conducting member 132 and the temperature simulating member 11 meets the preset length, which is easy to cause problems such as inconvenient use (e.g. the temperature simulating member 11 is worn on the forehead of the human subject, and the heat conducting member 132 cannot be placed on the tabletop far from the human subject). In practice, therefore, the length of the conveying members 134 may be set as the case may be.

In one possible implementation, the conveying member 134 may include a first conduit and a second conduit, where the first conduit and the second conduit are adapted for use in situations where the thermally conductive material is a gaseous thermally conductive material or a liquid thermally conductive material.

Specifically, the first flow guide pipe is connected to one end of the temperature simulation member 11 and the first portion of the heat conduction member 132; the second flow guide pipe is connected with the other end of the temperature simulation component 11 and the second part of the heat conduction component 132; the first portion is a portion of the heat conductive member 132 from which the heat conductive substance heated by the heating member 131 flows out; the second portion is a portion into which the heat conductive substance flows into the heat conductive member 132 before being heated by the heating member 131. A first flow guide pipe for conveying the heat transfer material heated by the heating member 131 to the inside of the temperature simulation member 11; and a second flow guide pipe for conveying the heat conductive substance flowing out from the inside of the temperature simulation member 11 to the heat conductive member 132.

Here, the inside of the temperature simulation member 11 may be provided with a cavity for circulation of a heat conductive substance. Specifically, the temperature simulation member 11 may be a sealed double-layered case, in which a cavity is formed, or may be integrally formed. In order to make the temperature simulation device 10 more lightweight, the temperature simulation component 11 may be composed of plexiglas or plastic.

After being heated by the heating member 131, the heat transfer material flows out from the first portion of the heat transfer member 132, then is transported to the inside of the temperature simulation member 11 through one end of the first flow guide tube and the temperature simulation member 11, and the heat transfer material in the inside of the temperature simulation member 11 flows out through the other end of the temperature simulation member 11, flows into the inside of the heat transfer member 132 through the second flow guide tube and the second portion of the heat transfer member 132, and is continuously heated by the heating member 131.

Through the above connection mode, the first flow guide pipe, the temperature simulation component 11, the second flow guide pipe and the heat conduction component 132 can be communicated, and the heat conduction substance can circulate inside the first flow guide pipe, the temperature simulation component 11, the second flow guide pipe and the heat conduction component 132, so that the temperature of the temperature simulation component 11 can be kept under the condition that the heat loss exists in the temperature simulation device 10.

In the disclosed embodiment, the temperature of the temperature simulation member 11 may be adjusted by controlling the amount of heat transferred to the temperature simulation member 11, and in one possible implementation, the speed of the heat transfer substance entering the inside of the temperature simulation member 11 may be controlled by controlling the speed of the heat transfer substance entering the inside of the temperature simulation member 11, the faster the amount of heat transferred to the temperature simulation member 11, the slower the speed of the heat transfer substance entering the inside of the temperature simulation member 11, and the less heat transferred to the temperature simulation member 11.

Specifically, in the schematic structural view of the temperature control member shown in fig. 6, the temperature control member 21 may include a flow rate adjustment member 211. And a flow rate adjusting part 211 for controlling a speed at which the heat conductive substance in the conveying part 134 enters the inside of the temperature simulating part 11 to control the heat transferred from the heat generating part 13 to the temperature simulating part 11. Accordingly, the flow rate adjusting part 211 is disposed at the first preset position of the conveying part 134.

In implementations, the flow regulating member 211 may include an air pump and/or an air pressure valve; and an air pump for adjusting the speed at which the heat conductive substance enters the inside of the temperature simulation part 11. And the air pressure valve is used for adjusting the pressure in the conveying part 134, reducing the pressure in the conveying part 134 through pressure relief when the pressure in the conveying part 134 is high, and increasing the pressure in the conveying part 134 through pressurization when the pressure in the conveying part 134 is low.

Here, the first preset position may be set at any position in the conveying member 134 before the heat conductive substance enters the inside of the temperature simulating member 11.

This embodiment is mainly applicable to the case where the heat conductive substance is a gaseous heat conductive substance or a liquid heat conductive substance, and when the heat conductive substance is a solid heat conductive substance, if the solid heat conductive substance can move inside the conveying member 134 and enter the inside of the temperature simulating member 11, and transfer heat to the temperature simulating member 11, the flow rate adjusting member 211 may be provided to control the speed at which the heat conductive substance in the conveying member 134 enters the inside of the temperature simulating member 11. For example, when the conveying member 134 is a conveyor belt and the flow rate adjusting member 211 is a speed adjusting member of the conveyor belt, it is also possible to control the speed at which the heat conductive substance in the conveying member 134 enters the inside of the temperature simulating member 11 to control the amount of heat transferred from the heat generating member 13 to the temperature simulating member 11.

In order to more precisely adjust the temperature transferred to the temperature simulation means 11, in one possible embodiment, in a schematic structural diagram of a third temperature simulation device as shown in fig. 7, the temperature adjustment means 12 may include a temperature measurement means 22, and the temperature control means 21 may further include a calculation means 212, where the calculation means 212 is disposed at a second preset position of the conveying means 134.

Here, the second preset position may be a position in the conveying member 134 before the heat conductive substance is input to the heat conductive member 132, and a position in the conveying member 134 after the heat conductive substance is output from the heat conductive member 132. So that the temperature measuring part 22 can measure a first temperature of the heat conductive substance after being heated by the heating part 131 and a second temperature of the heat conductive substance before being heated by the heating part 131. It is mainly considered here that the heat transfer substance may lose heat after being heated by the heating member 131 and before being heated by the heating member 131, especially during the transport within the transport member 134.

Then, the calculation section 212 generates and transmits a first control instruction to the flow rate adjustment section 211 based on the first temperature, the second temperature, and the preset temperature, so that the flow rate adjustment section 211 controls the speed at which the heat conductive substance in the conveying section 134 enters the inside of the temperature simulation section 11 based on the first control instruction.

Here, the calculation section 212 may calculate a difference between the first temperature and the second temperature, generate and send a first control instruction to the flow rate adjustment section 211 based on the difference. The computing component 212 herein may be any processor having computing and control capabilities.

Specifically, when the difference between the first temperature and the second temperature is large, the heat transfer substance can reach the inside of the temperature simulation member 11 as soon as possible before the heat of the heat transfer substance is not greatly lost by increasing the speed at which the heat transfer substance enters the inside of the temperature simulation member 11, so that the heat transfer substance can transfer more heat to the temperature simulation member 11, thereby increasing the temperature of the temperature simulation member 11 more quickly. When the difference between the first temperature and the second temperature is small, the heat conduction material can slowly transfer heat to the temperature simulation member 11 by reducing the speed at which the heat conduction material enters the inside of the temperature simulation member 11, thereby reducing the temperature rising speed inside the temperature simulation member 11 or maintaining the temperature inside the temperature simulation member 11 in a relatively stable state.

Meanwhile, the calculating part 212 adjusts the speed at which the heat conductive substance enters the inside of the temperature simulating part 11 based on the first temperature and the second temperature, that is, the calculating part 212 performs quantization processing on the speed at which the heat conductive substance enters the inside of the temperature simulating part 11, so that the temperature of the inside of the temperature simulating part 11 can be adjusted more accurately.

In one possible embodiment, the temperature measuring part 22 may include a first temperature measuring part disposed on the first flow guide pipe, and a second temperature measuring part disposed on the second flow guide pipe, the first temperature measuring part for measuring a first temperature of the heat conductive material after being heated by the heating part 131; and a second temperature measuring part for measuring a second temperature of the heat conductive substance before being heated by the heating part 131.

Since the heat conductive substance heated by the heating part 131 enters the inside of the temperature simulation part 11 through the first flow guide, the heat conductive substance before being heated by the heating part 131 enters the heat conductive part 132 through the second flow guide, that is, the temperature on the first flow guide is measured by the first temperature measuring part, and the temperature on the second flow guide is measured by the second temperature measuring part.

It should be noted that, in order to obtain the temperature difference between the first temperature and the second temperature more accurately, and further more accurately adjust the speed of the heat conduction material entering the temperature simulation component 11, the first temperature measurement device may be disposed on the first flow guide pipe near the heating component 131, and the second temperature measurement device may be disposed on the second flow guide pipe near the heating component 131, so that the first temperature measured by the first temperature measurement is the temperature of the heat conduction material just heated by the heating component 131, the second temperature measured by the second temperature measurement is the temperature of the heat conduction material just heated by the heating component 131, at this time, the temperature difference between the first temperature and the second temperature is the temperature difference of the heat conduction material after the completion of one transmission, which is equivalent to the temperature difference after taking into account all the heat lost by the heat conduction material during the transmission process, so that the speed of the heat conduction material entering the temperature simulation component 11 can be adjusted more accurately, and finally the temperature of the temperature simulation component 11 can be adjusted more accurately.

The calculation unit 212 may adjust the temperature in the temperature simulation unit 11 by controlling the amount of heat generated by the heating unit 131 in addition to adjusting the temperature in the temperature simulation unit 11 by sending the first control command to the flow rate adjustment unit 211 and causing the flow rate adjustment unit 211 to control the speed at which the thermally conductive material in the conveying unit 134 enters the inside of the temperature simulation unit 11 based on the first control command.

In a possible embodiment, the calculating part 212 is further configured to generate and send a second control instruction to the heating part 131 based on the first temperature, the second temperature and the preset temperature, so as to control the amount of heat generated by the heating part 131.

Here, the calculating part 212 may calculate a difference between the first temperature and the second temperature, and generate a second control instruction to control the amount of heat generated by the heating part 131 based on the difference and the preset temperature. When the difference between the first temperature and the second temperature is larger, more heat generated by the heating part 131 can be controlled; when the difference between the first temperature and the second temperature is smaller, less heat generated by the heating part 131 can be controlled.

Considering that the heat-conducting substance is subjected to a preheating process when the temperature simulation device 10 is changed from the non-use state to the use state, the temperature simulation device 10 can be normally used after the heat-conducting substance is preheated, and thus in a possible embodiment, the calculating unit 212 is further configured to determine whether the heat-conducting substance is preheated based on the preset temperature, the first temperature and the second temperature.

When the preheating of the heat-conducting substance is completed, the difference between the average value of the first temperature and the second temperature and the preset temperature is within a second preset range, and the difference between the first temperature and the second temperature is within a third preset range, and the process of completing the preheating of the heat-conducting substance will be described in detail below.

In the case where the preheating of the heat conductive substance is completed, the temperature of the heat conductive substance is determined based on the first temperature and the second temperature, and a second control instruction is generated and transmitted to the heating part 131 based on the temperature of the heat conductive substance and the preset temperature.

Wherein, in case the preheating of the heat conductive substance is completed, the first temperature and the second temperature should be equal in an ideal state, that is, the temperature of the heat conductive substance may be equal to the first temperature or the second temperature, but the accuracy and the sealability of the temperature simulation device 10 are considered here, so the temperature of the heat conductive substance may be an average value of the first temperature and the second temperature, that is, the calculating means 212 may be configured to calculate an average value of the first temperature and the second temperature based on the first temperature and the second temperature, and determine the average value of the first temperature and the second temperature as the temperature of the heat conductive substance.

The preset temperature refers to a temperature which is manually preset and within a range of change in body temperature in which a living body of a human body is located, and by presetting a temperature with the purpose of expecting the temperature of the heat conductive substance in the temperature simulating member 11 to reach the preset human body temperature, the preset human body temperature is represented by the temperature of the heat conductive substance.

After the preheating of the heat conductive substance is completed, the heat conductive substance may not always be maintained at the preset temperature due to the sealability problem of the temperature simulation device 10 and the use requirement problem, etc., the case that the heat conductive substance does not reach the preset temperature may occur, or the case that the heat conductive substance exceeds the preset temperature may occur, and thus the calculating part 212 may be configured to generate and transmit the second control instruction to the heating part 131 based on the temperature of the heat conductive substance and the preset temperature, so that the heating part 131 increases the heat generation amount or decreases the heat generation amount according to the second control instruction, so that the heat conductive substance is maintained at the preset temperature.

Here, the principle that the calculating part 212 keeps the heat conductive substance at the preset temperature by sending the second control command is described first for the case where the heat conductive substance does not reach the preset temperature.

In one possible implementation, the second control instruction may include a first sub-instruction. The calculating part 212 is further configured to generate and send a first sub-instruction to the heating part 131 to control the heating part 131 to increase the generated heat in a case where the temperature of the thermally conductive substance is lower than the preset temperature and a difference between the temperature of the thermally conductive substance and the preset temperature exceeds the first preset range.

It is known that the temperature of the heat conductive material and the preset temperature may not be completely equal due to the sealing property of the temperature simulation device 10, that is, when the difference between the temperature of the heat conductive material and the preset temperature is within a certain preset range, we can consider that the temperature of the heat conductive material reaches the preset temperature, and we can consider that the temperature simulation device 10 reaches the state of thermal equilibrium.

In a specific implementation, the difference between the temperature of the thermally conductive substance and the preset temperature may be a positive value or a negative value, that is, the temperature of the thermally conductive substance may be greater than the preset temperature or less than the preset temperature, for example, when the absolute value of the difference between the temperature of the thermally conductive substance and the preset temperature is 0.2 degrees celsius, the first preset range may be-0.2 degrees celsius to 0.2 degrees celsius.

In the case that the temperature of the heat conductive material is lower than the preset temperature and the difference between the temperature of the heat conductive material and the preset temperature exceeds the first preset range, it is indicated that the temperature of the heat conductive material has not reached the preset temperature, and therefore, it is necessary to control the heating part 131 to increase the generated heat at this time so that the temperature of the heat conductive material rapidly reaches the preset temperature (i.e., the difference between the temperature of the heat conductive material and the preset temperature is within the first preset range).

In one possible embodiment, the rapid reaching of the temperature of the thermally conductive mass to the preset temperature may also be achieved by increasing the rate at which the thermally conductive mass in the delivery member 134 enters the interior of the temperature simulating member 11.

Specifically, the first control instruction includes a second sub-instruction. The calculating part 212 is further configured to generate and send a second sub-instruction to the flow rate adjusting part 211 to increase the speed of the heat conducting substance in the conveying part 134 entering the inside of the temperature simulating part 11, in case that the temperature of the heat conducting substance is lower than the preset temperature and the difference between the temperature of the heat conducting substance and the preset temperature exceeds the first preset range.

In this embodiment, after the speed of the heat conductive substance in the conveying member 134 entering the inside of the temperature simulating member 11 is increased, the heat conductive substance in the conveying member 134 can enter the inside of the temperature simulating member 11 more quickly, that is, the heat conductive substance having more heat is conveyed to the inside of the temperature simulating member 11 more quickly, thereby achieving that the temperature of the heat conductive substance reaches the preset temperature quickly.

In one possible embodiment, the calculating unit 212 may also send the first sub-command to the heating unit 131 and the second sub-command to the flow regulating unit 211 simultaneously, so that the temperature of the heat conducting substance reaches the preset temperature more quickly. The specific implementation process is not described here again.

The above describes that, for the case where the heat conductive substance does not reach the preset temperature, the calculating part 212 implements the process of rapidly reaching the preset temperature by sending the first sub-command and/or the second sub-command. In the implementation process, the instruction sent by the calculating unit 212 may be determined according to the difference between the temperature of the heat conducting material and the preset temperature, which is not limited herein.

The principle by which the calculation section 212 causes the heat conductive substance to be maintained at the preset temperature by sending the second control instruction will be described below for the case where the heat conductive substance exceeds the preset temperature.

In one possible implementation, the second control instruction includes a third sub-instruction; the calculating part 212 is further configured to generate and send a third sub-instruction to the heating part 131 to control the heating part 131 to reduce the amount of heat generated in a case where the temperature of the thermally conductive substance is higher than the preset temperature and a difference between the temperature of the thermally conductive substance and the preset temperature exceeds the first preset range.

In the case where the temperature of the heat conductive substance is higher than the preset temperature and the difference between the temperature of the heat conductive substance and the preset temperature exceeds the first preset range, it is indicated that the temperature of the heat conductive substance has exceeded the preset temperature, and therefore it is necessary to control the heating part 131 to reduce the generated heat at this time so that the temperature of the heat conductive substance is rapidly lowered to the preset temperature (i.e., the difference between the temperature of the heat conductive substance and the preset temperature is within the first preset range).

In one possible implementation, the first control instruction includes a fourth sub-instruction; the calculating part 212 is further configured to generate and send a fourth sub-instruction to the flow rate adjusting part 211 to reduce the speed of the heat conducting substance in the conveying part 134 entering the inside of the temperature simulating part 11, in the case where the temperature of the heat conducting substance is higher than the preset temperature and the difference between the temperature of the heat conducting substance and the preset temperature exceeds the first preset range.

In this embodiment, after the speed of the heat conductive substance in the conveying member 134 entering the inside of the temperature simulating member 11 is reduced, the heat conductive substance in the conveying member 134 may enter the inside of the temperature simulating member 11 more slowly, that is, the heat conductive substance having more heat is conveyed to the inside of the temperature simulating member 11 more slowly, thereby achieving the temperature of the heat conductive substance to be reduced to the preset temperature.

In one possible embodiment, the calculating part 212 may also send the third sub-instruction to the heating part 131 and the fourth sub-instruction to the flow regulating part 211 at the same time, so that the temperature of the heat conducting substance is reduced to the preset temperature more quickly. The specific implementation process is not described here again.

The above describes the process in which the calculation section 212 performs the rapid temperature drop of the heat conductive substance to the preset temperature by sending the third sub-instruction and/or the fourth sub-instruction for the case where the heat conductive substance exceeds the preset temperature. In the implementation process, the instruction sent by the calculating unit 212 may be determined according to the difference between the temperature of the heat conducting material and the preset temperature, which is not limited herein.

In view of the above, in one possible embodiment, the process of determining whether the preheating of the thermally conductive material is completed may be performed by the calculating part 212, and in particular, the calculating part 212 is configured to determine that the preheating of the thermally conductive material is completed when the difference between the average value and the preset temperature is within the second preset range and the difference between the first temperature and the second temperature is within the third preset range, by determining that the average value and the second temperature are different from the preset temperature.

That is, there are two conditions for determining whether the preheating of the heat conductive substance is completed: firstly, determining whether the difference value between the average value of the first temperature and the second temperature and the preset temperature is within a second preset range; and secondly, whether the difference value between the first temperature and the second temperature is within a third preset range or not.

Wherein the average value of the first temperature and the second temperature refers to the average value of the first temperature and the second temperature.

In an ideal state, it can be considered that when the average value of the first temperature and the second temperature is equal to the preset temperature and the first temperature and the second temperature are equal to each other, the preheating of the heat conductive substance is completed, but in a specific operation, considering the accuracy and the sealability of the temperature simulation device 10, in general, the average value of the first temperature and the second temperature is not equal to the preset temperature and the first temperature and the second temperature is not equal to each other, so that the second preset range and the third preset range are set such that the difference between the average value of the first temperature and the second temperature and the preset temperature is within the second preset range and the difference between the first temperature and the second temperature is within the third preset range, we consider that the preheating is completed.

The second preset range and the third preset range may be the same or different, and illustratively, the second preset range and the third preset range may each be 0 degrees celsius to 0.2 degrees celsius, and the second preset range and the third preset range are not particularly limited herein.

With respect to the condition for determining whether the preheating of the heat-conductive substance is completed, when the preheating of the heat-conductive substance is not completed, it can be achieved by the following embodiments, and a detailed description will be given below of how the calculation section 212 sends instructions to control the completion of the preheating of the heat-conductive substance.

In one possible implementation, the first control instruction includes a fifth sub-instruction; the calculating part 212 is further configured to generate and send a fifth sub-instruction to the flow adjusting part 211 to increase the speed of the heat conducting substance in the conveying part 134 entering the inside of the temperature simulating part 11, when the difference between the average value and the preset temperature is within the second preset range and the difference between the first temperature and the second temperature is not within the third preset range.

In this embodiment, the fifth sub-command mainly makes the difference between the first temperature and the second temperature within the third preset range, and after increasing the speed of the heat-conducting substance in the conveying member 134 entering the interior of the temperature simulating member 11, the heat-conducting substance in the conveying member 134 can enter the interior of the temperature simulating member 11 faster, so that the difference between the first temperature and the second temperature is within the third preset range as soon as possible.

In one possible implementation, the second control instruction includes a sixth sub-instruction; the calculating part 212 is further configured to generate and send a sixth sub-instruction to the heating part 131 to control the heating part 131 to reduce the generated heat when the difference between the average value and the preset temperature is not within the second preset range and the average value is greater than the preset temperature.

In this embodiment, as previously described, the average value refers to an average value of the first temperature and the second temperature. The difference between the average value and the preset temperature is not within the second preset range, and the average value is greater than the preset temperature, which indicates that the temperature in the temperature simulation device 10 is higher, and at this time, the temperature simulation device 10 needs to be cooled, and the sixth sub-instruction mainly controls the heating component 131 to reduce the heat generation amount, so that the difference between the average value and the preset temperature is within the second preset range.

After the heating part 131 reduces the generated heat, the first temperature after the heating part 131 heats will decrease, and as the heat conductive material circulates, the overall temperature in the temperature simulation device 10 will decrease until the difference between the average value and the preset temperature is within the second preset range.

In one possible implementation, the second control instruction includes a seventh sub-instruction; the calculating part 212 is further configured to generate and send a seventh sub-instruction to the heating part 131 to control the heating part 131 to increase the generated heat when the difference between the average value and the preset temperature is not within the second preset range and the average value is less than the preset temperature.

In this embodiment, the difference between the average value and the preset temperature is not within the second preset range, and the average value is smaller than the preset temperature, which indicates that the temperature in the temperature simulation device 10 is low, and the temperature of the temperature simulation device 10 needs to be raised at this time, and the seventh sub-instruction mainly controls the heating component 131 to increase the generated heat, so that the difference between the average value and the preset temperature is within the second preset range.

After the heating part 131 increases the generated heat, the first temperature after the heating part 131 heats up will rise, and as the heat conductive material circulates, the overall temperature in the temperature simulation device 10 will rise until the difference between the average value and the preset temperature is within the second preset range.

In a possible embodiment, the calculating unit 212 is further configured to send the fifth sub-instruction to the flow adjusting unit 211, and simultaneously, the heating unit 131 sends the sixth sub-instruction or the seventh sub-instruction, so that a difference between the average value and the preset temperature is within a second preset range, and a difference between the first temperature and the second temperature is within a third preset range, thereby achieving that preheating of the heat conducting substance is completed.

When the heat conduction substance is preheated, a higher temperature (for example, 42 ℃) can be preset, so that the heat conduction substance can be preheated as soon as possible, after the preheating is finished, a proper temperature (for example, 37 ℃) is set, according to the process, after the temperature of the heat conduction substance reaches the preset temperature, the temperature simulation device provided by the embodiment of the disclosure can be utilized to simulate the temperature of a human body, and further the processes of temperature test, development of temperature measurement equipment and the like are realized.

The temperature simulation device according to the embodiment of the present disclosure will be described in detail below with reference to a schematic structural diagram of a fourth temperature simulation device shown in fig. 8. The temperature simulation device provided by the embodiment of the disclosure comprises a heating cover 801, an air outlet pipe 803, an air inlet pipe 805, an air pressure valve 806, a heating component 807, a power supply 808, a temperature control component 809, an air inlet thermocouple 810, an air outlet thermocouple 811, an air pump 812, a protection box 813 and a graphene electrothermal film 814.

The heating cover 801 is a sealed transparent double-layer heating cover, the heating cover 801 can be made of organic glass or plastic integrally, and a sealed interlayer space is formed in the middle of the heating cover 801 and used for passing heated air, and the heated air can transfer heat to the heating cover 801. The heating cover 801 can be worn on the forehead through an ear hook, and the shape and the size of the heating cover 801 are close to those of the forehead.

The heating cover 801 is provided with air inlet port 802 and air outlet port 804 respectively in both ends, and the one end of intake pipe 805 is connected with air inlet port 802, and the other end of intake pipe 805 is connected with the gas outlet of heating element 807, and the one end of outlet duct 803 is connected with air outlet port 804, and the other end of outlet duct 803 is connected with the air inlet of heating element 807. The air inlet pipe 805 is used for inputting the air heated by the heating component 807 into the heating cover 801, and the air outlet pipe 803 is used for inputting the air in the heating cover 801 into the heating component 807 for heating.

The air pressure valve 806 and the air pump 812 are both arranged on the air inlet pipe 805, the air pressure valve 806 is used for adjusting the air pressure of the air in the air inlet pipe 805, and the air pump 812 is used for adjusting the flow rate of the air in the air inlet pipe 805.

An air inlet thermocouple 810 is provided on the air inlet pipe 805 for measuring the temperature of air in the air inlet pipe 805, and an air outlet thermocouple 811 is provided on the air outlet pipe 803 for measuring the temperature of air in the air outlet pipe 803.

The graphene electrothermal film 814 is connected to the power supply 808, and the graphene electrothermal film 814 covers the surface of the heating component 807. The power supply 808 is configured to provide power to the graphene electrothermal film 814 such that the graphene electrothermal film 814 generates heat, the graphene electrothermal film 814 is configured to transfer heat to the heating element 807, and the heating element 807 is configured to transfer heat to the air inside. The heating element 807 may be an aluminum alloy heating element, with apertures provided in the heating element 807 for rapid heating of air within the heating element 807.

The temperature control assembly 809 is respectively connected with the air pump 812, the air inlet thermocouple 810, the air outlet thermocouple 811 and the graphene electrothermal film 814.

The temperature control component 809 is used for controlling the rotation speed of the air pump 812, adjusting the flow rate of air in the air inlet pipe 805 and controlling the heat generated by the graphene electrothermal film 814 according to the temperature of air in the air inlet pipe 805 measured by the air inlet thermocouple 810 and the temperature of air in the air outlet pipe 803 measured by the air outlet thermocouple 811, so as to change or maintain the temperature of the heating cover 801. The temperature control component 809 is further used for setting the temperature to be reached by the heating cover, and the temperature control component comprises a display screen for displaying the temperature of the heating cover and the set temperature and prompting the temperature state.

The protection box 813 is used to protect the air pressure valve 806, the heating element 807, the power supply 808, the temperature control element 809, the air intake thermocouple 810, the air outlet thermocouple 811, the air pump 812, and the graphene electrothermal film 814 disposed therein.

The principle of the temperature simulation device is as follows: the preheating temperature is set on the temperature control assembly 809, the power supply 808 is turned on to heat the graphene electrothermal film 814, the graphene electrothermal film 814 transfers heat to the heating assembly 807, the heating assembly 807 transfers heat to the air in the interior, the air is input into the heating cover 801 through the air inlet pipe 805, the heat is transferred to the heating cover 801, the air in the heating cover 801 is input into the heating assembly 807 through the air outlet pipe 803, the heating assembly 807 transfers heat to the air in the interior, and the temperature control assembly 809 controls the rotating speed of the air suction pump 812 according to the temperature of the air in the air inlet pipe 805 measured by the air inlet thermocouple 810 and the temperature of the air in the air outlet pipe 803 measured by the air outlet thermocouple 811, and controls the heat generated by the graphene electrothermal film 814 until the temperature of the air reaches balance.

According to the scheme provided by the embodiment of the disclosure, the temperature of the temperature simulation component is regulated by the temperature regulation component, so that the temperature simulation component can show different temperatures, and therefore, temperature measurement objects in different temperature states can be simulated, the defect that temperature measurement verification cannot be carried out by using an object with abnormal body temperature in the prior art is overcome, and the verification accuracy and integrity of the verified human body temperature measurement equipment are improved.

The following provides a scenario of using the temperature simulation device, for example, a batch of face recognition temperature measurement devices for detecting human body temperature need to measure temperature accuracy, a device debugging person can set the temperature of a temperature control component 809 in the temperature simulation device provided by the embodiment of the disclosure to 37.5 ℃, after the temperature control component 809 prompts that the temperature is stable, the device debugging person wears the temperature simulation device, before the device debugging person walks to a first face recognition temperature measurement device, the first face recognition temperature measurement device recognizes that the body temperature of the device debugging person is 37.5 ℃ and exceeds a high temperature line of 37.3 ℃, and the first face recognition temperature measurement device immediately prompts the device debugging person to generate heat and gives a warning. Before the equipment debugging personnel walk to the second face recognition temperature measuring equipment, the prompt temperature of the second face recognition temperature measuring equipment is 36.5 ℃, so that the equipment debugging personnel can judge that the first face recognition temperature measuring equipment is normal in temperature measurement and the second face recognition temperature measuring equipment is abnormal in temperature measurement, and further the second face recognition temperature measuring equipment can be debugged.

Based on the same inventive concept, the embodiment of the disclosure further provides a temperature simulation method corresponding to the temperature simulation device, and in a flow chart of the temperature simulation method shown in fig. 9, the method includes the following steps:

S901: acquiring the temperature of the temperature simulation component;

S902: adjusting the heat transferred to the temperature simulation member by the temperature adjustment member based on the acquired temperature to adjust the temperature of the temperature simulation member; wherein the temperature of the temperature simulating component characterizes the temperature of an object on which the temperature simulating component is mounted; the heat in the heat-conducting substance is transferred to the heat-conducting substance after the heat-generating component generates heat.

In one possible implementation, S902 may include: acquiring a preset temperature; and adjusting the heat transferred to the temperature simulation component by the heat conduction substance based on the acquired temperature and the preset temperature so as to adjust the temperature of the temperature simulation component.

Since the principle of solving the problem by the method in the embodiment of the present disclosure is similar to that of the temperature simulation device in the embodiment of the present disclosure, the implementation of the method may refer to the implementation of the device, and the repetition is not repeated.

Based on the same technical concept, the embodiment of the disclosure also provides computer equipment. Referring to fig. 10, a schematic diagram of a computer device 1000 according to an embodiment of the disclosure includes a processor 1001, a memory 1002, and a bus 1003. The memory 1002 is configured to store execution instructions, including a memory 10021 and an external memory 10022; the memory 10021 is also referred to as an internal memory, and is used for temporarily storing operation data in the processor 1001 and data exchanged with the external memory 10022 such as a hard disk, and the processor 1001 exchanges data with the external memory 10022 through the memory 10021, and when the computer device 1000 operates, the processor 1001 and the memory 1002 communicate with each other through the bus 1003, so that the processor 1001 executes the following instructions:

Acquiring the temperature of the temperature simulation component;

The disclosed embodiments also provide a computer readable storage medium having stored thereon a computer program which, when executed by a processor, performs the steps of the temperature simulation method described in the method embodiments above. Wherein the storage medium may be a volatile or nonvolatile computer readable storage medium.

The embodiments of the present disclosure further provide a computer program product, where the computer program product carries a program code, where instructions included in the program code may be used to perform the steps of the temperature simulation method described in the foregoing method embodiments, and specifically reference may be made to the foregoing method embodiments, which are not described herein.

Wherein the above-mentioned computer program product may be realized in particular by means of hardware, software or a combination thereof. In an alternative embodiment, the computer program product is embodied as a computer storage medium, and in another alternative embodiment, the computer program product is embodied as a software product, such as a software development kit (Software Development Kit, SDK), or the like.

It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described system and apparatus may refer to corresponding procedures in the foregoing method embodiments, which are not described herein again. In the several embodiments provided in the present disclosure, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of the units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.

The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional unit in each embodiment of the present disclosure may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.

The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a non-volatile computer readable storage medium executable by a processor. Based on such understanding, the technical solution of the present disclosure may be embodied in essence or a part contributing to the prior art or a part of the technical solution, or in the form of a software product stored in a storage medium, including several instructions to cause a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in the embodiments of the present disclosure. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a magnetic disk, or an optical disk, or other various media capable of storing program codes.

Finally, it should be noted that: the foregoing examples are merely specific embodiments of the present disclosure, and are not intended to limit the scope of the disclosure, but the present disclosure is not limited thereto, and those skilled in the art will appreciate that while the foregoing examples are described in detail, it is not limited to the disclosure: any person skilled in the art, within the technical scope of the disclosure of the present disclosure, may modify or easily conceive changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features thereof; such modifications, changes or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the disclosure, and are intended to be included within the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A temperature simulation apparatus, comprising: a temperature simulation part, a heat generation part and a temperature adjustment part; the heat generating component is connected with the temperature simulation component and the temperature adjustment component; a heat-conducting substance is provided in the heat-generating component;

The temperature adjusting component is used for adjusting the heat transferred to the temperature simulation component by the heat conduction substance so as to change or maintain the temperature of the temperature simulation component, wherein the temperature of the temperature simulation component is used for representing the temperature of an object on which the temperature simulation component is installed;

The heat generating part comprises a heating part, a heat conducting part and a conveying part for conveying the heat conducting substance; the thermally conductive substance is disposed in the thermally conductive member; the heating component is connected with the heat conduction component; the heating component is arranged on the surface of the heat conduction component; the temperature simulation component is connected with the heat conduction component through the conveying component;

The heat conduction member is used for conducting heat to the heat conduction substance so as to change or maintain the temperature of the heat conduction substance;

The conveying component is used for conveying the heat conduction substance into the temperature simulation component;

the temperature adjustment component comprises a temperature control component and a temperature measurement component; the temperature control component is connected with the heat generating component and the temperature simulation component; the temperature measuring part is arranged at a second preset position of the conveying part;

The temperature control component is used for controlling the heat transferred to the temperature simulation component by the heat generating component based on a preset temperature; the temperature control means includes calculation means;

The calculating part is used for determining whether the preheating of the heat conduction substance is finished or not based on the preset temperature, the first temperature and the second temperature; determining the temperature of the heat transfer substance based on the first temperature and the second temperature, and generating and transmitting a second control instruction to the heating part based on the temperature of the heat transfer substance and the preset temperature to change the heat generated by the heating part when the preheating of the heat transfer substance is completed;

The calculating part is further used for determining a difference value between the average value of the first temperature and the second temperature and the preset temperature, and determining that the preheating of the heat conduction substance is completed when the difference value between the average value and the preset temperature is within a second preset range and the difference value between the first temperature and the second temperature is within a third preset range.

2. The temperature simulation device according to claim 1, wherein the heating member is an electrothermal film; the heat generating component further comprises a power source; the power supply is connected with the electrothermal film;

3. The temperature simulation device according to claim 2, wherein the temperature control means includes flow rate adjustment means; the flow regulating component is arranged at a first preset position of the conveying component;

4. A temperature simulation apparatus according to claim 3, wherein the calculation means is configured to generate and send a first control instruction to the flow rate adjustment means based on the first temperature, the second temperature, and the preset temperature, so that the flow rate adjustment means controls a speed at which the heat conductive substance in the conveyance means enters the inside of the temperature simulation means based on the first control instruction.

5. The temperature simulation device according to claim 4, wherein the transport member includes a first flow guide and a second flow guide; the first guide pipe is connected with one end of the temperature simulation component and the first part of the heat conduction component; the second flow guide pipe is connected with the other end of the temperature simulation component and the second part of the heat conduction component; wherein the first portion is a portion of the heat conductive member from which the heat conductive substance heated by the heating member flows out; the second portion is a portion into which the heat conductive substance flows before being heated by the heating member;

6. The temperature simulation device according to claim 5, wherein the temperature measuring means includes a first temperature measuring means provided on the first flow guide pipe, and a second temperature measuring means provided on the second flow guide pipe;

7. The temperature simulation device of claim 1 wherein the second control instruction comprises a first sub-instruction;

8. The temperature simulation device of claim 4 wherein the first control instruction comprises a second sub-instruction;

9. The temperature simulation device of claim 1 wherein the second control instruction comprises a third sub-instruction;

10. The temperature simulation device of claim 8 wherein the first control instruction comprises a fourth sub-instruction;

11. The temperature simulation device of claim 4 wherein the first control instruction comprises a fifth sub-instruction;

12. The temperature simulation device of claim 1 wherein the second control instruction comprises a sixth sub-instruction;

13. The temperature simulation device of claim 1 wherein the second control instruction comprises a seventh sub-instruction;

14. A temperature simulation device according to claim 3, wherein the flow regulating means comprises an air pump and/or an air pressure valve;

15. A temperature simulation method, characterized by being applied to the temperature simulation apparatus according to any one of claims 1 to 14, comprising:

Acquiring the temperature of the temperature simulation component; the temperature is the temperature at which the delivery member delivers the thermally conductive mass to the interior of the temperature simulation member;

Adjusting the heat transferred to the temperature simulation member by the temperature adjustment member based on the acquired temperature to adjust the temperature of the temperature simulation member; wherein the temperature of the temperature simulating component characterizes the temperature of an object on which the temperature simulating component is mounted; the heat in the heat conductive substance is transferred to the heat conductive substance provided in the heat conductive member after the heating member provided on the surface of the heat conductive member generates heat.

16. The temperature simulation method according to claim 15, wherein the adjusting the heat transferred from the heat conductive substance to the temperature simulation member based on the obtained temperature to adjust the temperature of the temperature simulation member includes:

Acquiring a preset temperature;

And adjusting the heat transferred to the temperature simulation component by the heat conduction substance based on the acquired temperature and the preset temperature so as to adjust the temperature of the temperature simulation component.

17. A computer device, comprising: a processor, a memory storing machine readable instructions executable by the processor for executing machine readable instructions stored in the memory, which when executed by the processor, perform the steps of the temperature simulation method of claim 15 or 16.

18. A computer readable storage medium, characterized in that the computer readable storage medium has stored thereon a computer program which, when run by a computer device, performs the steps of the temperature simulation method according to claim 15 or 16.