CN113324678B - Temperature simulation device, method, computer equipment and storage medium - Google Patents

Abstract

The present disclosure provides a temperature simulation device, method, computer equipment and storage medium, wherein the method includes: a temperature simulation component, a heat generating component, and a temperature adjustment component; the heat generating component is connected to the temperature simulation component and the temperature adjustment component; a heat conductive material is arranged in the heat generating component; the heat generating component is used to transfer the heat generated by itself to the heat conductive material so that the heat conductive material transfers its own heat to the temperature simulation component; the temperature adjustment component is used to adjust the heat transferred by the heat conductive material to the temperature simulation component to change or maintain the temperature of the temperature simulation component. The present disclosure adjusts the temperature of the temperature simulation component through the temperature adjustment component, so that the temperature simulation component can show different temperatures, thereby simulating temperature measurement objects in different temperature states, overcoming the defect in the prior art that objects with abnormal body temperature cannot be used for temperature measurement verification, and is conducive to improving the verification accuracy and completeness of the verified human body temperature measurement equipment.

Description

A temperature simulation device, method, computer equipment and storage medium

Technical Field

The present disclosure relates to the field of temperature processing technology, and in particular to a temperature simulation device, method, computer equipment and storage medium.

Background Art

Due to the occurrence of public health incidents, there are more and more human body temperature measurement devices. In order to judge the accuracy of human body temperature measurement devices, it is necessary to verify the temperature measurement of human body temperature measurement devices.

At present, the method for verifying the temperature measurement of human body temperature measuring equipment generally uses human body for testing, but this method is usually only applicable to human bodies with normal body temperature, and is not applicable to testing people with abnormal body temperature. However, a human body with normal body temperature cannot show the temperature state of a human body with abnormal body temperature, resulting in incompleteness of the test, and thus the accuracy of abnormal temperature testing by human body temperature measuring equipment cannot be guaranteed.

Summary of the invention

The embodiments of the present disclosure at least provide a temperature simulation device, method, computer equipment and storage medium.

In a first aspect, an embodiment of the present disclosure provides a temperature simulation device, comprising: a temperature simulation component, a heat generating component, and a temperature adjustment component; the heat generating component is connected to the temperature simulation component and the temperature adjustment component; a heat conductive material is disposed in the heat generating component;

The heat generating component is used to generate heat and transfer the generated heat to the heat conductive material, so that the heat conductive material transfers its own heat to the temperature simulation component;

The temperature adjustment component is used to adjust the amount of heat transferred from the heat conductive material to the temperature simulation component to change or maintain the temperature of the temperature simulation component, wherein the temperature of the temperature simulation component is used to represent the temperature of the object on which the temperature simulation component is installed.

In this aspect, the temperature of the temperature simulation component is adjusted by adjusting the heat transferred to the temperature simulation component by the heat conducting material through the temperature adjusting component, so that the temperature simulation component can show different temperatures, thereby simulating temperature measurement objects in different temperature states, overcoming the defect in the prior art that objects with abnormal body temperature cannot be used for temperature measurement verification, which is beneficial to improving the verification accuracy and completeness of the verified human body temperature measurement equipment.

In an optional embodiment, the temperature adjustment component includes a heat generating component and a temperature control component; the temperature control component is connected to the heat generating component and the temperature simulation component;

The temperature control component is used to control the amount of heat transferred from the heat generating component to the temperature simulation component based on a preset temperature.

This embodiment controls the heat transferred from the heat generating component to the temperature simulation component through the temperature control component, so as to simulate the temperature measurement object in different preset temperature states, thereby ensuring the verification accuracy and completeness of the verified human body temperature measurement equipment.

In an optional embodiment, the heat generating component includes a heating component and a heat conducting component; the heat conducting material is arranged in the heat conducting component; the heating component is connected to the heat conducting component;

The heating component is used to generate heat and use the generated heat to heat the heat conducting component;

The heat conducting component is used to conduct heat to the heat conducting material to change or maintain the temperature of the heat conducting material.

In this embodiment, the heat generated by the heating component can be transferred to the temperature simulation component more efficiently through the heat conductive material in the heat conductive component, thereby simulating the temperature measurement object in different temperature states.

In an optional embodiment, the heating component is an electric heating film; the heat generating component further includes a power source; the power source is connected to the electric heating film; the electric heating film is arranged on the surface of the heat conducting component;

The power supply is used to supply power to the electric heating film so that the electric heating film generates heat.

This embodiment uses an electric heating film to generate heat, which can not only achieve more efficient and controllable heating of the heat conduction component, but also reduce the weight of the heating component.

In an optional embodiment, the heat generating component further comprises a conveying component for conveying the heat conducting material; the temperature simulation component is connected to the heat conducting component via the conveying component;

The transport component is used to transport the heat conductive material to the interior of the temperature simulation component.

This embodiment transports the heat-conducting material to the interior of the temperature simulation component through the transport component, thereby realizing the separation of the heating component and the heat-conducting component from the temperature simulation component. When in use, only the temperature simulation component can be installed on the object, which can not only improve the safety of heating, but also improve the installation convenience of the temperature simulation device.

In an optional embodiment, the temperature control component includes a flow regulating component; the flow regulating component is arranged at a first preset position of the conveying component;

The flow regulating component is used to control the speed at which the heat conductive material in the conveying component enters into the temperature simulation component.

This embodiment adjusts the transmission speed of the heat-conducting material through the flow regulating component, so as to more accurately control the amount of heat transferred to the temperature simulation component, thereby more accurately adjusting the temperature of the temperature simulation component.

In an optional embodiment, the temperature adjustment component further includes a temperature measuring component; the temperature control component further includes a calculation component; the temperature measuring component is arranged at a second preset position of the conveying component;

The temperature measuring component is used to measure a first temperature of the heat conductive material after being heated by the heating component and a second temperature of the heat conductive material before being heated by the heating component;

The calculation component is used to generate and send a first control instruction to the flow regulating component based on the first temperature, the second temperature and the preset temperature, so that the flow regulating component controls the speed at which the heat conductive material in the conveying component enters the interior of the temperature simulation component based on the first control instruction.

In this embodiment, by using the temperature of the heat-conducting material measured by the temperature measuring component, the heat dissipated by the heat-conducting material can be determined more accurately, thereby determining the temperature of the temperature simulation component. Based on this, the transmission speed of the heat-conducting material is adjusted, and the heat transferred to the temperature simulation component can be more accurately controlled, thereby more accurately adjusting the temperature of the temperature simulation component.

In an optional embodiment, the conveying component includes a first flow conduit and a second flow conduit; the first flow conduit is connected to one end of the temperature simulation component and a first portion of the heat conduction component; the second flow conduit is connected to the other end of the temperature simulation component and a second portion of the heat conduction component; wherein the first portion is a portion of the heat conduction component from which the heat conduction material flows out after being heated by the heating component; and the second portion is a portion of the heat conduction material that flows into the heat conduction component before being heated by the heating component;

The first flow guide pipe is used to transport the heat-conducting material heated by the heating component to the interior of the temperature simulation component;

The second flow guide pipe is used to transport the heat conduction material flowing out from the interior of the temperature simulation component to the heat conduction component.

In this embodiment, the first flow conduit and the second flow conduit can realize efficient transportation of the heat-conducting material, and realize the circulation of the heat-conducting material inside the temperature simulation component, thereby being able to transfer heat to the temperature simulation component more efficiently.

In an optional embodiment, the temperature measuring component includes a first temperature measuring component provided on the first flow guiding tube, and a second temperature measuring component provided on the second flow guiding tube;

The first temperature measuring component is used to measure a first temperature of the heat conductive material after being heated by the heating component;

The second temperature measuring component is used to measure a second temperature of the heat conductive material before being heated by the heating component.

In this implementation, the first temperature after heating and the second temperature before heating are measured respectively, which can improve the accuracy of the determined heat dissipation, thereby improving the accuracy of the temperature control of the temperature simulation component.

In an optional embodiment, the calculation component is further used to generate and send a second control instruction to the heating component based on the first temperature, the second temperature and the preset temperature to change the heat generated by the heating component.

In this embodiment, the accuracy of the determined heat dissipation can be improved through the first temperature and the second temperature, so that an accurate second control instruction can be generated to change or maintain the temperature of the temperature simulation component, while the degree of automation of temperature regulation can be improved and the number of operating steps can be reduced.

In an optional embodiment, the calculation component is further used to determine whether the heat conductive material is preheated based on the preset temperature, the first temperature and the second temperature; when the heat conductive material is preheated, the temperature of the heat conductive material is determined based on the first temperature and the second temperature, and the second control instruction is generated and sent to the heating component based on the temperature of the heat conductive material and the preset temperature.

In this embodiment, after the preheating of the heat conductive material is completed, the temperature of the heat conductive material can be determined more accurately based on the first temperature and the second temperature. Thereafter, based on the more accurate temperature of the heat conductive material and the preset temperature, an accurate second control instruction can be generated to adjust the temperature of the temperature simulation component according to the preset temperature, thereby improving the accuracy of the simulated temperature of the temperature simulation component.

In an optional implementation, the second control instruction includes a first sub-instruction;

The calculation component is also used to generate and send the first sub-instruction to the heating component to control the heating component to increase the amount of heat generated when the temperature of the heat conductive material is lower than the preset temperature and the difference between the temperature of the heat conductive material and the preset temperature exceeds a first preset range.

In this embodiment, after the preheating of the heat conductive material is completed, when the temperature of the temperature simulation component is much lower than the preset temperature, the heat generated by the heating component is controlled to increase the heat transferred to the temperature simulation component, thereby increasing the temperature inside the temperature simulation component.

In an optional implementation, the first control instruction includes a second sub-instruction;

The calculation component is also used to generate and send the second sub-instruction to the flow regulating component to increase the speed at which the heat conductive material in the conveying component enters the interior of the temperature simulation component when the temperature of the heat conductive material is lower than the preset temperature and the difference between the temperature of the heat conductive material and the preset temperature exceeds a first preset range.

In this embodiment, after the preheating of the heat conductive material is completed, when the temperature of the temperature simulation component is much lower than the preset temperature, the speed at which the heat conductive material enters the interior of the temperature simulation component can be increased, thereby increasing the temperature inside the temperature simulation component.

In an optional implementation, the second control instruction includes a third sub-instruction;

The calculation component is also used to generate and send the third sub-instruction to the heating component to control the heating component to reduce the amount of heat generated when the temperature of the heat conductive material is higher than the preset temperature and the difference between the temperature of the heat conductive material and the preset temperature exceeds a first preset range.

In this embodiment, after the preheating of the heat conductive material is completed, when the temperature of the temperature simulation component is much higher than the preset temperature, the heat transferred to the temperature simulation component can be reduced by controlling the heating component to increase or decrease the amount of heat, thereby lowering the temperature inside the temperature simulation component.

In an optional implementation, the first control instruction includes a fourth sub-instruction;

The calculation component is also used to generate and send the fourth sub-instruction to the flow regulating component to reduce the speed at which the heat conductive material in the conveying component enters the interior of the temperature simulation component when the temperature of the heat conductive material is higher than the preset temperature and the difference between the temperature of the heat conductive material and the preset temperature exceeds a first preset range.

In this embodiment, after the preheating of the heat conductive material is completed, when the temperature of the temperature simulation component is much higher than the preset temperature, the speed at which the heat conductive material enters the interior of the temperature simulation component can be reduced, thereby reducing the heat transferred to the temperature simulation component and lowering the temperature inside the temperature simulation component.

In an optional embodiment, the calculation component is also used to determine the difference between the average of the first temperature and the second temperature and the preset temperature, and determine that the preheating of the heat conduction material is completed when the difference between the average and the preset temperature is within a second preset range and the difference between the first temperature and the second temperature is within a third preset range.

In this embodiment, when the difference between the average of the first temperature and the second temperature and the preset temperature is small, and the difference between the first temperature and the second temperature is also small, it can be determined that the preheating of the heat conductive material is completed. After the preheating is completed, the temperature of the heat conductive material can be determined more accurately using the first temperature and the second temperature measured subsequently.

In an optional implementation, the first control instruction includes a fifth sub-instruction;

The calculation component is also used to generate and send the fifth sub-instruction to the flow regulating component to increase the speed at which the heat conductive material in the conveying component enters the interior of the temperature simulation component when the difference between the mean and the preset temperature is within the second preset range and the difference between the first temperature and the second temperature is not within the third preset range.

In this embodiment, when the preheating of the heat conductive material is not completed, if the difference between the first temperature and the second temperature is large, it means that the current temperature of the heat conductive material is low. At this time, by increasing the input speed of the heat conductive material, the amount of heat transferred to the heat conductive material can be increased, which is beneficial to reduce the difference between the first temperature and the second temperature, so as to complete the preheating of the heat conductive material.

In an optional implementation, the second control instruction includes a sixth sub-instruction;

The calculation component is also used to generate and send the sixth sub-instruction to the heating component to control the heating component to reduce the amount of heat generated when the difference between the mean and the preset temperature is not within a second preset range and the mean is greater than the preset temperature.

In this embodiment, when the preheating of the heat conductive material is not completed and the temperature of the temperature simulation component is much higher than the preset temperature, the heat generated by the heating component is controlled to reduce the heat transferred to the heat conductive material, thereby reducing the temperature of the conductive material and completing the preheating of the heat conductive material.

In an optional implementation, the second control instruction includes a seventh sub-instruction;

The calculation component is also used to generate and send the seventh sub-instruction to the heating component to control the heating component to increase the amount of heat generated when the difference between the mean and the preset temperature is not within a second preset range and the mean is less than the preset temperature.

In this embodiment, when the preheating of the heat conductive material is not completed and the temperature of the temperature simulation component is much lower than the preset temperature, the heat generated by the heating component can be increased to increase the heat transferred to the heat conductive material, thereby facilitating the completion of the preheating of the heat conductive material.

In an optional embodiment, the flow regulating component includes an air pump and/or an air pressure valve;

The air pump is used to adjust the speed at which the heat conductive material enters the interior of the temperature simulation component;

The air pressure valve is used to adjust the pressure in the conveying component.

In this embodiment, the flow rate of the heat transfer material can be effectively regulated by the air pump and the air pressure valve.

In a second aspect, the present disclosure also provides a temperature simulation method, including:

Acquiring the temperature of the temperature simulation component;

Based on the acquired temperature, the heat transferred from the heat conductive material to the temperature simulation component is adjusted by the temperature adjusting component to adjust the temperature of the temperature simulation component; wherein the temperature of the temperature simulation component represents the temperature of the object on which the temperature simulation component is installed; and the heat in the heat conductive material is the heat transferred to the heat conductive material after the heat generating component generates heat.

In order to make the above-mentioned objectives, features and advantages of the present disclosure more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following is a brief introduction to the drawings required for use in the embodiments. The drawings herein are incorporated into the specification and constitute a part of the specification. These drawings illustrate embodiments consistent with the present disclosure and are used together with the specification to illustrate the technical solutions of the present disclosure. It should be understood that the following drawings only illustrate certain embodiments of the present disclosure and should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can also be obtained based on these drawings without creative work.

FIG1 shows a schematic structural diagram of a first temperature simulation device provided by an embodiment of the present disclosure;

FIG2 shows a schematic structural diagram of a second temperature simulation device provided by an embodiment of the present disclosure;

FIG3 shows a schematic structural diagram of a first heat generating component provided by an embodiment of the present disclosure;

FIG4 shows a schematic structural diagram of a second heat generating component provided by an embodiment of the present disclosure;

FIG5 shows a schematic structural diagram of a third heat generating component provided in an embodiment of the present disclosure;

FIG6 shows a schematic diagram of the structure of a temperature control component provided in an embodiment of the present disclosure;

FIG. 7 shows a schematic diagram of the structure of a third temperature simulation device provided in an embodiment of the present disclosure.

FIG8 shows a schematic structural diagram of a fourth temperature simulation device provided by an embodiment of the present disclosure;

FIG9 shows a schematic flow chart of a temperature simulation method provided by an embodiment of the present disclosure;

FIG. 10 shows a schematic diagram of a computer device provided by an embodiment of the present disclosure.

Illustration Description:

801-heating hood; 802-air inlet interface; 803-air outlet pipe; 804-air outlet interface; 805-air inlet pipe; 806-air pressure valve; 807-heating component; 808-power supply; 809-temperature control component; 810-air inlet thermocouple; 811-air outlet thermocouple; 812-vacuum pump; 813-protection box; 814-graphene electric heating film.

DETAILED DESCRIPTION

In order to make the purpose, technical scheme and advantages of the embodiments of the present disclosure clearer, the technical scheme in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all of the embodiments. The components of the embodiments of the present disclosure generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present disclosure provided in the drawings is not intended to limit the scope of the present disclosure for protection, but merely represents the selected embodiments of the present disclosure. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present disclosure.

Research has found that the current method for verifying temperature measurement of human body temperature measurement equipment generally uses human bodies for testing, but this method is usually only applicable to humans with normal body temperatures and is not applicable to testing humans with abnormal body temperatures. However, humans with normal body temperatures cannot exhibit the temperature state of humans with abnormal body temperatures, resulting in incompleteness in the test, and thus the accuracy of abnormal temperature testing by human body temperature measurement equipment cannot be guaranteed.

Based on the above research, the present disclosure provides a temperature simulation device, including: a temperature simulation component, a heat generating component, and a temperature adjustment component; the heat generating component is connected to the temperature simulation component and the temperature adjustment component; a heat conductive material is arranged in the heat generating component; the heat generating component is used to generate heat and transfer the generated heat to the heat conductive material, so that the heat conductive material transfers its own heat to the temperature simulation component; the temperature adjustment component is used to adjust the heat transferred by the heat conductive material to the temperature simulation component to change or maintain the temperature of the temperature simulation component, wherein the temperature of the temperature simulation component is used to characterize the temperature of the object on which the temperature simulation component is installed. The technical solution of the present disclosure adjusts the temperature of the temperature simulation component through the temperature adjustment component, so that the temperature simulation component can show different temperatures, thereby simulating temperature measurement objects in different temperature states, overcoming the defect in the prior art that objects with abnormal body temperature cannot be used for temperature measurement verification, and is conducive to improving the verification accuracy and completeness of the verified human body temperature measurement equipment.

The defects existing in the above solutions are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed by the present disclosure for the above problems below should be the contributions made by the inventor to the present disclosure during the disclosure process.

It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

To facilitate understanding of this embodiment, a temperature simulation device disclosed in the embodiment of the present disclosure is first introduced in detail.

First of all, it should be noted that the temperature simulation device provided by the embodiment of the present disclosure is applicable to any possible application scenario of temperature simulation, and is particularly applicable to application scenarios of simulating human body temperature when detecting or testing human body temperature. In different application scenarios, the temperature simulation device provided by the embodiment of the present disclosure can be modified or easily changed, or some of its technical features can be replaced by equivalents.

The temperature simulation device provided by the embodiment of the present disclosure will be introduced in detail below by taking the application scenario of simulating human body temperature as an example.

Referring to FIG1 , which is a schematic diagram of the structure of a temperature simulation device 10 provided in an embodiment of the present disclosure, the temperature simulation device 10 comprises: a temperature simulation component 11, a heat generating component 13, and a temperature adjusting component 12, wherein the heat generating component 13 is connected to the temperature simulation component 11 and the temperature adjusting component 12; a heat conductive material is arranged in the heat generating component 13; the heat generating component 13 is used to generate heat and transfer the generated heat to the heat conductive material so that the heat conductive material transfers its own heat to the temperature simulation component 11; the temperature adjusting component 12 is used to adjust the heat transferred by the heat conductive material to the temperature simulation component 11 so as to change or maintain the temperature of the temperature simulation component 11, wherein the temperature of the temperature simulation component 11 is used to characterize the temperature of the object on which the temperature simulation component 11 is installed.

In the application scenario of simulating human body temperature, human body temperature should be within the temperature variation range of a living human body (including the temperature of a normal human body and the temperature of an abnormal human body). The temperature simulation component 11 is used to simulate any temperature within the temperature variation range of a living human body.

The temperature simulation component 11 can be installed on the human body. Without affecting the life safety and health status of the human body, the temperature simulation component 11 can be installed at any installable position on the human body. Generally, the temperature simulation component 11 can be installed on the skin surface of the human body. Specifically, for the convenience of installation and measurement, the temperature simulation component 11 can be installed on the forehead, wrist, etc. of the human body. For non-human objects, the temperature simulation component 11 can be installed at any feasible position. The temperature simulation component 11 can also be installed on non-human objects, such as a human body model.

The temperature of the temperature simulation component 11 is used to characterize the temperature of the object on which the temperature simulation component 11 is installed. The temperature simulation component 11 may include at least one subcomponent, each subcomponent is installed at a corresponding position of the object, and the temperature of each subcomponent characterizes the temperature of the corresponding position. The shape, size, style, etc. of each subcomponent can be set according to the installation position.

The temperature adjustment component 12 can adjust the temperature of the temperature simulation component 11 based on the preset temperature, so that the temperature of the temperature simulation component 11 changes within the temperature variation range of the human body. The preset temperature is artificially set, and it is expected that the temperature simulation component 11 will reach a stable state. When the temperature simulation component 11 includes multiple subcomponents, the temperature adjustment component 12 can adjust the temperature of each subcomponent separately or simultaneously.

The temperature in the temperature simulation component 11 may be derived from a heat source. In a possible implementation, as shown in the structural diagram of the second temperature simulation device in FIG2 , the temperature adjustment component 12 may include a temperature control component 21. The temperature control component 21 is connected to the heat generation component 13 and the temperature simulation component 11.

The temperature control component 21 is used to control the amount of heat transferred from the heat generating component 13 to the temperature simulation component 11 based on a preset temperature.

The heat generated by the heat generating component 13 can be transferred to the temperature simulation component 11 through a preset transfer method. In a possible implementation, as shown in the structural schematic diagram of the first heat generating component in FIG3 , the heat generating component 13 includes a heating component 131 and a heat conducting component 132 ; the heat conducting material is arranged in the heat conducting component 132 ; and the heating component 131 is connected to the heat conducting component 132 .

Specifically, the heating component 131 is used to generate heat and use the generated heat to heat the heat conducting component 132; the heat conducting component 132 is used to conduct heat to the heat conducting material to change or maintain the temperature of the heat conducting material. The heat conducting material is used to transfer its own heat to the temperature simulation component 11 to change or maintain the temperature of the temperature simulation component 11.

The heat conducting material can be any form of material, including gaseous heat conducting materials (such as air, etc.), solid heat conducting materials (such as solid metal, etc.) and liquid heat conducting materials (such as liquid water, etc.). In specific implementation, a suitable heat conducting material can be selected according to the specific conditions such as the use requirements of the temperature simulation device 10. For example, in order to reduce the weight of the temperature simulation device 10, a gaseous heat conducting material can be selected; for another example, in order to improve the heat transfer efficiency, a solid metal can be selected as the heat conducting material. The heat conducting component 132 can be set with different structures according to the form of the heat conducting material. For example, for the gaseous heat conducting material, the heat conducting component 132 can be set as a tubular structure to realize the flow and heat conduction of the gaseous heat conducting material in the heat conducting component 132. The material of the heat conducting component 132 can also be selected according to the form of the heat conducting material, the use requirements of the temperature simulation device 10 and other specific conditions, and is not specifically limited here.

In the above embodiment, the structure of the heat generating component 13 is refined, and the heating component 131 is connected to the heat conducting component 132. First, the heating component 131 transfers the generated heat to the heat conducting component 132, and then the heat conducting component 132 transfers the heat to the heat conducting material in the heat conducting component, and then the heat conducting material transfers its own heat to the temperature simulation component 11, thereby realizing the transfer of the heat generated by the heat generating component 13 to the temperature simulation component 11.

In combination with the use requirements of the temperature simulation device 10, in a possible implementation, as shown in the structural schematic diagram of the second heat-generating component in FIG4, the heating component 131 is an electric heating film; the heat-generating component 13 also includes a power supply 133; the power supply 133 is connected to the electric heating film; the electric heating film is arranged on the surface of the heat-conducting component 132; the power supply 133 is used to supply power to the electric heating film so that the electric heating film generates heat.

This embodiment is mainly suitable for scenarios where the temperature simulation device 10 is required to generate heat quickly and be light to wear. The electric heating film is connected to the power supply 133, and the power supply 133 can make the electric heating film generate heat quickly. At the same time, the electric heating film is light in weight and has little effect on the total weight of the temperature simulation device 10, which is suitable for wearing. In the specific implementation process, a graphene electric heating film can be used, but the material of the heating component 131 is not specifically limited here. By setting the electric heating film on the surface of the heat conduction component 132, the heat generated by the electric heating film can be quickly transferred to the heat conduction component 132.

In some possible implementations, the heat conduction component 132 can be directly connected to the temperature simulation component 11, and the heat conductor in the heat conduction component 132 can directly transfer its own heat to the temperature simulation component 11. In other possible implementations, in order to be easy to wear or safe to use (the surface of the heat conduction component 132 is provided with an electric heating film, and the electric heating film is connected to the power supply 133, which may cause a risk of electric shock), the heat conduction component 132 and the temperature simulation component 11 may not be directly connected (maintaining a certain distance for connection), and the temperature simulation component 11 and the heat conduction component 132 are connected through an intermediate component, so that the temperature simulation component 11 can be installed on the object and the heat conduction component 132 can be placed at a position away from the object.

Therefore, in the specific implementation process, as shown in the structural schematic diagram of the third heat-generating component in Figure 5, the heat-generating component 13 may also include a conveying component 134 for conveying heat-conducting material; the temperature simulation component 11 is connected to the heat-conducting component 132 through the conveying component 134; the conveying component 134 is used to convey the heat-conducting material to the interior of the temperature simulation component 11.

The conveying component 134 can be set according to the heat conductive material. For example, for gaseous heat conductive material or liquid heat conductive material, the conveying component 134 can be set as a sealed conveying pipe. After the heat conductive component 132 transfers heat to the gaseous heat conductive material, the gaseous heat conductive material carrying the heat passes through the conveying pipe to reach the temperature simulation component 11, thereby realizing the transfer of heat to the temperature simulation component 11.

The temperature simulation component 11 is connected to the heat conduction component 132 through the conveying component 134, so that the heat conduction material in the heat conduction component 132 can be conveyed to the inside of the temperature simulation component 11, and the heat conduction component 132 and the temperature simulation component 11 are not directly connected. The length of the conveying component 134 should not be too long, because an overly long conveying component 134 makes the distance for the heat conduction material to be conveyed from the heat conduction component 132 to the temperature simulation component 11 too long, which not only leads to a slow heat transfer process, but also may cause a large amount of heat loss during the conveying process. The conveying component 134 can be made of a material with good sealing and strong insulation ability, but an overly long conveying component 134 may lead to problems such as increased costs and waste of materials. The length of the conveying component 134 should not be too short, because an overly short conveying component 134 may not ensure that the connection length between the heat conduction component 132 and the temperature simulation component 11 meets the preset length, which may easily cause inconvenience in use (for example, the temperature simulation component 11 is worn on the forehead of the human subject, and the heat conduction component 132 cannot be placed on a desktop far away from the human subject). Therefore, in a specific implementation, the length of the conveying component 134 can be set according to actual conditions.

In a possible implementation, the conveying component 134 may include a first flow conduit and a second flow conduit, and the first flow conduit and the second flow conduit are suitable for scenarios where the heat conductive material is a gaseous heat conductive material or a liquid heat conductive material.

Specifically, the first flow conduit is connected to one end of the temperature simulation component 11 and the first part of the heat conduction component 132; the second flow conduit is connected to the other end of the temperature simulation component 11 and the second part of the heat conduction component 132; wherein the first part is the part of the heat conduction component 132 where the heat conduction material flows out after being heated by the heating component 131; the second part is the part where the heat conduction material flows into the heat conduction component 132 before being heated by the heating component 131. The first flow conduit is used to transport the heat conduction material heated by the heating component 131 to the inside of the temperature simulation component 11; the second flow conduit is used to transport the heat conduction material flowing out of the inside of the temperature simulation component 11 to the heat conduction component 132.

Here, a cavity may be provided inside the temperature simulation component 11, and the cavity is used for the circulation of heat-conducting materials. Specifically, the temperature simulation component 11 may be a sealed double-layer shell with a cavity formed inside the shell, or may be integrally formed. In order to make the temperature simulation device 10 more portable, the temperature simulation component 11 may be made of organic glass or plastic.

After being heated by the heating component 131, the heat-conductive material flows out from the first part of the heat-conductive component 132, and then is transported to the interior of the temperature simulation component 11 through the first flow conduit and one end of the temperature simulation component 11. The heat-conductive material inside the temperature simulation component 11 flows out through the other end of the temperature simulation component 11, and flows into the interior of the heat-conductive component 132 through the second flow conduit and the second part of the heat-conductive component 132, and continues to be heated by the heating component 131.

Through the above-mentioned connection method, the first flow conduit, the temperature simulation component 11, the second flow conduit, and the heat conduction component 132 can be connected, and the heat conduction material can circulate inside the first flow conduit, the temperature simulation component 11, the second flow conduit, and the heat conduction component 132, so as to maintain the temperature of the temperature simulation component 11 when there is heat loss in the temperature simulation device 10.

In the embodiment of the present disclosure, the temperature of the temperature simulation component 11 can be adjusted by controlling the amount of heat transferred to the temperature simulation component 11. In one possible implementation, this can be achieved by controlling the speed at which the heat conductive material enters the interior of the temperature simulation component 11. The faster the speed at which the heat conductive material enters the interior of the temperature simulation component 11, the more heat is transferred to the temperature simulation component 11. The slower the speed at which the heat conductive material enters the interior of the temperature simulation component 11, the less heat is transferred to the temperature simulation component 11.

Specifically, in the structural diagram of the temperature control component shown in FIG6 , the temperature control component 21 may include a flow regulating component 211. The flow regulating component 211 is used to control the speed at which the heat-conducting material in the conveying component 134 enters the interior of the temperature simulation component 11, so as to control the amount of heat transferred from the heat-generating component 13 to the temperature simulation component 11. Therefore, the flow regulating component 211 is disposed at the first preset position of the conveying component 134.

In a specific implementation, the flow regulating component 211 may include an air pump and/or an air pressure valve; the air pump is used to adjust the speed at which the heat conductive material enters the interior of the temperature simulation component 11. The air pressure valve is used to adjust the pressure in the conveying component 134. When the pressure in the conveying component 134 is relatively high, the air pressure valve reduces the pressure in the conveying component 134 by releasing pressure; when the pressure in the conveying component 134 is relatively low, the air pressure valve increases the pressure in the conveying component 134 by increasing pressure.

Here, the first preset position may be set at any position in the conveying member 134 before the heat conductive material enters the interior of the temperature simulation member 11 .

This embodiment is mainly applicable to the case where the heat conductive material is a gaseous heat conductive material or a liquid heat conductive material. When the heat conductive material is a solid heat conductive material, if the solid heat conductive material can move in the conveying component 134 and enter the interior of the temperature simulation component 11 to transfer heat to the temperature simulation component 11, a flow regulating component 211 can also be set to control the speed at which the heat conductive material in the conveying component 134 enters the interior of the temperature simulation component 11. For example, when the conveying component 134 is a conveyor belt and the flow regulating component 211 is a speed regulating component of the conveyor belt, it is also possible to control the speed at which the heat conductive material in the conveying component 134 enters the interior of the temperature simulation component 11, so as to control the amount of heat transferred from the heat generating component 13 to the temperature simulation component 11.

In order to more accurately adjust the temperature transmitted to the temperature simulation component 11, in a possible embodiment, as shown in the structural schematic diagram of the third temperature simulation device in Figure 7, the temperature adjustment component 12 may include a temperature measuring component 22, and the temperature control component 21 may also include a calculation component 212, and the calculation component 212 is arranged at a second preset position of the conveying component 134.

Here, the second preset position may be a position in the conveying member 134 before the heat conductive material is input into the heat conductive member 132, and a position in the conveying member 134 after the heat conductive material is output from the heat conductive member 132. Thus, the temperature measuring member 22 may measure the first temperature of the heat conductive material after being heated by the heating member 131 and the second temperature of the heat conductive material before being heated by the heating member 131. Here, it is mainly considered that the heat conductive material may lose heat after being heated by the heating member 131 and before being heated by the heating member 131, especially during the transmission process in the conveying member 134.

Then, the calculation component 212 generates and sends a first control instruction to the flow regulating component 211 based on the first temperature, the second temperature and the preset temperature, so that the flow regulating component 211 controls the speed at which the heat conductive material in the conveying component 134 enters the interior of the temperature simulation component 11 based on the first control instruction.

Here, the calculation component 212 may calculate the difference between the first temperature and the second temperature, and based on the difference, generate and send a first control instruction to the flow regulating component 211. The calculation component 212 here may be any processor with calculation and control capabilities.

Specifically, when the difference between the first temperature and the second temperature is large, the speed at which the heat-conductive material enters the temperature simulation component 11 can be increased, so that the heat-conductive material can reach the temperature simulation component 11 as soon as possible before the heat of the heat-conductive material is greatly lost, so that the heat-conductive material can transfer more heat to the temperature simulation component 11, thereby increasing the temperature of the temperature simulation component 11 more quickly. When the difference between the first temperature and the second temperature is small, the speed at which the heat-conductive material enters the temperature simulation component 11 can be reduced, so that the heat-conductive material can slowly transfer heat to the temperature simulation component 11, thereby reducing the temperature rise speed inside the temperature simulation component 11 or keeping the temperature inside the temperature simulation component 11 in a relatively stable state.

At the same time, the calculation component 212 adjusts the speed at which the heat conductive material enters the interior of the temperature simulation component 11 based on the first temperature and the second temperature. That is, the calculation component 212 quantifies the speed at which the heat conductive material enters the interior of the temperature simulation component 11, thereby more accurately adjusting the temperature inside the temperature simulation component 11.

In a possible implementation, the temperature measuring component 22 may include a first temperature measuring component disposed on the first flow conduit, and a second temperature measuring component disposed on the second flow conduit, wherein the first temperature measuring component is used to measure the first temperature of the heat conductive material after being heated by the heating component 131; and the second temperature measuring component is used to measure the second temperature of the heat conductive material before being heated by the heating component 131.

Since the heat conductive material heated by the heating component 131 enters the interior of the temperature simulation component 11 through the first flow conduit, the heat conductive material before being heated by the heating component 131 enters the heat conductive component 132 through the second flow conduit, that is, the temperature on the first flow conduit is measured by the first temperature measuring component, and the temperature on the second flow conduit is measured by the second temperature measuring component.

It should be noted that in order to more accurately obtain the temperature difference between the first temperature and the second temperature, and further more accurately adjust the speed at which the heat conductive material enters the interior of the temperature simulation component 11, the first temperature measuring device can be arranged on the first guide tube near the heating component 131, and the second temperature measuring device can be arranged on the second guide tube near the heating component 131. In this way, the first temperature measured by the first temperature measurement is the temperature of the heat conductive material just after being heated by the heating component 131, and the second temperature measured by the second temperature measurement is the temperature of the heat conductive material to be heated by the heating component 131. At this time, the temperature difference between the first temperature and the second temperature is the temperature difference of the heat conductive material after completing one transmission, which is equivalent to the temperature difference after considering all the heat lost by the heat conductive material during the transmission process. Therefore, the speed at which the heat conductive material enters the interior of the temperature simulation component 11 can be more accurately adjusted, and finally the temperature of the temperature simulation component 11 can be more accurately adjusted.

In addition to adjusting the temperature inside the temperature simulation component 11 by sending a first control instruction to the flow regulating component 211 so that the flow regulating component 211 controls the speed at which the heat conductive material in the conveying component 134 enters the interior of the temperature simulation component 11 based on the first control instruction, the calculation component 212 can also adjust the temperature inside the temperature simulation component 11 by controlling the amount of heat generated by the heating component 131.

In a possible implementation, the calculation component 212 is further configured to generate and send a second control instruction to the heating component 131 based on the first temperature, the second temperature and the preset temperature, so as to control the amount of heat generated by the heating component 131 .

Here, the calculation component 212 can calculate the difference between the first temperature and the second temperature, and generate a second control instruction for controlling the amount of heat generated by the heating component 131 based on the difference and the preset temperature. When the difference between the first temperature and the second temperature is large, the heating component 131 can be controlled to generate more heat; when the difference between the first temperature and the second temperature is small, the heating component 131 can be controlled to generate less heat.

Considering that the heat-conducting material will undergo a preheating process when the temperature simulation device 10 changes from an unused state to a used state, the temperature simulation device 10 can be used normally only after the preheating of the heat-conducting material is completed. Therefore, in a possible implementation, the calculation component 212 is also used to determine whether the preheating of the heat-conducting material is completed based on the preset temperature, the first temperature and the second temperature.

When the preheating of the heat conductive material is completed, the difference between the average of the first temperature and the second temperature and the preset temperature is within the second preset range, and the difference between the first temperature and the second temperature is within the third preset range. The process of completing the preheating of the heat conductive material will be described in detail below.

When the preheating of the heat conductive material is completed, the temperature of the heat conductive material is determined based on the first temperature and the second temperature, and a second control instruction is generated and sent to the heating component 131 based on the temperature of the heat conductive material and the preset temperature.

Among them, when the preheating of the heat conductive material is completed, under ideal conditions, the first temperature and the second temperature should be equal, that is, the temperature of the heat conductive material can be equal to the first temperature or the second temperature, but here the accuracy and sealing of the temperature simulation device 10 are considered, so the temperature of the heat conductive material can be the average of the first temperature and the second temperature, that is, the calculation component 212 can be used to calculate the average of the first temperature and the second temperature based on the first temperature and the second temperature, and determine that the average of the first temperature and the second temperature is the temperature of the heat conductive material.

The preset temperature refers to a temperature that is artificially preset and within the temperature variation range of the human body. By presetting a temperature, the purpose is to expect the temperature of the heat-conducting material in the temperature simulation component 11 to reach the preset human body temperature, and the temperature of the heat-conducting material is used to represent the preset human body temperature.

After the preheating of the heat conductive material is completed, due to the sealing problem of the temperature simulation device 10 and the usage requirements, the heat conductive material may not always be maintained at the preset temperature. The heat conductive material may not reach the preset temperature, or the heat conductive material may exceed the preset temperature. Therefore, the calculation component 212 can be used to generate and send a second control instruction to the heating component 131 based on the temperature of the heat conductive material and the preset temperature, so that the heating component 131 increases the heat production or decreases the heat production according to the second control instruction, so that the heat conductive material is maintained at the preset temperature.

Here, the principle that the calculation component 212 sends a second control instruction to keep the heat conductive material at the preset temperature when the heat conductive material does not reach the preset temperature is first introduced.

In a possible implementation, the second control instruction may include a first sub-instruction. The calculation component 212 is further configured to generate and send a first sub-instruction to the heating component 131 to control the heating component 131 to increase the amount of heat generated when the temperature of the heat-conducting material is lower than a preset temperature and the difference between the temperature of the heat-conducting material and the preset temperature exceeds a first preset range.

It is known that due to the sealing of the temperature simulation device 10, the temperature of the heat conductive material may not be completely equal to the preset temperature. That is, when the difference between the temperature of the heat conductive material and the preset temperature is within a certain preset range, we can consider that the temperature of the heat conductive material has reached the preset temperature, and at this time, we can also consider that the temperature simulation device 10 has reached a state of thermal equilibrium.

In a specific implementation, the difference between the temperature of the heat conductive material and the preset temperature can be a positive value or a negative value, that is, the temperature of the heat conductive material can be greater than the preset temperature or less than the preset temperature. For example, when the absolute value of the difference between the temperature of the heat conductive material and the preset temperature is 0.2 degrees Celsius, the first preset range can be -0.2 degrees Celsius to 0.2 degrees Celsius.

When the temperature of the heat conductive material is lower than the preset temperature, and the difference between the temperature of the heat conductive material and the preset temperature exceeds the first preset range, it means that the temperature of the heat conductive material has not reached the preset temperature. Therefore, it is necessary to control the heating component 131 to increase the heat generated so that the temperature of the heat conductive material quickly reaches the preset temperature (that is, the difference between the temperature of the heat conductive material and the preset temperature is within the first preset range).

In a possible implementation, the speed at which the heat-conducting material in the conveying component 134 enters the interior of the temperature simulation component 11 may be increased so that the temperature of the heat-conducting material quickly reaches a preset temperature.

Specifically, the first control instruction includes a second sub-instruction. The calculation component 212 is also used to generate and send a second sub-instruction to the flow regulating component 211 to increase the speed at which the heat conductive material in the conveying component 134 enters the interior of the temperature simulation component 11 when the temperature of the heat conductive material is lower than the preset temperature and the difference between the temperature of the heat conductive material and the preset temperature exceeds the first preset range.

In this embodiment, after increasing the speed at which the heat conductive material in the conveying component 134 enters the interior of the temperature simulation component 11, the heat conductive material in the conveying component 134 can enter the interior of the temperature simulation component 11 more quickly, that is, the heat conductive material with more heat is conveyed to the interior of the temperature simulation component 11 more quickly, thereby enabling the temperature of the heat conductive material to quickly reach the preset temperature.

In a possible implementation, the calculation component 212 may also send a first sub-instruction to the heating component 131 and a second sub-instruction to the flow regulating component 211 at the same time, so that the temperature of the heat-conducting material reaches a preset temperature more quickly. The specific implementation process is not repeated here.

The above describes that in the case where the heat conductive material does not reach the preset temperature, the calculation component 212 sends the first sub-instruction and/or the second sub-instruction to achieve the process of quickly reaching the preset temperature of the heat conductive material. In the specific implementation process, the calculation component 212 can determine what instruction to send according to the difference between the temperature of the heat conductive material and the preset temperature, which is not specifically limited here.

The following will introduce the principle that the calculation component 212 sends the second control instruction to keep the heat conductive material at the preset temperature when the heat conductive material exceeds the preset temperature.

In one possible embodiment, the second control instruction includes a third sub-instruction; the calculation component 212 is also used to generate and send the third sub-instruction to the heating component 131 when the temperature of the heat conductive material is higher than the preset temperature and the difference between the temperature of the heat conductive material and the preset temperature exceeds the first preset range, so as to control the heating component 131 to reduce the heat generation.

When the temperature of the heat conductive material is higher than the preset temperature, and the difference between the temperature of the heat conductive material and the preset temperature exceeds the first preset range, it means that the temperature of the heat conductive material has exceeded the preset temperature. Therefore, it is necessary to control the heating component 131 to reduce the heat generated so that the temperature of the heat conductive material quickly drops to the preset temperature (that is, the difference between the temperature of the heat conductive material and the preset temperature is within the first preset range).

In one possible embodiment, the first control instruction includes a fourth sub-instruction; the calculation component 212 is also used to generate and send the fourth sub-instruction to the flow regulating component 211 when the temperature of the heat conductive material is higher than the preset temperature and the difference between the temperature of the heat conductive material and the preset temperature exceeds the first preset range, so as to reduce the speed at which the heat conductive material in the conveying component 134 enters the interior of the temperature simulation component 11.

In this embodiment, after reducing the speed at which the heat conductive material in the conveying component 134 enters the interior of the temperature simulation component 11, the heat conductive material in the conveying component 134 can enter the interior of the temperature simulation component 11 more slowly, that is, the heat conductive material with more heat is conveyed more slowly to the interior of the temperature simulation component 11, thereby achieving the temperature of the heat conductive material being reduced to a preset temperature.

In a possible implementation, the calculation component 212 may also send a third sub-instruction to the heating component 131 and a fourth sub-instruction to the flow regulating component 211 at the same time, so as to reduce the temperature of the heat-conducting material to a preset temperature more quickly. The specific implementation process will not be described in detail here.

The above describes that in the case where the temperature of the heat conductive material exceeds the preset temperature, the calculation component 212 sends the third sub-instruction and/or the fourth sub-instruction to achieve a process of quickly reducing the temperature of the heat conductive material to the preset temperature. In the specific implementation process, the calculation component 212 can determine what instruction to send according to the difference between the temperature of the heat conductive material and the preset temperature, which is not specifically limited here.

Continuing from the above, in a possible implementation, the process of determining whether the preheating of the heat conductive material is completed can be completed by the calculation component 212. Specifically, the calculation component 212 is used to determine the difference between the average of the first temperature and the second temperature and the preset temperature, and determine that the preheating of the heat conductive material is completed when the difference between the average and the preset temperature is within a second preset range and the difference between the first temperature and the second temperature is within a third preset range.

That is, there are two conditions for determining whether the preheating of the heat conductive material is completed: first, determining whether the difference between the average of the first temperature and the second temperature and the preset temperature is within the second preset range; second, determining whether the difference between the first temperature and the second temperature is within the third preset range.

The average of the first temperature and the second temperature refers to the average value of the first temperature and the second temperature.

Under ideal conditions, it can be considered that when the average of the first temperature and the second temperature is equal to the preset temperature, and the first temperature is equal to the second temperature, it means that the preheating of the heat conduction material is completed. However, in the specific operation process, considering the accuracy and sealing of the temperature simulation device 10, usually, the average of the first temperature and the second temperature is not equal to the preset temperature, and the first temperature is not equal to the second temperature. Therefore, the second preset range and the third preset range are set here, so that the difference between the average of the first temperature and the second temperature and the preset temperature is within the second preset range, and the difference between the first temperature and the second temperature is within the third preset range. We believe that the preheating is completed.

The second preset range and the third preset range here may be the same or different. For example, the second preset range and the third preset range may both be 0 degrees Celsius to 0.2 degrees Celsius. The second preset range and the third preset range are not specifically limited here.

Regarding the conditions for determining whether the preheating of the heat conductive material is completed, when the preheating of the heat conductive material is not completed, it can be achieved through the following implementation. The following will introduce in detail how the calculation component 212 sends instructions to control the process of completing the preheating of the heat conductive material.

In one possible embodiment, the first control instruction includes a fifth sub-instruction; the calculation component 212 is also used to generate and send the fifth sub-instruction to the flow regulating component 211 when the difference between the mean and the preset temperature is within the second preset range and the difference between the first temperature and the second temperature is not within the third preset range, so as to increase the speed at which the heat conductive material in the conveying component 134 enters the interior of the temperature simulation component 11.

In this embodiment, the function of the fifth sub-instruction is mainly to make the difference between the first temperature and the second temperature within the third preset range. After increasing the speed at which the heat conductive material in the conveying component 134 enters the interior of the temperature simulation component 11, the heat conductive material in the conveying component 134 can enter the interior of the temperature simulation component 11 faster, thereby achieving the difference between the first temperature and the second temperature within the third preset range as soon as possible.

In one possible embodiment, the second control instruction includes a sixth sub-instruction; the calculation component 212 is also used to generate and send the sixth sub-instruction to the heating component 131 when the difference between the mean and the preset temperature is not within the second preset range and the mean is greater than the preset temperature, so as to control the heating component 131 to reduce the heat generated.

In this embodiment, as mentioned above, the mean refers to the average value of the first temperature and the second temperature. The difference between the mean and the preset temperature is not within the second preset range, and the mean is greater than the preset temperature, indicating that the temperature in the temperature simulation device 10 is high, and the temperature simulation device 10 needs to be cooled down. The function of the sixth sub-instruction is mainly to control the heating component 131 to reduce the heat generation so that the difference between the mean and the preset temperature is within the second preset range.

After the heating component 131 reduces the heat generated, the first temperature of the heating component 131 after heating will decrease. As the heat conductive material circulates, the overall temperature in the temperature simulation device 10 will decrease until the difference between the average value and the preset temperature is within the second preset range.

In one possible embodiment, the second control instruction includes a seventh sub-instruction; the calculation component 212 is also used to generate and send the seventh sub-instruction to the heating component 131 when the difference between the mean and the preset temperature is not within a second preset range and the mean is less than the preset temperature, so as to control the heating component 131 to increase the heat generated.

In this embodiment, the difference between the mean and the preset temperature is not within the second preset range, and the mean is less than the preset temperature, indicating that the temperature in the temperature simulation device 10 is low. At this time, the temperature simulation device 10 needs to be heated up. The function of the seventh sub-instruction is mainly to control the heating component 131 to increase the heat generated so that the difference between the mean and the preset temperature is within the second preset range.

After the heating component 131 increases the heat generated, the first temperature of the heated heating component 131 will increase. As the heat conductive material circulates, the overall temperature in the temperature simulation device 10 will increase until the difference between the average value and the preset temperature is within a second preset range.

In a possible embodiment, the calculation component 212 is also used to send the sixth sub-instruction or the seventh sub-instruction to the heating component 131 while sending the fifth sub-instruction to the flow regulation component 211, so that the difference between the average and the preset temperature is within the second preset range, and the difference between the first temperature and the second temperature is within the third preset range, thereby completing the preheating of the heat conduction material.

When preheating the heat conductive material, a higher temperature (for example, 42 degrees Celsius) can be set in advance so that the heat conductive material can complete the preheating as soon as possible. After the preheating is completed, a suitable temperature (for example, 37 degrees Celsius) is set. According to the aforementioned process, after the temperature of the heat conductive material reaches the preset temperature, the temperature simulation device provided in the embodiment of the present disclosure can be used to simulate the human body temperature, and further realize the process of temperature testing and the research and development of temperature measuring equipment.

The temperature simulation device provided by the embodiment of the present disclosure will be described in detail below based on the structural schematic diagram of the fourth temperature simulation device shown in Figure 8. The temperature simulation device provided by the embodiment of the present disclosure includes a heating cover 801, an air outlet pipe 803, an air inlet pipe 805, an air pressure valve 806, a heating component 807, a power supply 808, a temperature control component 809, an air inlet thermocouple 810, an air outlet thermocouple 811, an air pump 812, a protection box 813 and a graphene electric heating film 814.

The heating cover 801 is a sealed transparent double-layer heating cover, which can be made of organic glass or plastic in one piece, and the middle of the heating cover 801 is a sealed interlayer space for heated air to pass through, and the hot air can transfer heat to the heating cover 801. The heating cover 801 can be worn on the forehead through an ear hook, and the shape and size of the heating cover 801 are close to the forehead.

The heating hood 801 is provided with an air inlet interface 802 and an air outlet interface 804 at both ends, one end of the air inlet pipe 805 is connected to the air inlet interface 802, and the other end of the air inlet pipe 805 is connected to the air outlet of the heating component 807, one end of the air outlet pipe 803 is connected to the air outlet interface 804, and the other end of the air outlet pipe 803 is connected to the air inlet of the heating component 807. The air inlet pipe 805 is used to input the air heated by the heating component 807 into the heating hood 801, and the air outlet pipe 803 is used to input the air in the heating hood 801 into the heating component 807 for heating.

The air pressure valve 806 and the air pump 812 are both arranged on the air inlet pipe 805 . The air pressure valve 806 is used to adjust the air pressure of the air in the air inlet pipe 805 , and the air pump 812 is used to adjust the flow rate of the air in the air inlet pipe 805 .

The air inlet thermocouple 810 is disposed on the air inlet pipe 805 to measure the temperature of the air in the air inlet pipe 805 , and the air outlet thermocouple 811 is disposed on the air outlet pipe 803 to measure the temperature of the air in the air outlet pipe 803 .

The graphene electric heating film 814 is connected to the power supply 808, and the graphene electric heating film 814 covers the surface of the heating component 807. The power supply 808 is used to provide power to the graphene electric heating film 814, so that the graphene electric heating film 814 generates heat, and the graphene electric heating film 814 is used to transfer the heat to the heating component 807, and the heating component 807 is used to transfer the heat to the air inside. The heating component 807 can be an aluminum alloy heating component, and the heating component 807 is provided with a plurality of small holes for the air to be quickly heated in the heating component 807.

The temperature control component 809 is respectively connected to the air pump 812, the air inlet thermocouple 810, the air outlet thermocouple 811 and the graphene electric heating film 814.

The temperature control component 809 is used to control the rotation speed of the air pump 812, adjust the flow rate of the air in the air inlet pipe 805, and control the heat generated by the graphene electric heating film 814 according to the temperature of the air in the air inlet pipe 805 measured by the air inlet thermocouple 810 and the temperature of the air in the air outlet pipe 803 measured by the air outlet thermocouple 811, so as to change or maintain the temperature of the heating cover 801. The temperature control component 809 is also used to set the temperature that the heating cover needs to reach. The temperature control component includes a display screen for displaying the temperature of the heating cover and the set temperature, and prompting the temperature status.

The protection box 813 is used to protect the air pressure valve 806, the heating component 807, the power supply 808, the temperature control component 809, the air inlet thermocouple 810, the air outlet thermocouple 811, the air pump 812, and the graphene electric heating film 814 arranged therein.

The principle of the temperature simulation device is as follows: first, a preheating temperature is set on the temperature control component 809, and the power supply 808 is turned on to heat the graphene electric heating film 814. The graphene electric heating film 814 transfers heat to the heating component 807, and the heating component 807 transfers heat to the internal air. The air is input into the heating cover 801 through the air inlet pipe 805, and the heat is transferred to the heating cover 801. The air in the heating cover 801 is input into the heating component 807 through the air outlet pipe 803, and the heating component 807 transfers heat to the internal air. During the circulation of the air in the temperature simulation device, the temperature control component 809 controls the rotation speed of the vacuum pump 812 according to the temperature of the air in the air inlet pipe 805 measured by the air inlet thermocouple 810 and the temperature of the air in the air outlet pipe 803 measured by the air outlet thermocouple 811, adjusts the flow rate of the air in the air inlet pipe 805, and controls the heat generated by the graphene electric heating film 814 until the temperature of the air reaches equilibrium.

The solution provided by the embodiment of the present disclosure adjusts the temperature of the temperature simulation component through a temperature adjustment component, so that the temperature simulation component can exhibit different temperatures, thereby simulating temperature measurement objects in different temperature states, overcoming the defect in the prior art that objects with abnormal body temperatures cannot be used for temperature measurement verification, and is conducive to improving the verification accuracy and completeness of the verified human body temperature measurement equipment.

The following is a scenario of using the temperature simulation device. For example, a batch of face recognition temperature measurement devices used to detect human body temperature require temperature measurement accuracy. The equipment debugging personnel can set the temperature of the temperature control component 809 in the temperature simulation device provided by the embodiment of the present disclosure to 37.5 degrees Celsius. After the temperature control component 809 indicates that the temperature is stable, the equipment debugging personnel put on the temperature simulation device. The equipment debugging personnel walk to the first face recognition temperature measurement device. The first face recognition temperature measurement device recognizes that the body temperature of the equipment debugging personnel is 37.5 degrees Celsius, which exceeds the high temperature line of 37.3 degrees Celsius. The first face recognition temperature measurement device immediately prompts the equipment debugging personnel to have a fever and gives a warning. The equipment debugging personnel walks to the second face recognition temperature measurement device. The second face recognition temperature measurement device prompts that the temperature is 36.5 degrees Celsius. Based on this, the equipment debugging personnel can judge that the temperature measurement of the first face recognition temperature measurement device is normal, while the temperature measurement of the second face recognition temperature measurement device is abnormal, and then the second face recognition temperature measurement device can be debugged.

Based on the same inventive concept, the present disclosure also provides a temperature simulation method corresponding to the temperature simulation device. In a flow chart of a temperature simulation method as shown in FIG9 , the method includes the following steps:

S901: Acquire the temperature of the temperature simulation component;

S902: Based on the acquired temperature, adjust the heat transferred from the heat conductive material to the temperature simulation component through the temperature adjustment component to adjust the temperature of the temperature simulation component; wherein the temperature of the temperature simulation component represents the temperature of the object on which the temperature simulation component is installed; and the heat in the heat conductive material is the heat transferred to the heat conductive material after the heat generating component generates heat.

In a possible implementation, S902 may include: acquiring a preset temperature; and adjusting the amount of heat transferred from the heat conductive material to the temperature simulation component based on the acquired temperature and the preset temperature, so as to adjust the temperature of the temperature simulation component.

Since the principle of solving the problem by the method in the embodiment of the present disclosure is similar to that of the temperature simulation device in the embodiment of the present disclosure, the implementation of the method can refer to the implementation of the device, and the repeated parts will not be repeated.

Based on the same technical concept, the embodiment of the present disclosure also provides a computer device. Referring to FIG. 10 , it is a schematic diagram of the structure of the computer device 1000 provided in the embodiment of the present disclosure, including a processor 1001, a memory 1002, and a bus 1003. Among them, the memory 1002 is used to store execution instructions, including a memory 10021 and an external memory 10022; the memory 10021 here is also called an internal memory, which is used to temporarily store the calculation data in the processor 1001, and the data exchanged with the external memory 10022 such as a hard disk. The processor 1001 exchanges data with the external memory 10022 through the memory 10021. When the computer device 1000 is running, the processor 1001 communicates with the memory 1002 through the bus 1003, so that the processor 1001 executes the following instructions:

Acquiring the temperature of the temperature simulation component;

Based on the acquired temperature, the heat transferred from the heat conductive material to the temperature simulation component is adjusted by the temperature adjusting component to adjust the temperature of the temperature simulation component; wherein the temperature of the temperature simulation component represents the temperature of the object on which the temperature simulation component is installed; and the heat in the heat conductive material is the heat transferred to the heat conductive material after the heat generating component generates heat.

The present disclosure also provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the steps of the temperature simulation method described in the above method embodiment are executed. The storage medium can be a volatile or non-volatile computer-readable storage medium.

The present disclosure also provides a computer program product that carries a program code. The program code includes instructions that can be used to execute the steps of the temperature simulation method described in the above method embodiment. For details, please refer to the above method embodiment, which will not be repeated here.

The computer program product may be implemented in hardware, software or a combination thereof. In one optional embodiment, the computer program product is implemented as a computer storage medium. In another optional embodiment, the computer program product is implemented as a software product, such as a software development kit (SDK).

Those skilled in the art can clearly understand that, for the convenience and simplicity of description, the specific working process of the system and device described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. In the several embodiments provided in the present disclosure, it should be understood that the disclosed system, device and method can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of the device or unit can be electrical, mechanical or other forms.

The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional unit in each embodiment of the present disclosure may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present disclosure, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present disclosure. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present disclosure, which are used to illustrate the technical solutions of the present disclosure, rather than to limit them. The protection scope of the present disclosure is not limited thereto. Although the present disclosure is described in detail with reference to the above-described embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-described embodiments within the technical scope disclosed in the present disclosure, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure, and should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims (18)

1. A temperature simulation device, characterized in that it comprises: a temperature simulation component, a heat generating component, and a temperature adjustment component; the heat generating component is connected to the temperature simulation component and the temperature adjustment component; a heat conductive material is arranged in the heat generating component; The heat generating component is used to generate heat and transfer the generated heat to the heat conductive material, so that the heat conductive material transfers its own heat to the temperature simulation component; The temperature adjustment component is used to adjust the amount of heat transferred from the heat conductive material to the temperature simulation component to change or maintain the temperature of the temperature simulation component, wherein the temperature of the temperature simulation component is used to represent the temperature of the object on which the temperature simulation component is installed; The heat generating component comprises a heating component, a heat conducting component and a conveying component for conveying the heat conducting material; the heat conducting material is arranged in the heat conducting component; the heating component is connected to the heat conducting component; the heating component is arranged on the surface of the heat conducting component; the temperature simulation component is connected to the heat conducting component through the conveying component; The heating component is used to generate heat and use the generated heat to heat the heat conducting component; The heat conducting component is used to conduct heat to the heat conducting material to change or maintain the temperature of the heat conducting material; The conveying component is used to convey the heat conductive material to the interior of the temperature simulation component; The temperature adjustment component includes a temperature control component and a temperature measurement component; the temperature control component is connected to the heat generating component and the temperature simulation component; the temperature measurement component is arranged at a second preset position of the conveying component; The temperature control component is used to control the amount of heat transferred from the heat generating component to the temperature simulation component based on a preset temperature; the temperature control component includes a calculation component; The temperature measuring component is used to measure a first temperature of the heat conductive material after being heated by the heating component and a second temperature of the heat conductive material before being heated by the heating component; The calculation component is used to determine whether the preheating of the heat conductive material is completed based on the preset temperature, the first temperature and the second temperature; if the preheating of the heat conductive material is completed, determine the temperature of the heat conductive material based on the first temperature and the second temperature, and generate and send a second control instruction to the heating component based on the temperature of the heat conductive material and the preset temperature, so as to change the amount of heat generated by the heating component; The calculation component is further used to determine the difference between the average of the first temperature and the second temperature and the preset temperature, and determine that the preheating of the heat conductive material is completed when the difference between the average and the preset temperature is within a second preset range and the difference between the first temperature and the second temperature is within a third preset range. 2. The temperature simulation device according to claim 1, characterized in that the heating component is an electric heating film; the heat generating component further comprises a power supply; the power supply is connected to the electric heating film; The power supply is used to supply power to the electric heating film so that the electric heating film generates heat. 3. The temperature simulation device according to claim 2, characterized in that the temperature control component comprises a flow regulating component; the flow regulating component is arranged at a first preset position of the conveying component; The flow regulating component is used to control the speed at which the heat conductive material in the conveying component enters into the temperature simulation component. 4. The temperature simulation device according to claim 3 is characterized in that the calculation component is used to generate and send a first control instruction to the flow regulating component based on the first temperature, the second temperature and the preset temperature, so that the flow regulating component controls the speed at which the heat conductive material in the conveying component enters the interior of the temperature simulation component based on the first control instruction. 5. The temperature simulation device according to claim 4, characterized in that the conveying component comprises a first flow conduit and a second flow conduit; the first flow conduit is connected to one end of the temperature simulation component and a first portion of the heat conduction component; the second flow conduit is connected to the other end of the temperature simulation component and a second portion of the heat conduction component; wherein the first portion is a portion of the heat conduction component from which the heat conduction material flows out after being heated by the heating component; and the second portion is a portion of the heat conduction component from which the heat conduction material flows before being heated by the heating component; The first flow guide pipe is used to transport the heat-conducting material heated by the heating component to the interior of the temperature simulation component; The second flow guide pipe is used to transport the heat conduction material flowing out from the interior of the temperature simulation component to the heat conduction component. 6. The temperature simulation device according to claim 5, characterized in that the temperature measuring component comprises a first temperature measuring component arranged on the first flow conduit, and a second temperature measuring component arranged on the second flow conduit; The first temperature measuring component is used to measure a first temperature of the heat conductive material after being heated by the heating component; The second temperature measuring component is used to measure a second temperature of the heat conductive material before being heated by the heating component. 7. The temperature simulation device according to claim 1, characterized in that the second control instruction includes a first sub-instruction; The calculation component is also used to generate and send the first sub-instruction to the heating component to control the heating component to increase the amount of heat generated when the temperature of the heat conductive material is lower than the preset temperature and the difference between the temperature of the heat conductive material and the preset temperature exceeds a first preset range. 8. The temperature simulation device according to claim 4, characterized in that the first control instruction includes a second sub-instruction; The calculation component is also used to generate and send the second sub-instruction to the flow regulating component to increase the speed at which the heat conductive material in the conveying component enters the interior of the temperature simulation component when the temperature of the heat conductive material is lower than the preset temperature and the difference between the temperature of the heat conductive material and the preset temperature exceeds a first preset range. 9. The temperature simulation device according to claim 1, characterized in that the second control instruction includes a third sub-instruction; The calculation component is also used to generate and send the third sub-instruction to the heating component to control the heating component to reduce the amount of heat generated when the temperature of the heat conductive material is higher than the preset temperature and the difference between the temperature of the heat conductive material and the preset temperature exceeds a first preset range. 10. The temperature simulation device according to claim 8, characterized in that the first control instruction includes a fourth sub-instruction; The calculation component is also used to generate and send the fourth sub-instruction to the flow regulating component to reduce the speed at which the heat conductive material in the conveying component enters the interior of the temperature simulation component when the temperature of the heat conductive material is higher than the preset temperature and the difference between the temperature of the heat conductive material and the preset temperature exceeds a first preset range. 11. The temperature simulation device according to claim 4, characterized in that the first control instruction includes a fifth sub-instruction; The calculation component is also used to generate and send the fifth sub-instruction to the flow regulating component to increase the speed at which the heat conductive material in the conveying component enters the interior of the temperature simulation component when the difference between the mean and the preset temperature is within the second preset range and the difference between the first temperature and the second temperature is not within the third preset range. 12. The temperature simulation device according to claim 1, characterized in that the second control instruction includes a sixth sub-instruction; The calculation component is also used to generate and send the sixth sub-instruction to the heating component to control the heating component to reduce the amount of heat generated when the difference between the mean and the preset temperature is not within a second preset range and the mean is greater than the preset temperature. 13. The temperature simulation device according to claim 1, characterized in that the second control instruction includes a seventh sub-instruction; The calculation component is also used to generate and send the seventh sub-instruction to the heating component to control the heating component to increase the amount of heat generated when the difference between the mean and the preset temperature is not within a second preset range and the mean is less than the preset temperature. 14. The temperature simulation device according to claim 3, characterized in that the flow regulating component comprises an air pump and/or an air pressure valve; The air pump is used to adjust the speed at which the heat conductive material enters the interior of the temperature simulation component; The air pressure valve is used to adjust the pressure in the conveying component. 15. A temperature simulation method, characterized in that it is applied to the temperature simulation device according to any one of claims 1 to 14, comprising: Acquiring the temperature of the temperature simulation component; the temperature is the temperature at which the transport component transports the heat conductive material to the interior of the temperature simulation component; Based on the acquired temperature, the heat transferred from the heat conductive material to the temperature simulation component is adjusted by the temperature adjusting component to adjust the temperature of the temperature simulation component; wherein the temperature of the temperature simulation component represents the temperature of the object on which the temperature simulation component is installed; the heat in the heat conductive material is generated by the heating component arranged on the surface of the heat conductive component and then transferred to the heat conductive material arranged in the heat conductive component. 16. The temperature simulation method according to claim 15, characterized in that adjusting the amount of heat transferred from the heat conductive material to the temperature simulation component based on the acquired temperature to adjust the temperature of the temperature simulation component comprises: Get the preset temperature; Based on the acquired temperature and the preset temperature, the amount of heat transferred by the heat conductive substance to the temperature simulation component is adjusted to adjust the temperature of the temperature simulation component. 17. A computer device, characterized in that it comprises: a processor and a memory, wherein the memory stores machine-readable instructions executable by the processor, and the processor is used to execute the machine-readable instructions stored in the memory, and when the machine-readable instructions are executed by the processor, the processor executes the steps of the temperature simulation method as described in claim 15 or 16. 18. A computer-readable storage medium, characterized in that a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a computer device, the computer device executes the steps of the temperature simulation method according to claim 15 or 16.