CN113308206A - High-reflection black adhesive film and preparation method and application thereof - Google Patents
High-reflection black adhesive film and preparation method and application thereof Download PDFInfo
- Publication number
- CN113308206A CN113308206A CN202110654682.8A CN202110654682A CN113308206A CN 113308206 A CN113308206 A CN 113308206A CN 202110654682 A CN202110654682 A CN 202110654682A CN 113308206 A CN113308206 A CN 113308206A
- Authority
- CN
- China
- Prior art keywords
- black
- reflection
- reflection layer
- adhesive film
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002313 adhesive film Substances 0.000 title claims abstract description 82
- 238000002360 preparation method Methods 0.000 title claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 103
- 239000011347 resin Substances 0.000 claims abstract description 103
- 239000000049 pigment Substances 0.000 claims abstract description 50
- 238000002310 reflectometry Methods 0.000 claims abstract description 30
- 239000011159 matrix material Substances 0.000 claims abstract description 26
- 239000007822 coupling agent Substances 0.000 claims abstract description 21
- 239000004594 Masterbatch (MB) Substances 0.000 claims abstract description 15
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 11
- 239000011521 glass Substances 0.000 claims description 43
- 238000001125 extrusion Methods 0.000 claims description 30
- 239000003292 glue Substances 0.000 claims description 19
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 16
- 238000004132 cross linking Methods 0.000 claims description 16
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 16
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 16
- 229920001577 copolymer Polymers 0.000 claims description 13
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 13
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 12
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 239000000155 melt Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 10
- 239000004595 color masterbatch Substances 0.000 claims description 9
- 125000004386 diacrylate group Chemical group 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- 239000000178 monomer Substances 0.000 claims description 9
- 239000012463 white pigment Substances 0.000 claims description 8
- 239000011787 zinc oxide Substances 0.000 claims description 8
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 7
- SZVJSHCCFOBDDC-UHFFFAOYSA-N ferrosoferric oxide Chemical compound O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 claims description 7
- 230000003179 granulation Effects 0.000 claims description 7
- 238000005469 granulation Methods 0.000 claims description 7
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 6
- 239000012768 molten material Substances 0.000 claims description 6
- 239000004408 titanium dioxide Substances 0.000 claims description 6
- YTLYLLTVENPWFT-UPHRSURJSA-N (Z)-3-aminoacrylic acid Chemical compound N\C=C/C(O)=O YTLYLLTVENPWFT-UPHRSURJSA-N 0.000 claims description 5
- VAZQKPWSBFZARZ-UHFFFAOYSA-N 2-(2-phenylphenoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1C1=CC=CC=C1 VAZQKPWSBFZARZ-UHFFFAOYSA-N 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- 230000002441 reversible effect Effects 0.000 claims description 5
- 235000012239 silicon dioxide Nutrition 0.000 claims description 5
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 3
- UMTXKRPANUNUCO-UHFFFAOYSA-N 2-[4-(2-phenylpropan-2-yl)phenoxy]ethyl prop-2-enoate Chemical compound C=1C=C(OCCOC(=O)C=C)C=CC=1C(C)(C)C1=CC=CC=C1 UMTXKRPANUNUCO-UHFFFAOYSA-N 0.000 claims description 3
- 239000005995 Aluminium silicate Substances 0.000 claims description 3
- 235000000177 Indigofera tinctoria Nutrition 0.000 claims description 3
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 claims description 3
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 claims description 3
- WHROWQPBDAJSKH-UHFFFAOYSA-N [Mn].[Ni].[Cr] Chemical compound [Mn].[Ni].[Cr] WHROWQPBDAJSKH-UHFFFAOYSA-N 0.000 claims description 3
- AHGFXGSMYLFWEC-UHFFFAOYSA-N [SiH4].CC(=C)C(O)=O Chemical compound [SiH4].CC(=C)C(O)=O AHGFXGSMYLFWEC-UHFFFAOYSA-N 0.000 claims description 3
- -1 acrylic ester Chemical class 0.000 claims description 3
- 235000012211 aluminium silicate Nutrition 0.000 claims description 3
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims description 3
- 150000004056 anthraquinones Chemical class 0.000 claims description 3
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 claims description 3
- UPHIPHFJVNKLMR-UHFFFAOYSA-N chromium iron Chemical compound [Cr].[Fe] UPHIPHFJVNKLMR-UHFFFAOYSA-N 0.000 claims description 3
- PPSZHCXTGRHULJ-UHFFFAOYSA-N dioxazine Chemical compound O1ON=CC=C1 PPSZHCXTGRHULJ-UHFFFAOYSA-N 0.000 claims description 3
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 3
- 229940097275 indigo Drugs 0.000 claims description 3
- COHYTHOBJLSHDF-UHFFFAOYSA-N indigo powder Natural products N1C2=CC=CC=C2C(=O)C1=C1C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-UHFFFAOYSA-N 0.000 claims description 3
- JYGFTBXVXVMTGB-UHFFFAOYSA-N indolin-2-one Chemical group C1=CC=C2NC(=O)CC2=C1 JYGFTBXVXVMTGB-UHFFFAOYSA-N 0.000 claims description 3
- DALUDRGQOYMVLD-UHFFFAOYSA-N iron manganese Chemical compound [Mn].[Fe] DALUDRGQOYMVLD-UHFFFAOYSA-N 0.000 claims description 3
- IXQWNVPHFNLUGD-UHFFFAOYSA-N iron titanium Chemical compound [Ti].[Fe] IXQWNVPHFNLUGD-UHFFFAOYSA-N 0.000 claims description 3
- GWVMLCQWXVFZCN-UHFFFAOYSA-N isoindoline Chemical compound C1=CC=C2CNCC2=C1 GWVMLCQWXVFZCN-UHFFFAOYSA-N 0.000 claims description 3
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000010445 mica Substances 0.000 claims description 3
- 229910052618 mica group Inorganic materials 0.000 claims description 3
- 239000005543 nano-size silicon particle Substances 0.000 claims description 3
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 claims description 3
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 claims description 3
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- YPMOSINXXHVZIL-UHFFFAOYSA-N sulfanylideneantimony Chemical compound [Sb]=S YPMOSINXXHVZIL-UHFFFAOYSA-N 0.000 claims description 3
- 239000000454 talc Substances 0.000 claims description 3
- 229910052623 talc Inorganic materials 0.000 claims description 3
- 235000012222 talc Nutrition 0.000 claims description 3
- JOUDBUYBGJYFFP-FOCLMDBBSA-N thioindigo Chemical compound S\1C2=CC=CC=C2C(=O)C/1=C1/C(=O)C2=CC=CC=C2S1 JOUDBUYBGJYFFP-FOCLMDBBSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920002943 EPDM rubber Polymers 0.000 claims description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 claims description 2
- 229920000092 linear low density polyethylene Polymers 0.000 claims description 2
- 239000004707 linear low-density polyethylene Substances 0.000 claims description 2
- 229920001684 low density polyethylene Polymers 0.000 claims description 2
- 239000004702 low-density polyethylene Substances 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 2
- 229920006132 styrene block copolymer Polymers 0.000 claims description 2
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 230000009467 reduction Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 122
- 230000000052 comparative effect Effects 0.000 description 25
- 238000004806 packaging method and process Methods 0.000 description 17
- 239000000463 material Substances 0.000 description 15
- 238000012360 testing method Methods 0.000 description 13
- 239000002994 raw material Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000010030 laminating Methods 0.000 description 7
- 239000003431 cross linking reagent Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- 238000005303 weighing Methods 0.000 description 5
- 241000269913 Pseudopleuronectes americanus Species 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000004611 light stabiliser Substances 0.000 description 4
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 101001073212 Arabidopsis thaliana Peroxidase 33 Proteins 0.000 description 2
- UQBOJOOOTLPNST-UHFFFAOYSA-N Dehydroalanine Chemical class NC(=C)C(O)=O UQBOJOOOTLPNST-UHFFFAOYSA-N 0.000 description 2
- 101001123325 Homo sapiens Peroxisome proliferator-activated receptor gamma coactivator 1-beta Proteins 0.000 description 2
- 102100028961 Peroxisome proliferator-activated receptor gamma coactivator 1-beta Human genes 0.000 description 2
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 2
- XLWNBYUGNMTGDZ-UHFFFAOYSA-L [O-]S(C(C=C12)=CC=C1N=C(C(C(C1=C3)=O)=NC1=CC=C3S([O-])(=O)=O)C2=O)(=O)=O.[Na+].[Na+] Chemical compound [O-]S(C(C=C12)=CC=C1N=C(C(C(C1=C3)=O)=NC1=CC=C3S([O-])(=O)=O)C2=O)(=O)=O.[Na+].[Na+] XLWNBYUGNMTGDZ-UHFFFAOYSA-L 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 230000003667 anti-reflective effect Effects 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- WTFXARWRTYJXII-UHFFFAOYSA-N iron(2+);iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[Fe+2].[Fe+3].[Fe+3] WTFXARWRTYJXII-UHFFFAOYSA-N 0.000 description 2
- 229920006280 packaging film Polymers 0.000 description 2
- 239000012785 packaging film Substances 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 229940116351 sebacate Drugs 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- XCFLQKXIMOIXEN-UHFFFAOYSA-N tert-butyl 2-ethylhexoxycarbonyloxy carbonate Chemical compound C(=O)(OC(C)(C)C)OOC(=O)OCC(CCCC)CC XCFLQKXIMOIXEN-UHFFFAOYSA-N 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- FGHOOJSIEHYJFQ-UHFFFAOYSA-N (2,4-ditert-butylphenyl) dihydrogen phosphite Chemical compound CC(C)(C)C1=CC=C(OP(O)O)C(C(C)(C)C)=C1 FGHOOJSIEHYJFQ-UHFFFAOYSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- KGUHNPYZVOXLMM-UHFFFAOYSA-N 1-(2,2,6,6-tetramethylpiperidin-4-yl)hexane-1,6-diamine Chemical compound CC1(C)CC(C(N)CCCCCN)CC(C)(C)N1 KGUHNPYZVOXLMM-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- BRQMAAFGEXNUOL-UHFFFAOYSA-N 2-ethylhexyl (2-methylpropan-2-yl)oxy carbonate Chemical compound CCCCC(CC)COC(=O)OOC(C)(C)C BRQMAAFGEXNUOL-UHFFFAOYSA-N 0.000 description 1
- HTCRKQHJUYBQTK-UHFFFAOYSA-N 2-ethylhexyl 2-methylbutan-2-yloxy carbonate Chemical compound CCCCC(CC)COC(=O)OOC(C)(C)CC HTCRKQHJUYBQTK-UHFFFAOYSA-N 0.000 description 1
- QXNVGIXVLWOKEQ-UHFFFAOYSA-N Disodium Chemical class [Na][Na] QXNVGIXVLWOKEQ-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- NZYMWGXNIUZYRC-UHFFFAOYSA-N hexadecyl 3,5-ditert-butyl-4-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCCCOC(=O)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NZYMWGXNIUZYRC-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- WYKYCHHWIJXDAO-UHFFFAOYSA-N tert-butyl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)C WYKYCHHWIJXDAO-UHFFFAOYSA-N 0.000 description 1
- PKYCTRXXOZUHFK-UHFFFAOYSA-N tris(1,2,2,6,6-pentamethylpiperidin-4-yl) phosphite Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OP(OC1CC(C)(C)N(C)C(C)(C)C1)OC1CC(C)(C)N(C)C(C)(C)C1 PKYCTRXXOZUHFK-UHFFFAOYSA-N 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
- H10F19/804—Materials of encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/42—Optical elements or arrangements directly associated or integrated with photovoltaic cells, e.g. light-reflecting means or light-concentrating means
- H10F77/488—Reflecting light-concentrating means, e.g. parabolic mirrors or concentrators using total internal reflection
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
- C08K2003/2272—Ferric oxide (Fe2O3)
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/33—Applications of adhesives in processes or use of adhesives in the form of films or foils for batteries or fuel cells
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
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- Chemical & Material Sciences (AREA)
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- Adhesive Tapes (AREA)
Abstract
本发明涉及封装胶膜技术领域，尤其是涉及一种高反射黑色胶膜及其制备方法和应用。高反射黑色胶膜，包括长波段高反层和全波段高反层；所述长波段高反层包括按重量份数计的如下组分：基体树脂100份、改性树脂5～30份和助剂1～10份；所述改性树脂主要由基体树脂、高反黑色母粒、偶联剂和增粘树脂制得；所述高反黑色母粒主要由改性黑色颜料、高光反射颜料和增反单体制得。本发明的高反射黑色胶膜可在保持黑色外观的同时，实现高反射率，并且制得的黑色组件运行温度较普通黑色组件，可实现大幅降温，可提高组件的功率约5％～7.5％。The invention relates to the technical field of encapsulation adhesive films, in particular to a high-reflection black adhesive film and a preparation method and application thereof. The high-reflection black adhesive film includes a long-wavelength high-reflection layer and an all-wavelength high-reflection layer; the long-wavelength high-reflection layer includes the following components in parts by weight: 100 parts of matrix resin, 5-30 parts of modified resin and 1-10 parts of auxiliary agent; the modified resin is mainly made of matrix resin, high-reflection black masterbatch, coupling agent and tackifying resin; the high-reflection black masterbatch is mainly made of modified black pigment, high-gloss reflection pigment And the anti-reverse single system is obtained. The high-reflection black adhesive film of the present invention can achieve high reflectivity while maintaining the black appearance, and the operating temperature of the prepared black component is higher than that of the ordinary black component, which can achieve a great reduction in temperature, and can increase the power of the component by about 5% to 7.5%. .
Description
Technical Field
The invention relates to the technical field of packaging adhesive films, in particular to a high-reflection black adhesive film and a preparation method and application thereof.
Background
With the rapid development of photovoltaic power generation technology and application, Building Integrated Photovoltaics (BIPV) has a wide development prospect as a combination point of a building market and a photovoltaic market. The combination of photovoltaic and building is one of the most important fields in future photovoltaic application, and has huge market potential.
Building photovoltaics have certain requirements on the appearance of the module, which makes the black module a very beneficial development in the field of BIPV. At present, black assemblies on the market are basically realized by adopting black frames and black back plates, but for attractiveness, the double-glass assembly which is completely black in appearance is realized through a black film, and the requirement of BIPV is met. However, compared with a conventional transparent component or a ceramic white component, the black component packaged by the black adhesive film has the problems of low initial power, high operating temperature and short service life. The black color has strong absorption to all-band light, and the absorption of near infrared light of 760-1200 nm available for the cell directly causes the temperature of the assembly to rise by more than 5 ℃, so that the generating efficiency of the cell is reduced, and the power is lower than that of a conventional transparent assembly or a ceramic white assembly.
Aiming at the problems of the black assembly, in the prior art, the heat-conducting filler is added into the adhesive film to realize the heat-radiating effect, but the heat-conducting filler such as titanium dioxide or silicon dioxide is less in addition, the heat-radiating effect cannot be achieved, and the appearance is influenced by whitening of the black film due to more addition; the black high-reflectivity back plate is used for realizing light reflection of an infrared band, but a layer of ultraviolet high-cut-off adhesive film is arranged between the back plate and the battery piece, so that certain loss exists in reflected light, and meanwhile, the heat dissipation and the attractiveness of the black back plate are poorer than those of a double-glass black assembly; the infrared region reflection filler is directly added into the black film to realize the reflection of the near infrared region, so that light of 700-1200 nm is reflected to the cell, the heat absorption is inhibited, and the power is improved, but the reflection efficiency is limited due to the defects of modification and single-layer structure of the directly added reflection filler, the reflectivity of the near infrared light can only reach below 50 percent, and the reflectivity of the near infrared light is far less than 70 percent of that of the ceramic white film in the region.
In view of the above, the present invention is particularly proposed.
Disclosure of Invention
The first objective of the present invention is to provide a highly reflective black adhesive film to solve the technical problems of low reflectivity of the black packaging adhesive film, high operating temperature of the corresponding components, low power, etc. in the prior art.
The second objective of the present invention is to provide a method for preparing a highly reflective black glue film.
The third purpose of the invention is to provide the application of the high-reflection black adhesive film in photovoltaic modules and decorative glass.
In order to achieve the above purpose of the present invention, the following technical solutions are adopted:
the high-reflection black glue film comprises a long-wave band high-reflection layer and a full-wave band high-reflection layer;
the long-wave-band high-reflection layer comprises the following components in parts by weight: 100 parts of matrix resin, 5-30 parts of modified resin and 1-10 parts of auxiliary agent;
the modified resin is mainly prepared from a matrix resin, high black-reflecting color master batches, a coupling agent and a tackifying resin in a mass ratio of 100: 1-16: 1-6.5: 0.5-6.5;
the high-reflection black master batch is mainly prepared from a modified black pigment, a high-light-reflection pigment and a reflection increasing monomer in a mass ratio of 100: 80-120: 1-5.
In a specific embodiment of the present invention, the high light reflection pigment includes any one or more of anthraquinone, phthalocyanine, indigo, thioindigo, quinacridone, perylene, dioxazine, isoindoline, indolinone ring and azomethine type pigments.
In a specific embodiment of the invention, the anti-reflective monomer comprises any one or more of o-phenylphenoxyethyl acrylate, 2- (p-cumyl-phenoxy) -ethyl acrylate, benzyl methacrylate, ethoxylated bisphenol a (2EO) diacrylate, ethoxylated bisphenol a (3EO) diacrylate, ethoxylated bisphenol a (4EO) diacrylate and ethoxylated bisphenol a (2EO) dimethacrylate.
In a specific embodiment of the invention, the modified black pigment is mainly prepared from the black pigment, the nano-oxide and the coupling agent in a mass ratio of 100: 20-40: 1-5.
In a specific embodiment of the present invention, the black pigment comprises any one or more of black iron oxide, black iron chromium, black copper chromium, black cobalt, antimony sulfide, black manganese iron, black manganese chromium nickel and black titanium iron.
In a specific embodiment of the present invention, the nano-oxide comprises any one or more of nano-zinc oxide, nano-silicon oxide and nano-aluminum oxide.
In a specific embodiment of the invention, the full-waveband high-reflectivity layer comprises the following components in parts by weight: 100 parts of matrix resin, 5-30 parts of high-reflection modified resin and 1-10 parts of auxiliary agent;
the high-reflection modified resin is mainly prepared from a matrix resin, a high-reflection white pigment, a coupling agent and a tackifying resin in a mass ratio of 100: 50-150: 1.6.5: 0.5-6.5.
In a particular embodiment of the invention, the high reverse white pigment comprises any one or more of titanium dioxide, silica, zinc oxide, precipitated barium sulfate, talc, kaolin, quartz powder and mica.
In a specific embodiment of the present invention, the black adhesive film has a three-layer structure or a two-layer structure. When the structure is a three-layer structure, the structure comprises a full-wave-band high-reflection layer, a first long-wave-band high-reflection layer and a second long-wave-band high-reflection layer, wherein the first long-wave-band high-reflection layer and the second long-wave-band high-reflection layer are respectively attached to two sides of the full-wave-band high-reflection layer, namely the first long-wave-band high-reflection layer, the full-wave-band high-reflection layer and the second long-wave-band high-reflection layer are attached to each other; when the structure is a double-layer structure, the full-wave band high-reflection layer and the long-wave band high-reflection layer are arranged in a fit mode.
In a specific embodiment of the invention, the thickness of the high-reflection black adhesive film is 0.3-1.5 mm. Further, the thickness of the full-wave-band high-reflection layer accounts for 20% -40% of the thickness of the high-reflection black adhesive film.
The invention also provides a preparation method of the high-reflection black adhesive film, which comprises the following steps:
and carrying out multi-layer co-extrusion on the molten material of the components of the long-wave band high-reflection layer and the molten material of the components of the full-wave band high-reflection layer, then laminating, cooling to form a film, and then carrying out irradiation pre-crosslinking treatment.
The invention also provides an application of any one of the high-reflection black adhesive films in preparation of photovoltaic modules or decorative glass.
Compared with the prior art, the invention has the beneficial effects that:
(1) according to the invention, the high-reflection black master batch is introduced, and a long-wave band high-reflection layer and full-wave band high-reflection layer composite structure is adopted, so that the effects of low reflectivity of the black adhesive film in a visible light band and high reflectivity in an infrared light band are realized; on one hand, the modified black pigment which is coated by the composite nano oxide and is subjected to surface modification treatment by the silane coupling agent is introduced to be matched with the high light reflection pigment for reflection increasing modification, so that the form change of the surface of the high reflection black master batch is realized; on the other hand, the high reflectivity of the black adhesive film with the reflectivity exceeding 68% in the range of 700-1200 nm is realized through the synergistic gain of the multilayer structure;
(2) the black assembly packaged by the adhesive film can simultaneously meet the requirements of overall black appearance, high reflection gain power and good heat dissipation effect, and effectively solves the problems of power loss risk and poor heat dissipation caused by the conventional assembly packaged by the black adhesive film;
(3) compared with the common black component, the black component prepared by the high-reflection black packaging adhesive film can be cooled by 10-15 ℃ at the operating temperature, the CTM of the photovoltaic component is improved, the power of the component is further improved, and the actual power is improved by about 5% -7.5%.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following detailed description, but those skilled in the art will understand that the following described examples are some, not all, of the examples of the present invention, and are only used for illustrating the present invention, and should not be construed as limiting the scope of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
The high-reflection black glue film comprises a long-wave band high-reflection layer and a full-wave band high-reflection layer;
the long-wave-band high-reflection layer comprises the following components in parts by weight: 100 parts of matrix resin, 5-30 parts of modified resin and 1-10 parts of auxiliary agent;
the modified resin is mainly prepared from a matrix resin, high black-reflecting color master batches, a coupling agent and a tackifying resin in a mass ratio of 100: 1-16: 1-6.5: 0.5-6.5;
the high-reflection black master batch is mainly prepared from a modified black pigment, a high-light-reflection pigment and a reflection increasing monomer in a mass ratio of 100: 80-120: 1-5.
As in the different embodiments, the amount of the modified resin may be 5 parts, 10 parts, 15 parts, 20 parts, 25 parts, 30 parts, etc. compared to 100 parts by weight of the base resin in the long wavelength band high reflection layer; the amount of the auxiliary may be 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, etc.
In a specific embodiment of the invention, the auxiliary comprises the following components in parts by weight: 0.4-2 parts of a cross-linking agent, 0.3-2 parts of an auxiliary cross-linking agent, 0.1-2 parts of a coupling agent, 0.1-2 parts of a light stabilizer and 0.1-2 parts of an antioxidant.
The auxiliary agent can adopt the conventional auxiliary agent in the field, and specifically can be as follows:
the crosslinking agent can be selected from at least one of peroxide crosslinking agents; the peroxide crosslinking agent comprises tert-butyl hydroperoxide, 1-di-tert-butyl peroxy-3, 3, 5-trimethylcyclohexane, tert-amyl peroxy-2-ethylhexyl carbonate, 2-ethylhexyl tert-butyl peroxycarbonate, 1-di-tert-butyl peroxycyclohexane, tert-butyl peroxy-2-ethylhexanoate, isopropyl tert-butyl peroxycarbonate and 1, 1-di-tert-amyl peroxy-3, 3, 5-trimethylcyclohexane;
the auxiliary crosslinking agent comprises any one or more of triallyl isocyanurate, triallyl cyanurate and trimethylolpropane triacrylate;
the coupling agent may be selected from silane coupling agents; the silane coupling agent comprises any one or more of vinyl trimethoxy silane, gamma-methacryloxypropyl trimethoxy silane, vinyl triethoxy silane, methacrylate silane and gamma-aminopropyl triethoxy silane;
the light stabilizer may be selected from hindered amine light stabilizers; the hindered amine light stabilizer is any one or more of 3, 5-di-tert-butyl-4-hydroxy-benzoic acid hexadecyl ester, sebacic acid bis-2, 2,6, 6-tetramethylpiperidyl alcohol ester, N' -bis (2,2,6, 6-tetramethyl-4-piperidyl) -1, 6-hexanediamine and tris (1,2,2,6, 6-pentamethyl-4-piperidyl) phosphite;
the antioxidant comprises any one or more of tris [2, 4-di-tert-butylphenyl ] phosphite, n-octadecyl beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate and pentaerythritol tetrakis [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ].
As in the different embodiments, the high contrast black masterbatch may be used in an amount of 1 wt%, 5 wt%, 8 wt%, 10 wt%, 12 wt%, 15 wt%, 16 wt%, etc. of the amount of the base resin in the modified resin; the coupling agent may be used in an amount of 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, 6 wt%, 6.5 wt%, etc. of the amount of the base resin; the tackifying resin may be used in an amount of 0.5 wt%, 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, 6 wt%, 6.5 wt%, etc. of the amount of the base resin.
As in the different embodiments, the amount of the high light reflection pigment in the high anti-black color masterbatch may be 80 wt%, 90 wt%, 100 wt%, 110 wt%, 120 wt%, etc. of the amount of the modified black pigment; the amount of the reflection-enhancing monomer may be 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, etc. of the amount of the modified black pigment.
In a specific embodiment of the present invention, the high light reflection pigment includes any one or more of anthraquinone, phthalocyanine, indigo, thioindigo, quinacridone, perylene, dioxazine, isoindoline, indolinone ring and azomethine type pigments.
In a specific embodiment of the invention, the anti-reflective monomer comprises any one or more of o-phenylphenoxyethyl acrylate, 2- (p-cumyl-phenoxy) -ethyl acrylate, benzyl methacrylate, ethoxylated bisphenol a (2EO) diacrylate, ethoxylated bisphenol a (3EO) diacrylate, ethoxylated bisphenol a (4EO) diacrylate and ethoxylated bisphenol a (2EO) dimethacrylate.
In a specific embodiment of the invention, the modified black pigment is mainly prepared from the black pigment, the nano-oxide and the coupling agent in a mass ratio of 100: 20-40: 1-5.
As in the different embodiments, the nano-oxide may be used in an amount of 20 wt%, 25 wt%, 30 wt%, 35 wt%, 40 wt%, etc. of the amount of the black pigment in the modified black pigment; the coupling agent may be used in an amount of 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, etc. of the black pigment.
In the research, the black adhesive film with the single-layer structure directly added with the high-light-reflection pigment has a low reflectivity of 700-1200 nm, so that the assembly prepared from the black adhesive film with the single-layer structure has poor power improvement effect and poor effect of inhibiting heat absorption of the black assembly.
In order to realize the high-reflectivity effect of the black adhesive film on a near infrared region, on one hand, the high-reflectivity black master batch is prepared by introducing the black pigment coated by the nano oxide and modified on the surface of the silane and matching with the high-reflectivity pigment for reflection enhancement modification, so that the synergistic gain of the modified black pigment and the high-reflectivity pigment is realized; on the other hand, through the structural form of the multilayer composite packaging adhesive film, the reflectivity of 700-1200 nm is greatly improved finally, the light utilization rate of the wave band is improved, the power of the assembly is improved, and meanwhile, the operation temperature of the assembly is further reduced.
In a specific embodiment of the present invention, the black pigment comprises any one or more of black iron oxide, black iron chromium, black copper chromium, black cobalt, antimony sulfide, black manganese iron, black manganese chromium nickel and black titanium iron.
In a specific embodiment of the present invention, the nano-oxide comprises any one or more of nano-zinc oxide, nano-silicon oxide and nano-aluminum oxide.
In a specific embodiment of the invention, the full-waveband high-reflectivity layer comprises the following components in parts by weight: 100 parts of matrix resin, 5-30 parts of high-reflection modified resin and 1-10 parts of auxiliary agent;
the high-reflection modified resin is mainly prepared from a matrix resin, a high-reflection white pigment, a coupling agent and a tackifying resin in a mass ratio of 100: 50-150: 1.6.5: 0.5-6.5.
As in the different embodiments, the amount of the high-reflection modified resin may be 5 parts, 10 parts, 15 parts, 20 parts, 25 parts, 30 parts, etc. compared to 100 parts by weight of the base resin in the full-wavelength high-reflection layer; the amount of the auxiliary may be 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, etc.
The type and the dosage of the auxiliary agent of the full-wave band high-reflectivity layer can be the same as those of the auxiliary agent of the long-wave band high-reflectivity layer.
As in the different embodiments, the high reverse white pigment may be used in an amount of 50 wt%, 60 wt%, 70 wt%, 80 wt%, 90 wt%, 100 wt%, 110 wt%, 120 wt%, 130 wt%, 140 wt%, 150 wt%, etc. of the amount of the base resin in the high reverse modified resin; the coupling agent is used in an amount of 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, 6 wt%, 6.5 wt%, etc. of the base resin; the tackifying resin may be used in an amount of 0.5 wt%, 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, 6 wt%, 6.5 wt%, etc. of the amount of the base resin.
In a particular embodiment of the invention, the high reverse white pigment comprises any one or more of titanium dioxide, silica, zinc oxide, precipitated barium sulfate, talc, kaolin, quartz powder and mica.
In a specific embodiment of the present invention, the long wavelength band high reflection layer, the modified resin, the full wavelength band high reflection layer, and the matrix resin in the high reflection modified resin are each independently selected from any one or more of ethylene-vinyl acetate copolymer, ethylene-octene copolymer, ethylene-butene copolymer, low density polyethylene, linear low density polyethylene, ethylene-propylene copolymer, ethylene-hexene copolymer, ethylene propylene rubber, ethylene propylene diene rubber, styrene block copolymer, polymethyl methacrylate, and acrylic resin. Further, the melt index of the matrix resin is 5-30 g/10 min.
The matrix resin is conventionally adopted in the field of packaging adhesive films, and can be adjusted and selected according to actual requirements. In a preferred embodiment, the matrix resin is any one of an ethylene-vinyl acetate copolymer, an ethylene-octene copolymer, and an ethylene-butene copolymer.
In actual operation, the matrix resin in the long-wave band high-reflection layer, the modified resin, the full-wave band high-reflection layer and the high-reflection modified resin can be the same, so that the compatibility and the like of all components among the adhesive films are further ensured.
In a specific embodiment of the present invention, the coupling agents in the modified resin, the modified black pigment, and the high-reverse modified resin are each independently selected from any one or more of silane coupling agents. Further, the silane coupling agent includes vinyltrimethoxysilane, gamma-methacryloxypropyltrimethoxysilane, vinyltriethoxysilane, methacrylate silane, and gamma-aminopropyltriethoxysilane.
In a specific embodiment of the present invention, the tackifying resins in the modified resin and the high-reflection modified resin are each independently at least one selected from acrylic tackifying resins. Further, the acrylate tackifying resin comprises epoxy acrylate and amino acrylate.
In a specific embodiment of the present invention, the method for preparing the modified resin comprises: and (3) performing melt extrusion granulation on the mixture of the matrix resin, the high black masterbatch, the coupling agent and the tackifying resin. Further, the temperature of the melt extrusion is 100-200 ℃.
In practical practice, the preparation of the modified resin comprises: the melt extrusion was carried out in a twin screw extruder. Furthermore, the temperature of each zone of the double-screw extruder can be set to be 100-120 ℃ in the I zone, 110-130 ℃ in the II zone, 130-150 ℃ in the III zone, 135-160 ℃ in the IV zone, 140-190 ℃ in the V zone, 140-200 ℃ in the VI zone and 130-190 ℃ in the nose.
In a specific embodiment of the present invention, the method for preparing the high-reflection modified resin comprises: and (3) performing melt extrusion granulation on the mixture of the matrix resin, the high-reverse white pigment, the coupling agent and the tackifying resin. Further, the temperature of the melt extrusion is 100-200 ℃.
In practical operation, the preparation of the high-reflection modified resin comprises the following steps: the melt extrusion was carried out in a twin screw extruder. Furthermore, the temperature of each zone of the double-screw extruder can be set to be 100-120 ℃ in the I zone, 110-130 ℃ in the II zone, 130-150 ℃ in the III zone, 135-160 ℃ in the IV zone, 140-190 ℃ in the V zone, 140-200 ℃ in the VI zone and 130-190 ℃ in the nose.
In a specific embodiment of the present invention, the preparation method of the high black masterbatch comprises: and (3) performing melt extrusion granulation on the mixture of the modified black pigment, the high light reflection pigment and the reflection-increasing monomer. Further, the temperature of the melt extrusion is 110-160 ℃.
In practical operation, the preparation of the high black masterbatch comprises the following steps: the melt extrusion was carried out in a twin screw extruder. Furthermore, the temperature of each zone of the double-screw extruder can be set to be 140-145 ℃ in the I zone, 145-150 ℃ in the II zone, 150-155 ℃ in the III zone, 155-160 ℃ in the IV zone, 155-160 ℃ in the V zone, 155-160 ℃ in the VI zone and 155-160 ℃ in the nose.
In a specific embodiment of the present invention, the method for preparing the modified black pigment comprises: and (3) performing melt extrusion granulation on the mixture of the black pigment, the nano oxide and the coupling agent. Further, the temperature of the melt extrusion is 200-230 ℃.
In practice, the preparation of the modified black pigment comprises: the melt extrusion was carried out in a twin screw extruder. Further, the temperatures of the zones of the twin-screw extruder can be set as follows: 200-205 ℃ in the I area, 205-210 ℃ in the II area, 210-215 ℃ in the III area, 215-220 ℃ in the IV area, 220-225 ℃ in the V area, 220-230 ℃ in the VI area and 220-225 ℃ in the nose.
In a specific embodiment of the present invention, the black adhesive film has a three-layer structure or a two-layer structure. When the three-layer structure is adopted, the three-layer structure comprises a full-wave-band high-reflection layer, a first long-wave-band high-reflection layer and a second long-wave-band high-reflection layer, wherein the first long-wave-band high-reflection layer and the second long-wave-band high-reflection layer are respectively attached to two sides of the full-wave-band high-reflection layer, namely the first long-wave-band high-reflection layer, the full-wave-band high-reflection layer and the second long-wave-band high-reflection layer are attached to each other, and the thicknesses of the first long-wave-band high-reflection layer and the second long-wave-band high-reflection layer are the same; when the structure is a double-layer structure, the full-wave band high-reflection layer and the long-wave band high-reflection layer are arranged in a fit mode.
The black assembly prepared by the high-reflection black adhesive film with the double-layer structure can realize full black on the front side and full white on the back side, and the single glass assembly can be prepared optionally; the black assembly prepared by the three-layer structure high-reflection black packaging adhesive film can realize a positive and negative full-black appearance, and the prepared double-glass assembly is attractive in appearance.
In a specific embodiment of the invention, the thickness of the high-reflection black adhesive film is 0.3-1.5 mm. Further, the thickness of the full-wave band high-reflection layer accounts for 20% -40% of the thickness of the high-reflection black adhesive film, and for example, the thickness of the full-wave band high-reflection layer can be 0.06-0.6 mm, preferably 0.1-0.5 mm, and more preferably 0.2-0.4 mm.
The invention also provides a preparation method of the high-reflection black adhesive film, which comprises the following steps:
and carrying out multi-layer co-extrusion on the molten material of the components of the long-wave band high-reflection layer and the molten material of the components of the full-wave band high-reflection layer, then laminating, cooling to form a film, and then carrying out irradiation pre-crosslinking treatment.
In actual operation, the melting temperature of the components of the long-wave band high-reflection layer is 55-100 ℃; the melting temperature of the components of the full-wave-band high-reflection layer is 60-110 ℃.
Further, melting the components of the long-wave-band high-reflection layer by adopting a single-screw extruder; the temperature settings of the zones of the single screw extruder can be as follows: 55-80 ℃ in the I area, 60-85 ℃ in the II area, 70-90 ℃ in the III area, 75-95 ℃ in the IV area, 75-100 ℃ in the V area, 80-100 ℃ in the VI area and 100 ℃ in the handpiece; melting the components of the full-waveband high-reflection layer by adopting a single-screw extruder; the temperature settings of the zones of the single screw extruder can be as follows: the temperature of the I zone is 60-80 ℃, the temperature of the II zone is 65-85 ℃, the temperature of the III zone is 70-95 ℃, the temperature of the IV zone is 85-105 ℃, the temperature of the V zone is 90-110 ℃, the temperature of the VI zone is 95-110 ℃ and the temperature of the handpiece is 110 ℃.
In a specific embodiment of the present invention, the irradiation pre-crosslinking treatment is electron beam irradiation. Furthermore, the crosslinking degree of the pre-crosslinking treatment is 15-40%, namely, the irradiation pre-crosslinking treatment is carried out to ensure that the crosslinking degree reaches 15-40%.
In a specific embodiment of the present invention, the irradiation pre-crosslinking treatment is a one-sided irradiation pre-crosslinking treatment. Furthermore, the irradiation surface is a long-wave band high-reflection layer. Specifically, for a three-layer structure, the irradiation surface is a long-wave-band high-reflection layer with a shallow pattern surface; for a double-layer structure, the irradiation surface is a long-wave-band high-reflection layer with a shallow pattern surface.
The invention also provides an application of any one of the high-reflection black adhesive films in preparation of photovoltaic modules or decorative glass.
The high-reflection black adhesive film can be widely applied to the fields of BIPV building integration, roof components, power station components, architectural decoration glass and the like.
In particular embodiments of the invention, the photovoltaic module comprises a building photovoltaic module.
In a specific embodiment of the invention, the photovoltaic module comprises a single glass module or a dual glass module.
In a specific embodiment of the invention, the photovoltaic module comprises glass, a transparent packaging adhesive film, a battery piece, a high-reflection black adhesive film and a glass/back plate which are sequentially attached; and the long-wave-band high-reflection layer of the high-reflection black adhesive film is attached to the back surface of the battery piece.
The cell slice comprises a crystalline silicon or amorphous silicon cell slice.
In a specific embodiment of the invention, the decorative glass comprises two layers of glass, and the high-reflection black glue film is arranged between the two layers of glass.
In practical operation, the photovoltaic module and the device glass can be prepared by laminating through a vacuum laminating machine at the temperature of 140-150 ℃.
Specific information of the matrix resin used in the following examples is as follows, but not limited thereto:
ethylene-vinyl acetate copolymer, MI 25g/10min (2.16kg, 190 ℃);
ethylene-1-octene copolymer, MI ═ 10g/10min (2.16kg, 190 ℃).
Example 1
The embodiment provides a high-reflection black adhesive film and a preparation method thereof, wherein the preparation method comprises the following steps:
(1) preparing a modified black pigment: weighing the iron oxide black, the nano zinc oxide, the nano aluminum oxide and the gamma-methacryloxypropyl trimethoxy silane according to the mass ratio of 100: 15: 4, uniformly mixing in a high-speed mixer, then putting the obtained materials into a double-screw extruder for melt extrusion, and granulating and drying to obtain the modified black pigment. Wherein the temperature of each zone of the double-screw extruder is set as follows: 200-205 ℃ in the I area, 205-210 ℃ in the II area, 210-215 ℃ in the III area, 215-220 ℃ in the IV area, 220-225 ℃ in the V area, 220-230 ℃ in the VI area and 220-225 ℃ in the nose.
(2) Preparing a high black color master batch: weighing the modified black pigment in the step (1), 3 ' -dioxo-2, 2 ' -biindolyl-5, 5 ' -disulfonic acid disodium salt and o-phenylphenoxyethyl acrylate according to the mass ratio of 100: 5, uniformly mixing in a high-speed mixer, then putting the obtained materials into a double-screw extruder for melt extrusion, and granulating and drying to obtain the high-anti-black color master batch. Wherein the temperature of each zone of the double-screw extruder is set as follows: the temperature of the first zone is 100-105 ℃, the temperature of the second zone is 110-120 ℃, the temperature of the third zone is 130-140 ℃, the temperature of the fourth zone is 135-150 ℃, the temperature of the fourth zone is 140-160 ℃, the temperature of the sixth zone is 140-160 ℃ and the temperature of the machine head is 140-160 ℃.
(3) Preparing modified resin: and (3) weighing the ethylene-vinyl acetate copolymer, the high-black master batch obtained in the step (2), the gamma-methacryloxypropyltrimethoxysilane and the amino acrylate according to the mass ratio of 100: 16: 2: 3, uniformly mixing in a high-speed mixer, then putting the obtained materials into a double-screw extruder for melt extrusion, and granulating and drying to obtain the modified resin. Wherein the temperature of each zone of the double-screw extruder is set as follows: the temperature of the first zone is 100-105 ℃, the temperature of the second zone is 110-120 ℃, the temperature of the third zone is 130-140 ℃, the temperature of the fourth zone is 135-150 ℃, the temperature of the fourth zone is 140-160 ℃, the temperature of the sixth zone is 140-160 ℃ and the temperature of the machine head is 140-160 ℃.
(4) Preparing high-reflection modified resin: weighing the ethylene-vinyl acetate copolymer, the titanium dioxide, the gamma-methacryloxypropyltrimethoxysilane and the amino acrylate according to the mass ratio of 100: 3, uniformly mixing in a high-speed mixer, then putting the obtained materials into a double-screw extruder for melt extrusion, and granulating and drying to obtain the high-reverse modified resin. Wherein the temperature of each zone of the double-screw extruder is set as follows: the temperature of the first zone is 100-105 ℃, the temperature of the second zone is 110-120 ℃, the temperature of the third zone is 130-140 ℃, the temperature of the fourth zone is 135-150 ℃, the temperature of the fourth zone is 140-160 ℃, the temperature of the sixth zone is 140-160 ℃ and the temperature of the machine head is 140-160 ℃.
(5) Preparing a high-reflection black adhesive film with a three-layer structure: respectively putting raw material components of a long-wave band high-reflection layer and raw material components of a full-wave band high-reflection layer which are mixed in proportion into two single-screw extruders of a three-layer co-extrusion casting machine, respectively melting, conveying to a co-extrusion die head, distributing the melted materials of the long-wave band high-reflection layer to an upper layer and a lower layer by a distributor at the inlet of the die head, distributing the melted materials of the full-wave band high-reflection layer to a middle layer, conveying to the outlet of the same co-extrusion die head for converging, drawing by using an embossing roller (the temperature is 55-65 ℃), cooling by using a cooling roller (the temperature is 20-30 ℃), forming a film, and obtaining a film material with a three-layer structure, wherein the drawing ratio is 0.9-1.1; and then, carrying out single-side pre-crosslinking treatment on the film material by electron beam irradiation equipment (the irradiation surface is a long-wave-band high-reflection layer with a shallow pattern surface), and controlling the pre-crosslinking degree to be 20-30% to obtain the high-reflection black adhesive film. In the three-layer structure of the high-reflection black adhesive film, the thickness of the full-wave band high-reflection layer is 0.2mm, the thickness of the long-wave band high-reflection layers on the two sides is 0.2mm respectively, and the thickness of the high-reflection black adhesive film is 0.6 mm.
Wherein, the raw material components of the long-wave band high-reflection layer which are mixed according to the proportion comprise 100 parts of ethylene-vinyl acetate copolymer, 0.6 part of tert-butyl peroxydicarbonate-2-ethylhexyl ester, 0.6 part of triallyl isocyanurate, 0.5 part of gamma-methacryloxypropyl trimethoxy silane, 0.1 part of bis-2, 2,6, 6-tetramethyl piperidinol sebacate, 0.1 part of tris [2, 4-di-tert-butylphenyl ] phosphite and 10 parts of modified resin according to the parts by weight; the raw material components of the full-wave band high-reflection layer which are mixed according to the proportion comprise 100 parts of ethylene-vinyl acetate copolymer, 0.6 part of tert-butyl peroxydicarbonate-2-ethylhexyl ester, 0.6 part of triallyl isocyanurate, 0.5 part of gamma-methacryloxypropyl trimethoxy silane, 0.1 part of bis-2, 2,6, 6-tetramethyl piperidinol sebacate, 0.1 part of tri [2, 4-di-tert-butylphenyl ] phosphite and 15 parts of high-reflection modified resin according to the parts by weight.
The temperature of each zone of the single screw extruder into which the raw material components of the long-wave band high-reflection layer are mixed according to the proportion is set as follows: melting the material with the long-wave band high-reflection layer at 55-80 ℃ in the I area, 65-85 ℃ in the II area, 70-90 ℃ in the III area, 75-95 ℃ in the IV area, 75-100 ℃ in the V area, 80-100 ℃ in the VI area and 100 ℃ in the machine head; the temperature of each zone of the single screw extruder into which the raw material components of the full-waveband high-reflection layer mixed in proportion are fed is set as follows: and the temperature of the first zone is 60-80 ℃, the temperature of the second zone is 65-85 ℃, the temperature of the third zone is 70-95 ℃, the temperature of the fourth zone is 85-105 ℃, the temperature of the fifth zone is 90-110 ℃, the temperature of the sixth zone is 95-110 ℃ and the temperature of the head is 110 ℃ to obtain the melted material of the full-wave band high-reflection layer.
Example 2
This example refers to the highly reflective black glue film of example 1 and the preparation method thereof, and the difference is only that: in the step (5), the high-reflection black adhesive film has a different structure and a different co-extrusion method, and the high-reflection black adhesive film of the embodiment has a double-layer structure.
The preparation method of the high-reflection black glue film with the double-layer structure comprises the following steps: respectively putting raw material components of a long-wave band high-reflection layer and raw material components of a full-wave band high-reflection layer which are mixed in proportion into two single-screw extruders of a double-layer co-extrusion casting machine, respectively melting, conveying to a co-extrusion die head, distributing the melted materials of the long-wave band high-reflection layer to the upper layer by a distributor at the inlet of the die head, distributing the melted materials of the full-wave band high-reflection layer to the lower layer, conveying to the outlet of the same co-extrusion die head to converge, carrying out traction by using an embossing roller (the temperature is 55-65 ℃) and carrying out cooling film formation by using a cooling roller (the temperature is 20-30 ℃), wherein the draft ratio is 0.9-1.1, and preparing a film material with a double-layer structure; and then, carrying out single-side pre-crosslinking treatment on the film material by electron beam irradiation equipment (the irradiation surface is a long-wave-band high-reflection layer with a shallow pattern surface), and controlling the pre-crosslinking degree to be 20-30% to obtain the high-reflection black adhesive film. In the double-layer structure of the high-reflection black glue film, the thickness of the long-wave band high-reflection layer is 0.4mm, and the thickness of the full-wave band high-reflection layer is 0.2 mm.
Example 3
This example refers to the highly reflective black glue film of example 1 and the preparation method thereof, and the difference is only that: the matrix resin and the modified resin have different components.
In the long-wave band high-reflection layer, the modified resin, the full-wave band high-reflection layer and the high-reflection modified resin of the embodiment, the matrix resin ethylene-vinyl acetate copolymer is replaced by the ethylene-1-octene copolymer. The modified resin of this example had the following composition: ethylene-1-octene copolymer, high contrast black masterbatch, gamma-methacryloxypropyltrimethoxysilane and aminoacrylates in mass ratios 100: 8: 1.5: 2.
Example 4
This example refers to the highly reflective black glue film of example 1 and the preparation method thereof, and the difference is only that: the high-reflection modified resin has different components.
The high-reflection modified resin of the present example comprises the following components: ethylene vinyl acetate copolymer, titanium dioxide, vinyltrimethoxysilane and epoxy acrylate at a mass ratio of 100: 150: 4: 5.
Example 5
This embodiment provides encapsulation dual glass assembly: the high-reflection black adhesive film of the embodiment 1 is adopted to package the double-glass assembly according to the conventional process, during packaging, the long-wave-band high-reflection layer of the irradiation surface in the high-reflection black adhesive film is attached to the back surface of the battery piece, the long-wave-band high-reflection layer of the non-irradiation surface is attached to the back surface glass, the transparent packaging adhesive film is attached to the front surface of the battery piece, after lamination (lamination according to the sequence of front surface glass/transparent packaging adhesive film/battery piece/black adhesive film/back surface glass), the battery piece/black adhesive film/back surface glass is placed in a vacuum laminator, and lamination is carried out for 15min at 145 ℃. The glass of the packaged double-glass assembly is conventional photovoltaic glass, the cell is 60P-type PERC double-sided cells, and the transparent packaging adhesive film is a transparent EVA adhesive film (manufacturer: Lushan, model: EV1050G 2).
Example 6
This embodiment provides encapsulation single glass assembly: the high-reflection black adhesive film of the embodiment 2 is adopted to package the single-glass component according to the conventional process, during packaging, the long-wave band high-reflection layer of the high-reflection black adhesive film is attached to the back surface of the battery piece, the full-wave band high-reflection layer is attached to the back plate, the transparent packaging adhesive film is attached to the front surface of the battery piece, and the battery piece is stacked (stacked according to the sequence of front glass/transparent packaging adhesive film/battery piece/black adhesive film/back plate) and placed into a vacuum laminator to be laminated for 15min at 145 ℃. The glass of the packaged single-glass assembly is conventional photovoltaic glass, the back plate is a KPF type back plate, the cell pieces are 60P type PERC double-sided cell pieces, and the transparent packaging adhesive film is a transparent EVA adhesive film (manufacturer: Lushan, model: EV1050G 2).
Example 7
The present embodiment provides an encapsulated black decorative glass: the high-reflection black adhesive film of the embodiment 1 is adopted, the decorative glass is packaged according to the conventional process, and the glass/the high-reflection black adhesive film/the glass are overlapped in sequence and then placed into a vacuum laminating machine for laminating for 15min at 145 ℃. The encapsulated glass is conventional decorative glass.
Comparative example 1
Comparative example 1 the highly reflective black adhesive film of reference example 1 and the preparation method thereof were distinguished in that: the modified resin has different components.
The modified resin of comparative example 1 had the following composition: ethylene vinyl acetate copolymer, iron oxide black, gamma-methacryloxypropyltrimethoxysilane and aminoacrylates in mass ratios 100: 16: 2: 3.
Comparative example 2
Comparative example 2 referring to the highly reflective black glue film of example 1 and the preparation method thereof, the difference is that: the modified resin has different components.
The modified resin of comparative example 2 had the following composition: ethylene vinyl acetate copolymer, iron oxide black, disodium 3,3 ' -dioxo-2, 2 ' -biindolyl-5, 5 ' -disulfonate, gamma-methacryloxypropyltrimethoxysilane and aminoacrylate in mass ratios of 100: 8: 2: 3.
Comparative example 3
Comparative example 3 the highly reflective black adhesive film of reference example 1 and the preparation method thereof were distinguished in that: the high black contrast color master batch has different components and preparation methods.
The preparation method of the high black contrast color master batch of comparative example 3 comprises the following steps: weighing the iron oxide black, the 3,3 ' -dioxo-2, 2 ' -biindolyl-5, 5 ' -disulfonic acid disodium salt, the nano zinc oxide, the nano aluminum oxide, the gamma-methacryloxypropyltrimethoxysilane and the o-phenylphenoxyethyl acrylate according to the mass ratio of 100: 15: 4: 5, uniformly mixing in a high-speed mixer, and then putting the obtained materials into a double-screw extruder for melt extrusion, granulation and drying to obtain the high-contrast black master batch. The twin screw extruder temperature settings were the same as in example 1, step (2).
Comparative example 4
Comparative example 4 provides a glue film comprising only a long-wavelength band high-reflection layer having a thickness of 0.6mm, without a full-wavelength band high-reflection layer. The composition of the long wavelength band high reflection layer is the same as that of the long wavelength band high reflection layer in example 1.
Comparative example 5
An EVA Black encapsulating film (manufacturer: Lushan, model: EV1050G7) is commercially available.
Comparative example 6
A photovoltaic black backsheet (manufacturer: CYBRID, model: Cynagard 225A) is commercially available.
Comparative examples 7 to 11
Comparative examples 7-11 provide an encapsulated dual glass assembly, with reference to the method of example 5, except that: in comparative examples 7 to 11, the packaging films of comparative examples 1 to 5 were used to replace the high-reflective black adhesive film for packaging; among them, comparative examples 4 to 5 are single-layer films, and it is not necessary to distinguish between front and back surface packages.
Comparative example 12
Comparative example 12 provides an encapsulated single glass assembly, with reference to the method of example 6, except that: comparative example 12 the black back sheet of comparative example 6 was used for sealing, and the laminate was formed by laminating the front glass/transparent EVA film EV1050G 2/battery sheet/transparent EVA film EV1050G 1/black back sheet of comparative example 6 in this order. Both EV1050G2 and EV1050G1 are single-layer films, and front-back surface packaging is not required to be distinguished.
Experimental example 1
In order to comparatively illustrate the performance of the adhesive packaging films of the different examples and comparative examples of the present invention, the following performance tests were performed, and the test results are shown in tables 1 and 2.
And (3) reflectivity testing: respectively testing the reflectivities of 400-700 nm and 700-1200 nm by adopting an ultraviolet visible spectrophotometer lambda 950;
and (3) testing the temperature rise of the photovoltaic module, the power consumption of the module and the PID test of the module by adopting a conventional method of the photovoltaic module according to the standard IEC61215 and IEC 61730.
The preparation of samples corresponding to each detection item is as follows: the reflectivity test sample is a laminated single adhesive film (a release film/a single adhesive film/a release film are sequentially laminated, and lamination is carried out for 15min at 145 ℃; and the component temperature rise, power boost and PID attenuation test sample is a laminated component sample.
TABLE 1 test results for different adhesive films
Remarking: in the test result of the light reflectivity of 400-1200 nm in the embodiment 2, the front side corresponds to the reflectivity of the long-wave band high-reflectivity layer, and the back side corresponds to the reflectivity of the full-wave band high-reflectivity layer; the reflectivity test side of the remaining examples and comparative examples was the reflectivity of a pre-crosslinked layer.
TABLE 2 test results of different assemblies
From the test results, the high-reflection black adhesive film can keep pure black appearance and simultaneously realize the reflectivity of more than 68% in the 700-1200 nm wave band, and the black assembly prepared by the high-reflection black adhesive film can realize great temperature reduction compared with a common black assembly, so that the CTM of the photovoltaic assembly is improved, the power of the assembly is further improved, and the actual power is improved by about 5% -7.5%. Meanwhile, after PID (proportion integration differentiation) tests of the components, the components prepared by the high-reflection black glue film have better PID resistance, the attenuation of the power of the components is reduced, and the service life of the black components is greatly prolonged.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The high-reflection black glue film is characterized by comprising a long-wave band high-reflection layer and a full-wave band high-reflection layer;
the long-wave-band high-reflection layer comprises the following components in parts by weight: 100 parts of matrix resin, 5-30 parts of modified resin and 1-10 parts of auxiliary agent;
the modified resin is mainly prepared from a matrix resin, high black-reflecting color master batches, a coupling agent and a tackifying resin in a mass ratio of 100: 1-16: 1-6.5: 0.5-6.5;
the high-reflection black master batch is mainly prepared from a modified black pigment, a high-light-reflection pigment and a reflection increasing monomer in a mass ratio of 100: 80-120: 1-5.
2. The highly reflective black glue film according to claim 1, wherein the modified black pigment is mainly prepared from 100: 20-40: 1-5 by mass of the black pigment, the nano-oxide and the coupling agent;
preferably, the black pigment comprises any one or more of iron oxide black, iron chromium black, copper chromium black, cobalt black, antimony sulfide, manganese iron black, manganese chromium nickel black and titanium iron black;
preferably, the nano-oxide comprises any one or more of nano-zinc oxide, nano-silicon oxide and nano-aluminum oxide.
3. The highly reflective black glue film according to claim 2, wherein the modified black pigment is prepared by a method comprising: performing melt extrusion granulation on the mixture of the black pigment, the nano oxide and the coupling agent;
preferably, the temperature of the melt extrusion is 200-230 ℃.
4. The black adhesive film according to claim 1, wherein the high light reflection pigment comprises one or more of anthraquinone, phthalocyanine, indigo, thioindigo, quinacridone, perylene, dioxazine, isoindoline, indolinone ring and azomethine pigments;
the anti-reflection monomer comprises any one or more of o-phenylphenoxyethyl acrylate, 2- (p-cumyl-phenoxy) -ethyl acrylate, benzyl methacrylate, ethoxylated bisphenol A (2EO) diacrylate, ethoxylated bisphenol A (3EO) diacrylate, ethoxylated bisphenol A (4EO) diacrylate and ethoxylated bisphenol A (2EO) dimethacrylate;
preferably, the preparation method of the high black reflecting color master batch comprises the following steps: and performing melt extrusion granulation on the mixture of the modified black pigment, the high light reflection pigment and the reflection-increasing monomer.
5. The black adhesive film according to claim 1, wherein the full-waveband high-reflectivity layer comprises the following components in parts by weight: 100 parts of matrix resin, 5-30 parts of high-reflection modified resin and 1-10 parts of auxiliary agent;
the high-reflection modified resin is mainly prepared from a matrix resin, a high-reflection white pigment, a coupling agent and a tackifying resin in a mass ratio of 100: 50-150: 1-6.5: 0.5-6.5;
preferably, the high reverse white pigment includes any one or more of titanium dioxide, silicon dioxide, zinc oxide, precipitated barium sulfate, talc, kaolin, quartz powder and mica.
6. The highly reflective black glue film according to any one of claims 1 to 5, wherein the coupling agents in the modified resin, the modified black pigment and the highly reflective modified resin are each independently selected from any one or more of silane coupling agents; the tackifying resins in the modified resin and the high-reflection modified resin are respectively and independently selected from any one or more of acrylic ester tackifying resins;
preferably, the silane coupling agent includes vinyltrimethoxysilane, gamma-methacryloxypropyltrimethoxysilane, vinyltriethoxysilane, methacrylate silane and gamma-aminopropyltriethoxysilane;
preferably, the acrylate tackifying resin comprises epoxy acrylate and amino acrylate.
7. The highly reflective black glue film according to any one of claims 1 to 5, wherein the matrix resin of the long wavelength band high reflection layer, the modified resin, the full wavelength band high reflection layer and the high reflection modified resin is independently selected from any one or more of ethylene-vinyl acetate copolymer, ethylene-octene copolymer, ethylene-butene copolymer, low density polyethylene, linear low density polyethylene, ethylene-propylene copolymer, ethylene-hexene copolymer, ethylene propylene rubber, ethylene propylene diene rubber, styrene block copolymer, polymethyl methacrylate and acrylic resin;
preferably, the melt index of the matrix resin is 5-30 g/10 min.
8. The black adhesive film according to claim 1, wherein the black adhesive film has a three-layer structure or a two-layer structure;
preferably, when the black adhesive film is of a three-layer structure, the black adhesive film comprises a long-wave-band high-reflection layer, a full-wave-band high-reflection layer and a long-wave-band high-reflection layer which are attached to each other;
preferably, the thickness of the high-reflection black adhesive film is 0.3-1.5 mm;
preferably, the thickness of the full-wave-band high-reflection layer accounts for 20% -40% of the thickness of the high-reflection black adhesive film.
9. The method for preparing the highly reflective black glue film according to any one of claims 1 to 8, comprising the following steps:
after the multi-layer co-extrusion of the molten materials of the components of the long-wave band high-reflection layer and the molten materials of the components of the full-wave band high-reflection layer, pressing, cooling to form a film, and then carrying out irradiation pre-crosslinking treatment;
preferably, the melting temperature of the components of the long-wave band high-reflection layer is 55-100 ℃; the melting temperature of the components of the full-wave-band high-reflection layer is 60-110 ℃;
preferably, the degree of crosslinking of the pre-crosslinking treatment is 15% to 40%.
10. The use of the highly reflective black glue film of any one of claims 1 to 8 in the preparation of photovoltaic modules or decorative glass;
preferably, the photovoltaic module comprises any one of a single-glass module and a dual-glass module;
preferably, the photovoltaic module comprises a building photovoltaic module.
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| CN202110654682.8A Active CN113308206B (en) | 2021-06-11 | 2021-06-11 | High-reflection black adhesive film and preparation method and application thereof |
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| CN113943537A (en) * | 2021-10-26 | 2022-01-18 | 常州斯威克光伏新材料有限公司 | A kind of black high-reflection composite encapsulation film and preparation method thereof |
| CN113943536A (en) * | 2021-10-19 | 2022-01-18 | 常州斯威克光伏新材料有限公司 | Black infrared reflection type packaging adhesive film and preparation method thereof |
| CN114350268A (en) * | 2022-01-06 | 2022-04-15 | 苏州福斯特光伏材料有限公司 | Packaging adhesive film and photovoltaic module |
| CN114373819A (en) * | 2022-01-06 | 2022-04-19 | 苏州福斯特光伏材料有限公司 | Backplane and PV modules |
| CN115477875A (en) * | 2022-10-10 | 2022-12-16 | 江苏中来新材科技有限公司 | A kind of black radiation cooling functional coating and its production method, back plate and application |
| CN115572550A (en) * | 2022-12-07 | 2023-01-06 | 常州斯威克光伏新材料有限公司 | Black high-reliability composite packaging adhesive film and preparation method thereof |
| CN117238993A (en) * | 2023-09-12 | 2023-12-15 | 宁波勤邦新材料科技股份有限公司 | Novel high-reflection black backboard base film, preparation method and application thereof |
| WO2024260480A1 (en) * | 2023-06-21 | 2024-12-26 | 苏州赛伍应用技术股份有限公司 | Black high-reflectivity reflective strip and use thereof |
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| CN113943536A (en) * | 2021-10-19 | 2022-01-18 | 常州斯威克光伏新材料有限公司 | Black infrared reflection type packaging adhesive film and preparation method thereof |
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| CN115572550A (en) * | 2022-12-07 | 2023-01-06 | 常州斯威克光伏新材料有限公司 | Black high-reliability composite packaging adhesive film and preparation method thereof |
| WO2024260480A1 (en) * | 2023-06-21 | 2024-12-26 | 苏州赛伍应用技术股份有限公司 | Black high-reflectivity reflective strip and use thereof |
| CN117238993A (en) * | 2023-09-12 | 2023-12-15 | 宁波勤邦新材料科技股份有限公司 | Novel high-reflection black backboard base film, preparation method and application thereof |
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