CN113270460A - Display panel, preparation method thereof and display device - Google Patents
Display panel, preparation method thereof and display device Download PDFInfo
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- CN113270460A CN113270460A CN202110540686.3A CN202110540686A CN113270460A CN 113270460 A CN113270460 A CN 113270460A CN 202110540686 A CN202110540686 A CN 202110540686A CN 113270460 A CN113270460 A CN 113270460A
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- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
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Abstract
The disclosure provides a display panel, a preparation method thereof and a display device. The display panel comprises a conductive structure layer, wherein the conductive structure layer comprises a first insulating layer, a first conductive layer, a second insulating layer and a second conductive layer which are sequentially stacked, and the first conductive layer comprises a plurality of first conductive wires which are arranged at intervals; the second insulating layer comprises a plurality of insulating wires arranged at intervals, and the orthographic projection of each first conductive wire on the substrate base plate is positioned in the range of the orthographic projection of each insulating wire on the substrate base plate; the second conductive layer comprises a plurality of second conductive lines and a plurality of third conductive lines, the orthographic projection of each second conductive line on the substrate base plate is located in the range of the orthographic projection of each insulating line on the substrate base plate, each third conductive line is located in the area between every two adjacent insulating lines, and the insulating lines are configured to disconnect the adjacent third conductive lines and the second conductive lines from each other. According to the technical scheme, the number of the film layers is reduced, the mask frequency is reduced, and the cost is reduced.
Description
Technical Field
The disclosure relates to the technical field of display, and in particular relates to a display panel, a manufacturing method thereof and a display device.
Background
With the development of the full screen technology, the placement of cameras from the edge area is further developed to the camera under the screen. For the display panel of the under-screen camera, the resolution of the camera area is developed from the resolution lower than that of the display area to the same resolution as that of the conventional display area. As the resolution of the display area increases, higher demands are made on the design of the display panel.
Disclosure of Invention
The embodiment of the disclosure provides a display panel, a manufacturing method thereof and a display device, so as to solve or alleviate one or more technical problems in the prior art.
As a first aspect of the embodiments of the present disclosure, an embodiment of the present disclosure provides a display panel, including a substrate and a conductive structure layer disposed on the substrate, where the conductive structure layer includes:
a first insulating layer on one side of the substrate base plate;
the first conducting layer is positioned on one side, away from the substrate, of the first insulating layer and comprises a plurality of first conducting wires arranged at intervals;
the second insulating layer is positioned on one side, away from the substrate base plate, of the first conducting layer and comprises a plurality of insulating wires which are arranged at intervals, and the orthographic projection of each first conducting wire on the substrate base plate is positioned in the range of the orthographic projection of each insulating wire on the substrate base plate;
and the second conducting layer comprises a plurality of second conducting wires and a plurality of third conducting wires, each second conducting wire is positioned on one side, away from the substrate, of the second insulating layer, the orthographic projection of each second conducting wire on the substrate is positioned in the range of the orthographic projection of each insulating wire on the substrate, each third conducting wire is positioned in the area between every two adjacent insulating wires, each third conducting wire is positioned on one side, away from the substrate, of the first insulating layer, the insulating wires are configured to disconnect the adjacent third conducting wires and the second conducting wires from each other, the orthographic projection of the second conducting wires on the substrate is a first area, the orthographic projection of the third conducting wires adjacent to the second conducting wires on the substrate is a second area, and the width of the overlapped part of the first area and the second area is greater than or equal to 0.
In some possible implementations, the boundary of the first conductive line and the boundary of the insulating line have a receding distance therebetween, the receding distance ranging from 0.3 μm to 0.5 μm.
In some possible implementations, the thickness of the insulated wire ranges from 3500 angstroms to 4500 angstroms.
In some possible implementations, an angle between the sidewalls of the insulated wires and the base substrate of the substrate is less than or equal to 90 °.
In some possible implementations, the distance between adjacent insulated wires ranges from 1.5 μm to 2.5 μm.
In some possible implementations, a thickness of the first conductive line is greater than a thickness of the second conductive line, the thickness of the first conductive line ranging from 350 angstroms to 450 angstroms.
In some possible implementations, the width of the first conductive line ranges from 1.5 μm to 2.5 μm.
In some possible implementations, the display panel includes a display area, the display area includes a camera mounting area and a normal display area located outside the camera mounting area, the camera mounting area includes a plurality of first light emitting units located on one side of the substrate, the normal display area includes a driving circuit layer located on one side of the substrate and a plurality of second light emitting units, the display panel further includes a first driving circuit, and each first light emitting unit is connected to the first driving circuit through each conductive wire in the conductive structure layer.
In some possible implementations, the display panel further includes a frame area located at one side of the display area, and the first driving circuit is located in the frame area.
In some possible implementations, in the camera mounting region, the conductive structure layer is located between the substrate base plate and the first light emitting unit, and in the conventional display region, the conductive structure layer is located between the driving structure layer and the second light emitting unit.
As a second aspect of the embodiments of the present disclosure, embodiments of the present disclosure provide a method of manufacturing a display panel, including:
forming a first insulating layer on one side of a substrate;
sequentially forming a first conductive film and a second insulating film on one side of the first insulating layer, which is far away from the substrate base plate;
patterning the second insulating film to form a second insulating layer, wherein the second insulating layer comprises a plurality of insulating wires arranged at intervals;
etching the first conductive film by using the second insulating layer as a mask to form a first conductive layer, wherein the first conductive layer comprises a plurality of first conductive wires arranged at intervals, and the orthographic projection of each first conductive wire on the substrate is positioned in the orthographic projection range of each insulating wire on the substrate;
and forming a second conductive layer on one side of the second insulating layer, which is far away from the substrate base plate, wherein the second conductive layer comprises a plurality of second conductive lines and a plurality of third conductive lines, the orthographic projection of each second conductive line on the substrate base plate is positioned in the range of the orthographic projection of each insulating line on the substrate base plate, each third conductive line is positioned in the area between every two adjacent insulating lines, and the insulating lines are configured to disconnect the adjacent third conductive lines and the second conductive lines from each other.
In some possible implementations, an angle between a sidewall of the insulated wire and the substrate base is less than or equal to 90 °
In some possible implementations, the thickness of the insulated wire ranges from 3500 angstroms to 4500 angstroms.
In some possible implementations, etching the first conductive film includes: and etching the first conductive film by adopting a wet etching process so as to enable a preset retraction distance to be formed between the boundary of the first conductive wire and the boundary of the insulating wire, wherein the preset retraction distance ranges from 0.3 mu m to 0.5 mu m.
As a third aspect of the embodiments of the present disclosure, embodiments of the present disclosure provide a display device including the display panel in the embodiments of the present disclosure.
According to the technical scheme of the embodiment of the invention, the limitation that the conductive wires cannot be additionally arranged between two adjacent first conductive wires due to a patterning process is avoided, so that the first conductive wires, the second conductive wires and the third conductive wires are formed, only 4 film layers are needed, and compared with 6 film layers in the related art, the mask process frequency is reduced, the cost is reduced, and the production efficiency is improved.
The foregoing summary is provided for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present disclosure will be readily apparent by reference to the drawings and following detailed description.
Drawings
In the drawings, like reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily to scale. It is appreciated that these drawings depict only some embodiments in accordance with the disclosure and are not to be considered limiting of its scope.
Fig. 1 is a schematic diagram illustrating a display panel according to the related art after a first conductive layer is formed;
FIG. 2 is a schematic cross-sectional view illustrating a display panel according to an embodiment of the present disclosure;
FIG. 3 is a schematic plane structure diagram of a display panel according to an embodiment of the disclosure;
FIG. 4 is a schematic structural diagram illustrating a display panel after a photoresist layer is formed thereon according to an embodiment of the present disclosure;
FIG. 5 is a schematic diagram illustrating a structure of a display panel after photoresist lines are formed thereon according to an embodiment of the present disclosure;
FIG. 6 is a schematic structural diagram illustrating a second insulating layer formed according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a display panel according to an embodiment of the disclosure after a first conductive layer is formed.
Description of reference numerals:
10. a substrate base plate; 20. a conductive structure layer; 21. a first insulating layer; 22. a first conductive layer; 221. a first conductive line; 23. a second insulating layer; 231. an insulated wire; 24. a second conductive layer; 242. a second conductive line; 243. a third electrically conductive line; 25. a photoresist layer; 251. a photoresist line; 50. a display area; 51. a camera mounting area; 52. a regular display area; 521. a conductive line region; 60. a frame region; 61. and a driving circuit region.
Detailed Description
In the following, only certain exemplary embodiments are briefly described. As those skilled in the art can appreciate, the described embodiments can be modified in various different ways, without departing from the spirit or scope of the present disclosure. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.
In order to realize full-screen display, the light emitting units of the camera mounting area can be connected to the corresponding driving circuits through transparent conductive wires. In order to realize the same resolution of the camera mounting area and the conventional display area, at least three layers of transparent conductive wires are needed to connect all the light-emitting units in the camera mounting area with the corresponding driving circuits. Since an insulating layer is required to be disposed between two adjacent transparent conductive lines, three insulating layers are required to be simultaneously formed in order to form three transparent conductive lines, which requires 6 mask processes, resulting in an increase in cost.
Fig. 1 is a schematic diagram illustrating a display panel according to the related art after a first conductive layer is formed. As shown in fig. 1, the display panel may include a substrate base 10, a first insulating layer 21 on a side of the substrate base 10, and a first conductive layer 22 on a side of the first insulating layer 21 facing away from the substrate base 10. The first conductive layer 22 includes a plurality of first conductive lines 221 disposed at intervals. The adjacent two first conductive lines 221 have a predetermined distance d0 therebetween. The process of forming the first conductive layer 22 may include: after a first conductive film is formed on one side of the first insulating layer 21, which is far away from the substrate base plate 10, a photoresist is coated on the first conductive film, the photoresist is exposed and developed by adopting a mask, the photoresist at the 221 position of the first conductive line is reserved, the photoresist at other positions is removed, and the first conductive film is exposed; the exposed first conductive film is etched to form a plurality of first conductive lines 221 disposed at intervals. The process of forming the first conductive layer 22 may be referred to as a patterning process, and due to the limitation of the patterning process, at least a predetermined distance d0 is reserved between two adjacent first conductive lines 221, the predetermined distance d0 may range from 1.5 μm to 2.5 μm, for example, the predetermined distance d0 may be 2 μm, that is, in order to meet the requirements of the patterning process, no additional conductive line may be disposed between two adjacent first conductive lines 221. Thus, in order to form three layers of transparent conductive lines, 6 films and 6 mask processes are required, that is, a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer, a third insulating layer and a third conductive layer are sequentially stacked, which results in an increase in cost and a reduction in production efficiency.
Fig. 2 is a schematic cross-sectional structure diagram of a display panel according to an embodiment of the disclosure. As shown in fig. 2, the display panel includes a substrate 10 and a conductive structure layer 20, wherein the conductive structure layer 20 is located on one side of the substrate 10. Illustratively, the conductive structure layer 20 may be located on a side of the substrate base plate 10 facing the display side.
The conductive structure layer 20 may include a first insulating layer 21, a first conductive layer 22, a second insulating layer 23, and a second conductive layer 24. The first insulating layer 21 is located on one side of the substrate 10, the first conductive layer 22 is located on one side of the first insulating layer 21 facing away from the substrate 10, and the first conductive layer 22 may include a plurality of first conductive lines 221 arranged at intervals.
The second insulating layer 23 is located on a side of the first conductive layer 22 away from the substrate base plate 10, and the second insulating layer 23 includes a plurality of insulating lines 231 arranged at intervals. The distance between two adjacent insulated wires 231 is a preset distance d0, the preset distance d0 may range from 1.5 μm to 2.5 μm, and the preset distance d0 may be 2 μm, for example. The predetermined distance d0 is a dimension that the patterning process may limit, and it will be understood by those skilled in the art that the predetermined distance d0 may vary as the patterning process is improved. The insulated wires 231 correspond to the first conductive wires 221 one by one, and the orthographic projection of the first conductive wires 221 on the substrate 10 is within the range of the orthographic projection of the insulated wires 231 on the substrate 10. It is understood that the boundary of the first conductive line 221 and the boundary of the insulating line 231 refer to corresponding boundaries of the first conductive line 221 and the insulating line 231, for example, as shown in fig. 2, a left boundary of the first conductive line 221 and a left boundary of the second insulating layer 231, and a right boundary of the first conductive line 221 and a right boundary of the second insulating layer 231.
The second conductive layer 24 is located on a side of the second insulating layer 23 facing away from the substrate base plate 10, and the second conductive layer 24 includes a plurality of second conductive lines 242 and a plurality of third conductive lines 243. Each second conductive line 242 is located on a side of the second insulating layer 23 away from the substrate 10, each second conductive line 242 corresponds to each insulating line 231 one by one, and an orthographic projection of each second conductive line 242 on the substrate 10 is located within an orthographic projection range of each insulating line 231 on the substrate 10. Each third conductive line 243 is located in a region between every two adjacent insulating lines 231, each third conductive line 243 is located on a side of the first insulating layer 21 facing away from the substrate base 10, the insulating lines 231 are configured to disconnect the adjacent third conductive lines 243 from the second conductive lines 242, an orthographic projection of the second conductive lines 242 on the substrate base 10 is a first region, an orthographic projection of the third conductive lines 243 adjacent to the second conductive lines 242 on the substrate base 10 is a second region, and a width of an overlapping portion of the first region and the second region is greater than or equal to 0. Exemplarily, in the embodiment shown in fig. 2, the angle θ between the sidewall of the insulating line 231 and the substrate base plate 10 is equal to 90 °, and during the formation of the second conductive layer 24 by using the deposition process, the boundary of the first region and the second region may coincide (i.e., the width of the overlapping portion of the first region and the second region is equal to 0) or there is an overlapping portion of the first region and the second region (i.e., the width of the overlapping portion of the first region and the second region is greater than 0) due to the process reasons. Illustratively, the angle θ between the sidewall of the insulated wire 231 and the substrate base plate 10 is less than 90 °, and during the formation of the second conductive layer 24 by using the deposition process, the boundary of the first region and the second region may coincide (i.e., the width of the overlapping portion of the first region and the second region is equal to 0) or there is an overlapping portion of the first region and the second region (i.e., the width of the overlapping portion of the first region and the second region is greater than 0) due to the process. It is to be understood that "the width of the overlapping portion" is a dimension of the overlapping portion in a direction parallel to the extending direction of the second conductive line, and is a dimension in the width direction of the paper in fig. 2.
In the display panel of the embodiment of the disclosure, the first conductive lines 221 are located on the surface of the first insulating layer 21 on the side away from the substrate 10, and the third conductive lines 243 are located on the surface of the first insulating layer 21 on the side away from the substrate 10, so that the third conductive lines 243 are additionally arranged between two adjacent first conductive lines 221, and the limitation that the conductive lines cannot be additionally arranged between two adjacent first conductive lines 31 due to a patterning process is avoided. Therefore, in the display panel of the embodiment of the present disclosure, the first conductive line 221, the second conductive line 242, and the third conductive line 243 are formed, and only 4 film layers are required, so that the number of mask processes is reduced, the cost is reduced, and the production efficiency is improved.
Fig. 3 is a schematic plan view illustrating a display panel according to an embodiment of the disclosure. As shown in fig. 3, the display panel may include a display area 50, the display area 50 including a camera mounting area 51 and a normal display area 52, the normal display area 52 being an area of the display area 50 located outside the camera mounting area 51. The camera mounting area 51 includes a plurality of first light emitting units on the substrate base 10 side. The conventional display area 52 includes a driving circuit layer and a plurality of second light emitting cells on one side of the substrate base 10. The display panel may further include a first driving circuit, and each conductive line in the conductive structure layer 20 is configured to connect each first light emitting unit and the first driving circuit, that is, each first light emitting unit is connected to the first driving circuit through each conductive line in the conductive structure layer, so that the first driving circuit controls each first light emitting unit to emit light. Illustratively, the first conductive lines 221, the second conductive lines 242, and the third conductive lines 243 in the conductive structure layer 20 are connected to the first light emitting cells in a one-to-one correspondence, so that the first light emitting cells are connected to the first driving circuit through the first conductive lines 221, the second conductive lines 242, and the third conductive lines 243.
Such display panel is the comprehensive screen display panel of camera formula under the screen, through adopting the technical scheme of this disclosed embodiment, through set up conductive structure layer 20 in limited region, can set up more electric lead in limited region, can be connected to more first light-emitting units to first drive circuit to can set up more first light-emitting units in the camera installing zone, be favorable to realizing that the resolution ratio of camera installing zone is the same with the resolution ratio in conventional display area, improve display panel's display effect.
It is understood that the driving circuit layer may include a second driving circuit for driving the second light emitting cell. Illustratively, the first driving circuit may be located in the normal display area 52, and the driving circuit layer may include the first driving circuit. It is understood by those skilled in the art that in the conventional display area, the second light emitting cells are in one-to-one correspondence with the second driving circuits, and in the case where the first driving circuits are included in the driving circuit layer, the resolution of the conventional display area can be reduced, and thus, a part of the number of the second driving circuits can be used as the first driving circuits to drive the first light emitting cells. Those skilled in the art will understand that the specific circuit structures of the second driving circuit and the first driving circuit are conventional in the art, and the second driving circuit and the first driving circuit are not specifically limited herein.
In one embodiment, as shown in fig. 3, the display panel may further include a frame region 60 located at one side of the display region 50, and the frame region 60 may include a driving circuit region 61. The first driving circuit may be located in the frame region 60 and the first driving circuit may be located in the driving circuit region 61. The conductive structure layer 20 is located in a conductive line region 521, and the conductive line region 521 passes through the conventional display region 52 from the camera mounting region 51 to the driving circuit region 61, so that each conductive line in the conductive structure layer 20 is convenient for connecting each first light emitting unit with the first driving circuit. Illustratively, the camera mounting region 51 may be disposed close to the driving circuit region 61, so that the length of the conductive structure layer 20 may be reduced, and thus the length of each conductive line may be reduced, and the connection resistance may be reduced. By the arrangement mode, the first driving circuit does not influence the conventional display area and does not influence the resolution of the conventional display area. Illustratively, the resolution of the camera mounting region 51 is the same as that of the conventional display region 52, and may be 400PPI to 450 PPI.
In one embodiment, the second Light Emitting unit may be an Organic Light-Emitting Diode (OLED), and the first Light Emitting unit may be an OLED. It is understood that an OLED includes an anode, a cathode, and an organic light emitting layer between the anode and the cathode. Each of the first conductive lines 221, each of the second conductive lines 242, and each of the third conductive lines 243 in the conductive structure layer 20 are connected to the anode of each of the first light emitting cells in a one-to-one correspondence, so that the anode of each of the first light emitting cells is connected to the first driving circuit through each of the first conductive lines 221, each of the second conductive lines 242, and each of the third conductive lines 243.
In one embodiment, the first conductive layer 22 and the second conductive layer 24 are made of transparent conductive materials, so that the first conductive line 221, the second conductive line 242, and the third conductive line 243 are transparent conductive lines. The conductive wire can avoid the influence of the conductive wire on the display of the display panel, and meanwhile, when the camera shoots images, the influence on the shooting effect can be reduced. For example, the material of the first conductive layer 22 and the second conductive layer 24 may include at least one of indium tin oxide and indium zinc oxide.
In one embodiment, the conductive structure layer 20 may be located between the substrate base plate 10 and the first light emitting unit at the camera mounting region 51. In the conventional display area 52, the conductive structure layer 20 may be positioned between the driving circuit layer and the second light emitting unit. Therefore, the conductive structure layer 20 is located on one side of the first light emitting unit departing from the display side, and the conductive structure layer 20 is located on one side of the second light emitting unit departing from the display side, so that the conductive structure layer 20 does not affect the display effect of the display panel.
In one embodiment, as shown in fig. 2, the boundary of the first conductive line 221 and the boundary of the insulating line 231 have a retraction distance d1 therebetween, that is, the first conductive line 221 is retracted relative to the insulating line 231 by a retraction distance d1, d1 may range from 0.3 μm to 0.5 μm (inclusive), the retraction distance d1 may range from 0.3 μm to 0.5 μm, and the retraction distance d1 is set, so that not only the etching process requirement may be satisfied, but also the first conductive line 221 and the third conductive line 243 may be ensured to be disconnected from each other.
In one embodiment, as shown in fig. 2, the thicknesses of the second conductive line 242 and the third conductive line 243 may be the same, the thicknesses of the second conductive line 242 and the third conductive line 243 may range from 150 angstroms to 250 angstroms (inclusive), and the thicknesses of the second conductive line 242 and the third conductive line 243 may range from 150 angstroms to 250 angstroms, for example, the thicknesses of the second conductive line 242 and the third conductive line 243 may range from 200 angstroms.
In one embodiment, as shown in fig. 2, the thickness of the first conductive line 221 may be greater than the thickness of the second conductive line 242, the thickness of the first conductive line 221 may range from 350 angstroms to 450 angstroms (inclusive), and the thickness of the first conductive line 221 may be any value from 350 angstroms to 450 angstroms, for example, the thickness of the first conductive line 221 may be 400 angstroms. The width of the first conductive line 221 may range from 1.5 μm to 2.5 μm (inclusive), and illustratively, the width of the first conductive line 221 may be any value from 1.5 μm to 2.5 μm, for example, the width of the first conductive line 221 may be 2 μm. The first conductive line can have smaller resistance, can meet the requirements of patterning process and is beneficial to the formation of the first conductive line.
In one embodiment, as shown in fig. 2, the thickness of the insulated wire 231 may range from 3500 angstroms to 4500 angstroms (inclusive), and the thickness of the insulated wire 231 may be any value of 3500 angstroms to 4500 angstroms, for example, the thickness of the insulated wire 231 may be 4000 angstroms. Setting the thickness of the insulating line 231 in the range of 3500 angstroms to 4500 angstroms (inclusive) facilitates the insulating line 231 to separate the second conductive line 242 and the third conductive line 243 during the formation of the second conductive layer through the deposition process.
In one embodiment, as shown in fig. 2, the angle θ between the sidewalls of the insulated wires 231 and the substrate base plate 10 is less than or equal to 90 °. Thus, in the process of forming the second and third conductive lines 242 and 243, the sidewalls of the insulating line 231 may cut off the second and third conductive lines 242 and 243.
The embodiment of the present disclosure further provides a method for manufacturing a display panel, including:
forming a first insulating layer on one side of a substrate;
sequentially forming a first conductive film and a second insulating film on one side of the first insulating layer, which is far away from the substrate base plate;
patterning the second insulating film to form a second insulating layer, wherein the second insulating layer comprises a plurality of insulating wires arranged at intervals;
etching the first conductive film by using the second insulating layer as a mask to form a first conductive layer, wherein the first conductive layer comprises a plurality of first conductive wires arranged at intervals, and the orthographic projection of each first conductive wire on the substrate is positioned in the orthographic projection range of each insulating wire on the substrate;
and forming a second conductive layer on one side of the second insulating layer, which is far away from the substrate base plate, wherein the second conductive layer comprises a plurality of second conductive lines and a plurality of third conductive lines, the orthographic projection of each second conductive line on the substrate base plate is positioned in the range of the orthographic projection of each insulating line on the substrate base plate, each third conductive line is positioned in the area between every two adjacent insulating lines, and the insulating lines are configured to disconnect the adjacent third conductive lines and the second conductive lines from each other.
The technical solution of the embodiment of the present disclosure is further described below by the manufacturing process of the display panel in the embodiment of the present disclosure. It is to be understood that "patterning" as used herein includes processes of coating photoresist, mask exposure, development, etching, stripping photoresist, etc. when the material to be patterned is an inorganic material or a metal, and processes of mask exposure, development, etc. when the material to be patterned is an organic material, and evaporation, deposition, coating, etc. as used herein are well-known preparation processes in the related art.
The display panel may include a display area 50 and a bezel area 60 located at one side of the display area 50, the display area 50 including a camera mounting area 51 and a normal display area 52, the normal display area 52 being an area of the display area 50 other than the camera mounting area 51. The display panel may further include a bezel region 60 at one side of the display region 50, and the bezel region 60 may include a driving circuit region 61. The conductive structure layer 20 is located in a conductive line region 521, and the conductive line region 521 passes through the conventional display region 52 from the camera mounting region 51 to the driving circuit region 61. FIG. 4 is a schematic structural diagram illustrating a display panel after a photoresist layer is formed thereon according to an embodiment of the present disclosure; FIG. 5 is a schematic diagram illustrating a structure of a display panel after photoresist lines are formed thereon according to an embodiment of the present disclosure; FIG. 6 is a schematic structural diagram illustrating a second insulating layer formed according to an embodiment of the present disclosure; fig. 7 is a schematic structural diagram of a display panel according to an embodiment of the disclosure after a first conductive layer is formed. The preparation process of the display panel may include:
s11: a first insulating layer 21 is formed on one side of the base substrate 10, as shown in fig. 4, a material of the first insulating layer 21 may include a resin material, and the first insulating layer 21 may be a planarization layer. The first insulating layer 21 may be located at the conductive line region 521 as shown in fig. 4 and 3. The process of forming the first insulating layer 21 may include: a first insulating film is formed on one side of the base substrate 10, and the first insulating film is subjected to patterning processing to form the first insulating layer 21 in the conductive line region 521. Therefore, a mask process is required in the process of forming the first insulating layer 21.
S12: a first conductive film 22 'and a second insulating film 23' are sequentially formed on the side of the first insulating layer 21 facing away from the base substrate 10, as shown in fig. 4. The first conductive film 22 'may be made of a transparent conductive material, and the first conductive film 22' may include at least one of indium tin oxide and indium zinc oxide; the material of the second insulating film 23' may include at least one of silicon oxide and silicon nitride.
S13: the second insulating film 23' is patterned to form a second insulating layer 23, and the second insulating layer 23 includes a plurality of insulating lines 231 disposed at intervals. This step may include: coating a photoresist layer 25 on the side of the second insulating film 23' facing away from the base substrate 10, as shown in fig. 4; exposing and developing the photoresist layer 25 by using a mask, reserving the photoresist at the position of the insulating line 231, and removing the photoresist at other positions to form a photoresist line 251, as shown in fig. 5; the exposed second insulating film is etched by an etching process to form a second insulating layer 23 in the conductive line region 521, where the second insulating layer 23 includes a plurality of insulating lines 231 arranged at intervals, as shown in fig. 6. Wherein the thickness of the insulating line 231 may range from 3500 angstroms to 4500 angstroms (inclusive), and an angle θ between the sidewall of the insulating line 231 and the substrate base plate 10 is less than or equal to 90 °. As can be seen, a mask process is required to form the second insulating layer 23.
It is understood that the material of the second insulating film may be an organic material, such as a resin material, and the angle θ between the sidewall of the insulating line 231 and the base substrate 10 may be less than or equal to 90 ° by controlling the patterning process of the second insulating film. When the second insulating film is etched, a conventional dry etching process may be used, and by controlling the dry etching process, an angle θ between the sidewall of the insulating line 231 and the substrate base plate 10 may be obtained to be less than or equal to 90 °.
S14: the first conductive film 22' is etched using the second insulating layer 23 as a mask to form the first conductive layer 22. This step may include: the exposed first conductive film 22' is etched using a wet etching process using the second insulating layer 23 as a hard mask to form the first conductive layer 22 at the conductive line region 521, as shown in fig. 7. The first conductive layer 22 includes a plurality of first conductive lines 221 arranged at intervals, an orthographic projection of each first conductive line 221 on the substrate 10 is located in an orthographic projection range of each insulating line 231 on the substrate 10, and the first conductive lines 221 are retracted inward by a distance d1 relative to the insulating lines 231. It is understood that, during the etching of the first conductive film 22' by the wet etching process, the retraction distance d1 can be controlled by controlling the wet etching process, for example, the etching solution can be selected and the etching time can be controlled such that the retraction distance d1 is in the range of 0.3 μm to 0.5 μm (inclusive), and the retraction distance d1 can be any value in the range of 0.3 μm to 0.5 μm. The thickness of the first conductive line 221 may range from 350 angstroms to 450 angstroms (inclusive); the width of the first conductive lines 221 may range from 1.5 μm to 2.5 μm (inclusive).
S15: forming a second conductive layer 24 on a side of the second insulating layer 23 facing away from the base substrate 10, which may include: a second conductive film is deposited on the side of the second insulating layer 23 away from the substrate 10, and after patterning the second conductive film, a second conductive layer 24 located in the conductive line region 521 is formed, as shown in fig. 2. The second conductive layer 24 includes a plurality of second conductive lines 242 and a plurality of third conductive lines 243, an orthogonal projection of each second conductive line 242 on the substrate base plate 10 is located within an orthogonal projection range of each insulating line 231 on the substrate base plate 10, each third conductive line 243 is located in a region between every two adjacent insulating lines 231, as shown in fig. 2, so that the third conductive line 243 is located between two adjacent insulating lines 231, and the third conductive line 243 is located on a surface of the first insulating layer 21 on a side away from the substrate base plate 10. The insulating lines 231 are disposed such that the adjacent third conductive lines 243 and the second conductive lines 242 are disconnected from each other and the third conductive lines 243 and the adjacent first conductive lines 221 are disconnected from each other when the second conductive film is deposited. It is understood that, when the second conductive film is patterned, a mask process is required to form the second conductive layer 24 in the conductive line region 521.
Therefore, in the display panel according to the embodiment of the present disclosure, three mask processes are used to form the first conductive line 221, the second conductive line 242, and the third conductive line 243.
In the related art, in order to form the same number of conductive lines as that in fig. 2, a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer, a third insulating layer, and a third conductive layer need to be sequentially formed, where the first conductive layer includes a plurality of first conductive lines arranged at intervals, the second conductive layer includes a plurality of second conductive lines arranged at intervals, and the third conductive layer includes a plurality of third conductive lines arranged at intervals. This process requires 6 mask processes.
Compared with 6 mask processes in the related art, the preparation method of the display panel in the embodiment of the disclosure can form the first conductive line 221, the second conductive line 242, and the third conductive line 243 by only 3 mask processes, thereby greatly reducing the number of mask processes and the number of masks, reducing the cost, and improving the mass productivity.
In one embodiment, before step S11, the method for manufacturing a display panel may further include: a driver circuit layer located in the normal display area 52 and a first driver circuit located in the driver circuit area 61 in the frame area 60 are formed on the side of the base substrate 10 facing the first insulating layer 21. The driving circuit layer may include a second driving circuit. It is understood that the first driving circuit and the second driving circuit may be formed at the same time, the second driving circuit being located at the conventional display area 52 and the first driving circuit being located at the driving circuit area 61. The first insulating layer 21 is located on the side of the driver circuit layer and the first driver circuit facing away from the base substrate 10.
In one embodiment, after step S15, the method for manufacturing a display panel may further include: forming a third insulating layer on the side of the second conductive layer 24 away from the substrate base plate 10; a plurality of first light emitting units and a plurality of second light emitting units are formed on a side of the third insulating layer away from the substrate base plate 10, the first light emitting units are located in the camera mounting region 41, the second light emitting units are located in the normal display region 52, the plurality of second light emitting units are connected with the driving circuit layer through via holes penetrating through the third insulating layer, and the plurality of first light emitting units are connected with the first conductive lines 221, the second conductive lines 242 and the third conductive lines 243 in a one-to-one correspondence manner through via holes penetrating through the third insulating layer. The other ends of the first, second, and third conductive lines 221, 242, and 24 are connected to a first driving circuit, and thus, the plurality of first light emitting cells are connected to the first driving circuit through the first, second, and third conductive lines 221, 242, and 243.
Based on the inventive concept of the foregoing embodiments, the embodiments of the present disclosure also provide a display device including the display panel employing the foregoing embodiments. The display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
In the description of the present specification, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present disclosure and to simplify the description, but are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present disclosure.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present disclosure, "plurality" means two or more unless specifically limited otherwise.
In the present disclosure, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present disclosure can be understood by those of ordinary skill in the art as appropriate.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise the first and second features being in direct contact, or may comprise the first and second features being in contact, not directly, but via another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.
The above disclosure provides many different embodiments or examples for implementing different features of the disclosure. The components and arrangements of specific examples are described above to simplify the present disclosure. Of course, they are merely examples and are not intended to limit the present disclosure. Moreover, the present disclosure may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed.
While the present disclosure has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.
Claims (15)
1. A display panel, comprising a substrate and a conductive structure layer disposed on the substrate, wherein the conductive structure layer comprises:
a first insulating layer on one side of the substrate base plate;
the first conducting layer is positioned on one side, away from the substrate, of the first insulating layer and comprises a plurality of first conducting wires arranged at intervals;
the second insulating layer is positioned on one side, away from the substrate base plate, of the first conducting layer and comprises a plurality of insulating lines arranged at intervals, and the orthographic projection of each first conducting line on the substrate base plate is positioned in the range of the orthographic projection of each insulating line on the substrate base plate;
a second conductive layer including a plurality of second conductive lines and a plurality of third conductive lines, each of the second conductive lines being located on a side of the second insulating layer facing away from the substrate, an orthogonal projection of each of the second conductive lines on the substrate being located within an orthogonal projection range of each of the insulating lines on the substrate, each of the third conductive lines being located in a region between every two adjacent insulating lines, each of the third conductive lines being located on a side of the first insulating layer facing away from the substrate, the insulating line is configured to disconnect the third conductive line and the second conductive line adjacent to each other, an orthographic projection of the second conductive line on the substrate base plate is a first region, the orthographic projection of the third conductive line adjacent to the second conductive line on the substrate is a second area, and the width of the overlapped part of the first area and the second area is greater than or equal to 0.
2. The display panel according to claim 1, wherein a retraction distance is provided between a boundary of the first conductive line and a boundary of the insulating line, and the retraction distance is in a range of 0.3 μm to 0.5 μm.
3. The display panel of claim 1, wherein the thickness of the insulating line ranges from 3500 angstroms to 4500 angstroms.
4. The display panel according to claim 1, wherein an angle between a sidewall of the insulating line and the substrate base is less than or equal to 90 °.
5. The display panel according to claim 1, wherein a distance between adjacent insulating lines ranges from 1.5 μm to 2.5 μm.
6. The display panel of claim 1, wherein a thickness of the first conductive line is greater than a thickness of the second conductive line, the thickness of the first conductive line ranging from 350 angstroms to 450 angstroms.
7. The display panel of claim 1, wherein the width of the first conductive line ranges from 1.5 μ ι η to 2.5 μ ι η.
8. The display panel according to any one of claims 1 to 7, wherein the display panel comprises a display region including a camera mounting region and a normal display region located outside the camera mounting region, the camera mounting region includes a plurality of first light emitting units located on one side of the substrate, the normal display region includes a driving circuit layer and a plurality of second light emitting units located on one side of the substrate, and the display panel further comprises a first driving circuit, and each of the first light emitting units is connected to the first driving circuit through each of the conductive wires in the conductive structure layer.
9. The display panel according to claim 8, wherein the display panel further comprises a frame region located at one side of the display region, and the first driving circuit is located in the frame region.
10. The display panel according to claim 8, wherein the conductive structure layer is located between the substrate base plate and the first light emitting unit in the camera mounting region, and the conductive structure layer is located between the driving structure layer and the second light emitting unit in the normal display region.
11. A method for manufacturing a display panel, comprising:
forming a first insulating layer on one side of a substrate;
sequentially forming a first conductive film and a second insulating film on one side of the first insulating layer, which is far away from the substrate base plate;
patterning the second insulating film to form a second insulating layer, wherein the second insulating layer comprises a plurality of insulating wires arranged at intervals;
etching the first conductive film by using the second insulating layer as a mask to form a first conductive layer, wherein the first conductive layer comprises a plurality of first conductive wires arranged at intervals, and the orthographic projection of each first conductive wire on the substrate is positioned in the range of the orthographic projection of each insulating wire on the substrate;
and forming a second conductive layer on one side of the second insulating layer, which is far away from the substrate base plate, wherein the second conductive layer comprises a plurality of second conductive lines and a plurality of third conductive lines, the orthographic projection of each second conductive line on the substrate base plate is positioned in the range of the orthographic projection of each insulating line on the substrate base plate, each third conductive line is positioned in the area between every two adjacent insulating lines, and the insulating lines are configured to disconnect the adjacent third conductive lines and the second conductive lines from each other.
12. The method of claim 11, wherein an angle between a sidewall of the insulated wire and the substrate base plate is less than or equal to 90 °.
13. The method of claim 11, wherein the insulated wire has a thickness in a range of 3500 angstroms to 4500 angstroms.
14. The method of claim 11, wherein etching the first conductive film comprises: and etching the first conductive film by adopting a wet etching process so as to enable a preset retraction distance to be formed between the boundary of the first conductive wire and the boundary of the insulating wire, wherein the preset retraction distance is in a range of 0.3-0.5 mu m.
15. A display device characterized by comprising the display panel according to any one of claims 1 to 10.
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