CN113276407A - Flexible circuit printing device and method - Google Patents
Flexible circuit printing device and method Download PDFInfo
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- CN113276407A CN113276407A CN202110369311.5A CN202110369311A CN113276407A CN 113276407 A CN113276407 A CN 113276407A CN 202110369311 A CN202110369311 A CN 202110369311A CN 113276407 A CN113276407 A CN 113276407A
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- 238000007639 printing Methods 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000012530 fluid Substances 0.000 claims abstract description 82
- 238000002347 injection Methods 0.000 claims abstract description 68
- 239000007924 injection Substances 0.000 claims abstract description 68
- 230000007246 mechanism Effects 0.000 claims abstract description 61
- 239000011347 resin Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 15
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 15
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims description 15
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims description 15
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- XEBWQGVWTUSTLN-UHFFFAOYSA-M phenylmercury acetate Chemical compound CC(=O)O[Hg]C1=CC=CC=C1 XEBWQGVWTUSTLN-UHFFFAOYSA-M 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims 2
- 238000005286 illumination Methods 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 description 9
- 230000008859 change Effects 0.000 description 7
- 238000005452 bending Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
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- 238000001125 extrusion Methods 0.000 description 3
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- 239000000463 material Substances 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 239000012776 electronic material Substances 0.000 description 1
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- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
- B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
- B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
The invention discloses a flexible circuit printing device and a method, which comprises an injection mechanism loaded with conductive ink, an ultraviolet irradiation device used for curing and a moving mechanism used for controlling the injection mechanism and the ultraviolet irradiation device to move, wherein a temperature control device is arranged below the injection mechanism, a container is arranged at the top of the temperature control device and is loaded with viscous fluid, an injection port of the injection mechanism is aligned with the container and is arranged in the viscous fluid, and light beams of the ultraviolet irradiation device are focused on the injection port of the injection mechanism. The flexible circuit prepared by the invention can be formed in one step, the porosity of the circuit is small, the cost is low, the preparation of the three-dimensional flexible circuit is simple and convenient, and the flexible circuit can be well protected.
Description
Technical Field
The invention relates to the technical field of 3D printing of circuits, in particular to a flexible circuit printing device and a flexible circuit printing method.
Background
There are two mainstream methods of manufacturing flexible electronics, one is the use of high performance electronic materials in non-conventional geometries to achieve thin, stretchable, flexible designs, which combines traditional microfabrication technology with transfer technology to create stretchable cell arrays, lightweight electronic foils, solar cells, and biosensor arrays. Another approach is to fully print soft material components with conductive composites, liquid metals and ionic liquids to create flexible stretchable patterned electronics. These methods of manufacturing flexible electronic devices are cumbersome or costly.
Some manufacturers improve the manufacturing process at present, for example, chinese patents with publication numbers CN110648979A and publication dates 2020.1.3: an integrated flexible substrate with high stretchability is prepared through preparing an integrated flexible substrate made of multiple materials with different elastic moduli, then placing a rigid element on the substrate with a high elastic modulus region, placing a flexible element on the substrate with a low elastic modulus region, and packaging to obtain the flexible circuit. However, the method for preparing the flexible circuit is complicated, different components are packaged by using different elastic modulus substrates, the flexible circuit prepared by the wrapping method can only be in a plane direction, and the method for preparing the flexible circuit is mainly used for preparing the flexible circuit on a flexible substrate, wherein the flexible substrate comprises a metal sheet such as stainless steel and aluminum, ultrathin glass, a high polymer and the like. Printing a flexible circuit on a flexible substrate is exposed in the air, so that the porosity of the circuit is increased, and the preparation of a three-dimensional flexible circuit on the flexible substrate is difficult, so that a simple and efficient manufacturing scheme is urgently needed at present to solve the problem of flexible circuit printing and forming.
Disclosure of Invention
The invention provides a flexible circuit printing device and a method, the flexible circuit prepared by the printing device and the method can be formed in one step, the porosity of the circuit is small, the cost is low, the preparation of the three-dimensional flexible circuit is simple and convenient, and the flexible circuit can be well protected.
The technical scheme of the invention is as follows:
a flexible circuit printing device comprises an injection mechanism loaded with conductive ink, an ultraviolet irradiation device used for curing and a moving mechanism used for controlling the injection mechanism and the ultraviolet irradiation device to move, wherein a temperature control device is arranged below the injection mechanism, a container is arranged at the top of the temperature control device, the container is loaded with viscous fluid, an injection port of the injection mechanism is aligned with the container and placed in the viscous fluid, and light beams of the ultraviolet irradiation device are focused on the injection port of the injection mechanism.
The moving mechanism drives the injection mechanism to move, meanwhile, the injection port of the injection mechanism extrudes conductive ink to perform ink direct writing in the viscous fluid, the ultraviolet irradiation device generates ultraviolet light to cure the surrounding viscous fluid at any time along with the ink extruded by the injection port, the ink direct writing is enabled to form a three-dimensional circuit in the viscous fluid, then the temperature control device is driven to perform temperature control, the viscous fluid is further cured to wrap the circuit, and printing is completed.
Further, the irradiation spot of the ultraviolet irradiation device is 500 micrometers.
Further, the movement mechanism comprises a movable tri-or multi-axis platform controlled by a PMAC controller. The injection mechanism is fixed on the movable three-axis or multi-axis platform, and when the three-dimensional circuit is manufactured by ink printing, the movable three-axis or multi-axis platform controls the motion track through the PMAC controller, so that the injection mechanism performs ink extrusion printing according to the set printing track.
Further, the temperature control device comprises a temperature control plate. After printing, the viscous fluid is solidified through the temperature control plate, so that the ink obtained by direct writing is timely fixed, and the printed circuit is wrapped in the solidified viscous fluid, so that the flexible circuit can be bent and stretched without damaging the flexible circuit, and meanwhile, the printed flexible circuit is prevented from being exposed in the air, and the porosity of the circuit is effectively reduced.
Further, the ultraviolet light irradiation device includes a laser that generates ultraviolet light. The ultraviolet light of the laser irradiates the viscous fluid containing photosensitive resin, so that the function of fixing while printing can be achieved, the laser is fixed on the moving mechanism, a three-dimensional circuit with any pattern can be printed, the precision of the three-dimensional circuit can be ensured, the inaccuracy of line precision caused by the viscosity difference of liquid is eliminated, the influence of viscosity of the viscous fluid on a printing route is reduced, and the printing precision can be controlled by the variable which is easy to control and is the proportion of the photosensitive resin.
Furthermore, the container includes the culture dish, and the culture dish adopts transparent glass material, is convenient for observe.
Further, the viscous fluid is formed by mixing PDMS, a curing agent for curing the PDMS and photosensitive resin.
The invention also provides a flexible circuit printing method, which is used for printing by using the flexible circuit printing device and specifically comprises the following steps:
s1, preparing viscous fluid containing photosensitive resin;
s2, pouring the prepared viscous fluid into a culture dish, placing the culture dish on a temperature control plate, and sticking a temperature measuring strip, wherein the viscous fluid is in a liquid state;
s3, preparing conductive ink;
s4, adding conductive ink into the injection mechanism;
s5, starting a temperature control plate to heat the culture dish;
s6, the moving mechanism drives the injection mechanism and the ultraviolet irradiation device to move and print according to the set printing track, at the moment, the injection port of the injection mechanism extrudes conductive ink to continuously deposit in the viscous fluid to form a circuit, and ultraviolet light generated by the ultraviolet irradiation device moves and solidifies along with the injection port of the injection mechanism;
and S7, heating the temperature control plate to further solidify the viscous fluid in the culture dish, wherein the circuit is wrapped in the solidified viscous fluid, and the flexible circuit is printed.
When the conductive ink is directly written in the viscous fluid, the viscous fluid can be solidified through the temperature control plate according to the characteristic that the elastic modulus of the viscous fluid changes along with the change of the temperature, so that the conductive ink obtained by direct writing cannot settle, and the viscous fluid around the printing ink is solidified through the irradiation of ultraviolet light according to the characteristic that the photosensitive resin is solidified through the irradiation of the ultraviolet light, so that the conductive ink obtained by direct writing is fixed in time. Accordingly, complex three-dimensional circuits can be printed in viscous fluids. Because the circuit is wrapped in the solidified viscous fluid with the elastic modulus, the flexible circuit can be bent and stretched without damaging the flexible circuit, meanwhile, the printed flexible circuit is prevented from being exposed in the air, and the porosity of the circuit can be effectively reduced. Because the flexible circuit printed by the invention has good bending and stretching characteristics, the change of the resistivity can be detected in the bending deformation of the flexible circuit, thereby laying a foundation for preparing flexible electronic devices.
Further, the viscous fluid is formed by mixing PDMS, a curing agent for curing the PDMS and photosensitive resin, wherein the weight ratio of PDMS: curing agent: photosensitive resin ═ 10: 1: 1, were mixed in a mass ratio of 1.
Further, the surface viscosity and the shear elastic modulus of the conductive ink are both greater than the surface viscosity and the shear elastic modulus of the viscous fluid. In order to prevent the conductive ink from being broken by being stretched in the viscous fluid, it is required that both the surface viscosity and the shear elastic modulus of the conductive ink are larger than those of the viscous fluid.
The invention has the beneficial effects that:
the printing device extrudes the conductive ink to perform ink direct writing in the viscous fluid, the temperature control device is arranged below the viscous fluid, the temperature of the viscous fluid can be controlled, the viscosity fluid is heated and cured, the concentration of the viscous fluid can be changed through temperature control, the viscous fluid around the printing ink can be cured through ultraviolet light irradiation, and therefore the ink can directly write a complex three-dimensional flexible circuit, the three-dimensional flexible circuit is wrapped by the cured viscous fluid, can be stretched and bent, and can detect the change of the resistance. The flexible circuit prepared by the invention can be formed in one step, the porosity of the circuit is small, the cost is low, the preparation of the three-dimensional flexible circuit is simple, the printing and forming are convenient and quick, and the flexible circuit can be well protected.
Drawings
FIG. 1 is a schematic diagram of a printing apparatus;
FIG. 2 is a schematic flow chart of a printing method;
in the figure: an injection mechanism 1, a temperature control device 2, a container 3, a viscous fluid 4 and an ultraviolet irradiation device 5.
Detailed Description
The drawings are for illustrative purposes only and are not to be construed as limiting the patent; for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted. The positional relationships depicted in the drawings are for illustrative purposes only and are not to be construed as limiting the present patent.
Example 1:
as shown in fig. 1, a flexible circuit printing apparatus includes an injection mechanism 1 loaded with conductive ink, an ultraviolet irradiation device 5 for curing, and a moving mechanism (not shown in the figure) for controlling the injection mechanism 1 and the ultraviolet irradiation device 5 to move, a temperature control device 2 is arranged below the injection mechanism 1, a container 3 is arranged at the top of the temperature control device 2, the container 3 is loaded with viscous fluid 4, an injection port of the injection mechanism 1 is aligned with the container 3 and is placed inside the viscous fluid 4, the ultraviolet irradiation device 5 is positioned obliquely above the container 2, and a light beam of the ultraviolet irradiation device 5 focuses on the injection port of the injection mechanism 1. The moving mechanism drives the injection mechanism 1 to move, meanwhile, conductive ink is extruded from an injection port of the injection mechanism 1 to be printed in the viscous fluid 4 in a 3D mode, ultraviolet light generated by the ultraviolet light irradiation device 5 is solidified in the viscous fluid 4 around along with the ink extruded from the injection port, the ink is directly written in the viscous fluid 4 to form a three-dimensional circuit, then the temperature control device 2 is driven to control the temperature, the viscous fluid 4 is solidified to wrap the circuit, and printing is completed.
In this embodiment, the injection mechanism 1 includes an injector, and a needle tube is connected to the bottom of the injector, and the bottom of the needle tube is an injection port. The injector is used for loading the conductive ink, and the piston of the injector is extruded, so that the conductive ink can be extruded through the injection port to be printed on the viscous fluid.
In this embodiment, the movement mechanism comprises a movable tri-or multi-axis platform that is controlled by a PMAC controller. The injection mechanism 1 is fixed on a movable three-axis or multi-axis platform, and when the three-dimensional circuit is manufactured by ink printing, the movable three-axis or multi-axis platform is controlled to move by an instruction code output by a computer through a PMAC controller, so that the injection mechanism 1 performs ink extrusion printing according to a set printing track. The ultraviolet irradiation device 5 is also fixed on the movable three-axis or multi-axis platform and moves synchronously along with the injection mechanism 1 to synchronously cure the ink extruded from the injection port of the injection mechanism 1.
In this embodiment, the temperature control device 2 includes a temperature control board, and after printing, the viscous fluid 4 is cured by the temperature control board, so that the ink obtained by direct writing is fixed in time, and the printed circuit is wrapped in the cured viscous fluid 4, and therefore the flexible circuit can be bent and stretched without being damaged.
In this embodiment, container 3 includes the culture dish, and the culture dish adopts transparent glass material, is convenient for observe, can also adopt other containers. And a temperature measuring strip (not shown in the figure) is stuck on the container 3 and feeds back the real-time temperature of the container 3, so that the temperature control of the temperature control plate is more accurate.
In this embodiment, the ultraviolet light irradiation device 5 includes a laser, the laser generates ultraviolet light, the light beam is focused on the injection port of the injection mechanism 1, and the light spot size is about 500 micrometers. The ultraviolet light of the laser irradiates the viscous fluid containing photosensitive resin, so that the function of fixing while printing can be achieved, the laser is fixed on the moving mechanism, a three-dimensional circuit with any pattern can be printed, the precision of the three-dimensional circuit can be ensured, the inaccuracy of line precision caused by the viscosity difference of liquid is eliminated, the influence of viscosity of the viscous fluid on a printing route is reduced, and the printing precision can be controlled by the variable which is easy to control and is the proportion of the photosensitive resin.
In the present embodiment, the viscous fluid 4 is formed by mixing PDMS, a curing agent for curing the PDMS, and a photosensitive resin.
Referring to fig. 2, the present invention further provides a flexible circuit printing method, which performs printing by using the flexible circuit printing apparatus, and specifically includes the following steps:
s1, preparing viscous fluid containing photosensitive resin;
s2, pouring the prepared viscous fluid into a culture dish, placing the culture dish on a temperature control plate, and sticking a temperature measuring strip, wherein the viscous fluid is in a liquid state;
s3, preparing conductive ink;
s4, adding conductive ink into the injection mechanism;
s5, starting a temperature control plate to heat the culture dish;
s6, the moving mechanism drives the injection mechanism and the ultraviolet irradiation device to move and print according to the set printing track, at the moment, the injection port of the injection mechanism extrudes conductive ink to continuously deposit in the viscous fluid to form a circuit, and ultraviolet light generated by the ultraviolet irradiation device moves and solidifies along with the injection port of the injection mechanism;
and S7, heating the temperature control plate to further solidify the viscous fluid in the culture dish, wherein the circuit is wrapped in the solidified viscous fluid, and the flexible circuit is printed.
The viscous fluid is formed by mixing PDMS, a curing agent for curing the PDMS and photosensitive resin, wherein the ratio of PDMS: curing agent: photosensitive resin ═ 10: 1: 1, were mixed in a mass ratio of 1. Meanwhile, in order to avoid the conductive ink from being broken by being stretched in the viscous fluid, it is required that both the surface viscosity and the shear elastic modulus of the conductive ink are larger than those of the viscous fluid.
In this embodiment, the printed flexible circuit is removed, and the resistance change of the flexible circuit is detected and quantified to prepare the resistance strain gauge.
In this embodiment, the printing trajectory set in the moving mechanism is based on a circuit model designed by a computer and required to be printed, then a graphic file of the model is converted into three-dimensional coordinates, and then a coordinate instruction code output by the computer controls the movable three-axis or multi-axis platform to move through the PMAC controller, so that the injection mechanism 1 performs extrusion ink printing according to the set printing trajectory.
When the conductive ink is directly written in the viscous fluid, the viscous fluid can be cured through the temperature control plate according to the characteristic that the elastic modulus of the viscous fluid changes along with the change of the temperature, so that the conductive ink obtained by direct writing is fixed in time, the viscous fluid around the printing ink can be cured by ultraviolet irradiation, and accordingly, a complex three-dimensional circuit can be printed in the viscous fluid. Because the circuit is wrapped in the solidified viscous fluid with the elastic modulus, the flexible circuit can be bent and stretched without damaging the flexible circuit, meanwhile, the printed flexible circuit is prevented from being exposed in the air, and the porosity of the circuit can be effectively reduced. The flexible circuit printed by the invention has good bending and stretching characteristics, and the ink can not be cured under the action of ultraviolet light and heat and can conduct electricity, so that the change of the resistivity can be detected in the bending deformation of the flexible circuit, and a foundation is laid for preparing a flexible electronic device.
The printing device extrudes the conductive ink to perform ink direct writing in the viscous fluid, the temperature control device is arranged below the viscous fluid, the temperature of the viscous fluid can be controlled, the viscosity fluid is heated and cured, the concentration of the viscous fluid can be changed through temperature control, the viscous fluid around the printing ink can be cured through ultraviolet light irradiation, and therefore the ink can directly write a complex three-dimensional flexible circuit, the three-dimensional flexible circuit is wrapped by the cured viscous fluid, can be stretched and bent, and can detect the change of the resistance. The flexible circuit prepared by the invention can be formed in one step, the porosity of the circuit is small, the cost is low, the preparation of the three-dimensional flexible circuit is simple, the printing and forming are convenient and quick, and the flexible circuit can be well protected.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A flexible circuit printing device is characterized by comprising an injection mechanism loaded with conductive ink, an ultraviolet irradiation device used for curing and a moving mechanism used for controlling the injection mechanism and the ultraviolet irradiation device to move, wherein a temperature control device is arranged below the injection mechanism, a container is arranged at the top of the temperature control device, the container is loaded with viscous fluid, an injection port of the injection mechanism is aligned with the container and is placed in the viscous fluid, and light beams of the ultraviolet irradiation device are focused on the injection port of the injection mechanism.
2. The flexible circuit printing apparatus of claim 1, wherein said ultraviolet light illuminating device has an illumination spot of 500 microns.
3. The flexible circuit printing apparatus of claim 1, wherein the movement mechanism comprises a movable tri-or multi-axis platform controlled by a PMAC controller.
4. The flexible circuit printing apparatus of claim 1, wherein the temperature control device comprises a temperature control plate.
5. The flexible circuit printing apparatus of claim 1, wherein said ultraviolet light illuminating device comprises a laser, said laser generating ultraviolet light.
6. The flexible circuit printing apparatus of claim 1, wherein the container comprises a petri dish.
7. The flexible circuit printing apparatus of claim 1, wherein the viscous fluid is a mixture of PDMS, a curing agent for curing PDMS, and a photosensitive resin.
8. A method of printing flexible circuits using the flexible circuit printing apparatus of any one of claims 1 to 7, comprising the steps of:
s1, preparing viscous fluid containing photosensitive resin;
s2, pouring the prepared viscous fluid into a culture dish, placing the culture dish on a temperature control plate, and sticking a temperature measuring strip, wherein the viscous fluid is in a liquid state;
s3, preparing conductive ink;
s4, adding conductive ink into the injection mechanism;
s5, starting a temperature control plate to heat the culture dish;
s6, the moving mechanism drives the injection mechanism and the ultraviolet irradiation device to move and print according to the set printing track, at the moment, the injection port of the injection mechanism extrudes conductive ink to continuously deposit in the viscous fluid to form a circuit, and ultraviolet light generated by the ultraviolet irradiation device moves and solidifies along with the injection port of the injection mechanism;
and S7, heating the temperature control plate to further solidify the viscous fluid in the culture dish, wherein the circuit is wrapped in the solidified viscous fluid, and the flexible circuit is printed.
9. The method of claim 8, wherein the viscous fluid is a mixture of PDMS, a curing agent for curing the PDMS, and a photosensitive resin, the ratio of PDMS: curing agent: photosensitive resin ═ 10: 1: 1, were mixed in a mass ratio of 1.
10. The method of printing flexible circuits according to claim 8, wherein the conductive ink has a surface viscosity and a shear modulus of elasticity that are both greater than a surface viscosity and a shear modulus of elasticity of the viscous fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110369311.5A CN113276407A (en) | 2021-04-06 | 2021-04-06 | Flexible circuit printing device and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110369311.5A CN113276407A (en) | 2021-04-06 | 2021-04-06 | Flexible circuit printing device and method |
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| CN113276407A true CN113276407A (en) | 2021-08-20 |
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| CN202110369311.5A Pending CN113276407A (en) | 2021-04-06 | 2021-04-06 | Flexible circuit printing device and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113370519A (en) * | 2021-06-20 | 2021-09-10 | 赤壁市高质量发展研究院有限公司 | Integrated flexible visual wearable device based on 3D printing and preparation method thereof |
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2021
- 2021-04-06 CN CN202110369311.5A patent/CN113276407A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113370519A (en) * | 2021-06-20 | 2021-09-10 | 赤壁市高质量发展研究院有限公司 | Integrated flexible visual wearable device based on 3D printing and preparation method thereof |
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