CN113196895B

CN113196895B - Electronic component mounting board and electronic device

Info

Publication number: CN113196895B
Application number: CN201980083377.9A
Authority: CN
Inventors: 松戸和规; 安东健次; 早坂努; 松尾玲季
Original assignee: Toyo Ink SC Holdings Co Ltd; Toyochem Co Ltd
Current assignee: Toyochem Co Ltd; Artience Co Ltd
Priority date: 2018-12-18
Filing date: 2019-12-17
Publication date: 2023-12-15
Anticipated expiration: 2039-12-17
Also published as: WO2020129985A1; KR102400969B1; TWI841646B; KR20210094094A; CN113196895A; TW202038696A

Abstract

The application provides an electronic component mounting substrate and an electronic machine, wherein the electronic component mounting substrate (51) comprises: a substrate (20); an electronic component (30) mounted on at least one surface of the substrate (20); and an electromagnetic wave shielding member (1) which covers the substrate (20) from the upper surface of the electronic component (30) and covers the side surface of the step portion formed by mounting the electronic component (30) and at least a part of the substrate (20). The electromagnetic wave shielding member (1) has an electromagnetic wave shielding layer (5) containing a binder resin and a conductive filler, and the surface layer of the electromagnetic wave shielding member (1) is in accordance with JISB0601: the kurtosis measured in 2001 was 1 to 8.

Description

Electronic component mounting board and electronic device

The present application claims priority based on japanese patent application nos. 2018-236541 and 2018-236542, and japanese patent application nos. 2019-063673 and 2019-063674, and japanese patent application nos. 2019-220612, and 2019-12-5, and the disclosures of which are incorporated herein in their entireties.

Technical Field

The present application relates to an electronic component mounting substrate having an electromagnetic wave shielding member. The present application also relates to an electromagnetic wave shielding laminate suitable for forming an electromagnetic wave shielding member of the electronic component mounting substrate, and an electronic device mounted with the electronic component mounting substrate.

Background

Electronic components mounted with integrated circuit (Integrated Circuit, IC) chips and the like are generally provided with electromagnetic wave shielding structures in order to prevent malfunction caused by external magnetic fields or radio waves. For example, a method of coating a substrate on which an electronic component is mounted with a conductive adhesive film including an isotropic conductive adhesive and an anisotropic conductive adhesive is disclosed (patent document 1). Further, a method of coating a substrate on which an electronic component is mounted with an electromagnetic wave shielding film including a conductive adhesive layer and a base material layer having a specific storage elastic modulus (patent document 2), or a method of coating a substrate on which an electronic component is mounted with an electromagnetic wave shielding member having a specific tensile fracture strain and including a layer containing scale-like particles exhibiting isotropic conductivity (patent document 3) is disclosed.

Prior art literature

Patent literature

Patent document 1: international publication No. 2015/186624

Patent document 2: japanese patent laid-open publication No. 2014-57041

Patent document 3: international publication No. 2018/147355

Disclosure of Invention

Problems to be solved by the invention

For example, an electronic component mounting board is manufactured by coating an electromagnetic wave shielding member on a board on which an electronic component is mounted by the following method. First, as shown in fig. 18, an electromagnetic wave shielding laminate 104, which is a laminate of an electromagnetic wave shielding member 102 and a release buffer member 103, is placed on top of a plurality of electronic components 130 mounted on a substrate 120. Next, as shown in fig. 19, the electromagnetic wave shielding laminate 104 is thermally bonded, and the electromagnetic wave shielding member 101 covers a part of the electronic component 130 and the substrate 120. Thereafter, as shown in fig. 20, the releasable buffer member 103 is peeled off, and then, as shown in fig. 21, a step of singulating the substrate 120 into product units is performed. The singulation step is performed, for example, by: the electromagnetic wave shielding member 101 is brought into contact with the dicing table 141, and the substrate 120 and the electromagnetic wave shielding member 101 are cut from the substrate 120 side by the cutting tool 142 at a position facing the groove 125 which is a gap between the electronic components 130 while maintaining the contact state.

With the recent stringent demands for higher performance of electronic components, there is a need for a technique for improving the performance of the electromagnetic wave shielding member 101 of the electronic component mounting substrate.

The present invention has been made in view of the above background, and an object thereof is to provide an electronic component mounting board and an electronic device having an electromagnetic wave shielding member with high reliability.

Technical means for solving the problems

The present inventors have made diligent studies and have found that the following aspects can solve the problems of the present invention, thereby completing the present invention.

[1]: an electronic component mounting substrate, comprising: a substrate; an electronic component mounted on at least one surface of the substrate; and an electromagnetic wave shielding member that covers the substrate from the upper surface of the electronic component, and covers at least a part of the side surface of the step portion formed by mounting the electronic component and the substrate; the electromagnetic wave shielding member has an electromagnetic wave shielding layer containing a binder resin and a conductive filler, and the surface layer of the electromagnetic wave shielding member is in accordance with japanese industrial standard (Japanese Industrial Standards, JIS) B0601: the kurtosis (kurtosis) measured in 2001 was 1 to 8.

[2]: the electronic component mounting substrate according to item [1], wherein the surface layer of the electromagnetic wave shielding member is formed according to JISB0601: the root mean square height Rq measured in 2001 is 0.3 μm to 1.7. Mu.m.

[3]: the electronic component mounting substrate according to [1] or [2], wherein the conductive filler contains at least one of dendritic and needle-shaped conductive fillers.

[4]: an electronic component mounting substrate, comprising: a substrate; an electronic component mounted on at least one surface of the substrate; and an electromagnetic wave shielding member that covers the substrate from the upper surface of the electronic component, and covers at least a part of the side surface of the step portion formed by mounting the electronic component and the substrate;

the electromagnetic wave shielding member has an electromagnetic wave shielding layer containing a binder resin and a conductive filler, and has a press-in elastic modulus of 1GPa to 10GPa.

[5]: the electronic component mounting substrate according to [4], wherein the water contact angle of the surface layer of the electromagnetic wave shielding member is 70 DEG to 110 deg.

[6]: the electronic component mounting substrate according to [4] or [5], wherein the electromagnetic wave shielding member on the electronic component exhibits a residual percentage of transverse cut of 23/25 or more in a tape adhesion test after a pressure cooker test according to JIS K5600.

[7]: the electronic component mounting substrate according to any one of [4] to [6], wherein the surface layer of the electromagnetic wave shielding member is formed according to JISB0601: the kurtosis measured in 2001 was 1 to 8.

[8]: the electronic component mounting substrate according to any one of [4] to [7], wherein the root mean square height of the surface of the electromagnetic wave shielding member is in the range of 0.4 μm to 1.6 μm.

[9]: according to [4]]～[8]The electronic component mounting substrate according to any one of the above, wherein the electromagnetic wave shielding member has a Martens hardness (Mardness) of 50N/mm ² ～312N/mm ² 。

[10]: the electronic component mounting substrate according to any one of [4] to [9], wherein the binder resin is obtained by thermocompression bonding a binder resin precursor containing a thermosetting resin and a curable compound having a functional group crosslinkable with a reactive functional group of the thermosetting resin.

[11]: the electronic component mounting substrate according to any one of [4] to [10], wherein the electromagnetic wave shielding member has a film thickness of 10 μm to 200 μm.

[12]: an electronic component mounting substrate, comprising: a substrate; an electronic component mounted on at least one surface of the substrate; and an electromagnetic wave shielding member that covers the substrate from the upper surface of the electronic component, and covers at least a part of the side surface of the step portion formed by mounting the electronic component and the substrate; the electromagnetic wave shielding member has an electromagnetic wave shielding layer containing a binder resin and a conductive filler, and the surface layer of the electromagnetic wave shielding member has a root mean square height Rq of 0.05 [ mu ] m or more and less than 0.3 [ mu ] m.

[13]: the electronic component mounting substrate according to [12], wherein the root mean square slope Rdq of the surface layer of the electromagnetic wave shielding member is 0.05 to 0.4.

[14]: the electronic component mounting substrate according to [12] or [13], wherein the water contact angle of the surface layer of the electromagnetic wave shielding member is 90 DEG to 130 deg.

[15]: the electronic component mounting substrate according to any one of [12] to [14], wherein the conductive filler contains at least one of dendritic and needle-shaped conductive fillers and a scaly conductive filler.

[16]: an electronic device mounted with the electronic component mounting substrate according to any one of [1] to [15 ].

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, excellent effects are obtained in that an electronic component mounting substrate and an electronic device having an electromagnetic wave shielding member with high reliability can be provided.

Drawings

Fig. 1 is a schematic perspective view showing an example of an electronic component mounting substrate according to embodiment A1, embodiment B1, and embodiment C1.

FIG. 2 is a cross-sectional view of the section II-II of FIG. 1.

Fig. 3 is a schematic cross-sectional view showing another example of the electronic component mounting substrate according to embodiment A1, embodiment B1, and embodiment C1.

Fig. 4 is a schematic cross-sectional view showing an example of the electromagnetic wave shielding laminate according to embodiment A1, embodiment B1, and embodiment C1.

Fig. 5 is a schematic cross-sectional view showing an example of a manufacturing process of the electronic component mounting substrate according to embodiment A1, embodiment B1, and embodiment C1.

Fig. 6 is a schematic cross-sectional view showing an example of a manufacturing process of the electronic component mounting substrate according to embodiment A1, embodiment B1, and embodiment C1.

Fig. 7 is a schematic cross-sectional view showing an example of a manufacturing process of the electronic component mounting substrate according to embodiment A1, embodiment B1, and embodiment C1.

Fig. 8 is a schematic cross-sectional view showing an example of a manufacturing process of the electronic component mounting substrate according to embodiment A1, embodiment B1, and embodiment C1.

Fig. 9 is a schematic explanatory view for explaining a fluctuation factor of kurtosis of a surface layer of an electromagnetic wave shielding member.

Fig. 10 is a schematic explanatory view for explaining a fluctuation factor of kurtosis of a surface layer of an electromagnetic wave shielding member.

Fig. 11 is a schematic cross-sectional view showing an example of the electromagnetic wave shielding laminate according to embodiment A2, embodiment B2, and embodiment C2.

Fig. 12 is a schematic cross-sectional view showing an example of the electromagnetic wave shielding laminate according to embodiment A3, embodiment B3, and embodiment C3.

Fig. 13 is a schematic cross-sectional view showing an example of the electromagnetic wave shielding laminate according to embodiment A4, embodiment B4, and embodiment C4.

Fig. 14A is a schematic cross-sectional view showing an example of a manufacturing process of the electronic component mounting substrate according to embodiment A4, embodiment B4, and embodiment C4.

Fig. 14B is a schematic cross-sectional view showing an example of a manufacturing process of the electronic component mounting substrate according to embodiment A4, embodiment B4, and embodiment C4.

Fig. 14C is a schematic cross-sectional view showing an example of a manufacturing process of the electronic component mounting substrate according to embodiment A4, embodiment B4, and embodiment C4.

Fig. 15A is a schematic cross-sectional view showing an example of a manufacturing process of the electronic component mounting substrate according to embodiment A5, embodiment B5, and embodiment C5.

Fig. 15B is a schematic cross-sectional view showing an example of a manufacturing process of the electronic component mounting substrate according to embodiment A5, embodiment B5, and embodiment C5.

Fig. 15C is a schematic cross-sectional view showing an example of a manufacturing process of the electronic component mounting substrate according to embodiment A5, embodiment B5, and embodiment C5.

Fig. 16A is a schematic cross-sectional view showing an example of a manufacturing process of the electronic component mounting substrate according to the modification.

Fig. 16B is a schematic cross-sectional view showing an example of a manufacturing process of the electronic component mounting substrate according to the modification.

Fig. 16C is a schematic cross-sectional view showing an example of a manufacturing process of the electronic component mounting substrate according to the modification.

Fig. 16D is a schematic cross-sectional view showing an example of a manufacturing process of the electronic component mounting substrate according to the modification.

Fig. 17 is a schematic cross-sectional view showing an example of the electronic component mounting substrate of the present embodiment.

Fig. 18 is a schematic cross-sectional view illustrating a step of covering an electromagnetic wave shielding member on an electronic component or the like.

Fig. 19 is a schematic cross-sectional view illustrating a step of covering an electromagnetic wave shielding member on an electronic component or the like.

Fig. 20 is a schematic cross-sectional view illustrating a step of covering an electromagnetic wave shielding member on an electronic component or the like.

Fig. 21 is a schematic cross-sectional view illustrating a step of covering an electromagnetic wave shielding member on an electronic component or the like.

Fig. 22 is an optical micrograph of a side surface of the electronic component mounting substrate of this example B3.

Fig. 23 is an optical micrograph of a side surface of the electronic component mounting substrate of this reference example B1.

Fig. 24 is an explanatory diagram of an evaluation method of the electronic component mounting substrate of the present embodiment C.

[ description of symbols ]

1. 1c, 1d, 101: electromagnetic wave shielding member

2. 2a, 2b, 2c, 2d, 102: electromagnetic wave shielding member

3. 3a, 3b, 3c, 3d, 3e, 103: release cushioning member

4. 4a, 4b, 4c, 4d, 4e, 104: laminate for electromagnetic wave shielding

5. 5c, 5d, 5e electromagnetic wave shielding layer

6. 6a, 6b, 6c, 6d, 6e: conductive adhesive layer

6a1: first conductive adhesive layer

6a2: second conductive adhesive layer

6P: conductive adhesive layer during drying

7b: insulating resin layer

8c, 8d: insulating adhesive layer

9c, 9d, 9e: insulating coating

10: binder resin precursor

11: conductive filler

12: dendritic particles

15: releasable substrate

20. 120: substrate board

21: electrode

22: ground pattern

23: internal through hole

24: solder ball

25: half-cutting groove

30. 130: electronic component

31: semiconductor chip

32: molded resin

33: bonding wire

40: pressing substrate

51. 52, 53, 54, 55: electronic component mounting board

125: groove(s)

141: cutting table

142: cutting tool

GND: grounded (earth)

T1: thickness (film thickness)

T2: thickness of (L)

X, Y, Z: direction of

Detailed Description

An example of an embodiment to which the present invention is applied will be described below. The numerical values specifically defined in the present specification are values obtained by the methods disclosed in the embodiments or examples. In the present specification, the numerical values "a to B" are ranges satisfying the numerical values a and values larger than the numerical value a, and the numerical values B and values smaller than the numerical value B. The sheet of the present specification includes not only a sheet defined in JIS but also a film. The following description and drawings are appropriately simplified to clarify the description. The respective components appearing in the present specification may be used singly or in combination of two or more, unless otherwise noted. For convenience of explanation, the same reference numerals are given to the same component members even in different embodiments.

As the electronic component mounting substrate of the present invention, the electronic component mounting substrates of embodiments a to C are disclosed.

[ [ embodiment A ] ]

The electronic component mounting substrate according to embodiment a includes: a substrate; an electronic component mounted on at least one surface of the substrate; and an electromagnetic wave shielding member that covers the substrate from the upper surface of the electronic component, and covers at least a part of the side surface of the step portion formed by mounting the electronic component and the substrate. The electromagnetic wave shielding member has an electromagnetic wave shielding layer containing a binder resin and a conductive filler. Furthermore, the surface layer of the electromagnetic wave shielding member is subjected to JISB0601: the kurtosis measured in 2001 was set to 1 to 8.

According to the conventional technology, there is a case where a residue as shown in fig. 20 (i) adheres to the electromagnetic wave shielding member 101 of the electronic component mounting board. The residue is derived from the releasable cushioning member 103 as a constituent member of the electromagnetic wave shielding laminate 104 for forming the electromagnetic wave shielding member 101. The residue is generated by the anchor effect of the groove 125 formed in the gap of the electronic component 130 at the stage of peeling the release buffer member 103 after thermocompression bonding the electromagnetic wave shielding laminate 104. The residue is a chip of the release buffer member 103. The chips remain as residues even after the singulation step. Such residues on the electromagnetic wave shielding member 101 may cause not only poor appearance but also degradation of reliability of electromagnetic wave shielding performance of the electronic device, which may be an obstacle when packaged on a circuit board.

As a method for avoiding the above-described problem, a method of expanding the width of the gap between the electronic components 130 or reducing the height of the electronic components 130 in order to reduce the anchor effect of the groove 125 may be considered. However, the above method has a problem that the shape of the electronic component 130 is limited and cannot be applied to the electronic component 130 having complicated irregularities. In addition, if the gap between the electronic components 130 mounted on the substrate 120 can be reduced, the yield of the electronic components 130 obtained from one substrate 120 can be improved, and the efficiency of manufacturing can be improved. In addition, in order to prevent the reliability of the electromagnetic wave shielding member 101 from being lowered due to scratches during transportation or packaging of the electronic component 130, the electromagnetic wave shielding member 101 is required to have high scratch resistance.

According to the electronic component mounting substrate of embodiment a, an electronic component mounting substrate having an electromagnetic wave shielding member with high reliability, which has a high degree of freedom in design, suppresses adhesion of residues, and is excellent in scratch resistance, can be provided. Therefore, the present invention is particularly suitable for applications of electronic component mounting substrates for which improvement of design freedom is desired, or electronic component mounting substrates that are easily scratched.

[ [ embodiment B ] ]

The electronic component mounting substrate according to embodiment B includes: a substrate; an electronic component mounted on at least one surface of the substrate; and an electromagnetic wave shielding member that covers the substrate from the upper surface of the electronic component, and covers at least a part of the side surface of the step portion formed by mounting the electronic component and the substrate. The electromagnetic wave shielding member has an electromagnetic wave shielding layer containing a binder resin and a conductive filler, and has a press-in elastic modulus of 1GPa to 10GPa.

According to the prior art, there are the following problems: in the singulation step of the electronic component mounting substrate manufacturing step, burrs, which are the rolling-up of the electromagnetic wave shielding member 101, are easily generated with the cut surface of the electromagnetic wave shielding member 101 as a base point (see a partial enlarged view (ii) of fig. 21). The burr of the electromagnetic wave shielding member 101 is caused by high-pressure water washing or the like at the time of dicing in the singulation step. In addition, the adhesion between the electromagnetic wave shielding member 101 and the substrate 120 or the like may be reduced in the case of the electronic component mounting substrate after manufacturing under high humidity and heat conditions. Such occurrence of burrs and deterioration of adhesion of the electromagnetic wave shielding member 101 may cause deterioration of reliability of electromagnetic wave shielding performance of the electronic device, and may be an obstacle when the electronic device is packaged on a circuit board.

According to the electronic component mounting substrate of embodiment B, an electronic component mounting substrate having an electromagnetic wave shielding member which can suppress the occurrence of burrs and has high reliability and excellent pressure cooker test (Pressure Cooker Test, PCT) performance can be provided. Therefore, the method is particularly suitable for strict applications such as high-pressure water washing in a singulation step or applications of electronic component mounting substrates requiring durability under high-humidity and heat conditions.

[ [ embodiment C ] ]

The electronic component mounting substrate according to embodiment C includes: a substrate; an electronic component mounted on at least one surface of the substrate; and an electromagnetic wave shielding member that covers the substrate from the upper surface of the electronic component, and covers at least a part of the side surface of the step portion formed by mounting the electronic component and the substrate. The electromagnetic wave shielding member has an electromagnetic wave shielding layer containing a binder resin and a conductive filler, and the root mean square height Rq of the surface layer of the electromagnetic wave shielding member is set to be 0.05 [ mu ] m or more and less than 0.3 [ mu ] m.

According to the prior art, there are the following cases: in the singulation step, the electromagnetic wave shielding member 101 is brought into contact with a dicing table 141 (see fig. 21) via a dicing tape (not shown), and the substrate 120 and the electromagnetic wave shielding member 101 are cut from the substrate 120 side by a cutting tool 142 at a position facing the groove 125, which is a gap between the electronic components 130, while maintaining the contact state. In this case, the dicing tape and the electromagnetic wave shielding member 101 are peeled off after singulation, and the electronic component mounting substrate is manufactured. However, when the dicing tape is peeled off after singulation, there is a case where the electromagnetic wave shielding member 101 floats. In addition, there are cases where a part of the electromagnetic wave shielding member is peeled off. Further, when a cold and hot cycle test (-50 ℃ C. To 125 ℃ C.) is performed, cracks may occur in the electromagnetic wave shielding member.

Such a floating and cracking of the electromagnetic wave shielding member 101 may cause various problems as well as appearance defects. For example, when the electromagnetic wave shielding member 101 and the housing are connected to the ground surface with a conductive adhesive or a conductive adhesive, the adhesion or connection resistance is deteriorated, and the reliability of the electromagnetic wave shielding performance of the electronic device is lowered, which may be an obstacle when the electronic device is packaged on a circuit board. In addition, there are cases where there is a problem in terms of reliability over time.

According to the electronic component mounting substrate of embodiment C, an electronic component mounting substrate having an electromagnetic wave shielding member excellent in coating property and high in reliability can be provided. Therefore, the electromagnetic wave shielding member is particularly suitable for applications including a step of bringing the electromagnetic wave shielding member into contact with a dicing table by a dicing tape, or applications requiring a cold and hot cycle test, for example, applications requiring performance against severe temperature changes such as an electronic component mounting substrate mounted on an automobile.

[ [ embodiment A ] ]

A specific example of the electronic component mounting substrate according to embodiment a will be described below.

Embodiment A1

Electronic component mounting substrate

Fig. 1 is a schematic perspective view showing an example of an electronic component mounting substrate according to embodiment A1, and fig. 2 is a cross-sectional view of a II-II cut portion in fig. 1. The electronic component mounting board 51 includes the board 20, the electronic component 30, the electromagnetic wave shielding member 1, and the like.

The substrate 20 may be arbitrarily selected as long as it can mount the electronic component 30 and withstand the thermocompression bonding step described later. Examples include: a work board, a package module substrate, a printed wiring board, or a build-up substrate formed by a build-up method or the like, which includes a conductive pattern such as copper foil, is formed on the surface or inside. In addition, a film or a sheet-like flexible substrate may also be used. The conductive patterns include, for example, an electrode/wiring pattern (not shown) for electrically connecting to the electronic component 30, and a ground pattern 22 for electrically connecting to the electromagnetic wave shielding member 1. An electrode/wiring pattern, a via hole (not shown), or the like may be arbitrarily provided inside the substrate 20. The substrate 20 may be not only a rigid substrate but also a flexible substrate.

In the example of fig. 1, the electronic components 30 are arranged in a 5×4 array on the substrate 20. The electromagnetic wave shielding member 1 is provided so as to cover the exposed surfaces of the substrate 20 and the electronic component 30. That is, the electromagnetic wave shielding member 1 is covered so as to follow the irregularities formed by the electronic component 30. Unnecessary radiation generated from signal wiring and the like built in the electronic component 30 and/or the substrate 20 is shielded by the electromagnetic wave shielding member 1, and malfunction due to an external magnetic field or radio wave can be prevented.

The number, arrangement, shape, and kind of the electronic components 30 are arbitrary. Instead of arranging the electronic components 30 in an array, the electronic components 30 may be arranged at any position. In the case of singulating the electronic component mounting substrate 51 into unit modules, as shown in fig. 2, the half-cut grooves 25 may be provided so as to divide the unit modules in the thickness direction of the substrate from the upper surface of the substrate. The electronic component mounting substrate of embodiment A1 includes both a substrate before singulation into unit modules and a substrate after singulation into unit modules. That is, the electronic component mounting board 51 on which a plurality of unit modules (electronic components 30) are mounted as shown in fig. 1 and 2 includes an electronic component mounting board 52 on which the unit modules are singulated as shown in fig. 3. Of course, an electronic component mounting substrate in which one electronic component 30 is mounted on the substrate 20 and is covered with an electromagnetic wave shielding member without undergoing a singulation step is also included. That is, the electronic component mounting substrate of embodiment A1 includes the following structure: at least one electronic component is mounted on the substrate, and the electromagnetic wave shielding member is coated on at least a part of the step portion formed by mounting the electronic component.

The electronic component 30 includes all components in which electronic components such as a semiconductor integrated circuit are integrally covered with an insulator. For example, there is a method in which a semiconductor chip 31 (see fig. 3) on which an integrated circuit (not shown) is formed is molded with a sealing material (molding resin 32). The substrate 20 and the semiconductor chip 31 are electrically connected to a wiring or an electrode 21 formed on the substrate 20 via a contact region between the two, or via a bonding wire 33, a solder ball (not shown), or the like. Examples of the electronic component include an inductor, a thermal resistor, a capacitor, and a resistor, in addition to a semiconductor chip.

The electronic component 30 and the substrate 20 according to embodiment A1 can be widely applied to known configurations. In the example of fig. 3, the semiconductor chip 31 is connected to the solder balls 24 on the back surface of the substrate 20 via the internal through holes 23. In addition, a ground pattern 22 for electrically connecting to the electromagnetic wave shielding member 1 is formed in the substrate 20. As in embodiment A4 described later, a plurality of electronic components 30 may be mounted on the singulated electronic component mounting board or on an electronic component mounting board that is not singulated (see fig. 14C). In addition, one or a plurality of electronic components and the like may be mounted in the electronic component 30.

< electromagnetic wave shielding Member >)

The electromagnetic wave shielding member 1 is obtained by: after the electromagnetic wave shielding laminate is placed on the top surface of the electronic component 30 mounted on the substrate 20, the electronic component 30 and the substrate 20 are covered by thermocompression bonding. The electromagnetic wave shielding member 1 covers the substrate 20 from the upper surface of the electronic component 30, and covers the side surface of the stepped portion formed by mounting the electronic component 30 and at least a part of the substrate 20. In order to sufficiently exhibit the shielding effect, the electromagnetic wave shielding member 1 is preferably connected to a ground pattern (not shown) such as the ground pattern 22 exposed on the side surface or the upper surface of the substrate 20 and/or a connection wiring of the electronic component 30.

The electromagnetic wave shielding member 1 may be formed using a laminate for shielding electromagnetic waves. Fig. 4 is a schematic cross-sectional view of the electromagnetic wave shielding laminate. The electromagnetic wave shielding laminate 4 of embodiment A1 includes an electromagnetic wave shielding member 2 and a releasable cushioning member 3. In embodiment A1, the electromagnetic wave shielding member 2 includes a single-layer conductive adhesive layer 6. The conductive adhesive layer 6 is bonded to the electronic component 30 and the substrate 20 by thermocompression bonding to form the electromagnetic wave shielding layer 5. In embodiment A1, the electromagnetic wave shielding layer 5 functions as the electromagnetic wave shielding member 1.

The electromagnetic wave shielding member 2 may be formed of a laminate of two or more conductive adhesive layers as in embodiment A2 described later, a laminate of a conductive adhesive layer and a hard coat layer as in embodiment A3, or a laminate of an insulating adhesive layer and a conductive adhesive layer as in embodiment A4. The electromagnetic wave shielding member 1 obtained by thermocompression bonding the electromagnetic wave shielding member 2 includes a laminate of two or more electromagnetic wave shielding layers in embodiment A2, a laminate of an electromagnetic wave shielding layer and a hard coat layer in embodiment A3, and a laminate of an insulating coating layer and an electromagnetic wave shielding layer in embodiment A4. In this way, the electromagnetic wave shielding member may include a laminate of an electromagnetic wave shielding layer and another layer.

The electromagnetic wave shielding layer 5 includes a binder resin and a conductive filler. The conductive filler in the electromagnetic wave shielding layer 5 is continuously contacted and exhibits conductivity. From the viewpoint of improving the electromagnetic wave shielding property, the sheet resistance value of the electromagnetic wave shielding layer 5 is preferably 1 Ω/≡s or less.

The electromagnetic wave shielding member 1 has its surface layer according to JISB0601: the kurtosis measured in 2001 was set to 1 to 8. Kurtosis is an index of a roughness curve representing surface irregularities expressed by the formula (1), and represents flatness and kurtosis of a height distribution.

[ mathematics 1]

Here, L is a reference length. Rq is the root mean square height, and the change in height of the surface along one axis (x axis) is represented by the following expression (2) assuming Z (x).

[ math figure 2]

Kurtosis represents the average value of the fourth power of Z (x) in the reference length that is nondimensionalized by the fourth power of the root mean square height Rq. When the kurtosis is 3, the distribution of peaks representing the convex portions (or concave portions) is close to the normal distribution. As the kurtosis becomes larger by 3, the number of sharp convex portions (or concave portions) indicating steep points with respect to the reference height Rq increases, and as the kurtosis becomes smaller by 3, the number of steep sharp convex portions (or concave portions) becomes smaller.

The manufacturing method will be described later, but when the releasable cushioning member 3 is peeled off from the electromagnetic wave shielding member 1 after the electromagnetic wave shielding laminate 4 is thermally bonded to the substrate on which the electronic component 30 is mounted, the releasable cushioning member 3 of the half-cut groove 25 is peeled off while rubbing substantially perpendicularly. Since the releasable cushioning member 3 is easily broken by the anchor effect, a technique for suppressing the breakage thereof is required. As a result of diligent studies by the inventors, it was found that it is important to control the shape of the contact interface of the electromagnetic wave shielding member 1, and as the shape, the range of the kurtosis is suitable.

By setting the kurtosis to 8 or less, the releasable cushioning member 3 filled in the half-cut groove 25 of the electronic component 30 can be satisfactorily peeled off from the electromagnetic wave shielding member 1. The reason for this is considered to be: the degree of peak of the surface shape of the electromagnetic wave shielding member 1 becomes an appropriate degree of peak, and the release buffer member 3 and the electromagnetic wave shielding member 1 are easily peeled off. On the other hand, by setting the kurtosis of the surface layer of the electromagnetic wave shielding member 1 to 1 or more, steel wool resistance can be improved. As a result, the scratch resistance can be improved, and a highly reliable electronic component mounting substrate can be provided. The kurtosis of the electromagnetic wave shielding member is preferably in the range of 1.5 to 6.5, more preferably in the range of 2 to 4.

The root mean square height of the surface of the electromagnetic wave shielding member 1 is preferably in the range of 0.4 μm to 1.6 μm, more preferably 0.5 μm to 1.5 μm, and even more preferably 0.7 μm to 1.2 μm. In the present specification, the kurtosis and the root mean square height refer to values obtained by a method described in examples described later.

The kurtosis of the surface of the electromagnetic wave shielding member 1 can be adjusted by the manufacturing step of the electromagnetic wave shielding member 2 in the electromagnetic wave shielding laminate 4. The type of each component in the composition for forming the electromagnetic wave shielding member 1 before thermocompression bonding or the blending amount thereof can be adjusted. Details will be described later. Further, after the inventors have studied repeatedly, they have confirmed that by blending an amount of conductive filler that can function as an electromagnetic wave shielding layer, the kurtosis value does not substantially change before and after the reflow process, or even if it changes, the change amount is small.

Method for manufacturing electronic component mounting substrate

An example of a method for manufacturing the electronic component mounting substrate according to embodiment A1 will be described below with reference to fig. 5 to 8. However, the method for manufacturing the electronic component mounting substrate of the present invention is not limited to the following manufacturing method.

The method for manufacturing the electronic component mounting substrate 51 according to embodiment A1 includes: [a] a step of mounting the electronic component 30 on a substrate; [b] a step of mounting the electromagnetic wave shielding laminate 4 on the substrate 20 on which the electronic component 30 is mounted; [c] a step of joining the electromagnetic wave shielding member 1 by thermocompression bonding so as to follow at least a part of the exposed surface of the substrate and the side surface of the step portion formed by mounting the electronic component 30; [d] a step of peeling off the releasable cushioning member 3; and [ e ] singulating the electronic component mounting substrate 51. The following describes each step.

[a] A step of mounting an electronic component on a substrate:

first, the electronic component 30 is mounted on the substrate 20. For example, a semiconductor chip (not shown) is mounted on the substrate 20, the semiconductor chip is molded on the substrate 20 formed with the sealing resin, and the sealing resin and the substrate 20 are half-cut by dicing or the like so as to reach the inside of the substrate 20 from above between the electronic components 30. The electronic components 30 may be arranged in an array on the substrate 20 which has been half-cut in advance. Through these steps, for example, a substrate on which the electronic component 30 is mounted as shown in fig. 5 can be obtained. The electronic component 30 refers to an integrated product obtained by molding a semiconductor chip in the example of fig. 5, and refers to all electronic components protected by an insulator. The half-dicing is performed until reaching the inside of the substrate 20, and is performed until reaching the surface of the substrate 20. In addition, the entire substrate 20 may be cut at this stage. In this case, it is preferable that the substrate 20 is placed on the base with the adhesive tape so as not to cause positional displacement. The material of the sealing resin at the time of press molding is not particularly limited, but a thermosetting resin is generally used. The method for forming the sealing resin is not particularly limited, and examples thereof include: printing, lamination, transfer molding, compression, casting, and the like. The mounting method of the electronic component 30 may be arbitrarily changed by press molding.

[b] A step of mounting the electromagnetic wave shielding laminate on a substrate:

next, the electromagnetic wave shielding laminate 4 (see fig. 4) is prepared, which is melted by thermocompression bonding and covers the substrate 20 on which the electronic component 30 is mounted. The electromagnetic wave shielding laminate 4 is placed on the top surface of the electronic component 30 so that the conductive adhesive layer 6 of the electromagnetic wave shielding laminate 4 is on the electronic component 30 side. At this time, the electromagnetic wave shielding laminate 4 may be temporarily adhered to a part or the entire surface of the electronic component 30. The temporary adhesion means a state where the electric adhesive layer 6 is temporarily bonded so as to be in contact with at least a part of the upper surface of the electronic component 30, and the electric adhesive layer is fixed to the adherend in a B-stage. As the peel force, in the 90 DEG peel test, the peel force against Kapton (Kapton) 200 is preferably about 1N/cm to 5N/cm. As a method of temporary adhesion, there can be exemplified: the electromagnetic wave shielding laminate 4 is placed on the substrate 20 on which the electronic component 30 is mounted, and the whole surface or the end portion is gently thermally bonded by a heat source such as an iron to temporarily adhere the whole surface or the end portion. A plurality of electromagnetic wave shielding laminates 4 may be used in each region of the substrate 20 according to the manufacturing equipment, the size of the substrate 20, and the like. The electromagnetic wave shielding laminate 4 may be used for each electronic component 30. From the viewpoint of simplifying the manufacturing process, it is preferable to use one electromagnetic wave shielding laminate 4 for the entire plurality of electronic components 30 mounted on the substrate 20.

[c] A step of forming an electromagnetic wave shielding member:

then, the electromagnetic wave shielding laminate 4 is sandwiched between a pair of pressing substrates 40 on the substrate 20 on which the electronic component 30 is mounted, and thermocompression bonding is performed (see fig. 6). In the electromagnetic wave shielding laminate 4, the conductive adhesive layer 6 and the releasable buffer member 3 are melted by heat, and are pressed to extend along half-cut grooves provided in the manufacturing substrate, so as to cover the electronic component 30 and the substrate 20. The conductive adhesive layer 6 is bonded to the electronic component 30 or the substrate 20, and functions as the electromagnetic wave shielding layer 5 by thermocompression bonding. In embodiment A1, since the electromagnetic wave shielding member 1 includes the electromagnetic wave shielding layer 5 having a single layer, the electromagnetic wave shielding layer 5 is formed by thermocompression bonding the conductive adhesive layer 6. After the thermocompression bonding, a heat treatment may be further performed for the purpose of promoting thermal hardening or the like.

When the electromagnetic wave shielding laminate 4 is heated and pressed, a heat-softenable member, a buffer paper, or the like may be used between the electromagnetic wave shielding laminate 4 and the pressing substrate 40, as necessary.

The temperature and pressure of the thermocompression bonding step can be arbitrarily set independently within a range that can ensure the coating property of the conductive adhesive layer 6, in accordance with the heat resistance, durability, manufacturing equipment, or demand of the electronic component 30. The pressure range is not limited, but is preferably about 0.1MPa to 5.0MPa, more preferably 0.5MPa to 2.0 MPa. By releasing the pressing substrate 40, a manufacturing substrate as shown in fig. 7 can be obtained. In this way, the electromagnetic wave shielding member 1 covers the top and side surfaces of the electronic component and the exposed surface of the substrate.

The heating temperature in the thermocompression bonding step is preferably 100 ℃ or higher, more preferably 110 ℃ or higher, and still more preferably 120 ℃ or higher. The upper limit value depends on the heat resistance of the electronic component 30, but is preferably 220 ℃, more preferably 200 ℃, and even more preferably 180 ℃.

The thermocompression bonding time can be set corresponding to the heat resistance of the electronic component 30, the binder resin for the electromagnetic wave shielding member 1, the production steps, and the like. When a thermosetting resin is used as the binder resin precursor, the range is preferably about 1 minute to 2 hours. The thermocompression bonding time is more preferably about 1 minute to 1 hour. The thermosetting resin is cured by the thermocompression bonding. However, the thermosetting resin may be partially cured or substantially cured before thermocompression bonding as long as it is flowable.

The thickness of the conductive adhesive layer 6 is set to be capable of covering the top and side surfaces of the electronic component 30 and the exposed surface of the substrate 20, thereby forming the electromagnetic wave shielding layer 5. The fluidity of the binder resin precursor used and the distance and size between the electronic components 30 may vary, but it is generally preferably about 10 μm to 200 μm. This can improve the coating property with respect to the sealing resin and effectively exhibit the electromagnetic wave shielding property.

The releasable cushioning member 3 may be made of the following materials: the softening promotes the coating of the conductive adhesive layer 6, has a function of coating the top and side surfaces of the electronic component 30 and the exposed surface of the substrate 20, and is excellent in releasability in the peeling step. On the upper layer of the releasable cushioning member 3, a thermosetting member functioning as a cushioning material may be used as needed. In the example of embodiment A1, the ground pattern 22 formed in the substrate 20 is electrically connected to the electromagnetic wave shielding member 1 by the coating of the electromagnetic wave shielding member 1 (see fig. 7).

The conductive adhesive layer 6 contains a binder resin precursor and a conductive filler. As the binder resin precursor, there may be exemplified: thermoplastic resins, self-crosslinking resins, various reactive resins, and mixtures of curable resins and crosslinking agents. These may also be used in combination. When a thermoplastic resin is exclusively used as the binder resin precursor, the binder resin precursor may be said to be substantially the same as the binder resin in the sense that it does not have a crosslinked structure.

[d] A step of peeling off the release buffer member:

the releasable cushioning member 3 coated on the upper layer of the electromagnetic wave shielding member 1 is peeled off. Thus, an electronic component mounting substrate 51 having the electromagnetic wave shielding member 1 covering the electronic component 30 is obtained (see fig. 1 and 2). For example, the release buffer member 3 may be peeled off from the end portion by a manual force, or the outer surface of the release buffer member 3 may be sucked to peel off from the electromagnetic wave shielding member 1. In view of improving the yield by automation, peeling by suction is preferable.

[e] A step of performing singulation:

a cutting tool such as a dicing blade is used to cut the electronic component mounting substrate 51 in the X direction and the Y direction at positions corresponding to the individual product regions (see fig. 2). Through these steps, the singulated electronic component mounting substrate 51 in which the electronic component 30 is covered with the electromagnetic wave shielding member 1 and the ground pattern 22 formed on the substrate 20 is electrically connected to the electromagnetic wave shielding member 1 can be obtained. The method of dicing is not particularly limited as long as it can be singulated. The dicing may be performed from the substrate 20 side or the electromagnetic wave shielding laminate 4 side.

The peeling of the releasable cushioning member 3 in the step (d) is performed at an angle of, for example, 90 ° with respect to the substrate surface, and thus a large friction occurs at the contact interface between the releasable cushioning member 3 of the half-cut groove 25 and the electromagnetic wave shielding member 1 on the side surface of the half-cut groove 25. Therefore, it is technically difficult to cleanly peel the releasable cushioning member 3 from the electromagnetic wave shielding member 1, and as described with reference to fig. 20, the releasable cushioning member 3 may be broken into the half-cut grooves 25 to leave residues. Even after the singulation step, the residue remains depending on the position, and thus the reliability is lowered.

According to embodiment A1, the kurtosis of the electromagnetic wave shielding member 1 is set to 1 to 8, whereby in the step of forming the electromagnetic wave shielding member of the electronic component mounting substrate, after the laminate for electromagnetic wave shielding is thermocompression bonded to the electronic component mounting substrate, the releasability of the release buffer member to the electromagnetic wave shielding member can be improved. In addition, a part of the electromagnetic wave shielding member is peeled off together with the release buffer member, and a phenomenon that a part of the electromagnetic wave shielding member is damaged can be effectively suppressed. Therefore, the electronic component mounting substrate with high reliability can be provided. In addition, the degree of freedom in designing the height of the electronic components mounted on the substrate or the degree of freedom in designing the width of the gap between the electronic components can be increased.

Laminate for electromagnetic wave shielding

As described with reference to fig. 4, the electromagnetic wave shielding laminate of embodiment A1 includes two layers, namely, an electromagnetic wave shielding member 2 and a releasable cushioning member 3. In embodiment A1, the electromagnetic wave shielding member 2 includes a single-layer conductive adhesive layer 6. The conductive adhesive layer 6 is bonded to the electronic component 30 or the substrate 20 by a thermocompression bonding step, and functions as the electromagnetic wave shielding layer 5.

(conductive adhesive layer)

The conductive adhesive layer 6 is a layer formed of a resin composition containing a binder resin precursor and a conductive filler. The binder resin precursor contains at least a thermosetting resin. Examples of the thermosetting resin include thermoplastic resins, thermosetting resins, and actinic ray curable resins. The thermosetting resin and the actinic ray-curable resin generally have reactive functional groups. In the case of using a thermosetting resin, a curable compound or a thermosetting auxiliary agent may be used in combination. In the case of using a photohardenable resin, a photopolymerization initiator, a sensitizer, or the like may be used in combination. For the simplicity of the manufacturing process, it is preferably a thermosetting type which hardens at the time of thermocompression bonding.

In addition, a self-crosslinkable resin or a plurality of resins which crosslink with each other may be used. In addition, a thermoplastic resin may be mixed in addition to these resins. The blending components such as the resin and the curable compound may be used alone or in combination of two or more.

Further, partial crosslinking may be formed at the stage of the conductive adhesive layer 6 to be in the B-stage (semi-cured state). For example, the thermosetting resin may be semi-cured by reacting with a part of the curable compound.

Suitable examples of the thermosetting resin include: polyurethane resin, polycarbonate resin, styrene elastomer resin, phenoxy resin, polyurethane urea resin, polyimide resin, polyamide resin, polycarbonate imide resin, polyamide imide resin, epoxy ester resin, acrylic resin, polyester resin, polystyrene, polyester amide resin, and polyether ester resin. The thermosetting resin used under severe conditions in reflow soldering preferably contains at least one of an epoxy resin, an epoxy ester resin, a urethane urea resin, and a polyamide.

Among these resins, preferred are polyurethane resins, polycarbonate resins, styrene elastomer resins, phenoxy resins, polyamide resins, polyimide resins. In addition, a resin having a polycarbonate skeleton represented by the general formula (1) is preferable.

-R-O-CO-O- … general formula (1)

Wherein R is a divalent organic group.

The thermosetting resin may be used alone or in combination of two or more at an arbitrary ratio.

As the resin having a polycarbonate skeleton, in addition to a polycarbonate resin, there can be exemplified: a polyurethane resin, a polyamide resin and a polyimide resin having a polycarbonate skeleton. For example, the polycarbonate imide resin has a polyimide skeleton, which can improve heat resistance, insulation, and chemical resistance. On the other hand, by having a polycarbonate skeleton, flexibility and adhesion can be effectively improved.

As the polycarbonate urethane resin, a polycarbonate polyol based on one or two or more diols such as 1, 6-hexanediol, 3-methyl-1, 5-pentanediol, 1, 4-cyclohexanedimethanol, 1, 9-nonanediol, or 2-methyl-1, 8-octanediol can be used as the polyol component.

The thermosetting resin may have a plurality of functional groups usable for a crosslinking reaction by heating as the thermosetting resin. Examples of the functional group include: hydroxyl, phenolic hydroxyl, carboxyl, amino, epoxy, oxetanyl, oxazolinyl, oxazinyl, aziridinyl, thiol, isocyanate, blocked isocyanate, silanol, and the like.

The curable compound has a functional group that can crosslink with a reactive functional group of the thermosetting resin. The curable compound is preferably an epoxy compound, an acid anhydride group-containing compound, an isocyanate compound, a polycarbodiimide compound, an aziridine compound, an amine compound such as dicyandiamide compound and aromatic diamine compound, a phenol compound such as phenol novolac resin, an organometallic compound, or the like. The curable compound may be a resin. In this case, the distinction between the thermosetting resin and the curable compound is made by setting the thermosetting resin in a large amount and setting the curable compound in a small amount.

The curable compound is preferably contained in an amount of 1 to 70 parts by mass, more preferably 3 to 65 parts by mass, and even more preferably 3 to 60 parts by mass, per 100 parts by mass of the thermosetting resin. The curable compound may be used singly or in combination of two or more.

Suitable examples of thermoplastic resins can be exemplified by: polyesters, acrylic resins, polyethers, urethane resins, styrene elastomers, polycarbonates, butadiene rubbers, polyamides, ester amide resins, polyisoprene, and cellulose. Examples of the adhesion imparting resin include: rosin-based resins, terpene-based resins, alicyclic-based petroleum resins, aromatic-based petroleum resins, and the like. In addition, conductive polymers may be used. As the conductive polymer, there can be exemplified: polyethylene dioxythiophene, polyacetylene, polypyrrole, polythiophene and polyaniline. Suitable examples of thermoplastic resins can be exemplified by: polyesters, acrylic resins, polyethers, urethane resins, styrene elastomers, polycarbonates, butadiene rubbers, polyamides, ester amide resins, polyisoprene, and cellulose.

Examples of the conductive filler include: metal fillers, conductive ceramic particles, and mixtures of these. The metal filler may be exemplified by: metal powder of gold, silver, copper, nickel, etc., alloy powder of solder, etc., core-shell particles of silver-plated copper powder, gold-plated copper powder, silver-plated nickel powder, gold-plated nickel powder, etc. From the viewpoint of obtaining excellent conductive characteristics, a conductive filler containing silver is preferable. Silver-plated copper powder using silver-coated copper powder is particularly preferable from the viewpoint of cost.

The silver content in the silver-plated copper powder is preferably 3 to 20 mass%, more preferably 8 to 17 mass%, and even more preferably 10 to 15 mass% based on 100 mass% of the total of silver and copper. In the case of core-shell particles, the coating rate of the coating layer to the core is preferably 60% or more, more preferably 70% or more, and still more preferably 80% or more, on average. The core may be a nonmetallic material, but from the viewpoint of conductivity, a conductive material is preferable, and metal particles are more preferable.

As the conductive filler, an electromagnetic wave absorbing filler can also be used. Examples include: iron, fe-Ni alloy, fe-Co alloy, fe-Cr alloy, fe-Si alloy, fe-Al alloy, fe-Cr-Si alloy, fe-Cr-Al alloy, fe-Si-Al alloy, etc., ferrite-based materials such as Mg-Zn ferrite, mn-Mg ferrite, cu-Zn ferrite, mg-Mn-Sr ferrite, and Ni-Zn ferrite, and carbon fillers. The carbon filler may be exemplified by: acetylene black, ketjen black, furnace black, carbon fibers, particles comprising carbon nanotubes, graphene particles, graphite particles, and nanocarbon flakes.

Examples of the shape of the conductive filler used for the conductive adhesive layer include scaly particles, dendritic particles, needle-like particles, plate-like particles, grape-like particles, fibrous particles, and spherical particles, but from the viewpoint of adjusting the value of the desired kurtosis, a conductive filler containing needle-like particles and/or dendritic particles is preferable. Here, the needle-like shape means a shape having a long diameter three times or more the short diameter, and includes a spindle shape, a cylindrical shape, and the like in addition to the needle shape. The dendritic shape is a shape in which a plurality of branches extend two-dimensionally or three-dimensionally from a main axis of a rod shape when observed by an electron microscope (500 times to 20,000 times). In dendrites, the branches may also bend, or extend further from the branches.

Further, by containing scaly particles as the conductive filler, an electromagnetic wave shielding member excellent in coating property can be provided. Here, the scale-like shape also includes a sheet-like shape and a plate-like shape. The conductive filler may be in the form of a flake, an oval, a circle, or a slit around the microparticle.

The conductive fillers may be used alone or in combination. In the case of using the conductive filler in combination, from the viewpoint of obtaining a desired kurtosis and providing an electromagnetic wave shielding member with high reliability, a combination of scaly particles and dendritic particles, a combination of scaly particles and needle-like particles, and a combination of scaly particles, dendritic particles, and needle-like particles are preferable. Particularly preferred are combinations of scale-like particles and needle-like particles.

The content of the conductive filler in the solid content (100 mass%) of the thermosetting resin composition layer is preferably 40 to 85 mass%, more preferably 50 to 80 mass%.

The needle-like particles and/or dendritic particles are preferably 50 mass% or less relative to 100 mass% of the conductive filler in the conductive adhesive layer. More preferably 0.5 to 40% by mass, still more preferably 2 to 27% by mass. When the amount is 50 mass% or less, the releasability of the releasable cushioning member can be improved, and further, the scratch resistance can be effectively improved.

The average particle diameter D50 of the needle-like particles is preferably 2 μm to 100. Mu.m, more preferably 2 μm to 80. Mu.m. Further, it is more preferably 3 μm to 50. Mu.m, particularly preferably 5 μm to 20. Mu.m. The average particle diameter D50 of the dendritic particles is also preferably in the range of 2 μm to 100. Mu.m, more preferably 2 μm to 80. Mu.m. Further, it is more preferably 3 μm to 50. Mu.m, particularly preferably 5 μm to 20. Mu.m. The average particle diameter D50 of the flaky particles is preferably 2 μm to 100. Mu.m, more preferably 2 μm to 80. Mu.m. Further, it is more preferably 3 μm to 50. Mu.m, particularly preferably 5 μm to 20. Mu.m.

The average particle diameter D50 can be determined by laser diffraction/scattering. Specifically, for example, a particle size distribution measuring device LS 13320 (manufactured by Beckman Coulter) by a laser diffraction/scattering method is used, and the number obtained by measuring each conductive fine particle by a cyclone-type dry powder sample module is an average particle diameter of a diameter in which the cumulative value of the particles is 50%. The refractive index was measured at 1.6. The average particle diameter D50 of each particle in the electromagnetic wave shielding member 1 can be measured for 100 particle diameters using a scanning electron microscope (Scanning Electron Microscope, SEM) to determine the degree distribution. In the case of needle-shaped particles and dendritic particles, the longest length of each particle is used for the particle diameter.

By using dendritic particles and/or needle-like particles and scale-like particles in combination, the contact points of the conductive fillers with each other can be increased, and the shielding property can be improved. In addition, by using the dendritic particles and/or needle-like particles in combination, the contact area with the binder component can be increased, the kurtosis value can be easily adjusted, and further, the scratch resistance can be improved. Therefore, an electromagnetic wave shielding member with high reliability can be provided.

The composition constituting the conductive adhesive layer may further contain a colorant, a flame retardant, an inorganic additive, a lubricant, an anti-blocking agent, and the like.

Examples of the coloring agent include: organic pigments, carbon black, ultramarine blue, red iron oxide (red iron oxide), zinc oxide, titanium oxide, graphite, and the like. Wherein, by containing the black colorant, the printing visibility of the shielding layer is improved.

Examples of the flame retardant include: halogen-containing flame retardants, phosphorus-containing flame retardants, nitrogen-containing flame retardants, inorganic flame retardants, and the like.

Examples of the inorganic additive include: glass fibers, silica, talc, ceramics, and the like.

Examples of the lubricant include: fatty acid esters, hydrocarbon resins, paraffin waxes, higher fatty acids, fatty amides, fatty alcohols, metal soaps, modified silicones, and the like.

Examples of the anti-blocking agent include: calcium carbonate, silica, polymethylsilsesquioxane, aluminum silicate, and the like.

The conductive adhesive layer may be a layer having conductivity, in which the conductive filler is continuously contacted by thermocompression bonding, and may not necessarily have conductivity at a stage before thermocompression bonding. The conductive adhesive layer can be formed by mixing and stirring a composition containing the conductive filler and a binder resin precursor, applying the mixture to a releasable substrate, and drying the mixture. Further, the coating may be formed by a method of directly coating the releasable cushioning member 3 and drying the coated material.

After the coating liquid of the conductive adhesive layer is applied, the coating liquid is dried to form the conductive adhesive layer on the releasable substrate. The drying step is preferably carried out by heating (e.g., 80 ℃ C. To 120 ℃ C.). In order to adjust the kurtosis of the electromagnetic wave shielding member, it is preferable to dry the electromagnetic wave shielding member at 25 ℃ (room temperature) for 1 to 10 minutes at normal pressure after the application of the coating liquid and before the heating and drying. The drying time at 25℃before the heat drying (room temperature) is more preferably 2 to 6 minutes. The kurtosis value can be adjusted by setting the process of drying at room temperature prior to heat drying.

The influence of the viscosity of the coating liquid and the drying time at 25 ℃ before the heating and drying on the kurtosis of the electromagnetic wave shielding member 1 will be described with reference to the schematic diagram of fig. 9. As shown in the figure, a coating solution is applied to form the conductive adhesive layer 6 on the releasable substrate 15. A conductive adhesive layer 6P containing a solvent during drying can be obtained.

The drying time at 25 ℃ is set long for the conductive adhesive layer 6P during drying, and thus, as shown in fig. 9, the state in which the evaporation rate of the solvent is slow is intentionally prolonged, and thus, downward sinking of the binder resin precursor 10 can be promoted. On the other hand, by setting the drying time at 25 ℃ to be short, as shown in fig. 9, downward sinking of the binder resin precursor 10 is suppressed, and the conductive filler 11 is easily erected by performing heat drying at this stage. In addition, foaming accompanied by evaporation of the solvent tends to occur, and the surface tends to be cracked.

In order to set the kurtosis value of the electromagnetic wave shielding member 1 to 8, the solid content of the coating liquid is preferably set to 20% to 50%. In order to adjust the kurtosis of the electromagnetic wave shielding member, it is preferable that the viscosity of the coating liquid measured by the B-type viscometer is set to be in the range of 200mpa·s to 5000mpa·s. Further, in order to adjust the kurtosis of the electromagnetic wave shielding member, the thixotropic index of the coating liquid is preferably set to 1.2 to 2.0. The conductive filler 11 shown in fig. 9 and fig. 10 described later is a scaly particle, and the figure does not show a cross-sectional view of a cut portion in the thickness direction in a plan view of the main surface.

The kurtosis value also varies depending on the viscosity of the coating liquid used to form the conductive adhesive layer. The high viscosity of the coating liquid tends to inhibit the fluidity of the conductive filler. Therefore, when the viscosity is high, the conductive filler 11 tends to be random without being oriented. On the other hand, when the viscosity is low, the scale-like particles tend to be oriented such that the main surface is approximately opposite to the substrate surface. Further, when the drying time at 25 ℃ is shortened and the heating and drying are performed, the surface chap caused by foaming tends to be large when the viscosity is high, and the conductive filler tends to be easily moved in the longitudinal direction when the viscosity is low.

Thus, the kurtosis can be adjusted by adjusting the viscosity of the coating solution and the drying time at 25 ℃.

The kurtosis of the electromagnetic wave shielding member 1 may also be adjusted by the particle diameter of the dendritic particles and/or the needle-like particles. The influence of the particle diameter of the dendritic particles and/or needle-like particles on the kurtosis of the electromagnetic wave shielding member 1 will be described with reference to a schematic explanatory diagram of fig. 10. As in fig. 9, the conductive adhesive layer 6P during drying can be obtained by applying a coating liquid to form the conductive adhesive layer 6 on the releasable substrate 15. In fig. 10, the same members or components as those in fig. 9 are denoted by the same reference numerals. As shown in fig. 10, when the average particle diameter D50 of the dendritic particle 12, which is one type of conductive filler, is small, the kurtosis tends to decrease, whereas when the average particle diameter D50 of the dendritic particle 12 is large, the kurtosis tends to increase. Although depending on the thickness of the conductive adhesive layer 6, the average particle diameter D50 may be set to a value of 2 μm to 5 μm, for example, in the case where the kurtosis is to be reduced, the average particle diameter D50 may be set to a value of 20 μm to 50 μm, for example, in the case where the kurtosis is to be increased, and the average particle diameter D50 may be set to a value of more than 5 μm and less than 20 μm, for example, in the case where the kurtosis is to be intermediate between the two.

In order to adjust the kurtosis of the electromagnetic wave shielding member 1, it is preferable to apply a conductive adhesive composition for forming the conductive adhesive layer 6 as the outermost layer of the electromagnetic wave shielding member 2, and dry the composition, and then perform corona treatment or plasma treatment. The corona treatment is preferably performed with an irradiation amount of corona discharge electrons of 1W/m ² /min～1,000W/m ² Preferably 10W/m ² /min～100W/m ² /min。

The kurtosis of the electromagnetic wave shielding member 1 can be adjusted by increasing the amount of the needle-like or dendritic conductive filler added to the composition of the electromagnetic wave shielding member 2 before the thermocompression bonding. The kurtosis of the electromagnetic wave shielding member 1 can also be adjusted by the average particle diameter D50 and the average particle diameter D90 of the conductive filler.

In embodiment A1, the electromagnetic wave shielding member 2 includes a single-layer conductive adhesive layer 6, and therefore the releasable buffer member 3 is laminated on the conductive adhesive layer 6. As a lamination method, a lamination method and the like are used.

The releasable substrate is a substrate having releasability on one or both sides, and is a sheet having a tensile strain at break of less than 50% at 150 ℃. Examples of the releasable substrate include: polyethylene terephthalate, polyethylene naphthalate, polyvinyl fluoride, polyvinylidene fluoride, rigid polyvinyl chloride, polyvinylidene chloride, nylon, polyimide, polystyrene, polyvinyl alcohol, ethylene-vinyl alcohol copolymer, polycarbonate, polyacrylonitrile, polybutylene, soft polyvinyl chloride, plastic sheets of polyvinylidene fluoride, polyethylene, polypropylene, polyurethane resin, ethylene-vinyl acetate copolymer, polyvinyl acetate and the like, papers such as cellophane, woody paper, kraft paper, coated paper and the like, various nonwoven fabrics, synthetic papers, metal foils, composite films formed by combining these and the like.

(Release buffer Member)

The releasable buffer member is a sheet having releasability and functioning as a buffer material that promotes the following property of the conductive adhesive layer to the electronic component. That is, it is a layer that is peelable from the electromagnetic wave shielding member 1 after the thermocompression bonding step. It is preferable that the layer has a tensile fracture strain of 50% or more at 150 ℃ and melts at the time of thermocompression bonding.

The tensile fracture strain of the releasable substrate and the releasable cushioning member 3 was determined by the following method. The releasable substrate and the releasable cushioning member were cut into a size of 200mm in width by 600mm in length to obtain a measurement sample. A tensile TEST (TEST speed: 50 mm/min) was performed on the measurement sample using a small bench TEST machine EZ-TEST (manufactured by Shimadzu corporation) at a temperature of 25℃and a relative humidity of 50%. The tensile Strain at break (%) was calculated from the obtained S-S curve (Stress) -Strain (Strain) curve).

The releasable cushioning member 3 is preferably polyethylene, polypropylene, polyethersulfone, polyphenylene sulfide, polystyrene, polymethylpentene, polybutylene terephthalate, a cyclic olefin polymer, or silicone. Among them, polypropylene, polymethylpentene, polybutylene terephthalate, and silicone are more preferable from the viewpoint of both embedding property and releasability. The releasable cushioning member may be used in a single layer or in multiple layers. In the case of providing a plurality of layers, the same or different types of sheets may be stacked.

The method of laminating the releasable cushioning member 3 and the conductive adhesive layer 6 is not particularly limited, and a method of laminating these sheets may be mentioned. The releasable cushioning member 3 is preferably a material excellent in releasability, since it is finally released. The thickness of the releasable cushioning member is, for example, about 50 μm to 3mm, and more preferably about 100 μm to 1 mm.

Embodiment A2

Next, an example of an electronic component mounting board different from embodiment A1 will be described. The electronic component mounting substrate of embodiment A2 is similar to embodiment A1 in that the electromagnetic wave shielding member includes two electromagnetic wave shielding layers, unlike embodiment A1 in which an electromagnetic wave shielding member including a single electromagnetic wave shielding layer is used, and other basic configurations and manufacturing methods are similar to those of embodiment A1. Note that, the description repeated with embodiment A1 is omitted as appropriate.

As shown in fig. 11, the electromagnetic wave shielding member of embodiment A2 is formed using an electromagnetic wave shielding laminate 4a including an electromagnetic wave shielding member 2a and a release buffer member 3a, wherein the electromagnetic wave shielding member 2a is a conductive adhesive layer 6a including two layers, namely, a first conductive adhesive layer 6a1 and a second conductive adhesive layer 6 A2. The electromagnetic wave shielding laminate 4a is thermally bonded to cover the substrate on which the electronic component is mounted with an electromagnetic wave shielding member including a first electromagnetic wave shielding layer and a second electromagnetic wave shielding layer. By including two electromagnetic wave shielding layers, the degree of freedom in designing the electromagnetic wave shielding member can be improved. The second conductive adhesive layer 6a2 of the upper layer is manufactured by the same composition and procedure as in embodiment A1, and the first conductive adhesive layer 6A1 of the lower layer is not limited by the range of kurtosis, and may be designed to meet the requirements. For example, a filler such as fibrous particles or spherical particles may be used as the conductive filler contained in the first conductive adhesive layer 6a 1. In addition, the first conductive adhesive layer 6a1 may be used as an anisotropic conductive adhesive layer, and the second conductive adhesive layer 6a2 may be used as an isotropic conductive adhesive layer. The electromagnetic wave reflecting layer and the electromagnetic wave absorbing layer are preferably laminated. Three or more electromagnetic wave shielding layers may be laminated.

According to the electronic component mounting substrate of embodiment A2, the same effects as those of embodiment A1 can be obtained by using the electromagnetic wave shielding member including the electromagnetic wave shielding layer of two layers. In addition, by stacking two electromagnetic wave shielding layers, the degree of freedom in designing each layer can be improved, and thus there is an advantage in that an electromagnetic wave shielding member corresponding to the demand can be easily provided.

Embodiment A3

The electronic component mounting substrate of embodiment A3 is similar to the electromagnetic wave shielding member of embodiment A1 using an electromagnetic wave shielding layer including a single layer, in that the electromagnetic wave shielding member includes a laminate of an electromagnetic wave shielding layer and a hard coat layer.

As shown in fig. 12, the electromagnetic wave shielding member of embodiment A3 is formed using an electromagnetic wave shielding laminate 4b including an electromagnetic wave shielding member 2b and a release buffer member 3b, and the electromagnetic wave shielding member 2b is a laminate of a conductive adhesive layer 6b and an insulating resin layer 7 b. By thermocompression bonding the electromagnetic wave shielding laminate 4b, an electromagnetic wave shielding member including an electromagnetic wave shielding layer formed of the conductive adhesive layer 6b and a hard coat layer formed of the insulating resin layer 7b can be obtained on a substrate on which electronic components are mounted. The electromagnetic wave shielding member of embodiment A3 has a kurtosis of 1 to 8 when measured from the hard coat layer side.

The insulating resin layer 7b is a layer formed of a resin composition containing a binder resin precursor and an inorganic filler. The binder resin precursor contains at least a thermosetting resin. Examples of the thermosetting resin, and examples and preferable examples of the binder resin precursor are the same as those of the conductive adhesive layer of the electromagnetic wave shielding member described in embodiment A1. The binder resin precursor of the conductive adhesive layer and the insulating resin layer may be the same or different.

Unlike the conductive adhesive layer of embodiment A1, the inorganic filler does not have conductivity, but preferable characteristics of the inorganic filler, such as shape, amount of blended, D50, D90, and the like, are the same as those exemplified for the conductive filler. Examples of the inorganic filler include: inorganic compounds such as silica, alumina, magnesium hydroxide, barium sulfate, calcium carbonate, titanium oxide, zinc oxide, antimony trioxide, magnesium oxide, talc, kaolinite, mica, basic magnesium carbonate, sericite, montmorillonite, bentonite, and the like.

The thermosetting resin composition and the thermosetting resin composition layer may contain a colorant, a silane coupling agent, an ion scavenger, an antioxidant, an adhesion imparting resin, a plasticizer, an ultraviolet absorber, a leveling agent, a flame retardant, and the like, as necessary.

According to the electronic component mounting substrate of embodiment A3, by using the electromagnetic wave shielding member having the hard coat layer, in addition to the effects described in embodiment A1, an electromagnetic wave shielding member having more excellent durability due to the coating of the electromagnetic wave shielding layer with the hard coat layer can be provided.

Embodiment A4

The electronic component mounting substrate of embodiment A4 is different from embodiment A1 in which an electromagnetic wave shielding member including a single electromagnetic wave shielding layer is used in that the electromagnetic wave shielding member includes a laminate of an electromagnetic wave shielding layer and an insulating coating layer, and other basic configurations and manufacturing methods are the same as those of embodiment A1.

As shown in fig. 13, the electromagnetic wave shielding member of embodiment A4 is formed using an electromagnetic wave shielding laminate 4c including an electromagnetic wave shielding member 2c and a release buffer member 3c, wherein the electromagnetic wave shielding member 2c is a laminate of an insulating adhesive layer 8c and a conductive adhesive layer 6 c.

In embodiment A4, an example in which an electromagnetic wave shielding member is coated on a substrate on which a plurality of electronic components (for example, semiconductor packages) are formed without performing a singulation step or after completing singulation will be described. As shown in fig. 14A, the electromagnetic wave shielding laminate 4c is disposed above the substrate 20 on which the electronic component 30 having the solder ball 24 functioning as a connection terminal with the substrate 20 is mounted, and thermocompression bonding is performed from the side of the releasable buffer member 3c toward the substrate 20 on which the electronic component 30 is mounted (fig. 14B). Thereafter, the releasable buffer member 3C is peeled off, whereby the electronic component mounting substrate 53 in which the electromagnetic wave shielding member 1C is laminated in fig. 14C can be obtained.

The obtained electronic component mounting board 53 can be grounded from the upper surface of the electromagnetic wave shielding layer 5 c. Instead of the above method, a ground pattern may be provided on the substrate 20, and a conductive connector portion that is conductive with the electromagnetic wave shielding layer 5c may be provided on the ground pattern so as to pierce the insulating coating layer 9c so as to be conductive with the electromagnetic wave shielding layer 5 c.

In embodiment A4, an example of a method of manufacturing an electronic component mounting substrate that does not require a singulation step is described, but the electronic component mounting substrate shown in fig. 14C may be obtained by forming the unit cells of the product unit of fig. 14C in an array on a motherboard, placing the electromagnetic wave shielding laminate 4C thereon, and performing thermocompression bonding to form an electromagnetic wave shielding layer, and thereafter performing a singulation step.

The insulating adhesive layer 8c is a layer formed of a resin composition containing a binder resin precursor. The binder resin precursor contains at least a thermosetting resin. Examples of suitable binder resin precursors include the binder resin precursors of the electric adhesive layer described in embodiment A1. The binder resin precursors of the insulating adhesive layer 8c and the conductive adhesive layer 6c may be the same or different.

The thermosetting resin composition and the thermosetting resin composition layer may contain a colorant, a silane coupling agent, an ion scavenger, an antioxidant, an adhesion imparting resin, a plasticizer, an ultraviolet absorber, a leveling agent, a flame retardant, an inorganic filler, and the like, as necessary.

According to the electronic component mounting board of embodiment A4, by using the electromagnetic wave shielding member 1c having the insulating coating layer 9c, it is possible to prevent short-circuiting between the electromagnetic wave shielding member and the conductor portion such as the circuit or the electrode pattern other than the ground pattern, and to improve the bonding reliability between the electronic component and the electromagnetic wave shielding layer, in addition to the effects described in embodiment A1. In addition, the insulation reliability of the electronic component can be improved. Accordingly, an electromagnetic wave shielding member having excellent durability can be provided. As a result, an electronic component mounting substrate having excellent electromagnetic wave shielding properties can be provided. In addition, since the shield layer can be formed over the entire substrate at one time, the manufacturing process is simple, and the thickness can be significantly reduced as compared with a shield case or the like.

In embodiment A4, the insulating coating 9c is mainly used to strengthen the junction between the electronic component and the electromagnetic wave shielding member, but the insulating coating 9c may be used as a sealing material. When the insulating coating layer 9c is applied to the sealing material, there is an advantage that the sealing step of the semiconductor chip or the like and the coating of the electromagnetic wave shielding member can be performed in the same step. That is, the electromagnetic wave shielding member according to embodiment A4 can be applied to an electronic component that is not integrally covered with an insulator, and an insulating covering layer corresponding to a sealing material (molding resin) is obtained from an insulating adhesive layer. In this case, in order to cover the electromagnetic wave shielding member on the side surface of the electronic component, a pressing plate having concave portions corresponding to the electronic component (pressing plate having convex portions for embedding the electromagnetic wave shielding member in the gap of the electronic component) may be used.

Embodiment A5

The electronic component mounting substrate according to embodiment A5 uses the following laminate for electromagnetic wave shielding: the electromagnetic wave shielding layer is in direct contact with the ground pattern and is electrically conductive, and the conductive adhesive layer located in the inner layer of the laminate for electromagnetic wave shielding has a region exposed at the stage of the laminate. The exposed region is provided so that a conductive pattern such as a ground pattern formed on a substrate or the like is in contact with and in conduction with the electromagnetic wave shielding layer. Embodiment A5 is different from embodiment A4 in these respects, and other basic configurations and manufacturing methods are the same.

The laminated structure of the electromagnetic wave shielding laminate of embodiment A5 is the same as that of embodiment A4, but as shown in fig. 15A, the conductive adhesive layer 6d is exposed in the electromagnetic wave shielding laminate 4d at a position corresponding to the region covering the ground pattern 22 formed on the substrate 20. Specifically, in a plan view from the insulating adhesive layer 8d side, an exposed region of the conductive adhesive layer 6d is provided. In the example of the electromagnetic wave shielding laminate 4d of fig. 15A, the size of the insulating adhesive layer 8d is made smaller than the size of the electromagnetic wave shielding laminate 4d by one turn, and the conductive adhesive layer 6d is exposed in the edge region of the electromagnetic wave shielding laminate 4 d. With this configuration, as shown in fig. 15B and 15C, the electronic component mounting board 54 in which the ground pattern 22 and the electromagnetic wave shielding layer 5d are brought into contact and conducted by thermocompression bonding can be obtained. The position of the exposed portion of the conductive adhesive layer 6d of the electromagnetic wave shielding laminate 4d is not limited to the example of fig. 15A, and the exposed portion may be formed as an opening pattern.

[ [ embodiment B ] ]

A specific example of the electronic component mounting substrate according to embodiment B will be described below.

Embodiment B1

Electronic component mounting substrate

The electronic component mounting substrate of embodiment B1 uses the electromagnetic wave shielding member specified in embodiment B instead of the electromagnetic wave shielding member specified in embodiment a. The electronic component mounting board and the method for manufacturing the same according to embodiment B1 are similar to those according to embodiment A1, except for the point that the electromagnetic wave shielding member according to embodiment B is used and the points described otherwise. Therefore, redundant descriptions are appropriately omitted.

As a suitable example of the basic configuration of the electronic component mounting substrate of embodiment B1, the basic configuration of the electronic component mounting substrate of embodiment A1 described in fig. 1 to 10 can be exemplified. The features of embodiment B1 will be described below with reference to these drawings.

< electromagnetic wave shielding Member >)

As described in embodiment A1, the electromagnetic wave shielding member 1 of embodiment B1 is obtained by: after the electromagnetic wave shielding laminate is placed on the top surface of the electronic component 30 mounted on the substrate 20, the electronic component 30 and the substrate 20 are covered by thermocompression bonding. The coating form of the electromagnetic wave shielding member 1 is the same as that of embodiment A1, and therefore omitted.

The electromagnetic wave shielding member 1 of embodiment B1 can be formed using a laminate for shielding electromagnetic waves, as in embodiment A1. As shown in fig. 4, the electromagnetic wave shielding laminate 4 includes the electromagnetic wave shielding member 2 and the releasable cushioning member 3. As in embodiment A1, the electromagnetic wave shielding member 2 includes a single conductive adhesive layer 6. The conductive adhesive layer 6 is bonded to the electronic component 30 and the substrate 20 by thermocompression bonding to form the electromagnetic wave shielding layer 5. In embodiment B1, the electromagnetic wave shielding layer 5 functions as the electromagnetic wave shielding member 1.

As described in embodiment A1, the electromagnetic wave shielding member 2 of embodiment B1 may be formed of a laminate of two or more conductive adhesive layers, a laminate of a conductive adhesive layer and a hard coat layer, a laminate of an insulating adhesive layer and a conductive adhesive layer, or the like.

The electromagnetic wave shielding layer 5 of embodiment B1 includes a binder resin and a conductive filler. The conductive filler in the electromagnetic wave shielding layer 5 is continuously contacted and exhibits conductivity. From the viewpoint of improving the electromagnetic wave shielding property, the sheet resistance value of the electromagnetic wave shielding layer 5 is preferably 1 Ω/≡s or less.

The electromagnetic wave shielding member 1 of embodiment B1 has a press-in elastic modulus of 1GPa to 10GPa. By setting the press-in elastic modulus to the above range, local minute deformation of the electromagnetic wave shielding member 1 with respect to stress can be suppressed, and as a result, damage of the electromagnetic wave shielding member 1 due to burr generation can be effectively suppressed. Further, PCT resistance is excellent, and therefore, a decrease in adhesion after the reflow step can be effectively suppressed. Therefore, a high-quality electronic component mounting substrate can be provided.

By setting the press-in elastic modulus of the electromagnetic wave shielding member 1 of embodiment B1 to 1GPa or more, the deformation of the electromagnetic wave shielding member 1 can be suppressed against the stress received from the cutting tool such as the cutting blade in the cutting step, and burrs of the electromagnetic wave shielding member 1 generated in the manufacturing step can be effectively suppressed (see (ii) of fig. 21). The burrs described in the present specification mean the rolling of the electromagnetic wave shielding member with the cut surface of the electromagnetic wave shielding member 1 as a base point.

The press-in elastic modulus of the electromagnetic wave shielding member 1 of embodiment B1 can be adjusted by the composition of the electromagnetic wave shielding member 2 in the electromagnetic wave shielding laminate 4 described later before thermocompression bonding. More specifically, the amount of the binder resin precursor in the composition for forming the electromagnetic wave shielding member 2 before thermocompression bonding of the electromagnetic wave shielding member 1, the amount of each component to be blended, and the like can be adjusted. Specifically, the greater the filler content, the greater the indentation elastic modulus tends to be. In addition, by increasing the number of functional groups of the resin used as the binder resin precursor or the content of the curable compound, the indentation elastic modulus tends to be also increased. In addition, the higher the hardness of the binder resin, the greater the indentation elastic modulus tends to be. Therefore, it is desirable to appropriately use the kind of the binder resin precursor used for forming the binder resin, or the crosslinking density of the binder resin. The crosslink density can be easily adjusted by the kind of resin and the number of functional groups of the curable compound.

The indentation elastic modulus is also considered to be a young's modulus indicating properties corresponding to deformation of the material caused by external stress. The "indentation elastic modulus" in the present specification refers to a value obtained by the measurement method and measurement conditions described in examples described below.

The electromagnetic wave shielding member 1 of embodiment B1 has a press-in elastic modulus in a more preferable range of more than 1.5GPa and 8GPa or less, and in a more preferable range of 2GPa or more and 7.4GPa or less.

The film thickness of the electromagnetic wave shielding member 1 of embodiment B1 can be appropriately selected according to the application. In applications requiring thickness reduction, the thickness T1 and the thickness T2 of the electromagnetic wave shielding member 1 covering the upper surface of the electronic component are set to be, for example, about 10 μm to 200 μm.

Product information is sometimes imprinted on the electronic component 30. In this case, there are a method of forming the electromagnetic wave shielding member 1 after the electronic component 30 is printed, and a method of forming the electromagnetic wave shielding member 1 after the electronic component 30 is printed. In either case, maintaining a uniform surface with high barrier properties requires good visibility of the imprint. From the viewpoint of satisfying both characteristics, the film thickness T1 of the electromagnetic wave shielding member is preferably 10 μm or more, more preferably 20 μm or more. In the latter imprint method, that is, in the case of imprinting on the electromagnetic wave shielding member, there is no upper limit in the film thickness of the electromagnetic wave shielding member. On the other hand, in the former imprint method, that is, in the case of directly imprinting an electronic component, in order to maintain the visibility of the imprint, the upper limit of the film thickness T1 of the electromagnetic wave shielding member is preferably 50 μm or less, more preferably 30 μm or less.

The water contact angle of the surface layer of the electromagnetic wave shielding member 1 of embodiment B1 is preferably 70 ° to 110 °. By setting the range to this, damage to the electromagnetic wave shielding layer at the time of the manufacturing step can be more effectively suppressed. In addition, when the release buffer member filled in the groove-like recess formed in the half-cut groove 25 of the electronic component 30 is peeled off from the electromagnetic wave shielding member 1, the occurrence of burrs can be suppressed. The water contact angle of the electromagnetic wave shielding member is more preferably in the range of 75 ° to 105 °, and still more preferably in the range of 80 ° to 100 °. The water contact angle of the electromagnetic wave shielding member may be adjusted in the composition for forming an electromagnetic wave shielding member by the addition amount of the surface adjusting agent. As the amount of the surface conditioner added to the electromagnetic wave shielding member 1 increases, the value of the water contact angle tends to increase.

In order to further improve the pressure cooker test (hereinafter also referred to as PCT) performance, it is preferable that the marshi hardness of the electromagnetic wave shielding member 1 of embodiment B1 is 50N/mm ² The above range. The press-in elastic modulus of the electromagnetic wave shielding member 1 was set to 1GPaIn the range of 10GPa, further combined with 50N/mm ² The hardness of the mars above, and thus the adhesion after the pressure cooker test became more excellent. As a result, the electromagnetic wave shielding member 1 excellent in adhesion even after reflow soldering can be provided. The Martin hardness is more preferably 60N/mm ² The above, more preferably 70N/mm ² The above.

The mahalanobis hardness can be adjusted by the hardness of the conductive filler and the binder component. The hardness of the binder component is mainly determined by the hardness of the cured product of the thermosetting resin and the curable compound. Specifically, there is a tendency that the mahalanobis hardness increases due to the addition of the scale-like particles, and the mahalanobis hardness decreases due to the addition of the spherical dendritic particles. In addition, when the amount of the conductive filler increases, the mahalanobis hardness tends to increase. In addition, the higher the hardness of the resin after hardening, the harder the mahalanobis hardness becomes.

The manufacturing method will be described later, but in terms of improving the releasability when the release buffer member is peeled from the electromagnetic wave shielding member 1 after the electromagnetic wave shielding laminate 4 is thermally bonded to the substrate 20 on which the electronic component 30 is mounted, it is preferable that the surface layer of the electromagnetic wave shielding member 1 is subjected to JISB0601: the kurtosis measured in 2001 was 8 or less. It is considered that when the peak level of the surface shape of the electromagnetic wave shielding member 1 is 8 or less, the peak level becomes appropriate, and the release buffer member 3 and the electromagnetic wave shielding member 1 are easily peeled off. As a result, the phenomenon that the releasable cushioning member 3 breaks in the half-cut groove 25 of the gap between the electronic components and remains as a residue can be effectively suppressed. In the present specification, the term "chips" refers to a releasable cushioning member that breaks when the releasable cushioning member is peeled off and remains in a groove that is a gap between electronic components.

In addition, from the viewpoint of improving scratch resistance, it is preferable that the kurtosis of the electromagnetic wave shielding member 1 of embodiment B1 is 1 or more. By setting to 1 or more, steel wool resistance can be improved. The kurtosis of the electromagnetic wave shielding member is more preferably in the range of 1.5 to 6.5, and still more preferably in the range of 2 to 4. The method of adjusting the kurtosis of the surface of the electromagnetic wave shielding member 1 is as described in embodiment A1.

The root mean square height Rq of the surface of the electromagnetic wave shielding member 1 according to embodiment B1 is preferably in the range of 0.4 μm to 1.6 μm, more preferably 0.5 μm to 1.5 μm, and even more preferably 0.7 μm to 1.2 μm. In the present specification, the kurtosis and the root mean square height refer to values obtained by a method described in examples described later.

Method for manufacturing electronic component mounting substrate

The method of manufacturing the electromagnetic wave shielding member 1 of embodiment B1 is basically the same as the method of manufacturing the electromagnetic wave shielding member 1 of embodiment A1. In the step (c), the binder resin constituting the electromagnetic wave shielding layer 5 is preferably structured with a three-dimensional crosslinked structure in terms of improving the tape adhesiveness after PCT. When dicing is performed in the singulation step of step (e), high-pressure water washing may be performed to cool frictional heat generated by dicing and wash away dicing dust generated by dicing. In the electronic component mounting substrate 51 according to embodiment B, the peeling of the electromagnetic wave shielding member 1 due to the impact of high-pressure water washing can be significantly improved by setting the press-in elastic modulus to 1GPa to 10 GPa.

Laminate for electromagnetic wave shielding

As described with reference to fig. 4, the electromagnetic wave shielding laminate of embodiment B1 includes two layers, that is, the electromagnetic wave shielding member 2 and the releasable cushioning member 3. In embodiment B1, the electromagnetic wave shielding member 2 includes a single-layer conductive adhesive layer 6. The conductive adhesive layer 6 is bonded to the electronic component 30 or the substrate 20 by a thermocompression bonding step, and functions as the electromagnetic wave shielding layer 5.

(conductive adhesive layer)

The same applies to the thermosetting resin as in embodiment A1. The thermosetting resin may have a plurality of functional groups usable for a crosslinking reaction by heating as the thermosetting resin. Specific examples of the functional group are the same as in embodiment A1.

The curable compound has a functional group that can crosslink with a reactive functional group of the thermosetting resin. By crosslinking, the adhesion can be further enhanced and the water resistance can be improved. The curable compound is preferably an epoxy compound, an acid anhydride group-containing compound, an isocyanate compound, a polycarbodiimide compound, an aziridine compound, an amine compound such as dicyandiamide compound and aromatic diamine compound, a phenol compound such as phenol novolac resin, an organometallic compound, or the like. The curable compound may be a resin. In this case, the distinction between the thermosetting resin and the curable compound is made by setting the thermosetting resin in a large amount and setting the curable compound in a small amount.

The epoxy compound is a compound having two or more epoxy groups in 1 molecule. The epoxy compound may be in the form of liquid or solid. Examples of the epoxy compound include glycidyl ether type epoxy compounds, glycidyl amine type epoxy compounds, glycidyl ester type epoxy compounds, and cyclic aliphatic (alicyclic) epoxy compounds.

Examples of the glycidyl ether type epoxy compound include: bisphenol A type epoxy compound, bisphenol F type epoxy compound, bisphenol S type epoxy compound, bisphenol AD type epoxy compound, cresol novolak type epoxy compound, phenol novolak type epoxy compound, alpha-naphthol novolak type epoxy compound, bisphenol A type novolak type epoxy compound, dicyclopentadiene type epoxy compound, tetrabromobisphenol A type epoxy compound, brominated phenol novolak type epoxy compound, tris (glycidoxyphenyl) methane, tetrakis (glycidoxyphenyl) ethane, and the like.

Examples of the glycidylamine-type epoxy compound include: tetraglycidyl diaminodiphenylmethane, triglycidyl para-aminophenol, triglycidyl meta-aminophenol, tetraglycidyl meta-xylylenediamine, and the like.

Examples of the glycidyl ester type epoxy compound include: diglycidyl phthalate, diglycidyl hexahydrophthalate, diglycidyl tetrahydrophthalate, and the like.

Examples of the cyclic aliphatic (alicyclic) epoxy compound include: epoxycyclohexylmethyl-epoxycyclohexane carboxylate, bis (epoxycyclohexyl) adipate, and the like. In addition, a liquid epoxy compound can be suitably used.

The imidazole compound includes imidazole compounds such as 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 2, 4-dimethylimidazole, and 2-phenylimidazole, and further includes latent hardening accelerators which are insoluble in solvents by reacting the imidazole compound with an epoxy resin, and which improve storage stability by encapsulating the imidazole compound in microcapsules, and among these, the latent hardening accelerators are preferable from the viewpoint of starting hardening after heat-melting of the conductive adhesive layer.

The structure and molecular weight of the curable compound can be appropriately designed according to the application. In order to effectively suppress burrs by adjusting the press-fit elastic modulus to a range of 1GPa to 10GPa, it is preferable to use two or more curable compounds having different molecular weights. The use of the first curable compound and the second curable compound also has an effect of increasing the tensile strain at break of the electromagnetic wave shielding layer.

The curable compound is preferably contained in an amount of 1 to 70 parts by mass, more preferably 3 to 65 parts by mass, and even more preferably 3 to 60 parts by mass, per 100 parts by mass of the thermosetting resin. When the first curable compound and the second curable compound are used in combination, the first curable compound is preferably contained in an amount of 5 to 50 parts by mass, more preferably 10 to 40 parts by mass, and even more preferably 20 to 30 parts by mass, based on 100 parts by mass of the thermosetting resin. On the other hand, the second curable compound is preferably contained in an amount of 0 to 40 parts by mass, more preferably 5 to 30 parts by mass, and even more preferably 10 to 20 parts by mass, based on 100 parts by mass of the thermosetting resin.

The preferable examples of the thermoplastic resin are the same as those of embodiment A1. Examples of the conductive filler include a metal filler, conductive ceramic particles, and a mixture of these. The preferable examples of the metal filler are the same as those of embodiment A1. The silver content of the silver-plated copper powder is also the same as that of embodiment A1. Further, in the case of core-shell particles, the coating rate of the coating layer to the core is in the same suitable range as in embodiment A1. The core may be a nonmetallic material, but from the viewpoint of conductivity, a conductive material is preferable, and metal particles are more preferable.

As the conductive filler, an electromagnetic wave absorbing filler may be used, and specific examples thereof are the same as those of embodiment A1.

Examples of the shape of the conductive filler used for the conductive adhesive layer include scaly particles, dendritic particles, needle-like particles, plate-like particles, grape-like particles, fibrous particles, and spherical particles. From the viewpoint of adjusting the numerical value of kurtosis, a conductive filler containing needle-like particles and/or dendritic particles is preferable. Here, the needle-like shape means a shape having a long diameter three times or more the short diameter, and includes a spindle shape, a cylindrical shape, and the like in addition to the needle shape. The dendritic shape is a shape in which a plurality of branches extend two-dimensionally or three-dimensionally from a main axis of a rod shape when observed by an electron microscope (500 times to 20,000 times). In dendrites, the branches may also bend, or extend further from the branches.

Further, by containing scaly particles as the conductive filler, an electromagnetic wave shielding member excellent in coating property can be provided. Here, the scale-like shape also includes a sheet-like shape and a plate-like shape. The conductive filler may be in the form of a flake, an oval, a circle, or a slit around the microparticle. The scale-like particles tend to have a large mahalanobis hardness, and the spherical dendritic particles tend to have a low mahalans hardness. In addition, when the amount of the conductive filler increases, the mahalanobis hardness tends to increase. In addition, the higher the hardness of the resin after hardening, the harder the mahalanobis hardness becomes.

The conductive fillers may be used alone or in combination. Examples may include: a combination of scale-like particles and spherical particles; a combination of scale-like particles and dendritic particles; a combination of scale-like particles and needle-like particles; a combination of scaly particles, dendritic particles, and acicular particles. Further, spherical particles of nanometer size may be used in combination of these.

In addition, by using dendritic particles and/or needle-shaped particles in combination, contact points of the conductive fillers with each other can be increased, and shielding characteristics can be improved. In addition, by using dendritic particles and/or needle-like particles in combination, the contact area with the binder component can be increased, and thus a high-quality electromagnetic wave shielding member can be provided.

The electroconductive adhesive layer preferably contains 50 mass% or less of needle-like particles and/or dendritic particles, based on 100 mass% of the electroconductive filler. More preferably 0.5 to 40% by mass, still more preferably 1 to 35% by mass, and particularly preferably 1 to 30% by mass. By containing 50 mass% or less, an electromagnetic wave shielding member more excellent in scratch resistance can be provided.

The average particle diameter D50 of the flaky particles is preferably 2 μm to 100. Mu.m. The scale-like particles may be mixed with a nano-sized conductive filler.

The average particle diameter D50 of the needle-like particles is preferably 2 μm to 100. Mu.m, more preferably 2 μm to 80. Mu.m. Further, it is more preferably 3 μm to 50. Mu.m, particularly preferably 5 μm to 20. Mu.m. The average particle diameter D50 of the dendritic particles is also preferably in the range of 2 μm to 100. Mu.m, more preferably 2 μm to 80. Mu.m. Further, it is more preferably 3 μm to 50. Mu.m, particularly preferably 5 μm to 20. Mu.m. The average particle diameter D50 of the flaky particles is preferably 2 μm to 100. Mu.m, more preferably 2 μm to 80. Mu.m. Further, it is more preferably 3 μm to 50. Mu.m, particularly preferably 5 μm to 20. Mu.m. The use of the flake particles and the dendritic particles in combination makes it possible to optimize the surface glossiness, and to improve the printing visibility when characters are directly printed on the electromagnetic wave shielding layer.

The method for measuring the average particle diameter D50 and the like are as described in embodiment A1. The composition constituting the conductive adhesive layer may contain additives (coloring agent, flame retardant, inorganic additive, lubricant, anti-caking agent, etc.) described in embodiment A1. Specific examples of the additives are the same as those in embodiment A1.

After the coating liquid of the conductive adhesive layer is applied, the coating liquid is dried to form the conductive adhesive layer on the releasable substrate. The drying step is preferably carried out by heating (e.g., 80 ℃ C. To 120 ℃ C.). In terms of adjusting the kurtosis of the electromagnetic wave shielding member, it is preferable to perform drying at 25 ℃ (room temperature) and normal pressure for 1 to 10 minutes after the application of the coating liquid and before the heating and drying. The drying time at 25℃before the heat drying (room temperature) is more preferably 2 to 6 minutes. The kurtosis value can be adjusted by setting the process of drying at room temperature prior to heat drying.

The influence of the viscosity of the coating liquid and the drying time at 25 ℃ before the heating and drying on the kurtosis of the electromagnetic wave shielding member 1 will be described with reference to the schematic diagram of fig. 9. As shown in the figure, a coating solution is applied to form the conductive adhesive layer 6 on the releasable substrate 15. A conductive adhesive layer 6P containing a solvent during drying can be obtained. The electromagnetic wave shielding laminate can be produced by the same method as the electromagnetic wave shielding laminate of embodiment A1.

Embodiment B2

Next, an example of an electronic component mounting board different from embodiment B1 will be described. The electronic component mounting substrate of embodiment B2 is similar to embodiment B1 in that the electromagnetic wave shielding member includes two electromagnetic wave shielding layers, unlike embodiment B1 in which an electromagnetic wave shielding member including a single electromagnetic wave shielding layer is used, and other basic configurations and manufacturing methods are similar to those of embodiment B1. The basic configuration and manufacturing method are the same as those of embodiment A2, except that the electromagnetic wave shielding member of embodiment B is used instead of the electromagnetic wave shielding member of embodiment a, and the points described otherwise. Duplicate descriptions are omitted as appropriate.

As shown in fig. 11, the electromagnetic wave shielding member of embodiment B2 is formed using an electromagnetic wave shielding laminate 4a including an electromagnetic wave shielding member 2a and a release buffer member 3a, wherein the electromagnetic wave shielding member 2a is a conductive adhesive layer 6a including two layers, namely, a first conductive adhesive layer 6a1 and a second conductive adhesive layer 6a 2. The electromagnetic wave shielding laminate 4a is thermally bonded to cover the substrate 20 on which the electronic component 30 is mounted with an electromagnetic wave shielding member including a first electromagnetic wave shielding layer and a second electromagnetic wave shielding layer. In the electromagnetic wave shielding member as a laminate of the two electromagnetic wave shielding layers, the press-in elastic modulus when measured from the surface layer side is set to 1GPa to 10GPa. By including two electromagnetic wave shielding layers, the degree of freedom in designing the electromagnetic wave shielding member can be improved. For example, a laminate of an electromagnetic wave reflecting layer and an electromagnetic wave absorbing layer can be exemplified. Three or more electromagnetic wave shielding layers may be laminated.

According to the electronic component mounting substrate of embodiment B2, the same effects as those of embodiment B1 can be obtained by using the electromagnetic wave shielding member including the electromagnetic wave shielding layer of two layers. In addition, by stacking two electromagnetic wave shielding layers, the degree of freedom in designing each layer can be improved, and thus there is an advantage in that an electromagnetic wave shielding member corresponding to the demand can be easily provided.

Embodiment B3 to embodiment B5

The electronic component mounting board and the method for manufacturing the same according to embodiments B3 to B5 are described below with reference to embodiments A3 to A5 except that the electromagnetic wave shielding member according to embodiment B (including descriptions of embodiments B1 and B2) is used instead of the electromagnetic wave shielding member according to embodiment a. Therefore, the description of the electronic component mounting substrate and the manufacturing method thereof according to embodiments B3 to B5 will be omitted.

[ [ embodiment C ] ]

A specific example of the electronic component mounting substrate according to embodiment C will be described below.

Embodiment C1

Electronic component mounting substrate

The electronic component mounting substrate of embodiment C1 uses the electromagnetic wave shielding member of embodiment C instead of the electromagnetic wave shielding member of embodiment a. The electronic component mounting board and the manufacturing method of embodiment C1 are basically the same as those of embodiment A1, except for the electromagnetic wave shielding member and the points described in embodiment C1. Therefore, the same description is omitted.

As a suitable example of the basic configuration of the electronic component mounting substrate of embodiment C1, the basic configuration of the electronic component mounting substrate of embodiment A1 described in fig. 1 to 10 can be exemplified. The features of embodiment C1 will be described below with reference to these drawings.

< electromagnetic wave shielding Member >)

As described in embodiment A1, the electromagnetic wave shielding member 1 of embodiment C1 is obtained by: after the electromagnetic wave shielding laminate is placed on the top surface of the electronic component 30 mounted on the substrate 20, the electronic component 30 and the substrate 20 are covered by thermocompression bonding. The coating form of the electromagnetic wave shielding member 1 is the same as that of embodiment A1, and therefore omitted.

As in embodiment A1, the electromagnetic wave shielding member 1 of embodiment C1 can be formed using a laminate for electromagnetic wave shielding. As shown in fig. 4, the electromagnetic wave shielding laminate 4 includes the electromagnetic wave shielding member 2 and the releasable cushioning member 3. As in embodiment A1, the electromagnetic wave shielding member 2 includes a single conductive adhesive layer 6. The conductive adhesive layer 6 is bonded to the electronic component 30 and the substrate 20 by thermocompression bonding to form the electromagnetic wave shielding layer 5. The electromagnetic wave shielding layer 5 functions as the electromagnetic wave shielding member 1.

As described in embodiment A1, the electromagnetic wave shielding member 2 of embodiment C1 may be formed of a laminate of two or more conductive adhesive layers, a laminate of a conductive adhesive layer and a hard coat layer, a laminate of an insulating adhesive layer and a conductive adhesive layer, or the like.

The electromagnetic wave shielding layer 5 of embodiment C1 includes a binder resin and a conductive filler. The conductive filler in the electromagnetic wave shielding layer 5 is continuously contacted and exhibits conductivity. From the viewpoint of improving the electromagnetic wave shielding property, the sheet resistance value of the electromagnetic wave shielding layer 5 is preferably 1 Ω/≡s or less.

The electromagnetic wave shielding member 1 has its surface layer according to JISB0601: the root mean square height Rq measured in 2001 is set to 0.05 μm or more and less than 0.3. Mu.m. The root mean square height Rq is a parameter corresponding to the standard deviation of the distance from the average surface, and is expressed by the following equation (2) assuming that the height change of the surface along one axis (x axis) is Z (x) corresponding to the standard deviation of the height. L is the reference length.

[ math 3]

As a result of diligent studies, the inventors of the present invention have found that by setting the root mean square height Rq to a range of 0.05 μm or more and less than 0.3 μm as the shape of the contact interface of the surface layer of the electromagnetic wave shielding member 1, cracking of the electromagnetic wave shielding member can be effectively prevented against the cold and hot cycle test (-50 ℃ to 125 ℃) and an electromagnetic wave shielding member excellent in coating property can be provided. Therefore, the electronic component mounting substrate with high reliability can be provided. The electronic component mounting board of the present embodiment is particularly suitable as an electronic component mounting board (for example, an electronic component mounting board mounted on an automobile) for electronic equipment that is used in a severe environment with a large temperature difference.

In the manufacturing step of the electronic component mounting substrate, the following steps may be performed: the electromagnetic wave shielding member is fixed to the dicing table via the dicing tape, and is singulated from the substrate side into respective products while maintaining the state. In this case, the dicing tape and the electromagnetic wave shielding member are peeled off after the completion of the step, but in this case, there is a case where a floating (poor adhesion of a portion) or peeling occurs between the electromagnetic wave shielding member and the electronic component. According to the electronic component mounting substrate of the present embodiment, the root mean square height Rq of the surface layer of the electromagnetic wave shielding member is set to 0.05 μm or more and less than 0.3 μm, so that excellent effects can be exerted on the above-mentioned problems.

According to the present embodiment, since the electromagnetic wave shielding layer having excellent heat and cold cycle resistance and adhesion to electronic parts after the singulation step and excellent coating property is provided, the electronic part mounting substrate having high reliability can be provided.

In addition, the electronic component mounting substrate may be subjected to a high temperature treatment such as a reflow step, but at this time, substances in the electronic component mounting substrate, for example, components of a solder flux may adhere to the electromagnetic wave shielding member 101. In order to solve the above problems, the root mean square height Rq of the surface layer of the electromagnetic wave shielding member according to embodiment C1 is 0.05 μm or more and less than 0.3 μm, whereby a more excellent effect can be exhibited. That is, there is an effect of effectively preventing the adhesion of substances on the electromagnetic wave shielding member 1. The reason for this is considered to be: the surface roughness of the electromagnetic wave shielding member 1 is made to be appropriate roughness, and substances such as components of the solder flux can be effectively prevented from remaining on the surface of the roughness.

The root mean square height Rq of the electromagnetic wave shielding member of embodiment C1 is preferably in the range of 0.05 μm to 0.29 μm, more preferably in the range of 0.05 μm to 0.27 μm, and particularly preferably in the range of 0.05 μm to 0.25 μm, from the viewpoint of achieving excellent coating properties for the above-mentioned cold and hot cycle test.

The root mean square slope Rdq of the surface layer of the electromagnetic wave shielding member 1 according to embodiment C1 is preferably in the range of 0.05 to 0.4, more preferably 0.05 to 0.37, and even more preferably 0.1 to 0.35. In the present specification, the root mean square height Rq and the root mean square slope Rdq are in accordance with jis b0601:2001, and refers to a value obtained by a method described in examples described below. By setting the root mean square slope Rdq to 0.05 to 0.4, the stain resistance and the crack can be more effectively improved.

The root mean square slope Rdq is the root mean square of the local slope dz/dx in the reference length, and is expressed by the following expression (3).

[ mathematics 4]

Rdq can be calculated by processing a surface shape obtained by any one of an optical microscope, a laser microscope, and an electron microscope with analysis software. Rdq is a parameter expressing the steepness of the irregularities of the surface. As parameters expressing the properties of the surface, arithmetic average height Ra, maximum height Rz, and maximum height Rq may be used, but these are parameters indicating only the height of the irregularities, and are not suitable for accurately indicating the state of the surface.

The larger the value of Rdq, the steeper the surface irregularities become. That is, the degree of surface roughness sharpness can be determined by the value of Rdq.

The root mean square height Rq and the root mean square slope Rdq of the surface of the electromagnetic wave shielding member 1 of embodiment C1 can be adjusted by the manufacturing steps of the electromagnetic wave shielding member 2 in the electromagnetic wave shielding laminate 4. The amount of the composition for forming the electromagnetic wave shielding member 1 before thermocompression bonding can be adjusted by the components and the amount of the composition. Details will be described later. Further, after the inventors have studied repeatedly, they have confirmed that by blending an amount of conductive filler that can function as an electromagnetic wave shielding layer, the values of the root mean square height Rq and the root mean square slope Rdq do not substantially change before and after the reflow process, or even if they change, the amount of change is small. It is confirmed that by blending an inorganic filler also in an insulating layer such as a hard coat layer disclosed in the embodiment described later, the values of the root mean square height Rq and the root mean square slope Rdq do not substantially change before and after the reflow process, or even if they change, the amount of change is small.

The water contact angle of the surface layer of the electromagnetic wave shielding member 1 of embodiment C1 is preferably set to 90 ° to 130 °. By setting the range to this, the floating can be more effectively suppressed, and the stain resistance can be more effectively improved. The water contact angle of the electromagnetic wave shielding member is more preferably in the range of 95 ° to 125 °, and still more preferably in the range of 100 ° to 120 °. The water contact angle of the electromagnetic wave shielding member may be adjusted in the composition for forming an electromagnetic wave shielding member by the addition amount of the surface adjusting agent. As the amount of the surface conditioner added to the electromagnetic wave shielding member 1 increases, the value of the water contact angle tends to increase.

Method for manufacturing electronic component mounting substrate

The method of manufacturing the electromagnetic wave shielding member 1 of embodiment C1 is basically the same as the method of manufacturing the electromagnetic wave shielding member 1 of embodiment A1. The thickness of the conductive adhesive layer 6 is set to be capable of covering the top and side surfaces of the electronic component 30 and the exposed surface of the substrate 20, thereby forming the electromagnetic wave shielding layer 5. The fluidity of the binder resin precursor used, and the distance and size between the electronic components 30 may vary, but is usually preferably about 10 μm to 200 μm, more preferably about 15 μm to 100 μm, and even more preferably about 20 μm to 70 μm.

In embodiment C1, a case will be described in which the electromagnetic wave shielding member 1 is fixed to a dicing table using a dicing tape, and dicing is performed from the substrate 20 side. The method is suitable for the case of bonding solder balls to the outer main surface of the substrate 20. According to the electromagnetic wave shielding member 1 of embodiment C1, the root mean square height Rq of the surface layer of the electromagnetic wave shielding member 1 is set to a range of 0.05 μm or more and less than 0.3 μm, which is convenient for fixing the electromagnetic wave shielding member 1 side by the dicing tape in the singulation step, and can effectively prevent the electromagnetic wave shielding member and the electronic component from floating (poor partial adhesion) and peeling, thereby providing the electronic component mounting substrate having good coating property.

Laminate for electromagnetic wave shielding

As described with reference to fig. 4, the electromagnetic wave shielding laminate of embodiment C1 includes two layers, that is, the electromagnetic wave shielding member 2 and the releasable cushioning member 3. In embodiment C1, the electromagnetic wave shielding member 2 includes a single-layer conductive adhesive layer 6. The conductive adhesive layer 6 is bonded to the electronic component 30 or the substrate 20 by a thermocompression bonding step, and functions as the electromagnetic wave shielding layer 5.

(conductive adhesive layer)

The preferable examples and preferable amounts of the curable compound are the same as those in embodiment A1. The preferable examples of the thermoplastic resin and the preferable examples of the adhesion imparting resin are the same as those of embodiment A1.

Further, examples of the conductive filler include a metal filler, conductive ceramic particles, and a mixture of these, and specific examples of these are the same as embodiment A1. The silver content of the silver-plated copper powder is also the same as that of embodiment A1. Further, in the case of core-shell particles, the coating rate of the coating layer to the core is in the same suitable range as in embodiment A1.

As the conductive filler, an electromagnetic wave absorbing filler may be used, and as a specific example, the same example as in embodiment A1 can be given.

Examples of the shape of the conductive filler used for the conductive adhesive layer include scale-like particles, dendritic particles, needle-like particles, plate-like particles, grape-like particles, fibrous particles, and spherical particles, and the root mean square height Rq tends to be lowered by increasing the ratio of the scale-like particles, and the root mean square height Rq tends to be increased by decreasing the ratio of the scale-like particles. In terms of adjusting the values of the desired root mean square height Rq and root mean square slope Rdq, a conductive filler containing needle-like particles and/or dendritic particles is preferable.

The conductive fillers may be used alone or in combination. In the case of using the conductive filler in combination, from the viewpoint of obtaining a desired root mean square height Rq and providing an electromagnetic wave shielding member with high reliability, a combination of scaly particles and dendritic particles, a combination of scaly particles and needle-like particles, and a combination of scaly particles, dendritic particles and needle-like particles are preferable. Particularly preferred are combinations of scale-like particles and dendritic particles. The scale-like particles are preferably 0.2 μm or less in thickness.

The needle-shaped particles and/or dendritic particles are preferably 30 mass% or less with respect to 100 mass% of the conductive filler in the conductive adhesive layer. More preferably 0.1 to 20% by mass, still more preferably 1 to 20% by mass, and particularly preferably 3 to 16% by mass. The method of adjusting the root mean square height Rq to 0.05 μm or more and less than 0.3 μm is not particularly limited, and various methods are available. For example, before the lamination of the cushioning member, the surface layer of the electromagnetic wave shielding member and the surface layer of the conductive adhesive layer 6 in embodiment C1 are subjected to pressing treatment by a roller in advance, and then the cushioning member having the root mean square height of the surface on the side of the cushioning member to be joined to the surface layer of the electromagnetic wave shielding member being the desired Rq is used, whereby the root mean square height Rq can be easily adjusted.

The average particle diameter D50 of the needle-like particles is preferably 1 μm to 50. Mu.m, more preferably 2 μm to 25. Mu.m. More preferably 5 μm to 15. Mu.m. The average particle diameter D50 of the dendritic particles is preferably in the range of 2 μm to 100. Mu.m, more preferably 2 μm to 80. Mu.m. Further, it is more preferably 3 μm to 50. Mu.m, particularly preferably 5 μm to 20. Mu.m. The average particle diameter D50 of the flaky particles is preferably 2 μm to 70. Mu.m, more preferably 2 μm to 50. Mu.m. Further, it is more preferably 3 μm to 25. Mu.m, particularly preferably 5 μm to 15. Mu.m.

By using dendritic particles and/or needle-like particles and scale-like particles in combination, the contact points of the conductive fillers with each other can be increased, and the shielding property can be improved. In addition, by using dendritic particles and/or needle-like particles in combination, the contact area with the binder component can be increased, and an electromagnetic wave shielding member with high reliability can be provided.

The composition constituting the conductive adhesive layer may contain a colorant, a flame retardant, an inorganic additive, a lubricant, an anti-blocking agent, and the like. Specific examples of these are the same as in embodiment A1.

After the coating liquid of the conductive adhesive layer is applied, the coating liquid is dried to form the conductive adhesive layer on the releasable substrate. The drying step is preferably carried out by heating (e.g., 80 ℃ C. To 120 ℃ C.). In order to adjust the root mean square height Rq of the electromagnetic wave shielding member, it is preferable to dry the electromagnetic wave shielding member at 25 ℃ (room temperature) and normal pressure for 1 to 17 minutes after the application of the coating liquid and before the heating and drying. The drying time at 25℃before the heat drying (room temperature) is more preferably 2 minutes to 14 minutes. The value of the root mean square height Rq can be adjusted by setting the process of drying at room temperature before the heat drying.

Next, the influence of the viscosity of the coating liquid and the drying time at 25 ℃ before the heating and drying on the root mean square height Rq and the root mean square slope Rdq of the electromagnetic wave shielding member 1 will be described. The coating liquid is applied to form a conductive adhesive layer on the releasable substrate. A conductive adhesive layer containing a solvent during drying can be obtained.

The drying time at 25 ℃ is set long for the conductive adhesive layer during drying, and thus the state in which the evaporation rate of the solvent is slow is intentionally prolonged, and the downward sinking of the binder resin precursor can be promoted. On the other hand, setting the drying time at 25 ℃ short suppresses downward sinking of the binder resin precursor, and the conductive filler is easily erected by performing heat drying at the stage. In addition, foaming accompanied by evaporation of the solvent tends to occur, and the surface tends to be cracked. The temperature of 25℃is set as an example, and may be appropriately set.

The solid content of the coating liquid is preferably 20% to 30%. In order to adjust the root mean square height Rq of the electromagnetic wave shielding member, it is preferable that the viscosity of the coating liquid measured by the B-type viscometer is set to be in the range of 600mpa·s to 1800mpa·s. Further, in order to adjust the root mean square height Rq of the electromagnetic wave shielding member, the thixotropic index of the coating liquid is preferably set to 1.2 to 1.5.

The values of the root mean square height Rq and the root mean square slope Rdq also vary according to the viscosity of the coating liquid used to form the conductive adhesive layer. The high viscosity of the coating liquid tends to inhibit the fluidity of the conductive filler. Therefore, when the viscosity is high, the conductive filler tends to be random without alignment. On the other hand, when the viscosity is low, the scale-like particles tend to be oriented such that the main surface is approximately opposite to the substrate surface. Further, when the drying time at 25 ℃ is shortened and the heating and drying are performed, the surface chap caused by foaming tends to be large when the viscosity is high, and the conductive filler tends to be easily moved in the longitudinal direction when the viscosity is low. Thus, the root mean square height Rq can be adjusted by adjusting the viscosity of the coating liquid and the drying time at 25 ℃.

The root mean square height Rq and the root mean square slope Rdq of the electromagnetic wave shielding member 1 may be adjusted by the particle diameter of the dendritic particles and/or the needle-like particles. The influence of the particle diameter of the dendritic particles and/or needle-like particles on the root mean square height Rq and the root mean square slope Rdq of the electromagnetic wave shielding member 1 will be described. The coating liquid is applied to form the conductive adhesive layer 6 on the releasable substrate, whereby a conductive adhesive layer in the middle of drying can be obtained. If the average particle diameter D50 of the dendritic particle, which is one type of conductive filler, is small, the values of the root mean square height Rq and the root mean square slope Rdq tend to decrease, whereas if the average particle diameter D50 of the dendritic particle is large, the values of the root mean square height Rq and the root mean square slope Rdq tend to increase. In addition, the root mean square slope Rdq depends on the shape of the needle-like particles. When the particle diameter D50 of the needle-like particles is large, rdq becomes large. In addition, when the particle diameter D50 of the needle-like particles is small, rdq becomes small.

The root mean square height Rq and the root mean square slope Rdq of the electromagnetic wave shielding member 1 can be adjusted by adjusting the ratio of the addition amount of the scaly conductive filler to the needle-like and/or dendritic conductive filler in the composition for forming the electromagnetic wave shielding member 2 before thermocompression bonding, in addition to the adjustment method using the above-described process. The root mean square height Rq of the electromagnetic wave shielding member 1 can also be adjusted by the average particle diameter D50 and the average particle diameter D90 of the conductive filler.

In embodiment C1, the electromagnetic wave shielding member 2 includes a single-layer conductive adhesive layer 6, and therefore the releasable buffer member 3 is bonded to the conductive adhesive layer 6. The bonding method may be a lamination method.

The releasable substrate is a substrate having releasability on one or both sides, and is a sheet having a tensile strain at break of less than 50% at 150 ℃. Specific examples of the releasable substrate and the like are the same as those of embodiment A1.

The releasable cushioning member according to embodiment A1 may be cited.

Embodiment C2

Next, an example of an electronic component mounting board different from embodiment C1 will be described. The electronic component mounting substrate of embodiment C2 is similar to embodiment C1 in that the electromagnetic wave shielding member includes two electromagnetic wave shielding layers, unlike embodiment C1 in which an electromagnetic wave shielding member including a single electromagnetic wave shielding layer is used, and other basic configurations and manufacturing methods are similar to those of embodiment C1. The basic configuration and manufacturing method are the same as those of embodiment A2, except that the electromagnetic wave shielding member of embodiment C is used instead of the electromagnetic wave shielding member of embodiment a, and the points described otherwise. Duplicate descriptions are omitted as appropriate.

As shown in fig. 11, the electromagnetic wave shielding member of embodiment C2 is formed using an electromagnetic wave shielding laminate 4a including an electromagnetic wave shielding member 2a and a release buffer member 3a, and the electromagnetic wave shielding member 2a is a conductive adhesive layer 6a including two layers, i.e., a first conductive adhesive layer 6a1 and a second conductive adhesive layer 6a 2. The electromagnetic wave shielding laminate 4a is thermally bonded to cover the substrate 20 on which the electronic component 30 is mounted with an electromagnetic wave shielding member including a first electromagnetic wave shielding layer and a second electromagnetic wave shielding layer. The second conductive adhesive layer 6a2 on the upper layer is manufactured by the same composition and procedure as in embodiment C1, and the first conductive adhesive layer 6a1 on the lower layer is not limited by the range of the root mean square height Rq, and can be designed to meet the demand. For example, a filler such as fibrous particles or spherical particles may be used as the conductive filler contained in the first conductive adhesive layer 6a 1. In addition, the first conductive adhesive layer 6a1 may be used as an anisotropic conductive adhesive layer, and the second conductive adhesive layer 6a2 may be used as an isotropic conductive adhesive layer. The electromagnetic wave reflecting layer and the electromagnetic wave absorbing layer are preferably laminated. Three or more electromagnetic wave shielding layers may be laminated.

According to the electronic component mounting substrate of embodiment C2, the same effects as those of embodiment C1 can be obtained by using the electromagnetic wave shielding member including the electromagnetic wave shielding layer of two layers. In addition, by stacking two electromagnetic wave shielding layers, the degree of freedom in designing each layer can be improved, and thus there is an advantage in that an electromagnetic wave shielding member corresponding to the demand can be easily provided.

Embodiment C3

The electronic component mounting substrate of embodiment C3 is similar to the electromagnetic wave shielding member of embodiment C1 using an electromagnetic wave shielding layer including a single layer, in that the electromagnetic wave shielding member includes a laminate of an electromagnetic wave shielding layer and a hard coat layer, and other basic configurations and manufacturing methods are the same.

As shown in fig. 12, the electromagnetic wave shielding member of embodiment C3 is formed using an electromagnetic wave shielding laminate 4b including an electromagnetic wave shielding member 2b and a release buffer member 3b, and the electromagnetic wave shielding member 2b is a laminate of a conductive adhesive layer 6b and an insulating resin layer 7 b. By thermocompression bonding the electromagnetic wave shielding laminate 4b, an electromagnetic wave shielding member including an electromagnetic wave shielding layer formed of the conductive adhesive layer 6b and a hard coat layer formed of the insulating resin layer 7b can be obtained on a substrate on which electronic components are mounted. The electromagnetic wave shielding member of embodiment C3 has a root mean square height Rq of 0.05 μm or more and less than 0.3 μm when measured from the hard coat layer side.

The insulating resin layer 7b is a layer formed of a resin composition containing a binder resin precursor and an inorganic filler. The binder resin precursor contains at least a thermosetting resin. Examples and preferable examples of the binder resin precursor are the same as those of the conductive adhesive layer of the electromagnetic wave shielding member described in embodiment A1. The binder resin precursor of the conductive adhesive layer and the insulating resin layer may be the same or different.

Unlike the conductive adhesive layer of embodiment C1, the inorganic filler does not have conductivity, but preferable characteristics of the inorganic filler, such as shape, amount of blended, D50, D90, and the like, are the same as those exemplified for the conductive filler. Examples of the inorganic filler include: inorganic compounds such as silica (fused silica, crystalline silica, amorphous silica), beryllium oxide, aluminum oxide, magnesium hydroxide, barium sulfate, calcium carbonate, titanium oxide, zinc oxide, antimony trioxide, antimony oxide, magnesium oxide, talc, kaolinite, mica, basic magnesium carbonate, sericite, montmorillonite, bentonite, kaolinite, clay, hydrotalcite, wollastonite, xonotlite, silicon nitride, boron nitride, aluminum nitride, calcium hydrogen phosphate, calcium phosphate, glass flakes, hydrated glass, calcium titanate, sepiolite, magnesium sulfate, aluminum hydroxide, zirconium hydroxide, barium hydroxide, calcium oxide, tin oxide, aluminum oxide, zirconium oxide, molybdenum oxide, nickel oxide, zinc carbonate, magnesium carbonate, barium carbonate, zinc borate, aluminum borate, calcium silicate, silicon carbide, titanium carbide, diamond, graphite, and graphene.

By using a thermally conductive filler as the inorganic filler, the hard coat layer can also be made to function as a thermally conductive layer. May be used as a hard coat layer, a heat conductive layer (e.g., a heat dissipation layer), or a layer having functions of both, corresponding to the purpose.

The preferable blending components and blending amounts of the binder resin precursor for the insulating resin layer are the same as those of the conductive adhesive layer of embodiment C1. The preferable shape, preferable average particle diameter D50, and the like of the inorganic filler used for the insulating resin layer are the same as those of the conductive filler of embodiment C1. The additive applicable to the thermosetting resin composition and the thermosetting resin composition layer can be described in embodiment C1.

According to the electronic component mounting substrate of embodiment C3, by using the electromagnetic wave shielding member having the hard coat layer, in addition to the effects described in embodiment C1, an electromagnetic wave shielding member having more excellent durability due to the coating of the electromagnetic wave shielding layer with the hard coat layer can be provided.

Embodiment C4 and embodiment C5

The electronic component mounting substrates of embodiment C4 and embodiment C5 are described with reference to embodiment A4 and embodiment A5, except that the electromagnetic wave shielding member of embodiment C is used instead of the electromagnetic wave shielding member of embodiment a.

< modification >

Next, a modification of the electronic component mounting substrate and the like of the present embodiment will be described. However, the present invention is not limited to the above-described embodiments and modifications, and other embodiments may fall within the scope of the present invention as long as they are consistent with the gist of the present invention. The embodiments and modifications may be combined with each other as appropriate.

In embodiment A4, embodiment A5, embodiment B4, embodiment B5, embodiment C4, and embodiment C5, an example of an electromagnetic wave shielding laminate using a laminate including an insulating adhesive layer, a conductive adhesive layer, and a release buffer member has been described, but may be manufactured as follows. That is, on the substrate 20 on which the plurality of electronic components 30 are mounted as shown in fig. 16A, the insulating coating layer 9e is first formed as shown in fig. 16B. The insulating coating layer 9e is obtained by hot-pressing a sheet containing an insulating adhesive layer. Thereafter, the electromagnetic wave shielding layer 5e is formed by using the electromagnetic wave shielding laminate 4e including the laminate of the conductive adhesive layer 6e and the releasable buffer member 3e (fig. 16C and 16D). Through these steps, the electronic component mounting substrate 55 on which the electromagnetic wave shielding member is formed can be obtained. Further, the insulating coating layer 9e may be exemplified by a method of applying a solution resin and a method of spraying a solution resin instead of a method of hot-pressing a sheet.

In the above-described embodiment, the electronic component was described as an example of the component, but the present invention can be applied to all components which want to be away from electromagnetic waves. The shape of the component is not limited to a rectangular shape, and includes a component having an R-shaped corner, a component having an acute angle formed by the upper surface of the component and the side surface, and a component having an obtuse angle formed by the upper surface of the component and the side surface. In addition, the case where the outer surface of the component or the electronic component having the concave-convex shape on the upper surface is a curved surface such as a sphere is also included. In the above embodiment, the half-cut groove 25 (see fig. 2) is formed in the substrate 20, but the half-cut groove 25 is not necessarily required, and the electromagnetic wave shielding member may be mounted on and coated on a flat substrate. The electronic component mounting board of the present invention also includes, for example, the following: an electronic component mounting board on which electronic components are mounted, which is obtained by dicing the board 20 entirely and singulating the same, is mounted on another holding base material or the like.

The laminate for electromagnetic wave shielding is not limited to the laminate form of the embodiment. For example, a support substrate may be laminated on the releasable buffer member. By stacking the support substrates, contamination of the device at the time of thermocompression bonding can be prevented easily. In addition, the support substrate has an advantage that the adhesion step of the laminate for electromagnetic wave shielding is easy. The electronic components may be mounted on both surfaces of the substrate, and the electromagnetic wave shielding member may be formed on each of the electronic components.

The electronic component mounting substrate according to the present embodiment is excellent in coating property with respect to the concave-convex structure, and therefore can be suitably applied to various electronic devices such as personal computers, mobile devices, and digital cameras.

Examples (examples)

Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited to the following examples. In the examples, "parts" means "parts by mass" and "%" means "% by mass". The values described in the present invention were obtained by the following methods.

[ [ embodiment A ] ]

(test substrate 1)

A substrate in which molded and sealed electronic parts (1 cm×1 cm) were mounted in a 5×5 array on a substrate including epoxy glass was prepared. The thickness of the substrate was 0.3mm, and the die seal thickness, i.e., the height (part height) H from the upper surface of the substrate to the top surface of the die seal material was 0.7mm. Thereafter, half-cutting was performed along the grooves that were gaps between the parts, thereby obtaining a test substrate (see fig. 17). The half-cut groove depth was set to 0.8mm (the cut groove depth of the substrate 20 was 0.1 mm), and the half-cut groove width was set to 200 μm.

(test substrate 2, test substrate 3)

Test substrate 2 was produced in the same manner as test substrate 1, except that the half-cut groove width was changed to 150 μm. The test substrate 3 was produced in the same manner as the test substrate 1, except that the half-cut groove width was changed to 150 μm and the groove depth was changed to 1000 μm.

The materials used in the examples are shown below.

Binder resin precursor

Resin 1: polycarbonate resin (manufactured by Toyochem Co., ltd.)

Resin 2: phenoxy resin (manufactured by Toyo chemical Co., ltd.)

Curable compound 1: denacolol EX830 (manufactured by Darka chemical industry (Nagase chemteX))

Curable compound 2: jERYX8000 (Mitsubishi chemical (Mitsubishi Chemical) Co., ltd.)

Curable compound 3: jER157S70 (Mitsubishi chemical corporation)

Hardening accelerator: PZ-33 (manufactured by Japanese catalyst Co., ltd.)

Conductive filler 1: scale-like silver (average particle diameter D50:11 μm) (manufactured by Futian Metal Co., ltd.)

Conductive filler 2: needle-shaped silver-plated copper (average particle diameter D50:7.5 μm) (manufactured by Futian Metal Co., ltd.)

Additive 1: BYK322 (manufactured by BYK Chemie Co., ltd.)

Additive 2: BYK337 (manufactured by Pick chemical Co., ltd.)

Example A1

(preparation of resin composition for conductive adhesive layer)

As shown in table 1, 20 parts (solid content) of resin 1 (polycarbonate resin), 80 parts (solid content) of resin 2 (phenoxy resin), 20 parts of curable compound 1 (epoxy resin), 15 parts of curable compound 2 (epoxy resin), 10 parts of curable compound 3 (epoxy resin), and 320 parts of conductive filler 1 (scaly silver), 5 parts of conductive filler 2 (needle-like silver-plated copper), 1 part of hardening accelerator, 0.4 part of additive 1 were added to a container, and toluene was added so that the solid content concentration became 25 mass%: the mixed solvent of isopropyl alcohol (mass ratio 2:1) was stirred with a disperser for 10 minutes, thereby obtaining a resin composition for forming a conductive adhesive layer.

(production of laminate for electromagnetic wave shielding)

The resin composition was applied to a releasable substrate using a doctor blade so that the dry thickness became 50. Mu.m. Then, the mixture was dried at room temperature at 25℃for 14 minutes and then at 100℃for 2 minutes, whereby an electromagnetic wave shielding member (conductive adhesive layer) was obtained. Thereafter, a releasable cushioning member (CR 1040, layer structure (thickness 150 μm) made of polymethylpentene sandwiched between two surfaces of a soft resin layer, manufactured by samsung chemical xylonite (Mitsui Chemicals Tohcello)) was prepared and laminated with an electromagnetic wave shielding member, whereby the electromagnetic wave shielding laminate of example A1 was obtained on a releasable substrate.

Examples A2 to A5 and reference example A1

A resin composition for a conductive adhesive layer and a laminate for electromagnetic wave shielding were obtained in the same manner as in example A1, except that the compositions described in table 1 were changed.

Examples A6 to A10 and reference example A2

Toluene was added so that the solid content concentration became 29 mass% in addition to the composition shown in table 1: a resin composition for a conductive adhesive layer and a laminate for electromagnetic wave shielding were obtained in the same manner as in example A1, except for the mixed solvent of isopropyl alcohol (mass ratio 2:1).

< kurtosis >

The laminate for electromagnetic wave shielding of examples A1 to a10, reference example A1 and reference example A2 was prepared, and placed on an FR4 substrate having a thickness of 300 μm, and heat-press-bonded at 170 ℃ for 5 minutes from the side of the releasable cushioning member in the face direction under a condition of 8 MPa. Thereafter, the releasable cushioning member was peeled off, and heating was performed at 180℃for 2 hours. Thereafter, the releasable buffer member was peeled off to obtain a test piece having an electromagnetic wave shielding member formed thereon.

In the test piece, the surface of the electromagnetic wave shielding member from which the release buffer member was peeled was subjected to a metal sputtering treatment. The metal sputtering conditions were that sputtering was performed for 0.5 minutes using a sputtering apparatus "Smart Coater" manufactured by Nippon electronic Co., ltd.) using gold as a target and a distance between the target and the sample surface was set to 2 cm. For the metal sputtering surface of the obtained sample, according to JISB0601:2001, kurtosis was determined using a laser microscope (manufactured by kence corporation (VK-X100)). The measurement conditions were that in the shape measurement mode, the surface shape was obtained with the measurement magnification set to 1000 times. For the obtained surface shape image, in the surface roughness measurement of the analysis application software, the kurtosis was measured by selecting the entire area, setting the λs profile filter to 2.5 μm, and setting the λc profile filter to 0.8 mm. The measurement was performed at 5 different points, and the average value of the measured values was taken as the kurtosis value.

In the measurement of the kurtosis of the electromagnetic wave shielding member, when the electromagnetic wave shielding member actually coated on the electronic component mounting substrate is measured, the electromagnetic wave shielding member coated on the electronic component substrate may be measured directly.

Viscosity and thixotropic index of the coating solution

After the obtained conductive resin composition was allowed to stand in a water bath at 25℃for 30 minutes, the viscosity (v 1) at a rotation speed of 6rpm and the viscosity (v 2) at a rotation speed of 60rpm were measured by a "type B viscometer" (manufactured by Dong machine industry Co., ltd.). The thixotropic index is a value obtained by dividing (v 1) by (v 2).

< evaluation of releasability of half cut groove of release buffer Member after thermocompression bonding >

The laminate for electromagnetic wave shielding of each example and reference example was thermally bonded to each of the test substrates 1 to 3 at 8MPa and 170 ℃ for 5 minutes, and then the releasable cushioning members were peeled off by hand. The number of residues of the releasable cushioning members remaining after the grooves in the gaps between the electronic components were crushed was visually checked. The evaluation criteria are as follows.

+++: no residue was seen.

++: the number of residues is more than one and less than three.

+: residues are more than three and less than five.

NG: the residue is five or more, or the residue remains in the entire tank.

< Steel wool resistance >)

The laminate for electromagnetic wave shielding of each example and reference example cut into 5cm×15cm was placed on a polyimide film (Kapton) 500H manufactured by dolby eastern corporation) having a thickness of 125 μm, and hot-pressed at 180 ℃ under 2MPa for 10 minutes, and then cured at 180 ℃ for 2 hours, thereby obtaining a test substrate. Thereafter, the releasable cushioning member is peeled off. Then, the electromagnetic wave shielding member was set in a vibration type abrasion Tester (manufactured by test Sangyo Co., ltd.) and the number of vibration times until the polyimide film was exposed by abrasion of the electromagnetic wave shielding member was determined under conditions of a load of 200gf, a stroke of 120mm and a round trip speed of 30 times/min. The evaluation criteria are as follows.

+++:20,000 times or more.

++: more than 10,000 times and less than 20,000 times.

+: more than 5,000 times and less than 10,000 times (practical level).

NG: less than 5,000 times.

The evaluation results of examples A1 to a10 and reference examples A1 and A2 are shown in table 1.

TABLE 1

As shown in the examples of table 1, the steel wool resistance of the electronic component mounting substrate using the electromagnetic wave shielding member of reference example A1 having a kurtosis of less than 1 did not reach an acceptable level. In contrast, it was confirmed that the electromagnetic wave shielding members of the electronic component mounting substrate of the present invention all reached the acceptable level and were excellent in steel wool resistance. In addition, the peelability of the groove portion of the electromagnetic wave shielding member of reference example A2, in which the kurtosis exceeds 8, did not reach an acceptable level. In contrast, it was confirmed that the electromagnetic wave shielding member of the electronic component mounting substrate of the present invention was excellent in the releasability of the groove portion of the release buffer member after thermocompression bonding.

[ [ embodiment B ] ]

(test substrate)

The test substrate of embodiment B was obtained by the same manufacturing method as the test substrate 1 of embodiment a.

The materials used in the examples are shown below.

Binder resin precursor

Resin 1: urethane resin (manufactured by Toyo chemical Co., ltd.)

Resin 2: polycarbonate resin (manufactured by Toyo chemical Co., ltd.)

Resin 3: styrene elastomer resin (manufactured by Toyo chemical Co., ltd.)

Resin 4: phenoxy resin (manufactured by Toyo chemical Co., ltd.)

Curable compound 1: denacolol EX830 (manufactured by Chang chemical Co., ltd.)

Curable compound 2: jERYX8000 (Mitsubishi chemical Co., ltd.)

Curable compound 3: jER157S70 (Mitsubishi chemical corporation)

Hardening accelerator: PZ-33 (manufactured by Japanese catalyst Co., ltd.)

Conductive filler

Additives

Additive 1: BYK322 (manufactured by Pick chemical Co., ltd.)

Additive 2: BYK337 (manufactured by Pick chemical Co., ltd.)

Example B1

(preparation of resin composition for conductive adhesive layer)

As shown in table 2, 70 parts (solid content) of resin 1 (urethane resin), 30 parts (solid content) of resin 2 (polycarbonate resin), 30 parts of curable compound 1 (epoxy resin), 15 parts of curable compound 2 (epoxy resin), and 280 parts of conductive filler 1 (flake silver), 50 parts of conductive filler 2 (needle silver-plated copper), 1 part of hardening accelerator, and 0.4 part of additive 1 were added to a container, toluene was added so that the solid content concentration became 35 mass%: the mixed solvent of isopropyl alcohol (mass ratio 2:1) was stirred with a disperser for 10 minutes, thereby obtaining a resin composition for forming a conductive adhesive layer.

(production of laminate for electromagnetic wave shielding)

The resin composition was applied to a releasable substrate using a doctor blade so that the dry thickness became 50. Mu.m. Then, after drying at room temperature for 12 minutes at 25 ℃, drying was performed at 100 ℃ for 2 minutes, thereby obtaining a member for electromagnetic wave shielding (conductive adhesive layer). Thereafter, a releasable cushioning member (CR 1040, layer structure (thickness 150 μm) made of polymethylpentene sandwiched between two surfaces of a soft resin layer, manufactured by samsung chemical east cellophane) was prepared and laminated with an electromagnetic wave shielding member, whereby an electromagnetic wave shielding laminate of example B1 was obtained on a releasable substrate.

(production of test piece for electronic component mounting substrate)

Then, the laminate for electromagnetic wave shielding on the releasable substrate was cut into 10cm×10cm pieces, and after the releasable substrate was peeled off, the laminate for electromagnetic wave shielding was placed on and temporarily adhered to the test substrate so that the conductive adhesive layer surface side of the laminate for electromagnetic wave shielding was brought into contact with each other (see fig. 17). Then, the substrate surface was thermally bonded for 2 hours from above the electromagnetic wave shielding laminate under conditions of 2MPa and 180 ℃. After thermocompression bonding, the releasable buffer member was peeled off, whereby the electronic component mounting substrate (test piece) of example B1 coated with the electromagnetic wave shielding member was obtained.

Examples B2 to B19, reference example B1 and reference example B2

Resin compositions of conductive adhesive layers, electromagnetic wave shielding laminates, and test pieces of electronic component mounting substrates of each example and reference example were obtained in the same manner as in example B1, except that the compositions shown in table 2 and table 3 were changed.

< modulus of elasticity under indentation >

The laminate for electromagnetic wave shielding of examples B1 to B19, reference example B1 and reference example B2 was prepared, and placed on an FR4 substrate having a thickness of 300 μm, and heat-press-bonded at 180 ℃ for 2 hours from the side of the releasable cushioning member in the face direction under a condition of 2 MPa. Thereafter, the releasable buffer member was peeled off to obtain a test piece of FR4 substrate on which the electromagnetic wave shielding member was formed. The indentation elastic modulus was measured from the side on which the releasable cushioning member was laminated by the following method.

That is, measurement was performed with a vickers indenter (diamond indenter having a spherical tip of 100 Φ) using a fisherscope H100C (manufactured by fisherscope) durometer in a constant temperature chamber at 25 ℃ for a test force of 0.3N, a retention time of the test force of 20 seconds, and a time required for adding the test force of 5 seconds. The indentation elastic modulus was obtained by averaging values obtained by repeating measurements of the same film surface of the electromagnetic wave shielding member at 5 at random.

In the measurement of the pressing elastic modulus of the electromagnetic wave shielding member, the electromagnetic wave shielding member actually coated on the electronic component mounting substrate may be measured. In this case, the vickers indenter is brought into direct contact with the electromagnetic wave shielding member coated on the electronic component substrate to perform measurement. In the kurtosis and the water contact angle described later, the electromagnetic wave shielding member actually coated on the electronic component mounting substrate can be measured in the same manner.

< kurtosis >

A test substrate of an FR4 substrate was obtained by the same method as that described in embodiment a, and kurtosis was obtained by the same method.

< Water contact Angle >)

The water contact angle of the electromagnetic wave shielding member was measured on the surface of the electromagnetic wave shielding layer using an "automatic contact angle meter DM-501/analytical software fams" manufactured by synergetic interface science (inc.) for a test piece of the FR4 substrate manufactured in the same manner as the test piece for measuring the modulus of elasticity by pressing. The measurement was performed by a droplet method.

< measurement of Martin hardness >)

Test pieces of the electronic component mounting substrates of the examples and the reference examples were prepared, and the hardness of Mahalanobis was measured by a Fixel oscilloscope (Fischerscope) H100C (Fischerscope instruments Co., ltd.) according to International organization for standardization (International Organization for Standardization, ISO) 14577-1. The measurement was performed on the upper surface of the electronic component 30 by using a vickers indenter (a diamond indenter having a spherical tip of 100 Φ) under conditions of a test force of 0.3N, a retention time of 20 seconds, and a time required for adding the test force of 5 seconds in a constant temperature chamber at 25 ℃. The average value of the values obtained by repeating the measurement randomly at 10 on the same cured film surface was taken as the mahalanobis hardness. Further, the test force is adjusted in response to the thickness of the electromagnetic wave shielding layer. Specifically, the test force was adjusted so that the maximum press-in depth became about one tenth of the thickness of the electromagnetic wave shielding member.

Viscosity and thixotropic index of the coating solution

The viscosity (v 1) at a rotation speed of 6rpm and the viscosity (v 2) at a rotation speed of 60rpm were measured by the same method as described in embodiment A. In addition, the thixotropic index was obtained by the same method.

< burr at full cutting >)

The laminate for shielding electromagnetic wave of each example and reference example was thermally pressed against the test substrate (substrate on which electronic parts were mounted in a 5×5 array) at 8Mpa and 170 ℃ for 5 minutes, and then the releasable cushioning member was peeled off by hand. Thereafter, curing was performed at 180 ℃ for 2 hours, thereby obtaining a test sample coated with an electromagnetic wave shielding member. The occurrence of burrs at the time of the singulation step (full cut) was evaluated using a laser microscope on the obtained test sample according to the following criteria.

+++: no burrs were confirmed.

++: in 25 singulated electronic parts, the generation of burrs is less than two.

+: in 25 electronic parts which are singulated, burrs are generated in two or more but less than five.

NG: in 25 singulated electronic parts, burrs were generated in five or more.

< tape adhesion >

The laminate for electromagnetic wave shielding of each example and reference example cut into 5cm×5cm was placed on an FR4 substrate having a thickness of 300 μm, and was subjected to hot pressing at 170℃under 8MPa for 5 minutes, and then cured at 180℃for 2 hours, thereby obtaining a test substrate. Then, the releasable cushioning member is peeled off. Thereafter, the obtained test substrate was subjected to a pressure cooker test at 130℃and a humidity of 85% and 0.23 MPa. The test time was set to 96 hours, and an adhesive tape manufactured by Nichiban (Michaon) having a width of 18mm was used as the adhesive tape. Further, according to JISK5600, 25 grids with a 1mm interval were produced on the electromagnetic wave shielding member using the traverse guide. Thereafter, the adhesive tape was pressure-bonded to the grid portion of the electromagnetic wave shielding member, and the end portion of the tape was peeled off at once at an angle of 45 ° to perform a tape adhesion test. The state of the grid of the electromagnetic wave shielding member (transverse residual rate) was determined based on the following criteria.

+++: exhibiting a survival rate of 25/25.

++: exhibiting a survival rate of 24/25.

+: exhibiting a residual ratio of 23/25.

NG: a residual ratio of less than 23/25.

The test substrates (half-cut groove depth 800 μm, groove width 200 μm) were each subjected to thermal compression bonding at 8MPa and 170℃for 5 minutes, and then the releasable cushioning members were peeled off by hand. The number of residues of the releasable cushioning members remaining after the grooves in the gaps between the electronic components were crushed was visually checked. The evaluation criteria are as follows.

+++: no residue was seen.

++: the number of residues is more than one and less than three.

+: residues are more than three and less than five.

NG: the residue is five or more, or the residue remains in the entire tank.

< Steel wool resistance >)

Test substrates were obtained by the same method as that described in embodiment a, and steel wool resistance was evaluated by the same measurement method. The evaluation criterion was also set to be the same.

The evaluation results of examples B1 to B19 and reference examples B1 and B2 are shown in tables 2 and 3.

TABLE 2

TABLE 3

As shown in examples in tables 2 and 3, burrs at the time of full dicing of the electronic component mounting substrate using the electromagnetic wave shielding member of reference example B1 having a press-in elastic modulus of less than 1 did not reach an acceptable level. In contrast, it was confirmed that the electromagnetic wave shielding members of the electronic component mounting substrate of the present invention all reached the acceptable level, and the occurrence of burrs was suppressed. In addition, the tape adhesion after PCT test of the electronic component mounting substrate using the electromagnetic wave shielding member of reference example B2 having a press-in elastic modulus exceeding 10GPa did not reach an acceptable level. On the other hand, it was confirmed that the electromagnetic wave shielding member for an electronic component mounting substrate of the present invention was excellent in PCT resistance, and that the tape adhesion after PCT test was all at a satisfactory level.

Fig. 22 shows an image of a side surface of the singulated electronic component mounting substrate of example B3 observed with a microscope. As shown in the figures, no burrs are seen. On the other hand, fig. 23 shows an image of a side surface of the singulated electronic component mounting substrate of example B1 observed with a microscope. As shown in the figure, the generation of burrs can be seen.

[ [ embodiment C ] ]

(test substrate 1)

The test substrate was obtained by the same method as the method for producing the test substrate 1 of embodiment a.

The materials used in the examples are shown below.

Binder resin precursor

Thermosetting resin 1: polycarbonate resin (manufactured by Toyo chemical Co., ltd.)

Thermosetting resin 2: phenoxy resin (manufactured by Toyo chemical Co., ltd.)

Curable compound 1: denacolol EX830 (manufactured by Chang chemical Co., ltd.)

Curable compound 2: jERYX8000 (Mitsubishi chemical Co., ltd.)

Curable compound 3: jER157S70 (Mitsubishi chemical corporation)

Hardening accelerator: PZ-33

Conductive filler 1: scaly silver (average particle diameter D50:9.5 μm, D90=19 μm, thickness 0.1 μm)

Conductive filler 2: dendritic silver-plated copper (average particle diameter d50:7.1 μm, d90=15.1 μm)

Additive 1: BYK337

Example C1

(preparation of resin composition for conductive adhesive layer)

As shown in table 4, 20 parts (solid content) of thermosetting resin 1 (polycarbonate resin), 80 parts (solid content) of thermosetting resin 2 (phenoxy resin), 20 parts (epoxy resin), 15 parts (epoxy resin), 10 parts (epoxy resin) of curable compound 2, and 365 parts (flake silver) of conductive filler 1, 5 parts (dendritic silver-plated copper) of conductive filler 2, and 1 part of hardening accelerator were added to a container, and toluene was added so that the solid content concentration became 23 mass%: the mixed solvent of isopropyl alcohol (mass ratio 2:1) was stirred with a disperser for 10 minutes, thereby obtaining a resin composition for forming a conductive adhesive layer.

(production of laminate for electromagnetic wave shielding)

The laminate for electromagnetic wave shielding of example C1 was obtained by the same method as in embodiment a.

(production of test piece for electronic component mounting substrate)

Then, the laminate for electromagnetic wave shielding on the releasable substrate was cut into 10cm×10cm pieces, and after the releasable substrate was peeled off, the laminate for electromagnetic wave shielding was placed on and temporarily adhered to the test substrate so that the conductive adhesive layer surface side of the laminate for electromagnetic wave shielding was brought into contact with each other (see fig. 17). Then, the substrate surface was thermally bonded for 2 hours from above the electromagnetic wave shielding laminate under conditions of 2MPa and 180 ℃. After thermocompression bonding, the releasable buffer member was peeled off, whereby the electronic component mounting substrate (test piece) of example C1 coated with the electromagnetic wave shielding member was obtained.

Examples C2 to C9 and reference example C1

A resin composition for a conductive adhesive layer and a laminate for electromagnetic wave shielding were obtained in the same manner as in example C1, except that the compositions shown in table 4 were changed.

< root mean square height Rq >)

The laminate for electromagnetic wave shielding of examples C1 to C9 and reference example C1 was prepared, and placed on an FR4 substrate having a thickness of 300. Mu.m, and heat-pressed at 170℃for 5 minutes from the side of the releasable cushioning member toward the surface under 8 MPa. Thereafter, the releasable cushioning member was peeled off and heated at 180℃for 2 hours, to obtain a test piece having an electromagnetic wave shielding member formed thereon.

In the test piece, the surface of the electromagnetic wave shielding member from which the release buffer member was peeled was subjected to a metal sputtering treatment. The metal sputtering conditions were that sputtering was performed for 0.5 minutes using a sputtering apparatus "Smart Coater" manufactured by Nippon electronic Co., ltd.) using gold as a target and a distance between the target and the sample surface was set to 2 cm. For the metal sputtering surface of the obtained sample, according to JISB0601:2001, the root mean square height Rq was obtained using a laser microscope (manufactured by Kernel (Inc.) (VK-X100)). The measurement conditions were that in the shape measurement mode, the surface shape was obtained with the measurement magnification set to 1000 times. For the obtained surface shape image, in the surface roughness measurement of the analysis application software, the root mean square height Rq was measured by selecting the entire region, setting the λs profile filter to 2.5 μm, and setting the λc profile filter to 0.8 mm. The measurements were performed at different 5 and the average of the measured values was taken as the value of the root mean square height Rq.

In the measurement of the root mean square height Rq of the electromagnetic wave shielding member, when the electromagnetic wave shielding member actually coated on the electronic component mounting substrate is measured, the electromagnetic wave shielding member coated on the electronic component substrate may be directly measured.

< root mean square slope Rdq >)

Using the surface shape image obtained in the measurement of Rq, in the line roughness measurement of the analysis application software, 20 two-point lines were uniformly drawn in the entire image, and the root mean square slope Rdq was measured with the λs profile filter set to 2.5 μm and the λc profile filter set to 0.8 mm. The measurements were performed at different 5 and the average of the measured values was taken as the value of the root mean square slope Rdq.

< Water contact Angle >)

The laminate for electromagnetic wave shielding of each example and reference example was prepared, and a test piece of an FR4 substrate having a thickness of 300 μm and produced in the same manner as the test piece for measuring the press-fit elastic modulus was placed thereon, and was subjected to thermocompression bonding at 180℃for 2 hours from the side of the releasable cushioning member in the face direction under a condition of 2 MPa. Thereafter, the releasable buffer member was peeled off to obtain a test piece of FR4 substrate on which the electromagnetic wave shielding member was formed. The water contact angle was measured from the side on which the releasable cushioning member was laminated by the following method. That is, the water contact angle of the electromagnetic wave shielding member was measured using "automatic contact angle meter DM-501/analytical software FAMAS" manufactured by the Co., ltd. The measurement was performed by a droplet method.

Viscosity and thixotropic index of the coating solution

< tape coating Property >)

The laminate for electromagnetic wave shielding of each example and reference example cut into 5cm×5cm was placed on an FR4 substrate having a thickness of 300 μm, and was subjected to hot pressing at 170℃under 8MPa for 5 minutes, and then cured at 180℃for 2 hours, thereby obtaining a test substrate. Then, the releasable cushioning member is peeled off. Thereafter, the electromagnetic wave shielding member and dicing tape (UHP-110 AT (Ultraviolet (UV)) were cut from the outer surface of the substrate 20, the base material being polyethylene terephthalate (Polyethylene terephthalate, PET), the total thickness being 110 μm (including the thickness of the adhesive layer being 10 μm)), and the electronic component mounting substrate was singulated by dicing the obtained test substrate. After singulation, the dicing tape was peeled off from the electromagnetic wave shielding member, and the state of the electromagnetic wave shielding member was observed with an optical microscope (magnification 200 times) and evaluated based on the following criteria.

+++: the appearance is not abnormal.

++: at every 1cm ² The electromagnetic wave shielding member of (2) generates one to two floats with a diameter of 0.5mm or less.

+: at every 1cm ² Three to four floats with a diameter of 0.5mm or less are generated in the electromagnetic wave shielding member.

NG: at every 1cm ² The electromagnetic wave shielding member of (2) generates floating and peeling of a diameter exceeding 0.5mm, or five or more floating of a diameter of 0.5mm or less.

< evaluation of stain repellency >)

The laminate for electromagnetic wave shielding of each example and reference example cut into 5cm×15cm was placed on a polyimide film (Kapton) 500H manufactured by dolby eastern corporation) having a thickness of 125 μm, and hot-pressed at 180 ℃ under 2MPa for 10 minutes, and then cured at 180 ℃ for 2 hours, thereby obtaining a test substrate. Thereafter, the releasable cushioning member is peeled off. The top surface of the electromagnetic wave shielding member is coated with n-octanoic acid as a suspected flux. Thereafter, the mixture was immersed in a cleaning solution obtained by mixing dioxolane and isopropyl alcohol at 8/2 ratio, and ultrasonic cleaning was performed. After washing, the antifouling property was evaluated using an optical microscope (magnification 200). The evaluation criteria are as follows.

+++: after 3 minutes of washing, there was no residue.

++: after 5 minutes of washing, there was no residue.

+: after 5 minutes of washing, at every 1cm ² The electromagnetic wave shielding member has residues at 1 to 2 positions.

NG: after 5 minutes of washing, at every 1cm ² More than 2 residues are present on the surface of the electromagnetic wave shielding member.

< test of Cold and Hot circulation >)

An electronic component mounting substrate (test piece) in which the electromagnetic wave shielding member of example C1 was coated on the test substrate shown in fig. 17 was prepared, and the initial connection resistance value between the two top surfaces (arrows in fig. 24) of the electronic component coated with the electromagnetic wave shielding member 1 was measured using a BSP probe of "Luo Laisi tower (Loresta) GP" manufactured by mitsubishi chemical analysis technique (Mitsubishi Chemical Analytech). Then, a cold and hot impact device ("TSE-11-A", manufactured by Espec Co.) was put in, at high Wen Baoshai: 125 ℃, 15 minutes, wen Baoshai lower: 1000 alternating exposures were performed at-50℃for 15 minutes. Thereafter, the connection resistance value of the sample was measured in the same manner as in the initial stage.

The evaluation criteria for the reliability of the cold and hot cycle are as follows. The measurement was performed at 3, and the average value was used as a measurement value.

When an insulating layer such as a hard coat layer is laminated on the outermost surface, the measurement portion of the insulating layer is removed after the cold and hot cycle test, and the electromagnetic wave shielding layer 5 is exposed to perform the same test as described above. In this case, the connection resistance value of the electromagnetic wave shielding layer 5 before the cold and hot cycle test was obtained after removing the measurement portion of the insulating layer in the same manner as described above in other places of the same sample.

+++: the ratio of (the connection resistance after alternate exposure)/(the initial connection resistance) is less than 1.5, which is extremely preferable.

++: the ratio of (the connection resistance after alternate exposure)/(the initial connection resistance) is preferably 1.5 or more and less than 3.0.

+: the ratio of (the connection resistance after alternate exposure)/(the initial connection resistance) is 3.0 or more and less than 5.0.

NG: (connection resistance after alternate exposure)/(initial connection resistance) is 5.0 or more.

The evaluation results of examples C1 to C9 and reference example C1 are shown in table 4.

TABLE 4

As shown in the examples of table 4, the cooling and heating cycle test of the electronic component mounting substrate using the electromagnetic wave shielding member of reference example 1 having the root mean square height Rq of 0.3 or more did not reach the acceptable level. In contrast, it was confirmed that the electromagnetic wave shielding members of the electronic component mounting substrate of the present invention all reached the acceptable level, and the coating properties were excellent under severe conditions of the cold and hot cycle test. In addition, it has been confirmed that in the singulation step, coating defects such as lifting or peeling can be effectively prevented in the electromagnetic wave shielding member. Further, it was confirmed that the electromagnetic wave shielding member of the electronic component mounting substrate of the present invention is excellent in antifouling property.

Claims

1. An electronic component mounting substrate, comprising:

A substrate;

an electronic component mounted on at least one surface of the substrate; and

an electromagnetic wave shielding member that covers the substrate from the upper surface of the electronic component, and covers at least a part of the side surface of the step portion formed by mounting the electronic component and the substrate;

the electromagnetic wave shielding member has an electromagnetic wave shielding layer containing a binder resin and a conductive filler,

the surface layer of the electromagnetic wave shielding member is in accordance with japanese industrial standard B0601:2001 is a kurtosis of 1 to 8,

the surface layer of the electromagnetic wave shielding member is in accordance with japanese industrial standard B0601: the root mean square height Rq measured in 2001 is 0.3 μm to 1.7. Mu.m.

2. The electronic component mounting substrate according to claim 1, wherein the conductive filler contains at least one of dendritic and needle-shaped conductive fillers.

3. An electronic component mounting substrate, comprising:

a substrate;

an electronic component mounted on at least one surface of the substrate; and

The electromagnetic wave shielding member has an electromagnetic wave shielding layer containing a binder resin and a conductive filler, and has a press-in elastic modulus of 1GPa to 10GPa,

the surface layer of the electromagnetic wave shielding member is in accordance with japanese industrial standard B0601:2001 is 1 to 8, wherein the root mean square height of the surface of the electromagnetic wave shielding member is in the range of 0.4 μm to 1.6 μm.

4. The electronic component mounting substrate according to claim 3, wherein a water contact angle of a surface layer of the electromagnetic wave shielding member is 70 ° to 110 °.

5. The electronic component mounting substrate according to claim 3, wherein the electromagnetic wave shielding member on the electronic component exhibits a cross-cut residual ratio of 23/25 or more in a tape adhesion test after a pressure cooker test based on japanese industrial standard K5600.

6. The electronic component mounting substrate according to claim 3, wherein the electromagnetic wave shielding member has a hardness of 50N/mm ² ～312N/mm ² 。

7. The electronic component mounting board according to claim 3, wherein the binder resin is obtained by thermocompression bonding a binder resin precursor containing a thermosetting resin and a curable compound having a functional group capable of crosslinking with a reactive functional group of the thermosetting resin.

8. The electronic component mounting substrate according to claim 3, wherein the electromagnetic wave shielding member has a film thickness of 10 μm to 200 μm.

9. An electronic device mounted with the electronic component mounting substrate according to any one of claims 1 to 8.