CN113134988B - Bipolar plate forming method and bipolar plate forming device - Google Patents
Bipolar plate forming method and bipolar plate forming device Download PDFInfo
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- CN113134988B CN113134988B CN202110399625.XA CN202110399625A CN113134988B CN 113134988 B CN113134988 B CN 113134988B CN 202110399625 A CN202110399625 A CN 202110399625A CN 113134988 B CN113134988 B CN 113134988B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B9/00—Presses specially adapted for particular purposes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0204—Non-porous and characterised by the material
- H01M8/0213—Gas-impermeable carbon-containing materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/023—Porous and characterised by the material
- H01M8/0234—Carbonaceous material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
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Abstract
The invention relates to a bipolar plate forming method and a device, wherein the bipolar plate forming method comprises the following steps: coating the lower molding surface of the lower mold to assist delamination; covering an isolation film on one surface of the delamination-assisting layer, which is back to the lower molding surface, and placing an original piece on the isolation film; the upper die and the lower die are close to each other, and the original piece is extruded by the upper forming surface and the lower forming surface of the upper die to form the bipolar plate. In the method for forming the bipolar plate, the original piece is punched by the upper die and the lower die to obtain the bipolar plate. Also, the delamination aid has a lower friction and is smoother, allowing the barrier film to be more easily separated. Meanwhile, the original piece and the delamination-assisting layer are separated through the isolating membrane, so that on one hand, the original piece and the delamination-assisting layer are prevented from being directly contacted and then mutually bonded, the delamination-assisting layer and the bipolar plate are prevented from being adsorbed and bonded on a mold together, and the qualified rate of the bipolar plate molding is ensured; on the other hand, the formed bipolar plate is prevented from being contaminated by substances in the delamination aiding layer, the bipolar plate is prevented from being contaminated, and the quality of the bipolar plate can be further improved.
Description
Technical Field
The invention relates to the technical field of fuel cells, in particular to a bipolar plate forming method and a bipolar plate forming device.
Background
The bipolar plate plays roles of air guide, current collection, support and the like in the proton membrane fuel cell, accounts for more than 15% of the cost of a fuel cell stack and about 60% of the weight of the stack, and is one of core parts of the fuel cell. The flexible graphite bipolar plate is used as an important research and development direction of bipolar plate technology and products, has high durability and low cost, and has considerable application prospect in the field of fuel cell commercial vehicles.
However, the research on the manufacturing technology and the production application of the flexible graphite bipolar plate also face various problems. For example, the problem of difficult demoulding exists in the compression molding process of the flexible graphite electrode plate. When the plate is very thin and the compression molding force is very large, the formed flexible graphite plate is often damaged due to adhesion in the demolding process, even the whole plate is bonded on the surface of a mold and cannot be taken down, and the phenomenon is particularly obvious when the bipolar plate is demolded on one side of the plane of the bipolar plate.
In general, in order to assist the bipolar plate ejection, an auxiliary film is provided between the bipolar plate and the mold to assist the bipolar plate ejection. However, the molding of the flexible graphite bipolar plate using the expanded graphite sheet as a raw material needs to be performed in a vacuum environment, and the auxiliary film is likely to be adsorbed and bonded to the surface of the film together with the bipolar plate, which makes the bipolar plate difficult to remove or break. Therefore, flexible graphite bipolar plates are difficult to demould, and the difficulty in demoulding can directly cause the reduction of the dimensional accuracy, the surface quality and the yield of the formed bipolar plates. In addition, the bipolar plate is adhered to the mold surface, and the cleaning process consumes a lot of time, which seriously affects the molding efficiency.
Disclosure of Invention
Therefore, it is necessary to provide a bipolar plate forming method and a bipolar plate forming apparatus for solving the problems of difficult demolding of the flexible graphite bipolar plate and low yield and forming efficiency of the bipolar plate.
A bipolar plate forming method, comprising:
coating the lower molding surface of the lower die to assist delamination;
covering an isolation film on one surface of the delamination-assisting layer, which is opposite to the lower molding surface, and placing an original piece on the isolation film;
and enabling the upper die and the lower die to approach each other, and extruding the original piece by utilizing the upper forming surface and the lower forming surface of the upper die to form the bipolar plate.
In the method for forming the bipolar plate, the lower forming surface of the lower die is coated with the separation assisting layer, then the separation assisting layer can be covered with the isolating film, and then the original piece is placed on the isolating film so as to obtain the bipolar plate by stamping the original piece by using the upper die and the lower die. The delamination aid has a low friction and is relatively smooth during the molding process, allowing the release film to be relatively easily separated. Meanwhile, the original piece and the delamination-assisting layer are separated through the isolating membrane, so that on one hand, the original piece and the delamination-assisting layer are prevented from being directly contacted and then mutually bonded, the delamination-assisting layer and the bipolar plate are prevented from being adsorbed and bonded on a mold together, and the qualified rate of the bipolar plate molding is ensured; on the other hand, the formed bipolar plate is prevented from being contaminated by substances in the delamination aiding layer, the bipolar plate is prevented from being contaminated, and the quality of the bipolar plate can be further improved.
In one embodiment, the step of driving the upper die to move close to the lower die, and forming the bipolar plate by pressing the original with the upper forming surface and the lower forming surface of the upper die further includes a step of stripping the bipolar plate, specifically:
separating the upper die and the lower die from each other;
driving one end of the bipolar plate and one end of the isolating membrane to be separated from the lower molding surface;
and blowing air between the isolating film and the lower molding surface, and simultaneously driving the bipolar plate and the other end of the isolating film to be separated from the lower molding surface.
In one embodiment, the method further comprises the following steps after the bipolar plate demolding step:
and peeling the separation film from the bipolar plate.
In one embodiment, the step of peeling the separator from the bipolar plate further comprises the following steps:
sweeping the bipolar plate peels off the surface of the separator.
In one embodiment, the delamination-assist layer is any one of a solid lubricant layer, a chromium nitride coating, and a diamond-like film coating.
In one embodiment, the barrier film is a plastic wrap.
A bipolar plate forming apparatus, comprising:
a lower die having a lower molding surface;
the upper die is provided with an upper forming surface, and the upper die and the lower die can move towards and away from each other; and
a delamination-aid layer coated on the lower molding surface and a separation film covering a side of the delamination-aid layer facing away from the lower molding surface; when the upper die and the lower die are close to each other, a forming space can be formed between the isolation film and the upper forming surface.
When the bipolar plate forming device is used, an original piece is placed on the isolating membrane, and then the upper die is driven to move to form the bipolar plate. Wherein the delamination aid has a lower friction and is smoother, allowing the barrier film to be more easily separated. Meanwhile, the original piece and the delamination-assisting layer are separated through the isolating membrane, so that on one hand, the original piece and the delamination-assisting layer are prevented from being bonded with each other after being directly contacted, the delamination-assisting layer and the bipolar plate are prevented from being adsorbed and bonded on a die together, and the qualified rate of the bipolar plate forming is ensured; on the other hand, the formed bipolar plate is prevented from being contaminated by substances in the delamination aiding layer, the bipolar plate is prevented from being contaminated, and the quality of the bipolar plate can be further improved.
In one embodiment, the device further comprises a plurality of limiting assemblies, the limiting assemblies are arranged on the lower die around the periphery of the lower forming surface, and the isolating films are sleeved on the limiting assemblies.
In one embodiment, each limiting assembly comprises an adsorption part and a fixing wire, the adsorption part is detachably assembled on the lower die, the fixing wire is connected with the adsorption part, and the isolating film is sleeved on the fixing wire.
In one embodiment, the air source assembly further comprises a filter element, a flow regulating element and a blowing head, wherein the filter element is arranged upstream of the blowing head and used for filtering water vapor and impurities in the air flow, and the flow regulating element is arranged upstream of the blowing head and used for regulating the flow of the air flow flowing to the blowing head.
In one embodiment, a plurality of airflow branches are formed inside the blowing head, and the blowing head is provided with an air outlet communicated with the airflow branches, wherein the air outlet is long-strip-shaped.
Drawings
FIG. 1 is a schematic diagram illustrating steps of a bipolar plate forming method according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a bipolar plate forming apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic view of a retainer assembly of the bipolar plate forming apparatus shown in FIG. 2;
fig. 4 is a schematic view showing the arrangement of a gas source assembly in the bipolar plate forming apparatus shown in fig. 2.
100. A bipolar plate forming device; 10. a lower die; 11. a lower molding surface; 30. assisting in delamination; 50. an isolation film; 70. an upper die; 71. forming a molding surface; 80. a limiting component; 82. an adsorbing member; 84. fixing the wire; 90. a gas source assembly; 92. a sweeping head; 93. and an air outlet.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the second feature or the first and second features may be indirectly contacting each other through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Referring to fig. 1, in one embodiment of the present invention, a bipolar plate forming method is provided, which includes the following steps:
in step S100, a delamination assisting layer 30 is coated on the lower molding surface 11 of the lower mold 10. The delamination-assisting layer 30 may be any one of a solid lubricant layer, a chromium nitride coating layer, and a diamond-like film coating layer. For example, the separation-assisting layer 30 is a solid lubricant layer, and the solid lubricant powder is coated on the lower molding surface 11 by a coating tool, and the powder is uniformly dispersed on the lower molding surface 11 during coating, so that the powder is prevented from being aggregated into blocks, and finally a layer of mold-assisting is formed. Also for example, a chromium nitride coating or a diamond-like carbon film coating (DLC) may be applied.
In step S300, a surface of the delamination-assisting layer 30 opposite to the lower molding surface 11 is covered with a separation film 50, and the original is placed on the separation film 50. After the process of coating the delamination-aid layer 30 is finished, an isolation film 50 can be covered on the delamination-aid layer 30, and then an original piece is placed on the isolation film 50, so that the original piece and the delamination-aid layer 30 can be separated through the isolation film 50, on one hand, the original piece is prevented from being mutually bonded when vacuum extrusion forming is carried out subsequently after being directly contacted with the delamination-aid layer 30, the delamination-aid layer 30 and the original piece are prevented from being together adsorbed and bonded on a mould, and the qualification rate of the formed bipolar plate is ensured; on the other hand, the formed bipolar plate is prevented from being contaminated with the material in the delamination assisting layer 30, and the bipolar plate is prevented from being contaminated.
Optionally, the isolation film 50 is a preservative film, and is preferably made of polyethylene or polyvinyl chloride, so that an original can be effectively isolated and demolding is assisted, and the isolation film is smooth, so that separation from demolding during subsequent demolding is facilitated, and the demolding difficulty is further reduced.
Step S500, the upper mold 70 and the lower mold 10 are moved closer to each other, for example, the upper mold 70 is driven to move closer to the lower mold 10, or the lower mold 10 is driven to move closer to the upper mold 70, so as to press the element to form the bipolar plate by the upper molding surface 71 and the lower molding surface 11 of the upper mold 70. Equivalently, the original is changed into a bipolar plate having flow channels by the pressing of the upper mold 70 and the lower mold 10.
In the method for forming the bipolar plate, the separation-assisting layer 30 is coated on the lower forming surface 11 of the lower mold 10, then the separation-assisting layer 30 may be covered with the isolation film 50, and then the original is placed on the isolation film 50, so that the original is punched by the upper mold 70 and the lower mold 10 to obtain the bipolar plate. The assisted delamination 30 has a relatively low friction and is relatively smooth during the molding process, allowing the separator 50 to be more easily separated. Meanwhile, the original piece and the delamination-assisting layer 30 are separated through the isolating film 50, so that on one hand, the original piece and the delamination-assisting layer 30 are prevented from being directly contacted and then mutually bonded, the delamination-assisting layer 30 and the bipolar plate are prevented from being adsorbed and bonded on a mold together, and the forming qualification rate of the bipolar plate is ensured; on the other hand, the formed bipolar plate is prevented from being contaminated by the substances in the delamination-assisting layer 30, the bipolar plate is prevented from being contaminated, and the quality of the bipolar plate can be further improved.
Further, the bipolar plate forming method further includes a bipolar plate demolding step S700, where the bipolar plate demolding step S700 specifically includes:
in step S710, the upper mold 70 and the lower mold 10 are separated from each other, for example, the upper mold 70 is driven to move in a direction away from the lower mold 10, and the upper mold 70 is separated from the lower mold 10 after completion of the pressing, and returns to the initial position.
Step S730, driving one end of the bipolar plate and the isolation film 50 to separate from the lower molding surface 11;
in step S750, air is blown between the isolation film 50 and the lower molding surface 11, and the bipolar plate and the other end of the isolation film 50 are also driven to separate from the lower molding surface 11. The bipolar plate and the isolating film 50 are gradually separated from one end of the lower molding surface 11 to the other end, so that the isolating film 50 is gradually separated from the lower molding surface 11, and the demolding effect is ensured. Meanwhile, in the demolding process, air is blown between the isolating film 50 and the lower molding surface 11, the air flow can assist in pushing the isolating film 50 to be separated from the lower molding surface 11, meanwhile, in the separating process, the blowing force of the air flow is uniform, the isolating film 50 can be completely separated from the lower molding surface 11, and the demolding effect is improved.
Further, the bipolar plate demolding step S700 is followed by the following steps:
step S800, the separator 50 is peeled off from the bipolar plate. After the bipolar plate is completely separated from the mold by the separator 50, the separator 50 is peeled off from the bipolar plate.
Step S900, cleaning the surface of the bipolar plate stripped from the isolating membrane 50, cleaning the bipolar plate, and preventing the bipolar plate from influencing the performance of the bipolar plate due to low surface smoothness of the bipolar plate attached to the isolating membrane 50 so as to obtain the bipolar plate with good surface quality. In particular, cleaning may be performed using a cleaning tool, such as a soft brush or a lint. In addition, if the production volume of the bipolar plates is small, the bipolar plates can be cleaned manually, if the production volume is large, a mode of a conveyor belt combined with rollers can be adopted, and a plurality of bipolar plates can be continuously cleaned through the rotating rollers, so that the cleaning efficiency is improved.
Referring to fig. 1-2, in accordance with the same inventive concept, in one embodiment of the present invention, a bipolar plate forming apparatus 100 is further provided, which includes a lower mold 10 and an upper mold 70. The lower mold 10 has a lower molding surface 11, the upper mold 70 has an upper molding surface 71, and the upper mold 70 and the lower mold 10 are movable in directions to approach and separate from each other, for example, the upper mold 70 is movable in directions to approach and separate from the lower mold 10, so as to mold a bipolar plate by pressing the upper molding surface 71 and the lower molding surface 11 with respect to an original placed between the upper mold 70 and the lower mold 10.
Further, the bipolar plate forming device 100 further comprises a delamination-assisting layer 30 and a separation film 50, wherein the delamination-assisting layer 30 is coated on the lower forming surface 11, and the separation film 50 is covered on one side of the delamination-assisting layer 30, which is opposite to the lower forming surface 11; when the upper mold 70 and the lower mold 10 approach each other, a molding space for accommodating an original can be formed between the isolation film 50 and the upper molding surface 71. In the molding process, the original is placed on the separator 50, and then the upper mold 70 is driven to move to mold the bipolar plate. Wherein the delamination-assisting layer 30 has a low friction and is smooth, allowing the separation film 50 to be easily separated. Meanwhile, the original piece and the assisted layer 30 are separated through the isolating film 50, so that on one hand, the original piece and the assisted layer 30 are prevented from being bonded with each other after being directly contacted, the assisted layer 30 and the bipolar plate are prevented from being adsorbed and bonded on a mold together, and the qualified rate of the bipolar plate forming is ensured; on the other hand, the formed bipolar plate is prevented from being contaminated by the substances in the delamination-assisting layer 30, the bipolar plate is prevented from being contaminated, and the quality of the bipolar plate can be further improved.
Alternatively, the delamination-assisting layer 30 may be any one of a solid lubricant layer, a chromium nitride coating, and a diamond-like film coating. For example, the separation-assisting layer 30 is a solid lubricant layer, and the solid lubricant powder is coated on the lower molding surface 11 by a coating tool, and the powder is uniformly dispersed on the lower molding surface 11 during coating, so that the powder is prevented from being aggregated into blocks, and finally a layer of mold-assisting is formed. Also for example, a chromium nitride coating or a diamond-like carbon film coating (DLC) may be applied.
Optionally, the isolation film 50 is a preservative film, and is preferably made of polyethylene or polyvinyl chloride, so that an original can be effectively isolated and demolding can be assisted, and the isolation film is smooth, so that the isolation film can be conveniently separated from the demolding during subsequent demolding, and the demolding difficulty is further reduced.
In some embodiments, the bipolar plate forming apparatus 100 further includes a plurality of limiting assemblies 80, the limiting assemblies 80 are arranged on the lower mold 10 around the periphery of the lower forming surface 11, and the isolating membrane 50 is sleeved on the limiting assemblies 80, so that the isolating membrane 50 can be fixed and installed by the limiting assemblies 80, the isolating membrane 50 is fixed and supported on the delamination-assisting layer 30, and the isolating membrane 50 can be kept flat during the forming process, thereby ensuring the forming effect.
Referring to fig. 3, further, each of the position limiting assemblies 80 includes an adsorption member 82 and a fixing wire 84, the adsorption member 82 is detachably mounted on the lower mold 10, and the position limiting assemblies 80 can be conveniently mounted and dismounted through the adsorption member 82; the fixed wire 84 is connected with the adsorption element 82, the isolating membrane 50 is sleeved on the fixed wire 84, a plurality of positions of the isolating membrane 50 are penetrated by a plurality of fixed wires 84, and the isolating membrane 50 is limited and fixed. Alternatively, the attraction member 82 is a magnet. Still optionally, the fixing wire 84 has flexibility, and the orientation of the fixing wire 84 can be adjusted according to actual installation conditions, so that the fixing wire 84 has better universality.
Referring to fig. 4, in some embodiments, the bipolar plate forming apparatus 100 further comprises a gas supply assembly 90, the gas supply assembly 90 comprising a filter element and a purge head 92, the filter element being located upstream of the purge head 92 for filtering moisture and contaminants from the gas stream. During the demolding, the primary element is used to blow air between the isolation film 50 and the lower molding surface 11, and the filter element filters out moisture from the air flow, thereby preventing the moisture from remaining on the lower molding surface 11 during the blowing process and corroding and damaging the mold. Further, the air source assembly 90 further includes a flow regulating member disposed at the upstream of the blowing head 92 for regulating the flow of the air flowing to the blowing head 92, so that the flow of the air flowing between the isolating membrane 50 and the lower molding surface 11 is moderate, and sufficient driving force can be provided to ensure effective separation of the isolating membrane 50 and the bipolar plate from the mold, and damage to the bipolar plate due to excessive air flow can be prevented.
Furthermore, a plurality of air flow branches are formed inside the blowing head 92, the blowing head 92 is provided with air outlets 93 communicated with the plurality of air flow branches, the air outlets 93 are strip-shaped, air flows flowing out of the plurality of air flow branches can uniformly flow out of the strip-shaped air outlets 93, and uniform air flow blowing force can be applied to each position of the bipolar plate. Optionally, the length of the purge head 92 in the length direction is greater than the width of the bipolar plate, and the blowing range equivalent to the purge head 92 can completely cover the separation part of the bipolar plate and the mold, so that the uniform demolding of the bipolar plate can be assisted.
The bipolar plate forming apparatus 100 has the following advantages:
(1) The bipolar plate forming apparatus 100 may be used by placing an original on the separator 50 and then driving the upper mold 70 to move to form the bipolar plate. Wherein the delamination-assisting layer 30 has a low friction and is relatively smooth, allowing the separation film 50 to be separated relatively easily. Meanwhile, the original piece and the delamination-assisting layer 30 are separated through the isolating film 50, so that on one hand, the original piece and the delamination-assisting layer 30 are prevented from being directly contacted and then mutually bonded, the delamination-assisting layer 30 and the bipolar plate are prevented from being adsorbed and bonded on a mold together, and the forming qualification rate of the bipolar plate is ensured; on the other hand, the formed bipolar plate is prevented from being contaminated by the substances in the delamination-assisting layer 30, the bipolar plate is prevented from being contaminated, and the quality of the bipolar plate can be further improved.
(2) The bipolar plate forming device 100 further comprises a plurality of limiting assemblies 80, the limiting assemblies 80 are arranged on the lower die 10 around the periphery of the lower forming surface 11, the isolating membrane 50 is sleeved on the limiting assemblies 80, the isolating membrane 50 is fixed through the limiting assemblies 80 in an installing mode, the isolating membrane 50 is fixed on the separation assisting layer 30 in an opening mode, the isolating membrane 50 can be kept flat in the forming process, and the forming effect is guaranteed.
(3) The filtering piece in the air source assembly 90 filters out water vapor in air flow, and can prevent water vapor from remaining on the lower forming surface 11 in the blowing process to corrode and damage the die. Moreover, the flow of the air flow flowing to the blowing head 92 can be adjusted by the flow adjusting piece, so that the flow of the air flow blown to the space between the isolating membrane 50 and the lower molding surface 11 is moderate, enough driving force can be provided to ensure that the isolating membrane 50 and the bipolar plate are effectively separated from the mold, and the bipolar plate can be prevented from being damaged due to overlarge air flow.
The bipolar plate forming method and the bipolar plate forming device can be used for forming rigid bipolar plates, particularly flexible bipolar plates, and can greatly improve the forming quality.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. A method of forming a bipolar plate, comprising:
coating the lower molding surface of the lower mold to assist delamination;
covering a separation film on one side of the delamination-assisting layer, which faces away from the lower molding surface, and placing an original piece on the separation film;
enabling an upper die and the lower die to approach each other, and extruding the original piece by utilizing an upper molding surface and a lower molding surface of the upper die to form a bipolar plate;
separating and demolding the isolating film and the bipolar plate from the delamination-assisting layer simultaneously;
the upper die is driven to move towards the lower die, and the step of demoulding the bipolar plate is further included after the step of extruding the original piece by utilizing the upper forming surface and the lower forming surface of the upper die to form the bipolar plate, and the method specifically comprises the following steps:
moving the upper die and the lower die away from each other;
driving one end of the bipolar plate and one end of the isolating membrane to be separated from the lower molding surface;
blowing air between the isolating membrane and the lower molding surface, and simultaneously driving the other ends of the bipolar plate and the isolating membrane to be separated from the lower molding surface;
the delamination-assisting layer is a solid lubricant layer, and the isolating film is a preservative film.
2. The bipolar plate molding method as claimed in claim 1, further comprising the steps of, after the bipolar plate demolding step:
and peeling the separation film from the bipolar plate.
3. The method of forming a bipolar plate as claimed in claim 2, wherein the step of peeling the separator from the bipolar plate further comprises the steps of:
sweeping the bipolar plate peels off the surface of the separator.
4. A bipolar plate molding apparatus used in the bipolar plate molding method of any one of claims 1 to 3, comprising:
a lower die having a lower molding surface;
the upper die is provided with an upper forming surface, and the upper die and the lower die can move towards and away from each other; and
a delamination-aid layer coated on the lower molding surface and a separation film covering a side of the delamination-aid layer facing away from the lower molding surface; when the upper die and the lower die are close to each other, a forming space can be formed between the isolation film and the upper forming surface.
5. The bipolar plate forming apparatus as claimed in claim 4, further comprising a plurality of limiting assemblies, wherein the limiting assemblies are arranged around the periphery of the lower forming surface and are disposed on the lower mold, and the isolating membrane is sleeved on the limiting assemblies.
6. The bipolar plate forming apparatus as claimed in claim 5, wherein each of the position limiting assemblies includes an absorption member and a fixing wire, the absorption member is detachably mounted on the lower mold, the fixing wire is connected to the absorption member, and the isolation film is sleeved on the fixing wire.
7. The bipolar plate forming apparatus as claimed in any one of claims 4 to 6, further comprising an air supply assembly, wherein the air supply assembly comprises a filter element, a flow regulator and a purge head, the filter element is disposed upstream of the purge head for filtering moisture and impurities from the air flow, and the flow regulator is disposed upstream of the purge head for regulating the flow of air to the purge head.
8. A bipolar plate forming apparatus as claimed in claim 7, wherein a plurality of gas flow branches are formed inside the purge head, and gas outlets communicating with the gas flow branches are formed on the purge head, and the gas outlets are elongated.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110399625.XA CN113134988B (en) | 2021-04-14 | 2021-04-14 | Bipolar plate forming method and bipolar plate forming device |
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