CN113115521B - Reworking and repairing device and method for microwave assembly bonding process integrated device - Google Patents
Reworking and repairing device and method for microwave assembly bonding process integrated device Download PDFInfo
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- CN113115521B CN113115521B CN202110295479.6A CN202110295479A CN113115521B CN 113115521 B CN113115521 B CN 113115521B CN 202110295479 A CN202110295479 A CN 202110295479A CN 113115521 B CN113115521 B CN 113115521B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
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Abstract
The invention discloses a rework and repair device and a rework and repair method for microwave assembly bonding process integrated devices, wherein the device comprises a lower tray and an upper cover plate component, the lower tray is placed on a workbench, the upper cover plate component is placed on the lower tray, the lower tray is connected with the upper cover plate component through a bolt, a rework and repair product is clamped between the lower tray and the upper cover plate component, and the distance between the lower tray and the upper cover plate component can be adjusted according to different sizes of the product; a bolt mounting counter bore is processed on the lower tray; the upper cover plate component comprises a pressing plate, an acrylic plate, a bottom plate and the like; the invention can realize economical and efficient rework and repair of the bonding device of the high-density hybrid integrated microwave assembly, can meet the rework and repair of the bonding device at different positions of products with different sizes, can realize cold prying of the device, avoids secondary damage of operators and splashes to intact devices and interconnection wires in the prying process, reduces heating procedures, shortens rework and repair time and improves rework and repair efficiency.
Description
Technical Field
The invention relates to the technical field of rework and repair of bonding devices, in particular to a rework and repair device and method of a microwave assembly bonding process integrated device.
Background
The semiconductor integrated circuit completes electronic interconnection on a chip, on the basis of the semiconductor integrated circuit, the mixed integrated circuit technology of wire bonding, tape bonding, soldering and the like pushes electronic equipment and products to be continuously developed towards thinness, lightness, shortness and smallness, and the mixed integrated microwave assembly has the characteristics of integration, high density, small batch, multiple varieties and the like. In the mixed integrated microwave assembly, a bare tube core, a microwave printed circuit board, a thin film circuit board, an LTCC circuit board and other components are mostly integrated by adopting a bonding process, in the product debugging process, the bonded components which fail frequently are reworked and repaired, due to the factors of high product integration density, high product heating temperature, lack of supporting points and the like, in the process of picking the failed components, the hands of an operator or splashes picked by the operator are easy to damage the bare tube core, gold wires, gold tapes and other intact components or interconnection wires, secondary reworking and repairing are induced, the reworking and repairing cost is increased, the resource waste is caused, and the reworking efficiency is lower.
The novel BGA repair workbench disclosed by Chinese patents 201920520537.9, 201920490836.2, 201410134711.8, 201721528465.X and the like is mainly applied to BGA repair of welding in the PCBA industry, and has the structural characteristics of a local heating device and a driving platform. Chinese patent 201110266688.4, a method for transferring paste flux during the repair of BGA devices, discloses a process for precisely controlling the height of paste flux coated on the surface of solder balls during the repair of BGA devices, which can prevent the BGA devices or printed boards from being discarded due to improper soldering of BGA solder balls. Chinese patent 201810992775.X 'A full-automatic repair and unsolder method' discloses a full-automatic repair and unsolder method, which can reliably and efficiently finish the unsolder and unsolder of a PCB (printed Circuit Board) by means of soldering flux spraying, PCB preheating, robot unsolder and the like to perform unsolder and reprocess on the PCB attached with electrical elements.
Chinese patent 201610840013.9 "a special fixture for gold and tin removing of QFN packaged components and methods for gold and tin removing" discloses a device for removing gold and tin through moving a lower support mechanism and an upper support plate installed on a guide rail to make a pad of a QFN device pass through a gushed molten tin-lead alloy wave crest, thereby completing gold and tin removing. Chinese patent 201320149654.1 "diode poor welding repair workbench" discloses a diode repair workbench with preheating function, which can realize repair or replacement of diodes rapidly by means of electric soldering iron, and reduce the damage rate of diodes. Chinese patent 201721025774.5 "a photovoltaic cell string repair workbench" discloses a method for heating and series welding a photovoltaic cell string by using a turning clamp and a series welding module, which avoids the undesirable problems of hidden cracks and the like caused by manually turning the cell string. The repair workbench disclosed in chinese patent 201220509728.3 "photovoltaic module repair workbench" facilitates operators to clearly see the string spacing of the battery strings and the piece spacing of the battery pieces in the photovoltaic module by means of the tempered glass and the illuminating lamp, and facilitates the operators to control the precision.
The reworking and reworking device for BGA, diode, QFN device, mounted electrical element, photovoltaic cell string and other integrated devices adopting welding process is characterized in that the local heating unsoldering and reworking efficiency of the devices are concerned, the reworking and reworking device for the integrated devices adopting bonding process is not known, and particularly, other reworking and reworking devices and methods for the bonded devices of the high-density hybrid integrated microwave assembly are not known.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a rework and rework device and a rework and rework method for a microwave assembly bonding process integrated device, which can realize economic and efficient rework and rework of a high-density hybrid integrated microwave assembly bonding device, can meet the rework and rework of bonding devices of different positions of products with different sizes, can realize cold prying of the device, avoid secondary damage of operators and splashes to intact devices and interconnection wires in the prying process, reduce the heating process, shorten the rework and rework time and improve the rework and rework efficiency.
The purpose of the invention is realized by the following scheme:
a rework and repair device of a microwave assembly bonding process integrated device comprises a lower tray and an upper cover plate component, wherein the lower tray is placed on a workbench, the upper cover plate component is placed on the lower tray, the lower tray is connected with the upper cover plate component through a bolt, a rework and repair product is clamped between the lower tray and the upper cover plate component, and the distance between the lower tray and the upper cover plate component can be adjusted according to different sizes of the product; a bolt mounting counter bore is machined in the lower tray; the upper cover plate component comprises a pressing plate, an acrylic plate and a bottom plate, wherein slotted holes of matrix types with the same size are processed in the same position of the pressing plate and the bottom plate in the vertical projection direction, the acrylic plate with the same specification is placed between the pressing plate and the bottom plate, and the pressing plate and the bottom plate are fixed through peripheral screws; a gap is formed between the pressing plate and the bottom plate to ensure that the acrylic plate can freely move back and forth, left and right in the plane of the upper cover plate component; the length and the width of the slotted holes in the pressure plate and the bottom plate are smaller than those of the acrylic plate; the acrylic plate matrix can be moved quickly to form a new jigsaw puzzle so as to expose different positions of the product.
Further, the bolt includes a hexagon socket head cap screw.
Furthermore, a mounting counter bore of the hexagon socket head cap screw is processed on the lower tray.
Further, the acrylic plate is made of a transparent material.
Furthermore, the acrylic plates are arranged in a matrix mode, and the number of the acrylic plates is smaller than that of the slotted holes in the bottom plate.
A rework and rework method for integrated devices of a microwave assembly bonding process adopts any one of the rework and rework devices, and comprises the following steps:
step 001, clamping the product;
step 002, moving the acrylic plate matrix to expose the failed component;
step 003, cold prying to obtain a failure component and cleaning residual glue;
step 004, detaching the product;
and 005, re-bonding the components.
Further, in step 001, the method comprises the following steps: and adjusting the distance between the lower tray and the upper cover plate part according to the height of the product, clamping the product between the lower tray and the upper cover plate part, screwing the nut on the hexagon socket head cap screw, and clamping the product.
Further, in step 002, the following steps are included: and according to the position of the product to be reworked and repaired, moving the acrylic plate matrix jigsaw to expose the failed component and cover other intact components and interconnection wires.
Further, in step 003, the method comprises the following steps: the cover plate component above the hand of the operator is used as a supporting point, the heating product softening glue is not needed, the failed component is directly taken by cold prying by using the scalpel, and the residual glue is cleaned up.
Further, in step 004, the following steps are included: and loosening the nut on the inner hexagon bolt, and taking down the product.
The invention has the beneficial effects that:
the rework and rework device and the method of the embodiment of the invention can realize economic and efficient rework and rework of the bonding device of the high-density hybrid integrated microwave assembly, and can meet the rework and rework of the bonding device at different positions of products with different sizes; meanwhile, the reworked product is not required to be heated and softened to glue during reworking and reworking, the cold prying of the device can be realized, the secondary damage of an operator and splashes to the intact device and the interconnection wire in the prying process is avoided, the heating process is reduced, and the reworking and reworking time is shortened. The reworking and reworking device and method are suitable for reworking and reworking the bonded devices at different positions of products with different sizes, and can improve the reworking and reworking efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of the apparatus of the present invention;
FIG. 2 is a flow chart of the method of the present invention;
FIG. 3 is a schematic view of a product placement configuration of an embodiment of the apparatus of the present invention;
in the figure, 1-hexagon socket head cap screw, 2-lower tray, 3-nut, 4-upper cover plate component, 5-product, 401-bottom plate, 402-acrylic plate, 403-screw, 404-pressing plate, 501-failure component, 502-failure component and 503-failure component.
Detailed Description
All features disclosed in all embodiments in this specification, or all methods or process steps implicitly disclosed, may be combined and/or expanded, or substituted, in any way, except for mutually exclusive features and/or steps.
As shown in fig. 1 to 3, a rework repair device for a microwave assembly bonding process integrated device comprises a lower tray and an upper cover plate component, wherein the lower tray is placed on a workbench, the upper cover plate component is placed on the lower tray, the lower tray is connected with the upper cover plate component through a bolt, a rework repair product is clamped between the lower tray and the upper cover plate component, and the distance between the lower tray and the upper cover plate component can be adjusted according to different sizes of the product; a bolt mounting counter bore is machined in the lower tray; the upper cover plate component comprises a pressing plate, an acrylic plate and a bottom plate, wherein slotted holes of matrix types with the same size are processed in the same position of the pressing plate and the bottom plate in the vertical projection direction, the acrylic plate with the same specification is placed between the pressing plate and the bottom plate, and the pressing plate and the bottom plate are fixed through peripheral screws; a gap is formed between the pressing plate and the bottom plate to ensure that the acrylic plate can freely move back and forth, left and right in the plane of the upper cover plate component; the length and the width of the slotted holes in the pressure plate and the bottom plate are smaller than those of the acrylic plate; the acrylic plate matrix can be moved quickly to form a new jigsaw puzzle so as to expose different positions of the product.
Further, the bolt includes a hexagon socket head cap screw.
Furthermore, a mounting counter bore of the hexagon socket head cap screw is processed on the lower tray.
Further, the acrylic plate is made of a transparent material.
Furthermore, the acrylic plates are arranged in a matrix mode, and the number of the acrylic plates is smaller than that of the slotted holes in the bottom plate.
The rework and repair method for the integrated device of the high-density hybrid integrated microwave assembly bonding process adopts any one of the rework and repair devices, and comprises the following steps:
step 001, clamping the product;
step 002, moving the acrylic plate matrix to expose the failed component;
step 003, cold prying to obtain a failure component and cleaning residual glue;
step 004, detaching the product;
and 005, re-bonding the components.
Further, in step 001, the method comprises the following steps: and adjusting the distance between the lower tray and the upper cover plate part according to the height of the product, clamping the product between the lower tray and the upper cover plate part, screwing the nut on the hexagon socket head cap screw, and clamping the product.
Further, in step 002, the following steps are included: and according to the position of the product to be reworked and repaired, moving the acrylic plate matrix jigsaw to expose the failed component and cover other intact components and interconnection wires.
Further, in step 003, the method comprises the following steps: the cover plate component above the hand of the operator is used as a supporting point, the heating product softening glue is not needed, the failed component is directly taken by cold prying by using the scalpel, and the residual glue is cleaned up.
Further, in step 004, the following steps are included: and loosening the nut on the inner hexagon bolt, and taking down the product.
In the invention, a lower tray in the rework and repair device is placed on a workbench, an upper cover plate component in the rework and repair device is placed on the lower tray, the lower tray is connected with the upper cover plate component through hexagon socket head cap screws, a rework and repair product is clamped between the lower tray and the upper cover plate component, and the distance between the lower tray and the upper cover plate component can be adjusted according to different sizes of the product. A lower tray in the reworking and repairing device is provided with a hexagon socket head cap screw mounting counter bore, so that a product can be clamped conveniently and rapidly; the upper cover plate component in the rework and repair device consists of a pressing plate, an acrylic plate and a bottom plate, slotted holes of matrix types with the same size are processed in the same positions of the vertical projection directions on the pressing plate and the bottom plate, the acrylic plate with the same specification is placed between the pressing plate and the bottom plate, and the pressing plate and the bottom plate are fixed through screws all around. A gap is designed between the pressure plate and the bottom plate to ensure that the acrylic plate can freely move back and forth, left and right in the plane of the upper cover plate component; the length and the width of the slotted holes in the pressure plate and the bottom plate are slightly smaller than those of the acrylic plate, so that the acrylic plate is prevented from falling out of the upper cover plate component; the acrylic plate is made of transparent material to ensure that reworked and reworked products can be seen clearly; the acrylic plate matrix is placed, the number of the acrylic plate matrix is smaller than that of the slotted holes in the bottom plate, and the acrylic plate matrix can be quickly moved to form a new jigsaw so as to expose different positions of the product.
In another embodiment of the present invention, there may be provided a rework and repair apparatus for a high-density hybrid integrated microwave assembly bonded device, which is described in this embodiment and is shown in fig. 1. The lower tray 2 is placed on the workbench, the upper cover plate component 4 is placed on the lower tray 2, and the lower tray 2 is connected with the upper cover plate component 4 through the hexagon socket head cap screw 1; a certain number of acrylic plates 402 are put into the bottom plate 401 to form a matrix puzzle, a pressing plate 404 is used for pressing the acrylic plates 402 and is locked by a screw 403, and a gap is designed between the pressing plate 404 and the bottom plate 401 to ensure that the acrylic plates 402 can freely move in the plane of the upper cover plate component 4. The situation of placing the product in this embodiment is shown in fig. 3, the distance between the lower tray 2 and the upper cover plate part 4 is adjusted to place the product 5, after the nut 4 is screwed to clamp the product 5, the acrylic plate 402 matrix jigsaw is moved to expose the failed component according to the positions of the failed component 501, the failed component 502 and the failed component 503 on the product 5, so as to cover other components and interconnection wires, the upper cover plate part 4 on the hand of an operator is used as a supporting point, the product softening glue does not need to be heated, the failed component 501, the failed component 502 and the failed component 503 are directly picked by cold prying with a scalpel, and the residual glue is cleaned; if other failure components exist, the acrylic plate matrix jigsaw is moved to repeat the operations until all the failure components are cleaned; loosening the nut on the inner hexagon bolt, and detaching the product; and re-bonding the new component.
Other embodiments than the above examples may be devised by those skilled in the art based on the foregoing disclosure, or by adapting and using knowledge or techniques of the relevant art, and features of various embodiments may be interchanged or substituted and such modifications and variations that may be made by those skilled in the art without departing from the spirit and scope of the present invention are intended to be within the scope of the following claims.
Claims (10)
1. A rework and repair device of a microwave assembly bonding process integrated device is characterized by comprising a lower tray and an upper cover plate component, wherein the lower tray is placed on a workbench, the upper cover plate component is placed on the lower tray, the lower tray is connected with the upper cover plate component through a bolt, a rework and repair product is clamped between the lower tray and the upper cover plate component, and the distance between the lower tray and the upper cover plate component can be adjusted according to different sizes of the product; a bolt mounting counter bore is machined in the lower tray; the upper cover plate component comprises a pressing plate, an acrylic plate and a bottom plate, wherein slotted holes of matrix types with the same size are processed in the same position of the pressing plate and the bottom plate in the vertical projection direction, the acrylic plate with the same specification is placed between the pressing plate and the bottom plate, and the pressing plate and the bottom plate are fixed through peripheral screws; a gap is formed between the pressing plate and the bottom plate to ensure that the acrylic plate can freely move back and forth, left and right in the plane of the upper cover plate component; the length and the width of the slotted holes in the pressure plate and the bottom plate are smaller than those of the acrylic plate; the acrylic plate matrix can be moved quickly to form a new jigsaw puzzle so as to expose different positions of the product.
2. The rework repair apparatus for microwave assembly bonding process integrated devices as recited in claim 1, wherein said bolts comprise hexagon socket head cap bolts.
3. The rework repair device of the microwave assembly bonding process integrated device according to any one of claims 1 or 2, wherein the lower tray is provided with a hexagon socket head cap screw mounting counter bore.
4. The rework device of claim 1, wherein the acrylic plate is made of transparent material.
5. The rework device of claim 1, wherein the acrylic boards are arranged in a matrix form, and the number of the acrylic boards is smaller than the number of the slots on the bottom board.
6. A rework and rework method of microwave assembly bonding process integrated devices, characterized in that the rework and rework device as claimed in any one of claims 1 to 5 is used, and the following steps are implemented:
step 001, clamping the product;
step 002, moving the acrylic plate matrix to expose the failed component;
step 003, cold prying to obtain a failure component and cleaning residual glue;
step 004, detaching the product;
and 005, re-bonding the components.
7. The method of claim 6, wherein in step 001, the method comprises the following steps: and adjusting the distance between the lower tray and the upper cover plate part according to the height of the product, clamping the product between the lower tray and the upper cover plate part, screwing the nut on the hexagon socket head cap screw, and clamping the product.
8. The method of claim 6, wherein in step 002, the method comprises the following steps: and according to the position of the product to be reworked and repaired, moving the acrylic plate matrix jigsaw to expose the failed component and cover other intact components and interconnection wires.
9. The method of claim 6, wherein in step 003, the method comprises the steps of: the cover plate component above the hand of the operator is used as a supporting point, the heating product softening glue is not needed, the failed component is directly taken by cold prying by using the scalpel, and the residual glue is cleaned up.
10. The method of claim 6, wherein in step 004, the method comprises the following steps: and loosening the nut on the inner hexagon bolt, and taking down the product.
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| CN202110295479.6A CN113115521B (en) | 2021-03-19 | 2021-03-19 | Reworking and repairing device and method for microwave assembly bonding process integrated device |
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| CN202110295479.6A CN113115521B (en) | 2021-03-19 | 2021-03-19 | Reworking and repairing device and method for microwave assembly bonding process integrated device |
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| CN113115521A CN113115521A (en) | 2021-07-13 |
| CN113115521B true CN113115521B (en) | 2022-02-15 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203392123U (en) * | 2013-07-22 | 2014-01-15 | 株洲时代新材料科技股份有限公司 | Spliced combined plastic pallet |
| WO2016046796A2 (en) * | 2014-09-26 | 2016-03-31 | Universita' Degli Studi Di Padova | Dissipative connection with optimized stiffness and strength for joining construction elements |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5177844A (en) * | 1992-01-15 | 1993-01-12 | Swift James C | Placement device for electronic components |
| US7768785B2 (en) * | 2004-09-29 | 2010-08-03 | Super Talent Electronics, Inc. | Memory module assembly including heat-sink plates with heat-exchange fins attached to integrated circuits by adhesive |
| US10237926B2 (en) * | 2015-11-09 | 2019-03-19 | Pace, Inc. | Inductive heater for area array rework system and soldering handpieces |
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2021
- 2021-03-19 CN CN202110295479.6A patent/CN113115521B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203392123U (en) * | 2013-07-22 | 2014-01-15 | 株洲时代新材料科技股份有限公司 | Spliced combined plastic pallet |
| WO2016046796A2 (en) * | 2014-09-26 | 2016-03-31 | Universita' Degli Studi Di Padova | Dissipative connection with optimized stiffness and strength for joining construction elements |
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