CN113115510A - Printed circuit board heat dissipation system using high-thermal-conductivity substrate - Google Patents
Printed circuit board heat dissipation system using high-thermal-conductivity substrate Download PDFInfo
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- CN113115510A CN113115510A CN202110267093.4A CN202110267093A CN113115510A CN 113115510 A CN113115510 A CN 113115510A CN 202110267093 A CN202110267093 A CN 202110267093A CN 113115510 A CN113115510 A CN 113115510A
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- heat dissipation
- heat
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a printed circuit board heat dissipation system using a high thermal conductive substrate, wherein the printed circuit board heat dissipation system includes: the high-heat-conductivity substrate is provided with insulating layers on the upper surface and the lower surface respectively, and a conducting layer and a heat dissipation device are arranged on the outer side of each insulating layer respectively; the high heat conduction substrate is a composite heat conduction plate and sequentially comprises a first graphite heat dissipation plate, a metal heat dissipation plate and a second graphite heat dissipation plate which are combined together from top to bottom. And grooves for mounting the heat dissipation device are formed in the high-heat-conductivity substrate, the insulating layer and the conductive layer, and the grooves penetrate through the conductive layer and the insulating layer and reach the first graphite heat dissipation plate or the second graphite heat dissipation plate. The printed circuit board heat dissipation system has the advantages that the high-heat-conductivity substrate is formed by compounding the metal heat dissipation plate and the graphite heat dissipation plate, and compared with the prior art, the printed circuit board heat dissipation system is low in production cost, good in mechanical performance and high in heat dissipation efficiency.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a printed circuit board heat dissipation system using a high-thermal-conductivity substrate.
Background
Printed circuit boards, also known as printed circuit boards, are important electronic components, support bodies for electronic components, and carriers for electrical interconnection of electronic components. When an electronic component is mounted on a printed circuit board and power is supplied, heat is inevitably generated because the resistive member obstructs the flow of current between the conductive pattern on the printed circuit board and the electronic component. When heat is generated, a situation occurs in which elements such as a microprocessor, a FET, and a regulator are sensitive to heat and malfunction due to heat.
The existing metal heat-conducting substrate is mainly made of copper or aluminum materials, so the manufacturing cost is high, and the production difficulty is large, while the ceramic substrate is mainly made of alumina-based, aluminum nitride-based and silicon nitride materials, although the production cost is low, the mechanical property is poor, and the fracture is easy.
Therefore, it is desirable to provide a printed circuit board heat dissipation system using a high thermal conductivity substrate with low production cost and good mechanical properties.
Disclosure of Invention
Technical problem to be solved
In view of the above drawbacks and deficiencies of the prior art, the present invention provides a printed circuit board heat dissipation system using a high thermal conductive substrate, which solves the problem of low heat dissipation efficiency of the prior printed circuit board heat dissipation system.
(II) technical scheme
In order to achieve the purpose, the invention adopts the main technical scheme that:
an embodiment of the present invention provides a printed circuit board heat dissipation system using a high thermal conductive substrate, wherein the printed circuit board heat dissipation system includes: the high-thermal-conductivity substrate is provided with insulating layers on the upper surface and the lower surface respectively, and a conducting layer is arranged on the outer side of each insulating layer;
the high-heat-conductivity substrate is a composite heat-conducting plate and sequentially comprises a first graphite heat-radiating plate, a metal heat-radiating plate and a second graphite heat-radiating plate which are combined together from top to bottom;
the printed circuit board heat dissipation system further comprises a heat dissipation device, grooves for mounting the heat dissipation device are formed in the high-heat-conductivity substrate, the insulating layer and the conducting layer, and the bottoms of the grooves penetrate through the conducting layer and the insulating layer and reach the high-heat-conductivity substrate.
Optionally, a plurality of hollow holes are formed in the metal heat dissipation plate, and the shape of each hollow hole is circular, square, triangular or regular hexagon.
Optionally, the metal heat dissipation plate is made of an aluminum or copper material, the thickness of the metal heat dissipation plate is greater than 1 mm, and the thickness of the first graphite heat dissipation plate and the thickness of the second graphite heat dissipation plate are greater than 1 mm.
Optionally, a conductive pattern is formed on the conductive layer, the conductive pattern providing a current path between one or more electronic components, the conductive pattern having a thickness of 0.2 mm to 0.4 mm.
Optionally, the heat dissipation device comprises a semiconductor refrigeration sheet, a mounting seat and a heat dissipation row, wherein the mounting seat is made of a ceramic material and is arranged in the groove, the periphery of the mounting seat is attached to the insulating layer and the first graphite heat dissipation plate or the second graphite heat dissipation plate, and the semiconductor refrigeration sheet is mounted on one side, away from the graphite heat dissipation plate, of the mounting seat;
the semiconductor refrigeration piece is provided with a first variable temperature surface for generating cold and a second variable temperature surface for generating heat, the first variable temperature surface is attached to the mounting seat, and the second variable temperature surface is connected with the heat dissipation bar.
Optionally, the heat dissipation bar includes a heat dissipation body and a plurality of heat dissipation fins vertically mounted on the heat dissipation body, and the heat dissipation bar is made of copper, aluminum material or ceramic material.
Optionally, the heat dissipation device includes a heat dissipation frame and a heat dissipation fan, one part of the heat dissipation frame is installed in the groove, the other part of the heat dissipation frame is located in the outside air, a plurality of air channels are arranged inside the heat dissipation frame, the air channels are separated by heat exchange fins, and the heat dissipation fan is installed at an air inlet of the air channels.
Optionally, the insulating layer is a heat-conducting bonding sheet for bonding the high heat-conducting substrate and the conductive layer.
The insulating layer is an epoxy glass fiber cloth bonding sheet or an epoxy resin polymer, and the heat conductivity coefficient of the insulating layer is greater than 6W/(m.K);
optionally, the high thermal conductive substrate, the insulating layer and the conductive layer are provided with through holes for heat dissipation.
Optionally, the upper surface and the lower surface of the metal heat dissipation plate are respectively provided with a plurality of reinforcing bars longitudinally or transversely.
(III) advantageous effects
The invention has the beneficial effects that: according to the printed circuit board heat dissipation system using the high-heat-conductivity substrate, the high-heat-conductivity substrate comprises the metal heat dissipation plate and the graphite heat dissipation plate, so that compared with the prior art, the metal heat dissipation plate enhances the mechanical property of the high-heat-conductivity substrate, the graphite heat dissipation plate reduces the cost, and the effects of low cost, high mechanical property and high heat dissipation efficiency are achieved.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation system 1 of a printed circuit board using a high thermal conductive substrate according to an embodiment of the present invention;
FIG. 2 is an exploded view of the heat sink bar and mounting base of FIG. 1;
fig. 3 is a schematic top view of a first metal heat sink plate according to the present invention;
fig. 4 is a schematic top view of a second metal heat sink plate according to the present invention;
fig. 5 is a schematic top view of a third metal heat sink plate according to the present invention;
fig. 6 is a schematic top view of a fourth metal heat sink plate according to the present invention;
FIG. 7 is a schematic structural diagram of an embodiment 2 of a heat dissipation system of a printed circuit board using a high thermal conductivity substrate according to the present invention;
fig. 8 is a schematic top view of the metal heat sink of fig. 7;
FIG. 9 is a schematic structural diagram of an embodiment 3 of a heat dissipation system of a printed circuit board using a high thermal conductivity substrate according to the present invention;
fig. 10 is a cross-sectional view of the heat dissipation frame of fig. 9.
[ description of reference ]
1: a high thermal conductive substrate; 2: an insulating layer; 3: a conductive layer; 4: a metal heat dissipation plate; 5: a first graphite heat dissipation plate; 6: a second graphite heat dissipation plate; 7: a semiconductor refrigeration sheet; 8: a mounting seat; 9: heat dissipation is carried out; 10: a heat dissipation body; 11: a heat sink; 12: a through hole; 13: a reinforcing strip; 14: a heat dissipation frame; 15: a heat dissipation fan.
Detailed Description
For the purpose of better explaining the present invention and to facilitate understanding, the present invention will be described in detail by way of specific embodiments with reference to the accompanying drawings. As used herein, the terms "upper", "lower", and the like are used with reference to the orientation of FIG. 1.
Example 1:
referring to fig. 1 and 2, the present embodiment provides a printed circuit board heat dissipation system using a high thermal conductive substrate, including: the high-heat-conductivity substrate comprises a high-heat-conductivity substrate 1, wherein insulating layers 2 are respectively arranged on the upper surface and the lower surface of the high-heat-conductivity substrate 1, and a conductive layer 3 is arranged on each insulating layer 2.
Specifically, as shown in fig. 1, the structure of the printed circuit board heat dissipation system includes, from top to bottom, a conductive layer 3, an insulating layer 2, a high thermal conductivity substrate 1, an insulating layer 2, and a conductive layer 3. The conductive layer 3 has formed thereon a conductive pattern that provides a current path between one or more electronic components. Specifically, the thickness of the conductive pattern is 0.2 mm to 0.4 mm. The high heat conduction substrate distributes heat generated by the current flowing through the conductive pattern to the whole printed circuit board heat dissipation system laterally and dissipates the heat to the outside. The insulating layer bonds the high thermal conductive substrate 1 and the conductive layer 3, and plays a role in heat conduction and insulation.
The high heat conduction substrate 1 is a composite heat conduction plate, and the high heat conduction substrate 1 sequentially comprises a first graphite heat dissipation plate 5, a metal heat dissipation plate 4 and a second graphite heat dissipation plate 6 which are combined together from top to bottom. The metal heat dissipation plate 4 can be made of aluminum or copper materials, so that the heat conduction performance is good, the metal heat dissipation plate is not prone to cracking, the mechanical performance of the high-heat-conduction substrate 1 is improved, the first graphite heat dissipation plate 5 and the second graphite heat dissipation plate 6 are matched, the production cost is reduced, and the heat dissipation efficiency is improved.
Referring to fig. 3, 4, 5 and 6, a plurality of hollow holes are formed in the metal heat sink 4, and the hollow holes are circular, square, triangular or regular hexagonal. Preferably, the metal heat dissipation plate 4 is provided with hexagonal hollow holes, and the plurality of hollow holes are honeycomb-shaped as a whole. The metal heat dissipation plate 4 with the structure can save metal materials, reduce production cost and facilitate heat dissipation. When first graphite heating panel 5, metal heating panel 4 and 6 pressfitting processing of second graphite heating panel become high heat conduction base plate 1, partial graphite is filled in the fretwork hole of metal heating panel 4, and first graphite heating panel 5 and 6 accessible fretwork holes of second graphite heating panel carry out the heat transfer fast, make local heat diffusion to whole high heat conduction base plate 1, improve the holistic radiating efficiency of printed circuit board cooling system.
The thickness of the metal heat dissipation plate 4 is greater than 1 mm, and the thickness of the first graphite heat dissipation plate 5 and the second graphite heat dissipation plate 6 is greater than 1 mm.
The insulating layer is a heat-conducting bonding sheet which can be an epoxy glass fiber cloth bonding sheet or an epoxy resin polymer. For example, the thermal conductivity of the adhesive heat-conductive silicone sheet or the thermosetting heat-conductive adhesive sheet is preferably greater than 3W/(mK), and more preferably greater than 6W/(mK). On the basis of meeting the bonding strength, the thickness of the heat-conducting bonding sheet can be set as thin as possible so as to reduce the thermal resistance, so that heat can be rapidly transferred to the graphite heat-radiating plate through the conducting layer, the graphite heat-radiating plate can diffuse local heat to the whole high-heat-conducting substrate 1, and the overall heat-radiating efficiency of the printed circuit board heat-radiating system is improved.
The printed circuit board heat dissipation system further comprises a heat dissipation device, grooves for mounting the heat dissipation device are formed in the high-heat-conductivity substrate 1, the insulating layer 2 and the conducting layer 3, and the bottoms of the grooves penetrate through the conducting layer 3 and the insulating layer 2 and reach the high-heat-conductivity substrate 1 directly.
The heat dissipation device comprises a semiconductor refrigeration sheet 7, a mounting seat 8 made of ceramic materials and a heat dissipation row 9. Offer flutedly on the printed circuit board cooling system, the recess sees through conducting layer 3 and the direct first graphite heating panel 5 of insulating layer 2 or second graphite heating panel 6, and mount pad 8 is established in the recess, and laminate mutually with insulating layer 2, first graphite heating panel 5 or second graphite heating panel 6 around the mount pad 8, and one side that graphite heating panel was kept away from to mount pad 8 is installed semiconductor refrigeration piece 7.
The semiconductor refrigeration piece 7 is provided with a first variable temperature surface for generating cold and a second variable temperature surface for generating heat, the first variable temperature surface is attached to the mounting seat 8 and used for absorbing the heat on the high-heat-conductivity substrate 1, and the second variable temperature surface is connected with a heat dissipation row 9 so as to further dissipate the heat.
The conductive patterns comprise positive electrode bonding pads and negative electrode bonding pads which are arranged in pairs and located on two opposite sides of the semiconductor refrigerating piece 7 respectively, one end of the semiconductor refrigerating piece 7 is connected with the positive electrode bonding pads, and the other end of the semiconductor refrigerating piece 7 is connected with the negative electrode bonding pads.
The heat dissipation row 9 comprises a heat dissipation body 10 and a plurality of heat dissipation fins 11 vertically installed on the heat dissipation body 10, and is used for improving the heat dissipation efficiency of the semiconductor refrigeration fins 7 and the ambient air. The heat dissipation fins 9 may be made of copper, aluminum material or ceramic material.
The high thermal conductive substrate 1, the insulating layer 2, and the conductive layer 3 are provided with through holes 12 for heat dissipation. When in use, air flows through the printed circuit board heat dissipation system through the through holes 12 to take away heat accumulated in the printed circuit board heat dissipation system.
The printed circuit board heat dissipation system of the embodiment is formed by compounding the first graphite heat dissipation plate 5, the metal heat dissipation plate 4 and the second graphite heat dissipation plate 6 on the high heat conduction substrate 1, so that compared with the prior art, the printed circuit board heat dissipation system is low in production cost and good in mechanical property, and improves heat dissipation efficiency.
Example 2:
referring to fig. 7 and 8, in this embodiment, another printed circuit board heat dissipation system using a high thermal conductive substrate is provided, and on the basis of embodiment 1, a plurality of reinforcing bars 13 are respectively disposed on the upper surface and the lower surface of the metal heat dissipation plate 4, so as to enhance the overall mechanical performance of the printed circuit board heat dissipation system and prevent the printed circuit board heat dissipation system from being broken.
In specific implementation, the plurality of reinforcing strips 13 are parallel to each other and are longitudinally or transversely arranged on the metal heat dissipation plate 4, or the plurality of reinforcing strips 13 are arranged on the metal heat dissipation plate 4 in an intersecting manner, and the reinforcing strips and the metal heat dissipation plate 4 together enhance the mechanical performance of the whole printed circuit board heat dissipation system, so that the printed circuit board heat dissipation system is prevented from being broken.
The printed circuit board heat dissipation system of this embodiment, because high heat conduction base plate 1 adopts first graphite heating panel 5, metal heating panel 4 and the compounding of second graphite heating panel 6 to form to and the upper and lower surface of metal heating panel 4 sets up a plurality of enhancement strips 13, for prior art, its low in production cost, mechanical properties are better.
Example 3:
referring to fig. 9 and 10, the present embodiment provides another printed circuit board heat dissipation system using a high thermal conductive substrate, which replaces the semiconductor cooling fins 7, the mounting seats 8 and the heat dissipation bars 9 in embodiment 1 with heat dissipation frames 14 and heat dissipation fans 15.
One part of the heat dissipation frame 14 is installed in the groove on the high thermal conductivity substrate 1, the insulating layer 2 and the conductive layer 3, and the other part is in the outside air. A plurality of air channels are arranged in the heat dissipation frame 14, the air channels are separated by heat exchange fins, and the heat dissipation fan 15 is installed at an air inlet of each air channel. The heat dissipation frame 14 is made of a ceramic material.
During the use, heat diffusion to heat dissipation frame 14 on first graphite heating panel 5 and the second graphite heating panel 6, radiator fan 15 lasts and bloies to heat dissipation frame 14 inside, and fresh air current carries out the heat transfer with the inside heat exchanger fin of heat dissipation frame 14 to improve the radiating efficiency.
In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium; either as communication within the two elements or as an interactive relationship of the two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, a first feature may be "on" or "under" a second feature, and the first and second features may be in direct contact, or the first and second features may be in indirect contact via an intermediate. Also, a first feature "on," "above," and "over" a second feature may be directly or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lower level than the second feature.
In the description herein, the description of the terms "one embodiment," "some embodiments," "an embodiment," "an example," "a specific example" or "some examples" or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are illustrative and not restrictive, and that those skilled in the art may make changes, modifications, substitutions and alterations to the above embodiments without departing from the scope of the present invention.
Claims (10)
1. A printed circuit board heat dissipation system using a high thermal conductive substrate, comprising: the printed circuit board heat dissipation system includes: the high-heat-conductivity substrate (1), wherein the upper surface and the lower surface of the high-heat-conductivity substrate (1) are respectively provided with an insulating layer (2), and the outer side of each insulating layer (2) is respectively provided with a conductive layer (3);
the high-heat-conductivity substrate (1) is a composite heat-conducting plate, and the high-heat-conductivity substrate (1) sequentially comprises a first graphite heat-radiating plate (5), a metal heat-radiating plate (4) and a second graphite heat-radiating plate (6) which are combined together from top to bottom;
the printed circuit board heat dissipation system further comprises a heat dissipation device, grooves for mounting the heat dissipation device are formed in the high-heat-conductivity substrate (1), the insulating layer (2) and the conducting layer (3), and the bottoms of the grooves penetrate through the conducting layer (3) and the insulating layer (2) and directly reach the high-heat-conductivity substrate (1).
2. The printed circuit board heat dissipation system of claim 1, wherein: the metal heat dissipation plate (4) is provided with a plurality of hollowed holes, and the hollowed holes are circular, square, triangular or regular hexagonal.
3. The printed circuit board heat dissipation system of claim 2, wherein: metal heating panel (4) adopt aluminium or copper product to make, the thickness of metal heating panel (4) is greater than 1 millimeter, the thickness of first graphite heating panel (5) and second graphite heating panel (6) is greater than 1 millimeter.
4. The printed circuit board heat dissipation system of claim 1, wherein: the conductive layer (3) has a conductive pattern formed thereon, the conductive pattern providing a current path between one or more electronic components, the conductive pattern having a thickness of 0.2 mm to 0.4 mm.
5. The printed circuit board heat dissipation system of claim 4, wherein: the heat dissipation device comprises a semiconductor refrigeration sheet (7), a mounting seat (8) and a heat dissipation row (9), wherein the mounting seat (8) is made of ceramic materials, the periphery of the mounting seat (8) is attached to the insulating layer (2), the first graphite heat dissipation plate (5) or the second graphite heat dissipation plate (6), and the semiconductor refrigeration sheet (7) is mounted on one side, away from the graphite heat dissipation plate, of the mounting seat (8);
the semiconductor refrigeration sheet (7) is provided with a first variable temperature surface for generating cold and a second variable temperature surface for generating heat, the first variable temperature surface is attached to the mounting seat (8), and the second variable temperature surface is connected with the heat dissipation row (9).
6. The printed circuit board heat dissipation system of claim 5, wherein: the heat dissipation bar (9) comprises a heat dissipation body (10) and a plurality of heat dissipation fins (11) vertically installed on the heat dissipation body (10), and the heat dissipation bar (9) is made of copper, aluminum materials or ceramic materials.
7. The printed circuit board heat dissipation system of claim 4, wherein:
the heat dissipation device comprises a heat dissipation frame (14) and a heat dissipation fan (15), wherein one part of an installation groove of the heat dissipation frame (14) is provided with another part of the installation groove in the outside air, a plurality of air channels are arranged inside the heat dissipation frame (14), the air channels are separated through heat exchange fins, and the heat dissipation fan (15) is installed at an air inlet of each air channel.
8. The printed circuit board heat dissipation system of claim 1, wherein: the insulating layer (2) is a heat-conducting bonding sheet and is used for bonding the high-heat-conducting substrate (1) and the conducting layer (3);
the insulating layer (2) is an epoxy glass fiber cloth bonding sheet or an epoxy resin polymer, and the heat conductivity coefficient of the insulating layer is greater than 6W/(m.K).
9. The printed circuit board heat dissipation system of claim 1, wherein: the high-thermal-conductivity substrate (1), the insulating layer (2) and the conductive layer (3) are provided with through holes (12) for heat dissipation.
10. The printed circuit board heat dissipation system of claim 1, wherein: the upper surface and the lower surface of the metal heat dissipation plate (4) are respectively provided with a plurality of reinforcing strips (13) longitudinally or transversely.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110267093.4A CN113115510A (en) | 2021-03-10 | 2021-03-10 | Printed circuit board heat dissipation system using high-thermal-conductivity substrate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110267093.4A CN113115510A (en) | 2021-03-10 | 2021-03-10 | Printed circuit board heat dissipation system using high-thermal-conductivity substrate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113724594A (en) * | 2021-08-27 | 2021-11-30 | 京东方科技集团股份有限公司 | Display device and wearable display apparatus |
| TWI785834B (en) * | 2021-10-07 | 2022-12-01 | 璦司柏電子股份有限公司 | High thermal conductivity circuit board with embedded ceramic heat conduction block and hollow copper clad layer |
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Application publication date: 20210713 |