CN113108823B - Sensor and valve device - Google Patents

Abstract

A sensor and valve device, the sensor comprising: metal shell, circuit board subassembly and insulating cap. The circuit board assembly comprises a substrate, a conductive path and a plurality of electronic elements, the sensor is provided with a runner and a first cavity which are positioned on different sides of the thickness direction of the substrate, the plurality of electronic elements are at least partially positioned in the first cavity, and the runner is not communicated with the first cavity. The electronic components are electrically connected with each other through the conductive paths. The plurality of electronic elements includes a pressure sensing element, a first capacitance, and a conditioning chip, and the conductive path includes a power path. The sensor comprises a grounding plate, the first capacitor comprises a first polar plate and a second polar plate, the first polar plate is electrically connected with the power path, the second polar plate is electrically connected with the grounding plate, and the grounding plate is electrically connected with the metal shell, so that the damage risk of the surge high-voltage to the conditioning chip is reduced, and the safety of the sensor and the valve device is improved.

Description

Sensor and valve device

Technical Field

The present application relates to a measuring device and a fluid control device, and more particularly, to a sensor and a valve device.

Background

The related art sensor is provided to the valve device for detecting the pressure and/or temperature of the refrigerant flowing into the valve device. The sensor comprises: the circuit board comprises a circuit substrate, a conductive path and a plurality of electronic elements, wherein the electronic elements are electrically connected with each other through the conductive path. The electronic components comprise a pressure sensing component and a conditioning chip, and the conductive path comprises a power path electrically connected with the conditioning chip. The power supply path supplies power to the conditioning chip, and under some conditions, unexpected high-voltage surge voltage exists in the power supply path, for example, when the power supply system encounters high-voltage generated by lightning stroke, the surge high-voltage is input to the conditioning chip through the power supply path, damage to the chip is caused, the sensor cannot work, and the safety performance is poor.

Disclosure of Invention

The application aims to provide a sensor with high safety.

The present application provides a sensor comprising: the sensor comprises a metal shell, a circuit board assembly and an insulating cover, wherein the circuit board assembly comprises a substrate, a conductive path and a plurality of electronic elements, the sensor is provided with a runner and a first cavity which are positioned on different sides of the thickness direction of the substrate, at least part of the electronic elements are positioned in the first cavity, and the runner is not communicated with the first cavity; the electronic components are electrically connected with each other through conductive paths, the electronic components comprise pressure sensing elements, first capacitors and conditioning chips, and the conductive paths comprise power supply paths; the sensor comprises a grounding plate, the first capacitor comprises a first polar plate and a second polar plate, the first polar plate is electrically connected with the power supply path, the second polar plate is electrically connected with the grounding plate, and the grounding plate is electrically connected with the metal shell.

Compared with the related art, the application is provided with the grounding piece, the grounding piece is electrically connected with the metal shell, the surge high-voltage of the power supply path can be directly connected to the metal shell through the first capacitor, and the metal shell can be grounded, so that the damage risk of the surge high-voltage to the conditioning chip is reduced, and the safety of the sensor is improved.

The application aims to provide a valve device with high safety.

The application provides a valve device, which comprises the sensor, a valve body and a valve core part, wherein the valve core part is fixed with the valve body, the valve body is provided with a pore canal, the valve core part can control the on-off of the pore canal, the sensor is fixed with the valve body, a flow channel of the sensor is in fluid communication with the pore canal, and the metal shell is electrically connected with the valve body.

Compared with the related art, the application is provided with the grounding piece, the grounding piece is electrically connected with the metal shell, the surge high-voltage of the power supply path can be directly connected to the metal shell through the first capacitor, the metal shell is electrically connected with the valve body, and the risk of damaging the conditioning chip by the surge high-voltage can be reduced through the grounding of the valve body, so that the safety of the valve device is improved.

Drawings

Fig. 1 is a schematic perspective view of a first embodiment of the sensor of the present application.

Fig. 2 is a schematic perspective view of the sensor shown in fig. 1 at another angle.

Fig. 3 is an exploded perspective view of the sensor shown in fig. 1.

Fig. 4 is another perspective exploded view of the sensor shown in fig. 3.

Fig. 5 is a further exploded schematic view of the sensor shown in fig. 4.

Fig. 6 is a further exploded schematic view of the sensor shown in fig. 3.

Fig. 7 is a further exploded schematic view of the sensor shown in fig. 5.

Fig. 8 is a further exploded schematic view of the sensor shown in fig. 6.

Fig. 9 is a schematic perspective cross-sectional view of the sensor shown in fig. 1.

Fig. 10 is a schematic cross-sectional view of the sensor shown in fig. 1.

Fig. 11 is a further perspective cross-sectional schematic view of the sensor shown in fig. 1.

Fig. 12 is an exploded perspective schematic view of the sensor shown in fig. 1.

Fig. 13 is a schematic circuit diagram of the sensor shown in fig. 1.

Fig. 14 is a circuit board wiring diagram of the flexible circuit board shown in fig. 6, spread flat.

Fig. 15 is a schematic perspective view of a second embodiment of the sensor of the present application.

Fig. 16 is an exploded perspective view of the sensor shown in fig. 15.

Fig. 17 is a schematic perspective cross-sectional view of the sensor shown in fig. 15.

Fig. 18 is a further perspective cross-sectional schematic view of the sensor shown in fig. 15.

Fig. 19 is a schematic cross-sectional view of a third embodiment of the sensor of the present application.

Fig. 20 is a schematic cross-sectional view of a fourth embodiment of the sensor of the present application.

Fig. 21 is a schematic perspective view of the sensor of the present application applied to a valve device.

Fig. 22 is an exploded perspective view of the valve device shown in fig. 21.

Fig. 23 is another perspective exploded view of the valve device of fig. 21.

Fig. 24 is a schematic perspective sectional view of the valve device shown in fig. 21.

FIG. 25 is a system schematic diagram of the sensor of the present application applied to a thermal management system.

Detailed Description

As shown in fig. 1 to 14, a sensor 100 according to a first embodiment of the present application includes: the metal housing 10, the circuit board assembly 20, the base 40, the insulating cover 50, and two sealing rings 60.

As shown in fig. 5 to 14, the circuit board assembly 20 includes a substrate 21, a conductive path 22 and a plurality of electronic components. The electronic components are electrically connected to each other through the conductive paths 22, and the electronic components include the pressure sensing element 23, the first capacitor 24 and the conditioning chip 25. The conductive path 22 includes a power path/first conductive path 221, the sensor 100 includes a ground plate 90, the first capacitor 24 includes a first electrode plate 241 and a second electrode plate 242, the first electrode plate 241 is electrically connected to the power path 221, the second electrode plate 242 is electrically connected to the ground plate 90, and the ground plate 90 is electrically connected to the metal casing 10. As shown in fig. 10, the metal shell 10 includes a first abutting portion 104, the insulating cover 50 includes a second abutting portion 58, the grounding plate 90 includes a third abutting portion 91, the third abutting portion 91 is pressed between the first abutting portion 104 and the second abutting portion 58, and the grounding plate 90 is in contact with the first abutting portion 104.

The first capacitor 24 is a high voltage capacitor, for example, the specification of the first capacitor 24 is 10nf/1000V, that is, the capacitance value of the first capacitor 24 is 10nf, the rated voltage is 1000V, and the voltage of 1000V can be born.

As shown in fig. 13 to 14, the conditioning chip 25 includes a pressure signal input 251, a pressure signal output 252, and a power input 253. The pressure sensing element 23 is electrically connected to the pressure signal input end 251, the sensor 100 further comprises a power connection end 271 and a pressure signal output connection end 272, the power connection end 271 is electrically connected to the power input end 253, and the pressure signal output connection end 272 is electrically connected to the pressure signal output end 252. The power connection terminal 271 and the pressure signal output connection terminal 272 are used for electrically connecting with an external circuit of the sensor 100, for example, electrically connecting with a conductive path of a built-in circuit board of the electronic expansion valve. The first electrode plate 241 is electrically connected to the power connection end 271, the first electrode plate 241 is electrically connected to the power input end 253, and the second electrode plate 242 is electrically connected to the metal casing 10 through the grounding plate 90, and the metal casing 10 can be connected to the ground, so that when the power connection end 271 has a high voltage surge, the high voltage surge can be directly conducted to the ground, and the risk of impact damage to the management chip 25 caused by the high voltage surge entering the power input end 253 is reduced.

The sensor 100 includes a first clamping diode 28, the sensor 100 includes a ground terminal 275, the first clamping diode 28 has a first electrode terminal 281 and a second electrode terminal 282, the first electrode terminal 281 is electrically connected to the power input terminal 253 and the power connection terminal 271, and the second electrode terminal 282 is electrically connected to the ground terminal 275. The first clamping diode 28 can limit the voltage of the power input end 253 within the rated operating range, so that the hidden trouble that the power input end 253 is damaged by impact caused by the unexpected high voltage of the power input end 253 entering the power input end 253 is reduced. The first capacitor 24 and the grounding plate 90 can directly conduct the high voltage of the alternating current to the ground to protect the conditioning chip 25 from the high voltage of the alternating current, and the first clamping diode 28 can limit the unexpected high voltage of the direct current within the rated working range, so that the conditioning chip 25 is protected from the high voltage of the direct current.

The sensor 100 includes a power supply path/first conductive path 221 electrically connected to the power supply input 253 and the power supply connection 271, a second conductive path 222 connected between the first capacitor 24 and the first conductive path 221, and a third conductive path 223 connected to the first clamp diode 28 and the first conductive path 221, wherein when the power supply connection 271 is energized, a power supply passes through an intersection of the first conductive path 221 and the second conductive path 222, then passes through an intersection of the first conductive path 22 and the third conductive path 223, and then enters the power supply input 253. The first capacitor 24 is arranged before being close to the first clamping diode 28, so that larger surge voltage, such as accidental high voltage such as lightning stroke, can be conducted to earth for protection, and then double protection of the conditioning chip 25 is achieved through the limiting voltage effect of the first clamping diode 28, so that safety redundancy is higher.

The sensor 100 further includes a second clamp diode 29, the second clamp diode 29 having a third electrode terminal 291 and a fourth electrode terminal 292, the third electrode terminal 291 being electrically connected to the pressure signal output terminal 252 and the pressure signal output connection terminal 272, and the fourth electrode terminal 292 being electrically connected to the ground terminal 275. The provision of the second clamping diode 29 reduces the risk of an unexpected dc high voltage entering the conditioning chip 25 from the pressure signal output connection 272 damaging the conditioning chip 25.

The conditioning chip 25 includes a power output 254, and the sensor 100 further includes a ground connection 273 and a second capacitor 31, where the ground connection 273 is electrically connected to the power output 254. The second capacitor 31 is a high voltage capacitor, for example, the second capacitor 31 has a specification of 10nf/1000V, that is, the second capacitor 31 has a capacitance of 10nf and a rated voltage of 1000V, and can withstand a voltage of 1000V. The second capacitor 31 includes a third electrode plate 311 and a fourth electrode plate 312, the third electrode plate 311 is electrically connected to the power output end 254, the third electrode plate 311 is electrically connected to the ground connection end 273, and the fourth electrode plate 312 is electrically connected to the metal casing 10 through the ground plate 90. Similar to the principle of the first capacitor 24, the arrangement of the second capacitor 31 can also reduce the risk of damage to the impact of the surge high voltage from the ground connection 273 to the power output 254 on the conditioning chip 25. The power connection 271 in the circuit system corresponds to the positive electrode of the power input, and the ground connection 273 corresponds to the negative electrode of the power input. The ideal operating voltage of the power connection 271 is 5V and the ideal operating voltage of the ground connection 273 is 0V. In the illustrated embodiment, the second capacitor 31 and the first capacitor 24 are electrically connected to the metal casing 10 corresponding to an independent grounding piece 90, so that the circuit arrangement is simpler and easier, and the circuit conduction paths corresponding to the second capacitor are closer to the grounding path of the metal casing, so that the flow length of the high-voltage conductive path in the circuit board assembly is reduced, and the protection of the management chip 25 is safer. Of course, in other alternative embodiments, the second capacitor 31 and the first capacitor 24 may be associated with the same ground 90, which may reduce the material cost of the circuit board assembly 20 and the ground plate.

The pressure signal input end 251 includes a first pressure signal input end 321 and a second pressure signal input end 322, the pressure sensing element 23 includes a first signal end 231, a second signal end 232, and a ground end 233, the first signal end 231 is electrically connected to the first pressure signal input end 321, the second signal end 232 is electrically connected to the second pressure signal input end 322, and the ground end 233 is electrically connected to the ground end 275.

The pressure signal output end 252 includes a first pressure signal output end 323 and a second pressure signal output end 324, the sensor 100 further includes a first resistor 33 and a second resistor 34, the first resistor 33 is electrically connected with the first pressure signal output end 323, the second resistor 34 is electrically connected with the second pressure signal output end 324, and the first resistor 33 and the second resistor 34 are parallel connected between the pressure signal output end 252 and the pressure signal output connection end 272. The resistance of the first resistor 33 is smaller than that of the second resistor, for example, the resistance of the first resistor is 100 ohms (Ω), and the resistance of the second resistor is 1000 ohms (Ω). A voltage signal corresponding to the detected pressure signal is outputted from the pressure signal output connection 272 through the parallel connection of the first resistor 33 and the second resistor 34.

The sensor 100 further includes a first inductor 35 and a second inductor 36, the first inductor 35 is electrically connected between the power input end 253 and the power connection end 271, the first resistor 33 and the second resistor 34 are connected in parallel and then connected in series with the second inductor 36, and the second inductor 36 is electrically connected with the pressure signal output connection end 272. The direct current resistance achieved by the first inductor 35 and the second inductor 26 reduces the unstable ac signal in the power supply connection 271 and the pressure signal output connection 272. Optionally, the inductance of the first inductor 35 and the second inductor 36 is 120 henry (H).

As shown in fig. 9, the sensor 100 further includes a temperature sensing element 70, and the temperature sensing element 70 and the pressure sensing element 23 are disposed on the same sensor 100, so that the sensor 100 integrates a pressure temperature sensor with functions of detecting the temperature and the pressure of the refrigerant, and the integrated design reduces the occupied space and the material cost of the separately designed temperature sensor and pressure sensor.

As shown in fig. 13 and 14, the sensor 100 further includes a third resistor 37 and a temperature signal connection 274, and the third resistor 37 and the temperature sensing element 70 are connected in series between the power connection 271 and the ground 275. The conductive path 22 includes a fourth conductive path 224, one end of the fourth conductive path 224 is electrically connected between the third resistor 37 and the temperature sensing element 70, and the other end of the fourth conductive path 224 is electrically connected to the temperature signal connection end 274. The temperature sensing element 70 is a thermistor, the sensor 100 includes a third capacitor 38, the third capacitor 38 is disposed in parallel with the temperature sensing element 70, the third capacitor 38 includes a fifth electrode plate 381 and a sixth electrode plate 382, the fifth electrode plate 381 is electrically connected to the temperature signal connection end 274, and the sixth electrode plate 382 is electrically connected to the ground end 275. All of the grounding terminals 275 are electrically connected to the ground connection 273, i.e., to the negative pole of the power source.

The power output 254 includes a first power output 325, a second power output 326, and a third power output 327, the first power output 325 and the second power output 326 are connected in parallel, the first power output 325 is connected in series with the fourth capacitor 30, and the third power output 327 is connected in series with the fifth capacitor 39.

The conditioning chip 25, the pressure sensing element 23, and the first capacitor 24 are electrically connected through the conductive path 22 of the circuit board assembly 20. As shown in fig. 3, 6, 9, 13 and 14, the plurality of conductive terminals 80 includes a ground terminal 84, a power terminal 85, a pressure signal terminal 86 and a temperature signal terminal 87, the ground terminal 84 is electrically connected to the ground connection terminal 273, the power terminal 85 is electrically connected to the power connection terminal 271, the pressure signal terminal 86 is electrically connected to the pressure signal output connection terminal 272, and the temperature signal terminal 87 is electrically connected to the temperature signal connection terminal 274.

As shown in fig. 8 to 11, the sensor 100 has a first chamber 101 and a second chamber 102 located on opposite sides in the thickness direction of the substrate 21, and the sensor 100 has a refrigerant flow path 103, the refrigerant flow path 103 communicates with the second chamber 102, and the second chamber 102 and the first chamber 101, which communicate with the refrigerant flow path 103, are sealed by two seal rings 60 so as not to communicate with each other. The second chamber 102 is located at the lower side of the base plate 21, the first chamber 101 is located at the upper side of the base plate 21, and the refrigerant flow passage 103 is located at the lower side of the second chamber 102. In other alternative embodiments, the second cavity may be omitted, flow may be directly through the refrigerant flow path to the underside of the circuit board assembly, or the refrigerant flow path 103 and second cavity 102 of the illustrated embodiment may be collectively referred to as a refrigerant flow path. The seal ring 60 includes a first seal ring 61 and a second seal ring 62, the first seal ring 61 is sealingly connected between the metal housing 10 and the base 40, and the second seal ring 62 is sealingly connected between the base 40 and the base plate 21, so that the refrigerant flow passage 103 is not communicated with the first cavity 101, and the risk of leakage of the refrigerant caused by the refrigerant flowing in from the refrigerant flow passage 103 entering the first cavity 101 is reduced.

As shown in fig. 7 to 9, the circuit board assembly 20 includes a flexible circuit board 26, the substrate 21 includes a ceramic substrate 21, the pressure sensing element 23 is formed on the ceramic substrate 21, the ground plate 90 is a part of the flexible circuit board 26, and the flexible circuit board 26 is located in the first cavity 101. The ceramic substrate 21 includes a first surface 211 facing the refrigerant flow path 103, a second surface 212 facing the flexible circuit board 26, and a peripheral wall surface 213 connected between the first surface 211 and the second surface 212, the first surface 211 and the second surface 212 being located on opposite sides in the thickness direction of the substrate 21. The flexible circuit board 26 includes a first circuit board 261 and a second circuit board 262 arranged at intervals, the first circuit board 261 is arranged on the second surface 212, and the second circuit board 262 is far away from the second surface 212 compared with the first circuit board 261.

As shown in fig. 6 to 9 and 14, the flexible circuit board 26 includes a first flexible circuit board 263 and a second flexible circuit board 264, the first flexible circuit board 263 is connected between the first circuit board 261 and the second circuit board 262, the second flexible circuit board 264 is connected to the second circuit board 262, the grounding plate 90 is disposed on the second flexible circuit board 264, the conditioning chip 25 is disposed on the first circuit board 261, and the first capacitor 24 is disposed on the second circuit board 262. The second flexible circuit board 264 includes a first extension 265 extending from the second circuit board 262, a second extension 266 extending from the first extension 265, a third extension 267 extending from the second extension 266, and a fourth extension 268 extending from the third extension 267. The strength of the first circuit board 261 and the second circuit board 262 is enhanced relative to the strength of the first flexible circuit board 263 and the second flexible circuit board 264, and the flexibility of the first flexible circuit board 263 and the second flexible circuit board 264 is better relative to the first circuit board 261 and the second circuit board 262, which is beneficial to bending.

As shown in fig. 5 and 6 and 9, the base 40 includes a bottom wall 41 and a peripheral wall 42, the base 40 has a groove 43 between the bottom wall 41 and the peripheral wall 42, the ceramic substrate 21 is located in the groove 43, and the ceramic substrate 21, the base 40, and the seal ring 60 define the second cavity 102. The refrigerant flow passage 103 includes a first flow passage 1031 and a second flow passage 1032, the second flow passage 1032 being located in the base 40, and the second flow passage 1032 penetrating the base 40 in the thickness direction of the base 40, wherein the aperture of the second flow passage 1032 is smaller than the aperture of the first flow passage 1031. The substrate 21 is substantially disc-shaped, the first guide post 45 is provided in the peripheral wall 42, the first guide groove 214 is provided in the peripheral wall 213 of the substrate 21, and the first guide groove 214 and the first guide post 45 cooperate to facilitate the guide mounting of the substrate 21 and position the mounting direction of the substrate 21. In other alternative embodiments, the substrate 21 may also have a square, diamond, polygonal or irregular shape, as long as the groove 43 for accommodating and fixing the substrate 21 can be realized, and the application is not limited to the shape of the substrate 21 shown in the drawings.

As shown in fig. 9 and 10, the insulating cover 50 is at least partially housed inside the metal shell 10. The insulating cover 50 includes a first portion 51 and a second portion 52 in the thickness direction of the insulating cover 50, and the metal shell 10 includes a base portion 11, a cylindrical portion 12 extending from the base portion 11 in a direction away from the refrigerant flow path 103, a butt portion 13 extending from the base portion 11 away from the cylindrical portion 12, and a bent portion 14 bent from the cylindrical portion 12 toward an axis line near the cylindrical portion 12.

Before the bending part 14 is not bent, the extending direction of the cylinder part 12 is the same, and when the bending part is subjected to external pressure, the bending part 14 is bent and riveted to the second part 52, so that the bending part 14 presses against the second part 52 of the insulating cover 50 and the grounding piece 90, and the electrical and physical connection between the metal shell and the grounding piece is realized. The first portion 51 of the insulating cover 50 presses against the substrate 21, the base 40 and the flexible circuit board 26, thereby fixing the substrate 21 inside the metal case 10. The docking portion 13 is inserted into and mounted to the valve device 93 or a system pipe, and the valve device 93 may be an electronic expansion valve, and the system pipe may be a connection pipe connected between any two of the heat exchanger, the compressor 951, the valve device 93, the liquid reservoir, and the gas-liquid separator. The base 11 has a flat surface 111 to be fitted with a corresponding mounted element, and the flat surface 111 is planar.

As shown in fig. 6 and 9, the first extension 265 is located in the first cavity 101 and the second extension 266 is compressed between the first portion 52 and the surrounding wall 42. The third extension 267 is abutted against the outer peripheral wall 53 of the insulating cover 50, and the third extension 267 is located between the outer peripheral wall 53 of the insulating cover 50 and the first inner wall surface 123 of the cylinder 12. Fourth extension 268 compresses tightly between kink 14 and first portion 51 to set up in fourth extension's earthing lug 90 and metal casing 10 contact steadily, realize earth connection, reduced when power signal suddenly changes or meets the thunderbolt, enter into the risk that the conditioning chip burns out the conditioning chip through the power route, also reduced the hidden danger that receives the damage when conditioning chip 25, pressure sensing element 23, temperature sensing element 70 receive the voltage suddenly change simultaneously.

As shown in fig. 9 and 12, the metal case 10 includes a second inner wall surface 127 disposed facing the bottom wall 41 of the base 40, and the metal case 10 has a first groove portion 16 recessed from the second inner wall surface 127. The first seal ring 61 is accommodated in the first groove portion 16, and the first seal ring 61 is fluidly sealed between the refrigerant flow passage 103 and the first chamber 101. The first seal ring 61 is pressed between the bottom wall 41 of the base 40 and the first groove bottom surface 161 of the first groove portion 16. As shown in fig. 9, the first seal ring 61 has an O-ring shape, and the first seal ring 61 has a first top portion 611 abutting against the bottom wall 41 and a first bottom portion 612 abutting against the first groove bottom surface 161 of the first groove portion 16.

As shown in fig. 9 and 12, the base 40 includes a third inner wall surface 45 disposed facing the first surface 211, and the base 40 has a second groove portion 46 recessed from the third inner wall surface 45. The second seal ring 62 is received in the second groove 46, and the second seal ring 62 is fluidly sealed between the first chamber 101 and the second chamber 102. The second seal ring 62 is pressed between the first surface 211 of the base plate 21 and the second groove bottom surface 461 of the second groove portion 46. The second seal ring 62 has an O-ring shape, and the second seal ring 62 has a second top 621 abutting against the first face and a second bottom 622 abutting against the second groove bottom face 461 of the second groove portion 46.

As shown in fig. 10, the cylindrical portion 12 includes a first cylindrical portion 121 connected to the base portion 11 and a second cylindrical portion 122 connected between the first cylindrical portion 121 and the bent portion 14, and the wall thickness of the first cylindrical portion 121 in the radial direction is larger than the thickness of the second cylindrical portion 122 in the radial direction. The outer wall surface 124 of the first cylinder portion 121 and the outer wall surface 124 of the second cylinder portion 122 are disposed in alignment, and the first cylinder portion 121 has a stepped portion 125 protruding inward relative to the second cylinder portion 122. The first portion 51 abuts against the second surface 212 of the substrate 21 and the stepped portion 125, the uppermost stepped surface 126 of the stepped portion 125 is substantially level with the second surface 212, and the provision of the stepped portion 125 plays a role in positioning the support and mounting position of the insulating cover 50.

As shown in fig. 6 to 8, the insulating cover 50 has a substantially inverted bowl shape, and the insulating cover 50 includes a top wall 56, a peripheral wall 57 extending downward from the top wall 56, and a housing cavity 501 defined by the top wall 56 and the peripheral wall 57. The top wall 56 includes a first land 561 perpendicular to the peripheral wall 57, a second land 562 located above the first land 561, and a connection 563 connected between the first land 561 and the second land 562. The top of the peripheral wall 42 of the base 40 is provided with a positioning boss 421 protruding upward, and the peripheral wall 57 of the insulating cover 50 is provided with a positioning recess 571 for mating with the positioning boss 421. As shown in fig. 4, the positioning boss 421 of the base 40 and the positioning recess 571 of the insulating cover 50 are disposed in alignment, thereby facilitating positioning installation between the positioning base 40 and the insulating cover 50. Of course, in other alternative embodiments, positioning protrusions may be provided on the insulating cover 50, while positioning recesses may be provided on the base 40, and the mounting positioning between the base 40 and the insulating cover 50 may be achieved as well. As shown in fig. 4-6, the peripheral wall 57 is also provided with mating recesses 572 to facilitate the mounting positioning and retention of the third extension 267 of the flexible circuit board 26.

The insulating cover 50 is provided with a plurality of first holes 564 penetrating the top wall 56 in a vertical direction, and the plurality of first holes 564 may be uniformly distributed around the axis of the first platform 561. As shown in fig. 9, the bending portion 14 is riveted and pressed to the second platform portion 562, the fourth extension portion 268 and the grounding plate 90, and the conductive terminal 80 penetrates the first hole 564 of the second platform portion 562. The conductive terminal 80 may be fixed to the first hole 564 by interference, or the conductive terminal 80 may be fixed to the insulating cover 50 by insert injection molding.

The metal case 10 is a metal member so that electromagnetic interference (EMI) of the outside to the internal electronic components of the sensor 100 can be reduced, and the insulating cover 50 is an insulating member so that the metal case 10 and the conductive terminals 80 can be insulated from each other. Alternatively, the metal casing 10 may be an aluminum metal piece or a stainless steel metal piece, where the aluminum metal piece is light in weight, so as to facilitate light weight design of the sensor 100, and thus facilitate light weight design of the whole vehicle when the sensor 100 is used in a thermal management system of the vehicle. Although the stainless steel metal piece has a slightly heavier metal mass than the aluminum metal piece, the stainless steel metal piece has the advantage of being convenient for welding. The insulating cover 50 is made of plastic, and can be manufactured by injection molding, and the insulating cover 50 made of insulating material insulates the conductive terminal 80 from the metal housing 10. The metal shell 10 made of metal can be manufactured by a process such as metal die casting, extrusion molding, or metal powder injection molding.

As shown in fig. 7, the temperature sensing element 70 includes a temperature sensing portion 71 and a pin portion 72, the pin portion 72 is disposed in the base 40 by insert injection molding, the pin portion 72 is electrically connected with the temperature sensing portion 71 to the conductive path 22 of the circuit board assembly 20, the temperature sensing portion 71 is located in the refrigerant flow channel 103, or the temperature sensing portion 71 at least partially exceeds the refrigerant flow channel 103 in a direction away from the first cavity 101, so that the temperature sensing portion 71 can be fully contacted with the refrigerant, the temperature difference after the refrigerant flows in from the refrigerant flow channel 103 is reduced, and the sensitivity and accuracy of the temperature detection of the refrigerant are improved. The temperature change of the refrigerant causes a voltage change in the temperature sensing unit 71, and the voltage change is transmitted to the circuit board assembly 21 through the pin portion 72, so that the real-time temperature of the refrigerant can be calculated. The temperature sensing element 70 may be an NTC (Negative Temperature Coefficient ) thermistor, and the working principle of the thermistor is: the resistance value drops rapidly with the temperature rise, so that a corresponding voltage signal is fed back. In the illustrated embodiment, the temperature sensing element 70 is a pin NTC thermistor. The pin-type temperature sensing element 70 can extend the temperature sensing portion 71 into the refrigerant flow path 103 or close to the opening side of the refrigerant flow path 103, so that when sensing the refrigerant flowing into the refrigerant flow path 103, the temperature can be sensed in time, and the temperature error caused by the temperature change in the process of flowing into the refrigerant flow path 103 is reduced due to the close to the opening side of the refrigerant flow path 103. In other alternative embodiments, the temperature sensing element 70 may also be a patch type NTC thermistor, which is directly surface-mounted to the circuit board assembly 20, and has the advantage of being small in size.

As shown in fig. 3 to 8, the temperature sensing element 70 further includes a protective sleeve 91 for protecting the needle foot 72, the protective sleeve 91 is made of an insulating material resistant to corrosion by a refrigerant, and optionally the protective sleeve 91 is made of a plastic material. The metal shell 10 has a shell cavity 171 and a second channel 172, wherein the shell cavity 171 is at least partially located between the barrel 12, the bending portion 14 and the base 11, and the second channel 172 is at least partially located inside the butt joint portion 13. The second bore 172 communicates with the housing interior 171, the protective sleeve 91 is at least partially disposed within the second bore 172, and the pin portion 72 has a first leg 721 disposed within the protective sleeve 91, a second leg 722 disposed within the base 40, and a third leg 723 disposed within the second cavity 102. The first circuit board 261 of the flexible circuit board 26 has a substantially disk-like shape with a peripheral wall of the disk shape protruding outward with a boss portion 269, and the third leg portion 723 is soldered to the boss portion 269, reducing the length of the stitch portion 72.

As shown in fig. 8 and 9, the base 40 includes a boss portion 47 extending from the bottom wall 41 toward the protection sleeve 91, wherein the boss portion 47 includes a first fastening portion 471, the inner wall of the protection sleeve 91 is provided with a second fastening portion 911, and the first fastening portion 471 and the second fastening portion 911 fasten the protection sleeve 91 to the boss portion 47 of the base 40 in a fastening fit. In the illustrated embodiment, the first fastening portion 471 is a convex portion and the second fastening portion 911 is a concave portion. In other alternative embodiments, the first fastening portion 471 may be a concave portion and the second fastening portion 911 may be a convex portion, so long as the positioning and fastening of the base 40 and the protection sleeve 91 can be achieved, and the present application is not limited thereto. The protection sleeve 91 is a hollow cylinder, the protection sleeve 91 forms the first flow channel 1031, the second flow channel 1032 penetrates the bottom wall 41 and the convex column portion 47 along the thickness direction of the base 40, and the axis of the second flow channel 1032 is parallel to the axis of the first flow channel 1031, but not coincident with each other, that is, the axis of the second flow channel 1032 is eccentrically arranged with the axis of the first flow channel 1031, so that the temperature sensing portion 71 of the temperature sensing element 70 is conveniently arranged at the middle position of the protection sleeve 91.

As shown in fig. 7 and 9, each conductive terminal 80 includes a first end 81, a second end 82, and an intermediate portion 83 connected between the first end 81 and the second end 82, and each first end 81 is physically and electrically connected to the power connection 271, the pressure signal output connection 272, the ground connection 273, and the temperature signal connection 274, respectively, so as to be electrically connected to the conductive path 22. The intermediate portion 83 is at least partially located inside the insulating cover 50, the second end 82 is located outside the insulating cover 50, and the first end 81 is located in the first cavity 101. The first end portion 81 is physically and electrically connected to the second circuit board 262 of the flexible circuit board 26, the intermediate portion 83 is received in the first aperture 564 of the insulating cover 50, and the second end portion 82 extends upwardly from the intermediate portion 83 beyond the insulating cover 50. The first end 81 of the conductive terminal 80 is electrically connected to the conductive path 22, and the second end 82 of the conductive terminal 80 is electrically connected to a component external to the sensor 100.

When the pressure sensing element 23 contacts with the refrigerant, the pressure of the received refrigerant is converted into an electric signal, when the temperature sensing unit contacts with the refrigerant, the temperature of the received refrigerant is converted into an electric signal, and the corresponding electronic elements such as chips on the circuit board assembly 20 feed back the real-time pressure and temperature of the refrigerant according to the electric signal, so that the real-time monitoring of the temperature and pressure of the refrigerant is realized, and the accurate control and intelligent design of the electromagnetic valve 93 are facilitated.

In the illustrated embodiment, the pressure sensing element 23 is a ceramic capacitor structure, and as shown in fig. 5, the ceramic substrate 21 includes a ceramic membrane 234 at a lower end and a ceramic plate 235 above the ceramic membrane 234, the ceramic membrane 234 having a thickness less than the thickness of the ceramic plate 235, and the ceramic membrane 234 and the ceramic plate 235 forming a ceramic capacitor. The ceramic diaphragm 234 has a sensing region 236, and the sensing region 236 may be aligned with the plane of the rest of the ceramic diaphragm 234. The sensing region 236 is electrically connected to three cover wires 238, and the three cover wires 238 are buried in the ceramic membrane 234. The pressure sensing element 23 further has three conductive posts 237 electrically connected to three cover wires 238, respectively, and one end of each conductive post 237 is physically connected to the cover wire 237, and the other end is exposed on the second surface 212 of the ceramic substrate 21. The ceramic pressure sensing element 23 directly acts on the first surface 211 of the ceramic diaphragm 234 by pressure based on the piezoresistive effect, so that the diaphragm is slightly deformed, thick film resistors are printed on the back surface of the ceramic diaphragm 234 and are connected into a wheatstone bridge, the bridge generates a voltage signal which is highly linear and proportional to the pressure and the excitation voltage due to the piezoresistive effect, the voltage signal is transmitted to the flexible circuit board 26 by the conductive posts 237, and the conditioning chip 25 on the flexible circuit board 26 performs corresponding pressure and voltage relation conversion, so that the real-time pressure of the refrigerant can be conveniently detected.

As shown in fig. 15 to 18, a sensor 100 according to a second embodiment of the present application is different from the first embodiment mainly in that the circuit board assembly 20 is a ceramic circuit board assembly 20, the pressure sensing element 23 is a micro-electro-mechanical system (Micro Electromechanical System, MEMS) pressure sensing chip, and the conductive terminals 80 are coil springs. The refrigerant flow passage 103 includes a first flow passage 1031 located in the protection sleeve 91 and a second flow passage 1032 located in the base plate 21, the second flow passage 1032 penetrating the base plate 21 in the base plate thickness direction. The substrate 21 includes a ceramic substrate 21, the ceramic substrate 21 includes a first surface 211 facing the first refrigerant flow channel 1031 and a second surface 212 facing the first cavity 101, electronic components such as the pressure sensing element 23 and the conditioning chip 25 are soldered on the second surface 212, the grounding plate 90 is soldered on the conductive path 22 of the second surface 212, and the grounding plate is a conductive metal plate. The pressure sensing element 23 is fixed on the first surface of the substrate 21 by gluing, the pressure sensing element 23 seals the second flow channel 1032, that is, the pressure sensing element 23 is designed as a back pressure chip, so that the risk that the welding binding wire of the pressure sensing element 23 is impacted by the refrigerant is reduced. The insulating cover 50 includes a first portion 51 and a second portion 52 in the thickness direction of the insulating cover 50, the metal shell 10 includes a base 11, a cylindrical body 12 extending from the base 11 in a direction away from the refrigerant flow path 103, and a bent portion 14 bent from the cylindrical body 12, the bent portion 14 presses the second portion 52 of the insulating cover 50, and the first portion 51 presses the substrate 21 and the grounding plate 90. The inner side of the cylindrical body 12 has a stepped surface 126, the stepped surface 126 is positioned on top of the stepped portion 125, the grounding plate 90 is clamped between the stepped surface 126 and the first portion 51, and the grounding plate 90 is in direct contact with the stepped surface 126. Compared with the first embodiment, the pressure sensing element 23 of the micro-electromechanical system (Micro Electromechanical System, MEMS) chip is adopted in the application, the volume of the pressure sensing element 23 formed by the ceramic capacitor is smaller, the base 40 can be omitted, a sealing ring 60 positioned between the base 40 and the metal shell 10 is reduced, the cost is lower, and the occupied space is smaller. The ground plate 90 is provided at an intermediate position in the thickness direction of the sensor 100, and can more uniformly conduct the ground in both directions. MEMS pressure integrated chip sizes are small, and common MEMS pressure integrated chip product sizes are typically on the order of millimeters or even smaller. The surface of the silicon cup film of the integrated chip prepared by the MEMS technology is made into a Wheatstone bridge with 4 resistors, and when no pressure acts on the silicon cup film and the circuit is connected, the Wheatstone bridge is balanced, and the output voltage is 0. When pressure acts on the silicon cup film, the Wheatstone bridge balance is broken, and voltage output is achieved. Therefore, the change of the pressure can be reflected by the change of the electric signal in the detection circuit, thereby realizing the pressure detection function.

A sensor 100 according to a third embodiment of the application is shown in fig. 19, and differs from the previous embodiments mainly in that: the refrigerant runner 103 is directly formed by the metal shell 10, the substrate 21 in the circuit board assembly 20 of the sensor 100 is a printed circuit board mainly made of resin materials, and sealing between the refrigerant runner 103 and the second cavity 102 is realized through gluing of the sealant 92, so that a sealing ring is omitted, the material cost is lower, and the sealing failure hidden danger caused by fatigue failure of the sealing ring is reduced. Of course, welding may also be used to achieve the connection between the metal shell 10 and the base plate 21 and the sealing between the refrigerant flow channel 103 and the second chamber 102. The ceramic circuit board has better corrosion resistance and better heat conduction performance compared with the printed circuit board. The printed circuit board is lower in manufacturing cost than the ceramic circuit board and facilitates soldering of the electronic components. The substrate 21 and the conductive path 22 in the substrate of the present application are not limited to the above-mentioned embodiments, as long as the electrical connection between the temperature sensing unit, the pressure sensing element, the plurality of electronic elements, and the conductive terminals can be achieved. The substrate 21 adopts an integrated structure, and the pressure sensing unit and the temperature sensing unit are electrically connected to the conductive paths 22 of the substrate 21, so that the structure of assembling and connecting the two plates together is simpler, the assembling process is reduced, and the manufacturing process is simplified.

A sensor 100 according to a fourth embodiment of the application is shown in fig. 20, which differs from the previous embodiments mainly in that: the pressure sensing element 23 is a MEMS pressure sensing chip using a micro-electro-mechanical system, the temperature sensing element 70 is a patch type NTC thermistor, and the welding pins or leads of the pressure sensing element 23 and the temperature sensing element 70 are protected by a protective adhesive 93. The pressure sensing element 23 adopts a positive pressure type structure, and is in contact with the refrigerant earlier and has lower detection delay. Of course, in other alternative embodiments, the pressure sensing element 23 and the temperature sensing element 70 may also be integrated on the same MEMS chip.

As shown in fig. 21 to 24, a valve device 93 according to the present application includes a sensor 100 according to any of the foregoing embodiments, and the sensor 100 according to the first embodiment is taken as an example. The valve device 93 may be an electronic expansion valve (Electronic Expansion Valve, EXV) comprising a valve body 931 and a valve core which are fixed in phase, which may be referred to as direct contact fixation or indirect fixation of an intermediate spacer element. The spool portion includes a spool 933, a spool seat 934, a motor portion, an internal circuit board 935, a cover 932, and a connector 936. The valve body 931 includes a duct including a third duct 937 and a fourth duct 938 parallel to each other and a first installation chamber 939 and a second installation chamber 940 parallel to each other, the first installation chamber 939 and the third duct 937 communicating, and the second installation chamber 940 and the fourth duct 938 communicating. Of course, in other alternative embodiments, the third channel 937 and the fourth channel 938 may be provided as the same channel with coincident axes.

The valve core 933 is installed in the first installation cavity 939 to control the on-off state or the throttled state of the refrigerant in the third duct 937, and the sensor 100 is installed in the second installation cavity 940 to detect the temperature and pressure of the refrigerant flowing into the fourth duct 938. The internal circuit board 935 is mounted within the cover cavity 943 of the cover 932, the second ends 82 of the conductive terminals 80 of the sensor 100 are abutted against a lower surface of the internal circuit board 935, and the connector 936 is connected to an upper surface of the internal circuit board 935. The sensor 100 is fixedly mounted to the second mounting cavity 940 by means of a fastener 944, wherein a third sealing ring 945 is further provided in the second mounting cavity 940, which sealing ring seals between the platform surface 111 of the sensor 100 and the inner wall of the valve body 931.

The motor portion and the valve core 933 are located in the valve core seat 934, the motor portion includes a static core/stator 941 and a moving core/rotor 942, the stator 941 surrounds the rotor 942, the rotor 942 is in driving connection with the valve core 933, and the stator 941 is electrically connected with the internal circuit board 935. The sensor 100 and the connector 936 are electrically connected to the internal circuit board 935, and the connector 936 is electrically connected to the external controller to power the electrical power to the electrical power supply 941, the sensor 100, or to transmit temperature and pressure signals within the sensor 100 to the external controller. When the stator 941 is energized, the varying current generates a magnetic field to drive the rotor 942 to rotate, and the rotor 942 drives the valve core 933 to move up and down linearly through the nut screw mechanism, so as to realize on-off or throttling of the refrigerant in the third duct 937.

As shown in fig. 25, the present application also provides a thermal management system or air conditioning system 95 that includes a compressor 951, a condenser 952, a valve device 93 (electronic expansion valve), an evaporator 953, and a sensor 100. The compressor 951 compresses a refrigerant into a high-temperature and high-pressure refrigerant, releases heat to air or a cooling liquid through the condenser 952, enters a third duct 937 of the valve device 93 (electronic expansion valve) to throttle and decompress the refrigerant into a low-temperature and low-pressure refrigerant, enters the evaporator to absorb heat from the air or the cooling liquid and evaporate the heat into a gaseous refrigerant, and enters the compressor 951 to circulate after measuring the temperature and the pressure of the refrigerant through the fourth duct 938 and the sensor 100. The sensor 100 and the electronic expansion valve are merely illustrative of the principle in the system, and the actual physical structure is shown in fig. 21 to 24 as an integrated structure.

The above embodiments are only for illustrating the present application and not for limiting the technical solutions described in the present application, and it should be understood that the present application should be based on those skilled in the art, and although the present application has been described in detail with reference to the above embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the present application without departing from the spirit and scope of the present application and modifications thereof should be covered by the scope of the appended claims.

Claims (8)

1. A sensor for the use in a medical device, characterized by comprising the following steps: a metal shell, a circuit board assembly and an insulating cover,

The circuit board assembly comprises a substrate, a conductive path and a plurality of electronic elements, the sensor is provided with a flow channel and a first cavity which are positioned on different sides of the thickness direction of the substrate, at least part of the electronic elements are positioned in the first cavity, and the flow channel is not communicated with the first cavity;

The electronic components are electrically connected with each other through conductive paths, the electronic components comprise pressure sensing elements, first capacitors and conditioning chips, and the conductive paths comprise power supply paths electrically connected with the conditioning chips;

the sensor comprises a grounding plate, the first capacitor comprises a first polar plate and a second polar plate, the first polar plate is electrically connected with the power supply path, the second polar plate is electrically connected with the grounding plate, and the grounding plate is electrically connected with the metal shell;

the metal shell comprises a first abutting part, the insulating cover comprises a second abutting part, the grounding piece comprises a third abutting part, the third abutting part is pressed between the first abutting part and the second abutting part, and the grounding piece is in contact with the first abutting part;

The circuit board assembly comprises a printed circuit board, the conductive path is arranged in the printed circuit board or on the surface of the printed circuit board, the grounding piece is physically and electrically connected to the conductive path of the printed circuit board, the sensor comprises a temperature sensing element, and the temperature sensing element, the pressure sensing element and the first capacitor are welded on the surface of the printed circuit board.

2. The sensor of claim 1, wherein: the circuit board assembly includes a flexible circuit board, the substrate includes a ceramic substrate, the pressure sensing element is formed on the ceramic substrate, the ground pad is a portion of the flexible circuit board, and the flexible circuit board is located in the second cavity.

3. The sensor of claim 2, wherein: the ceramic substrate comprises a first surface facing the flow channel and a second surface facing the flexible circuit board, the flexible circuit board comprises a first circuit board and a second circuit board which are arranged at intervals, the first circuit board is arranged on the two surfaces, and the second circuit board is far away from the second surface compared with the first circuit board;

the flexible circuit board comprises a first flexible circuit board and a second flexible circuit board, the first flexible circuit board is connected between the first circuit board and the second circuit board, the second flexible circuit board is connected with the second circuit board, the grounding piece is arranged on the second flexible circuit board, the conditioning chip is arranged on the first circuit board, and the first capacitor is arranged on the second circuit board.

4. A sensor according to claim 3, wherein: the sensor comprises a base, wherein the base comprises a bottom wall and a peripheral wall, the base is provided with a groove positioned between the bottom wall and the peripheral wall, the ceramic substrate is positioned in the groove, and the flow channel penetrates through the base along the thickness direction of the base;

The insulating cover comprises a first part and a second part which are positioned in the thickness direction of the insulating cover, the metal shell comprises a base part, a cylinder part extending from the base part along the direction far away from the flow channel and a bending part bending from the cylinder part, the bending part is propped against the grounding piece and the second part, and the first part is propped against the substrate and the base.

5. The sensor of claim 4, wherein: the second flexible circuit board comprises a first extending part extending from the second circuit board, a second extending part extending from the first extending part, a third extending part extending from the second extending part and a fourth extending part extending from the third extending part, wherein the first extending part is positioned in the second cavity, the second extending part is pressed between the second part and the peripheral wall, the third extending part is abutted against the peripheral wall of the insulating cover, the fourth extending part is pressed between the bending part and the first part, the third extending part is positioned between the peripheral wall of the insulating cover and the inner wall surface of the barrel, and the grounding piece is arranged on the fourth extending part.

6. The sensor of claim 5, wherein: the sensor comprises a temperature sensing element, the temperature sensing element comprises a temperature sensing part and a pin part, the pin part is arranged in the base through insert injection molding, the pin part is electrically connected with a conducting path from the temperature sensing part to the circuit board assembly, the temperature sensing part is positioned in the runner, or the temperature sensing part exceeds the runner along a direction far away from the first cavity.

7. The sensor of claim 1, wherein: the circuit board assembly is a ceramic circuit board assembly, the substrate comprises a ceramic substrate, the ceramic substrate comprises a first surface facing the flow channel and a second surface facing the first cavity, the pressure sensing element is a pressure sensing chip, the conditioning chip and the first capacitor are welded on a conductive path positioned on the second surface, and the grounding piece is connected to the conductive path on the second surface;

The insulating cover comprises a first part and a second part which are positioned in the thickness direction of the insulating cover, the metal shell comprises a base part, a cylinder part extending from the base part along the direction far away from the refrigerant flow channel and a bending part bending from the cylinder part, the bending part is propped against the second part of the insulating cover, and the first part is propped against the substrate and the grounding piece.

8. A valve device characterized in that: the sensor comprises any one of claims 1 to 7, the valve device further comprises a valve body and a valve core part, the valve core part is fixed with the valve body, the valve body is provided with a pore canal, the valve core part can control the on-off of the pore canal, the sensor is fixed with the valve body, a flow channel of the sensor is communicated with the pore canal of the valve body, and the metal shell is electrically connected with the valve body.