CN113068362B

CN113068362B - Flexible circuit board assembly, driving device, camera module and electronic product

Info

Publication number: CN113068362B
Application number: CN202110326107.5A
Authority: CN
Inventors: 韦华
Original assignee: New Shicoh Motor Co Ltd
Current assignee: New Shicoh Motor Co Ltd
Priority date: 2021-03-26
Filing date: 2021-03-26
Publication date: 2022-09-20
Anticipated expiration: 2041-03-26
Also published as: CN113068362A

Abstract

The invention discloses a flexible circuit board assembly, a driving device, a camera module and an electronic product, wherein the flexible circuit board assembly comprises: the FPC board is fixed on one side of the base; the FP drive coil board is arranged on the FPC board, a drive coil is arranged in the FP drive coil board, and the FP drive coil can generate X-direction and/or Y-direction drive force on magnets above the FP drive coil board after being electrified; i C module, wherein the IC module is connected to the FPC board, the I C module can sense the magnetic field change of the magnet and feed back the offset of the magnet in the X direction and/or the Y direction; the other side of the base is connected with a plurality of PIN PINs, the PIN PINs are connected with the IC module through connecting wires, and the connecting wires are embedded in the base. The invention not only can enhance the anti-shake performance, but also has the advantages of simple structure, less assembly procedures, simple and convenient assembly and the like.

Description

Flexible circuit board assembly, driving device, camera module and electronic product

Technical Field

The invention relates to the technical field of micromotors, in particular to a flexible circuit board assembly, a driving device, a camera module and an electronic product.

Background

When a user uses a shooting device of a mobile device to shoot, shaking is easy to occur, and the shot image is blurred. Therefore, an optical anti-shake motor is added in a camera of a mobile device, an optical anti-shake driving device is adopted for shake compensation when the camera shoots, so that a shot image is clear, a Hall element is adopted by the traditional anti-shake motor to sense the change of an operation position, the Hall element carries out micro measurement on a lens according to the magnetic field change of a magnet, feedback operation is assisted, so that the compensation displacement is accurate as much as possible, the Hall element is arranged on one side of the magnet to detect the magnetic field change of the magnet, when the lens generates micro displacement, the change of the magnetic field is fine, the current flow in other electronic elements in the camera module can generate micro magnetic fields, the magnetic fields can interfere the measurement of the Hall sensor, and further the detection of the micro displacement of the Hall element has errors.

Disclosure of Invention

In view of the above, it is desirable to provide a flexible circuit board assembly, a driving device, a camera module, and an electronic product, which have the advantages of enhanced anti-shake performance, simple structure, less assembly processes, and easy assembly.

A flexible circuit board assembly, comprising:

the FPC board is fixed on one side of the base;

the FP drive coil board is arranged on the FPC board, a coil group is arranged in the FP drive coil board, and the FP drive coil can generate X-direction and/or Y-direction drive force on a magnet above the FP drive coil board after being electrified;

the IC module is connected to the FPC board and can sense the magnetic field change of the magnet and feed back the offset of the magnet in the X direction and/or the Y direction;

the other side of the base is connected with a plurality of PIN PINs, the PIN PINs are connected with the IC module through connecting wires, and the connecting wires are embedded in the base.

In one embodiment, the connecting wires are also connected with the FPC board and the FP drive coil board.

In one embodiment, the connection lines include upper buried lines and lower buried lines stacked one on another, and the upper buried lines and the lower buried lines are alternately connected to the IC module, the FPC board, and the FP drive coil board.

In one embodiment, the connection line includes a left half buried line and a right half buried line disposed on the same plane, the IC module includes an X-direction IC module and a Y-direction IC module, and the left half buried line and the right half buried line are respectively connected to the X-direction IC module and the Y-direction IC module.

In one embodiment, a limiting unit is arranged between the FPC board and the base and can limit the position of the FPC on the base.

In one embodiment, the limiting unit comprises a limiting block and a limiting groove, the limiting block is arranged at the four peripheral corners of the base, the limiting groove is arranged on the FPC board, and the limiting groove is matched with the limiting block.

In one embodiment, one side of the limiting block, which is far away from the limiting groove, is provided with a sinking platform, a hanging wire hole is formed in the sinking platform, and a fixed hanging wire can be installed in the hanging wire hole.

In one embodiment, the suspension wires are connected with electrical terminals which are welded to the base.

In one embodiment, the limiting unit further includes a positioning column, a first positioning hole and a second positioning hole, the positioning column is disposed on the upper surface of the base, the first positioning hole is disposed on the FPC board, the second positioning hole is disposed on the FP driving coil board, the first positioning hole and the second positioning hole correspond in position, and the positioning column is matched with the first positioning hole and the second positioning hole relatively.

In one embodiment, a first through hole, a second through hole and a third through hole are respectively formed in the middle of the base, the middle of the FPC board and the middle of the FP drive coil board, and the positions of the first through hole, the second through hole and the third through hole correspond to each other.

In one embodiment, an inwardly recessed notch is formed in the edge of the first through hole, and the solder joints of the FPC board and the FP driving coil board are located in the notch.

A driving device comprises the flexible circuit board assembly.

A camera module comprises the driving device.

An electronic product comprises the camera module.

In above-mentioned flexible circuit board subassembly, drive arrangement, module and electronic product make a video recording, through the magnetic field change of IC module direct induction magnetite, and feedback magnetite at X to and/or Y to the offset to, then, the FP is driven the coil assembly of relevant position in the coil plate and is switched on, drive the magnetite and move along X to and/or Y to, the floating installation that drives the magnetite place moves along X to and/or Y to, thereby realized the position compensation of shake, strengthened anti-shake performance, simultaneously, through inlaying the connecting wire and establishing in the base, it can make the wiring of connecting wire is simpler, reduce equipment process and manufacturing process.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic structural view of a flexible circuit board assembly of the present invention;

FIG. 2 is a schematic view of a first angular configuration of the base of the present invention;

FIG. 3 is a second angular configuration of the base of the present invention;

FIG. 4 is a state diagram of the connecting wire of the present invention;

FIG. 5 is another state diagram of the connecting wire of the present invention;

FIG. 6 is a schematic view of the structure of the FPC board of the present invention;

FIG. 7 is a schematic diagram of the structure of the FP drive coil plate of the present invention;

FIG. 8 is a schematic view of the construction of the driving device of the present invention;

FIG. 9 is a schematic structural diagram of a camera module according to the present invention;

fig. 10 is a schematic structural diagram of an electronic product of the present invention.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The first embodiment is as follows:

please refer to fig. 1 to 7. An embodiment of the present invention provides a flexible circuit board assembly 10, which includes: FPC board 101, FP drive coil board 102, IC module 103, and PIN 105.

The FPC board 101 is fixed on one side of the base 104; the FP driving coil board 102 is arranged on the FPC board 101, a coil group is arranged in the FP driving coil board 102, and the FP driving coil 102 can generate driving force in the X direction and/or the Y direction to a magnet above the FP driving coil board after being electrified; the IC module 103 is connected to the FPC board 101, and the IC module 103 can sense a change in a magnetic field of the magnet and feed back a shift amount of the magnet in an X direction and/or a Y direction. The other side of the base 104 is connected with a plurality of PIN PINs 105, the PIN PINs 105 are connected with the IC module 103 through connecting wires 109, and the connecting wires 109 are embedded in the base 104.

In the present invention, the X direction, the Y direction and the Z direction form a virtual coordinate system, the Z direction is an axial direction of the base 104, the X direction and the Y direction are perpendicular to each other and form a horizontal plane, and the horizontal plane is perpendicular to the axial line of the base 104, wherein the X direction is a transverse direction of the horizontal plane, and the Y direction is a longitudinal direction of the horizontal plane.

The magnet of the present invention may be mounted on a carrier, and a structure (e.g., a lens assembly) to be driven may be mounted on the carrier, so as to form a floating device, and the floating device may be connected to the base 104 through a hard conductive suspension wire or the like, so that the floating device may move in the X direction and the Y direction with respect to the base 104, thereby achieving the anti-shake adjustment of the lens assembly. The number of magnets in this embodiment may be two or four, and the magnets are disposed above the FP driving coil plate 102 and distributed in the X direction and the Y direction. The coil groups in the FP coil plate 031 are also distributed in the X-direction and the Y-direction, and correspond to the positions of the magnets.

When a certain amount of current is applied to the coil group in the X direction, the coil group and the magnet positioned above the coil group in the X direction interact to generate electromagnetic force, and the floating device is driven to move along the X direction by the electromagnetic force generated according to the left-hand rule. When a certain amount of current is applied to the coil group in the Y direction, the coil group and the magnet positioned above the coil group in the Y direction interact to generate electromagnetic force, and the floating device is driven to move along the Y direction by the electromagnetic force generated according to the left-hand rule. Therefore, the position compensation can be carried out on the image deviation amount of the lens assembly caused by hand shake through the system control.

In the flexible circuit board assembly, the magnetic field change of the magnet is directly induced through the IC module 103, the offset of the magnet in the X direction and/or the Y direction is fed back, then, the FP drives the coil group at the corresponding position in the coil plate 102 to be electrified, the magnet is driven to move along the X direction and/or the Y direction, and the floating device where the magnet is located is driven to move along the X direction and/or the Y direction, so that the position compensation of shaking is realized, the anti-shaking performance is enhanced, meanwhile, the connecting wire 109 is embedded in the base 104, the wiring of the connecting wire 109 can be simpler, and the assembly process and the production and manufacturing process are reduced.

In the present invention, the connection line 109 is also connected to the FPC board 101 and the FP driving coil board 102. Thus, the power supply can be connected to the FPC board 101 and the FP drive coil board 102 through the PIN 105 and the connection line 109.

Referring to fig. 4, in an embodiment of the invention, the connection line 109 includes an upper buried line 1091 and a lower buried line 1092 stacked one on top of the other, and the upper buried line 1091 and the lower buried line 1092 are alternately connected to the IC module 103, the FPC board 101 and the FP driving coil board 102. In this way, the number of PIN PINs 105 can be reduced, and the wiring structure of the connection line 109 can be made more compact.

Referring to fig. 5 again, in another embodiment of the present invention, the connection line 109 includes a left half buried line 1093 and a right half buried line 1094 disposed on the same plane, the IC module includes an X-direction IC module 1031 and a Y-direction IC module 1032, and the left half buried line 1093 and the right half buried line 1094 are respectively connected to the X-direction IC module and the Y-direction IC module 1032. In this way, the X-direction IC module 1031 and the Y-direction IC module 1032 can be supplied with power through the left half buried line 1093 and the right half buried line 1094, respectively, so that the circuit interference between the X-direction IC module 1031 and the Y-direction IC module 1032 can be reduced, and the reliability of use of the IC modules can be improved. It is to be understood that the left half buried line 1093 and the right half buried line 1094 in this embodiment are only differences in name, and in some embodiments, the left half buried line 1093 and the right half buried line 1094 may be connected to the Y-direction IC module 1032 and the X-direction IC module 1031, respectively, to supply power to the Y-direction IC module 1032 and the X-direction IC module 1031, respectively.

In this embodiment, the left half buried line 1093 and the right half buried line 1094 lead out wires to be connected to the FPC board 101 and the FP driving coil board 102, so as to supply power to the FPC board 101 and the FP driving coil board 102.

Optionally, a plurality of through soldering holes are formed in the base 104, and the PIN 105 may be connected to the FP driving coil board 102 and the FPC board 101 by soldering or the like, so as to achieve conductive connection of the circuit. The shape of the soldering hole can be round, square, arc and the like.

In an embodiment of the present invention, a position limiting unit 106 is disposed between the FPC board 101 and the base 104, and the position limiting unit 106 can limit the position of the FPC board 101 on the base 104. Therefore, the installation of the FPC board 101 on the base 104 can be facilitated, the position precision and the assembly precision of the whole device can be improved, and the product quality is improved.

Specifically, the limiting unit 106 includes a limiting block 1061 and a limiting groove 1062, the limiting block 1061 is disposed at four peripheral corners of the base 104, the limiting groove 1062 is disposed on the FPC board 101, and the limiting groove 1062 is matched with the limiting block 1061. Specifically, the limiting groove 1062 has a first side wall 10621 and a second side wall 10622 which are distributed at an angle, the limiting block 1061 has a first mating surface 10611 and a second mating surface 10612 which are distributed at an angle, the first side wall 10621 corresponds to the first mating surface 10611, and the second side wall 10622 corresponds to the second mating surface 10612. Due to the arrangement, the limiting groove 1062 and the limiting block 1061 can be clamped with each other, so that the positioning accuracy of the FPC board 101 on the base 104 can be obviously improved.

In other embodiments of the present invention, the limiting block 1061 may also be provided with a wavy limiting fitting surface, the limiting groove 1062 is provided with a wavy limiting sidewall, and the wavy limiting fitting surface is matched with the wavy limiting sidewall, so that the positioning accuracy of the FPC board 101 on the base 104 can be further improved.

In an embodiment of the present invention, a sinking platform 1063 is disposed on a side of the limiting block 1061 away from the limiting groove 1062, a suspension wire hole 1064 is formed in the sinking platform 1063, and the suspension wire can be installed and fixed in the suspension wire hole 1064. In this embodiment, the bottom of the suspension wire is fixed in the suspension wire hole 1064, the top of the suspension wire is connected to the floating device, and the suspension wire hole 1064 may be disposed at a position close to the sidewall of the sinking platform 1063, so that when the floating device performs position compensation adjustment and the suspension wire is stressed in a horizontal plane, the limiting block 1061 may increase the structural strength of the sinking platform 1063, reduce the deformation and bending of the sinking platform 1063, and thereby may improve the position compensation adjustment speed and the adjustment precision of the floating device.

In one embodiment of the present invention, the suspension wires are connected to electrical terminals 107, and the electrical terminals 107 are welded to the base 104. The electrical connection terminal 107 can connect an external power source to the suspension wire, transmit the suspension wire to the coil in the floating device, and then utilize the mutual matching of the charged coil and the magnet to realize the adjustment of the lens assembly carried on the carrier in the direction of the Z direction (optical axis).

In an embodiment of the present invention, the limiting unit 106 further includes a positioning column 1065, a first positioning hole 1066, and a second positioning hole 1067, where the positioning column 1065 is disposed on the upper surface of the base 104, the first positioning hole 1066 is disposed on the FPC board 101, the second positioning hole 1067 is disposed on the FP driving coil board 102, the positions of the first positioning hole 1066 and the second positioning hole 1067 correspond, and the positioning columns 1065 are both matched with the first positioning hole 1066 and the second positioning hole 1067 relatively. By such arrangement, the positioning structure of the base 104 is simple, the assembling procedures are reduced, and the assembly is easier. In other embodiments of the present invention, the number of the positioning posts 1065 may be multiple, and the positioning posts are distributed at intervals on the upper surface of the base 104, a part of the first positioning holes 1066 and the second positioning holes 1067 may be set to be circular to be in transition fit with the positioning posts 1065, and another part of the first positioning holes 1066 and the second positioning holes 1067 may be set to be elliptical to be in clearance fit with the positioning posts 1065, so that an over-positioning phenomenon of the FPC board 101 and the FP driving coil board 102 when the FPC board 101 and the FP driving coil board 102 are mounted on the base 104 can be reduced, and the mounting efficiency of the FPC board 101 and the FP driving coil board 102 is improved.

In an embodiment of the present invention, a first through hole 1041, a second through hole 1011, and a third through hole 1021 are respectively disposed in a middle portion of the base 104, a middle portion of the FPC board 101, and a middle portion of the FP driving coil board 102, and positions of the first through hole 1041, the second through hole 1011, and the third through hole 1021 correspond to each other. The first through hole 1041, the second through hole 1011 and the third through hole 1021 can provide an avoidance space, so that the lens assembly and other parts can be conveniently mounted, meanwhile, the first through hole 1041, the second through hole 1011 and the third through hole 1021 can also reduce the weight of the base 104, the FPC board 101 and the FP drive coil board 102, and light-weight production and processing of the base 104, the FPC board 101 and the FP drive coil board 102 are realized. In this embodiment, the first through hole 1041, the second through hole 1011, and the third through hole 1021 may have a circular shape, a square shape, or the like.

Further, an inwardly recessed notch 1042 is disposed on a hole edge of the first through hole 1041, and a solder joint of the FPC board 101 and the FP driving coil board 102 is located in the notch 1042. Due to the arrangement of the notch 1042, an operation space is reserved for mechanical equipment to grab the FPC board 101 and the FP drive coil board 102, so that the FPC board 101 and the FP drive coil board 102 are installed on the base 104 more simply and conveniently. Meanwhile, dispensing can be carried out in the notch 1042, after the glue is solidified, the connection strength of the FPC board 101, the FP driving coil board 102 and the base 104 can be increased, soldering points of the FPC board 101 and the FP driving coil board 102 can be wrapped, and the risk of solder joint desoldering and short circuit is reduced.

Optionally, a plurality of steps 1043 are disposed on a sidewall of the notch 1042. When glue is dripped into the notch 1042, the glue on the outer layer can adhere to the multiple layers of steps 1043, which can enlarge the contact area between the glue and the notch 1042 and reduce the glue from slipping out of the notch 1042, thereby improving the connection strength between the FPC board 101, the FP driving coil board 102 and the base 104.

Referring to fig. 1 again, in an embodiment of the present invention, in order to facilitate the mounting of the IC module 103, a mounting hole 1044 is formed on the base 104, and the IC module 103 is located in the mounting hole 1044. In this embodiment, the size of the mounting hole 1044 may be larger than that of the IC module 103, so that the bump on the IC module 103 during the mounting process may be reduced.

Example two:

referring to fig. 8, an embodiment of the invention provides a driving device 20, and the driving device 20 includes a base 104, a housing 108, a floating device, a suspension wire, a flexible circuit board assembly 10, and the like. The housing 108 is covered on the base 104 and encloses with the base 104 to form an installation cavity, the floating device is installed in the installation cavity, the flexible circuit board assembly 10 is fixed on the base 104, one end of the suspension wire is connected with the floating device, and the other end of the suspension wire is connected with the base 104. The floating device comprises a carrier, a magnet, a coil, an upper elastic sheet and a lower elastic sheet.

In practical use, a structure to be driven (such as a lens assembly) is connected with the carrier, and at the moment, the coil is electrified, so that the carrier can move along the Z direction (optical axis) in the mounting cavity, and further, the structure such as the lens assembly can be driven to move along the Z direction. And the flexible circuit board assembly 10 is matched with the magnet, so that the floating device can be driven to move in the horizontal plane in the X direction and the Y direction.

Example three:

referring to fig. 9, an embodiment of the invention provides a camera module 30, which includes the driving device 20. Specifically, the camera module 30 includes a driving device 20 and a lens assembly 40, where the driving device 20 is connected to the lens assembly 40, and when the driving device 20 is connected to the lens assembly 40, the lens assembly 40 is connected to a carrier of the driving device 20, and when a coil of the driving device 20 is powered on, the carrier can move along an optical axis direction of the lens assembly 40, so as to drive the lens assembly 40 to achieve auto-focusing. When the FP of the flexible circuit board assembly 10 drives the coil board 102 to be powered on, the magnet and the carrier can be driven to move in the horizontal plane, so as to drive the lens assembly 40 to move in the horizontal plane, thereby realizing the shake position compensation of the image.

Example four:

referring to fig. 10, an embodiment of the invention provides an electronic product 50, which includes the camera module 30. Specifically, the electronic product 50 may be a mobile phone, a tablet computer, a telephone watch, a security camera, an on-vehicle camera, and the like, and includes a camera module 30 and a housing 501, where the camera module 30 is disposed on the housing 501.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-described examples merely represent several embodiments of the present application and are not to be construed as limiting the scope of the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A flexible circuit board assembly, comprising:

the FPC board is fixed on one side of the base;

wherein the other side of the base is connected with a plurality of PIN PINs, the PIN PINs are connected with the IC module through connecting wires, the connecting wires are embedded in the base,

the middle part of the base, the middle part of the FPC board and the middle part of the FP drive coil board are respectively provided with a first through hole, a second through hole and a third through hole, and the positions of the first through hole, the second through hole and the third through hole are corresponding;

an inwards concave notch is formed in the edge of the first through hole, the soldering welding points of the FPC board and the FP drive coil board are located in the notch, and multiple layers of steps are arranged on the side wall of the notch;

the connecting wire is also connected with the FPC board and the FP drive coil board;

the connecting line comprises a left half buried line and a right half buried line which are arranged on the same plane, the IC module comprises an X-direction IC module and a Y-direction IC module, and the left half buried line and the right half buried line are respectively connected with the X-direction IC module and the Y-direction IC module;

and the left half-embedded line and the right half-embedded line lead-out lead are connected with the FPC board and the FP drive coil board.

2. The flexible circuit board assembly of claim 1, wherein a position limiting unit is disposed between the FPC board and the base, and the position limiting unit can limit the position of the FPC on the base.

3. The flexible circuit board assembly of claim 2, wherein the limiting unit comprises limiting blocks and limiting grooves, the limiting blocks are arranged at four peripheral corners of the base, the limiting grooves are arranged on the FPC board, and the limiting grooves are matched with the limiting blocks.

4. The flexible circuit board assembly of claim 3, wherein a sinking platform is disposed on a side of the limiting block away from the limiting groove, and a hanging wire hole is formed in the sinking platform and is capable of installing and fixing a hanging wire.

5. The flexible circuit board assembly of claim 4, wherein the suspension wires are connected to electrical terminals that are soldered to the base.

6. The flexible circuit board assembly of claim 5, wherein the position limiting unit further comprises a positioning column and a first positioning hole and a second positioning hole, the positioning column is disposed on the upper surface of the base, the first positioning hole is disposed on the FPC board, the second positioning hole is disposed on the FP drive coil board, the first positioning hole and the second positioning hole correspond in position, and the positioning column is correspondingly matched with the first positioning hole and the second positioning hole.

7. A drive device comprising a flexible circuit board assembly according to any one of claims 1-6.

8. A camera module, characterized in that it comprises a drive device according to claim 7.

9. An electronic product, characterized by comprising the camera module according to claim 8.