CN113021104A - Grinding mechanism and grinding device - Google Patents

Abstract

The invention provides a grinding mechanism and a grinding device. The present invention is a method for making flatness constant in rough grinding and finish grinding of an object to be ground, including: a platform (2) for holding a plate-like grinding object (W); a stage moving unit (3) that linearly reciprocates the stage (2) in a predetermined range in one direction; a rough grinding section (4) which moves within the moving range of the object (W) to be ground by the table moving section (3) and performs rough grinding on the object (W) to be ground; and a lapping section (5) which moves within the moving range of the object (W) to be ground by the table moving section (3) and performs lapping on the object (W) to be ground.

Description

Grinding mechanism and grinding device

Technical Field

The invention relates to a grinding mechanism and a grinding device.

Background

When grinding an object to be ground, such as a resin sealing substrate, for example, grinding may be performed after rough grinding.

Further, conventionally, it is considered that rough grinding and finish grinding are performed by different grinding apparatuses, respectively, or in a semiconductor belt grinder including two stages as shown in patent document 1, rough grinding is performed on one stage and finish grinding is performed on the other stage.

[ Prior art documents ]

[ patent document ]

[ patent document 1] Japanese patent No. 6181799 publication

Disclosure of Invention

[ problems to be solved by the invention ]

However, in either case of performing rough grinding and finish grinding using different grinding apparatuses or performing rough grinding and finish grinding on different stages as in patent document 1, it is necessary to transfer the object to be ground to another stage after rough grinding. In this case, the alignment needs to be performed again on the transferred stage. Even if the alignment is performed, the levelness of the surface plate is not completely the same before and after the transfer, and therefore, the flatness of the object to be ground, which is fixed to the surface plate and ground, is affected, and the flatness of the object to be ground during rough grinding and the flatness of the object to be ground during finish grinding are changed. As a result, the grinding accuracy may be deteriorated. In particular, when the object to be ground is thin (for example, 5mm or less and 1mm or less), the problem of flatness (grinding accuracy) is significant.

Therefore, the main subject of the present invention is to make the flatness constant in the rough grinding and the finish grinding of the grinding object.

[ means for solving problems ]

That is, the grinding mechanism of the present invention includes: a table for holding a plate-like object to be ground; a stage moving unit configured to linearly reciprocate the stage in a predetermined range along one direction; a rough grinding section that moves within a movement range of the object to be ground by the table moving section and performs rough grinding on the object to be ground; and a lapping section that moves within a movement range of the object to be ground by the table moving section and performs lapping on the object to be ground.

The grinding device comprises the grinding mechanism.

[ Effect of the invention ]

According to the present invention configured as described above, the flatness can be made constant in rough grinding and finish grinding of the object to be ground.

Drawings

Fig. 1 is a plan view schematically showing the configuration of an embodiment of the grinding apparatus according to the present invention.

Fig. 2 is a rear view schematically showing the structure of the grinding mechanism of the embodiment.

Fig. 3 is a plan view schematically showing (a) a state of rough grinding and (B) a state of finish grinding in the above embodiment.

Fig. 4 is a plan view schematically showing the structure of a modified embodiment of the grinding apparatus of the present invention.

Fig. 5 is a plan view schematically showing the structure of a modified embodiment of the grinding apparatus of the present invention.

Fig. 6 is a front view and a side view schematically showing the structure of the belt grinding section according to the modified embodiment.

Fig. 7 is a schematic diagram showing the structure of the sleeve in the belt grinding section.

Fig. 8 is a view schematically showing the mounting structure of the rough grinding portion, the finish grinding portion, and the belt grinding portion on the Z-direction slider.

[ description of symbols ]

2: platform

3: platform moving part

4: rough grinding part

5: lapping and cutting part

6: supporting part

7: rough grinding part moving part

8: moving part of fine grinding part

9: control unit

10: contact sensor

11: substrate supply part before grinding

12: ground substrate storage part

13: washing part

14: drying section

15: inspection section

16: deburring part

17: belt grinding section

18: z-direction slider

19a, 19 b: accessory member

41: grinding stone for rough grinding

42: main shaft

51: grinding stone for fine grinding

52: main shaft

61: a pair of feet

62: connecting beam section

100: grinding device

100A: substrate storage module

100B: base plate grinding module (grinding mechanism)

100C: substrate washing module

100D: substrate conveying mechanism

170: base member

171: grinding belt

172: main shaft

173: drive shaft

174: driving wheel

175: contact wheel

176: tension pulley

177: covering body

177 a: lower wall part

177 b: side wall part

177 c: discharge hole

177H: opening part

CTL: control machine

P: first position

Q: second position

VP: suction pump

W: plate-like grinding object (sealed substrate, substrate)

Detailed Description

Next, the present invention will be described in further detail by way of example. However, the present invention is not limited to the following description.

As described above, the grinding mechanism of the present invention includes: a table for holding a plate-like object to be ground; a stage moving unit configured to linearly reciprocate the stage in a predetermined range along one direction; a rough grinding section that moves within a movement range of the object to be ground by the table moving section and performs rough grinding on the object to be ground; and a lapping section that moves within a movement range of the object to be ground by the table moving section and performs lapping on the object to be ground.

With this grinding mechanism, since the rough grinding section and the finish grinding section move within the movement range of the object to be ground by the table moving section to grind the object to be ground, respectively, the rough grinding and the finish grinding can be performed in a state where the object to be ground is held on one table. Thus, the object to be ground does not need to be transferred to a different surface plate, and the object to be ground does not need to be aligned again on a different surface plate, and the flatness can be made constant in rough grinding and finish grinding of the object to be ground. As a result, the grinding accuracy of the object to be ground can be improved. In addition, since the rough grinding section and the finish grinding section share the moving range of the table, the footprint (installation area) of the grinding mechanism can be reduced.

As a specific movement form of the rough grinding section and the finish grinding section, it is considered that the rough grinding section and the finish grinding section move in a direction crossing a reciprocating direction of the table by the table moving section. Preferably, the rough grinding part and the finish grinding part move in a direction orthogonal to a reciprocating direction of the table.

Since the grinding amount is increased in rough grinding, clogging of the grinding stone for rough grinding becomes a problem. Therefore, the rough grinding portion is preferably a horizontal shaft type grinding portion including a grinding stone for rough grinding. The horizontal axis type grinding section is a grinding system in which the rotation axis of the grinding stone is parallel to the flat surface.

With this configuration, clogging of the rough grinding grindstone can be reduced.

The lapping section is preferably a vertical-axis type lapping section including a lapping stone for lapping. The vertical axis type grinding section is a grinding system in which the rotation axis of the grinding stone is perpendicular to the flat surface.

With this configuration, high-precision grinding can be performed, the grinding area is large, and productivity can be improved.

The problem of clogging of the rough grinding stones or the finish grinding stones is increased depending on the kind of the object to be ground. In addition, there are also some grinding objects that require less high grinding accuracy, such as a grinding object that exposes only a copper wiring portion or a welded portion. In the case of the above-described grinding object, if a rough grinding stone or a finish grinding stone is used, the running cost increases.

In order to appropriately solve this problem, the rough grinding section or the finish grinding section is preferably a belt grinding type grinding section using an endless belt-shaped grinding belt. The grinding belt is less expensive than a rough grinding stone or a finish grinding stone, and can achieve a significant cost reduction. Further, the grinding tape is easier to exchange than a rough grinding stone or a finish grinding stone.

In order to enable selection of a grinding mode according to the type of a grinding object and improve the versatility of the grinding mechanism, the rough grinding portion is preferably configured to be changeable in the form of a horizontal shaft type grinding portion including a rough grinding stone and a belt type grinding portion using an endless belt-shaped grinding belt, and the finish grinding portion is preferably configured to be changeable in the form of a vertical shaft type grinding portion including a finish grinding stone and a belt type grinding portion using an endless belt-shaped grinding belt.

Specifically, the grinding mechanism includes: a rough grinding section moving section for moving the rough grinding section; a lapping section moving section for moving the lapping section; and a control unit for controlling the rough grinding unit moving unit and the finish grinding unit moving unit.

In this configuration, in order to controllably prevent the two grinding portions from interfering with each other, it is preferable that the control portion: when one of the rough grinding part and the finish grinding part grinds the grinding object, the other one of the rough grinding part and the finish grinding part is retreated to be out of the moving range of the grinding object.

In order to stably support the rough grinding portion and the finish grinding portion to improve the grinding accuracy, the grinding mechanism preferably further includes: a pair of feet arranged at two sides of the platform moving part; and a connecting beam part erected on the pair of leg parts; and the rough grinding portion and the finish grinding portion are movably supported by the connection beam portion.

In order to prevent the rough grinding portion and the finish grinding portion from structurally interfering with each other, it is preferable that one of the rough grinding portion and the finish grinding portion is supported by the connection beam portion on a front side, and the other of the rough grinding portion and the finish grinding portion is supported by a rear side.

In addition, in order to improve the versatility of the grinding mechanism, it is preferable that a belt grinding section using an endless belt-shaped grinding belt be provided in addition to the rough grinding section and the finish grinding section, and the belt grinding section be moved within a movement range of the object to be ground by the table moving section.

In order to suppress a grinding failure due to a burr or to improve the quality of the object to be ground, it is preferable that the grinding mechanism further includes a deburring unit that moves within a movement range of the object to be ground by the table moving unit to deburr the object to be ground.

In addition, a grinding device including the grinding mechanism is also an embodiment of the invention.

< one embodiment of the present invention >

Hereinafter, an embodiment of the grinding apparatus according to the present invention will be described with reference to the drawings. In addition, any of the drawings described below is schematically drawn without being enlarged or exaggerated as appropriate for easy understanding. The same constituent elements are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

In the following description, a resin-sealed substrate (sealed substrate) will be described as an example of a plate-shaped object to be ground. Examples of the substrate include: general substrates such as glass epoxy substrates, ceramic substrates, resin substrates, and metal substrates, and lead frames. In addition, the plate-like object to be ground may be an object other than the substrate.

< integral Structure of grinding apparatus 100 >

The polishing apparatus 100 of the present embodiment performs a planar polishing of the surface of a sealed substrate W (hereinafter, simply referred to as "substrate W") to improve the substrate, such as height adjustment (thickness adjustment) of the substrate W or improvement of heat dissipation of electronic components mounted on the substrate W.

Specifically, as shown in fig. 1, the grinding apparatus 100 includes: the substrate storage module 100A for storing the substrate W, the substrate polishing module 100B for polishing the substrate W, and the substrate cleaning module 100C for cleaning the polished substrate W are respectively provided as components. Each of the components 100A to 100C is detachable from and replaceable with respect to other components. The movement of the substrate W between the modules 100A to 100C is performed by the substrate transfer mechanism 100D and/or a robot (not shown). The operation of the entire grinding apparatus 100 of the present embodiment is controlled by a control device CTL including a control unit 9 described later.

The substrate storage module 100A supplies a substrate W before polishing (pre-polishing substrate) and stores a substrate W after polishing (polished substrate). Specifically, the substrate storage module 100A includes: a pre-grinding substrate supply part 11 for supplying the pre-grinding substrate W, and a ground substrate storage part 12 for storing the ground substrate W. The pre-grinding substrate supply unit 11 and the ground substrate storage unit 12 may be configured by using common components (e.g., magazine rack).

The substrate grinding module 100B performs plane grinding of the surface of the substrate W conveyed by the substrate conveying mechanism 100D, and specifically, the substrate grinding module 100B performs both rough grinding and finish grinding. Details will be described later.

The substrate cleaning module 100C cleans the ground substrate W ground by the substrate grinding module 100B. In the polishing apparatus 100 of the present embodiment, the substrate W is transferred from the stage 2 of the substrate polishing module 100B to the substrate cleaning module 100C by a robot (not shown) and cleaned. Specifically, the substrate washing module 100C includes: a washing unit 13 for spraying a washing liquid such as water to the ground substrate W to wash the substrate; and a drying unit 14 for drying the washed and ground substrate. In addition, the substrate cleaning module 100C may be provided with an inspection unit 15 for determining the quality of the ground substrate W. The inspection unit 15 may be provided as an inspection module separately from the substrate washing module 100C.

The ground substrate W cleaned by the substrate cleaning module 100C is transferred to the substrate storage module 100A by a robot (not shown) and the substrate transfer mechanism 100D, and stored in the ground substrate storage section 12.

< substrate grinding module 100B (grinding mechanism) >)

Next, the substrate grinding module 100B (grinding mechanism) will be described in detail.

Specifically, as shown in fig. 1 and 2, the substrate grinding module 100B includes: a stage 2 for holding a substrate W; a stage moving part 3 for linearly reciprocating the stage 2; a rough grinding section 4 for rough grinding the substrate W; and a lapping section 5 for lapping the substrate W.

The stage 2 holds the substrate W by suction, and has a plurality of suction holes (not shown) formed in an upper surface thereof for sucking the substrate W. In addition, a plurality of adsorption holes are connected to the suction pump VP. The stage 2 of the present embodiment corresponds to the substrate W having a rectangular shape in plan view and forms a rectangular shape in plan view.

The stage moving unit 3 linearly reciprocates the stage 2 in one direction (Y direction) within a predetermined range. Specifically, the stage moving unit 3 linearly reciprocates the stage 2 between a first position P set on the near side in the Y direction and a second position Q set on the deep side in the Y direction. Here, the first position P is a position at which the reception and transfer of the substrate W are performed, but may be set to a position different from the position at which the reception and transfer of the substrate W are performed.

In order to achieve high grinding accuracy, the table moving unit 3 preferably does not include a mechanism for rotating the table 2. In this case, the grinding apparatus 100 includes an alignment mechanism, and the orientation of the substrate W in the substrate transfer mechanism 100D is made to coincide with the orientation of the substrate W in the stage moving unit 3 (see fig. 1). The alignment mechanism may be, for example, a rotation mechanism included in the substrate transfer mechanism 100D, or may be a transfer mechanism such as a robot arm that moves the substrate W from the substrate transfer mechanism 100D to the stage 2 while rotating the orientation of the substrate W appropriately.

The stage moving unit 3 of the present embodiment is configured to move the stage 2 so that the longitudinal direction of the stage 2 coincides with the reciprocating direction (Y direction) of the stage 2. For example, the stage moving section 3 includes: a Y-direction rail provided along the Y-direction, a Y-direction slider sliding on the Y-direction rail and fixed with the stage 2, and a Y-direction driving part for driving the Y-direction slider. The Y-direction driving unit linearly reciprocates the stage 2 along the Y-direction rail by being controlled by a control unit 9 described later.

The rough grinding section 4 moves within the movement range of the substrate W by the stage moving section 3 to roughly grind the upper surface of the substrate W. The rough grinding section 4 is a horizontal-axis type grinding section including a rough grinding stone 41, and is set so that the rotation axis of a spindle 42 for rotating the rough grinding stone 41 is parallel to the flat surface. The rough grinding stone 41 is formed in a disk shape, and its outer peripheral surface is a use surface for grinding.

The lapping section 5 moves within the moving range of the substrate W by the stage moving section 3 to lap the substrate W. The lapping section 5 is a vertical-axis type lapping section including a lapping stone 51 for lapping, and is set so that the rotation axis of a spindle 52 for rotating the lapping stone 51 is perpendicular to the flat surface. Here, the lapping stones 51 have a smaller hole than the lapping stones 41. The polishing stone 51 for finish grinding has an annular or disc shape, and one end surface in the axial direction thereof is a surface to be used for grinding. Further, the lapping stone 51 has a diameter larger than the width of the substrate W.

Specifically, the rough grinding section 4 and the finish grinding section 5 are configured to move in a direction transverse to the reciprocating direction (Y direction) of the table 2 by the table moving section 3. In the present embodiment, the rough grinding section 4 and the finish grinding section 5 are configured to move in the X direction orthogonal to the Y direction between the first position P and the second position Q.

The substrate polishing module 100B of the present embodiment includes a gate-shaped support portion 6 that movably supports the rough polishing portion 4 and the finish polishing portion 5. As shown in fig. 2, the support portion 6 includes: a pair of leg portions 61 provided on both sides of the table moving portion 3, and a connecting beam portion 62 erected on the pair of leg portions 61, and the rough grinding portion 4 and the finish grinding portion 5 are movably supported by the connecting beam portion 62. The connecting beam portion 62 is provided along the X direction between the first position P and the second position Q. The present embodiment has the following structure: the rough grinding portion 4 and the finish grinding portion 5 are both supported at the deep side of the connection beam portion 62.

Here, as shown in fig. 2, the rough grinding portion moving portion 7 is provided between the connection beam portion 62 and the rough grinding portion 4, and the finish grinding portion moving portion 8 is provided between the connection beam portion 62 and the finish grinding portion 5. In fig. 1, the rough grinding section moving section 7 and the finish grinding section moving section 8 are not shown.

The rough grinding section moving section 7 moves the rough grinding section 4 in the X direction, and includes, for example, in the connection beam section 62: the X-direction driving device comprises an X-direction track arranged along the X direction, an X-direction slider moving along the X-direction track, and an X-direction driving part driving the X-direction slider. The X-direction driving unit is controlled by a control unit 9 described later, and the rough grinding unit 4 moves in the X direction.

The rough grinding portion moving portion 7 is configured to be able to move the rough grinding portion 4 in the Z direction, and the coupled beam portion 62 includes: a Z-direction rail arranged along the Z direction, a Z-direction slider moving along the Z-direction rail, and a Z-direction driving part driving the Z-direction slider. The Z-direction driving unit is controlled by a control unit 9 described later, and the rough grinding unit 4 moves in the Z-direction.

The lapping section moving section 8 moves the lapping section 5 in the X direction, and for example, the connection beam section 62 includes: the X-direction driving device comprises an X-direction track arranged along the X direction, an X-direction slider moving along the X-direction track, and an X-direction driving part driving the X-direction slider. The X-direction driving unit is controlled by a control unit 9 described later, and the lapping unit 5 moves in the X direction. The X-direction orbit of the rough grinding section moving section 7 and the finish grinding section moving section 8 may be common.

The lapping section moving section 8 is configured to move the lapping section 5 in the Z direction, and the connection beam section 62 includes: a Z-direction rail arranged along the Z direction, a Z-direction slider moving along the Z-direction rail, and a Z-direction driving part driving the Z-direction slider. The Z-direction driving unit is controlled by a control unit 9 described later, and the lapping unit 5 moves in the Z-direction.

In the above configuration, the control unit 9 controls each part to perform rough grinding and finish grinding of the substrate W.

Specifically, when roughly grinding the substrate W, the control unit 9 moves the rough grinding unit 4 within the movement range of the substrate W as shown in fig. 3 (a) to roughly grind the substrate W in a predetermined order.

The controller 9 controls the stage moving unit 3 to linearly reciprocate the substrate W and controls the rough grinding unit moving unit 7 to move the rough grinding unit 4 in the X direction, thereby roughly grinding the entire upper surface of the substrate W. For example, the control unit 9 linearly moves the table 2 at least once to roughly grind a desired portion of the substrate W in the longitudinal direction, and then linearly moves the table 2 at least once to roughly grind the desired portion of the substrate W in the longitudinal direction while shifting the rough grinding unit 4 in the X direction and aligning the rough grinding unit 4 with an unground portion. By repeating the above operation, the entire upper surface of the substrate W is roughly ground.

In the rough grinding, the control unit 9 performs feedback control on the position of the rough grinding unit 4 in the Z direction to adjust the rough grinding amount of the substrate W.

Specifically, the control unit 9 performs feedback control of the Z-direction position of the rough grinding unit 4 based on detection signals from one or more contact sensors 10 (see fig. 1) that are in contact with the substrate W so that the thickness of the substrate W reaches a predetermined target value. Here, the thickness of the substrate W may be determined based on a difference between the Z-direction position of the top surface of the table and the Z-direction position of the top surface of the substrate, or may be determined based on a polishing amount determined based on the Z-direction position of the top surface of the substrate before polishing and the Z-direction position of the top surface of the substrate after polishing. The sensor for detecting the thickness or the amount of grinding of the substrate W may be a displacement sensor of another type such as an optical sensor, in addition to the contact sensor.

On the other hand, when the substrate W is subjected to the finish grinding after the rough grinding, the control unit 9 moves the finish grinding unit 5 within the movement range of the substrate W to perform the finish grinding in a predetermined order, as shown in fig. 3 (B).

The control unit 9 controls the lapping section moving unit 8 to place the lapping stones 51 of the lapping section 5 in contact with the substrate W, and controls the table moving unit 3 to linearly move the substrate W, thereby roughly lapping the entire upper surface of the substrate W. For example, the control unit 9 controls the lapping section moving unit 8 to bring the lapping stone 51 into contact with the entire width direction of the substrate W, and then controls the table moving unit 3 to linearly move the substrate W at least once to lap the substrate W in the longitudinal direction.

In the finish grinding, the control unit 9 performs feedback control of the position of the finish grinding unit 5 in the Z direction to adjust the finish grinding amount of the substrate W. Specifically, the control unit 9 performs feedback control of the Z-direction position of the lapping section 5 based on a detection signal from the contact sensor 10 that is in contact with the substrate W so that the thickness of the substrate W reaches a predetermined target value. Here, the thickness of the substrate W may be determined based on a difference between the Z-direction position of the top surface of the table and the Z-direction position of the top surface of the substrate, or may be determined based on a polishing amount determined based on the Z-direction position of the top surface of the substrate before polishing and the Z-direction position of the top surface of the substrate after polishing.

In the above control, when one of the rough grinding section 4 and the finish grinding section 5 grinds the substrate W, the control section 9 retracts the other of the rough grinding section 4 and the finish grinding section 5 out of the movement range of the substrate W (see fig. 3). Here, the movement range of the rough grinding section 4 or the finish grinding section 5 is not obstructed in addition to the predetermined retreat position, in order to retreat the workpiece to the outside of the movement range. For example, the control unit 9 moves and stops one of the rough grinding unit 4 and the finish grinding unit 5 to a retracted position outside the movement range, and then moves the other of the rough grinding unit 4 and the finish grinding unit 5 to the movement range to start grinding.

< Effect of the present embodiment >

According to the polishing apparatus 100 of the present embodiment, since the rough polishing unit 4 and the finish polishing unit 5 each move within the movement range of the substrate W by the stage moving unit 3 to polish the substrate W, the rough polishing and the finish polishing can be performed in a state where the substrate W is held on one stage 2. This eliminates the need to transfer the substrate W to a different stage and realign the substrate W on a different stage, and allows the flatness to be constant during rough grinding and finish grinding of the substrate W. As a result, the grinding accuracy of the substrate W can be improved.

In addition, since the rough grinding section 4 and the finish grinding section 5 share the moving range of the table 2, the footprint of the substrate grinding module 100B (grinding mechanism) can be reduced. In the present embodiment, since the direction of reciprocation of the platform 2 formed in a rectangular shape in plan view coincides with the longitudinal direction of the platform 2, the footprint in the width direction of the grinding mechanism can be reduced in size.

< other modified embodiment >

The present invention is not limited to the above embodiments.

For example, as shown in fig. 4, the coupled beam portion 62 may have the following configuration: one of the rough grinding part 4 or the finish grinding part 5 is supported on the near side, and the other of the rough grinding part 4 or the finish grinding part 5 is supported on the deep side. With this configuration, the rough grinding section 4 and the finish grinding section 5 can be configured so as not to physically interfere with each other. Further, the rough grinding section moving section 7 and the finish grinding section moving section 8 are disposed on both sides of the connecting beam section 62, and the degree of freedom in design thereof can be increased.

In addition to the above embodiment, as shown in fig. 5, a deburring unit 16 may be provided, and the deburring unit 16 may move within the moving range of the substrate W by the stage moving unit 3 to deburr the substrate W. It is considered that the deburring portion 16 is movably supported by the connecting beam portion 62 in the same manner as the rough grinding portion 4 and the finish grinding portion 5. As the deburring portion 16, for example, bristles may be included. In fig. 5, the deburring portion 16 is supported on the front side of the connection beam portion 62, but may be supported on the deep side.

In the rough grinding section 4 of the above embodiment, the rough grinding stone 41 is used, and the finish grinding stone 51 is used for the finish grinding section 5, but as shown in fig. 6, the rough grinding section 4 or the finish grinding section 5 may be a belt grinding type grinding section (hereinafter, belt grinding section 17) using an endless belt-shaped grinding belt 171. The grinding belt 171 is formed in a belt shape by joining both ends of a belt-shaped polishing cloth sheet having polishing particles adhered to the surface thereof. The grinding belt 171 is less expensive than the rough grinding stone 41 or the finish grinding stone 51, and can achieve a significant cost reduction. The grinding belt 171 is also easier to exchange than the rough grinding stones 41 or the finish grinding stones 51. Further, the belt-type grinding section 17 is effective in grinding an object to be ground which is not so much required for grinding accuracy, such as a substrate W on which a problem of clogging is conspicuous when the rough grinding stone 41 or the finish grinding stone 51 is used, or a substrate W on which only a copper wiring portion or a welded portion is exposed, or in removing burrs formed on the object to be ground.

The belt grinding section 17 includes: a drive wheel 174 rotationally driven by a drive shaft 173 of the main shaft 172, a contact wheel 175, and an endless belt-shaped grinding belt 171 looped around these wheels 174 and 175. Further, a tension pulley 176 for applying tension to the grinding belt 171 may be included. Each of these parts 172 to 176 is supported by the base member 170.

As shown in fig. 7, the belt-type grinding section 17 includes a covering body 177 covering the grinding belt 171 so that a part of the grinding belt 171 is exposed. A lower wall portion 177a (a wall surface facing the substrate W) of the cover 177 is formed in a planar shape, and an opening 177H for exposing the grinding tape 171 is formed in the lower wall portion 177 a. Here, since the lower wall portion 177a of the cover 177 has a planar shape facing the substrate W, the polishing liquid such as water supplied from the outside flows through a space formed between the lower surface of the lower wall portion 177a and the upper surface of the substrate W, and is efficiently supplied to the polishing portion.

Further, a discharge hole 177c for discharging the grinding fluid introduced into the cover 177 to the outside is formed in the lower wall portion 177a of the cover 177 or a lower portion of the side wall portion 177b continuous to the lower wall portion 177 a. In addition, similarly to the belt-type grinding section 17, a covering body that covers the rough grinding section 4 and the finish grinding section 5 so that a part of the grinding stones 41 and 51 is exposed may be provided.

In addition to the configuration in which the rough grinding section 4 or the finish grinding section 5 is provided as the belt grinding section 17, the substrate grinding module 100B (grinding means) may include the belt grinding section 17 using the endless belt-shaped grinding belt 171 in addition to the rough grinding section 4 and the finish grinding section 5. The belt-type grinding section 17 is configured to be movable within the movement range of the substrate W by the table moving section 3, and is movably supported by the connection beam section 62 in the same manner as the rough grinding section 4 and the finish grinding section 5.

In addition, the rough grinding section 4 may be configured to be changeable in the form of a horizontal shaft type grinding section including the rough grinding stone 41 and a belt type grinding section using the endless belt-shaped grinding belt 171, and the finish grinding section 5 may be configured to be changeable in the form of a vertical shaft type grinding section including the finish grinding stone 51 and a belt type grinding section using the endless belt-shaped grinding belt 171. By making these possible changes, it is possible to select a grinding mode according to the type of the substrate W, and it is possible to improve the versatility of the substrate grinding module 100B (grinding mechanism).

In this case, as shown in fig. 8, the following configuration may be adopted: the Z-direction slider 18 of the Z-direction moving portion of the rough grinding portion 4 and the finish grinding portion 5 is attached by using the attachment members 19a and 19 b. For example, the rough grinding portion 4 is attached to the Z-direction slider via an attachment member 19a for the rough grinding portion 4. The lapping section 5 is attached to the Z-direction slider 18 via an attachment member 19b for the lapping section 5. In fig. 8, the belt grinding portion 17 is attached to the Z-direction slider 18 without using an attachment member, but the belt grinding portion may be attached to the Z-direction slider 18 using an attachment member. By using the attachment members 19a and 19b corresponding to the grinding portions 4 and 5 as described above, the rough grinding portion 4 (horizontal axis type) and the belt grinding portion 17 can be changed from each other, and the finish grinding portion 5 (vertical axis type) and the belt grinding portion 17 can be changed from each other. In fig. 8, the rough grinding section 4 (horizontal axis type), the finish grinding section 5 (vertical axis type), and the belt grinding section 17 can be changed to each other because the rough grinding section 4, the finish grinding section 5, and the Z-direction slider 18 of the Z-direction moving section are common. Alternatively, the horizontal spindle 42 and the spindle 172 of the belt-type grinding unit 17 may be used in common, and the rough grinding polishing stone 41 and the grinding belt 171 may be changed to each other with respect to the common spindle.

Further, in addition to the above embodiment, a polishing section including a polishing stone having a finer hole than the polishing stone 51 of the polishing section 5 may be provided. The polishing section is configured to be movable within the movement range of the substrate W by the stage moving section 3, and is supported movably by the connecting beam section 62 in the same manner as the rough polishing section 4 and the finish polishing section 5.

In addition to the above embodiment, a polishing unit including a polishing stone having a finer hole than the polishing stone 51 of the polishing unit 5 may be provided. The polishing portion is considered to be movably supported by the connecting beam portion 62 in the same manner as the rough polishing portion 4 and the finish polishing portion 5.

The rough grinding portion 4 of the above embodiment is a horizontal-axis type grinding portion, but may be a vertical-axis type grinding portion. On the other hand, the finish grinding section 5 of the above embodiment is a vertical shaft type grinding section, but may be a horizontal shaft type grinding section.

Further, a rotating portion for rotating the grinding portion may be provided between each grinding portion and the grinding portion moving portion. The rotating portion rotates the rotating shaft of the grinding portion by 90 degrees, and can be switched between a vertical shaft type and a horizontal shaft type.

In addition, although the support portion 6 of the above-described embodiment is of a gate type, it may be of a cantilever type including one leg portion and a beam portion extending from the leg portion.

In the above embodiment, the substrate W is supplied from the substrate storage module 100A, and is ground and washed and then stored in the substrate storage module 100A again, but a module for supplying a substrate (supply module) and a module for storing a substrate after grinding and washing (storage module) may be provided separately, and for example, the supply module and the storage module may be provided at opposite positions.

In addition, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

Claims (11)

1. A lapping mechanism comprising:

a table for holding a plate-like object to be ground;

a stage moving unit configured to linearly reciprocate the stage in a predetermined range along one direction;

a rough grinding section that moves within a movement range of the object to be ground by the table moving section and performs rough grinding on the object to be ground; and

and a lapping section which moves within a movement range of the object to be ground by the table moving section and performs lapping on the object to be ground.

2. The grinding mechanism of claim 1, wherein

The rough grinding section and the finish grinding section move in a direction transverse to a reciprocating direction of the table by the table moving section.

3. The grinding mechanism of claim 1 or 2, wherein

The rough grinding part is a horizontal shaft type grinding part comprising a grinding stone for rough grinding,

the lapping section is a vertical-axis type lapping section including a lapping stone for lapping.

4. The grinding mechanism of claim 1 or 2, wherein

The rough grinding part or the finish grinding part is a belt grinding type grinding part using an endless belt-shaped grinding belt.

5. The grinding mechanism of claim 1 or 2, wherein

The rough grinding part can be changed in the form of a transverse shaft type grinding part comprising a grinding stone for rough grinding and a belt type grinding part using an endless belt-shaped grinding belt,

the lapping section can be modified in the form of a vertical-axis type lapping section including a lapping stone for lapping and a belt-type lapping section using an endless belt-shaped lapping belt.

6. The grinding mechanism of claim 1 or 2, comprising:

a rough grinding section moving section for moving the rough grinding section;

a lapping section moving section for moving the lapping section; and

a control unit for controlling the rough grinding unit moving unit and the finish grinding unit moving unit; and is

The control unit retracts one of the rough grinding unit and the finish grinding unit out of a movement range of the object to be ground when the other of the rough grinding unit and the finish grinding unit grinds the object to be ground.

7. The grinding mechanism of claim 1 or 2, further comprising:

a pair of feet arranged at two sides of the platform moving part; and

a connecting beam part erected on the pair of leg parts; and is

The rough grinding portion and the finish grinding portion are movably supported by the connecting beam portion.

8. The grinding mechanism of claim 1 or 2, further comprising:

a pair of feet arranged at two sides of the platform moving part; and

a connecting beam part erected on the pair of leg parts;

the rough grinding portion and the finish grinding portion are movably supported by the connecting beam portion; and is

The connecting beam portion supports one of the rough grinding portion and the finish grinding portion on a proximal side and supports the other of the rough grinding portion and the finish grinding portion on a deep side.

9. The grinding mechanism of claim 1 or 2, wherein

The polishing apparatus further includes a belt-type polishing unit using an endless belt-type polishing belt, in addition to the rough polishing unit and the finish polishing unit, and the belt-type polishing unit moves within a movement range of the object to be polished by the table moving unit.

10. The grinding mechanism of claim 1 or 2, further comprising:

and a deburring unit that moves within a movement range of the object to be ground by the table moving unit to deburr the object to be ground.

11. A grinding apparatus comprising the grinding mechanism as recited in any one of claims 1 to 10.

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