CN112995443B

CN112995443B - Periscopic camera module and manufacturing method thereof

Info

Publication number: CN112995443B
Application number: CN201911278714.8A
Authority: CN
Inventors: 王启; 袁栋立; 俞丝丝; 郑雪莹
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2019-12-13
Filing date: 2019-12-13
Publication date: 2022-09-02
Anticipated expiration: 2039-12-13
Also published as: CN112995443A

Abstract

A periscopic camera module and a method for manufacturing the same. The periscopic camera module comprises a module component, a light turning component, a light quantity adjusting component and a circuit board component. The module assembly has a photosensitive path. The light turning component is correspondingly arranged on the photosensitive path of the module component and is provided with a light inlet end and a light outlet end facing the module component, wherein the light turning component is used for turning the light rays emitted from the light inlet end to be emitted from the light outlet end and transmitting the light rays along the photosensitive path to be received by the module component for imaging. The light quantity adjusting component is assembled at the light outlet end of the light turning component so as to be positioned between the light turning component and the module component and used for adjusting the quantity of light rays entering the module component. The circuit board assembly is electrically connected with the light quantity adjusting assembly and used for providing electric energy required by the operation for the light quantity adjusting assembly.

Description

Periscopic camera module and manufacturing method thereof

Technical Field

The invention relates to the technical field of camera modules, in particular to a periscopic camera module and a manufacturing method thereof.

Background

In recent years, the demand for the camera function of portable electronic devices (such as tablet computers, smart phones, etc.) is still increasing rapidly, and the camera module configured for the electronic device gradually realizes a plurality of functions such as background blurring, night shooting, double-shot zooming, etc. In particular, due to the application of periscopic camera modules, the capability of the bi-zoom is gradually increasing, for example, the optical zoom capability thereof has been upgraded to 3 times zoom through 2 times zoom, even 5 times zoom. In other words, the periscopic camera module greatly changes the cognition of people on the shooting capability of the portable electronic equipment (such as a smart phone), and has a wide market prospect.

As is well known, the quality of the image captured by the camera module is closely related to the light input of the camera module, and the light input of the camera module is usually controlled by a diaphragm disposed on the camera module, and the larger the diaphragm (aperture diameter), the larger the light input of the camera module. For example, as shown in fig. 1, a conventional periscopic camera module 1P includes a photosensitive assembly 11P and a lens barrel unit 12P, wherein the lens barrel unit 12P includes a lens group 121P, a prism 122P and a liquid crystal dimming device 123P, wherein the lens group 121P and the prism 122P are sequentially disposed in a photosensitive path of the photosensitive assembly 11P, and the lens group 121P is located between the prism 122P and the photosensitive assembly 11P, wherein the liquid crystal dimming device 123P is mounted to an inclined surface of the prism 122P for changing an orientation of liquid crystal molecules under an applied voltage, thereby changing a light transmittance of the liquid crystal dimming device 123P. In other words, the light entering the prism 122P enters the liquid crystal dimming device 123P through the prism 122P, and then is reflected at the liquid crystal dimming device 123P, so that the reflected light passes through the prism 122P and the lens assembly 121P to be received and imaged by the photosensitive assembly 11P. At this time, the orientation of the liquid crystal molecules is adjusted under the driving of the liquid crystal layer voltage to change the amount of light reflected back through the liquid crystal dimming device 123P, so that the amount of light passing through the prism 122P and the lens set 121P to be received by the photosensitive element 11P is changed, thereby changing the amount of light entering the periscopic imaging module 1P.

However, in the process of adjusting the light entering amount of the conventional periscopic camera module 1P, light rays are reflected and/or refracted for multiple times and enter and exit multiple interfaces (such as the interface between the liquid crystal dimming device and the prism), which causes light energy loss, resulting in insufficient light amount during imaging. In addition, the liquid crystal dimming device 123P is difficult to be assembled on the inclined surface of the prism 122P, which results in high assembly cost of the conventional periscopic camera module 1P.

Disclosure of Invention

An advantage of the present invention is to provide a periscopic camera module and a method for manufacturing the same, which can make the structure compact and contribute to reducing the overall size of the module.

Another advantage of the present invention is to provide a periscopic camera module and a method for manufacturing the same, wherein in an embodiment of the present invention, a light quantity adjusting component of the periscopic camera module is disposed at a light exit end of a light turning component, which is helpful for reducing difficulty in assembling the periscopic camera module.

Another advantage of the present invention is to provide a periscopic camera module and a method for manufacturing the same, wherein in an embodiment of the present invention, the light quantity adjusting component of the periscopic camera module is disposed on the module component, which helps to reduce the difficulty of assembling the periscopic camera module, so that the light quantity adjusting component can be debugged during assembling.

Another advantage of the present invention is to provide a periscopic camera module and a method for manufacturing the same, wherein in an embodiment of the present invention, the periscopic camera module directly bonds or engages the light quantity adjusting assembly to the housing bracket of the light turning assembly, so as to reduce the assembly difficulty of the module, improve the internal space utilization of the module, and contribute to reducing the size of the periscopic camera module.

Another advantage of the present invention is to provide a periscopic camera module and a method for manufacturing the same, wherein in an embodiment of the present invention, the periscopic camera module is electrically controlled by using a split circuit board, so as to avoid unstable performance of an integrated circuit board due to an oversize circuit board.

Another advantage of the present invention is to provide a periscopic camera module and a method for manufacturing the same, wherein in an embodiment of the present invention, the periscopic camera module can integrate background blurring and multiple long-shot functions into a whole and can be switched to use.

Another advantage of the present invention is to provide a periscopic camera module and a method for manufacturing the same, wherein in an embodiment of the present invention, the periscopic camera module can prevent a flexible board from being damaged due to an excessively large bending angle, which is helpful for improving the stability of the periscopic camera module.

Another advantage of the present invention is to provide a periscopic camera module and a method for manufacturing the same, wherein the use of expensive materials or complicated structures is not required in order to achieve the above advantages. Therefore, the present invention successfully and effectively provides a solution, not only provides a periscopic camera module and a manufacturing method thereof, but also increases the practicability and reliability of the periscopic camera module and the manufacturing method thereof.

To achieve at least one of the above advantages or other advantages and objects, the present invention provides a periscopic camera module, comprising:

a module assembly, wherein the module assembly has a photosensitive path;

the light steering component is correspondingly arranged on the photosensitive path of the module component and is provided with a light inlet end and a light outlet end facing the module component, wherein the light steering component is used for steering light rays entering from the light inlet end to be emitted from the light outlet end and propagating along the photosensitive path to be received by the module component for imaging;

a light quantity adjusting assembly, wherein the light quantity adjusting assembly is assembled at the light outlet end of the light turning assembly so as to be positioned between the light turning assembly and the module assembly, and is used for adjusting the quantity of light rays entering the module assembly; and

a circuit board assembly, wherein the circuit board assembly is configured to be electrically connected to the light quantity adjusting assembly for providing the light quantity adjusting assembly with electric power required for operation.

In an embodiment of the invention, the circuit board assembly includes a first circuit board electrically connected to the light turning assembly, a second circuit board electrically connected to the module assembly, and a first extension circuit board, wherein the first extension circuit board extends from the module assembly to the light turning assembly, and the first extension circuit board is electrically connected to the first circuit board and the second circuit board respectively.

In an embodiment of the invention, the circuit board assembly further includes at least one electrical connection element, wherein the electrical connection element electrically connects the first extension circuit board and the light quantity adjusting assembly, and is used for providing the electrical energy required by the operation of the light quantity adjusting assembly through the first extension circuit board.

In an embodiment of the invention, the electrical connecting element is a conductive pin, wherein the conductive pin is electrically connected to the light quantity adjusting assembly, so as to electrically connect the light quantity adjusting assembly to the first extension circuit board through the conductive pin.

In an embodiment of the invention, the conductive pins extend from the side wall of the light quantity adjusting assembly to the first extension circuit board side by side and are soldered to the first extension circuit board.

In an embodiment of the invention, the conductive pins are disposed at intervals and electrically connected to a sidewall of the light amount adjustment assembly, wherein the first extension circuit board is provided with two notches, and the notches on the first extension circuit board correspond to the conductive pins disposed on the light amount adjustment assembly one to one, respectively, so as to solder the conductive pins to the first extension circuit board.

In an embodiment of the invention, the circuit board assembly further includes at least one electrical connection element, wherein the electrical connection element electrically connects the first circuit board and the light quantity adjusting assembly, and is used for providing the electrical energy required by the operation of the light quantity adjusting assembly through the first circuit board.

In an embodiment of the invention, the electrical connecting element is a conductive pin, wherein the conductive pin is electrically connected to the light quantity adjusting assembly, and the conductive pin extends forward from the bottom wall of the light quantity adjusting assembly side by side to the first circuit board, and the conductive pin is soldered to the first circuit board.

In an embodiment of the present invention, the electrical connecting element includes a lead, wherein one end of the lead is electrically connected to the first circuit board, and the other end of the lead is electrically connected to the light quantity adjusting assembly

In an embodiment of the invention, the circuit board assembly further includes a driving circuit board, wherein the driving circuit board is electrically connected to the bottom side of the module assembly, and the driving circuit board is electrically connected to the first extension circuit board, wherein the circuit board assembly further includes at least one electrical connection element, wherein the electrical connection element electrically connects the driving circuit board and the light quantity adjusting assembly, and is used for providing the electrical energy required by the operation of the light quantity adjusting assembly through the driving circuit board.

In an embodiment of the invention, the electrical connection element is a conductive pin, wherein the conductive pin is electrically connected to the light amount adjustment assembly, and the conductive pin extends from the bottom wall of the light amount adjustment assembly to the driving circuit board side by side and backward, and the conductive pin is soldered to the driving circuit board.

In an embodiment of the invention, the circuit board assembly further includes a first flexible board, wherein the first flexible board is electrically connected to the second circuit board and the first extension circuit board in a bending manner.

In an embodiment of the invention, the circuit board assembly further includes a first flexible board, a second extension circuit board, and a second flexible board, wherein the second circuit board is disposed at the rear side of the module assembly, and the second extension circuit board is stacked on the second circuit board, wherein the first flexible board is electrically connected to the first extension circuit board and the second extension circuit board in a bent manner, and wherein the second flexible board is electrically connected to the second circuit board and the second extension circuit board in a bent manner.

In an embodiment of the invention, the periscopic camera module further includes a spacer, wherein the spacer is stacked between the second circuit board and the second extension circuit board, and a height of the second extension circuit board is smaller than a height of the second circuit board.

In an embodiment of the present invention, the circuit board assembly further includes a connector and a connection flexible board, wherein the connection flexible board electrically connects the connector to the second extension circuit board in a height direction of the second extension circuit board, and the connector is used for electrically connecting a main board of an electronic device.

In an embodiment of the invention, the periscopic camera module further includes an adhesive layer, so that the light turning component and the module component are respectively adhered to the light quantity adjusting component through the adhesive layer.

In an embodiment of the invention, the light quantity adjusting module is fastened to the light emitting end of the light turning module.

According to another aspect of the present invention, there is further provided a method for manufacturing a periscopic camera module, comprising the steps of:

assembling a light quantity adjusting assembly at a light outlet end of a light turning assembly, so that light rays incident from a light inlet end of the light turning assembly are firstly turned by the turning assembly and then emitted from the light outlet end, and then the light quantity passing through the light quantity adjusting assembly is changed by the adjustment of the light quantity adjusting assembly;

arranging the light quantity adjusting assembly and the light turning assembly in a photosensitive path of a module assembly, wherein the light quantity adjusting assembly is positioned between the light turning assembly and the module assembly and is used for enabling the light rays passing through the light quantity adjusting assembly to be received by the module assembly for imaging; and

and electrically connecting a circuit board assembly to the light quantity adjusting assembly to provide electric energy required by the work for the light quantity adjusting assembly.

In an embodiment of the present invention, the step of electrically connecting a circuit board assembly to the light quantity adjusting assembly for providing the light turning assembly, the module assembly and the light quantity adjusting assembly with electric power required for operation includes the steps of:

electrically connecting a first circuit board to the light steering assembly to electrically connect the first circuit board to an anti-shake driver of the light steering assembly;

electrically connecting a second circuit board to the module assembly to electrically connect the second circuit board to a photosensitive chip of a photosensitive assembly of the module assembly;

a first extension circuit board is arranged on the module assembly and the light steering assembly in an extending mode, and the first extension circuit board is electrically connected to the first circuit board and the second circuit board respectively; and

the light quantity adjusting component is electrically connected to the first circuit board or the first extension circuit board through at least one electrical connection element.

In an embodiment of the present invention, the step of electrically connecting a circuit board assembly to the light quantity adjusting assembly for providing the light quantity adjusting assembly with electric power required for operation further includes the steps of:

superposing a second extension circuit board on the second circuit board, and electrically connecting the second extension circuit board to the second circuit board through a second flexible board;

electrically connecting the first extension circuit board to the second extension circuit board or the second circuit board through a first flexible board; and

a spacer is stacked between the second wiring board and the second extension wiring board.

In an embodiment of the present invention, the method for manufacturing a periscopic camera module further includes:

the light quantity adjusting component is adhered or buckled on the light outlet end of the light turning component; and

and correspondingly bonding the light quantity adjusting assembly to the module assembly.

pre-positioning the light quantity adjusting assembly and the module assembly so that center lines of the light quantity adjusting assembly and the module assembly are substantially aligned in an optical axis direction of an optical lens of the module assembly;

adjusting the position of the light quantity adjusting component according to the shooting effect of shooting a target through the photosensitive component of the module component; and

and debugging the light quantity adjusting component to enable the light quantity size controlled by the light quantity adjusting component to meet a preset requirement.

pre-positioning the light redirecting assembly, the light quantity adjusting assembly, and the module assembly such that centerlines of the light redirecting assembly, the light quantity adjusting assembly, and the module assembly are substantially aligned; and

and adjusting the position of the light steering component according to the shooting effect of shooting the target through the photosensitive component.

Further objects and advantages of the invention will be fully apparent from the ensuing description and drawings.

These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

Fig. 1 shows a schematic structural diagram of a periscopic camera module in the prior art.

Fig. 2 is a system diagram of a periscopic camera module according to a first embodiment of the present invention.

Fig. 3 is a perspective view of the periscopic camera module according to the first embodiment of the present invention.

Fig. 4 shows an exploded view of the periscopic camera module according to the first embodiment of the present invention.

Fig. 5 is a schematic structural diagram of the periscopic camera module according to the first embodiment of the present invention.

Fig. 6 is a schematic structural diagram of the light steering assembly of the periscopic camera module according to the first embodiment of the present invention.

Fig. 7A shows an example of the wiring board assembly of the periscopic camera module according to the above-described first embodiment of the present invention.

Fig. 7B shows a first example of the wiring board assembly of the periscopic camera module according to the above-described first embodiment of the present invention.

Fig. 7C shows a second example of the wiring board assembly of the periscopic camera module according to the above-described first embodiment of the present invention.

Fig. 8A and 8B are schematic structural views showing a light amount adjustment assembly of the periscopic camera module according to the above-described first embodiment of the present invention.

Fig. 9 is a schematic structural diagram of the photosensitive assembly of the module assembly of the periscopic camera module according to the first embodiment of the present invention.

Fig. 10 is a schematic expanded view of the wiring board assembly of the periscopic camera module according to the first embodiment of the present invention.

Fig. 11A shows a first modified embodiment of the periscopic camera module according to the above-described first embodiment of the present invention.

Fig. 11B shows a second modification of the periscopic camera module according to the above-described first embodiment of the present invention.

Fig. 12 is a perspective view of a periscopic camera module according to a second embodiment of the present invention.

Fig. 13 is a perspective view showing a light amount adjustment assembly of the periscopic camera module according to the second embodiment of the present invention.

Fig. 14 and 15 show a first variant of the periscopic camera module according to the above-described second embodiment of the present invention.

Fig. 16 to 18 show a second modified embodiment of the periscopic camera module according to the above-described second embodiment of the present invention.

Fig. 19 is a schematic structural diagram of a periscopic camera module according to a third embodiment of the present invention.

Fig. 20A to 20C are schematic flow charts illustrating a method for manufacturing a periscopic camera module according to an embodiment of the present invention.

Detailed Description

The following description is provided to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.

In the present invention, the terms "a" and "an" in the claims and the description should be understood as meaning "one or more", that is, one element may be one in number in one embodiment, and the element may be more than one in number in another embodiment. The terms "a" and "an" should not be construed as limiting the number unless the number of such elements is explicitly recited as one in the present disclosure, but rather the terms "a" and "an" should not be construed as being limited to only one of the number.

In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

The periscopic camera module can realize long-focus shooting, has small size and particularly accords with the trend of miniaturization development at present. The invention designs the light quantity adjusting component (such as an iris diaphragm) and the periscopic camera module in a matching way, thereby not only realizing the shooting mode of a large diaphragm with a long focus to achieve the effect of blurring the background when shooting the portrait and making the portrait more prominent; and the shooting mode of a small aperture and a long focus can be realized, so that multiple long-shot shooting is realized. Therefore, the periscopic camera module can combine the background blurring shooting function and the multiple long-distance scene shooting function into one camera module and can be switched to use.

Referring to fig. 2 to 6 of the drawings, a periscopic camera module according to a first embodiment of the present invention is illustrated. Specifically, as shown in fig. 2 and 3, the periscopic camera module 1 includes a module assembly 10, a light turning assembly 20, a light quantity adjusting assembly 30, and a circuit board assembly 40. The module assembly 10 has a photosensitive path 100 for receiving light along the photosensitive path 100 for image formation. The light turning component 20 is correspondingly disposed on the photosensitive path 100 of the module component 10, and the light turning component 20 has a light inlet end 201 and a light outlet end 202 facing the module component 10, wherein the light turning component 20 is configured to turn the light entering from the light inlet end 201 to exit from the light outlet end 202, so that the light exiting from the light outlet end 202 propagates along the photosensitive path 100 to be received by the module component 10 for imaging. The light quantity adjusting assembly 30 is assembled to the light exit end 202 of the light turning assembly 20 to be located between the light turning assembly 20 and the module assembly 10 for adjusting the quantity of light entering the module assembly 10. It is understood that the light quantity adjusting assembly 30 is assembled between the light exit end 202 of the light turning assembly 20 and the module assembly 10 such that the light quantity adjusting assembly 30 is located between the light turning assembly 20 and the module assembly 10 for adjusting the quantity of light entering the module assembly 10 via the light turning assembly 20.

In other words, the light quantity adjusting assembly 30 and the light turning assembly 20 are sequentially located in the photosensitive path 100 of the module assembly 10, and the light quantity adjusting assembly 30 is located between the module assembly 10 and the light exit end 202 of the light turning assembly 20, so that the light entering from the light entrance end 201 of the light turning assembly 20 is first turned by the light turning assembly 20 to exit from the light exit end 202, and then is received by the module assembly 10 to form an image after the amount of light is adjusted by the light quantity adjusting assembly 30.

It should be noted that, since the light quantity adjusting assembly 30 is directly assembled to the light exit end 202 of the light turning assembly 20, the periscopic camera module 1 of the present invention can fully utilize the internal space of the module, so that the internal structure of the module is more compact, which is helpful to reduce the overall size of the module. Meanwhile, the module assembly 10, the light turning assembly 20, and the light amount adjusting assembly 30 in the periscopic camera module 1 are independent of each other so that one component may be replaced independently when a problem occurs, without affecting other components, which contributes to reducing the maintenance cost of the periscopic camera module 1.

More specifically, as shown in fig. 4 and fig. 6, the light diverting assembly 20 of the periscopic camera module 1 may include a reflecting element 21, a carrier 22 and a housing support 23, wherein the housing support 23 has a diverting passage 230, wherein the reflecting element 21 and the carrier 22 are disposed in the diverting passage 230 of the housing support 23, and the reflecting element 21 is carried on the carrier 22 to keep the reflecting element 21 correspondingly located on the photosensitive path 100 of the module assembly 10, such that the light diverting assembly 20 is used for diverting the light entering from the light inlet end 201 to exit from the light outlet end 202 by the reflection of the reflecting element 21, and the light exiting from the light outlet end 202 propagates along the photosensitive path 100 to be received by the module assembly 10 for imaging.

For example, in the first embodiment of the present invention, as shown in fig. 4 and fig. 6, the reflective element 21 of the light turning assembly 20 can be, but is not limited to be, implemented as a prism 210, that is, the prism 210 has a light incident surface 211, a light emitting surface 212 and a reflective surface 213, wherein the light incident surface 211 of the prism 210 is located at the light incident end 201 of the light turning assembly 20, and the reflective surface 213 of the prism 210 is disposed on the carrier 22, wherein the light emitting surface 212 of the prism 210 is located at the light emitting end 202 of the light turning assembly 20, and the light emitting surface 212 faces the module assembly 10, so that a light ray incident into the prism 210 through the light incident surface 211 is firstly reflected by the reflective surface 213 to be turned and then exits the prism 210 through the light emitting surface 212 to propagate along the photosensitive path 100, and is received by the modular assembly 10 for imaging. Of course, in other examples of the present invention, the reflective element 21 of the light steering assembly 20 may also be implemented as other optical elements such as a reflective plane mirror and a waveguide, or the reflective element 21 may also be replaced by a refractive element as long as the propagation direction of the light can be changed, which is not described in detail herein.

Preferably, the light incident surface 211 of the prism 210 is perpendicular to the light emitting surface 212 of the prism 210, so that the prism 210 is implemented as a right-angle prism, and the light ray perpendicularly incident into the prism 210 through the light incident surface 211 is firstly reflected by the reflecting surface 213 to be turned by 90 °, and then perpendicularly exits the prism 210 through the light emitting surface 212 to be transmitted along the photosensitive path 100, and then is received by the module assembly 10 to be imaged. In other words, the light incident surface 211 of the prism 210 is parallel to the light sensing path 100 of the module assembly 10, and the light emitting surface 212 of the prism 210 is perpendicular to the light sensing path 100 of the module assembly 10, so that the light ray propagating perpendicular to the light sensing path 100 can propagate along the light sensing path 100 after being reflected by the prism 210, so as to be received and imaged by the module assembly 10.

More preferably, as shown in fig. 6, the prism 210 is completely accommodated in the housing support 23, that is, the light incident surface 211 and the light emitting surface 212 of the prism 210 are both located in the turning channel 230 of the housing support 23, so as to protect the prism 210 and reduce abrasion.

It should be noted that, as shown in fig. 6, the light turning component 20 of the periscopic camera module 1 may further include an anti-shake driver 24, where the anti-shake driver 24 is disposed between the carrier 22 and the housing bracket 23, and is configured to drive the carrier 22 to drive the prism 210 to rotate, so as to change a rotation angle of the prism 210, so that the light turned by the prism 210 can better propagate along the photosensitive path 100, so as to achieve an anti-shake effect of the periscopic camera module 1, and help to improve the image quality of the periscopic camera module 1.

Specifically, as shown in fig. 6, the carrier 22 of the light turning assembly 20 has a bearing surface 221 and at least one non-bearing surface 222, wherein the reflection surface 213 of the prism 210 is disposed on the bearing surface 221 of the carrier 22 in a face-to-face manner, and wherein the anti-shake driver 24 is disposed between the non-bearing surface 222 of the carrier 22 and an inner wall surface of the housing bracket 23, and is configured to drive the carrier 22 to drive the prism 210 to rotate, so as to achieve an anti-shake function of the periscopic camera module 1.

For example, as shown in fig. 6, the anti-shake driver 24 may include, but is not limited to, a magnet 241 and a coil 242, wherein the magnet 241 is disposed on the non-bearing surface 222 of the carrier 22, and the coil 242 is correspondingly disposed on an inner wall surface of the housing bracket 23, so that the position of the magnet 241 and the position of the coil 242 correspond to each other to form an electric motor for driving the carrier 22 to rotate the prism 210 under the action of electric power to achieve the anti-shake effect. Of course, in another example of the present invention, the magnet 241 may be provided on the inner wall surface of the housing holder 23, and the coil 242 may be correspondingly provided on the non-bearing surface 222 of the carrier 22, as long as an electric motor can be formed, and the positions of the magnet 241 and the coil 242 are not limited in the present invention.

In the first embodiment of the present invention, as shown in fig. 4 and 5, the circuit board assembly 40 of the periscopic camera module 1 includes a first circuit board 41, wherein the first circuit board 41 is disposed on the housing bracket 23 of the light turning assembly 20, and the first circuit board 41 is electrically connected to the anti-shake driver 24 for providing the electrical energy required by the anti-shake driver 24 to operate, so that the prism 210 rotates, thereby achieving optical anti-shake.

Illustratively, as shown in fig. 3, the first circuit board 41 of the circuit board assembly 40 is attached to the outer side of the housing support 23 of the light turning assembly 20 and located at the bottom side of the light turning assembly 20, wherein the first circuit board 41 is electrically connected to the anti-shake driver 24 directly through a lead (not shown) so as to realize the anti-shake function of the periscopic camera module 1. It will be appreciated that the first circuit board 41 may also be electrically connected to the anti-shake driver 24 via conductive pins. In addition, the first circuit board 41 of the circuit board assembly 40 may be implemented as a hard board PCB, a soft board FPC or a rigid-flex board, and the present invention does not limit the type of the first circuit board 41. It is understood that the bottom side mentioned in the present invention is defined as the side facing away from the light entrance end 201 of the light diverting component 20, and the front and rear sides mentioned in the present invention correspond to the light diverting component 20 and the module component 10, respectively, that is, the light rays propagate from the front to the rear along the photosensitive path of the module component 10 to be received and imaged by the module component 10.

It is to be noted that the light quantity adjusting assembly 30 of the periscopic camera module 1 according to the first embodiment of the present invention can be implemented as, but not limited to, various types of variable diaphragms such as voltage-type variable diaphragms, liquid crystal-type variable diaphragms, or blade-type variable diaphragms, so as to change the size of the diaphragm aperture of the variable diaphragm under the action of electric energy, thereby adjusting the quantity of light entering the module assembly 10. Therefore, the light quantity adjusting module 30 of the periscopic camera module 1 of the present invention is electrically connected to the circuit board assembly 40 to provide the light quantity adjusting module 30 with electric power through the circuit board assembly 40, so that the light quantity adjusting module 30 adjusts the amount of light entering the module assembly 10 under the action of the electric power.

More specifically, as shown in fig. 4 and 5, the circuit board assembly 40 may further include at least one electrical connection element 42, wherein the electrical connection element 42 electrically connects the light quantity adjusting assembly 30 and the first circuit board 41 together to transmit power to the light quantity adjusting assembly 30 through the first circuit board 41 and the electrical connection element 42.

In an example of the present invention, as shown in fig. 4 and 7A, the electrical connection element 42 may be implemented as a conductive pin 421 electrically connected to the light quantity adjusting assembly 30, wherein the conductive pin 421 extends from the bottom wall 301 of the light quantity adjusting assembly 30 to the first circuit board 41 side by side and forward, so as to directly weld the conductive pin 421 to the first circuit board 41, thereby achieving the electrical connection between the light quantity adjusting assembly 30 and the first circuit board 41. It is understood that in other examples of the present invention, the conductive pins 421 may also be electrically connected and adhered to the first circuit board 41 by a conductive adhesive, which is not described in detail herein.

It should be noted that, since the conductive pins 421 extend directly to the bottom of the light turning component 20, and the first circuit board 41 is assembled on the bottom of the light turning component 20, the conductive pins 421 can directly contact the first circuit board 41 to electrically connect the first circuit board 41 by soldering, so as to electrically connect the first circuit board 41 and the light quantity adjusting component 30.

Of course, in the first modified example of the present invention, as shown in fig. 7B, the electrical connection element 42 may also be implemented as a lead 422, wherein one end of the lead 422 is electrically connected to the first circuit board 41, and the other end of the lead 422 is electrically connected to the light quantity adjusting assembly 30, so that the light quantity adjusting assembly 30 at the light exit end 202 of the light redirecting assembly 20 is electrically connected to the first circuit board 41 through the lead 422.

For another example, in a second modified example of the present invention, as shown in fig. 7C, the electrical connection element 42 may include the conductive pin 421 and the lead wire 422, wherein the conductive pin 421 is electrically connected to the light amount adjustment assembly 30, wherein one end of the lead wire 422 is electrically connected to the first circuit board 41, and the other end of the lead wire 422 is electrically connected to the conductive pin 421, so that the light amount adjustment assembly 30 is electrically connected to the first circuit board 41 by the bonding between the conductive pin 421 and the lead wire 422, and the light amount adjustment assembly 30 is easily detached.

It should be noted that, according to the first embodiment of the present invention, as shown in fig. 2 and fig. 5, the periscopic camera module 1 may further include an adhesive layer 50, where the adhesive layer 50 is located between the light quantity adjusting component 30 and the light exit end 202 of the light turning component 20, so as to adhere the light quantity adjusting component 30 to the light exit end 202 of the light turning component 20 through the adhesive layer 50, so that the light turned by the light turning component 20 passes through the light quantity adjusting component 30 first after exiting from the light exit end 202, and then enters the module component 10 to be received and imaged. Thus, the periscopic camera module 1 can adjust the light quantity entering the module assembly 10 more accurately through the light quantity adjusting assembly 30, so that the periscopic camera module 1 can meet the light inlet quantity requirements of different shooting modes and also contribute to improving the imaging quality of the periscopic camera module 1.

For example, as shown in fig. 8A and 8B, the light amount adjustment assembly 30 of the periscopic camera module 1 may include, but is not limited to, a plurality of blades 31, a plurality of electric actuators 32, and a frame 33, wherein the blades 31 are partially overlapped and mounted on the frame 33 to form a diaphragm hole 300 with an adjustable aperture by the blades 31, the electric actuators 32 are correspondingly disposed on the frame 33, and the electric actuators 32 are connected with the blades 31 in a one-to-one correspondence for actuating the corresponding blades 31 to adjust the aperture size of the diaphragm hole 300. It will be appreciated that the electrical actuator 32 may include a magnet, a coil, and a plunger, the coil generating a magnetic field when energized to drive the magnet in a particular direction to move the plunger; the lever is connected to the blade 31, so that the blade 31 can change its position (e.g., rotate within a specific angle range) with the movement of the lever, thereby changing the aperture size of the diaphragm aperture 300. In addition, the number and shape of the blades 31 in the light amount adjusting unit 30 may be any as long as the diaphragm aperture 300 with a variable aperture can be formed, and the present invention is not limited thereto.

It should be noted that, in the first embodiment of the present invention, the adhesive layer 50 is located between the housing support 23 of the light turning assembly 20 and the frame 33 of the light quantity adjusting assembly 30, so as to firmly attach the light quantity adjusting assembly 30 to the light emitting end 202 of the light turning assembly 20. Meanwhile, the adhesive layer 50 may be simultaneously located between the light amount adjustment unit 30 and the module unit 10, so that the light redirecting unit 20, the light amount adjustment unit 30, and the module unit 10 are sequentially adhered together by the adhesive layer 50 to be independently assembled into the periscopic camera module 1.

In particular, the adhesive layer 50 may be cured, but not limited to, by an adhesive such as glue, so as to adjust the relative positions among the light turning member 20, the light quantity adjusting member 30 and the module assembly 10 before curing, and ensure that the center of the aperture hole 300 of the light quantity adjusting member 30 is aligned or substantially aligned with the photosensitive path 100 of the module assembly 10, so that the light turned by the light turning member 20 can pass through the aperture hole 300 of the light quantity adjusting member 30 to enter the module assembly 10 to be imaged.

Illustratively, in the above example of the present invention, a ring of adhesive is applied on the frame 33 of the light quantity adjusting assembly 30, and then the light quantity adjusting assembly 30 is correspondingly placed on the light exit end 202 of the light turning assembly 20, and the adhesive is located between the housing support 23 of the light turning assembly 20 and the frame 33 of the light quantity adjusting assembly 30, so as to form the adhesive layer 50 after the adhesive is cured, so as to adhesively fix the light quantity adjusting assembly 30 to the light exit end 202 of the light turning assembly 20 through the adhesive layer 50; finally, an adhesive is further applied between the light amount adjustment member 30 and the module assembly 10 to form the adhesive layer 50 that adhesively fixes the light amount adjustment member 30 and the module assembly 10 after the adhesive is cured.

Of course, in another example of the present invention, the light amount adjustment unit 30 and the module unit 10 are bonded together by the adhesive layer 50, and after the light amount adjustment unit 30 is debugged, the light exit end 202 of the light redirecting unit 20 is correspondingly bonded to the light amount adjustment unit 30 by the adhesive layer 50, thereby completing the assembly of the periscopic camera module 1. Thus, before the light turning assembly 20 is assembled, the light quantity adjusting assembly 30 can be debugged by the photographing effect of the lens and the photosensitive chip to determine whether the center of the diaphragm hole 300 of the light quantity adjusting assembly 30 is aligned with the optical center of the optical lens of the module assembly 10; alternatively, it is tested whether the effect of the opening and closing of the blades in the light quantity adjusting unit 30 on the quantity of incoming light can achieve the desired effect, and so on.

According to the first embodiment of the present invention, as shown in fig. 4 and 5, the module assembly 10 of the periscopic camera module 1 may include an optical lens 11, a photosensitive assembly 12, a focus actuator 13 and an assembly housing 14, wherein the optical lens 11, the photosensitive element 12 and the focus driver 13 are assembled in the assembly housing 14, wherein the optical lens 11 is drivably provided to the focus driver 13, and the focus driver 13 is correspondingly provided to the photosensitive assembly 12, so that the optical lens 11 is held in the photosensitive path of the photosensitive element 12 (i.e. the photosensitive path 100 of the module assembly 10), the focusing driver 13 is configured to drive the optical lens 11 to move on the light sensing path 100, so as to implement a focusing function of the periscopic imaging module 1.

More specifically, as shown in fig. 5, the optical lens 11 may include a lens barrel 111 and a plurality of lenses 112, wherein the plurality of lenses 112 are disposed on the lens barrel 111 coaxially, so as to drive the lens barrel 111 to move through the focus actuator 13, and further drive the lenses 112 to move to achieve a focus effect. Preferably, an included angle between the optical axis of the optical lens 11 and the reflection surface 213 of the prism 210 of the light turning assembly 20 is 45 °, so as to ensure that the center of the diaphragm aperture 300 of the light quantity adjusting assembly 30 substantially coincides with the optical axis of the optical lens 11, which helps to improve the imaging quality of the periscopic camera module 1.

It is noted that in one example of the present invention, as shown in fig. 5, the focus actuator 13 may include a driving motor 131 and a driving housing 132. The driving motor 131 may include a magnet mounted on the lens barrel 111 of the optical lens 11 and a coil mounted on the driving housing 132, and a position of the magnet and a position of the coil correspond to each other. The driving housing 131 has a recessed hole for mounting the optical lens 11. It is understood that the driving motor 131 may be implemented as, but not limited to, a voice coil motor or a piezoelectric motor. In another example of the present invention, the coil may be attached to the lens barrel 111, and the magnet may be attached to the drive housing 132.

Specifically, as shown in fig. 3 and 5, the circuit board assembly 40 of the present invention may include a driving circuit board 43, wherein the driving circuit board 43 is mounted on the outside of the driving housing 132 of the focus driver 13, and the driving circuit board 43 is provided with pins extending horizontally from the outside of the driving housing 132, through which circuit boards of other components may be soldered together. Of course, the driving motor 131 of the focus driver 13 may also be electrically connected to the driving circuit board 43 through a pin or a wire, so as to obtain electrical energy from the driving circuit board 43, so that the optical lens 11 moves relative to the photosensitive component 12 under the driving of the driving motor 131, so as to implement a focusing function. It is understood that the type of the driving circuit board 43 is not a limitation of the present invention, and may be a hard board PCB, a soft board FPC or a rigid-flex board.

According to the first embodiment of the present invention, as shown in fig. 3 and 9, the photosensitive assembly 12 of the module assembly 10 may include a photosensitive chip 121 and a filter element 122, wherein the filter element 122 is disposed between the photosensitive chip 121 and the optical lens 11, such that the light entering the module assembly 10 is converged by the optical lens 11, and then is received by the photosensitive chip 121 for imaging after being filtered by the filter element 122.

Correspondingly, as shown in fig. 3 and 5, the circuit board assembly 40 of the periscopic camera module 1 further includes a second circuit board 44, wherein the photosensitive chip 121 of the photosensitive assembly 12 is attached to the second circuit board 44, and the photosensitive chip 121 is electrically connected to the second circuit board 44, so as to provide electric energy for the photosensitive chip 121 through the second circuit board 44, so that the photosensitive chip 121 can receive light to form an image.

Illustratively, as shown in fig. 9, the photosensitive assembly 12 may further include a support 123, wherein the filter element 122 is disposed on the support 123, and the support 123 is correspondingly disposed on the second circuit board 44, so as to hold the filter element 122 between the photosensitive chip 121 and the optical lens 11, so that light rays sequentially pass through the optical lens 11 and the filter element 122 and are then received by the photosensitive chip 121 for imaging.

It should be noted that, in the first embodiment of the present invention, as shown in fig. 3 and 10, the circuit board assembly 40 of the periscopic camera module 1 further includes a first extension circuit board 45, wherein the first extension circuit board 45 extends from the module assembly 10 to the light turning assembly 20, and the first extension circuit board 45 is electrically connected to the first circuit board 41, the driving circuit board 43 and the second circuit board 44 at the same time to form the circuit board assembly 40 in a split conduction manner, so that each part of the circuit board assembly 40 can be provided with electric energy through one connector. In other words, the first extension wiring board 45 is electrically extendable from the second wiring board 44 to the first wiring board 41, and the drive wiring board 43 located between the first wiring board 41 and the second wiring board 44 is electrically connectable to the first extension wiring board 45 to form the split-conduction wiring board assembly 40.

Preferably, as shown in fig. 10, the first extension circuit board 45 is provided with a processing chip 451, so as to control the driving/actuating components in the module assembly 10, the light turning assembly 20 and the light quantity adjusting assembly 30 through the processing chip 451, thereby achieving the functions of focusing, anti-shake and adjusting the amount of light entering the lens.

It should be noted that the first extension wiring board 45 may be electrically connected to the first wiring board 41 and the driving wiring board 43 by means of pin soldering, respectively; meanwhile, the light amount adjustment member 30 may be indirectly electrically connected to the first extension wiring board 45 through the first wiring board 41. In particular, as shown in fig. 3, the first circuit board 41 and the driving circuit board 43 are respectively located at the bottom of the periscopic imaging module 1, and the first extension circuit board 45 is preferably located at the side of the periscopic imaging module 1, so that the first diffraction circuit board 45 can intersect at the first circuit board 41 and the driving circuit board 43 at the same time, so as to directly electrically connect the first circuit board 41 and the driving circuit board 43 to the first diffraction circuit board 45 by means of pin soldering, respectively. Of course, in other examples of the present invention, the first extension wiring board 45 may be disposed at the bottom of the periscopic imaging module 1, so that the first wiring board 41 and the driving wiring board 43 are electrically stacked on the first extension wiring board 45, respectively.

Further, as shown in fig. 3 and 5, the second circuit board 44 in the circuit board assembly 40 of the present invention is usually located at the rear side of the module main body 10 of the periscopic camera module 1, so that the included angle between the second circuit board 44 and the first extension circuit board 45 is a right angle, and therefore, in order to electrically connect the second circuit board 44 and the first extension circuit board 45, the circuit board assembly 40 of the present invention may further include a first flexible board 46, wherein the first flexible board 46 is arranged between the first extension circuit board 45 and the second circuit board 44 in a bent manner, so as to electrically connect the first extension circuit board 45 and the second circuit board 44 through the first flexible board 46. It is to be understood that the first flexible board 46 may be implemented as a flexible board FPC that can be bent, so that the first flexible board 46 can reduce the size of the periscopic camera module 1 while stably and electrically connecting the first extension wiring board 45 and the second wiring board 44 together.

Further, as shown in fig. 3 and 10, the circuit board assembly 40 of the periscopic camera module 1 may further include a connector 47, wherein the connector 47 is electrically connected to the second circuit board 44 for electrically connecting to a main board of an electronic device such as a mobile phone, so as to provide power and/or control signals for the circuit board assembly 40 through the main board of the electronic device. It is noted that the connector 47 is preferably electrically connected to the second circuit board 44 through a flexible connection board 470, so that the position of the connector 47 relative to the second circuit board 44 can be adjusted as needed to electrically connect to the main board of the electronic device.

It should be noted that, in an example of the present invention, the periscopic camera module 1 may further include a housing or an external support (not shown), wherein the module assembly 10, the light turning assembly 20, the light quantity adjusting assembly 30 and the circuit board assembly 40 are assembled in the housing or the external support, so that the module assembly 10, the light turning assembly 20, the light quantity adjusting assembly 30 and the circuit board assembly 40 are protected by the housing or the external support, and the module assembly 10, the light turning assembly 20, the light quantity adjusting assembly 30 and the circuit board assembly 40 are prevented from being contaminated.

It should be noted that fig. 11A shows a first variant of the periscopic camera module 1 according to the first embodiment of the present invention, wherein the light quantity adjusting assembly 30 is fastened to the light exit end 202 of the light turning assembly 20, so as to omit the adhesive layer 50, and the light quantity adjusting assembly 30 is directly detachably assembled to the light turning assembly 20, so as to replace the light turning assembly 20 or the light quantity adjusting assembly 30.

Specifically, the light exit end 202 of the light turning assembly 20 is provided with a first engaging structure 231 located on the housing bracket 23, and the frame 33 of the light quantity adjusting assembly 30 is provided with a second engaging structure 232 adapted to the first engaging structure, wherein when the first engaging structure 231 and the second engaging structure 232 are adapted to be engaged together, the frame 33 of the light quantity adjusting assembly 30 is mounted on the housing bracket 23 of the light turning assembly 20, so that the light quantity adjusting assembly 30 is assembled to the light exit end 202 of the light turning assembly 20.

Preferably, as shown in fig. 11A, in the periscopic camera module 1 according to the first modified embodiment of the present invention, the first engaging structure 231 is implemented as a groove provided on the housing bracket 23, and the second engaging structure 232 is implemented as a protrusion provided on the frame 33, so as to realize fixed assembly between the light quantity adjusting assembly 30 and the light turning assembly 20 by inserting the protrusion on the frame 33 into the groove on the housing bracket 23, which not only can reduce the size of the periscopic camera module 1, but also can simplify the disassembly and assembly of the periscopic camera module 1.

In particular, in order to further enhance the connection strength between the first and

second fastening structures

231 and 232, so that the light quantity adjusting assembly 30 is more firmly mounted to the housing bracket 23 of the light turning assembly 20, the adhesive layer 50 of the present invention may also be disposed between the first and

second fastening structures

231 and 232. For example, an adhesive is applied in the first engaging structure 231 (i.e., the groove of the housing bracket 23), and then the first engaging structure 231 and the second engaging structure 232 are engaged, so as to form the adhesive layer 50 between the first engaging structure 231 and the second engaging structure 232 after the adhesive is cured, thereby firmly fixing the light quantity adjusting assembly 30 to the housing bracket 23 of the light turning assembly 20.

It should be noted that, although the first engaging structure 231 and the second engaging structure 232 are sequentially implemented as a groove and a protrusion in the periscopic camera module 1 as shown in fig. 11A to achieve the engaging connection between the light quantity adjusting assembly 30 and the light turning assembly 20, the engaging manner is only an example, and the invention is not limited thereto. For example, as shown in fig. 11B, a second modified embodiment of the periscopic camera module 1 according to the above-described first embodiment of the present invention is illustrated, in which the first snap-in structure 231 of the periscopic camera module 1 is implemented as a protrusion provided on the housing bracket 23, and the second snap-in structure 232 is implemented as a groove provided on the frame 33, so that the fixed assembly between the light quantity adjusting assembly 30 and the light redirecting assembly 20 is also achieved by inserting the protrusion on the housing bracket 23 into the groove on the frame 33.

Specifically, referring to fig. 12 and 13 of the drawings, a periscopic camera module according to a second embodiment of the present invention is illustrated. The periscopic camera module 1 according to the second embodiment of the present invention differs from the above-described first embodiment of the present invention in that: the light quantity adjusting member 30 is directly electrically connected to the first extension wiring board 45 of the wiring board assembly 40 without electrically connecting the light quantity adjusting member 30 indirectly to the first extension wiring board 45 through the first wiring board 41, so that the first wiring board 41 alone supplies the electric power to the light redirecting member 20, contributing to simplification of the circuit design of the first wiring board 41.

Specifically, as shown in fig. 13, the electrical connection element 42 of the circuit board assembly 40 is implemented as the conductive pin 421 electrically connected to the side wall 302 of the light amount adjustment assembly 30, wherein the conductive pin 421 is soldered to the first extension circuit board 45 to electrically connect the light amount adjustment assembly 30 to the first extension circuit board 45 through the conductive pin 421.

Illustratively, as shown in fig. 12 and 13, the electrical connection element 42 includes two conductive pins 421, wherein the conductive pins 421 are disposed at intervals on an outer side wall of the frame 33 of the light quantity adjusting assembly 30, and the conductive pins 421 are electrically connected to the electrical actuator 32 of the light quantity adjusting assembly 30, wherein the conductive pins 421 can be electrically connected to the first extension circuit board 45 of the circuit board assembly 40 by means of a solder ball, so as to provide electrical energy to the electrical actuator 32 of the light quantity adjusting assembly 30 through the first extension circuit board 45, thereby achieving the light quantity adjusting effect of the light quantity adjusting assembly 30. Of course, in other examples of the present invention, the number of the conductive pins 421 may be more than two, and the conductive pins 421 may also be electrically connected and adhered to the first extension wiring board 45 by means of conductive adhesive.

Preferably, as shown in fig. 12, the first extension wiring board 45 of the wiring board assembly 40 is provided with two

notches

452, 453, and the

notches

452, 453 correspond to the conductive pins 421 on the light amount adjustment assembly 30, respectively, so that the conductive pins 421 can be soldered to the first extension wiring board 45 at the

notches

452, 453 of the first extension wiring board 45, respectively. It can be understood that, just because the first extension circuit board 45 is provided with the

notches

452 and 453, the conductive pins 421 can be electrically connected to the first extension circuit board 45 at the

notches

452 and 453 of the first extension circuit board 45 by means of a solder ball, so as to avoid increasing the size of the periscopic camera module 1 and facilitate soldering.

More preferably, as shown in fig. 12, one of the conductive pins 421 is disposed on an upper portion of an outer side wall of the frame 33 to form an upper pin; another conductive lead 422 is disposed at a lower portion of an outer sidewall of the frame 33 to form a lower lead. The first extension wiring board 45 of the wiring board assembly 40 is provided with an upper notch 452 and a lower notch 453, and the upper notch 452 and the lower notch 453 of the first extension wiring board 45 correspond to the upper pin and the lower pin of the frame 33, respectively, so that the conductive pins 421 are soldered to the first extension wiring board 45, respectively, thereby electrically connecting the light amount adjusting assembly 30 to the first extension wiring board 45 integrally for obtaining electric power from the first extension wiring board 45 to adjust the amount of incoming light. It can be understood that the upper notch 452 and the lower notch 453 are disposed on the first extension circuit board 45 of the present invention, which is not only beneficial to soldering the conductive pins 421, but also beneficial to reducing the installation space of the periscopic camera module 1.

Fig. 14 and 15 show a modified embodiment of the periscopic camera module 1 according to the second embodiment of the present invention, in which the conductive pins 421 extend from the side walls 302 of the light quantity adjusting assembly 30 to the first extension circuit board 45 side by side and outwards, so that the conductive pins 421 are soldered to the first extension circuit board 45.

Illustratively, as shown in fig. 15, the conductive pins 421 are electrically connected to the light quantity adjusting assembly 30, wherein the conductive pins 421 extend side by side to protrude from the side wall 302 of the light quantity adjusting assembly 30, so that the conductive pins 421 are located on the bottom side of the first extended circuit board 45, that is, the conductive pins 421 and the first extended circuit board 45 are located on the same side of the light quantity adjusting assembly 30, which facilitates soldering the conductive pins 421 and the first extended circuit board 45 together.

It should be noted that, since the height of the second circuit board 44 of the circuit board assembly 40 of the periscopic camera module 1 of the present invention is substantially equal to the height of the periscopic camera module 1, and the connecting soft board 470 for connecting the connector 47 and the second circuit board 44 does not protrude out of the side of the periscopic camera module 1, the bending angle of the connecting soft board 470 for connecting the connector 47 and the second circuit board 44 is too large, which easily causes the circuit components of the connecting soft board 470 to be damaged.

Therefore, in order to solve the above problem, fig. 16 to 18 show a second modified embodiment of the periscopic camera module according to the above second embodiment of the present invention. The periscopic camera module 1 according to the second variant embodiment of the present invention differs from the above-described second embodiment of the present invention in that: the circuit board assembly 40 further includes a second extension circuit board 48 and a second flexible board 49, wherein the second flexible board 49 electrically and flexibly connects the second extension circuit board 48 to the second circuit board 44, and the first flexible board 46 electrically and flexibly connects the first extension circuit board 48 to the second extension circuit board 48. Specifically, the second extension wiring board 48 is stacked on the second wiring board 44, and the height of the second extension wiring board 48 is smaller than the height of the second wiring board 44, wherein the connector 47 is electrically connected to the second extension wiring board 48 in the height direction of the second extension wiring board 48, so that the wiring board assembly 40 is electrically connected to the main board of the electronic device through the connector 47.

It should be noted that, just as the height of the second extension circuit board 48 is smaller than the height of the second circuit board 44 (as shown in fig. 18), so as to form a height difference between the second extension circuit board 48 and the second circuit board 44, the connection flexible board 470 connected to the connector 47 still has enough space to be bent without protruding out of the side surface of the periscopic camera module 1, so as to reduce the bending angle of the connection flexible board 470, and further avoid the connection flexible board 470 from being damaged due to an excessively large bending angle.

Further, as shown in fig. 16 and 17, the periscopic camera module 1 further includes a spacer 60, wherein the spacer 60 is stacked between the second circuit board 44 and the second extension circuit board 48 to reduce the bending angle of the first soft board 46 and the second soft board 49, which helps to prevent the first soft board 46 and the second soft board 49 from being damaged due to too large bending.

Preferably, the gasket 60 is made of a metal material, so that heat of the second circuit board 44 is transferred to the second extension circuit board 48 through the gasket 60, which helps to improve the heat dissipation performance of the periscopic camera module 1.

It should be noted that, in the second modified embodiment of the present invention, as shown in fig. 17, the first extension wiring board 45 and the driving wiring board 43 in the wiring board assembly 40 are integrally soldered and conducted by conductive pins, and the first extension wiring board 45 and the first wiring board 41 are integrally soldered and conducted by conductive pins, wherein the first extension wiring board 45 and the light quantity adjusting assembly 30 are integrally soldered and conducted by the conductive pins 421, which is helpful for reducing the mounting area of the periscopic imaging module 1. It can be understood that the first circuit board 41, the driving circuit board 43, the light quantity adjusting assembly 30 and the first extension circuit board 46 in the circuit board assembly 40 are all connected into a whole by an electrical connection manner of conductive pin soldering, so that unstable performance caused by an overlarge integrated circuit board is avoided. Meanwhile, the first extension circuit board 46 can be electrically connected to the second extension circuit board 48 by the first flexible board 47 in a bendable manner, and the second extension circuit board 48 can be electrically connected to the second circuit board 44 by the second flexible board 49 in a bendable manner, so that the internal space of the periscopic camera module 1 is further utilized, the structure of the periscopic camera module 1 is more compact, and the size of the periscopic camera module 1 is reduced.

Specifically, referring to fig. 19 of the drawings, a periscopic camera module according to a third embodiment of the present invention is illustrated. Compared to the second modified embodiment according to the second embodiment of the present invention, the periscopic camera module 1 according to the third embodiment of the present invention is different in that: the electrical connection element 42 can be implemented as a conductive pin 421 electrically connected to the light quantity adjusting assembly 30, wherein the conductive pin 421 extends from the bottom wall 301 of the light quantity adjusting assembly 30 to the driving circuit board 43 side by side and backward to directly weld the conductive pin 421 to the driving circuit board 43, so as to achieve the electrical connection between the light quantity adjusting assembly 30 and the driving circuit board 43. It is understood that in other examples of the present invention, the conductive pin 421 may also be electrically connected and adhered to the driving circuit board 43 by a conductive adhesive, which is not described in detail herein.

It should be noted that, as shown in fig. 19, since the conductive pin 421 directly extends to the bottom of the module assembly 10, and the driving circuit board 43 is just assembled on the bottom of the module assembly 10, the conductive pin 421 can directly contact the driving circuit board 43 to electrically connect the driving circuit board 43 by soldering, so as to electrically connect the driving circuit board 43 and the light quantity adjusting assembly 30.

According to another aspect of the present invention, a method for manufacturing a periscopic camera module is further provided. Specifically, as shown in fig. 20A, the method for manufacturing the periscopic camera module includes the steps of:

s100: assembling a light quantity adjusting assembly at a light outlet end of a light turning assembly, so that light rays incident from a light inlet end of the light turning assembly are firstly turned by the turning assembly and then emitted from the light outlet end, and then the light quantity passing through the light quantity adjusting assembly is changed by the adjustment of the light quantity adjusting assembly; and

s200: arranging the light quantity adjusting assembly and the light turning assembly in a photosensitive path of a module assembly, wherein the light quantity adjusting assembly is positioned between the light turning assembly and the module assembly and is used for enabling light rays passing through the light quantity adjusting assembly to be received by the module assembly for imaging; and

s300: and electrically connecting a circuit board assembly to the light quantity adjusting assembly to provide electric energy required by the work for the light quantity adjusting assembly.

In an embodiment of the present invention, as shown in fig. 20B, the step S300 of the method for manufacturing a periscopic imaging module further includes the steps of:

s310: electrically connecting a first circuit board to the light turning component to electrically connect the first circuit board to an anti-shake driver of the light turning component;

s320: electrically connecting a second circuit board to the module assembly to electrically connect the second circuit board to a photosensitive chip of a photosensitive assembly of the module assembly;

s330: a first extension circuit board is arranged on the module assembly and the light steering assembly in an extending mode, and the first extension circuit board is electrically connected to the first circuit board and the second circuit board respectively; and

s340: the light quantity adjusting component is electrically connected to the first circuit board or the first extension circuit board through at least one electrical connection element.

In an example of the present invention, as shown in fig. 20B, the step S300 of the method for manufacturing a periscopic imaging module further includes the steps of:

s350: superposing a second extension circuit board on the second circuit board, and electrically connecting the second extension circuit board to the second circuit board through a second flexible board; and

s360: the first extension circuit board is electrically connected to the second extension circuit board or the second circuit board through a first flexible board.

s370: a spacer is stacked between the second wiring board and the second extension wiring board.

According to the above embodiment of the present invention, as shown in fig. 20A, the method for manufacturing a periscopic imaging module further includes:

s400: the light quantity adjusting assembly is adhered or buckled at the light outlet end of the light steering assembly; and

s500: and correspondingly bonding the light quantity adjusting assembly to the module assembly.

It should be noted that, in an example of the present invention, as shown in fig. 20C, in order to accurately assemble the periscopic camera module 1, the manufacturing method of the periscopic camera module may further include the steps of:

s610: pre-positioning the light quantity adjusting member 30 and the module assembly 10 such that the center lines of the light quantity adjusting member 30 and the module assembly 10 are substantially aligned in the optical axis direction of the optical lens 11 of the module assembly 10;

s620: adjusting the position of the light quantity adjusting assembly 30 according to the shooting effect of shooting a target through the photosensitive assembly 12 of the module assembly 10; and

s630: the light quantity adjusting unit 30 is adapted so that the size of the amount of incident light controlled by the light quantity adjusting unit 30 satisfies a predetermined requirement.

As shown in fig. 20C, the method for manufacturing a periscopic camera module may further include:

s640: pre-positioning the light redirecting assembly 20, the light amount adjusting assembly 30, and the module assembly 10 such that the centerlines of the light redirecting assembly 20, the light amount adjusting assembly 30, and the module assembly 10 are substantially aligned; and

s650: and adjusting the position of the light steering component 20 according to the shooting effect of shooting the target through the photosensitive component 12.

For example, when assembling the periscopic camera module 1, the light quantity adjusting assembly 30 and the module assembly 10 may be pre-positioned by a shooting tool such as a jig or a suction cup, so that the center lines of the light quantity adjusting assembly 30 and the module assembly 10 are substantially aligned (or approximately aligned) along the optical axis direction of the optical lens 11 of the module assembly 10, so that the photosensitive assembly 12 can shoot the image of the target through the light quantity adjusting assembly 30; adjusting the position of the light quantity adjusting assembly 30 according to the image quality (such as the SFR value of the image) so as to improve the degree of alignment between the light quantity adjusting assembly 30 and the optical axis of the optical lens 11; thereafter, the control effect of the light quantity adjusting assembly 30 is adjusted to test whether the SFR value of the image reaches the expected SFR value during the adjustment of the light quantity adjusting assembly 30 in the light quantity adjusting range, so as to facilitate the replacement of the light quantity adjusting assembly 30 which fails the test before the light turning assembly 20 is assembled.

Then, in the case where the light quantity adjusting member 30 satisfies the requirement, the light redirecting member 20, the light quantity adjusting member 30, and the module assembly 10 may be further pre-positioned such that the center lines of the light redirecting member 20, the light quantity adjusting member 30, and the module assembly 10 are substantially aligned; and adjusting the position of the light turning component 20 according to the quality of the image (i.e. the shooting effect) shot by the photosensitive component 12, so as to further improve the degree of alignment between the light turning component 20 and the optical axis of the optical lens 11; finally, after the adjustment and adjustment, the light redirecting assembly 20, the light quantity adjusting assembly 30 and the module assembly 10 are fixed in position to complete the production of the periscopic camera module 1.

Of course, in other examples of the present invention, the relative position of the light steering assembly 20 may also be adjusted according to the SFR value of the captured image, so as to test and adjust the anti-shake effect of the periscopic camera module 1; the relative position of the optical lens 11 of the module assembly 10 can be adjusted according to the SFR value of the captured image, so as to test and adjust the auto-focusing effect or anti-shake effect of the periscopic camera module 1.

It should be noted that, although the steps of the method for manufacturing the periscopic camera module according to the present invention are sequentially depicted in the drawings, the order of the steps of the method for manufacturing the periscopic camera module according to the present invention is not limited thereto, and may be implemented in other orders. In other examples of the present invention, the method for manufacturing the periscopic camera module may include only a part of the steps shown in fig. 20A and 20B, or may include other steps besides the steps shown in fig. 20A and 20B, as long as one of the periscopic camera modules 1 can be manufactured, and the present invention is not described herein again.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. A periscopic module of making a video recording, its characterized in that includes:

a module assembly, wherein the module assembly has a photosensitive path;

a light turning component, wherein the light turning component is correspondingly disposed on the photosensitive path of the module component, and the light turning component has a light inlet end and a light outlet end facing the module component, wherein the light turning component is used for turning the light entering from the light inlet end to exit from the light outlet end, and propagating along the photosensitive path to be received by the module component for imaging;

a circuit board assembly, wherein the circuit board assembly is configured to be electrically connected to the light quantity adjusting assembly for providing the light quantity adjusting assembly with electric power required for operation, wherein the circuit board assembly comprises a first circuit board electrically connected to the light turning assembly, a second circuit board electrically connected to the module assembly, a first extension circuit board, at least one electrical connecting element, and a driving circuit board, wherein the first extension circuit board extends from the module assembly to the light turning assembly, and the first extension circuit board is electrically connected to the first circuit board, the driving circuit board, and the second circuit board at the same time to form the circuit board assembly in a split conduction type, and the light quantity adjusting assembly is electrically connected to the first extension circuit board directly or indirectly through the electrical connecting element, the driving circuit board is electrically connected to the bottom side of the module assembly, and the electric connection element electrically connects the driving circuit board and the light quantity adjusting assembly and is used for providing electric energy required by the operation of the light quantity adjusting assembly through the driving circuit board.

2. The periscopic camera module of claim 1, wherein said electrical connection element electrically connects said first extension circuit board with said light quantity adjusting assembly for providing electrical energy required for operation of said light quantity adjusting assembly through said first extension circuit board.

3. The periscopic camera module of claim 2, wherein said electrical connection element is a conductive pin, wherein said conductive pin is electrically connected to said light quantity adjusting assembly, so as to electrically connect said light quantity adjusting assembly to said first extension board through said conductive pin.

4. The periscopic camera module of claim 3, wherein said conductive pins extend outwardly from side-by-side walls of said light intensity adjustment assembly to said first extension wiring board, and said conductive pins are soldered to said first extension wiring board.

5. The periscopic camera module of claim 4, wherein the conductive pins are disposed at intervals and electrically connected to the side wall of the light quantity adjusting assembly, wherein the first extension circuit board is provided with two notches, and the notches on the first extension circuit board are in one-to-one correspondence with the conductive pins disposed on the light quantity adjusting assembly, respectively, so as to solder the conductive pins to the first extension circuit board.

6. The periscopic camera module of claim 1, wherein said electrical connection element electrically connects said first circuit board and said light quantity adjusting assembly for providing electrical energy required for operation of said light quantity adjusting assembly through said first circuit board.

7. The periscopic camera module of claim 6, wherein said electrical connection element is a conductive pin, wherein said conductive pin is electrically connected to said light quantity adjusting assembly, and said conductive pin extends from a bottom wall of said light quantity adjusting assembly side by side forward to said first circuit board, and said conductive pin is soldered to said first circuit board.

8. The periscopic camera module of claim 7, wherein said electrical connection element comprises a lead, wherein one end of said lead is electrically connected to said first circuit board, and the other end of said lead is electrically connected to said light quantity adjustment assembly.

9. The periscopic camera module of claim 8, wherein said electrical connection element is a conductive pin, wherein said conductive pin is electrically connected to said light quantity adjusting assembly, and said conductive pin extends from a bottom wall of said light quantity adjusting assembly side by side and backward to said driving circuit board, and said conductive pin is soldered to said driving circuit board.

10. The periscopic camera module of any one of claims 1-9, wherein said circuit board assembly further comprises a first flexible board, wherein said first flexible board is electrically connected to said second circuit board and said first extension circuit board by bending.

11. The periscopic camera module of any one of claims 1-9, wherein said circuit board assembly further comprises a first flexible board, a second extension circuit board and a second flexible board, wherein said second circuit board is disposed on the rear side of said module assembly and said second extension circuit board is stacked on said second circuit board, wherein said first flexible board is electrically connected to said first extension circuit board and said second extension circuit board in a bent manner, wherein said second flexible board is electrically connected to said second circuit board and said second extension circuit board in a bent manner.

12. The periscopic camera module of claim 11, further comprising a spacer, wherein said spacer is stacked between said second circuit board and said second extension circuit board, wherein a height of said second extension circuit board is less than a height of said second circuit board.

13. The periscopic camera module of claim 12, wherein said circuit board assembly further comprises a connector and a flexible connection board, wherein said flexible connection board electrically connects said connector to said second extension circuit board in a height direction of said second extension circuit board, and said connector is used for electrically connecting a main board of an electronic device.

14. The periscopic camera module of any one of claims 1-9, further comprising an adhesive layer to respectively adhere the light redirecting assembly and the module assembly to the light quantity adjusting assembly via the adhesive layer.

15. The periscopic camera module of any one of claims 1-9, wherein said light quantity adjusting module is fastened to said light exit end of said light turning module.

16. A manufacturing method of a periscopic camera module is characterized by comprising the following steps:

assembling a light quantity adjusting assembly at a light outlet end of a light turning assembly, so that light rays incident from a light inlet end of the light turning assembly are firstly turned by the light turning assembly and then emitted from the light outlet end, and then the light quantity passing through the light quantity adjusting assembly is changed by the adjustment of the light quantity adjusting assembly;

electrically connecting a circuit board assembly to the light quantity adjusting assembly for providing the light turning assembly, the module assembly and the light quantity adjusting assembly with electric energy required for operation, comprising the steps of:

electrically connecting a first circuit board to the light turning component to electrically connect the first circuit board to an anti-shake driver of the light turning component;

electrically connecting the light quantity adjusting assembly to the first circuit board or the first extension circuit board by at least one electrical connection element;

and correspondingly positioning the first circuit board and the driving circuit board at the bottom of the periscopic camera module respectively, and positioning the first extension circuit board at the side part of the periscopic camera module, so that the first extension circuit board is intersected with the first circuit board and the driving circuit board simultaneously.

17. The method of manufacturing a periscopic camera module of claim 16, wherein said step of electrically connecting a circuit board assembly to said light level adjustment assembly for providing electrical power for operation of said light redirecting assembly, said module assembly and said light level adjustment assembly further comprises the steps of:

18. The method for manufacturing a periscopic camera module according to any one of claims 16 to 17, further comprising the steps of:

the light quantity adjusting assembly is adhered or buckled at the light outlet end of the light steering assembly; and

19. The method for manufacturing a periscopic camera module set according to claim 16, further comprising the steps of:

and debugging the light quantity adjusting component to enable the light quantity controlled by the light quantity adjusting component to meet the preset requirement.

20. The method for manufacturing a periscopic camera module set according to claim 19, further comprising the steps of: