CN112976382B - Method for cutting brittle and hard material by diamond wire - Google Patents
Method for cutting brittle and hard material by diamond wire Download PDFInfo
- Publication number
- CN112976382B CN112976382B CN202110240333.1A CN202110240333A CN112976382B CN 112976382 B CN112976382 B CN 112976382B CN 202110240333 A CN202110240333 A CN 202110240333A CN 112976382 B CN112976382 B CN 112976382B
- Authority
- CN
- China
- Prior art keywords
- diamond wire
- cutting
- brittle
- hard material
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 123
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 123
- 238000005520 cutting process Methods 0.000 title claims abstract description 109
- 239000000463 material Substances 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 30
- 230000003746 surface roughness Effects 0.000 claims abstract description 8
- 241001391944 Commicarpus scandens Species 0.000 abstract description 6
- 238000010008 shearing Methods 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229910021422 solar-grade silicon Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention provides a method for cutting a brittle and hard material by using a diamond wire, wherein the cutting process comprises 4 steps of S1, S2, S3 and S4, wherein in the step of S1, the diamond wire is fed downwards for cutting, and the longitudinal movement position distance of a rotating wheel is 5-30% L; s2, feeding and cutting the diamond wire downwards, wherein the longitudinal moving position distance of the rotating wheel is 101-150% L; s3, the diamond wire retreats upwards, and the distance between the diamond wire retreated to the longitudinal moving position of the rotating wheel is 100-130% L; and step S4, the diamond wire is fed downwards to cut the brittle and hard material completely. In the cutting process, due to the addition of the S3 rollback step, the cutting efficiency of the diamond wire is high, the diamond wire is not easy to break, and the surface roughness can reach Ra0.8-3.2.
Description
Technical Field
The invention relates to the field of cutting of brittle and hard materials, in particular to a method for cutting a brittle and hard material by using diamond wires.
Background
The single and polycrystalline silicon rods for diamond wire cutting have become the mainstream of solar grade silicon wafer cutting, and various special machine tools and modification machine tools are put into use in many times. Electroplating diamond wires become main consumable items for silicon wafer cutting, the price of the electroplating diamond wires is nearly one hundred times that of common steel wires, and in order to reduce the consumable cost, various measures are taken by each silicon wafer processing enterprise to save the consumption of the diamond wires.
Therefore, cutting of brittle and hard materials such as silicon rods and gems with diamond wires is currently the conventional method in the field. However, the cutting efficiency of the existing diamond wire cutting process method is low, and particularly if the long wire diamond wire is repeatedly cut, the roughness of a cutting surface is high; while the diamond wire is easily broken if unidirectional cutting is adopted.
Disclosure of Invention
Therefore, it is required to provide a cutting method which can improve cutting efficiency, reduce surface roughness of the diamond wire, and is not easily broken. In order to achieve the above object, the inventor provides the cutting method, which is to longitudinally cut a brittle and hard material represented by a silicon crystal bar by using a diamond wire, wherein the brittle and hard material has a maximum longitudinal length of L and a maximum transverse width of M; the cutting is carried out by driving the diamond wire to move towards the brittle and hard material by the lifting mechanism, the diamond wire forms a wire arc between two same horizontal rotating wheels of the lifting mechanism, and the wire arc carries out cutting wire movement to cut the brittle and hard material; the distance T between the shafts of the two rotating wheels is not less than T1.2M and not more than 10M; the cutting process comprises S1, S2, S3, S4,4 steps; in the step S1, the diamond wire is fed downwards for cutting, and the distance of the longitudinal moving position of the rotating wheel is 5-30% L; s2, feeding and cutting the diamond wire downwards, wherein the longitudinal moving position distance of the rotating wheel is 101-150% L; s3, the diamond wire retreats upwards, and the distance between the diamond wire retreated to the longitudinal moving position of the rotating wheel is 100-130% L; and step S4, the diamond wire is fed downwards to cut the brittle and hard material completely.
The inventors found that, during the cutting of brittle and hard materials by a diamond wire cutting machine, breakage of the diamond wire occurs mostly in the latter half of cutting, and the diamond wire is broken due to the accumulated abrasion of the diamond wire in the later period, high cutting temperature and excessive tensile tension. Therefore, the inventors have designed the cutting process in stages, adding the step of backing off S3. In the cutting process, an S3 retraction step is added, so that the tensile tension of the diamond wire in the S2 step is effectively relieved, the diamond wire is prevented from being broken due to excessive tension, and the tensile radian of the diamond wire is also reduced (in the S3 step, the diamond wire cutting arc is tightened because brittle and hard materials are not cut in the retraction process). This increases the shearing force of the diamond wire on the brittle and hard material under the same moment, and the final effect is that the tensile tension of the diamond wire becomes smaller and the shearing force becomes larger at step S4. Therefore, the step S4 can provide a large shearing force to the brittle and hard material to cut the brittle and hard material even in the case of low-speed feeding; so that the cutting in the step S4 can be carried out in a low-speed mode (the diamond wire is easy to break because the diamond wire is worn in the previous step S1\ S2; and the low speed can also reduce the risk of breaking the diamond wire). Meanwhile, in the steps S3 and S4, due to the fact that the friction force is reduced, the situation that the molecular arrangement state of the diamond wire is unstable and easy to break due to the fact that the temperature of the diamond wire continues to rise can be avoided, and the risk of breakage is further reduced.
The cutting line movement can be unidirectional movement or reciprocating movement.
Preferably, the cutting linear velocity of the diamond wire is 10-100 m/s.
Preferably, the cutting linear velocity of the diamond wire is 10-50 m/s.
Preferably, in the step S1, the feeding speed of the diamond wire is 5 to 500 m/min.
Preferably, in the step S2, the feeding speed of the diamond wire is 1 to 250 m/min.
Preferably, in the step S3, the upward withdrawing speed of the diamond wire is 10 to 3000 mm/min. Preferably, in the step S4, the feeding speed of the diamond wire is 0.1 to 50 mm/min.
Preferably, the diameter of the diamond wire is 0.1mm to 5 mm.
Preferably, the tensile tension of the diamond wire is 10% -90% of the breaking force of the diamond wire.
Preferably, the surface roughness of the cut surface of the brittle and hard material is Ra0.8-3.2.
Different from the prior art, the technical scheme at least comprises the following beneficial effects: the cutting process is designed in a segmented manner, and a retraction step S3 is added. In the cutting process, due to the addition of the S3 retraction step, the tensile tension of the diamond wire in the S2 step is effectively relieved, the diamond wire is prevented from being broken due to excessive tension, and the tensile radian of the diamond wire is also reduced. This increases the shearing force of the diamond wire on the brittle and hard material under the same moment, and the final effect is that the tensile tension of the diamond wire becomes smaller and the shearing force becomes larger at step S4. Therefore, the step S4 can provide a large shearing force to the brittle and hard material to cut the brittle and hard material even in the case of low-speed feeding; so that the cutting in the step S4 can be carried out in a low-speed mode (the diamond wire is easy to break because the diamond wire is worn in the previous step S1\ S2; and the low speed can also reduce the risk of breaking the diamond wire). Meanwhile, in the steps S3 and S4, due to the fact that the friction force is reduced, the situation that the molecular arrangement state of the diamond wire is unstable and easy to break due to the fact that the temperature of the diamond wire continues to rise can be avoided, and the risk of breakage is further reduced. The diamond wire has high cutting efficiency and is not easy to break, and the surface roughness can reach Ra0.8-3.2.
Drawings
Fig. 1 is a schematic cutting diagram of step S1, wherein a vertical downward arrow indicates a downward cutting direction;
fig. 2 is a schematic cutting diagram of step S2, wherein a vertical downward arrow indicates a downward cutting direction;
fig. 3 is a schematic diagram of the retraction of step S3, wherein a vertical upward arrow indicates an upward retraction direction;
fig. 4 is a schematic cutting diagram of step S4, in which a vertical downward arrow indicates a downward cutting direction.
Description of reference numerals:
1. the length of the diamond wire is increased by the length of the diamond wire,
2. a brittle and hard material.
Detailed Description
To explain technical contents, structural features, and objects and effects of the technical solutions in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Example 1
The maximum longitudinal length of the brittle and hard material is L, and the maximum transverse width of the brittle and hard material is M; the cutting is carried out by driving the diamond wire to move towards the brittle and hard material by the lifting mechanism, the diamond wire forms a wire arc between two same horizontal rotating wheels of the lifting mechanism, and the wire arc carries out cutting wire movement to cut the brittle and hard material; the distance T between the shafts of the two rotating wheels is not less than T1.2M and not more than 10M; the cutting process comprises S1, S2, S3, S4,4 steps; in the step S1, the diamond wire is fed downwards for cutting, and the distance of the longitudinal moving position of the rotating wheel is 5-30% L; s2, feeding and cutting the diamond wire downwards, wherein the longitudinal moving position distance of the rotating wheel is 101-150% L; s3, the diamond wire retreats upwards, and the distance between the diamond wire retreated to the longitudinal moving position of the rotating wheel is 100-130% L; and step S4, the diamond wire is fed downwards to cut the brittle and hard material completely.
As shown in fig. 1-4, a cutting machine of diamond wire 1 is used (when the lifting mechanism drives the diamond wire to move towards the brittle and hard material, the diamond wire forms a wire arc between two horizontal rotating wheels of the lifting mechanism, the wire arc performs cutting line movement to cut the brittle and hard material, the brittle and hard material has a square longitudinal section (side length 370mm), the rotating wheels have a diameter of 150 and 500mm (220mm), and the rotating wheel shaft spacing is 900 mm. the cutting process includes the following cutting machine control steps:
s1, feeding and cutting the diamond wire downwards at a cutting line speed of 80m/S and a feeding speed of 100mm/min, wherein the longitudinal moving position distance S1 of the rotating wheel is 5% L;
s2: the diamond wire is fed downwards for cutting, the linear cutting speed is 50m/S, the feeding speed is 50mm/min, and the longitudinal moving position distance S2 of the rotating wheel is 130% L;
s3: the diamond wire returns upwards to the position where the distance S3 from the longitudinal moving position of the rotating wheel is 100% L, wherein the cutting linear speed is 50m/S, and the returning speed is 1000 mm/min;
and S4, feeding the diamond wire downwards for cutting, wherein the linear cutting speed is 50m/S, and the feeding speed is 30mm/min till the brittle and hard material is cut through.
The diameter of the diamond wire is 0.2mm, the tensile tension of the diamond wire is 20-90% of the breaking force of the diamond wire, and in the step S2, the tensile tension reaches the peak value; and finally, the surface roughness of the cut surface of the brittle and hard material is Ra0.8-3.2.
In the cutting process, an S3 retraction step is added, so that the tensile tension of the diamond wire in the S2 step is effectively relieved, the diamond wire is prevented from being broken due to excessive tension, the tensile radian of the diamond wire is also reduced (the diamond wire is tightened in the S3 step), and the shearing force of the diamond wire on the brittle and hard material is increased under the condition of the same moment. The tension of the diamond wire at step S4 was small, and the shear force was large.
Example 2
The method comprises the following steps of (1) using a diamond wire cutting machine (when a lifting mechanism drives a diamond wire to move towards a brittle and hard material, the diamond wire forms a wire arc between two same horizontal rotating wheels of the lifting mechanism, the wire arc carries out cutting wire movement to cut the brittle and hard material, the brittle and hard material is circular in longitudinal section (diameter 400mm), the diameter of the rotating wheels is 150 plus 500mm, and the distance between the rotating wheels is 900 mm. the cutting process comprises the following cutting machine control steps:
the method for longitudinally cutting the brittle and hard material by using the diamond wire cutting machine comprises the following cutting machine control steps: s1, feeding and cutting the diamond wire downwards at a cutting line speed of 100m/S and a feeding speed of 300mm/min, wherein the longitudinal moving position distance S1 of the rotating wheel is 20% L;
s2: the diamond wire is fed downwards for cutting, the cutting wire speed is 100m/S, the feeding speed is 250mm/min, and the longitudinal moving position distance S2 of the rotating wheel is 150% L;
s3: the diamond wire retreats upwards at the cutting wire speed of 100m/S and the retreating speed of 3000mm/min to the position where the distance S3 from the longitudinal moving position of the rotating wheel is 130% L;
and S4, feeding the diamond wire downwards for cutting at a cutting line speed of 100m/S and a feeding speed of 50mm/min until the brittle and hard material is cut through.
The diameter of the diamond wire is 3 mm; the surface roughness of the cut surface of the brittle and hard material is Ra0.8-3.2.
Example 3
The method comprises the following steps of (1) using a diamond wire cutting machine (when a lifting mechanism drives a diamond wire to move towards a brittle and hard material, the diamond wire forms a wire arc between two same horizontal rotating wheels of the lifting mechanism, the wire arc carries out cutting wire movement to cut the brittle and hard material, the brittle and hard material is circular in longitudinal section (diameter 400mm), the diameter of the rotating wheels is 300-500mm, and the distance between the rotating wheels is 1200 mm. the cutting process comprises the following cutting machine control steps:
the method for longitudinally cutting the brittle and hard material by using the diamond wire cutting machine comprises the following cutting machine control steps: s1, feeding and cutting the diamond wire downwards at a cutting line speed of 60m/S and a feeding speed of 500mm/min, wherein the longitudinal moving position distance S1 of the rotating wheel is 30% L;
s2: the diamond wire is fed downwards for cutting, the cutting wire speed is 100m/S, the feeding speed is 150mm/min, and the longitudinal moving position distance S2 of the rotating wheel is 130% L;
s3: the diamond wire returns upwards at the cutting wire speed of 100m/S and the retraction speed of 1000mm/min to a position where the distance S3 from the longitudinal moving position of the rotating wheel is 120% L;
and S4, feeding the diamond wire downwards for cutting, wherein the linear cutting speed is 50m/S, and the feeding speed is 20mm/min till the brittle and hard material is cut through.
The diameter of the diamond wire is 5 mm; the surface roughness of the cut surface of the brittle and hard material is Ra0.8-3.2.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrases "comprising … …" or "comprising … …" does not exclude the presence of additional elements in a process, method, article, or terminal that comprises the element. Further, herein, "greater than," "less than," "more than," and the like are understood to exclude the present numbers; the terms "above", "below", "within" and the like are to be understood as including the number.
It should be noted that, although the above embodiments have been described herein, the invention is not limited thereto. Therefore, based on the innovative concepts of the present invention, the technical solutions of the present invention can be directly or indirectly applied to other related technical fields by making changes and modifications to the embodiments described herein, or by using equivalent structures or equivalent processes performed in the content of the present specification and the attached drawings, which are included in the scope of the present invention.
Claims (10)
1. The cutting method of the diamond wire for the brittle and hard material is characterized in that the diamond wire is adopted to longitudinally cut the brittle and hard material, the maximum longitudinal length of the brittle and hard material is L, and the maximum transverse width of the brittle and hard material is M; the cutting is carried out by driving the diamond wire to move towards the brittle and hard material by the lifting mechanism, the diamond wire forms a wire arc between two same horizontal rotating wheels of the lifting mechanism, and the wire arc carries out cutting wire movement to cut the brittle and hard material; the distance T between the shafts of the two rotating wheels is more than or equal to 1.2M and less than or equal to 10M; the cutting method comprises S1, S2, S3, S4,4 steps; in the step S1, the diamond wire is fed downwards for cutting, and the distance of the longitudinal moving position of the rotating wheel is 5-30% L; s2, feeding and cutting the diamond wire downwards, wherein the longitudinal moving position distance of the rotating wheel is 101-150% L; s3, the diamond wire retreats upwards, and the distance between the diamond wire retreated to the longitudinal moving position of the rotating wheel is 100-130% L; and step S4, the diamond wire is fed downwards to cut the brittle and hard material completely.
2. The cutting method according to claim 1, wherein the linear cutting speed of the diamond wire is 10 to 100 m/s.
3. The cutting method according to claim 2, wherein the linear cutting speed of the diamond wire is 10 to 50 m/s.
4. The cutting method as set forth in claim 1, wherein the feeding speed of the diamond wire is 5 to 500m/min in the step of S1.
5. The cutting method according to claim 1, wherein in the step of S2, the feeding speed of the diamond wire is 1 to 250 m/min.
6. The cutting method as set forth in claim 1, wherein in the step S3, the upward withdrawing speed of the diamond wire is 10-3000 mm/min.
7. The cutting method as set forth in claim 1, wherein the feeding speed of the diamond wire is 0.1-50mm/min in the step of S4.
8. The cutting method according to claim 1, wherein the diameter of the diamond wire is 0.1mm to 5 mm.
9. The cutting method according to claim 1, wherein the diamond wire has a tensile tension of 10 to 90% of its breaking force.
10. The cutting method according to claim 1, wherein the surface roughness Ra of the cut surface of the brittle and hard material is 0.8 to 3.2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110240333.1A CN112976382B (en) | 2021-03-04 | 2021-03-04 | Method for cutting brittle and hard material by diamond wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110240333.1A CN112976382B (en) | 2021-03-04 | 2021-03-04 | Method for cutting brittle and hard material by diamond wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112976382A CN112976382A (en) | 2021-06-18 |
| CN112976382B true CN112976382B (en) | 2022-04-01 |
Family
ID=76352696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110240333.1A Active CN112976382B (en) | 2021-03-04 | 2021-03-04 | Method for cutting brittle and hard material by diamond wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112976382B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103302754A (en) * | 2013-06-19 | 2013-09-18 | 中国有色桂林矿产地质研究院有限公司 | Diamond fretsaw cutting method and device |
| CN103817811A (en) * | 2014-03-21 | 2014-05-28 | 成都青洋电子材料有限公司 | Multi-wire cutting method for silicon rod |
| CN103998182A (en) * | 2011-12-22 | 2014-08-20 | 信越半导体株式会社 | Method for cutting work piece |
| TW201829144A (en) * | 2016-12-05 | 2018-08-16 | 上海新昇半導體科技有限公司 | Wire cutting apparatus for a crystal bar and a wire cutting method thereof |
| CN208601733U (en) * | 2018-07-05 | 2019-03-15 | 郑州元素工具技术有限公司 | Three train ring wire saw cutter devices |
| CN111923261A (en) * | 2020-07-17 | 2020-11-13 | 苏州赛万玉山智能科技有限公司 | Control method and control system for cutting crystal bar by diamond wire |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4998241B2 (en) * | 2007-12-11 | 2012-08-15 | 信越半導体株式会社 | Method of cutting workpiece by wire saw and wire saw |
-
2021
- 2021-03-04 CN CN202110240333.1A patent/CN112976382B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103998182A (en) * | 2011-12-22 | 2014-08-20 | 信越半导体株式会社 | Method for cutting work piece |
| CN103302754A (en) * | 2013-06-19 | 2013-09-18 | 中国有色桂林矿产地质研究院有限公司 | Diamond fretsaw cutting method and device |
| CN103817811A (en) * | 2014-03-21 | 2014-05-28 | 成都青洋电子材料有限公司 | Multi-wire cutting method for silicon rod |
| TW201829144A (en) * | 2016-12-05 | 2018-08-16 | 上海新昇半導體科技有限公司 | Wire cutting apparatus for a crystal bar and a wire cutting method thereof |
| CN208601733U (en) * | 2018-07-05 | 2019-03-15 | 郑州元素工具技术有限公司 | Three train ring wire saw cutter devices |
| CN111923261A (en) * | 2020-07-17 | 2020-11-13 | 苏州赛万玉山智能科技有限公司 | Control method and control system for cutting crystal bar by diamond wire |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112976382A (en) | 2021-06-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Wu | Wire sawing technology: A state-of-the-art review | |
| CN107052452B (en) | It is cut into the method for many especially slices of uniform thickness simultaneously by workpiece | |
| CN112976382B (en) | Method for cutting brittle and hard material by diamond wire | |
| CN104511975A (en) | Method for simultaneously cutting a multiplicity of wafers from a workpiece | |
| CN104002389A (en) | Marking wheel, retainer unit, marking apparatus and marking wheel manufacturing method | |
| CN110605403B (en) | Method for preparing gradient nano-structure metal material by ultra-precision machining technology | |
| CN104476686B (en) | Method for cutting solar-grade silicon wafers through ultra-high-density diamond wires | |
| CN1035971A (en) | Low stress impact shearing method | |
| WO2009153877A1 (en) | Fret bar for ingot slicing, ingot to which fret bar is stuck, and ingot cutting method using fret bar | |
| WO2019142494A1 (en) | Workpiece cutting method and wire saw | |
| US9427888B2 (en) | Method for resuming a wire sawing process of a workpiece after an unplanned interruption | |
| CN102626959A (en) | Equal-line-loss computation method for multi-line cutting machine | |
| CN104589522B (en) | A kind of multi-line cutting method and a kind of multi-line cutting machine | |
| CN102451843A (en) | Metal plate strip processing method | |
| Kumar et al. | Drilling of AISI 304 stainless steel under liquid nitrogen cooling: A comparison with flood cooling | |
| Yan et al. | Surface generation mechanism of ceramic matrix composite in ultrasonic assisted wire sawing | |
| TWI377102B (en) | Wire cut electrical discharge machine | |
| CN105773695B (en) | A kind of multistation crystal bar material list wire cutting machine | |
| CN102152418A (en) | Multi-axis cutting machine | |
| CN102264515A (en) | Workpiece for frame gang saw, method for cutting the workpiece, and product cut by the method | |
| CN112705793B (en) | Method for multi-wire cutting of samarium cobalt magnet by using diamond wire | |
| CN214601056U (en) | Device for conveying and transferring high-temperature deformed steel bar to cooling bed in steel rolling production | |
| CN204019763U (en) | Line cutting machine guide wheel | |
| CN1047332C (en) | Device for producing prestressed concrete reinforcing steel | |
| CN202147322U (en) | Wire distribution structure of multi-wire cutter for silicon chips |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240712 Address after: No. 1588 Lingmei South Street, Hushi Town, Xiuyu District, Putian City, Fujian Province, 351100 Patentee after: Fujian Tianshiyuan Intelligent Equipment Co.,Ltd. Country or region after: China Address before: No.6 Nanxing Road, sugarcane street, Minhou County, Fuzhou City, Fujian Province, 350100 Patentee before: FUZHOU TIANRUI SCROLL SAW TECHNOLOGY Co.,Ltd. Country or region before: China |