CN112881896A - Conductive assembly and testing device - Google Patents
Conductive assembly and testing device Download PDFInfo
- Publication number
- CN112881896A CN112881896A CN202110169573.7A CN202110169573A CN112881896A CN 112881896 A CN112881896 A CN 112881896A CN 202110169573 A CN202110169573 A CN 202110169573A CN 112881896 A CN112881896 A CN 112881896A
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- conductive
- testing
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- circuit board
- columns
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- 238000012360 testing method Methods 0.000 title claims abstract description 110
- 238000009413 insulation Methods 0.000 claims abstract description 30
- 239000004020 conductor Substances 0.000 claims abstract description 29
- 239000002245 particle Substances 0.000 claims abstract description 7
- 230000001681 protective effect Effects 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims description 5
- 238000012423 maintenance Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000523 sample Substances 0.000 description 13
- 238000009826 distribution Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The invention discloses a conductive assembly and a testing device. The conductive assembly comprises an elastic conductive body and a protective plate, the elastic conductive body comprises an elastic insulating plate body and a plurality of conductive particles distributed in the elastic insulating plate body, the elastic conductive body is not conducted in the vertical direction and the horizontal direction under normal conditions, and when the elastic conductive body is stressed in the vertical direction, the elastic conductive body is conducted in the vertical direction of a stressed part; the protection shield is arranged on the elastic conductor and comprises an insulation body and a plurality of conductive columns arranged on the insulation body, the conductive columns penetrate through the insulation body, the lower ends of the conductive columns protrude out of the lower surface of the insulation body to form first protruding columns, and the first protruding columns are used for enabling the elastic conductor to be conducted up and down at a pressed position by a testing device to enable the circuit board for testing and a tested product to be electrically connected. The invention can reduce the manufacturing and maintenance cost and is suitable for testing the chip with higher frequency.
Description
Technical Field
The present invention relates to the field of electronic testing devices, and more particularly, to a conductive assembly and a testing device for testing an integrated circuit and an electronic device.
Background
The development speed of semiconductors is faster and faster, and the integration degree is higher and higher, and along with 5G's development, the frequency of chip is also higher and higher, and is higher and higher to the requirement of chip test technique, and traditional test technique mainly uses the spring probe at present, and the spring probe mainly has several short boards: firstly, the thin and short spring probe is difficult to manufacture and has high cost; the spring probe is provided with a spring component which has an inductive effect on electronic signals and interference on electric signals, and a high-frequency chip cannot be tested; thirdly, the spring probes are required to be arranged in a needle plate, a plurality of micropores are distributed on the needle plate, if the micropores are finished by a machining mode, the processing cost is very high, if the micropores are finished by an injection molding mode, the mold cost is high, the manufacturing period is long, and if batch is not formed, the cost of a single piece is extremely high; and fourthly, the pins of the integrated circuit are more and more dense, the spring probes are extremely fine, the assembly is inconvenient, the cost for installing the probes is high, the follow-up maintenance is inconvenient, the needle plate needs to be made again after the needle plate is damaged, and the maintenance cost is high.
Disclosure of Invention
The invention mainly aims to provide a conductive component and a testing device, aiming at reducing the manufacturing and maintenance cost and being suitable for testing a chip with higher frequency.
In order to achieve the above object, the present invention provides a conductive assembly for electrically connecting a test circuit board and a tested product in a testing device, the conductive assembly includes an elastic conductive body and a protection plate, the elastic conductive body includes an elastic insulating plate and a plurality of conductive particles distributed in the elastic insulating plate, the elastic conductive body is not conducted in the vertical direction and the horizontal direction under normal conditions, and when the elastic conductive body is pressed in the vertical direction, the elastic conductive body is conducted in the vertical direction of the pressed portion; the protection plate is arranged on the elastic conductor and comprises an insulation body and a plurality of conductive columns arranged on the insulation body, the conductive columns penetrate through the insulation body, the lower ends of the conductive columns protrude out of the lower surface of the insulation body to form first convex columns, and the first convex columns are used for enabling the elastic conductor to be conducted up and down at a pressed position by a testing device when the testing device is used for testing so as to electrically connect a circuit board for testing with a tested product.
Preferably, the upper end of the conductive column protrudes out of the upper surface of the insulating body to form a second convex column, and the second convex column is used for being in contact with a test pin of a tested product.
Preferably, the protection plate is a flexible circuit board, the first protruding column is a lower bonding pad formed on the lower surface of the flexible circuit board, and the second protruding column is an upper bonding pad formed on the upper surface of the flexible circuit board and conducted with the corresponding lower bonding pad.
Preferably, the first protruding columns are distributed at positions corresponding to positions of pads for testing on the circuit board for testing, and the second protruding columns are distributed at positions corresponding to positions of testing pins of a tested product.
Preferably, the protection plate is a flexible circuit board.
In order to achieve the above object, the present invention further provides a testing device, which includes a bottom frame, a testing circuit board, a pressure head assembly and a conductive assembly, wherein the bottom frame is provided with a receiving portion for placing a tested product, the testing circuit board is mounted on the bottom frame and located at a lower side of the receiving portion, the conductive assembly is located between the receiving portion and the testing circuit board, the pressure head assembly is used for pressing down the tested product during testing, the conductive assembly includes an elastic conductive body and a protection plate, the elastic conductive body includes an elastic insulation plate body and a plurality of conductive particles distributed in the elastic insulation plate body, the elastic conductive body is not conducted in the vertical direction and the horizontal direction under normal conditions, and when the elastic conductive body is pressed in the vertical direction, the elastic conductive body is conducted in the vertical direction of the pressed portion; the protection plate is arranged on the elastic conductor and comprises an insulation body and a plurality of conductive columns arranged on the insulation body, the conductive columns penetrate through the insulation body, the lower ends of the conductive columns protrude out of the lower surface of the insulation body to form first convex columns, and the first convex columns are used for enabling the elastic conductor to be conducted up and down at a pressed position by a testing device when the testing device is used for testing so as to electrically connect testing pins on a tested product with corresponding pads on a testing circuit board.
Preferably, the upper end of the conductive column protrudes out of the upper surface of the insulating body to form a second convex column, and the second convex column is used for being in contact with a test pin of a tested product.
Preferably, the protection plate is a flexible circuit board, the first protruding column is a lower bonding pad formed on the lower surface of the flexible circuit board, and the second protruding column is an upper bonding pad formed on the upper surface of the flexible circuit board and conducted with the corresponding lower bonding pad.
Preferably, the first protruding columns are distributed at positions corresponding to positions of pads for testing on the circuit board for testing, and the second protruding columns are distributed at positions corresponding to positions of testing pins of a tested product.
Preferably, the protection plate is a flexible circuit board.
In the conductive assembly and the testing device, the conductive assembly adopts a combination mode of the elastic conductor and the protection plate, and compared with the traditional spring probe, a needle plate distributed with micropores does not need to be manufactured, so that the installation of the spring probe is omitted, and the manufacturing cost and the maintenance cost are greatly reduced; the electric signal interference generated by the inductance effect of a spring component on an electronic signal in the traditional spring probe is avoided, and meanwhile, the electric conduction part can be extremely short and can be used for testing a high-frequency integrated circuit; the protection shield can carry out fine protection to elastic conductor, avoids being surveyed the test pin on the product and directly pushes down elastic conductor, improves whole conductive component's life to when elastic conductor or protection shield damage, only need carry out corresponding change, maintain simply and with low costs.
Drawings
Fig. 1 is a schematic structural diagram of a conductive assembly according to a preferred embodiment of the present invention.
Fig. 2 is an exploded view of the conductive assembly shown in fig. 1.
Fig. 3 is an exploded view of the conductive assembly of fig. 2, viewed from the back.
FIG. 4 is a schematic structural diagram of a testing apparatus according to a preferred embodiment of the present invention, in which a product under test is also shown.
Fig. 5 is a partially exploded view of the testing device shown in fig. 4.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the detailed description and specific examples, while indicating the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
As shown in fig. 1 to 3, a preferred embodiment of a conductive assembly according to the present invention is used for electrically connecting a circuit board for testing and a product to be tested in a testing device, in this embodiment, the conductive assembly 10 includes an elastic conductor 11 and a protection plate 12, the elastic conductor 11 includes an elastic insulating plate and a plurality of conductive particles distributed in the elastic insulating plate, the elastic conductor 11 is not conducted in the up-down direction and the left-right direction under normal conditions, and when the elastic conductor 11 is pressed in the up-down direction, the elastic conductor is conducted in the up-down direction of the pressed portion; the protection plate 12 is disposed on the elastic conductor 11, the protection plate 12 includes an insulation body 121 and a plurality of conductive pillars 122 disposed on the insulation body 121, the conductive pillars 122 penetrate through the insulation body 121, the lower end of the conductive pillars 122 protrudes out of the lower surface of the insulation body 121 to form a first protruding pillar 1221, and the first protruding pillar 1221 is used for the testing device to press down the elastic conductor 11 to make the elastic conductor 11 be conducted up and down at a pressed position during testing, so as to electrically connect the circuit board for testing and the tested product.
In this embodiment, the upper end of the conductive pillar 122 protrudes out of the upper surface of the insulating body 121 to form a second pillar 1222, and the second pillar 1222 is used for contacting a test pin of a product under test.
In this embodiment, the protection board 12 is a Flexible Printed Circuit (FPC), the first protruding column 1221 is a lower pad formed on a lower surface of the FPC, and the second protruding column 1222 is an upper pad formed on an upper surface of the FPC and electrically connected to the corresponding lower pad.
The distribution positions of the first posts 1221 correspond to positions of pads for testing on a circuit board for testing, the positions of the first posts 1221 in the figure are only examples, the distribution positions of the first posts 1221 can be changed correspondingly according to different circuit boards for testing, the distribution positions of the second posts 1222 correspond to positions of test pins of a product to be tested, the positions of the second posts 1222 in the figure are only examples, and the distribution positions of the second posts 1222 can be changed correspondingly according to different products to be tested.
The conductive assembly 10 adopts a combination mode of the elastic conductor 11 and the protective plate 12, and compared with the traditional spring probe, a needle plate distributed with micropores does not need to be manufactured, so that the installation of the spring probe is omitted, and the manufacturing cost and the maintenance cost are greatly reduced; the electric signal interference generated by the inductance effect of a spring component on an electronic signal in the traditional spring probe is avoided, and meanwhile, the electric conduction part can be extremely short and can be used for testing a high-frequency integrated circuit; the protection shield 12 can carry out fine protection to the elastic conductor 11, avoids the direct elastic conductor 11 that pushes down of test pin on the product 50 under test, improves the life of whole conductive component 10 to when elastic conductor 11 or protection shield 12 damaged, only need carry out corresponding change, maintain simply and with low costs.
Fig. 4 to 5 show a preferred embodiment of the testing device of the present invention. The testing device comprises a bottom frame 20, a circuit board 30 for testing, a pressure head assembly 40 and a conductive assembly 10. The bottom frame 20 is provided with a receiving portion 21 for placing the tested product 50, the circuit board 30 for testing is mounted on the bottom frame 20 and located at a lower side of the receiving portion 21, and the conductive assembly 10 is located between the receiving portion 21 and the circuit board 30 for testing. The indenter assembly 40 is used to depress the product under test 50 during testing.
In this embodiment, the ram assembly 40 is rotatably connected to the base frame 20 by rotating the ram assembly 40. The pressing manner of the pressing head assembly 40 is not limited to this, and in other embodiments, the pressing head assembly 40 and the bottom frame 20 may be pressed vertically.
Referring to fig. 1 to 3 together, the conductive assembly 10 includes an elastic conductive body 11 and a protective plate 12, the elastic conductive body 11 includes an elastic insulating plate body and a plurality of conductive particles distributed in the elastic insulating plate body, the elastic conductive body 11 is not conducted in the vertical direction and the horizontal direction under normal conditions, and when the elastic conductive body 11 is pressed in the vertical direction, the elastic conductive body is conducted in the vertical direction of the pressed portion; the protection plate 12 is disposed on the elastic conductor 11, the protection plate 12 includes an insulation body 121 and a plurality of conductive pillars 122 disposed on the insulation body 121, the conductive pillars 122 penetrate through the insulation body 121, the lower end of the conductive pillars 122 protrudes out of the lower surface of the insulation body 121 to form a first protruding pillar 1221, and the first protruding pillar 1221 is used for a testing device to press down the elastic conductor 11 during testing so as to make the elastic conductor 11 be conducted up and down at a pressed position, so as to electrically connect a testing pin on the tested product 50 with a corresponding pad 31 on the testing circuit board 30.
The upper end of the conductive pillar 122 protrudes out of the upper surface of the insulating body 121 to form a second protrusion 1222, and the second protrusion 1222 is used for contacting a test pin of the product under test 50.
The protection plate 12 is a Flexible Printed Circuit (FPC), the first protruding column 1221 is a lower pad formed on a lower surface of the FPC, and the second protruding column 1222 is an upper pad formed on an upper surface of the FPC and connected to the corresponding lower pad.
The distribution positions of the first posts 1221 correspond to the positions of the pads 31 for testing on the test circuit board 30, the positions of the first posts 1221 in the figure are only examples, the distribution positions of the first posts 1221 can be changed correspondingly according to the different test circuit boards 30, the distribution positions of the second posts 1222 correspond to the positions of the test pins of the tested product 50, the positions of the second posts 1222 in the figure are only examples, and the distribution positions of the second posts 1222 can be changed correspondingly according to the different tested products 50.
Fig. 4 and 5 illustrate only one example of the conductive member 10 applied to a testing apparatus, and the conductive member 10 is not limited to the testing apparatus shown in fig. 4 and 5, and in other embodiments, the conductive member 10 may be applied to other types of testing apparatuses, such as a vertical press-down type testing apparatus.
The present invention is not limited to the above embodiments, and various modifications can be made within the technical contents disclosed in the above embodiments. All structural equivalents which may be introduced in the specification and drawings of the present invention, whether directly or indirectly through other related techniques, are encompassed by the present invention as if fully set forth herein.
Claims (10)
1. A conductive assembly is characterized in that the conductive assembly is used for electrically connecting a circuit board for testing with a product to be tested in a testing device and comprises an elastic conductive body and a protective plate, the elastic conductive body comprises an elastic insulating plate body and a plurality of conductive particles distributed in the elastic insulating plate body, the elastic conductive body is not conducted in the vertical direction and the horizontal direction under normal conditions, and when the elastic conductive body is stressed in the vertical direction, the elastic conductive body is conducted in the vertical direction of a stressed part; the protection plate is arranged on the elastic conductor and comprises an insulation body and a plurality of conductive columns arranged on the insulation body, the conductive columns penetrate through the insulation body, the lower ends of the conductive columns protrude out of the lower surface of the insulation body to form first convex columns, and the first convex columns are used for enabling the elastic conductor to be conducted up and down at a pressed position by a testing device when the testing device is used for testing so as to electrically connect a circuit board for testing with a tested product.
2. The conductive assembly of claim 1, wherein the upper end of the conductive post protrudes beyond the upper surface of the insulating body to form a second protrusion, and the second protrusion is used for contacting a test pin of a product under test.
3. The conductive assembly of claim 2, wherein the protection plate is a flexible circuit board, the first protrusion is a lower pad formed on a lower surface of the flexible circuit board, and the second protrusion is an upper pad formed on an upper surface of the flexible circuit board and in communication with the corresponding lower pad.
4. The conductive assembly of claim 2, wherein the first posts are distributed at positions corresponding to positions of pads for testing on a circuit board for testing, and the second posts are distributed at positions corresponding to positions of test pins of a product under test.
5. The conductive assembly of claim 1, wherein the protective plate is a flexible circuit board.
6. A testing device is characterized by comprising a bottom frame, a testing circuit board, a pressure head assembly and a conductive assembly, wherein the bottom frame is provided with a containing part for placing a tested product, the testing circuit board is installed on the bottom frame and is positioned on the lower side of the containing part, the conductive assembly is positioned between the containing part and the testing circuit board, the pressure head assembly is used for pressing the tested product during testing, the conductive assembly comprises an elastic conductive body and a protective plate, the elastic conductive body comprises an elastic insulating plate body and a plurality of conductive particles distributed in the elastic insulating plate body, the elastic conductive body is not conducted in the vertical direction and the horizontal direction under normal conditions, and when the elastic conductive body is stressed in the vertical direction, the elastic conductive body is conducted in the vertical direction of the stressed part; the protection plate is arranged on the elastic conductor and comprises an insulation body and a plurality of conductive columns arranged on the insulation body, the conductive columns penetrate through the insulation body, the lower ends of the conductive columns protrude out of the lower surface of the insulation body to form first convex columns, and the first convex columns are used for enabling the elastic conductor to be conducted up and down at a pressed position by a testing device when the testing device is used for testing so as to electrically connect testing pins on a tested product with corresponding pads on a testing circuit board.
7. The testing device as claimed in claim 6, wherein the upper end of the conductive post protrudes from the upper surface of the insulating body to form a second protrusion, and the second protrusion is used for contacting with a testing pin of a product under test.
8. The test apparatus as claimed in claim 7, wherein the protection board is a flexible circuit board, the first protrusion is a lower pad formed on a lower surface of the flexible circuit board, and the second protrusion is an upper pad formed on an upper surface of the flexible circuit board and in communication with the corresponding lower pad.
9. The testing apparatus as claimed in claim 7, wherein the first posts are disposed at positions corresponding to positions of pads for testing on the circuit board for testing, and the second posts are disposed at positions corresponding to positions of test pins of a product under test.
10. The test device of claim 6, wherein the protective plate is a flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110169573.7A CN112881896A (en) | 2021-02-07 | 2021-02-07 | Conductive assembly and testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110169573.7A CN112881896A (en) | 2021-02-07 | 2021-02-07 | Conductive assembly and testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112881896A true CN112881896A (en) | 2021-06-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110169573.7A Pending CN112881896A (en) | 2021-02-07 | 2021-02-07 | Conductive assembly and testing device |
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| Country | Link |
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| CN (1) | CN112881896A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5088190A (en) * | 1990-08-30 | 1992-02-18 | Texas Instruments Incorporated | Method of forming an apparatus for burn in testing of integrated circuit chip |
| CN2904346Y (en) * | 2006-06-08 | 2007-05-23 | 番禺得意精密电子工业有限公司 | Electric connector |
| TW200831906A (en) * | 2007-01-30 | 2008-08-01 | Winway Technology Co Ltd | Connector for IC testing |
| CN205193228U (en) * | 2015-11-05 | 2016-04-27 | 深圳市斯纳达科技有限公司 | Integrated circuit test fixture and integrated circuit testing arrangement |
| CN105929319A (en) * | 2016-04-20 | 2016-09-07 | 浪潮电子信息产业股份有限公司 | Test equipment connection method based on anisotropic conductive adhesive |
| CN111308306A (en) * | 2020-03-12 | 2020-06-19 | 深圳市江波龙电子股份有限公司 | Wafer testing device and wafer testing method |
| CN215375667U (en) * | 2021-02-07 | 2021-12-31 | 荀露 | Conductive assembly and testing device |
-
2021
- 2021-02-07 CN CN202110169573.7A patent/CN112881896A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5088190A (en) * | 1990-08-30 | 1992-02-18 | Texas Instruments Incorporated | Method of forming an apparatus for burn in testing of integrated circuit chip |
| CN2904346Y (en) * | 2006-06-08 | 2007-05-23 | 番禺得意精密电子工业有限公司 | Electric connector |
| TW200831906A (en) * | 2007-01-30 | 2008-08-01 | Winway Technology Co Ltd | Connector for IC testing |
| CN205193228U (en) * | 2015-11-05 | 2016-04-27 | 深圳市斯纳达科技有限公司 | Integrated circuit test fixture and integrated circuit testing arrangement |
| CN105929319A (en) * | 2016-04-20 | 2016-09-07 | 浪潮电子信息产业股份有限公司 | Test equipment connection method based on anisotropic conductive adhesive |
| CN111308306A (en) * | 2020-03-12 | 2020-06-19 | 深圳市江波龙电子股份有限公司 | Wafer testing device and wafer testing method |
| CN215375667U (en) * | 2021-02-07 | 2021-12-31 | 荀露 | Conductive assembly and testing device |
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