CN112714589A - Heat sink structure - Google Patents
Heat sink structure Download PDFInfo
- Publication number
- CN112714589A CN112714589A CN202011423133.1A CN202011423133A CN112714589A CN 112714589 A CN112714589 A CN 112714589A CN 202011423133 A CN202011423133 A CN 202011423133A CN 112714589 A CN112714589 A CN 112714589A
- Authority
- CN
- China
- Prior art keywords
- heat
- base
- fins
- heat sink
- sink structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 24
- 239000012530 fluid Substances 0.000 claims abstract description 16
- 239000007788 liquid Substances 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a heat sink structure, comprising: a plurality of heat dissipation fins, a base; the plurality of radiating fins are provided with a combining end and a free end, and a cavity is arranged between the combining end and the free end and is filled with working fluid; the upper and lower sides of the base are respectively provided with a combination side and a heating side, and the combination ends of the plurality of radiating fins are integrally combined on the combination sides in an enveloping way, so that the thermal resistance after different parts are combined can be eliminated.
Description
Technical Field
The present invention relates to a heat sink structure, and more particularly, to a heat sink structure with a base and heat dissipating fins integrated by a wrapping injection method to prevent thermal resistance.
Background
At present, the application of the conventional die-casting radiator on 5G products and equipment (such as communication cabinets, communication equipment and the like) is limited in heat dissipation capacity, and simultaneously, the product volume and the weight are large, and the outdoor installation and maintenance of the product are not facilitated, so that in order to further improve the heat dissipation capacity of the product, reduce the product weight and achieve high efficiency of the heat dissipation fins, the connection part of the heat dissipation fins and the base is mainly glued or riveted by Epoxy resin (Epoxy), as the 5G products and the equipment are mostly applied outdoors, but the fins and the base are connected by Epoxy resin (Epoxy) gluing, the aging risk exists, the scheme is not perfect, the application is less at present, the riveting is the main mode of connecting the high-efficiency heat dissipation fins and the base in the present market, but because a natural contact gap exists between the contact surfaces of two metal parts, air smearing between the gaps can lead to high heat resistance which cannot be extinguished, although high efficiency fins provide considerable heat dissipation capability, heat cannot be completely conducted from the heat generating element to the fins due to the gap.
The high-efficiency radiating fins are internally provided with cavities, working liquid or gas is selectively filled in the cavities, and the cavities are in a vacuum state, so that the working liquid or gas can be evaporated and vaporized in advance under the condition of lower boiling point, and the heat transfer efficiency of the radiating fins is improved.
Since the inner chamber of the high-efficiency heat sink has working fluid or gas, when the high-efficiency heat sink is combined with the base, special attention must be paid to whether the vacuum tightness of the inner chamber is damaged, and when the high-efficiency heat sink is subjected to thermal processing, attention must be paid to whether the working fluid in the chamber is evaporated due to heating, so that the heat exchange effect is lost.
How to combine the high-efficiency heat dissipation fins and the base firmly without generating gaps is the primary objective to be solved.
Disclosure of Invention
Accordingly, the present invention is directed to a heat sink structure with no thermal resistance between a base and heat dissipating fins.
To achieve the above object, the present invention provides a heat sink structure, comprising: a plurality of heat dissipation fins, a base;
the plurality of radiating fins are provided with a combining end and a free end, and a cavity is arranged between the combining end and the free end in the fins and filled with working fluid; the upper and lower sides of the base are respectively provided with a combining side and a heating side, and the combining sides are combined with the combining ends of the plurality of radiating fins in an integrally wrapping manner.
The combination side is provided with a plurality of convex combination parts, and the combination parts are coated outside the combination end, so that the plurality of radiating fins can be firmly combined with the base into a whole.
The working fluid is a gas or a liquid.
The plurality of heat dissipation fins and the base are made of the same or different materials.
The heat dissipation fins and the base are combined together by an integral wrapping and injecting mode, and then the heat dissipation fins are filled with water and vacuumized.
The plurality of radiating fins and the base are mutually combined in an integral wrapping and injecting mode, and the plurality of radiating fins are filled with water and vacuumized, so that the working liquid or gas in the inner cavities of the plurality of radiating fins can be maintained to be stable and prevented from evaporating, and the problem of thermal resistance between the base and the radiating fins can be solved.
Drawings
FIG. 1 is an exploded perspective view of a first embodiment of the heat sink structure of the present invention;
fig. 2 is a combined sectional view of a first embodiment of the heat sink structure of the present invention.
Description of reference numerals: a heat sink structure 1; heat dissipating fins 11; a coupling end 111; a free end 112; a chamber 113; a base 12; a bonding side 121; a coupling portion 1211; a heated side 122; a working fluid 2.
Detailed Description
The above objects, together with the structural and functional features thereof, are accomplished by the preferred embodiments according to the accompanying drawings.
Referring to fig. 1 and fig. 2, which are three-dimensional exploded and assembled cross-sectional views of a heat sink structure according to a first embodiment of the present invention, the heat sink structure 1 includes: a plurality of heat dissipation fins 11, a base 12;
the two ends of the plurality of heat dissipation fins 11 are respectively provided with a combining end 111 and a free end 112, a vacuum cavity 113 is arranged between the combining end 111 and the free end 112 of the heat dissipation fins, the cavity 113 is filled with a working fluid 2, and the working fluid 2 can be gas or liquid.
The upper and lower sides of the base 12 are respectively provided with a bonding side 121 and a heated side 122, the heat receiving side 122 contacts with at least one heat source, the combining side 121 corresponds to the combining ends 111 of the plurality of heat dissipating fins 11, and combines the combining ends 111 into a whole by an enveloping method, that is, the combining side 121 protrudes with a plurality of combining portions 1211, the combining portions 1211 are wrapped outside the combining end 111, the connecting end 111 can be in any one of an inverted T shape, an L shape or other geometric shapes, the embodiment is an inverted T shape as an illustrative embodiment, but not limited to, the combining portion 1211 is integrally wrapped around the outer portion of the combining end 111 in the shape of an inverted T, so that the plurality of heat dissipation fins 11 are firmly combined with the base 12 without a gap, and the heat dissipation fins 11 can be prevented from being pulled out of the combining portion 1211 of the base 12 by the design of the combining end 111.
The heat dissipation fins 11 and the base 12 are made of the same or different materials, and can be any one or combination of copper, aluminum, stainless steel, etc. the heat dissipation fins 11 and the base 12 are combined by integral injection, and after the integral injection is combined, the heat dissipation fins 11 are filled with water and vacuumized.
The main purpose of the method is to prevent the working fluid 2 inside the heat sink fins 11 from evaporating under the influence of high temperature during the integral injection operation of the base 12 and the heat sink fins 11, so that the vapor-liquid circulation heat exchange inside the heat sink fins 11 is ineffective, and after the integral injection combination operation of the base 12 and the heat sink fins 11 is completed, the working fluid 2 is filled into the heat sink fins 11 and vacuumized, and finally the heat sink fins 11 are sealed.
The invention mainly provides a heat radiation fin 11 with high efficiency heat conduction efficiency, the heat radiation fin 11 is internally provided with a cavity 113 filled with working fluid 2 (liquid and gas), and before the working fluid 2 is filled, the heat radiation fin 11 and the base 12 are combined in an integral wrapping and injecting way, so that the heat radiation fin 11 and the base 12 are combined into a whole without generating gaps, thereby avoiding the generation of heat resistance, and after the integral wrapping and injecting is finished, the cavity 113 of the heat radiation fin 11 is filled with the working fluid 2 and vacuumized, thereby avoiding the situation that the working fluid 2 in the cavity is damaged by high temperature to evaporate and vaporize when the heat radiation fin 11 and the base 12 are subjected to the integral wrapping and injecting operation.
Claims (5)
1. A heat sink structure, comprising:
the heat dissipation device comprises a plurality of heat dissipation fins, a heat dissipation device and a control device, wherein the heat dissipation fins are provided with a combination end and a free end, a cavity is arranged between the combination end and the free end, and working fluid is filled in the cavity;
the upper side and the lower side of the base are respectively provided with a combining side and a heated side, the heated side is contacted with a heat source, and the combining sides integrally wrap the combining ends of the plurality of radiating fins.
2. The heat sink structure as claimed in claim 1, wherein the connecting side protrudes a plurality of connecting portions, the connecting portions are wrapped outside the connecting end, so that the plurality of heat dissipating fins are firmly integrated with the base.
3. The heat sink structure of claim 1, wherein the working fluid is a gas or a liquid.
4. The heat sink structure as claimed in claim 1, wherein the plurality of heat dissipating fins and the base are made of the same or different materials.
5. The heat sink structure as claimed in claim 1, wherein the plurality of heat dissipating fins and the base are integrally bonded together by injection, and the plurality of heat dissipating fins are filled with water and evacuated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011423133.1A CN112714589A (en) | 2020-12-08 | 2020-12-08 | Heat sink structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011423133.1A CN112714589A (en) | 2020-12-08 | 2020-12-08 | Heat sink structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112714589A true CN112714589A (en) | 2021-04-27 |
Family
ID=75542740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011423133.1A Pending CN112714589A (en) | 2020-12-08 | 2020-12-08 | Heat sink structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112714589A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM250535U (en) * | 2000-02-25 | 2004-11-11 | Mitac Technology Corp | Overlap-type heat dissipating device |
| TW201317400A (en) * | 2011-10-26 | 2013-05-01 | Ever Bless Metal Co Ltd | Aluminum heat-dissipation unit and method of manufacturing same |
| JP2014232893A (en) * | 2014-09-05 | 2014-12-11 | Ｄｏｗａメタルテック株式会社 | Base integrated substrate with fin, and base integrated substrate device with fin |
| TWM511193U (en) * | 2015-07-24 | 2015-10-21 | Asia Vital Components Co Ltd | Heat dissipation apparatus |
| TWM584591U (en) * | 2019-07-19 | 2019-10-01 | 大陸商深圳興奇宏科技有限公司 | Heat dissipation device |
| CN213783963U (en) * | 2020-12-08 | 2021-07-23 | 深圳兴奇宏科技有限公司 | Heat sink structure |
-
2020
- 2020-12-08 CN CN202011423133.1A patent/CN112714589A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM250535U (en) * | 2000-02-25 | 2004-11-11 | Mitac Technology Corp | Overlap-type heat dissipating device |
| TW201317400A (en) * | 2011-10-26 | 2013-05-01 | Ever Bless Metal Co Ltd | Aluminum heat-dissipation unit and method of manufacturing same |
| JP2014232893A (en) * | 2014-09-05 | 2014-12-11 | Ｄｏｗａメタルテック株式会社 | Base integrated substrate with fin, and base integrated substrate device with fin |
| TWM511193U (en) * | 2015-07-24 | 2015-10-21 | Asia Vital Components Co Ltd | Heat dissipation apparatus |
| TWM584591U (en) * | 2019-07-19 | 2019-10-01 | 大陸商深圳興奇宏科技有限公司 | Heat dissipation device |
| CN213783963U (en) * | 2020-12-08 | 2021-07-23 | 深圳兴奇宏科技有限公司 | Heat sink structure |
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