CN112683170B - Method for detecting soldering position precision of soldering tin - Google Patents
Method for detecting soldering position precision of soldering tin Download PDFInfo
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- CN112683170B CN112683170B CN202011574694.1A CN202011574694A CN112683170B CN 112683170 B CN112683170 B CN 112683170B CN 202011574694 A CN202011574694 A CN 202011574694A CN 112683170 B CN112683170 B CN 112683170B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention relates to a method for detecting the precision of a soldering tin welding position, which comprises the following steps: step 1: marking, namely making an upper limit mark and a lower limit mark on the welded copper wire and ensuring the position accuracy of the upper limit mark and the lower limit mark; step 2: detecting whether the position of the upper limit mark is on the copper wire or not and whether the position of the lower limit mark is on the soldering tin or not; if the upper limit mark is positioned on the copper wire and the lower limit mark is positioned on the soldering tin, the end part of the soldering tin is positioned between the lower limit mark and the upper limit mark, and the position of the soldering tin is in accordance with the requirement. When the upper limit mark is located on the copper wire and the lower limit mark is located on the soldering tin, the length and the position of the soldering tin meet the use requirements, the convenience of operation of workers is greatly improved, and the workers can rapidly measure the length and the position accuracy of the soldering tin conveniently.
Description
Technical Field
The invention relates to the technical field of circuit processing and manufacturing, in particular to a method for detecting the accuracy of a soldering position of soldering tin.
Background
In integrated circuit processing, it is necessary to solder circuit components such as copper wires to a circuit board. The copper wire usually comprises a plurality of copper wires, so when the copper wire is welded, a layer of soldering tin needs to be welded at the end part of the copper wire in advance, so that the end parts of the copper wires are fixed, and the copper wire is welded to the circuit board subsequently.
Because integrated circuit precision degree is higher, in order to guarantee that the length of soldering tin satisfies the operation requirement, need detect the length and the position of soldering tin after the welding is accomplished. A commonly used detection method is to directly measure the length of the solder and to evaluate the positional accuracy of the solder.
However, when the shape of the soldering tin is irregular, the length of the soldering tin is not a definite value, so that the length of the soldering tin cannot be directly measured by a worker, and therefore, the detection work of the length and the position accuracy of the soldering tin has great difficulty and is inconvenient for the worker to operate.
Disclosure of Invention
In order to facilitate the staff to carry out short-term test to the length and the position of soldering tin, this application provides the detection method of soldering tin welding position precision.
The detection method for the accuracy of the soldering tin welding position adopts the following technical scheme:
the detection method of the soldering tin welding position precision comprises the following steps:
step 1: marking, namely making an upper limit mark and a lower limit mark on the welded copper wire and ensuring the position accuracy of the upper limit mark and the lower limit mark;
firstly, respectively taking a first marking line and a second marking line on a copper wire, wherein the second marking line is positioned between the first marking line and the end part of the copper wire, and the first marking line and the second marking line are parallel to each other;
making a first parallel line on one side of the first marking line, which is opposite to the second marking line, so that the first parallel line is parallel to the first marking line; taking a first mark between the first mark line and the first parallel line; making a second parallel line on one side of the second marking line, which is opposite to the first marking line, and making the second parallel line parallel to the second marking line, and taking a second mark between the second marking line and the second parallel line;
step 2: detecting whether the position of the upper limit mark is on the copper wire or not and whether the position of the lower limit mark is on the soldering tin or not; if the upper limit mark is positioned on the copper wire and the lower limit mark is positioned on the soldering tin, the end part of the soldering tin is positioned between the lower limit mark and the upper limit mark, and the position of the soldering tin is in accordance with the requirement.
Through adopting above-mentioned technical scheme, when the tip of soldering tin was irregular shape, because form a length range between upper limit mark and the lower limit mark, consequently, the staff need not measure the length of soldering tin, only need observe whether upper limit mark is located the copper wire, whether the lower limit mark is located soldering tin. If it is that the upper limit mark is located the copper wire, the lower limit mark is located soldering tin, and when the tip of soldering tin was located between upper limit mark and the lower limit mark this moment, the length and the position of soldering tin were promptly satisfied the operation requirement, had greatly promoted the convenience of staff's operation, and the staff of being convenient for carries out the rapid survey to the length and the position precision of soldering tin.
A marking range is formed between the first parallel line and the first marking line, and a marking range is also formed between the second parallel line and the second marking line, so that the position accuracy of the first marking and the second marking is convenient to ensure, the position accuracy of the upper limit marking and the lower limit marking is convenient to ensure, and the detection accuracy of soldering tin is ensured. Simultaneously be convenient for set up first mark fast, effectively promote the efficiency that detects.
Preferably, a plurality of first circles are formed between the first parallel line and the first marking line, and the plurality of first circles are arranged along the length direction of the first marking line; making a first mark between two adjacent first circles; making a plurality of second circles between the second parallel lines and the second marking lines, wherein the plurality of second circles are arranged along the length direction of the second marking lines; and making a second mark between two adjacent second circles.
By adopting the technical scheme, the position between the first marking line and the first parallel line can be defined into a plurality of small ranges by the first circles, so that the position of the first marking can be conveniently judged by a worker. The second circles can define a plurality of small ranges for the positions between the second marking lines and the second parallel lines, so that the staff can conveniently judge the positions of the second marks. Thereby effectively promoting detection efficiency.
Preferably, the first mark and the second mark are both provided as spot marks.
By adopting the technical scheme, the first mark and the second mark are both in spot shapes, and the positions of the first mark and the second mark can be accurately detected, so that the accuracy of the soldering position can be conveniently judged.
Preferably, the first marks and the second marks are arranged in plurality, the first marks are arranged in the radial direction of the copper wire, and whether the first marks are all located on the copper wire is observed; the plurality of second marks are arranged in the radial direction of the copper wire, and whether the plurality of second marks are all located on the soldering tin is observed.
Through adopting above-mentioned technical scheme, the radial distribution of copper line is all followed to a plurality of first marks and a plurality of second mark for the staff can be accurate judge the position precision of each position on the soldering tin tip, whether the position of the audio-visual judgement soldering tin of the staff of being convenient for satisfies the operation requirement.
Preferably, the first mark and the second mark are both provided as strip marks, and the first mark and the second mark are both provided along a radial direction of the copper wire.
Through adopting above-mentioned technical scheme, first mark and second mark all are rectangular form setting for form a length interval between first mark and the second mark, so that audio-visual position to first mark, second mark and soldering tin tip is judged.
Preferably, the first mark and the second mark are both photographic images.
By adopting the technical scheme, the first mark and the second mark are photographic images, so that workers do not need to directly mark the entity on the copper wire, the operation steps are simplified, and the quality of the copper wire and soldering tin can be ensured. And the image of first mark is on the copper line, and the second mark is located soldering tin, consequently, the colour of first mark and second mark is inconsistent, can directly judge the position of soldering tin tip through the colour of image, effectively promotes the convenience and the degree of accuracy that detect.
Preferably, after the detection step is completed, the position of the solder is rechecked.
By adopting the technical scheme, the probability of detection errors caused by detection errors can be effectively reduced by rechecking the position of the solder, so that the detection precision is further ensured.
Preferably, after confirming that the upper limit mark is located on the copper wire and the lower limit mark is located on the solder, it is redetected whether or not all positions on the end portion of the solder are located between the upper limit mark and the lower limit mark.
Through adopting above-mentioned technical scheme, whether tip through observing soldering tin lies in between first mark and the second mark completely, directly detects the position accuracy of soldering tin, when the staff's operation of being convenient for, also can effectively guarantee to detect the precision.
In summary, the present invention includes at least one of the following beneficial effects:
1. when the end part of the soldering tin is in an irregular shape, a worker does not need to measure the length of the soldering tin, only needs to observe whether the upper limit mark is positioned on the copper wire or not and whether the lower limit mark is positioned on the soldering tin or not, if the upper limit mark is positioned on the copper wire and the lower limit mark is positioned on the soldering tin, the length and the position of the soldering tin meet the use requirements, the operation convenience of the worker is greatly improved, and the worker can conveniently and quickly measure the length and the position precision of the soldering tin;
2. the first mark and the second mark are both provided with a plurality of point-shaped marks, so that a worker can accurately judge the position precision of each position on the end part of the soldering tin, and the worker can conveniently and visually judge whether the position of the soldering tin meets the use requirement;
3. the first mark and the second mark are photographic images, so that workers do not need to directly mark an entity on the copper wire, the operation steps are simplified, and the quality of the copper wire and soldering tin can be ensured; on the other hand, the image of first mark is on the copper line, and the second mark is located soldering tin, and the colour of first mark and second mark is inconsistent, and the staff can directly judge the position of soldering tin tip through the colour of image, effectively promotes the convenience that detects.
Detailed Description
Example 1:
the embodiment of the application discloses a method for detecting the precision of a soldering tin welding position, which comprises the following steps:
step 1: marking, using a CCD camera to take a black and white image of the copper wire with solder on the end. First, the whole image of the end of the copper wire is taken. And constructing a first marking line and a second marking line which are parallel to each other at a specific position of the copper wire image, and ensuring that the first marking line and the second marking line are both arranged along the radial direction of the copper wire. The position between the first marking line and the second marking line is the theoretical position of the end part of the soldering tin, so that the soldering tin meets the requirement when the end part of the soldering tin is positioned between the first marking line and the second marking line.
And making a first parallel line on one side of the first marking line far away from the second marking line, and making a second parallel line on one side of the second marking line far away from the first marking line, wherein the first parallel line, the second parallel line, the first marking line and the second marking line are all parallel to each other. The distance between the first parallel lines and the first marking lines and the distance between the second marking lines and the second parallel lines are both set to 0.1 mm.
And a plurality of first circles with the diameter of 0.1 mm are formed between the first marking line and the first parallel line, and are distributed along the length direction of the first marking line. And a plurality of second circles with the diameter of 0.1 mm are formed between the second marking line and the second parallel line, and are distributed along the length direction of the first marking line.
A first spot is taken in a range between the first circles and is marked as a first mark. A second blob is captured in a range between the second plurality of circles, and the second plurality of blobs are marked as second marks. In this embodiment, the first mark and the second mark are three, or four or five. Three first flags are set as the upper limit flag, and three second flags are set as the lower limit flag.
Step 2: and detecting the gray value of the upper limit mark image, and if the gray value is less than 220, judging that the upper limit mark is positioned on the copper wire. The gray scale value of the lower limit mark image is detected, and if the gray scale value of the lower limit mark image is larger than 220, the lower limit mark is judged to be positioned on the soldering tin. At this time, it can be determined that the end of the solder is located between the lower limit mark and the upper limit mark, indicating that the position of the solder meets the requirement.
Step 3: and rechecking, namely manually rechecking whether all positions on the end part of the soldering tin are positioned between the upper limit mark and the lower limit mark or not after the detection step is finished so as to prevent detection errors.
Example 2:
the embodiment of the application discloses a method for detecting the precision of a soldering position, which is different from the embodiment 1 in that: the first mark and the second mark are both strip-shaped images. The upper limit mark and the lower limit mark are both in strip shapes, and the first mark and the second mark are both arranged along the radial direction of the copper wire. Therefore, when the speckle image is determined, whether the end of the solder is located between the upper limit mark and the lower limit mark can be determined quickly, and the detection accuracy is improved.
The embodiments of the present invention are preferred embodiments of the present invention, and the scope of the present invention is not limited by these embodiments, so: all equivalent changes made according to the structure, shape and principle of the invention are covered by the protection scope of the invention.
Claims (8)
1. The detection method of the soldering tin welding position precision is characterized in that: the method comprises the following steps:
step 1: marking, namely making an upper limit mark and a lower limit mark on the welded copper wire and ensuring the position accuracy of the upper limit mark and the lower limit mark;
firstly, respectively taking a first marking line and a second marking line on a copper wire, wherein the second marking line is positioned between the first marking line and the end part of the copper wire, and the first marking line and the second marking line are parallel to each other;
making a first parallel line on one side of the first marking line, which is opposite to the second marking line, so that the first parallel line is parallel to the first marking line; taking a first mark between the first mark line and the first parallel line; setting the first flag as an upper limit flag; making a second parallel line on one side of the second marking line, which is opposite to the first marking line, and making the second parallel line parallel to the second marking line, and taking a second mark between the second marking line and the second parallel line; setting the second flag as a lower limit flag;
step 2: detecting whether the position of the upper limit mark is on the copper wire or not and whether the position of the lower limit mark is on the soldering tin or not; if the upper limit mark is positioned on the copper wire and the lower limit mark is positioned on the soldering tin, the end part of the soldering tin is positioned between the lower limit mark and the upper limit mark, and the position of the soldering tin is in accordance with the requirement.
2. A method of detecting accuracy of a solder bonding position according to claim 1, characterized in that: making a plurality of first circles between the first parallel lines and the first marking lines, wherein the plurality of first circles are arranged along the length direction of the first marking lines; making a first mark between two adjacent first circles; making a plurality of second circles between the second parallel lines and the second marking lines, wherein the plurality of second circles are arranged along the length direction of the second marking lines; and making a second mark between two adjacent second circles.
3. A method of detecting accuracy of a solder bonding position according to claim 1, characterized in that: the first mark and the second mark are both arranged as spot marks.
4. A method of detecting accuracy of a solder bonding position according to claim 3, characterized in that: the first marks and the second marks are arranged in plurality, the first marks are arranged along the radial direction of the copper wire, and whether the first marks are located on the copper wire or not is observed; the plurality of second marks are also arranged in a radial direction of the copper wire, and whether the plurality of second marks are all located on the solder is observed.
5. A method of detecting accuracy of a solder bonding position according to claim 1, characterized in that: the first mark and the second mark are both arranged to be strip-shaped marks, and the first mark and the second mark are both arranged along the radial direction of the copper wire.
6. A method of detecting accuracy of a solder bonding position according to claim 3 or 5, characterized in that: the first mark and the second mark are both photographic images.
7. A method for detecting accuracy of a solder bonding position according to claim 1, characterized in that: and after the detection step is finished, rechecking the position of the soldering tin.
8. A method of detecting accuracy of a solder bonding position according to claim 7, characterized in that: after confirming that the upper limit mark is located on the copper wire and the lower limit mark is located on the solder, it is re-detected whether all the positions on the end of the solder are located between the upper limit mark and the lower limit mark.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011574694.1A CN112683170B (en) | 2020-12-28 | 2020-12-28 | Method for detecting soldering position precision of soldering tin |
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| CN202011574694.1A CN112683170B (en) | 2020-12-28 | 2020-12-28 | Method for detecting soldering position precision of soldering tin |
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| CN112683170A CN112683170A (en) | 2021-04-20 |
| CN112683170B true CN112683170B (en) | 2022-06-07 |
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| CN202607658U (en) * | 2012-06-29 | 2012-12-19 | 成都陵川特种工业有限责任公司 | Welding spot positioning device adapted to various car pre-mufflers |
| CN210172753U (en) * | 2019-05-31 | 2020-03-24 | 苏州琦少工程科技有限公司 | Cable soldering tin anchor clamps |
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| US5965307A (en) * | 1995-05-11 | 1999-10-12 | Sumitomo Heavy Industries, Ltd. | Position detecting method with observation of position detecting marks |
| JP3962782B1 (en) * | 2006-08-11 | 2007-08-22 | 国立大学法人 岡山大学 | Soldering inspection method, solder bonding method, and solder bonding apparatus |
| JP4490468B2 (en) * | 2007-10-10 | 2010-06-23 | シーケーディ株式会社 | Solder printing inspection device |
| NL1036476A1 (en) * | 2008-02-01 | 2009-08-04 | Asml Netherlands Bv | Alignment mark and a method of aligning a substrate including such an alignment mark. |
| CN104097395A (en) * | 2013-04-12 | 2014-10-15 | 神奔机电科技（上海）有限公司 | Selective electrode type solar cell grid line printing position precision detecting method |
| CN104764752B (en) * | 2015-03-24 | 2017-09-12 | 广州视源电子科技股份有限公司 | Solder joint tin connection detection method and device |
| US10192133B2 (en) * | 2015-06-22 | 2019-01-29 | Seiko Epson Corporation | Marker, method of detecting position and pose of marker, and computer program |
| CN105628497A (en) * | 2015-12-24 | 2016-06-01 | 西南铝业（集团）有限责任公司 | Mark line marking ruler |
| CN106092163B (en) * | 2016-07-28 | 2018-11-30 | 珠海格力电器股份有限公司 | Photoelectric encoder and attaching structure of photoelectric conversion chip and fixed grating thereof |
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- 2020-12-28 CN CN202011574694.1A patent/CN112683170B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202607658U (en) * | 2012-06-29 | 2012-12-19 | 成都陵川特种工业有限责任公司 | Welding spot positioning device adapted to various car pre-mufflers |
| CN210172753U (en) * | 2019-05-31 | 2020-03-24 | 苏州琦少工程科技有限公司 | Cable soldering tin anchor clamps |
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