CN112680759B - Method for reducing carrying-out of gantry line tank liquid in circuit board electroplating - Google Patents
Method for reducing carrying-out of gantry line tank liquid in circuit board electroplating Download PDFInfo
- Publication number
- CN112680759B CN112680759B CN202011407041.4A CN202011407041A CN112680759B CN 112680759 B CN112680759 B CN 112680759B CN 202011407041 A CN202011407041 A CN 202011407041A CN 112680759 B CN112680759 B CN 112680759B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- air
- tank
- liquid
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B3/00—Drying solid materials or objects by processes involving the application of heat
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Microbiology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The application provides a method for reducing and taking out gantry line tank liquor in circuit board electroplating, which comprises the following steps: placing the circuit board into a liquid medicine tank, and performing immersion electroplating operation; lifting the circuit board away from the liquid medicine groove, and adjusting the distance between the circuit board and the liquid level of the liquid medicine groove to be a preset liquid return distance; blowing cold air to the circuit board to blow off the residual tank liquor adhered to the circuit board so as to make the residual tank liquor flow back to the liquor tank; lifting the circuit board, and adjusting the distance between the circuit board and the liquid level of the pharmaceutical tank to be a preset drying distance, wherein the preset drying distance is greater than a preset liquid return distance; and blowing hot air to the circuit board to dry the circuit board. Through the auxiliary air flow blowing-off mode of blowing cold air firstly and then blowing hot air, the bath solution adhered to the circuit board can be removed more cleanly, the volatilization degree of the bath solution can be reduced, and the content of harmful substances in the air of the electroplating operation area can be better reduced.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for reducing the carrying-out of gantry line bath solution in circuit board electroplating.
Background
The linear gantry electroplating production line adopts a gantry crane to hoist the electroplating parts, and the PLC is automatically controlled to accurately run; can be equipped with a high-precision filter to ensure the high quality of the plating layer. The linear gantry electroplating production line is characterized in that a gantry crane is adopted to hoist the electroplating hanger. Various grooves for electroplating are arranged in parallel to form a straight line or a plurality of straight lines, the crane makes straight line motion along the track, and one pair or two pairs of lifting hooks on the crane are used for hoisting, so that the automatic line completes the processing task according to the required program. The portal crane has good rigidity, large hoisting weight and stable operation, is suitable for hoisting workpieces in plating tanks of various sizes, and can adopt the car body structure of the type for an automatic line with a longer plating tank. The running rails are arranged on two sides of the groove body, and the advantages of reducing the corrosion of the rails and the running and being convenient for checking the electric sensing fault are achieved; the automatic line using the large-scale plating tank is controlled by a high-precision computer, and the automatic line has the advanced functions of automatically memorizing and storing production process parameters and being used for quality inspection and tracing; can be provided with vibration and swing; stirring with air; the PLC is automatically controlled and runs accurately; a high-precision filter can be arranged to ensure the high quality of the plating layer; and a high-quality rectifier can be matched to ensure the stability of electroplating.
Many processes of circuit board trade all have orthoscopic longmen line, especially heavy gold, heavy copper, processes such as copper facing, longmen line hanger (mother's basket) carry the son basket (main support plate instrument), when setting for lifting from a liquid medicine groove to another groove according to the form, no matter the dwell time length after lifting, the tank liquor still can be taken out, many producers design gantry crane regularly to rock when lifting, reduce the volume that the tank liquor was taken out, nevertheless because the time of rocking is short can't be very well with the water draining of circuit board and son basket, if change shake for a long time then can lead to every groove dwell time extension to lead to the reduction in efficiency.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides a method for reducing and taking out slot liquid of a gantry line in circuit board electroplating, which can enable the slot liquid adhered to a circuit board to be removed more cleanly when the circuit board is transported between adjacent liquid medicine slots, can reduce the volatilization degree of the slot liquid and better reduce the content of harmful substances in air of an electroplating operation area.
The purpose of the invention is realized by the following technical scheme:
a method for reducing the carrying-out of gantry line tank liquid in circuit board electroplating comprises the following steps:
placing the circuit board into a liquid medicine tank, and performing immersion electroplating operation;
lifting the circuit board away from the liquid medicine groove, and adjusting the distance between the circuit board and the liquid level of the liquid medicine groove to be a preset liquid return distance;
blowing cold air to the circuit board to blow off residual tank liquor adhered to the circuit board so as to enable the residual tank liquor to flow back to the liquid medicine tank;
lifting the circuit board, and adjusting the distance between the circuit board and the liquid level of the pharmaceutical tank to be a preset drying distance, wherein the preset drying distance is greater than the preset liquid return distance;
and blowing hot air to the circuit board to dry the circuit board.
In one embodiment, the temperature of the cold air is 10-15 ℃.
In one embodiment, the temperature of the hot air is 30-60 ℃.
In one embodiment, the blowing operation of blowing cold air to the circuit board to blow off residual bath solution adhered to the circuit board specifically includes the following steps:
separating a plurality of circuit boards in advance to ensure that a gap is reserved between every two adjacent circuit boards;
will cold wind turns into vortex cold wind to make vortex cold wind to the polylith the circuit board is bloated, with to the polylith the operation is blown away to the residual tank liquor of adhesion on the circuit board.
In one embodiment, the preset liquid return distance is 0.1-2 m.
In one embodiment, the preset drying distance is 2.5 meters to 5 meters.
In one embodiment, the duration of the blowing of the cold air to the circuit board is 15 seconds to 100 seconds.
In one embodiment, the duration of the hot air blown to the circuit board is 5 seconds to 10 seconds.
According to the method for reducing and taking out the gantry line tank liquid in the circuit board electroplating process, the cold air is blown firstly and then the hot air is blown out in an auxiliary air flow mode, so that the tank liquid adhered to the circuit board can be removed more cleanly when the circuit board is transported between adjacent liquid medicine tanks, the volatilization degree of the tank liquid can be reduced, and the content of harmful substances in the air of an electroplating operation area can be reduced better.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic diagram of a gantry line for electroplating a circuit board according to an embodiment;
FIG. 2 is a schematic structural diagram of an air knife plate according to an embodiment;
FIG. 3 is a flowchart illustrating the steps of a method for reducing carryover of gantry line bath solution during electroplating of a circuit board according to an embodiment.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, which is a schematic structural diagram of a gantry line 10 for circuit board electroplating in an embodiment, the gantry line 10 for circuit board electroplating includes: the device comprises a liquid medicine tank 100, a portal frame 200, a hanging basket assembly 300 and an air knife turbulence assembly 400, wherein the liquid medicine tank 100 is used for electroplating the circuit board, and specifically, the liquid medicine tanks are multiple and specifically comprise a copper deposition liquid medicine tank, a micro-etching liquid medicine tank, a water washing liquid medicine tank and the like. The gantry 200 spans the whole gantry structure and is positioned right above the liquid medicine tanks, the hanging basket assembly 300 and the air knife turbulence assembly 400 are respectively installed on the gantry 200, and the gantry 200 is used for enabling the hanging basket assembly 300, the air knife turbulence assembly 400 and a plurality of circuit boards placed on the hanging basket assembly 300 to sequentially pass through the liquid medicine tanks, so that the circuit boards placed on the hanging basket assembly 300 are sequentially immersed into the liquid medicine tanks, and the whole electroplating process is completed. When hanging flower basket subassembly 300 is hung from by portal frame 200 during liquid medicine groove 100, by air knife vortex subassembly 400 to placing polylith circuit board bloat the vortex air current on hanging flower basket subassembly 300 to blow to each circuit board, on the one hand, through the surface to the circuit board air current of blowing, can accelerate remaining tank liquor backward flow drippage on the circuit board surface extremely in the liquid medicine groove, on the other hand, compare in the air current of linear type flow direction, the vortex air current has the inside complicated and unordered air current's such as uneven wind speed characteristics of flow direction of air current, can make polylith on hanging flower basket subassembly 300 the circuit board is in the crane condition that portal frame 200 does not rock, produces rocking of certain degree, so, combines the air current to blow and rock the residual adhesion tank liquor that liquid on the circuit board surface can be blown off more effectively of getting rid of liquid.
Referring to fig. 1, the chemical solution tank 100 is used for performing an electroplating operation on a circuit board, and specifically, the chemical solution tank includes a plurality of chemical solution tanks, a micro etching chemical solution tank, a water washing chemical solution tank, and the like.
Referring to fig. 1, the gantry 200 includes a support frame 210 and a suspension member 220, the suspension member 220 is mounted on the support frame 210, and the suspension member 220 is used for driving the basket assembly 300 to move, so that the basket assembly 300 can be immersed and suspended in each of the chemical solution tanks, thereby implementing the whole electroplating process for the circuit board.
In one embodiment, the supporting frame is provided with a sliding rail assembly, and the hanging member is slidably disposed on the sliding rail assembly, so that the hanging basket assembly 300 can pass through the liquid medicine tanks in sequence more smoothly and flexibly.
Referring to fig. 1, the basket assembly 300 includes a mother basket hanger 310 and a plurality of board-carrying sub baskets 320, the mother basket hanger 310 is disposed on the suspension member 220, the suspension member 220 is used for driving the mother basket hanger 310 to move towards or away from the liquid medicine tank 100, the board-carrying sub baskets 320 are respectively disposed on the mother basket hanger 310, and the board-carrying sub baskets 320 are used for containing circuit boards, so that when the suspension member 220 drives the mother basket hanger 310 to ascend or descend, the circuit boards disposed on the board-carrying sub baskets 320 can be immersed in and suspended from the liquid medicine tank.
Referring to fig. 1, the air knife spoiler assembly 400 includes an air knife plate 410, a blower pipe 420, a beam shaft 430, and a plurality of spoiler blades 440, the air knife plate 410 is mounted on the suspension member 220, referring to fig. 2, an air cavity 411 is formed in the air knife plate 410, an air inlet 412 is formed in the air knife plate 410, the air inlet 412 is respectively communicated with the air cavity 411 and the blower pipe 420, an air blowing elongated slot 413 is further formed in the air knife plate 410, the air blowing elongated slot 413 is communicated with the air cavity 411, specifically, the blower pipe 420 is connected to an air blowing device, the air blowing device is used for blowing air into the blower pipe 420, the air blowing pipe 420 blows air into the air cavity 411 in the air knife plate 410 through the air inlet 412, the high-pressure air flow entering the air cavity 411 will be blown out through the air blowing elongated slot 413 communicated with the air cavity 411, specifically, an air outlet width of the air blowing elongated slot 413 is 0.05cm to 0.1cm, and the width is consistent along the length direction of the air blowing long groove 413, so that the air flow blown out from the air blowing long groove 413 is stronger and more uniform, and the air flow is more reasonably processed because the air blowing long groove 413 is provided with a narrow air opening, so that the tank liquid adhered to the surface of the circuit board can be more effectively blown off.
Referring to fig. 1, the beam shaft 430 is installed on the cradle hanger 310, the spoiler blades 440 are sequentially and rotatably installed on the beam shaft 430, the air blowing elongated slot 413 is used for blowing the blown air flow to the beam shaft to respectively drive the spoiler blades 440 to rotate, so as to form spoiler air flow to blow to the cradle baskets, thus, when the air flow blown out by the air blowing elongated slot 413 passes through the spoiler blades 440, the spoiler blades 440 rotate relative to the beam shaft 430, so that the air flow treatment in the linear direction blown out by the air blowing elongated slot 413 can be converted into spoiler air flow, compared with the air flow in the linear direction, the spoiler air flow has the characteristics of complicated air flow direction and non-uniform turbulent air flow such as air speed, and the plurality of circuit boards on the cradle assembly 300 can not shake on the crane, that is, i.e., the gantry 200, and the residual adhesive bath solution on the surface of the circuit board can be effectively blown off by combining air flow blowing and liquid throwing shaking to a certain degree.
It should be noted that, because each the vortex flabellum 440 rotates in proper order and sets up in on the crossbeam axle 430, in order to ensure each the vortex flabellum 440 is when rotating, every adjacent two influence pivoted problems such as mutual collision can not produce between the vortex flabellum 440, in one embodiment, wind sword vortex subassembly includes a plurality of spacer bushes, each the spacer bush is used for fixed cover respectively and puts on the crossbeam axle, and each the spacer bush corresponds and is located adjacent two between the vortex flabellum, so, through setting up the spacer bush, adjacent two the vortex flabellum can be by the spacer bush is isolated, in order to ensure each the vortex flabellum 440 is when rotating, every adjacent two influence pivoted problems such as mutual collision can not produce between the vortex flabellum 440, and then produce more stable vortex air current. Further, the vortex flabellum includes and rotates cover and a plurality of distortion blade, it puts to rotate the rotatory cover of cover the crossbeam off-axis, each distortion blade is radial fixed mounting in rotate the cover, so, can produce more stable vortex air current.
In order to cooperate with turbulent air flow to further enhance the shaking degree of the circuit board, so as to improve the efficiency of blowing off tank liquid adhered on the surface of the circuit board and better protect the circuit board, in one embodiment, the plate-carrying sub-basket comprises a hollowed-out basket body and a plurality of blocking pieces, the blocking pieces are sequentially arranged on the hollowed-out basket body at intervals, and a circuit board placing area is correspondingly formed between every two adjacent blocking pieces, so that the circuit board placing area has a looser shaking space, and the shaking degree of the circuit board can be further enhanced by cooperating with turbulent air flow; furthermore, a plurality of accommodating partitions are arranged in the main basket frame, and the carrier plate sub-baskets are correspondingly arranged on the accommodating partitions one by one, so that more circuit boards can be arranged in a unit space, and the residual tank liquor removing operation of the circuit boards cannot be influenced; furthermore, the blocking part comprises a supporting inner core and a coating soft sleeve, the supporting inner core is fixedly arranged on the hollowed-out basket body, the coating soft sleeve is coated outside the supporting inner core, and when the circuit board shakes and contacts with the coating soft sleeve, the coating soft sleeve can better protect the circuit board, so that the shaking degree of the circuit board can be further enhanced by matching with turbulent air flow, the efficiency of blowing off groove liquid adhered to the surface of the circuit board is improved, and the circuit board can be better protected.
In one embodiment, the primary basket hanger comprises a primary basket frame and at least two pull rods, one end of each rail is fixed to the primary basket frame, and the other end of each rail is connected with the suspension piece, so that blocking of turbulent airflow by the primary basket hanger can be further reduced, the turbulent airflow can be better enabled to act on residual tank liquid on the circuit board, and the effect of eliminating the residual tank liquid is achieved.
In one embodiment, the air knife spoiler assembly further includes a linear air direction air outlet knife, the linear air direction air outlet knife is mounted on the suspension member, an air outlet long groove is formed in the linear air direction air outlet knife, and air flow blown out of the air outlet long groove is used for being arranged away from the cross beam shaft.
In order to inhibit the volatilization degree of residual bath solution, reduce the content of harmful substances in the air of an electroplating operation area better and dry a circuit board quickly, in one embodiment, the gantry line for electroplating the circuit board further comprises a cooler, a first air blowing device, a heater and a second air blowing device, wherein the two blast pipes comprise a cold air blast pipe and a hot air blast pipe, the air knife board is provided with two air inlets, the two air inlets comprise a cold air inlet and a hot air inlet, the first air blowing device is communicated with the cooler, the cold air blast pipe is respectively communicated with the cooler and the cold air inlet, the first air blowing device is used for blowing fresh air into the cold area device, and the fresh air enters the air cavity of the air knife board through the cold air blast pipe and the cold air inlet in sequence after being cooled by the cold area device, and finally, blowing turbulent cold air out of the air blowing long groove, for example, the temperature of the turbulent cold air is 10-15 ℃, so that the lower turbulent cold air can inhibit the volatilization degree of residual bath solution, and the content of harmful substances in the air of the electroplating operation area can be better reduced. It can be understood that when the disturbed flow cold air is adopted to remove the residual tank liquid on the circuit board to a certain degree, namely the residual tank liquid on the circuit board is less, for example, the disturbed flow cold air is blown to the circuit board for 15 seconds to 100 seconds, and then the cold air blowing pipe is closed; the second air blowing device is communicated with the heater, the hot air blast pipe is respectively communicated with the heater and the hot air inlet, the second air blowing device is used for blowing fresh air into the heater, the fresh air is cooled by the heater, then the hot air enters the air cavity of the air knife plate through the hot air blast pipe and the hot air inlet in sequence, finally turbulent hot air is blown out through the air blast elongated slot, and the special description is that, before blowing hot air, the cold air blast pipe needs to be closed, and as the residual tank liquor on the circuit board is little remained, at the moment, turbulent hot air is blown in, the circuit board can be dried rapidly, and the harmful substance content in the air volatilized to the electroplating operation area is less, namely, the circuit board is sequentially acted by the cold air flow and the hot air flow, but the cold air flow and the hot air flow are not simultaneously acted on the circuit board.
The scheme also provides a circuit board electroplating method, which is implemented by adopting the gantry line for circuit board electroplating as described in any one of the above, the gantry line for circuit board electroplating can accelerate the backflow dripping of residual tank liquor on the surface of the circuit board into the liquor tank, and on the other hand, compared with the linear flowing air flow, the turbulent air flow has the characteristic that the flow inside the air flow is complex and the air speed is uneven, and disordered air flow is generated, so that a plurality of circuit boards on the hanging basket component can not shake on a crane, namely the gantry frame, to a certain extent, and thus, the residual adhesive tank liquor on the surface of the circuit board can be more effectively blown off by combining turbulent air flow blowing and shaking liquid throwing.
Compared with the prior art, the gantry line for electroplating the circuit board at least has the following advantages:
the gantry line 10 for electroplating the circuit board is provided with a liquid medicine tank 100, a gantry frame 200, a hanging basket assembly 300 and an air knife turbulent flow assembly 400, when the basket assembly 300 is lifted away from the chemical solution tank 100 by the gantry 200, turbulent air flows are blown to a plurality of circuit boards placed on the basket assembly 300 by the air knife turbulent flow assembly 400 and blown to the circuit boards, on one hand, by blowing air flows to the surfaces of the circuit boards, can accelerate the tank liquor remained on the surface of the circuit board to flow back and drip into the liquid medicine tank, on the other hand, compared with the air flow in the linear flow direction, the turbulent air flow has the characteristics of disordered air flow such as complex air flow direction and uneven air speed in the air flow, the circuit boards on the basket assembly 300 can be enabled to swing to a certain degree under the condition that the crane, namely the portal frame 200 does not swing, thus, the residual adhesive bath solution on the surface of the circuit board can be more effectively blown off by combining air flow blowing and shaking liquid throwing.
In order to further explain the technical idea of the gantry line for electroplating the circuit board, the present disclosure further provides a method for reducing and taking out gantry line tank liquid in electroplating the circuit board, in an embodiment, please refer to fig. 3, which is a flow chart of steps of the method for reducing and taking out gantry line tank liquid in electroplating the circuit board in an embodiment, and the method for reducing and taking out gantry line tank liquid in electroplating the circuit board includes the following steps:
s110: and placing the circuit board into a liquid medicine tank for immersion electroplating operation.
In one embodiment, the chemical solution tanks are multiple, and specifically include a copper deposition chemical solution tank, a microetching chemical solution tank, a water washing chemical solution tank, and the like, and of course, in the whole electroplating production line, the number of the copper deposition chemical solution tanks, the number of the microetching chemical solution tanks, the number of the water washing chemical solution tanks, and the sequence of the different chemical solution tanks can be flexibly selected and set according to the actual situation; the immersion plating operation may specifically include a circuit board copper deposition operation, a circuit board microetching operation, and a circuit board washing operation.
S120: and lifting the circuit board away from the liquid medicine groove, and adjusting the distance between the circuit board and the liquid level of the liquid medicine groove to be a preset liquid return distance.
Through hanging the circuit board from the liquid medicine groove, can make the circuit board unsettled, even make the circuit board with the tank liquor in the liquid medicine groove separates, does benefit to subsequent remaining tank liquor and eliminates the operation.
It can be understood that when the operation is blown away to the last adhered residual tank liquor of circuit board, through adjusting the circuit board with distance between the liquid level in liquid medicine groove is the predetermined liquid distance of returning, can avoid cold wind to blow away residual tank liquor when, the liquid drop of tank liquor excessively sputter to the liquid medicine groove outside to ensure that the liquid drop of tank liquor can flow back as early as possible to inside the liquid medicine groove. In one embodiment, the preset liquid return distance is 0.1-2 m, so that excessive splashing of liquid drops of the bath solution to the outside of the liquid medicine tank can be avoided when cold air blows away residual bath solution, and the liquid drops of the bath solution can be enabled to flow back to the inside of the liquid medicine tank as soon as possible.
S130: blowing cold air to the circuit board to blow off the residual tank liquor adhered to the circuit board so as to enable the residual tank liquor to flow back to the liquid medicine tank.
Compare in the circuit board at room temperature or just at the beginning to the circuit board drum out hot-blast, can cause the degree of volatilization of circuit board surface residual bath great, and then make the harmful substance who remains the bath volatilization production lose to electroplating operation regional air in, and through to the circuit board drum out cold wind, the temperature of cold wind is lower, can restrain effectively the degree of volatilization of residual bath, and then can reduce the harmful substance content in the electroplating operation regional air better.
In order to make polylith on the hanging flower basket subassembly the circuit board just also is the condition that the portal frame does not rock, produces rocking of certain degree, so, combine cold wind to blow and rock and get rid of the liquid and can blow off the remaining adhesion tank liquor on circuit board surface more effectively, in one of them embodiment, to in the operation of circuit board drum-out cold wind, still will cold wind is handled and is turned into the vortex cold wind, compares in the cold wind of linear type flow direction, and the vortex cold wind has the inside complicated and unordered air current's such as air current flow direction is uneven characteristics of wind speed of air current, can make polylith on the hanging flower basket subassembly the circuit board is the condition that the portal frame does not rock in the crane just, produces rocking of certain degree, so, combines cold wind to blow and rocks and can blow off the remaining adhesion tank liquor on circuit board surface more effectively with the liquid of getting rid of.
In one embodiment, the blowing operation of blowing cold air to the circuit board to blow off residual bath solution adhered to the circuit board specifically includes the following steps: separating a plurality of circuit boards in advance to ensure that a gap is reserved between every two adjacent circuit boards; will cold wind changes the vortex cold wind into, and makes the vortex cold wind is to the polylith the circuit board is bloated, with to the polylith the operation of blowing away is gone up to the remaining tank liquor of adhesion on the circuit board, so, can make the cold wind of blowing more comprehensively blow the surface of circuit board, in order to take away more rapidly the tank liquor of remaining of adhesion on the circuit board, simultaneously, because each has the clearance between the circuit board, when the vortex cold wind blows during the circuit board, can make the circuit board produces more violent rocking, in order to further improve the getting rid of operation of tank liquor is remained to the circuit board.
S140: and lifting the circuit board, and adjusting the distance between the circuit board and the liquid level of the pharmaceutical tank to be a preset drying distance, wherein the preset drying distance is greater than the preset liquid return distance.
S150: and blowing hot air to the circuit board to dry the circuit board.
It should be noted that after blowing cold air to the circuit board and completing the operation of blowing away the residual tank liquid of the circuit board by cold air, the residual tank liquid on the circuit board is little, and the residual tank liquid on the circuit board is difficult to be completely removed by cold air or shaking, and the time spent for blowing away is long, through step S150, hot air is blown to the circuit board to dry the circuit board, and the distance between the circuit board and the liquid level of the pharmaceutical tank is adjusted to be a preset drying distance, which is greater than the preset liquid return distance, so that the hot air blown out to the circuit board is away from the liquid medicine in the pharmaceutical tank, and is concentrated on drying the residual tank liquid on the circuit board, thereby the tank liquid adhered to the circuit board can be removed more cleanly when the circuit board is transported between the adjacent pharmaceutical tanks, and the volatilization degree of the bath solution can be reduced, and the content of harmful substances in the air of the electroplating operation area can be better reduced. In other words, even if the residual bath solution is volatilized to the air of the electroplating operation area, the residual bath solution is still within an acceptable range, namely, the circuit board is subjected to the actions of cold air flow and hot air flow in sequence, so that the blowing-off efficiency of the residual bath solution is considered, and the problem of environmental protection is solved well.
In one embodiment, the temperature of the cold air is 10-15 ℃, so that the volatilization degree of the bath solution can be reduced, and the content of harmful substances in the air of the electroplating operation area can be better reduced; furthermore, the temperature of the hot air is 30-60 ℃, and the residual bath solution on the circuit board can be dried rapidly without affecting the performance of the circuit board; further, the preset liquid return distance is 0.1-2 m, so that liquid drops of the bath solution are prevented from being excessively sputtered to the outside of the liquid medicine groove when cold air blows away residual bath solution, and the liquid drops of the bath solution can be enabled to flow back to the inside of the liquid medicine groove as soon as possible; furthermore, the preset drying distance is 2.5-5 meters, so that hot air blown out of the circuit board is far away from the liquid medicine in the liquid medicine groove and is absorbed in drying residual liquid medicine on the circuit board, and therefore when the circuit board is transported between adjacent liquid medicine grooves, the liquid medicine adhered to the circuit board can be removed more cleanly, the volatilization degree of the liquid medicine can be reduced, and the content of harmful substances in the air of an electroplating operation area can be reduced better; furthermore, the duration of blowing cold air to the circuit board is 30 seconds to 100 seconds, for example, corresponding cold air blowing duration is established for different liquid medicine tanks, the circuit board from the copper deposition liquid medicine tank is 95 seconds, the microetching liquid medicine tank is 45 seconds, and the water washing liquid medicine tank is 30 seconds, so that residual tank liquid can be blown off from different liquid medicine tanks more pertinently; furthermore, the duration of hot air blowing to the circuit board is 5 seconds-10 seconds, corresponding hot air blowing duration is established for different liquid medicine tanks, the circuit board that the heavy copper liquid medicine tank came out is 10 seconds, the microetching liquid medicine tank is 8 seconds, and the washing liquid medicine tank is 5 seconds, so, can carry out the operation of remaining tank liquid stoving to different liquid medicine tanks more pertinence.
Compared with the prior art, the invention has at least the following advantages:
according to the method for reducing and taking out the gantry line tank liquid in the circuit board electroplating process, the cold air is blown firstly and then the hot air is blown out in an auxiliary air flow mode, so that the tank liquid adhered to the circuit board can be removed more cleanly when the circuit board is transported between adjacent liquid medicine tanks, the volatilization degree of the tank liquid can be reduced, and the content of harmful substances in the air of an electroplating operation area can be reduced better.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. A method for reducing and bringing out gantry line tank liquid in circuit board electroplating is carried out by adopting a gantry line for circuit board electroplating, and is characterized by comprising the following steps:
placing the circuit board into a liquid medicine tank, and performing immersion electroplating operation;
lifting the circuit board away from the liquid medicine groove, and adjusting the distance between the circuit board and the liquid level of the liquid medicine groove to be a preset liquid return distance;
blowing cold air to the circuit board to blow off residual tank liquor adhered to the circuit board so as to enable the residual tank liquor to flow back to the liquid medicine tank;
lifting the circuit board, and adjusting the distance between the circuit board and the liquid level of the liquid medicine tank to be a preset drying distance, wherein the preset drying distance is larger than the preset liquid return distance;
blowing hot air to the circuit board to dry the circuit board;
wherein, circuit board is electroplated and is used longmen line includes:
a liquid medicine groove is arranged on the upper part of the medicine liquid groove,
the gantry comprises a support frame and a suspension piece, and the suspension piece is arranged on the support frame;
the hanging basket assembly comprises a mother basket hanging tool and a plurality of board carrying sub-baskets, the mother basket hanging tool is arranged on the suspension part, the suspension part is used for driving the mother basket hanging tool to move towards a direction close to or far away from the liquid medicine groove, the board carrying sub-baskets are respectively placed on the mother basket hanging tool, and the board carrying sub-baskets are used for containing circuit boards;
the air knife turbulence assembly comprises an air knife plate, an air blowing pipe, a cross beam shaft and a plurality of turbulence fan blades, the air knife plate is installed on the suspension part, an air cavity is formed in the air knife plate, an air inlet is formed in the air knife plate and is respectively communicated with the air cavity and the air blowing pipe, an air blowing long groove is further formed in the air knife plate and is communicated with the air cavity, the cross beam shaft is installed on the female basket hanger, the turbulence fan blades are sequentially and rotatably arranged on the cross beam shaft, and the air blowing long groove is used for blowing blown air flow to the cross beam shaft so as to respectively drive the turbulence fan blades to rotate and further form turbulent air flow blowing to the carrier plate sub-baskets;
the plate-carrying sub-basket comprises a hollow basket body and a plurality of blocking parts, wherein the blocking parts are sequentially arranged on the hollow basket body at intervals, a circuit board placing area is correspondingly formed between every two adjacent blocking parts, each blocking part comprises a supporting inner core and a covering soft sleeve, the supporting inner core is fixedly arranged on the hollow basket body, the covering soft sleeve covers the supporting inner core, and when a circuit board shakes and contacts with the covering soft sleeve, the covering soft sleeve can better protect the circuit board.
2. The method for reducing the carry-over of the gantry line tank liquid in the electroplating of the circuit board according to claim 1, wherein the temperature of the cold air is 10-15 ℃.
3. The method for reducing the carry-over of the gantry line tank liquid in the electroplating of the circuit board according to claim 1, wherein the temperature of the hot air is 30-60 ℃.
4. The method for reducing the carry-over of the gantry line bath solution in the electroplating of the circuit board according to claim 1, wherein cold air is blown to the circuit board to blow off residual bath solution adhered to the circuit board, and the method comprises the following steps:
separating a plurality of circuit boards in advance to ensure that a gap is reserved between every two adjacent circuit boards;
will cold wind turns into vortex cold wind to make vortex cold wind to the polylith the circuit board is bloated, with to the polylith the operation is blown away to the residual tank liquor of adhesion on the circuit board.
5. The method for reducing the carry-over of the gantry line tank solution in the electroplating of the circuit board according to claim 1, wherein the preset liquid return distance is 0.1-2 m.
6. The method for reducing the carry-over of the gantry line tank solution in the electroplating of the circuit board according to claim 5, wherein the preset drying distance is 2.5-5 m.
7. The method for reducing carry-over of gantry line bath solution in circuit board electroplating according to claim 1, wherein the duration of blowing cold air to the circuit board is 15 seconds to 100 seconds.
8. The method for reducing carry-over of gantry line bath solution in circuit board electroplating according to claim 7, wherein the duration of hot air blowing to the circuit board is 5 seconds to 10 seconds.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011407041.4A CN112680759B (en) | 2020-12-04 | 2020-12-04 | Method for reducing carrying-out of gantry line tank liquid in circuit board electroplating |
| PCT/CN2021/084939 WO2022116454A1 (en) | 2020-12-04 | 2021-04-01 | Method for reducing discharge of gantry line tank liquid in circuit board electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011407041.4A CN112680759B (en) | 2020-12-04 | 2020-12-04 | Method for reducing carrying-out of gantry line tank liquid in circuit board electroplating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112680759A CN112680759A (en) | 2021-04-20 |
| CN112680759B true CN112680759B (en) | 2021-12-28 |
Family
ID=75445997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011407041.4A Active CN112680759B (en) | 2020-12-04 | 2020-12-04 | Method for reducing carrying-out of gantry line tank liquid in circuit board electroplating |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112680759B (en) |
| WO (1) | WO2022116454A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113668037A (en) * | 2021-08-25 | 2021-11-19 | 惠州市特创电子科技股份有限公司 | Spraying device for reducing liquid in circuit board processing gantry line tank and bringing out |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1070927A2 (en) * | 1999-07-22 | 2001-01-24 | Systronic Maschinenbau GmbH | Continuous dryer for plates or webs |
| CN202022991U (en) * | 2011-02-16 | 2011-11-02 | 昆山市苏元电子有限公司 | Copper sinking basket with clamping strips |
| CN205393103U (en) * | 2016-03-16 | 2016-07-27 | 东莞市晋拓自动化科技有限公司 | Novel small -size clean air knife |
| CN207869516U (en) * | 2017-12-29 | 2018-09-14 | 广州兴森快捷电路科技有限公司 | Tooling for loading wiring board |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2951581B2 (en) * | 1995-11-08 | 1999-09-20 | ハヤマ工業株式会社 | Equipment for drying plating objects |
| US6760981B2 (en) * | 2002-01-18 | 2004-07-13 | Speedline Technologies, Inc. | Compact convection drying chamber for drying printed circuit boards and other electronic assemblies by enhanced evaporation |
| CN100552352C (en) * | 2006-09-12 | 2009-10-21 | 健鼎科技股份有限公司 | Circuit base plate drying device |
| CN204187951U (en) * | 2014-10-14 | 2015-03-04 | 苏州慧杰贸易有限公司 | The vertical drying unit of electroplating device |
| CN108149309A (en) * | 2017-12-26 | 2018-06-12 | 宁波江北清锐汽车零部件有限公司 | A kind of electroplanting device with drying functions |
| CN210886298U (en) * | 2019-11-22 | 2020-06-30 | 湖州努特表面处理科技有限公司 | Electroplating production line |
| CN211036152U (en) * | 2019-12-10 | 2020-07-17 | 深圳生溢快捷电路有限公司 | PCB board is electroplated and is used drying device |
| CN111575771A (en) * | 2020-05-22 | 2020-08-25 | 十堰协同工贸有限公司 | A high-efficient electroplating device for metal surface treatment |
-
2020
- 2020-12-04 CN CN202011407041.4A patent/CN112680759B/en active Active
-
2021
- 2021-04-01 WO PCT/CN2021/084939 patent/WO2022116454A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1070927A2 (en) * | 1999-07-22 | 2001-01-24 | Systronic Maschinenbau GmbH | Continuous dryer for plates or webs |
| CN202022991U (en) * | 2011-02-16 | 2011-11-02 | 昆山市苏元电子有限公司 | Copper sinking basket with clamping strips |
| CN205393103U (en) * | 2016-03-16 | 2016-07-27 | 东莞市晋拓自动化科技有限公司 | Novel small -size clean air knife |
| CN207869516U (en) * | 2017-12-29 | 2018-09-14 | 广州兴森快捷电路科技有限公司 | Tooling for loading wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112680759A (en) | 2021-04-20 |
| WO2022116454A1 (en) | 2022-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2162569B1 (en) | Vertical system for the plating treatment of a work piece and method for conveying the work piece | |
| CN112680759B (en) | Method for reducing carrying-out of gantry line tank liquid in circuit board electroplating | |
| TW201331412A (en) | Electroless plating apparatus and electroless plating method | |
| CN112553677B (en) | Gantry line for electroplating circuit board and circuit board electroplating method | |
| CN110139949A (en) | The electroplanting device of small parts | |
| CN206359646U (en) | Electroplating device with automatic stripping and hanging system | |
| US3753762A (en) | Method of galvanizing | |
| US3699918A (en) | Galvanizing apparatus | |
| JP2011032538A (en) | Electroless plating method | |
| JP2773102B2 (en) | Rotating barrel device for plating and its use | |
| JPH11229198A (en) | Plating apparatus for printed wiring board | |
| CN207839610U (en) | A kind of adjustable melt material cleaning device | |
| CN210569791U (en) | Drying-machine for electroplated metal | |
| TW202243561A (en) | Electroless nickel immersion gold manufacturing method and system capable of reducing chemical processing steps capable of reducing the consumption of cleaning water and various chemicals and reducing expenditure costs | |
| CN101570878A (en) | Electroplating bath for integrated circuit silicon chip and electroplating method thereof | |
| TWI732109B (en) | Plating method | |
| JPH07316827A (en) | Electroless plating method and device therefor | |
| JP2004339590A (en) | Surface treatment device | |
| CN220697665U (en) | Cleaning device for electronic electroplating equipment | |
| JPH09195092A (en) | Continuous electrolytic device | |
| JPH05106072A (en) | Carrier bar washing device | |
| CN214088670U (en) | Rotor core belt cleaning device | |
| CN220812574U (en) | Copper wire stay wire annealing device | |
| CN218321569U (en) | Pretreatment device before hot galvanizing | |
| CN211546706U (en) | PCB board plating line |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |