CN112635427A - Support capable of packaging flip IC chip and electronic component - Google Patents
Support capable of packaging flip IC chip and electronic component Download PDFInfo
- Publication number
- CN112635427A CN112635427A CN202011595197.XA CN202011595197A CN112635427A CN 112635427 A CN112635427 A CN 112635427A CN 202011595197 A CN202011595197 A CN 202011595197A CN 112635427 A CN112635427 A CN 112635427A
- Authority
- CN
- China
- Prior art keywords
- pad
- bonding pad
- front bonding
- chip
- bowl cup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 8
- 238000009413 insulation Methods 0.000 claims abstract description 7
- 239000007769 metal material Substances 0.000 claims abstract description 4
- 239000004593 Epoxy Substances 0.000 claims description 6
- 239000005022 packaging material Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 101100327917 Caenorhabditis elegans chup-1 gene Proteins 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H01L33/48—
-
- H01L33/62—
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses a bracket and an electronic component capable of packaging a flip IC chip, comprising: the bowl cup of metal material, the one side of bowl cup is provided with positive pad and positive insulating region, and positive pad includes: a first front bonding pad, a second front bonding pad, a third front bonding pad and a fourth front bonding pad; the another side of bowl cup is provided with back pad and back insulating area, and the back pad includes: a first back side pad, a second back side pad, a third back side pad, and a fourth back side pad; the first front bonding pad, the second front bonding pad, the third front bonding pad and the fourth front bonding pad are respectively positioned at four corners of the bowl cup, and the front insulation area is arranged between the adjacent front bonding pads; the first back pad, the second back pad, the third back pad and the fourth back pad are respectively positioned at four corners of the bowl cup, and the back insulation area is arranged between the adjacent back pads. The invention is suitable for flip IC chips, and avoids using a normal IC chip.
Description
Technical Field
The invention belongs to the technical field of semiconductors, and particularly relates to a support capable of packaging a flip IC chip and an electronic component.
Background
The LED built-in IC chip is convenient for downstream application and simplifies circuit design, which is a development trend of the current LED design.
Disclosure of Invention
In order to overcome the technical defects, the invention provides a bracket capable of packaging a flip-chip IC chip and an electronic component, which can realize the packaging of the flip-chip IC chip.
In order to solve the problems, the invention is realized according to the following technical scheme:
a carrier that can package a flip-chip IC, comprising: the bowl cup of metal material, the one side of bowl cup is provided with positive pad and positive insulating area, positive pad includes: a first front bonding pad, a second front bonding pad, a third front bonding pad and a fourth front bonding pad;
the another side of bowl cup is provided with back pad and back insulating area, the back pad includes: a first back side pad, a second back side pad, a third back side pad, and a fourth back side pad;
the first front bonding pad, the second front bonding pad, the third front bonding pad and the fourth front bonding pad are respectively positioned at four corners of the bowl cup, and the front insulation area is arranged between the adjacent front bonding pads so as to separate the first front bonding pad, the second front bonding pad, the third front bonding pad and the fourth front bonding pad;
the first back pad, the second back pad, the third back pad, the fourth back pad are located respectively four corners of the bowl cup, the back insulation area is arranged between the adjacent back pads, so that the first back pad, the second back pad, the third back pad and the fourth back pad are separated.
As a further improvement of the present invention, the front side pad further includes: the fifth front bonding pad is located beside the first front bonding pad and the second front bonding pad, the front insulating area is arranged between the first front bonding pad and the second front bonding pad, and the fifth front bonding pad is separated from the first front bonding pad and the second front bonding pad.
As a further improvement of the present invention, the front side pad further includes: and the front insulating area is arranged between the fifth front bonding pad and the sixth front bonding pad, and the fifth front bonding pad is separated from the sixth front bonding pad.
As a further improvement of the present invention, the front side pad further includes: and the front insulating region is positioned between the sixth front bonding pad and the seventh front bonding pad, and separates the sixth front bonding pad from the seventh front bonding pad.
As a further improvement of the present invention, the front side insulating region is made of epoxy plastic packaging material, and the back side insulating region is made of epoxy plastic packaging material.
As a further improvement of the invention, the depth of the bowl cup is more than 0.3 mm.
As a further improvement of the invention, the height of the bowl cup is higher than that of the front bonding pad.
In addition, the present invention provides an electronic component, including the cradle according to any one of claims 1 to 6, further including: and the IC chip, the red chip, the green chip and the blue chip are connected with the front bonding pad.
As a further improvement of the invention, the connection mode of the negative electrode of the red light chip, the negative electrode of the green light chip and the negative electrode of the blue light chip and the front bonding pad is gold wire or silver glue bonding.
As a further improvement of the invention, the connection mode of the anode of the red light chip, the anode of the green light chip, the anode of the blue light chip and the front bonding pad is gold bonding wire.
Compared with the prior art, the invention has the following beneficial effects: front pads and back pads are respectively arranged on two different surfaces of the bowl cup, and the bowl cup is made of metal, so that the front pads and the back pads on the two different surfaces are mutually conducted, the bowl cup is suitable for an inverted IC chip, and the use of a front IC chip is avoided, so that the routing of an electronic element device is reduced, the whole manufacturing process is simpler, and the probability of manufacturing failure is reduced.
Drawings
Embodiments of the invention are described in further detail below with reference to the attached drawing figures, wherein:
FIG. 1 is a schematic front view of a bracket according to an embodiment;
FIG. 2 is a schematic rear view of the bracket according to the second embodiment;
fig. 3 is a schematic diagram of the electronic component according to the third embodiment.
Description of the labeling: 1. a bowl cup; 2. a front side pad; 21. a first front side pad; 22. a second front side pad; 23. a third front side pad; 24. a fourth front side pad; 25. a fifth front side pad; 26. a sixth front side pad; 3. a front side insulating region; 4. a back side pad; 41. a first backside pad; 42. a second backside pad; 43. a third backside pad; 44. a fourth backside pad; 5. a back side insulating region; 6. an IC chip; 7. a red light chip; 8. a green chip; 9. blue light chip.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Example one
The embodiment provides a support capable of packaging a flip-chip IC, comprising: bowl cup 1 of metal material, the one side of bowl cup 1 is provided with positive pad 2 and positive insulating zone 3, and positive pad 2 is used for welding the chip, and positive insulating zone 3 makes each other do not switch on between the pin of chip, and positive pad 2 includes: first front surface pads 21, second front surface pads 22, third front surface pads 23, and fourth front surface pads 24; the another side of bowl cup 1 is provided with back pad 4 and back insulating region 5, and back pad 4 is used for connecting external power source and signal source, and back insulating region 5 is used for insulating external power source and signal source, and back pad 4 includes: first, second, third, and fourth backside pads 41, 42, 43, and 44; the first front bonding pad 21, the second front bonding pad 22, the third front bonding pad 23 and the fourth front bonding pad 24 are respectively positioned at four corners of the bowl cup 1, and the front insulation area 3 is arranged between the adjacent front bonding pads 2 so as to separate the first front bonding pad 21, the second front bonding pad 22, the third front bonding pad 23 and the fourth front bonding pad 24; the first back surface pad 41, the second back surface pad 42, the third back surface pad 43, and the fourth back surface pad 44 are located at the four corners of the bowl 1, respectively, and the back surface insulating region 5 is provided between the adjacent back surface pads 4 to separate the first back surface pad 41, the second back surface pad 42, the third back surface pad 43, and the fourth back surface pad 44.
Specifically, the height of the front insulating region 3 is flush with the height of the front pad 2, the height of the back insulating region 5 is flush with the height of the back pad 4, the front insulating region is used for placing packaging glue, and the depth of the bowl cup 1 is larger than 0.3 mm.
In this embodiment, the first front pad 21 and the first back pad 41, the second front pad 22 and the second back pad 42, the third front pad 23 and the third back pad 43, and the fourth front pad 24 and the fourth back pad 44 are in one-to-one correspondence with each other on the bowl 1, the first front pad 21 and the second front pad 22 correspond to the VDD front pad and the VSS front pad respectively, the third front pad 23 and the fourth front pad 24 correspond to the DI front pad and the DO front pad respectively, the first back pad 41 and the second back pad 42 correspond to the VDD back pad and the VSS back pad respectively, the third back pad 43 and the fourth back pad 44 correspond to the DI back pad and the DO back pad respectively, because the VDD pad, the VSS pad, the DI pad and the DO pad are located on two different sides of the same metal bowl 1 respectively and are connected with each other, so as to reduce wire bonding between components, and convenience is provided for the manufacture of subsequent electronic components.
In the above embodiment, the front surface pad 2 further includes: and a fifth front surface pad 25 located beside the first front surface pad 21 and the second front surface pad 22, the front surface insulating region 3 being provided between the first front surface pad 21, the second front surface pad 22, and the fifth front surface pad 25, separating the fifth front surface pad 25 from the first front surface pad 21 and the second front surface pad 22.
In the above embodiment, the front surface pad 2 further includes: and a sixth front surface pad 26 located beside the fifth front surface pad 25, the front surface insulating region 3 being provided between the fifth front surface pad 25 and the sixth front surface pad 26 to separate the fifth front surface pad 25 from the sixth front surface pad 26.
In the above embodiment, the front surface pad 2 further includes: and a seventh front pad 27 located beside one of the sixth front pads 26, the other side of the seventh front pad 27 being the third front pad 23 and the fourth front pad 24, and the front insulating region 3 located between the sixth front pad 26 and the seventh front pad 27 separating the sixth front pad 26 from the seventh front pad 27.
In practical application, the shapes of the front and back pads 2 and 4 can be set according to the size of the chip to be soldered, and the shapes of the front and back insulating regions 3 and 5 should be changed according to the shapes of the front and back pads 2 and 4.
In the above embodiment, the front insulating region 3 is made of epoxy plastic package material, and the back insulating region 5 is made of epoxy plastic package material.
In the above embodiment, the height of the bowl 1 is higher than the height of the front pad 2.
Example two
This embodiment provides an electronic components, including the support of embodiment one, still include: an IC chip 6 connected to the front surface pad 2, a red chip 7, a green chip 8, and a blue chip 9.
Specifically, the red chip 7 is connected to the fifth front pad 25, the green chip 8 is connected to the sixth front pad 26, and the blue chip 9 is connected to the seventh front pad 27.
Furthermore, the connection mode of the negative electrode of the red light chip 7, the negative electrode of the green light chip 8 and the negative electrode of the blue light chip 9 with the front bonding pad 2 is gold wire or silver glue bonding.
Furthermore, the connection mode of the positive electrode of the red light chip 7, the positive electrode of the green light chip 8 and the positive electrode of the blue light chip 9 with the front bonding pad 2 is gold bonding wire.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, so that any modification, equivalent change and modification made to the above embodiment according to the technical spirit of the present invention are within the scope of the technical solution of the present invention.
Claims (10)
1. A carrier capable of encapsulating a flip-chip IC chip, comprising: the bowl cup of metal material, the one side of bowl cup is provided with positive pad and positive insulating area, positive pad includes: a first front bonding pad, a second front bonding pad, a third front bonding pad and a fourth front bonding pad;
the another side of bowl cup is provided with back pad and back insulating area, the back pad includes: a first back side pad, a second back side pad, a third back side pad, and a fourth back side pad;
the first front bonding pad, the second front bonding pad, the third front bonding pad and the fourth front bonding pad are respectively positioned at four corners of the bowl cup, and the front insulation area is arranged between the adjacent front bonding pads so as to separate the first front bonding pad, the second front bonding pad, the third front bonding pad and the fourth front bonding pad;
the first back pad, the second back pad, the third back pad, the fourth back pad are located respectively four corners of the bowl cup, the back insulation area is arranged between the adjacent back pads, so that the first back pad, the second back pad, the third back pad and the fourth back pad are separated.
2. The carrier in accordance with claim 1, wherein said front side pad further comprises: the fifth front bonding pad is located beside the first front bonding pad and the second front bonding pad, the front insulating area is arranged between the first front bonding pad and the second front bonding pad, and the fifth front bonding pad is separated from the first front bonding pad and the second front bonding pad.
3. The carrier in accordance with claim 2, wherein said front side pad further comprises: and the front insulating area is arranged between the fifth front bonding pad and the sixth front bonding pad, and the fifth front bonding pad is separated from the sixth front bonding pad.
4. The carrier in accordance with claim 3, wherein said front side pad further comprises: and the front insulating region is positioned between the sixth front bonding pad and the seventh front bonding pad, and separates the sixth front bonding pad from the seventh front bonding pad.
5. The bracket of claim 1, wherein the front side insulating region is made of epoxy plastic packaging material, and the back side insulating region is made of epoxy plastic packaging material.
6. The rack of claim 1, wherein the depth of the bowl is greater than 0.3 mm.
7. The bracket of claim 1 wherein the height of the bowl is greater than the height of the front pad.
8. An electronic component comprising the cradle of any one of claims 1-6, further comprising: and the IC chip, the red chip, the green chip and the blue chip are connected with the front bonding pad.
9. The electronic component as claimed in claim 8, wherein the negative electrodes of the red light chip, the green light chip and the blue light chip are connected to the front bonding pad by gold wire or silver adhesive bonding.
10. The electronic component according to claim 8, wherein the positive electrode of the red light chip, the positive electrode of the green light chip, the positive electrode of the blue light chip and the front bonding pad are connected by gold bonding wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011595197.XA CN112635427A (en) | 2020-12-29 | 2020-12-29 | Support capable of packaging flip IC chip and electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011595197.XA CN112635427A (en) | 2020-12-29 | 2020-12-29 | Support capable of packaging flip IC chip and electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112635427A true CN112635427A (en) | 2021-04-09 |
Family
ID=75286131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011595197.XA Pending CN112635427A (en) | 2020-12-29 | 2020-12-29 | Support capable of packaging flip IC chip and electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112635427A (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150294959A1 (en) * | 2014-04-10 | 2015-10-15 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Led package structure |
| CN105702831A (en) * | 2016-01-19 | 2016-06-22 | 深圳市华天迈克光电子科技有限公司 | Full-color SMD display screen support and die bonding and wire soldering method thereof |
| CN206451706U (en) * | 2017-01-22 | 2017-08-29 | 广州闻达电子有限公司 | A kind of 9V lamp beads |
| CN108133929A (en) * | 2017-12-19 | 2018-06-08 | 苏州晶台光电有限公司 | A kind of high contrast LED light source encapsulating structure |
| CN207587722U (en) * | 2017-12-14 | 2018-07-06 | 天水华天科技股份有限公司 | A kind of LED display of SMT all-colour LEDs module and its composition |
| CN108598071A (en) * | 2018-06-28 | 2018-09-28 | 山西高科华兴电子科技有限公司 | A kind of three-primary color LED module device of TOP structures and preparation method thereof |
| CN208570653U (en) * | 2018-06-26 | 2019-03-01 | 佛山市国星光电股份有限公司 | A kind of LED display unit group and display panel |
| CN208690286U (en) * | 2018-07-24 | 2019-04-02 | 深圳市源磊科技有限公司 | A kind of lamp bead bracket, LED lamp bead and LED lamp |
| CN209184860U (en) * | 2018-09-28 | 2019-07-30 | 深圳市洲明科技股份有限公司 | PCB substrate, LED integration packaging display module and display device |
| US20190280163A1 (en) * | 2018-02-26 | 2019-09-12 | Shandong Prosperous Star Optoelectronics Co., Ltd. | Rgb-led packaging modules and display screen formed thereof |
| CN214753737U (en) * | 2020-12-29 | 2021-11-16 | 广东晶科电子股份有限公司 | Support capable of packaging flip IC chip and electronic component |
| US20210398954A1 (en) * | 2018-08-10 | 2021-12-23 | Foshan Nationstar Optoelectronics Co., Ltd. | Led display unit group and display panel |
| CN217822776U (en) * | 2022-03-29 | 2022-11-15 | 广东比亚迪节能科技有限公司 | Support for chip packaging and electronic component |
-
2020
- 2020-12-29 CN CN202011595197.XA patent/CN112635427A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150294959A1 (en) * | 2014-04-10 | 2015-10-15 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Led package structure |
| CN105702831A (en) * | 2016-01-19 | 2016-06-22 | 深圳市华天迈克光电子科技有限公司 | Full-color SMD display screen support and die bonding and wire soldering method thereof |
| CN206451706U (en) * | 2017-01-22 | 2017-08-29 | 广州闻达电子有限公司 | A kind of 9V lamp beads |
| CN207587722U (en) * | 2017-12-14 | 2018-07-06 | 天水华天科技股份有限公司 | A kind of LED display of SMT all-colour LEDs module and its composition |
| CN108133929A (en) * | 2017-12-19 | 2018-06-08 | 苏州晶台光电有限公司 | A kind of high contrast LED light source encapsulating structure |
| US20190280163A1 (en) * | 2018-02-26 | 2019-09-12 | Shandong Prosperous Star Optoelectronics Co., Ltd. | Rgb-led packaging modules and display screen formed thereof |
| CN208570653U (en) * | 2018-06-26 | 2019-03-01 | 佛山市国星光电股份有限公司 | A kind of LED display unit group and display panel |
| CN108598071A (en) * | 2018-06-28 | 2018-09-28 | 山西高科华兴电子科技有限公司 | A kind of three-primary color LED module device of TOP structures and preparation method thereof |
| CN208690286U (en) * | 2018-07-24 | 2019-04-02 | 深圳市源磊科技有限公司 | A kind of lamp bead bracket, LED lamp bead and LED lamp |
| US20210398954A1 (en) * | 2018-08-10 | 2021-12-23 | Foshan Nationstar Optoelectronics Co., Ltd. | Led display unit group and display panel |
| CN209184860U (en) * | 2018-09-28 | 2019-07-30 | 深圳市洲明科技股份有限公司 | PCB substrate, LED integration packaging display module and display device |
| CN214753737U (en) * | 2020-12-29 | 2021-11-16 | 广东晶科电子股份有限公司 | Support capable of packaging flip IC chip and electronic component |
| CN217822776U (en) * | 2022-03-29 | 2022-11-15 | 广东比亚迪节能科技有限公司 | Support for chip packaging and electronic component |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6291881B1 (en) | Dual silicon chip package | |
| CN206282838U (en) | The integrated encapsulation structure of passive device and active device | |
| CN214753737U (en) | Support capable of packaging flip IC chip and electronic component | |
| TW200419745A (en) | Multi-chips module and manufacturing method thereof | |
| JP5486807B2 (en) | Stacked integrated circuit chip assembly | |
| KR20050074145A (en) | Multi-chip package | |
| US6849952B2 (en) | Semiconductor device and its manufacturing method | |
| KR20040059746A (en) | Side braze package | |
| CN105374805A (en) | Multi-chip packaging structure | |
| CN112635427A (en) | Support capable of packaging flip IC chip and electronic component | |
| CN118099148A (en) | RGB lamp bead based on separated bracket design and manufacturing method thereof | |
| US20040159929A1 (en) | Semiconductor die package having two die paddles | |
| CN112563233B (en) | Planar packaging part and production method thereof | |
| CN100481407C (en) | Pin ball grid array encapsulation structure of wafer | |
| CN104112811A (en) | LED (light emitting diode) packaging method | |
| JP3183064B2 (en) | Semiconductor device | |
| JP2014187365A (en) | Integrate circuit chip using solar energy as power | |
| TW201830737A (en) | Light-emitting device and manufacturing method of light-emitting device using a conductor line to connect two ohmic contact layers so that a package process required by wire bonding can be eliminated to thus reduce the size of the light-emitting device | |
| CN218996696U (en) | Packaging structure for improving chip pin density | |
| CN206789535U (en) | A kind of fan-out package structure of power electronic devices | |
| US20120056240A1 (en) | Semiconductor device | |
| CN212695150U (en) | LED packaging product | |
| CN215600364U (en) | IC magic color LED lamp bead built in conventional universal support design | |
| CN220895502U (en) | Package structure for fixing chip on lead | |
| CN220086044U (en) | LED package with IC |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |