CN112540227A - FPC bonding resistance testing method - Google Patents

Abstract

The invention discloses a method for testing FPC bonding resistance, which relates to the field of FPC bonding of a silicon-based OLED micro-display device and comprises the following steps: the method comprises the following steps: designing a first short-circuit test PIN group on a pad of a DIE, setting a second open-circuit test PIN group on a pad of an FPC, and manufacturing two test points on the FPC; step two: coating ACF conductive adhesive between the DIE and the FPC, and pre-pressing the DIE and the FPC on a bonding machine; step three: continuously pressing the prepressing area on a binding machine, and heating at constant pressure to press the DIE and the FPC, thereby completing binding; step four: the resistance between the bonded test points is tested on the two test points using a multimeter or test fixture. According to the invention, the resistance value between the bonded test points is tested on the two test points by using the universal meter or the test fixture, FPC observation conductive particles are not required to be torn off, product scrap is reduced, the bonding condition between DIE and FPC can be visually determined, manpower is saved, and cost is saved.

Description

FPC bonding resistance testing method

Technical Field

The invention relates to the field of FPC bonding of a silicon-based OLED (organic light emitting diode) device, in particular to a method for testing FPC bonding resistance.

Background

Along with the blowout type development of the domestic semiconductor industry, the silicon-based OLED (silicon-based OLED micro-display device) is also attracted by market attention along with the development of semiconductors, the silicon-based OLED (silicon-based OLED micro-display device) takes a single crystal silicon chip as a substrate, the pixel size is 1/10 of the traditional display device, and based on the technical advantages and the wide application market, the silicon-based OLED micro-display device is expected to bring a new wave of near-to-eye display in the fields of military affairs and consumer electronics;

1. after the FPC in the industry is bonded by conventional display, the bonding effect and the conduction condition are observed according to the quantity and the shape of the ACF particles after bonding, but the substrate is required to be transparent and visible (the conventional LCD and the OLED are glass substrates, the scheme is adopted), but the silicon substrate is opaque, so that the observation cannot be carried out by a microscope from the back, and the microscope observation is carried out on the front surface of a bonding area after the FPC is torn off;

2. at present, intuitive quantitative measurement cannot be carried out, and the conduction resistance value of the ACF after bonding cannot be judged:

due to the fact that a microscope observes the bonding effect of ACF conductive particles after FPC bonding, the FPC is required to be torn off to observe the conductive particles when the silicon-based product is light-tight, and the conduction resistance after bonding cannot be tested;

therefore, there are the following problems:

a. observing the appearance of the particles and needing to scrap products;

b. the bond resistance cannot be measured directly.

Disclosure of Invention

The invention solves the technical problem of providing the FPC bonding resistance test method which can observe conductive particles without tearing off FPC, reduce product scrap, directly measure bonding resistance and realize quantification and intuition.

The technical scheme adopted by the invention for solving the technical problems is as follows: a FPC bonding resistance testing method comprises the following steps:

the method comprises the following steps: designing a first short-circuit test PIN group on a pad of a DIE, setting a second open-circuit test PIN group on a pad of an FPC, and manufacturing two test points on the FPC;

step two: coating ACF conductive adhesive between the DIE and the FPC, and pre-pressing the DIE and the FPC on a bonding machine;

step three: continuously pressing the prepressing area on a binding machine, and heating at constant pressure to press the DIE and the FPC, thereby completing binding;

step four: the resistance between the bonded test points is tested on the two test points using a multimeter or test fixture.

Further, the method comprises the following steps: and in the second step, a bonding machine is used for smearing ACF conductive adhesive.

The invention has the beneficial effects that: design the first group test PIN of short circuit on DIE's pad, set up the second test group PIN that opens circuit on FPC's pad to make two test points on FPC, use universal meter or test fixture to test the resistance between the test point after bonding on two test points, need not tear FPC and observe conductive particle, it is scrapped to reduce the product, can be very audio-visual confirm the bonding condition between DIE and the FPC, use manpower sparingly, practice thrift the cost.

Drawings

FIG. 1 is a cross-sectional view after DIE and FPC bonding;

FIG. 2 is a schematic diagram of the DIE and FPC after plugging;

labeled as: 1. DIE; 2. FPC; 3. and an ACF conductive adhesive.

Detailed Description

The invention is further described with reference to the following figures and detailed description.

A FPC bonding resistance testing method comprises the following steps:

the method comprises the following steps: designing a first short-circuit test PIN group on a pad of DIE1, arranging a second open-circuit test PIN group on a pad of FPC2, and manufacturing two test points on the FPC; the FPC is a flexible circuit board, and the DIE is a bare chip of a semiconductor chip.

Step two: coating ACF conductive adhesive 3 between DIE1 and FPC2, and pre-pressing DIE1 and FPC2 on a bonding machine;

step three: continuously pressing the pre-pressing area on a bonding machine table, and heating at constant pressure to enable the DIE1 and the FPC2 to be pressed, so that bonding is completed;

step four: testing the resistance value between the bonded test points on the two test points by using a universal meter or a test fixture;

on the basis, the ACF conductive adhesive is coated by using a bonding machine in the second step.

The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (2)

1. A FPC bonding resistance test method is characterized by comprising the following steps: the method comprises the following steps:

the method comprises the following steps: designing a first short-circuit test PIN group on a pad of a DIE (digital independent interface) (1), setting a second open-circuit test PIN group on a pad of an FPC (2), and manufacturing two test points on the FPC;

step two: coating ACF conductive adhesive (3) between the DIE (1) and the FPC (2), and pre-pressing the DIE (1) and the FPC (2) on a bonding machine;

step three: continuously pressing the prepressing area on a binding machine, and heating at constant pressure to press the DIE (1) and the FPC (2) so as to finish binding;

step four: the resistance between the bonded test points is tested on the two test points using a multimeter or test fixture.

2. The FPC bonding resistance test method of claim 1, wherein: and in the second step, a bonding machine is used for smearing ACF conductive adhesive.

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