CN112530850A - Calibration method for station position in process chamber and semiconductor process equipment - Google Patents
Calibration method for station position in process chamber and semiconductor process equipment Download PDFInfo
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
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- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
- H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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Abstract
The embodiment of the application provides a calibration method of station positions in a process chamber and semiconductor process equipment, wherein the method comprises the following steps: placing the calibration piece to a preset position by using a transmission device, and rotating the calibration piece to a preset orientation by using the calibration device, wherein the calibration piece comprises a plurality of openings which are arranged in one-to-one correspondence with a plurality of thimbles on a chuck in a process chamber, and the side wall of each opening is conical and is used for accommodating the thimble; transferring the calibration piece rotated to a preset direction into a process chamber by using a transmission device, enabling the calibration piece to be located above a chuck, lifting a plurality of ejector pins, controlling the transmission device to descend, guiding the ejector pins into the holes respectively, and supporting the calibration piece by the ejector pins; transferring the calibration piece out of the process chamber by using a transfer device, and detecting the offset of the calibration piece in a preset direction relative to a preset position by using a calibration device; and calibrating the current station position based on the offset to obtain the calibrated station position.
Description
Technical Field
The application relates to the field of semiconductor manufacturing, in particular to a calibration method of a station position in a process chamber and semiconductor process equipment.
Background
Semiconductor processing equipment such as ion etchers use transfer devices such as vacuum robots to transfer wafers during operation. Over time, small deviations in displacement between the machine components can occur, resulting in small displacements of the stations in the process chamber. After a slight displacement of the station in the process chamber, the current position of the station in the process chamber, i.e. the position of the station currently provided to the relevant device, e.g. a robot, is determined before the displacement of the station in the process chamber. Therefore, it is necessary to calibrate the station positions of the stations in the process chamber in time, obtain calibrated station positions, and provide the calibrated station positions to the relevant devices such as the robot.
Currently, the commonly adopted calibration method is as follows: the station position of the station in the process chamber needs to be calibrated by relevant personnel performing corresponding manual operations under the atmospheric environment. The atmospheric environment can break the vacuum of the chamber such that the process chamber is stopped for an extended period of time, such as 8 to 24 hours, when the position of a station in the process chamber is calibrated. Resulting in a reduction in production efficiency. Meanwhile, the accuracy rate of calibrating the station position of the station in the process chamber by corresponding manual operation of related personnel is low.
Disclosure of Invention
In order to overcome the problems in the related art, the application provides a method for calibrating the position of a station in a process chamber and semiconductor process equipment.
According to a first aspect of embodiments of the present application, there is provided a method for calibrating a position of a station in a process chamber, applied to a semiconductor processing apparatus, comprising:
placing the calibration piece to a preset position by using a transmission device, and rotating the calibration piece to a preset orientation by using the calibration device, wherein the calibration piece comprises a plurality of openings which are arranged in one-to-one correspondence with a plurality of thimbles on a chuck in a process chamber, and the side wall of each opening is conical and is used for accommodating the thimble;
transferring the calibration piece rotated to the preset orientation into a process chamber by using a transmission device, enabling the calibration piece to be located above a chuck, lifting a plurality of ejector pins, controlling the transmission device to descend, guiding the ejector pins into a plurality of openings respectively, and supporting the calibration piece by the ejector pins;
transferring the calibration piece out of the process chamber by using a transfer device, and detecting the offset of the calibration piece in a preset direction relative to a preset position by using a calibration device;
and calibrating the current station position based on the offset to obtain the calibrated station position.
According to a second aspect of embodiments of the present application, there is provided a semiconductor processing apparatus comprising: a controller, a calibration device, a transfer device, a process chamber, wherein,
the calibration device is configured to rotate a calibration piece in a preset position to a preset orientation, wherein the calibration piece comprises a plurality of openings which correspond to a plurality of ejector pins on a chuck in a process chamber in a one-to-one manner, and the side walls of the openings are tapered for accommodating the ejector pins; after the transmission device transmits the calibration piece out of the process chamber, detecting the offset of the calibration piece in a preset direction relative to a preset position;
the transmission device is configured to transmit the calibration piece which rotates to a preset orientation into the process chamber, so that the calibration piece is positioned above the chuck, and after the plurality of ejector pins are lifted, the transmission device is driven to descend, so that the plurality of ejector pins are respectively guided into the plurality of openings, and the calibration piece is supported by the plurality of ejector pins;
the controller is configured to calibrate the current workstation position based on the offset, resulting in a calibrated workstation position.
The calibration of station position in the process chamber provided by the embodiment of the application realizes that the station position in the process chamber is calibrated more accurately through the calibration piece automatically under the condition that the station in the process chamber is displaced. The cavity opening operation is not needed, and the problems that the process chamber is in a process stopping state for a long time and the production efficiency is reduced due to the fact that relevant personnel need to perform corresponding manual operation to calibrate the position of the process chamber in the atmospheric environment are solved. Meanwhile, the labor cost and the time cost are saved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
FIG. 1 is a flow chart illustrating a method for calibrating a position of a process chamber provided by an embodiment of the present application;
FIG. 2 shows a top view of the calibration piece;
FIG. 3 shows a side view of the aperture;
FIG. 4 is a schematic diagram showing the comparison of the radius of the alignment device and the distance of the thimble from the center of the chuck;
FIG. 5 is a schematic view illustrating a process of introducing the thimble into the hole;
FIG. 6 is a schematic diagram showing the effect of lateral displacement of the opening;
fig. 7 is a block diagram illustrating a semiconductor processing apparatus according to an embodiment of the present disclosure.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the related invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Fig. 1 is a flowchart illustrating a method for calibrating a position of a process chamber according to an embodiment of the present disclosure, the method comprising:
In this application, the calibration piece includes a plurality of trompils, a plurality of thimbles one-to-one's setting on a plurality of trompils and the chuck in the process chamber, and the lateral wall of trompil is the toper, and the trompil is funnel type trompil promptly for hold the thimble.
The lift pins on the Chuck (Chuck) of the process chamber may be referred to as pin pins. The shape of the calibration piece may be the same as the shape of the wafer or may be a sheet-like body with a shape similar to the wafer.
The total weight of the calibration piece is not too heavy, and the total material of the calibration piece can be a resin material, so that the total weight of the calibration piece is light. The slope of the opening of the calibration piece may be larger and the side walls of the opening of the calibration piece smooth. The calibration member may include an opening in a lower surface of the calibration member.
In the present application, the calibration element may be placed in a predetermined position, for example on the calibration device, i.e. Aligner, by means of a transport device, for example a robot, and rotated to a predetermined orientation by means of the calibration device. The calibrating piece is rotated to the preset orientation by the aid of the calibrating device, so that the station in the process chamber is not displaced, and under the condition that the ejector pin is not displaced, when the calibrating piece is conveyed into the process chamber by the aid of the conveying device, for each hole of the calibrating piece, the hole position of each hole is aligned to the pin corresponding to the hole.
In some embodiments, the edge of the calibration piece further comprises an opening; rotating the calibration piece to a preset orientation with the calibration device comprises: the calibration member is rotated by the calibration device such that the opening is oriented in a predetermined orientation.
The opening at the edge of the calibration piece may be referred to as a nrth opening. When the calibration member is rotated by the calibration device, the opening can be used as a marker, and the calibration member is rotated by the calibration device to enable the opening to face a preset orientation, so that the calibration member faces the preset orientation.
Referring to fig. 2, a top view of the calibration piece is shown.
In fig. 2, the profile 201 of the calibration piece, the opening 202 of the calibration piece, the opening 203 at the edge of the calibration piece are shown in top view. The profile 201 of the calibration piece is circular.
Referring to fig. 3, a side view of the opening is shown.
The side wall of the opening is conical, namely the opening is a funnel-shaped opening. The side view of trompil is when placing calibration piece vertically, and the side view that obtains is carried out the lateral projection to the trompil of calibration piece when the trompil of calibration piece is towards the positive direction of horizontal coordinate axis.
In the side view of the opening, a projected shape 301 corresponding to the bottom of the opening, which is formed by side-view projection of the opening, and inclined projected line segments 302, 303 corresponding to the contour of the portion of the opening other than the bottom are shown.
As an example, H5 mm, L4 mm, L1 3mm, D5 mm, D2 mm.
In some embodiments, the radius of the calibration device is different from the distance of the thimble from the center of the chuck.
Each of the lift pins is spaced a same distance from a center of a chuck of the process chamber. When the calibration piece is placed on the calibration device for rotation, the needle on the calibration device for carrying the object to be calibrated can also be used to support the calibration piece. The radius of the calibration device is different from the distance from the centre of the chuck, so that when the transport device places the calibration piece on the calibration device, the pins of the calibration device carrying the object to be calibrated cannot be inserted into the openings of the calibration piece.
Referring to FIG. 4, a schematic diagram illustrating the comparison between the radius of the calibration device and the distance of the thimble from the center of the chuck is shown.
The calibration piece belongs to a frock. The position of the hole of the tool is the position of the thimble. The radius of the calibrating device, namely the Aligner is R, and the distance from the thimble to the center of the chuck is R.
In this application, a transfer device, such as a robot, may be controlled to grasp the calibration piece rotated to the predetermined orientation and transfer the calibration piece rotated to the predetermined orientation into the process chamber so that the calibration piece is positioned above the chuck. After transferring the calibration piece rotated to the predetermined orientation into the process chamber, the plurality of lift pins may be raised to control the lowering of the transfer device. The transmission device can carry the calibration piece which rotates to the preset orientation to vertically move downwards, so that the ejector pins are respectively guided into the openings, and the calibration piece is supported by the ejector pins. The control device stops controlling the transmission device to descend when the calibration piece rotated to the preset orientation moves to the position of the top of the pin needle along with the descending of the transmission device, and the transmission device releases the calibration piece rotated to the preset orientation, so that the calibration piece rotated to the preset orientation falls under the action of gravity.
If the station in the process chamber does not displace, correspondingly, for any pin needle, the pin needle does not displace, the pin needle is basically aligned to the center of the bottom of the opening corresponding to the pin needle at the moment when the pin needle starts to be inserted into the opening corresponding to the pin needle, the pin needle cannot be contacted with the opening corresponding to the pin needle, the calibration piece only moves in the vertical direction under the condition that the pin needle cannot be contacted with the opening corresponding to the pin needle, and the pin needle reaches the bottom of the opening corresponding to the pin needle after a certain period of time, so that the thimble is guided into the opening.
If the position in the process chamber is displaced, so that any pin needle is displaced, and the side wall of the opening is tapered, in the falling process of the calibration piece, after the top of the pin needle is inserted into the opening corresponding to the pin needle, the top of the pin needle is firstly in point contact with a certain point on the side wall of the opening corresponding to the pin needle, which is not part of the bottom of the opening, and then the opening corresponding to the pin needle is caused to move obliquely, so that the calibration piece is further caused to displace in a non-vertical direction until the pin needle reaches the bottom of the opening corresponding to the pin needle, and the thimble is guided into the opening.
Please refer to fig. 5, which illustrates a process of guiding the thimble into the hole of the calibration member.
In fig. 5, the process of introducing the thimble into the calibration piece in case the pin is displaced due to a displacement of the station in the process chamber is shown.
In fig. 5, one opening 501 of the calibration piece and a pin needle 502 corresponding to the opening 501 are exemplarily shown.
Before the calibration piece falls, the calibration piece is grabbed by a conveying device such as a mechanical arm, the calibration piece is conveyed into the process chamber, the conveying device is controlled to descend, and the conveying device carries the calibration piece to move vertically downwards. When the position of the calibration piece moves to the position of the top of pin needle 502, the transport means stops being controlled to descend, the transport means releases the calibration piece, and the calibration piece starts falling under the action of gravity.
During the dropping process of the calibration piece, the top of the pin 502 is first in point contact with a certain point on the sidewall of the opening 501, which is not the part of the bottom of the opening, after being inserted into the opening 501, and the sidewall of the opening 501 is tapered and smooth, so that after the point contact, the opening 501 is caused to move obliquely, which is equivalent to the pin 502 sliding into the opening 501 along the slope on the sidewall of the opening.
Please refer to fig. 6, which illustrates the effect of the lateral displacement of the opening.
In fig. 6, the lateral displacement of the opening is shown in case of a displacement of the pin due to a displacement of the work station in the process chamber, and correspondingly the lateral displacement of the calibration piece with respect to the predetermined position.
In the present application, after the plurality of pins are respectively guided into the plurality of openings and the calibration piece is supported by the plurality of pins, the calibration piece may be transferred out of the process chamber by using the transfer device, and the offset of the calibration piece in the predetermined direction with respect to the predetermined position may be detected by using the calibration device.
If the station in the process cavity displaces, the ejector pin is caused to displace, and then the calibration piece displaces in a non-vertical direction relative to the preset position. Thus, the offset amount of the calibration piece in the preset direction with respect to the preset position can be detected by the calibration means. The preset direction is a direction other than the vertical direction.
In some embodiments, the preset direction comprises: the telescopic shaft direction and the rotating shaft direction of the transmission device.
In this application, the telescopic shaft may refer to an R-axis in a rectangular coordinate system of the robot established based on a position, e.g., a center point, of the transmission device. The rotation axis may refer to a T-axis in a rectangular coordinate system of the robot. The telescopic shaft direction of the transmission device can be called as an R-axis direction. The direction of the axis of rotation of the transport device may be referred to as the T-axis direction.
And 104, calibrating the current station position based on the offset to obtain the calibrated station position.
In this application, the current station position may refer to the station position that is currently provided to the associated device in the process chamber. The current station position is determined prior to a station displacement in the process chamber.
In the present application, a calibrated station position of a station in a process chamber may be determined based on the offset and a current station position of the station in the process chamber. Therefore, the calibration of the station positions of the stations in the process chamber is completed, and the calibrated station positions of the stations in the process chamber can be provided for relevant devices, for example, the calibrated station positions are provided for the mechanical arm, so that the mechanical arm can accurately grab the wafer and place the wafer according to the calibrated station positions.
The correlation between the offset of the calibration piece in the predetermined direction and the offset of the station position of the station in the process chamber in the case of a displacement of the process chamber can be predetermined. The offset of the station position of the station in the process chamber in the preset direction can be determined according to the correlation between the offset of the calibration piece in the preset direction relative to the preset position and the offset of the station position of the station in the process chamber in the preset direction, and the offset of the calibration piece in the preset direction relative to the preset position. Determining the sum of the component of the current station position of the stations in the process chamber in the preset direction and the offset of the station position of the stations in the process chamber in the preset direction as the component of the stations in the process chamber after calibration in the preset direction.
In the calibrated station positions of the stations in the process chamber, the component in the preset direction is the sum of the component in the preset direction of the current station position of the stations in the process chamber and the offset of the station position in the preset direction of the stations in the process chamber, and for the other directions except the preset direction, the components in the other directions are the components in the other directions of the current station position of the stations in the process chamber.
For example, the preset directions include: the telescopic shaft direction and the rotating shaft direction of the transmission device can predetermine the incidence relation between the offset of the calibration piece relative to the preset position in the R-axis direction and the offset of the station position of the station in the process chamber in the R-axis direction and the incidence relation between the offset of the calibration piece relative to the preset position in the T-axis direction and the offset of the station position of the station in the process chamber in the T-axis direction under the condition that the station position of the station in the process chamber is displaced. The offset of the station position of the station in the process chamber in the R-axis direction can be determined according to the correlation between the offset of the calibration piece in the R-axis direction relative to the preset position and the offset of the station position of the station in the process chamber in the R-axis direction relative to the offset of the calibration piece in the R-axis direction. The offset of the station position of the station in the process chamber in the T-axis direction can be determined according to the correlation between the offset of the calibration piece in the T-axis direction relative to the preset position and the offset of the station position of the station in the process chamber in the T-axis direction relative to the offset of the calibration piece in the T-axis direction.
After determining the offset of the station position of the station in the process chamber in the R-axis direction and the offset in the T-axis direction, the sum of the component of the current station position of the station in the process chamber in the R-axis direction and the offset of the station position of the station in the process chamber in the R-axis direction may be determined as the component of the calibrated station position of the station in the process chamber in the R-axis direction. The sum of the T-axis component of the current station position of the stations in the process chamber and the T-axis offset of the station position of the stations in the process chamber may be determined as the T-axis component of the calibrated station position of the stations in the process chamber. After determining the component of the calibrated station position of the station in the process chamber in the R-axis direction and the component in the T-axis direction, the calibrated station position of the station in the process chamber may be determined, i.e., the calibrated station position of the station in the process chamber may be composed of the component of the calibrated station position of the station in the process chamber in the R-axis direction and the component in the T-axis direction.
In some embodiments, calibrating the current workstation position based on the offset, and obtaining the calibrated workstation position includes: calculating the sum of the component of the current station position in the telescopic shaft direction and the offset of the calibration piece in the telescopic shaft direction, and determining the sum as the component of the calibrated station position in the telescopic shaft direction; and calculating the sum of the component of the current station position in the direction of the rotating shaft and the offset of the calibration piece in the direction of the rotating shaft, and determining the sum as the component of the station position after calibration in the direction of the rotating shaft.
The offset in the R axis with respect to the pre-set position calibration piece can be directly taken as the offset in the R axis direction of the station position of the station in the process chamber. And directly taking the offset of the calibration piece relative to the preset position in the T-axis direction as the offset of the station position of the station in the process chamber in the T-axis direction. The offset amount in the R axis direction with respect to the preset position calibration piece is represented by Δ R, and the offset amount in the T axis direction with respect to the preset position calibration piece is represented by Δ T. The sum of the component of the current station position of the stations in the process chamber in the direction of the R-axis and Δ R may be determined as the component of the calibrated station position of the stations in the process chamber in the R-axis. The sum of the component in the T-axis direction of the current station position of the stations in the process chamber and Δ T may be determined as the component in the T-axis direction of the calibrated station position of the stations in the process chamber.
Referring to fig. 7, a block diagram of a semiconductor processing apparatus according to an embodiment of the present disclosure is shown. The semiconductor processing equipment comprises: a controller 701, a calibration apparatus 702, a transfer apparatus 703, and a process chamber 704.
The alignment apparatus 702 is configured to rotate an alignment member in a predetermined position to a predetermined orientation, wherein the alignment member includes a plurality of openings configured in a one-to-one correspondence with a plurality of pins on a chuck in the process chamber 704, the sidewalls of the openings being tapered for receiving the pins; detecting an offset of the calibration piece in a predetermined direction relative to a predetermined position after the transfer device transfers the calibration piece out of the process chamber 704;
the transfer device 703 is configured to transfer the calibration piece rotated to a predetermined orientation into the process chamber, so that the calibration piece is located above the chuck, and after the plurality of lift pins are lifted, the transfer device 703 is driven to descend, so as to guide the plurality of lift pins into the plurality of openings, respectively, and the plurality of lift pins support the calibration piece;
the controller 701 is configured to calibrate the current workstation position based on the offset, resulting in a calibrated workstation position.
In some embodiments, the preset direction comprises: the transport device 703 has a telescopic axis direction and a rotary axis direction.
In some embodiments, the edge of the calibration piece further comprises an opening; the alignment device 702 is further configured to rotate the alignment member such that the opening is oriented in a predetermined orientation.
In some embodiments, the controller 701 is further configured to calculate a sum of a component of the current workstation position in the telescopic shaft direction and an offset of the calibration piece in the telescopic shaft direction, and determine it as a component of the calibrated workstation position in the telescopic shaft direction; and calculating the sum of the component of the current station position in the direction of the rotating shaft and the offset of the calibration piece in the direction of the rotating shaft, and determining the sum as the component of the station position after calibration in the direction of the rotating shaft.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (10)
1. A method of calibrating a station position in a process chamber, the method comprising:
placing a calibration piece to a preset position by using a transmission device, and rotating the calibration piece to a preset orientation by using a calibration device, wherein the calibration piece comprises a plurality of openings which are arranged in one-to-one correspondence with a plurality of ejector pins on a chuck in a process chamber, and the side wall of each opening is conical and is used for accommodating the ejector pins;
transferring the calibration piece rotated to the preset orientation into the process chamber by using a transfer device, so that the calibration piece is positioned above the chuck, raising the plurality of ejector pins, controlling the transfer device to descend, guiding the plurality of ejector pins into the plurality of openings respectively, and supporting the calibration piece by the plurality of ejector pins;
transferring the calibration piece out of the process chamber using the transfer device and detecting an offset of the calibration piece in a predetermined direction relative to the predetermined position using the calibration device;
and calibrating the current station position based on the offset to obtain the calibrated station position.
2. The method of claim 1, wherein the preset direction comprises: the transmission device comprises a transmission device and a transmission device, wherein the transmission device comprises a telescopic shaft and a rotating shaft.
3. The method of claim 1, wherein the calibration piece further comprises an opening at an edge thereof;
the rotating the calibration piece to a preset orientation with a calibration device comprises:
rotating the calibration piece with the calibration device such that the opening is oriented in the preset orientation.
4. The method of claim 1, wherein a radius of the calibration device is different from a distance of the ejector pin from a center of the chuck.
5. The method of claim 1, wherein said number of said pins is three and said number of said openings is three.
6. The method of claim 2, wherein calibrating the current workstation position based on the offset comprises:
calculating the sum of the component of the current station position in the telescopic shaft direction and the offset of the calibration piece in the telescopic shaft direction, and determining the sum as the component of the calibrated station position in the telescopic shaft direction;
and calculating the sum of the component of the current station position in the direction of the rotating shaft and the offset of the calibration piece in the direction of the rotating shaft, and determining the sum as the component of the station position after calibration in the direction of the rotating shaft.
7. A semiconductor processing apparatus, comprising: a controller, a calibration device, a transfer device, a process chamber, wherein,
the alignment device is configured to rotate an alignment member in a predetermined position to a predetermined orientation, wherein the alignment member includes a plurality of openings corresponding to a plurality of pins on a chuck in a process chamber, and sidewalls of the openings are tapered to accommodate the pins; detecting an offset of the calibration piece in a predetermined direction relative to the predetermined position after the transfer device transfers the calibration piece out of the process chamber;
the transmission device is configured to transmit the calibration piece rotated to the preset orientation into the process chamber, so that the calibration piece is positioned above the chuck, and after the plurality of ejector pins are lifted, the transmission device is driven to descend to guide the plurality of ejector pins into the plurality of openings respectively, and the calibration piece is supported by the plurality of ejector pins;
the controller is configured to calibrate a current workstation position based on the offset, resulting in a calibrated workstation position.
8. The semiconductor processing apparatus of claim 7, wherein the predetermined direction comprises: the transmission device comprises a transmission device and a transmission device, wherein the transmission device comprises a telescopic shaft and a rotating shaft.
9. The semiconductor processing apparatus of claim 6, wherein the calibration piece further comprises an opening at an edge thereof;
the alignment device is further configured to rotate the alignment member such that the opening is oriented in the preset orientation.
10. The semiconductor processing apparatus of claim 8, wherein the controller is further configured to calculate a sum of a component of a current workstation position in the telescoping axis direction and an offset of the calibration piece in the telescoping axis direction and determine it as a component of a calibrated workstation position in the telescoping axis direction; and calculating the sum of the component of the current station position in the direction of the rotating shaft and the offset of the calibration piece in the direction of the rotating shaft, and determining the sum as the component of the station position after calibration in the direction of the rotating shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| WO2024199233A1 (en) * | 2023-03-28 | 2024-10-03 | 苏州维嘉科技股份有限公司 | Spindle calibration apparatus, spindle calibration method, and circuit board processing device |
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