CN112504593B - Water-cooling switching device for thermal vibration test - Google Patents

Abstract

The invention discloses a water-cooling transfer device for thermal vibration test. The top of the test bench is provided with micro-grooves, and the micro-grooves are spiral grooves or densely and concentrically arranged multiple circular grooves, which can effectively Reduce the heat accumulation between the product bottom and the test bench, and reduce the adverse effects on the test product. The water cooling mechanism of the present invention includes multi-layer water cooling components arranged correspondingly with the unit structure of the test bench, and the water cooling components of each layer are connected with each layer The test bench unit structures are arranged in one-to-one correspondence with each other and are spaced apart from each other, and the water cooling mechanism is configured such that the temperature of the test bench unit structure on the upper floor is higher than that of the adjacent test bench unit structure on the lower floor The temperature can effectively ensure the balance of the temperature of the test bench, reduce the problem of excessive temperature changes of the test bench, and effectively ensure the accuracy of the test. At the same time, the test bench will not experience large temperature changes, ensuring the service life of the test bench.

Description

A water cooling adapter device for thermal vibration test

technical field

Specifically, the invention relates to a water-cooling adapter device for thermal vibration tests, and relates to the field of vibration tests.

Background technique

Thermal vibration test is a test that applies vibration force and thermal environment force to the product under test to simulate the real use environment of the product. It is an effective means to assess the adaptability of the product to the thermal and vibration coupling environment. Therefore, the thermal vibration test bench generally needs to work in a high-temperature environment. For this, in order to ensure the working life of the test bench, it is generally necessary to install a water cooling device on the test bench. However, the current water-cooling device is generally provided with a simple water-cooling coil in the test bench, and uses water cooling to cool the test bench. However, although the water-cooling method of this structure can achieve aerodynamic cooling effect, it is prone to cooling Inhomogeneity, and when the temperature is lowered, the temperature of the test bench will change greatly. This change will have a certain impact on the test product and affect the test accuracy of the test product. Moreover, the contact between the test product and the test bench It is easy to generate heat condensation at the contact point between the product and the test bench, which will affect the test accuracy of the product.

Contents of the invention

Therefore, in order to solve the above disadvantages, the present invention provides a water-cooling adapter device for thermal vibration test.

The present invention is achieved by constructing a water-cooling adapter for thermal vibration tests, which includes a base, a vibrator, a vibrating table, a test bench and a water-cooling mechanism, wherein the vibrator is fixed on the base, The output end of the vibrator is arranged upward, and the output end of the vibrator is supported and fixedly connected with the vibration table, the test bench is coaxially supported on the vibration table, and the test bench is provided with In the water-cooling mechanism, the product to be tested is clamped and fixed on the test bench. A circular groove, the depth of the miniature groove is 2-5mm, the test bench includes a multilayer test bench unit structure arranged coaxially and layered up and down, and the water cooling mechanism includes multiple A layer of water-cooling components, each layer of the water-cooling component and each layer of the test bench unit structure are in one-to-one correspondence and arranged at a distance from each other, and the water cooling mechanism is configured so that the temperature of the test bench unit structure on the upper layer is greater than and The temperature of the adjacent unit structure of the test bench in the lower layer.

Further, preferably, positioning posts are provided on the four corners of the base, and the heater for heating the product to be tested is located above the test bench and positioned on the positioning posts.

Further, preferably, a cooling groove is also provided on the outer peripheral wall of the vibrating table.

Further, preferably, the water-cooling mechanism further includes a cooling controller, a cooling control pump, a water-cooling water inlet joint, and a water-cooling delivery pipe, wherein the cooling control pump is fixed on the base, and the inlet of the cooling control pump The water end is provided with the water-cooling inlet joint, the water outlet end of the cooling control pump is connected to the water-cooling delivery pipe, and there are multiple water-cooling delivery pipes, and each of the water-cooling delivery pipes is connected to the respective water-cooling assembly .

Further, preferably, the unit structure of the test bench includes a heat conduction disk, the heat conduction disk is a cylindrical structure, and the water cooling assembly is arranged between two adjacent heat conduction disks arranged one above the other.

Further, as a preference, the water-cooling assembly includes a water-cooling ring seat, a water-cooling tube group, and a cooling grid, wherein the lower end surface of the heat-conducting disk is coaxially connected to the cooling grid, and the bottom of the cooling grid is coaxial Connect the water-cooling ring seat, the bottom of the water-cooling ring seat is connected with the heat-conducting disk below, the center of the water-cooling ring seat is provided with a hollow cavity, and the water-cooling tube group is arranged in the hollow cavity, so The water inlet end of the water-cooling tube group is connected to the water-cooling delivery pipe, and the water-cooling tube group is arranged in contact with the heat dissipation net plate and the heat conduction disc.

Further, preferably, a connecting shoulder is provided on the outer circumferential wall of the water-cooling coil seat, and a connecting hole is provided on the connecting shoulder to connect with the heat dissipation mesh disk and the heat conduction disc.

Further, as a preference, honeycomb holes are densely arranged on the heat dissipation mesh disk.

Further, preferably, the test bench includes a four-layer test bench unit structure, and the water-cooling mechanism also includes four-layer water-cooling components correspondingly, and the four-layer test bench unit structure includes a first layer of heat-conducting discs, a second layer of heat-conducting disk, the third layer of heat conduction disk and the fourth layer of heat conduction disk, the four-layer water cooling assembly includes the first layer of water cooling ring seat, the second layer of water cooling ring seat, the third layer of water cooling ring seat, the fourth layer of water cooling ring Seat, the first layer of water-cooled tube group, the second layer of water-cooled tube group, the third layer of water-cooled tube group, the fourth layer of water-cooled tube group, the first layer of cooling network disk, the second layer of cooling network disk, the third layer of cooling network disk , the fourth layer of heat dissipation mesh disk, wherein, the first layer of heat conduction circle, the first layer of heat dissipation mesh disk, the first layer of water cooling ring seat, the second layer of heat conduction circle, the second layer of heat dissipation mesh disk, the second layer of water cooling ring The seat, the third layer of heat conduction disk, the third layer of heat dissipation network disk, the third layer of water cooling ring seat, the fourth layer of heat conduction disk, the fourth layer of heat dissipation network disk, and the fourth layer of water cooling ring seat are connected in order from top to bottom , the first layer of water-cooled tube group is located in the first layer of water-cooled ring seat, the second layer of water-cooled tube group is located in the second layer of water-cooled ring seat, and the third layer of water-cooled tube group is located in the In the third layer of water cooling ring seat, the fourth layer of water cooling tube group is located in the fourth layer of water cooling ring seat.

Further, as a preference, the first layer of water-cooled tube groups, the second layer of water-cooled tube groups, the third layer of water-cooled tube groups, and the fourth layer of water-cooled tube groups have the same structure, all of which are spiral coil or serpentine tube structures, and all The pipe body of the spiral coil or serpentine tube structure includes an inner heat conduction circulation pipe and an outer heat conduction winding group, circulating water circulates in the inner heat conduction circulation pipe, and the outer heat conduction winding group is wound in the inner heat conduction circulation on the outer circumference of the tube.

The present invention has the following advantages: Compared with the same type of equipment, the water-cooled adapter device provided by the present invention has the following advantages:

(1) According to the present invention, a water-cooling adapter device for thermal vibration test, the top of the test bench is provided with a micro-groove, and the micro-groove is a spiral groove or a plurality of dense and concentrically arranged circular grooves, It can effectively reduce the heat accumulation between the bottom of the product and the test bench, and reduce the adverse effect on the test product. The water cooling mechanism of the present invention includes multi-layer water cooling components arranged correspondingly to the unit structure of the test bench, and each layer of the water cooling component The test bench unit structures of each layer correspond to each other and are spaced apart from each other, and the water cooling mechanism is configured so that the temperature of the test bench unit structure on the upper floor is higher than that of the adjacent test bench unit structures on the lower floor. The temperature of the unit structure of the test bench can effectively ensure the temperature balance of the test bench, reduce the problem of excessive temperature changes of the test bench, and effectively ensure the test accuracy. At the same time, the test bench will not experience large temperature changes, ensuring the service life of the test bench.

(2) The test bench of the present invention adopts a multi-layer structure, which effectively improves the effect and reliability of water cooling, and improves the stability and precision of thermal vibration tests.

Description of drawings

Fig. 1 is the overall structural representation of the present invention;

Fig. 2 is the structure schematic diagram after each layer of water-cooling assembly and each layer of test bench unit structure of the present invention are disassembled;

Fig. 3 is the structural representation when the micro-groove of the present invention is a spiral groove;

Fig. 4 is a structural schematic diagram of the pipe body of the spiral coil or serpentine pipe structure of the present invention.

Detailed ways

The present invention will be described in detail below in conjunction with accompanying drawings 1-4, and the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. . Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

The present invention provides a kind of water-cooling transfer device for thermal vibration test through improvement here, and it comprises base 1, vibrator 8, vibrating table 7, test bench 4 and water-cooling mechanism, wherein, described vibrator is fixed on the described On the base, the output end of the vibrator is arranged upwards, and the output end of the vibrator is supported and fixedly connected with the vibration table, and the test bench is coaxially supported on the vibration table, and the test bench is The water-cooling mechanism is arranged inside, and the product to be tested is clamped and fixed on the test bench. A plurality of circular grooves concentrically arranged, the depth of the micro-groove is 2-5mm, the test bench includes a multilayer test bench unit structure coaxially arranged up and down, and the water cooling mechanism includes a The multi-layer water-cooling assembly is arranged accordingly, the water-cooling assembly on each layer and the test bench unit structure on each layer correspond to each other and are spaced apart from each other, and the water-cooling mechanism is configured so that the test bench unit on the upper layer The temperature of the structure is greater than the temperature of the test bench unit structure adjacent to it on the lower level.

In this embodiment, positioning columns 2 are also arranged on the four corners of the base, and the heater for heating the product to be tested is located above the test bench and positioned on the positioning columns. .

The outer peripheral wall of the vibrating table 7 is also provided with a cooling groove 6, the setting of the cooling groove can effectively prevent the problem of heat accumulation on the vibrating table, effectively improve the heat dissipation effect, and reduce the internal stress of the vibrating table when the temperature changes, so as to realize Thermal stress relief.

The water-cooling mechanism also includes a cooling controller, a cooling control pump 10, a water-cooling water inlet joint 9, and a water-cooling delivery pipe 3, wherein the cooling control pump 10 is fixed on the base, and the inlet of the cooling control pump 10 The water end is provided with the water-cooling water inlet joint 9, the water outlet end of the cooling control pump is connected to the water-cooling delivery pipe 3, there are multiple water-cooling delivery pipes 3, and each of the water-cooling delivery pipes is connected to the respective The water cooling components described above.

The unit structure of the test bench includes a heat conduction disk 11, the heat conduction disk is a cylindrical structure, and the water cooling assembly is arranged between two adjacent heat conduction disks arranged one above the other.

The water-cooling assembly includes a water-cooling ring seat, a water-cooling tube group, and a cooling grid, wherein the lower end surface of the heat-conducting disc is coaxially connected to the cooling grid, and the bottom of the cooling grid is coaxially connected to the water-cooling coil Seat, the bottom of the water-cooling ring seat is connected with the heat-conducting disk below, the center of the water-cooling ring seat is provided with a hollow cavity 22, and the water-cooling tube group is arranged in the hollow cavity 22, and the water-cooling tube The water inlet end of the group is in communication with the water-cooling delivery pipe 3, and the water-cooling pipe group is arranged in contact with the heat dissipation mesh disk and the heat conduction disc.

A connecting shoulder 18 is provided on the outer peripheral wall of the water-cooling coil seat, and a connecting hole for connecting with the heat dissipation grid plate and the heat conducting disc 11 is provided on the connecting shoulder.

Honeycomb holes 12 are densely arranged on the heat dissipation mesh disk.

The test bench includes a four-layer test bench unit structure, and the water-cooling mechanism also includes four-layer water-cooling components correspondingly. The four-layer test bench unit structure includes a first layer of heat conducting disks, a second layer of heat conducting disks, a third layer of heat conducting disks A layer of heat-conducting disks and a fourth layer of heat-conducting disks, the four-layer water-cooling assembly includes a first layer of water-cooling ring seats 17, a second layer of water-cooling ring seats 19, a third layer of water-cooling ring seats 20, and a fourth layer of water-cooling ring seats 21 , The first layer of water-cooled tube group 13, the second layer of water-cooled tube group, the third layer of water-cooled tube group, the fourth layer of water-cooled tube group, the first layer of heat dissipation network disk 13, the second layer of heat dissipation network disk 14, the third layer of heat dissipation Mesh disk 15, the fourth layer of heat dissipation mesh disk 16, wherein, the first layer of heat conduction circle, the first layer of heat dissipation mesh disk 13, the first layer of water cooling ring seat 17, the second layer of heat conduction circle, the second layer of heat dissipation mesh disk 14. The second layer of water cooling ring seat 19, the third layer of heat conduction disk, the third layer of heat dissipation mesh disk 15, the third layer of water cooling ring seat 20, the fourth layer of heat conduction disk, the fourth layer of heat dissipation mesh disk 16, the fourth layer of The layers of water-cooling coil seats 21 are arranged sequentially from top to bottom, the first layer of water-cooling tubes 13 is located in the first layer of water-cooling coils, and the second layer of water-cooling tubes is located in the second layer of water-cooling coils Inside, the third layer of water-cooling tube group is located in the third layer of water-cooling ring seat, and the fourth layer of water-cooling tube group is located in the fourth layer of water-cooling ring seat.

The first layer of water-cooled tube group 13, the second layer of water-cooled tube group, the third layer of water-cooled tube group, and the fourth layer of water-cooled tube group have the same structure, all of which are spiral coil or serpentine tube structures, and the spiral coil Or the tube body of serpentine tube structure includes an inner heat conduction circulation pipe 22 and an outer heat conduction winding group, circulating water circulates in the inner heat conduction circulation pipe, and the outer heat conduction winding group is wound on the outer circumference of the inner heat conduction circulation pipe face.

According to the water-cooling adapter device for thermal vibration test of the present invention, the top of the test bench is provided with micro-grooves, and the micro-grooves are spiral grooves or multiple circular grooves arranged densely and concentrically, which can effectively Reduce heat accumulation between the bottom of the product and the test bench, and reduce adverse effects on the test product. The water cooling mechanism of the present invention includes multi-layer water cooling components arranged correspondingly with the unit structure of the test bench, and the water cooling components of each layer are connected with each layer The test bench unit structures are arranged in one-to-one correspondence with each other and spaced apart from each other, and the water cooling mechanism is configured such that the temperature of the test bench unit structure on the upper floor is higher than that of the adjacent test bench unit structure on the lower floor The temperature can effectively ensure the balance of the temperature of the test bench, reduce the problem of excessive temperature changes of the test bench, and effectively ensure the accuracy of the test. At the same time, the test bench will not experience large temperature changes, ensuring the service life of the test bench. The test bench of the present invention adopts a multi-layer structure, which effectively improves the effect and reliability of water cooling, and improves the stability and precision of thermal vibration tests.

The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above, and the standard parts used in the present invention can be purchased from the market, and the special-shaped parts can be customized according to the instructions and the accompanying drawings. The specific connection method of each part adopts conventional methods such as bolts, rivets, and welding in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection in the prior art. method, which will not be described in detail here.

The above description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention will not be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (3)

1. A water-cooling adapter for thermal vibration test, which comprises base (1), vibrator (8), vibrating table (7), test stand (4) and water-cooling mechanism, wherein said vibrator is fixed On the base, the output end of the vibrator is arranged upward, and the output end of the vibrator is supported and fixedly connected to the vibrating table, and the test bench is coaxially supported on the vibrating table, so The water-cooling mechanism is arranged in the test bench, and the product to be tested is clamped and fixed on the test bench. It is a spiral groove or multiple circular grooves arranged densely and concentrically. The depth of the micro groove is 2-5mm. The test bench includes a multi-layer test bench unit structure arranged coaxially and layered up and down. It includes multi-layer water-cooling assemblies arranged correspondingly to the test bench unit structure, each layer of the water-cooling assembly and each layer of the test bench unit structure correspond to each other and are spaced apart from each other, and the water-cooling mechanism is configured such that it is in the The temperature of the test bench unit structure in the upper layer is higher than the temperature of the adjacent test bench unit structure in the lower layer; Positioning columns (2) are also arranged on the four corners of the base, and the heater for heating the product to be tested is located above the test bench and positioned on the positioning column; The unit structure of the test bench includes a heat conduction disk (11), the heat conduction disk is a cylindrical structure, and the water cooling assembly is arranged between two heat conduction disks arranged up and down adjacently; The water-cooling assembly includes a water-cooling ring seat, a water-cooling tube group, and a cooling grid, wherein the lower end surface of the heat-conducting disc is coaxially connected to the cooling grid, and the bottom of the cooling grid is coaxially connected to the water-cooling coil Seat, the bottom of the water-cooling ring seat is connected with the heat-conducting disc below it, a hollow cavity (22) is arranged in the center of the water-cooling ring seat, and the water-cooling tube group is arranged in the hollow cavity (22), The water inlet end of the water-cooled tube group is in communication with the water-cooled delivery pipe (3), and the water-cooled tube group is set in contact with the heat dissipation mesh disk and the heat conduction disk; Honeycomb holes (12) are densely arranged on the heat dissipation net disk; A cooling groove (6) is also arranged on the peripheral wall of the vibrating table (7); The water-cooling mechanism also includes a cooling controller, a cooling control pump (10), a water-cooling water inlet joint (9), and a water-cooling delivery pipe (3), wherein the cooling control pump (10) is fixed on the base, and the The water inlet end of the cooling control pump (10) is provided with the water cooling water inlet joint (9), the water outlet end of the cooling control pump is connected to the water cooling delivery pipe (3), and the water cooling delivery pipe (3) is Multiple, and each of the water-cooling delivery pipes is connected to a respective of the water-cooling components; The test bench includes a four-layer test bench unit structure, and the water-cooling mechanism also includes four-layer water-cooling components correspondingly. The four-layer test bench unit structure includes a first layer of heat conducting disks, a second layer of heat conducting disks, a third layer of heat conducting disks A layer of heat-conducting disks and a fourth layer of heat-conducting disks, the four-layer water-cooling assembly includes a first-layer water-cooling ring seat (17), a second-layer water-cooling ring seat (19), a third-layer water-cooling ring seat (20), and a third-layer water-cooling ring seat (20). Four-layer water-cooling ring seat (21), the first layer of water-cooling tube group, the second layer of water-cooling tube group, the third layer of water-cooling tube group, the fourth layer of water-cooling tube group, the first layer of cooling network disk (13), the second layer Heat dissipation network disk (14), third layer heat dissipation network disk (15), fourth layer heat dissipation network disk (16), wherein, the first layer of heat conduction circle, the first layer of heat dissipation network disk (13), the first layer Water-cooling ring seat (17), second layer of heat conduction circle, second layer of heat dissipation mesh disk (14), second layer of water cooling ring seat (19), third layer of heat conduction disc, third layer of heat dissipation mesh disk (15), The third layer of water cooling ring seat (20), the fourth layer of heat conduction disk, the fourth layer of heat dissipation grid plate (16), and the fourth layer of water cooling ring seat (21) are arranged sequentially from top to bottom, and the first layer of water cooling The tube group is located in the first layer of water-cooling ring seat, the second layer of water-cooling tube group is located in the second layer of water-cooling ring seat, and the third layer of water-cooling tube group is located in the third layer of water-cooling ring seat , the fourth-layer water-cooling tube group is located in the fourth-layer water-cooling ring seat. 2. A water-cooling adapter for thermal vibration tests according to claim 1, characterized in that: a connecting shoulder (18) is provided on the outer peripheral wall of the water-cooling ring seat, and a connecting shoulder is provided on the connecting shoulder There are connection holes connected with the heat dissipation grid disk and the heat conduction disc (11). 3. A water-cooling adapter device for thermal vibration test according to claim 1, characterized in that: the first layer of water-cooled tube groups, the second layer of water-cooled tube groups, the third layer of water-cooled tube groups, the fourth layer of water-cooled tube groups The layers of water-cooled tube groups have the same structure, all of which are spiral coil or serpentine tube structures, and the tube body of the spiral coil or serpentine tube structure includes an inner heat conduction circulation tube and an outer heat conduction winding group, and the inner heat conduction circulation tube Circulating water circulates, and the outer heat conduction winding group is wound on the outer peripheral surface of the inner heat conduction circulation pipe.

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