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CN112375506A - Heat-peelable pressure-sensitive adhesive sheet - Google Patents

Heat-peelable pressure-sensitive adhesive sheet Download PDF

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Publication number
CN112375506A
CN112375506A CN202011287050.4A CN202011287050A CN112375506A CN 112375506 A CN112375506 A CN 112375506A CN 202011287050 A CN202011287050 A CN 202011287050A CN 112375506 A CN112375506 A CN 112375506A
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CN
China
Prior art keywords
adhesive layer
meth
sensitive adhesive
pressure
heat
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Granted
Application number
CN202011287050.4A
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Chinese (zh)
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CN112375506B (en
Inventor
平山高正
下川大辅
西尾昭徳
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Nitto Denko Corp
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Nitto Denko Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

Provided is a heat-peelable pressure-sensitive adhesive sheet, namely a heat-peelable pressure-sensitive adhesive sheet, which is provided with a pressure-sensitive adhesive layer into which a chemical solution is less likely to penetrate. The heat-peelable pressure-sensitive adhesive sheet of the present invention comprises a first pressure-sensitive adhesive layer, a substrate, and a second pressure-sensitive adhesive layer in this order, the first pressure-sensitive adhesive layer comprising an acrylic pressure-sensitive adhesive and heat-expandable microspheres, the acrylic pressure-sensitive adhesive comprising a (meth) acrylic polymer comprising: the structural unit derived from an alkyl (meth) acrylate having an alkyl group with 2 or more carbon atoms and the structural unit derived from a (meth) acrylic monomer having an OH group, wherein the molar ratio (C/OH) of carbon (C) to the OH group in the side chain alkyl group in the (meth) acrylic polymer is 40 to 150.

Description

Heat-peelable pressure-sensitive adhesive sheet
This application is a divisional application of chinese patent application 201610093369.0, and the original application 201610093369.0 was filed 2016, 02, 19, and is entitled "heat-peelable pressure-sensitive adhesive sheet".
Technical Field
The present invention relates to a heat-peelable pressure-sensitive adhesive sheet.
Background
Conventionally, when a substrate provided in an electronic device is manufactured, an adhesive sheet is attached to a substrate material for protection (for example, patent document 1). For example, when a copper foil as a substrate material is etched, an adhesive sheet is attached to the copper foil in order to prevent an etching solution from adhering to a non-treated surface of the copper foil. In addition, when the surface of the glass substrate is polished with an acid such as hydrofluoric acid, an adhesive sheet is also attached to the non-treated surface. In the adhesive sheet for such applications, when a chemical solution is impregnated into the adhesive layer of the adhesive sheet, the interface between the adhesive layer and another layer, or the like, the chemical solution that has penetrated into the adhesive sheet becomes a factor of exhausting gas in a subsequent step after the chemical solution treatment, or becomes a factor of causing the additive material in the adhesive layer to change in quality. For example, as also described in patent document 1, the following problem occurs in the pressure-sensitive adhesive layer containing thermally expandable microspheres (foaming agent) added to exhibit removability: the foaming agent undergoes chemical deterioration due to an acidic or basic chemical solution, resulting in the disappearance of the foaming function.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2001-019915
Disclosure of Invention
Problems to be solved by the invention
The present invention has been made to solve the above-described conventional problems, and a main object thereof is to provide a heat-peelable pressure-sensitive adhesive sheet (heat-peelable pressure-sensitive adhesive sheet) having a pressure-sensitive adhesive layer into which a chemical solution is less likely to infiltrate.
Means for solving the problems
The heat-peelable pressure-sensitive adhesive sheet of the present invention comprises a first pressure-sensitive adhesive layer, a substrate, and a second pressure-sensitive adhesive layer in this order, the first pressure-sensitive adhesive layer comprising an acrylic pressure-sensitive adhesive and heat-expandable microspheres, the acrylic pressure-sensitive adhesive comprising a (meth) acrylic polymer comprising: the structural unit derived from an alkyl (meth) acrylate having an alkyl group with 2 or more carbon atoms and the structural unit derived from a (meth) acrylic monomer having an OH group, wherein the molar ratio (C/OH) of carbon (C) to the OH group in the side chain alkyl group in the (meth) acrylic polymer is 40 to 150.
In one embodiment, the second adhesive layer contains the thermally expandable microspheres.
In one embodiment, the first adhesive layer and/or the second adhesive layer has an arithmetic mean deviation roughness Ra of 1 μm or less.
In one embodiment, a contact angle of water to the first adhesive layer and/or the second adhesive layer is 85 ° to 115 °.
In one embodiment, the first adhesive layer contains a tackifier, and the tackifier is contained in an amount of 40 parts by weight or less based on 100 parts by weight of the first adhesive layer.
In one embodiment, the second adhesive layer contains a tackifier, and the content ratio of the tackifier is 40 parts by weight or less with respect to 100 parts by weight of the second adhesive layer.
In one embodiment, the first pressure-sensitive adhesive layer and/or the second pressure-sensitive adhesive layer has a gel fraction of 50% or more.
In one embodiment, the first pressure-sensitive adhesive layer has an adhesive strength of 1N/20mm or more at 23 ℃ when the first pressure-sensitive adhesive layer is bonded to a polyethylene terephthalate film.
According to another aspect of the present invention, an electronic component is provided. The electronic component is produced using the heat-peelable adhesive sheet.
ADVANTAGEOUS EFFECTS OF INVENTION
In the present invention, by forming an adhesive layer containing a (meth) acrylic polymer as a base polymer, the (meth) acrylic polymer contains: the heat-peelable pressure-sensitive adhesive sheet can be provided which comprises a pressure-sensitive adhesive layer that is less likely to be impregnated with a chemical solution and has excellent adhesive strength, by setting the molar ratio (C/OH) of carbon (C) to OH groups in a side chain alkyl group in the (meth) acrylic polymer to a specific range, the structural unit derived from an alkyl (meth) acrylate having an alkyl group with 2 or more carbon atoms, and the structural unit derived from a (meth) acrylic monomer having an OH group. The pressure-sensitive adhesive sheet of the present invention has a pressure-sensitive adhesive layer containing thermally expandable microspheres, and therefore exhibits excellent peelability upon heating. Further, in the present invention, since the chemical solution is less likely to penetrate into the pressure-sensitive adhesive layer, it is possible to provide a heat-peelable pressure-sensitive adhesive sheet which has high compatibility between adhesiveness and peelability without impairing the function of the heat-expandable microspheres even in applications such as exposure to an acidic or alkaline chemical solution (for example, protection applications in etching).
Drawings
Fig. 1 is a schematic cross-sectional view of a heat-peelable pressure-sensitive adhesive sheet according to an embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view of a heat-peelable pressure-sensitive adhesive sheet according to another embodiment of the present invention.
Description of the reference numerals
10 first adhesive layer
20 base material
30 second adhesive layer
40 elastic layer
100. 200 Heat-peelable pressure-sensitive adhesive sheet
Detailed Description
A. Integral structure of heat-peelable pressure-sensitive adhesive sheet
Fig. 1 is a schematic cross-sectional view of a heat-peelable pressure-sensitive adhesive sheet according to an embodiment of the present invention. The heat-peelable pressure-sensitive adhesive sheet 100 includes a first pressure-sensitive adhesive layer 10, a substrate 20, and a second pressure-sensitive adhesive layer 30 in this order. The first adhesive layer 10 contains thermally expandable microspheres. The heat-expandable microspheres expand or foam by heating, and therefore the adhesive layer containing the heat-expandable microspheres has a reduced adhesive force by heating. The heat-peelable pressure-sensitive adhesive sheet of the present invention includes the pressure-sensitive adhesive layer containing the heat-expandable microspheres, and therefore, even when an adherend is adhered to both surfaces, the adherend can be easily peeled off by heating, and damage to the adherend can be prevented. The second adhesive layer may be included.
Fig. 2 is a schematic cross-sectional view of a heat-peelable pressure-sensitive adhesive sheet according to another embodiment of the present invention. The heat-peelable pressure-sensitive adhesive sheet 200 further includes an elastic layer 40. The elastic layer 40 may be disposed adjacent to the first adhesive layer 10 or the second adhesive layer 30. Preferably, the elastic layer 40 is disposed adjacent to the adhesive layer containing the thermally expandable microspheres. In one embodiment, as shown in the illustrated example, the elastic layer 40 is disposed between the first adhesive layer 10 and the substrate 20. By providing the elastic layer, the following property to an adherend having an uneven surface is improved. Further, when the elastic layer is provided adjacent to the pressure-sensitive adhesive layer containing the thermally expandable microspheres, deformation (expansion) of the pressure-sensitive adhesive layer in the surface direction is suppressed and deformation in the thickness direction occurs preferentially when the pressure-sensitive adhesive layer is heated during peeling. As a result, the releasability is improved.
Although not shown, the heat-peelable pressure-sensitive adhesive sheet of the present invention may be provided with a release liner on the outer side of the pressure-sensitive adhesive layer for the purpose of protecting the pressure-sensitive adhesive surface until the sheet is used.
The adhesive strength at 23 ℃ when the first pressure-sensitive adhesive layer side of the heat-peelable pressure-sensitive adhesive sheet of the present invention is adhered to a polyethylene terephthalate (PET) film is preferably 1N/20mm or more, more preferably 3N/20mm to 20N/20mm, and even more preferably 4N/20mm to 10N/20 mm. Within such a range, a heat-peelable pressure-sensitive adhesive sheet useful as a pressure-sensitive adhesive sheet for temporary protection can be obtained. In the present specification, the adhesive force refers to an adhesive force measured by a method based on JIS Z0237: 2000. Specific measurement methods are described below. The heat-peelable pressure-sensitive adhesive sheet of the present invention has a reduced adhesive strength by heating, and the "adhesive strength at 23 ℃" refers to the adhesive strength before the adhesive strength is reduced.
B. First adhesive layer
The above-mentioned first adhesive layer contains an acrylic adhesive I containing a (meth) acrylic polymer as a base polymer, and thermally expandable microspheres.
B-1 acrylic adhesive I
[ meth (acrylic) Polymer ]
As the (meth) acrylic polymer contained in the acrylic adhesive I, a polymer obtained by using, as monomer components, (a) an alkyl (meth) acrylate having an alkyl group with 2 or more carbon atoms and (b) a (meth) acrylic monomer having an OH group can be used.
Specific examples of the alkyl (meth) acrylate (a) include ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, and mixtures thereof, Pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, heptadecyl (meth) acrylate, octadecyl (meth) acrylate, nonadecyl (meth) acrylate, eicosyl (meth) acrylate, and the like. The alkyl (meth) acrylate (a) may be used singly or in combination of 2 or more.
As described above, the alkyl group of the alkyl (meth) acrylate (a) has 2 or more, preferably 4 or more, more preferably 4 to 20, and still more preferably 6 to 18 carbon atoms. By using the alkyl (meth) acrylate (a) having such an alkyl group, an adhesive layer in which a chemical solution (for example, an acidic or basic chemical solution) is difficult to impregnate can be formed.
Specific examples of the (meth) acrylic monomer (b) having an OH group include hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, hydroxyhexyl (meth) acrylate, hydroxyoctyl (meth) acrylate, hydroxydecyl (meth) acrylate, hydroxylauryl (meth) acrylate, and (4-hydroxymethylcyclohexyl) methyl methacrylate. As the (meth) acrylic monomer (b), a carboxyl group-containing (meth) acrylic monomer such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, or the like can also be used. The (meth) acrylic monomer (b) may be used singly or in combination of 2 or more.
The (meth) acrylic polymer contained in the acrylic adhesive I may contain a structural unit corresponding to another monomer copolymerizable with the alkyl (meth) acrylate (a) and/or the (meth) acrylic monomer (b) as necessary for the purpose of modification of cohesion, heat resistance, crosslinkability, and the like. Examples of such monomers include methyl (meth) acrylate; anhydride monomers such as maleic anhydride and itaconic anhydride; sulfonic acid group-containing monomers such as styrenesulfonic acid, allylsulfonic acid, 2- (meth) acrylamide-2-methylpropanesulfonic acid, (meth) acrylamidopropanesulfonic acid, (meth) sulfopropyl acrylate, and (meth) acryloyloxynaphthalenesulfonic acid; (N-substituted) amide monomers such as (meth) acrylamide, N-dimethyl (meth) acrylamide, N-butyl (meth) acrylamide, N-methylol (meth) acrylamide and N-methylol propane (meth) acrylamide; aminoalkyl ester (meth) acrylate monomers such as aminoethyl (meth) acrylate, N-dimethylaminoethyl (meth) acrylate, and t-butylaminoethyl (meth) acrylate; alkoxyalkyl (meth) acrylate monomers such as methoxyethyl (meth) acrylate and ethoxyethyl (meth) acrylate; maleimide monomers such as N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide and N-phenylmaleimide; itaconimide-based monomers such as N-methylitaconimide, N-ethylitaconimide, N-butylitaconimide, N-octylitaconimide, N-2-ethylhexyl itaconimide, N-cyclohexylitaconimide and N-lauryl itaconimide; succinimide monomers such as N- (meth) acryloyloxymethylene succinimide, N- (meth) acryloyl-6-oxyhexamethylene succinimide, and N- (meth) acryloyl-8-oxyoctamethylene succinimide; vinyl monomers such as vinyl acetate, vinyl propionate, N-vinylpyrrolidone, methyl-vinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperazine, vinylpyrazine, vinylpyrrole, vinylimidazole, vinyloxazole, vinylmorpholine, N-vinylcarboxylic acid amides, styrene, alpha-methylstyrene and N-vinylcaprolactam; cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; epoxy group-containing acrylic monomers such as glycidyl (meth) acrylate; glycol-based acrylate monomers such as polyethylene glycol (meth) acrylate, polypropylene glycol (meth) acrylate, methoxyethylene glycol (meth) acrylate, and methoxypolypropylene glycol (meth) acrylate; acrylate monomers having a heterocycle, a halogen atom, a silicon atom, and the like, such as tetrahydrofurfuryl (meth) acrylate, fluoro (meth) acrylate, and silicone (meth) acrylate; polyfunctional monomers such as hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy acrylate, polyester acrylate, and urethane acrylate; olefin monomers such as isoprene, butadiene, and isobutylene; vinyl ether monomers such as vinyl ether. These monomer components may be used alone or in combination of 2 or more.
The (meth) acrylic polymer contained in the acrylic adhesive I is obtained by polymerizing an alkyl (meth) acrylate (a) having an alkyl group having 2 or more carbon atoms, a (meth) acrylic monomer (b) having an OH group, and another monomer (c) used as needed by an arbitrary appropriate polymerization method. The (meth) acrylic polymer thus obtained contains: a structural unit A derived from an alkyl (meth) acrylate having an alkyl group with 2 or more carbon atoms (preferably 4 or more, more preferably 4 to 20, and further preferably 6 to 18), and a structural unit B derived from a (meth) acrylic monomer having an OH group. That is, the (meth) acrylic polymer contains: a structural unit A having an alkyl group having 2 or more carbon atoms in a side chain, and a structural unit B having an OH group.
The content ratio of the (meth) acrylic polymer containing the structural unit a and the structural unit B is preferably 50 to 100 parts by weight, more preferably 60 to 98 parts by weight, and still more preferably 65 to 90 parts by weight, based on 100 parts by weight of the solid content in the acrylic adhesive I.
The content ratio of the structural unit a derived from an alkyl (meth) acrylate having an alkyl group with 2 or more carbon atoms is preferably 70 to 98 parts by weight, more preferably 80 to 95 parts by weight, and still more preferably 85 to 95 parts by weight, based on 100 parts by weight of the (meth) acrylic polymer.
The content ratio of the structural unit B derived from a (meth) acrylic monomer having an OH group is preferably 1 to 30 parts by weight, more preferably 2 to 20 parts by weight, and still more preferably 3 to 10 parts by weight, based on 100 parts by weight of the (meth) acrylic polymer.
In the (meth) acrylic polymer contained in the acrylic adhesive I, the molar ratio (C/OH) of carbon (C) in the side chain alkyl group to OH group is preferably 40 to 150, more preferably 42 to 120, further preferably 50 to 100, particularly preferably 55 to 80, and most preferably 55 to 75. The molar ratio (C/OH) can be determined from the amount of the monomer(s) forming the structural unit having a side chain alkyl group (i.e., the alkyl (meth) acrylate (a), the optionally used methyl (meth) acrylate), the molecular weight, the number of side chain alkyl groups, and the amount of the (meth) acrylic monomer (b) having an OH group, the molecular weight, and the number of OH groups. For example, as a material for forming a composite material havingMonomers of structural units of pendant alkyl groups and use of monomers a1Monomer a2And a monomer a3And a monomer b is used as the (meth) acrylic monomer (b)1Monomer b2In this case, the molar ratio (C/OH) can be determined by the following formula (1).
[ mathematical formula 1]
{ (monomer a)1Number of alkyl groups in (1) × (monomer a)1(amount of monomer a)/(amount of monomer a) to be blended (g))/(1Molecular weight of) }
+ { (monomer a)2Number of alkyl groups in (1) × (monomer a)2(amount of monomer a)/(amount of monomer a) to be blended (g))/(2Molecular weight of) }
+ { (monomer a)3Number of alkyl groups in (1) × (monomer a)3(amount of monomer a)/(amount of monomer a) to be blended (g))/(3Molecular weight of) }
/{ (monomer b)1Number of hydroxyl groups in (1) × (monomer b)1(amount of monomer b))/(amount of monomer b)1Molecular weight of) }
+ { (monomer b)2Number of hydroxyl groups in (1) × (monomer b)2(amount of monomer b))/(amount of monomer b)2Molecular weight of) } … (1)
In the present invention, by adding a predetermined amount of an alkyl group having 2 or more carbon atoms to the (meth) acrylic polymer as the base polymer, the polarity of the pressure-sensitive adhesive layer can be reduced, and intrusion of a chemical solution (for example, an acidic or basic chemical solution) can be prevented. On the other hand, when the polarity of the pressure-sensitive adhesive layer is too low, sufficient adhesive force cannot be obtained, but in the present invention, by further including OH groups in the (meth) acrylic polymer and setting the molar ratio of carbon (C) having a side chain alkyl group to OH groups (C/OH) within the above range, it is possible to prevent the chemical solution from entering the pressure-sensitive adhesive layer while maintaining the adhesive property. The heat-peelable pressure-sensitive adhesive sheet of the present invention having the pressure-sensitive adhesive layer capable of exhibiting excellent adhesiveness by containing a predetermined amount of OH groups can also effectively prevent the chemical solution from entering the interface between the pressure-sensitive adhesive sheet and the adherend. When the chemical solution is prevented from entering, deterioration of the adhesive can be suppressed, and thus excellent adhesiveness can be maintained. Further, since the heat-expandable microspheres in the pressure-sensitive adhesive layer can be inhibited from being altered by the chemical solution, the heat-peelable property is not impaired even when the pressure-sensitive adhesive is used in an acidic or alkaline chemical solution. Further, the binder composed of the (meth) acrylic polymer is less likely to impair expansion or foaming of the thermally expandable microspheres. The heat-peelable pressure-sensitive adhesive sheet having these effects can be suitably used as a protective sheet in a step using an acidic or alkaline chemical solution, such as an etching treatment step.
The weight average molecular weight of the (meth) acrylic polymer (value measured by gel permeation chromatography (solvent: THF) using a calibration curve of standard polystyrene) is preferably 10 to 300 ten thousand, more preferably 20 to 250 ten thousand, and further preferably 30 to 200 ten thousand in terms of polystyrene.
< additives >
The acrylic adhesive I may contain any appropriate additive as needed. Examples of the additives include crosslinking agents, tackifiers, plasticizers (e.g., trimellitate ester-based plasticizers and pyromellitic ester-based plasticizers), pigments, dyes, fillers, antioxidants, conductive materials, antistatic agents, ultraviolet absorbers, light stabilizers, release control agents, softeners, surfactants, flame retardants, and antioxidants.
As the above tackifier, any suitable tackifier can be used. As the tackifier, for example, a tackifier resin can be used. Specific examples of the tackifier resin include rosin-based tackifier resins (e.g., unmodified rosin, modified rosin, rosin phenol-based resin, rosin ester-based resin, etc.), terpene-based tackifier resins (e.g., terpene-based resin, terpene phenol-based resin, styrene-modified terpene-based resin, aromatic-modified terpene-based resin, hydrogenated terpene-based resin), hydrocarbon-based tackifier resins (e.g., aliphatic hydrocarbon resin, aliphatic cyclic hydrocarbon resin, aromatic hydrocarbon resin (e.g., styrene-based resin, xylene-based resin, etc.), aliphatic/aromatic petroleum resin, aliphatic/alicyclic petroleum resin, hydrogenated hydrocarbon resin, coumarone-based resin, coumarone-indene-based resin, etc.), phenol-based tackifier resins (e.g., alkylphenol-based resin, xylene formaldehyde-based resin, resol, novolak, etc.), ketone-based tackifier resins, and the like, Polyamide-based tackifying resins, epoxy-based tackifying resins, elastic-based tackifying resins, and the like. Among them, a rosin-based tackifier resin, a terpene-based tackifier resin, or a hydrocarbon-based tackifier resin (styrene-based resin, etc.) is preferable. The tackifier may be used singly or in combination of 2 or more.
Commercially available tackifiers can be used. Specific examples of commercially available tackifiers include terpene phenol resins such as YASUHARA chemcal co., ltd., trade name "YS POLYSTAR S145", "Mighty Ace K140", and trade name "TAMANOL 901", manufactured by seikagawa CHEMICAL corporation; rosin phenol resins such as "SUMILITERISI PR-12603" which is a trade name manufactured by Sumitomo Bakelite Company Limited and "TAMANOL 361" which is a trade name manufactured by Kawakawa chemical Co., Ltd; alkylphenol resins such as "TAMANOL 1010R" and "TAMANOL 200N" manufactured by seikagawa chemical corporation; and alicyclic saturated hydrocarbon resins such as ARKON P-140, trade name of crude chemical Co., Ltd.
The amount of the tackifier added is preferably 40 parts by weight or less, more preferably 30 parts by weight or less, further preferably 25 parts by weight or less, and further preferably 15 to 25 parts by weight, based on 100 parts by weight of the pressure-sensitive adhesive layer. When the content is within this range, a pressure-sensitive adhesive layer having excellent adhesive strength and unevenness follow-up property can be formed. When a pressure-sensitive adhesive layer having excellent unevenness follow-up properties is formed, the chemical solution is significantly prevented from entering between the pressure-sensitive adhesive layer and the adherend.
The hydroxyl value of the thickener is preferably not less than 10mgKOH/g, more preferably 40mgKOH/g to 400 mgKOH/g. Within such a range, adhesion and prevention of entry of a chemical solution are both achieved, and the effect of the present invention is remarkable.
Examples of the crosslinking agent include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, urea-based crosslinking agents, metal alkoxide-based crosslinking agents, metal chelate-based crosslinking agents, metal salt-based crosslinking agents, carbodiimide-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, and amine-based crosslinking agents. Among them, an isocyanate-based crosslinking agent or an epoxy-based crosslinking agent is preferable.
Specific examples of the isocyanate-based crosslinking agent include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; alicyclic isocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate and isophorone diisocyanate; aromatic isocyanates such as 2, 4-tolylene diisocyanate, 4' -diphenylmethane diisocyanate, and xylylene diisocyanate; an isocyanate adduct such as a trimethylolpropane/tolylene diisocyanate trimer adduct (trade name "CORONATE L" manufactured by Nippon polyurethane industries Co., Ltd.), a trimethylolpropane/hexamethylene diisocyanate trimer adduct (trade name "CORONATE HL" manufactured by Nippon polyurethane industries Co., Ltd.), and an isocyanurate product of hexamethylene diisocyanate (trade name "CORONATE HX" manufactured by Nippon polyurethane industries Co., Ltd.). The content of the isocyanate-based crosslinking agent may be set to an arbitrary appropriate amount according to the desired adhesive force, and is typically 0.1 to 20 parts by weight, more preferably 0.5 to 10 parts by weight, based on 100 parts by weight of the base polymer (i.e., (meth) acrylic polymer) in the acrylic adhesive I.
Examples of the epoxy-based crosslinking agent include N, N, N ', N' -tetraglycidyl m-xylylenediamine, diglycidylaniline, 1, 3-bis (N, N-glycidylaminomethyl) cyclohexane (trade name "TETRAD C" manufactured by Mitsubishi gas chemical Co., Ltd.), 1, 6-hexanediol diglycidyl ether (trade name "Eplight 1600" manufactured by Co., Ltd.), neopentyl glycol diglycidyl ether (trade name "Eplight 1500 NP" manufactured by Co., Ltd.), ethylene glycol diglycidyl ether (trade name "Eplight 40E" manufactured by Co., Ltd.), propylene glycol diglycidyl ether (trade name "Eplight 70P" manufactured by Co., Ltd.), polyethylene glycol diglycidyl ether (trade name "Eplight 70P" manufactured by Nippon oil & fat chemical Co., Ltd.), and the like, Trade name "EPIOL E-400"), polypropylene glycol diglycidyl ether (trade name "EPIOL P-200" manufactured by Nippon fat and oil Co., Ltd.), sorbitol polyglycidyl ether (trade name "Denacol EX-611" manufactured by Nagase ChemteX Corporation), glycerol polyglycidyl ether (trade name "Denacol EX-314" manufactured by Nagase ChemteX Corporation), pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether (trade name "Denacol EX-512" manufactured by Nagase ChemteX Corporation), sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipic acid diglycidyl ester, phthalic acid diglycidyl ester, triglycidyl-tris (2-hydroxyethyl) isocyanurate, resorcinol diglycidyl ether, bisphenol S diglycidyl ether, epoxy resins having 2 or more epoxy groups in the molecule, and the like. The content of the epoxy crosslinking agent may be set to an arbitrary appropriate amount according to the desired adhesive strength, and is typically 0.01 to 10 parts by weight, more preferably 0.03 to 5 parts by weight, based on 100 parts by weight of the base polymer.
B-2. thermally expandable microspheres
The thermally expandable microspheres are microspheres that can be expanded or foamed by heating. A heat-peelable pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer containing the heat-expandable microspheres has sufficient adhesive strength when adhesive strength is required and has excellent peelability when peeling is required, because unevenness occurs on the bonding surface by heating and the adhesive strength is reduced. As described above, in the present invention, the thermally-expansible microballs are hardly deteriorated even when exposed to an acidic or alkaline chemical solution, and can sufficiently exhibit the above-described functions as thermally-expansible microballs.
The content ratio of the thermally expandable microspheres may be appropriately set according to the desired adhesive force reducing property and the like. The content of the thermally expandable microspheres is, for example, 1 to 150 parts by weight, preferably 10 to 130 parts by weight, and more preferably 25 to 100 parts by weight, based on 100 parts by weight of the (meth) acrylic polymer in the acrylic adhesive I.
As the thermally expandable microspheres, any suitable thermally expandable microspheres can be used. As the thermally expandable microspheres, for example, microspheres obtained by incorporating a substance that is easily expanded by heating into an elastic shell can be used. Such heat-expandable microspheres can be produced by any suitable method, for example, an agglomeration method, an interfacial polymerization method, or the like.
Examples of the substance which is easily expanded by heating include low boiling point liquids such as propane, propylene, butene, n-butane, isobutane, isopentane, neopentane, n-pentane, n-hexane, isohexane, heptane, octane, petroleum ether, halides of methane, and tetraalkylsilane; azodicarbonamide vaporized by pyrolysis, and the like.
Examples of the substance constituting the shell include polymers composed of the following monomers: nitrile monomers such as acrylonitrile, methacrylonitrile, α -chloroacrylonitrile, α -ethoxyacrylonitrile, and fumaronitrile; carboxylic acid monomers such as acrylic acid, methacrylic acid, itaconic acid, maleic acid, fumaric acid, and citraconic acid; vinylidene chloride; vinyl acetate; (meth) acrylates such as methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, isobornyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, and β -carboxyethyl acrylate; styrene monomers such as styrene, alpha-methylstyrene, chlorostyrene and the like; amide monomers such as acrylamide, substituted acrylamide, methacrylamide, and substituted methacrylamide, and the like. The polymer composed of these monomers may be a homopolymer or a copolymer. Examples of the copolymer include a vinylidene chloride-methyl methacrylate-acrylonitrile copolymer, a methyl methacrylate-acrylonitrile-methacrylonitrile copolymer, a methyl methacrylate-acrylonitrile copolymer, and an acrylonitrile-methacrylonitrile-itaconic acid copolymer.
As the thermally expandable microspheres, an inorganic foaming agent or an organic foaming agent can be used. Examples of the inorganic blowing agent include ammonium carbonate, ammonium hydrogen carbonate, sodium hydrogen carbonate, ammonium nitrite, sodium borohydride, and various azides. Examples of the organic blowing agent include chlorofluorinated alkane compounds such as trichloromonofluoromethane and dichloromonofluoromethane; azo compounds such as azobisisobutyronitrile, azodicarbonamide, and barium azodicarboxylate; hydrazine compounds such as p-toluenesulfonyl hydrazide, diphenylsulfone-3, 3 '-disulfonyl hydrazide, 4' -oxybis-benzenesulfonyl hydrazide and allyldisulfonyl hydrazide; semicarbazide-based compounds such as p-toluenesulfonyl semicarbazide and 4, 4' -oxybis (benzenesulfonyl semicarbazide); triazole-based compounds such as 5-morpholino-1, 2,3, 4-thiotriazole; and N-nitroso compounds such as N, N ' -dinitrosopentamethylenetetramine and N, N ' -dimethyl-N, N ' -dinitrosoterephthalamide.
Commercially available products can be used as the thermally expandable microspheres. Specific examples of commercially available heat-expandable microspheres include "Matsumoto Microsphere" (grades: F-30, F-30D, F-36D, F-36LV, F-50D, F-65, F-65D, FN-100SS, FN-100SSD, FN-180SS, FN-180SSD, F-190D, F-260D, F-2800D), Japan Fillite Co., trade name "Expancel" (grades: 053-40, 031-40, 920-40, 909-80, 930) manufactured by Ltd, and "IFDAOAM" (grades: H750, H850, H1100, S2320D, S2640D, M330, M430, M520) manufactured by Wuhui chemical industries, Ltd, and "EML 101" (grade: EML101 manufactured by chemical industries, Ltd, EMH204, EHM301, EHM302, EHM303, EM304, EHM401, EM403, EM501), etc.
The particle diameter of the thermally expandable microspheres before heating is preferably 0.5 to 80 μm, more preferably 5 to 45 μm, still more preferably 10 to 20 μm, and particularly preferably 10 to 15 μm. Therefore, when the particle size of the thermally expandable microspheres before heating is described as an average particle size, it is preferably 6 to 45 μm, more preferably 15 to 35 μm. The particle diameter and the average particle diameter are values obtained by a particle size distribution measurement method in the laser light scattering method.
The thermally expandable microspheres preferably have a suitable strength so as not to crack until the volume expansion ratio reaches preferably 5 times or more, more preferably 7 times or more, and still more preferably 10 times or more. When such thermally expandable microspheres are used, the adhesive force can be effectively reduced by heat treatment.
B-3. characteristics of the first adhesive layer, etc
The thickness of the first pressure-sensitive adhesive layer is preferably 1 to 100. mu.m, more preferably 5 to 80 μm, and particularly preferably 10 to 50 μm. As described above, the first adhesive layer is a layer containing thermally expandable microspheres. Thus, the thickness of the first adhesive layer means: a distance from an outer side surface (a surface on the opposite side from the substrate) of the first adhesive layer to an innermost end portion of the thermally-expansible microballs closest to the substrate when the first adhesive layer is viewed in a cross section in the thickness direction.
The difference between the thickness of the first pressure-sensitive adhesive layer and the average particle diameter of the thermally expandable microspheres contained in the first pressure-sensitive adhesive layer (thickness-average particle diameter) is preferably 8 μm or more, more preferably 10 μm or more, still more preferably 15 μm or more, particularly preferably 20 μm or more, and most preferably 25 to 100 μm. When the amount is within this range, the first pressure-sensitive adhesive layer has appropriate surface roughness, and a heat-peelable pressure-sensitive adhesive sheet in which the chemical solution is less likely to enter the interface between the first pressure-sensitive adhesive layer and the adherend can be obtained.
The elastic modulus of the first pressure-sensitive adhesive layer at 25 ℃ measured by nanoindentation is preferably 0.01 to 50MPa, more preferably 0.1 to 10MPa, and particularly preferably 0.5 to 5 MPa. When the elastic modulus of the pressure-sensitive adhesive layer is in the above range, a heat-peelable pressure-sensitive adhesive sheet having excellent adhesiveness, cuttability, and step following properties can be obtained. The elastic modulus measured by the nanoindentation method means: the load and the depth of penetration of the indenter when the indenter is pressed into the sample are continuously measured over the time of loading and unloading, and the elastic modulus is obtained from the load-depth of penetration curve obtained. In this specification, the elastic modulus measured by the nanoindentation method means: the measurement conditions were set as load: 1mN, load/unload speed: 0.1mN/s, retention time: 1s, and the modulus of elasticity determined as described above.
The elastic modulus of the first pressure-sensitive adhesive layer can be adjusted by the composition of the base polymer constituting the pressure-sensitive adhesive in the pressure-sensitive adhesive layer, or the like. In addition, an additive may be added to the first adhesive layer to adjust the elastic modulus. For example, when the beads are contained in the first pressure-sensitive adhesive layer, the elastic modulus of the pressure-sensitive adhesive layer can be increased. Examples of the beads include glass beads and resin beads. The average particle diameter of the beads is, for example, 0.01 to 50 μm. The amount of the beads added is, for example, 10 to 200 parts by weight, preferably 20 to 100 parts by weight, based on 100 parts by weight of the entire adhesive layer.
The arithmetic mean roughness Ra of the contour of the bonding surface of the first pressure-sensitive adhesive layer is preferably 1 μm or less, more preferably 0.01 to 1 μm, still more preferably 0.03 to 0.8 μm, and particularly preferably 0.06 to 0.6 μm. When the amount is within this range, a heat-peelable pressure-sensitive adhesive sheet in which the chemical solution hardly penetrates into the interface between the first pressure-sensitive adhesive layer and the adherend can be obtained. The surface roughness Ra was measured in accordance with JIS B0601.
The contact angle of water with respect to the first pressure-sensitive adhesive layer is preferably 85 ° to 115 °, more preferably 87 ° to 115 °, and particularly preferably 90 ° to 115 °. When the contact angle of water is larger than 115 °, that is, when the hydrophobicity of the pressure-sensitive adhesive layer is high, there is a fear that sufficient adhesive properties cannot be obtained. On the other hand, when the contact angle of water is less than 85 °, that is, when the hydrophobicity of the pressure-sensitive adhesive layer is too low, the chemical solution may enter the interface between the pressure-sensitive adhesive layer and the adherend.
The gel fraction of the first pressure-sensitive adhesive layer is preferably 50% or more, more preferably 52% to 99%, and still more preferably 55% to 99%. Within such a range, the chemical solution can be prevented from entering the adhesive layer. The gel fraction of the adhesive layer can be adjusted by controlling the composition of the base polymer constituting the adhesive, the kind and content of the crosslinking agent, the kind and content of the tackifier, and the like. The gel fraction is measured by the method described below.
C. Second adhesive layer
C-1. adhesive
The second adhesive layer comprises any suitable adhesive. The adhesive contained in the second adhesive layer includes, for example, an acrylic adhesive, a rubber adhesive, a vinyl alkyl ether adhesive, a silicone adhesive, a polyester adhesive, a polyamide adhesive, a urethane adhesive, a styrene-diene block copolymer adhesive, an active energy ray-curable adhesive, and the like, from the viewpoint of adhesion, and from the viewpoint of not suppressing expansion or foaming of the thermally expandable microspheres in heating when the second adhesive layer contains the thermally expandable microspheres. The adhesive may be a creep property improving adhesive containing a hot-melt resin having a melting point of about 200 ℃ or lower. The creep property-improving adhesive is described in detail in Japanese patent application laid-open Nos. 56-61468 and 63-17981. Among the above adhesives, an acrylic adhesive or a rubber adhesive can be preferably used. The above-mentioned binders may be used singly or in combination of 2 or more.
As the acrylic adhesive contained in the second adhesive layer, any suitable acrylic adhesive can be used. Examples of the acrylic adhesive include an acrylic adhesive containing, as a base polymer, an acrylic polymer (homopolymer or copolymer) containing 1 or 2 or more kinds of alkyl (meth) acrylates as monomer components. In one embodiment, the acrylic adhesive I described in the above item B may be used.
Examples of the rubber-based adhesive include those having, as a base polymer, the following rubbers: natural rubber; synthetic rubbers such as polyisoprene rubber, styrene-butadiene (SB) rubber, styrene-isoprene (SI) rubber, styrene-isoprene-styrene block copolymer (SIs) rubber, styrene-butadiene-styrene block copolymer (SBs) rubber, styrene-ethylene-butylene-styrene block copolymer (SEBS) rubber, styrene-ethylene-propylene-styrene block copolymer (SEPS) rubber, styrene-ethylene-propylene block copolymer (SEP) rubber, reclaimed rubber, butyl rubber, polyisobutylene, and modified products thereof.
As the binder contained in the second binder layer, an active energy ray-curable binder that can be cured (with a high elastic modulus) by irradiation with an active energy ray can be used. When an active energy ray-curable pressure-sensitive adhesive is used, a heat-peelable pressure-sensitive adhesive sheet can be obtained which has low elasticity and high flexibility at the time of sticking, has excellent handling properties, and can reduce adhesive strength by irradiation with active energy rays when peeling is required. Examples of the active energy ray include gamma rays, ultraviolet rays, visible rays, infrared rays (heat rays), radio waves, alpha rays, beta rays, electron beams, plasma current, ionizing rays, particle beams, and the like.
Examples of the resin material constituting the active energy ray-curable adhesive include those described in, for example, the ultraviolet curing system (Kangtao Kangshui, published by the general technology center, (1989)), the light curing technology (published by the technical information Association (2000)), Japanese patent application laid-open No. 2003-292916, and Japanese patent application laid-open No. 4151850. More specifically, a resin material (R1) containing a polymer serving as a mother agent and an active energy ray-reactive compound (monomer or oligomer), a resin material (R2) containing an active energy ray-reactive polymer, and the like can be given.
Examples of the polymer to be the mother agent include rubber-based polymers such as natural rubber, polyisobutylene rubber, styrene-butadiene rubber, styrene-isoprene-styrene block copolymer rubber, reclaimed rubber, butyl rubber, polyisobutylene rubber, and nitrile rubber (NBR); a silicone-based polymer; acrylic polymers, and the like. These polymers may be used alone or in combination of 2 or more.
Examples of the active energy ray-reactive compound include photoreactive monomers or oligomers having a functional group having a carbon-carbon multiple bond such as an acryloyl group, a methacryloyl group, a vinyl group, an allyl group, or an ethynyl group. Specific examples of the photoreactive monomer or oligomer include (meth) acryloyl group-containing compounds such as trimethylolpropane tri (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1, 4-butanediol di (meth) acrylate, 1, 6-hexanediol di (meth) acrylate, and polyethylene glycol di (meth) acrylate; 2-5 mer of the (meth) acryloyl group-containing compound, and the like.
As the active energy ray-reactive compound, monomers such as epoxidized butadiene, glycidyl methacrylate, acrylamide and vinyl siloxane; or an oligomer composed of the monomer. The resin material (R1) containing these compounds can be cured by high-energy rays such as ultraviolet rays and electron beams.
Further, as the active energy ray-reactive compound, a mixture of an organic salt such as an onium salt and a compound having a plurality of heterocyclic rings in the molecule may be used. The mixture is irradiated with active energy rays (e.g., ultraviolet rays or electron beams) to cleave the organic salt and generate ions, and the ions serve as initiating species to initiate a ring-opening reaction of the heterocyclic ring, thereby forming a three-dimensional network structure. Examples of the organic salts include iodonium salts, phosphonium salts, antimony salts, sulfonium salts, and borate salts. Examples of the heterocyclic ring in the compound having a plurality of heterocyclic rings in the molecule include an oxetane, an oxolane, a thiirane, and an aziridine.
Further, as the active energy ray-reactive compound, a mixture of an organic salt such as an onium salt and a compound having a plurality of heterocyclic rings in the molecule may be used. The mixture is irradiated with active energy rays (e.g., ultraviolet rays or electron beams) to cleave the organic salt and generate ions, and the ions serve as initiating species to initiate a ring-opening reaction of the heterocyclic ring, thereby forming a three-dimensional network structure. Examples of the organic salts include iodonium salts, phosphonium salts, antimony salts, sulfonium salts, and borate salts. Examples of the heterocyclic ring in the compound having a plurality of heterocyclic rings in the molecule include an oxetane, an oxolane, a thiirane, and an aziridine.
In the resin material (R1) containing the polymer as the base agent and the active energy ray-reactive compound, the content ratio of the active energy ray-reactive compound is preferably 0.1 to 500 parts by weight, more preferably 1 to 300 parts by weight, and still more preferably 10 to 200 parts by weight, based on 100 parts by weight of the polymer as the base agent.
The resin material (R1) containing the polymer as the base and the active energy ray-reactive compound may contain any appropriate additive as needed. Examples of the additives include an active energy ray polymerization initiator, an active energy ray polymerization accelerator, a crosslinking agent, a plasticizer, and a vulcanizing agent. As the active energy ray polymerization initiator, any suitable initiator can be used depending on the kind of active energy ray used. The active energy ray polymerization initiator may be used alone or in combination of 2 or more. In the resin material (R1) comprising the polymer as the base agent and the active energy ray-reactive compound, the content ratio of the active energy ray polymerization initiator is preferably 0.1 to 10 parts by weight, more preferably 1 to 5 parts by weight, based on 100 parts by weight of the polymer as the base agent.
Examples of the active energy ray-reactive polymer include polymers containing functional groups having carbon-carbon multiple bonds, such as acryloyl groups, methacryloyl groups, vinyl groups, allyl groups, and ethynyl groups. Specific examples of the polymer having an active energy ray-reactive functional group include polymers composed of polyfunctional (meth) acrylates; a photo-cationic polymerizable polymer; cinnamoyl group-containing polymers such as polyvinyl cinnamate; a diazotized amino novolac resin; polyacrylamide, and the like. As the resin material (R2) containing an active energy ray-reactive polymer, a mixture of an active energy ray-reactive polymer having an allyl group and a compound having a thiol group may be used. In addition to the polymer having an active energy ray-reactive functional group, an oligomer having an active energy ray-reactive functional group may be used as long as a pressure-sensitive adhesive layer precursor having a practical hardness (viscosity) can be formed before curing by irradiation with an active energy ray (for example, when a heat-peelable pressure-sensitive adhesive sheet is stuck).
The above-mentioned resin material (R2) containing an active energy ray-reactive polymer may further contain the above-mentioned active energy ray-reactive compound (monomer or oligomer). The resin material (R2) containing the active energy ray-reactive polymer may further contain any appropriate additive as needed. Specific examples of the additives are the same as those which can be contained in the resin material (R1) containing the polymer to be the base resin and the active energy ray-reactive compound. In the resin material (R2) containing an active energy ray-reactive polymer, the content ratio of the active energy ray polymerization initiator is preferably 0.1 to 10 parts by weight, more preferably 1 to 5 parts by weight, based on 100 parts by weight of the active energy ray-reactive polymer.
The adhesive contained in the second adhesive layer may contain any appropriate additive as needed. Examples of the additives include those described in the above item B-1. The amount of additives (such as a thickener and a crosslinking agent) added is preferably the amount described in item B-1. Therefore, in one embodiment, the second adhesive layer may contain a tackifier, and the content ratio of the tackifier is preferably 40 parts by weight or less, more preferably 30 parts by weight or less, further preferably 25 parts by weight or less, and further preferably 3 parts by weight to 25 parts by weight with respect to 100 parts by weight of the adhesive layer.
C-2 thermally expandable microspheres
In one embodiment, the second adhesive layer further comprises the thermally expandable microspheres described in item B-2. In the second pressure-sensitive adhesive layer, the content of the thermally expandable microspheres is, for example, 1 to 150 parts by weight, preferably 10 to 130 parts by weight, and more preferably 25 to 100 parts by weight, based on 100 parts by weight of the base polymer in the pressure-sensitive adhesive forming the second pressure-sensitive adhesive layer.
C-3. characteristics of the second adhesive layer, etc
The thickness of the second pressure-sensitive adhesive layer is preferably 1 to 100. mu.m, more preferably 5 to 80 μm, and particularly preferably 10 to 50 μm. When the second adhesive layer contains thermally expandable microspheres, the thickness of the second adhesive layer is, similarly to the thickness of the first adhesive layer: a distance from an outer side surface (a surface on the opposite side from the substrate) of the second adhesive layer to an innermost end portion of the thermally-expansible microballs closest to the substrate when the second adhesive layer is viewed in a cross section in the thickness direction.
When the second pressure-sensitive adhesive layer contains thermally expandable microspheres, the difference (thickness-average particle diameter) between the thickness of the second pressure-sensitive adhesive layer and the average particle diameter of the thermally expandable microspheres contained in the second pressure-sensitive adhesive layer is preferably 8 μm or more, more preferably 10 μm or more, still more preferably 15 μm or more, particularly preferably 25 μm or more, and most preferably 25 to 100 μm.
The elastic modulus of the second pressure-sensitive adhesive layer at 25 ℃ measured by nanoindentation is preferably 0.01 to 50MPa, more preferably 0.1 to 10MPa, and particularly preferably 0.5 to 5 MPa.
The arithmetic mean roughness Ra of the contour of the bonding surface of the second pressure-sensitive adhesive layer is preferably 1 μm or less, more preferably 0.01 to 1 μm, still more preferably 0.03 to 0.8 μm, and particularly preferably 0.06 to 0.6 μm.
The contact angle of water with respect to the second adhesive layer is preferably 85 ° to 115 °, more preferably 87 ° to 115 °, and particularly preferably 90 ° to 115 °.
The gel fraction of the second pressure-sensitive adhesive layer is preferably 50% or more, more preferably 52% to 99%, and still more preferably 55% to 99%. Within such a range, the chemical solution can be prevented from entering the adhesive layer.
D. Base material
Examples of the substrate include a resin sheet, a nonwoven fabric, paper, a metal foil, a woven fabric, a rubber sheet, and a foamed sheet. Further, a substrate composed of a laminate of these (particularly a laminate including a resin sheet), or a composite substrate obtained by using a plurality of materials among these as a raw material can be used. Examples of the resin constituting the resin sheet include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), Polyethylene (PE), polypropylene (PP), an ethylene-propylene copolymer, an ethylene-vinyl acetate copolymer (EVA), polyamide (nylon), wholly aromatic polyamide (aramid), Polyimide (PI), polyvinyl chloride (PVC), Polyphenylene Sulfide (PPs), a fluorine-based resin, polyether ether ketone (PEEK), urethane acrylate, and an acrylic resin (preferably, a UV-curable acrylic resin). Among them, from the viewpoint of acid resistance, PET, PEN, PE, or PP can be preferably used. Examples of the nonwoven fabric include: nonwoven fabrics made of heat-resistant natural fibers, such as nonwoven fabrics containing abaca; and synthetic resin nonwoven fabrics such as polypropylene resin nonwoven fabrics, polyethylene resin nonwoven fabrics, and ester resin nonwoven fabrics.
The elastic modulus of the substrate is preferably 10MPa to 10GPa as measured at 25 ℃ by a nanoindentation method. The elastic modulus of the substrate measured by nanoindentation at 25 ℃ is more preferably 100MPa to 5GPa, and particularly preferably 500MPa to 5 GPa. Within such a range, a heat-peelable pressure-sensitive adhesive sheet having excellent cutting properties and excellent handleability at the time of bonding can be obtained.
The thickness of the substrate is preferably 1 to 1000. mu.m, more preferably 2 to 250. mu.m, and particularly preferably 10 to 100. mu.m. Within such a range, a heat-peelable pressure-sensitive adhesive sheet having excellent cutting properties and excellent handleability at the time of bonding can be obtained.
The substrate may be surface-treated. Examples of the surface treatment include corona treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment, and coating treatment with an organic coating material. Such surface treatment can improve adhesion between the pressure-sensitive adhesive layer and the substrate and suppress the intrusion of a chemical solution into the interface between the pressure-sensitive adhesive layer and the substrate. In particular, the coating treatment with an organic coating material is preferable because anchor failure of the pressure-sensitive adhesive layer can be suppressed at the time of thermal peeling.
Examples of the organic coating material include those described in plastic hard coat material II (Japanese: プラスチックハードコート material II) (published by CMC, (2004)). Urethane-based polymers may be preferably used, and more preferably, polyacrylic urethane, polyester urethane, or precursors thereof are used. This is because: the coating of the substrate is simple and industrially available and can be selected from a wide variety of substances and obtained at low cost. The urethane polymer is, for example, a polymer formed from a reaction mixture of an isocyanate monomer and an alcoholic hydroxyl group-containing monomer (for example, a hydroxyl group-containing acrylic compound or a hydroxyl group-containing ester compound). The organic coating material may contain, as optional additives, a chain extender such as polyamine, an antioxidant, an oxidation stabilizer, and the like. The thickness of the organic coating layer is not particularly limited, and is, for example, suitably about 0.1 to 10 μm, preferably about 0.1 to 5 μm, and more preferably about 0.5 to 5 μm. As the organic coating material, commercially available products such as ARACOAT series (for example, a combination of trade name "AP 2500E" and trade name "CL 2500" as a curing agent) manufactured by Mitsubishi chemical industries, Ltd., trade name "NB 300" and trade name "HR Color" manufactured by Daihai chemical industries, Ltd., can be used.
E. Elastic layer
As described above, the heat-peelable pressure-sensitive adhesive sheet of the present invention may further include an elastic layer.
The elastic layer contains a base polymer, and as the base polymer, an adhesive polymer can be used. Examples of the base polymer constituting the elastic layer include (meth) acrylic polymers; rubber polymers such as natural rubber and synthetic rubber (e.g., nitrile, diene and acrylic); thermoplastic elastomers such as polyolefin and polyester; a vinyl alkyl ether polymer; a silicone-based polymer; a polyester-based polymer; a polyamide-based polymer; a urethane-based polymer; styrene-diene block copolymers; ethylene-vinyl acetate copolymers; a polyurethane polymer; polybutadiene; soft polyvinyl chloride; radiation-curable polymers, and the like. The base polymer constituting the elastic layer may be the same as or different from the base polymer forming the pressure-sensitive adhesive layer (first pressure-sensitive adhesive layer and/or second pressure-sensitive adhesive layer). The elastic layer may be a foamed film formed of the base polymer. The foamed film can be obtained by any suitable method. It should be noted that the elastic layer and the first adhesive layer (and the second adhesive layer containing the thermally expandable microspheres) can be distinguished by the presence of the thermally expandable microspheres (the elastic layer does not contain the thermally expandable microspheres).
The (meth) acrylic polymer as the base polymer constituting the elastic layer is, for example, an acrylic polymer (homopolymer or copolymer) obtained by using 1 or 2 or more kinds of alkyl (meth) acrylates as monomer components. Specific examples of the alkyl (meth) acrylate include alkyl (meth) acrylates having a linear or branched alkyl group having 20 or less carbon atoms. The acrylic polymer may further contain units corresponding to other monomer components copolymerizable with the alkyl (meth) acrylate. Examples of such monomer components include acrylic acid, methacrylic acid, itaconic acid, hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, N-methylolacrylamide, acrylonitrile, methacrylonitrile, glycidyl acrylate, glycidyl methacrylate, vinyl acetate, styrene, isoprene, butadiene, isobutylene, vinyl ether, and the like.
The elastic layer may contain any suitable additive as required. Examples of the additives include a crosslinking agent, a vulcanizing agent, a tackifier, a plasticizer, a softening agent, a filler, an antioxidant, and the like. When a hard resin such as polyvinyl chloride is used as the base polymer, it is preferable to form an elastic layer having desired elasticity by using a plasticizer and/or a softening agent in combination.
The thickness of the elastic layer is preferably 3 to 200 μm, more preferably 5 to 100 μm. Within such a range, the above function of the elastic layer can be sufficiently exhibited.
The tensile modulus of the elastic layer at 25 ℃ is preferably less than 100MPa, more preferably 0.1MPa to 50MPa, and still more preferably 0.1MPa to 10 MPa. Within such a range, the above function of the elastic layer can be sufficiently exhibited.
F. Method for producing heat-peelable pressure-sensitive adhesive sheet
The heat-peelable pressure-sensitive adhesive sheet of the present invention can be produced by any suitable method. Examples of the heat-peelable pressure-sensitive adhesive sheet of the present invention include the following: a method of directly applying a first composition for forming an adhesive layer on one surface of a substrate and applying a second composition for forming an adhesive layer on the other surface of the substrate; a method of forming the first adhesive layer and the second adhesive layer by transferring a coating layer formed by coating on an arbitrary appropriate substrate to a base material, and the like. In addition, the adhesive layer containing the thermally expandable microspheres may also be formed as follows: the adhesive coating layer is formed using a composition containing an adhesive, and then thermally expandable microspheres are sprinkled on the adhesive coating layer and then embedded in the coating layer using a laminator or the like.
The first pressure-sensitive adhesive layer-forming composition contains the acrylic pressure-sensitive adhesive I and the thermally expandable microspheres, and if necessary, contains an arbitrary appropriate solvent. The second pressure-sensitive adhesive layer-forming composition contains any appropriate pressure-sensitive adhesive and, if necessary, the thermally expandable microspheres and/or any appropriate solvent.
When the heat-peelable pressure-sensitive adhesive sheet has the elastic layer, the elastic layer and the pressure-sensitive adhesive layer adjacent to the elastic layer can be formed by, for example, applying a composition for forming an elastic layer to a substrate and then applying a composition for forming a pressure-sensitive adhesive layer. For example, the elastic layer and the first pressure-sensitive adhesive layer can be formed in this order from the substrate side by applying a composition for forming an elastic layer containing a material (base polymer, additive, or the like) for forming an elastic layer on the substrate, and then applying a composition for forming a first pressure-sensitive adhesive on the coating layer of the composition for forming an elastic layer.
As the coating method of each composition described above, any appropriate coating method can be adopted. For example, each layer may be formed by drying after coating. Examples of the coating method include a coating method using, for example, a Multi-coater (Multi-coater), a die coater, a gravure coater, an applicator, or the like. Examples of the drying method include natural drying and heat drying. The heating temperature in the heat drying may be set to any appropriate temperature according to the characteristics of the substance to be dried.
G. Use of
The heat-peelable pressure-sensitive adhesive sheet of the present invention can be suitably used as a protective sheet in the production of electronic parts. Particularly, when an electronic part is subjected to a treatment (e.g., an etching treatment) using an acidic or alkaline chemical solution, it can be suitably used as a protective sheet for protecting the electronic part.
The heat-peelable adhesive sheet of the present invention is a double-sided adhesive sheet, and electronic components as objects to be processed are adhered to both sides of the adhesive sheet, and the electronic components are subjected to a processing step, whereby warping of the electronic components can be prevented. In addition, by performing the treatment step in this way, the production efficiency can be improved.
Examples
The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. In the examples, "part(s)" and "%" are based on weight unless otherwise specified.
Production example 1 preparation of acrylic adhesive I (i)
An acrylic adhesive i (i) was prepared by mixing 100 parts by weight of a (meth) acrylic polymer (a copolymer of Butyl Acrylate (BA) and Acrylic Acid (AA), a structural unit derived from BA: a structural unit derived from AA (weight ratio): 95:5) with 0.6 parts by weight of an epoxy-based crosslinking agent (trade name "TETRAD C", manufactured by mitsubishi gas CHEMICAL corporation) and 30 parts by weight of a terpene phenol-based tackifying resin (YASUHARA CHEMICAL co., ltd.
Production examples 2 to 9 preparation of acrylic pressure-sensitive adhesives I (ii) to (ix)
The (meth) acrylic polymer, the crosslinking agent, and the tackifier resin shown in table 1 were mixed in the compounding amounts shown in table 1 to prepare acrylic adhesives i (ii) to (ix).
TETRAD X: an epoxy-based crosslinking agent; trade name "TETRAD X" manufactured by Mitsubishi gas chemical corporation "
CORONATE L: an isocyanate-based crosslinking agent; manufactured by Nippon polyurethane industries, Ltd., trade name "CORONATE L"
SUPER ESTER A-75: a rosin-based tackifying resin; manufactured by Ishikawa chemical industries, Ltd., product name "SUPER ESTER A-75"
TAMANOL 200: an alkylphenol-based tackifying resin; manufactured by Ishikawa chemical industries, Ltd., trade name "TAMANOL 200"
TABLE 1
Figure BDA0002782712070000271
[ example 1]
An acrylic adhesive agent I (i) obtained in production example 1 (130.6 parts by weight), thermally expandable microspheres (product name "Matsumoto microspheres F-50D" manufactured by Songbu oil & fat pharmaceuticals Co., Ltd.) 25 parts by weight, and toluene 210 parts by weight were mixed to prepare an adhesive agent layer-forming composition (i).
The composition (i) for forming an adhesive layer was applied to both surfaces of a PET film (trade name "Lumiror S10", thickness: 100 μm, manufactured by Toray corporation) as a base material to form a first adhesive layer and a second adhesive layer each having a thickness of 40 μm.
By the above operation, a heat-peelable pressure-sensitive adhesive sheet was obtained which was provided with the first pressure-sensitive adhesive layer (40 μm), the substrate (100 μm), and the second pressure-sensitive adhesive layer (40 μm) in this order.
[ example 2]
An acrylic adhesive agent I (i) obtained in production example 1 (130.6 parts by weight), thermally expandable microspheres (product name "Matsumoto microspheres F-48D" manufactured by Songbu oil & fat pharmaceuticals Co., Ltd.) 30 parts by weight, and toluene 210 parts by weight were mixed to prepare an adhesive agent layer-forming composition (ii).
Further, as the composition (i) for forming an elastic layer, a mixture of 130.6 parts by weight of an acrylic pressure-sensitive adhesive i (i) and 210 parts by weight of toluene was prepared. Further, as the composition (ii) for forming an elastic layer, a mixture of 130.1 parts by weight of the acrylic pressure-sensitive adhesive i (ii) obtained in production example 2 and 210 parts by weight of toluene was prepared.
An elastic layer (thickness: 20 μm) and a first adhesive layer (thickness: 40 μm) were formed by applying the composition (i) for forming an elastic layer and the composition (ii) for forming an adhesive layer in this order on one surface of a polyester film (product name "DIAFOIL" manufactured by Mitsubishi resin corporation, thickness: 50 μm) as a substrate. Further, the other surface of the substrate was coated with the composition (ii) for forming an elastic layer and the composition (ii) for forming an adhesive layer in this order, thereby forming an elastic layer (thickness: 20 μm) and a second adhesive layer (20 μm).
By the above operation, a heat-peelable pressure-sensitive adhesive sheet was obtained which was provided with a first pressure-sensitive adhesive layer (40 μm), an elastic layer (20 μm), a base material (50 μm), an elastic layer (20 μm), and a second pressure-sensitive adhesive layer (20 μm) in this order.
[ example 3]
An adhesive layer-forming composition (iii) was prepared by mixing 151 parts by weight of the acrylic adhesive (iii) obtained in production example 3, 40 parts by weight of thermally expandable microspheres (product name "Matsumoto Microsphere FN-100 SD", manufactured by masson pharmaceuticals corporation), and 210 parts by weight of toluene.
Further, as the composition (iii) for forming an elastic layer, a mixture of 101 parts by weight of the acrylic pressure-sensitive adhesive i (iv) obtained in production example 4 and 210 parts by weight of toluene was prepared.
The elastic layer (thickness: 30 μm) and the first adhesive layer (thickness: 30 μm) were formed by applying the composition (iii) for forming an elastic layer and the composition (iii) for forming an adhesive layer in this order on one surface of a PET film (product name "Lumiror S10" manufactured by Toray corporation, thickness: 100 μm) as a substrate. Further, the elastic layer-forming composition (iii) and the adhesive layer-forming composition (iii) were applied to the other surface of the substrate in this order to form an elastic layer (thickness: 15 μm) and a second adhesive layer (thickness: 20 μm).
By the above-described operation, a heat-peelable pressure-sensitive adhesive sheet was obtained which was provided with a first pressure-sensitive adhesive layer (30 μm), an elastic layer (30 μm), a substrate (100 μm), an elastic layer (15 μm), and a second pressure-sensitive adhesive layer (20 μm) in this order.
[ example 4]
An adhesive layer-forming composition (iv) was prepared by mixing 122 parts by weight of the acrylic adhesive (v) obtained in production example 5, 30 parts by weight of thermally expandable microspheres (product name "Expancel 909-DU 80", manufactured by ltd.) and 210 parts by weight of toluene.
Further, as the composition (iv) for forming an elastic layer, a mixture of 112 parts by weight of the acrylic pressure-sensitive adhesive i (vi) obtained in production example 6 and 210 parts by weight of toluene was prepared.
The elastic layer (thickness: 25 μm) and the first adhesive layer (thickness: 50 μm) were formed by applying the composition (iv) for forming an elastic layer and the composition (iv) for forming an adhesive layer in this order on one surface of a PET film (product name "Lumiror S10" manufactured by Toray corporation, thickness: 50 μm) as a substrate. Further, the elastic layer-forming composition (iv) and the adhesive layer-forming composition (iv) were applied to the other surface of the substrate in this order to form an elastic layer (thickness: 20 μm) and a second adhesive layer (thickness: 30 μm).
By the above operation, a heat-peelable pressure-sensitive adhesive sheet was obtained which was provided with a first pressure-sensitive adhesive layer (50 μm), an elastic layer (25 μm), a base material (50 μm), an elastic layer (20 μm), and a second pressure-sensitive adhesive layer (30 μm) in this order.
Comparative example 1
An acrylic adhesive agent I (vii) obtained in production example 7, 140.7 parts by weight, 25 parts by weight of thermally expandable microspheres (product name "Matsumoto Microsphere F-50D", manufactured by Songbu oil & fat pharmaceuticals Co., Ltd.), and 210 parts by weight of toluene were mixed to prepare an adhesive agent layer-forming composition (v).
The composition (v) for forming an adhesive layer was applied to both surfaces of a PET film (trade name "Lumiror S10", thickness: 100 μm, manufactured by Toray corporation) as a base material to form a first adhesive layer and a second adhesive layer each having a thickness of 45 μm.
By the above operation, a heat-peelable pressure-sensitive adhesive sheet was obtained which was provided with the first pressure-sensitive adhesive layer (45 μm), the substrate (100 μm), and the second pressure-sensitive adhesive layer (45 μm) in this order.
Comparative example 2
An adhesive layer-forming composition (vi) was prepared by mixing 127 parts by weight of the acrylic adhesive i (viii) obtained in production example 8, 30 parts by weight of thermally expandable microspheres (manufactured by Japan Fillite co., ltd., trade name "Expancel 909-DU 80"), and 210 parts by weight of toluene.
Further, as the composition (vi) for forming an elastic layer, a mixture of 117 parts by weight of the acrylic pressure-sensitive adhesive i (ix) obtained in production example 9 and 210 parts by weight of toluene was prepared.
An elastic layer (thickness: 20 μm) and a first adhesive layer (thickness: 40 μm) were formed by applying the composition (vi) for forming an elastic layer and the composition (vi) for forming an adhesive layer in this order on one surface of a PET film (product name "Lumiror S10" manufactured by Toray corporation, thickness: 100 μm) as a substrate. Further, an adhesive layer forming composition (vi) was applied to the other surface of the substrate to form a second adhesive layer (40 μm).
By the above operation, a heat-peelable pressure-sensitive adhesive sheet was obtained which was provided with a first pressure-sensitive adhesive layer (40 μm), an elastic layer (20 μm), a substrate (100 μm), and a second pressure-sensitive adhesive layer (40 μm) in this order.
[ evaluation ]
The heat-peelable pressure-sensitive adhesive sheets obtained in examples and comparative examples were subjected to the following evaluations. The results are shown in Table 2.
(1) Arithmetic mean deviation roughness Ra of profile
The arithmetic mean deviation roughness Ra of the profile on the first adhesive layer side was measured based on JIS B0601. Specifically, the measurement was carried out under the following measurement conditions using an optical surface roughness meter (product name "Wyko NT 9100" manufactured by Veeco Metrogy Group). The average values of the measurement values obtained by measuring 5 times in the vertical and horizontal directions are shown in table 2.
(evaluation conditions)
Sample size: 50mm x 50mm
Measurement range: 2.534mm × 1.901mm
Measurement mode: VSL
An objective lens: 2.5 times of
Inner lens: 1.0 times of
(2) Contact angle
Using a contact angle meter (product name "CX-A type" manufactured by Kyowa Kagaku Co., Ltd.), 2. mu.l of pure water was dropped onto the surface of the first pressure-sensitive adhesive layer under an atmosphere of 23 ℃/50% RH, and the contact angle of the liquid droplet was measured 5 seconds after dropping. The average values of the measurement values obtained by measuring 5 times are shown in table 2.
(3) Gel fraction
0.1g of the sample for evaluation sampled from the first resin layer was wrapped with a mesh sheet and left standing in 50ml of toluene at room temperature for 1 week to impregnate the sample with toluene. Thereafter, the toluene-insoluble matter was taken out and dried at 70 ℃ for 2 hours, and then the dried toluene-insoluble matter was weighed.
The gel fraction of the resin layer was calculated from the weight of the sample before immersion in toluene and the weight of toluene-insoluble matter by the following formula.
Gel fraction (%) [ (weight of toluene-insoluble matter)/(weight of sample before toluene impregnation) ] × 100
(4) Method for measuring adhesive force
Cutting the heat-peelable pressure-sensitive adhesive sheet into widths: 20mm, length: 140mm in size, based on JIS Z0237 (2000), at temperature: 23 ± 2 ℃ and humidity: a polyethylene terephthalate film (trade name "Lumiror S-10", manufactured by Toray corporation; thickness: 25 μm, width: 20mm) as an adherend was pressure-bonded to the first pressure-sensitive adhesive layer by reciprocating a 2kg roller 1 time in an atmosphere of 65. + -. 5% RH, and was bonded thereto. Subsequently, the heat-peelable pressure-sensitive adhesive sheet with an adherend was set in a tensile testing machine with a thermostatic bath (trade name "Shimadzu AUTOGRAPH AG-120 kN", manufactured by Shimadzu corporation) set at 23 ℃ and left to stand for 30 minutes. After standing, the peel angle was measured at a temperature of 23 ℃: 180 °, peeling speed (stretching speed): the load at the time of peeling the adherend from the heat-peelable pressure-sensitive adhesive sheet under the condition of 300 mm/min was determined as the maximum load (maximum value of load except the peak at the initial measurement) at that time, and this maximum load was taken as the adhesive force (N/20mm) of the first pressure-sensitive adhesive layer.
(5) Chemical solution intrusion evaluation
A heat-peelable adhesive sheet was cut into a size of 50mm X50 mm, a silicon wafer was placed on the first adhesive layer side, a glass plate (thickness: 1mm) was placed on the second adhesive layer side, and these were pressure-bonded at a temperature of 60 ℃ under a pressure of 0.5MPa for a time of 3 minutes to prepare a sample for evaluation. Thereafter, the sample for evaluation was immersed in a nitric acid solution having a concentration of 60% by weight at a temperature of 40 ℃ for 10 minutes. After the immersion, the amount of chemical solution entering the first pressure-sensitive adhesive layer side was evaluated based on the liquid-entering distance from the end of the pressure-sensitive adhesive sheet.
(6) Heat peelability
The same procedure as in the chemical solution invasion evaluation (5) was used to prepare a sample for evaluation. The sample for evaluation was heated at 130 ℃ for 1 minute. The peeling state of the heated silicon wafer was visually checked. In Table 2, the case where the adhesive layer lost the adhesive force and the silicon wafer peeled off is indicated as "O", and the case where the adhesive layer had the adhesive force and the silicon wafer did not peel off is indicated as "X".
TABLE 2
Figure BDA0002782712070000331
Industrial applicability
The heat-peelable adhesive sheet of the present invention is suitably used as a protective tape for electronic components to be supplied to a processing liquid such as an etching liquid.

Claims (8)

1. A heat-peelable pressure-sensitive adhesive sheet comprising a first pressure-sensitive adhesive layer, a substrate and a second pressure-sensitive adhesive layer in this order,
the first adhesive layer comprises an acrylic adhesive containing a (meth) acrylic polymer and thermally expandable microspheres,
the (meth) acrylic polymer comprises: a structural unit derived from an alkyl (meth) acrylate having an alkyl group with 2 or more carbon atoms and a structural unit derived from a (meth) acrylic monomer having an OH group,
in the (meth) acrylic polymer, the molar ratio of carbon (C) of a side chain alkyl group to OH groups, i.e., C/OH, is 40 to 150,
a contact angle of water to the first adhesive layer and/or the second adhesive layer is 85 ° to 115 °.
2. The heat-peelable adhesive sheet according to claim 1, wherein the second adhesive layer contains the heat-expandable microspheres.
3. The heat-peelable adhesive sheet according to claim 1, wherein the first adhesive layer and/or the second adhesive layer has an arithmetic mean deviation roughness Ra of 1 μm or less in profile.
4. The heat-peelable adhesive sheet according to claim 1, wherein the first adhesive layer contains a tackifier, and the content ratio of the tackifier is 40 parts by weight or less with respect to 100 parts by weight of the first adhesive layer.
5. The heat-peelable adhesive sheet according to claim 1, wherein the second adhesive layer contains a tackifier, and the content ratio of the tackifier is 40 parts by weight or less with respect to 100 parts by weight of the second adhesive layer.
6. The heat-peelable adhesive sheet according to claim 1, wherein the gel fraction of the first adhesive layer and/or the second adhesive layer is 50% or more.
7. The heat-peelable adhesive sheet according to claim 1, wherein the adhesive strength at 23 ℃ when the first adhesive layer side is adhered to a polyethylene terephthalate film is 1N/20mm or more.
8. An electronic component produced using the heat-peelable adhesive sheet according to claim 1.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116829665A (en) * 2021-09-02 2023-09-29 株式会社寺冈制作所 Heat-peelable pressure-sensitive adhesive tape

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109906385A (en) * 2016-10-27 2019-06-18 三井化学东赛璐株式会社 The manufacturing method of electronic device, electronic device manufacture adherence film and apparatus for electronic device test
EP3533852A4 (en) 2016-10-27 2020-06-17 Mitsui Chemicals Tohcello, Inc. Electronic device production method, adhesive film for electronic device production, and electronic component testing device
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JP6759374B2 (en) * 2018-02-05 2020-09-23 日東電工株式会社 Adhesive sheet and adhesive sheet peeling method
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SG11202109973WA (en) 2019-03-14 2021-10-28 Mitsui Chemicals Tohcello Inc Method for manufacturing electronic device
JP7311293B2 (en) * 2019-03-29 2023-07-19 日東電工株式会社 back grind tape
CN110128977B (en) * 2019-05-14 2021-07-27 业成科技（成都）有限公司 Method of using a thermo-adhesive pressure-sensitive adhesive composition
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FR3099933B1 (en) * 2019-08-12 2023-05-26 Rescoll Compositions removable by thermal activation, uses and assemblies comprising such compositions
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CN113225916A (en) * 2020-01-21 2021-08-06 达迈科技股份有限公司 Method for manufacturing micro-circuit printed circuit board
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CN117157367A (en) * 2021-03-30 2023-12-01 3M创新有限公司 Adhesive precursor composition and thermally expandable temporary adhesive therefrom

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1046127A (en) * 1996-08-07 1998-02-17 Soken Chem & Eng Co Ltd Water-resistant solvent-resistant pressuresensitive adhesive and pressure-sensitive adhesive sheet
JPH10316954A (en) * 1997-05-21 1998-12-02 Nippon Shokubai Co Ltd Thermally releasable adhesive composition, thermally releasable adhesive article, and use thereof
JP2001064607A (en) * 1999-09-01 2001-03-13 Nitto Denko Corp Surface protective film
JP2005023286A (en) * 2003-07-04 2005-01-27 Nitto Denko Corp Gas permeable and thermally peelable adhesive sheet
JP2008115273A (en) * 2006-11-04 2008-05-22 Nitto Denko Corp Thermally strippable pressure-sensitive adhesive sheet and method of recovering adherend
JP2008274163A (en) * 2007-05-02 2008-11-13 Nitto Denko Corp Double-sided self-adhesive sheet and liquid crystal display
JP2008297498A (en) * 2007-06-01 2008-12-11 Nitto Denko Corp Double-faced foamed tacky sheet and liquid crystal display
CN101348679A (en) * 2008-08-28 2009-01-21 上海大通高科技材料有限责任公司 Anti-pasting anti-covering coating and preparation thereof
JP2013072036A (en) * 2011-09-28 2013-04-22 Furukawa Electric Co Ltd:The Pressure-sensitive adhesive tape for working brittle wafer and grinding method using the same
CN103194152A (en) * 2012-01-10 2013-07-10 藤森工业株式会社 Surface protection film and optical components and industrial products attached with the film
CN103328592A (en) * 2011-01-19 2013-09-25 日东电工株式会社 Double-sided adhesive tape or sheet, and adherend processing method
US20140030519A1 (en) * 2012-07-27 2014-01-30 Nitto Denko Corporation Pressure-sensitive adhesive sheet
WO2014024686A1 (en) * 2012-08-10 2014-02-13 ハリマ化成株式会社 Two-pack type curable coating agent
CN104031570A (en) * 2013-03-04 2014-09-10 日东电工株式会社 Heat-peelable adhesive sheet
JP2015017179A (en) * 2013-07-10 2015-01-29 ニッタ株式会社 Temperature-sensitive adhesive, and crosslinking method of the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3644850B2 (en) 1999-07-09 2005-05-11 積水化学工業株式会社 Removable adhesive tape
JP2007246848A (en) * 2006-03-18 2007-09-27 Nitto Denko Corp Pressure sensitive adhesive double coated sheet and use thereof
WO2010004703A1 (en) * 2008-07-08 2010-01-14 日東電工株式会社 Process for producing organic electroluminescent panel
JP2015021082A (en) * 2013-07-19 2015-02-02 日東電工株式会社 Thermal peeling type adhesive tape for cutting-off electronic component and cutting-off method of electronic component

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1046127A (en) * 1996-08-07 1998-02-17 Soken Chem & Eng Co Ltd Water-resistant solvent-resistant pressuresensitive adhesive and pressure-sensitive adhesive sheet
JPH10316954A (en) * 1997-05-21 1998-12-02 Nippon Shokubai Co Ltd Thermally releasable adhesive composition, thermally releasable adhesive article, and use thereof
JP2001064607A (en) * 1999-09-01 2001-03-13 Nitto Denko Corp Surface protective film
JP2005023286A (en) * 2003-07-04 2005-01-27 Nitto Denko Corp Gas permeable and thermally peelable adhesive sheet
JP2008115273A (en) * 2006-11-04 2008-05-22 Nitto Denko Corp Thermally strippable pressure-sensitive adhesive sheet and method of recovering adherend
JP2008274163A (en) * 2007-05-02 2008-11-13 Nitto Denko Corp Double-sided self-adhesive sheet and liquid crystal display
JP2008297498A (en) * 2007-06-01 2008-12-11 Nitto Denko Corp Double-faced foamed tacky sheet and liquid crystal display
CN101348679A (en) * 2008-08-28 2009-01-21 上海大通高科技材料有限责任公司 Anti-pasting anti-covering coating and preparation thereof
CN103328592A (en) * 2011-01-19 2013-09-25 日东电工株式会社 Double-sided adhesive tape or sheet, and adherend processing method
JP2013072036A (en) * 2011-09-28 2013-04-22 Furukawa Electric Co Ltd:The Pressure-sensitive adhesive tape for working brittle wafer and grinding method using the same
CN103194152A (en) * 2012-01-10 2013-07-10 藤森工业株式会社 Surface protection film and optical components and industrial products attached with the film
US20140030519A1 (en) * 2012-07-27 2014-01-30 Nitto Denko Corporation Pressure-sensitive adhesive sheet
WO2014024686A1 (en) * 2012-08-10 2014-02-13 ハリマ化成株式会社 Two-pack type curable coating agent
CN104031570A (en) * 2013-03-04 2014-09-10 日东电工株式会社 Heat-peelable adhesive sheet
JP2015017179A (en) * 2013-07-10 2015-01-29 ニッタ株式会社 Temperature-sensitive adhesive, and crosslinking method of the same

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
俞剑峰等: "E10p改性丙烯酸树脂的制备及其在水性卷材涂料中的应用", 《化学世界》 *
吴科如 等: "《建筑材料》", 31 March 1996, 同济大学出版社 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116829665A (en) * 2021-09-02 2023-09-29 株式会社寺冈制作所 Heat-peelable pressure-sensitive adhesive tape
CN116829665B (en) * 2021-09-02 2024-03-15 株式会社寺冈制作所 Heat-peelable pressure-sensitive adhesive tape

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