CN112311973A

CN112311973A - Photosensitive assembly, camera module and manufacturing method thereof

Info

Publication number: CN112311973A
Application number: CN201910709052.9A
Authority: CN
Inventors: 栾仲禹; 黄桢; 刘丽; 陈凯
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2019-08-01
Filing date: 2019-08-01
Publication date: 2021-02-02

Abstract

The application discloses a photosensitive assembly, a camera module and a manufacturing method of the camera module. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected with the circuit board, and a shaping component arranged on the circuit board. The lower surface of the photosensitive chip is attached to the shaping component so as to form an accommodating space with the shaping component and the circuit board. The accommodating space is configured to allow the photosensitive chip to be bent downward during assembly of the photosensitive assembly. In this way, the photosensitive chip is bent to a shape adapted to the actual focal plane during assembly to improve the imaging quality.

Description

Photosensitive assembly, camera module and manufacturing method thereof

Technical Field

The application relates to the field of camera modules, in particular to a photosensitive assembly, a camera module and a manufacturing method of the camera module.

Background

The camera module is an important image sensing device. As the imaging quality of the terminal device (e.g., a smart phone) is higher and higher by consumers, the size of the photosensitive chip collected by the camera module is gradually increased, which causes a series of technical problems, such as chip deformation and poor heat dissipation of the chip. These technical problems cannot be properly solved in the existing camera module manufacturing process.

Accordingly, there is a need for improved camera module structures and manufacturing solutions to provide satisfactory camera modules.

Disclosure of Invention

The main object of the present application is to provide a photosensitive assembly, a camera module and a manufacturing method thereof, which can bend a planar photosensitive chip into a shape adapted to an actual focus imaging surface, and in such a way, improve the imaging quality of the camera module.

Another objective of the present application is to provide a photosensitive assembly, a camera module and a manufacturing method thereof, wherein the photosensitive chip of the camera module is still planar during transportation, so that transportation can still be performed in a makeup manner.

Another object of the present application is to provide a photosensitive assembly, a camera module and a method for manufacturing the same, wherein a chip manufacturer does not need to change an existing photosensitive chip manufacturing process, that is, the photosensitive assembly manufacturing process provided by the present application can be implemented based on an existing planar photosensitive chip.

Another objective of the present application is to provide a photosensitive assembly, a camera module and a manufacturing method thereof, wherein the accommodating space below the photosensitive chip includes a heat dissipation member for reinforcing the heat dissipation of the photosensitive chip, so as to reinforce the heat dissipation performance of the camera module.

The present application is directed to achieving at least one of the objects or advantages described above. An embodiment of the present application provides a photosensitive assembly, which includes:

a circuit board;

the photosensitive chip is electrically connected with the circuit board; and

and the shaping component is arranged on the circuit board, wherein the lower surface of the photosensitive chip is attached to the shaping component so as to form an accommodating space with the shaping component and the circuit board, and the accommodating space is configured to enable the photosensitive chip to bend downwards in the process of assembling the photosensitive assembly.

In the photosensitive assembly according to the application, the shaping part comprises a first shaping piece and a second shaping piece, the first shaping piece, the photosensitive chip and the circuit board form the accommodating space, the second shaping piece is arranged on the circuit board and located in the accommodating space, and the height of the second shaping piece is lower than that of the first shaping piece.

In a photosensitive assembly according to the present application, an upper surface of at least one of the first and second shaping members includes an arc surface recessed downward and inward, the arc surface being configured such that the photosensitive chip forms a lower surface adapted to a focus imaging surface of the photosensitive assembly when bent downward.

In the photosensitive assembly according to the application, the circuit board has at least one opening which is penetratingly formed therein and communicated with the accommodating space, and the at least one opening is configured to exhaust gas in the accommodating space so that the photosensitive chip bends downward when the photosensitive assembly is assembled.

In the photosensitive assembly according to the present application, the opening is formed at a position of the circuit board corresponding to a central region of the photosensitive chip.

In a photosensitive assembly according to the present application, the second shaping member is arranged symmetrically with respect to a center of the photosensitive chip.

In the photosensitive assembly according to the present application, the second shaping members are symmetrically disposed at both sides of a center line defined by longer sides of the photosensitive chip.

In a photosensitive assembly according to the present application, a cross-sectional shape of the first shaping member is a closed loop shape.

In a photosensitive assembly according to the present application, the opening is formed at a position of the wiring board between the first shaping member and the second shaping member.

In a photosensitive assembly according to the present application, a part of the opening is formed at a position of the circuit board corresponding to a central region of the photosensitive chip, and another part of the opening is formed at a position of the circuit board between the first shaping member and the second shaping member.

In the photosensitive assembly according to the present application, the openings are formed at positions of the circuit board symmetrically with respect to a center of the photosensitive chip.

In the photosensitive assembly according to the present application, another part of the openings are formed at positions of the circuit board symmetrically arranged with respect to the center of the photosensitive chip.

In a photosensitive assembly according to the present application, the shaping member further includes an adhesive applied between the first shaping member and the second shaping member, wherein a height of the adhesive is higher than an upper surface of the second shaping member.

In a photosensitive assembly according to the present application, the first shaping member includes a first shaping member body and an adhesive applied to the first shaping member body, and the second shaping member includes a second shaping member body and an adhesive applied to the second shaping member body.

In a photosensitive assembly according to the present application, the first and second shaping body are integrally formed on a top surface of the circuit board.

In a photosensitive assembly according to the present application, the first and second shaping body are prefabricated and mounted to the circuit board. In an embodiment of the present application, the first and second fairing bodies are made of a metallic material.

In a photosensitive assembly according to the present application, the first and second shaping body are integrally formed on the top surface of the circuit board by an electroplating process.

In the photosensitive assembly according to the present application, the photosensitive assembly further includes a heat dissipation member, the heat dissipation member is formed in the accommodating space and attached to at least a portion of the lower surface of the photosensitive chip.

In the photosensitive assembly according to the present application, the heat dissipation member is formed by a heat dissipation material entering the accommodating space through the at least one opening.

In a photosensitive assembly according to the present application, at least one of the openings forms the vent hole.

In the photosensitive assembly according to the application, the photosensitive assembly further comprises at least one electronic component arranged in the non-photosensitive area of the photosensitive chip.

In the photosensitive assembly according to the application, photosensitive assembly is further including locating the support of circuit board, wherein, the support forms and corresponds to the light-passing hole of the photosensitive region of sensitization chip.

In the photosensitive assembly according to the application, the support is integrally formed on the circuit board through a molding process so as to integrally cover at least one part of the circuit board and at least one part of the at least one electronic component.

In the photosensitive assembly according to the application, the support passes through molding process integrated into one piece in the circuit board to an organic whole cladding at least partly of circuit board at least an electronic components, and, the photosensitive chip is not at least partly regional photosensitive.

In the photosensitive assembly according to the application, the inner side surface of the support is perpendicular to the upper surface of the photosensitive chip.

In a photosensitive assembly according to the present application, an inner side surface of the holder extends obliquely outward.

In a photosensitive assembly according to the present application, the holder includes a mounting platform concavely formed on a top surface of the holder for supporting a filter element thereon.

In the photosensitive assembly according to the present application, the photosensitive assembly further includes a side encapsulation covering the photosensitive chip and an outer side of the shaping member, for preventing a position of the photosensitive chip from being shifted during a molding process.

In a photosensitive assembly according to the present application, the photosensitive assembly further includes a filter element held in a photosensitive path of the photosensitive assembly.

In the photosensitive assembly according to the application, the filter element is superposed on the photosensitive element, and the support is integrally formed on the circuit board through a molding process, and integrally covers at least one part of the circuit board, the at least one electronic component, at least one part of a non-photosensitive area of the photosensitive chip and at least one part of the filter element.

In a photosensitive assembly according to the present application, the filter element is supported on the top of the holder.

In a photosensitive assembly according to the present application, the filter element is mounted to the mounting platform of the holder.

In a photosensitive assembly according to the present application, the photosensitive assembly further includes a filter element holder mounted to the holder and used to mount the filter element.

According to another aspect of the present application, the present application further provides a camera module, which includes:

an optical lens; and

the photosensitive assembly as described above, wherein the optical lens is held in the photosensitive path of the photosensitive assembly.

In the module of making a video recording according to this application, the crooked shape adaptation of the lower surface of sensitization chip in the shape of the real focus imaging surface of the module of making a video recording.

In the camera module according to the application, the optical lens is mounted on the bracket.

In the camera module according to the present application, the camera module further includes a driving element, wherein the driving element is supported by the bracket, and the optical lens is mounted on the driving element.

According to still another aspect of the present application, there is also provided a method of manufacturing a photosensitive assembly, including:

providing a circuit board, a photosensitive chip, a first shaping piece and a second shaping piece, wherein the circuit board comprises at least one opening;

providing the first and second shaping members to the circuit board, wherein the second shaping member has a height less than the first shaping member;

attaching the lower surface of the photosensitive chip to the first shaping piece to form an accommodating space with the shaping component and the circuit board, wherein the at least one opening is communicated with the accommodating space, and the second shaping piece is positioned in the accommodating space; and

and exhausting the air in the accommodating space through the at least one opening hole so as to generate a pressure difference between the upper surface and the lower surface of the photosensitive chip, so that the photosensitive chip bends downwards.

In a method of manufacturing a photosensitive assembly according to the present application, an upper surface of at least one of the first and second shaping members includes an arc surface depressed downward and inward, wherein gas in the accommodating space is discharged through the at least one opening to generate a pressure difference between an upper surface and a lower surface of the photosensitive chip so that the photosensitive chip is bent downward, including:

and bending the photosensitive chip until the lower surface of the photosensitive chip is attached to the arc-shaped surface, so that the lower surface matched with the focus imaging surface of the photosensitive assembly is formed when the photosensitive chip is bent downwards.

In the manufacturing method of the photosensitive assembly according to the present application, the opening is formed at a position of the circuit board corresponding to a central region of the photosensitive chip.

In the method of manufacturing a photosensitive assembly according to the present application, further comprising:

and injecting a heat dissipation material into the accommodating space through the opening to form the heat dissipation member in the accommodating space, wherein the heat dissipation member is attached to at least one part of the lower surface of the photosensitive chip.

According to another aspect of the present application, there is also provided a method of manufacturing a photosensitive assembly, including:

providing a circuit board and a photosensitive chip, wherein the circuit board comprises at least one opening;

integrally forming a first shaping piece and a second shaping piece on the circuit board, wherein the height of the second shaping piece is smaller than that of the first shaping piece;

In a method of manufacturing a photosensitive assembly according to the present application, integrally molding a first shaping member and a second shaping member on the circuit board includes:

integrally forming a first shaping piece main body and a second shaping piece main body on the circuit board through an electroplating process; and

applying adhesive on the first and second profile bodies, respectively.

Further objects and advantages of the present application will become apparent from an understanding of the ensuing description and drawings.

These and other objects, features and advantages of the present application will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

The above and other objects, features and advantages of the present application will become more apparent by describing in more detail embodiments of the present application with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. In the drawings, like reference numbers generally represent like parts or steps.

Fig. 1 illustrates a schematic diagram of a pick-up process of a photosensitive chip in a conventional COB assembly process.

Fig. 2 illustrates an imaging optical path schematic diagram of the camera module.

FIG. 3 illustrates a schematic view of a photosensitive assembly according to an embodiment of the present application.

Fig. 4A and 4B illustrate a schematic view of a manufacturing process of the photosensitive member according to an embodiment of the present application.

FIG. 5 illustrates a top view of the photosensitive assembly according to an embodiment of the present application.

FIG. 6 illustrates an enlarged schematic view of an upper surface of a shaping component in the photosensitive assembly according to an embodiment of the present application.

FIG. 7 illustrates a schematic top view of a variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 8 illustrates a schematic top view of another implementation variation of the photosensitive assembly according to an embodiment of the present application.

FIG. 9 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 10 illustrates a schematic diagram of yet another variant embodiment of the photosensitive assembly according to an embodiment of the present application.

FIG. 11 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 12 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 13 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 14 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 15 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 16 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 17 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 18 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 19 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 20 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 21 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

Fig. 22A and 22B are schematic views illustrating another manufacturing process of the photosensitive assembly according to an embodiment of the present application.

Fig. 23 illustrates a schematic diagram of a camera module according to an embodiment of the present application, wherein the camera module is a fixed-focus camera module.

Fig. 24 is a schematic diagram illustrating another variant implementation of the camera module according to an embodiment of the present application.

Fig. 25 illustrates a schematic diagram of still another variant implementation of the camera module according to an embodiment of the present application.

Fig. 26 is a schematic diagram illustrating still another variant implementation of the camera module according to an embodiment of the present application.

FIG. 27 is a schematic diagram illustrating still another variant implementation of the camera module according to an embodiment of the present application

Fig. 28 illustrates a schematic view of a camera module according to an embodiment of the present application, wherein the camera module is a moving focus camera module.

Detailed Description

Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be understood that the described embodiments are only some embodiments of the present application and not all embodiments of the present application, and that the present application is not limited by the example embodiments described herein.

Summary of the application

As described above, as the imaging quality of the terminal device is higher and higher, the size of the photosensitive chip collected by the camera module is gradually increased, which causes a series of technical problems. Moreover, these technical problems cannot be solved properly in the existing camera module manufacturing process. Accordingly, there is a need for an improved camera module structure and manufacturing scheme thereof to produce photosensitive assemblies and camera modules that meet performance requirements.

Specifically, the conventional camera module is generally assembled by using a cob (chip on board) process: picking up the photosensitive chip → attaching to the circuit board → attaching the plastic bracket to the circuit board. However, with the increasing size, the photosensitive chip is easily deformed during the pick-up process.

Fig. 1 illustrates a schematic diagram of a pick-up process of a photosensitive chip in a conventional COB assembly process. As shown in fig. 1, in the conventional COB assembly process, the photosensitive chip is picked up by suction, and the suction nozzle of the pickup can only be attached to the non-photosensitive area of the photosensitive chip because the photosensitive area of the photosensitive chip cannot be contacted. During the picking-up process, the photosensitive chip will be sucked and bent toward the photosensitive surface of the photosensitive chip to form an upwardly convex shape (from the effect shown in fig. 1, the curved shape of the photosensitive chip can be defined as "crying face").

Those skilled in the art should know that even if the photosensitive chip does not generate "crying-face" shape deformation (i.e. the photosensitive chip is planar), due to the difference between the optical paths of the edge portion and the central portion of the photosensitive chip relative to the optical lens, when the optical center reaches the edge portion of the photosensitive chip, the poor phenomena such as distortion, corner light loss, and acute angle decrease easily occur, resulting in the poor imaging effect. These artifacts are further exacerbated after the "crying face" shape changes occur, and more severely affect the imaging quality.

Specifically, fig. 2 illustrates an imaging optical path schematic diagram of the camera module. As shown in fig. 2, during the imaging process of the image capturing module, an actual focal plane (an actual focal imaging plane) is formed in an arc shape protruding toward the image side (generally, a side where the optical lens is located is defined as an object side, and a side where the photosensitive chip is located is defined as an image side). Those skilled in the art will appreciate that the best imaging quality is achieved when the plane of the photosensitive chip coincides with the focal plane. However, in practical cases, even if a multi-lens is used to modulate the optical system of the camera module, the focal plane still appears as an arc-shaped surface. This is why even if the photosensitive chip is not deformed during the pickup process, there still occur such problems as distortion, corner light loss, and sharp angle drop. However, since the photosensitive chip generates the crying-face-shaped deformation during the picking-up process, it can be seen from the comparison of the shape of the actual focal plane in fig. 2 that the crying-face-shaped deformation is just opposite to the deformation of the actual focal plane, which causes the aggravation of the undesirable phenomena such as distortion, corner light loss, and acute angle reduction, and more seriously affects the imaging quality of the camera module.

In order to solve the problem of the "crying face" shape of the photosensitive chip, there is a technical direction to provide a "smiling face" shape of the photosensitive chip (refer to patent application document CN201480052226.4 in the related art). Although the curved photosensitive chip can alleviate the above technical problems, it brings a series of new problems, and some technical problems are difficult to overcome in the actual industry.

Specifically, it is necessary to solve how to mount the curved photo sensor chip in the camera module, because the existing assembly process of the camera module is directed to the photo sensor chip having a planar shape. Secondly, compared with the planar photosensitive chip, the manufacturing process of the curved photosensitive chip is more complicated and has higher process difficulty. Still, the manufacturers of most sensitization chips and the manufacturing enterprise of the module of making a video recording are the separation at present, and crooked sensitization chip has transported into a big difficult problem than plane sensitization chip: the flat photosensitive chips can be transported in a makeup manner, while the bent photosensitive chips are difficult to transport in a makeup manner.

In addition to the imaging problem, as the size of the photosensitive chip is increased (or the frame rate is increased), the photosensitive chip generates a large amount of heat during the working process, and how to realize heat dissipation is also an urgent problem to be solved.

In view of the above technical problem, the basic idea of the present application is to bend a planar photosensitive chip into a shape adapted to an actual focus imaging surface through a special manufacturing process, so as to improve the imaging quality of the camera module. And, a heat sink for enhancing heat dissipation is formed on the back surface of the photosensitive chip to solve the heat dissipation problem.

Based on this, this application has proposed a photosensitive assembly, and it includes: the circuit board is provided with at least one opening which is penetratingly formed in the circuit board, the photosensitive chip is electrically connected to the circuit board, the lower surface of the photosensitive chip is attached to the shaping component so as to form an accommodating space with the shaping component and the circuit board, and the accommodating space is communicated with the at least one opening and is configured to enable the photosensitive chip to bend downwards in the process of assembling the photosensitive assembly. Therefore, the planar photosensitive chip is bent to be adapted to the shape of the actual focal imaging surface through a special manufacturing process, so that the imaging quality of the camera module is improved.

Having described the general principles of the present application, various non-limiting embodiments of the present application will now be described with reference to the accompanying drawings.

Exemplary photosensitive Assembly and method of manufacturing the same

As shown in fig. 3 to 4B, a photosensitive assembly and a manufacturing process thereof according to an embodiment of the present application are explained. As shown in fig. 3, the photosensitive assembly 10 includes a circuit board 11, a photosensitive chip 12 electrically connected to the circuit board 11, and a shaping component 13, wherein a lower surface 122 of the photosensitive chip 12 is attached to the shaping component 13 to form an accommodating space 100 with the shaping component 13 and the circuit board 11, and the accommodating space 100 is configured to allow the photosensitive chip 12 to bend downward during the assembly of the photosensitive assembly 10. In particular, in the present embodiment, the photosensitive chip 12 is bent into a shape that fits the actual focal plane, in such a way as to improve the imaging quality.

As shown in fig. 3 and 4B, in the embodiment of the present application, the shaping component 13 is fixedly disposed on the top surface of the circuit board 11, wherein the top surface of the shaping component 13 is attached to the lower surface 122 of the photosensitive chip 12 to form the accommodating space 100 with the photosensitive chip 12 and the circuit board 11. It should be understood that the accommodating space 100 under the photo sensor chip 12 provides a deformation space for the photo sensor chip 12 to bend downwards under a specific force. Also, in the embodiment of the present application, the shaping part 13 sets a shaping surface 130, wherein the shaping surface 130 is configured to limit the shape of the downward bending of the photosensitive chip 12, so that the shape of the lower surface 122 of the photosensitive chip 12 after bending is adapted to the actual focal plane, thereby improving the imaging quality.

More specifically, in the embodiment of the present application, the shaping component 13 includes a first shaping member 131 and a second shaping member 132, wherein the first shaping member 131 is fixed to the circuit board 11, and the lower surface 122 of the photosensitive chip 12 is attached to the first shaping member 131, in such a way that an accommodating space 100 is formed among the first shaping member 131, the photosensitive chip 12 and the circuit board 11. The second shaping member 132 is fixedly disposed on the circuit board 11 and located in the accommodating space 100, and the height of the second shaping member 132 is lower than that of the first shaping member 131. In other words, in the present embodiment, the first and

second shaping members

131 and 132 are arranged in a stepped manner. In particular, in the embodiment of the present application, the upper surface of at least one of the first and

second shaping members

131 and 132 includes a downwardly and inwardly recessed arc surface configured to form the lower surface 122 adapted to the focus imaging surface of the photosensitive assembly 10 when the photosensitive chip 12 is bent downwardly, so as to form the downwardly bent shaping surface 130 through the upper surfaces of the first and

second shaping members

131 and 132. Preferably, in the present embodiment, the upper surfaces of the first and

second shaping members

131 and 132 each include an arc surface recessed downward and inward, as shown in fig. 6.

Further, the shaping component 13 further includes at least one opening 133 penetratingly formed in the circuit board 11 and communicating with the accommodating space 100, wherein after the photo chip 12 is attached to the first shaping member 131 to form the accommodating space 100, the air in the accommodating space 100 can be exhausted through the opening 133, so as to form a pressure difference between the upper and lower surfaces 121,122 of the photo chip 12 to force the photo chip 12 to bend downward until being attached to the shaping surface 130 formed by the first shaping member 131 and the second shaping member 132.

In order to form the accommodating space 100, in the present embodiment, the first shaping member 131 has a closed shape. As shown in fig. 5, the shape of the first shaping member 131 is preferably adapted to the shapes of the circuit board 11 and the photosensitive chip 12. Those skilled in the art will appreciate that the existing circuit board 11 and the photo sensor chip 12 are generally rectangular in shape, and accordingly, the shape of the first shaping member 131 is preferably implemented as a closed "square". Of course, it should be understood by those skilled in the art that as the technology of the camera module and the application thereof are developed, the shapes of the circuit board 11 and the photo sensor chip 12 may be changed, and correspondingly, the shape of the first adjustment member 131 may also be adaptively adjusted, which is not limited by the present application.

It will be appreciated that the first shaping member 131, which is square in shape, has an opening. Accordingly, after the first shaping member 131 is fixed to the circuit board 11, the opening is covered by the photosensitive chip 12 attached to the first shaping member 131, so that the photosensitive chip 12, the circuit board 11 and the first shaping member 131 surround and form the accommodating space 100. Preferably, the size of the first shaping member 131 is adapted to the size of the photosensitive chip 12, so that when the photosensitive chip 12 is attached to the first shaping member 131, the first shaping member 131 is supported on the edge portion of the photosensitive chip 12. As will be known to those skilled in the art, the upper surface 121 of the photosensitive chip 12 includes a photosensitive area 1211 and a non-photosensitive area 1212 located around the photosensitive area 1211, wherein the photosensitive area 1211 is a sensitive area and is generally located at a central portion of the upper surface 121 of the photosensitive chip 12, and the non-photosensitive area 1212 is located at an edge portion of the upper surface 121 and surrounds the photosensitive area 1211. That is, the size of the first shaping member 131 is adapted to the photosensitive chip 12, so that the first shaping member 131 is supported by the non-photosensitive region 1212 of the photosensitive chip 12, which ensures that the photosensitive region 1211 of the photosensitive chip 12 is not damaged in the subsequent bending process of the photosensitive chip 12. It should be noted that, in the present invention, it is assumed that the central line of the photosensitive chip 12 is a regular shape, i.e., the photosensitive region 1211 and the non-photosensitive region 1212 of the photosensitive chip 12 are symmetrically distributed about the center. When the photo sensor chip 12 is in an irregular shape, the central line of the photo sensor chip 12 refers to the central line of the photo sensing area 1211.

More preferably, the shape and size of the first shaping member 131 are adapted to the shape and size of the photosensitive chip 12, so that when the photosensitive chip 12 is attached to the first shaping member 131, the first shaping member 131 is supported on the non-photosensitive area 1212 of the photosensitive chip 12, and the center of the first shaping member 131 is coaxial with the center of the photosensitive chip 12. That is, the photosensitive chip 12 is coaxially attached to the first shaping member 131.

As shown in fig. 3, in the embodiment of the present application, the first shaping member 131 includes a first shaping member body 1311 and an adhesive 1340 applied to the first shaping member body, wherein the first shaping member body 1311 is disposed on the circuit board 11, and the adhesive 1340 is used for adhering the photosensitive chip 12. It should be understood that the adhesive 1340 serves to adhere the first shaping body 1311 and the photo sensor chip 12, and the thickness and material thereof are not limited to the application. Also, in other examples of the present application, the photosensitive chip 12 may be directly disposed on the first shaping member body 1311 by ultrasonic welding or the like without the adhesive 1340. That is, in other examples of the present application, the adhesive is 1340 an unnecessary element. Preferably, in the embodiment of the present application, the adhesive 1340 has a certain flexibility and a high viscosity.

Specifically, before the accommodating space 100 is formed, the second shaping member 132 should be pre-set at a pre-set position of the circuit board 11 in advance, so that the second shaping member 132 is accommodated in the accommodating space 100 after the photosensitive chip 12 is bonded to the first shaping member 131 to form the accommodating space 100.

As previously mentioned, the height of the second shaping member 132 is less than the height of the first shaping member 131. In particular, in the present embodiment, the height setting of the second shaping member 132 is related to the relative positional relationship between the second shaping member and the first shaping member 131. Specifically, the shape of the shaping surface 130 formed by the first shaping member 131 and the second shaping member 132 is set based on the shape of the actual focal plane. That is, the relative positional relationship between the first and

second shaping members

131 and 132 and the setting of the height difference therebetween should be matched to the actual focal plane shape. More specifically, as the second shaping member 132 approaches the first shaping member 131, the difference in height between the first and

second shaping members

131, 132 should decrease, i.e., the height of the second shaping member 132 should increase; as the second shaping member 132 moves away from the first shaping member 131, the difference in height between the first and

second shaping members

131, 132 should increase, i.e., the height of the second shaping member 132 should decrease. It is worth mentioning that in the present embodiment, the shape of the shaping surface 130 matches the actual focal plane shape, and does not mean that the shape of the shaping surface 130 completely coincides or coincides with the shape of the actual focal plane, which merely means that the shape of the shaping surface 130 tends to coincide with the shape of the actual focal plane.

Preferably, in the embodiment of the present application, the second shaping member 132 is symmetrically arranged with respect to the center of the photosensitive chip 12. In this way, when the lower surface 122 of the photosensitive chip 12 is attached to the second shaping member 132 under the action of the pressure difference, the bonding points of the second shaping member 132 and the photosensitive chip 12 are also symmetrically distributed with respect to the center of the photosensitive chip 12, so as to form uniform bonding force on two opposite sides or four sides of the photosensitive chip 12, thereby ensuring that the photosensitive chip 12 can be shaped more stably. More specifically, in the embodiment of the present application, the second shaping members 132 are symmetrically disposed on both sides of the center line defined by the longer sides of the photosensitive chip 12. Of course, those skilled in the art will appreciate that in other examples of the present application, the second shaping member 132 can be symmetrically disposed in other ways with respect to the center of the photosensitive chip 12. It should be noted that, in the embodiment of the present application, the shape of the second shaping member 132 is not limited to the present application, and includes, but is not limited to, an elongated shape, a pillar shape, and the like.

Similar to the first shaping member 131, in the present embodiment, the second shaping member 132 includes a second shaping member body 1321 and an adhesive 1340 applied to the second shaping member body 1321. It should be understood that the photosensitive chip 12 is adhered to the upper surface of the second shaping member 132 by the adhesive 1340, so as to prevent the photosensitive chip 12 from being broken due to the suspension of the photosensitive chip 12, and prevent the photosensitive chip 12 from being deformed (e.g., gradually tending to a flat photosensitive chip) during the use process. It should be noted that in the embodiment of the present application, the adhesive 1340 applied to the first shaping body 1311 and the adhesive 1340 applied to the second shaping body 1321 can be implemented by the same adhesive 1340 or different types of adhesives 1340, and neither the amount nor the thickness of the adhesive 1340 is limited by the present application.

Preferably, in the present embodiment, the first and

second shaper bodies

1311, 1321 are made of a material having a high hardness and a high thermal conductivity, such as a metallic material (including a pure metallic material, a metallic and non-metallic alloy material, a metallic and metallic alloy material). It should be noted that, in the embodiment of the present application, the first and

second shaping body

1311 and 1321 extend between the photosensitive chip 12 and the circuit board 11, respectively, so that when the first and

second shaping body

1311 and 1321 are implemented by a metal material having a high thermal conductivity, heat generated by the operation of the photosensitive chip 12 can be efficiently conducted to the circuit board 11 by the first and

second shaping body

1311 and 1321 and finally emitted to the outside. The heat dissipation portion will be further described in the following description, and will not be further expanded here.

When the photosensitive chip 12 is adhered to the first shaping member 131 to define the accommodating space 100, a certain distance exists between the lower surface 122 of the photosensitive chip 12 and the adhesive 1340 of the second shaping member 132. Accordingly, after the air in the accommodating space 100 is sucked out through the opening 133, the photo chip 12 is continuously bent downward under the action of the pressure difference so that the distance between the lower surface 122 of the photo chip 12 and the second shaping member 132 is continuously reduced until the lower surface 122 of the photo chip 12 contacts the adhesive 1340 of the second shaping member 132, so as to adhere the photo chip 12 to the second shaping member 132 through the adhesive 1340. When the photosensitive chip 12 is adhered to the first and

second shaping members

131 and 132 at the same time, the shape of the photosensitive chip 12 is shaped into the shape of the shaping surface 130, so that the shape of the lower surface 122 of the photosensitive chip 12 is adapted to the actual focal plane.

As shown in fig. 5, in the embodiment of the present application, the opening 133 is formed in the circuit board 11 at a position corresponding to the central region of the photosensitive chip 12. Thus, when the air in the accommodating space 100 is exhausted by the air suction device such as an air pump, the air in the accommodating space 100 can flow out of the opening 133 from the periphery in a specific manner (the other flow rate near the center of the photo chip 12 is fast, and the flow rate near the edge of the photo chip 12 is slow). Based on the relationship between the pressure and the flow rate, the pressure difference formed at each position between the upper and lower surfaces 121,122 of the photo chip 12 gradually increases from the edge position to the central region of the photo chip 12, so that the deformation degree of the photo chip 12 gradually increases from the edge of the photo chip 12 to the center of the photo chip 12 under the increasing pressure difference to bend and deform downward in a manner of tending to the shaping surface 130. That is, in the embodiment of the present application, the position where the opening 133 is formed on the circuit board 11 is set to correspond to the central region of the photosensitive chip 12, which is beneficial for the deformation mode of the photosensitive chip 12 to be more towards the shape of the actual focal plane, and the gradual pressure difference (without sudden stress change) is beneficial for preventing the photosensitive chip 12 from being suddenly broken during the deformation process. It should be noted that, in the embodiment of the present application, the number of the openings 133 may be set to be one or more, which is not limited in the present application.

It should be understood that the opening 133 may be formed at other positions on the circuit board 11 in other examples of the embodiments of the present application.

FIG. 7 illustrates a schematic top view of a variant implementation of the photosensitive assembly according to an embodiment of the present application. As shown in fig. 7, in this modified embodiment, the opening 133 is formed at a position of the wiring board 11 between the first and

second shaping members

131 and 132. Preferably, in this modified embodiment, the positions of the openings 133 formed on the circuit board 11 are symmetrically arranged with respect to the center of the photosensitive chip 12, so that when the air in the accommodating space 100 is exhausted by an air suction device such as an air pump, the air in the accommodating space 100 can be respectively exhausted relatively uniformly and symmetrically along the openings 133, thereby forming relatively uniform pressure differences at the positions symmetrical with respect to the center of the photosensitive chip 12, so that the photosensitive chip 12 can be bent downward more symmetrically and gently in a manner of tending to the shape of the shaping surface 130.

FIG. 8 illustrates a schematic diagram of another variant implementation of the photosensitive assembly according to an embodiment of the present application. As shown in fig. 8, in this modified embodiment, a part of the opening 133 is formed in the wiring board 11 at a position corresponding to the central region of the photosensitive chip 12, and another part of the opening 133 is formed in the wiring board 11 at a position between the first shaping member 131 and the second shaping member 132. In particular, in this modified embodiment, another part of the opening 133 is formed at a position of the wiring board 11 symmetrically arranged with respect to the center of the photosensitive chip 12.

To facilitate positioning and mounting of the first and

second shaping members

131 and 132, as shown in fig. 9, in some examples of the embodiments of the present application, the circuit board 11 further includes a first positioning groove 111 and a second positioning groove 112 concavely formed on a top surface of the circuit board 11, wherein the first positioning groove 111 is used for positioning to fittingly mount the first shaping member 131 therein, and the second positioning groove 112 is used for positioning to fittingly mount the second shaping member 132 therein.

In some other examples of the present application, in order to facilitate positioning and mounting of the first and

second shaping members

131 and 132, as shown in fig. 10, the circuit board 11 further includes a first positioning through hole 111A and a second positioning through hole 112A penetratingly formed in the circuit board 11, wherein the first positioning through hole 111A is configured to be positioned to fittingly mount the first shaping member 131 therein, and the second positioning through hole 112A is configured to be positioned to fittingly mount the second shaping member 132 therein. Moreover, the photosensitive assembly 10 further includes a reinforcing plate 18 attached to the bottom surface of the circuit board 11. Preferably, the reinforcing plate 18 is made of a metal material with high thermal conductivity, so that the heat generated by the photosensitive chip 12 can be directly conducted to the reinforcing plate 18 through the first shaping member 131 and the second shaping member 132 for heat dissipation.

It is worth mentioning that in the present embodiment, the first and

second shaping members

131 and 132 are prefabricated members, that is, the first and

second shaping members

1311 and 1321 are attached to the circuit board 1 at predetermined positions after being prefabricated. Alternatively, the first shaping member 131 and the second shaping member 132 may be integrally formed at a predetermined position of the circuit board 11. For example, when the first and

second shaping body

1311, 1321 are made of a metal material, the first and

second shaping body

1311, 1321 may be integrally formed at a predetermined position of the wiring board 11 by a plating molding process. Of course, it should be readily understood that when the first and

second shaping members

1311, 1321 are made of other materials having high hardness and high thermal conductivity, the first and

second shaping members

131, 132 may be integrally formed at predetermined positions of the circuit board 11 using corresponding integral molding processes. And is not intended to limit the scope of the present application.

It is also worth mentioning that in other examples of embodiments of the present application, the shaping member 13 may also comprise a greater number of shaping members or a smaller number of shaping members. For example, in another example of the present application, as shown in fig. 11, the shaping member 13 further includes a third shaping member 134 (including a third shaping member 134 body and an adhesive 1340 applied to a top surface of the third shaping member 134 body), wherein the third shaping member 134 is disposed between the first shaping member 131 and the second shaping member 132 to form the shaping surface 130 through the first shaping member 131, the second shaping member 132, and the third shaping member 134. As another example, as shown in fig. 12, in another example of the present application, the shaping component 13 only includes the first shaping member 131, wherein an upper surface of the first shaping member 131 includes an arc surface recessed downward, and the arc surface is configured to form the lower surface 122 adapted to the focus imaging surface of the photosensitive assembly 10 when the photosensitive chip 12 is bent downward.

FIG. 13 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application. In this variant embodiment, as shown in fig. 13, both the first and the

second shaping members

131, 132 have a closed ring shape, so as to form a housing cavity between the first and the

second shaping members

131, 132. In particular, in this variant embodiment, the reshaping component 13 further comprises an adhesive 1340 disposed between the first reshaping element 131 and the second reshaping element 132, wherein the highest height of the upper surface of the adhesive 1340 is higher than that of the upper surface of the second reshaping element 132. It should be appreciated that in this alternative embodiment, the adhesive 1340 has a relatively high viscosity to prevent the adhesive 1340 from flowing out of the upper surface of the second shaping member 132. Thus, after the photo chip 12 is attached to the first shaping member 131, the photo chip 12 can be forced to bend downward by the pressure difference generated by the air sucked and exhausted from the accommodating space 100 until the photo chip is adhered to the adhesive 1340 between the first shaping member 131 and the second shaping member 132. It is worth mentioning that in this variant embodiment, the adhesive 1340 may not be provided on the upper surface of the second shaping member 132. It should be noted that, since the adhesive 1340 is higher than the second shaping member 132, the adhesive 1340 may flow to the upper surface of the second shaping member 132 during air suction, so that the photosensitive chip 12 is adhered to the second shaping member 132 through the adhesive 1340 after bending downward, so as to achieve better adhesion and improved reliability. Further, the adhesive 1340 may also be no higher than the second shaping member 132, for example, the upper surface of the adhesive 1340 is flush with the upper surface of the second shaping member 132.

In order to improve the heat dissipation performance of the photosensitive assembly, as shown in fig. 3 to 4B, in the embodiment of the present application, the photosensitive assembly 10 further includes a heat dissipation member 19 formed in the accommodating space 100, wherein the heat dissipation member 19 is attached to at least a portion of the lower surface 122 of the photosensitive chip 12, so that the heat generated by the photosensitive chip 12 can be conducted to the outside through the heat dissipation member 19 in contact with the photosensitive chip 12.

Preferably, in the embodiment of the present application, the heat dissipation member 19 fills the entire accommodating space 100, so that the lower surface 122 of the photosensitive chip 12 is completely in contact with the heat dissipation member 19, thereby maximizing the heat dissipation area and improving the heat dissipation performance. It should be noted that the forming position and the filling ratio of the heat dissipating member 19 in the accommodating space 100 are determined by the shape of the second shaping member 132 and the position of the at least one opening 133.

Specifically, when the second shaping member 132 is implemented in a closed "square" shape and the at least one opening 133 is formed in the circuit board 11 at a position corresponding to the central region of the photosensitive chip 12, the heat dissipation member 19 can occupy at most only the cavity surrounded by the second shaping member 132, the photosensitive chip 12 and the circuit board 11, as shown in fig. 14. Of course, even if the second shaping member 132 is implemented in a closed "square" shape, the heat sink 19 can occupy the entire accommodating space 100, and only a portion of the opening 133 formed in the circuit board 11 is required to be located in a position corresponding to the central region of the photo sensor chip 12, and another portion of the opening 133 formed in the circuit board 11 is required to be located between the first shaping member 131 and the second shaping member 132.

In a specific implementation, the heat dissipation material 190 for forming the heat dissipation member 19 may enter the accommodating space 100 through the opening 133, so as to form the heat dissipation member 19 in the accommodating space 100.

For example, when the heat dissipation material 190 is implemented as a heat dissipation material 190 having a fluid shape, the fluid-shaped heat dissipation material 190 may be injected into the accommodating space 100 through the opening 133 to form the heat dissipation member 19 after being cured and molded. For ease of operation, the photosensitive assembly 10 may be inverted during the implantation process to prevent the fluid-like heat sink material 190 from flowing out of the openings 133. In particular, when the number of the openings 133 is only one, in order to balance the internal and external pressures so that the fluid heat dissipation material 190 can be smoothly injected into the accommodating space 100, a vent hole 135 may be further formed on the circuit board 11, as shown in fig. 15. Of course, when the number of the openings 133 exceeds one, the suction holes function as the air holes 135 except for being used for injecting the heat dissipation material 190. That is, when the number of the openings 133 exceeds one, at least one of the openings forms the vent hole 135.

It should be noted that, when the heat dissipation member 19 is cured and molded by the fluid-shaped heat dissipation material 190, preferably, the heat dissipation material 190 can fill the entire accommodating space 100, so that after the curing and molding, on one hand, the heat dissipation member 19 is attached to the entire lower surface 122 (corresponding to the part of the accommodating space 100) of the photo sensor chip 12 to increase the heat dissipation area; on the other hand, the heat dissipation member 19 extends from the lower surface 122 of the light sensing chip 12 to the opening 133, that is, the heat dissipation member 19 directly extends to the outside, so as to further facilitate heat dissipation. Of course, in other examples of the embodiment of the present application, the photosensitive assembly 10 further includes a reinforcing plate 18 attached to the bottom surface of the circuit board 11, and preferably, the reinforcing plate 18 is made of a metal material with high thermal conductivity, in such a way as to further enhance the heat dissipation performance of the photosensitive assembly 10.

Of course, in other examples of the embodiments of the present application, the heat dissipation material 190 may also be implemented in other forms, for example, a granular heat dissipation material 190, as shown in fig. 16. Accordingly, the heat dissipation material 190 in a granular form may be filled into the accommodating space 100 to form the heat dissipation member 19. In order to prevent the granular heat dissipation material 190 from leaking out of the opening 133, in this example of the embodiment of the present application, the photosensitive assembly 10 further includes a reinforcing plate 18 for sealing the opening 133, and preferably, the reinforcing plate 18 is made of a metal material having high thermal conductivity, so as to further enhance the heat dissipation performance of the photosensitive assembly 10 while sealing the opening 133.

Further, as shown in fig. 3, in the embodiment of the present application, the photosensitive assembly 10 further includes at least one electronic component 14, a lead for electrically connecting the photosensitive chip 12 to the circuit board 11, a filter element 15, and a bracket 16, where the at least one electronic component 14 is disposed on the circuit board 11 and located around the photosensitive chip 12, and includes but is not limited to a capacitor, a resistor, an inductor, and the like.

After the photosensitive chip 12 is attached to the first shaping member 131 and bent, the photosensitive chip 12 is electrically connected to the circuit board 11 through the lead 123. Specifically, each of the leads 123 extends between the photo sensor chip 12 and the circuit board 11 in a bending manner, so as to electrically connect the photo sensor chip 12 to the circuit board 11 through the leads 123, so that the circuit board 11 can supply power to the photo sensor chip 12 based on the leads 123, and the photo sensor chip 12 can transmit the collected signals based on the leads 123.

It is worth mentioning that in this specific example, the type of the lead wire 123 is not limited by the present application, for example, the lead wire 123 may be a gold wire, a silver wire, a copper wire. And, the lead 123 can be mounted between the circuit board 11 and the light sensing chip 12 through a process of "gold wire bonding" for realizing electrical connection therebetween.

Specifically, "gold wire bonding" processes generally fall into two types: the 'forward bonding of gold thread' process and the 'reverse bonding of gold thread' process. The "direct bonding gold wire" process means that in the process of laying the lead 123, one end of the lead 123 is first formed on the conductive end of the wiring board 11, the lead 123 is then extended in a bent manner, and finally the other end of the lead 123 is formed on the conductive end of the photosensitive chip 12, in such a manner that the lead 123 is formed between the photosensitive chip 12 and the wiring board 11. The "reverse gold wire bonding" process means that in the process of laying the lead 123, one end of the lead 123 is first formed on the conductive end of the photosensitive chip 12, the lead 123 is then extended curvedly, and finally the other end of the lead 123 is formed on the conductive end of the wiring board 11, in such a manner that the lead 123 is formed between the photosensitive chip 12 and the wiring board 11. It is worth mentioning that the height of the upward protrusion of the lead 123 formed by the "reverse bonding gold wire" process is higher than the height of the upward protrusion of the lead 123 formed by the "forward bonding gold wire" process, and therefore, it is preferable that the lead 123 is formed by the "reverse bonding gold wire" process in this embodiment.

Of course, those skilled in the art should understand that in other examples of the embodiment of the present application, the photosensitive chip 12 and the circuit board 11 may be conducted in other manners (the lead 123 may not be used), for example, a backside conduction solution is used. And is not intended to limit the scope of the present application.

As shown in fig. 3, in the embodiment of the present application, the holder 16 is provided to the circuit board 11 for supporting the filter element 15. Specifically, in the embodiment of the present application, the support 16 is implemented as a conventional plastic support 16, which is pre-formed and attached to the top surface of the circuit board 11, wherein the filter element 15 is mounted on the top of the support 16 and corresponds to at least the photosensitive area 1211 of the photosensitive chip 12 for filtering the light entering the photosensitive chip 12 to improve the imaging quality. That is, in the embodiment of the present application, the photosensitive assembly 10 is based on a conventional COB process.

Those skilled in the art will appreciate that the filter element 15 can be implemented in different types, including but not limited to the filter element 15 can be implemented as an infrared cut filter, a full transmission spectrum filter, and other filters or combinations of filters. Specifically, for example, when the filter element 15 is implemented as a combination of an infrared cut filter and a full-transmission spectrum filter, that is, the infrared cut filter and the full-transmission spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive chip 12, so that, when the device is used in an environment with sufficient light, such as daytime, the infrared cut filter can be switched to the photosensitive path of the photosensitive chip 12 to filter the infrared rays entering the photosensitive chip 12 in the light reflected by the object by the infrared cut filter, and, when the device is used in an environment with dark light, such as night, the full-transmission spectrum filter can be switched to the photosensitive path of the photosensitive chip 12 to allow the infrared rays entering the photosensitive chip 12 in the light reflected by the object to be partially transmitted.

FIG. 17 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application. As shown in fig. 17, in this modified embodiment, the photosensitive assembly 10 is prepared based on a mob (molding on board) process. Specifically, in this modified embodiment, the bracket 16 is implemented as a mold bracket 16A that is integrally formed on the circuit board 11 by a molding process so as to integrally cover at least a part of the circuit board 11 and at least a part of the electronic component 14.

In a specific manufacturing process, the circuit board 11 may be placed in a lower mold, and an upper mold matched with the lower mold is provided to form a molding cavity between the upper mold and the lower mold after the upper mold and the lower mold are closed, wherein the upper mold includes a pressing block pressed on the circuit board 11 during closing. Then, a molding material is injected into the molding cavity, and after curing, molding and drawing, the molding bracket 16A integrally covering at least a part of the circuit board 11 and at least a part of the electronic component 14 is obtained.

It is worth mentioning that the shape of the inner side surface of the mold holder 16A is determined by the shape of the compact. For example, when the side of the compact is perpendicular to the wiring board 11, the inner side of the mold holder 16A is perpendicular to the upper surface 121 of the photosensitive chip 12. For another example, when the inner side surface of the compact is inclined to the wiring board 11, the inner side surface of the mold holder 16A extends obliquely outward.

It should be noted that, when the photosensitive assembly 10 is manufactured based on the MOB process, the first shaping member 131 and the second shaping member 132 of the shaping assembly are preferably mounted on the predetermined position of the circuit board 11 after the module bracket 16 is integrally formed on the predetermined position of the circuit board 11. Such a manufacturing sequence is advantageous for engineering implementation.

FIG. 18 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application. As shown in fig. 18, in this modified embodiment, the photosensitive assembly 10 is prepared based on an moc (molding on chip) process. Specifically, in this modified embodiment, the support 16 is implemented as a mold support 16B that is integrally formed on the circuit board 11 by a molding process to integrally cover at least a portion of the circuit board 11, the at least one electronic component 14, and at least a portion of the non-photosensitive region 1212 of the photosensitive chip 12.

In a specific manufacturing process, after the photosensitive chip 12 is attached to the first shaping member 131 and bent to be attached to the second shaping member 132 (for convenience of description, this state is positioned as a component semi-finished product), the component semi-finished product is placed in a lower mold, and an upper mold matched with the lower mold is provided, so that a molding cavity is formed between the upper mold and the lower mold after the upper mold and the lower mold are closed. The upper mold comprises a pressing block, wherein the pressing block is pressed in a non-photosensitive area 1212 of the photosensitive chip 12 during mold closing. And then, injecting a molding material into the molding cavity, and after curing, molding and drawing, obtaining the molding support 16B integrally covering at least a part of the circuit board 11, the at least one electronic component 14, and at least a part of the non-photosensitive region 1212 of the photosensitive chip 12, wherein the region occupied by the pressing block correspondingly forms a light through hole of the photosensitive chip 12.

It is worth mentioning that the shape of the inner side surface of the mold holder 16B is determined by the shape of the compact. For example, when the side of the pressing block is perpendicular to the upper surface 121 of the photosensitive chip 12, the inner side of the mold holder 16B is perpendicular to the upper surface 121 of the photosensitive chip 12. For another example, when the inner side surface of the compact is inclined to the upper surface 121 of the photosensitive chip 12, the inner side surface of the holder mold 16B extends obliquely outward. In particular, when the inner side of the press block has a stepped shape, the inner side of the mold holder 16 also has a stepped shape to form a mounting platform 160 for mounting the filter element 15 on the top surface of the mold holder 16B. For convenience of explanation, this technical solution is defined as an IOM solution (IR Filter on Molding) in the application, as shown in fig. 19.

It should be noted that, when the photosensitive assembly 10 is manufactured based on the MOC process, the first shaping member 131 and the second shaping member 132 of the shaping assembly are pre-installed or integrally formed at a predetermined position of the circuit board 11 before the module bracket 16 is integrally formed at the predetermined position of the circuit board 11 and the photosensitive chip 12. Such a manufacturing sequence is advantageous for engineering implementation.

It is worth mentioning that, in order to prevent the photosensitive chip 12 from being shifted in position due to the impact of the injected molding material during the MOC process, in some examples of this modified embodiment of the present application, the photosensitive assembly 10 further includes a side coating 161 covering the photosensitive chip 12 and the side portion of the first shaping member 131, for preventing the photosensitive chip 12 from being shifted in position during the molding process, as shown in fig. 20. It should be understood that the side encapsulation 161 can not only prevent the position of the photosensitive chip 12 from being shifted, but also effectively reduce the stress generated by the mold frame 16B from being transmitted to the photosensitive chip 12.

FIG. 21 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application. As shown in fig. 21, in this variant implementation, the filter element 15 is stacked on the photosensitive chip 12, and the support 16 is implemented as a molding support 16C that is integrally molded by a molding process to cover at least a portion of the circuit board 11, the at least one electronic component 14, at least a portion of the non-photosensitive region 1212 of the photosensitive chip 12, and at least a portion of the filter element 15.

In a specific manufacturing process, after the photosensitive chip 12 is attached to the first shaping member 131 and bent to be attached to the second shaping member 132, the filter element 15 is stacked on the photosensitive chip 12 to form a semi-finished component. And then, placing the semi-finished product of the component in a lower die, and providing an upper die matched with the lower die so as to form a forming cavity between the upper die and the lower die after the upper die and the lower die are closed. The upper mold comprises a pressure piece, wherein the pressure piece presses against the filter element 15 when the mold is closed. And then, injecting a molding material into the molding cavity, and after curing, molding and drawing, obtaining the molding support 16C integrally covering at least a part of the circuit board 11, the at least one electronic component 14, and at least a part of the non-photosensitive region 1212 of the photosensitive chip 12, wherein the region occupied by the pressing block correspondingly forms a light through hole of the photosensitive chip 12.

It is worth mentioning that the shape of the inner side surface of the mold holder 16C is determined by the shape of the compact. For example, when the side of the compact is perpendicular to the filter element 15, the inner side of the mold holder 16C is perpendicular to the filter element 15. For another example, when the inner side surface of the pressing block is inclined to the filter element 15, the inner side surface of the molding holder 16C extends obliquely outward. For ease of explanation, this solution is defined in the application as the IOC solution (IR Filter on Chip).

It should be noted that, in the embodiment of the present application, in addition to supporting the filter element 15 on the support 16 (including the plastic support 16, the molding supports 16A,16B, and 16C) and the photosensitive chip 12, the filter element 15 may be mounted in other manners, and only the filter element 15 needs to be held in the photosensitive path of the photosensitive component 10. For example, in other examples of the embodiment of the present application, the photosensitive assembly 10 further includes a filter element holder 17, and the filter element holder 17 is mounted to the holder 16 and is used for mounting the filter element 15. For another example, when the photosensitive assembly 10 and the optical lens 20 cooperate to form a camera module, the filter element 15 may also be supported in the optical lens 20, or may be formed on the surface of a lens in the optical lens 20 in a form of a coating. And is not intended to limit the scope of the present application.

In conclusion, the photosensitive assembly based on the embodiment of the application is clarified, and the planar photosensitive chip is bent to be adapted to the shape of the actual focal point imaging surface through a special manufacturing process, so that the imaging quality of the camera module is improved.

The manufacturing process of the photosensitive assembly 10 is explained below from the viewpoint of the manufacturing process.

As shown in fig. 4A and 4B, a manufacturing process of the photosensitive member 10 based on the embodiment of the present application is illustrated, which is used to prepare the photosensitive member described above and its modified implementation.

Specifically, the method for manufacturing the photosensitive assembly 10 according to the embodiment of the present application includes the steps of:

first, a circuit board 11, a photosensitive chip 12, a first shaping member 131 and a second shaping member 132 are provided, wherein the circuit board 11 includes at least one opening 133.

Then, the first shaping member 131 and the second shaping member 132 are fixed to the predetermined positions of the circuit board 11.

Then, the photosensitive chip 12 is attached to the first shaping member 131, so as to define an accommodating space 100 among the first shaping member 131, the circuit board 11 and the photosensitive chip 12, wherein the opening 133 formed in the circuit board 11 is communicated with the accommodating space 100, the second shaping member 132 is located in the accommodating space 100, and the second shaping member 132 is lower than the first shaping member 131, wherein an upper surface of at least one of the first and second shaping members includes an arc surface which is recessed downward and inward.

Then, the air in the accommodating space 100 is sucked out through the opening 133 to generate a pressure difference between the upper surface 121 and the lower surface of the photosensitive chip 12, so that the photosensitive chip 12 is forced to bend downward until being attached to the second shaping member 132, so that the lower surface 122 of the photosensitive chip 12 is fittingly attached to the shaping surface 130 defined by the first shaping member 131 and the second shaping member 132.

It should be noted that the opening 133 on the circuit board 11 may also be formed by a punching process after the accommodating space 100 is formed, which is not limited in the present application.

Preferably, in the embodiment of the present application, the first shaping member 131 should have a closed shape (e.g., implemented to have a shape of a "square"), the second shaping member 132 is symmetrically arranged with respect to the center of the photosensitive chip 12, and the opening 133 is formed at the circuit board 11 at a position corresponding to the central region of the photosensitive chip 12. Alternatively, the opening 133 may be formed at a position of the wiring board 11 between the first shaping member 131 and the second shaping member 132, and the opening 133 may be formed at a position of the wiring board 11 symmetrically arranged with respect to the center of the photosensitive chip 12.

It is worth mentioning that the height setting of the second shaping member 132 is related to the relative position relationship between the second shaping member 132 and the first shaping member 131. Specifically, the shape of the shaping surface 130 for defining the curved shape of the photosensitive chip 12, which is defined by the first shaping member 131 and the second shaping member 132, is set based on the shape of the actual focal plane. More specifically, as the second shaping member 132 approaches the first shaping member 131, the difference in height between the first and

second shaping members

131, 132 should decrease (i.e., the height of the second shaping member 132 should increase); as the second shaping member 132 moves away from the first shaping member 131, the difference in height between the first and

second shaping members

131, 132 should increase (i.e., the height of the second shaping member 132 should decrease). It is worth mentioning that in the present embodiment, the shape of the shaping surface 130 matches the actual focal plane shape, and does not mean that the shape of the shaping surface 130 completely coincides or coincides with the shape of the actual focal plane, which merely means that the shape of the shaping surface 130 tends to coincide with the shape of the actual focal plane.

In particular, in the embodiment of the present application, the upper surface of at least one of the first and

second shaping members

131 and 132 each include an arc surface recessed downward and inward.

Accordingly, the process of bending the photosensitive chip 12 includes:

the photosensitive chip 12 is bent until the lower surface 122 of the photosensitive chip 12 is attached to the arc surface, so that the photosensitive chip 12 forms a lower surface adapted to the focal point imaging surface of the photosensitive assembly 10 when being bent downward.

As shown in fig. 4B, the manufacturing method further includes the steps of:

a heat sink 19 is formed in the accommodating space 100 defined by the first shaping member 131, the photosensitive chip 12 and the circuit board 11, wherein the heat sink 19 is attached to at least a portion of the lower surface 122 of the photosensitive chip 12.

Preferably, in the embodiment of the present application, the heat dissipation member 19 occupies the entire accommodating space 100, so that the lower surface 122 (corresponding to the portion of the accommodating space 100) of the photosensitive chip 12 is completely in contact with the heat dissipation member 19, and thus the heat dissipation area is maximally increased, and the heat dissipation performance is improved.

In a specific implementation, when the heat dissipation material 190 is implemented as the heat dissipation material 190 having a fluid shape, the process of forming the heat dissipation member 19 in the accommodating space 100 includes: the fluid heat dissipation material 190 is injected into the accommodating space 100 through the opening 133 to form the heat dissipation member 19 after curing.

For ease of operation, the photosensitive assembly 10 may be inverted during the implantation process to prevent the fluid-like heat sink material 190 from flowing out of the openings 133. In particular, when the number of the openings 133 is only one, in order to balance the internal and external pressures so that the fluid heat dissipation material 190 can be smoothly injected into the accommodating space 100, the circuit board 11 may be further provided with a vent hole 135. Of course, when the number of the openings 133 exceeds one, the suction holes function as the air holes 135 except for being used for injecting the heat dissipation material 190. That is, when the number of the openings 133 exceeds one, at least one of the suction holes forms the vent hole 135.

After the heat sink 19 is molded, a reinforcing plate 18 may be further attached to the bottom surface of the circuit board 11, wherein the reinforcing plate 18 is preferably made of a metal material with high thermal conductivity, in such a way as to further enhance the heat dissipation performance of the photosensitive assembly 10.

In an implementation, the heat dissipation material 190 is implemented as granular heat dissipation material 190. The process of forming the heat sink 19 in the accommodating space 100 includes: filling the granular heat dissipation material 190 into the accommodating space 100 through the opening 133, and attaching a reinforcing plate 18 to the bottom surface of the circuit board 11 to seal the opening 133 through the reinforcing plate 18. Preferably, the reinforcing plate 18 is made of a metal material having a high thermal conductivity to further enhance the heat dissipation performance of the photosensitive assembly 10 while sealing the opening 133.

Further, the manufacturing process of the photosensitive assembly 10 further includes: a holder 16 is provided to the wiring board 11, and a filter element 15 is mounted to the holder 16.

In particular, in the COB process, the support 16 is embodied as a conventional plastic support 16. Accordingly, the process of disposing the bracket 16 on the circuit board 11 is specifically represented as follows: the plastic bracket 16 is attached to the circuit board 11. Further, the filter element 15 is attached to the holder 16.

In the MOB process, the bracket 16 is implemented as a molded bracket 16A. Accordingly, the process of disposing the bracket 16 on the circuit board 11 includes: the molding bracket 16A is integrally formed on the circuit board 11 by a molding process, wherein the molding bracket 16A covers at least a portion of the circuit board 11 and at least a portion of the at least one electronic component 14. Further, the filter element 15 is attached to the mold holder 16A.

It should be noted that, in the MOB process, the first shaping member 131 and the second shaping member 132 are mounted on the predetermined position of the circuit board 11 after the module bracket 16 is integrally formed on the predetermined position of the circuit board 11. Such a manufacturing sequence is advantageous for engineering implementation.

In the MOC process, the support 16 is implemented as a molded support 16B, and accordingly, the process of disposing the support 16 on the circuit board 11 includes: the molding bracket 16B is integrally formed on the circuit board 11 by a molding process, wherein the molding bracket 16B covers at least a portion of the circuit board 11, the at least one electronic component 14, and at least a portion of the non-photosensitive region 1212 of the photosensitive chip 12. Further, the filter element 15 is attached to the mold holder 16B.

In order to prevent the photosensitive chip 12 from being shifted in position due to impact of injected molding material during the MOC process, before the MOC process is performed to form the mold support 16B, a side encapsulation 161 is applied to the sides of the photosensitive chip 12 and the first shaping member 131, so that the side encapsulation 161 encapsulates the sides of the photosensitive chip 12 and the first shaping member 131, in such a way that the position of the photosensitive chip 12 is prevented from being shifted during the MOC process.

In the IOC process, the carrier 16 is implemented as a molded carrier 16C, and accordingly, the process of disposing the carrier 16 and the wiring board 11 includes: the optical filter element 15 is stacked on the photosensitive chip 12, and the circuit board 11 is integrally formed with the molding bracket 16C, wherein the molding bracket integrally covers at least a portion of the circuit board 11, the at least one electronic component 14, at least a portion of the non-photosensitive area 1212 of the photosensitive chip 12, and at least a portion of the optical filter element 15.

It is worth mentioning that in MOB, MOC and IOC processes, the shape of the inside of the molded stent 16 is determined by the shape of the compact. In particular, when the inner side of the press block has a stepped shape, the inner side of the mold holder 16 also has a stepped shape to form a mounting platform 160 for mounting the filter element 15 on the top surface of the mold holder 16. Accordingly, in these examples, the filter element 15 is mounted to the mounting platform 160.

It should also be noted that, in the embodiment of the present application, in addition to supporting the filter element 15 on the support 16 (including the plastic support 16, the molding supports 16A,16B, and 16C) and the photosensitive chip 12, the filter element 15 may be mounted in other manners, and only the filter element 15 needs to be held in the photosensitive path of the photosensitive component 10. For example, in other examples of the embodiment of the present application, the photosensitive assembly 10 further includes a filter element holder 17, and the filter element holder 17 is mounted to the holder 16 and is used for mounting the filter element 15. For another example, when the photosensitive assembly 10 and the optical lens 20 cooperate to form a camera module, the filter element 15 may also be supported in the optical lens 20, or may be formed on the surface of a lens in the optical lens 20 in a form of a coating. And is not intended to limit the scope of the present application.

As shown in fig. 22A and 22B, a second manufacturing process of the photosensitive member based on the embodiment of the present application is illustrated, which is used for preparing the photosensitive member described above and its modified implementation.

Specifically, as shown in fig. 22A, the manufacturing process of the photosensitive assembly 10 according to the embodiment of the present application includes the steps of:

first, a circuit board 11 and a photo sensor chip 12 are provided, wherein the circuit board 11 includes at least one opening 133. It should be noted that the opening 133 on the circuit board 11 may also be formed by a punching process after the accommodating space 100 is formed, which is not limited in the present application.

Next, a first shaping member 131 and a second shaping member 132 are integrally formed on the circuit board 11, wherein the second shaping member 132 has a height lower than that of the first shaping member 131, in such a way that the first and second shaping members 132 define a shaping surface 130 forming a concavity.

Then, the photosensitive chip 12 is attached to the first shaping member 131, and in this way, an accommodating space 100 is defined among the first shaping member 131, the circuit board 11 and the photosensitive chip 12, wherein the opening 133 is communicated with the accommodating space 100.

That is, compared to the first manufacturing process, in the second manufacturing process, the first shaping member 131 and the second shaping member 132 are integrally formed on the circuit board 11, instead of being prefabricated and then mounted.

Specifically, in the embodiment of the present application, the process of integrally forming a first shaping member 131 and a second shaping member 132 on the circuit board 11 includes:

integrally forming a first and a

second shaping body

1311, 1321 on the circuit board 11 by an electroplating molding process; and

adhesive 1340 is applied to the first and

second profile bodies

1311, 1321, respectively, to form the first profile 131 with the first profile body 1311 and the adhesive 1340 and the second profile 132 with the second profile body 1321 and the adhesive 1340.

second shaping members

131, 132 should increase (i.e., the height of the second shaping member 132 should decrease). Preferably, the top surface of the second trim body 1321 curves inwardly and downwardly.

It is worth mentioning that in the present embodiment, the shape of the shaping surface 130 matches the actual focal plane shape, and does not mean that the shape of the shaping surface 130 completely coincides or coincides with the shape of the actual focal plane, which merely means that the shape of the shaping surface 130 tends to coincide with the shape of the actual focal plane.

second shaping members

131 and 132 each include an arc surface recessed downward and inward.

Accordingly, the process of bending the photosensitive chip 12 includes:

As shown in fig. 22B, the process of manufacturing the photosensitive assembly 10 further includes the steps of:

In an implementation, the heat dissipation material 190 is implemented as granular heat dissipation material 190. The process of forming the heat sink 19 in the accommodating space 100 includes: the heat dissipation material 190 in a granular form is filled into the accommodating space 100 through the opening 133, and the reinforcing plate 18 is attached to the bottom surface of the circuit board 11 to seal the opening 133 through the reinforcing plate 18. Preferably, the reinforcing plate 18 is made of a metal material having a high thermal conductivity to further enhance the heat dissipation performance of the photosensitive assembly 10 while sealing the opening 133.

In order to prevent the photosensitive chip 12 from being shifted in position due to impact of injected molding material during the MOC process, before the MOC process is performed to form the mold support 16B, a side encapsulation 161 is applied to the sides of the photosensitive chip 12 and the first shaping member 131, so that the side encapsulation 161 encapsulates the sides of the photosensitive chip 12 and the first shaping member 131, in such a way that the position of the photosensitive chip 12 is prevented from being shifted during the MOC process. Further, the side encapsulation 161 can also serve as a buffer, reducing the stress transmitted from the mold support 16B to the photosensitive chip 12.

In summary, the method for manufacturing the photosensitive element according to the embodiment of the present application is clarified, and the planar photosensitive chip is bent to a shape adapted to an actual focal point imaging surface through a special manufacturing process, so as to improve the imaging quality of the camera module. And a heat dissipation member for enhancing heat dissipation is formed on the lower surface of the photosensitive chip to improve heat dissipation performance.

Schematic camera module

The following description applies the photosensitive assembly 10 described above to a camera module. The skilled person knows that the camera module has a moving focus camera module and a fixed focus camera module.

When the camera module is implemented as a fixed focus camera module, the camera module includes the photosensitive assembly and the optical lens 20 as described above, wherein the optical lens 20 is held in a photosensitive path of the photosensitive assembly 10. Specifically, the optical lens 20 is generally mounted on the bracket 16 to hold the optical lens 20 on the photosensitive element of the photosensitive element 10, and the specific effect thereof can be seen in fig. 23 to fig. 27. It should be noted that the drawings only illustrate some typical photosensitive assemblies in the embodiments of the present application, and the corresponding modifications are not listed, and those skilled in the art should fully understand this.

In the imaging process, the external light firstly passes through the optical lens 20, and is collected by the photosensitive chip 12 after being filtered by the filter element 15. In particular, in the embodiment of the present application, the photosensitive chip 12 is bent based on the shape of the actual focal plane, in such a way that the imaging quality of the camera module is improved.

When the camera module is implemented as a moving focus camera module, as shown in fig. 28, the camera module includes the photosensitive assembly, the optical lens 20 and the driving element 30, wherein the driving element 30 is mounted on the bracket 16, and the optical lens 20 is mounted on the driving element 30, so that the driving element 30 can carry the optical lens 20 to move along the photosensitive path of the photosensitive assembly 10 to realize the moving focus function. It should be noted that the drawings only illustrate a typical photosensitive assembly in the embodiments of the present application, and the corresponding modifications are not listed, and those skilled in the art should fully understand this.

In summary, the image pickup module according to the embodiment of the present application is clarified, which improves the imaging quality of the image pickup module by bending the planar photosensitive chip 12 to a shape adapted to the actual focal point imaging surface through a special manufacturing process.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. A photosensitive assembly, comprising:

a circuit board;

the photosensitive chip is electrically connected with the circuit board; and

2. The photosensitive assembly of claim 1, wherein the shaping component includes a first shaping member and a second shaping member, the first shaping member forms the accommodating space with the photosensitive chip and the circuit board, the second shaping member is disposed on the circuit board and located in the accommodating space, and the second shaping member is lower than the first shaping member in height.

3. The photosensitive assembly of claim 2, wherein an upper surface of at least one of the first and second shaping members includes a downwardly and inwardly recessed arcuate surface configured such that the photosensitive chip, when bent downwardly, forms a lower surface that conforms to a focal imaging plane of the photosensitive assembly.

4. The photosensitive assembly of claim 1, wherein the circuit board has at least one opening formed therethrough and communicating with the receiving space, the at least one opening configured to vent gas in the receiving space during assembly of the photosensitive assembly so as to bend the photosensitive chip downward.

5. The photosensitive assembly according to claim 4, wherein the opening is formed in the circuit board at a position corresponding to a central region of the photosensitive chip.

6. A photosensitive assembly according to claim 3 wherein the second shaping members are symmetrically arranged with respect to the center of the photosensitive chip.

7. The photosensitive assembly of claim 6, wherein the second shaping element is symmetrically disposed on both sides of a center line defined by the longer sides of the photosensitive chip.

8. A photosensitive assembly according to claim 3 wherein the cross-sectional shape of the first shaping member is a closed loop.

9. The photosensitive assembly of claim 3, wherein the shaping component further comprises an adhesive applied between the first and second shaping members, wherein the adhesive has a height that is higher than an upper surface of the second shaping member.

10. The photosensitive assembly of claim 3 wherein the first shaping member includes a first shaping member body and an adhesive applied to the first shaping member body, and the second shaping member includes a second shaping member body and an adhesive applied to the second shaping member body.

11. The photosensitive assembly of claim 10 wherein the first and second profile bodies are integrally formed on a top surface of the circuit board.

12. The photosensitive assembly of claim 10 wherein the first and second profile bodies are pre-fabricated and mounted to the circuit board.

13. The photosensitive assembly of claim 4, further comprising a heat sink, wherein the heat sink is formed in the receiving space and attached to at least a portion of a lower surface of the photosensitive chip.

14. The photosensitive assembly of claim 13, wherein the heat sink is formed by heat dissipating material entering the receiving space through the at least one opening.

15. The utility model provides a module of making a video recording which characterized in that includes:

an optical lens; and

the photosensitive assembly of any one of claims 1-14 wherein the optical lens is held in a photosensitive path of the photosensitive assembly.

16. The camera module according to claim 15, wherein the curved shape of the lower surface of the photo-sensing chip is adapted to the shape of an actual focus imaging plane of the camera module.

17. A method of manufacturing a photosensitive assembly, comprising:

18. The method of manufacturing a photosensitive assembly according to claim 17, wherein an upper surface of at least one of the first and second shaping members includes an arc surface depressed downward and inward, wherein exhausting the gas in the accommodating space through the at least one opening to generate a pressure difference between an upper surface and a lower surface of the photosensitive chip to bend the photosensitive chip downward comprises:

19. The method of manufacturing a photosensitive assembly according to claim 17, wherein the opening is formed in the wiring board at a position corresponding to a central region of the photosensitive chip.

20. The method of manufacturing a photosensitive assembly according to claim 17, further comprising:

21. A method of manufacturing a photosensitive assembly, comprising:

22. The method of claim 21, wherein integrally molding a first shaping member and a second shaping member on the circuit board comprises:

applying adhesive on the first and second profile bodies, respectively.

23. The method of manufacturing a photosensitive assembly according to claim 21, wherein an upper surface of at least one of the first and second shaping members includes an arc surface depressed downward and inward, wherein exhausting the gas in the accommodating space through the at least one opening to generate a pressure difference between an upper surface and a lower surface of the photosensitive chip to bend the photosensitive chip downward comprises:

24. The method of manufacturing a photosensitive assembly according to claim 21, wherein said opening is formed in a position of said wiring board corresponding to a central region of said photosensitive chip.

25. The method of manufacturing a photosensitive assembly according to claim 21, further comprising: