CN112286002B - Optical device, exposure device, and article manufacturing method - Google Patents
Optical device, exposure device, and article manufacturing method Download PDFInfo
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- CN112286002B CN112286002B CN202010704311.1A CN202010704311A CN112286002B CN 112286002 B CN112286002 B CN 112286002B CN 202010704311 A CN202010704311 A CN 202010704311A CN 112286002 B CN112286002 B CN 112286002B
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- gas
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- blowing
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- 230000003287 optical effect Effects 0.000 title claims abstract description 219
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000007664 blowing Methods 0.000 claims abstract description 99
- 230000003749 cleanliness Effects 0.000 claims abstract description 55
- 239000007789 gas Substances 0.000 claims description 187
- 239000000758 substrate Substances 0.000 claims description 31
- 230000008859 change Effects 0.000 claims description 7
- 239000011261 inert gas Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 11
- 238000010586 diagram Methods 0.000 description 16
- 239000000356 contaminant Substances 0.000 description 14
- 239000000126 substance Substances 0.000 description 13
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 9
- 239000012535 impurity Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000000428 dust Substances 0.000 description 5
- 230000007613 environmental effect Effects 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- -1 ammonium ions Chemical class 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 150000002894 organic compounds Chemical group 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Plasma & Fusion (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention provides an optical device, an exposure device and a method for manufacturing an article. The optical device is characterized by comprising: a lens barrel formed with an opening through which light passes; an optical member having a surface with an area larger than that of the opening, the optical member being accommodated in the lens barrel so that the surface faces the opening; and a blowing portion configured to blow a gas having a higher cleanliness than a cleanliness of a gas outside the lens barrel with respect to the surface, around the opening.
Description
Technical Field
The invention relates to an optical device, an exposure device and a method for manufacturing an article.
Background
Since chemicals or other impurities adhering to the optical member affect the functions and performances of the device or equipment including the optical member, countermeasures for suppressing adhesion of the chemicals or impurities to the optical member are required. For example, in an exposure apparatus for transferring a pattern of an original plate to a substrate, an optical member such as a lens or a mirror is used in an illumination optical system for irradiating the original plate with light (exposure light) from a light source or in a projection optical system for accurately projecting the pattern of the original plate. In such an exposure apparatus, as the exposure light is shortened in wavelength, there is a problem in that dark rust is generated on an optical member through which the exposure light is transmitted or irradiated. The substance that causes the formation of dark rust in the optical member is an organic compound or ammonium sulfate (NH 4)2SO4. These are substances obtained by a photochemical reaction of ammonium ions (NH 4 +) and sulfuric acid ions (SO 4 2－) existing in the air or a compound or an organic gas thereof by irradiation of exposure light.
In order to solve such problems, an impurity removal filter is provided in an environmental chamber for controlling the temperature, humidity, and dust in the exposure apparatus, and substances such as alkaline gas, sulfuric acid gas, and organic compound gas present in the environment of the environmental chamber are removed. The components used in the environmental chamber are subjected to a treatment such as cleaning, and the lubricant and the like are also selected to have a small outgas amount.
In addition, japanese patent application laid-open No. 2001-028331 proposes the following technique: the optical components constituting the exposure device are housed in a lens barrel, the lens barrel is made into a closed space, and the inside of the lens barrel is cleaned by air having a higher cleanliness than the air in the environment chamber. Furthermore, japanese patent application laid-open No. 2006-245401 proposes the following technique: the air with high cleanliness is blown at a predetermined flow rate at which the surrounding contaminant is not involved against (the surface of) the optical member exposed to the environmental chamber and the space in the vicinity thereof, thereby preventing the attachment of the impurity to the optical member.
Disclosure of Invention
Problems to be solved by the invention
In japanese patent application laid-open No. 2006-245401, air with high cleanliness is blown to an optical member exposed in an environmental chamber and a space in the vicinity thereof, and disturbance of air flow is suppressed by a rectifying plate, thereby preventing adhesion of impurities to the optical member. The technique disclosed in japanese patent application laid-open No. 2006-245401 is effective for an apparatus for processing a substrate having a relatively small size, such as an exposure apparatus for a semiconductor.
However, since the size of the substrate to be processed is large, the exposure apparatus for a flat panel display such as an LCD or an OLED also has an increased space for an optical member for blowing air having high cleanliness and the vicinity thereof. Therefore, in the exposure apparatus for a flat panel display, in order to form the same airflow as that of the exposure apparatus for a semiconductor, a flow rate of about 100 times that required in the exposure apparatus for a semiconductor is required.
In order to achieve this, an air conditioning apparatus for supplying a large flow of air with high cleanliness is required, and thus, an increase in cost is caused, and a space for disposing a rectifying plate or a space for disposing an air outlet and a duct must be ensured in the apparatus. However, since the exposure apparatus for a flat panel display is provided with a plurality of optical members for correcting high definition and various optical performances, particularly, the interval between the stage (object surface or imaging surface) and the optical member nearest to the stage is narrowed. Therefore, it is difficult to secure a space for disposing the rectifying plate or a space for disposing the air outlet and the duct, and it is not realistic.
The invention provides an optical device which is beneficial to inhibiting the adhesion of pollutants to an optical component.
Means for solving the problems
An optical device according to an aspect of the present invention is characterized by comprising: a lens barrel formed with an opening through which light passes; an optical member having a surface with an area larger than that of the opening, the optical member being accommodated in the lens barrel so that the surface faces the opening; and a blowing portion configured to blow a gas having a higher cleanliness than a cleanliness of a gas outside the lens barrel with respect to the surface, around the opening.
As another aspect of the present invention, an optical device includes: a lens barrel formed with an opening through which light passes; an optical member having a surface with an area larger than that of the opening, the optical member being accommodated in the lens barrel so that the surface faces the opening; and a shielding portion provided in the lens barrel, wherein the shielding portion is provided so that a gas having a higher cleanliness than a gas outside the lens barrel flows to the opening through a space between the shielding portion and the optical member.
As still another aspect of the present invention, an exposure apparatus for exposing a substrate through a mask, the exposure apparatus comprising: a stage for holding and moving the mask; and a projection optical system for projecting the pattern of the mask onto the substrate, the projection optical system including: a lens barrel having an opening through which light emitted from the mask and incident on the projection optical system passes; an optical member having a surface with an area larger than that of the opening, the optical member being accommodated in the lens barrel so that the surface faces the opening; and a blowing portion configured to blow a gas having a higher cleanliness than a cleanliness of a gas outside the lens barrel with respect to the surface, around the opening.
As still another aspect of the present invention, an exposure apparatus for exposing a substrate through a mask, the exposure apparatus comprising: a stage for holding and moving the mask; and a projection optical system for projecting the pattern of the mask onto the substrate, the projection optical system including: a lens barrel having an opening through which light emitted from the mask and incident on the projection optical system passes; an optical member having a surface with an area larger than that of the opening, the optical member being accommodated in the lens barrel so that the surface faces the opening; and a shielding portion provided in the lens barrel, the shielding portion being provided so that a gas having a higher cleanliness than that of a gas outside the lens barrel flows to the opening through a space between the shielding portion and the optical member.
A method for manufacturing an article according to still another aspect of the present invention is characterized by comprising: exposing the substrate with the exposure apparatus; for the above-mentioned exposure a step of developing the substrate; and a step of manufacturing an article from the substrate subjected to development.
Other objects and other aspects of the invention will become apparent from the following description of the embodiments with reference to the accompanying drawings.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, for example, an optical device that is advantageous in suppressing adhesion of a contaminant to an optical member can be provided.
Drawings
Fig. 1 is a schematic diagram showing a configuration of an exposure apparatus as an aspect of the present invention.
Fig. 2A to 2C are diagrams for explaining the configuration of the exposure apparatus in embodiment 1.
Fig. 3 is a diagram for explaining the configuration of the exposure apparatus in embodiment 2.
Fig. 4A and 4B are diagrams for explaining the configuration of the exposure apparatus according to embodiment 3.
Fig. 5 is a diagram for explaining the configuration of the exposure apparatus in embodiment 4.
Fig. 6A and 6B are diagrams for explaining the configuration of the exposure apparatus in embodiment 5.
Fig. 7 is a diagram for explaining the configuration of an exposure apparatus in embodiment 6.
Fig. 8 is a diagram for explaining the configuration of the exposure apparatus in embodiment 7.
Detailed Description
Hereinafter, embodiments will be described in detail with reference to the drawings. The following embodiments do not limit the invention according to the claims. In the embodiments, a plurality of features are described, but not all of the plurality of features are defined as essential features of the invention, and a plurality of features may be arbitrarily combined. In the drawings, the same or similar components are denoted by the same reference numerals, and redundant description thereof is omitted.
Fig. 1 is a schematic diagram showing a configuration of an exposure apparatus 100 as an aspect of the present invention. The exposure apparatus 100 is a lithographic apparatus that exposes a substrate (glass plate) via a master (mask) and transfers a pattern of the master to the substrate. The exposure apparatus 100 is used for manufacturing flat panel displays, liquid crystal display elements, semiconductor elements, MEMS, and the like, and is particularly suitable as a flat panel display exposure apparatus.
The exposure apparatus 100 has an illumination optical system 101, a mask stage 103 that holds and moves a mask 102, a projection optical system 104, a substrate stage 106 that holds and moves a substrate 105, a lens barrel 107, and a chamber 110. The exposure apparatus 100 includes a1 st gas supply unit 111 for a chamber, a1 st gas discharge unit 112 for a chamber, a 2 nd gas supply unit 108 for a projection optical system, a 2 nd gas discharge unit 109 for a projection optical system, and a control unit 130.
The illumination optical system 101 illuminates the mask 102 with light (exposure light) 114 from a light source. The projection optical system 104 projects the pattern formed on the mask 102 onto the substrate 105. The projection optical system 104 includes a plurality of optical components such as lenses and mirrors necessary for accurately projecting the pattern of the mask 102 onto the substrate 105, and has a correction function using various optical performances of the optical components.
The chamber 110 accommodates each part of the exposure apparatus 100, and appropriately maintains an apparatus internal environment including cleanliness, temperature, humidity, and the like of gas (air) in the apparatus. The 1 st gas supply unit 111 supplies a gas having high cleanliness, such as clean dry air, from which chemical substances that cause formation of dark rust of the optical component are removed (filtered) by a chemical filter to the inside of the chamber 110. The gas supplied from the 1 st gas supply unit 111 into the chamber 110 is a gas whose temperature and humidity are adjusted to be appropriate for maintaining the optical performance of the exposure apparatus 100, and whose dust is removed by a dust removal filter. The 1 st gas discharge portion 112 discharges (discharges) the gas inside the chamber 110 including the gas supplied from the 1 st gas supply portion 111 to the outside of the chamber 110.
The 2 nd gas supply unit 108 and the 2 nd gas discharge unit 109 are provided in the projection optical system 104, and appropriately maintain the inside environment of the lens barrel including the cleanliness, temperature, humidity, and the like of the gas (air) inside the lens barrel 107. The 2 nd air supply unit 108 supplies a gas with high cleanliness, such as clean dry air, from which chemicals causing formation of dark rust of the optical component are removed (filtered) by a chemical filter to the inside of the lens barrel 107. The gas supplied from the 2 nd gas supply unit 108 into the barrel 107 is gas whose temperature and humidity are adjusted to be appropriate and whose dust is removed by the dust removal filter, similarly to the gas supplied from the 1 st gas supply unit 111 into the chamber 110. The 2 nd gas supply unit 108 may supply an inert gas having high purity such as nitrogen, helium, or argon to the inside of the lens barrel 107 instead of the gas from which the chemical substances have been removed by the chemical filter. The 2 nd gas discharge unit 109 discharges (discharges) the gas inside the lens barrel 107 including the gas supplied from the 2 nd gas supply unit 108 to the outside of the lens barrel 107.
Since a plurality of optical components constituting the projection optical system 104 are housed in the interior (projection optical system space) of the lens barrel 107, it is required to maintain a higher cleanliness than the interior of the chamber 110. Therefore, the 2 nd gas supply portion 108 supplies gas having a higher cleanliness than the cleanliness of the gas supplied from the 1 st gas supply portion 111 to the inside of the chamber 110 to the inside of the lens barrel 107. Further, the 2 nd gas supply unit 108 and the 2 nd gas discharge unit 109 supply gas to the inside of the lens barrel 107 and discharge gas from the inside of the lens barrel 107 so as to maintain the inside of the lens barrel 107 at positive pressure with respect to the inside of the chamber 110 under the control of the control unit 130. This can prevent (prevent) the gas inside the chamber 110, that is, the gas outside the barrel 107 from flowing into the barrel 107.
The control unit 130 is configured by an information processing device (computer) including a CPU, a memory, and the like, and controls each part of the exposure apparatus 100 according to a program stored in the storage unit. The control unit 130 controls, for example, a process (exposure) of exposing the substrate 105 through the mask 102 to transfer a pattern of the mask 102 to the substrate 105.
< Embodiment 1>
Fig. 2A, 2B, and 2C are diagrams for explaining the configuration of the exposure apparatus 100 according to embodiment 1. Fig. 2A shows the vicinity of the mask stage 103 and the projection optical system 104 shown in fig. 1 in an enlarged manner. As shown in fig. 2A, an opening 202 for allowing light (exposure light) 114 emitted from the mask 102 and incident on the projection optical system 104 to pass through is formed in the lens barrel 107, and an optical member 201 constituting the projection optical system 104 is provided in the vicinity of the opening 202. The optical member 201 includes a surface 201A having an area larger than that of the opening 202 (the outermost surface of the outermost optical members among the optical members constituting the projection optical system 104), and is accommodated in the lens barrel 107 so that the surface 201A faces the opening 202. The optical member 201 is aspherical glass in the present embodiment, but is not limited thereto, and may include various optical members.
Here, the gas 205 with lower cleanliness flows inside the chamber 110 (outside the barrel 107) than inside the barrel 107. The gas 205 with low cleanliness chemically reacts with the light 114, and flows into the barrel 107 through the opening 202, and by adhering to (the surface 201A of) the optical member 201, dark rust is generated on the optical member 201.
Then, in the present embodiment, by blowing the gas having high cleanliness to the surface 201A of the optical member 201, which is the surface 201A of the optical member 201 in detail, the gas 205 having low cleanliness inside the cavity 110 is suppressed (prevented) from contacting the optical member 201. This can prevent impurities generated by chemical reaction from adhering to the optical member 201, and can reduce the occurrence of dark rust on the optical member 201.
Specifically, in the present embodiment, as shown in fig. 2A, the lens barrel 107 is provided with a blowing portion 203 for blowing a gas 204 toward the surface 201A of the optical member 201. The blowing section 203 is held (fixed) by the lens barrel 107, and blows the highly clean gas 204 from which the chemical substances have been removed (filtered) by the chemical filter toward the surface 201A of the optical member 201. The gas 204 has a higher cleanliness than the cleanliness of the gas inside the chamber 110 and thus the interior of the barrel 107. The blowing unit 203 may blow inert gas having high purity such as nitrogen, helium, or argon as the gas 204 toward the surface 201A of the optical member 201. The gas 204 from the blowing portion 203 collides with the surface 201A of the optical member 201 as shown in fig. 2A. A part of the gas 204 that collides with the surface 201A of the optical member 201 flows along the surface 201A, and is discharged to the outside of the lens barrel 107 through the 2 nd gas discharge portion 109.
Thus, in the present embodiment, the surface 201A of the optical member 201 is covered (covered) by the gas 204 having high cleanliness by forming the flow (gas flow) of the gas 204 along the surface 201A of the optical member 201. Accordingly, the surface 201A of the optical member 201 can be suppressed from being exposed to the gas 205 having low cleanliness inside the cavity 110, and thus occurrence of dark rust in the optical member 201 can be reduced.
Fig. 2B shows a case where the lens barrel 107 and the blowing section 203 are viewed from above. The opening 202 formed in the lens barrel 107 has a U-shaped (arc-shaped or crescent-shaped) opening shape in the present embodiment. However, the shape of the opening 202 is not limited, and may be rectangular. In addition, the blowing portion 203 is disposed so as to surround the opening 202. This makes it possible to fill (blow) the entire surface 201A of the optical member 201 with the gas 204 having high cleanliness.
When the gas 204 is blown against the surface 201 of the optical member 201, as shown in fig. 2A, a vortex 206 (turbulence of the gas flow) is generated in the vicinity of the blowing portion 203 due to a velocity gradient or a viscous action against the surrounding gas. Generally, there is a tendency for the larger the velocity gradient to be, the larger the vortex 206. The vortex 206 has a property of entraining surrounding air (in this embodiment, the gas 205 inside the chamber 110). Therefore, when the vortex 206 approaches the inside of the chamber 110, the low-cleanliness gas 205 is caught by the vortex 206 through the opening 202, and the surface 201A of the optical member 201 is highly likely to be exposed to the gas 205.
In the present embodiment, as shown in fig. 2A, the blowing portion 203 is disposed apart from the end of the opening 202 in the direction along the surface 201A of the optical member 201, and a predetermined distance 207 is provided between the blowing portion 203 and the opening 202. By controlling the vortex 206 generated by blowing the gas 204 against the surface 201 of the optical member 201 within the range of the distance 207, entrainment of the gas 205 with low cleanliness can be suppressed.
The size of the vortex 206 varies depending on the flow rate and angle of the gas 204 blown out from the blowing portion 203, the distance from (the surface 201A of) the optical member 201 from the blowing portion 203, or the like. In addition, the allowable entrainment amount also varies depending on the concentration of the contaminant in the gas 205 in the chamber 110, and the like. Accordingly, the optimum value of the distance 207 between the blowing section 203 and the opening 202 varies according to various conditions.
For example, the flow rate of the gas 204 blown out from the blowing portion 203 with respect to the surface 201A of the optical member 201 is set to 1m/s, and the distance between the blowing portion 203 and the surface 201A in the direction orthogonal to the direction along the surface 201A of the optical member 201 is set to 10mm. In this case, by setting the distance 207 between the blowing portion 203 and the opening 202 to 15mm and controlling the vortex 206 to the range of the distance 207, entrainment of the gas 205 in the chamber 110 can be suppressed.
On the other hand, when the blowing portion 203 is provided at the end of the opening 202 (i.e., the distance 207 is zero), as shown in fig. 2C, a gas 205 having low cleanliness is caught in a vortex 206 generated by blowing the gas 204 against the surface 201A of the optical member 201. The gas 205 entrained by the vortex 206 flows along the surface 201A of the optical member 201 while being mixed with the gas 204 having high cleanliness blown out from the blowing portion 203. Therefore, the surface 201A of the optical member 201 is exposed to the gas 205 having low cleanliness, which becomes a cause of formation of dark rust of the optical member 201.
The optical device including the opening 202 (the lens barrel 107), the blowing portion 203, and the optical member 201 is not limited to the space between the mask stage 103 and the projection optical system 104 as shown in fig. 2A, but may be applied between a space with high cleanliness and a space with low cleanliness (a boundary). For example, an optical device including the opening 202, the blowing portion 203, and the optical member 201 may be provided between the projection optical system 104 and the substrate table 106. In this case, the opening 202 passes the light emitted from the projection optical system 104 and incident on the substrate 105. Further, an optical device including an opening 202, a blowing portion 203, and an optical member 201 may be provided between the illumination optical system 101 and the mask stage 103. In this case, the opening 202 passes light emitted from the illumination optical system 101 and incident on the mask 102.
< Embodiment 2>
Fig. 3 is a diagram for explaining the configuration of the exposure apparatus 100 according to embodiment 2. Fig. 3 shows the vicinity of the mask stage 103 and the projection optical system 104 shown in fig. 1 in an enlarged manner. In this embodiment, the possibility that the gas 205 having low cleanliness inside the chamber 110 contacts (the surface 201A of) the optical member 201 can be further reduced as compared with embodiment 1.
For example, if turbulence is generated in the gas 205 in the chamber 110 by the movement of the mask stage 103, the flow (gas flow) of the gas 204 having high cleanliness blown to the surface 201A of the optical member 201 is also disturbed due to the influence. Thereby, (the surface 201A of) the optical member 201 becomes highly likely to be exposed to the gas 205 having low cleanliness inside the chamber 110. In addition, when the concentration of the contaminant in the gas 205 in the chamber 110 is high, a large amount of the contaminant is contained in a small amount of the gas 205, and therefore, even if the optical member 201 is exposed to the same amount of the gas 205, the amount of the contaminant contacting the optical member 201 increases.
In the present embodiment, as shown in fig. 3, the surrounding member 301 is provided in the vicinity of the opening 202 formed in the lens barrel 107. In other words, the present embodiment is different from embodiment 1 in that the surrounding member 301 is provided. The surrounding member 301 extends from the opening 202 to the outside of the lens barrel 107, that is, from the end of the opening 202 to the outside of the lens barrel 107 on the opposite side of the optical member 201, and surrounds the opening 202. In this way, in the case where the suppression of the adhesion of the contaminant to the optical member 201 is insufficient in embodiment 1, the surrounding member 301 may be provided.
As described above, since the inside of the lens barrel 107 is maintained at a positive pressure with respect to the inside of the chamber 110, the space surrounded by the surrounding member 301 is filled with the gas 204 having high cleanliness and the gas supplied from the 2 nd gas supply unit 108 by providing the surrounding member 301. Therefore, the space surrounded by the surrounding member 301 functions as a buffer space inside the lens barrel 107 of high cleanliness and inside the cavity 110 of low cleanliness. Thus, when the gas 205 inside the chamber 110 is disturbed, the influence can be absorbed by the space surrounded by the surrounding member 301, and the influence of the contaminant on the surface 201A of the optical member 201 can be reduced. Even when the concentration of the contaminant in the gas 205 in the chamber 110 is high, the concentration of the contaminant can be gradually reduced as approaching the optical member 201 by providing the surrounding member 301 (the space surrounded by the surrounding member). Therefore, the amount of contaminant contacting the optical member 201 can be reduced.
< Embodiment 3>
In embodiment 1 and embodiment 2, when the amount of the gas 204 blown from the blowing portion 203 to (the surface 201A of) the optical member 201 is increased, the amount or flow rate of the gas 204 flowing along the surface 201A of the optical member 201 is increased. Therefore, the influence of disturbance or the like of the flow (gas flow) of the gas 205 inside the chamber 110 can be suppressed. However, since the vortex 206 generated in the vicinity of the blowing portion 203 becomes large, the amount of the gas 205 involved in the inside of the chamber 110 increases.
On the other hand, when the amount of the gas 204 blown from the blowing portion 203 to the optical member 201 is reduced, the vortex 206 generated in the vicinity of the blowing portion 203 becomes small, and thus the amount of the gas 205 involved in the inside of the chamber 110 is reduced. However, since the amount or flow rate of the gas 204 flowing along the surface 201A of the optical member 201 is reduced, the influence of disturbance or the like of the flow of the gas 205 inside the chamber 110 is easily received.
From such a phenomenon, it is considered that the optimum value of the amount of the gas 204 blown from the blowing portion 203 to the optical member 201 varies depending on the condition of the inside of the chamber 110, specifically, the flow rate of the gas 205 in the inside of the chamber 110 (outside of the lens barrel 107 on the opening). In the present embodiment, the control unit 130 controls the flow rate of the gas 204 blown by the blowing unit 203 onto the surface 201A of the optical member 201 based on the flow rate of the gas 205 inside the chamber 110 (outside the barrel 107). In other words, the control unit 130 changes the flow rate of the gas 204 blown by the blowing unit 203 onto the surface 201A of the optical member 201 according to the change in the flow rate (disturbance of the flow) of the gas 205 in the chamber 110. The present embodiment is different from embodiment 1 in that the flow rate of the gas 204 blown by the blowing portion 203 onto the surface 201A of the optical member 201 is changed.
For example, consider a case where disturbance of the flow of the gas 205 inside the chamber 110 has a small influence and the flow rate of the gas 205 is reduced. In this case, the flow rate of the gas 204 blown by the blowing portion 203 onto the surface 201A of the optical member 201 is an optimal value for suppressing entrainment due to the vortex 206. Therefore, the control unit 130 reduces or sets the flow rate of the gas 204 blown by the blowing unit 203 to the surface 201A of the optical member 201 to zero.
On the other hand, it is considered that the influence of turbulence of the flow of the gas 205 in the chamber 110 is large and the flow rate of the gas 205 increases. In this case, the flow rate of the gas 204 blown by the blowing portion 203 onto the surface 201A of the optical member 201 is set to a value that is optimal to allow entrainment by the vortex 206 and to reduce the amount of the contaminant in contact with the surface 201A of the optical member 201. Therefore, the control unit 130 increases the flow rate of the gas 204 blown by the blowing unit 203 toward the surface 201A of the optical member 201.
Here, when the cause of the disturbance in the flow of the gas 205 in the chamber 110 is the movement of the mask stage 103, the timing or amount of the disturbance in the flow of the gas 205 can be grasped. Therefore, by changing the flow rate of the gas 204 blown by the blowing portion 203 to the surface 201A of the optical member 201 according to the timing or the amount of occurrence of disturbance of the flow of the gas 205, the operation can be performed at an optimum flow rate for the condition of the gas 205 at all times.
Fig. 4A and 4B are diagrams for explaining the configuration of the exposure apparatus 100 according to embodiment 3. Fig. 4A shows a state in which the mask stage 103 is not moved. As shown in fig. 4A, since the mask stage 103 is not present in the vicinity of the opening 202 formed in the lens barrel 107, the flow of the gas 205 inside the chamber 110 is not disturbed. Therefore, the flow rate of the gas 204 blown by the blowing portion 203 toward the surface 201A of the optical member 201 is reduced.
Fig. 4B shows a state in which the mask stage 103 is moving. As shown in fig. 4B, when the mask stage 103 passes through the vicinity of the opening 202 formed in the lens barrel 107, turbulence occurs in the flow of the gas 205 inside the chamber 110. Therefore, the flow rate of the gas 204 blown by the blowing portion 203 onto the surface 201A of the optical member 201 is increased, and the amount of the contaminant contacting the surface 201A of the optical member 201 is reduced. On the other hand, by increasing the flow rate of the gas 204 blown by the blowing portion 203 onto the surface 201A of the optical member 201, the vortex 206 increases, and the entrainment amount of the gas 205 by the vortex 206 increases. However, since the amount of the contaminant in contact with the surface 201A of the optical member 201 is reduced, as a result (total), the cleanliness of the surface 201A of the optical member 201 is ensured in the state shown in fig. 4A in which the flow rate of the gas 204 is smaller than that of the gas 204.
As described above, in the present embodiment, the flow rate of the gas 204 blown by the blowing section 203 onto the surface 201A of the optical member 201 is controlled according to the movement of the mask stage 103, which is the cause of the disturbance (change in flow rate) of the flow of the gas 205 inside the chamber 110. Thus, the flow rate of the gas 204 blown from the blowing portion 203 to the surface 201A of the optical member 201 can be used at an optimal flow rate for suppressing the dark rust of the optical member 201.
< Embodiment 4>
Fig. 5 is a diagram for explaining the configuration of the exposure apparatus 100 according to embodiment 4. In the present embodiment, as shown in fig. 5, the optical member 201 is attached to the lens barrel 107 so as to form a closed space on the side opposite to the opening 202. The present embodiment is different from embodiment 1 in that the optical member 201 is attached to the lens barrel 107 and a closed space is formed inside the lens barrel 107.
The blowing section 203 is disposed so as to surround the opening 202 formed in the lens barrel 107, as in embodiment 1, and the gas 204 with high cleanliness blown from the blowing section 203 collides with the surface 201A of the optical member 201. All the gas 204 after colliding with the surface 201A of the optical member 201 flows along the surface 201A, and is discharged to the outside of the lens barrel 107 via the 2 nd gas discharge portion 109. The blowing unit 203 is disposed apart from the end of the opening 202, and a predetermined distance 207 is provided between the blowing unit 203 and the opening 202 in order to reduce entrainment of the gas 205 in the chamber 110 due to the vortex 206 generated in the vicinity of the blowing unit 203.
< Embodiment 5 >
In embodiment 3, the following example is explained: when the flow of the gas 205 inside the chamber 110 is disturbed to affect the surface 201A of the optical member 201, the entrainment of the gas 205 by the vortex 206 is allowed, and the flow rate of the gas 204 blown to the surface 201A is increased.
In the present embodiment, the flow rate of the gas 204 blown onto the surface 201A of the optical member 201 is increased, and the blowing portion 203 is moved in the direction along the surface 201A, thereby lengthening the distance 207 from the end of the opening 202 to the blowing portion 203. This can further suppress the entrainment of the gas 205 due to the vortex 206. The present embodiment is different from embodiment 1 in that the position of the blowing portion 203 in the direction along the surface 201A of the optical member 201 is changed.
Fig. 6A and 6B are diagrams for explaining the configuration of the exposure apparatus 100 according to embodiment 5. In the present embodiment, as shown in fig. 6A and 6B, the 1 st moving portion 140 is provided to move the blowing portion 203 in a direction along the surface 201A of the optical member 201. The 1 st moving part 140 includes, for example, an actuator, a linear motor, or the like, and moves the blowing part 203 in a direction along the surface 201A of the optical member 201 based on the flow rate of the gas 205 inside the chamber 110 (outside the lens barrel 107 on the opening). In other words, the 1 st moving part 140 moves the blowing part 203 in a direction along the surface 201A of the optical member 201 according to a change in the flow rate (disturbance of flow) of the gas 205 inside the chamber 110, so as to change the distance 207 between the end of the opening 202 and the blowing part 203.
Fig. 6A shows a state in which the mask stage 103 is not moved. As shown in fig. 6A, since the mask stage 103 is not present in the vicinity of the opening 202 formed in the lens barrel 107, the flow of the gas 205 inside the chamber 110 is not disturbed. Therefore, the flow rate of the gas 204 blown by the blowing portion 203 toward the surface 201A of the optical member 201 is reduced, and the blowing portion 203 is moved in the direction along the surface 201A of the optical member 201 so that the distance 207 between the end of the opening 202 and the blowing portion 203 becomes shorter.
Fig. 6B shows a state in which the mask stage 103 is moving. As shown in fig. 6B, when the mask stage 103 passes near the opening 202 formed in the lens barrel 107, turbulence occurs in the flow of the gas 205 inside the chamber 110. Accordingly, the flow rate of the gas 204 blown by the blowing portion 203 toward the surface 201A of the optical member 201 is increased, and the blowing portion 203 is moved in the direction along the surface 201A of the optical member 201 so that the distance 207 between the end of the opening 202 and the blowing portion 203 becomes longer. Thus, although the vortex 206 generated in the vicinity of the opening 202 increases, the distance 207 between the end of the opening 202 and the blowing portion 203 increases, and thus an increase in the entrainment amount of the gas 205 in the chamber 110 can be suppressed.
In the present embodiment, the case where the flow rate of the gas 204 blown onto the surface 201A of the optical member 201 is controlled and the distance 207 between the end of the opening 202 and the blowing portion 203 is controlled has been described, but the present invention is not limited thereto. For example, the flow rate of the gas 204 blown onto the surface 201A of the optical member 201 may be changed, but only the distance 207 between the end of the opening 202 and the blowing portion 203 may be changed (that is, the blowing portion 203 may be moved by the 1 st moving portion 140).
< Embodiment 6 >
Fig. 7 is a diagram for explaining the configuration of the exposure apparatus 100 according to embodiment 6. Fig. 7 shows the vicinity of the mask stage 103 and the projection optical system 104 shown in fig. 1 in an enlarged manner.
In the present embodiment, the optical member 201 is held (fixed) to the lens barrel 107 via the frame 701, the fixing member 702, and the structure 703. The frame 701, the fixing member 702, and the structure 703 constitute a holding member that holds the optical member 201. In the present embodiment, the blowing unit 203 is provided in the structure 703. Further, in the present embodiment, in order to correct (adjust) the optical performance of the projection optical system 104, a moving mechanism for moving the optical member 201 in a direction orthogonal to the direction along the surface 201A is provided. The moving mechanism is configured as the 2 nd moving part 150 that moves the holding member including the frame 701, the fixing member 702, and the structure 703 in a direction orthogonal to the direction along the surface 201A of the optical member 201. According to such a configuration, even if the optical member 201 is moved in the direction perpendicular to the direction along the surface 201A, the distance between the surface 201A and the blowing portion 203 can be kept constant. Thus, even when the optical member 201 is moved in the direction perpendicular to the direction along the surface 201A, the gas 205 having low cleanliness involved in the interior of the chamber 110 can be suppressed.
In the present embodiment, the 2 nd moving unit 150 has a structure in which the optical member 201 and the blowing unit 203 are moved simultaneously, but may be a structure in which the optical member 201 and the blowing unit 203 are moved separately. In this case, the mechanism for moving the blowing unit 203 moves the blowing unit 203 so that the distance between the surface 201A and the blowing unit 203 becomes constant in accordance with the movement of the optical member 201 in the direction orthogonal to the direction along the surface 201A.
< Embodiment 7 >
Fig. 8 is a diagram for explaining the configuration of the exposure apparatus 100 according to embodiment 7. Fig. 8 shows the vicinity of the mask stage 103 and the projection optical system 104 shown in fig. 1 in an enlarged manner.
In the present embodiment, as the gas (204) having high cleanliness, the gas 804 inside the lens barrel 107 is used. In addition, as the blowing portion (203), an orifice portion 802 (space) is provided (formed) between the optical member 201 and the shielding portion 801. The shielding portion 801 is a shielding object provided in the lens barrel 107.
In such a configuration, by maintaining the inside of the lens barrel 107 at a positive pressure, the gas 804 inside the lens barrel 107 flows along the surface 201A of the optical member 201 through the aperture 802, and flows toward the opening 202. In other words, the gas 804 inside the lens barrel 107 is blown from the orifice portion 802 toward the surface 201A of the optical member. The present embodiment is different from embodiment 1 in that a gas 804 inside the lens barrel 107 is used as a gas having high cleanliness, and an orifice portion 802 is used as a blowing portion.
Here, a relationship among the optical member 201, the opening 202, and the shielding portion 801 will be described. For example, the interval between (the surface 201A of) the optical member 201 and the shielding portion 801 is X, and the interval between (the surface 201A of) the optical member 201 and the opening 202 is Y. In this case, the relationship among the optical member 201, the opening 202, and the shielding portion 801 is set to satisfy the condition of 1/100< x/Y < 1/5.
Thus, in the gas 804 flowing to the opening 202 through the orifice portion 802 between the shielding portion 801 and the optical member 201, a flow rate sufficient to maintain the cleanliness of the surface 201A of the optical member 201 can be obtained. On the other hand, when the above condition is released, the flow rate of the gas 804 flowing through the aperture 802 between the shielding portion 801 and the optical member 201 and toward the opening 202 may be reduced, and there is a possibility that the surface 201A of the optical member 201 may be insufficiently cleaned.
As described above, in the present embodiment, the gas 205 having low cleanliness can be suppressed from being involved in the chamber 110 without requiring a dedicated pipe or equipment for blowing the gas 204 having high cleanliness, and the cleanliness of the surface 201A of the optical member 201 can be maintained. However, in the present embodiment, the gas 804 inside the lens barrel 107 is required to have high cleanliness.
< Embodiment 8 >
The method for manufacturing an article according to the embodiment of the present invention is suitable for manufacturing an article such as a flat panel display, a liquid crystal display element, a semiconductor element, or a MEMS, for example. The manufacturing method includes a step of exposing a substrate coated with a photosensitive agent by the exposure apparatus 100 and a step of developing the photosensitive agent subjected to exposure. Further, the pattern of the developed photosensitive agent is used as a mask, and a circuit pattern is formed on the substrate by performing an etching process, an ion implantation process, or the like on the substrate. These steps of exposure, development, etching, and the like are repeated to form a circuit pattern composed of a plurality of layers on a substrate. In the subsequent steps, the substrate on which the circuit pattern is formed is subjected to dicing (processing), chip mounting, soldering, and inspection steps. The production method may include other known steps (oxidation, film formation, vapor deposition, doping, planarization, photoresist stripping, and the like). The method for manufacturing an article according to the present embodiment is advantageous in at least one of performance, quality, productivity, and production cost of the article as compared with the conventional method.
The present invention is not limited to the above-described embodiments, and various changes and modifications may be made without departing from the spirit and scope of the invention. Accordingly, the appended claims are intended to disclose the scope of the invention.
Claims (18)
1. An optical device, characterized in that, the optical device comprises:
A lens barrel formed with an opening through which light passes;
an optical member having a surface with an area larger than that of the opening, the optical member being accommodated in the lens barrel so that the surface faces the opening; and
A blowing part which is arranged to surround the opening and is separated from the end of the opening in the direction along the surface, and blows a gas with a higher cleanliness than the gas outside the lens barrel to the surface,
The inside of the barrel is positive pressure relative to the outside of the barrel.
2. The optical device of claim 1, wherein,
The optical device further includes a surrounding member that extends from an end of the opening to an outside of the lens barrel on an opposite side of the optical member, and surrounds the opening.
3. The optical device of claim 1, wherein,
The optical device further includes a control unit that controls a flow rate of the gas blown by the blowing unit onto the surface based on a flow rate of the gas outside the barrel at the opening.
4. An optical device as claimed in claim 3, wherein,
The control unit changes the flow rate of the gas blown by the blowing unit onto the surface in response to the change in the flow rate of the gas outside the barrel at the opening.
5. The optical device of claim 4, wherein,
The control part is used for controlling the control part,
When the flow rate of the gas outside the barrel on the opening is increased, the flow rate of the gas blown by the blowing part to the surface is increased,
When the flow rate of the gas outside the barrel on the opening is reduced, the flow rate of the gas blown by the blowing portion toward the surface is reduced.
6. The optical device of claim 1, wherein,
The optical device further includes a1 st moving portion for moving the blowing portion in a direction along the surface.
7. The optical device of claim 6, wherein,
The 1 st moving unit moves the blowing unit in a direction along the surface based on a flow rate of the gas outside the barrel at the opening.
8. The optical device of claim 7, wherein,
The 1 st moving part moves the blowing part in a direction along the surface according to a change in a flow rate of the gas outside the barrel on the opening so as to change a distance between an end of the opening and the blowing part.
9. The optical device of claim 8, wherein,
The 1 st moving part is provided with a first moving part,
When the flow rate of the gas outside the lens barrel on the opening is increased, the blowing part is moved in the direction along the surface so that the distance between the end of the opening and the blowing part is increased,
When the flow rate of the gas outside the barrel on the opening is reduced, the blowing portion is moved in the direction along the surface so that the distance between the end of the opening and the blowing portion becomes shorter.
10. The optical device of claim 1, wherein,
The optical device further includes a 2 nd moving portion for moving the blowing portion in a direction perpendicular to a direction along the surface.
11. The optical device of claim 10, wherein,
The 2 nd moving unit moves the blowing unit in a direction perpendicular to the direction along the surface so that a distance between the surface and the blowing unit becomes constant, in response to movement of the optical member in the direction perpendicular to the direction along the surface.
12. The optical device of claim 1, wherein,
The opening has a U-shaped opening shape.
13. The optical device of claim 1, wherein,
The gas blown onto the surface by the blowing portion includes at least one of air filtered by a filter and an inert gas.
14. The optical device of claim 1, wherein,
The blowing portion is held by the lens barrel.
15. The optical device of claim 1, wherein,
The optical device further comprises a holding member provided on the lens barrel and holding the optical member,
The blowing portion is held by the holding member.
16. The optical device of claim 1, wherein,
The blowing part blows a gas having a higher cleanliness than that of the gas outside the lens barrel.
17. An exposure apparatus for exposing a substrate through a mask, characterized in that,
The exposure device comprises:
a stage for holding and moving the mask; and
A projection optical system for projecting the pattern of the mask onto the substrate,
The projection optical system includes:
A lens barrel having an opening through which light emitted from the projection optical system and incident on the substrate passes;
an optical member having a surface with an area larger than that of the opening, the optical member being accommodated in the lens barrel so that the surface faces the opening; and
A blowing part which is arranged to be separated from the opening along the direction of the surface and to blow gas with higher cleanliness than the cleanliness of the gas outside the lens barrel to the surface,
The inside of the barrel is positive pressure relative to the outside of the barrel.
18. A method of manufacturing an article, comprising:
a step of exposing a substrate using the exposure apparatus according to claim 17;
for the above-mentioned exposure a step of developing the substrate; and
And a step of manufacturing an article from the developed substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410773083.1A CN118550164A (en) | 2019-07-25 | 2020-07-21 | Optical device, exposure device, and article manufacturing method |
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| JP2019-137081 | 2019-07-25 | ||
| JP2019137081 | 2019-07-25 | ||
| JP2020-070010 | 2020-04-08 | ||
| JP2020070010A JP7425661B2 (en) | 2019-07-25 | 2020-04-08 | Optical device, exposure device, and article manufacturing method |
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| CN112286002B true CN112286002B (en) | 2024-08-13 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1440512A (en) * | 2000-03-31 | 2003-09-03 | 株式会社尼康 | Method and device for holding optical member, optical device, exposure apparatus and device manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| IL136037A0 (en) * | 1997-11-12 | 2001-05-20 | Nikon Corp | Exposure apparatus, apparatus for manufacturing devices, and method of manufacturing exposure apparatuses |
| JP2001358056A (en) * | 2000-06-15 | 2001-12-26 | Canon Inc | Exposure apparatus |
| US9632433B2 (en) * | 2012-10-31 | 2017-04-25 | Asml Holding N.V. | Patterning device support, lithographic apparatus, and method of controlling patterning device temperature |
| JP6660179B2 (en) * | 2015-12-28 | 2020-03-11 | キヤノン株式会社 | Exposure apparatus and article manufacturing method |
| JP6742870B2 (en) * | 2016-09-16 | 2020-08-19 | キヤノン株式会社 | Exposure apparatus and article manufacturing method |
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2020
- 2020-07-14 KR KR1020200086534A patent/KR20210012917A/en not_active Application Discontinuation
- 2020-07-21 CN CN202010704311.1A patent/CN112286002B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1440512A (en) * | 2000-03-31 | 2003-09-03 | 株式会社尼康 | Method and device for holding optical member, optical device, exposure apparatus and device manufacturing method |
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| CN118550164A (en) | 2024-08-27 |
| KR20210012917A (en) | 2021-02-03 |
| CN112286002A (en) | 2021-01-29 |
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