CN112258493B - Method, system, equipment and medium for quickly identifying and positioning two-dimensional material on substrate - Google Patents
Method, system, equipment and medium for quickly identifying and positioning two-dimensional material on substrate Download PDFInfo
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Abstract
The invention provides a method, a system, equipment and a medium for quickly identifying and positioning two-dimensional materials on a substrate, wherein the method comprises the following steps: collecting a microscopic image of a two-dimensional material on a substrate; processing the microscopic image and acquiring a corresponding binary image; the method comprises the steps of obtaining the area of each white continuous region in a binary image, screening and extracting the white continuous regions which accord with a preset area threshold value to serve as identification regions; acquiring a brightness distribution statistical chart of each identification area, and extracting a plurality of sub-areas with uniformly distributed brightness in a centralized manner from the brightness distribution statistical chart; calculating a contrast between the average brightness of the sub-region and the average brightness of a background region of the microscope image; and when the contrast is within a preset contrast range, determining the sub-area as a required two-dimensional material area, and performing corresponding output display. The invention adopts computer vision to identify and position the two-dimensional material on the substrate, has high speed and high accuracy and saves a great deal of manpower and time.
Description
Technical Field
The invention relates to the technical field of nanotechnology, in particular to the technical field of material identification, and specifically relates to a method, a system, equipment and a medium for quickly identifying and positioning a two-dimensional material on a substrate.
Background
The preparation method of the conventional thin-layer two-dimensional material sample comprises the steps of firstly cleaving a raw material crystal on a silicon dioxide substrate by using a mechanical stripping method, and then manually searching the thin-layer two-dimensional material under an optical microscope. Due to different absorption or reflection of light by materials with different thicknesses, different colors and contrasts can be presented under an optical microscope, so that the thicknesses of the materials can be distinguished, and the required materials can be searched. However, the existing search is completed by a manual observation microscope, which wastes time and labor, has low efficiency, and cannot quickly search to obtain the required sample.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, it is an object of the present invention to provide a method, system, device and medium for quickly identifying and positioning a two-dimensional material on a substrate, which are used to solve the problems of time and labor waste and easy identification errors caused by manual identification of the two-dimensional material on the substrate in the prior art.
To achieve the above and other related objects, the present invention provides a method for rapidly identifying a two-dimensional material on a positioning substrate, comprising: acquiring a microscopic image of a two-dimensional material on a substrate; processing the microscopic image to obtain a corresponding binary image; acquiring the area of each white continuous region in the binary image, screening and extracting the white continuous regions which accord with a preset area threshold value to serve as identification regions; acquiring a brightness distribution statistical chart of each identification area, and extracting a plurality of brightness sub-areas from the brightness distribution statistical chart; calculating a contrast between the average brightness of the brightness sub-region and the average brightness of a background region of the microscope image; and when the contrast is within a preset contrast range, determining the sub-area as a required two-dimensional material area, and performing corresponding output display.
In an embodiment of the invention, the processing the microscopic image includes: acquiring an image of the substrate when the substrate does not contain the two-dimensional material, and taking the image as a background image; and dividing the acquired microscopic image with the background image to form a microscopic image with uniform background.
In an embodiment of the present invention, one way of obtaining the corresponding binarized image includes: converting the microscope image with uniform background into a gray image; drawing a statistical distribution graph of brightness on the gray level image based on the gray level image; determining a binarization processing threshold value based on the statistical distribution graph of the brightness; and processing the gray level image based on the binarization processing threshold value to obtain a corresponding binarization image.
In an embodiment of the present invention, before obtaining the areas of the white continuous regions in the binarized image, the method for rapidly identifying and positioning the two-dimensional material on the substrate further includes: and carrying out noise reduction processing on the acquired binary image.
In an embodiment of the present invention, an implementation manner of extracting a plurality of luminance sub-regions from the luminance distribution statistical diagram includes: obtaining each pattern peak in the brightness distribution statistical chart; determining an extraction threshold value based on the peak bottom value of each graph peak; extracting a plurality of brightness sub-regions in the brightness distribution statistical chart based on the determined extraction threshold.
In an embodiment of the invention, before acquiring the microscopic image of the two-dimensional material on the substrate, the method further comprises: and configuring the background brightness and the preset contrast of the microscopic image.
In an embodiment of the invention, before acquiring the microscopic image of the two-dimensional material on the substrate, the method further comprises: the microscopic magnification of the microscope is adjusted based on the two-dimensional material on the substrate.
To achieve the above object, the present invention also provides an electronic device including a memory for storing a computer program; a processor for running the computer program to implement the method for rapidly identifying a two-dimensional material on a positioning substrate as described above; and the display is used for outputting the processing result of the processor.
To achieve the above object, the present invention further provides a storage medium storing program instructions which, when executed, implement the method for rapidly identifying a two-dimensional material on a positioning substrate as described above.
To achieve the above object, the present invention further provides a system for rapidly identifying and positioning a two-dimensional material on a substrate, comprising: a carrier for carrying a substrate or a substrate comprising a two-dimensional material; a microscope for microscopic magnification of the substrate or a substrate comprising a two-dimensional material; the moving platform is used for fixing the bearing device and controlling the bearing device to move below the microscope; the image shooting device is arranged above the microscope and is used for shooting a corresponding microscopic image of the microscope when the bearing device moves once to generate a microscopic image; the electronic device as described above acquires the microscopic image from the image pickup apparatus and processes the microscopic image based on the method of rapidly identifying and positioning the two-dimensional material on the substrate as described above.
As described above, the method, system, device and medium for rapidly identifying and positioning two-dimensional material on a substrate according to the present invention have the following advantages:
1. the invention adopts computer vision to identify and position the two-dimensional material on the substrate, has high speed and high accuracy, can quickly obtain a large number of thin-layer two-dimensional material samples, and saves a large amount of manpower and time.
2. The invention can search different materials on different substrates by simply adjusting related parameters, and has wide application and strong applicability.
Drawings
FIG. 1 is a schematic overall flow chart illustrating a method for rapidly identifying two-dimensional materials on a positioning substrate according to the present invention;
FIG. 2 is a schematic flow chart illustrating one implementation of obtaining a binarized image in a method for rapidly identifying two-dimensional material on a positioning substrate according to the present invention;
FIG. 3 is a statistical graph of the brightness distribution of a background uniform gray scale image in the method for rapidly identifying and locating a two-dimensional material on a substrate according to the present invention;
FIG. 4 is a schematic diagram of a binarized image before noise reduction in the method for rapidly identifying and positioning two-dimensional material on a substrate according to the present invention;
FIG. 5 is a schematic diagram showing a denoised binary image in the method for rapidly identifying and positioning two-dimensional materials on a substrate according to the present invention;
FIG. 6 is a schematic flow chart illustrating one implementation of extracting a plurality of luminance sub-regions from a luminance distribution histogram in the method for rapidly identifying and locating two-dimensional materials on a substrate according to the present invention;
FIG. 7 is a schematic diagram illustrating an output manner of the two-dimensional material on the substrate for fast recognition and positioning according to the present invention;
FIG. 8 is a schematic structural diagram of an electronic device according to an embodiment of the invention;
FIG. 9 is a schematic block diagram of a system for rapidly identifying two-dimensional material located on a substrate in accordance with the present invention;
FIG. 10 shows the result of the identification and positioning of the thin graphene layer on the silicon dioxide substrate in the method for rapidly identifying and positioning the two-dimensional material on the substrate according to the present invention;
fig. 11 shows the result of identifying and positioning a thin layer of tungsten disulfide on a silicon dioxide substrate in the method for rapidly identifying and positioning a two-dimensional material on a substrate according to the present invention.
Description of the element reference
100. System for rapidly identifying and positioning two-dimensional material on substrate
110. Bearing device
120. Microscope
130. Image pickup apparatus
140. Mobile platform
150. Electronic device
151. Processor with a memory for storing a plurality of data
152. Memory device
153. Display device
S100 to S600
S210 to S240
S410 to S430
Detailed Description
Other advantages and capabilities of the present invention will be readily apparent to those skilled in the art from the description given herein, wherein embodiments of the present invention are illustrated by specific examples. The invention is capable of other and different embodiments, and its several details are capable of modifications and various changes without departing from the spirit of the invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present invention, and therefore, the drawings only show the components related to the present invention rather than the number, shape and size of the components in actual implementation, the type, quantity and proportion of the components in actual implementation can be changed freely, and the layout of the components can be more complicated.
The embodiment aims to provide a method, a system, equipment and a medium for quickly identifying and positioning a two-dimensional material on a substrate, which are used for solving the problems that in the prior art, the identification of the two-dimensional material on the substrate is time-consuming and labor-consuming due to manual work, and identification errors are easy to occur.
The method, the system, the equipment and the medium for quickly identifying and positioning the two-dimensional material on the substrate are used for automatically searching the thin-layer two-dimensional material on the silicon dioxide substrate, are generally suitable for materials with obvious brightness difference between a sample and the substrate under an optical microscope, and a user can self-define the contrast range of the material and the size of the required sample according to actual requirements to search the corresponding thin-layer two-dimensional material. The method and the system for rapidly identifying and positioning the two-dimensional material on the substrate in the embodiment are simple and convenient to use, rapid in operation, capable of identifying and searching one silicon wafer per minute, capable of saving a large amount of manpower and time, good in expansibility of a search control program, and applicable to automatic identification and positioning of various materials on different substrates.
The principles and embodiments of the method, system, apparatus and medium for fast identifying and locating two-dimensional materials on a substrate according to the present embodiment will be described in detail below, so that those skilled in the art can understand the method, system, apparatus and medium for fast identifying and locating two-dimensional materials on a substrate without creative efforts.
Example 1
As shown in fig. 1, the present embodiment provides a method for quickly identifying and positioning a two-dimensional material on a substrate, which is applied to an electronic device, and the method for quickly identifying and positioning a two-dimensional material on a substrate includes the following steps:
step S100: collecting a microscopic image of a two-dimensional material on a substrate;
step S200: processing the microscopic image and acquiring a corresponding binary image;
step S300: acquiring the area of each white continuous region in the binary image, screening and extracting the white continuous regions which accord with a preset area threshold value to serve as identification regions;
step S400: acquiring a brightness distribution statistical chart of each identification area, and extracting a plurality of brightness sub-areas from the brightness distribution statistical chart;
step S500: calculating a contrast between the average brightness of the brightness sub-region and the average brightness of a background region of the microscope image;
step S600: and when the contrast is within a preset contrast range, determining the sub-area as a required two-dimensional material area, and performing corresponding output display.
The following describes steps S100 to S600 of the method for quickly identifying and positioning a two-dimensional material on a substrate according to this embodiment in detail.
Step S100: microscopic images of two-dimensional material on a substrate are acquired.
In this embodiment, the type of the substrate is not limited, and the substrate is a silicon substrate such as a silicon dioxide layer. The two-dimensional material refers to a material in which electrons can move freely (planar motion) only on a two-dimensional nanoscale (1-100 nm), and includes but is not limited to graphene (graphene), boron Nitride (BN), molybdenum disulfide (MoS 2), tungsten disulfide (WS 2), and Mxene materials.
In this embodiment, before acquiring the microscopic image of the two-dimensional material on the substrate, the method further comprises: the microscope's microscopic magnification is adjusted based on the two-dimensional material on the substrate.
This is due to the fact that some two-dimensional materials, such as thin layers of molybdenum disulfide, are relatively small (about 20 microns) and require a high power objective to be seen, and the two-dimensional material is clearly visible in the microscopic image.
In this embodiment, before acquiring the microscopic image of the two-dimensional material on the substrate, the method further includes: and configuring the background brightness and the preset contrast of the microscopic image.
For example, the brightness of the background of the microscope image is adjusted to about 120 (brightness range 0-255) by adjusting parameters such as the brightness of the microscope light source and the exposure time of the camera.
Different preset contrasts are configured according to different two-dimensional materials on the substrate, for example, the two-dimensional material is graphene (graphene), the range of the preset contrast is set to be 0.02-0.20 (one-four layers), for example, the two-dimensional material is tungsten disulfide (TMD, transition metal dichalcogenide), and the range of the preset contrast is set to be 0.08-0.45.
Therefore, the embodiment can search different two-dimensional materials on different substrates by simply adjusting the relevant parameters corresponding to the required two-dimensional materials, and has wide application and strong applicability.
Step S200: and processing the microscopic image to obtain a corresponding binary image.
In this embodiment, the processing the microscopic image includes:
acquiring an image of the substrate when the substrate does not contain the two-dimensional material, and taking the image as a background image; and dividing the acquired microscopic image with the background image to form a microscopic image with uniform background.
That is, before the microscopic image is subjected to the recognition process, it is necessary to take a clean substrate image without a sample (two-dimensional material) as a background at the same objective magnification for eliminating the background unevenness caused by the light source distribution unevenness or the like. And dividing each shot image by the background picture to obtain an image with uniform background.
As shown in fig. 2, in particular, in the present embodiment, one way of acquiring the corresponding binarized image includes:
step S210, converting the microscope image with uniform background into a gray image;
step S220, drawing a statistical distribution graph of brightness on the gray level image based on the gray level image;
step S230, determining a binarization processing threshold value based on the statistical distribution diagram of the brightness;
the method for determining the binarization processing threshold value comprises the following steps: and acquiring a background peak formed by the background brightness in the statistical distribution diagram of the brightness, and taking the brightness at the start of the peak bottom slightly smaller than the background peak as a binarization processing threshold, wherein the difference between the binarization processing threshold and the brightness at the start of the peak bottom of the background peak is preferably 2 or 3, because the background brightness value of the microscopic image has a certain fluctuation error, and the half-peak width of the background peak is about 4.
And step S240, processing the gray level image based on the binarization processing threshold value to obtain a corresponding binarization image.
That is, in this embodiment, the microscope image with uniform background is converted from a color image to a gray image, a statistical distribution graph of the brightness on the gray image is drawn, and when the background is uniform, the brightness value of the background should be the same or very close to each other, so in the statistical distribution graph of the brightness, the background brightness has a high background peak, the broadening of the background peak reflects the background uniformity and the noise level, and the smaller the broadening, the more uniform the background is, the smaller the noise is, and the better the image recognition effect is. Since the sample will absorb a portion of the light intensity, the intensity of the sample in the gray scale is lower than the background, and therefore a threshold (threshold) is set slightly below the intensity of the background, as shown in fig. 3. And carrying out binarization processing on the gray level image according to the threshold, setting the part with the brightness higher than the threshold as pure black, and setting the part with the brightness lower than the threshold as pure white to form a binarization image of the microscopic image.
Step S300: and obtaining the area of each white continuous region in the binary image, and screening and extracting the white continuous regions which accord with a preset area threshold value to be used as identification regions.
In this embodiment, before obtaining the areas of the white continuous regions in the binarized image, the method for rapidly identifying and positioning the two-dimensional material on the substrate further includes: and carrying out noise reduction processing on the acquired binary image.
As shown in fig. 4, the white area portion of the binarized image contains the two-dimensional material (sample) and other interferents (such as noise or residual glue) with brightness lower than the background, and in order to identify the two-dimensional material (sample) more accurately, it is necessary to perform noise reduction on the binarized image.
Since random noise and colloidal particles mostly appear as discontinuous dots, interference is eliminated by evaluating the continuity of the white area in the present embodiment. And performing opening operation and closing operation on the binarized image to eliminate most discontinuous granular noises, wherein the image subjected to noise reduction processing on the binarized image is shown in fig. 5, and as can be seen from fig. 5, the granular noises in fig. 4 are well eliminated.
In this embodiment, the outline of the white continuous region is drawn, the area of each white continuous region is calculated, then the shape with an excessively small area is screened out by setting a threshold value according to the requirement, and the remaining white continuous regions meeting the preset area threshold value are used as the identification regions. In this embodiment, a mask plate is adopted to separately extract an identification area from a binarized image, that is, a white continuous area in each contour left after screening is extracted.
Since the distribution of the sample in a single pattern is not uniform and may contain a plurality of layers of samples, a further subdivision process is required. And (3) independently drawing a brightness distribution statistical graph of the graph in the profile, setting threshold values on two sides of the peak bottom of each graph peak, and extracting a plurality of small areas (sub-areas) with uniformly distributed brightness in a concentrated manner.
Step S400: and acquiring a brightness distribution statistical chart of each identification area, and extracting a plurality of brightness sub-areas from the brightness distribution statistical chart.
In this embodiment, as shown in fig. 6, one implementation manner of extracting a plurality of luminance sub-regions from the luminance distribution statistical diagram includes:
step S410: obtaining each pattern peak in the brightness distribution statistical chart;
step S420: determining an extraction threshold value based on the peak bottom value of each graph peak;
step S430: extracting a plurality of luminance sub-regions in the luminance distribution statistical map based on the determined extraction threshold.
Step S500: calculating a contrast between the average brightness of the brightness sub-region and the average brightness of the background region of the microscopy image.
Step S600: and when the contrast is within a preset contrast range, determining the sub-area as a required two-dimensional material area, and performing corresponding output display.
That is, in this embodiment, the contrast between the average brightness in the sub-area and the average brightness in the adjacent background area is calculated, and if the value is within the required range, the two-dimensional material required for identification and positioning is determined, and it is prompted to find the target two-dimensional material (sample) and output the position of the sample, and one output mode of the identification and positioning result is shown in fig. 7.
Therefore, the method for quickly identifying and positioning the two-dimensional material on the substrate can identify and position the two-dimensional material, is high in speed and accuracy, can quickly obtain a large number of thin-layer two-dimensional material samples, saves a large amount of labor and time, and greatly improves the working efficiency of a laboratory.
Example 2
As shown in fig. 8, the present embodiment further provides an electronic device 150, where the electronic device 150 includes a processor 151, a memory 152, and a display 153.
The memory 152 for storing a computer program; a processor 151 for executing the computer program to implement the method for rapidly identifying a two-dimensional material on a positioning substrate as described in embodiment 1; the display 153 is used for outputting the processing result of the processor. Embodiment 1 has already described the method for rapidly identifying and positioning two-dimensional material on a substrate in detail, and will not be described herein again.
The electronic device 150 is a server, a desktop computer, a notebook computer, a tablet computer, a smart phone, a smart television, a personal digital assistant, or the like.
The memory 152 is connected to the processor 151 via a system bus and is configured to communicate with the processor 151, the memory 152 is configured to store a computer program, and the processor 151 is configured to execute the computer program, so that the electronic device 150 performs the method for rapidly identifying a two-dimensional material on a substrate. The method for quickly identifying and positioning a two-dimensional material on a substrate has been described in detail above, and will not be described herein again.
It should be noted that the above-mentioned system bus may be a Peripheral Component Interconnect (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, or the like. The system bus may be divided into an address bus, a data bus, a control bus, and the like. For ease of illustration, only one thick line is shown, but this does not mean that there is only one bus or one type of bus. The communication interface is used for realizing communication between the database access device and other equipment (such as a client, a read-write library and a read-only library). The Memory 152 may include a Random Access Memory (RAM) and may further include a non-volatile Memory (non-volatile Memory), such as at least one disk Memory.
The Processor 151 may be a general-purpose Processor, and includes a Central Processing Unit (CPU), a Network Processor (NP), and the like; the Integrated Circuit may also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, a discrete Gate or transistor logic device, or a discrete hardware component.
In this embodiment, the display 153 may be an OLED, LED, LCD display, or the like.
Example 3
The present embodiment also provides a storage medium storing all program instructions, which when executed by a processor, implement the method for rapidly identifying and locating a two-dimensional material on a substrate in embodiment 1. Embodiment 1 has already described the method for rapidly identifying and positioning two-dimensional material on a substrate in detail, and is not repeated herein.
Those of ordinary skill in the art will understand that: all or part of the steps for implementing the above method embodiments may be performed by hardware associated with a computer program. The aforementioned computer program may be stored in a computer-readable storage medium. When executed, the program performs steps comprising the method embodiments described above; and the aforementioned storage medium includes: various media that can store program codes, such as ROM, RAM, magnetic or optical disks.
Example 4
As shown in fig. 9, the present embodiment provides a system 100 for rapidly identifying and locating a two-dimensional material on a substrate, the system 100 comprising: a carrying device 110, a microscope 120, a mobile platform 140, an image capturing device 130, and an electronic apparatus 150 as described in embodiment 2.
In the present embodiment, the carrier 110 is also referred to as a sample box; the carrier 110 is used for carrying a substrate or a substrate comprising a two-dimensional material.
In this embodiment, the microscope 120 is used to microscopically magnify the substrate or a substrate comprising a two-dimensional material; the microscope 120 is configured with a microscope 120 light source, and the brightness value of the background of the microscopic image is adjusted by adjusting the brightness of the light source.
In this embodiment, the movable platform 140 is used for fixing the carrying device 110 and controlling the carrying device 110 to move under the microscope 120. The moving platform 140 includes a three-axis electric displacement table for fixing the bearing device 110 and driving the bearing device 110 to move, and a displacement table controller for controlling the three-axis electric displacement table to operate.
In this embodiment, the image capturing device 130 is disposed above the microscope 120, and is configured to capture a corresponding microscopic image of the microscope 120 when the carrying device 110 moves once, so as to generate a microscopic image. The image capturing device 130 is a camera, and the type of the camera is not limited, for example, a single lens reflex camera.
In this embodiment, the electronic device 150 is configured to obtain the microscopic image from the image capturing apparatus 130, and process the microscopic image based on the method for rapidly identifying and positioning two-dimensional material on a substrate as described in embodiment 1.
The operation of the system 100 for rapidly identifying and positioning two-dimensional materials on a substrate in this embodiment is as follows:
the silicon dioxide substrate is cut into a square shape of about 1cm × 1cm, and placed in the carrier device 110 (sample box), the carrier device 110 (sample box) is fixed on the movable platform 140, the movable platform 140 places the carrier device 110 (sample box) under the objective lens of the microscope 120, and the image pickup device 130 (single lens reflex) is connected above the lens barrel of the microscope 120 for outputting a microscopic image. In the system 100 for rapidly recognizing and positioning a two-dimensional material on a substrate, the moving platform 140 controls the carrier device 110 (sample box) to move, each moving step, the image capturing device 130 (single lens reflex) captures an image and transmits the image to the electronic device 150 in real time, and the computer vision recognition program (a method for rapidly recognizing and positioning a two-dimensional material on a substrate running in the processor 151) recognizes and positions the two-dimensional material in each picture and stores the pictures meeting the search condition in a "result" folder.
1. The following describes the identification and positioning process of the system 100 for rapidly identifying and positioning two-dimensional materials on a substrate according to this embodiment, taking graphene on a 285nm silicon dioxide substrate as an example.
1) A graphene sample is prepared on a silicon wafer substrate with a silicon dioxide layer with the thickness of 285 nanometers on the surface by a mechanical stripping method.
2) The light source brightness and the camera exposure time of the microscope 120 are adjusted to make the brightness value of the background about 120 (brightness value range 0-255).
3) A clean silicon wafer substrate was placed under the microscope 120 and a background picture was taken using a 5 x objective lens.
4) The substrate was placed in the sample box and the sample box was placed on an XYZ tri-axial motorized translation stage.
5) The control program in the electronic device 150 is opened, the type of the search target sample is set to graphene, and the contrast range is set to 0.02 to 0.20 (one to four layers).
6) The sample was initially scanned and identified and the time required to search and identify graphene was approximately 1 minute under a 5 x objective lens through a 1cm x 1cm square silicon plate. Fig. 10 shows the search results.
The following describes the identification and positioning process of the system 100 for rapidly identifying and positioning two-dimensional materials on a substrate according to this embodiment, taking tungsten disulfide on a 90nm silica substrate as an example.
1) A tungsten disulfide sample was prepared by mechanical lift-off on a silicon substrate having a 90nm silicon dioxide layer on the surface.
2) The light source brightness and camera exposure time of the microscope 120 are adjusted to provide a background brightness value of about 120 (brightness value range 0-255).
3) A clean silicon wafer substrate was placed under a microscope 120, the objective lens of 5 times that was used to take a photograph of graphene on a 285nm silicon dioxide substrate was changed to an objective lens of 20 times, and a background picture was taken using the objective lens of 20 times. This is due to the relatively small (about 20 microns) layer of molybdenum disulfide material, which requires a higher power objective to be visible.
4) The substrate was placed in the sample box and the sample box was placed on an XYZ tri-axial motorized translation stage.
3) The control program is opened, the type of the search target sample is set to TMD (transition metal dichalcogenide), and the contrast range is set to 0.08-0.45.
4) Scanning of the sample and identification positioning was started with a TMD material identification rate of 20 times under mirror of about 7 minutes per substrate. Fig. 11 shows the search results.
In conclusion, the invention adopts computer vision to identify and position the two-dimensional material on the substrate, has high speed and high accuracy, can quickly obtain a large number of thin-layer two-dimensional material samples, and saves a large amount of manpower and time; the invention can search different materials on different substrates by simply adjusting related parameters, and has wide application and strong applicability. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (9)
1. A method for rapidly identifying and positioning two-dimensional materials on a substrate is characterized by comprising the following steps: the method comprises the following steps:
acquiring a microscopic image of a two-dimensional material on a substrate;
processing the microscopic image and acquiring a corresponding binary image;
acquiring the area of each white continuous region in the binary image, screening and extracting the white continuous regions which accord with a preset area threshold value to serve as identification regions;
acquiring a brightness distribution statistical chart of each identification area, and extracting a plurality of brightness sub-areas from the brightness distribution statistical chart;
calculating a contrast between the average brightness of the brightness sub-region and the average brightness of a background region of the microscope image;
when the contrast is within a preset contrast range, determining the sub-area as a required two-dimensional material area, and performing corresponding output display;
one implementation manner of extracting a plurality of luminance sub-regions from the luminance distribution statistical diagram includes:
obtaining each pattern peak in the brightness distribution statistical chart;
determining an extraction threshold value based on the peak bottom value of each graph peak;
extracting a plurality of luminance sub-regions in the luminance distribution statistical map based on the determined extraction threshold.
2. The method for rapidly identifying and positioning two-dimensional materials on a substrate as claimed in claim 1, wherein: the processing the microscopic image comprises:
acquiring an image of the substrate when the substrate does not contain the two-dimensional material, and taking the image as a background image;
and dividing the acquired microscopic image with the background image to form a microscopic image with uniform background.
3. The method for rapidly identifying and positioning two-dimensional materials on a substrate as claimed in claim 2, wherein: one way to obtain the corresponding binarized image includes:
converting the microscope image with uniform background into a gray image;
drawing a statistical distribution graph of brightness on the gray level image based on the gray level image;
determining a binarization processing threshold value based on the statistical distribution diagram of the brightness;
and processing the gray level image based on the binarization processing threshold value to obtain a corresponding binarization image.
4. The method of claim 3, wherein the step of rapidly identifying and locating two-dimensional material on a substrate comprises: before acquiring the area of each white continuous area in the binarized image, the method for rapidly identifying and positioning the two-dimensional material on the substrate further comprises the following steps: and carrying out noise reduction processing on the acquired binary image.
5. The method for rapidly identifying and locating two-dimensional materials on a substrate as recited in claim 1, wherein: prior to acquiring a microscopic image of a two-dimensional material on a substrate, the method further comprises:
and configuring the background brightness and the preset contrast of the microscopic image.
6. The method for rapidly identifying and locating two-dimensional materials on a substrate as recited in claim 1, wherein: prior to acquiring a microscopic image of a two-dimensional material on a substrate, the method further comprises: the microscopic magnification of the microscope is adjusted based on the two-dimensional material on the substrate.
7. An electronic device, characterized in that: comprising a memory for storing a computer program; a processor for running the computer program to implement the method of rapidly identifying a two-dimensional material on a positional substrate as claimed in any one of claims 1 to 6; and the display is used for outputting the processing result of the processor.
8. A storage medium storing program instructions, characterized in that: the program instructions when executed implement a method of rapidly identifying a two-dimensional material on a positional substrate as claimed in any one of claims 1 to 6.
9. A system for rapidly identifying and locating two-dimensional materials on a substrate, comprising: the method comprises the following steps:
a carrier for carrying a substrate or a substrate comprising a two-dimensional material;
a microscope for microscopic magnification of the substrate or a substrate comprising a two-dimensional material;
the moving platform is used for fixing the bearing device and controlling the bearing device to move below the microscope;
the image shooting device is arranged above the microscope and used for shooting a corresponding microscopic image of the microscope when the bearing device moves once to generate a microscopic image;
the electronic device of claim 7, wherein the microscopic image is acquired from the image capturing device and processed based on the method for rapidly identifying and positioning two-dimensional material on a substrate as claimed in any one of claims 1 to 6.
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