CN112214804A - Micro-system chip for preventing vacuum packaging cap opening cracking - Google Patents
Micro-system chip for preventing vacuum packaging cap opening cracking Download PDFInfo
- Publication number
- CN112214804A CN112214804A CN202011109006.4A CN202011109006A CN112214804A CN 112214804 A CN112214804 A CN 112214804A CN 202011109006 A CN202011109006 A CN 202011109006A CN 112214804 A CN112214804 A CN 112214804A
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- Prior art keywords
- vacuum packaging
- solar cell
- chip
- preventing
- super capacitor
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
- G06F21/78—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure storage of data
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/34—Parallel operation in networks using both storage and other dc sources, e.g. providing buffering
- H02J7/345—Parallel operation in networks using both storage and other dc sources, e.g. providing buffering using capacitors as storage or buffering devices
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/34—Parallel operation in networks using both storage and other dc sources, e.g. providing buffering
- H02J7/35—Parallel operation in networks using both storage and other dc sources, e.g. providing buffering with light sensitive cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/56—Power conversion systems, e.g. maximum power point trackers
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Security & Cryptography (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Software Systems (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention relates to a micro-system chip for preventing cracking of a vacuum packaging cap, belonging to the technical field of micro-system design. Aiming at the problem that the inner core data of the vacuum packaging micro-system chip is cracked by opening the cover, the invention realizes the cracking detection of the vacuum packaging device by utilizing the photoinduction principle and the instantaneous output high-voltage characteristic of the solar cell with high efficiency and small volume, and simultaneously realizes the high-voltage destruction of the core data such as Flash and the like, thereby ensuring the core data security of the micro-system chip. The invention can realize the rapid detection of whether the vacuum packaging is uncapped; the voltage and the current which can destroy the core storage data can be efficiently and automatically generated; the circuit and the device are adopted as few as possible, and related products are all designed in a miniaturized mode; the method is suitable for the design of multi-chip integrated package and the design of a single chip, and has wide applicability.
Description
Technical Field
The invention belongs to the technical field of micro-system design, and particularly relates to a micro-system chip for preventing cracking of a vacuum packaging cap.
Background
The export of weapons such as missiles from foreign trade is an important growth point for the development of the military industry in China. But with the increase of products purchased in China in foreign countries, the protection of knowledge products of core technology is increasingly prominent. The board-level design of the traditional system architecture memory and processor classification inevitably exposes the core program memory to the other side, the design is easy to crack along with the improvement of stealing capacity, and although partial problems can be solved by adopting the SoC design, the problems can not be completely solved because the memory chip process is incompatible with the CPU process. Therefore, the problems can be better solved by adopting the SiP packaging integration technology, but for the vacuum-packaged microsystem chip product, if the microsystem chip product is cracked by violence cap opening, the internal core program or the data memory can be read, and the data information and the key technology of the core can be cracked. Therefore, the development of a microsystem design technology capable of aiming at core data protection of a vacuum packaging microsystem product is urgently needed, and the urgent need of export trade of missiles and other weapons for knowledge product protection of the core technology is solved.
Disclosure of Invention
Technical problem to be solved
The technical problem to be solved by the invention is as follows: how to solve the problem that the vacuum packaging micro-system chip is uncapped to crack internal core data.
(II) technical scheme
In order to solve the technical problem, the invention provides a micro-system chip for preventing the cracking of a vacuum packaging cap, which comprises a solar battery, a super capacitor, a power management circuit and a data memory, wherein the solar battery is connected with the super capacitor;
the solar cell is used as a detection element for detecting whether the vacuum packaging is disassembled;
the super capacitor is used for collecting energy input by the solar battery;
after the vacuum packaging is finished, the interior of the solar cell is in a completely lightless environment, and at the moment, the internally integrated high-efficiency solar cell does not output voltage and current; once the vacuum package is damaged, the internal solar cell can generate instant voltage and current output by external sunlight or a light source in a visible light spectrum range generated by other light sources, the energy output by the solar cell is stored in the super capacitor through the power management circuit, whether the energy of the super capacitor meets the requirement of destroying the data storage is detected, and when the stored energy meets the requirement of the data storage, the data of the data storage is destroyed.
Preferably, the solar cell, the power management circuit and the super capacitor are integrated in a tiled mode.
Preferably, the solar cell, the power management circuit and the super capacitor are designed in a stacking mode according to the internal structure characteristics of the micro system chip.
Preferably, the solar cell surface is free of stacked devices.
Preferably, after the vacuum packaging is completed, the connection of the external destruction circuit and the data storage is realized by using an external concealed connection.
Preferably, the solar cell is a miniaturized solar cell, the size is 1cm multiplied by 1cm at the minimum, and the maximum voltage is 25V.
Preferably, the size of the super capacitor is 1cm x 1cm at minimum, and the input power is 25V at minimum.
Preferably, the data storage is Flash.
The invention also provides a design method of the microsystem chip.
The invention also provides an application of the microsystem chip in the technical field of microsystem design.
(III) advantageous effects
Aiming at the problem that the inner core data of the vacuum packaging micro-system chip is cracked by opening the cover, the invention realizes the cracking detection of the vacuum packaging device by utilizing the photoinduction principle and the instantaneous output high-voltage characteristic of the solar cell with high efficiency and small volume, and simultaneously realizes the high-voltage destruction of the core data such as Flash and the like, thereby ensuring the core data security of the micro-system chip. The invention comprises the following steps: 1. whether the vacuum packaging is uncapped can be quickly detected; 2. the voltage and the current which can destroy the core storage data can be efficiently and automatically generated; 3. the scheme adopts as few circuits and devices as possible, and related products all adopt miniaturized design; 4. the design of this scheme of utilization is suitable for the design of multicore piece integrated package also is applicable to the design of single-chip, has wider suitability.
Drawings
FIG. 1 is a block diagram of the system architecture of the present invention;
fig. 2 is a schematic diagram of a package integration scheme of the present invention.
Detailed Description
In order to make the objects, contents, and advantages of the present invention clearer, the following detailed description of the embodiments of the present invention will be made in conjunction with the accompanying drawings and examples.
Aiming at the problem that the inner core data of the vacuum packaging micro-system chip is cracked by uncapping, the invention ensures the core data safety of the micro-system chip by quickly detecting whether the packaging is uncapped and quickly destroying the key data and programs in the inner core memory.
The invention mainly aims at the problem of safety protection of core data in a chip or a multi-chip integrated chip packaged in vacuum.
The scheme utilizes the high-efficiency solar cell as a detection element for detecting whether the vacuum packaging is disassembled or not. After the vacuum packaging is finished, the interior of the solar cell is in a completely lightless environment, and at the moment, the internally integrated high-efficiency solar cell does not output voltage and current; once the vacuum package is broken, the external sunlight or light source in the visible light spectrum generated by other light sources can enable the internal solar cell to generate instant voltage and current output, so that the vacuum package can be efficiently detected whether the vacuum package is complete or not.
The super capacitor is used for collecting energy input by the solar battery, and when the obtained energy can meet the requirement of destroying the core data memory, the core data is destroyed by starting a high-voltage and high-current destroying digestion process.
The solar cell management circuit has the functions of maximum power tracking, boosting management, charging management and the like of the solar cell, and has the characteristics of miniaturization and stacking integration.
The solar cell, the battery management circuit and the super capacitor can be integrated by adopting a tiled scheme, and can also be designed by stacking according to the internal structure characteristics of the micro-system chip.
According to the scheme, after vacuum packaging and sealing are completed, connection between the destruction circuit and the core data memory is achieved through external hidden connection.
The scheme forms a detection circuit which can utilize the high-performance solar cell as the vacuum package to be disassembled or not by integrating the solar cell, the power management circuit and the three components of the super capacitor in the vacuum package. After the vacuum packaging is finished, the interior of the solar cell is in a completely lightless environment, and at the moment, the internally integrated high-efficiency solar cell does not output voltage and current; once the vacuum package is damaged, the internal solar cell can generate instant voltage and current output by external sunlight or a light source in a visible light spectrum range generated by other light sources, the energy output by the solar cell is stored in the super capacitor through the power management circuit, and when the stored energy meets the requirement of the data storage device, the data of the data storage device is destroyed.
The specific working mode is as follows:
1. the miniaturized solar cell is internally integrated, the minimum size is 1cm multiplied by 1cm, and the maximum output voltage is 25V.
2. The power management circuit stores the energy output by the solar battery into the super capacitor, detects whether the energy of the super capacitor meets the requirement of destroying the program memory, and is mainly realized by comparing the output voltage of the super capacitor.
The 3 super capacitor adopts a miniaturized design, the minimum size is 1cm multiplied by 1cm, and the minimum input power supply is 25V.
The package integration with the overall design can adopt the scheme shown in fig. 2, namely three devices and other devices are tiled in the package, or the design of stacking can be carried out according to the system design, but the devices cannot be stacked on the surface of the solar cell.
5 the connection of the destruction circuit to the memory power supply is carried out outside the package and the soldering is carried out after the package cover is completed, this point being as concealed as possible and provided with some external protection.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A micro system chip for preventing cracking of a vacuum packaging uncapping is characterized by comprising a solar battery, a super capacitor, a power management circuit and a data memory;
the solar cell is used as a detection element for detecting whether the vacuum packaging is disassembled;
the super capacitor is used for collecting energy input by the solar battery;
after the vacuum packaging is finished, the interior of the solar cell is in a completely lightless environment, and at the moment, the internally integrated high-efficiency solar cell does not output voltage and current; once the vacuum package is damaged, the internal solar cell can generate instant voltage and current output by external sunlight or a light source in a visible light spectrum range generated by other light sources, the energy output by the solar cell is stored in the super capacitor through the power management circuit, whether the energy of the super capacitor meets the requirement of destroying the data storage is detected, and when the stored energy meets the requirement of the data storage, the data of the data storage is destroyed.
2. The microsystem chip for preventing vacuum packaging cap opening as claimed in claim 1, wherein the solar cell, the power management circuit and the super capacitor are integrated in a tiled manner.
3. The microsystem chip for preventing the cracking of the vacuum package cap opening as claimed in claim 1, wherein the solar cell, the power management circuit and the super capacitor are designed to be stacked according to the internal structure characteristics of the microsystem chip.
4. The microsystem chip for preventing vacuum packaging cap opening as claimed in claim 3, wherein the solar cell surface is free of stacked devices.
5. The microsystem chip for preventing decapping of vacuum packages as claimed in claim 1, wherein the connection of the external destruction circuit to the data storage is achieved by an external concealed connection after the vacuum package is completed.
6. The microsystem chip for preventing vacuum packaging cap opening as claimed in claim 1, wherein the solar cell is a miniaturized solar cell having a minimum size of 1cm x 1cm and a maximum output voltage of 25V.
7. The microsystem chip for preventing vacuum packaging cap opening as claimed in claim 1, wherein the size of the super capacitor is 1cm x 1cm at minimum, and the input power is 25V at minimum.
8. The microsystem chip for preventing vacuum packaging cap opening as claimed in claim 1, wherein the data storage is Flash.
9. A design method of the microsystem chip for preventing the cracking of the vacuum packaging cap opening as claimed in any one of claims 1 to 8.
10. Use of the microsystem chip for preventing the cracking of the vacuum packaging cap as claimed in any one of claims 1 to 8 in the technical field of microsystem design.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011109006.4A CN112214804A (en) | 2020-10-16 | 2020-10-16 | Micro-system chip for preventing vacuum packaging cap opening cracking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011109006.4A CN112214804A (en) | 2020-10-16 | 2020-10-16 | Micro-system chip for preventing vacuum packaging cap opening cracking |
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| Publication Number | Publication Date |
|---|---|
| CN112214804A true CN112214804A (en) | 2021-01-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011109006.4A Pending CN112214804A (en) | 2020-10-16 | 2020-10-16 | Micro-system chip for preventing vacuum packaging cap opening cracking |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101699461A (en) * | 2009-10-30 | 2010-04-28 | 曙光信息产业(北京)有限公司 | Protective device of data inside chips |
| CN102107206A (en) * | 2010-12-20 | 2011-06-29 | 朱海生 | Destruction equipment for hard disk, compact disk and semiconductor memory bank |
| CN103839014A (en) * | 2014-03-19 | 2014-06-04 | 深圳市亿道信息技术有限公司 | Self-destruction circuit of tablet personal computer storage device |
| US9189656B1 (en) * | 2014-11-25 | 2015-11-17 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | IC chip package disabling device |
| WO2017138773A1 (en) * | 2016-02-12 | 2017-08-17 | 한양대학교 산학협력단 | Security semiconductor chip and method for operating same |
| CN108766937A (en) * | 2018-07-23 | 2018-11-06 | 李扬渊 | A kind of chip data self-destruction encapsulating structure |
-
2020
- 2020-10-16 CN CN202011109006.4A patent/CN112214804A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101699461A (en) * | 2009-10-30 | 2010-04-28 | 曙光信息产业(北京)有限公司 | Protective device of data inside chips |
| CN102107206A (en) * | 2010-12-20 | 2011-06-29 | 朱海生 | Destruction equipment for hard disk, compact disk and semiconductor memory bank |
| CN103839014A (en) * | 2014-03-19 | 2014-06-04 | 深圳市亿道信息技术有限公司 | Self-destruction circuit of tablet personal computer storage device |
| US9189656B1 (en) * | 2014-11-25 | 2015-11-17 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | IC chip package disabling device |
| WO2017138773A1 (en) * | 2016-02-12 | 2017-08-17 | 한양대학교 산학협력단 | Security semiconductor chip and method for operating same |
| CN108766937A (en) * | 2018-07-23 | 2018-11-06 | 李扬渊 | A kind of chip data self-destruction encapsulating structure |
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Application publication date: 20210112 |
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