CN112133245A - Drive chip full-embedded LED display screen based on thin film circuit - Google Patents
Drive chip full-embedded LED display screen based on thin film circuit Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
A drive chip full-embedded LED display screen based on a thin film circuit comprises a substrate, a display device and a drive device, wherein the display device and the drive device are arranged on the substrate; the display device comprises a plurality of LED pixels, each pixel area is provided with at least one LED pixel, each LED pixel comprises at least one LED device, and a gap is formed between every two adjacent LED pixels; in each pixel region, at least one gap is set as the chip region; the driving device at least comprises a plurality of inner driving chips, and each inner driving chip is completely arranged in a corresponding chip area. The invention can improve the display resolution and the display effect by increasing the number of the LED devices.
Description
Technical Field
The invention relates to an LED display screen, in particular to a drive chip full-embedded LED display screen based on a thin film circuit.
Background
With the development of display technology, display screens with various novel structures such as ultrathin screens, transparent screens, bent screens, flexible screens and the like appear at present.
The LED display screen directly takes the array LED device as a display screen of display pixels, and has the advantages of high brightness, long service life and the like. However, the substrate of the LED display screen is generally a printed circuit board, which generally welds a large number of LED devices on the printed circuit board, and the printed circuit board is generally an opaque hard board body, which limits the structure of the LED display screen, so that the LED display screen is difficult to be made into a display screen with various novel structures, such as an ultra-thin screen, a transparent screen, a curved screen, and a flexible screen.
In order to solve the above problems, a LED display screen based on a thin film circuit is proposed, in which a substrate of the LED display screen is generally a glass substrate (or a plastic film using the glass substrate as a mother substrate), and a driving circuit of the LED display screen is generally a thin film circuit disposed on the glass substrate, and the LED display screen can be easily manufactured into a display screen with various novel structures, such as an ultra-thin screen, a transparent screen, a bending screen, and a flexible screen, under the condition of utilizing various manufacturing processes of a flat display screen (such as LCD and OLED). However, it is difficult for the thin film circuit fabricated on the glass substrate to form conductive holes penetrating through the glass substrate, as in the case of the printed circuit board, and the LED devices and the driving chips are disposed in parallel on the same surface of the glass substrate, generally, the driving chips are disposed in the peripheral region outside the display region of the LED display screen, and then signals of the driving chips are output to the LED devices within the display region through a large number of leads connected between the display region and the peripheral region.
Disclosure of Invention
The invention aims to solve the technical problem of providing a driving chip full-embedded LED display screen based on a thin film circuit, and the driving chip full-embedded LED display screen can improve the display resolution and the display effect by increasing the number of LED devices. The technical scheme is as follows:
the utility model provides a drive chip full-embedded LED display screen based on thin film circuit, includes the base plate to and display device and the drive device of setting on the base plate, the base plate has the first surface, is equipped with the thin film circuit who constitutes by graphical film on the first surface, and the first surface divide into the display area and is in the peripheral region of display area periphery, its characterized in that: the display area is divided into a plurality of driving subareas, and each driving subarea is provided with a pixel area and a chip area; the display device comprises a plurality of LED pixels, each pixel area is provided with at least one LED pixel, each LED pixel comprises at least one LED device, and a gap is formed between every two adjacent LED pixels; in each pixel region, at least one gap is set as the chip region; the driving device at least comprises a plurality of inner driving chips, and each inner driving chip is completely arranged in a corresponding chip area.
The internal driving chip is completely arranged in the corresponding chip area, namely: the main body and each pin of the inner driving chip are arranged in the corresponding chip area. Preferably, the internal driving chip is a bare chip IC. The bare chip IC can be manufactured by a nanoscale chip manufacturing process, has a small area, and is more suitable for being arranged in a narrow gap between adjacent LED pixels.
The fully-embedded LED display screen with the driving chips has the advantages that the internal driving chips for driving the LED devices are dispersedly arranged in the driving subareas, so that the functions of the internal driving chips can be simplified, the area of the internal driving chips can be reduced, the internal driving chips are integrally and respectively arranged in the corresponding chip areas, the number of the driving subareas is basically not limited because each driving subarea is driven by the independent internal driving chip, and the number of the LED devices can be increased to improve the display resolution and the display effect; and because the internal driving chip is simplified and miniaturized and is arranged in the driving subarea, a large area of driving chip is not required to be arranged in a larger peripheral area, and more driving subareas can be arranged on the basis of unchanging the area of the display screen to improve the display resolution and the display area. In addition, seams among the driving subareas can be set to be small, the display area and the resolution ratio of the LED display can be made to be very large through splicing of the LED display screens, and the problem that the resolution ratio and the display area of the LED display are difficult to improve is solved.
In a preferred embodiment, the internal driving chip is a static driving chip.
In another preferred scheme, the internal driving chip is a dynamic driving chip.
In a more preferable scheme, the driving device further includes a plurality of peripheral driving chips, each peripheral driving chip is a dynamic driving chip, and each peripheral driving chip is disposed in the peripheral region. The peripheral driving chip is used as an upper-level chip of the internal driving chip and is used for distributing display signals to each internal driving chip; or, the peripheral driving chip and the inner driving chip cooperate with each other to perform display driving.
In a further preferred embodiment, the inner driving chip is a column driving chip constituting a dynamic driving function, and the peripheral driving chip is a row driving chip constituting the dynamic driving function. The row driving chip is generally a multi-channel scan switch chip. From the peripheral region to each of the driving sections, the thin film circuit includes a row driving line connected from the row driving chip to one end (e.g., a positive electrode) of each of the LED devices of each of the driving sections, and an external input line connected to each of the column driving chips (in a serial connection); and within each drive partition, the thin film circuit includes a column drive line from each column drive chip to the other end of its respective LED device. The driving signal of each LED device is input to the column driving chip through the serial signal line, the column driving chip converts the driving signal into a driving signal and outputs the driving signal to a plurality of column driving lines through the transverse jumper, and the driving signal is output to one welding pin (such as an anode pin) of each LED device through the column driving line. The row driver chip is connected to another leg (e.g., a negative pin) of each LED device through a plurality of row driver lines, thereby forming a dynamic drive circuit network connection of the column driver chip and the row driver chip to each LED device. The driving partitions in the same row share the same serial signal line, the same row driving line and the same row driving chip.
More preferably, the internal driving chip is provided with a storage unit. The storage unit is used for storing the brightness (or voltage, current) data of the LED devices driven by the internal driving chip so as to store the display state of each LED device within the required display time (such as a refresh period or a frame).
In a preferred embodiment, the substrate is a 0.2 mm-2.0 mm thick transparent glass substrate.
In another preferred embodiment, the substrate is a 5 μm-200 μm thick plastic film. More preferably, the substrate is a polyimide film. More preferably, the substrate is a colorless polyimide film.
The LED device can be an LED chip, and also can be an LED lamp bead packaged or integrated with the LED chip. Typically, each LED pixel comprises the same number of LED devices, for example: when the LED display screen is a monochrome display screen, each LED pixel includes one LED chip, and when the LED display screen is a color display screen, each LED pixel may include three LED chips (light emission colors are red, green, and blue, respectively), or one LED bead packaged with three color LED chips. In a preferred embodiment, the pixel region is provided with a plurality of LED pixels forming a uniform array, and each LED pixel is composed of three LED devices of three emission colors, namely red, green, and blue.
Generally, the LED display screen further includes a peripheral circuit and an external circuit, wherein the peripheral circuit is disposed at the periphery of the display screen, and is generally formed by extending the thin film circuit, and is used for disposing an external interface of the LED display screen; in addition, the external circuit is an external circuit component connected to the first surface, such as a flexible circuit board (FPC), which may be used for circuit connection between different driving sections in addition to external connection for the LED display screen.
Generally, the thin film circuit is provided with a plurality of first mounting positions for mounting the respective LED devices, a plurality of second mounting positions for mounting the respective internal driving chips, and a connection circuit for electrically connecting the respective first mounting positions and the respective second mounting positions. The second mounting positions are used as mounting positions of the pin parts of the inner driving chips and are respectively positioned in gaps between corresponding adjacent LED pixels, and each LED device and each driving chip can be respectively mounted on the corresponding first mounting position or the corresponding second mounting position in a welding mode, an anisotropic conductive adhesive connection mode or a conductive paste (such as carbon paste and silver paste) bonding mode.
In a preferred embodiment, the thin film circuit is composed of at least two patterned conductive film layers, and an insulating film layer is disposed between each two adjacent patterned conductive film layers. The patterned conductive film layer is a metal film (such as copper alloy and Mo-Al-Mo alloy) deposited by magnetron sputtering, and a high-precision film pattern is formed by photoetching. The insulating film layer may be a patterned photosensitive resin coating layer, which is made of a photosensitive resin by extrusion coating (slit-coating), and is formed into a high-precision pattern by exposure and development. Generally, the insulating film layer is provided with a through hole for realizing the conduction of two adjacent patterned conductive film layers, so that flexible circuit routing can be realized in a drive partition with a limited area. The series signal line, the row driving line, the column driving line, the transverse jumper line and other lines are all formed by thin film circuits.
In a preferred embodiment, the gap between adjacent LED pixels at the edge of two adjacent driving sub-regions is the same as the gap distance between adjacent LED pixels in the same driving sub-region. Therefore, the LED pixels in the whole display area of the LED display screen can be ensured to be uniformly arranged.
The individual LED pixels of the pixel region may form a uniform array (typically, a matrix) or may form a non-uniform array. The gap of some adjacent LED pixels may be set larger for the pixel region where the respective LED pixels constitute the uneven array, to set a larger driving chip in the gap.
When the gap of some adjacent LED pixels is wider than the gaps of other adjacent LED pixels, in order to make the light-emitting position of each LED pixel finally corrected to an even array, in the preferred scheme, the drive chip full-embedded LED display screen still is equipped with the leaded light layer, and the leaded light layer sets up on the first surface, the leaded light layer includes a plurality of light guides, and a light guide corresponds one the LED pixel, every light guide have the receiving terminal that is used for receiving light respectively and the end that sends that is used for sending light, and the receiving terminal of each light guide sets up respectively on corresponding LED pixel, and the end that sends of each light guide constitutes an even light emitting array. More preferably, the light guide is an optical fiber corresponding to an LED pixel. Thus, the light emitted from each LED pixel can be guided to the emission end of the light guide with low loss.
The light guide layer can be manufactured by the following steps: providing a first mold which comprises a positive mold of an optical fiber forming the light guide layer; injecting a first material into the first mold, and removing the first material from the mold after solidification to form a second mold with a plurality of optical fiber reverse modes, wherein the first material is an elastic material which is soluble in water or an organic solvent after solidification; injecting molten light-transmitting plastic into the light hole of the second mold, and forming a light guide layer of the optical fiber after cold curing; and step four, dissolving the second mold to obtain the light guide layer.
According to the drive chip fully-embedded LED display screen, the inner drive chips for driving the LED devices are dispersedly arranged in the drive subareas, so that the functions of the inner drive chips can be simplified, the area of the inner drive chips can be reduced, the inner drive chips are integrally and respectively arranged in the gaps between the corresponding adjacent LED pixels, the number of the drive subareas is basically not limited because each drive subarea is driven by the independent inner drive chip, and the number of the LED devices can be increased so as to improve the display resolution and the display effect; and because the internal driving chip is simplified and miniaturized and is arranged in the driving subarea, a large area of driving chip is not required to be arranged in a larger peripheral area, and more driving subareas can be arranged on the basis of unchanging the area of the display screen to improve the display resolution and the display area. In addition, the seam between the driving subareas can be set to be very small, the display area and the resolution ratio of the LED display can be made to be very large through the splicing of the LED display screens, and the problem that the resolution ratio and the display area of the LED display are difficult to improve is solved.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of the present invention.
Fig. 2 is an enlarged view of fig. 1 at a.
Fig. 3 is a schematic structural diagram of a second embodiment of the present invention.
FIG. 4 is a schematic diagram illustrating a state in which the driving sub-region and the light guide layer are separated according to a second embodiment of the present invention.
Fig. 5 is a sectional view taken along line B-B of fig. 3.
Detailed Description
Example one
As shown in fig. 1 and fig. 2, the thin film circuit-based driving chip fully embedded LED display panel includes a substrate 1, and a display device 2 and a driving device 3 disposed on the substrate 1, where the substrate 1 has a first surface 11, a thin film circuit 12 formed by a patterned thin film is disposed on the first surface 11, and the first surface 11 is divided into a display area 111 and a peripheral area 112 located at the periphery of the display area 111; the display area 111 is divided into a plurality of driving subareas 113, and each driving subarea 113 is provided with a pixel area 114 and a chip area 115; the display device 2 comprises a plurality of LED pixels 21, each pixel region 114 is provided with at least one LED pixel 21, each LED pixel 21 comprises at least one LED device 211, and a gap is formed between every two adjacent LED pixels 21; in each pixel region 114, at least one gap is provided as the chip region 115; the driving device 3 includes a plurality of inner driving chips 31 and a plurality of peripheral driving chips 32, each peripheral driving chip 32 and each inner driving chip 31 are dynamic driving chips, each inner driving chip 31 is completely disposed in the corresponding chip region 115, and each peripheral driving chip 32 is disposed in the peripheral region 112.
In the present embodiment, the substrate 1 is a 0.2 mm-2.0 mm thick transparent glass substrate.
In the present embodiment, the pixel region 114 is provided with a plurality of LED pixels 21 constituting a uniform array, and each LED pixel 21 is composed of three LED devices 211 of three emission colors of red, green, and blue.
In the present embodiment, the gap between the adjacent LED pixels 21 at the edge of two adjacent driving partitions 113 is the same as the gap distance between the adjacent LED pixels 21 in the same driving partition 113. This ensures that the LED pixels 21 are uniformly arranged throughout the display area 111.
In the present embodiment, the internal driving chip 31 is a bare-die IC. The bare-chip IC can be manufactured by a nano-chip process, and has a small area, and is more suitable for being disposed in a narrow gap between adjacent LED pixels 21.
In the present embodiment, the internal driving chip 31 is a column driving chip constituting a dynamic driving function, and the peripheral driving chip 32 is a row driving chip (typically, a multi-channel scan switch chip) constituting a dynamic driving function. From the peripheral region 112 to each of the driving partitions 113, the thin film circuit 12 includes a row driving line 122 connected from the row driving chip to one end (e.g., a positive electrode) of each of the LED devices 211 of each of the driving partitions 113, and an external input line connected to each of the column driving chips (in a serial connection manner); and within each drive partition 113, the thin-film circuit 12 includes a column drive line 123 from each column drive chip to the other end of its respective LED device 211; the driving signal of each LED device 211 is input to the column driving chip via the serial signal line 121, and the column driving chip converts the driving signal into a driving signal and outputs the driving signal to the plurality of column driving lines 123 via the horizontal jumper line 124, and then outputs the driving signal to one pad (e.g., a positive electrode pad) of each LED device 211 via the column driving line 123. The row driver chip is connected to another leg (e.g., a negative leg) of each LED device 211 via a plurality of row driver lines 122, thereby forming a dynamic drive circuit network connection of the column driver chip and the row driver chip to each LED device 211. The driving partitions 113 in the same row share the same serial signal line 121, the same row driving line 122 and the same row driving chip.
In the present embodiment, the internal driving chip 31 is provided with a storage unit. The storage unit is used for storing the brightness (or voltage, current) data of the LED devices 211 driven by the internal driving chip 31, so as to store the display state of each LED device 211 within the required display time (such as a refresh period or frame).
In the present embodiment, the thin film circuit 12 is composed of three patterned conductive film layers, and an insulating film layer is disposed between two adjacent patterned conductive film layers. The patterned conductive film layer is a metal film (such as copper alloy and Mo-Al-Mo alloy) deposited by magnetron sputtering, and a high-precision film pattern is formed by photoetching. The insulating film layer may be a patterned photosensitive resin coating layer, which is made of a photosensitive resin by extrusion coating (slit-coating), and is formed into a high-precision pattern by exposure and development. Generally, the insulating film layer is provided with a through hole for realizing the conduction of two adjacent patterned conductive film layers, so that flexible circuit routing can be realized in the drive partition 113 with a limited area. The serial signal line 121, the row driving line 122, the column driving line 123, the transverse jumper line 124 and the like are all formed by the thin film circuit 12.
Example two
Referring to fig. 3 to 5, in the case where the other parts are the same as those of the first embodiment, the difference is: the display device 2 ' includes a plurality of first LED pixels 21 ' and a plurality of second LED pixels 22 ', each of the first LED pixels 21 ' constituting a uniform matrix, each of the second LED pixels 22 ' constituting a non-uniform array, and each of the second LED pixels 22 ' being respectively located in gaps between parts of the first LED pixels 21 '. Thus, the area of the chip region 115 can be effectively increased, the internal driving chip 31 with a larger area can be arranged, and the requirement on the size of the internal driving chip 31 is reduced.
In order to finally correct the light emitting position of each second LED pixel 22 'to be a uniform matrix consistent with each first LED pixel 21', in this embodiment, the above-mentioned driving chip fully-embedded LED display screen is further provided with a light guiding layer 4, the light guiding layer 4 is disposed on the first surface 11, the light guiding layer 4 includes a plurality of optical fibers 41 as light guides, one optical fiber corresponds to one second LED pixel 22 ', each optical fiber 41 has a receiving end 411 for receiving light and an emitting end 412 for emitting light, the receiving ends 411 of the optical fibers 41 are respectively disposed on the corresponding second LED pixels 22', and the emitting ends 412 of the optical fibers 41 form a uniform light emitting array. In this way, the light emitted by each second LED pixel 22' may be directed to the emission end 412 of the optical fiber 41 with low loss.
The light guiding layer 4 can be manufactured by the following steps: step one, providing a first mold which comprises a positive mold of an optical fiber 41 forming the light guide layer 4; injecting a first material into the first mold, and removing the first material from the mold after solidification to form a second mold with a plurality of optical fiber reverse modes, wherein the first material is an elastic material which is soluble in water or an organic solvent after solidification; step three, injecting molten light-transmitting plastic into the light hole of the second mold, and forming the light guide layer 4 of the optical fiber 41 after cold solidification; and step four, dissolving the second mold to obtain the light guide layer 4.
In addition, it should be noted that the names of the parts and the like of the embodiments described in the present specification may be different, and the equivalent or simple change of the structure, the characteristics and the principle described in the present patent idea is included in the protection scope of the present patent. Various modifications, additions and substitutions for the specific embodiments described may be made by those skilled in the art without departing from the scope of the invention as defined in the accompanying claims.
Claims (10)
1. The utility model provides a drive chip full-embedded LED display screen based on thin film circuit, includes the base plate to and display device and the drive device of setting on the base plate, the base plate has the first surface, is equipped with the thin film circuit who constitutes by graphical film on the first surface, and the first surface divide into the display area and is in the peripheral region of display area periphery, its characterized in that: the display area is divided into a plurality of driving subareas, and each driving subarea is provided with a pixel area and a chip area; the display device comprises a plurality of LED pixels, each pixel area is provided with at least one LED pixel, each LED pixel comprises at least one LED device, and a gap is formed between every two adjacent LED pixels; in each pixel region, at least one gap is set as the chip region; the driving device at least comprises a plurality of inner driving chips, and each inner driving chip is completely arranged in a corresponding chip area.
2. The thin film circuit-based driving chip fully-embedded LED display screen according to claim 1, characterized in that: the inner driving chip is a static driving chip.
3. The thin film circuit-based driving chip fully-embedded LED display screen according to claim 1, characterized in that: the inner driving chip is a dynamic driving chip.
4. The LED display screen based on the fully embedded driving chip of the thin film circuit as claimed in claim 3, wherein: the driving device further comprises a plurality of peripheral driving chips, each peripheral driving chip is a dynamic driving chip, and each peripheral driving chip is arranged in the peripheral area.
5. The LED display screen based on the fully embedded driving chip of the thin film circuit as claimed in claim 4, wherein: the inner driving chip is a column driving chip forming a dynamic driving function, and the peripheral driving chip is a row driving chip forming the dynamic driving function; the inner driving chip is provided with a storage unit.
6. The LED display screen with the fully embedded driving chip based on the thin film circuit as claimed in any one of claims 1 to 5, wherein: the thin film circuit is composed of at least two graphical conductive film layers, and an insulating film layer is arranged between every two adjacent graphical conductive film layers.
7. The LED display screen with the fully embedded driving chip based on the thin film circuit as claimed in any one of claims 1 to 5, wherein: and the gap between the adjacent LED pixels at the edges of the two adjacent driving subareas is the same as the gap distance between the adjacent LED pixels in the same driving subarea.
8. The LED display screen with the fully embedded driving chip based on the thin film circuit as claimed in any one of claims 1 to 5, wherein: the full-embedded LED display screen of driver chip still is equipped with the leaded light layer, and the leaded light layer sets up on the first surface, and the leaded light layer includes a plurality of light guides, and a light guide corresponds one the LED pixel, every light guide have the receiving terminal that is used for receiving light respectively and be used for sending the end of sending of light, and the receiving terminal of each light guide sets up respectively on corresponding LED pixel, and the end of sending of each light guide constitutes an even luminous array.
9. The thin film circuit-based driving chip fully-embedded LED display screen according to claim 8, wherein: the light guide is an optical fiber corresponding to the LED pixel.
10. The LED display screen with the fully embedded driving chip based on the thin film circuit as claimed in any one of claims 1 to 5, wherein: the pixel area is provided with a plurality of LED pixels forming a uniform array, and each LED pixel consists of three LED devices with three luminous colors of red, green and blue.
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| CN202011076539.7A Active CN112133245B (en) | 2020-09-10 | 2020-10-10 | Drive chip full-embedded LED display screen based on thin film circuit |
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| CN114185200B (en) * | 2021-12-13 | 2022-11-08 | Tcl华星光电技术有限公司 | Light source module and display device |
| CN115762429A (en) * | 2022-12-21 | 2023-03-07 | 广州长嘉电子有限公司 | LED backlight module partitioned lighting control method and backlight module |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100026703A1 (en) * | 2008-07-31 | 2010-02-04 | Parker Jeffery R | Optically transmissive substrates and light emitting assemblies and methods of making same, and methods of displaying images using the optically transmissive substrates and light emitting assemblies |
| US20110102306A1 (en) * | 2009-11-02 | 2011-05-05 | Samsung Electronics Co., Ltd. | Backlight unit and display apparatus having the same |
| CN102087814A (en) * | 2010-11-30 | 2011-06-08 | 曹嘉灿 | Borderless display device and large screen displayer |
| CN102270411A (en) * | 2011-01-17 | 2011-12-07 | 深圳市保千里电子有限公司 | Seamless splicing display screen device and seamless spicing method thereof |
| CN102405493A (en) * | 2009-02-17 | 2012-04-04 | 全球Oled科技有限责任公司 | Chiplet driver pairs for two-dimensional display |
| CN102414823A (en) * | 2009-04-29 | 2012-04-11 | 全球Oled科技有限责任公司 | Chiplet display with oriented chiplets and busses |
| CN103155202A (en) * | 2010-10-15 | 2013-06-12 | 全球Oled科技有限责任公司 | Chiplet display with multiple passive-matrix controllers |
| CN103206639A (en) * | 2013-04-19 | 2013-07-17 | 四川九洲光电科技股份有限公司 | LED flexible light-emitting structure |
| US9070323B2 (en) * | 2009-02-17 | 2015-06-30 | Global Oled Technology Llc | Chiplet display with multiple passive-matrix controllers |
| CN105096748A (en) * | 2015-07-27 | 2015-11-25 | 武汉华星光电技术有限公司 | Display panel and display device with same |
| CN108230905A (en) * | 2018-01-02 | 2018-06-29 | 京东方科技集团股份有限公司 | A kind of display screen and display device |
| CN109937323A (en) * | 2016-11-07 | 2019-06-25 | 富士胶片株式会社 | Film containing absorber of light and back light unit |
| CN209980696U (en) * | 2019-06-25 | 2020-01-21 | 深圳玩意东西工业设计有限公司 | LED matrix display device for scale body |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5818404A (en) * | 1996-03-04 | 1998-10-06 | Motorola, Inc. | Integrated electro-optical package |
| US8125472B2 (en) * | 2009-06-09 | 2012-02-28 | Global Oled Technology Llc | Display device with parallel data distribution |
| US8125418B2 (en) * | 2009-06-26 | 2012-02-28 | Global Oled Technology Llc | Passive-matrix chiplet drivers for displays |
| CN203800046U (en) * | 2014-04-11 | 2014-08-27 | 广东威创视讯科技股份有限公司 | Combined diver board type LED packaging device |
| US10665578B2 (en) * | 2015-09-24 | 2020-05-26 | Apple Inc. | Display with embedded pixel driver chips |
| CN106373987A (en) * | 2016-11-15 | 2017-02-01 | 武汉华星光电技术有限公司 | OLED display module and making method thereof |
| CN106847864B (en) * | 2017-01-09 | 2019-11-12 | 张一帆 | A kind of narrow frame touch-control display panel and display device and preparation method thereof |
| CN106601141B (en) * | 2017-02-27 | 2020-01-03 | 武汉华星光电技术有限公司 | OLED display module, display device and preparation method of display module |
| CN107658330B (en) * | 2017-09-06 | 2023-12-12 | Oppo广东移动通信有限公司 | OLED display panel, mobile terminal and manufacturing method |
| TWI667643B (en) * | 2018-04-18 | 2019-08-01 | 英屬開曼群島商錼創科技股份有限公司 | Display panel with micro light emitting diode |
| US10854129B2 (en) * | 2018-06-18 | 2020-12-01 | Apple Inc. | Hybrid architecture for zero border display |
| CN111490069B (en) * | 2019-01-29 | 2023-06-02 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
-
2020
- 2020-10-10 CN CN202011075969.7A patent/CN112133244B/en active Active
- 2020-10-10 CN CN202011076539.7A patent/CN112133245B/en active Active
- 2020-10-10 CN CN202011075973.3A patent/CN112201670B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100026703A1 (en) * | 2008-07-31 | 2010-02-04 | Parker Jeffery R | Optically transmissive substrates and light emitting assemblies and methods of making same, and methods of displaying images using the optically transmissive substrates and light emitting assemblies |
| US9070323B2 (en) * | 2009-02-17 | 2015-06-30 | Global Oled Technology Llc | Chiplet display with multiple passive-matrix controllers |
| CN102405493A (en) * | 2009-02-17 | 2012-04-04 | 全球Oled科技有限责任公司 | Chiplet driver pairs for two-dimensional display |
| CN102414823A (en) * | 2009-04-29 | 2012-04-11 | 全球Oled科技有限责任公司 | Chiplet display with oriented chiplets and busses |
| US20110102306A1 (en) * | 2009-11-02 | 2011-05-05 | Samsung Electronics Co., Ltd. | Backlight unit and display apparatus having the same |
| CN103155202A (en) * | 2010-10-15 | 2013-06-12 | 全球Oled科技有限责任公司 | Chiplet display with multiple passive-matrix controllers |
| CN102087814A (en) * | 2010-11-30 | 2011-06-08 | 曹嘉灿 | Borderless display device and large screen displayer |
| CN102270411A (en) * | 2011-01-17 | 2011-12-07 | 深圳市保千里电子有限公司 | Seamless splicing display screen device and seamless spicing method thereof |
| CN103206639A (en) * | 2013-04-19 | 2013-07-17 | 四川九洲光电科技股份有限公司 | LED flexible light-emitting structure |
| CN105096748A (en) * | 2015-07-27 | 2015-11-25 | 武汉华星光电技术有限公司 | Display panel and display device with same |
| CN109937323A (en) * | 2016-11-07 | 2019-06-25 | 富士胶片株式会社 | Film containing absorber of light and back light unit |
| CN108230905A (en) * | 2018-01-02 | 2018-06-29 | 京东方科技集团股份有限公司 | A kind of display screen and display device |
| CN209980696U (en) * | 2019-06-25 | 2020-01-21 | 深圳玩意东西工业设计有限公司 | LED matrix display device for scale body |
Non-Patent Citations (2)
| Title |
|---|
| 谢洪波;于洪朗;宫仁敏;韩凛;李韬: "用于背光模组的三基色微细导光管的设计研究", 《激光与光电子学进展》 * |
| 金海洋;刘卫东;乔明胜: "改善侧导光LED背光Hot Spot现象的导光板设计", 《现代显示》 * |
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| Publication number | Publication date |
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| CN112133244B (en) | 2021-12-21 |
| CN112201670A (en) | 2021-01-08 |
| CN112201670B (en) | 2023-04-07 |
| CN112133245B (en) | 2021-12-21 |
| CN112133244A (en) | 2020-12-25 |
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