CN112129150A - Aluminum alloy heat pipe heat dissipation mobile phone back shell and manufacturing method thereof - Google Patents
Aluminum alloy heat pipe heat dissipation mobile phone back shell and manufacturing method thereof Download PDFInfo
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- CN112129150A CN112129150A CN202011066798.1A CN202011066798A CN112129150A CN 112129150 A CN112129150 A CN 112129150A CN 202011066798 A CN202011066798 A CN 202011066798A CN 112129150 A CN112129150 A CN 112129150A
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- heat pipe
- aluminum alloy
- plate
- cover plate
- pipe part
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- General Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an aluminum alloy heat pipe heat radiation mobile phone back shell and a manufacturing method thereof, wherein the mobile phone back shell is divided into two parts, namely an aluminum alloy back plate and a heat pipe heat radiation system; the heat pipe radiating system is divided into a heat pipe part and heat conducting silicone; the total height range of the heat pipe part is 1mm-1.2mm, and the length and the width are adapted to the concentration area of the mobile phone chip matched with the heat pipe part; the heat pipe part is composed of a cover plate with the thickness of 0.2mm-0.25mm and matched with the aluminum alloy backboard, a wave plate which is arranged in the middle area of the cover plate and the aluminum alloy backboard, the top of the wave plate is tightly attached to the lower surface of the aluminum alloy backboard, the bottom of the wave plate is tightly attached to the upper surface of the cover plate, and a working medium which circulates in the gap of the three plates, wherein the working medium is acetone. The invention has the advantages of integrated structure, high-efficiency heat dissipation, permanent curing and no need of maintenance.
Description
Technical Field
The invention relates to the technical field of heat dissipation of electrical equipment, in particular to an aluminum alloy heat pipe heat dissipation mobile phone back shell and a manufacturing method thereof.
Background
The high heat flux density generated inside the power electronic device poses a great threat to the reliability of the device. The failure due to high temperature accounts for more than 50% of all electronic equipment failures, and the heat transfer problem even becomes a bottleneck in the development of devices toward miniaturization. In addition to the requirement of the highest temperature, the electronic component also requires uniformity of temperature. With the rapid development of microelectronic technology, the miniaturization of electronic devices has become a mainstream trend in the development of modern electronic devices. The integration level, packaging density and operating frequency of chips are increasing due to the decreasing feature sizes of electronic devices (e.g., the feature size of microprocessors is decreased from 0.35 μm to 0.18 μm in 1990-2000), which all lead to the rapid increase of the heat flux density of chips. Therefore, the heat dissipation problem of the circuit and the chip thereof is particularly outstanding. The flat heat pipe has high thermal conductivity and good temperature uniformity, and becomes one of promising technologies for solving the problem of electronic heat dissipation.
With the development of science and technology, aluminum alloy heat pipes are produced accordingly. At present, the existing aluminum alloy heat pipe is directly filled with working media such as water, ammonia water and the like in an extruded aluminum alloy profile correspondingly, two ends of the profile are closed and kept close to vacuum pressure, an evaporation end is arranged below gravity, and a cooling end is arranged above. When the cooled workpiece generates heat, the temperature is continuously increased, after the temperature reaches a certain temperature, the working medium in the aluminum alloy heat pipe is vaporized at the evaporation end to take away heat, after the gas reaches the cooling end, the temperature is reduced, the working medium is changed from a gas state to a liquid state, the liquid flows downwards along the gravity direction and returns to the evaporation end again, and the process is repeated. However, when the evaporation end of the conventional aluminum alloy heat pipe is above the direction of gravity, since the evaporated gas is below the gravity when reaching the cooling end, the liquid cannot return to the evaporation end against the gravity, and thus the aluminum alloy heat pipe cannot work normally.
The flat heat pipe is used for effectively solving the heat dissipation problem of electronic equipment with high heat flux density in a tiny space, and is an important development direction of the heat pipe, how to realize the flat heat pipe with higher performance becomes a hot point problem in the field at present, but no heat dissipation device specially designed for mobile phones and compounded with external heat pipes exists in the market at present.
Therefore, there is a need for an aluminum alloy heat pipe heat dissipation handset back shell with an integrated structure, high heat dissipation efficiency, permanent curing, and no need for maintenance.
Disclosure of Invention
The invention aims to provide an aluminum alloy heat pipe radiating mobile phone back shell which has an integrated structure, is efficient in heat radiation, is permanently solidified and does not need maintenance.
In order to achieve the purpose, the invention adopts the following technical scheme: a back shell of an aluminum alloy heat pipe heat radiation mobile phone is divided into two parts, namely an aluminum alloy back plate and a heat pipe heat radiation system; the heat pipe radiating system is divided into a heat pipe part and heat conducting silicone; the total height range of the heat pipe part is 1mm-1.2mm, and the length and the width are adapted to the concentration area of the mobile phone chip matched with the heat pipe part; the heat pipe part is composed of a cover plate with the thickness of 0.2mm-0.25mm and matched with the aluminum alloy backboard, a wave plate which is arranged in the middle area between the cover plate and the aluminum alloy backboard, the top of the wave plate is tightly attached to the lower surface of the aluminum alloy backboard, the bottom of the wave plate is tightly attached to the upper surface of the cover plate, and a working medium which circulates in the gap of the three plates, wherein the working medium is acetone;
the manufacturing method of the heat pipe part comprises the following steps:
s1: raw material preparation
Preparing two AL6063 aluminum alloy plates with the thickness of 0.25mm-0.3mm, manufacturing one Al6063 aluminum alloy plate into an Jiong-shaped cover plate with the height range of 1mm-1.2mm, punching one Al6063 aluminum alloy plate into a triangular wave plate with the height of 0.75mm-1mm, and preparing sufficient deionized water and sufficient acetone;
s2: partial preparation of heat pipe
Firstly, performing acid-base re-soaking treatment on the inner surface of the Jiong-shaped cover plate obtained in the step S1 and the whole triangular wave plate by using nitric acid with the volume concentration of 10% and sodium hydroxide with the volume concentration of 10%, and cleaning the surface subjected to the acid-base re-soaking treatment by using deionized water to obtain a plate material for later use;
placing the triangular wave plate in the middle of the Jiong-shaped cover plate, then attaching the Jiong-shaped cover plate with the opening facing downwards to the group of the corresponding chip concentration area on the inner surface of the aluminum alloy back plate to obtain a combined structure, wherein liquid filling ports are preset on the two ends of the triangular wave plate in the combined structure corresponding to the Jiong-shaped cover plate;
thirdly, the combined structure obtained in the step is placed in a working area of vacuum laser welding equipment, and is firstly vacuumized to the vacuum degree of 1 multiplied by 10-2Pa-1×10-3Pa, all the contact surfaces of the three plates are welded compactly in a vacuum environment to obtain a vacuum sealing box with an upper channel and a lower channel, acetone is injected into the cavity through a preset liquid filling port in the vacuum environment, specifically, the liquid filling rate in the upper space of the triangular corrugated plate is 65% -70%, the liquid filling rate in the lower space is 75% -80%, the liquid filling device is drawn out, and a closed combined structure is welded in the vacuum environment to obtain the required heat pipe part.
Compared with the prior art, the invention has the following advantages: (1) the invention adopts the metal felt capillary core structure which has the lowest cost and is most easily realized in the heat pipe structure, and the concentrated heat dissipation area which is contacted with the mobile phone through the heat-conducting silicone is 1cm2In the process, the maximum heat flow of the heat pipe (namely the high-heat-conduction sealing cover plate) can reach 75.22W/cm-79.57W/cm. (2) Under the design structure of the invention, the heat dissipation structure is directly contacted with the metal back shell of the mobile phone and the chip through the heat conduction silicone, is a completely cured integrated structure, and has higher reliability compared with an external heat dissipation device. (3) The heat pipe part at the core of the invention is aluminum alloy, the content is acetone under vacuum condition, compared with the service life of the mobile phone, the invention has no worry in corrosion and aging, and no extra maintenance is needed. Therefore, the invention has the performances of integrated structure, high-efficiency heat dissipation, permanent curing and no need of maintenance.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic cross-sectional view of the present invention;
in the figure, an aluminum alloy backboard 1, a heat pipe cooling system 2, a cover plate 3, a corrugated plate 4 and heat-conducting silicone 5 are shown.
Detailed Description
Example 1:
as shown in fig. 1-2, the back shell of an aluminum alloy heat pipe heat dissipation mobile phone is divided into two parts, namely an aluminum alloy back plate 1 and a heat pipe heat dissipation system 2; the heat pipe cooling system 2 is divided into a heat pipe part and heat conducting silicone 5; the total height range of the heat pipe part is 1mm-1.2mm, and the length and the width are adapted to the concentration area of the mobile phone chip matched with the heat pipe part; the heat pipe part is specifically composed of a cover plate 3 with the thickness of 0.2mm-0.25mm and matched with an aluminum alloy backboard 1, a wave plate 4 which is arranged in the middle area of the cover plate 3 and the aluminum alloy backboard 1, the top of the wave plate is tightly attached to the lower surface of the aluminum alloy backboard 1, the bottom of the wave plate is tightly attached to the upper surface of the cover plate 3, and a working medium which circulates in the gaps of the three plates, wherein the working medium is acetone;
the manufacturing method of the heat pipe part comprises the following steps:
s1: raw material preparation
Preparing two AL6063 aluminum alloy plates with the thickness of 0.25mm-0.3mm, manufacturing one Al6063 aluminum alloy plate into an Jiong-shaped cover plate 3 with the height range of 1mm-1.2mm, punching one Al6063 aluminum alloy plate into a triangular wave plate 4 with the height of 0.75mm-1mm, and preparing sufficient deionized water and sufficient acetone;
s2: partial preparation of heat pipe
Firstly, performing acid-base re-soaking treatment on the inner surface of the Jiong-shaped cover plate 3 and the whole triangular wave plate 4 obtained in the step S1 by adopting nitric acid with the volume concentration of 10% and sodium hydroxide with the volume concentration of 10%, and cleaning the surface subjected to the acid-base re-soaking treatment by adopting deionized water to obtain a plate material for later use;
firstly, placing the triangular wave plate 4 in the middle of the Jiong-shaped cover plate 3, then, attaching the Jiong-shaped cover plate 3 with an opening facing downwards to an assembly of the corresponding chip concentration area on the inner surface of the aluminum alloy back plate 1 to obtain a combined structure, wherein liquid filling ports are preset on the plate materials of the Jiong-shaped cover plate 3 corresponding to the two ends of the triangular wave plate 4 in the combined structure;
thirdly, the combined structure obtained in the step is placed in a working area of vacuum laser welding equipment, and is firstly vacuumized to the vacuum degree of 1 multiplied by 10-2Pa-1×10-3Pa, then all phases of the three plates are put in a vacuum environmentAnd (3) closely welding all the contact surfaces to obtain a vacuum sealing box with an upper channel and a lower channel, then injecting acetone into the cavity through a preset liquid filling port in the vacuum environment, specifically, drawing out a liquid injection device, and welding a closed combined structure in the vacuum environment to obtain the required heat pipe part, wherein the liquid filling rate in the upper space of the triangular corrugated plate 4 is 65-70%, and the liquid filling rate in the lower space is 75-80%.
According to the practical application condition of the mobile phone cover produced by the embodiment, under the condition that the mobile phone is used at the highest strength and continuously plugged, the temperature of the back surface of the mobile phone can be kept to be always stable between 33.3 ℃ and 36.7 ℃ (24-hour power-plugging repeated power-plugging division) for a long time under the condition that the Sony xperia xz2 premium mobile phone (the hottest mobile phone is commented by the Lu university teacher), the practical application condition is superior to the highest temperature of 43.04 ℃ tested by the Lu university teacher, and the working condition used by the test is considered to be worse, so that the practical technical performance of the mobile phone cover is determined to be good, and the mobile phone cover is obviously only suitable for severe mobile phone users due to relatively complex structure and high cost (the average production cost is about 510 yuan, and the market retail price.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (1)
1. The utility model provides an aluminum alloy heat pipe heat dissipation cell-phone dorsal scale which characterized in that: the mobile phone back shell is divided into two parts, namely an aluminum alloy back plate (1) and a heat pipe cooling system (2); the heat pipe heat dissipation system (2) is divided into a heat pipe part and heat conducting silicone (5); the total height range of the heat pipe part is 1mm-1.2mm, and the length and the width are adapted to the concentration area of the mobile phone chip matched with the heat pipe part; the heat pipe part is composed of a cover plate (3) which is 0.2mm-0.25mm thick and is matched with the aluminum alloy backboard (1), a wave plate (4) which is arranged in the middle area of the cover plate (3) and the aluminum alloy backboard (1) and the top of which is tightly attached to the lower surface of the aluminum alloy backboard (1) and the bottom of which is tightly attached to the upper surface of the cover plate (3), and a working medium which circulates in the gaps of the three plates, wherein the working medium is acetone;
the manufacturing method of the heat pipe part comprises the following steps:
s1: raw material preparation
Preparing two AL6063 aluminum alloy plates with the thickness of 0.25mm-0.3mm, manufacturing one Al6063 aluminum alloy plate into an Jiong-shaped cover plate (3) with the height range of 1mm-1.2mm, stamping one Al6063 aluminum alloy plate into a triangular wave plate (4) with the height of 0.75mm-1mm, and preparing sufficient deionized water and sufficient acetone;
s2: partial preparation of heat pipe
Firstly, performing acid-base re-soaking treatment on the inner surface of the Jiong-shaped cover plate (3) obtained in the step S1 and the whole triangular wave plate (4) by using nitric acid with the volume concentration of 10% and sodium hydroxide with the volume concentration of 10%, and cleaning the surface subjected to the acid-base re-soaking treatment by using deionized water to obtain a plate material for later use;
firstly, placing the triangular wave plate (4) in the middle of the Jiong-shaped cover plate (3), then, enabling an opening of the Jiong-shaped cover plate (3) to face downwards, and attaching the cover plate to an inner surface of the aluminum alloy back plate (1) corresponding to a group of a chip concentration area to obtain a combined structure, wherein liquid filling ports are preset on the plate material of the Jiong-shaped cover plate (3) corresponding to two ends of the triangular wave plate (4) in the combined structure;
thirdly, the combined structure obtained in the step is placed in a working area of vacuum laser welding equipment, and is firstly vacuumized to the vacuum degree of 1 multiplied by 10-2Pa-1×10-3Pa, all the contact surfaces of the three plates are welded compactly in a vacuum environment to obtain a vacuum sealing box with an upper channel and a lower channel, acetone is injected into the cavity through a preset liquid filling port in the vacuum environment, specifically, 65% -70% of liquid filling rate in the upper space and 75% -80% of liquid filling rate in the lower space of the triangular corrugated plate (4), the liquid filling device is drawn out, and a closed combined structure is welded in the vacuum environment to obtain the required heat pipe part.
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| CN202011066798.1A CN112129150B (en) | 2020-10-03 | 2020-10-03 | Aluminum alloy heat pipe heat dissipation mobile phone back shell and manufacturing method thereof |
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| CN112129150B CN112129150B (en) | 2021-11-02 |
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| US20120182687A1 (en) * | 2011-01-14 | 2012-07-19 | Microsoft Corporation | Adaptive thermal management for devices |
| CN205039873U (en) * | 2015-09-22 | 2016-02-17 | 蒲彩贵 | Heat pipe cooling formula mobile phone motherboard heat radiation structure |
| CN206149684U (en) * | 2016-08-29 | 2017-05-03 | 河南城建学院 | Heat pipe cooling heat radiation protection shell |
| CN206865511U (en) * | 2017-01-19 | 2018-01-09 | 深圳辉烨通讯技术有限公司 | A kind of mobile phone for being provided with thermally conductive backplane |
| CN207603738U (en) * | 2017-11-15 | 2018-07-10 | 山东科技大学 | A kind of heat pipe heat radiation mobile phone shell |
| CN208690240U (en) * | 2018-05-11 | 2019-04-02 | 新乡市特美特热控技术股份有限公司 | A kind of heat radiation combined device of big heat flow density chip |
| CN208849832U (en) * | 2018-09-30 | 2019-05-10 | 华南理工大学 | A kind of reinforcing heat dissipation cell-phone cover based on heat pipe |
| CN110392154A (en) * | 2019-07-29 | 2019-10-29 | 昆山奢茂电子科技有限公司 | A kind of mobile phone fender bracket with heat sinking function |
-
2020
- 2020-10-03 CN CN202011066798.1A patent/CN112129150B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120182687A1 (en) * | 2011-01-14 | 2012-07-19 | Microsoft Corporation | Adaptive thermal management for devices |
| CN205039873U (en) * | 2015-09-22 | 2016-02-17 | 蒲彩贵 | Heat pipe cooling formula mobile phone motherboard heat radiation structure |
| CN206149684U (en) * | 2016-08-29 | 2017-05-03 | 河南城建学院 | Heat pipe cooling heat radiation protection shell |
| CN206865511U (en) * | 2017-01-19 | 2018-01-09 | 深圳辉烨通讯技术有限公司 | A kind of mobile phone for being provided with thermally conductive backplane |
| CN207603738U (en) * | 2017-11-15 | 2018-07-10 | 山东科技大学 | A kind of heat pipe heat radiation mobile phone shell |
| CN208690240U (en) * | 2018-05-11 | 2019-04-02 | 新乡市特美特热控技术股份有限公司 | A kind of heat radiation combined device of big heat flow density chip |
| CN208849832U (en) * | 2018-09-30 | 2019-05-10 | 华南理工大学 | A kind of reinforcing heat dissipation cell-phone cover based on heat pipe |
| CN110392154A (en) * | 2019-07-29 | 2019-10-29 | 昆山奢茂电子科技有限公司 | A kind of mobile phone fender bracket with heat sinking function |
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