CN112103206B - Workpiece conveying system, workpiece conveying method and laser annealing equipment - Google Patents
Workpiece conveying system, workpiece conveying method and laser annealing equipment Download PDFInfo
- Publication number
- CN112103206B CN112103206B CN201910522660.9A CN201910522660A CN112103206B CN 112103206 B CN112103206 B CN 112103206B CN 201910522660 A CN201910522660 A CN 201910522660A CN 112103206 B CN112103206 B CN 112103206B
- Authority
- CN
- China
- Prior art keywords
- workpiece
- air source
- manipulator
- air
- factory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 68
- 238000005224 laser annealing Methods 0.000 title claims abstract description 35
- 230000005540 biological transmission Effects 0.000 claims abstract description 59
- 230000008569 process Effects 0.000 claims abstract description 47
- 230000002159 abnormal effect Effects 0.000 claims abstract description 39
- 230000005856 abnormality Effects 0.000 claims abstract description 23
- 230000007246 mechanism Effects 0.000 claims abstract description 23
- 238000003860 storage Methods 0.000 claims abstract description 13
- 238000012546 transfer Methods 0.000 claims description 137
- 238000001179 sorption measurement Methods 0.000 claims description 27
- 238000012545 processing Methods 0.000 claims description 12
- 230000001960 triggered effect Effects 0.000 claims description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 description 151
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 129
- 229910052710 silicon Inorganic materials 0.000 description 129
- 239000010703 silicon Substances 0.000 description 129
- 238000001514 detection method Methods 0.000 description 11
- 238000013459 approach Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000007306 turnover Effects 0.000 description 4
- 238000000137 annealing Methods 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a workpiece conveying system, a workpiece conveying method and laser annealing equipment, wherein the workpiece conveying system is used for conveying workpieces among a workpiece storage, a pretreatment mechanism and a workpiece table, and comprises the following components: the conveying manipulator is connected with the factory air source through the pipeline and is configured to enable the workpiece to be in a safe station after the factory air source is abnormal; the standby air source is arranged in parallel with the factory air source and is configured to supply air to the transmission manipulator when the factory air source is abnormal. The workpiece conveying system can ensure that the workpiece cannot fall or be damaged due to abnormality of a factory air source in the workpiece conveying process, is beneficial to improving the efficiency of the laser annealing process and saves the cost of the laser annealing process. Correspondingly, the invention also provides a workpiece conveying method and laser annealing equipment.
Description
Technical Field
The present invention relates to the field of integrated circuit manufacturing, and in particular, to a workpiece conveying system, a workpiece conveying method, and a laser annealing apparatus.
Background
Compared with the traditional annealing process, the laser annealing process has the advantages of high activation rate, small damage to devices and the like, and gradually replaces the traditional annealing process in the manufacturing fields of insulated gate bipolar transistors, thin film transistors, image sensors and the like. The workpiece stage of the laser annealing equipment adsorbs the silicon wafer in a pin-free mode, so that a Bernoulli manipulator is generally adopted to adsorb the silicon wafer from the upper surface of the silicon wafer for silicon wafer transmission, and the manipulator provides positive pressure by a factory gas circuit. However, the adsorption mode is easily influenced by abnormal gas interruption of the factory gas circuit, so that potential safety hazards exist in silicon wafer transmission, once the abnormal gas interruption occurs in the factory gas circuit, the silicon wafer cannot be adsorbed by the manipulator, and even the silicon wafer falls down and is broken due to falling, and the process cost and the efficiency of laser annealing are influenced.
Disclosure of Invention
The invention aims to provide a workpiece conveying system which can ensure safe and reliable workpiece conveying, is beneficial to improving the efficiency of a laser annealing process and saves the cost of the laser annealing process.
Another object of the present invention is to provide a laser annealing apparatus, which has high efficiency and low cost of the laser annealing process by applying the above workpiece conveying system.
Still another object of the present invention is to provide a workpiece conveying method, by applying the workpiece conveying system, the efficiency of the laser annealing process can be improved, and the cost of the laser annealing process can be saved.
In order to achieve the purpose, on one hand, the invention adopts the following technical scheme:
a workpiece transport system for transporting workpieces between a workpiece store, a pretreatment mechanism, and a workpiece stage, the workpiece transport system comprising:
The transmission manipulator is used for transmitting the workpiece among the workpiece storage, the pretreatment mechanism and the workpiece table, and is connected with a factory air source through a pipeline and configured to enable the workpiece to be in a safe station after the factory air source is abnormal;
And the standby air source is arranged in parallel with the plant air source and is configured to supply air for the transmission manipulator when the plant air source is abnormal.
In one embodiment, the transfer manipulator is configured to obtain the workpiece adsorption direction after the abnormality occurs in the factory air source, and if the transfer manipulator adsorbs the workpiece from above the workpiece, the transfer manipulator carries the workpiece to turn over by an angle so that the workpiece is in a safe station.
In one embodiment, the standby air source is stable for at least s.
In one embodiment, the workpiece conveying system further includes: the first pressure sensor is arranged on a pipeline between the factory air source and the transmission manipulator and is used for detecting the air supply pressure of the factory air source.
In one embodiment, the transfer robot is configured to carry the workpiece to perform an ° turn at a preset turn station, where the preset turn station is a position where the transfer robot and the workpiece do not interfere with the workpiece storage, the pretreatment mechanism, and the workpiece table during the turn process.
In one embodiment, the preset flipping station is disposed between the transfer robot and the workpiece storage and/or the pretreatment mechanism and/or the workpiece table.
In one embodiment, the first pressure sensor is triggered to detect the air supply pressure of the factory air source when the transfer robot carries the workpiece through the preset turning station.
In one embodiment, the workpiece conveying system further includes: the device comprises a first check valve and a second check valve, wherein the first check valve is arranged on a pipeline between the factory air source and the transmission manipulator, and the second check valve is arranged on a pipeline between the standby air source and the transmission manipulator.
In one embodiment, the workpiece conveying system further includes: and the filter triplet is arranged on a pipeline between the standby air source and the second one-way valve.
In one embodiment, the workpiece conveying system further includes: and the dryer is arranged on a pipeline after the plant air source and the standby air source are connected in parallel.
In one embodiment, the workpiece conveying system further includes: the pressure reducing valve is arranged on a pipeline after the plant air source and the standby air source are connected in parallel.
In one embodiment, the workpiece conveying system further includes: and the second pressure sensor is arranged on a pipeline between the pressure reducing valve and the transmission manipulator.
In one embodiment, the workpiece conveying system further includes: the one-way throttle valve is arranged on a pipeline after the plant air source and the standby air source are connected in parallel, and the flow sensor is arranged on a pipeline between the one-way throttle valve and the transmission manipulator.
In one embodiment, the transfer robot is a bernoulli robot.
On the other hand, the invention also provides laser annealing equipment, which comprises the workpiece conveying system.
In yet another aspect, the present invention further provides a workpiece conveying method, including the steps of: when the factory air source is abnormal in air supply, the factory air source is automatically switched to the standby air source to supply air for the transmission manipulator, and the transmission manipulator enables the workpiece to be in a safe station.
In one embodiment, the step of the transfer robot bringing the workpiece to a safe station includes: and acquiring the workpiece adsorption direction, and carrying the workpiece to overturn by the transmission manipulator to enable the workpiece to be in a safety station when the transmission manipulator adsorbs the workpiece from the upper part of the workpiece.
In one embodiment, before the step of handling the abnormal air supply, the method further includes: and detecting whether the output pressure of the plant air source is lower than an output pressure threshold value or not when the transmission manipulator moves to a preset overturning station, and executing the air supply abnormality processing step when the output pressure of the plant air source is lower than the output pressure threshold value.
In one embodiment, the preset turning station is a position where the transmission manipulator and the workpiece do not interfere with the workpiece storage, the pretreatment mechanism and the workpiece table in the process of turning the workpiece carried by the transmission manipulator.
In one embodiment, the workpiece conveying method further includes the following steps: if the plant air source is abnormal in air supply when the transmission manipulator does not move to the preset overturning station, the transmission manipulator is automatically switched to the standby air source to supply air for the transmission manipulator.
In one embodiment, in the step of automatically switching to the standby air source to supply air to the transfer manipulator, the plant air source and the standby air source are automatically switched by using a pressure difference through a first one-way valve and a second one-way valve.
The workpiece conveying system comprises a standby air source, wherein the standby air source can supply air for the conveying manipulator when the factory air source is abnormal, so that the conveying manipulator can stably adsorb workpieces after the factory air source is abnormal, and the workpieces are prevented from falling. And moreover, the conveying manipulator can enable the workpiece to be in a safe station after the abnormality of the factory air source occurs, so that the workpiece is further prevented from falling off, and the safe and reliable workpiece conveying is ensured. Therefore, compared with the prior art, the workpiece conveying system can ensure safe and reliable workpiece conveying, ensure that the workpiece cannot fall or be damaged due to abnormality of a factory air source in the workpiece conveying process, and is beneficial to improving the efficiency of a laser annealing process and saving the cost of the laser annealing process.
The laser annealing equipment is realized by applying the workpiece conveying system, so that the equipment process efficiency can be improved, and the laser annealing process cost can be saved.
By applying the workpiece conveying system, the workpiece conveying method can ensure safe and reliable workpiece conveying, is beneficial to improving the efficiency of the laser annealing process and saves the cost of the laser annealing process.
Drawings
FIG. 1 is a schematic diagram of a work piece transport system in one embodiment;
FIG. 2 is a schematic diagram of pneumatic control of a transfer robot in one embodiment;
FIG. 3 is a schematic diagram of a transfer robot in one embodiment adsorbing a silicon wafer from above;
FIG. 4 is a schematic diagram of a transport robot carrying a silicon wafer rotated 90 deg. in one embodiment;
FIG. 5 is a schematic diagram of a transfer robot carrying a silicon wafer flipped 180 to a safety station in one embodiment;
FIG. 6 is a schematic diagram of the distribution of preset flipping stations in one embodiment;
FIG. 7 is a flow chart illustrating the execution of a method of transporting a workpiece in one embodiment.
In the figure:
10-of a wafer library, 20-of a pretreatment mechanism, 30-of a workpiece table and 40-of a silicon wafer;
51-transmission manipulator, 52-factory air source, 53-standby air source, 54-pipeline, 541-first pressure sensor, 542-first one-way valve, 543-second one-way valve, 544-filter triplet, 545-dryer, 546-pressure reducing valve, 547-second pressure sensor, 548-one-way throttle valve, 549-flow sensor;
61-workpiece table approach; 62-preprocessing the proximity bits; 63—first slice library approach bit; 64-second slice library approach bit.
Detailed Description
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
The present embodiments provide a workpiece transport system for transporting silicon wafers between a workpiece store, a pretreatment mechanism, and a workpiece stage. Specifically, the following examples illustrate the application of the workpiece transfer system to a laser annealing process. The workpiece is specifically a silicon wafer, the workpiece memory is a wafer library, and the wafer library is used for storing the silicon wafer to be processed and storing the processed silicon wafer. The pretreatment mechanism comprises, but is not limited to, pretreatment, scanning, exposure, photographing, temperature adjustment and other treatment operations on the silicon wafer. The workpiece table is used for detecting and processing the pretreated silicon wafer. And the workpiece transmission system takes out the silicon wafer to be processed from the wafer library and transmits the silicon wafer to be detected to the pretreatment mechanism for pretreatment operation, the pretreated silicon wafer to be detected is continuously transmitted to the workpiece platform for detection, and the detected silicon wafer is returned to the wafer library for storage.
As shown in fig. 1 and 2, the workpiece transfer system of an embodiment is used for transferring the silicon wafer 40 among the wafer library 10, the pretreatment mechanism 20 and the workpiece stage 30, and includes a transfer robot 51, a factory air source 52, a standby air source 53 and a pipeline 54. The transfer robot 51 transfers the silicon wafer 40 between the wafer library 10, the pretreatment mechanism 20 and the workpiece stage 30, the transfer robot 51 is connected to the factory air source 52 through a pipeline 54, the transfer robot 51 is configured to enable the silicon wafer 40 to be in a safe station after the factory air source 52 is abnormal, and in particular, the transfer robot 51 may be, but not limited to, a bernoulli robot. The backup air source 53 is disposed in parallel with the plant air source 52, and the backup air source 53 is configured to supply air to the transfer robot 51 when an abnormality occurs in the plant air source 52.
The workpiece conveying system comprises a standby air source 53, wherein the standby air source 53 can supply air for the conveying manipulator 51 when the factory air source 52 is abnormal, so that the conveying manipulator 51 can stably adsorb the silicon wafer 40 after the factory air source 52 is abnormal, and the silicon wafer 40 is prevented from falling. And, the transmission manipulator 51 can make the silicon wafer 40 in a safe station after the abnormality of the factory air source 52, so as to further avoid the falling of the silicon wafer 40 and ensure the safe and reliable transmission of the silicon wafer 40. Compared with the prior art, the workpiece conveying system can ensure that the silicon wafers 40 are conveyed safely and reliably, ensure that the silicon wafers 40 cannot fall or be damaged due to abnormality of the factory air source 52 in the conveying process, and are beneficial to improving the efficiency of the laser annealing process and saving the cost of the laser annealing process.
In one embodiment, the transfer robot 51 is configured to obtain the silicon wafer adsorption direction after the abnormality of the factory air source 52, and if the transfer robot 51 adsorbs the silicon wafer 40 from above the silicon wafer 40, the transfer robot 51 carries the silicon wafer 40 to turn 180 ° so that the silicon wafer 40 is in the safety station.
Specifically, the safety station is specifically an adsorption station where the transfer robot 51 is located below the silicon wafer 40. According to different process requirements, the transfer manipulator 51 can adsorb the silicon wafer 40 from above the silicon wafer 40 or adsorb the silicon wafer 40 from below the silicon wafer 40. In this embodiment, when the factory air source 52 is abnormal, firstly, the silicon wafer adsorption direction is obtained, if the transfer manipulator 51 adsorbs the silicon wafer 40 from above the silicon wafer 40 (as shown in fig. 3), the transfer manipulator 51 carries the silicon wafer 40 to turn 180 ° so that the silicon wafer 40 is located above the transfer manipulator 51 (as shown in fig. 4), thereby the silicon wafer 40 is in a safe station, and the transfer manipulator 51 supports the silicon wafer 40 from below the silicon wafer 40 so that the silicon wafer 40 cannot fall; if the transfer robot 51 adsorbs the silicon wafer 40 from below the silicon wafer 40, no processing is required. Specifically, the silicon wafer adsorption direction may be detected by a sensor to obtain the processing information of the silicon wafer 40, which may also be stored in the system, and the specific obtaining mode is not limited.
In one embodiment, the steady supply of air from the backup air source 53 is for a period of at least 30 seconds. Specifically, the standby air source 53 may be, but not limited to, an air compressor, which has an air storage tank with a volume of not less than 20L, so as to ensure that the air compressor can provide stable air supply for not less than 30s.
In one embodiment, the transfer robot 51 is configured to carry the silicon wafer 40 for 180 ° flipping at a preset flipping station, which is a position where the transfer robot 51 and the silicon wafer 40 do not interfere with the wafer library 10, the pretreatment mechanism 20, and the workpiece stage 30 during flipping. In one embodiment, a preset flipping station is provided between the transfer robot 51 and the workpiece store (the magazine 10) and/or the pretreatment mechanism 20 and/or the workpiece stage 30. Specifically, as shown in fig. 6, in the present embodiment, the preset flipping station includes a workpiece stage access position 61, a preprocessing access position 62, a first magazine access position 63, and a second magazine access position 64. Wherein the workpiece stage approaching position 61 is located between the transfer robot 51 and the workpiece stage 30; the pretreatment access position 62 is located between the transfer robot 51 and the pretreatment mechanism 20, and the first and second magazine access positions 63 and 64 are located between the transfer robot 51 and the corresponding magazine 10. It should be noted that, in the present embodiment, the number of the slice library approach bits corresponds to the number of the slice libraries, and correspondingly, the number of the slice library approach bits is also two, in practical application, the number of the slice library approach bits may be more than two or less than two according to the number of the slice libraries 10, and the present embodiment is not limited specifically.
In this embodiment, the transfer manipulator 51 carries the silicon wafer 40 to overturn at a preset overturn station, so that it can be ensured that the silicon wafer 40 cannot interfere with other equipment components in the overturning process, and the silicon wafer 40 is effectively protected. Further, in order to optimize the driving scheme and save the energy consumption of the system, the workpiece conveying system performs positive pressure detection on the factory air source 52 only when the conveying manipulator 51 is at a preset turning station. Specifically, the transfer manipulator 51 performs positive pressure detection on the factory air source 52 when moving to each preset turning station, if abnormal positive pressure of the factory air source 52 is detected, the silicon wafer adsorption direction is obtained, if the transfer manipulator 51 adsorbs the silicon wafer 40 from above the silicon wafer 40, the transfer manipulator 51 directly carries the silicon wafer 40 for turning, and the system automatically switches the air source to the standby air source 53 to supply air for the transfer manipulator 51, so as to ensure that the silicon wafer 40 does not fall.
Furthermore, when the transfer robot 51 does not reach the preset turning station, the workpiece transfer system does not perform positive pressure detection on the factory air source 52, and if the factory air source 52 is abnormal in positive pressure when the transfer robot 51 does not reach the preset turning station (for example, during the wafer transferring process of the transfer robot 51), the system only automatically switches the air source to the standby air source 53 to supply air for the transfer robot 51, and does not perform the silicon wafer adsorption direction confirmation and the turning operation of the corresponding transfer robot 51 carrying the silicon wafer 40, so as to ensure that the silicon wafer 40 does not interfere with other equipment components and ensure the safety of the silicon wafer 40. Specifically, the transfer robot 51 performs the transfer operation with the workpiece stage 30 in the longest transfer time among the transfer robot 51, and as shown in table 1, the transfer time period for the transfer robot 51 to transfer the workpiece stage 30 is about 6.9s. Further, the time from the detection of the positive pressure abnormality of the factory air source 52 to the movement of the transfer robot 51 to the next preset turning station and carrying the silicon wafer 40 to complete the 180 ° turning operation of the transfer robot 51 is about 7s, and the air supply duration of the independent stable air supply of the standby air source 53 is not less than 30s, which is far greater than the sum of the wafer delivering duration of the transfer robot 51 and the time consuming of the turning of the transfer robot 51, so that the standby air source 53 can still ensure that the transfer robot 51 stably adsorbs the silicon wafer 40 after the abnormal air supply of the factory air source 52 occurs in the wafer delivering process, and ensure that the silicon wafer 40 does not drop.
Table 1: time resolution schematic diagram of transfer manipulator and workpiece table connecting piece
In one embodiment, the workpiece transfer system further includes a first check valve 542 and a second check valve 543, the first check valve 542 is disposed on the pipeline 54 between the factory air source 52 and the transfer robot 51, and the second check valve 543 is disposed on the pipeline 54 between the standby air source 53 and the transfer robot 51. Specifically, the plant air source 52 and the standby air source 53 pass through the first check valve 542 before being summarized, and the standby air source 53 and the plant air source 52 pass through the second check valve 543 before being summarized, and the first check valve 542 and the second check valve 543 can be switched by the air pressure difference, so that the automatic switching to the standby air source 53 for air supply can be realized when the plant air source 52 is abnormal. Specifically, the pressure of the gas provided by the plant gas source 52 is greater than the pressure of the gas outputted by the backup gas source 53, the output pressure threshold of the plant gas source 52 is preset, the pressure of the gas outputted by the backup gas source 53 is less than or equal to the output pressure threshold of the plant gas source 52, and preferably the pressure of the gas outputted by the backup gas source 53 is equal to the output pressure threshold of the plant gas source 52. When the output pressure of the plant air source 52 is greater than the output pressure threshold, the first check valve 542 is opened, and the plant air source 52 supplies air normally; when the plant air source 52 is abnormal in air supply, the output pressure of the plant air source 52 becomes smaller, and when the output pressure of the plant air source 52 is smaller than the output pressure threshold value, the first one-way valve 542 is closed, at the moment, the second one-way valve 543 is opened, and the system is automatically switched to the standby air source 53 for supplying air to the transmission manipulator 51.
Further, in the air supply process of the standby air source 53, the first check valve 542 is closed, so that the air output by the standby air source 53 can be ensured not to flow back to the plant air source 52 side, and the air supply stability of the standby air source 53 can be ensured. Further, in the normal air supply process of the plant air source 52, since the air pressure provided by the plant air source 52 is greater than the air pressure output by the standby air source 53, the second one-way valve 543 is closed, so that the air of the standby air source 53 overflows slowly, which is beneficial to saving resources, and when the air compressor is adopted by the standby air source 53, the internal pressure of the air compressor can be reduced slowly by the second one-way valve 543, which can effectively reduce frequent work of the air compressor and is beneficial to prolonging the service life of the air compressor.
In one embodiment, the workpiece transfer system further includes a first pressure sensor 541, where the first pressure sensor 541 is disposed on the pipeline 54 between the factory air supply 52 and the transfer robot 51 for detecting the air supply pressure of the factory air supply 52. Specifically, the first pressure sensor 541 is configured to detect a supply pressure of the plant air source 52 to determine whether the supply of the plant air source 52 is normal, and when the supply pressure of the plant air source 52 is greater than or equal to an output pressure threshold of the plant air source 52, the supply of the plant air source 52 is normal; when the air supply pressure of the plant air source 52 is smaller than the output pressure threshold of the plant air source 52, the plant air source 52 is abnormally supplied, the system is automatically switched to the standby air source 53 for supplying air, and the transmission manipulator 51 performs adsorption direction identification and corresponding overturning operation.
Further, in one embodiment, the workpiece conveying system further includes a central control system, the first pressure sensor 541 is connected to the central control system of the workpiece conveying system, an output pressure threshold of the factory air source 52 is stored in the central control system in advance, the first pressure sensor 541 sends the detected air supply pressure of the factory air source 52 to the central control system, and the central control system compares the received air supply pressure with the pre-stored output pressure threshold of the factory air source 52 and controls the conveying manipulator 51 to perform the adsorption direction recognition and the corresponding overturning operation according to the comparison result. Further, in one embodiment, the workpiece conveying system further includes an alarm connected to the central control system, and when the plant air source 52 is abnormal, the central control system further notifies the alarm to alarm, so as to remind the staff to timely repair the plant air source 52 to timely restore the plant air source 52 to supply air.
In one embodiment, the first pressure sensor 541 is triggered to detect the supply pressure of the factory air supply 52 as the transfer robot 51 carries the workpiece through the preset flipping station. The first pressure sensor 541 is triggered to detect positive pressure of the factory air supply 52 only when the transfer robot 51 is in the preset flipping station. When the transfer robot 51 does not reach the preset turning station, the first pressure sensor 541 is triggered to not perform positive pressure detection on the factory air source 52.
In one embodiment, the workpiece transfer system further includes a pressure reducing valve 546, wherein the pressure reducing valve 546 is disposed on the pipeline 54 after the plant air source 52 and the backup air source 53 are connected in parallel. Specifically, to ensure that the factory air source 52 and the backup air source 53 provide a stable and reliable positive pressure air supply to the transfer robot 51, the output pressures of the factory air source 52 and the backup air source 53 are generally set to be higher than the adsorption air pressure value required by the transfer robot 51 to compensate for the air pressure drop generated in the transfer process, so that the air pressure transferred in the pipeline 54 is generally higher than the adsorption air pressure value of the transfer robot 51. In this embodiment, the pressure reducing valve 546 is provided to decompress the gas conveyed in the pipeline 54, so that the gas pressure meets the use requirement of the conveying manipulator 51, and the conveying manipulator 51 can be ensured to work stably and reliably.
Generally, the adsorption air pressure values required by the transfer robot 51 for adsorbing the silicon wafers 40 of different specifications are different, and the adsorption air pressure requirement of the silicon wafers 40 of different specifications is comprehensively considered, wherein the adsorption air pressure value of the transfer robot 51 is 0.2-0.5 MPa, preferably 0.4MPa. In combination with the above, in one embodiment, the output pressure threshold of the plant air source 52 is 0.3 to 0.6MPa, preferably 0.5MPa. Accordingly, the gas output pressure of the backup gas source 53 is from.3 to 0.6MPa, preferably 0.5MPa. Further, when the standby air source 53 adopts an air compressor, the outlet pressure value of the air compressor is 0.5MPa, when the internal pressure value of the air storage tank of the air compressor is lower than 0.5MPa, the motor of the air compressor works, and when the internal pressure value of the air storage tank rises to 0.7MPa, the motor stops working.
In one embodiment, the workpiece conveying system further includes a second pressure sensor 547, where the second pressure sensor 547 is disposed on the pipeline 54 between the pressure reducing valve 546 and the conveying manipulator 51, and the second pressure sensor 547 can detect the air supply pressure of the conveying manipulator 51 in real time, so that the pressure reducing valve 546 can be adjusted in real time according to the air supply pressure of the conveying manipulator 51 detected by the second pressure sensor 547, so as to ensure that the pressure regulating valve 546 can adjust the air supply pressure in time accurately, improve the adjusting precision of the pressure reducing valve 546, and further ensure that the conveying manipulator 51 works stably and reliably.
In one embodiment, the workpiece conveying system further comprises a one-way throttle valve 548 and a flow sensor 549, wherein the one-way throttle valve 548 is arranged on the pipeline 54 after the plant air source 52 and the standby air source 53 are connected in parallel, and the flow sensor 549 is arranged on the pipeline between the one-way throttle valve 548 and the conveying manipulator 51. In this embodiment, the unidirectional throttle valve 548 and the flow sensor 549 are provided to accurately regulate the flow of the gas in the pipeline 54, so that the flow of the gas meets the use requirement of the transfer manipulator 51, and the stable and reliable operation of the transfer manipulator 51 is further ensured.
In one embodiment, the workpiece conveying system further includes a filter triplet 544, where the filter triplet 544 is disposed on the pipeline 54 between the backup gas source 53 and the second check valve 543, and the filter triplet 544 is used to remove water and oil from the gas provided by the backup gas source 53 for use by the conveying robot 51.
In one embodiment, the workpiece conveying system further includes a dryer 545, where the dryer 545 is disposed on the pipeline 54 after the plant gas source 52 and the standby gas source 53 are connected in parallel, and the dryer 545 can dry the gas provided by the plant gas source 52 and the standby gas source 53, so as to ensure gas safety.
On the other hand, the invention also provides laser annealing equipment, which comprises the workpiece conveying system. The laser annealing equipment of the embodiment is realized by applying the workpiece conveying system, and can start the standby air source 53 to supply air for the conveying manipulator 51 when the air supply abnormality occurs in the factory air source 52, and enable the silicon wafer 40 to be in a safe station, so that the silicon wafer 40 is ensured not to fall off, the silicon wafer 40 is ensured to be conveyed safely and reliably, the process efficiency of the laser annealing equipment is high, and the cost of the laser annealing process is low.
In still another aspect, the present invention also provides a workpiece conveying method, including the following air supply abnormality processing steps: when the air supply of the factory air source 52 is abnormal, the automatic switching to the standby air source 53 supplies air to the transmission manipulator 51, and the transmission manipulator 51 enables the workpiece to be in a safe station. The workpiece conveying method in this embodiment is implemented based on the workpiece conveying system, and can enable the standby air source 53 to supply air for the conveying manipulator 51 when the air supply abnormality occurs in the factory air source 52, and enable the workpiece to be in a safe station, so that the workpiece is ensured not to drop, the workpiece conveying is ensured to be safe and reliable, the efficiency of the laser annealing process is improved, and the cost of the laser annealing process is saved.
In one embodiment, the step of transporting the robot 51 to secure the workpiece in the safe station includes: the workpiece adsorption direction is obtained, and when the conveying manipulator 51 adsorbs the workpiece from above the workpiece, the conveying manipulator 51 carries the workpiece to turn over 180 degrees so that the workpiece is in a safety station.
Specifically, taking the application of the workpiece conveying system to the laser annealing process as an example, the safety station is specifically an adsorption station where the conveying manipulator 51 is located below the silicon wafer 40. According to different process requirements, the transfer manipulator 51 can adsorb the silicon wafer 40 from above the silicon wafer 40 or adsorb the silicon wafer 40 from below the silicon wafer 40. In this embodiment, when the factory air source 52 is abnormal, firstly, the silicon wafer adsorption direction is obtained, if the transfer manipulator 51 adsorbs the silicon wafer 40 from above the silicon wafer 40 (as shown in fig. 3), the transfer manipulator 51 carries the silicon wafer 40 to turn 180 ° so that the silicon wafer 40 is located above the transfer manipulator 51 (as shown in fig. 4), thereby the silicon wafer 40 is in a safe station, and the transfer manipulator 51 supports the silicon wafer 40 from below the silicon wafer 40 so that the silicon wafer 40 cannot fall; if the transfer robot 51 adsorbs the silicon wafer 40 from below the silicon wafer 40, no processing is required. Specifically, the silicon wafer adsorption direction may be detected by a sensor to obtain the processing information of the silicon wafer 40, which may also be stored in the system, and the specific obtaining mode is not limited.
In one embodiment, before the air supply abnormality processing step, further comprising: when the transfer robot 51 moves to the preset turning station, it is detected whether the output pressure of the plant air source 52 is lower than the output pressure threshold, and when the output pressure of the plant air source 52 is lower than the output pressure threshold, the above-described air supply abnormality processing step is performed.
Specifically, the preset turning station is a position where the transfer manipulator 51 and the silicon wafer 40 do not interfere with the wafer library 10, the pretreatment mechanism 20 and the workpiece table 30 in the process of turning the workpiece carried by the transfer manipulator 51, and the setting position of the specific preset turning station is described in the above embodiments and will not be described herein.
Further, the transfer manipulator 51 performs positive pressure detection on the factory air source 52 when moving to each preset turning station, if abnormal positive pressure of the factory air source 52 is detected, the silicon wafer adsorption direction is obtained, if the transfer manipulator 51 adsorbs the silicon wafer 40 from above the silicon wafer 40, the transfer manipulator 51 directly carries the silicon wafer 40 for turning, and the system automatically switches the air source to the standby air source 53 to supply air for the transfer manipulator 51, so as to ensure that the silicon wafer 40 does not fall. In this embodiment, the factory air source 52 is subjected to positive pressure detection at the preset turning station, and corresponding air source switching and turning operation of the transmission manipulator 51 are performed according to the detection result, so that it is ensured that the silicon wafer 40 cannot fall after the abnormality occurs in the factory air source 52, interference cannot occur in the process of turning the silicon wafer 40 carried by the transmission manipulator 51, stability and reliability in turning are ensured, and safety of the silicon wafer 40 is ensured.
In one embodiment, the workpiece conveying method further includes the following steps: if the factory air source 52 is abnormal in air supply when the transfer manipulator 51 does not move to the preset overturning station, the automatic switching to the standby air source 53 supplies air for the transfer manipulator 51.
Specifically, the work conveying system performs positive pressure detection on the factory air source 52 only when the conveying manipulator 51 moves to the preset turning station, and does not perform positive pressure detection on the factory air source 52 when the conveying manipulator 51 does not reach the preset turning station. If the factory air source 52 is abnormal in positive pressure when the transfer manipulator 51 does not reach the preset turning station (for example, during the wafer exchanging process of the transfer manipulator 51), the system only automatically switches the air source to the standby air source 53 to supply air for the transfer manipulator 51, and the silicon wafer adsorption direction confirmation and the turning operation of the corresponding transfer manipulator 51 carrying the silicon wafer 40 are not performed. At this time, only the standby air source 53 supplies air to the transfer manipulator 51, until the transfer manipulator 51 moves to the preset turning station, the silicon wafer adsorption direction is confirmed, and the corresponding transfer manipulator 51 carries the silicon wafer 40 to turn 180 ° to the safety station, so that the silicon wafer 40 is ensured not to interfere with other equipment components, and the safety of the silicon wafer 40 is ensured. Specifically, in one embodiment, the air supply duration of the independent stable air supply of the standby air source 53 is not less than 30s, which is far greater than the sum of the duration of the handover of the transfer manipulator 51 and the time consuming for overturning the transfer manipulator 51, so that the standby air source 53 can still ensure that the transfer manipulator 51 stably adsorbs the silicon wafer 40 after the abnormal air supply of the factory air source 52 occurs in the handover process, and ensure that the silicon wafer 40 does not fall. The comparison analysis of the air supply time period of the stand-by air source 53 alone for stable air supply and the sum of the time period of the transfer robot 51 and the time period of the transfer robot 51 for turning over is described in the previous embodiment, and will not be repeated here.
In one embodiment, in the step of automatically switching to the standby air source 53 as the transfer robot 51, the air supply factory air source 52 and the standby air source 53 are automatically switched by using the pressure difference through the first check valve 542 and the second check valve 543.
Specifically, the plant air source 52 and the standby air source 53 pass through the first check valve 542 before being summarized, and the standby air source 53 and the plant air source 52 pass through the second check valve 543 before being summarized, and the first check valve 542 and the second check valve 543 can be switched by the air pressure difference, so that the automatic switching to the standby air source 53 for air supply can be realized when the plant air source 52 is abnormal. The switching principle and the switching process of the automatic switching between the factory air source 52 and the standby air source 53 by using the pressure difference through the first check valve 542 and the second check valve 543 are described in detail in the above embodiment of the workpiece conveying system, and are not described herein again.
Specifically, in the following, with reference to fig. 7, taking the application of the workpiece conveying system to the laser annealing process, the conveying manipulator 51 adsorbs the silicon wafer 40 from above the silicon wafer 40, and a detailed description is given of a specific implementation process of implementing the workpiece conveying method by using the workpiece conveying system with reference to one conveying cycle.
Firstly, the transmission manipulator 51 moves to the workpiece platform approaching position 61, the first pressure sensor 541 detects the output gas pressure of the factory gas source 52 and sends the output gas pressure to the central control system, the central control system compares the received output gas pressure value with a pre-stored output pressure threshold value, if the output gas pressure value is smaller than the output pressure threshold value, the factory gas source 52 has positive pressure abnormality, the transmission manipulator 51 stops taking sheets and reporting errors, and alarm information is output; if the output gas pressure value is greater than or equal to the output pressure threshold, the factory gas source 52 supplies gas normally and the transfer robot 51 takes a sheet from the workpiece stage 30 and returns to the workpiece stage approach position 61. The transfer robot 51 is retracted to the workpiece stage approaching position 61, the system again detects whether the supply of the factory air source 52 is normal, if the supply of the air is abnormal, the first check valve 542 is closed, the second check valve 543 is opened, and the standby air source 53 is automatically switched to supply the air for the transfer robot 51. Meanwhile, the silicon wafer adsorption direction of the transfer manipulator 51 is obtained, in this embodiment, the transfer manipulator 51 adsorbs the silicon wafer from above the silicon wafer 40, and the transfer manipulator 51 carries the silicon wafer 40 to turn 180 ° to a safety station, so that the transfer manipulator 51 carries the silicon wafer 40 from below the silicon wafer 40, and the silicon wafer 40 is ensured not to fall. Further, if the plant air source 52 supplies air normally, the transfer robot 51 moves to the next station.
Then, the transmission manipulator 51 carries the silicon wafer 40 to move to the position of the second wafer warehouse approaching position 64, the system detects whether the air supply of the factory air source 52 is normal, if the air supply is abnormal, the air source is automatically switched to the standby air source 53, the transmission manipulator 51 carries the silicon wafer 40 to overturn 180 DEG at the position of the second wafer warehouse approaching position 64, and meanwhile, the system reports errors and outputs alarm information; if the air supply is normal, the transfer robot 51 returns to the second magazine access position 64 and moves to the pretreatment access position 62 after placing the sheets in the magazine.
The transmission manipulator 51 moves to the pretreatment approaching position 62, the system detects whether the air supply of the factory air source 52 is normal, and if the air supply is abnormal, the film taking is stopped and the error is reported; if the air supply is normal, the transmission manipulator 51 takes a piece from the pretreatment mechanism 20 and returns to the pretreatment approaching position 62, the system detects whether the air supply of the factory air source 52 is normal again, if the air supply is abnormal, the air source is automatically switched to the standby air source 53, the transmission manipulator 51 carries the silicon wafer 40 at the pretreatment approaching position 62 to turn over 180 degrees, and meanwhile, the system reports errors and outputs alarm information; if the gas supply is normal, the transfer robot 51 moves the wafer 40 to the workpiece stage approach position 61.
The transmission manipulator 51 carries the silicon wafer 40 to move to the workpiece platform approaching position 61, the system detects whether the air supply of the factory air source 52 is normal, if the air supply is abnormal, the air source is automatically switched to the standby air source 53, the transmission manipulator 51 carries the silicon wafer 40 to overturn 180 DEG at the workpiece platform approaching position 61, and meanwhile, the system reports errors and outputs alarm information; if the air supply is normal, the transfer robot 51 withdraws the sheet to the stage 30, returns to the stage approaching position 61 and moves further to the first magazine approaching position 63.
The transmission manipulator 51 moves to the first slice warehouse approaching position 63, the system detects whether the air supply of the factory air source 52 is normal, if the air supply is abnormal, the slice taking is stopped and the error is reported; if the air supply is normal, the transmission manipulator 51 takes the wafer from the wafer warehouse and returns to the first wafer warehouse approaching position 63, the system detects whether the air supply of the factory air source 52 is normal or not again, if the air supply is abnormal, the air source is automatically switched to the standby air source 53, the transmission manipulator 51 carries the silicon wafer 40 at the first wafer warehouse approaching position 63 to turn over 180 degrees, and meanwhile, the system reports errors and outputs alarm information; if the gas supply is normal, the transfer robot 51 moves the wafer 40 to the pretreatment proximity 62.
The transmission manipulator 51 carries the silicon wafer 40 to move to the pretreatment approaching position 62, the system detects whether the air supply of the factory air source 52 is normal, if the air supply is abnormal, the air source is automatically switched to the standby air source 53, the transmission manipulator 51 carries the silicon wafer 40 to overturn 180 DEG at the pretreatment approaching position 62, and meanwhile, the system reports errors and outputs alarm information; if the air supply is normal, the transfer robot 51 places the wafer onto the pretreatment mechanism 20 and returns to the pretreatment access position 62, completing the transfer operation of the silicon wafer 40 for one cycle.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (17)
1. A workpiece transfer system for transferring workpieces between a workpiece store, a pretreatment mechanism (20) and a workpiece stage (30), the workpiece transfer system comprising:
A transfer robot (51), the transfer robot (51) transferring the workpiece between the workpiece storage, the pretreatment mechanism (20) and the workpiece table (30), the transfer robot (51) being connected to a factory air source (52) through a pipeline (54), the transfer robot (51) being configured to enable the workpiece to be in a safe station after an abnormality occurs in the factory air source (52);
A backup air source (53) disposed in parallel with the plant air source (52), the backup air source (53) configured to supply air to the transfer robot (51) when an abnormality occurs in the plant air source (52);
the transmission manipulator (51) is configured to be capable of acquiring a workpiece adsorption direction after the abnormality of the factory air source (52), and if the transmission manipulator (51) adsorbs the workpiece from above the workpiece, the transmission manipulator (51) carries the workpiece to overturn 180 degrees so that the workpiece is in a safety station;
further comprises: a first pressure sensor (541), where the first pressure sensor (541) is disposed on a pipeline (54) between the plant air source (52) and the transfer manipulator (51), and is configured to detect an air supply pressure of the plant air source (52);
The transmission manipulator (51) is configured to carry the workpiece to turn 180 degrees at a preset turning station, and the preset turning station is a position where the transmission manipulator (51) and the workpiece do not interfere with the workpiece storage, the pretreatment mechanism (20) and the workpiece table (30) in the turning process;
When the conveying manipulator (51) carries a workpiece to pass through the preset overturning station, the first pressure sensor (541) is triggered to detect the air supply pressure of the factory air source (52);
When the transmission manipulator (51) does not reach the preset overturning station, the pressure of the factory air source (52) is not detected, and when the transmission manipulator (51) does not reach the preset overturning station, the factory air source (52) is abnormal, and the system only automatically switches the air source to the standby air source (53) to supply air for the transmission manipulator (51) and does not perform operations of acquiring the workpiece adsorption direction and overturning the workpiece by 180 degrees.
2. The workpiece transport system according to claim 1, characterized in that the steady supply of gas from the backup gas source (53) is at least 30s long.
3. Workpiece transfer system according to claim 1, characterized in that the preset turning station is arranged between the transfer robot (51) and the workpiece storage and/or the pretreatment mechanism (20) and/or the workpiece table (30).
4. The workpiece transport system of claim 1, further comprising: the device comprises a first one-way valve (542) and a second one-way valve (543), wherein the first one-way valve (542) is arranged on a pipeline (54) between the factory air source (52) and the transmission manipulator (51), and the second one-way valve (543) is arranged on the pipeline (54) between the standby air source (53) and the transmission manipulator (51).
5. The workpiece transport system of claim 4, further comprising: and the filter triplet (544) is arranged on a pipeline (54) between the standby air source (53) and the second one-way valve (543).
6. The workpiece transport system of claim 1, further comprising: and the dryer (545) is arranged on a pipeline (54) after the plant air source (52) and the standby air source (53) are connected in parallel.
7. The workpiece transport system of claim 1, further comprising: the pressure reducing valve (546) is arranged on a pipeline (54) after the plant air source (52) and the standby air source (53) are connected in parallel.
8. The workpiece transport system of claim 7, further comprising: -a second pressure sensor (547), said second pressure sensor (547) being arranged on a pipeline (54) between said pressure reducing valve (546) and said transfer robot (51).
9. The workpiece transport system of claim 1, further comprising: the device comprises a one-way throttle valve (548) and a flow sensor (549), wherein the one-way throttle valve (548) is arranged on a pipeline (54) formed by connecting a factory air source (52) and a standby air source (53) in parallel, and the flow sensor (549) is arranged on the pipeline (54) between the one-way throttle valve (548) and the transmission manipulator (51).
10. The workpiece transport system according to claim 1, characterized in that the transport robot (51) is a bernoulli robot.
11. A laser annealing apparatus comprising the workpiece conveying system according to any one of claims 1 to 10.
12. A workpiece conveying method, characterized by being applied to the workpiece conveying system according to any one of claims 1 to 10, comprising the following air supply abnormality processing steps: when the air supply of the factory air source (52) is abnormal, the factory air source is automatically switched to the standby air source (53) to supply air for the transmission manipulator (51), and the transmission manipulator (51) enables the workpiece to be in a safe station.
13. The workpiece transfer method of claim 12, wherein the step of the transfer robot (51) bringing the workpiece to a safe station comprises: and acquiring the workpiece adsorption direction, wherein when the conveying manipulator (51) adsorbs the workpiece from the upper part of the workpiece, the conveying manipulator (51) carries the workpiece to overturn 180 degrees so that the workpiece is in a safety station.
14. The workpiece transfer method of claim 12, further comprising, prior to the air supply abnormality processing step:
And detecting whether the output pressure of the plant air source (52) is lower than an output pressure threshold value or not when the transmission manipulator (51) moves to a preset overturning station, and executing the air supply abnormality processing step when the output pressure of the plant air source (52) is lower than the output pressure threshold value.
15. The workpiece conveying method according to claim 14, wherein the preset turning station is a position where the conveying manipulator (51) and the workpiece do not interfere with a workpiece storage, a pretreatment mechanism (20) and a workpiece table (30) in the process of turning the workpiece carried by the conveying manipulator (51).
16. The workpiece transport method of claim 14, further comprising the steps of: if the plant air source (52) is abnormal in air supply when the transmission manipulator (51) does not move to the preset overturning station, the automatic switching is performed to the standby air source (53) to supply air for the transmission manipulator (51).
17. The workpiece transfer method according to claim 12 or 16, characterized in that in the step of automatically switching to the standby air source (53) for supplying air to the transfer robot (51), the automatic switching is achieved between the factory air source (52) and the standby air source (53) by means of a pressure difference through a first one-way valve (542) and a second one-way valve (543).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910522660.9A CN112103206B (en) | 2019-06-17 | 2019-06-17 | Workpiece conveying system, workpiece conveying method and laser annealing equipment |
| TW109120465A TWI743840B (en) | 2019-06-17 | 2020-06-17 | Work piece transmission system, work piece transmission method and laser annealing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910522660.9A CN112103206B (en) | 2019-06-17 | 2019-06-17 | Workpiece conveying system, workpiece conveying method and laser annealing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112103206A CN112103206A (en) | 2020-12-18 |
| CN112103206B true CN112103206B (en) | 2024-09-27 |
Family
ID=73748541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910522660.9A Active CN112103206B (en) | 2019-06-17 | 2019-06-17 | Workpiece conveying system, workpiece conveying method and laser annealing equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112103206B (en) |
| TW (1) | TWI743840B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004235622A (en) * | 2003-01-09 | 2004-08-19 | Disco Abrasive Syst Ltd | Transport apparatus for plate-like object |
| CN203064799U (en) * | 2013-01-22 | 2013-07-17 | 帕圣科技发展(上海)有限公司 | Protection system of glass carrying device |
| JP2018083244A (en) * | 2016-11-22 | 2018-05-31 | 株式会社ディスコ | Spindle unit |
| WO2018207599A1 (en) * | 2017-05-11 | 2018-11-15 | ローツェ株式会社 | Thin-plate substrate holding finger and transfer robot provided with said finger |
| CN209747480U (en) * | 2019-06-17 | 2019-12-06 | 上海微电子装备（集团）股份有限公司 | Workpiece conveying system and laser annealing equipment |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3691434B2 (en) | 2001-12-25 | 2005-09-07 | 本田技研工業株式会社 | Landing shock absorber for legged mobile robot |
| JP2008124091A (en) * | 2006-11-09 | 2008-05-29 | Fuji Electric Device Technology Co Ltd | Treatment apparatus and treatment method of semiconductor device |
| JP5952526B2 (en) * | 2011-02-04 | 2016-07-13 | 株式会社ダイヘン | Work transfer system |
| CN104011845B (en) * | 2011-10-26 | 2018-05-11 | 布鲁克斯自动化公司 | Semiconductor wafer is carried and transport |
| JP5777549B2 (en) * | 2012-03-23 | 2015-09-09 | 東京エレクトロン株式会社 | Peeling apparatus, peeling system, peeling method, program, and computer storage medium |
| JP5717803B2 (en) * | 2013-07-04 | 2015-05-13 | 東京エレクトロン株式会社 | Peeling system, peeling method, program, and computer storage medium |
| CN104626207B (en) * | 2013-11-13 | 2017-01-11 | 沈阳新松机器人自动化股份有限公司 | internal pressure explosion-proof system of industrial robot |
| JP5877859B2 (en) * | 2014-03-12 | 2016-03-08 | ファナック株式会社 | Robot system for taking out workpieces stacked in bulk and determination method for determining gripping state of workpieces |
| JP2017123425A (en) * | 2016-01-08 | 2017-07-13 | 株式会社日立国際電気 | Substrate processing apparatus, semiconductor device manufacturing method, program and recording medium |
| CN106115270B (en) * | 2016-08-29 | 2018-12-11 | 北京京城清达电子设备有限公司 | A kind of air bearing vacuum suction carrying device |
| CN106671055B (en) * | 2016-12-14 | 2023-03-14 | 中航西安飞机工业集团股份有限公司 | Power-assisted manipulator and control system thereof |
| US10903107B2 (en) * | 2017-07-11 | 2021-01-26 | Brooks Automation, Inc. | Semiconductor process transport apparatus comprising an adapter pendant |
| CN208744886U (en) * | 2018-08-14 | 2019-04-16 | 大科机械(厦门)有限公司 | A kind of time-delay mechanism of dying of air assisted manipulator |
-
2019
- 2019-06-17 CN CN201910522660.9A patent/CN112103206B/en active Active
-
2020
- 2020-06-17 TW TW109120465A patent/TWI743840B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004235622A (en) * | 2003-01-09 | 2004-08-19 | Disco Abrasive Syst Ltd | Transport apparatus for plate-like object |
| CN203064799U (en) * | 2013-01-22 | 2013-07-17 | 帕圣科技发展(上海)有限公司 | Protection system of glass carrying device |
| JP2018083244A (en) * | 2016-11-22 | 2018-05-31 | 株式会社ディスコ | Spindle unit |
| WO2018207599A1 (en) * | 2017-05-11 | 2018-11-15 | ローツェ株式会社 | Thin-plate substrate holding finger and transfer robot provided with said finger |
| CN209747480U (en) * | 2019-06-17 | 2019-12-06 | 上海微电子装备（集团）股份有限公司 | Workpiece conveying system and laser annealing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI743840B (en) | 2021-10-21 |
| CN112103206A (en) | 2020-12-18 |
| TW202100434A (en) | 2021-01-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20090004426A (en) | Transfer system, transferring method and transfer vehicle | |
| CN102064123A (en) | Vacuum processing system and vacuum processing method of semiconductor processing substrate | |
| US11682571B2 (en) | Apparatus and methods for handling die carriers | |
| US20140075774A1 (en) | Semiconductor apparatus with inner wafer carrier buffer and method | |
| KR100856587B1 (en) | Automatic guided vehicle | |
| CN209747480U (en) | Workpiece conveying system and laser annealing equipment | |
| KR20160050948A (en) | aging method of Apparatus for Processing Substrate and Substrate Processing system | |
| CN112103206B (en) | Workpiece conveying system, workpiece conveying method and laser annealing equipment | |
| TW201347935A (en) | Robot system | |
| CN101615025B (en) | Maintenance control method and system used for semiconductor processing equipment | |
| CN108807247B (en) | Graphite boat connection caching method | |
| TW202014693A (en) | Apparatus and methods for semiconductor fabrication | |
| US20240071799A1 (en) | System for a semiconductor fabrication facility and method for operating the same | |
| CN210069488U (en) | Gas supply system | |
| JP4820008B2 (en) | To-be-processed object transfer system and to-be-processed object transfer method | |
| JP2505915B2 (en) | Substrate transfer device | |
| KR20100040999A (en) | Wafer centering method | |
| KR102166968B1 (en) | Processing method and processing device | |
| US20220181178A1 (en) | Correction method and substrate transfer apparatus | |
| JPS59128125A (en) | Loader unloader | |
| JP2004319889A (en) | Manufacturing-object delivering apparatus and method | |
| KR100652286B1 (en) | System for carrying wafer cassette carrier | |
| KR102641232B1 (en) | Substrate processing system and control method of the substrate processing system | |
| US20220148857A1 (en) | Detection device, processing system, and transfer method | |
| US20230187247A1 (en) | Detection system, detection method, and storage medium |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |