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CN112074078A - Rigid-flexible circuit board for 200G light receiving device - Google Patents

Rigid-flexible circuit board for 200G light receiving device Download PDF

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Publication number
CN112074078A
CN112074078A CN202010961001.8A CN202010961001A CN112074078A CN 112074078 A CN112074078 A CN 112074078A CN 202010961001 A CN202010961001 A CN 202010961001A CN 112074078 A CN112074078 A CN 112074078A
Authority
CN
China
Prior art keywords
layer
board
fpc
hard
soft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010961001.8A
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Chinese (zh)
Inventor
周俊文
周书刚
陈新鹏
黄劲威
翟因敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujian ZK Litecore Ltd
Original Assignee
Fujian ZK Litecore Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujian ZK Litecore Ltd filed Critical Fujian ZK Litecore Ltd
Priority to CN202010961001.8A priority Critical patent/CN112074078A/en
Publication of CN112074078A publication Critical patent/CN112074078A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298Multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention relates to a soft and hard combined circuit board for a 200G light receiving device, which comprises an N-path bare DIE TIA chip, N PD arrays, a plurality of routing capacitors and a soft and hard combined board; the PD array transmits the received signal to a TIA chip, and the TIA chip converts the signal and transmits the signal to a mainboard signal processing chip; the PD array and the TIA chip are arranged on a hard board of the soft and hard combination board, and the signals are transmitted on the flexible board. The circuit board is simple in manufacturing process, and can effectively avoid possible transmission instability caused by extrusion of the electric signal wire.

Description

Rigid-flexible circuit board for 200G light receiving device
Technical Field
The invention relates to the field of optical fiber communication, in particular to a rigid-flexible circuit board for a 200G light receiving device.
Background
The circuit board is used as a key component in various electronic products, and has a great influence on the performance of the electronic products. With the development of electronic products toward miniaturization and multi-functionalization, the requirements for circuit boards are increasing, multilayer circuit boards are being used in various applications, and the number of layers in the multilayer circuit boards is still increasing, from four layers, six layers to eight layers, or even more. In the manufacturing process of the conventional circuit board, the signal loss caused by the uncontrollable thickness, width and shape of the solder and the soldering alignment deviation of the bonding pad is large, which causes the instability of the possible transmission.
Disclosure of Invention
In view of the above, the present invention provides a rigid-flex circuit board for a 200G light receiving device, which can effectively avoid the extrusion of electrical signal wires, resulting in possible transmission instability.
In order to achieve the purpose, the invention adopts the following technical scheme:
a soft and hard combined circuit board for a 200G light receiving device comprises an N-path bare DIE TIA chip, N PD arrays, a plurality of routing capacitors and a soft and hard combined board; the PD array transmits the received signal to a TIA chip, and the TIA chip converts the signal and transmits the signal to a mainboard signal processing chip; the PD array and the TIA chip are arranged on a hard board of the soft and hard combination board, and the signals are transmitted on the flexible board.
Further, the rigid-flex board is a rigid-flex board with 6 layers.
Further, the laminated structure of the 6 layers of rigid-flex boards specifically includes:
the TOP layer is a hard board and is a BONDING area of TIA and PD;
the second layer and the third layer are combined together to form a flexible board for transmitting high-speed radio-frequency signals, wherein 4 pairs of high-speed differential signal lines are arranged on the second layer, and the third layer is a complete ground plane;
the fourth layer to the fifth layer are combined to form a flexible plate for low-speed electric signal transmission and power supply;
the BOTTOM layer is a hard board, and the soft and hard combination board and the assembly shell are tightly attached together.
Furthermore, an epoxy resin layer is arranged between the third layer and the fourth layer of the 6 soft and hard combined board.
Furthermore, the BONDING area is subjected to nickel-palladium-gold surface treatment, wherein the thickness of palladium is 0.2um, and the thickness of gold is 0.05 um.
Furthermore, the TOP layer is provided with laser blind holes, the high-speed signal line is switched from the TOP layer to the second layer through the laser blind holes, and a pair of ground holes is arranged on the periphery of each laser blind hole.
Furthermore, the BOTTOM layer is a bare flat copper sheet.
Further, the soft board covering film penetrates into the hard board area to be larger than 0.5mm in the soft board combining part of the soft board and the hard board; the soft board extends out of the hard board part and is provided with a part which is longer than 1mm and can not be bent.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention adopts the flexible board to transmit high-speed radio frequency signals, and is directly connected with the PCB. Compared with a pure hard board circuit, the method reduces one-time welding process, and reduces signal loss caused by uncontrollable thickness, width and shape of tin on welding and welding alignment deviation of a welding pad;
2. the BOTTOM layer hard board is a copper sheet which is flat and smooth in whole board without covering green oil, placing devices and routing. Firstly, the coupling and alignment of the optical paths are more facilitated; secondly, the heat dissipation is enhanced, and the chip work and the signal transmission are more stable; thirdly, because the BOTTOM needs to be tightly attached to the shell, the design can avoid the extrusion of the electric signal line to cause the instability of possible transmission.
Drawings
FIG. 1 is a schematic diagram of a rigid-flex circuit board for a 200G light-receiving device according to an embodiment of the present invention;
fig. 2 is a schematic view of a laminated structure of 6 layers of rigid-flex boards according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a TOP layer of a rigid-flex board according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a second layer of the rigid-flex board according to an embodiment of the present invention;
FIG. 5 is a schematic view of a third layer of the rigid-flex circuit board according to an embodiment of the invention;
FIG. 6 is a diagram illustrating a fourth layer of the rigid-flex board according to an embodiment of the present invention;
FIG. 7 is a fifth layer of the rigid-flex circuit board according to an embodiment of the present invention;
fig. 8 is a schematic diagram of a sixth layer of the rigid-flex board in an embodiment of the invention.
Detailed Description
The invention is further explained below with reference to the drawings and the embodiments.
Referring to fig. 1, the present embodiment provides a rigid-flex circuit board for a 200G optical receiver, including a 4-channel bare DIE TIA chip, 4 PD arrays, a plurality of wire bonding capacitors, and a 6-layer rigid-flex board;
in this embodiment, 4 paths of light transmitted from an external optical path, which carries a 50G-PAM4 signal, are converted into photocurrent by a PIN photodiode, transmitted to a TIA chip by a gold wire, converted into four paths of differential voltage signals by the TIA, and transmitted to a motherboard signal processing chip. The TIA and PD chips related in the embodiment are assembled on a hard board of a circuit board; the high-speed signal line is transmitted on the flexible board and is linked to the main board through the flexible board; the low speed electrical control signal and the power supply are transmitted on the other flexible board.
Preferably, in this embodiment, it is vertical that the rigid-flex board is a rigid-flex board with 6 layers, and the laminated structure specifically includes:
the TOP layer is a hard board and is a BONDING area of TIA and PD;
the second layer and the third layer are combined together to form a flexible board for transmitting high-speed radio-frequency signals, wherein 4 pairs of high-speed differential signal lines are arranged on the second layer, and the third layer is a complete ground plane and is a reference plane of the high-speed signal transmission line of the second layer, so that the impedance continuity of the high-speed signal transmission line is ensured;
the fourth layer to the fifth layer are combined to form a flexible plate for low-speed electric signal transmission and power supply;
the BOTTOM layer is a hard board, and the soft and hard combination board and the assembly shell are tightly attached together.
Preferably, in this embodiment, an epoxy resin layer is disposed between the third layer and the fourth layer of the 6-layer rigid-flex printed circuit board. First in order to guarantee the alignment of the optical chip on the PCB and rear end light path, on the other hand is in order to separate two flexible boards, the bending behind convenient contact mainboard PCB.
In this embodiment, the BONDING region is subjected to nickel-palladium-gold surface treatment, with palladium thickness of 0.2um and gold thickness of 0.05um, so that flatness of the BONDING region is ensured, alignment of a rear-end optical path is facilitated, and optical path coupling loss is reduced;
in this embodiment, because the power consumption of the TIA chip is large, a certain number of through holes need to be drilled to remove heat from the bottom layer, and the working reliability of the chip and the stability of signal transmission are maintained.
In this embodiment, the TOP layer is provided with laser blind holes, the high-speed signal line is switched from the TOP layer to the second layer through the laser blind holes, and in order to ensure the impedance continuity of the high-speed signal transmission line and reduce the signal return area, a pair of ground holes is arranged on the periphery of each laser blind hole.
In this embodiment, the BOTTOM layer is a bare flat copper sheet, no signal line is needed, no device is placed, and no green oil is covered, so that the BOTTOM layer is convenient to attach to the wall of the housing, and the BOTTOM layer is used for enhancing heat dissipation.
In the embodiment, the soft board covering film penetrates into the hard board area to be more than 0.5mm in the soft board combining part of the soft board and the hard board; the soft board extends out of the hard board part and is provided with a part which is longer than 1mm and can not be bent.
The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made in accordance with the claims of the present invention should be covered by the present invention.

Claims (8)

1. A soft and hard combined circuit board for a 200G light receiving device is characterized by comprising N paths of TIA chips of bare DIE, N PD arrays, a plurality of routing capacitors and a soft and hard combined board; the PD array transmits the received signal to a TIA chip, and the TIA chip converts the signal and transmits the signal to a mainboard signal processing chip; the PD array and the TIA chip are arranged on a hard board of the soft and hard combination board, and the signals are transmitted on the flexible board.
2. The FPC of claim 1, wherein the FPC is a 6-layer rigid-flex board.
3. The FPC of claim 1, wherein the laminated structure of the 6-layer FPC specifically comprises:
the TOP layer is a hard board and is a BONDING area of TIA and PD;
the second layer and the third layer are combined together to form a flexible board for transmitting high-speed radio-frequency signals, wherein 4 pairs of high-speed differential signal lines are arranged on the second layer, and the third layer is a complete ground plane;
the fourth layer to the fifth layer are combined to form a flexible plate for low-speed electric signal transmission and power supply;
the BOTTOM layer is a hard board, and the soft and hard combination board and the assembly shell are tightly attached together.
4. The FPC of claim 3, wherein an epoxy layer is disposed between the third layer and the fourth layer of the 6-layer FPC.
5. The FPC of claim 3, wherein the BONDING region is subjected to NiPdAu surface treatment, wherein Pd is 0.2 μm thick and Au is 0.05 μm thick.
6. The rigid-flex circuit board for 200G light-receiving device as claimed in claim 3, wherein the TOP layer is provided with laser blind holes, the high-speed signal lines are switched from the TOP layer to the second layer through the laser blind holes, and each laser blind hole is provided with a pair of ground holes on the periphery side.
7. The FPC of claim 3, wherein the BOTTOM layer is a bare flat copper sheet.
8. The FPC of claim 1, wherein the FPC/FPC board has a FPC-bonding portion, and the FPC/FPC cover film extends more than 0.5mm into the FPC area; the soft board extends out of the hard board part and is provided with a part which is longer than 1mm and can not be bent.
CN202010961001.8A 2020-09-14 2020-09-14 Rigid-flexible circuit board for 200G light receiving device Pending CN112074078A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010961001.8A CN112074078A (en) 2020-09-14 2020-09-14 Rigid-flexible circuit board for 200G light receiving device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010961001.8A CN112074078A (en) 2020-09-14 2020-09-14 Rigid-flexible circuit board for 200G light receiving device

Publications (1)

Publication Number Publication Date
CN112074078A true CN112074078A (en) 2020-12-11

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CN (1) CN112074078A (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170139162A1 (en) * 2015-11-16 2017-05-18 Electronics And Telecommunications Research Institute Multi-channel receiver optical sub-assembly and manufacturing method thereof
CN106961799A (en) * 2017-04-28 2017-07-18 无锡市同步电子科技有限公司 A kind of high speed Rigid Flex method for designing
CN107896418A (en) * 2017-10-10 2018-04-10 青岛海信宽带多媒体技术有限公司 A kind of optical module
CN108494495A (en) * 2018-05-07 2018-09-04 深圳市迅特通信技术有限公司 A kind of miniaturization hot plug high speed optical receiver module
CN109757022A (en) * 2017-11-01 2019-05-14 健鼎(无锡)电子有限公司 Flexible-rigid compound circuit board and its manufacturing method
US20190364184A1 (en) * 2016-12-23 2019-11-28 Ningbo Sunny Opotech Co., Ltd. Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module
CN209731254U (en) * 2019-05-29 2019-12-03 广东瑞谷光网通信股份有限公司 A kind of multichannel QSFP DD optical module
CN111308620A (en) * 2020-03-20 2020-06-19 青岛海信宽带多媒体技术有限公司 Optical module
CN211240263U (en) * 2019-12-11 2020-08-11 武汉精立电子技术有限公司 Rigid-flex board and electronic equipment comprising same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170139162A1 (en) * 2015-11-16 2017-05-18 Electronics And Telecommunications Research Institute Multi-channel receiver optical sub-assembly and manufacturing method thereof
US20190364184A1 (en) * 2016-12-23 2019-11-28 Ningbo Sunny Opotech Co., Ltd. Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module
CN106961799A (en) * 2017-04-28 2017-07-18 无锡市同步电子科技有限公司 A kind of high speed Rigid Flex method for designing
CN107896418A (en) * 2017-10-10 2018-04-10 青岛海信宽带多媒体技术有限公司 A kind of optical module
CN109757022A (en) * 2017-11-01 2019-05-14 健鼎(无锡)电子有限公司 Flexible-rigid compound circuit board and its manufacturing method
CN108494495A (en) * 2018-05-07 2018-09-04 深圳市迅特通信技术有限公司 A kind of miniaturization hot plug high speed optical receiver module
CN209731254U (en) * 2019-05-29 2019-12-03 广东瑞谷光网通信股份有限公司 A kind of multichannel QSFP DD optical module
CN211240263U (en) * 2019-12-11 2020-08-11 武汉精立电子技术有限公司 Rigid-flex board and electronic equipment comprising same
CN111308620A (en) * 2020-03-20 2020-06-19 青岛海信宽带多媒体技术有限公司 Optical module

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Application publication date: 20201211