CN112053995A - Optical sensing chip package structure - Google Patents
Optical sensing chip package structure Download PDFInfo
- Publication number
- CN112053995A CN112053995A CN201910485023.9A CN201910485023A CN112053995A CN 112053995 A CN112053995 A CN 112053995A CN 201910485023 A CN201910485023 A CN 201910485023A CN 112053995 A CN112053995 A CN 112053995A
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- light
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- optical sensing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
An optical sensing chip package structure includes a substrate, an optical sensing element, a light emitting element, a transparent adhesive layer and a transparent cover plate. The light sensing element is arranged on the substrate. The light emitting element is arranged on the light sensing element and is provided with a light emitting surface. The transparent adhesive layer is arranged on the light-emitting element and contacts and covers the light-emitting surface. The transparent cover plate is arranged on the transparent adhesive layer.
Description
Technical Field
The present invention relates to a chip package structure; in particular, to an optical sensing chip package structure.
Background
Fig. 1 is a schematic structural diagram of a conventional optical sensing chip package structure 100, which is composed of a substrate 120, an optical sensing device 140 and a light emitting device 160, wherein the light emitting device 160 is separated from the substrate 120 and the optical sensing device 140. The photo sensor 140 is disposed on the substrate 120. The light emitting device 160 is used to emit light to a target O, and the target O reflects the light to the photo sensing device 140; by the optical sensor chip package 100, it is able to sense whether the object O is in front of the optical sensor chip package 100; alternatively, the optical sensing die package 100 can be used to detect the movement of the object O relative to the optical sensing die package 100. Thus, the optical sensor chip package 100 can be applied to optical scales, servo motors, and the like. However, the photo sensing element 140 of the optical sensing chip package structure 100 is directly exposed to the outside, and therefore, it is easy to be stained with dust or dirt, resulting in a misalignment of the sensing result of the photo sensing element 140.
To solve the above problems, there is also shown in fig. 2 another conventional optical sensing chip package structure 200, which is composed of a substrate 220, a photo sensing device 240, a light emitting device 260 and a transparent cover 280. The photo sensor 240 is disposed on the substrate 220; the light emitting device 260 is disposed on the photo sensing device 240; the transparent cover 280 is disposed on the light emitting device 260 for protecting the light emitting device 260 and the light sensing device 240. Unlike the optical sensing chip package 100, the conventional optical sensing chip package 200 integrates the substrate 220, the optical sensing device 240, the light emitting device 260 and the transparent cover 280 together, thereby reducing the volume of the optical sensing chip package 200 and improving the optical sensing path, while preventing dust or dirt from contaminating the optical sensing device 240 and the light emitting device 260.
However, there is an air gap 270 between the transparent cover 280 and the light emitting device 260, when the light emitting device 260 emits the light L outwards, the light L will be significantly refracted and reflected at the interface between the gap 270 and the transparent cover 280, resulting in loss of light energy, and the reflected light R will be incident into the photo sensing device 240, resulting in significant noise, which further affects the resolution and accuracy of the conventional optical sensing chip package structure 200.
In summary, the problems of the conventional optical sensing device still remain to be overcome.
Disclosure of Invention
In view of the above, an object of the present invention is to provide an optical sensing chip package structure, which has a transparent adhesive layer disposed between a light emitting device and a transparent cover plate, wherein the transparent adhesive layer contacts the light emitting device, so as to reduce light energy loss and prevent dust from contaminating the light sensing device and the light emitting device.
The present invention provides an optical sensing chip package structure, which includes a substrate, an optical sensing device, a light emitting device, a transparent adhesive layer and a transparent cover plate. The optical sensing element is arranged on the substrate and electrically connected with the substrate. The light-emitting element is arranged on the light sensing element and electrically connected with the substrate or the light sensing element, and the light-emitting element is provided with a light-emitting surface. The transparent adhesive layer is arranged on the light-emitting element and contacts and covers the light-emitting surface. The transparent cover plate is arranged on the transparent adhesive layer and is contacted with the transparent adhesive layer.
Another object of the present invention is to provide an optical sensing chip package structure, which includes a substrate, an optical sensing device, a light emitting device, a transparent focusing lens and a transparent cover plate. The optical sensing element is arranged on the substrate and electrically connected with the substrate. The light-emitting element is arranged on the light sensing element and electrically connected with the substrate or the light sensing element, and the light-emitting element is provided with a light-emitting surface. The transparent focusing lens is arranged on the light-emitting element and contacts and covers the light-emitting surface. The transparent cover plate is arranged on the transparent focusing lens.
The invention has the advantages that the transparent adhesive layer is contacted with the light-emitting surface of the light-emitting element and the transparent cover plate, the light emitted by the light-emitting surface is transmitted out through the transparent adhesive layer and the transparent cover plate, and no air gap exists between the transparent adhesive layer and the transparent cover plate, so that the reflectivity of the transparent cover plate to the light and the loss of light energy formed by refraction can be reduced. In addition, the transparent cover plate can also prevent dust from polluting the light sensing element and the light emitting element. On the other hand, the transparent focusing lens is disposed on the light-emitting element and contacts and covers the light-emitting surface to prevent dust or dirt in the air from blocking the light-emitting surface of the light-emitting element. The transparent focusing lens is used to convert the divergent light emitted from the light-emitting device into parallel light beams, thereby achieving the effect of reducing light noise and reducing light energy loss.
Drawings
FIG. 1 is a diagram illustrating a conventional optical sensor chip package;
FIG. 2 is a block diagram of another conventional optical sensor chip package;
FIG. 3 is a diagram illustrating a structure of an optical sensor chip package according to a first embodiment of the present invention;
FIG. 4a is a schematic view of a shape of a transparent adhesive layer according to a first embodiment of the present invention;
FIG. 4b is a schematic view of another transparent adhesive layer according to the first embodiment of the present invention;
FIG. 4c is a schematic view of a shape of another transparent adhesive layer according to the first embodiment of the present invention;
FIG. 5 is a diagram illustrating a second embodiment of an optical sensor chip package according to the present invention;
FIG. 6 is a diagram illustrating a third embodiment of an optical sensor chip package according to the present invention;
FIG. 7 is a diagram illustrating an optical sensor chip package according to a fourth embodiment of the present invention;
FIG. 8 is a diagram illustrating an optical sensor chip package according to a fifth embodiment of the present invention;
FIG. 9 is a diagram illustrating an optical sensor chip package according to a sixth embodiment of the present invention.
Detailed Description
In order to more clearly illustrate the present invention, a preferred embodiment will be described in detail below with reference to the accompanying drawings. Referring to fig. 3, an optical sensing chip package structure 300a according to a first preferred embodiment of the invention includes a substrate 520, a photo sensing device 340, a light emitting device 360, a transparent adhesive layer 370 and a transparent cover 380. In the present embodiment, the substrate 520 may be a circuit substrate; the photo sensing device 340 is disposed on the substrate 520 and electrically connected to the substrate 520.
The light emitting device 360 is disposed on the photo sensing device 340 and electrically connected to the substrate 520 or the photo sensing device 340. In the embodiment of the present invention, the light emitting device 360 has a light emitting surface 362, and the light sensing device 340 is used for sensing the light emitted by the light emitting device 360. In one application of the present embodiment, the optical sensor chip package 300a can be used to sense whether an object is located in front of the optical sensor chip package 300a, or the optical sensor chip package 300a can be used to detect whether an object moves relative to the optical sensor chip package 300a, and can be used as an optical ruler, a servo motor, and the like. In the embodiment of the invention, the light emitting device 360 is a point light source, such as a light emitting diode or a laser light source, but not limited thereto. In the embodiment of the invention, the light-emitting angle θ of the light-emitting element 360 is less than or equal to 150 degrees. In addition, in the embodiment of the present invention, the light emitting surface 362 of the light emitting device 360 is substantially the same as the light sensing surface 342 of the light sensing device 340, so that when the light emitted from the light emitting surface 362 of the light emitting device 360 encounters a target to be reflected, the incident light and the reflected light can have a smaller angle to obtain a more accurate measurement value.
The transparent adhesive layer 370 is disposed on the light emitting element 360 and contacts and covers the light emitting surface 362, so as to prevent dust or dirt in the air from blocking the light emitting surface 362 of the light emitting element 360. In the embodiment of the present invention, the material of the transparent adhesive layer 370 includes, but is not limited to, silicone, acrylic, or a combination thereof.
In the first embodiment of the present invention, as shown in FIG. 3, the substrate 520 of the optical sensing chip package structure 300a includes a bottom plate 522 and a retaining wall 530. The bottom plate 522 and the wall 530 form a receiving space 530a, and the top of the wall 530 includes a contact 532a and a contact 532 b. The photo sensing device 340, the light emitting device 360 and the transparent adhesive layer 370 are disposed in the accommodating space 530a and are covered on the substrate 520 by the transparent cover 380. The light emitting device 360 is connected to a wire 540, one end of the wire 540 is connected to the light emitting device 360, and the other end is connected to the contact 532a, so that the light emitting device 360 is electrically connected to the substrate 520. In addition, the photo sensing device 340 is connected to a conducting wire 541, one end of the conducting wire 541 is connected to the photo sensing device 340, and the other end thereof is connected to the contact 532b, so that the photo sensing device 340 is electrically connected to the substrate 520. In the first embodiment of the present invention, a portion of the conductive wire 540 is covered by the transparent adhesive layer 370.
The transparent cover 380 is a transparent plate disposed on the transparent adhesive layer 370, and the transparent plate can directly or indirectly contact the transparent adhesive layer 370, in this embodiment, the transparent plate and the transparent adhesive layer are in direct contact.
In an embodiment of the present invention, the difference between the refractive index of the transparent adhesive layer 370 and the refractive index of the transparent cover 380 is less than 0.5; for example, when the material of the transparent adhesive layer 370 is silicon or acryl adhesive, the refractive index of the transparent adhesive layer 370 is about 1.4, and when the material of the transparent cover plate 380 is glass, the refractive index of the transparent cover plate 380 is about 1.5. In a preferred embodiment of the present invention, the refractive index of the transparent adhesive layer 370 is substantially the same as the refractive index of the transparent cover 380; for example, when the transparent adhesive layer 370 and the transparent cover 380 are made of silicone or acrylic, the refractive indexes of the transparent adhesive layer 370 and the transparent cover 380 are about 1.4. In addition, since the difference between the refractive index of the transparent adhesive layer 370 and the refractive index of the transparent cover 380 is less than 0.5 or approximately the same, when the transparent adhesive layer 370 and the transparent cover 380 are in direct contact, the reflectivity of the interface between the transparent adhesive layer 370 and the transparent cover 380 is less than 4%, preferably less than 2%. Compared to the reflectivity of the conventional optical sensor chip package structure 200 shown in fig. 2 being about 8%, the optical sensor chip package structure 300a provided by the embodiment of the present invention has a smaller reflectivity by the transparent adhesive layer 370 directly or indirectly contacting the transparent cover plate 380, and the light path is not changed due to an excessive difference in the refractive index, so as to improve the noise problem of the conventional optical sensor chip package structure 200, and further provide a preferable resolution and precision. No air bubbles exist inside the transparent adhesive layer 370, so as to prevent the light from being refracted inside the transparent adhesive layer 370.
The transparent adhesive layer 370 according to the first to fifth embodiments of the present invention may have different shapes as shown in fig. 4a, 4b and 4 c. In fig. 4a, the width of the upper and lower edges of the transparent adhesive layer 370a is W, and the width of the middle section thereof is W1, wherein W is greater than W1. In fig. 4b, the width of the upper and lower edges of the transparent adhesive layer 370b is W, and the width of the middle section thereof is W2, where W is equal to W2. In fig. 4c, the width of the upper and lower edges of the transparent adhesive layer 370c is W, and the width of the middle section thereof is W3, wherein W is smaller than W3. It should be noted that, compared to the transparent adhesive layers 370b and 370c, the connection strength between the transparent adhesive layer 370a and the light emitting device 360 and the transparent cover 380 is strongest and does not affect the light sensing effect of the light sensing device 340. Preferably, the transparent adhesive layers 370a, 370b, 370c are only located within the front projection range of the light emitting element 360 and do not exceed the front projection range of the light emitting element 360, so as to avoid blocking the light sensing surface 342 of the sensing element 340.
Referring to fig. 5, the optical sensor chip package structure 300b according to the second embodiment of the invention further includes a transparent cover plate 380 including a first anti-reflection layer 420 plated on a lower surface of a transparent plate 382 of the transparent cover plate 380 such that the first anti-reflection layer 420 faces the transparent adhesive layer 370, and the transparent adhesive layer 370 is in direct contact with the first anti-reflection layer 420, i.e., the transparent adhesive layer 370 is in indirect contact with the transparent plate 382 through the first anti-reflection layer 420.
In the second embodiment of the present invention, as shown in FIG. 5, the substrate 520 of the optical sensing chip package 300b includes a bottom plate 522 and a retaining wall 530. The bottom plate 522 and the wall 530 form a receiving space 530a, and the top of the wall 530 includes a contact 532 b. The photo sensing device 340, the light emitting device 360 and the transparent adhesive layer 370 are disposed in the accommodating space 530a and are covered on the substrate 520 by the transparent cover 380. The light emitting device 360 is connected to a conductive wire 540, one end of the conductive wire 540 is connected to the light emitting device 360, the other end of the conductive wire 540 is connected to a contact 532a, and the contact 532a is located on the photo sensing device 340, so that the light emitting device 360 is electrically connected to the photo sensing device 340. In addition, the photo sensing device 340 is connected to a conducting wire 541, one end of the conducting wire 541 is connected to the contact 532c on the photo sensing device 340, and the other end thereof is connected to the contact 532b at the top of the blocking wall 530, so that the photo sensing device 340 is electrically connected to the substrate 520. In the second embodiment of the present invention, a portion of the conductive wire 540 is covered by the transparent adhesive layer 370.
Referring to fig. 6, the transparent cover plate 380 of the optical sensing chip package structure 300c according to the third embodiment of the present invention includes a second anti-reflection layer 440, wherein the second anti-reflection layer 440 is plated on the upper surface of the transparent plate 382 of the transparent cover plate 380, such that the second anti-reflection layer 440 faces away from the transparent adhesive layer 370. In practice, the lower surface and the upper surface of the transparent plate 382 may be coated with the first anti-reflection layer 420 and the second anti-reflection layer 440, respectively. By disposing the first anti-reflection layer 420 and the second anti-reflection layer 440, the reflectivity of the transparent cover 380 of the optical sensor chip package 300c can be further reduced, thereby providing better resolution and accuracy.
Referring to fig. 7, in the fourth embodiment of the invention, the substrate 520 of the optical sensing chip package structure 300d includes a bottom plate 522 and a retaining wall 530. The bottom plate 522 and the retaining wall 530 form an accommodating space 530a, and the photo sensing element 340, the light emitting element 360 and the transparent adhesive layer 370 are located in the accommodating space 530a and are covered on the retaining wall 530 of the substrate 520 by the transparent cover 380. Base plate 522 includes contacts 524a and 524 b. Wherein, the light sensing element 340 is connected with a conducting wire 541, one end of the conducting wire 541 is connected to the light sensing element 340, and the other end thereof is connected to the contact 524b, so that the light sensing element 340 is electrically connected with the substrate 520; the light emitting device 360 is connected to a wire 540, one end of the wire 540 is connected to the light emitting device 360, and the other end is connected to the contact 524a, so that the light emitting device 360 is electrically connected to the substrate 520.
In the fifth embodiment of the present invention, as shown in FIG. 8, the substrate 520 of the optical sensing chip package structure 300e includes a bottom plate 522 and a retaining wall 530. The bottom plate 522 and the retaining wall 530 form an accommodating space 530a, and the photo sensing element 340, the light emitting element 360 and the transparent adhesive layer 370 are located in the accommodating space 530a and are covered on the retaining wall 530 of the substrate 520 by the transparent cover 380. The bottom plate 522 includes a contact 524a, wherein the light emitting device 360 is connected to a conductive wire 540, one end of the conductive wire 540 is connected to the light emitting device 360, and the other end is connected to the contact 524a, so that the light emitting device 360 is electrically connected to the substrate 520. In the fifth embodiment of the present invention, the photo sensing device 340 is electrically connected to the substrate 520 in a flip-chip manner, so that no additional connecting wires are required.
In a sixth embodiment of the present invention, as shown in fig. 9, an optical sensing chip package structure 600 includes a substrate 520, a photo sensing device 340, a light emitting device 360, a transparent focusing lens 670 and a transparent cover 380. In the present embodiment, the substrate 520 may be a circuit substrate; the photo sensing device 340 is disposed on the substrate 520 and electrically connected to the substrate 520.
The light emitting device 360 is disposed on the light sensing device 340. In the embodiment of the present invention, the light emitting device 360 has a light emitting surface 362, and the light sensing device 340 is used for sensing the light emitted by the light emitting device 360.
The transparent focusing lens 670 is disposed on the light emitting device 360 and contacts and covers the light emitting surface 362, so as to prevent dust or dirt in the air from blocking the light emitting surface 362 of the light emitting device 360. In the embodiment of the present invention, the light emitting element 360 has a light emitting angle θ, which is less than or equal to 150 degrees; the transparent focusing lens 670 is used to convert the divergent light emitted from the light-emitting device 360 into a parallel light beam, so as to achieve the effect of reducing the light noise and reducing the light energy loss.
In the sixth embodiment of the invention, as shown in fig. 9, the substrate 520 of the optical sensing chip package structure 600 includes a bottom plate 522 and a retaining wall 530. The bottom plate 522 and the wall 530 form a receiving space 530a, and the bottom plate 522 includes a contact 524a and a contact 524 b. The photo sensing device 340, the light emitting device 360 and the transparent focusing lens 670 are disposed in the accommodating space 530a, and are covered on the substrate 520 by the transparent cover 380. In the sixth embodiment of the present invention, the transparent plate body may or may not be in contact with the transparent focusing lens 670. The light emitting device 360 is connected to a wire 540, one end of the wire 540 is connected to the light emitting device 360, and the other end of the wire 540 is connected to the contact 524a, so that the light emitting device 360 is electrically connected to the substrate 520. In addition, the light sensing device 340 is connected to a conducting wire 541, one end of the conducting wire 541 is connected to the light sensing device 340, and the other end thereof is connected to the contact 524b, so that the light sensing device 340 is electrically connected to the substrate 520.
The invention has the advantages that the transparent adhesive layer is contacted with the light-emitting surface of the light-emitting element and the transparent cover plate, the light emitted by the light-emitting surface is transmitted out through the transparent adhesive layer and the transparent cover plate, and no air gap exists between the transparent adhesive layer and the transparent cover plate, so that the reflectivity of the transparent cover plate to the light and the loss of light energy formed by refraction can be reduced. In addition, the transparent cover plate can also prevent dust from polluting the light sensing element and the light emitting element. On the other hand, the transparent focusing lens is disposed on the light-emitting element and contacts and covers the light-emitting surface to prevent dust or dirt in the air from blocking the light-emitting surface of the light-emitting element. The transparent focusing lens is used to convert the divergent light emitted from the light-emitting device into parallel light beams, thereby achieving the effect of reducing light noise and reducing light energy loss.
The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications to the present invention as described and claimed should be included in the scope of the present invention.
Description of the reference numerals
[ Prior Art ]
100. 200 optical sensing chip package structure
120. 220 substrate 140, 240 photosensing element
160. 260 light emitting element 270 gap 280 transparent cover plate
L ray O target R reflected light
[ invention ]
300a, 300b, 300c, 300d, 300e, 600 optical sensing chip package structure
340 light sensing element 342 light sensing surface
360 luminous element 362 light-emitting surface
370. 370a, 370b, 370c transparent cover plate with a layer of transparent glue 380
382 transparent plate body 420 first antireflection layer 440 second antireflection layer
520 base plate 522 bottom plate 530 retaining wall
530a accommodating space 540, 541 wire
524a, 524b, 532a, 532b, 532c junction
670 transparent focusing lens
W, W1, W2, W3 Width theta light-emitting Angle
Claims (16)
1. An optical sensing chip package structure, comprising:
a substrate;
the optical sensing element is arranged on the substrate and is electrically connected with the substrate;
the light-emitting element is arranged on the light sensing element and is electrically connected with the substrate or the light sensing element, and the light-emitting element is provided with a light-emitting surface;
the transparent adhesive layer is arranged on the light-emitting element and contacts and covers the light-emitting surface; and
and the transparent cover plate is arranged on the transparent adhesive layer and is in contact with the transparent adhesive layer.
2. The optical sensing die package of claim 1, wherein the transparent cover and the transparent adhesive layer are in direct contact with each other.
3. The optical sensing die package of claim 1, wherein the transparent cover further comprises a first anti-reflection layer facing the transparent adhesive layer, and the transparent adhesive layer is in contact with the first anti-reflection layer.
4. The optical sensing die package of claim 2 or 3, wherein the refractive index of the transparent glue layer is substantially the same as the refractive index of the transparent cover plate.
5. The optical sensing die package of claim 2 wherein the reflectivity of the interface between the transparent adhesive layer and the transparent cover is less than 4%.
6. The optical sensing die package structure of claim 1, wherein the material of the transparent adhesive layer comprises silicone, acrylic or a combination thereof.
7. The optical sensing die package of claim 1, wherein the transparent cover further comprises a second anti-reflection layer opposite to the transparent adhesive layer.
8. The optical sensing chip package structure of claim 1, wherein the light emitting device is a point light source, and the light emitting angle of the point light source is smaller than or equal to 150 °.
9. The optical sensing die package of claim 1 wherein the difference between the refractive index of the transparent glue layer and the refractive index of the transparent cover plate is less than 0.5.
10. The optical sensing chip package structure as claimed in claim 1, wherein the light emitting device is connected to a wire, and one end of the wire is connected to the photo sensing device, so that the light emitting device is electrically connected to the photo sensing device.
11. The optical sensing chip package structure as claimed in claim 1, wherein the light emitting device is connected to a wire, and one end of the wire is connected to the substrate, so that the light emitting device is electrically connected to the substrate.
12. The optical sensor die package of claim 10 or 11, wherein a portion of the conductive traces is covered by the transparent adhesive layer.
13. The optical sensing die package of claim 1, wherein no air bubbles exist inside the transparent glue layer.
14. The optical sensing die package of claim 1, wherein the transparent adhesive layer does not contact the optical sensing device and the substrate.
15. The optical sensing die package of claim 1, wherein the transparent adhesive layer is only located within the orthographic projection range of the light emitting device.
16. An optical sensing chip package structure, comprising:
a substrate;
the optical sensing element is arranged on the substrate and is electrically connected with the substrate;
the light-emitting element is arranged on the light sensing element and is electrically connected with the substrate or the light sensing element, and the light-emitting element is provided with a light-emitting surface;
the transparent focusing lens is arranged on the light-emitting element and contacts and covers the light-emitting surface; and
and the transparent cover plate is arranged on the transparent focusing lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910485023.9A CN112053995A (en) | 2019-06-05 | 2019-06-05 | Optical sensing chip package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910485023.9A CN112053995A (en) | 2019-06-05 | 2019-06-05 | Optical sensing chip package structure |
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| CN112053995A true CN112053995A (en) | 2020-12-08 |
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| CN201910485023.9A Pending CN112053995A (en) | 2019-06-05 | 2019-06-05 | Optical sensing chip package structure |
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| CN103681649A (en) * | 2012-09-06 | 2014-03-26 | 力祥半导体股份有限公司 | Proximity sensor package and packaging method thereof |
| CN108074918A (en) * | 2016-11-18 | 2018-05-25 | 光宝光电(常州)有限公司 | Optical profile type life doctor's sensor module and preparation method thereof |
| CN109642951A (en) * | 2016-06-07 | 2019-04-16 | ams有限公司 | The method of optical sensor arrangement and manufacture optical sensor arrangement |
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2019
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130153933A1 (en) * | 2011-12-19 | 2013-06-20 | Xintec Inc. | Chip package and method for forming the same |
| CN103681649A (en) * | 2012-09-06 | 2014-03-26 | 力祥半导体股份有限公司 | Proximity sensor package and packaging method thereof |
| CN109642951A (en) * | 2016-06-07 | 2019-04-16 | ams有限公司 | The method of optical sensor arrangement and manufacture optical sensor arrangement |
| CN108074918A (en) * | 2016-11-18 | 2018-05-25 | 光宝光电(常州)有限公司 | Optical profile type life doctor's sensor module and preparation method thereof |
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