CN112018006A - Semiconductor cleaning equipment - Google Patents
Semiconductor cleaning equipment Download PDFInfo
- Publication number
- CN112018006A CN112018006A CN202010987933.XA CN202010987933A CN112018006A CN 112018006 A CN112018006 A CN 112018006A CN 202010987933 A CN202010987933 A CN 202010987933A CN 112018006 A CN112018006 A CN 112018006A
- Authority
- CN
- China
- Prior art keywords
- process tank
- way valve
- communicated
- pipeline
- flow passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 87
- 239000004065 semiconductor Substances 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 claims abstract description 183
- 230000008569 process Effects 0.000 claims abstract description 180
- 238000001816 cooling Methods 0.000 claims abstract description 24
- 230000005540 biological transmission Effects 0.000 claims abstract description 16
- 230000001276 controlling effect Effects 0.000 claims description 25
- 230000007246 mechanism Effects 0.000 claims description 21
- 239000012530 fluid Substances 0.000 claims description 16
- 230000001105 regulatory effect Effects 0.000 claims description 15
- 230000000712 assembly Effects 0.000 claims description 6
- 238000000429 assembly Methods 0.000 claims description 6
- 238000009529 body temperature measurement Methods 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 abstract description 11
- 230000007797 corrosion Effects 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 6
- 239000007789 gas Substances 0.000 description 35
- 239000007788 liquid Substances 0.000 description 26
- 239000000243 solution Substances 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000013461 design Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- 238000001914 filtration Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- -1 Polytetrafluoroethylene Polymers 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The embodiment of the application provides semiconductor cleaning equipment. The semiconductor cleaning apparatus includes: a process tank assembly and a tank cover assembly; the process tank assembly comprises: the cooling device comprises an inner process tank, an outer process tank, a circulating pipeline and a cooling pipeline, wherein an opening of the inner process tank is arranged inside the outer process tank, the inner process tank is communicated with the outer process tank through the circulating pipeline, and a tank cover assembly is used for opening or closing a transmission port of the outer process tank; the cooling pipeline is arranged on the upper part of the inner wall of the outer process tank and is used for condensing steam generated by the inner process tank and the outer process tank; the circulating pipeline is provided with a first heater, and the side wall and/or the bottom wall of the inner process tank is provided with a second heater. The embodiment of the application realizes that a large amount of steam is reduced to diffuse upwards to control the steam diffusion, thereby greatly reducing the corrosion of the steam to other parts of the semiconductor cleaning equipment and greatly reducing the fault rate of the semiconductor cleaning equipment.
Description
Technical Field
The application relates to the technical field of semiconductor processing, in particular to a semiconductor cleaning device.
Background
Currently, in semiconductor cleaning equipment, some cleaning processes require the temperature of the chemical cleaning solution to be 100-200 ℃. In order to enable the temperature of chemical cleaning liquid to meet the requirements of a cleaning process, a heater is usually installed on a circulating pipeline, the chemical cleaning liquid is kept within a preset temperature range in the process through the heater, a tank cover is arranged above the process tank, the tank cover is kept closed in the process, and the tank cover is opened when a wafer needs to be taken out after the process is finished. For the process requiring high temperature, especially when the temperature is more than 150 ℃, the heater is arranged on the circulating pipeline to heat the cleaning liquid, the requirement on the heater is high due to factors such as heat dissipation of the circulating pipeline, and the heating rate is difficult to meet the process requirement. In addition, when the tank cover is opened, a large amount of steam is generated in the process tank due to the higher temperature of the cleaning solution, and more steam is generated especially when an aqueous chemical cleaning solution is used. In the prior art, a fan filtering device is generally arranged on the upper part of semiconductor cleaning equipment, laminar air blown by the fan filtering device drives steam to diffuse upwards and towards two sides, but because the speed and the pressure of the laminar air are limited, a large part of steam still cannot be exhausted timely through an exhaust system on the lower part of the rear side of the equipment, and therefore the problem of controlling the diffusion of the steam is urgently needed to be solved at present.
Disclosure of Invention
The application provides a semiconductor cleaning device aiming at the defects of the prior art, and is used for solving the technical problems that the heating rate in the prior art cannot meet the requirement and the steam diffusion is caused.
The embodiment of the application provides a semiconductor cleaning equipment, includes: a process tank assembly and a tank cover assembly; the process bowl assembly comprises: the cooling device comprises an inner process tank, an outer process tank, a circulating pipeline and a cooling pipeline, wherein an opening of the inner process tank is arranged inside the outer process tank, the inner process tank is communicated with the outer process tank through the circulating pipeline, and a tank cover assembly is used for opening or closing a transmission port of the outer process tank; the cooling pipeline is arranged on the upper part of the inner wall of the outer process tank and is used for condensing steam generated by the inner process tank and the outer process tank; the circulating pipeline is provided with a first heater, and the side wall and/or the bottom wall of the inner process tank is provided with a second heater.
In an embodiment of the present application, the process bowl assembly further comprises: the upper part of the inner wall of the outer process groove is provided with an exhaust port, and the first exhaust pipe is communicated with the exhaust port and an exhaust pipeline of the semiconductor cleaning equipment respectively and used for exhausting steam generated by the inner process groove and the outer process groove.
In one embodiment of the present application, the slot cover assembly includes: the process tank assembly comprises a cover body and a driving mechanism, wherein the pivoting end of the cover body is pivoted on the process tank assembly, and the movable end of the cover body can rotate relative to the pivoting end; the driving mechanism is used for driving the cover body to rotate so as to open or close the transmission port of the outer process tank; the driving mechanism is also used for controlling the cover body to hover at a preset position for a preset time when the cover body is driven to rotate so as to open the transmission port of the outer process tank.
In an embodiment of the present application, when the cover is located at the predetermined position, a predetermined included angle is formed between the cover and the transmission port of the outer process tank, and the angle of the predetermined included angle is 25 to 50 degrees; the preset time is 5 to 20 seconds.
In one embodiment of the present application, the driving mechanism includes: the telescopic cylinder comprises a cylinder body and a telescopic rod, and the telescopic rod is arranged in the cylinder body in a telescopic mode and is connected with the cover body; the control assembly comprises a first flow passage, a second flow passage, a third flow passage, a fourth flow passage, a fifth flow passage, a sixth flow passage, a first three-way valve, a second three-way valve, a shut-off valve and a control component, wherein one end of the first flow passage is communicated with one end of the cylinder body, the other end of the first flow passage is communicated with a first interface of the first three-way valve, one end of the second flow passage is communicated with the other end of the cylinder body, and the other end of the second flow passage is communicated with a first interface of the second three-way valve; the third port of the first three-way valve is communicated with the second port of the second three-way valve through the third flow channel, and the fourth flow channel is communicated with the third flow channel; one end of the fifth flow passage is communicated with the second interface of the first three-way valve, the other end of the fifth flow passage is communicated with an exhaust pipeline of the semiconductor cleaning equipment, one end of the sixth flow passage is communicated with the third interface of the second three-way valve, the other end of the sixth flow passage is communicated with the exhaust pipeline, and the shutoff valve is arranged on the sixth flow passage; the control component is connected with the first three-way valve, the second three-way valve and the shutoff valve and is used for controlling the conduction states of the first three-way valve, the second three-way valve and the shutoff valve.
In one embodiment of the present application, the driving mechanism includes: the telescopic cylinder comprises a cylinder body and a telescopic rod, and the telescopic rod is arranged in the cylinder body in a telescopic mode and is connected with the cover body; the control assembly comprises a three-position five-way valve, an air inlet pipeline, a first air pipeline, a second air pipeline, a speed regulating valve and a control component, wherein the air inlet pipeline is communicated with a source air inlet of the three-position five-way valve, one end of the first air pipeline is communicated with a first air inlet of the three-position five-way valve, the other end of the first air pipeline is communicated with one end of the cylinder body, one end of the second air pipeline is communicated with a second air inlet of the three-position five-way valve, and the other end of the second air pipeline is communicated with the other end of the cylinder body; the first gas pipeline and the second gas pipeline are both provided with the speed regulating valves; the control component is connected with the three-position five-way valve and is used for controlling the three-position five-way valve to switch among a first side position, a second side position and a third side position; the control component is connected with the speed regulating valve and used for controlling the working state of the speed regulating valve.
In an embodiment of the present application, an exhaust channel is formed in the cover body, and an air suction port of the exhaust channel is located on a surface of the cover body facing the outer process tank; the slot cover assembly further comprises: and the second exhaust pipe is communicated with the air outlet of the exhaust channel and the exhaust pipeline respectively and is used for exhausting steam generated by the inner process groove and the outer process groove.
In an embodiment of the present application, a plurality of the air inlets are disposed on a surface of the cover facing the outer process tank, and the plurality of the air inlets are distributed on a side of the cover away from the pivot joint end.
In an embodiment of the present application, the process tank assembly further includes a plurality of temperature measurement assemblies, and the temperature measurement assemblies are disposed in the inner process tank and configured to detect a temperature of the cleaning solution in the inner process tank.
In an embodiment of the present application, saw-shaped teeth are disposed on the side wall at the opening of the inner process groove.
The technical scheme provided by the embodiment of the application has the following beneficial technical effects:
the embodiment of this application is provided with cooling line through being provided with on the inner wall in outer technology groove, and the steam that produces in interior technology groove and the outer technology groove meets cooling line and can condense into liquid at the in-process that rises to reduce a large amount of steam and upwards spread, and then realize controlling steam diffusion. Because the steam is controlled better, the corrosion of the steam to other parts of the semiconductor cleaning equipment is greatly reduced, the fault rate of the semiconductor cleaning equipment is greatly reduced, and the cleaning speed and the process yield of the wafer can be improved. In addition, the first heater and the second heater of the process tank assembly work simultaneously, so that the cleaning solution in the inner process tank can quickly reach the required temperature, and the heating rate is greatly improved. And because the second adder is arranged in the inner process tank, the first heater can meet the requirement when working under low power, the temperature of the cleaning liquid in the circulating pipeline is relatively low, and the influence of the high-temperature cleaning liquid on the pipeline part is greatly reduced.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic perspective view of a semiconductor cleaning apparatus provided in an embodiment of the present application in a cross-sectional state;
FIG. 2 is a schematic perspective view illustrating a lid body of a semiconductor cleaning device provided in an embodiment of the present application remaining hovering;
FIG. 3 is a schematic diagram of a cycle of a semiconductor cleaning apparatus according to an embodiment of the present disclosure;
fig. 4 is a schematic perspective view of an inner process tank according to an embodiment of the present disclosure;
FIG. 5 is a schematic diagram illustrating a control assembly controlling a cover to remain closed according to an embodiment of the present disclosure;
FIG. 6 is a schematic diagram illustrating a control assembly controlling a cover to be kept open according to an embodiment of the present disclosure;
FIG. 7 is a schematic diagram illustrating a control assembly controlling a cover to remain hovering according to an embodiment of the present application;
FIG. 8 is a schematic diagram of another control assembly controlling the cover to remain closed according to an embodiment of the present disclosure;
FIG. 9 is a schematic diagram illustrating another control assembly controlling the cover to remain open according to an embodiment of the present disclosure;
fig. 10 is a schematic diagram illustrating another control assembly controlling the cover to maintain hovering according to an embodiment of the present application.
Detailed Description
Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments.
An embodiment of the present application provides a semiconductor cleaning apparatus, a schematic structural diagram of which is shown in fig. 1 to 4, including: a process tank assembly 1 and a tank cover assembly 2; the process tank assembly 1 comprises: the device comprises an inner process tank 12, an outer process tank 13, a circulating pipeline 14 and a cooling pipeline 15, wherein an opening of the inner process tank 12 is arranged inside the outer process tank 13, the inner process tank 12 is communicated with the outer process tank 13 through the circulating pipeline 14, and a tank cover assembly 2 is used for opening or closing a transmission port 11 of the outer process tank 13; the cooling pipeline 15 is arranged on the upper part of the inner wall of the outer process tank 13 and is used for condensing steam generated by the inner process tank 12 and the outer process tank 13; the circulation line 14 is provided with a first heater 141, and the inner process tank 12 is provided with a second heater 142 on the side wall and/or the bottom wall thereof.
As shown in fig. 1 to 4, the inner process tank 12 and the outer process tank 13 may be an integrated quartz tank, the inner process tank 12 is a place for cleaning wafers, so that the concentration and temperature of the cleaning solution in the inner process tank 12 are important, and a heat insulation layer may be disposed outside the outer process tank 13 to insulate heat of the outer process tank 13. The opening of the inner process tank 12 can be located inside the outer process tank 13, and the top end of the side wall of the inner process tank 12 can be provided with saw-shaped teeth 121 for facilitating the cleaning solution to overflow to the outside, i.e. the opening of the inner process tank 12 is provided with the saw-shaped teeth 121. The cleaning liquid in the inner process tank 12 continuously overflows to the outer process tank 13, and the cleaning liquid in the outer process tank 13 enters the inner process tank 12 from a liquid injection port at the bottom of the inner process tank 12 after passing through a circulating pipeline 14, so that the cleaning liquid circulates between the inner process tank and the outer process tank, and the purity of the cleaning liquid in the inner process tank 12 is ensured.
The capping assembly 2 may be a plate-shaped structure made of an acid-resistant and alkali-resistant material, for example, the capping assembly may be made of a meltable Polytetrafluoroethylene (PFA) or a Polytetrafluoroethylene (PTFE), but the embodiment of the present disclosure is not limited thereto. The tank cover assembly 2 is pivotally connected to the outer process tank 13 for opening or closing the transfer port 11 of the outer process tank 13.
The cooling line 15 is embodied as a thin-walled tube with a small diameter in order to increase the surface area as much as possible and to prevent corrosion. Specifically, the cooling pipe 15 may be made of a fusible Polytetrafluoroethylene (PFA) pipe having an outer diameter of 4 to 12 mm, and cooling water may flow inside the cooling pipe 15 for reducing the temperature above the outer process tank 13. The cooling pipeline 15 is arranged on the inner wall of the outer process tank 13 in a surrounding mode and is close to the position of the conveying port 11, the cooling pipeline is used for reducing the temperature above the process tank assembly 1, meanwhile, steam generated in the inner process tank 12 and the outer process tank 13 meets the outer wall of the cooling pipeline 15 in the rising process and can be condensed into liquid, and therefore steam diffusion is greatly reduced.
The first heater 141 may be specifically a wire heater so as to be disposed in the circulation line 14; the second heater 142 is specifically a heating plate, and the second heater 142 may be disposed on the bottom wall and the side wall of the inner process tank 12, but the embodiment of the present application is not limited thereto. When the application is realized, the first heater 141 and the second heater 142 work simultaneously, so that the cleaning liquid in the inner process tank 12 can quickly reach a preset temperature, and the preset temperature can be any value between 100 ℃ and 200 ℃ to meet different process requirements. Due to the arrangement of the second heater 142, the first heater 141 can meet the requirement when working under a small power, so that the temperature of the cleaning liquid in the circulation pipeline 14 is reduced, and the influence of the high-temperature cleaning liquid on the circulation pipeline 14 is greatly reduced. Optionally, a pump 143 and a filter 144 are disposed on the circulation line 14 to increase the flow rate of the cleaning solution and further increase the purity of the cleaning solution in the inner process tank 12.
The embodiment of this application is provided with cooling line through being provided with on the inner wall in outer technology groove, and the steam that produces in interior technology groove and the outer technology groove meets cooling line and can condense into liquid at the in-process that rises to reduce a large amount of steam and upwards spread, and then realize controlling steam diffusion. Because the steam is controlled better, the corrosion of the steam to other parts of the semiconductor cleaning equipment is greatly reduced, the fault rate of the semiconductor cleaning equipment is greatly reduced, and the cleaning speed and the process yield of the wafer can be improved. In addition, the first heater and the second heater of the process tank assembly work simultaneously, so that the cleaning solution in the inner process tank can quickly reach the required temperature, and the heating rate is greatly improved. And because the second adder is arranged in the inner process tank, the first heater can meet the requirement when working under low power, the temperature of the cleaning liquid in the circulating pipeline is relatively low, and the influence of the high-temperature cleaning liquid on the pipeline part is greatly reduced.
It should be noted that the specific material of the process tank assembly 1 is not limited in the embodiments of the present application, and for example, the process tank assembly may be made of other materials as long as the material has the characteristics of high temperature resistance and corrosion resistance. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In one embodiment of the present application, as shown in FIG. 1, the process bowl assembly 1 further comprises: the first exhaust pipe 16 and the upper part of the inner wall of the outer process tank 13 are provided with an exhaust port 131, and the first exhaust pipe 16 is respectively communicated with the exhaust port 131 and an exhaust pipeline (not shown) of the semiconductor cleaning equipment and is used for exhausting steam generated by the inner process tank 12 and the outer process tank 13. The upper portion of the rear side of the outer process tank 13 is provided with an exhaust port 131, as shown in the left side of fig. 1, the rear side of the outer process tank 13 is provided, the exhaust port 131 can be located above the cooling pipeline 15, one end of the first exhaust pipe 16 is connected with the exhaust port 131, the other end can be communicated with an exhaust pipeline of the semiconductor cleaning equipment, and the exhaust pipe assembly 6 can timely exhaust steam in the inner process tank 12 and the outer process tank 13 in the state that the tank cover assembly 2 is closed to the transmission port 11 and in the process, so as to further reduce the diffusion of the steam.
In an embodiment of the present application, as shown in fig. 1 and 2, the slot cover assembly 2 includes: a cover 21 and a driving mechanism 22, wherein the pivoting end 211 of the cover 21 is pivoted to the process tank assembly 1, and the movable end 212 of the cover 21 can rotate relative to the pivoting end 211; the driving mechanism 22 is used for driving the cover body 21 to rotate so as to open or close the transmission port 11 of the outer process tank 13; the driving mechanism 22 is also used for controlling the cover body 21 to hover at a preset position for a preset time when the cover body 21 is driven to pivot to open the transfer port 11 of the outer process tank 13. Specifically, the drive mechanism 22 may be coupled to the process bowl assembly 1 and the lid 21. The driving mechanism 22 is used for driving the cover body 21 to rotate so as to open or close the transmission port 11 of the outer process tank 13; for example, the driving mechanism 22 can control the cover 21 to completely open the transmission port 11, or control the cover 21 to completely close the transmission port 11, or control the cover 21 to partially open the transmission port 11 and suspend at a preset position for a preset time, so that the steam is slowly discharged and discharged through an exhaust duct (not shown) of the semiconductor cleaning device, thereby preventing the steam from being diffused upwards after the cover 21 is completely opened, and thus controlling the diffusion of the steam in the process tank assembly 1.
In an embodiment of the present application, as shown in fig. 1 and fig. 2, when the cover 21 is at the predetermined position, a predetermined included angle is formed between the cover 21 and the transmission port 11 of the outer process tank 13, and the predetermined included angle is 25 to 50 degrees; the preset time is 5 to 20 seconds. Specifically, when it is desired to reduce the vapor diffusion in the process bowl assembly 1, the driving mechanism 22 can control the bowl cover assembly 2 to form a predetermined angle with the transfer port 11. The angle of the preset included angle may be 25 degrees, 30 degrees, 37 degrees, 43 degrees, 49 degrees, and the like, and the specific value of the preset included angle may be set according to the temperature of the cleaning liquid in the process tank assembly 1 and different process requirements, and therefore, the embodiment of the present invention is not limited thereto. The preset time may be 6 seconds, 10 seconds, 15 seconds, etc., and the preset time may be set according to the temperature of the cleaning liquid in the process tank assembly 1 and different process requirements, and therefore, the embodiment of the present invention is not limited thereto. By adopting the design, the application embodiment can set the preset included angle and the preset time according to different process requirements, so that the applicability and the application range of the application embodiment are greatly improved.
In an embodiment of the present application, as shown in fig. 1, 5 to 7, the driving mechanism 22 includes: the telescopic device comprises a telescopic cylinder 23 and a control assembly 24, wherein the telescopic cylinder 23 comprises a cylinder body 231 and a telescopic rod 232, and the telescopic rod 232 is arranged in the cylinder body 231 in a telescopic manner and is connected with a cover body 21; the control assembly 24 includes a first flow passage 31, a second flow passage 32, a third flow passage 33, a fourth flow passage 34, a fifth flow passage 35, a sixth flow passage 36, a first three-way valve 37, a second three-way valve 38, a shut-off valve 39 and a control member (not shown in the figure), wherein one end of the first flow passage 31 is communicated with one end of the cylinder 231, the other end of the first flow passage 31 is communicated with a first port C1 of the first three-way valve 37, one end of the second flow passage 32 is communicated with the other end of the cylinder 231, and the other end of the second flow passage 32 is communicated with a first port C1 of the second three-way valve 38; the third port C3 of the first three-way valve 37 communicates with the second port C2 of the second three-way valve 38 via the third flow path 33, and the fourth flow path 34 communicates with the third flow path 33; one end of the fifth flow passage 35 is communicated with the second port C2 of the first three-way valve 37, the other end is communicated with an exhaust pipeline (or other exhaust channels) of the semiconductor cleaning equipment, one end of the sixth flow passage 36 is communicated with the third port of the second three-way valve 38, the other end is communicated with the exhaust pipeline (or other exhaust channels), and the shutoff valve 39 is arranged on the sixth flow passage 36; the control unit is connected to the first three-way valve 37, the second three-way valve 38, and the shut-off valve 39, and controls the conduction states of the first three-way valve 37, the second three-way valve 38, and the shut-off valve 39.
As shown in fig. 1, 2, 5 to 7, the telescopic cylinder 23 can be driven by fluid, and the telescopic action of the telescopic cylinder 23 corresponds to the opening and closing of the cover 21, and is suspended for a preset time corresponding to the cover 21 hovering at a preset position during the telescopic process. The cylinder 231 may be specifically disposed at the rear side of the process tank assembly 1, i.e. at a position far away from the movable end 212 of the cover 21, and by adopting this design, the telescopic cylinder 23 according to the embodiment of the present application is not easily mechanically interfered with other components, so that the failure rate is greatly reduced. The top end of the telescopic rod 232 is connected to the pivoting end 211, but the embodiment of the present invention is not limited thereto. By adopting the design, the embodiment of the application has a simple structure, and the application and maintenance cost can be greatly reduced. It should be noted that the embodiment of the present application is not limited to use of the telescopic cylinder 23, and for example, the driving mechanism 22 may also use a lead screw mechanism. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
The first flow passage 31 is connected to the top end of the cylinder 231, and is used for inputting fluid to the top end of the cylinder 231; the second flow passage 32 is connected to a bottom end of the cylinder 231, and is used to supply fluid to the bottom end of the cylinder 231. The fourth flow channel 34 is connected to a fluid source (not shown) to introduce fluid into the first flow channel 31 and the second flow channel 32 through the third flow channel 33. One end of the fifth flow passage 35 is communicated with the second port C2 of the first three-way valve 37, the other end is communicated with the exhaust duct of the semiconductor cleaning equipment, one end of the sixth flow passage 36 is communicated with the third port C3 of the second three-way valve 38, the other end is communicated with the exhaust duct, and the shut-off valve 39 is arranged on the sixth flow passage 36. The control unit (not shown in the figure) may specifically adopt a single chip microcomputer or an upper computer of the semiconductor cleaning device, and the control unit is connected to the first three-way valve 37, the second three-way valve 38, and the shut-off valve 39, and is used for controlling the conduction states of the first three-way valve 37, the second three-way valve 38, and the shut-off valve 39.
Further, when the cover 21 needs to be closed, as shown in fig. 5 in detail, the fluid enters the third flow channel 33 from the fourth flow channel 34, enters the second flow channel 32 through the second port C2 and the first port C1 of the second three-way valve 38, and then the second flow channel 32 guides the fluid to the bottom end of the cylinder 231; the fluid at the top end of the cylinder 231 enters the first flow channel 31, enters the fifth flow channel 35 through the first port C1 and the second port C2 of the first three-way valve 37, and is then exhausted through the exhaust duct of the semiconductor cleaning device, so that the fluid pressure in the third flow channel 33 is continuously maintained, and the cover 21 can be kept closed.
When the cover 21 needs to be opened, as shown in fig. 6, the control unit may switch the conduction states of the first three-way valve 37 and the second three-way valve 38 by using a solenoid valve. Specifically, the fluid enters the third flow channel 33 through the fourth flow channel 34, enters the first flow channel 31 through the third port C3 and the first port C1 of the first three-way valve 37, and then the first flow channel 31 guides the fluid to the top end of the cylinder 231; the fluid at the bottom end of the cylinder 231 passes through the second flow passage 32, enters the sixth flow passage 36 through the first port C1 and the third port C3 of the second three-way valve 38, and is then exhausted through the exhaust duct of the semiconductor cleaning apparatus, so that the cover remains open.
When the cover 21 is required to suspend at the preset position, as shown in fig. 7, specifically, when the cover 21 is opened to the intermediate position, the control component may control the shut-off valve 39 to disconnect the sixth flow channel 36, and at this time, since the fluid cannot be drained away, the telescopic rod 232 stops moving after the fluid at the two ends of the cylinder 231 keeps balanced, so that the cover 21 suspends at the preset position for a preset time. With the above design, the two three-way valves are adopted, so that the fluid in the control assembly 24 can be liquid or gas, thereby improving the applicability and the application range, and greatly reducing the application and maintenance cost.
In an embodiment of the present application, as shown in fig. 1, 2, 8 to 10, the driving mechanism 22 includes: the telescopic device comprises a telescopic cylinder 23 and a control assembly 24, wherein the telescopic cylinder 23 comprises a cylinder body 231 and a telescopic rod 232, and the telescopic rod 232 is arranged in the cylinder body 231 in a telescopic manner and is connected with a cover body; the control assembly 24 includes a three-position five-way valve 41, an air inlet pipeline (not shown), a first air pipeline 42, a second air pipeline 43, a speed regulating valve 44 and a control component (not shown), wherein the air inlet pipeline is communicated with a source air inlet 411 of the three-position five-way valve 41, one end of the first air pipeline 42 is communicated with a first air inlet 412 of the three-position five-way valve 41, the other end of the first air pipeline 42 is communicated with one end of the cylinder 231, one end of the second air pipeline 43 is communicated with a second air inlet 413 of the three-position five-way valve 41, and the other end of the second air pipeline 43 is communicated with the other end of the cylinder 231; the first gas pipeline 42 and the second gas pipeline 43 are both provided with speed regulating valves 44; the control component is connected with the three-position five-way valve 41 and is used for controlling the three-position five-way valve 41 to switch among a first side position P1, a second side position P2 and a third side position P3; the control component is connected with the speed regulating valve 44 and is used for controlling the working state of the speed regulating valve 44.
As shown in fig. 1, 2, 8 to 10, the telescopic cylinder 23 may be driven by gas, and the telescopic action of the telescopic cylinder 23 corresponds to the opening and closing of the cover 21, and is suspended in the telescopic process to hover at a preset position corresponding to the cover 21 for a preset time. An air inlet line (not shown) is connected at one end to an air source (not shown) and at the other end to a source air inlet 411. One end of the first gas line 42 communicates with the first gas inlet 412 of the three-position five-way valve 41, and the other end of the first gas line 42 communicates with the top end of the cylinder 231. One end of the second gas pipeline 43 is communicated with the second gas inlet 413 of the three-position five-way valve 41, and the other end of the second gas pipeline 43 is communicated with the bottom end of the cylinder 231. The control component is connected to the three-position five-way valve 41, and is used for controlling the three-position five-way valve 41 to switch among a first side position P1, a second side position P2 and a third side position P3. The first side position and the second side position P2 of the three-position five-way valve 41 correspond to the open state and the closed state of the cover respectively, and the third side position P3 corresponds to the cover 21 hovering at a preset position. In addition, the control unit may be specifically connected to the speed valve 44 for adjusting the operating state of the speed valve 44.
Further, when it is required that the cover 21 is kept closed, as shown in fig. 8 in particular, the control component controls the three-position five-way valve 41 to operate at the second side position P2, the gas from the source gas inlet 411 enters the bottom end of the cylinder 231 through the second gas inlet 413 and the second gas pipeline 43, the gas from the top end of the cylinder 231 enters the three-position five-way valve 41 through the first gas pipeline 42 and the first gas inlet 412 and is exhausted through the gas outlet EA, and thus the telescopic rod 232 extends to keep the cover 21 closed.
When it is required to open the cover 21, as shown in fig. 9 in particular, the control component controls the three-position five-way valve 41 to operate at the first side position P1, the gas from the source gas inlet 411 enters the top end of the cylinder 231 from the first gas inlet 412 through the first gas pipeline 42, the gas from the bottom end of the cylinder 231 enters the three-position five-way valve 41 through the second gas pipeline 43 and the second gas inlet 413, and is exhausted through the gas outlet EB, and the telescopic rod 232 contracts to open and keep open the cover 21.
When the cover 21 needs to be suspended at the preset position, as shown in fig. 10, when the cover 21 is opened to the middle position, the control component controls the three-position five-way valve 41 to be powered off, so that the three-position five-way valve 41 works at the third side P3, at this time, the three-position five-way valve 41 stops operating, and after the two ends of the cylinder 231 simultaneously have gas and keep balance, the telescopic rod 232 stops moving, so that the cover 21 is suspended at the preset position.
Optionally, the speed regulating valves 44 are disposed on the first gas pipeline 42 and the second gas pipeline 43, and the sectional areas inside the speed regulating valves 44 can be adjusted by adjusting knobs, or the speed regulating valves 44 can be directly controlled by a control component, so that the flow rates of the gases inside the first gas pipeline 42 and the second gas pipeline 43 can be changed, the purpose of adjusting the movement speed of the telescopic rod 232 is achieved, and the working efficiency can be improved.
By adopting the design, the control component adopts the three-position five-way valve 41, so that the control component 24 can adopt gas to control the telescopic cylinder 23, and the structure of the embodiment of the application is simple, so that the failure rate and the application cost are greatly reduced.
In an embodiment of the present application, as shown in fig. 1 and fig. 2, an exhaust channel (not shown) is formed in the cover 21, and an air suction port of the exhaust channel is located on a surface of the cover 21 facing the outer process tank 13; the slot cover assembly 2 further comprises: and the second exhaust pipe 25 is respectively communicated with the air outlet of the exhaust channel and the exhaust pipeline of the semiconductor cleaning equipment, and is used for exhausting steam generated by the inner process tank 12 and the outer process tank 13. Optionally, a plurality of air inlets are disposed on the surface of the cover 21 facing the outer process tank 13, and the plurality of air inlets are distributed on the side of the cover 21 away from the pivoting end 211. With the above design, the second exhaust pipe 25 is matched with the exhaust channel to further exhaust the steam in the process tank assembly 1, thereby further controlling the steam diffusion in the process tank assembly 1.
In an embodiment of the present application, as shown in fig. 3, the process tank assembly 1 further includes a plurality of temperature measurement assemblies 17, and the temperature measurement assemblies 17 are disposed in the inner process tank 14 and used for detecting the temperature of the cleaning solution in the inner process tank 14. Specifically, the plurality of temperature measuring assemblies 17 are respectively disposed at different positions in the inner process tank 12 for monitoring the temperature and the temperature uniformity of the cleaning solution in real time. The working power and the target temperature of the first heater 141 and the second heater 142 are preset, the actually measured temperature value of the temperature measuring component 17 is combined, the difference between the target temperature and the actually measured temperature value is compared, the percentage of the working power of the first heater 141 and the percentage of the working power of the second heater 142 are adjusted in real time, the target temperature of the process requirement is achieved, and the target temperature of the cleaning liquid is controlled to fluctuate within an error range (the error range is not more than 0.5 ℃). By adopting the design, the target temperature fluctuation of the cleaning liquid is small, so that the uniformity of the wafer cleaning process is greatly improved.
In an embodiment of the present application, referring to fig. 1, the semiconductor cleaning apparatus further includes a fan filter device and an exhaust duct (not shown), the fan filter device is disposed above the process tank assembly 1, and the exhaust duct is disposed at one side of the fan filter device and the process tank assembly 1. The fan filtering device is used for providing laminar air flowing downwards to the process tank assembly 1, so that steam in the process tank assembly 1 is diffused downwards and on two sides, and the exhaust pipeline can be connected to a negative pressure pipeline of a factory and used for timely pumping away the steam. The exhaust pipeline and the fan filtering device run simultaneously, so that a microenvironment in the semiconductor cleaning equipment is ensured.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
the embodiment of this application is provided with cooling line through being provided with on the inner wall in outer technology groove, and the steam that produces in interior technology groove and the outer technology groove meets cooling line and can condense into liquid at the in-process that rises to reduce a large amount of steam and upwards spread, and then realize controlling steam diffusion. Because the steam is controlled better, the corrosion of the steam to other parts of the semiconductor cleaning equipment is greatly reduced, the fault rate of the semiconductor cleaning equipment is greatly reduced, and the cleaning speed and the process yield of the wafer can be improved. In addition, the first heater and the second heater of the process tank assembly work simultaneously, so that the cleaning solution in the inner process tank can quickly reach the required temperature, and the heating rate is greatly improved. And because the second adder is arranged in the inner process tank, the first heater can meet the requirement when working under low power, the temperature of the cleaning liquid in the circulating pipeline is relatively low, and the influence of the high-temperature cleaning liquid on the pipeline part is greatly reduced.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.
Claims (10)
1. The semiconductor cleaning equipment is characterized by comprising a process tank assembly and a tank cover assembly;
the process bowl assembly comprises: the cooling device comprises an inner process tank, an outer process tank, a circulating pipeline and a cooling pipeline, wherein an opening of the inner process tank is arranged inside the outer process tank, the inner process tank is communicated with the outer process tank through the circulating pipeline, and a tank cover assembly is used for opening or closing a transmission port of the outer process tank;
the cooling pipeline is arranged on the upper part of the inner wall of the outer process tank and is used for condensing steam generated by the inner process tank and the outer process tank;
the circulating pipeline is provided with a first heater, and the side wall and/or the bottom wall of the inner process tank is provided with a second heater.
2. The semiconductor cleaning apparatus of claim 1, wherein the process bowl assembly further comprises: the upper part of the inner wall of the outer process groove is provided with an exhaust port, and the first exhaust pipe is communicated with the exhaust port and an exhaust pipeline of the semiconductor cleaning equipment respectively and used for exhausting steam generated by the inner process groove and the outer process groove.
3. The semiconductor cleaning apparatus according to claim 1 or 2, the tank cover assembly comprising: a cover body and a driving mechanism, wherein,
the pivoting end of the cover body is pivoted on the process tank assembly, and the movable end of the cover body can rotate relative to the pivoting end;
the driving mechanism is used for driving the cover body to rotate so as to open or close the transmission port of the outer process tank; the driving mechanism is also used for controlling the cover body to hover at a preset position for a preset time when the cover body is driven to rotate so as to open the transmission port of the outer process tank.
4. The semiconductor cleaning apparatus according to claim 3, wherein a predetermined included angle is formed between the cover and the transfer opening of the outer process tank at the predetermined position, and the predetermined included angle is 25 to 50 degrees; the preset time is 5 to 20 seconds.
5. The semiconductor cleaning apparatus of claim 3, wherein the drive mechanism comprises: a telescopic cylinder and a control component, wherein,
the telescopic cylinder comprises a cylinder body and a telescopic rod, and the telescopic rod is arranged in the cylinder body in a telescopic manner and is connected with the cover body;
the control assembly comprises a first flow passage, a second flow passage, a third flow passage, a fourth flow passage, a fifth flow passage, a sixth flow passage, a first three-way valve, a second three-way valve, a shut-off valve and a control component, wherein one end of the first flow passage is communicated with one end of the cylinder body, the other end of the first flow passage is communicated with a first interface of the first three-way valve, one end of the second flow passage is communicated with the other end of the cylinder body, and the other end of the second flow passage is communicated with a first interface of the second three-way valve; the third port of the first three-way valve is communicated with the second port of the second three-way valve through the third flow channel, and the fourth flow channel is communicated with the third flow channel; one end of the fifth flow passage is communicated with the second interface of the first three-way valve, the other end of the fifth flow passage is communicated with an exhaust pipeline of the semiconductor cleaning equipment, one end of the sixth flow passage is communicated with the third interface of the second three-way valve, the other end of the sixth flow passage is communicated with the exhaust pipeline, and the shutoff valve is arranged on the sixth flow passage; the control component is connected with the first three-way valve, the second three-way valve and the shutoff valve and is used for controlling the conduction states of the first three-way valve, the second three-way valve and the shutoff valve.
6. The semiconductor cleaning apparatus of claim 3, wherein the drive mechanism comprises: a telescopic cylinder and a control component, wherein,
the telescopic cylinder comprises a cylinder body and a telescopic rod, and the telescopic rod is arranged in the cylinder body in a telescopic manner and is connected with the cover body;
the control assembly comprises a three-position five-way valve, an air inlet pipeline, a first air pipeline, a second air pipeline, a speed regulating valve and a control component, wherein the air inlet pipeline is communicated with a source air inlet of the three-position five-way valve, one end of the first air pipeline is communicated with a first air inlet of the three-position five-way valve, the other end of the first air pipeline is communicated with one end of the cylinder body, one end of the second air pipeline is communicated with a second air inlet of the three-position five-way valve, and the other end of the second air pipeline is communicated with the other end of the cylinder body; the first gas pipeline and the second gas pipeline are both provided with the speed regulating valves; the control component is connected with the three-position five-way valve and is used for controlling the three-position five-way valve to switch among a first side position, a second side position and a third side position; the control component is connected with the speed regulating valve and used for controlling the working state of the speed regulating valve.
7. The semiconductor cleaning device according to claim 3, wherein an exhaust channel is formed in the cover body, and an air suction port of the exhaust channel is located on a surface of the cover body facing the outer process tank;
the slot cover assembly further comprises: and the second exhaust pipe is communicated with the air outlet of the exhaust channel and the exhaust pipeline respectively and is used for exhausting steam generated by the inner process groove and the outer process groove.
8. The semiconductor cleaning device according to claim 7, wherein a plurality of air inlets are disposed on a surface of the cover facing the outer process tank, and the plurality of air inlets are distributed on a side of the cover away from the pivot end.
9. The semiconductor cleaning apparatus of claim 1 or 2, wherein the process tank assembly further comprises a plurality of temperature measurement assemblies disposed within the inner process tank for detecting a temperature of the cleaning fluid within the inner process tank.
10. The semiconductor cleaning apparatus according to claim 1 or 2, wherein saw-shaped teeth are provided on the side wall at the opening of the inner process tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010987933.XA CN112018006B (en) | 2020-09-18 | 2020-09-18 | Semiconductor cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010987933.XA CN112018006B (en) | 2020-09-18 | 2020-09-18 | Semiconductor cleaning equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112018006A true CN112018006A (en) | 2020-12-01 |
| CN112018006B CN112018006B (en) | 2024-06-21 |
Family
ID=73523077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010987933.XA Active CN112018006B (en) | 2020-09-18 | 2020-09-18 | Semiconductor cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112018006B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112713110A (en) * | 2020-12-28 | 2021-04-27 | 北京北方华创微电子装备有限公司 | Semiconductor cleaning equipment |
| CN114308848A (en) * | 2022-01-24 | 2022-04-12 | 北京北方华创微电子装备有限公司 | Cleaning equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000008734A (en) * | 1998-07-15 | 2000-02-15 | 윤종용 | Wafer cleaning apparatus having cleaning solution recurring and filtering functions |
| WO2008010319A1 (en) * | 2006-07-20 | 2008-01-24 | Nidec Sankyo Corporation | Cleaning device |
| JP2008086900A (en) * | 2006-09-30 | 2008-04-17 | Nidec Sankyo Corp | Cleaner |
| CN203526173U (en) * | 2013-09-13 | 2014-04-09 | 江苏晶鼎电子材料有限公司 | Exhaust outlet condensation reflux device for silicon wafer cleaning machine |
| CN208356723U (en) * | 2018-03-14 | 2019-01-11 | 天津朗星流体设备有限公司 | A kind of process gas section of vacuum lead condensate recovery system |
| CN111515188A (en) * | 2020-05-25 | 2020-08-11 | 广东凯尔迪清洗技术有限公司 | Cleaning solution regeneration circulating device |
-
2020
- 2020-09-18 CN CN202010987933.XA patent/CN112018006B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000008734A (en) * | 1998-07-15 | 2000-02-15 | 윤종용 | Wafer cleaning apparatus having cleaning solution recurring and filtering functions |
| WO2008010319A1 (en) * | 2006-07-20 | 2008-01-24 | Nidec Sankyo Corporation | Cleaning device |
| JP2008086900A (en) * | 2006-09-30 | 2008-04-17 | Nidec Sankyo Corp | Cleaner |
| CN203526173U (en) * | 2013-09-13 | 2014-04-09 | 江苏晶鼎电子材料有限公司 | Exhaust outlet condensation reflux device for silicon wafer cleaning machine |
| CN208356723U (en) * | 2018-03-14 | 2019-01-11 | 天津朗星流体设备有限公司 | A kind of process gas section of vacuum lead condensate recovery system |
| CN111515188A (en) * | 2020-05-25 | 2020-08-11 | 广东凯尔迪清洗技术有限公司 | Cleaning solution regeneration circulating device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112713110A (en) * | 2020-12-28 | 2021-04-27 | 北京北方华创微电子装备有限公司 | Semiconductor cleaning equipment |
| CN114308848A (en) * | 2022-01-24 | 2022-04-12 | 北京北方华创微电子装备有限公司 | Cleaning equipment |
| CN114308848B (en) * | 2022-01-24 | 2023-08-18 | 北京北方华创微电子装备有限公司 | Cleaning equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112018006B (en) | 2024-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111538360B (en) | Temperature control system and temperature control method | |
| CN112018006A (en) | Semiconductor cleaning equipment | |
| KR101584843B1 (en) | Liquid processing apparatus, liquid processing method, and storage medim | |
| JP6756824B2 (en) | Leakage resistant liquid cooling system with improved air purge mechanism | |
| US7628862B2 (en) | Treating solution supply nozzle, a substrate treating apparatus having this nozzle, and a method of manufacturing a treating solution supply nozzle | |
| TWI550220B (en) | Fluid control valves | |
| US20180277398A1 (en) | Substrate processing apparatus | |
| WO2004079805A1 (en) | Substrate-processing apparatus and temperature-regulating apparatus | |
| CN209744353U (en) | Vacuum type steam and hot water combined boiler | |
| CN110333446B (en) | New energy motor testing system | |
| TWI690384B (en) | Auxiliary device for providing temperature-increasing and lowering effect on main shaft of machine tool | |
| CN112394145A (en) | Low-pressure VOC (volatile organic compound) test device | |
| KR20180126823A (en) | Constant temperature and constant humidity apparatus of rack structure | |
| CN210070003U (en) | Water mixing device | |
| WO2019085161A1 (en) | Salt corrosion resistance test device | |
| CN205199543U (en) | High -efficient electric heating constant temperature water -bath for pharmacy | |
| CN116772628A (en) | Plate heat exchanger and temperature control system | |
| CN207334260U (en) | Steam tracing device | |
| CN116060151A (en) | Thermal cycle experimental device | |
| CN111208853B (en) | Mass flow control device, reaction chamber pressure control system and adjusting method | |
| JP3810890B2 (en) | Constant temperature and humidity air supply device | |
| WO2024221738A1 (en) | Hydrogen production system | |
| KR102466137B1 (en) | Fluid and or gas control apparatus with improved heating uniformity | |
| CN219309633U (en) | Waste gas treatment device for semiconductor wet process | |
| CN219177877U (en) | High-precision humidifying equipment with steam preheating and flow control valve |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |