CN112002704A - Flexible display panel, preparation method thereof and flexible display device - Google Patents

Abstract

The present application provides a flexible display panel, comprising: a flexible substrate; a protective layer disposed on one side of the flexible substrate; a display element layer disposed on the side of the flexible substrate away from the protective layer, the The protective layer can encapsulate the fines dropped during the preparation of the flexible display panel, so as to prevent the fines from damaging the flexible substrate. In addition, the present application also provides a preparation method of a flexible display panel and a flexible display device.

Description

Flexible display panel, preparation method thereof, and flexible display device

technical field

The present application relates to the field of display technology, and in particular, to a flexible display panel, a manufacturing method thereof, and a flexible display device.

Background technique

With the rapid development of display technology, the application scenarios of displays are increasingly diversified. With the development trend of thinner and lighter electronic products, various portable electronic products have higher and higher requirements for liquid crystal display panels. Today, bendable flexible displays have become the mainstream. Organic Light-Emitting Diode (OLED) display panels are widely used in smart products such as mobile phones, digital cameras, and notebook computers due to their advantages of self-luminescence, high contrast, fast response speed, and wide viewing angle. It has the advantages of light weight, thin thickness and strong bending resistance, making it one of the ideal choices for manufacturing flexible displays.

At present, the preparation method of OLED display panel is as follows: first, a flexible material layer is prepared on a rigid substrate; then, various electronic components and protective structures, such as thin film transistors, protective films, etc., are prepared on the flexible material layer; The material layer is peeled off from the rigid substrate; finally, a protective backsheet is attached to the peeled flexible material layer to protect the flexible material layer. Among them, during the bonding process of the protective backplane, a small amount of fines may fall off, and the dropped fines are mixed between the protective backplane and the flexible material layer, which has the risk of damaging the flexible material layer. If the falling fines are in the bending area, the flexible material layer will be double damaged during the bending process, and even cause the flexible material layer to be damaged and lose its protective effect on the thin film transistor, thereby shortening the life of the flexible display.

SUMMARY OF THE INVENTION

The present application provides a flexible display panel, a method for manufacturing the same, and a flexible display device to solve the problem in the prior art: during the bonding process of the protective backplane, there are fines that fall and are mixed into the protective backplane and the flexible display. Risk between layers of material, which can easily damage the layers of flexible material.

In a first aspect, the present application provides a flexible display panel, including:

flexible substrate;

a protective layer, disposed on one side of the flexible substrate; and

The display element layer is disposed on the side of the flexible substrate away from the protective layer.

At least the difference from the existing flexible display panel is that a protective layer is provided on the side of the flexible substrate facing away from the display element layer, instead of a protective backplane with a certain hardness, which can effectively prevent the flexible substrate from being damaged and is conducive to improving the Bending resistance of flexible display panels for extended service life.

In some embodiments of the present application, the material of the protective layer is graphene and/or ethylene-vinyl acetate copolymer.

In some embodiments of the present application, the thickness of the protective layer is 30 micrometers to 50 micrometers.

In some embodiments of the present application, the flexible display panel further includes: an encapsulation layer disposed on the display element layer.

In some embodiments of the present application, the flexible display panel further includes: a protective cover plate disposed on the encapsulation layer and disposed opposite to the flexible substrate. The protective cover plate further protects and encapsulates the display element, and effectively prevents the penetration of water vapor and oxygen.

In a second aspect, the present application provides a method for preparing a flexible display panel, which is used for preparing the flexible display panel described in the first aspect, including the following steps:

providing a carrier substrate on which a flexible substrate is prepared;

preparing a display element layer on the flexible substrate;

Separating the flexible substrate and the carrier substrate; and

On the side of the flexible substrate away from the display element layer, a protective layer is prepared by deposition technology.

The difference from the prior art is that after the flexible substrate and the carrier substrate are separated, the protective backplane is no longer attached to the flexible substrate, but the material is deposited on the flexible substrate through deposition technology, thereby A protective layer is formed, the protective layer can wrap the falling fines inside, so as to prevent the falling fines from damaging the flexible substrate.

Further, the use of deposition technology to prepare the protective layer is to use a low-temperature sputtering deposition method to prepare the protective layer, which has the advantages of simple process, uniform and dense protective layer, and strong bonding force with the flexible substrate.

In some embodiments of the present application, the manufacturing method of the flexible display panel further includes the step of: preparing an encapsulation layer on the display element layer. The encapsulation layer is used to protect various display elements and avoid external damage to the display elements.

In some embodiments of the present application, the manufacturing method of the flexible display panel further includes the step of: preparing a protective cover plate on the encapsulation layer.

In a third aspect, the present application provides a flexible display device, including the flexible display panel described in the first aspect.

The present application produces the following effects by providing a flexible display panel, a preparation method thereof, and a flexible display device:

The flexible display panel provided by the present application has a protective layer on the side of the flexible substrate away from the display element layer, and has the advantages of uniform and dense texture, strong bonding force with the flexible substrate, and stable properties. By controlling the material selection and thickness of the protective layer , further improving the bending performance of the flexible display panel, and will not have a negative impact on the characteristics of the flexible display panel.

The difference between the flexible display panel preparation method provided by the present application and the prior art is that after separating the flexible substrate and the carrier substrate, the method of attaching the protective backplane to the flexible substrate is changed, and the flexible A protective layer is formed on the substrate. On the one hand, the protective layer formed by deposition can wrap the falling fines inside, so as to avoid the falling fines from damaging the flexible substrate, thereby improving the bending performance of the flexible display panel and prolonging the service life of the display panel; On the one hand, since the flexible substrate is more sensitive to temperature and has a large thermal expansion coefficient, when the surface temperature of the flexible substrate rises, the stress between the protective backplane and the flexible substrate will cause the protective backplane to peel off, and the protection formed by deposition The bonding force between the layer and the flexible substrate is strong, and the protective effect of the protective layer on the flexible substrate will not be affected by temperature changes.

The flexible display panel provided by the present application is applied to a flexible display device, which has the advantages of ideal bending performance, long service life, and wide operating temperature range. The flexible display device can be a smart phone, a tablet computer, a notebook computer, a digital camera, Smart wearable devices, etc.

Description of drawings

The technical solutions and other beneficial effects of the present application will be apparent through the detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings.

FIG. 1 is a schematic cross-sectional view of a flexible display panel according to an embodiment of the present application.

FIG. 2 is a schematic flowchart of a manufacturing method of a flexible display panel according to an embodiment of the present application.

FIG. 3 is a schematic diagram of a flexible substrate damaged by fines in the prior art.

FIG. 4 is a schematic diagram of the protective layer wrapping the fines in the embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc., or The positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as a limitation on this application. In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as "first", "second" may expressly or implicitly include one or more of said features. In the description of the present application, "plurality" means two or more, unless otherwise expressly and specifically defined.

In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction of two elements relation. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

In this application, unless otherwise expressly specified and defined, a first feature "on" or "under" a second feature may include direct contact between the first and second features, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the application. Furthermore, this application may repeat reference numerals and/or reference letters in different instances for the purpose of simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, this application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

In a first aspect, an embodiment of the present application provides a flexible display panel, referring to FIG. 1 , which mainly includes: a flexible substrate 1 , a protective layer 12 and a display element layer, wherein the protective layer 12 is disposed on the flexible substrate On one side of the flexible substrate 1 , the display element layer is disposed on the side of the flexible substrate 1 away from the protective layer 12 .

Specifically, the material of the protective layer 12 is graphene and/or ethylene-vinyl acetate copolymer, preferably a mixture of graphene and ethylene-vinyl acetate copolymer. The thickness of the protective layer 12 is 30-50 microns. The protective layer 12 is formed on the flexible substrate 1 by a vapor deposition technique.

Specifically, the material of the flexible substrate 1 is polyimide (PI), polyethersulfone (PES), polycarbonate (PC), polyethylene terephthalate (PET), polyethylene naphthalene One or more of ethylene formate (PEN), polyarylate (PAR), and fiberglass reinforced plastic (FRP). Since polyimide (PI) has good heat resistance and stability, polyimide (PI) is preferable as the material of the flexible substrate 1 . The thickness of the flexible substrate 1 is 8 to 10 microns.

Specifically, the display element layer includes an OLED display unit 3 and a thin film transistor array layer 2, the OLED display unit 3 is disposed on the thin film transistor array layer 2, and the flexible display panel is a flexible active matrix organic light emitting two Polar body display panel. Alternatively, the display element layer includes an OLED display unit 3, corresponding to which the flexible display panel is a flexible passive matrix organic light emitting diode display panel.

In some embodiments, the flexible display panel further includes: an encapsulation layer 4 disposed on the display element layer.

In some embodiments, the flexible display panel further includes: a protective cover plate 7 disposed on the encapsulation layer 4 , and the protective cover plate 7 is disposed opposite to the flexible substrate 1 .

In some embodiments, the flexible display panel further includes: a touch layer 5 disposed between the encapsulation layer 4 and the protective cover plate 7 .

In some embodiments, the flexible display panel further includes: a polarizer 6 disposed between the encapsulation layer 4 and the protective cover plate 7 . For the flexible display panel with the touch layer 5 , the polarizer 6 is disposed between the touch layer 5 and the protective cover 7 .

For example, a flexible display panel, from bottom to top, includes: a protective layer 12 , a flexible substrate 1 , a thin film transistor array layer 2 , an OLED display unit 3 , an encapsulation layer 4 , a touch layer 5 , and a polarizing layer 6 , which are stacked in sequence. , a protective cover 7 and a protective film 8 for the protective cover.

The encapsulation layer 4 encapsulates the OLED display unit 3, and one end of the encapsulation layer 4 extends to the flexible substrate 1, and the other end extends to the thin film transistor on Array Layer 2.

A driving chip 11 is further provided between the protective cover plate 7 and the thin film transistor array layer 2 , and the driving chip 11 is used to amplify the input weak electric signal into a strong electric signal suitable for external equipment.

In the flexible display panel provided by the embodiments of the present application, a protective layer 12 is provided on the side of the flexible substrate 1 away from the display element layer. The advantages of strong bonding force and stable properties; in the process of depositing and forming the protective layer 12 , the falling fines 9 can be wrapped inside, effectively preventing the falling fines 9 from damaging the flexible substrate 1 . By controlling the material selection and thickness of the protective layer 12, the bending performance of the flexible display panel is further improved, and the characteristics of the flexible display panel are not negatively affected.

In the second aspect, an embodiment of the present application provides a method for preparing a flexible display panel, which is used to prepare the flexible display panel described in the first aspect. Referring to FIGS. 2 to 4 , FIG. 2 is the method provided in the embodiment of the present application. A schematic flowchart of a method for preparing a flexible display panel, including the following steps:

S1. Provide a carrier substrate (not shown), and prepare the flexible substrate 1 on the carrier substrate.

Various electronic components of the flexible display panel are usually fabricated on the flexible substrate 1, but since the flexible substrate 12 has the characteristics of low hardness, poor high temperature resistance, and high thermal expansion coefficient, it is easy to deform under the action of heat or force, so it cannot be Various electronic components are fabricated directly on the flexible substrate 1 . Therefore, it is necessary to fix the flexible substrate 1 on the carrier substrate first, and then fabricate various electronic components on the flexible substrate 1 .

Specifically, the carrier substrate is a rigid substrate, preferably a glass substrate as the carrier substrate.

Specifically, the material of the flexible substrate 1 is one or more of PI, PES, PC, PET, PEN, PAR and FRP, preferably PI.

Specifically, the flexible substrate 1 is prepared on the carrier substrate by a coating method, and the coating method may be spray coating, spin coating, or the like. The thickness of coating can be selected according to actual needs. The processes of coating the flexible material, drying and curing are sequentially performed on the carrier substrate to form the flexible substrate 1 .

S2. A display element layer is prepared on the flexible substrate 1 .

In some embodiments, the display element layer includes a plurality of organic light-emitting diode (Organic Light-Emitting Diode, OLED) display units 3, and each OLED display unit 3 includes: an anode layer, a light-emitting layer, and a cathode layer that are stacked in sequence. The light-emitting layer includes a hole transport layer, a light-emitting material layer and an electron transport layer sequentially formed on the anode layer.

Preferably, the preparation of the OLED display unit 3 by vacuum thermal evaporation includes the steps of: performing surface treatment on indium tin oxide (Indi micron tin oxide, ITO) glass; etching the ITO glass to form an anode pattern; cleaning the patterned ITO glass ; Carry out vacuum evaporation on ITO glass, and evaporate to form hole transport layer, luminescent material layer, electron transport layer, cathode layer and so on.

Preferably, the OLED display unit 3 is prepared by a solution film forming method, which is a conventional technical means in the field, and will not be repeated here.

Preferably, the OLED display unit 3 is prepared by an electronic printing process, and the electronic printing process may be an inkjet printing process. The specific steps include: sequentially printing an anode, a hole transport layer, a light-emitting material layer, an electron transport layer and a cathode layer on the flexible substrate 1 .

In some embodiments, the display element layer includes a thin film transistor array layer 2 and a plurality of OLED display units 3, and each OLED display unit 3 is equipped with one thin film transistor. The thin film transistor array layer 2 is disposed on the flexible substrate 1 , and the OLED display unit 3 is disposed on the side of the thin film transistor array layer 2 facing away from the flexible substrate 1 . The thin film transistor array layer 2 can be formed by depositing a thin film combined with a photolithography process, which is a conventional technical means in the art, and will not be repeated here.

The thin film transistor array layer 2 can also be prepared by an electronic printing process, including: preparing electronic ink; printing a patterned gate electrode on the flexible substrate 1 ; printing a gate insulation on the flexible substrate 1 layer, the gate insulating layer covers the gate electrode; patterned source and drain electrodes are printed on the gate insulating layer; patterned active electrodes are printed between the source and drain electrodes layer, two ends of the active layer are respectively connected to the source electrode and the drain electrode. Compared with depositing a thin film combined with a photolithography process to prepare the thin film transistor array layer 2, it has the advantage of a simple preparation process, which is conducive to reducing the thickness of the thin film transistor array layer 2, and conforms to the development trend of thin and light flexible display panels.

S3, the flexible substrate 1 and the carrier substrate are separated.

Specifically, the flexible substrate 1 and the carrier substrate are separated by a laser peeling method, and the contact surface of the flexible substrate 1 and the carrier substrate is cracked at high temperature by using a laser, so as to realize the peeling of the flexible substrate 1 .

S4. On the side of the flexible substrate 1 away from the display element layer, a protective layer 12 is prepared by deposition technology.

Specifically, after the flexible substrate 1 is peeled off from the carrier substrate, a protective layer 12 needs to be formed on the flexible substrate 1 to prevent the flexible substrate 1 from being damaged. In the embodiment of the present application, the protective layer 12 is prepared by vapor deposition. Preferably, the protective layer 12 is prepared on the flexible substrate 1 by low-temperature sputtering deposition, which has the advantages of simple process, uniform and dense protective layer 12, and flexible substrate. 1. The advantages of strong bonding force, etc., and the entire preparation process is carried out under low temperature conditions, which will not cause negative effects on the flexible substrate 1 with thermally sensitive characteristics. In the process of preparing the protective layer 12 by the low-temperature sputtering deposition method, the temperature is controlled at 80-90° C., the power is 7kw-8kw, and the film-forming time of the protective layer 12 is 300s-3000s.

In some embodiments, the material of the protective layer 12 is graphene and/or ethylene-vinyl acetate copolymer.

Graphene has the advantages of high strength, good toughness, good thermal conductivity, and flexibility. Therefore, it is one of the ideal choices as the material for the protective layer 12 . As the protective layer 12, graphene can effectively avoid external damage to the flexible substrate 1, and effectively release the stress generated when the flexible display panel is bent, further improving the bending performance of the flexible display panel; on the other hand, improving the flexibility The corrosion resistance of the display panel gives the flexible display panel the characteristics of dirt resistance and water resistance, which is beneficial to environmental protection.

The ethylene-vinyl acetate copolymer has good wear resistance, light weight, good elasticity and good flexibility, so it is one of the ideal choices as the material of the protective layer 12 . As the protective layer 12, the ethylene-vinyl acetate copolymer can effectively avoid external damage to the flexible substrate 1, and can effectively release the stress generated when the flexible display panel is bent, thereby further improving the bending performance of the flexible display panel; In one aspect, the weight of the flexible display panel can be reduced, and the development trend of thinner and lighter electronic products can be met.

The material of the protective layer 12 can be a mixture of graphene and ethylene-vinyl acetate copolymer, which can absorb the advantages of the two, avoid the disadvantages of the two, and further improve the quality of the flexible display panel.

In some embodiments, the thickness of the protective layer 12 is 30 micrometers to 50 micrometers.

The thickness of the protective layer 12 is in the range of 30 micrometers to 50 micrometers, which can not only effectively protect the flexible substrate 1 and the display element layer formed on the flexible substrate 1 , but also help to save the cost of products, which is very economical.

In some embodiments, the manufacturing method of the flexible display panel further comprises the steps of:

S2a, an encapsulation layer 4 is prepared on the display element layer.

Specifically, the display element layer may be oxidized when exposed to water and air, resulting in a significant decrease in the performance of the flexible display panel. Therefore, an encapsulation layer 4 needs to be prepared to protect the display element layer.

In some embodiments, the encapsulation layer 4 is prepared on the OLED display unit 3, and the encapsulation layer 4 wraps the OLED display unit 3 inside, so as to protect the OLED display unit 3 from external damage.

In some embodiments, a chemical vapor deposition method is used to form an encapsulation film layer on the display element layer, and the corresponding material of the encapsulation film layer may be inert compounds such as silicon nitride, silicon dioxide, and aluminum oxide.

In some embodiments, the encapsulation layer 4 is formed on the OLED display unit 3 by an electronic printing process, which is preferably an inkjet printing process.

In some embodiments, the manufacturing method of the flexible display panel further comprises the steps of:

S2b, preparing a protective cover plate 7 on the encapsulation layer 4 .

Specifically, the protective cover plate 7 is made of glass, metal or plastic material. Since ultra-thin glass has the advantages of good light transmittance and dense texture, and can effectively prevent the penetration of water vapor and oxygen, ultra-thin glass is preferably used as the protective cover plate 7 .

In some embodiments, the protective cover 7 is attached to the encapsulation layer 4 by optical adhesive (Optically Clear Adhesive, OCA), so that the protective cover 7 is glued on the encapsulation layer 4 .

In some embodiments, the protective cover 7 is formed on the encapsulation layer 4 through a coating process. The coating process may be slot coating, spin coating, or spray coating. Compared with the OCA attachment method, the protective cover 7 has a stronger binding force, and is conducive to reducing the thickness of the entire flexible display panel, effectively avoiding the problem that the protective cover 7 is detached when the flexible display panel is bent

In some embodiments, the manufacturing method of the flexible display panel further comprises the steps of:

S2c, a touch layer 5 is prepared between the encapsulation layer 4 and the protective cover plate 7 .

Specifically, the function of the touch layer 5 is to realize human-computer interaction, and it can be attached to the package layer 4 through OCA, so that the touch layer 5 is glued on the package layer 4 and located in the package layer 4 . between the layer 4 and the protective cover 7 .

In some embodiments, the touch layer 5 is formed by printing between the encapsulation layer 4 and the protective cover plate 7 using an electronic printing process, and the electronic printing process may be an inkjet printing process or a screen printing process. Compared with the OCA attachment method, the bonding force of the touch layer 5 is stronger, and it is beneficial to reduce the thickness of the entire flexible display panel, which effectively avoids the problem that the touch layer 5 is detached when the flexible display panel is bent.

Specifically, using an electronic printing process to prepare the touch layer 5 includes: using nano-silver electronic ink as a printing material, and printing the touch electrodes and electrode leads of the touch layer 5 on the packaging layer 4 .

In some embodiments, the manufacturing method of the flexible display panel further comprises the steps of:

S2d, a polarizer 6 is prepared between the encapsulation layer 4 and the protective cover plate 7 .

Specifically, the polarizer 6 has an anti-reflection function to increase the display contrast of the flexible display panel under strong light. The polarizer 6 can be attached to the encapsulation layer 4 by OCA, and the polarizer 6 is located between the encapsulation layer 4 and the protective cover plate 7 .

In some embodiments, the polarizer 6 is located between the touch layer 5 and the protective cover 7 , that is, the polarizer 6 is prepared and formed on the touch layer 5 .

In some embodiments, the polarizer 6 is prepared by a coating process. Compared with the OCA attachment method, the polarizer 6 has stronger bonding force, and is beneficial to reduce the thickness of the entire flexible display panel, effectively preventing the flexible display panel from The polarizer 6 has a problem of detachment during bending.

In the prior art, a protective backplane 10 needs to be attached to the peeled flexible substrate 1 to protect the flexible substrate 1 and the display element layer formed on the flexible substrate 1 . During the lamination process of the protective backplane 10, a small amount of fines 9 may drop. Referring to FIG. 3, the dropped fines 9 are interposed between the protective backplane 10 and the flexible substrate 1, and have damage flexibility. Substrate 1 risk. If the dropped fines 9 are located in the bending area of the flexible display panel, the fines 9 will doubly damage the flexible substrate 1 during the bending process of the flexible display panel, and even cause the flexible substrate 1 to be destroyed and lose its support to the display element layer. The protective effect of the flexible display panel shortens the life of the flexible display panel.

The difference from the prior art is that, after separating the flexible substrate 1 and the carrier substrate, the embodiment of the present application no longer adopts the protection method of laminating the protective backplane 10 on the flexible substrate 1, but uses the deposition technology in the flexible substrate. A protective layer 12 is formed on the substrate 1 . On the one hand, referring to FIG. 4 , the protective layer 12 formed by deposition can wrap the falling fines 9 inside, so as to prevent the falling fines 9 from damaging the flexible substrate 1, thereby improving the bending performance of the flexible display panel, and Extend the service life of the display panel; on the other hand, since the flexible substrate 1 is more sensitive to temperature and has a large thermal expansion coefficient, when the surface temperature of the flexible substrate 1 rises, the stress between the backplane 10 and the flexible substrate 1 is protected. The protective backsheet 10 will be peeled off, while the protective layer 12 formed by deposition has strong bonding force with the flexible substrate 1, and the protective effect of the protective layer 12 on the flexible substrate 1 will not be affected by temperature changes.

In a third aspect, an embodiment of the present application provides a flexible display device, where the flexible display device includes the flexible display panel disclosed in the first aspect.

Specifically, the flexible display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a notebook computer, a digital camera, a digital video camera, a smart wearable device, a smart weighing electronic scale, a vehicle-mounted display, and a TV. Wherein, the smart wearable device may be a smart bracelet, a smart watch, smart glasses, or the like.

In the above-mentioned embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

A flexible display panel, a manufacturing method thereof, and a flexible display device provided by the embodiments of the present application have been described in detail above. Specific examples are used in this paper to illustrate the principles and implementations of the present application. The descriptions of the above embodiments are only used to help understand the technical solutions and core ideas of the present application; those of ordinary skill in the art should understand that: it can still be Modifications are made to the technical solutions described in the foregoing embodiments, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. A flexible display panel, comprising: flexible substrate; a protective layer, disposed on one side of the flexible substrate; and The display element layer is disposed on the side of the flexible substrate away from the protective layer. 2 . The flexible display panel according to claim 1 , wherein the protective layer is made of graphene and/or ethylene-vinyl acetate copolymer. 3 . 3 . The flexible display panel according to claim 1 , wherein the protective layer has a thickness of 30 μm˜50 μm. 4 . 4 . The flexible display panel according to claim 1 , further comprising: an encapsulation layer disposed on the display element layer. 5 . 5 . The flexible display panel according to claim 1 , further comprising: a protective cover plate disposed on the packaging layer and disposed opposite to the flexible substrate. 6 . 6. A preparation method of a flexible display panel, characterized in that, for preparing the flexible display panel as claimed in any one of claims 1 to 5, comprising the steps of: providing a carrier substrate on which a flexible substrate is prepared; preparing a display element layer on the flexible substrate; Separating the flexible substrate and the carrier substrate; and On the side of the flexible substrate away from the display element layer, a protective layer is prepared by deposition technology. 7 . The method for preparing a flexible display panel according to claim 6 , wherein the preparing the protective layer by a deposition technique is to prepare the protective layer by a low-temperature sputtering deposition method. 8 . 8 . The manufacturing method of the flexible display panel according to claim 6 , further comprising the step of: preparing an encapsulation layer on the display element layer. 9 . 9 . The manufacturing method of the flexible display panel according to claim 6 , further comprising the step of: preparing a protective cover plate on the encapsulation layer. 10 . 10. A flexible display device, comprising the flexible display panel according to any one of claims 1 to 5.

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