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CN111982960A - High-temperature-resistant heat probe device for online measurement of heat conductivity coefficient based on hot wire method - Google Patents

High-temperature-resistant heat probe device for online measurement of heat conductivity coefficient based on hot wire method Download PDF

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Publication number
CN111982960A
CN111982960A CN202010810079.XA CN202010810079A CN111982960A CN 111982960 A CN111982960 A CN 111982960A CN 202010810079 A CN202010810079 A CN 202010810079A CN 111982960 A CN111982960 A CN 111982960A
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temperature
alloy
hot wire
measuring
heat
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陈磊
王聪
刘勇
刘松林
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Hefei Institutes of Physical Science of CAS
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Hefei Institutes of Physical Science of CAS
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00Investigating or analyzing materials by the use of thermal means
    • G01N25/20Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples

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  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
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  • General Health & Medical Sciences (AREA)
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  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

The invention discloses a high-temperature-resistant heat probe device for measuring heat conductivity coefficient on line based on a hot wire method, which comprises a heat probe body, a hot wire control system and a data acquisition system, wherein the heat probe body is provided with a plurality of heat conducting wires; the hot probe body comprises an alloy sleeve, an alloy wire, a nano composite high-temperature ceramic coating and a high-temperature micro armored thermocouple; the hot wire control system comprises an electric control switch and a constant direct current power supply; the heat probe body can adapt to a series of complex working conditions such as high temperature, strong mechanical load and the like. The hot wire control system can provide constant current for the alloy wire, the electric signals of the high-temperature miniature armored thermocouple are acquired on line, and the heat conductivity coefficient of the material can be obtained through data processing by a hot wire method. The high-temperature-resistant heat probe device for measuring the heat conductivity coefficient on line based on the hot wire method has the advantages of high temperature measurement range, high integration, small volume, quick response, simple and convenient operation and low cost, and can be applied to the on-line measurement of the heat conductivity coefficients of different types of materials under different working conditions (heat load, mechanical load and the like).

Description

High-temperature-resistant heat probe device for online measurement of heat conductivity coefficient based on hot wire method
Technical Field
The invention relates to the field of high-temperature and thermophysical property measurement, in particular to a high-temperature-resistant heat probe device for measuring a heat conductivity coefficient on line based on a hot wire method.
Background
The thermal conductivity coefficient is an important physical property parameter for evaluating the thermal conductivity of the material, and the material is concerned in the fields of thermal engineering, metallurgy, building, aerospace, chips and the like. The device for measuring the heat conductivity coefficient based on the hot wire method has the advantages of simple and convenient operation, rapid measurement, wide application range, simple equipment and the like, and is widely applied to engineering technology and scientific research. For example, the heat conductivity coefficient measurement of the tritium breeding ball bed in the nuclear fusion field, the ball bed is used as a tritium carrier produced in a fusion reactor solid tritium breeding blanket and is also a functional area for converting nuclear energy into heat energy in the blanket. The thermal conductivity of the clad has important influence on the thermal engineering safety design of the clad. Based on the special topic of the national magnetic confinement nuclear fusion development research, the plasma develops the design research of a water-cooling ceramic proliferation agent cladding concept (WCCB) which is one of CFETR candidate concepts, and the heat conductivity coefficients of different ball beds are measured by applying a hot wire method; for example, the heat conductivity coefficient of the heat insulation material in the building field is measured, the novel building heat insulation material has good material heat insulation performance, can effectively reduce the building energy consumption of China, and relieves the energy problem of China. The thermal conductivity is one of the important performance indexes for evaluating the thermal insulation performance of the thermal insulation material, and the thermal physical property measurement and detection of the novel building thermal insulation material are usually carried out by adopting a hot wire method.
The device for measuring the heat conductivity coefficient by the domestic hot wire method is provided with a plurality of devices, for example, Chen Lei et al (CN106969792) invents a ball bed comprehensive experiment measuring device which applies the hot wire method to measure different temperatures, different flow rates and different pressures, wherein a hot wire is fixed at the middle part of an experiment section, and three temperature sensors are used for measuring the temperature change of the hot wire; for example, Yanyanmin (CN105223228) invented a thermal conductivity measuring instrument, which uses thermal-conductive silicone grease as the probe filler, and the probe is internally provided with a heating unit (without a temperature measuring unit) for measuring the thermal conductivity of various soft materials; for example, Shenyong et al (CN109738485) invented a device for measuring the thermal conductivity of a material, which is used to measure the thermal conductivity of a solid sample block, and the temperature measuring range is 0-60 ℃. The above devices have the disadvantages that:
(1) the heating and temperature measurement of the measuring device is not sufficiently integrated;
(2) the measuring object of the measuring device has limitation, and cannot be widely applied;
(3) the measuring temperature range of the measuring device is small;
(4) the method is limited in applicable working conditions and is not suitable for online measurement of complex working conditions such as mechanical load.
The current method for measuring the temperature range is the laser flash method, and by using the method, the material with the thermal conductivity coefficient of 0.1-2000W/m.K can be measured, and the test temperature is RT-1000 ℃. But also has disadvantages: (1) the laser flash method has high device cost; (2) the measurement object is relatively rigid and is an isotropic, homogeneous, opaque sheet material.
Disclosure of Invention
In order to solve the technical problems, the invention provides a measuring probe with small volume, high temperature resistance and quick response for measuring the heat conductivity coefficient based on a hot wire method at high temperature, and provides a high temperature resistant probe device for measuring the heat conductivity coefficient on line based on the hot wire method, which can be used for measuring the heat conductivity coefficient of materials on line under the working conditions of high temperature, mechanical load and the like; the blank of the measurement of the heat conductivity coefficient probe at high temperature is made up, and a convenient means is provided for the research of the thermal property of the material and the like.
The technical scheme of the invention is as follows: a high-temperature-resistant thermal probe device for online measurement of heat conductivity coefficient based on a hot wire method comprises a thermal probe body, a hot wire control system and a data acquisition system, wherein the thermal probe body comprises an alloy sleeve, an alloy wire, a micro armored thermocouple and a nano composite ceramic coating, the alloy sleeve meets the requirement of length-diameter ratio L/D larger than 25 according to the measurement requirement of the hot wire method probe, L represents the length of the alloy sleeve, D represents the outer diameter, the alloy wire is arranged in the whole alloy sleeve in a U shape, the micro armored thermocouple is arranged at the axis position of the alloy sleeve, a thermocouple temperature measurement point is arranged at the L/2 position of the alloy sleeve and is used for measuring the temperature change of the alloy wire, the nano composite ceramic coating is formed by solidification of nano composite ceramic paint and is arranged on the surface of the alloy wire, the inner surface of the alloy sleeve and the surface of the high-temperature micro, gaps in the alloy sleeve are uniformly filled; the hot wire control system comprises a constant-current direct-current power supply, an alloy wire and an electric control switch, wherein the constant-current direct-current power supply provides an adjustable and constant current for the alloy wire to increase the temperature of the alloy wire, and the electric control switch is connected with the constant-current direct-current power supply and the alloy wire in series; the data acquisition system is used for signal acquisition and visualization, the probe is inserted into a material to be detected, after power is supplied to the alloy wire, the temperature change of the alloy wire can cause the change of the electric signal of the thermocouple, the data acquisition system visualizes the thermocouple signal acquired in real time into a curve chart, and the thermal conductivity coefficient of the material to be detected can be calculated through data processing by combining the hot wire method principle.
Furthermore, the thermal probe body integrates an alloy wire and a micro armored thermocouple, and adopts a nano composite ceramic coating as electric insulation between the alloy sleeve and the alloy wire and between the alloy wire and the high-temperature micro armored thermocouple and a gap filler in the alloy sleeve.
Furthermore, the constant-current direct-current power supply is used for providing a constant controllable current for the alloy wire, so that the alloy wire can meet the requirement of measuring the heat conductivity coefficient by a hot wire method.
Furthermore, the data acquisition system can record the change of the temperature of the alloy wire with time under constant current in real time and is used for calculating the heat conductivity coefficient of the measured material.
Furthermore, the micro armored thermocouple is a micro high-temperature armored thermocouple, the high temperature refers to RT-800 ℃, and the temperature range is from room temperature to 800 ℃.
Further, the nano composite ceramic coating is a high-temperature nano composite ceramic coating, the nano composite high-temperature ceramic coating can be insulated at high temperature, the coating material comprises one or a combination of high-resistance inorganic crystal materials of alumina, silicon nitride and mica sheets, and the high temperature is more than 800 ℃.
Further, the thermal conductivity of the particulate material, the solid material and the liquid material is measured using the probe apparatus described above.
The invention has the beneficial effects that:
(1) the high-temperature-resistant heat probe device with the built-in hot wire for online measurement of the heat conductivity coefficient can be suitable for online measurement of the heat conductivity coefficient of materials under a series of complex working conditions such as high temperature and strong mechanical load (due to the fact that the related probe is small in size, firm and high-temperature-resistant, and the applied working conditions are wide).
(2) The high-temperature-resistant heat probe device with the built-in hot wire for measuring the heat conductivity coefficient on line has the advantages of high integration, small volume and quick response.
(3) Compared with a probe heat conductivity coefficient instrument on the market, the high-temperature-resistant heat probe device with the built-in hot wire for measuring the heat conductivity coefficient on line has the advantages that the cost is greatly saved, the temperature measuring range is higher, the device is not limited by the type of materials, can be used for granular materials, solid materials, liquid materials and the like, is easy to modify and can adapt to more experimental conditions.
Drawings
FIG. 1 is a structural view of a probe apparatus of the present invention;
in the figure: 1. an alloy sleeve; 2. alloy wires; 3. nano composite high temperature ceramic coating; 4. a high temperature miniature sheathed thermocouple; 5. an electric control switch K; 6. a constant direct current power supply; 7. a data acquisition system.
Detailed Description
The technical solution in the embodiments of the present invention is clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
According to an embodiment of the invention, as shown in fig. 1, a high temperature resistant thermal probe device for online measurement of thermal conductivity based on a hot wire method comprises a thermal probe body, a hot wire control system and a data acquisition system 7, wherein the thermal probe body comprises an alloy sleeve 1, an alloy wire 2, a nano-composite high temperature ceramic coating 3 and a high temperature micro armored thermocouple 4; the hot wire control system comprises an electric control switch K5 and a constant direct current power supply 6; the alloy sleeve 1 meets the requirement of length-diameter ratio (L/D) more than 25 according to the measurement requirement of a hot wire method probe and is used as a shell of the hot wire probe; the alloy wires 2 are arranged in the whole alloy sleeve in a U shape; the high-temperature miniature armored thermocouple 4 is arranged at the axis position of the alloy sleeve, and a thermocouple temperature measuring point is arranged at the L/2 position of the alloy sleeve and is used for measuring the temperature change of the alloy wire 2; the nano composite high-temperature ceramic coating 3 is formed by solidifying nano composite high-temperature ceramic paint, is arranged on the surface of the alloy wire 2, the inner surface of the alloy sleeve 1 and the surface of the high-temperature micro armored thermocouple 4, uniformly fills gaps in the alloy sleeve 1 and is used for electrical insulation among all parts; the constant current direct current power supply 6 provides an adjustable and constant current for the alloy wire 2 to increase the temperature of the alloy wire; the electric control switch 5 is connected with the constant-current direct-current power supply 6 and the alloy wire 2 in series and is used for controlling the constant-current direct-current power supply; the data acquisition system 7 is used for signal acquisition and visualization, and can visualize the thermocouple signals acquired in real time into a curve graph. When measuring, the probe device is inserted into an object to be measured to perform measurement.
According to an embodiment of the invention, preferably, the micro armored thermocouple is a micro high-temperature armored thermocouple, and the high temperature is RT-800 ℃.
According to an embodiment of the present invention, the nano composite high temperature ceramic coating can insulate at high temperature, and optionally, the coating material includes high resistance inorganic crystal material alumina, silicon nitride, mica sheet, and the high temperature is from 800 ℃ or above.
In addition, the high temperature resistant heat probe apparatus with built-in hot wire for online measurement of thermal conductivity according to the present invention has high integration, a minimum dimension diameter D of 2mm and a length L of 50 mm. It is also possible to design according to the space actually measured. The miniature armored thermocouple in the heat probe is closely arranged with the alloy wire, and the miniature armored thermocouple can immediately measure the temperature change of the alloy wire after the alloy wire is electrified, so the invention has the advantages of small volume and quick response.
Although the foregoing description describes illustrative embodiments of the invention to facilitate understanding thereof by those skilled in the art. It is to be understood that the invention is not limited in scope to the specific embodiments, but that various changes may be apparent to those skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (7)

1. The utility model provides a high temperature resistant hot probe device based on hot wire method on-line measuring coefficient of heat conductivity which characterized in that:
the thermal probe comprises a thermal probe body, a hot wire control system and a data acquisition system, wherein the thermal probe body comprises an alloy sleeve, an alloy wire, a micro armored thermocouple and a nano composite ceramic coating, the alloy sleeve meets the requirement that the length-diameter ratio L/D is more than 25 according to the measurement requirement of a hot wire method probe, L represents the length of the alloy sleeve, D represents the outer diameter, the alloy wire is arranged in the whole alloy sleeve in a U shape, the micro armored thermocouple is arranged at the axis position of the alloy sleeve, a thermocouple temperature measurement point is arranged at the L/2 position of the alloy sleeve and is used for measuring the temperature change of the alloy wire, and the nano composite ceramic coating is formed by solidifying a nano composite ceramic coating and is arranged on the surface of the alloy wire, the inner surface of the alloy sleeve and the surface of the high-temperature micro armored thermocouple and uniformly fills gaps in the alloy; the hot wire control system comprises a constant-current direct-current power supply, an alloy wire and an electric control switch, wherein the constant-current direct-current power supply provides an adjustable and constant current for the alloy wire to increase the temperature of the alloy wire, and the electric control switch is connected with the constant-current direct-current power supply and the alloy wire in series; the data acquisition system is used for signal acquisition and visualization, the probe is inserted into a material to be detected, after power is supplied to the alloy wire, the temperature change of the alloy wire can cause the change of the electric signal of the thermocouple, the data acquisition system visualizes the thermocouple signal acquired in real time into a curve chart, and the thermal conductivity coefficient of the material to be detected can be calculated through data processing by combining the hot wire method principle.
2. The high-temperature-resistant heat probe device for measuring the thermal conductivity on line based on the hot wire method according to claim 1, wherein:
the thermal probe body integrates an alloy wire and a micro armored thermocouple, and adopts a nano composite ceramic coating as electric insulation between the alloy sleeve and the alloy wire and between the alloy wire and the micro armored thermocouple and a gap filler in the alloy sleeve.
3. The high-temperature-resistant heat probe device for measuring the thermal conductivity on line based on the hot wire method according to claim 1, wherein:
the constant-current direct-current power supply is used for providing a constant controllable current for the alloy wire, so that the alloy wire can meet the requirement of measuring the heat conductivity coefficient by a hot wire method.
4. The high-temperature-resistant heat probe device for measuring the thermal conductivity on line based on the hot wire method according to claim 1, wherein:
the data acquisition system can record the change of the temperature of the alloy wire with time under constant current in real time and is used for calculating the heat conductivity coefficient of the measured material.
5. The high-temperature-resistant heat probe device for measuring the thermal conductivity on line based on the hot wire method according to claim 1, wherein: the miniature armored thermocouple is a miniature high-temperature armored thermocouple, the high temperature refers to RT-800 ℃, and the temperature range is from room temperature to 800 ℃.
6. The high-temperature-resistant heat probe device for measuring the thermal conductivity on line based on the hot wire method according to claim 1, wherein: the nano composite ceramic coating is a high-temperature nano composite ceramic coating, the nano composite high-temperature ceramic coating can be insulated at high temperature, the coating material comprises one or a combination of high-resistance inorganic crystal materials of alumina, silicon nitride and mica sheets, and the high temperature is more than 800 ℃.
7. The high-temperature-resistant heat probe device for measuring the thermal conductivity on line based on the hot wire method according to claim 1, wherein:
the thermal conductivity of the particulate material, solid material and liquid material was measured using the probe apparatus described above.
CN202010810079.XA 2020-08-13 2020-08-13 High-temperature-resistant heat probe device for online measurement of heat conductivity coefficient based on hot wire method Pending CN111982960A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114034733A (en) * 2021-11-29 2022-02-11 吉林大学 Multifunctional unsaturated soil in-situ matrix suction measuring instrument
CN114386286A (en) * 2022-01-18 2022-04-22 上海交通大学 Main insulation heat conductivity coefficient calculation method and system based on high-heat-conductivity mica tape manufacturing
CN115248231A (en) * 2022-07-19 2022-10-28 北京工业大学 Measuring device and system for thermal conductivity of magnetic liquid

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114034733A (en) * 2021-11-29 2022-02-11 吉林大学 Multifunctional unsaturated soil in-situ matrix suction measuring instrument
CN114386286A (en) * 2022-01-18 2022-04-22 上海交通大学 Main insulation heat conductivity coefficient calculation method and system based on high-heat-conductivity mica tape manufacturing
CN114386286B (en) * 2022-01-18 2023-08-08 上海交通大学 Main insulation heat conductivity coefficient calculation method and system based on high heat conductivity mica tape manufacturing
CN115248231A (en) * 2022-07-19 2022-10-28 北京工业大学 Measuring device and system for thermal conductivity of magnetic liquid
CN115248231B (en) * 2022-07-19 2024-06-11 北京工业大学 Measuring device and system for heat conduction performance of magnetic liquid

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Application publication date: 20201124