CN111968536B - Shielding belt and preparation method of display module - Google Patents
Shielding belt and preparation method of display module Download PDFInfo
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- CN111968536B CN111968536B CN202010942349.2A CN202010942349A CN111968536B CN 111968536 B CN111968536 B CN 111968536B CN 202010942349 A CN202010942349 A CN 202010942349A CN 111968536 B CN111968536 B CN 111968536B
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- layer
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- flexible circuit
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- shielding tape
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application provides a shielding belt and a preparation method of a display module, wherein in the shielding belt, a first substrate comprises a first part; the first glue layer is at least arranged on the first part; the signal shielding structure layer is arranged on the first adhesive layer and is overlapped with the first part; the second glue layer is arranged on the signal shielding structure layer. The shielding belt integrates the substrate and the signal shielding structure layer, and facilitates the subsequent preparation process of the display module.
Description
Technical Field
The application relates to the technical field of display, in particular to a shielding belt and a preparation method of a display module.
Background
Flexible circuit board (FPC) designs are getting smaller and smaller with screen shops. When the FPC with the too small size is bent, the overturning adsorption area of the equipment is not enough, and the production cannot be carried out. This requires that the FPC design incorporate a guide film (guide film) that increases the suction area. The guide film is large and is easy to fall off in the using process; in addition, the FPC is bent to the back of the display panel, the guide film is torn off, then the shielding tape is attached to the FPC, and the shielding tape is attached to the FPC after bending, so that the circuit of the FPC is easily damaged, and yield loss is caused.
Disclosure of Invention
The embodiment of the application provides a shielding tape and a preparation method of a display module, and aims to solve the technical problems that a guide film is easy to fall off in the process of binding and attaching the shielding tape to an FPC (flexible printed circuit) of the existing display module, and a circuit of the FPC is easy to damage when the shielding tape is attached to the bent FPC.
The embodiment of the application provides a shielding tape, it includes:
a first substrate comprising a first portion;
the first adhesive layer is at least arranged on the first part and comprises a first state and a second state, and the adhesive force of the first adhesive layer in the first state is greater than that of the first adhesive layer in the second state;
the signal shielding structure layer is arranged on the first adhesive layer and is overlapped with the first part; and
and the second adhesive layer is arranged on the signal shielding structure layer.
In the shielding tape of this embodiment, the first substrate includes a second portion, and the first portion is connected to the second portion and located on one side of the second portion.
In the shielding tape of the present embodiment, the shielding tape further includes a second substrate; the first glue layer is also arranged on the second part; the second substrate is attached to the first glue layer, and the second substrate and the second portion are arranged in an overlapping mode.
In the shielding tape of this embodiment, the signal shielding structure layer includes a conductive cloth, and the second adhesive layer is an insulating layer.
In the shielding tape of this embodiment, the signal shielding structure layer further includes a wave-absorbing layer and an insulating glue layer, the conductive cloth, the insulating glue layer, the wave-absorbing layer and the second glue layer are sequentially disposed on the first glue layer.
In the shielding band of this embodiment, the signal shielding structure layer still includes ripples layer, foam blanket and insulating glue film, it has set gradually on the first glue film insulating glue film conductive cloth the ripples layer the foam blanket with the second glue film.
In the shielding tape of this embodiment, the first adhesive layer is an ultraviolet light adhesive reducing layer or a thermal adhesive reducing layer.
In the shielding tape of this embodiment, the material of the first substrate is one of polyethylene terephthalate, polyvinyl chloride, polyethylene, and polystyrene.
The application also relates to a preparation method of the display module, which comprises the following steps:
providing a flexible circuit board, a display panel and the shielding tape of the above embodiment;
binding and connecting the flexible circuit board with the display panel;
attaching the shielding tape to one surface of the flexible circuit board with the component;
bending the flexible circuit board to the back of the display panel;
weakening the adhesive force of the first adhesive layer;
and removing the first substrate and the first glue layer.
The method for manufacturing a display module according to this embodiment is characterized in that the first substrate further includes a second portion, the first portion is connected to the second portion, and the first portion is located on one side of the second portion;
the step of bending the flexible circuit board to the back of the display panel includes:
adsorbing at least the second portion with an adsorbent member;
the adsorption part is turned over to drive the flexible circuit board to be turned over to the back of the display panel;
and attaching the flexible circuit board to the back surface of the display panel.
The shielding belt integrates the substrate and the signal shielding structure layer, so that the subsequent preparation process of the display module is facilitated; specifically, in the preparation process of the display module, the flexible circuit board is firstly bound and connected with the display panel, then the shielding belt is attached to the surface of the flexible circuit board with the components, and then the flexible circuit board is bent to the back of the display panel; because the shielding belt is attached before the bending step, on one hand, the risk of substrate separation is reduced, on the other hand, the flexible circuit board is prevented from being attached with the shielding belt after being bent, and further, the damage of the circuit of the flexible circuit board is avoided.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required in the embodiments are briefly described below. The drawings in the following description are only some embodiments of the present application, and it will be obvious to those skilled in the art that other drawings can be obtained from the drawings without inventive effort.
FIG. 1 is a schematic structural view of a shielding tape according to a first embodiment of the present application;
FIG. 2 is an exploded view of a first embodiment of the shielding tape of the present application;
FIG. 3 is a schematic structural view of a shielding tape according to a second embodiment of the present application;
FIG. 4 is a schematic structural view of a third embodiment of the shielding tape of the present application;
FIG. 5 is a flowchart illustrating a method for fabricating a display module according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of step S2 of the method for manufacturing a display module according to the embodiment of the present application;
fig. 7 is a schematic structural diagram of step S3 of the method for manufacturing a display module according to the embodiment of the present application;
fig. 8 is a schematic structural diagram of step S4 of the method for manufacturing a display module according to the embodiment of the present application;
fig. 9 is a schematic structural diagram of step S6 of the method for manufacturing a display module according to the embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. To simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of a shielding tape according to a first embodiment of the present application; fig. 2 is a schematic view of an exploded structure of the shielding tape according to the first embodiment of the present application.
The first embodiment of the present application provides a shielding tape 100, and the shielding tape 100 is used for preparing a display module. Specifically, the flexible circuit board for attaching to the display module is arranged on the side with the components, so that external signal interference is avoided. Including but not limited to chips, resistors, capacitors, and transistors.
The shielding tape 100 of the first embodiment includes a first substrate 11, a first adhesive layer 12, a signal shielding structure layer 13, and a second adhesive layer 14.
The first substrate 11 includes a first portion 111 and a second portion 112. The first portion 111 is connected to the second portion 112, and the first portion 111 is located at one side of the second portion 112. That is, the first portion 111 and the second portion 112 are integrally formed, and the materials of the two are the same.
The first glue layer 12 is arranged at least on the first portion 111. The first adhesive layer 12 includes a first state and a second state, and the adhesive force of the first adhesive layer 12 in the first state is greater than the adhesive force of the first adhesive layer 12 in the second state.
The signal shielding structure layer 13 is disposed on the first adhesive layer 12. The signal shielding structure layer 13 is disposed to overlap the first portion 111. The second adhesive layer 14 is disposed on the signal shielding structure layer 13.
The shielding tape 100 of the first embodiment integrates the substrate and the signal shielding structure layer, so as to facilitate the subsequent manufacturing process of the display module, wherein the substrate includes the first substrate 11 and the second substrate 15. Specifically, in the preparation process of the display module, the flexible circuit board is firstly bound and connected with the display panel, then the shielding tape 100 is attached to the surface of the flexible circuit board with the components, and then the flexible circuit board is bent to the back of the display panel; because the shielding tape 100 is attached before the bending step, on one hand, the risk of substrate separation is reduced, and on the other hand, the flexible circuit board is prevented from being attached with the shielding tape after being bent, and further, the circuit of the flexible circuit board is prevented from being damaged.
Moreover, compared with the guide film in the prior art, the first portion 111 is more convenient to be absorbed without arranging an avoiding hole to avoid components in the flexible circuit board.
In the first embodiment, due to the multi-functionalization of the display panel, the assembling space is smaller and smaller, so that the design of the flexible circuit board is smaller and smaller, and the area of the signal shielding structure layer 13 of the shielding tape 100 is smaller, which results in insufficient absorption area and is not beneficial to turning over the flexible circuit board. Therefore, the first substrate 11 of the shielding tape 100 of the first embodiment includes the second portion 112, and the second portion 112 is formed by extending the sidewall of the first portion 111 outward, so as to increase the area available for absorption.
Additionally, in some embodiments, the first portion 111 and the second portion 112 may also be connected together by a medium, such as an adhesive.
In the shielding tape 100 of the present first embodiment, the shielding tape 100 further includes a second substrate 15. The first layer of glue 12 is also disposed on the second portion 112. The second substrate 15 is attached to the first adhesive layer 12. The second substrate 15 is disposed to overlap the second portion 112. The first embodiment arranges the first adhesive layer 12 and the second substrate 15 on the second portion 112, which is to improve the rigidity of the shielding tape 100 in the area corresponding to the second portion 112, so as to facilitate the absorption and the subsequent turning; secondly, the shielding belt 100 is convenient to prepare, and the preparation efficiency is improved.
Of course, in some embodiments, the first adhesive layer 12 of the shielding tape 100 may not be provided with the second portion 112, and the second substrate 15 may not be provided on the second portion 112.
In the shielding tape 100 of the first embodiment, the signal shielding structure layer 13 includes a conductive cloth 131. The second adhesive layer 14 is an insulating layer. Specifically, the conductive cloth 131 is disposed on the first adhesive layer 12, and the second adhesive layer 14 is disposed on the conductive cloth 131.
In the shielding tape 100 of the first embodiment, the first adhesive layer 12 is optionally an ultraviolet light adhesive reducing layer or a thermal adhesive reducing layer. Specifically, when the first adhesive layer 12 is an ultraviolet light-reducing adhesive, the state of the first adhesive layer 12 before being irradiated by ultraviolet light is a first state, and the state of the first adhesive layer 12 after being irradiated by ultraviolet light is a second state, at this time, the adhesive force of the first adhesive layer 12 in the first state is greater than the adhesive force of the second adhesive layer 12 in the second state; when the first adhesive layer 12 is a thermal adhesive reducing agent, the state of the first adhesive layer 12 before being heated is a first state, and the state of the first adhesive layer 12 after being heated is a second state, at this time, the adhesive force of the first adhesive layer 12 in the first state is greater than the adhesive force of the second adhesive layer 12 in the second state.
The material of the first substrate 11 and the second substrate 115 is one of polyethylene terephthalate (PET), polyvinyl chloride (PVC), Polyethylene (PE), and Polystyrene (PS), but is not limited thereto.
Referring to fig. 3, a difference between the shielding tape 200 of the second embodiment and the shielding tape 100 of the first embodiment is that the signal shielding structure layer 13 of the shielding tape 200 of the second embodiment further includes an insulating glue layer 132 and a wave absorbing layer 133. The first adhesive layer 12 is sequentially provided with the conductive cloth 131, the insulating adhesive layer 132, the wave-absorbing layer 133 and the second adhesive layer 14.
Wherein the wave-absorbing layer 133 is formed of a wave-absorbing material. Wave-absorbing material refers to a material capable of absorbing or greatly reducing the electromagnetic wave energy received by the surface of the material, thereby reducing the interference of the electromagnetic wave
Referring to fig. 4, a difference between the shielding tape 300 of the third embodiment and the shielding tape 100 of the first embodiment is that the signal shielding structure layer 13 of the shielding 300 of the third embodiment further includes an insulating glue layer 132, a wave absorbing layer 133, and a foam layer 134. The insulation adhesive layer 132, the conductive cloth 131, the wave-absorbing layer 133, the foam layer 134 and the second adhesive layer 14 are sequentially disposed on the first adhesive layer 12.
Referring to fig. 5, fig. 5 is a flowchart illustrating a method for manufacturing a display module according to an embodiment of the disclosure. The application also relates to a preparation method of the display module 1000, which comprises the following steps:
step S1: providing a flexible circuit board, a display panel and a shielding tape;
step S2: binding and connecting the flexible circuit board with the display panel;
step S3: attaching the shielding tape to one surface of the flexible circuit board with the component;
step S4: bending the flexible circuit board to the back of the display panel;
step S5: weakening the adhesive force of the first adhesive layer;
step S6: and removing the first substrate and the first glue layer.
The shielding tape is the shielding tape of the above embodiments, such as the shielding tape 100 of the first embodiment, the shielding tape 200 of the second embodiment, and the shielding tape 300 of the third embodiment.
The manufacturing method of this embodiment uses the shielding tape integrated with the substrate and the signal shielding structure layer in the above embodiments to manufacture the display module, wherein the substrate includes the first substrate 11.
Specifically, the flexible circuit board is bound and connected with the display panel, then the shielding belt is attached to one surface of the flexible circuit board, which is provided with the components, and then the flexible circuit board is bent to the back of the display panel; because the shielding belt is attached before the bending step, on one hand, the risk of substrate separation is reduced, on the other hand, the flexible circuit board is prevented from being attached with the shielding belt after being bent, and further, the damage of the circuit of the flexible circuit board is avoided.
The following description of the manufacturing method of this embodiment will take the shielding tape 100 of the first embodiment as an example to describe the manufacturing method of the display module 1000.
Step S1: the flexible circuit board 21, the display panel 22, and the shield tape 100 are provided. Subsequently, the process proceeds to step S2.
Step S2: and binding and connecting the flexible circuit board 21 and the display panel 22, as shown in fig. 6.
Specifically, the flexible circuit board 21 is electrically and fixedly connected to a portion of the bonding region of the display panel 22. The display panel 22 may be an organic light emitting diode panel, a liquid crystal panel, or a Mini-LED panel, but is not limited thereto.
Subsequently, the process proceeds to step S3.
Step S3: the shielding tape 100 is attached to the side of the flexible circuit board 21 having the components, as shown in fig. 7.
Specifically, the second adhesive layer of the shielding tape 100 is attached to the flexible circuit board 21. Including but not limited to chips, resistors, capacitors, and transistors. In the embodiment, the step of attaching the shielding tape 100 to the flexible circuit board 21 is performed before the bending step, so that the flexible circuit board is prevented from being attached to the shielding tape after being bent, and further, the circuit of the flexible circuit board 21 is prevented from being damaged. In addition, the step of attaching the shielding tape 100 to the flexible circuit board 21 of the present embodiment is provided after the binding step, reducing the risk that the first substrate 11 of the shielding tape 100 is easily detached.
Subsequently, the process proceeds to step S4.
Step S4: the flexible circuit board 21 is bent to the back surface of the display panel 22, as shown in fig. 8.
Specifically, as shown in fig. 1, the first substrate 11 further includes a second portion 112, and the first portion 111 is connected to the second portion 112. The first portion 111 is located at one side of the second portion 112.
Step S4 includes:
a first step of adsorbing at least the second portion 112 using an adsorption member; that is, the adsorbing member may adsorb only the second portion 112, or may adsorb both the first portion 111 and the second portion 112.
Secondly, turning over the adsorption part to drive the flexible circuit board 21 to turn over to the back of the display panel 22; since the shielding tape 100 is attached to the flexible circuit board 21, when the suction component is turned over, the shielding tape 100 and the flexible circuit board 21 are driven to turn over together until the flexible circuit board 21 is bent to the back of the display panel 22.
Third, the flexible circuit board 21 is attached to the back surface of the display panel 22.
Subsequently, the process proceeds to step S4.
Step S5: the adhesive force of the first adhesive layer 12 is weakened.
Specifically, when the first adhesive layer 12 is the ultraviolet light-reducing adhesive, the ultraviolet light is irradiated on the first adhesive layer 12 to weaken the adhesive force of the first adhesive layer 12; when the first adhesive layer 12 is a thermal adhesive, the adhesive force of the first adhesive layer 12 is weakened by thermally radiating or heating the first adhesive layer 12.
The weakening of the adhesive force of the first adhesive layer 12 facilitates the tearing off of the first substrate 11, the second substrate 15 and the first adhesive layer 12 in the subsequent steps.
Subsequently, the process proceeds to step S6.
Step S6: and removing the first substrate and the first glue layer, as shown in fig. 9.
Specifically, after the first substrate 11, the second substrate 15 and the first adhesive layer 12 are torn off, the signal shielding structure layer 13 is attached to the flexible circuit board 21.
Thus, the manufacturing process of the display module is completed.
The shielding belt integrates the substrate and the signal shielding structure layer, so that the subsequent preparation process of the display module is facilitated; specifically, in the preparation process of the display module, the flexible circuit board is firstly bound and connected with the display panel, then the shielding belt is attached to the surface of the flexible circuit board with the components, and then the flexible circuit board is bent to the back of the display panel; because the shielding belt is attached before the bending step, on one hand, the risk of substrate separation is reduced, on the other hand, the flexible circuit board is prevented from being attached with the shielding belt after being bent, and further the damage of the circuit of the flexible circuit board 21 is avoided.
The shielding tape and the display module manufacturing method provided by the embodiment of the present application are described in detail above, a specific example is applied in the description to explain the principle and the implementation manner of the present application, and the description of the above embodiment is only used to help understand the technical scheme and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (8)
1. A shielding tape, comprising:
a first substrate comprising a first portion;
the first adhesive layer is at least arranged on the first part and comprises a first state and a second state, and the adhesive force of the first adhesive layer in the first state is greater than that of the first adhesive layer in the second state;
the signal shielding structure layer is arranged on the first adhesive layer and is overlapped with the first part; and
the second adhesive layer is arranged on the signal shielding structure layer;
the first substrate includes a second portion, the first portion is connected to the second portion, the first portion is located at one side of the second portion, the second portion is formed by extending outward from a sidewall of the first portion, and the second portion is used for increasing an area that can be adsorbed.
2. The shielding tape of claim 1, wherein the shielding tape further comprises a second substrate; the first glue layer is also arranged on the second part; the second substrate is attached to the first glue layer, and the second substrate and the second portion are arranged in an overlapping mode.
3. The shielding tape of claim 1, wherein the signal shielding structure layer comprises a conductive cloth, and the second adhesive layer is an insulating layer.
4. The shielding tape according to claim 3, wherein the signal shielding structure layer further comprises a wave-absorbing layer and an insulating glue layer, and the conductive cloth, the insulating glue layer, the wave-absorbing layer and the second glue layer are sequentially disposed on the first glue layer.
5. The shielding tape according to claim 3, wherein the signal shielding structure layer further comprises a wave absorbing layer, a foam layer and an insulating glue layer, and the insulating glue layer, the conductive cloth, the wave absorbing layer, the foam layer and the second glue layer are sequentially arranged on the first glue layer.
6. The masking tape of claim 1, wherein the first adhesive layer is an ultraviolet light reduced adhesive or a thermal reduced adhesive.
7. The shielding tape of claim 1, wherein the material of the first substrate is one of polyethylene terephthalate, polyvinyl chloride, polyethylene, and polystyrene.
8. A preparation method of a display module is characterized by comprising the following steps:
providing a flexible circuit board, a display panel and the shielding tape of any one of claims 1-7;
binding and connecting the flexible circuit board with the display panel;
attaching the shielding tape to one surface of the flexible circuit board, which is provided with the components;
bending the flexible circuit board to the back of the display panel;
weakening the adhesive force of the first adhesive layer;
removing the first substrate and the first glue layer;
the step of bending the flexible circuit board to the back of the display panel includes:
adsorbing at least the second portion with an adsorbent member;
the adsorption part is turned over to drive the flexible circuit board to be turned over to the back of the display panel;
and attaching the flexible circuit board to the back surface of the display panel.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010942349.2A CN111968536B (en) | 2020-09-09 | 2020-09-09 | Shielding belt and preparation method of display module |
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| CN2569515Y (en) * | 2002-09-06 | 2003-08-27 | 广州安可玛软性电路有限公司 | Soft circuit boardwith electromagnetic shield layer |
| JP2012227404A (en) * | 2011-04-21 | 2012-11-15 | Sumitomo Electric Printed Circuit Inc | Flexible printed wiring board |
| JP2013093518A (en) * | 2011-10-27 | 2013-05-16 | Fujimori Kogyo Co Ltd | Manufacturing method of electromagnetic wave shield material for fpc |
| CN106042519A (en) * | 2015-04-17 | 2016-10-26 | 藤森工业株式会社 | FPC conductive bonding sheet and FPC using same |
| JP2016207738A (en) * | 2015-04-17 | 2016-12-08 | 藤森工業株式会社 | Conductive adhesive sheet for FPC and FPC using the same |
| JP2016154267A (en) * | 2016-05-18 | 2016-08-25 | 藤森工業株式会社 | Manufacturing method of electromagnetic wave shield material for fpc |
| CN106028769A (en) * | 2016-05-27 | 2016-10-12 | 武汉华星光电技术有限公司 | Display panel and display terminal |
| CN105960157A (en) * | 2016-07-06 | 2016-09-21 | 武汉华星光电技术有限公司 | Electromagnetic shielding protection film and FPC (flexible printed circuit) |
| CN208940031U (en) * | 2018-11-21 | 2019-06-04 | Tcl移动通信科技（宁波）有限公司 | A kind of screen mould group and mobile terminal |
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| CN111968536A (en) | 2020-11-20 |
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