CN111966187A - External plug-in card heat dissipation management device and method applied to high-density server - Google Patents
External plug-in card heat dissipation management device and method applied to high-density server Download PDFInfo
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- CN111966187A CN111966187A CN202010925306.3A CN202010925306A CN111966187A CN 111966187 A CN111966187 A CN 111966187A CN 202010925306 A CN202010925306 A CN 202010925306A CN 111966187 A CN111966187 A CN 111966187A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000005057 refrigeration Methods 0.000 claims abstract description 32
- 238000010438 heat treatment Methods 0.000 claims abstract description 29
- 238000007726 management method Methods 0.000 claims description 14
- 238000012544 monitoring process Methods 0.000 claims description 11
- 239000004519 grease Substances 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 238000013507 mapping Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 abstract description 4
- 230000001276 controlling effect Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000013021 overheating Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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Abstract
The invention provides an external card heat dissipation management device and method applied to a high-density server, wherein a local temperature control circuit is added in a server node, the temperature of an area with larger heat productivity is detected through an NTC thermistor or a temperature sensor, when the temperature exceeds an allowable range, the temperature control circuit starts to work, the current passing through a TEC refrigeration sheet is regulated and controlled through a PWM wave, and then the refrigeration is carried out through the TEC refrigeration sheet, so that the temperature of a heating board card is reduced, and the area temperature of the heating board card is controlled within a safe range. Because the TEC refrigeration plate is arranged above the heating plate card or is closely arranged, the inner space of the node is not occupied; the temperature control circuit of the refrigerating sheet is integrated into the board card shell, so that the heat dissipation can be enhanced and the confidentiality can be ensured; the refrigerating sheet uses a DSP chip, a control circuit is simple, and CPLD or BMC resources in the server are prevented from being occupied; and the control precision is high through the closed-loop control of temperature feedback.
Description
Technical Field
The invention relates to the technical field of server heat dissipation, in particular to an external plug-in card heat dissipation management device and method applied to a high-density server.
Background
In recent years, under the promotion of technologies such as cloud computing, big data, internet of things and the like, in the period of rapid growth of data center industry, the complete cabinet server is deployed on a large scale as an exclusive form of large-scale internet enterprises such as BAT and the like, and is widely used in other traditional enterprises with large quantities and self-built data centers. Compared with the traditional rack and the blade server, the deployment and the use mode of the traditional server are changed, the hardware platform can be flexibly configured according to the requirements of users, more advantages are brought, the space utilization rate of the cabinet is improved, the cabinet serves as an integral unit to pool the power supply unit, the heat dissipation unit and the cloud computing unit, the space occupation of the auxiliary module is reduced, the power supply efficiency is improved through the design of centralized power supply and heat dissipation, and the energy consumption reduction and the efficient delivery are realized.
The traditional server adopts an exclusive design on the design of a heat dissipation subsystem, and a single machine is provided with an independent fan for heat dissipation. SmartRack removes the cooling fan of each server node through concentrated heat dissipation, integrates into a cooling fan wall, and the overall arrangement only needs 18 fans at the rear portion of whole rack, 48 nodes, and the quantity reduces more than 93%, has effectively improved radiating efficiency, space utilization and power conversion, greatly reduced the heat dissipation consumption.
Along with the development of internet enterprises, the adding of more and more peripheral equipment and functions makes components and parts inside a server cabinet and an external plug-in board card have higher and higher density, and the existing heat dissipation mode cannot reserve enough heat dissipation air ducts or carry out independent heat dissipation design for some chips with larger heat productivity and external plug-in boards. The server which uses the fan wall to uniformly manage heat dissipation cannot be independently regulated and controlled for a certain internal area, so that the local overheating condition occurs inside the server. The local overheating will cause the performance of the board card to be reduced, cause speed reduction and frequency reduction, high temperature alarm, even bring about downtime and other serious consequences, and finally may cause the local components to be invalid.
Disclosure of Invention
The invention aims to provide an external plug-in card heat dissipation management device and method applied to a high-density server, and aims to solve the problem that local overheating is easy to occur inside the server in the prior art, realize closed-loop control through temperature feedback and improve control precision.
In order to achieve the above technical object, the present invention provides an external card heat dissipation management device applied to a high-density server, the device including:
the thermoelectric cooler comprises a TEC refrigerating plate, a temperature monitoring assembly, a power control chip, a DSP chip and a radiator;
the temperature monitoring component monitors the temperature information of the heating board card and feeds the temperature information back to the DSP chip;
the DSP chip is connected with the power control chip and adjusts the power output of the power control chip through PWM waves according to the temperature information;
the power control chip is connected with the TEC refrigerating piece and controls the current magnitude and direction of the TEC refrigerating piece according to power output;
the DSP chip is also connected with a radiator fan.
Preferably, the refrigerating surface of the TEC refrigerating plate is attached to and pressed against the heat-emitting plate card housing, heat-conducting silicone grease is applied to the middle of the TEC refrigerating plate, the heating surface of the TEC refrigerating plate is attached to and pressed against the heat-radiator plate card housing, and heat-conducting silicone grease is applied to the middle of the TEC refrigerating plate.
Preferably, the temperature monitoring component is an NTC thermistor or a temperature sensor.
Preferably, the TEC refrigeration piece supplies power through a connector on the motherboard for supplying power to the peripheral board card.
Preferably, the device also comprises a double-color LED connected to the DSP chip, and when the temperature of the heating board card is too high or the temperature adjustment cannot be normally carried out, the TEC refrigeration piece is too high in temperature, the device can warn red, otherwise, the device normally displays green.
The invention also provides an external card heat dissipation management method applied to the high-density server and realized by using the device, and the method comprises the following operations:
monitoring the real-time temperature of the heating board card through a temperature sensor, and calculating the real-time temperature difference between the real-time temperature and the reference temperature by using a DSP chip;
when the real-time temperature difference is not larger than the reference temperature difference threshold value, reading an output value of the incremental PID controller, and linearly mapping the output value to a PWM duty ratio, or controlling the temperature control circuit not to work;
when the real-time temperature difference is larger than the reference temperature difference threshold value, the output PWM duty ratio is 1, the power control chip works in a full-power mode, and the PWM duty ratio of the next period is obtained;
the TEC refrigeration piece sets the magnitude and the direction of input current according to the magnitude of power, and carries out heat dissipation on the heating board card.
Preferably, the DSP chip is initially set at a power-on initial stage, including a PWM period, a reference temperature difference threshold, and a PID controller coefficient.
Preferably, the formula of the incremental PID controller is:
ΔPd＝Kp[e(k)-e(k-1)]+KIe(k)+KD[e(k)-2e(k-1)+e(k-2)]
in the formula, Kp、KI、KDRespectively a proportional term, an integral term and a differential term of the PID controller; e is the power error.
The effect provided in the summary of the invention is only the effect of the embodiment, not all the effects of the invention, and one of the above technical solutions has the following advantages or beneficial effects:
compared with the prior art, the method has the advantages that the local temperature control circuit is added in the server node, the NTC thermistor or the temperature sensor is used for detecting the temperature of the area with larger heat productivity, when the temperature exceeds the allowable range, the temperature control circuit starts to work, the PWM wave is used for adjusting and controlling the current passing through the TEC refrigerating sheet, the TEC refrigerating sheet is used for refrigerating, the temperature of the heating board card is reduced, and the temperature of the area of the heating board card is controlled within the safe range. Because the TEC refrigeration plate is arranged above the heating plate card or is closely arranged, the inner space of the node is not occupied; the temperature control circuit of the refrigerating sheet is integrated into the board card shell, so that the heat dissipation can be enhanced and the confidentiality can be ensured; the refrigerating sheet uses a DSP chip, a control circuit is simple, and CPLD or BMC resources in the server are prevented from being occupied; and the control precision is high through the closed-loop control of temperature feedback.
Drawings
Fig. 1 is a schematic view of a heat dissipation structure provided in an embodiment of the present invention;
FIG. 2 is a schematic diagram of an embodiment of an external card heat dissipation management apparatus applied to a high-density server;
fig. 3 is a flowchart of an add-in card heat dissipation management method applied to a high-density server according to an embodiment of the present invention.
Detailed Description
In order to clearly explain the technical features of the present invention, the following detailed description of the present invention is provided with reference to the accompanying drawings. The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. It should be noted that the components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and procedures are omitted so as to not unnecessarily limit the invention.
The following describes in detail an external card heat dissipation management apparatus and method applied to a high-density server according to an embodiment of the present invention with reference to the accompanying drawings.
As shown in fig. 1-2, the present invention discloses an external card heat dissipation management device applied to a high-density server, the device comprising:
the thermoelectric cooler comprises a TEC refrigerating plate, a temperature monitoring assembly, a power control chip, a DSP chip and a radiator;
the temperature monitoring component monitors the temperature information of the heating board card and feeds the temperature information back to the DSP chip;
the DSP chip is connected with the power control chip and adjusts the power output of the power control chip through PWM waves according to the temperature information;
the power control chip is connected with the TEC refrigerating piece and controls the current magnitude and direction of the TEC refrigerating piece according to power output;
the DSP chip is also connected with a radiator fan.
The refrigeration surface of the TEC refrigeration piece is attached to and pressed against the heating board card shell, heat-conducting silicone grease is coated in the middle, the heating surface of the TEC refrigeration piece is attached to and pressed against the radiator board card shell, and heat-conducting silicone grease is coated in the middle.
The NTC thermistor or the temperature sensor is arranged on the board card provided with the TEC refrigeration piece, in order to obtain the best overall stability, the thermistor or the temperature sensor is placed close to the TEC refrigeration piece, or the temperature sensor integrated in the TEC is used for feeding back the temperature information of the TEC refrigeration piece, and the temperature control circuit can be integrated into the shell of the heating board card and is tightly attached to the upper side of the chip of the confidential board card. In addition, the temperature information feedback circuit has at least two paths, so that one feedback circuit can be ensured to be invalid, and information can be obtained from the other feedback circuit.
The TEC refrigeration piece is powered by a connector which is originally used for peripheral board card power supply through a mainboard, and initialization setting including PWM period, reference temperature difference threshold value and PID controller coefficient is carried out at the initial stage of DSP chip power-on.
After the DSP chip is powered on and started, the temperature difference is calculated through temperature information detected by the DSP chip and a set reference temperature value, PWM is calculated through an incremental PID controller according to the temperature difference, a power control chip is adjusted through PWM waves, the power control chip outputs certain current to the TEC refrigerating piece, when the TEC refrigerating piece flows through current in a fixed direction, the refrigerating face of the TEC refrigerating piece starts refrigerating, the heating face of the TEC refrigerating piece starts heating, and the refrigerating capacity of the TEC refrigerating piece is in direct proportion to the current. The refrigeration face will reduce the temperature of the integrated circuit board that generates heat, and the face that generates heat can be with heat transfer to integrated circuit board shell or radiator for the heat discharge machine case that will produce.
In addition, the board card is also provided with a double-color LED, and the double-color LED is driven by the DSP, so that when the temperature of the heating board card is too high or the temperature is regulated, the TEC refrigerating piece cannot normally work to ensure that the temperature of the TEC refrigerating piece is too high, the warning is red, and otherwise, the normal display is green.
According to the embodiment of the invention, a local temperature control circuit is added in the server node, the temperature of the area with larger heat productivity is detected through the NTC thermistor or the temperature sensor, when the temperature exceeds the allowable range, the temperature control circuit starts to work, the current passing through the TEC refrigeration sheet is regulated and controlled through the PWM wave, the refrigeration is further performed through the TEC refrigeration sheet, the temperature of the heating board card is reduced, and the temperature of the area of the heating board card is controlled within the safe range. Because the TEC refrigeration plate is arranged above the heating plate card or is closely arranged, the inner space of the node is not occupied; the temperature control circuit of the refrigerating sheet is integrated into the board card shell, so that the heat dissipation can be enhanced and the confidentiality can be ensured; the refrigerating sheet uses a DSP chip, a control circuit is simple, and CPLD or BMC resources in the server are prevented from being occupied; and the control precision is high through the closed-loop control of temperature feedback.
As shown in fig. 3, an embodiment of the present invention further discloses an external card heat dissipation management method implemented by using the apparatus and applied to a high-density server, where the method includes the following operations:
monitoring the real-time temperature of the heating board card through a temperature sensor, and calculating the real-time temperature difference between the real-time temperature and the reference temperature;
when the real-time temperature difference is not larger than the reference temperature difference threshold value, reading an output value of the incremental PID controller, and linearly mapping the output value to a PWM duty ratio, or controlling the temperature control circuit not to work;
when the real-time temperature difference is larger than the reference temperature difference threshold value, the output PWM duty ratio is 1, the power control chip works in a full-power mode, and the PWM duty ratio of the next period is obtained;
the TEC refrigeration piece sets the magnitude and the direction of input current according to the magnitude of power, and carries out heat dissipation on the heating board card.
When the temperature difference between the temperature of the heating board card and the reference temperature is not larger than the reference temperature difference threshold value, the whole temperature control circuit does not work or works according to the output value mode of the PID controller, and when the temperature difference between the temperature of the heating board card and the reference temperature is larger than the threshold value, the temperature control circuit works in a full-power mode. The TEC refrigeration piece works for refrigeration, and the temperature of the board card is reduced until the area temperature of the heating board card is within a safety range.
And the DSP chip is initialized at the power-on initial stage and comprises a PWM period, a reference temperature difference threshold value and a PID controller coefficient.
After the DSP chip is powered on and started, waiting for a PWM period, reading a reference temperature difference threshold value preset by the DSP chip, reading a real-time temperature through the DSP chip, calculating a real-time temperature difference between the real-time temperature and the reference temperature, and comparing the real-time temperature difference with the reference temperature difference threshold value.
And when the real-time temperature difference is not greater than the reference temperature difference threshold value, reading the output value of the incremental PID controller, and linearly mapping the output value to the PWM duty ratio, or controlling the temperature control circuit not to work.
The formula of the incremental PID controller is as follows:
ΔPd＝Kp[e(k)-e(k-1)]+KIe(k)+KD[e(k)-2e(k-1)+e(k-2)]
in the formula, Kp、KI、KDRespectively a proportional term, an integral term and a differential term of the PID controller; e is the power error. The proportional term can make the power error quickly react, the integral term can make the power of the power control chip reach the set power, the static difference of the power is eliminated, the differential term predicts the output condition of the next period according to the error rate, and the speed of the dynamic response of the system can be improved.
And when the real-time temperature difference is larger than the reference temperature difference threshold value, the output PWM duty ratio is 1, the power control chip works in a full-power mode, and the PWM duty ratio of the next period is obtained.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. An external plug-in card heat dissipation management device applied to a high-density server, the device comprising:
the thermoelectric cooler comprises a TEC refrigerating plate, a temperature monitoring assembly, a power control chip, a DSP chip and a radiator;
the temperature monitoring component monitors the temperature information of the heating board card and feeds the temperature information back to the DSP chip;
the DSP chip is connected with the power control chip and adjusts the power output of the power control chip through PWM waves according to the temperature information;
the power control chip is connected with the TEC refrigerating piece and controls the current magnitude and direction of the TEC refrigerating piece according to power output;
the DSP chip is also connected with a radiator fan.
2. The external card heat dissipation management device applied to the high-density server as recited in claim 1, wherein the refrigeration surface of the TEC refrigeration sheet is attached to and pressed against the heat-generating board card housing, and a heat-conducting silicone grease is applied to the refrigeration surface, the heat-generating surface of the TEC refrigeration sheet is attached to and pressed against the heat-radiator board card housing, and a heat-conducting silicone grease is applied to the refrigeration surface.
3. The device as claimed in claim 1, wherein the temperature monitoring component is an NTC thermistor or a temperature sensor.
4. The external card heat dissipation management device applied to the high-density server as recited in claim 1, wherein the TEC refrigeration plate is powered by a connector on the motherboard for supplying power to the peripheral board.
5. The device as claimed in claim 1, further comprising a bi-color LED connected to the DSP chip, wherein when the temperature of the heat-generating board card is too high or the temperature adjustment cannot be performed normally, the TEC refrigeration plate will alarm red, otherwise the TEC refrigeration plate will display green.
6. An external card heat dissipation management method applied to a high-density server and realized by the device of any one of claims 1 to 5, characterized by comprising the following operations:
monitoring the real-time temperature of the heating board card through a temperature sensor, and calculating the real-time temperature difference between the real-time temperature and the reference temperature by using a DSP chip;
when the real-time temperature difference is not larger than the reference temperature difference threshold value, reading an output value of the incremental PID controller, and linearly mapping the output value to a PWM duty ratio, or controlling the temperature control circuit not to work;
when the real-time temperature difference is larger than the reference temperature difference threshold value, the output PWM duty ratio is 1, the power control chip works in a full-power mode, and the PWM duty ratio of the next period is obtained;
the TEC refrigeration piece sets the magnitude and the direction of input current according to the magnitude of power, and carries out heat dissipation on the heating board card.
7. The method as claimed in claim 6, wherein the initial setup of the DSP chip at power-on stage includes PWM period, reference temperature difference threshold and PID controller coefficient.
8. The method for managing heat dissipation of external plug-in cards applied to high-density servers of claim 6, wherein the incremental PID controller has the formula:
ΔPd＝Kp[e(k)-e(k-1)]+KIe(k)+KD[e(k)-2e(k-1)+e(k-2)]
in the formula, Kp、KI、KDRespectively a proportional term, an integral term and a differential term of the PID controller; e is the power error.
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| CN114326851A (en) * | 2021-11-17 | 2022-04-12 | 苏州浪潮智能科技有限公司 | Edge intelligent temperature control method and system based on TEC |
| CN114442692A (en) * | 2021-12-30 | 2022-05-06 | 中国人民解放军陆军工程大学 | Intelligent temperature control device and method |
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