CN111952293B

CN111952293B - Power module and method for manufacturing the same

Info

Publication number: CN111952293B
Application number: CN201910402768.4A
Authority: CN
Inventors: 洪守玉; 周锦平; 周敏; 辛晓妮; 季鹏凯; 鲁凯; 梁乐; 赵振清
Original assignee: Delta Electronics Shanghai Co Ltd
Current assignee: Delta Electronics Shanghai Co Ltd
Priority date: 2019-05-15
Filing date: 2019-05-15
Publication date: 2022-07-01
Anticipated expiration: 2039-05-15
Also published as: CN111952293A

Abstract

The present disclosure relates to a power module and a method of manufacturing the same. The power module comprises a first carrier plate, a magnetic assembly, a second carrier plate and a power device. The first carrier plate comprises a first surface, a second surface and at least one guide connecting part, wherein the first surface and the second surface are opposite to each other, and the at least one guide connecting part is arranged between the first surface and the second surface. The magnetic assembly is disposed between the first surface and the second surface of the first carrier, and includes at least one magnetic core and at least one winding, wherein the at least one winding has a first conductive terminal and a second conductive terminal, which are respectively led out from the first surface and the second surface of the first carrier. The second carrier plate is arranged on the first carrier plate and comprises a third surface and a fourth surface, the third surface and the fourth surface are opposite to each other, and the fourth surface faces the first surface. The at least one power device is arranged on the third surface of the second carrier plate and is electrically connected to the first carrier plate through the second carrier plate.

Description

Power module and method for manufacturing the same

Technical Field

The present disclosure relates to power modules, and more particularly, to an optimized power module and a method of manufacturing the same.

Background

Along with the improvement of human intelligent living requirements, the improvement of intelligent product manufacturing requirements, the rise of the Internet of things and the like, the demand of the society on information transmission and data processing is increasingly vigorous. The main board of such a server is usually composed of a Central Processing Unit (CPU), a chipset (Chipsets), a memory, and other digital data processing chips, a power supply thereof, and necessary peripheral components. However, as the processing capacity of the server increases per unit volume, the number and the integration of such digital chips also increase, which leads to an increase in the space occupation and power consumption. Therefore, the power supply provided by the system for these digital chips (on the same motherboard as the data processing chip, also called motherboard power supply) is expected to have higher efficiency, higher power density and smaller size to support energy saving and reduced footprint of the entire server and even the entire data center.

Since the power supply of the digital chip usually requires low voltage and large current, in order to reduce the loss and impedance influence of the output lead, a power supply for directly supplying power is often provided at the position of the main board so as to be as close to the digital chip as possible. Therefore, such a power supply directly supplying power to the chip is called a Point of the Load (POL), and its input is provided by other external power sources. The typical input voltage of the point power supply on the main board of the current server is about 12V. And with the continuous promotion of various chip performances, its consumption also increases along with it, and the distance of some power is nearer apart from the load, and this has brought higher requirement to the system heat dissipation.

On the other hand, for distributed information terminal applications, since the constituent components and digital chips must be integrated in a small space and operate continuously for a long time, the power supply is usually performed by using a low operating voltage, and is usually provided by a power storage device such as a battery of 3V to 5V. The power supply that supplies it is therefore more demanding in terms of high efficiency and high power density.

In recent years, switching power supplies have been widely used because they can achieve better efficiency conversion than linear power supplies. However, compared to a linear power supply, the circuit of the switching power supply is more complicated, and magnetic components/capacitors are generally used as energy storage/filtering, so that the application of chip integration is not easy to realize.

At present, for low-voltage direct current/direct current (DC/DC) conversion occasions, a Buck converter (Buck circuit) is generally used directly to implement, and various voltages between 0V and 5V are output to corresponding digital chips. As shown in fig. 1, a circuit diagram of a buck converter circuit is disclosed. The buck conversion circuit comprises an input filter capacitor Cin, a main switching tube Q1, a follow current tube Q2, an inductor L and an output capacitor Co. The input filter capacitor Cin is connected to a power source to receive the input voltage Vin. The main switch Q1 has one end connected to the input filter capacitor Cin and the other end connected to the inductor L, and the main switch Q1 performs on/off switching operations to adjust the energy transferred from the input to the output and adjust the output voltage current, wherein the main switch Q1 is usually formed by a Metal Oxide Semiconductor (MOS) field effect transistor. The freewheeling tube Q2 has one end connected to a node of the main switching tube Q1 and the inductor L, and the other end grounded, and the freewheeling tube Q2 provides a channel for the inductor L to release energy freewheeling, wherein the freewheeling tube Q2 may be a diode, but may also be a Metal Oxide Semiconductor (MOS) field effect transistor for reducing loss, and performs synchronous rectification control to achieve a near-ideal diode function. One end of the inductor L is connected to a node between the main switching transistor Q1 and the follow current transistor Q2, and the other end is connected to the output capacitor Co, and the inductor L and the output capacitor Co cooperatively filter the square wave output voltage formed by the alternating switching operation between the main switching transistor Q1 and the follow current transistor Q2 into an average value, i.e., a direct current is output to an output voltage Vout. The output capacitor Co is configured to absorb the current ripple output by the inductor L, so that the voltage ripple of the output voltage Vout is smaller than the required value. The output voltage Vout of the buck converter circuit can provide energy to a load RL, such as a digital chip or a Central Processing Unit (CPU).

In the prior art, in order to further improve the conversion efficiency and power density of the power converter, independent optimization is performed from the angles of, for example, a magnetic component, a bare power device, a capacitor component, and the like, however, with the technological progress, independent optimization of a single component has gradually reached the utmost, and high efficiency, high power density, and high heat dissipation capability cannot be further realized.

Therefore, how to develop a power module to add a new space for optimizing the performance of the power supply and further achieve the objectives of high efficiency, high power density and high heat dissipation capability to solve the problems faced by the prior art is a problem to be faced in the field.

Disclosure of Invention

An object of the present disclosure is to provide a power module and a method of manufacturing the same. The magnetic assembly and the connecting part are embedded in the support plate and connected between the wiring layers on the two surfaces of the support plate, so that the flexibility of arrangement of the power device and other electronic devices is improved, and meanwhile, the connection between the magnetic assembly and the power device is optimized and integrated, so that the power module can realize high efficiency, high power density and high heat dissipation capacity, the occupation of the power module on system mainboard resources is effectively reduced, and the competitiveness of a power module product is further improved.

Another object of the present disclosure is to provide a power module and a method of manufacturing the same. The integrated and optimized power module can be modulated according to different application requirements, and the change of design can be added, so that the circuit characteristics of the power module are further optimized, and more functions are integrated in the power module.

It is still another object of the present disclosure to provide a power module and a method of manufacturing the same. The magnetic assembly is integrated between the wiring layers on the two surfaces of the carrier plate through the copper block, the conductive through hole, the lead frame or the circuit board, and meanwhile, the process that the magnetic assembly and the conductive connecting part are embedded in the carrier plate is simplified, the production efficiency is improved, and the purposes of assembling the optimized power module and reducing the manufacturing cost of the power module are achieved.

To achieve the above objective, the present disclosure provides a power module including a first carrier, a magnetic assembly, a second carrier, and a power device. The first carrier plate comprises a first surface, a second surface and at least one guide connecting part, wherein the first surface and the second surface are opposite to each other, and the at least one guide connecting part is arranged between the first surface and the second surface. The magnetic assembly is disposed between the first surface and the second surface of the first carrier, and includes at least one magnetic core and at least one winding, wherein the at least one winding has a first conductive terminal and a second conductive terminal, which are respectively led out from the first surface and the second surface of the first carrier. The second carrier is disposed on the first carrier and includes a third surface and a fourth surface opposite to each other, wherein the fourth surface faces the first surface. The at least one power device is disposed on the third surface of the second carrier and electrically connected to the at least one conductive member through the second carrier.

To achieve the above object, the present disclosure also provides a method for manufacturing a power module, which includes: (a) providing a first carrier plate and a magnetic assembly, wherein the first carrier plate comprises a first surface, a second surface and at least one guiding and connecting part, the first surface and the second surface are opposite to each other, the at least one guiding and connecting part is arranged between the first surface and the second surface, the magnetic assembly is arranged between the first surface and the second surface of the first carrier plate and comprises at least one magnetic core and at least one winding, and the at least one winding is provided with a first guiding and connecting terminal and a second guiding and connecting terminal which are respectively led out from the first surface and the second surface of the first carrier plate; (b) providing a second carrier plate which is arranged on the first carrier plate and comprises a third surface and a fourth surface, wherein the third surface and the fourth surface are opposite to each other, and the fourth surface faces the first surface; (c) providing at least one power device, and (d) disposing the power device on the third surface of the second carrier, wherein the power device is electrically connected to the at least one conductive member through the second carrier.

Drawings

Fig. 1 is a circuit diagram disclosing a buck converter circuit.

Fig. 2 is a schematic cross-sectional structure diagram of a power module disclosing a first preferred embodiment of the present disclosure.

Fig. 3 is a schematic cross-sectional structure diagram of a power module disclosing a second preferred embodiment of the present disclosure.

Fig. 4 is a schematic cross-sectional structure diagram of a power module disclosing a third preferred embodiment of the present disclosure.

Fig. 5 is a first preferred embodiment disclosing other constituent components of the first carrier board assembly of the present disclosure.

Fig. 6 discloses a second preferred embodiment of the first carrier plate of the present disclosure.

Fig. 7 is a schematic cross-sectional structure diagram of a power module disclosing a fourth preferred embodiment of the present disclosure.

Fig. 8 is a schematic cross-sectional structure diagram of a power module disclosing a fifth preferred embodiment of the present disclosure.

Fig. 9 is a schematic cross-sectional structure diagram of a power module disclosing a sixth preferred embodiment of the present disclosure.

Fig. 10 is a schematic cross-sectional structure diagram of a power module disclosing a seventh preferred embodiment of the present disclosure.

Fig. 11 is a schematic cross-sectional structural view of a power module disclosing an eighth preferred embodiment of the present disclosure.

Fig. 12 is a manufacturing method of a power module disclosing a preferred embodiment of the present disclosure.

Fig. 13A to 13E are schematic manufacturing process diagrams of other components of the first carrier assembly according to the first preferred embodiment of the disclosure.

Fig. 14A to 14D are schematic manufacturing process diagrams of other components of the first carrier assembly according to the second preferred embodiment of the disclosure.

Fig. 15A to 15D are schematic manufacturing process diagrams of other components of the first carrier assembly according to the third preferred embodiment of the disclosure.

Fig. 16A to 16D are schematic manufacturing process diagrams of other components of the first carrier assembly according to the fourth preferred embodiment of the disclosure.

Fig. 17A to 17E are schematic manufacturing flow diagrams of other components of the first carrier assembly according to the fifth preferred embodiment of the disclosure.

Fig. 18A-18C disclose other embodiments of a first-tier plate and a second-tier plate combined magnetic assembly.

Fig. 19A to 19B disclose another embodiment in which the magnetic member is provided on the release film.

Fig. 20A is an exemplary circuit diagram disclosing multiple sets of switching devices in a power module of the present disclosure in conjunction with one inductor.

Fig. 20B is an exemplary circuit diagram disclosing a set of switching devices in a power module of the present disclosure in conjunction with multiple inductors.

Fig. 20C is an exemplary circuit diagram disclosing multiple sets of switching devices in a power module of the present disclosure in conjunction with multiple inductors.

Description of the symbols

1. 1a, 1b, 1c, 1d, 1e, 1f, 1 g: power module

10: first carrier plate

10 a: accommodating opening

11: first side

11 a: peripheral region

11 b: partial region

12: second surface

13: a first wiring layer

13 a: surface wiring layer

13 b: inner wiring layer

14: second wiring layer

14 a: surface wiring layer

14 b: inner wiring layer

15: first insulator

16: second insulator

20: magnetic assembly

21: the top surface

22: bottom surface

23: magnetic core

23 a: opening area

24: first lead terminal

25: second lead terminal

26: winding wire

26 a: connecting piece

30: first lead connecting part

30 a: auxiliary connecting piece

30 b: partial region

31: first end

32: second end

40: second connecting part

41: first end

42: second end

50: second carrier plate

50 a: accommodating opening

51: third side

52: fourth surface

52 a: peripheral region

52 b: partial region

53: third wiring layer

54: a fourth wiring layer

55: a fifth wiring layer

60: power device

61: conduction terminal

70: electronic device

71: first electronic device

72: second electronic device

80: brazing filler metal

81: brazing filler metal

90: release film

91: first insulating material layer

92: a second insulating material layer

93: first layer board

93 a: first metal layer

93 b: first insulating material layer

94: second laminate

94 a: second metal layer

94 b: a second insulating material layer

95: slotting

96: photoresist layer

97: opening(s)

Cin: input filter capacitor

Vin: input voltage

Q1: main switch tube

Q2: continuous flow tube

L: inductor

Co: output capacitor

Vout: output voltage

RL: load(s)

Detailed Description

Some exemplary embodiments that incorporate the features and advantages of the present disclosure will be described in detail in the specification which follows. It is to be understood that the disclosure is capable of various modifications in various embodiments without departing from the scope of the disclosure, and that the description and drawings are to be regarded as illustrative in nature, and not as restrictive.

Fig. 2 is a schematic cross-sectional structure diagram of a power module disclosing a first preferred embodiment of the present disclosure. The power module 1 includes a first carrier 10, a magnetic assembly 20, a second carrier 50, and a power device 60. The first carrier 10 includes a first surface 11, a second surface 12, a first guiding and connecting component 30 and a second guiding and connecting component 40, wherein the first surface 11 and the second surface 12 are opposite to each other, the first surface 11 is a plane where a highest position of the first carrier 10 is located, the second surface 12 is a plane where a lowest position of the first carrier 10 is located, and the first guiding and connecting component 30 and the second guiding and connecting component 40 are respectively disposed between the first surface 11 and the second surface 12. The magnetic element 20 is disposed between the first surface 11 and the second surface 12 of the first carrier 10, and includes at least one core 23 and at least one winding 26. The top surface 21 of the core 23 corresponds spatially, for example, to the first surface 11 of the first carrier 10, and the bottom surface 22 of the core 23 corresponds spatially, for example, to the second surface 12 of the first carrier 10. In the embodiment, at least one winding 26 has a first conductive terminal 24 and a second conductive terminal 25 respectively led out from the first surface 11 and the second surface 12 of the first carrier 10, that is, the first conductive terminal 24 and the second conductive terminal 25 of the winding 26 are respectively led out from the first surface 11 and the second surface 12 of the first carrier 10, and compared with the case where both ends of the winding 26 are led out from the same side (such as the first surface 11) of the first carrier 10, at least a portion of the first conductive part 30 can be omitted, which is significant for reducing the equivalent impedance of the magnetic device 20 and reducing the resource waste of the second carrier 50. The structure of the magnetic element 20 can be modulated according to the practical application requirements, and the magnetic element 20 can be, for example, an LTCC inductor, a lamination or a combined inductor. Furthermore, for certain applications such as electrical modules or Voltage Regulator Modules (VRMs) powered by CPUs, the requirement for dynamic performance of the power supply is becoming more and more stringent, and the magnetic element 20 may be a decoupling inductor. The first end 31 of the first guide member 30 is extended from the first surface 11 of the first carrier 10, and the second end 32 of the first guide member 30 is extended from the second surface 12 of the first carrier 10. The first end 41 of the second guiding member 40 is guided out of the first surface 11 of the first carrier plate 10, and the second end 42 of the second guiding member 40 is guided out of the second surface 12 of the first carrier plate 10. The first conductive part 30 is, for example, a copper block, and the second conductive part 40 is, for example, a conductive via. In other embodiments, the first and

second guiding components

30 and 40 may be, for example, one selected from the group consisting of a copper block, a conductive via, a lead frame, and a circuit board. In this embodiment, the first carrier further includes a first wiring layer 13 and a second wiring layer 14, and the first wiring layer 13 and the second wiring layer 14 are respectively disposed on the first surface 11 and the second surface 12. The first and second

conductive members

30 and 40 are electrically connected between the first and second wiring layers 13 and 14. The first and

second conduction terminals

24 and 25 of the at least one winding 26 are electrically connected to the first and second wiring layers 13 and 14, respectively. In the present embodiment, at least one layer of dielectric material (not shown) is further disposed between the first and second wiring layers 13 and 14 and the magnetic core 23 of the magnetic assembly 20, and the at least one layer of dielectric material can serve the purposes of insulating, protecting the surface of the magnetic core 23, and increasing the bonding force between the magnetic core 23 and the first and second wiring layers 13 and 14. In this embodiment, the top surface 21 of the magnetic device 20 embedded in the first carrier 10 may be directly exposed to the first surface 11 of the first carrier 10, and the bottom surface 22 of the magnetic device 20 embedded in the first carrier 10 may be directly exposed to the second surface 12 of the first carrier 10.

In the embodiment, the second carrier 50 is disposed on the first carrier 10 and includes a third surface 51 and a fourth surface 52, the third surface 51 and the fourth surface 52 are opposite to each other, wherein the fourth surface 52 faces the first surface 11. At least one power device 60 is disposed on the third surface 51 of the second carrier 50 and electrically connected to the first carrier 10 through the second carrier 50. The second carrier 50 includes a third wiring layer 53 and a fourth wiring layer 54. The third wiring layer 53 and the fourth wiring layer 54 are disposed on the third surface 51 and the fourth surface 52, respectively, and are electrically connected to each other. In some embodiments, the second carrier 50 further includes a fifth wiring layer 55, and the fifth wiring layer 55 is disposed between the third surface 51 and the fourth surface 52 and is electrically connected to at least the third wiring layer 53 or the fourth wiring layer 54. In addition, the fourth wiring layer 54 on the fourth surface 52 of the second carrier 50 and the first wiring layer 13 on the first surface 11 of the first carrier 10 can be connected by, for example, a solder (solder)80 or other connection methods, such as conductive paste, low temperature sintering material (low temperature sintering silver, etc.). The terminal 61 of the power device 60 can also be electrically connected to the third wiring layer 53 on the third surface 51 of the second carrier 50, for example, through a solder 81 or other connection methods. In the present embodiment, the power device 60 may be, for example, a Si MOSFET, a GaN switch component, a SiC MOSFET, etc., and further, the power device 60 may integrate functions of driving, controlling, etc. In an embodiment, the power device 60 is also, for example, a single power semiconductor switching device, which may be a half-bridge circuit, or may include a plurality of half-bridge circuits, and the disclosure is not limited thereto. Further, the Package of the power device 60 may be a flip chip (QFN), a Quad Flat No-lead Package (QFN) with a surface exposed to the chip substrate, or a QFN Package with a surface exposed to a heat sink thermally coupled to the chip substrate, which is more favorable for conducting heat of the power device 60 to a heat spreader (not shown) mounted on the surface of the power device 60, or directly dissipating the heat spreader to the environment. Further, when the power device 60 is packaged as a flip chip, an underfill (underfill) is disposed under the power device to improve structural stability. Further, when the power device 60 is packaged in a flip chip form, a thermal diffusion sheet (usually a metal material) may be mounted thereon through a thermal interface material, so as to improve thermal performance and provide mechanical protection for the chip. Furthermore, when the power device 60 is packaged in a flip chip manner, a height-limiting block may be disposed on the second carrier 50, and the height of the height-limiting block is not lower than the height of the chip, so that the chip can be prevented from being damaged due to excessive pressure when an external heat sink is mounted. The magnetic component 20, the first guiding and connecting component 30 and the second guiding and connecting component 40 are embedded in the first carrier plate 10 and connected between the first wiring layer 13 on the first surface 11 and the second wiring layer 14 on the second surface 12 of the first carrier plate 10, so that the flexibility of the layout of the power device 60 is increased, and the connection between the magnetic component 20 and the power device 60 is optimized and integrated, so that the power module 1 can achieve high efficiency and high power density, the occupation of the power module 1 on system mainboard resources is effectively reduced, meanwhile, the manufacturing process of the power module 1 is simpler, and the competitiveness of the power module 1 product is further improved.

Referring to fig. 1 and fig. 2, in the present embodiment, the power device 60 may integrate two switching devices, such as a main switching transistor Q1 and a freewheeling transistor Q2, wherein the middle points of the two switching devices Q1 and Q2 are connected to one end of an inductor L through a metallization layer, and the other end of the inductor is Vout and directly outputs the Vout. Other terminals on the power device 60, such as Vin, GND and other drive control electrodes, may also fan out through the first and second

conductive parts

30 and 40. For example, the GND terminal of the power device 60 can also be fanned out to the second surface 12 of the first carrier board 10 by the first conductive part 30 with the shortest distance to connect with the system motherboard, which is not described herein again.

Fig. 3 is a schematic cross-sectional structure diagram of a power module according to a second preferred embodiment of the present disclosure. In the present embodiment, the power module 1a is similar to the power module 1 shown in fig. 2, and the same component numbers represent the same components, structures and functions, which are not described herein again. In this embodiment, the power module 1a further includes at least one electronic device 70 disposed on the third wiring layer 53 on the third surface 51 of the second carrier 50, and the pins of the at least one electronic device 70 are electrically connected to the third wiring layer 53 of the second carrier 50 through solder or the like (not shown). The at least one electronic device 70 is disposed adjacent to the power device 60 or, for example, between two power devices 60. A heat dissipation device (not shown) is further integrated on the power device 60 and the electronic device 70, which is not limited to the essential features of the present disclosure, and thus, will not be described herein again. The at least one electronic device 70 may, for example, be one selected from the group consisting of a capacitor, a resistor, and a driver. The at least one electronic device 70 may also be the input filter capacitor Cin shown in fig. 1, and since the input filter capacitor Cin, the main switching tube Q1, and the freewheeling tube Q2 are disposed nearby, the loop parasitic inductance can be effectively reduced, and thus the efficiency and the electrical reliability of the power module 1a can be effectively improved. The magnetic assembly 20, the first guiding component 30 and the second guiding component 40 are embedded in the first carrier 10 and connected between the first wiring layer 13 on the first surface 11 and the second wiring layer 14 on the second surface 12 of the first carrier 10, so that the flexibility of the layout of the power device 60 and the electronic device 70 is increased, and the connection of the magnetic assembly 20, the power device 60 and the electronic device 70 is optimized and integrated, so that the power module 1a can achieve high efficiency, high power density and high heat dissipation performance, the occupation of system motherboard resources by the power module 1a is effectively reduced, the manufacturing process of the power module 1 is simpler, and the competitiveness of the power module 1a product is further improved.

Fig. 4 is a schematic cross-sectional structure diagram of a power module according to a third preferred embodiment of the present disclosure. In the present embodiment, the power module 1b is similar to the power module 1a shown in fig. 3, and the same component numbers represent the same components, structures and functions, which are not described herein again. In this embodiment, the power module 1b includes at least one first electronic device 71 and at least one second electronic device 72, which are disposed on the third wiring layer 53 on the third surface 51 of the second carrier 50, and the leads of the first electronic device 71 and the second electronic device 72 are electrically connected to the third wiring layer 53 of the second carrier 50 through solder or the like (not shown). The first electronic device 71 is disposed between the two power devices 60, and the second electronic device 72 is disposed on the peripheral region of the third face 51 of the second carrier 50. The first electronic device 71 and the second electronic device 72 may be the same or different electronic devices selected from a group consisting of a capacitor, a resistor, and a driver, for example, and the disclosure is not limited thereto. The first electronic device 71 or the second electronic device 72 may also be an input filter capacitor Cin shown in fig. 1, and since the input filter capacitor Cin, the main switching tube Q1, and the follow current tube Q2 are disposed nearby, the loop parasitic inductance can be effectively reduced, and thus the efficiency and the electrical reliability of the power module 1b can be effectively improved. In this embodiment, the layout of the first electronic device 71 and the second electronic device 72 can be modulated according to the actual application requirement, so as to achieve high efficiency and high power density, reduce the occupation of the system motherboard resources by the power module 1b, and further improve the competitiveness of the power module 1b product.

In addition, in all of the foregoing embodiments, the magnetic assembly 20, the first guiding component 30 and the second guiding component 40 are embedded in the first carrier 10 and connected between the first wiring layer 13 on the first surface 11 and the second wiring layer 14 on the second surface 12 of the first carrier 10, so as to increase the flexibility of the layout of the power device 60, the first electronic device 71 and the second electronic device 72. The number of the first and second

conductive parts

30 and 40 and the way of connecting the first and second wiring layers 13 and 14 can also be modulated or replaced according to the actual application requirements. In one embodiment, the first conductive part 30 or the second conductive part 40 may be omitted, and only one of the first conductive part 30 and the second conductive part 40 is electrically connected between the first wiring layer 13 and the second wiring layer 14. The disclosure is not limited thereto and will not be described in detail.

Fig. 5 is a first preferred embodiment disclosing other constituent components of the first carrier board assembly of the present disclosure. In the embodiment, the first carrier 10 includes a first surface 11, a second surface 12, and a first guiding component 30 and a second guiding component 40, wherein the first surface 11 and the second surface 12 are opposite to each other, and the first guiding component 30 and the second guiding component 40 are respectively disposed between the first surface 11 and the second surface 12. The magnetic element 20 is disposed between the first surface 11 and the second surface 12 of the first carrier 10, and includes at least one core 23 and at least one winding 26. The top surface 21 of the core 23 corresponds spatially, for example, to the first surface 11 of the first carrier 10, and the bottom surface 22 of the core 23 corresponds spatially, for example, to the second surface 12 of the first carrier 10. In the present embodiment, at least one winding 26 has a first conductive terminal 24 and a second conductive terminal 25, which are led out from the first surface 11 and the second surface 12 of the first carrier 10, respectively. The structure of the magnetic element 20 can be modulated according to the practical application requirements, and the magnetic element 20 can be, for example, an LTCC inductor, a lamination or a combined inductor. Furthermore, for certain applications such as electrical modules or Voltage Regulator Modules (VRMs) powered by a CPU, the requirement for dynamic performance of the power supply is becoming more stringent, and the magnetic element 20 may be a decoupling inductor. The first end 31 of the first guide member 30 is extended from the first surface 11 of the first carrier 10, and the second end 32 of the first guide member 30 is extended from the second surface 12 of the first carrier 10. The first end 41 of the second guiding member 40 is guided out of the first surface 11 of the first carrier plate 10, and the second end 42 of the second guiding member 40 is guided out of the second surface 12 of the first carrier plate 10. The first carrier 10 further includes a first wiring layer 13 and a second wiring layer 14, wherein the first wiring layer 13 and the second wiring layer 14 are respectively disposed on the first surface 11 and the second surface 12. The first and second

conductive members

second conduction terminals

24 and 25 of the at least one winding 26 are electrically connected to the first and second wiring layers 13 and 14, respectively. By embedding the magnetic assembly 20, the first guiding component 30 and the second guiding component 40 in the first carrier 10 and connecting the magnetic assembly to the first wiring layer 13 on the first surface 11 and the second wiring layer 14 on the second surface 12 of the first carrier 10, the flexibility of the layout of the subsequent power device 60 and the electronic device 70 can be increased. In the present embodiment, at least one layer of dielectric material (not shown) is further disposed between the first and second wiring layers 13 and 14 and the magnetic core 23 of the magnetic assembly 20, and the at least one layer of dielectric material can serve the purposes of insulating, protecting the surface of the magnetic core 23, and increasing the bonding force between the magnetic core 23 and the first and second wiring layers 13 and 14.

Fig. 6 is a second preferred embodiment of the first carrier board of the present disclosure combined with other constituent components. In the embodiment, the first carrier 10 and other components are similar to the first carrier 10 and other components shown in fig. 5, and the same component numbers represent the same components, structures and functions, which are not described herein again. In the embodiment, the first carrier 10 further includes a first insulator 15 and a second insulator 16 respectively disposed on the first surface 11 and the second surface 12. The first wiring layer 13 and the second wiring layer 14 are provided on the first insulator 15 and the second insulator 16, respectively. The first wiring layer 13 and the second wiring layer 14 may be, for example, multilayer wiring layers. In the present embodiment, the first wiring layer 13 includes a surface wiring layer 13a and an inner wiring layer 13 b. The second wiring layer 14 includes a surface wiring layer 14a and an inner wiring layer 14 b. Of course, the disclosure is not so limited. In addition, the magnetic element 20 is disposed between the first insulator 15 and the second insulator 16, and the first conductive terminal 24 and the second conductive terminal 25 of the winding 26 are electrically connected to the first wiring layer 13 and the second wiring layer 14, respectively, that is, the first conductive terminal 24 and the second conductive terminal 25 of the winding 26 are led out from the first surface 11 and the second surface 12 of the first carrier 10, respectively. By embedding the magnetic assembly 20, the first guiding component 30 and the second guiding component 40 in the first carrier 10 and connecting the magnetic assembly to the first wiring layer 13 on the first surface 11 and the second wiring layer 14 on the second surface 12 of the first carrier 10, the flexibility of the layout of the subsequent power device 60 and the electronic device 70 can be increased. It should be noted that, according to different manufacturing methods of the first carrier 10, the first insulator 15 and the second insulator 16 may include a plurality of insulating material layer structures, and interface positions between the layers may also be different accordingly, which will not be described in detail hereinafter. In one embodiment, at least one of the insulating material layer of the first insulator 15 and the insulating material layer of the second insulator 16 is flowable and forms a final insulating material layer in the lamination process.

Fig. 7 is a schematic cross-sectional structure diagram of a power module according to a fourth preferred embodiment of the present disclosure. In the present embodiment, the power module 1c is similar to the power module 1a shown in fig. 3, and the same component numbers represent the same components, structures and functions, which are not described herein again. In the embodiment, the power module 1c includes at least one first electronic device 71 and at least one second electronic device 72, which are respectively disposed on the second carrier 50 and the first carrier 10. Wherein the first electronic device 71 is disposed on the third wiring layer 53 on the third surface 51 of the second carrier 50, and the first electronic device 71 and the third wiring layer 53 of the second carrier 50 are electrically connected through solder or the like (not shown). And the first electronic device 71 is located between the two power devices 60. In the embodiment, the second carrier 50 exposes at least one peripheral region 11a of the first surface 11 of the first carrier 10, i.e. within the peripheral region 11a, the first carrier 10 and the second carrier 50 do not overlap in the vertical direction, and the second electronic device 72 is disposed on at least one peripheral region 11a of the first surface 11 of the first carrier 10. Further, the first electronic device 71 or the second electronic device 72 is an input filter capacitor Cin shown in fig. 1. The first electronic device 71 is a capacitor with small height and good high-frequency characteristics, and is arranged close to the main switching tube Q1 and the follow current tube Q2, so that the parasitic inductance of the loop can be effectively reduced; the second electronic device 72 is a capacitor with a high height and a large capacity, so that the efficiency and the electrical reliability of the power module 1c can be effectively improved. Therefore, the arrangement of the magnetic component 20, the first guiding and connecting component 30 and the second guiding and connecting component 40 embedded in the first carrier plate 10 is matched, so that the magnetic component 20, the power device 60, the first electronic device 71 and the second electronic device 72 are more favorably optimized and integrated, the power module 1c can achieve high efficiency and high power density, the occupation of the power module 1c on system mainboard resources is effectively reduced, and the competitiveness of the power module 1c product is further improved.

Fig. 8 is a schematic cross-sectional structure view of a power module according to a fifth preferred embodiment of the present disclosure. In the present embodiment, the power module 1d is similar to the power module 1a shown in fig. 3, and the same component numbers represent the same components, structures and functions, which are not described herein again. In the embodiment, the power module 1d includes at least one first electronic device 71 and at least one second electronic device 72 respectively disposed on the second carrier 50 and the first carrier 10. Wherein the first electronic device 71 is disposed on the third wiring layer 53 on the third surface 51 of the second carrier 50, and the first electronic device 71 and the third wiring layer 53 of the second carrier 50 are electrically connected through solder or the like (not shown). And the first electronic device 71 is disposed adjacent to one side of the power device 60. In the embodiment, the second carrier 50 has at least one receiving opening 50a, such that the second carrier 50 exposes at least a portion of the area 11b of the first surface 11 of the first carrier 10, i.e. in the portion of the area 11b, the first carrier 10 and the second carrier 50 are not overlapped in the vertical direction, and the second electronic device 72 is received in the receiving opening 50a and disposed on at least a portion of the area 11b of the first surface 11. Further, the first electronic device 71 or the second electronic device 72 is a filter capacitor Cin shown in fig. 1. The first electronic device 71 is a capacitor with small height and good high-frequency characteristics and is arranged close to the main switching tube Q1 and the follow current tube Q2, so that the parasitic inductance of a loop can be effectively reduced; the second electronic device 72 is a capacitor with a high height and a large capacity, so that the efficiency and the electrical reliability of the power module 1d can be effectively improved. Therefore, the arrangement of the magnetic component 20, the first guiding and connecting component 30 and the second guiding and connecting component 40 embedded in the first carrier plate 10 is matched, so that the magnetic component 20, the power device 60, the first electronic device 71 and the second electronic device 72 are more favorably optimized and integrated, the power module 1d can achieve high efficiency and high power density, the occupation of the power module 1d on system mainboard resources is effectively reduced, and the competitiveness of the power module 1d product is further improved.

Fig. 9 is a schematic cross-sectional structure diagram of a power module according to a sixth preferred embodiment of the present disclosure. In the present embodiment, the power module 1e is similar to the power module 1a shown in fig. 3, and the same component numbers represent the same components, structures and functions, which are not described herein again. In the embodiment, the power module 1e includes at least one first electronic device 71 and at least one second electronic device 72, which are respectively disposed on the second carrier 50 and the first carrier 10, and only includes the first conductive connection element 30 embedded in the first carrier 10. The first electronic device 71 is disposed on the third wiring layer 53 on the third surface 51 of the second carrier 50, and the first electronic device 71 and the third wiring layer 53 of the second carrier are electrically connected by solder or the like (not shown), and are located between the two power devices 60. In the embodiment, the second carrier 50 exposes the peripheral region 11a of the first surface 11 of the first carrier 10, and the second electronic device 72 is disposed on the peripheral region 11a of the first surface 11 of the first carrier 10 and can be electrically connected to the second surface 12 of the first carrier 10 directly through the first conductive member 30. Further, the first electronic device 71 or the second electronic device 72 is a filter capacitor Cin shown in fig. 1. The first electronic device 71 is a capacitor with small height and good high-frequency characteristics and is arranged close to the main switching tube Q1 and the follow current tube Q2, so that the parasitic inductance of a loop can be effectively reduced; the second electronic device 72 is a capacitor with a high height and a large capacity, so that the efficiency and the electrical reliability of the power module can be effectively improved. Therefore, the arrangement of the magnetic component 20 and the first guiding component 30 embedded in the first carrier plate 10 is matched, which is more beneficial to optimizing and integrating the connection of the magnetic component 20, the power device 60, the first electronic device 71 and the second electronic device 72, so that the power module 1e can realize high efficiency and high power density, the occupation of the power module 1e on system mainboard resources is effectively reduced, and the competitiveness of the power module 1e product is further improved.

Fig. 10 is a schematic cross-sectional structure view of a power module according to a seventh preferred embodiment of the present disclosure. In the present embodiment, the power module 1f is similar to the power module 1a shown in fig. 3, and the same component numbers represent the same components, structures and functions, which are not described herein again. In the embodiment, the power module 1f includes at least one first electronic device 71 and at least one second electronic device 72 respectively disposed on the third surface 51 and the fourth surface 52 of the second carrier 50. The first electronic device 71 is disposed on the third wiring layer 53 on the third surface 51 of the second carrier 50, and the first electronic device 71 and the third wiring layer 53 of the second carrier 50 are electrically connected by solder or the like (not shown), and are located between the two power devices 60. In the present embodiment, the first carrier 10 exposes at least one peripheral region 52a of the fourth surface 52 of the second carrier 50, and the second electronic device 72 is disposed on at least one peripheral region 52a of the fourth surface 52. Further, the first electronic device 71 or the second electronic device 72 is a filter capacitor Cin shown in fig. 1. The first electronic device 71 is a capacitor with small height and good high-frequency characteristic, is arranged close to the main switching tube Q1 and the follow current tube Q2, and can effectively reduce the parasitic inductance of the loop; the second electronic device 72 is a capacitor with a high height and a large capacity, so that the efficiency and the electrical reliability of the power module can be effectively improved. Therefore, the arrangement of the magnetic component 20, the first guiding and connecting component 30 and the second guiding and connecting component 40 embedded in the first carrier plate 10 is matched, so that the magnetic component 20, the power device 60, the first electronic device 71 and the second electronic device 72 are more favorably optimized and integrated, the power module 1f can achieve high efficiency and high power density, the occupation of the power module 1f on system mainboard resources is effectively reduced, and the competitiveness of the power module 1f product is further improved.

Fig. 11 is a schematic cross-sectional structure diagram of a power module according to an eighth preferred embodiment of the present disclosure. In the present embodiment, the power module 1g is similar to the power module 1a shown in fig. 3, and the same component numbers represent the same components, structures and functions, which are not described herein again. In the embodiment, the power module 1g includes at least one first electronic device 71 and at least one second electronic device 72 respectively disposed on the third surface 51 and the fourth surface 52 of the second carrier 50. The first electronic device 71 is disposed on the third wiring layer 53 on the third surface 51 of the second carrier 50, and the first electronic device 71 and the third wiring layer 53 of the second carrier 50 are electrically connected by solder or the like (not shown), and are located between the two power devices 60. In the embodiment, the first carrier 10 has at least one receiving opening 10a, such that the first carrier 10 exposes at least a portion of the area 52b of the fourth surface 52 of the second carrier 50, and the second electronic device 72 is received in the receiving opening 10a and disposed on at least a portion of the area 52b of the fourth surface 52. Therefore, the arrangement of the magnetic component 20, the first guiding and connecting component 30 and the second guiding and connecting component 50 embedded in the first carrier plate 10 is matched, so that the magnetic component 20, the power device 60, the first electronic device 71 and the second electronic device 72 are more favorably optimized and integrated, the power module 1g can achieve high efficiency and high power density, the occupation of the power module 1g on system mainboard resources is effectively reduced, and the competitiveness of the power module 1g product is further improved.

Based on the structure of the power module 1 in the foregoing embodiment, the present disclosure also discloses an assembling method of the power module. Refer to fig. 2 and 12. Fig. 12 is a manufacturing method of a power module disclosing a preferred embodiment of the present disclosure. First, in step S1, a first carrier 10 and a magnetic device 20 are provided, in which the first carrier 10 includes a first surface 11, a second surface 12, a first guiding component 30 and a second guiding component 40, the first surface 11 and the second surface 12 are opposite to each other, the first guiding component 30 and the second guiding component 40 are disposed between the first surface 11 and the second surface 12, the magnetic device 20 is disposed between the first surface 11 and the second surface 12 of the first carrier 10 and includes at least one magnetic core 23 and at least one winding 26, the at least one winding 26 has a first guiding terminal 24 and a second guiding terminal 25, which are respectively led out from the first surface 11 and the second surface 12 of the first carrier 10. The first end 31 of the first guiding member 30 is guided out of the first surface 11 of the first carrier plate 10. The second end 32 of the first guiding and guiding component 30 is guided out of the second side 12 of the first carrier plate 10. The first end 41 of the second guiding member 40 is guided out of the first surface 11 of the first carrier plate 10, and the second end 42 of the second guiding member 40 is guided out of the second surface 12 of the first carrier plate 10. In this embodiment, the first carrier 10 further includes a first wiring layer 13 and a second wiring layer 14, and the first wiring layer 13 and the second wiring layer 14 are respectively disposed on the first surface 11 and the second surface 12. The first and second

conductive members

second conduction terminals

24 and 25 of the at least one winding 26 are electrically connected to the first and second wiring layers 13 and 14, respectively.

Next, in step S2, a second carrier 50 is provided and disposed on the first carrier 10. The second carrier 50 includes a third surface 51 and a fourth surface 52, the third surface 51 and the fourth surface 52 are opposite to each other, wherein the fourth surface 52 faces the first surface 11 of the first carrier 10. The second carrier 50 further includes a third wiring layer 53 and a fourth wiring layer 54. The third wiring layer 53 and the fourth wiring layer 54 are disposed on the third surface 51 and the fourth surface 52, respectively, and are electrically connected to each other. In some embodiments, the second carrier 50 further includes a fifth wiring layer 55, and the fifth wiring layer 55 is disposed between the third surface 51 and the fourth surface 52 and electrically connected to the third wiring layer 53 and the fourth wiring layer 54. In addition, the fourth wiring layer 54 on the fourth surface 52 of the second carrier 50 and the first wiring layer 13 on the first surface 11 of the first carrier 10 may be connected by, for example, a solder 80 or other bonding methods.

Then, in step S3, at least one power device 60 having at least one conductive terminal 61 is provided. Finally, in step S4, the power device 60 is disposed on the third surface 51 of the second carrier 50, and the connection terminals 61 of the power device 60 are electrically connected to the first carrier 10 through the second carrier 50. The connection terminal 61 of the power device 60 can also be electrically connected to the third wiring layer 53 on the third surface 51 of the second carrier 50, for example, by a conductive adhesive 81 or other connection methods. In addition, in the embodiment, for example, the power device 60 and the second carrier board 50 may be soldered together, and then the test is completed, and then the power device 60 is soldered to the first carrier board 10, so that the power device 60 is electrically connected to the first carrier board 10 through the second carrier board 50. In an embodiment, the power device 60, the first carrier 10, and the second carrier 50 may be soldered at the same time. In other embodiments, the first carrier plate 10 and the second carrier plate 50 are soldered first, and then soldered with the power device 60. The present disclosure is not limited thereto and will not be described in detail.

It is worth noting that, in the power module 1 of the present disclosure, the magnetic component 20, the first guiding component 30 and the second guiding component 40 are embedded in the first carrier 10 and connected between the first wiring layer 13 on the first surface 11 and the second wiring layer 14 on the second surface 12 of the first carrier 10, so as to increase the flexibility of the layout of the power device 60, and optimize and integrate the connection between the magnetic component 20 and the power device 60, so that the power module 1 can achieve high efficiency and high power density, effectively reduce the occupation of the system motherboard resources by the power module 1, and further improve the competitiveness of the power module 1 product.

It should be noted that, the manufacturing process is mostly a one-piece type manufacturing process, and only one unit is used for description for simplicity, which is not limited to this disclosure.

Fig. 13A to 13E are schematic manufacturing process diagrams of other components of the first carrier assembly according to the first preferred embodiment of the disclosure. In this embodiment, a release film 90 is first provided, and the release film 90 provides a temporary fixing function during the manufacturing process. Next, at least one magnetic core 23 and at least one connecting element 26a are provided and disposed on the peeling film 90, as shown in fig. 13A. In the present embodiment, the at least one magnetic core 23 has at least one opening area 23a, and the at least one connecting element 26a is accommodated in the at least one opening area 23 a. Then, a first insulating material layer 91 is covered on the peeling film 90, the at least one connecting element 26a and the at least one magnetic core 23 to form the first surface 11 of the first carrier 10 in an assembled manner, as shown in fig. 13B. Subsequently, the peeling film 90 is removed to expose the bottom surface 22 of the at least one magnetic core 23 and the bottom surface of the at least one connecting member 26 a. In addition, a second insulating material layer 92 is covered on the bottom surface 22 of the at least one magnetic core 23 and the bottom surface of the at least one connecting element 26a to form the second surface 12 of the first carrier 10, as shown in fig. 13C. Finally, a first wiring layer 13 and a second wiring layer 14 are formed on the first surface 11 and the second surface 12 respectively by drilling and metallization wiring, and the first wiring layer 13 and the second wiring layer 14 are electrically connected to each other through the at least one connecting element 26a to form the winding 26 of the magnetic element 20. In the present embodiment, when the metallization lines form a first wiring layer 13 and a second wiring layer 14, a second conductive part 40 (e.g., a conductive via) may also be formed between the first surface 11 and the first surface 12 of the first carrier 10, as shown in fig. 13D. It should be noted that in some embodiments, the step of covering the second insulating layer 92 may be omitted, and the second wiring layer 14 may be directly disposed on the bottom surface. Further, it is also possible to partially remove the first insulating material 91 to expose the top surface 21 of the magnetic core 23, and provide the first wiring layer 13. In other embodiments, at least two connectors 26a are accommodated in the at least two opening regions 23a, and are electrically connected to each other through the first wiring layer 13, the second wiring layer 14 and the at least two connectors 26a to form the windings 26 of the magnetic assembly 20. In other embodiments, the plurality of connectors 26a are accommodated in the at least one opening region 23a, and are electrically connected to each other through the first wiring layer 13, the second wiring layer 14, the plurality of connectors 26a, the at least one first guiding component 30, or the at least one second guiding component 40 to form the plurality of turns of the plurality of windings 26 of the magnetic element 20. In another embodiment, the first wiring layer 13 and the second wiring layer 14 may be, for example, a plurality of wiring layers. As shown in fig. 13E, the first carrier 10 further includes a first insulator 15 and a second insulator 16 respectively disposed on the first surface 11 and the second surface 12. The first wiring layer 13 includes a surface wiring layer 13a and an inner wiring layer 13 b. The second wiring layer 14 includes a surface wiring layer 14a and an inner wiring layer 14 b. The first wiring layer 13 and the second wiring layer 14 are provided on the first insulator 15 and the second insulator 16, respectively. Of course, the disclosure is not so limited.

Fig. 14A to 14D are schematic manufacturing process diagrams of other components of the first carrier assembly according to the second preferred embodiment of the disclosure. In the embodiment, the first carrier 10 and other components are similar to the first carrier 10 and other components shown in fig. 13A to 13E, and the same component numbers represent the same components, structures and functions, which are not described herein again. In the present embodiment, the magnetic core 23 has at least two opening regions 23a, the at least two connecting members 26a are respectively accommodated in the at least two opening regions 23a, and both the magnetic core 23 and the two connecting members 26a are firstly disposed on the peeling film 90, as shown in fig. 14A. Then, a first insulating material layer 91 is covered on the peeling film 90, the two connectors 26a and the magnetic core 23 to form the first surface 11 of the first carrier 10 in an assembled manner, as shown in fig. 14B. Subsequently, the peeling film 90 is removed, exposing the bottom surface 22 of the magnetic core 23 and the bottom surfaces of the two connection members 26 a. In addition, a second insulating material layer 92 is covered on the bottom surface 22 of the core 23 and the bottom surfaces of the two connectors 26a to form the second surface 12 of the first carrier 10, as shown in fig. 14C. Finally, a first wiring layer 13 and a second wiring layer 14 are formed on the first surface 11 and the second surface 12 respectively by metallization wiring. The winding 26 of the magnetic component 20 may be formed by two connectors 26a and the first wiring layer 13 and/or the second wiring layer 14, for example. It should be noted that in some embodiments, the step of covering the second insulating layer 92 may be omitted, and the second wiring layer 14 may be directly disposed on the bottom surface. Further, it is also possible to partially remove the first insulating material 91 to expose the top surface 21 of the magnetic core 23, and provide the first wiring layer 13. In the present embodiment, when the metallization lines form a first wiring layer 13 and a second wiring layer 14, a second conductive part 40 (e.g., a conductive via) may also be formed between the first surface 11 and the first surface 12 of the first carrier 10, as shown in fig. 14D. In other embodiments, the plurality of connectors 26a are accommodated in the at least one opening region 23a, and are electrically connected to each other through the first wiring layer 13, the second wiring layer 14 and the plurality of connectors 26a to form the plurality of windings 26 of the magnetic assembly 20. In other embodiments, the plurality of connectors 26a are accommodated in the at least one opening region 23a, and are electrically connected to each other through the first wiring layer 13, the second wiring layer 14, the plurality of connectors 26a, the at least one first guiding component 30, or the at least one second guiding component 40 to form the multi-turn winding 26 of the magnetic element 20. Therefore, the magnetic component 20 and the second guiding component 40 can be embedded in the first carrier plate 10 and electrically connected between the first surface 11 and the second surface 12 to increase the flexibility of the layout of the power device 60, and simultaneously optimize and integrate the connection between the magnetic component 20 and the power device 60, so that the power module 1 can achieve high efficiency and high power density, effectively reduce the occupation of the power module 1 on system motherboard resources, and further improve the competitiveness of the power module 1 product.

Fig. 15A to 15D are schematic manufacturing process diagrams of other components of the first carrier assembly according to the third preferred embodiment of the disclosure. In the embodiment, the first carrier 10 and other components are similar to the first carrier 10 and other components shown in fig. 14A to 14D, and the same component numbers represent the same components, structures and functions, which are not described herein again. In the present embodiment, the magnetic core 23 has an opening area 23a, and a connecting member 26a is accommodated in the opening area 23a and disposed on the peeling film 90 together with the first and second pre-formed guiding

members

30 and 40, as shown in fig. 15A. In the present embodiment, the first conductive member 30 and the connecting member 26a may be a copper block, for example, and the second conductive member 40 may be a circuit board including conductive vias, for example. Then, a first insulating material layer 91 is covered on the peeling film 90, the connecting member 26a, the first guiding component 30, the second guiding component 40 and the magnetic core 23 to form the first surface 11 of the first carrier 10 in an assembly manner, as shown in fig. 15B. Subsequently, the peeling film 90 is removed, exposing the bottom surface 22 of the magnetic core 23 and the bottom surface of the connecting member 26 a. In addition, a second insulating material layer 92 is covered on the bottom surface 22 of the core 23 and the bottom surface of the connecting component 26a to form the second surface 12 of the first carrier 10, as shown in fig. 15C. Finally, a first wiring layer 13 and a second wiring layer 14 are formed on the first surface 11 and the second surface 12 respectively by metallization wiring. The winding 26 of the magnetic component 20 can be formed by a connector 26a and the first and second wiring layers 13 and 14, for example. In addition, when the first wiring layer 13 and the second wiring layer 14 are formed, both the first guiding component 30 and the second guiding component 40 can be electrically connected between the first surface 11 and the second surface 12 of the first carrier 10, as shown in fig. 15D. In other embodiments, the plurality of connectors 26a are accommodated in the at least one opening region 23a, and are electrically connected to each other through the first wiring layer 13, the second wiring layer 14 and the plurality of connectors 26a to form the plurality of windings 26 of the magnetic device 20. In other embodiments, the plurality of connectors 26a are accommodated in the at least one opening region 23a, and are electrically connected to each other through the first wiring layer 13, the second wiring layer 14, the plurality of connectors 26a, the at least one first guiding component 30, or the at least one second guiding component 40 to form the multi-turn winding 26 of the magnetic element 20. Therefore, the magnetic component 20, the first guiding component 30 and the second guiding component 40 can be embedded in the first carrier plate 10 and electrically connected between the first surface 11 and the second surface 12 to increase the flexibility of the layout of the power device 60, and simultaneously optimize and integrate the connection between the magnetic component 20 and the power device 60, so that the power module 1 can achieve high efficiency and high power density, effectively reduce the occupation of the power module 1 on system motherboard resources, and further improve the competitiveness of the power module 1 product.

Fig. 16A to 16D are schematic manufacturing process diagrams of other components of the first carrier assembly according to the fourth preferred embodiment of the disclosure. In the embodiment, the first carrier 10 and other components are similar to the first carrier 10 and other components shown in fig. 15A to 15D, and the same component numbers represent the same components, structures and functions, which are not described herein again. In the present embodiment, the magnetic element 20, the first guiding component 30 and the second guiding component 40 are embedded in the first carrier 10, as shown in fig. 16A. In mass production, two sets of the first carrier 10, the second guiding component 40, the magnetic core 23 and the connecting element 26a are further disposed symmetrically on the peeling film 90 (see fig. 15A), and an auxiliary connecting element 30a (e.g. a copper block) is further disposed between the two sets of the first carrier 10, the second guiding component 40, the magnetic core 23 and the connecting element 26a, as shown in fig. 16B. After the first wiring layer 13 and the second wiring layer 14 are formed by a similar process as described in the previous embodiment, the first guiding members 30 of the two first carriers 1 are formed by cutting the removed partial areas 30b of at least one auxiliary connecting member 30a, as shown in fig. 16A. In one embodiment, the two first guiding components 30 can also be formed by auxiliary connecting components (e.g. a U-shaped metal component) 30a (as shown in fig. 16C), which are divided into two parts and divided into two adjacent modules after the manufacture of the connecting piece is completed, so that the cutting amount can be reduced, and the connecting piece can be formed by a metal plate method at a low cost. Further, when the subsidiary link 30a of the U-shaped metal member is used, the angle of the vertical portion thereof to the bottom surface is not limited to 90 degrees, and for example, there may be an inclination within 15 degrees to absorb a certain thickness direction tolerance. Further, in another embodiment, the first guiding component 30 can be formed by using an auxiliary connecting component 30a (as shown in fig. 16D) formed by slotting and side-wall metalizing on the insulating material layer, i.e. dividing into two parts and belonging to two adjacent modules after the connection is completed. Further, in order to further reduce the conduction resistance in the vertical direction, a metalized via may be provided in parallel with the sidewall metallization layer, which has the effect of further improving the structural stability. In other words, in addition to integrating the first guiding component 30, the second guiding component 40 and the magnetic element 20 between the first surface 11 and the second surface 12 of the first carrier 10, the present disclosure also simplifies the process of embedding the first guiding component 30, the second guiding component 40 and the magnetic element 20 in the first carrier 10, thereby improving the production efficiency, achieving the purpose of assembling the optimized power module 1 and reducing the manufacturing cost thereof.

Fig. 17A to 17E are schematic manufacturing flow diagrams of other components of the first carrier assembly according to the fifth preferred embodiment of the disclosure. In the embodiment, the first carrier 10 and other components are similar to the first carrier 10 and other components shown in fig. 13A to 13E, and the same component numbers represent the same components, structures and functions, which are not described herein again. In the embodiment, the first carrier 10 is further assembled with other components by pressing. First, a first plate 93, a second plate 94, the magnetic element 20 and at least one first guiding component 30 are provided. The first layer 93 includes a first metal layer 93a and a first insulating material layer 93 b. The second laminate 94a includes a second metal layer 94a and a second insulating material layer 94 b. The magnetic element 20 and the at least one first guiding component 30 are disposed on the first insulating material layer 93b of the first layer plate 93, as shown in fig. 17A. In some embodiments, at least one adhesive layer is disposed between the magnetic element 20 and the first guiding member 30 and the first insulating material layer 93b of the first plate 93. Next, the first laminate 93 and the second laminate 94 are laminated to form the first surface 11 and the second surface 12 of the first carrier 10, wherein the second insulating material layer 94B of the second laminate 94 faces the first insulating material layer 93B of the first laminate 93, and the magnetic element 20 and the at least one first conductive connecting part 30 are wrapped between the first metal layer 93a and the second metal layer 94a by the insulating material layer, as shown in fig. 17B. In some embodiments, the first layer of insulating material 93b and the second layer of insulating material 94b are flowable during the lamination process and form the final layer of insulating material. In some embodiments, the first metal layer 93a and the first insulating material layer 93b of the first laminate 93 may each be independent layers. In some embodiments, the second metal layer 94a and a second insulating material layer 94b of the second laminate 94 may each be separate layers. In certain embodiments, the first laminate 93 comprises a plurality of layers 93b of a first insulating material. In certain embodiments, the second laminate 94 comprises a plurality of second layers of insulating material 94 b. In some embodiments, the first laminate 93 includes a plurality of first insulating material layers 93b, and at least one first insulating material layer 93b is prefabricated with the first metal layer 93a, and the first insulating material layer 93b does not have fluidity during the lamination process, and at least one first insulating material layer 93b has fluidity during the lamination process. In some embodiments, the second laminate 94 includes a plurality of second insulating material layers 94b, and at least one second insulating material layer 94b is pre-formed with the second metal layer 94a, and the second insulating material layer 94b does not have flowability during the lamination process, and at least one second insulating material layer 94b has flowability during the lamination process. Of course, the first layer 93 and the second layer 94 can be modulated according to the actual application. Fig. 18A-18C also disclose other embodiments of a first tier plate and a second tier plate combined magnetic assembly. The disclosure is not limited thereto and will not be described in detail. In addition, it should be noted that the first lead terminal 24 and the second lead terminal 25 of at least one winding 26 of the magnetic assembly 20 may protrude from the top surface 21 and the bottom surface 22 of the magnetic core 23, and at this time, corresponding receiving spaces or openings 97 may be formed in the openings of the first layer board 93 and the second layer board 94, so as to ensure that the process is performed smoothly. The opening 97 may extend partially through the first layer plate 93 or through the first layer plate 93. Correspondingly, the opening 97 may extend partially through the second layer 94 or through the second layer 94. In addition to facilitating the process, the distance between the first and second

conductive terminals

24 and 25 of at least one winding 26 of the magnetic element 20 and a first metal layer 93a of the first layer 93 and a second metal layer 94a of the second layer 94 can be reduced to reduce the connection resistance and the amount of insulation material removal. Next, a plurality of slots 95 are formed by, for example, laser drilling/slotting, mechanical drilling/slotting, etc., and penetrate through the first metal layer 93a and the second metal layer 94a, exposing the at least one first conductive part 30 and the first conductive terminal 24 and the second conductive terminal 25 of the at least one winding 26, as shown in fig. 17C. Then, after a thin copper layer is formed on the surface by electroless plating, a photoresist layer 96 is disposed, and the first metal layer 93a and the second metal layer 94a are continuously thickened according to the shape of the photoresist layer 96, as shown in fig. 17D. Finally, tin-lead plating (patterning) is performed through the photoresist layer 96, and the copper layer is etched under the protection of the tin-lead layer after the photoresist layer 96 is removed, so as to form the first wiring layer 13 and the second wiring layer 14, as shown in fig. 17E. Of course, the first wiring layer 13 and the second wiring layer 14 can also be realized by electroplating a thickened copper layer on the whole surface after forming the plurality of slots 95, and finally etching under the definition of the photoresist. In the present embodiment, the first carrier 10 obtained forms the first wiring layer 13 and the second wiring layer 14 on the first surface 11 and the second surface 12, respectively, the first wiring layer 13 and the second wiring layer 14 are electrically connected to each other through at least one first conductive connection component 30, and the first conductive terminal 24 and the second conductive terminal 25 of the at least one winding 26 are led out from the first surface 11 and the second surface 12 of the first carrier 10, respectively. Therefore, the magnetic component 20 and the first guiding component 30 can be embedded in the first carrier plate 10 and electrically connected between the first surface 11 and the second surface 12 to increase the flexibility of the layout of the power device 60, and simultaneously optimize and integrate the connection between the magnetic component 20 and the power device 60, so that the power module 1 can achieve high efficiency and high power density, effectively reduce the occupation of the power module 1 on system motherboard resources, and further improve the competitiveness of the power module 1 product.

In addition, fig. 19A to 19B disclose another embodiment in which a magnetic member is provided on a release film. It should be noted that, when the first conductive terminal 24 and the second conductive terminal 25 of at least one winding 26 of the magnetic assembly 20 protrude from the top surface 21 and the bottom surface 22 of the magnetic core 23, in addition to the first layer plate 93 and the second layer plate 94 being provided with the corresponding opening 97 according to practical applications, when the peeling film 90 is used to carry the magnetic assembly 20, the corresponding opening 97 may also be provided on the peeling film 90, so that when the magnetic assembly 20 is attached to the peeling film 90 and carried on the peeling film 90, the first conductive terminal 24 or the second conductive terminal 25 may partially penetrate through the peeling film 90, so as to achieve the aforementioned technical effects. The disclosure is not limited thereto and will not be described in detail.

As can be seen from the above descriptions, the power module 1 of the present disclosure may vary widely according to practical application requirements. With a typical buck circuit, the power module 1 of the present disclosure may have circuit variations similar to those shown in fig. 20A to 20C, such as multiple sets of switching devices with one inductor (as shown in fig. 20A), one set of switching devices with multiple inductors (as shown in fig. 20B), or multiple sets of switching devices with multiple inductors (as shown in fig. 20C), for different applications. The power module can be realized by slightly deforming the structural design of the power module and the design of the circuit pattern. In the case of multiple inductors, the inductor may be implemented as multiple independent inductors or coupled inductors by a pattern design, which is not limited in this disclosure.

In summary, the present disclosure provides a power module and a method for manufacturing the same. The magnetic assembly and the connecting part are embedded in the carrier plate and connected between the wiring layers on the two surfaces of the carrier plate, so that the flexibility of arrangement of the power device and other electronic devices is improved, and meanwhile, the connection between the magnetic assembly and the power device is optimized and integrated, so that the power module can realize high efficiency and high power density, the occupation of the power module on system mainboard resources is effectively reduced, and the competitiveness of a power module product is further improved. The integrated and optimized power module can be modulated according to different application requirements, and the change of design can be added, so that the circuit characteristics of the power module are further optimized, and more functions are integrated in the power module. In addition, the magnetic assembly is integrated between the wiring layers on the two surfaces of the carrier plate through the copper block, the conductive through hole, the lead frame or the circuit board, and meanwhile, the process that the magnetic assembly and the conductive connecting part are embedded in the carrier plate is simplified, the production efficiency is improved, and the purposes of assembling the optimized power module and reducing the manufacturing cost of the power module are achieved.

The disclosure is susceptible to various modifications by persons skilled in the art, without however departing from the scope of protection as defined in the appended claims.

Claims

1. A power module, comprising:

the first carrier plate comprises a first surface, a second surface and at least one guide connecting part, wherein the first surface and the second surface are opposite to each other, and the at least one guide connecting part is arranged between the first surface and the second surface;

a magnetic assembly disposed between the first surface and the second surface of the first carrier and including at least one magnetic core and at least one winding, wherein the at least one winding has a first conductive terminal and a second conductive terminal respectively led out from the first surface and the second surface of the first carrier, and the at least one conductive member is located outside the magnetic assembly;

the second carrier plate is arranged on the first carrier plate and comprises a third surface and a fourth surface, the third surface and the fourth surface are opposite to each other, and the fourth surface faces the first surface; and

and the power device is arranged on the third surface of the second carrier plate and is electrically connected to the first carrier plate through the second carrier plate.

2. The power module of claim 1, wherein the first carrier further comprises a first wiring layer and a second wiring layer, the first wiring layer and the second wiring layer are disposed on the first surface and the second surface, respectively, and the at least one conductive connecting member is electrically connected between the first wiring layer and the second wiring layer.

3. The power module of claim 2 wherein the first and second lead terminals are electrically connected to the first and second routing layers, respectively.

4. The power module as claimed in claim 2, wherein the first carrier further comprises at least one insulator disposed between the first wiring layer and the second wiring layer, forming an insulating material layer covering the magnetic element, and the first lead terminal and the second lead terminal are electrically connected to the first wiring layer and the second wiring layer, respectively.

5. The power module of claim 4 wherein at least one of the first and second routing layers is a multi-layer routing layer.

6. The power module of claim 1 wherein the at least one conductive connection member is selected from one of the group consisting of a copper block, a conductive via, a lead frame, and a circuit board.

7. The power module as claimed in claim 1, wherein the second carrier includes a third wiring layer and a fourth wiring layer respectively disposed on the third surface and the fourth surface.

8. The power module as claimed in claim 7, wherein the second carrier includes a fifth wiring layer disposed between the third surface and the fourth surface and electrically connected to at least the third wiring layer or the fourth wiring layer.

9. The power module of claim 1 further comprising at least one electronic device disposed on the first face, the third face, or the fourth face.

10. The power module of claim 1 further comprising at least one electronic device, wherein the second carrier exposes at least one peripheral region of the first side of the first carrier, the at least one electronic device being disposed in the at least one peripheral region of the first side.

11. The power module of claim 1 further comprising at least one electronic device, wherein the second carrier has at least one receiving opening, and the at least one electronic device is received in the at least one receiving opening and disposed on the first surface.

12. The power module of claim 1 further comprising at least one electronic device, wherein the first carrier exposes at least one peripheral region of the fourth surface of the second carrier, the at least one electronic device being disposed on the at least one peripheral region of the fourth surface.

13. The power module of claim 1 further comprising at least one electronic device, wherein the first carrier has at least one receiving opening, and the at least one electronic device is received in the at least one receiving opening and disposed on the fourth surface.

14. The power module of any of claims 9-13 wherein the at least one electronic device is selected from one of the group consisting of a capacitor, a resistor, and a driver.

15. A method of manufacturing a power module, comprising:

the method comprises the following steps of (a) providing a first carrier plate and a magnetic assembly, wherein the first carrier plate comprises a first surface, a second surface and at least one guide part, the first surface and the second surface are opposite to each other, the at least one guide part is arranged between the first surface and the second surface, the magnetic assembly is arranged between the first surface and the second surface of the first carrier plate and comprises at least one magnetic core and at least one winding, the at least one winding is provided with a first guide terminal and a second guide terminal, the first guide terminal and the second guide terminal are respectively guided out from the first surface and the second surface of the first carrier plate, and the at least one guide part is positioned outside the magnetic assembly;

providing a second carrier plate which is arranged on the first carrier plate and comprises a third surface and a fourth surface, wherein the third surface and the fourth surface are opposite to each other, and the fourth surface faces the first surface;

step (c) providing at least one power device; and

and (d) arranging the at least one power device on the third surface of the second carrier plate, wherein the at least one power device is electrically connected to the first carrier plate through the second carrier plate.

16. The method of manufacturing of claim 15, wherein the step (a) comprises:

step (a11) providing a release film;

step (a12) providing the at least one magnetic core and at least one connecting piece, wherein the at least one magnetic core and the at least one connecting piece are arranged on the peeling film, the at least one magnetic core is provided with at least one opening area, and the at least one connecting piece is accommodated in the at least one opening area;

step (a13) covering a first insulating material layer on the peeling film, the at least one connecting member and the at least one magnetic core to form the first surface of the first carrier;

step (a14) removing the peeling film to expose the bottom surface of the at least one magnetic core and the bottom surface of the at least one connecting element;

covering a second insulating material layer on the bottom surface of the at least one magnetic core and the bottom surface of the at least one connecting piece to form the second surface of the first carrier plate (a 15); and

step (a16) is to form a first wiring layer and a second wiring layer on the first surface and the second surface, respectively, and the first wiring layer and the second wiring layer are electrically connected to each other through the at least one connecting element to form the at least one winding of the magnetic assembly.

17. The method of claim 16, further comprising the step (a17) of forming the at least one via disposed between the first and second surfaces and electrically connected to the first and second wiring layers.

18. The method according to claim 16, wherein the first carrier further comprises a first insulator and a second insulator respectively disposed on the first surface and the second surface, wherein the first wiring layer and the second wiring layer are respectively disposed on the first insulator and the second insulator, the magnetic element is disposed between the first insulator and the second insulator, and the at least one winding of the magnetic element is formed by at least one connecting element and the first wiring layer and the second wiring layer.

19. The method according to claim 16, wherein the at least one magnetic core has at least two open areas, at least two of the connectors are respectively received in the at least two open areas, and the at least one winding of the magnetic element is formed by the at least two connectors and the first and/or second wiring layers.

20. The method of claim 19, wherein the step (a12) further provides two magnetic cores and at least one auxiliary connector disposed on the release film, wherein the two magnetic cores are disposed adjacent to each other and the at least one auxiliary connector is disposed between the two magnetic cores.

21. The method according to claim 20, wherein the at least one auxiliary connecting element is a U-shaped metal element or a metal element of a sidewall of a trench formed on the first insulating material layer or the second insulating material layer.

22. The method according to claim 20, further comprising the step (a18) of cutting the at least one auxiliary connecting element to form the at least one guiding element of two first carriers respectively.

23. The method according to claim 16, wherein the first connection terminal and the second connection terminal of the at least one winding protrude from the surface and the bottom of the at least one magnetic core, respectively, and the peeling film includes at least one opening corresponding to the first connection terminal or the second connection terminal such that the first connection terminal or the second connection terminal passes through the peeling film.

24. The method of manufacturing of claim 15, wherein the step (a) comprises:

step (a21) providing a first laminate, the magnetic element and the at least one conductive element, wherein the first laminate comprises a first metal layer and a first insulating material layer, and the magnetic element and the at least one conductive element are disposed on the first insulating material layer of the first laminate;

step (a22) of providing a second laminate comprising a second metal layer and a second layer of insulating material;

step (a23) pressing the first layer board and the second layer board to form the first surface and the second surface of the first carrier, wherein the second insulating material layer of the second layer board faces the first insulating material layer of the first layer board, and the magnetic assembly and the at least one conductive connecting part are wrapped between the first metal layer and the second metal layer by the first insulating material layer or the second insulating material layer;

forming a plurality of slots penetrating through the first metal layer and the second metal layer to expose the at least one conductive member and the first conductive terminal and the second conductive terminal of the at least one winding (a 24); and

step (a25) forming a first wiring layer and a second wiring layer on the first surface and the second surface respectively, the first wiring layer and the second wiring layer being electrically connected to each other through the at least one connection member, and the first connection terminal and the second connection terminal of the at least one winding being led out from the first surface and the second surface of the first carrier respectively.

25. The method of claim 24, wherein the step (a24) is performed by forming the plurality of slots by a mechanical slotting process.

26. The method of manufacturing of claim 24, wherein the step (a25) further comprises:

step (a251) forming a photoresist layer on the first metal layer and the second metal layer, respectively; and

in step (a252), after performing the second copper and tin-lead electroplating and etching processes through the photoresist layer, the photoresist layer is removed to form the first wiring layer and the second wiring layer.

27. The manufacturing method according to claim 24, wherein the first and second connection terminals of the at least one winding protrude from the surface and bottom surface of the magnetic core, respectively, and the first or second layer board includes at least one opening corresponding to the first or second connection terminal such that the first or second connection terminal portion passes through the first or second layer board.