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CN111946600A - Cooling method for water cavity of hydrogen compressor - Google Patents

Cooling method for water cavity of hydrogen compressor Download PDF

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Publication number
CN111946600A
CN111946600A CN202010770068.3A CN202010770068A CN111946600A CN 111946600 A CN111946600 A CN 111946600A CN 202010770068 A CN202010770068 A CN 202010770068A CN 111946600 A CN111946600 A CN 111946600A
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CN
China
Prior art keywords
cavity
cooling
water cavity
cold air
water
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Pending
Application number
CN202010770068.3A
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Chinese (zh)
Inventor
王淮北
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bengbu Aipu Compressor Machinery Co ltd
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Bengbu Aipu Compressor Machinery Co ltd
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Publication date
Application filed by Bengbu Aipu Compressor Machinery Co ltd filed Critical Bengbu Aipu Compressor Machinery Co ltd
Priority to CN202010770068.3A priority Critical patent/CN111946600A/en
Publication of CN111946600A publication Critical patent/CN111946600A/en
Pending legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B39/00Component parts, details, or accessories, of pumps or pumping systems specially adapted for elastic fluids, not otherwise provided for in, or of interest apart from, groups F04B25/00 - F04B37/00
    • F04B39/06Cooling; Heating; Prevention of freezing
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/20Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Control Of Positive-Displacement Pumps (AREA)

Abstract

The invention discloses a method for cooling a water cavity of a hydrogen compressor, which relates to the technical field of hydrogen compressor protection and comprises a compressor cavity and a cooling device, wherein the cooling device comprises a generating box and an exhaust pipeline, the generating box is arranged at the bottom of the compressor cavity through a bolt, a cold air cavity, a conveying cavity and a discharge cavity are arranged in the generating box, a U-shaped communicating groove is arranged between the cold air cavity and the conveying cavity, a semiconductor refrigerating plate is arranged on the inner wall of the cold air cavity through a bolt, an air pump is arranged in the conveying cavity through a bolt, one end of the air pump is arranged in the discharge cavity, a water cavity is arranged in the compressor cavity, a pipeline groove is arranged at the bottom of the water cavity, the exhaust pipeline is arranged in the pipeline groove, a liquid sensor is arranged on the inner wall of the water cavity, a detection cavity is arranged at the bottom of the water, has the characteristics of high automation degree and two cooling options.

Description

Cooling method for water cavity of hydrogen compressor
Technical Field
The invention relates to the technical field of hydrogen compressor protection, in particular to a method for cooling a water cavity of a hydrogen compressor.
Background
The hydrogen compressor is a compressor which discharges hydrogen collected in the water electrolyzer to the outboard, the hydrogen compressor is widely applied to ship engineering, has the characteristic of wide flow range, can work stably only under the pressure of 1Kg for all types of pumps, obtains the minimum flow at the moment, can obtain different flows after adjusting the air input, is easy to control, can meet the requirements from simple manual control to complete automatic control, is safe to operate, adopts gas drive, has no electric arc and spark, and can be used in dangerous occasions. The temperature of the water cavity in the hydrogen compressor cannot be too high, otherwise, the normal work of the hydrogen compressor can be seriously influenced, some difficulties exist in cooling the water cavity of the hydrogen compressor, whether the water cavity is in a working state or not, the stability needs to be ensured, the internal cooling speed is high directly, but the working state in the water cavity can be influenced when the water cavity works, and therefore a method for cooling the water cavity of the hydrogen compressor is needed at present.
Disclosure of Invention
The invention aims to provide a method for cooling a water cavity of a hydrogen compressor, which aims to solve the problem of single method in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a cooling method for a water cavity of a hydrogen compressor comprises a compressor cavity and a cooling device, wherein the cooling device comprises a generating box and an exhaust pipeline, the generating box is installed at the bottom of the compressor cavity through bolts, a cold air cavity, a conveying cavity and a discharging cavity are arranged in the generating box, a U-shaped communicating groove is formed between the cold air cavity and the conveying cavity, a semiconductor refrigerating plate is installed on the inner wall of the cold air cavity through bolts, an air pump is installed in the conveying cavity through bolts, one end of the air pump is arranged in the discharging cavity, a water cavity is arranged in the compressor cavity, a pipeline groove is formed in the bottom of the water cavity, the exhaust pipeline is installed in the pipeline groove, a liquid sensor is installed on the inner wall of the water cavity, a detection cavity is formed in the bottom of the water cavity, a temperature sensor is installed in the detection cavity, and a cooling cavity, the cooling cavity is arranged on the outer side of the water cavity, the discharge cavity is connected with the exhaust pipeline and the cooling cavity through a first air pipe and a second air pipe respectively, and the first air pipe and the second air pipe are provided with a first electromagnetic valve and a second electromagnetic valve respectively.
Preferably, a control unit and a power supply are arranged in the generation box, the power supply, the temperature sensor and the liquid sensor are respectively connected with the control unit through electric wires, and the control unit is respectively connected with the semiconductor refrigeration plate, the air pump, the first electromagnetic valve and the second electromagnetic valve through electric wires.
Preferably, the control unit comprises a controller and a control switch, the controller comprises a printed circuit board, and a microprocessor and a processing chip which are arranged on the printed circuit board, and the microprocessor and the processing chip are connected through a wire.
Preferably, a control valve head is welded at one end of the exhaust pipeline, and the control valve head is arranged at the bottom of the water cavity.
Preferably, an inner cavity is arranged in the control valve head, and the top and the bottom of the inner wall of the inner cavity are respectively provided with a discharge groove group and an air inlet.
Preferably, a blocking piece is welded to the top of the inner wall of the inner cavity through a spring, and the blocking piece is tightly attached to the inner side of the air inlet.
Preferably, a circulating pipe is arranged between the cooling cavity and the cold air cavity, and an air inlet groove is formed in one side of the cold air cavity.
The method comprises the following steps:
a. cold air generation: after the interior of the device is electrified through the power supply, the temperature sensor can sense the temperature in the water cavity, the semiconductor refrigeration plate and the air pump can be automatically triggered after the temperature is higher than a set temperature, the semiconductor refrigeration plate can generate cold air, and the air pump can deliver the cold air;
b. judging a cooling mode: the liquid sensor can sense whether solution exists in the water cavity, so that whether the compressor cavity is in a use state or not can be judged, the use state can be automatically controlled to select external cooling, and the non-use state can be automatically controlled to select internal cooling.
The invention has the technical effects and advantages that:
1. when the temperature-reducing device is used, the temperature-reducing device has the function of automatically sensing and detecting temperature, can automatically trigger the temperature-reducing device when the temperature is too high, and is high in automation degree and convenient to use.
2. When the intelligent water cavity temperature-reducing device is used, whether the interior of the water cavity is in a working state or not can be automatically judged, and the temperature-reducing mode can be automatically selected, so that the intelligent degree is high.
3. When the air conditioner is used, the air conditioner has a cold air recovery structure, so that the air conditioner has the effect of saving resources, is novel in structure and has a good cooling effect.
Drawings
Fig. 1 is an internal structural view of the structure of the present invention.
Fig. 2 is a cross-sectional view of a control valve head of the present construction.
FIG. 3 is a diagram of electrical connections of the structure of the present invention.
In the figure: 1. a compressor cavity; 2. generating a bin; 3. an exhaust duct; 4. a cold air chamber; 5. a delivery lumen; 6. a discharge chamber; 7. a U-shaped communicating groove; 8. a semiconductor refrigeration plate; 9. an air pump; 10. a water chamber; 11. a liquid sensor; 12. a temperature sensor; 13. a cooling cavity; 14. a first trachea; 15. a second trachea; 16. a first electromagnetic valve; 17. a second electromagnetic valve; 18. a control unit; 19. a power source; 20. a control valve head; 21. a discharge slot group; 22. an air inlet; 23. a spring; 24. a baffle plate; 25. a circulation pipe; 26. an air inlet groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a method for cooling a water cavity of a hydrogen compressor, which is shown in figures 1-3 and comprises the following steps:
example 1
The cooling device comprises a compressor cavity 1 and a cooling device, the cooling device comprises a generating box 2 and an exhaust pipeline 3, the generating box 2 is installed at the bottom of the compressor cavity 1 through bolts, a cold air cavity 4, a conveying cavity 5 and a discharge cavity 6 are arranged in the generating box 2, a U-shaped communicating groove 7 is arranged between the cold air cavity 4 and the conveying cavity 5, a semiconductor refrigerating plate 8 is installed on the inner wall of the cold air cavity 4 through bolts, an air pump 9 is installed in the conveying cavity 5 through bolts, one end of the air pump 9 is arranged in the discharge cavity 6, a water cavity 10 is arranged in the compressor cavity 1, a pipeline groove is arranged at the bottom of the water cavity 10, the exhaust pipeline 3 is installed in the pipeline groove, a liquid sensor 11 is installed on the inner wall of the water cavity 10, a detection cavity is arranged at the bottom of the water cavity 10, a temperature sensor 12 is installed in the detection cavity, the discharge cavity 6 is respectively connected with the exhaust pipeline 3 and the cooling cavity 13 through a first air pipe 14 and a second air pipe 15, the first air pipe 14 and the second air pipe 15 are respectively provided with a first electromagnetic valve 16 and a second electromagnetic valve 17, the generation box 2 is internally provided with a control unit 18 and a power supply 19, the temperature sensor 12 and the liquid sensor 11 are respectively connected with the control unit 18 through wires, the control unit 18 is respectively connected with the semiconductor refrigeration plate 8, the air pump 9, the first electromagnetic valve 16 and the second electromagnetic valve 17 through wires, the control unit 18 comprises a controller and a control switch, the controller comprises a printed circuit main board and a microprocessor and a processing chip which are arranged on the printed circuit main board, the microprocessor and the processing chip are connected through wires, one end of the exhaust pipeline 3 is welded with a control valve head 20, the control valve head 20 is arranged at the bottom of the water cavity 10, an inner cavity is arranged in the control valve head, a baffle 24 is welded on the top of the inner wall of the inner cavity through a spring 23, the baffle 24 is tightly attached to the inner side of the air inlet 22, a circulating pipe 25 is arranged between the cooling cavity 13 and the cold air cavity 4, and an air inlet groove 26 is arranged on one side of the cold air cavity 4.
a. Cold air generation: after the interior of the device is electrified through a power supply 19, the temperature sensor 12 can sense the temperature inside the water cavity 10, the semiconductor refrigeration plate 8 and the air pump 9 can be automatically triggered after the temperature is higher than the set temperature, the semiconductor refrigeration plate 8 can generate cold air, and the air pump 9 can deliver the cold air;
b. judging a cooling mode: the liquid sensor 11 does not sense the presence of the solution in the water chamber 10.
Firstly, a maximum temperature value is set through the control unit 18, then power is supplied to the cooling device through the power supply 19, when the internal temperature of the compressor cavity 1 is higher than the set temperature, the temperature sensor 12 can transmit the sensed temperature information to the control unit 18, so that the control unit 18 can control the starting of the semiconductor refrigeration plate 8 and the air pump 9, the semiconductor refrigeration plate 8 can generate cold air, the air pump 9 can pump the cold air in the cold air cavity 4 into the discharge cavity 6, when the liquid sensor 11 does not sense the solution, the liquid sensor 11 can transmit the sensed information to the control unit 18, so that the control unit 18 can open the electromagnetic valve I16 through control, the cooling in the discharge cavity 6 can enter the control valve head 20 in the exhaust pipeline 3 through the air pipe I14, and the baffle plate 24 can be pushed to extrude the spring 23 to move upwards after the air pressure is increased, so that the cooling can enter the water cavity 10 through the air inlet 22 and, thereby cooling the water chamber 10.
Example 2
The cooling device comprises a compressor cavity 1 and a cooling device, the cooling device comprises a generating box 2 and an exhaust pipeline 3, the generating box 2 is installed at the bottom of the compressor cavity 1 through bolts, a cold air cavity 4, a conveying cavity 5 and a discharge cavity 6 are arranged in the generating box 2, a U-shaped communicating groove 7 is arranged between the cold air cavity 4 and the conveying cavity 5, a semiconductor refrigerating plate 8 is installed on the inner wall of the cold air cavity 4 through bolts, an air pump 9 is installed in the conveying cavity 5 through bolts, one end of the air pump 9 is arranged in the discharge cavity 6, a water cavity 10 is arranged in the compressor cavity 1, a pipeline groove is arranged at the bottom of the water cavity 10, the exhaust pipeline 3 is installed in the pipeline groove, a liquid sensor 11 is installed on the inner wall of the water cavity 10, a detection cavity is arranged at the bottom of the water cavity 10, a temperature sensor 12 is installed in the detection cavity, the discharge cavity 6 is respectively connected with the exhaust pipeline 3 and the cooling cavity 13 through a first air pipe 14 and a second air pipe 15, the first air pipe 14 and the second air pipe 15 are respectively provided with a first electromagnetic valve 16 and a second electromagnetic valve 17, the generation box 2 is internally provided with a control unit 18 and a power supply 19, the temperature sensor 12 and the liquid sensor 11 are respectively connected with the control unit 18 through wires, the control unit 18 is respectively connected with the semiconductor refrigeration plate 8, the air pump 9, the first electromagnetic valve 16 and the second electromagnetic valve 17 through wires, the control unit 18 comprises a controller and a control switch, the controller comprises a printed circuit main board and a microprocessor and a processing chip which are arranged on the printed circuit main board, the microprocessor and the processing chip are connected through wires, one end of the exhaust pipeline 3 is welded with a control valve head 20, the control valve head 20 is arranged at the bottom of the water cavity 10, an inner cavity is arranged in the control valve head, a baffle 24 is welded on the top of the inner wall of the inner cavity through a spring 23, the baffle 24 is tightly attached to the inner side of the air inlet 22, a circulating pipe 25 is arranged between the cooling cavity 13 and the cold air cavity 4, and an air inlet groove 26 is arranged on one side of the cold air cavity 4.
a. Cold air generation: after the interior of the device is electrified through a power supply 19, the temperature sensor 12 can sense the temperature inside the water cavity 10, the semiconductor refrigeration plate 8 and the air pump 9 can be automatically triggered after the temperature is higher than the set temperature, the semiconductor refrigeration plate 8 can generate cold air, and the air pump 9 can deliver the cold air;
b. judging a cooling mode: the liquid sensor 11 senses the presence of a solution in the water chamber 10.
Firstly, a maximum temperature value is set through the control unit 18, then the power supply 19 supplies power for the cooling device, when the internal temperature of the compressor cavity 1 is higher than the set temperature, the temperature sensor 12 can transmit the sensed temperature information to the control unit 18, therefore, the control unit 18 can control the starting of the semiconductor refrigeration plate 8 and the air pump 9, the semiconductor refrigeration plate 8 can generate cold air, the air pump 9 can pump the cold air in the cold air cavity 4 into the discharge cavity 6, when the liquid sensor 11 senses a solution, the liquid sensor 11 can transmit the sensed information to the control unit 18, therefore, the control unit 18 can control the opening of the electromagnetic valve II 17, the cooling in the discharge cavity 6 can enter the cooling cavity 13 through the air pipe II 15, therefore, the internal of the water cavity 10 can be cooled through the outside, the internal work of the water cavity 10 cannot be influenced, and the cold air can flow back into the cold air cavity 4 through the circulating, therefore, the cold air can be recycled.
This practical theory of operation: when the invention is used, firstly, a highest temperature value is set through the control unit 18, then power is supplied to the cooling device through the power supply 19, when the internal temperature of the compressor cavity 1 is higher than the set temperature, the temperature sensor 12 can transmit the sensed temperature information to the control unit 18, therefore, the control unit 18 can control the semiconductor refrigeration plate 8 and the air pump 9 to be started, the semiconductor refrigeration plate 8 can generate cold air, the air pump 9 can pump the cold air in the cold air cavity 4 into the discharge cavity 6, the liquid sensor 11 can sense whether a solution exists in the water cavity 10, therefore, the judgment of an automatic cooling mode can be carried out, when the liquid sensor 11 does not sense the solution, the liquid sensor 11 can transmit the sensed information to the control unit 18, therefore, the control unit 18 can open the electromagnetic valve I16 through control, the cooling in the discharge cavity 6 can enter the control valve head 20 in the exhaust pipeline 3 through the air pipe I, and can promote separation blade 24 extrusion spring 23 upward movement after atmospheric pressure increases, therefore the cooling can pass air inlet 22 and discharge groove group 21 and get into in the water cavity 10, because directly cool down to the inside of water cavity 10, therefore the cooling rate is fast, when liquid sensor 11 senses solution, liquid sensor 11 can transmit the response information for control unit 18, therefore control unit 18 can open solenoid valve two 17 through the control, the cooling in the discharge chamber 6 can get into in cooling chamber 13 through trachea two 15, consequently can cool down to the inside of water cavity 10 through the outside, and can not influence the inside work of water cavity 10, can flow back to in the cold air chamber 4 through circulating pipe 25 when cold air flows, consequently can use cold air cycle.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims (8)

1. The cooling method for the water cavity of the hydrogen compressor comprises a compressor cavity (1) and a cooling device, and is characterized in that: the cooling device comprises a generating box (2) and an exhaust pipeline (3), the generating box (2) is installed at the bottom of a compressor cavity (1) through bolts, a cold air cavity (4), a conveying cavity (5) and a discharging cavity (6) are arranged in the generating box (2), a U-shaped communicating groove (7) is formed between the cold air cavity (4) and the conveying cavity (5), a semiconductor refrigerating plate (8) is installed on the inner wall of the cold air cavity (4) through bolts, an air pump (9) is installed in the conveying cavity (5) through bolts, one end of the air pump (9) is arranged in the discharging cavity (6), a water cavity (10) is arranged in the compressor cavity (1), a pipeline groove is formed in the bottom of the water cavity (10), the exhaust pipeline (3) is installed in the pipeline groove, and a liquid sensor (11) is installed on the inner wall of the water cavity (10), water cavity (10) bottom is provided with detects the chamber, it installs temperature sensor (12) to detect the intracavity, be provided with cooling chamber (13) in compressor cavity (1), cooling chamber (13) set up the water cavity (10) outside, discharge chamber (6) through trachea one (14) and trachea two (15) respectively with exhaust duct (3) with cooling chamber (13) are connected, trachea one (14) with install solenoid valve one (16) and solenoid valve two (17) on trachea two (15) respectively.
2. The method for cooling the water cavity of the hydrogen compressor according to claim 1, wherein: the device is characterized in that a control unit (18) and a power supply (19) are arranged in the production box (2), the power supply (19), the temperature sensor (12) and the liquid sensor (11) are respectively connected with the control unit (18) through electric wires, and the control unit (18) is respectively connected with the semiconductor refrigeration plate (8), the air pump (9), the first electromagnetic valve (16) and the second electromagnetic valve (17) through electric wires.
3. The method for cooling the water cavity of the hydrogen compressor according to claim 2, wherein: the control unit (18) comprises a controller and a control switch, the controller comprises a printed circuit mainboard and a microprocessor and a processing chip which are arranged on the printed circuit mainboard, and the microprocessor and the processing chip are connected through electric wires.
4. The method for cooling the water cavity of the hydrogen compressor according to claim 1, wherein: one end of the exhaust pipeline (3) is welded with a control valve head (20), and the control valve head (20) is arranged at the bottom of the water cavity (10).
5. The method for cooling the water cavity of the hydrogen compressor according to claim 4, wherein: an inner cavity is arranged in the control valve head (20), and the top and the bottom of the inner wall of the inner cavity are respectively provided with a discharge groove group (21) and an air inlet (22).
6. The method for cooling the water cavity of the hydrogen compressor according to claim 5, wherein: a blocking piece (24) is welded to the top of the inner wall of the inner cavity through a spring (23), and the blocking piece (24) is tightly attached to the inner side of the air inlet (22).
7. The method for cooling the water cavity of the hydrogen compressor according to claim 1, wherein: a circulating pipe (25) is arranged between the cooling cavity (13) and the cold air cavity (4), and an air inlet groove (26) is arranged on one side of the cold air cavity (4).
8. The method for cooling the water cavity of the hydrogen compressor according to claim 1, wherein: the method comprises the following steps:
a. cold air generation: after the inside of the device is electrified through the power supply (19), the temperature sensor (12) can sense the temperature inside the water cavity (10), the semiconductor refrigeration plate (8) and the air pump (9) can be automatically triggered after the temperature is higher than a set temperature, the semiconductor refrigeration plate (8) can generate cold air, and the air pump (9) can deliver the cold air;
b. judging a cooling mode: liquid sensor (11) can respond to whether there is solution in water cavity (10), consequently can judge whether compressor cavity (1) is in the user state, and the user state can automatic control select outside cooling, and the user state can automatic control select inside cooling.
CN202010770068.3A 2020-08-04 2020-08-04 Cooling method for water cavity of hydrogen compressor Pending CN111946600A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010770068.3A CN111946600A (en) 2020-08-04 2020-08-04 Cooling method for water cavity of hydrogen compressor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010770068.3A CN111946600A (en) 2020-08-04 2020-08-04 Cooling method for water cavity of hydrogen compressor

Publications (1)

Publication Number Publication Date
CN111946600A true CN111946600A (en) 2020-11-17

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CN202010770068.3A Pending CN111946600A (en) 2020-08-04 2020-08-04 Cooling method for water cavity of hydrogen compressor

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101410624A (en) * 2006-03-24 2009-04-15 西门子公司 Compressor unit
CN207864125U (en) * 2018-02-13 2018-09-14 河北镕达环保科技有限公司 Make-up hydrogen compressor
JP2018189079A (en) * 2017-05-09 2018-11-29 株式会社神戸製鋼所 Compressor
CN210569218U (en) * 2019-10-17 2020-05-19 山东澳信供热有限公司 Air source heat pump hot water unit with full cold recovery
CN210808088U (en) * 2019-11-26 2020-06-19 赵君 Electric power automation equipment heat sink

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101410624A (en) * 2006-03-24 2009-04-15 西门子公司 Compressor unit
JP2018189079A (en) * 2017-05-09 2018-11-29 株式会社神戸製鋼所 Compressor
CN207864125U (en) * 2018-02-13 2018-09-14 河北镕达环保科技有限公司 Make-up hydrogen compressor
CN210569218U (en) * 2019-10-17 2020-05-19 山东澳信供热有限公司 Air source heat pump hot water unit with full cold recovery
CN210808088U (en) * 2019-11-26 2020-06-19 赵君 Electric power automation equipment heat sink

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Application publication date: 20201117