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CN111945082A - Copper-based palladium coating composite bonding material - Google Patents

Copper-based palladium coating composite bonding material Download PDF

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Publication number
CN111945082A
CN111945082A CN202010696825.7A CN202010696825A CN111945082A CN 111945082 A CN111945082 A CN 111945082A CN 202010696825 A CN202010696825 A CN 202010696825A CN 111945082 A CN111945082 A CN 111945082A
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parts
copper
bonding material
palladium
composite bonding
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田鹏
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Shenzhen Kingstar application materials Co.,Ltd.
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Shandong Yingnaixin Electronic Technology Co ltd
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    • C22C47/00Making alloys containing metallic or non-metallic fibres or filaments
    • C22C47/08Making alloys containing metallic or non-metallic fibres or filaments by contacting the fibres or filaments with molten metal, e.g. by infiltrating the fibres or filaments placed in a mould
    • HELECTRICITY
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    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C49/00Alloys containing metallic or non-metallic fibres or filaments
    • C22C49/02Alloys containing metallic or non-metallic fibres or filaments characterised by the matrix material
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C49/00Alloys containing metallic or non-metallic fibres or filaments
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    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139Silver (Ag) as principal constituent
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147Copper (Cu) as principal constituent
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45163Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/45164Palladium (Pd) as principal constituent
    • HELECTRICITY
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
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    • H01L2224/4554Coating
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554Coating
    • H01L2224/45599Material
    • H01L2224/456Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45663Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/45664Palladium (Pd) as principal constituent
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    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

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Abstract

The invention relates to the technical field of composite bonding materials, in particular to a copper-based palladium coating composite bonding material which is prepared from the following raw materials in parts by weight: the material comprises 70-90 parts of copper, 30-40 parts of silver, 10-20 parts of palladium, 5-11 parts of zinc, 9-11 parts of carbon fiber reinforcement, 0.3-1.6 parts of chromium, 0.3-1.6 parts of lithium, 0.2-2 parts of calcium, 0.3-1.6 parts of aluminum and 0.05-0.15 part of yttrium; the whole material is low in component, the component preparation is easy to obtain, and the problems that the traditional bonding lead is high in price, the surface is easy to oxidize, the bonding performance is poor, and the drawing and wire breaking are easy to occur can be effectively solved.

Description

Copper-based palladium coating composite bonding material
Technical Field
The invention relates to the technical field of composite bonding materials, in particular to a copper-based palladium coating composite bonding material.
Background
With the development of society and the continuous progress of science and technology, more and more composite materials appear around people, and the composite material is widely applied to the fields of aerospace, automobile industry, chemical engineering and textile, mechanical manufacturing and the like as a new material which is formed by optimizing and combining material components with different properties by applying an advanced material preparation technology to people, so that the development of modern high technology is promoted. Composite materials are generally classified into two major types, namely, metal and nonmetal, wherein a gold-based alloy is one of metal composite materials, and an alloy composed of gold as a matrix and other metal elements is added thereto. The existing gold-based silver-palladium composite bonding material has insufficient purity due to the problems of materials and processes, and influences the quality of products and the service life.
Chinese patent (No. CN 111041267A) discloses a high-purity gold-based silver-palladium composite bonding material, which is a gold-based silver-palladium composite bonding material manufactured by adopting a formula and a process, but gold is a very expensive metal material, and although the gold has extremely good ductility, the cost is too high, so that the operation cost is reduced, and the effect of ensuring composite bonding is a problem that needs to be improved in the prior art.
Disclosure of Invention
The invention aims to provide a copper-based palladium coating composite bonding material to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
the copper-based palladium coating composite bonding material is prepared from the following raw materials in parts by weight: the material comprises 70-90 parts of copper, 30-40 parts of silver, 10-20 parts of palladium, 5-11 parts of zinc, 9-11 parts of carbon fiber reinforcement, 0.3-1.6 parts of chromium, 0.3-1.6 parts of lithium, 0.2-2 parts of calcium, 0.3-1.6 parts of aluminum and 0.05-0.15 part of yttrium.
The copper-based palladium coating composite bonding material is prepared from the following raw materials in parts by weight: comprises 70 parts of copper, 40 parts of silver, 10 parts of palladium, 5 parts of zinc, 9 parts of carbon fiber reinforcement, 0.3 part of chromium, 0.3 part of lithium, 2 parts of calcium, 1.6 parts of aluminum and 0.15 part of yttrium.
The copper-based palladium coating composite bonding material is prepared from the following raw materials in parts by weight: comprises 90 parts of copper, 30 parts of silver, 20 parts of palladium, 11 parts of zinc, 11 parts of carbon fiber reinforcement, 1.6 parts of chromium, 6 parts of lithium, 0.2 part of calcium, 0.3 part of aluminum and 0.05 part of yttrium.
The copper-based palladium coating composite bonding material is prepared from the following raw materials in parts by weight: comprises 80 portions of copper, 35 portions of silver, 15 portions of palladium, 8 portions of zinc, 10 portions of carbon fiber reinforcement, 0.8 portion of chromium, 3 portions of lithium, 1.5 portions of calcium, 1.2 portions of aluminum and 0.09 portion of yttrium
The application also discloses a preparation method of the copper-based palladium coating composite bonding material, which comprises the following steps:
the method comprises the following steps: weighing the raw materials in proportion;
step two: washing the materials with a sodium hydroxide aqueous solution with the mass concentration of 5-8%, then washing with deionized water, and drying to obtain a pretreated blank;
step three: putting the copper ingot in the pretreated blank into a vacuum casting furnace, heating to 500-600 ℃ at the speed of 40-50 ℃/min, preserving heat for 30min, heating to 1100-1200 ℃ at the speed of 40-50 ℃/min, and preserving heat for 30 min; subsequently, the power supply is turned off, and the alloy melt is cooled to obtain an alloy billet;
putting the alloy billet B into a vacuum down-draw continuous casting furnace, heating to 1100-1200 ℃ at the speed of 50 ℃/min, continuously heating until the alloy billet B is completely melted, refining for 30min, standing and preserving heat for 10-25min to obtain molten metal;
step five, pouring the molten metal into a mold by adopting a directional solidification technical method, then cooling in an air cooling mode, controlling the cooling speed at 20-25 ℃/min, and naturally cooling at room temperature when the temperature of the material is reduced to be below 80 ℃ to obtain a finished product.
As a further scheme of the invention: and step three and step four require to work in a vacuum environment, and high-purity argon is filled after the vacuum degree is higher than 5 multiplied by 10 < -2 > Pa.
As a still further scheme of the invention: and step five, adopting a turning air cooling operation mode when the metal melt is cast and cooled.
Compared with the prior art, the invention has the beneficial effects that:
the copper alloy is used as a base material, the copper is used as a basic metal alloy main body, the silver is used as an auxiliary material, and compared with the gold, the silver has lower price and cost, but can refine crystal grains and effectively improve the wire drawing ductility of the alloy; a small amount of lithium, calcium, aluminum and yttrium are added for configuration, so that the tensile strength and the oxidation resistance of the copper alloy bonding lead can be improved, the mechanical strength of the copper alloy bonding lead is improved, and meanwhile, components such as a carbon fiber reinforcement, calcium and the like are added in an auxiliary manner, so that the wire diameter of the copper alloy bonding lead is reduced, and the bonding performance is improved; and a small amount of chromium is added for improving the integral rigidity, and the palladium material is a plating surface material and can solve the problem that the surface is easy to oxidize.
The whole material is low in component, the component preparation is easy to obtain, and the problems that the traditional bonding lead is high in price, the surface is easy to oxidize, the bonding performance is poor, and the drawing and wire breaking are easy to occur can be effectively solved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Detailed Description
It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
the copper-based palladium coating composite bonding material is prepared from the following raw materials in parts by weight: comprises 70 parts of copper, 40 parts of silver, 10 parts of palladium, 5 parts of zinc, 9 parts of carbon fiber reinforcement, 0.3 part of chromium, 0.3 part of lithium, 2 parts of calcium, 1.6 parts of aluminum and 0.15 part of yttrium.
The preparation method of the copper-based palladium coating composite bonding material comprises the following steps:
the method comprises the following steps: weighing the raw materials in proportion;
step two: washing the materials with a sodium hydroxide aqueous solution with the mass concentration of 5-8%, then washing with deionized water, and drying to obtain a pretreated blank;
step three: putting the copper ingot in the pretreated blank into a vacuum casting furnace, filling high-purity argon after the vacuum degree is higher than 5 multiplied by 10 < -2 > Pa, heating to 500-600 ℃ at the speed of 40-50 ℃/min, preserving heat for 30min, heating to 1100-1200 ℃ at the speed of 40-50 ℃/min, and preserving heat for 30 min; subsequently, the power supply is turned off, and the alloy melt is cooled to obtain an alloy billet;
putting the alloy billet B into a vacuum down-draw continuous casting furnace, filling high-purity argon after the vacuum degree is higher than 5 x 10 < -2 > Pa, heating to 1100-1200 ℃ at the speed of 50 ℃/min, continuously heating until the alloy billet is completely molten, refining for 30min, and standing and preserving the temperature for 10-25min to obtain molten metal;
pouring the molten metal into a mold by adopting a directional solidification technical method, and then cooling the molten metal in an air cooling mode, wherein a turning air cooling operation mode can be adopted during casting and cooling of the molten metal, so that air convection is increased, and the air cooling speed is increased. The cooling speed is controlled at 20-25 deg.C/min, the material temperature can be controlled in real time, and when the material temperature is reduced to below 80 deg.C, the material is naturally cooled at room temperature to obtain the final product.
Example two:
the copper-based palladium coating composite bonding material is prepared from the following raw materials in parts by weight: comprises 70 parts of copper, 40 parts of silver, 10 parts of palladium, 5 parts of zinc, 9 parts of carbon fiber reinforcement, 0.3 part of chromium, 0.3 part of lithium, 2 parts of calcium, 1.6 parts of aluminum and 0.15 part of yttrium.
The preparation method of the copper-based palladium coating composite bonding material comprises the following steps:
the method comprises the following steps: weighing the raw materials in proportion;
step two: washing the materials with a sodium hydroxide aqueous solution with the mass concentration of 5-8%, then washing with deionized water, and drying to obtain a pretreated blank;
step three: putting the copper ingot in the pretreated blank into a vacuum casting furnace, filling high-purity argon after the vacuum degree is higher than 5 multiplied by 10 < -2 > Pa, heating to 500-600 ℃ at the speed of 40-50 ℃/min, preserving heat for 30min, heating to 1100-1200 ℃ at the speed of 40-50 ℃/min, and preserving heat for 30 min; subsequently, the power supply is turned off, and the alloy melt is cooled to obtain an alloy billet;
putting the alloy billet B into a vacuum down-draw continuous casting furnace, filling high-purity argon after the vacuum degree is higher than 5 x 10 < -2 > Pa, heating to 1100-1200 ℃ at the speed of 50 ℃/min, continuously heating until the alloy billet is completely molten, refining for 30min, and standing and preserving the temperature for 10-25min to obtain molten metal;
pouring the molten metal into a mold by adopting a directional solidification technical method, and then cooling the molten metal in an air cooling mode, wherein a turning air cooling operation mode can be adopted during casting and cooling of the molten metal, so that air convection is increased, and the air cooling speed is increased. The cooling speed is controlled at 20-25 deg.C/min, the material temperature can be controlled in real time, and when the material temperature is reduced to below 80 deg.C, the material is naturally cooled at room temperature to obtain the final product.
Example three:
the copper-based palladium coating composite bonding material is prepared from the following raw materials in parts by weight: the material comprises 80 parts of copper, 35 parts of silver, 15 parts of palladium, 8 parts of zinc, 10 parts of carbon fiber reinforcement, 0.8 part of chromium, 3 parts of lithium, 1.5 parts of calcium, 1.2 parts of aluminum and 0.09 part of yttrium.
The preparation method of the copper-based palladium coating composite bonding material comprises the following steps:
the method comprises the following steps: weighing the raw materials in proportion;
step two: washing the materials with a sodium hydroxide aqueous solution with the mass concentration of 5-8%, then washing with deionized water, and drying to obtain a pretreated blank;
step three: putting the copper ingot in the pretreated blank into a vacuum casting furnace, filling high-purity argon after the vacuum degree is higher than 5 multiplied by 10 < -2 > Pa, heating to 500-600 ℃ at the speed of 40-50 ℃/min, preserving heat for 30min, heating to 1100-1200 ℃ at the speed of 40-50 ℃/min, and preserving heat for 30 min; subsequently, the power supply is turned off, and the alloy melt is cooled to obtain an alloy billet;
putting the alloy billet B into a vacuum down-draw continuous casting furnace, filling high-purity argon after the vacuum degree is higher than 5 x 10 < -2 > Pa, heating to 1100-1200 ℃ at the speed of 50 ℃/min, continuously heating until the alloy billet is completely molten, refining for 30min, and standing and preserving the temperature for 10-25min to obtain molten metal;
pouring the molten metal into a mold by adopting a directional solidification technical method, and then cooling the molten metal in an air cooling mode, wherein a turning air cooling operation mode can be adopted during casting and cooling of the molten metal, so that air convection is increased, and the air cooling speed is increased. The cooling speed is controlled at 20-25 deg.C/min, the material temperature can be controlled in real time, and when the material temperature is reduced to below 80 deg.C, the material is naturally cooled at room temperature to obtain the final product.
Comparative example one, the existing high-purity gold-based silver-palladium composite bonding material a is composed of the following raw materials in parts by weight: 70-90 parts of gold, 60-80 parts of silver, 10-20 parts of palladium, 3-8 parts of copper, 1-2 parts of zinc, 0.3-1.6 parts of chromium and 0.5-1.4 parts of ruthenium.
In a second comparative example, the existing high-purity gold-based silver-palladium composite bonding material B is composed of the following raw materials in parts by weight: 60-90 parts of gold, 5-15 parts of silver, 1-5 parts of palladium, 3-12 parts of platinum, 5-10 parts of zinc, 1-5 parts of tin, 2-8 parts of niobium, 6-13 parts of nickel, 3-9 parts of tantalum and 2-6 parts of cerium.
The third comparative example shows that the existing high-purity copper-silver-palladium multiple composite bonding material C is composed of the following raw materials in parts by weight: 13-17 parts of palladium, 15-25 parts of copper, 12-14 parts of silicon powder, 13-17 parts of steel fiber, 2-3 parts of cobalt, 2-3 parts of silver and 3-5 parts of mixed rare earth.
According to the invention, a palladium material with the purity of palladium not lower than 99.999% is used as a plating surface material, and the practicability of the copper-based palladium coating composite bonding material is verified.
Figure 899971DEST_PATH_IMAGE002
The working principle of the invention is as follows: the copper alloy is used as a base material, the copper is used as a basic metal alloy main body, the silver is used as an auxiliary material, and compared with the gold, the silver has lower price and cost, but can refine crystal grains and effectively improve the wire drawing ductility of the alloy; a small amount of lithium, calcium, aluminum and yttrium are added for configuration, so that the tensile strength and the oxidation resistance of the copper alloy bonding lead can be improved, the mechanical strength of the copper alloy bonding lead is improved, and meanwhile, components such as a carbon fiber reinforcement, calcium and the like are added in an auxiliary manner, so that the wire diameter of the copper alloy bonding lead is reduced, and the bonding performance is improved; and a small amount of chromium is added for improving the integral rigidity, and the palladium material is a plating surface material and can solve the problem that the surface is easy to oxidize.
The whole material is low in component, the component preparation is easy to obtain, and the problems that the traditional bonding lead is high in price, the surface is easy to oxidize, the bonding performance is poor, and the drawing and wire breaking are easy to occur can be effectively solved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (7)

1. The copper-based palladium coating composite bonding material is characterized by comprising the following raw materials in parts by weight: the material comprises 70-90 parts of copper, 30-40 parts of silver, 10-20 parts of palladium, 5-11 parts of zinc, 9-11 parts of carbon fiber reinforcement, 0.3-1.6 parts of chromium, 0.3-1.6 parts of lithium, 0.2-2 parts of calcium, 0.3-1.6 parts of aluminum and 0.05-0.15 part of yttrium.
2. The copper-based palladium coating composite bonding material as claimed in claim 1, which is characterized by comprising the following raw materials in parts by weight: comprises 70 parts of copper, 40 parts of silver, 10 parts of palladium, 5 parts of zinc, 9 parts of carbon fiber reinforcement, 0.3 part of chromium, 0.3 part of lithium, 2 parts of calcium, 1.6 parts of aluminum and 0.15 part of yttrium.
3. The copper-based palladium coating composite bonding material as claimed in claim 1, which is characterized by comprising the following raw materials in parts by weight: comprises 90 parts of copper, 30 parts of silver, 20 parts of palladium, 11 parts of zinc, 11 parts of carbon fiber reinforcement, 1.6 parts of chromium, 6 parts of lithium, 0.2 part of calcium, 0.3 part of aluminum and 0.05 part of yttrium.
4. The copper-based palladium coating composite bonding material as claimed in claim 1, which is characterized by comprising the following raw materials in parts by weight: the material comprises 80 parts of copper, 35 parts of silver, 15 parts of palladium, 8 parts of zinc, 10 parts of carbon fiber reinforcement, 0.8 part of chromium, 3 parts of lithium, 1.5 parts of calcium, 1.2 parts of aluminum and 0.09 part of yttrium.
5. The method for preparing the copper-based palladium-coated composite bonding material according to any one of claims 1 to 4, comprising the steps of:
the method comprises the following steps: weighing the raw materials in proportion;
step two: washing the materials with a sodium hydroxide aqueous solution with the mass concentration of 5-8%, then washing with deionized water, and drying to obtain a pretreated blank;
step three: putting the copper ingot in the pretreated blank into a vacuum casting furnace, heating to 500-600 ℃ at the speed of 40-50 ℃/min, preserving heat for 30min, heating to 1100-1200 ℃ at the speed of 40-50 ℃/min, and preserving heat for 30 min; subsequently, the power supply is turned off, and the alloy melt is cooled to obtain an alloy billet;
putting the alloy billet B into a vacuum down-draw continuous casting furnace, heating to 1100-1200 ℃ at the speed of 50 ℃/min, continuously heating until the alloy billet B is completely melted, refining for 30min, standing and preserving heat for 10-25min to obtain molten metal;
step five, pouring the molten metal into a mold by adopting a directional solidification technical method, then cooling in an air cooling mode, controlling the cooling speed at 20-25 ℃/min, and naturally cooling at room temperature when the temperature of the material is reduced to be below 80 ℃ to obtain a finished product.
6. The method for preparing the copper-based palladium coating composite bonding material according to claim 5, wherein the third step and the fourth step are both required to be operated in a vacuum environment, and the vacuum degree is higher than 5 x 10-2And after Pa, filling high-purity argon.
7. The preparation method of the copper-based palladium coating composite bonding material according to claim 5, wherein a turning air cooling operation mode is adopted when the molten metal in the step five is cast and cooled.
CN202010696825.7A 2020-07-20 2020-07-20 Copper-based palladium coating composite bonding material Withdrawn CN111945082A (en)

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