CN111874995A - Vacuum system and method for realizing film evaporation wastewater treatment - Google Patents
Vacuum system and method for realizing film evaporation wastewater treatment Download PDFInfo
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- CN111874995A CN111874995A CN202010650761.7A CN202010650761A CN111874995A CN 111874995 A CN111874995 A CN 111874995A CN 202010650761 A CN202010650761 A CN 202010650761A CN 111874995 A CN111874995 A CN 111874995A
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- 238000001704 evaporation Methods 0.000 title claims abstract description 60
- 230000008020 evaporation Effects 0.000 title claims abstract description 60
- 238000004065 wastewater treatment Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 33
- 239000010409 thin film Substances 0.000 claims description 83
- 239000002351 wastewater Substances 0.000 claims description 79
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 74
- 230000001105 regulatory effect Effects 0.000 claims description 20
- 238000000605 extraction Methods 0.000 claims description 19
- 239000000498 cooling water Substances 0.000 claims description 17
- 238000009833 condensation Methods 0.000 claims description 11
- 230000005494 condensation Effects 0.000 claims description 11
- 238000000926 separation method Methods 0.000 claims description 10
- 239000010408 film Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- 230000007613 environmental effect Effects 0.000 description 7
- 239000012528 membrane Substances 0.000 description 7
- 230000001276 controlling effect Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000809 air pollutant Substances 0.000 description 1
- 231100001243 air pollutant Toxicity 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000006477 desulfuration reaction Methods 0.000 description 1
- 230000023556 desulfurization Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005374 membrane filtration Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/44—Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis
- C02F1/447—Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis by membrane distillation
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/18—Nature of the water, waste water, sewage or sludge to be treated from the purification of gaseous effluents
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2301/00—General aspects of water treatment
- C02F2301/06—Pressure conditions
- C02F2301/063—Underpressure, vacuum
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2301/00—General aspects of water treatment
- C02F2301/08—Multistage treatments, e.g. repetition of the same process step under different conditions
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Abstract
The invention discloses a vacuum system for realizing film evaporation wastewater treatment and a vacuum method for realizing film evaporation wastewater treatment. The vacuum system can form a vacuum space without arranging rotating equipment, does not need to consume high-quality electric energy, and has high running reliability.
Description
Technical Field
The invention relates to the technical field of environmental protection, in particular to a vacuum system for realizing film evaporation wastewater treatment and a vacuum method for realizing film evaporation wastewater treatment.
Background
Along with the improvement of environmental protection standards, the emission control of dust, NOx and SO2 in thermal power plants is increasingly strict, more and more power plants need to be subjected to ultralow emission modification or environmental protection facility upgrading, the air pollutants are strictly controlled, and great achievement is achieved.
In the related art, the main technologies of desulfurization wastewater treatment include wastewater pretreatment, evaporative concentration, flue evaporation, membrane concentration, evaporative crystallization, wastewater pretreatment, evaporative concentration, crystallization and the like. Because of the evaporation process, a large amount of high-grade heat energy needs to be consumed, and the evaporation process can cause the problems of serious scaling and the like inside heat exchange equipment, and because a process system for treating wastewater is complex and the equipment investment cost is high, the wastewater treatment cost is high, and the wide popularization and application are difficult.
Therefore, a thin film evaporation technology is provided in the related art, the technology is a wastewater treatment technology integrating the membrane filtration and the thermal evaporation process, the problems of scaling, blockage and the like in the wastewater treatment process can be avoided, the concentration ratio of the wastewater can be improved, and the residual quantity of the high-concentration wastewater is small.
In order to ensure the normal operation of the film evaporation process, the negative pressure side of the film is required to maintain a constant vacuum degree, the higher the vacuum degree is, the more beneficial the separation efficiency is, therefore, a constant cold source is required, for example, a cold source between 15 ℃ and 25 ℃, however, the natural environment temperature changes with seasons, and the constant cold source is difficult to obtain. For this reason, the related art is usually configured with a set of independent refrigeration system to provide a cold source for the vacuum system for implementing the membrane evaporation wastewater treatment, but this method needs to consume additional high-quality electric energy and is configured with a large piping system, which is not beneficial to system operation and maintenance. The vacuum pump is adopted for pumping to form vacuum, and the working fluid of the vacuum pump is cooled by cooling water in the related technology, but the mode is limited by the ambient temperature, the temperature of the working fluid influences the lowest vacuum value, and particularly the normal operation requirement can not be met in summer, and the vacuum can be changed. In addition, the steam corrosion phenomenon can occur due to the gasification of water and other reasons in the operation process of the vacuum pump, so that the impeller is subjected to fatigue damage, the service life is shortened, the operation reliability of the system is reduced, and the power consumption is high.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, the embodiment of the invention provides a vacuum system for realizing film evaporation wastewater treatment, which does not need to consume high-quality electric energy, has small influence of the vacuum degree on the environment temperature and has high system operation reliability.
The embodiment of the invention also provides a vacuum method for realizing the thin film evaporation wastewater treatment.
The vacuum system for realizing thin film evaporation wastewater treatment according to the embodiment of the first aspect of the invention comprises: a thin film evaporator having a waste water inlet and a steam outlet; the waste water supply device is connected with the waste water inlet of the thin film evaporator and is used for supplying waste water to the thin film evaporator; a heater provided between the thin film evaporator and the wastewater supply device for heating wastewater supplied from the wastewater supply device to the thin film evaporator; the condenser is provided with a steam inlet, a first steam extraction outlet and a condensate water outlet, and the steam inlet is connected with the steam outlet of the thin film evaporator; the first-stage steam ejector is provided with a first driving steam inlet, a first ejection steam inlet and a first mixed steam outlet, and the first ejection steam inlet is connected with a first steam extraction outlet of the condenser; the first-stage condenser is provided with a first mixed steam inlet and a first condensate water outlet, and the first mixed steam inlet is connected with a first mixed steam outlet of the first-stage steam ejector.
According to the vacuum system for realizing thin film evaporation wastewater treatment provided by the embodiment of the invention, the first-stage steam ejector with the first driving steam inlet is arranged, low-pressure driving steam is input towards the first-stage steam ejector by utilizing the first driving steam inlet, so that a vacuum space is formed in the first-stage steam ejector, the extraction of steam which is not condensed in the condenser is realized by utilizing the pressure difference between the first-stage steam ejector and the condenser, the vacuum space can be formed without arranging rotating equipment (such as a vacuum pump), high-quality electric energy is not consumed, the influence of the environmental temperature on the vacuum space formed by the steam is small, and the operation reliability of the system is high.
In some embodiments, realize vacuum system of film evaporation waste water treatment still includes second level steam ejector and second level condenser, first level condenser still has second steam extraction mouth, the second level condenser has second mixed steam inlet and second comdenstion water discharge port, second level steam ejector has second drive steam inlet, second and draws and penetrate steam inlet and second mixed steam outlet, the second draw penetrate steam inlet with the second steam extraction mouth of first level condenser links to each other, the second mixed steam outlet with the second mixed steam inlet of second level condenser links to each other.
In some embodiments, the vacuum system for realizing membrane evaporation wastewater treatment further comprises a steam-water separator, and the first condensate water outlet and the second condensate water outlet are connected with the steam-water separator.
In some embodiments, the vacuum system for realizing thin film evaporation wastewater treatment further includes a driving steam supply line, the driving steam supply line is connected to the first driving steam inlet and the second driving steam inlet, and a steam main valve is arranged on the driving steam supply line, and is used for adjusting a first-stage driving steam regulating valve for regulating the driving steam supplied to the first-stage steam ejector and a second-stage driving steam regulating valve for regulating the driving steam supplied to the second-stage steam ejector.
In some embodiments, the cooling water pipelines of the condenser, the first-stage condenser and the second-stage condenser are connected in series, and the cooling water pipeline firstly enters the condenser, then enters the first-stage condenser after exiting from the condenser, then enters the second-stage condenser after exiting from the first-stage condenser, and finally extends out of the second-stage condenser.
In some embodiments, the vacuum system for realizing membrane evaporation wastewater treatment further comprises a condensed water tank connected with a condensed water outlet of the condenser and a booster pump arranged between the wastewater water supply device and the heater.
In some embodiments, the thin film evaporator further has a concentrated wastewater outlet connected to the wastewater supply.
The vacuum method for realizing the thin film evaporation wastewater treatment according to the embodiment of the second aspect of the invention comprises the following steps: heating the waste water and then supplying the heated waste water into a thin film evaporator for evaporation and separation; introducing steam in the thin film evaporator into a condenser for condensation; supplying driving steam into the first-stage steam ejector so as to introduce the ejection steam in the condenser into the first-stage steam ejector; and introducing mixed steam formed in the first-stage steam ejector into a first-stage condenser for condensation.
According to the vacuum method for realizing the thin film evaporation wastewater treatment, the driving steam can be utilized to form a vacuum space in the first-stage steam ejector, so that the ejector steam in the condenser can be extracted by utilizing the pressure difference between the first-stage steam ejector and the condenser, the vacuum space formed by the vacuum method for realizing the thin film evaporation wastewater treatment is stable, is slightly influenced by the environmental temperature, is simple in control process, does not relate to rotating equipment, and does not need to consume high-quality electric energy.
In some embodiments, the vacuum method of performing thin film evaporation wastewater treatment further comprises: supplying driving steam into a second-stage steam ejector so as to introduce the ejection steam in the first-stage condenser into the second-stage steam ejector; and introducing mixed steam formed in the second-stage steam ejector into a second-stage condenser for condensation.
In some embodiments, the vacuum method of performing thin film evaporation wastewater treatment further comprises: passing cooling water through the condenser, the first stage condenser and the second stage condenser in sequence; introducing the condensed water in the first-stage condenser and the second-stage condenser into a steam-water separator for steam-water separation; the concentrated waste water in the thin film evaporator is led out of the thin film evaporator and heated and then supplied into the thin film evaporator.
Drawings
FIG. 1 is a schematic diagram of a vacuum system for performing membrane evaporation wastewater treatment according to an embodiment of the present invention.
Reference numerals:
a vacuum system 100 for realizing the thin film evaporation wastewater treatment;
a thin film evaporator 10; a wastewater inlet 101; a steam outlet 102; a concentrated wastewater outlet 103;
a wastewater supply 20;
a heater 30;
a condenser 40; a steam inlet 401; a first vapor draw-off port 402; a condensed water outlet 403;
a first stage steam eductor 50; a first drive steam inlet 501; a first ejector steam inlet 502; a first mixed vapor outlet 503;
a first stage condenser 60; a first mixed steam inlet 601; a first condensate drain 602; a second steam extraction port 603;
a second stage steam eductor 70; a second drive steam inlet 701; a second ejector steam inlet 702; a second mixed steam outlet 703;
a second stage condenser 80; a second mixed steam inlet 801; a second condensate drain 802;
a steam-water separator 90; a steam main valve 901; the first stage drives the steam adjustment valve 902; a second stage drive steam control valve 903; a booster pump 904; a condensation water tank 905; a cooling water line 906; a condensate pump 907.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
As shown in fig. 1, a vacuum system 100 for realizing thin film evaporation wastewater treatment according to an embodiment of the present invention includes a thin film evaporator 10, a wastewater supply device 20, a heater 30, a condenser 40, a first-stage steam ejector 50, and a first-stage condenser 60.
The thin film evaporator 10 has a waste water inlet 101 and a steam outlet 102, and a waste water supply device 20 is connected to the waste water inlet 101 of the thin film evaporator 10 for supplying waste water to the thin film evaporator 10. As shown in figure 1, the waste water after being boosted by the waste water supply device 20 enters the thin film evaporator 10 from the waste water inlet 101, the thin film evaporator 10 carries out low-temperature evaporation and separation on the waste water, a part of clean water in the waste water is subjected to flash evaporation, and steam formed by the flash evaporation penetrates through the thin film and flows out from the steam outlet 102.
The heater 30 is provided between the thin film evaporator 10 and the wastewater supply device 20, and heats the wastewater supplied from the wastewater supply device 20 to the thin film evaporator 10. It is understood that a part of energy is lost when the wastewater is subjected to the evaporation separation by the thin film evaporator 10, and the heating of the heater 30 can provide energy for the evaporation separation of the wastewater, thereby ensuring energy balance and constant temperature in the whole vacuum system for realizing the treatment of the wastewater by the thin film evaporation.
The condenser 40 has a steam inlet 401, a first steam withdrawal outlet 402 and a condensate outlet 403, the steam inlet 401 being connected to the steam outlet 102 of the thin film evaporator 10. As shown in fig. 1, the steam flowing out of the steam outlet 102 of the thin film evaporator 10 enters the condenser 40 through the steam inlet 401, and part of the steam is condensed into condensed water in the condenser 40 and flows out of the condensed water outlet 403.
The first-stage steam ejector 50 is provided with a first driving steam inlet 501, a first ejection steam inlet 502 and a first mixed steam outlet 503, and the first ejection steam inlet 502 is connected with the first steam extraction outlet 402 of the condenser 40. Specifically, as shown in fig. 1, the first driving steam inlet 501 is used for introducing low-pressure driving steam into the first-stage steam ejector 50, the low-pressure driving steam can form a vacuum space in the first-stage steam ejector 50, so that steam which is not condensed in the condenser 40 is sucked into the first-stage steam ejector 50 by using the pressure difference between the first-stage steam ejector 50 and the condenser 40, and the mixed steam flows out through the first mixed steam outlet 503.
The first-stage condenser 60 has a first mixed steam inlet 601 and a first condensate drain 602, and the first mixed steam inlet 601 is connected to the first mixed steam outlet 503 of the first-stage steam ejector 50. Specifically, as shown in fig. 1, the mixed steam flowing out of the first mixed steam outlet 503 flows into the first-stage condenser 60 through the first mixed steam inlet 601, a part of the mixed steam is condensed into condensed water in the first-stage condenser 60, and the condensed water flows out of the first condensed water outlet 602.
According to the vacuum system for realizing thin film evaporation wastewater treatment provided by the embodiment of the invention, the first-stage steam ejector with the first driving steam inlet is arranged, low-pressure driving steam is input towards the first-stage steam ejector by utilizing the first driving steam inlet, so that a vacuum space is formed in the first-stage steam ejector, the extraction of steam which is not condensed in the condenser is realized by utilizing the pressure difference between the first-stage steam ejector and the condenser, the vacuum space can be formed without arranging rotating equipment (such as a vacuum pump), high-quality electric energy is not consumed, the influence of the environmental temperature on the vacuum space formed by the steam is small, and the operation reliability of the system is high.
In some embodiments, as shown in fig. 1, the vacuum system 100 for implementing thin film evaporation wastewater treatment further includes a second-stage steam ejector 70 and a second-stage condenser 80, the first-stage condenser 60 further has a second steam extraction outlet 603, the second-stage condenser 80 has a second mixed steam inlet 801 and a second condensed water discharge port 802, the second-stage steam ejector 70 has a second driving steam inlet 701, a second ejector steam inlet 702 and a second mixed steam outlet 703, the second ejector steam inlet 702 is connected to the second steam extraction outlet 603 of the first-stage condenser 60, and the second mixed steam outlet 703 is connected to the second mixed steam inlet 801 of the second-stage condenser 80.
Specifically, the second driving steam inlet 701 may input low-pressure driving steam to the second-stage steam ejector 70, so that the second-stage steam ejector 70 forms a low-pressure space, the pressure difference between the second-stage steam ejector 70 and the first-stage condenser 60 is utilized, the non-condensed mixed steam in the first-stage condenser 60 is sucked into the second-stage steam ejector 70 through the second steam suction port 603 and the second ejection steam inlet 702, the mixed steam flows into the second-stage condenser 80 through the second mixed steam outlet 703 and the second mixed steam inlet 801, the mixed steam is condensed into condensed water in the second-stage condenser 80 and flows out from the second condensed water outlet 802, and the non-condensed steam in the second-stage condenser 80 is discharged from the second condensed water outlet 802. Therefore, through multistage condensation, the wastewater utilization rate can be improved, and zero discharge of wastewater is realized.
In some embodiments, as shown in FIG. 1, vacuum system 100 for membrane evaporative wastewater treatment further includes a steam separator 90, and a first condensate drain 602 and a second condensate drain 802 are coupled to steam separator 90. Thus, the condensate discharged from the first condensate discharge port 602 and the condensate and steam discharged from the second condensate discharge port 802 can be mixed and stored in the steam separator 90, and the steam can be separated and discharged by the steam separator.
In some embodiments, as shown in fig. 1, the vacuum system 100 for thin film evaporation wastewater treatment further includes a driving steam supply line connected to the first driving steam inlet 501 and the second driving steam inlet 701, so that driving steam can be input to the first-stage steam ejector 50 through the first driving steam inlet 501 and driving steam can be input to the second-stage steam ejector 70 through the second driving steam inlet 701.
The drive steam supply line is provided with a steam header valve 901, a first-stage drive steam regulating valve 902 for regulating the drive steam supplied to the first-stage steam ejector 50, and a second-stage drive steam regulating valve 903 for regulating the drive steam supplied to the second-stage steam ejector 70.
Specifically, the driving steam supply line has a main line, a first branch line and a second branch line, one end of each of the first branch line and the second branch line is connected to the main line, the other end of the first branch line is connected to the first driving steam inlet 501, and the other end of the second branch line is connected to the second driving steam inlet 701. The main steam valve 901 is provided on the main line, the first stage driving steam regulating valve 902 is provided on the first branch line, and the second stage driving steam regulating valve 903 is provided on the second branch line.
The steam main valve 901 is suitable for controlling the flow of driving steam in the main pipeline, and the first-stage driving steam regulating valve 902 is suitable for controlling the flow of the driving steam in the first branch pipeline, so that the filling amount of the driving steam in the first-stage steam ejector 50 is controlled, the vacuum degree in the first-stage steam ejector is controlled, and the requirement of pressure difference between the first-stage steam ejector and the condenser is met.
The second stage drive steam control valve 903 is adapted to control the flow of drive steam in the second branch, thereby controlling the fill volume of drive steam in the second stage steam ejector 70, controlling the vacuum degree in the second stage steam ejector, and meeting the requirement of pressure difference between the second stage steam ejector and the first stage condenser.
In some embodiments, as shown in fig. 1, the condenser 40, the first stage condenser 60, and the cooling water line 906 of the second stage condenser 80 are connected in series, and the cooling water line 906 first enters the condenser 40, exits the condenser 40 and enters the first stage condenser 60, then exits the first stage condenser 60 and enters the second stage condenser 80, and finally extends from the second stage condenser 80.
As shown in fig. 1, the steam discharged from the thin film evaporator 10 flows through the condenser 40, the first-stage condenser 60, and the second-stage condenser 80 in this order, and the flow rates of the steam flowing into the condenser 40, the first-stage condenser 60, and the second-stage condenser 80 are reduced in this order, and accordingly, the demands of the condenser 40, the first-stage condenser 60, and the second-stage condenser 80 on the heat exchange capacity of the cooling water are reduced in this order. Therefore, the cooling water amount of the whole process flow is saved, and the cascade utilization idea of the low-temperature cold source is embodied.
In some embodiments, as shown in fig. 1, the vacuum system 100 for performing thin film evaporation wastewater treatment further includes a condensate tank 905 connected to the condensate outlet 403 of the condenser 40 and a booster pump 904 provided between the wastewater supply device 20 and the heater 30. The condensate tank 905 is configured to receive condensate discharged from the condenser 40, and the booster pump 904 may boost pressure of wastewater discharged from the wastewater supply device 20 so that the wastewater is discharged into the condenser 40.
In some embodiments, as shown in figure 1, the thin film evaporator 10 also has a concentrated waste water outlet 103 connected to the waste water supply 20. It can be understood that part of the clean water is flashed in the thin film evaporator 10 to form steam, the temperature of the concentrated wastewater is reduced due to partial evaporation, and the part of the concentrated wastewater flows back to the wastewater supply device 20 through the concentrated wastewater outlet 103 for subsequent recycling treatment.
A vacuum system 100 for performing thin film evaporation wastewater treatment according to one specific example of the present invention is described below with reference to fig. 1.
As shown in fig. 1, the vacuum system 100 for realizing the thin film evaporation wastewater treatment includes a wastewater supply device 20, a booster pump 904, a heater 30, a thin film evaporator 10, a condenser 40, a first-stage steam ejector 50, a first-stage condenser 60, a second-stage steam ejector 70, a second-stage condenser 80, a condensate pump 907, a condensate tank 905, a steam-water separator 9090, a steam main valve 901, a first-stage driving steam regulating valve 902, a second-stage driving steam regulating valve 903 and a cooling water pipeline 906.
The thin film evaporator 10 is provided with a waste water inlet 101, a steam outlet 102 and a concentrated waste water outlet 103, the waste water inlet 101 and the concentrated waste water outlet 103 are connected with a waste water supply device 20, a heater 30 and a booster pump 904 are connected between the waste water supply device 20 and the waste water inlet 101, the condenser 40 is provided with a steam inlet 401, a first steam extraction outlet 402 and a condensed water outlet 403, the steam inlet 401 is connected with the steam outlet 102 of the thin film evaporator 10, and the condensed water outlet 403 is connected with a condensed water tank 905.
Specifically, a part of clean water of the wastewater is flashed in the thin film evaporator 10 to form steam, the steam enters the condenser 40 through the steam outlet 102 and the steam inlet 401 of the condenser 40, a part of the steam is condensed in the condenser 40 to form condensed water, the condensed water flows into the condensed water tank 905 through the condensed water outlet 403, and the condensed wastewater flows back to the wastewater supply device 20 through the condensed wastewater outlet 103.
The first-stage steam ejector 50 is provided with a first driving steam inlet 501, a first ejection steam inlet 502 and a first mixed steam outlet 503, the first ejection steam inlet 502 is connected with the first steam extraction outlet 402 of the condenser 40, the first driving steam inlet 501 is suitable for conveying low-pressure driving steam into the first-stage steam ejector 50 to form a vacuum space, steam which is not condensed in the condenser 40 is extracted, and a first-stage driving steam regulating valve 902 is connected to a first branch communicated with the first driving steam inlet 501 and used for regulating the flow of the driving steam in the first branch.
The first-stage condenser 60 has a first mixed steam inlet 601, a first condensed water discharge port 602, and a second steam extraction port 603, the first mixed steam inlet 601 is connected to the first mixed steam outlet 503 of the first-stage steam ejector 50, and the first condensed water discharge port 602 is connected to the steam-water separator 90. Mixed steam formed by the steam extracted by the first-stage steam ejector 50 and the driving steam enters the first-stage condenser 60 through the first mixed steam outlet 503 and the first mixed steam inlet 601, a part of the mixed steam is condensed into condensed water in the first-stage condenser 60 and is discharged into the steam-water separator 90 through the first condensed water discharge port 602, and the condensed water pump 907 is connected between the first condensed water discharge port 602 and the steam-water separator 90 to boost the pressure of the condensed water discharged from the first condensed water discharge port 602.
The second-stage steam ejector 70 is provided with a second driving steam inlet 701, a second ejection steam inlet 702 and a second mixed steam outlet 703, the second ejection steam inlet 702 is connected with the second steam extraction outlet 603, the second driving steam inlet 701 is used for inputting low-pressure driving steam to the second-stage steam ejector 70 to form a vacuum space, a second-stage driving steam regulating valve 903 is arranged on a second branch communicated with the second driving steam inlet 701, and the second-stage steam ejector 70 pumps the mixed steam which is not condensed in the first-stage condenser 60 into the second-stage steam ejector 70 through the second steam extraction outlet 603 and the second ejection steam inlet 702.
The first branch and the first branch are both connected to the main pipeline, and the main pipeline is provided with a main steam valve 901 for controlling the flow of driving steam in the main pipeline.
The second-stage condenser 80 has a second mixed steam inlet 801 and a second condensed water discharge port 802, the second mixed steam inlet 801 is connected to the second mixed steam outlet 703, and the second condensed water discharge port 802 is connected to the steam-water separator 90. The mixed steam in the second-stage steam ejector 70 flows into the second-stage condenser 80 through the second mixed steam outlet 703 and the second mixed steam inlet 801, and the mixed steam is condensed into condensed water in the second-stage condenser 80 and flows into the steam-water separator 90 through the second condensed water outlet 802.
The cooling water pipeline 906 sequentially flows through the condenser 40, the first-stage condenser 60 and the second-stage condenser 80, so that the cooling water amount of the whole process flow is saved, and the cascade utilization idea of a low-temperature cold source is embodied.
The following describes a vacuum method for performing thin film evaporation wastewater treatment according to an embodiment of the present invention.
The vacuum method for realizing the thin film evaporation wastewater treatment comprises the steps of heating wastewater, supplying the heated wastewater into a thin film evaporator for evaporation and separation, introducing steam in the thin film evaporator into a condenser for condensation, supplying driving steam into a first-stage steam ejector to introduce ejection steam in the condenser into the first-stage steam ejector, and introducing mixed steam formed in the first-stage steam ejector into the first-stage condenser for condensation.
According to the vacuum method for realizing the thin film evaporation wastewater treatment, the driving steam can be utilized to form a vacuum space in the first-stage steam ejector, so that the ejector steam in the condenser can be extracted by utilizing the pressure difference between the first-stage steam ejector and the condenser, the vacuum space formed by the vacuum method for realizing the thin film evaporation wastewater treatment is stable, is slightly influenced by the environmental temperature, is simple in control process, does not relate to rotating equipment, and does not need to consume high-quality electric energy.
In some embodiments, the vacuum method for thin film evaporation wastewater treatment further comprises supplying driving steam into the second-stage steam ejector to introduce the ejector steam in the first-stage condenser into the second-stage steam ejector, and introducing mixed steam formed in the second-stage steam ejector into the second-stage condenser for condensation. Therefore, the uncondensed injection steam in the first-stage condenser can be further treated and condensed, and the reliability of the vacuum method for realizing the thin-film evaporation wastewater treatment is improved.
In some embodiments, the vacuum method of performing membrane evaporative wastewater treatment further comprises passing cooling water through the condenser, the first stage condenser, and the second stage condenser in sequence. Therefore, the cooling water amount of the whole process flow is saved, and the cascade utilization idea of the low-temperature cold source is embodied.
And introducing the condensed water in the first-stage condenser and the second-stage condenser into a steam-water separator for steam-water separation. Therefore, the condensed water discharged from the first condensed water discharge port, the condensed water discharged from the second condensed water discharge port and the steam can be mixed and contained in the steam-water separator, and the residual steam can be separated and discharged by the steam-water separator.
The concentrated waste water in the thin film evaporator is led out of the thin film evaporator and heated and then supplied into the thin film evaporator. Therefore, the concentrated wastewater can be circularly treated, and zero discharge of the wastewater is realized.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the present disclosure, the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" and the like mean that a specific feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (10)
1. A vacuum system for realizing thin film evaporation wastewater treatment is characterized by comprising:
a thin film evaporator having a waste water inlet and a steam outlet;
the waste water supply device is connected with the waste water inlet of the thin film evaporator and is used for supplying waste water to the thin film evaporator;
a heater provided between the thin film evaporator and the wastewater supply device for heating wastewater supplied from the wastewater supply device to the thin film evaporator;
the condenser is provided with a steam inlet, a first steam extraction outlet and a condensate water outlet, and the steam inlet is connected with the steam outlet of the thin film evaporator;
the first-stage steam ejector is provided with a first driving steam inlet, a first ejection steam inlet and a first mixed steam outlet, and the first ejection steam inlet is connected with a first steam extraction outlet of the condenser;
the first-stage condenser is provided with a first mixed steam inlet and a first condensate water outlet, and the first mixed steam inlet is connected with a first mixed steam outlet of the first-stage steam ejector.
2. The vacuum system for realizing thin film evaporation wastewater treatment of claim 1, further comprising a second-stage steam ejector and a second-stage condenser,
the first-stage condenser is also provided with a second steam extraction port, the second-stage condenser is provided with a second mixed steam inlet and a second condensate water discharge port,
the second-stage steam ejector is provided with a second driving steam inlet, a second ejection steam inlet and a second mixed steam outlet, the second ejection steam inlet is connected with a second steam extraction outlet of the first-stage condenser, and the second mixed steam outlet is connected with a second mixed steam inlet of the second-stage condenser.
3. The vacuum system for thin film evaporation wastewater treatment of claim 2, further comprising a steam-water separator, wherein the first condensate drain port and the second condensate drain port are connected to the steam-water separator.
4. The vacuum system for realizing thin film evaporation wastewater treatment according to claim 2, further comprising a driving steam supply pipeline, wherein the driving steam supply pipeline is connected with the first driving steam inlet and the second driving steam inlet, a steam main valve is arranged on the driving steam supply pipeline, and the first-stage driving steam regulating valve is used for regulating the driving steam supplied to the first-stage steam ejector and the second-stage driving steam regulating valve is used for regulating the driving steam supplied to the second-stage steam ejector.
5. The vacuum system for realizing film evaporation wastewater treatment according to any one of claims 2 to 4, wherein the cooling water pipelines of the condenser, the first-stage condenser and the second-stage condenser are connected in series, and the cooling water pipeline firstly enters the condenser, then enters the first-stage condenser after exiting from the condenser, then exits from the first-stage condenser and enters the second-stage condenser, and finally extends out from the second-stage condenser.
6. The vacuum system for realizing thin film evaporation wastewater treatment of claim 1, further comprising a condensed water tank connected with a condensed water outlet of the condenser and a booster pump arranged between the wastewater water supply device and the heater.
7. The vacuum system for thin film evaporation wastewater treatment of claim 1, wherein the thin film evaporator further has a concentrated wastewater outlet connected to the wastewater supply.
8. A vacuum method for realizing thin film evaporation wastewater treatment is characterized by comprising the following steps:
heating the waste water and then supplying the heated waste water into a thin film evaporator for evaporation and separation;
introducing steam in the thin film evaporator into a condenser for condensation;
supplying driving steam into the first-stage steam ejector so as to introduce the ejection steam in the condenser into the first-stage steam ejector;
and introducing mixed steam formed in the first-stage steam ejector into a first-stage condenser for condensation.
9. The vacuum method for thin film evaporation wastewater treatment of claim 8, further comprising:
supplying driving steam into a second-stage steam ejector so as to introduce the ejection steam in the first-stage condenser into the second-stage steam ejector;
and introducing mixed steam formed in the second-stage steam ejector into a second-stage condenser for condensation.
10. The vacuum method for thin film evaporation wastewater treatment of claim 9, further comprising:
passing cooling water through the condenser, the first stage condenser and the second stage condenser in sequence;
introducing the condensed water in the first-stage condenser and the second-stage condenser into a steam-water separator for steam-water separation;
the concentrated waste water in the thin film evaporator is led out of the thin film evaporator and heated and then supplied into the thin film evaporator.
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