CN111863776B - Low-noise double-sided integrated injectable biological photoelectric electrode microprobe and preparation method thereof - Google Patents
Low-noise double-sided integrated injectable biological photoelectric electrode microprobe and preparation method thereof Download PDFInfo
- Publication number
- CN111863776B CN111863776B CN202010748912.2A CN202010748912A CN111863776B CN 111863776 B CN111863776 B CN 111863776B CN 202010748912 A CN202010748912 A CN 202010748912A CN 111863776 B CN111863776 B CN 111863776B
- Authority
- CN
- China
- Prior art keywords
- anode
- preparing
- cathode
- window
- recording electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 238000002161 passivation Methods 0.000 claims abstract description 42
- 238000002955 isolation Methods 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 16
- 229910002601 GaN Inorganic materials 0.000 claims description 39
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 39
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 33
- 238000000151 deposition Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 8
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 7
- 238000012536 packaging technology Methods 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 229910052594 sapphire Inorganic materials 0.000 description 11
- 239000010980 sapphire Substances 0.000 description 11
- 238000009413 insulation Methods 0.000 description 7
- 239000000523 sample Substances 0.000 description 6
- 235000012239 silicon dioxide Nutrition 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 230000033228 biological regulation Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 210000005036 nerve Anatomy 0.000 description 2
- 210000002569 neuron Anatomy 0.000 description 2
- 241000124008 Mammalia Species 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001537 neural effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000002618 waking effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N5/00—Radiation therapy
- A61N5/06—Radiation therapy using light
- A61N5/0613—Apparatus adapted for a specific treatment
- A61N5/0622—Optical stimulation for exciting neural tissue
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N5/00—Radiation therapy
- A61N5/06—Radiation therapy using light
- A61N5/0601—Apparatus for use inside the body
- A61N2005/0612—Apparatus for use inside the body using probes penetrating tissue; interstitial probes
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N5/00—Radiation therapy
- A61N5/06—Radiation therapy using light
- A61N2005/065—Light sources therefor
- A61N2005/0651—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Biomedical Technology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Biophysics (AREA)
- Neurosurgery (AREA)
- Pathology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Radiology & Medical Imaging (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Manufacturing & Machinery (AREA)
- Led Devices (AREA)
Abstract
The invention discloses a low-noise double-sided integrated injectable biological photoelectric electrode microprobe and a preparation method thereof, wherein the microprobe comprises a transparent substrate, a light-emitting structure on the front side of the transparent substrate, a recording electrode structure on the back side of the transparent substrate and an electromagnetic shielding structure, a first insulating isolation layer is arranged between the recording electrode structure and the electromagnetic shielding structure, the recording electrode structure comprises a recording electrode, a recording electrode lead, a recording electrode pad and a first insulating passivation layer, the recording electrode is connected with the recording electrode pad through the recording electrode lead, and a recording electrode window, a recording electrode pad window and a grounding end window are arranged on the first insulating passivation layer. The method includes a method for making the above-described microprojection structure. By using the invention, the recording quality of the bio-signals can be optimized. The invention is a low-noise double-sided integrated injectable biological photoelectrode microprobe and a preparation method thereof, and can be widely applied to the field of semiconductor chips in life science.
Description
Technical Field
The invention relates to the field of semiconductor chips in life science, in particular to a low-noise double-sided integrated injectable biological photoelectrode microprobe and a preparation method thereof.
Background
"optogenetics" is an interdisciplinary discipline that has been incorporated by disciplines of optics, genetics, neuroscience, bioengineering, and the like, and is dedicated to the regulation of neural function with light as a tool. The technology realizes the control of the activation or the inhibition of the neurons by light, combines genetics and optics, greatly improves the time resolution and the spatial resolution of the specificity identification and the control of nerve cells, and is favorable for the research of the correlation between the waking behavior of the free-moving mammal and the long-term implanted nerve regulation.
The optogenetic tool needs to have two functions of specific targeted light regulation and control and nerve signal recording, and is defined as a photoelectrode, wherein the photoelectrode can be divided into a coupling light source type and an injection light source type.
Disclosure of Invention
In order to solve the above technical problems, an object of the present invention is to provide a low-noise double-sided integrated injectable bio-photoelectrode microprobe and a method for preparing the same, which can optimize the recording quality of bio-signals.
The first technical scheme adopted by the invention is as follows: the utility model provides a two-sided integrated biological photoelectrode microprobe of can pouring into of low noise, includes transparent substrate, the positive light emitting structure of transparent substrate, record electrode structure and the electromagnetic shield structure at the transparent substrate back, be equipped with first insulation isolation layer between record electrode structure and the electromagnetic shield structure, record electrode structure includes record electrode, record electrode wire, record electrode pad and first insulation passivation layer, record electrode passes through the record electrode wire and is connected with the record electrode pad, be equipped with record electrode window, record electrode pad window and earthing terminal window on the first insulation passivation layer.
Further, the first insulating isolation layer is provided with a through hole, the electromagnetic shielding structure comprises a first transparent conducting layer and a grounding end, the grounding end is connected with the first transparent conducting layer through the through hole, and the first transparent conducting layer is arranged between the transparent substrate and the first insulating isolation layer.
Further, the light emitting structure comprises a transparent substrate, n-type gallium nitride, an active layer, p-type gallium nitride, a second transparent conductive layer, an anode structure, a cathode structure, a second insulating isolation layer and a second insulating passivation layer, wherein a cathode pad window and an anode pad window are arranged on the second insulating passivation layer.
Further, be equipped with anode structure and cathode structure on the transparent conducting layer of second, anode structure includes anode electrode, anode electrode wire and anode electrode pad, anode electrode passes through the anode electrode wire and is connected with the anode electrode pad, cathode structure includes cathode electrode, cathode electrode wire and cathode electrode pad, cathode electrode passes through the cathode electrode wire and is connected with the cathode electrode pad.
The second technical scheme adopted by the invention is as follows: the utility model provides a two-sided integrated biological photoelectrode microprobe of can pouring into of low noise, includes the record electrode structure and the electromagnetic shield structure at transparent substrate, the positive light emitting structure of transparent substrate, the transparent substrate back, be equipped with first insulation isolation layer between record electrode structure and the electromagnetic shield structure, record electrode structure includes record electrode, record electrode wire, record electrode pad and first insulation passivation layer, record electrode passes through the record electrode wire and is connected with the record electrode pad, be equipped with record electrode window, record electrode pad window and earthing terminal window on the first insulation passivation layer.
Further, the first insulating isolation layer is provided with a through hole, the electromagnetic shielding structure comprises a first transparent conducting layer and a grounding end, the grounding end is connected with the first transparent conducting layer through the through hole, and the first transparent conducting layer is arranged between the transparent substrate and the first insulating isolation layer.
Further, the light emitting structure comprises a transparent substrate, n-type gallium nitride, an active layer, p-type gallium nitride, a second transparent conductive layer, an anode structure, a cathode structure, a second insulating isolation layer and a second insulating passivation layer, wherein a cathode pad window and an anode pad window are arranged on the second insulating passivation layer.
Further, the anode structure includes anode base, positive pole wire, positive pole pad and anode electrode, the anode electrode passes through anode base and positive pole wire and is connected with the positive pole pad, the cathode structure includes negative pole base, negative pole wire, negative pole pad and cathode electrode, the cathode electrode passes through negative pole base and negative pole wire and is connected with the negative pole pad.
Furthermore, the joint of the anode electrode and the anode base and the joint of the cathode electrode and the cathode base are both provided with lead-tin solder films.
The third technical scheme adopted by the invention is as follows: a preparation method of a low-noise double-sided integrated injectable biological photoelectrode microprobe comprises the following steps:
preparing a first transparent conducting layer on the back of the transparent substrate;
preparing a first insulating isolation layer provided with a through hole on the first transparent conductive layer;
preparing a recording electrode, a recording electrode lead, a recording electrode pad and a grounding end by adopting a metal film;
preparing a first insulating passivation layer provided with a recording electrode window, a recording electrode pad window and a grounding terminal window;
the epitaxial structure on the front surface of the transparent substrate is sequentially n-type gallium nitride, an active layer and p-type gallium nitride;
preparing a second transparent conducting layer to cover the p-type gallium nitride and reserving a position for preparing an anode on the p-type gallium nitride;
preparing a second insulating isolation layer and reserving positions of an anode structure and a cathode structure;
depositing a metal film to prepare an anode electrode, an anode electrode lead, an anode electrode pad, a cathode electrode lead and a cathode electrode pad;
and preparing a second insulating passivation layer provided with an anode pad window and a cathode pad window.
Further, the metal film is a 50nm titanium metal film or a 150nm gold metal film.
The fourth technical scheme adopted by the invention is as follows: a preparation method of a low-noise double-sided integrated injectable biological photoelectric electrode microprobe comprises the following steps:
preparing a first transparent conducting layer on the back of the transparent substrate;
preparing a first insulating isolation layer provided with a through hole on the transparent conducting layer;
preparing a recording electrode, a recording electrode lead, a recording electrode pad and a grounding end by adopting a metal film;
preparing a first insulation passivation layer provided with a recording electrode window, a recording electrode pad window and a second grounding terminal window;
preparing an independent chip as a light emitting structure;
depositing a metal film on the front surface of a transparent substrate to prepare an anode base, a cathode base, an anode lead, a cathode lead, an anode bonding pad and a cathode bonding pad;
preparing a second insulating passivation layer provided with an anode base window, a cathode base window, an anode pad window and a cathode pad window, and coating lead-tin solder films on the anode base and the cathode base;
welding an independent chip serving as a light-emitting structure to a base at 200 ℃ by using a flip chip packaging technology, wherein the anode and the cathode of the independent chip serving as the light-emitting structure correspond to the anode base and the cathode base one by one;
after the devices on both sides are integrated, the individual chips and the base portion of the light-emitting structure are packaged with UV glue.
Further, the step of preparing the independent chip as the light emitting structure specifically includes:
the epitaxial structure on the transparent substrate is sequentially n-type gallium nitride, an active layer and p-type gallium nitride;
preparing a second transparent conducting layer to cover the p-type gallium nitride and reserving a position for preparing an anode on the p-type gallium nitride;
preparing a second insulating isolation layer and reserving positions of an anode structure and a cathode structure;
depositing a metal film to prepare an anode electrode and a cathode electrode.
The invention has the beneficial effects that: preparing a metal electrode matched with the size of the cell on the back of the transparent substrate as a recording electrode structure, adding a transparent conductive layer with conductive property between the back transparent substrate and a recording electrode lead layer as an electromagnetic interference shielding layer, and connecting the electromagnetic interference shielding layer with a ground wire conveniently through a through hole structure arranged on the first insulating isolation layer. The design of the structure can effectively weaken and restrain the driving current of the light-emitting structure and electromagnetic shielding interference caused by external signals when the recording electrode works.
Drawings
FIG. 1 is a cross-sectional view of a first embodiment of a low-noise double-sided integrated injectable bioelectrode microprobe of the present invention;
FIG. 2 is a cross-sectional view of a second embodiment of a low-noise double-sided integrated implantable bio-photoelectrode microprobe of the present invention;
FIG. 3 is a perspective view of the backside of the microprojection structure of the present invention after fabrication of an electromagnetic shield and vias;
FIG. 4 is a perspective view of a microprojection structure of the present invention having a recording electrode, a recording electrode lead and a recording electrode pad formed on the backside thereof;
FIG. 5 is a perspective view of the backside of the microprojection structure after a first insulating passivation layer has been formed thereon;
FIG. 6 is a perspective view of a microprojection structure having a mesa formed on the front surface thereof in accordance with a first embodiment of the present invention;
FIG. 7 is a perspective view of a microprojection structure having a second insulating spacer, metal electrodes, leads and bonding pads formed on the front surface thereof in accordance with a first embodiment of the present invention;
FIG. 8 is a perspective view of a front side of a microprojection structure having a second insulating passivation layer formed thereon in accordance with a first embodiment of the present invention;
FIG. 9 is a perspective view of a second embodiment of a method of the present invention after fabricating a metal electrode pad, a lead, and a bonding pad on a front side of a microprojection structure;
fig. 10 is a perspective view of the micro-probe structure of the second embodiment of the method of the present invention after a second insulating passivation layer and a solder film are formed on the front surface thereof, and a schematic diagram of a flip chip packaging technique.
Reference numerals: 1. a transparent substrate; 2. a first transparent conductive layer; 3. a first insulating isolation layer; 4. a through hole; 5. a recording electrode; 6. a recording electrode lead; 7. a recording electrode pad; 8. a ground terminal; 9. a first insulating passivation layer; 10. a recording electrode window; 11. recording an electrode pad window; 12. a ground terminal window; 13. n-type gallium nitride; 14. an active layer; 15. p-type gallium nitride; 16. a second transparent conductive layer; 17. a second insulating isolation layer; 18. an anode electrode; 19. a cathode electrode; 20. an anode electrode lead; 21. a cathode electrode lead; 22. a cathode electrode pad; 23. an anode electrode pad; 24. a second insulating passivation layer; 25. a cathode pad window; 26. an anode pad window; 27. an anode base; 28. a cathode base; 29. an anode lead; 30. a cathode lead; 31. an anode pad; 32. a cathode pad; 33. a second insulating passivation layer; 34. an anode base window; 35. a cathode base window; 36. a cathode pad window; 37. an anode pad window; 38. a lead-tin solder film; 39. a separate chip as a light emitting structure; 40. and (5) UV glue.
Detailed Description
The invention is described in further detail below with reference to the figures and the specific embodiments. The step numbers in the following embodiments are provided only for convenience of illustration, the order between the steps is not limited at all, and the execution order of each step in the embodiments can be adapted according to the understanding of those skilled in the art.
The first embodiment is as follows:
as shown in fig. 1, the present invention provides a low-noise double-sided integrated injectable bio-photoelectric micro-probe, which comprises a transparent substrate 1, a light emitting structure on the front side of the transparent substrate, a recording electrode structure on the back side of the transparent substrate, and an electromagnetic shielding structure, wherein a first insulating isolation layer 3 is arranged between the recording electrode structure and the electromagnetic shielding structure, the recording electrode structure comprises a recording electrode 5, a recording electrode lead 6, a recording electrode pad 7, and a first insulating passivation layer 9, the recording electrode 5 is connected with the recording electrode pad 7 through the recording electrode lead 6, and the first insulating passivation layer 9 is provided with a recording electrode window 10, a recording electrode pad window 11, and a grounding end window 12.
Specifically, the transparent substrate 1 may be a sapphire transparent substrate, the first insulating isolation layer 3 and the first insulating passivation layer 9 may be made of a silicon dioxide material, the first insulating passivation layer 9 is intended to protect the recording electrode structure, the first insulating passivation layer 9 is etched to prepare a recording electrode window 10, a recording electrode pad window 11, and a ground terminal window 12, and the ground terminal window 12 enables the ground terminal 8 of the electromagnetic shielding layer to be used for introducing a ground wire to realize electromagnetic shielding.
Further as a preferred embodiment, the first insulating and isolating layer 3 is provided with a through hole, the electromagnetic shielding structure includes a first transparent conductive layer 2 and a ground terminal 8, the ground terminal 8 is connected to the first transparent conductive layer 2 through the through hole 4, and the first transparent conductive layer 2 is disposed between the transparent substrate 1 and the first insulating and isolating layer 3.
Further as a preferred embodiment, the light emitting structure includes a transparent substrate, n-type gallium nitride 13, an active layer 14, p-type gallium nitride 15, a second transparent conductive layer 16, an anode structure, a cathode structure, a second insulating isolation layer 17, and a second insulating passivation layer 24, and a cathode pad window 25 and an anode pad window 26 are disposed on the second insulating passivation layer 24.
Further as a preferred embodiment of the method, an anode structure and a cathode structure are arranged on the second transparent conductive layer 16, the anode structure includes an anode electrode 18, an anode electrode lead 19 and an anode electrode pad 23, the anode electrode 18 is connected to the anode electrode pad 23 through the anode electrode lead 19, the cathode structure includes a cathode electrode 19, a cathode electrode lead 21 and a cathode electrode pad 22, and the cathode electrode 19 is connected to the cathode electrode pad 22 through the cathode electrode lead 21.
The second embodiment is as follows:
as shown in fig. 2, the present invention further provides another low-noise double-sided integrated injectable bio-photoelectric electrode microprobe, which comprises a transparent substrate 1, a light emitting structure on the front side of the transparent substrate, a recording electrode structure on the back side of the transparent substrate, and an electromagnetic shielding structure, wherein a first insulating isolation layer 3 is arranged between the recording electrode structure and the electromagnetic shielding structure, the recording electrode structure comprises a recording electrode 5, a recording electrode lead 6, a recording electrode pad 7, and a first insulating passivation layer 9, the recording electrode 5 is connected with the recording electrode pad 7 through the recording electrode lead 6, and the first insulating passivation layer 9 is provided with a recording electrode window 10, a recording electrode pad window 11, and a ground terminal window 12.
Further as a preferred embodiment, the first insulating and isolating layer 3 is provided with a through hole, the electromagnetic shielding structure includes a first transparent conductive layer 2 and a ground terminal 8, the ground terminal 8 is connected to the first transparent conductive layer 2 through the through hole 4, and the first transparent conductive layer 2 is disposed between the transparent substrate 1 and the first insulating and isolating layer 3.
Further as a preferred embodiment, the light emitting structure includes a transparent substrate, n-type gallium nitride 13, an active layer 14, p-type gallium nitride 15, a second transparent conductive layer 16, an anode structure, a cathode structure, a second insulating isolation layer 17, and a second insulating passivation layer 24, and a cathode pad window 25 and an anode pad window 26 are disposed on the second insulating passivation layer 24.
Further as a preferred embodiment, the anode structure comprises an anode base 27, an anode lead 29, an anode pad 31 and an anode electrode 18, the anode electrode 18 is connected with the anode pad 31 through the anode base 27 and the anode lead 29, the cathode structure comprises a cathode base 28, a cathode lead 30, a cathode pad 32 and a cathode electrode 19, and the cathode electrode 19 is connected with the cathode pad 32 through the cathode base 28 and the cathode lead 30.
In a further preferred embodiment, a lead-tin solder film 38 is provided at the junction of the anode electrode 18 and the anode base 27 and at the junction of the cathode electrode 19 and the cathode base 28.
The first specific embodiment of the method is as follows:
the invention provides a preparation method of a low-noise double-sided integrated injectable biological photoelectrode microprobe, which comprises the following steps:
preparing a first transparent conducting layer 2 on the back of a transparent substrate 1;
preparing a first insulating isolation layer 3 provided with a through hole 4 on the first transparent conductive layer 2;
preparing a recording electrode 5, a recording electrode lead 6, a recording electrode pad 7 and a grounding terminal 8 by adopting a metal film;
preparing a first insulating passivation layer 9 provided with a recording electrode window 10, a recording electrode pad window 11 and a ground terminal window 12;
the epitaxial structure on the front surface of the transparent substrate 1 is n-type gallium nitride 13, an active layer 14 and p-type gallium nitride 15 in sequence;
preparing a second transparent conducting layer 16 to cover the p-type gallium nitride 15 and reserving a position for preparing an anode on the p-type gallium nitride 15;
preparing a second insulating isolation layer 17 and reserving a part of an anode structure and a cathode structure;
depositing a metal film to prepare an anode electrode 18, an anode electrode lead 20, an anode electrode pad 23, a cathode electrode 19, a cathode electrode lead 21 and a cathode electrode pad 22;
a second insulating passivation layer 24 provided with an anode pad window 26 and a cathode pad window 25 is prepared.
Further as a preferred embodiment of the method, the metal film is a 50nm titanium metal film or a 150nm gold metal film.
Specifically, a recording electrode having an electromagnetic shielding layer structure is prepared on the back surface of a sapphire transparent substrate. On the front surface of a sapphire transparent substrate, a light-emitting diode is prepared by using a sapphire-based gallium nitride epitaxial wafer and used as a light-emitting structure of a photoelectric micro-probe: as shown in fig. 6, the sapphire-based gan epitaxial wafer has a structure of a sapphire transparent substrate, n-type gan, a quantum well, and p-type gan, and is etched from a mesa to the n-type gan, an ito layer is prepared as a transparent electrode, and a portion for preparing a metal anode of a led is left on the p-type gan; as shown in fig. 7, a silicon dioxide isolation layer is prepared on the basis of fig. 6, an anode portion and a cathode portion of the light emitting diode are reserved, and 50nm titanium metal and 150nm gold metal are deposited to prepare an anode, an anode lead, an anode pad, a cathode lead and a cathode pad of the light emitting diode. Finally, as shown in fig. 8, a silicon dioxide passivation layer is prepared on the basis of fig. 7, and an anode pad window and a cathode pad window are prepared at the anode pad and the cathode pad of the light emitting diode. The structure of the light emitting diode on the front side, the structure of the back recording electrode and the structure of the electromagnetic shielding layer are added to form the low-noise double-sided integrated micro probe capable of being injected with the biological photoelectrode. The final integrated effect is shown in fig. 1.
The second specific embodiment of the method:
the invention also provides another preparation method of the low-noise double-sided integrated injectable biological photoelectrode microprobe, which comprises the following steps:
preparing a first transparent conducting layer 2 on the back of a transparent substrate 1;
preparing a first insulating isolation layer 3 provided with a through hole 4 on the first transparent conductive layer 2;
preparing a recording electrode 5, a recording electrode lead 6, a recording electrode pad 7 and a grounding terminal 8 by adopting a metal film;
preparing a first insulating passivation layer 9 provided with a recording electrode window 10, a recording electrode pad window 11 and a grounding end window 12;
preparing an independent chip 39 as a light emitting structure;
depositing a metal film on the front surface of the transparent substrate to prepare an anode base 27, a cathode base 28, an anode lead 29, a cathode lead 30, an anode bonding pad 31 and a cathode bonding pad 32;
preparing a second insulating passivation layer 24 provided with an anode base window 34, a cathode base window 35, an anode pad window 37 and a cathode pad window 36 and coating a lead-tin solder film 38 on the anode base 27 and the cathode base 28;
welding the independent chip 39 serving as the light-emitting structure to the base at 200 ℃ by using a flip chip packaging technology, wherein the anode electrode 18 and the cathode electrode 19 of the independent chip 39 serving as the light-emitting structure correspond to the anode base 27 and the cathode base 28 one by one;
after the devices on both sides are integrated, the individual chips 39 and the base portion as the light emitting structure are encapsulated with UV glue 40.
Further as a preferred embodiment of the method, the step of preparing the independent chip as the light emitting structure specifically includes:
the epitaxial structure on the front surface of the transparent substrate 1 is n-type gallium nitride 13, an active layer 14 and p-type gallium nitride 15 in sequence;
preparing a second transparent conducting layer 16 to cover the p-type gallium nitride 15 and reserving a position for preparing an anode on the p-type gallium nitride 15;
preparing a second insulating isolation layer 17 and reserving a part of an anode structure and a cathode structure;
depositing a metal film prepares the anode electrode 18 and the cathode electrode 19.
Specifically, a recording electrode having an electromagnetic shielding layer structure is prepared on the back surface of a sapphire transparent substrate: preparing a transparent electrode indium tin oxide film and a silicon dioxide film on the back of the sapphire transparent substrate; preparing a recording electrode 5, a recording electrode lead 6, a recording electrode pad 7 and a grounding terminal 8 by adopting a metal film; a first silicon oxide passivation layer provided with a recording electrode window 10, a recording electrode pad window 11, and a ground terminal window 12 is prepared. The method comprises the following steps of preparing a light-emitting structure of a photoelectric electrode microprobe by using a flip chip packaging technology on the front surface of a sapphire transparent substrate: first, as shown in fig. 9, a 50nm titanium metal or 150nm gold metal film is deposited on the front surface of a sapphire transparent substrate to prepare a base structure for bonding a light emitting diode chip, which comprises: an anode base 27, a cathode base 28, an anode lead 29, a cathode lead 30, an anode pad 32, and a cathode pad 31; then, as shown in fig. 10, depositing a second silicon dioxide passivation layer on the basis of fig. 9, preparing windows of a structure for welding, including an anode base window 34, a cathode base window 35, an anode pad window 37 and a cathode pad window 36, and coating a lead-tin solder film 38 on the anode base 27 and the cathode base 28 for adhesion between the bases and the electrodes of the light emitting diode chip during welding; finally, the independent chip 39 serving as the light-emitting structure is welded to the base at about 200 ℃ by using a flip chip packaging technology, and the anode and the cathode of the independent chip 39 serving as the light-emitting structure correspond to the anode base 27 and the cathode base 28 one by one. The individual chip 39 as the light emitting structure has a specific structure similar to that of the first embodiment, and includes a sapphire transparent substrate, n-type gallium nitride, a quantum well, p-type gallium nitride, a transparent electrode indium tin oxide layer 16, a silicon dioxide isolation layer, an anode electrode, and a cathode electrode. The front surface of the biological photoelectric electrode micro probe is provided with a light-emitting structure prepared by a flip chip packaging technology and an LED chip, the back surface of the biological photoelectric electrode micro probe is provided with a recording electrode structure, and an electromagnetic shielding layer structure is additionally arranged. Finally, after integrating the devices on both sides, the LED chip and the base portion are encapsulated by UV glue 40, and the final integration effect is shown in fig. 2.
The contents in the embodiments are all applicable to the embodiments of the method, the functions specifically realized by the embodiments of the method are the same as those of the embodiments, and the beneficial effects achieved by the embodiments are also the same as those achieved by the embodiments.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (4)
1. A preparation method of a low-noise double-sided integrated injectable biological photoelectrode microprobe is characterized by comprising the following steps:
preparing a first transparent conducting layer on the back of the transparent substrate to serve as an electromagnetic shielding structure;
preparing a first insulating isolation layer provided with a through hole on the first transparent conductive layer;
preparing a recording electrode, a recording electrode lead, a recording electrode pad and a grounding end on the first insulating isolation layer by adopting a metal film;
preparing a first insulating passivation layer provided with a recording electrode window, a recording electrode pad window and a grounding terminal window on the first insulating isolation layer;
the epitaxial structure on the front surface of the transparent substrate is sequentially n-type gallium nitride, an active layer and p-type gallium nitride;
preparing a second transparent conducting layer to cover the p-type gallium nitride and reserving a position for preparing an anode on the p-type gallium nitride;
preparing a second insulating isolation layer on the second transparent conducting layer and reserving positions of an anode structure and a cathode structure;
depositing a metal film on the second transparent conductive layer to prepare an anode electrode, an anode electrode lead, an anode electrode pad, a cathode electrode lead and a cathode electrode pad;
and preparing a second insulating passivation layer provided with an anode pad window and a cathode pad window on the second transparent conductive layer.
2. The method for preparing a low-noise double-sided integrated injectable biological photoelectrode microprobe according to claim 1, wherein a 50nm titanium metal film or a 150nm gold metal film is adopted as the metal film.
3. A preparation method of a low-noise double-sided integrated injectable biological photoelectrode microprobe is characterized by comprising the following steps:
preparing a first transparent conducting layer on the back of the transparent substrate to serve as an electromagnetic shielding structure;
preparing a first insulating isolation layer provided with a through hole on the transparent conducting layer;
preparing a recording electrode, a recording electrode lead, a recording electrode pad and a grounding end on the first insulating isolation layer by adopting a metal film;
preparing a first insulating passivation layer provided with a recording electrode window, a recording electrode pad window and a second grounding terminal window on the first insulating isolation layer;
preparing an independent chip as a light emitting structure;
depositing a metal film on the front surface of a transparent substrate to prepare an anode base, a cathode base, an anode lead, a cathode lead, an anode bonding pad and a cathode bonding pad;
preparing a second insulating passivation layer provided with an anode base window, a cathode base window, an anode pad window and a cathode pad window on the front surface of the transparent substrate, and coating lead-tin solder films on the anode base and the cathode base;
welding an independent chip serving as a light-emitting structure to the front surface of the transparent substrate at 200 ℃ by using a flip chip packaging technology, wherein the anode and the cathode of the independent chip serving as the light-emitting structure correspond to the anode base and the cathode base one by one;
after integrating the devices on the two sides, UV glue is used for packaging the independent chip, the anode base and the cathode base which are used as the light-emitting structure.
4. The method for preparing a low-noise double-sided integrated injectable biological photoelectrode microprobe according to claim 3, wherein the step of preparing the independent chip as the light emitting structure specifically comprises:
the epitaxial structure on the transparent substrate is sequentially n-type gallium nitride, an active layer and p-type gallium nitride;
preparing a second transparent conducting layer to cover the p-type gallium nitride and reserving a position for preparing an anode on the p-type gallium nitride;
preparing a second insulating isolation layer on the p-type gallium nitride and reserving positions of an anode structure and a cathode structure;
and depositing a metal film on the p-type gallium nitride to prepare an anode electrode and a cathode electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010748912.2A CN111863776B (en) | 2020-07-30 | 2020-07-30 | Low-noise double-sided integrated injectable biological photoelectric electrode microprobe and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010748912.2A CN111863776B (en) | 2020-07-30 | 2020-07-30 | Low-noise double-sided integrated injectable biological photoelectric electrode microprobe and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111863776A CN111863776A (en) | 2020-10-30 |
| CN111863776B true CN111863776B (en) | 2022-09-20 |
Family
ID=72946172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010748912.2A Active CN111863776B (en) | 2020-07-30 | 2020-07-30 | Low-noise double-sided integrated injectable biological photoelectric electrode microprobe and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111863776B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117476830A (en) * | 2023-12-27 | 2024-01-30 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Photoelectrode microprobe and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103296009A (en) * | 2012-02-22 | 2013-09-11 | 中国科学院微电子研究所 | Shielding structure with EBG, 3D packaging structure and preparation method thereof |
| CN106356350A (en) * | 2016-10-11 | 2017-01-25 | 广东顺德中山大学卡内基梅隆大学国际联合研究院 | TSV (through silicon via)-interconnect-based system in package electromagnetic coupling suppression method |
| CN108389931A (en) * | 2018-04-13 | 2018-08-10 | 中山大学 | Collect the biological neural chip and preparation method thereof of optoelectronic pole and microelectrode one |
| CN109545884A (en) * | 2018-11-09 | 2019-03-29 | 中山大学 | A kind of integrated form can the atomic probe of injection type biological photoelectric and preparation method thereof |
| CN111134654A (en) * | 2019-12-25 | 2020-05-12 | 上海交通大学 | Photoelectric nerve probe integrated with internal metal shielding layer and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7936052B2 (en) * | 2008-09-30 | 2011-05-03 | Infineon Technologies Ag | On-chip RF shields with backside redistribution lines |
-
2020
- 2020-07-30 CN CN202010748912.2A patent/CN111863776B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103296009A (en) * | 2012-02-22 | 2013-09-11 | 中国科学院微电子研究所 | Shielding structure with EBG, 3D packaging structure and preparation method thereof |
| CN106356350A (en) * | 2016-10-11 | 2017-01-25 | 广东顺德中山大学卡内基梅隆大学国际联合研究院 | TSV (through silicon via)-interconnect-based system in package electromagnetic coupling suppression method |
| CN108389931A (en) * | 2018-04-13 | 2018-08-10 | 中山大学 | Collect the biological neural chip and preparation method thereof of optoelectronic pole and microelectrode one |
| CN109545884A (en) * | 2018-11-09 | 2019-03-29 | 中山大学 | A kind of integrated form can the atomic probe of injection type biological photoelectric and preparation method thereof |
| CN111134654A (en) * | 2019-12-25 | 2020-05-12 | 上海交通大学 | Photoelectric nerve probe integrated with internal metal shielding layer and preparation method thereof |
Non-Patent Citations (2)
| Title |
|---|
| EMI control for VLSI biosensor circuitry;T.M.Babij 等;《Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society》;19881107 * |
| High-yield benzocyclobutene(BCB) based neural implants for simultaneous intra- and extracortical recording in rats;Haixin Zhu 等;《The 26th Annual International Conference of the IEEE Engineering in Medicine and Biology Society》;20050314;第4341-4344页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111863776A (en) | 2020-10-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20200194963A1 (en) | Laser diode module | |
| CN102569297B (en) | Monolithic IGBT and diode structure and method for preparing quasi-resonant converter | |
| TWI414088B (en) | Light-emitting device and the manufacturing method thereof | |
| CN106531700B (en) | A kind of chip-packaging structure and its packaging method | |
| US20100148293A1 (en) | Miniaturized implantable sensor platform having multiple devices and sub-chips | |
| US9548433B2 (en) | Light-emitting diode chip | |
| US6630735B1 (en) | Insulator/metal bonding island for active-area silver epoxy bonding | |
| CN103003941B (en) | Opto-electronic device | |
| CN102446948B (en) | Light emitting element | |
| CN109300430A (en) | Light emitting device and method for manufacturing the same | |
| CN109545884B (en) | Preparation method of integrated injectable biological photoelectric electrode microprobe | |
| CN110571224A (en) | Display device and method for manufacturing the same | |
| US20020079500A1 (en) | Light emitting diode | |
| CN104300056A (en) | High-reliability inverted LED chip, LED device and manufacturing method of high-reliability inverted LED chip | |
| CN111863776B (en) | Low-noise double-sided integrated injectable biological photoelectric electrode microprobe and preparation method thereof | |
| JP2770717B2 (en) | Gallium nitride based compound semiconductor light emitting device | |
| US20220115572A1 (en) | Drive backplane and preparation method thereof, display panel, and display device | |
| US5466948A (en) | Monolithic silicon opto-coupler using enhanced silicon based LEDS | |
| CN111863777B (en) | Low-noise single-sided integrated injectable biological photoelectric electrode microprobe and preparation method thereof | |
| CN113471243B (en) | Micro-LED display panel and preparation method thereof | |
| CN111180565B (en) | Flip LED chip | |
| TWI271120B (en) | Organic electroluminescent device | |
| CN107331654A (en) | A kind of rectifier bridge device and preparation method thereof | |
| CN208738229U (en) | Rectifying device and Schottky diode | |
| US11605667B2 (en) | Component with electrically conductive converter layer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |