CN111842528B - Manufacturing method of temperature equalization plate - Google Patents
Manufacturing method of temperature equalization plate Download PDFInfo
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- CN111842528B CN111842528B CN202010629748.3A CN202010629748A CN111842528B CN 111842528 B CN111842528 B CN 111842528B CN 202010629748 A CN202010629748 A CN 202010629748A CN 111842528 B CN111842528 B CN 111842528B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1121—Making porous workpieces or articles by using decomposable, meltable or sublimatable fillers
- B22F3/1137—Making porous workpieces or articles by using decomposable, meltable or sublimatable fillers by coating porous removable preforms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/02—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of sheets
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Abstract
The invention discloses a manufacturing method of a temperature equalization plate, which comprises the following steps: step 1, a fiber board formed by fiber tissues, wherein a plurality of first pores are formed on the fiber board; step 2, placing metal powder into a plurality of first pores; step 3, performing high-temperature sintering on the fiber board with the metal powder, removing all the fiber tissues, forming the metal board by the metal powder after high-temperature sintering, and forming second pores by the space occupied by the sintered fiber tissues, wherein the second pores are positioned in the metal board; step 4, firstly carrying out hydrophilic treatment on the metal plate, and then carrying out thinning treatment on the metal plate to reduce the aperture of the second pore; or firstly, thinning the metal plate to reduce the aperture of the second pore, and then, carrying out hydrophilic treatment on the metal plate; through the steps, the pore density of the second pores in the metal plate is increased, so that the diffusion speed of liquid working fluid in the metal plate can be increased, and the heat dissipation performance of the temperature equalization plate is improved.
Description
[ field of technology ]
The present invention relates to a method for manufacturing a temperature equalization plate, and more particularly, to a method for manufacturing a temperature equalization plate with improved heat dissipation efficiency.
[ background Art ]
The manufacturing method of the conventional temperature equalization plate comprises the following steps: step one, an upper plate and a lower plate are provided. The lower surface of the upper plate is concavely provided with a first groove upwards, and the upper surface of the lower plate is concavely provided with a second groove downwards; placing metal powder in the second groove, and then sintering the metal powder at high temperature to form a metal plate with pores; and thirdly, stacking the upper plate above the lower plate, so that the first groove and the second groove are communicated with each other to form a containing cavity. Step four, sealing the upper plate and the lower plate, and reserving an opening to enable the accommodating cavity to be communicated with the outside through the opening; and fifthly, filling the working fluid into the accommodating cavity through the opening, and partially penetrating the working fluid into the metal plate, and then sealing the opening. The temperature equalizing plate manufactured by the method can enable the working fluid to circulate in the accommodating cavity, so that the temperature equalizing plate can radiate heat of external elements.
However, since the metal plate having the voids manufactured in the above manner is directly formed by sintering, the number of voids in the metal plate and the size of the voids may vary with the variation of the sintering temperature. If the sintering temperature is too low, the pore diameter of the pores of the metal plate is larger, and even the metal powder cannot be sintered into the metal plate, so that the diffusion of the working fluid in the metal plate is affected, and the maldistribution of the working fluid in a liquid state is caused, so that the heat dissipation performance of the temperature equalization plate is affected. If the sintering temperature is too high, the number of voids in the metal plate is reduced and even the metal plate is broken and damaged. This also affects the diffusion of the working fluid of the liquid in the metal plate, thus causing maldistribution of the working fluid and affecting the heat dissipation performance of the temperature equalizing plate.
Therefore, it is necessary to design a manufacturing method of the temperature equalization plate to overcome the above problems.
[ invention ]
The invention aims to provide a manufacturing method of a temperature equalization plate, which is provided with a plurality of second pores, wherein the metal plate is subjected to thinning treatment, so that the metal plate is thinned, and the pore diameters of the second pores are reduced, so that the porosity of the metal plate is increased.
In order to achieve the above purpose, the manufacturing method of the temperature equalization plate adopts the following technical scheme:
the manufacturing method of the temperature equalization plate is characterized by comprising the following steps of: step 1, a fiber board formed by fiber tissue, wherein a plurality of first pores are formed on the fiber board; before the step 2 after the step 1, firstly performing activation treatment on the fiber board to enable the surface of the fiber board to have catalytic activity; step 2, placing metal powder in a plurality of first pores, specifically: firstly, carrying out chemical plating treatment on the fiber board with catalytic activity on the surface so that the fiber tissue and the metal powder are tightly combined, and then, placing the fiber board plated with the metal powder into electroplating solution for electroplating so that the metal powder is completely electroplated in the first pores; step 3, sintering the fiber board with the metal powder at a high temperature, removing all fiber tissues in the fiber board, wherein the metal powder after high-temperature sintering forms a metal board, and the space occupied by the sintered fiber tissues forms a second pore, and the second pore is positioned in the metal board; step 4, firstly carrying out hydrophilic treatment on the metal plate, and then carrying out thinning treatment on the metal plate to reduce the aperture of the second pore; or firstly, thinning the metal plate, reducing the aperture of the second pore, and then, carrying out hydrophilic treatment on the metal plate; step 5, providing an upper plate and a lower plate, wherein a containing cavity is formed between the upper plate and the lower plate, and the metal plate is placed in the containing cavity; step 6, correspondingly matching the upper plate with the lower plate, and reserving an opening to enable the accommodating cavity to be communicated with the outside through the opening; step 7, filling the working fluid into the accommodating cavity through the opening, and enabling at least part of the working fluid to permeate into the second pores of the metal plate; and 8, sealing the upper plate, the lower plate and the opening, so that the metal plate and the working fluid are sealed in the accommodating cavity, and the metal plate, the working fluid, the upper plate and the lower plate jointly form the temperature equalizing plate.
Further, in step 3, the second pores have a plurality, the second pores are mutually communicated, and at least two second pores having different pore diameters are arranged in the second pores.
Further, in step 4, during the process of pressing the metal plate, the pressing force acting on the metal plate is larger than the yield strength of the metal plate, and the thickness of the metal plate is gradually thinned along the pressing direction, the pore diameters of the plurality of second pores are gradually reduced, and the number of the plurality of second pores is unchanged.
Further, in step 4, during the process of pressing the metal plate, the distance between two adjacent second apertures in the pressing direction is gradually reduced.
Further, in step 4, during the process of pressing the metal plate, the distance between two adjacent second apertures is gradually increased along the direction perpendicular to the pressing direction, and the length and width of the metal plate are also gradually increased.
Further, in step 4, fifty grams of sodium hydroxide (NaOH) and twenty grams of potassium persulfate (K2S 2O 4) are selected as the oxidizing agent when the metal sheet is subjected to the hydrophilic treatment, and one liter of water is mixed as the oxidizing agent, and then the oxidizing agent is heated to eighty degrees celsius, and thereafter the metal sheet is put into the oxidizing agent at eighty degrees celsius, so that the metal sheet is blackened.
Further, in step 5, a first groove is concavely formed on the lower surface of the upper plate, the top surface of the first groove protrudes downwards, a plurality of bumps are arranged at intervals, and in step 6, the bumps are abutted against the metal plate.
Further, in step 6, the upper plate is set in one mold, the lower plate is set in another mold, the molds with the upper plate mounted thereon are stacked above the molds with the lower plate mounted thereon, and after that, the two molds are placed in a high-temperature vacuum furnace to perform high-temperature press-fit, so that the upper plate and the lower plate are sealed.
In step 7, a gap is formed between the working fluid and the upper surface of the accommodating cavity, and after step 7, before step 8, the accommodating cavity is vacuumized through the opening.
Compared with the prior art, the manufacturing method of the temperature equalizing plate has the following beneficial effects:
the fiber board formed by fiber tissue in the invention has a plurality of the first pores. And firstly placing the metal powder in a plurality of first pores, and then sintering the fiber board with the metal powder at a high temperature, so that all fiber tissues in the fiber board are removed, the space occupied by the sintered fiber tissues forms a second pore, the metal powder forms the metal board, and the second pore is positioned in the metal board. In this way, only the fibrous structure needs to be completely sintered, the space occupied by the fibrous structure forms the second pores, and the second pores are located in the metal plate. And since the number and size of the fibrous structures are already determined at the time of forming the fiberboard, the size of the space occupied by the fibrous structures that are sintered away is also determined. Therefore, the number of the second voids formed in the metal plate and the size of the aperture of the second voids do not change with the change of the sintering temperature. In this way, the working fluid in the liquid state can be stably diffused in the metal plate with the second pores, so that the temperature equalizing plate has good heat dissipation performance. And thereafter, the metal plate having the second apertures is subjected to a ironing process, the aperture of the second apertures in the metal plate is reduced during ironing, and the distance between two adjacent second apertures along the ironing direction is also reduced. In this way, the void density of the second voids in the metal plate is increased. Therefore, the diffusion speed of the liquid working fluid in the metal plate can be increased, so that the liquid working fluid can be uniformly distributed in the metal plate, and the heat dissipation performance of the temperature equalization plate is improved.
[ description of the drawings ]
FIG. 1 is a cross-sectional view of a fiber board of a isopipe of the present invention prior to electroless plating;
FIG. 2 is a cross-sectional view of the fiber board of the isopipe of the present invention after electroplating;
FIG. 3 is a cross-sectional view of a sheet metal of the isopipe of the present invention prior to compression;
FIG. 4 is a cross-sectional view of a metal plate of the temperature equalization plate of the present invention when compressed;
FIG. 5 is a perspective view of the upper plate of the temperature equalization plate of the present invention;
FIG. 6 is an exploded view of the temperature equalization plate of the present invention prior to assembly;
FIG. 7 is an assembled view of the temperature equalization plate of the present invention.
Reference numerals of the specific embodiments illustrate:
[ detailed description ] of the invention
For a better understanding of the invention with objects, structures, features, and effects, the invention will be described further with reference to the drawings and to the detailed description.
As shown in fig. 5, 6 and 7, a temperature equalizing plate a according to the present invention for dissipating heat from a heating electronic element (not shown, the same applies hereinafter) includes an upper plate 3, a lower plate 4 and a metal plate 2 having a plurality of second holes 21 between the upper plate 3 and the lower plate 4. The lower surface of the upper plate 3 is concavely provided with a first groove 31 and a plurality of protrusions 33, the upper surface of the lower plate 4 is concavely provided with a second groove 41, when the upper plate 3 and the lower plate 4 are sealed together, the first groove 31 and the second groove 41 are communicated to form a containing cavity 8, the metal plate 2 is contained in the second groove (of course, in other embodiments, the metal plate can also protrude upwards into the first groove), and the working fluid 5 is filled in the containing cavity 8, so that the heat-generating electronic component is radiated by the heat-equalizing plate a.
As shown in fig. 5, 6 and 7, the upper plate 3 is made of a metal copper plate (in other embodiments, the upper plate 3 may be made of aluminum or other metal materials), and the upper plate 3 is rectangular (in other embodiments, the upper plate 3 may be circular or other shapes). The upper surface of the upper plate 3 is a horizontal surface for contacting an external member (not shown, the same applies hereinafter). The lower surface of the upper plate 3 is provided with the first groove 31 and a first mounting portion 32 surrounding the first groove 31, and the lower surface of the first mounting portion 32 is flush with the lower surface of the upper plate 3. The first groove 31 has a first inner surface 311, the first inner surface 311 is higher than the lower surface of the upper plate 3, and a plurality of protruding blocks 33 are further disposed downward from the first inner surface 311 of the first groove 31, and the plurality of protruding blocks 33 are disposed at intervals. Each of the bumps 33 is provided with an abutment surface 331, and the abutment surface 331 is flush with the lower surface of the upper plate 3 (of course, in other embodiments, the height of the abutment surface 331 may be higher or lower than the lower surface of the upper plate 3), and the abutment surface 331 is configured to abut against the metal plate 2.
As shown in fig. 6 and 7, the lower plate 4 is made of a metal copper plate (in other embodiments, the upper plate 3 may be made of aluminum or other metal materials), and the lower plate 4 is rectangular (in other embodiments, the lower plate 4 may be circular or other shapes). The lower surface of the lower plate 4 is a horizontal plane, and the lower surface of the lower plate 4 is used for contacting with the heating electronic component. The upper surface of the lower plate 4 is concavely provided with the second groove 41 and a second mounting portion 42 surrounding the second groove 41, and the upper surface of the second mounting portion 42 is flush with the upper surface of the lower plate 4.
As shown in fig. 4, 6 and 7, the metal material of the metal plate 2 is copper (of course, the metal plate 2 may be made of other metal materials in other embodiments), and the size of the metal plate 2 is substantially the same as the size of the second groove 41. The metal plate 2 has a plurality of second holes 21 inside, the plurality of second holes 21 are communicated with each other, and the aperture diameter of one part of the second holes 21 is larger than the aperture diameter of the other part of the second holes 21. In other words, at least two of the second voids 21 have different pore sizes (of course, in other embodiments, the pore sizes of the second voids 21 may be the same). And the distance between two adjacent second apertures 21 in a part of the plurality of second apertures 21 is larger than the distance between two adjacent second apertures 21 in another part (of course, in other embodiments, the distance between any two adjacent second apertures 21 may be the same).
As shown in fig. 7, when the upper plate 3 and the lower plate 4 are sealed, the metal plate 2 is fixed in the second groove 41, and the abutting surface 331 of the protrusion 33 abuts against the upper surface of the metal plate 2. The first groove 31 and the second groove 41 are aligned up and down and are mutually communicated to form the accommodating cavity 8, and the first mounting portion 32 and the second mounting portion 42 are mutually sealed. The accommodating cavity 8 is in a vacuum state, the working fluid 5 is accommodated in the accommodating cavity 8, and a gap 6 is further provided between the working fluid 5 and the first inner surface 311 of the first groove 31, so that the working fluid 5 is heated and evaporated in the gap 6.
As shown in fig. 1 to 7, the manufacturing method of the temperature uniformity plate a is the best embodiment (for convenience, some steps are omitted in fig. 1, 2 and 3):
step 1, providing a fiber board 1 (the fiber board 1 may be a sponge board, a foam board, etc.), wherein the fiber board 1 is formed by interweaving fiber tissues 11, and the fiber board 1 is further provided with a plurality of first pores 12 inside, and the first pores 12 are mutually communicated. The fiber board 1 is firstly put into an oxidation roughening solution for roughening treatment, SO that the surface of the fiber board 1 is oxidized and roughened, and the fiber board 1 has good hydrophilic performance, wherein the oxidation roughening solution is prepared by chromium trioxide (CrO 3) and sulfuric acid (H2 SO 4) (in other embodiments, the oxidation roughening solution can be prepared by other substances with oxidizing property). After that, the fiber board 1 with good hydrophilic performance is cleaned and reduced, then the cleaned and reduced fiber board 1 is put into a sensitization solution prepared by stannous chloride (SnCl 2) and hydrogen chloride (HCl) (of course, other reagents can be used for preparing the sensitization solution in other embodiments), and finally the fiber board 1 is put into an activation solution for activation treatment, so that palladium microcrystals (of course, other metal substances with catalytic activity can be also absorbed on the surface of the fiber board 1) are adsorbed on the surface of the fiber board 1, and the surface of the fiber board 1 has catalytic activity. The activation solution is prepared from palladium chloride (PdCl 2) and hydrogen chloride (HCl), and the first pores 12 of the fiberboard 1 are made to be relatively uniform in size by the above treatment.
Step 2, placing the fiber board 1 with the surface having the activity catalysis into an electroless copper plating solution for electroless copper plating treatment (of course, in other embodiments, the fiber board 1 can also be placed into other electroless metal solutions for electroless copper plating treatment), so that the fiber board 1 after the electroless copper plating treatment has conductivity. In the electroless copper plating process, electroless copper plating solution of a three-coordination system is adopted for electroless plating, and the complexing agent adopted in the electroless copper plating solution of the three-coordination system is prepared from potassium sodium tartrate, ethylenediamine tetraacetic acid (EDTA) and citric acid. Before electroless copper plating, the electroless copper plating solution is prepared into solution A 'and solution B', wherein the solution A 'is formed by mixing copper sulfate and a complexing agent, and the solution B' is prepared from formaldehyde reducing solution. In electroless copper plating, after mixing the solution A 'and the solution B', the fiber board 1 having the surface active catalyst is put into the mixed solution to be subjected to electroless copper plating.
After that, the fiber board 1 after electroless copper plating is placed in an electroplating solution for electroplating, so that the plurality of first pores 12 in the fiber board 1 are all filled with metal powder (the metal powder in this embodiment is copper powder, but may be other metal powder in other embodiments), and the metal powder filled in the plurality of first pores 12 is already connected to each other to form a plurality of metal fibers 22 during electroplating. The fiber board 1 after electroless copper plating is set as a cathode during the plating process, and is placed in a plating solution prepared from a copper sulfate (CuSO 4) solution for the plating process. And the concentration of copper ions and the density of the energizing current in the electroplating solution can be adjusted in the electroplating process, so that the metal fiber 22 has higher porosity and higher tensile strength.
And 3, placing the fiber plate 1 with the metal fibers 22 into a vacuum furnace for high-temperature sintering treatment, wherein the high-temperature sintering temperature is higher than or equal to the melting point of the fiber tissues 11 in the fiber plate 1. So that all of the fibrous structure 11 in the fiberboard 1 is melted by sintering, and the space occupied by the fibrous structure 11 that is sintered away forms a plurality of the second pores 21. The pore size of a part of the second pores 21 is larger than that of another part of the second pores 21 (of course, in other embodiments, the pore sizes of the second pores 21 may be the same, and the distance between two adjacent pores in a part of the second pores 21 is larger than that between two adjacent pores in another part of the second pores 21 (of course, in other embodiments, the distance between any two adjacent pores 21 is equal), when all the fibrous tissues 11 are sintered, the interconnected metal fibers 22 are formed, the interconnected metal fibers 22 are interwoven with each other to form the metal plate 2, the metal plate 2 is a three-dimensional network porous structure, the second pores 21 are located in the metal plate 2, and the shapes of the second pores 21 are different from each other (of course, in other embodiments, the shape of the second pores 21 in a part of the second pores 21 is equal to that of the second pores 21, or the second pores 21 are not equal to each other, and the second pores 21 are sintered, and the shape of the second pores 21 is not equal to each other, and the metal plate 2 is annealed after the second pores 21 has the shape is equal, and the hydrogen gas has the shape of the second pores 21 is annealed.
And 4, mixing fifty grams of sodium hydroxide (NaOH) and twenty grams of potassium persulfate (K2S 2O 4) with one liter of water to serve as an oxidant, and then performing heat treatment on the oxidant to ensure that the temperature of the oxidant is kept at about eighty degrees centigrade. After that, the metal plate 2 is put into the oxidizing agent at eighty degrees celsius, so that the metal plate 2 is blackened, and thus the metal plate 2 has good hydrophilic performance (of course, in other embodiments, the metal plate 2 has good hydrophilic performance by means of hydrogen reduction, potassium peroxide oxidation, microetching, titanium dioxide coating on the surface of the metal plate 2, and the like, wherein 7% hydrogen and 93% nitrogen are selected as candidates for the hydrogen reduction treatment, and then the metal plate 2 is put into a mixed gas for the reduction treatment, so that the metal plate 2 has good hydrophilic performance.
After that, the metal plate 2 having good hydrophilic performance is placed in a punch press, the metal plate 2 is pressed along the thickness direction of the metal plate 2 by a jig B of the punch press (in other implementations, the metal plate 2 may be pressed along the thickness direction of the metal plate 2 by a hydraulic cylinder), and the pressing force applied by the jig B to the metal plate 2 is greater than the yield strength of the metal plate 2, so that the metal plate 2 is plastically deformed. In this way, the thickness of the metal plate 2 becomes gradually thinner along the extrusion direction, and the pore diameters of the plurality of second pores 21 also become gradually smaller. The shape of each of the second apertures 21, which is deformed by pressing, and the size of the deformation thereof are different, but the number of the second apertures 21 in the metal plate 2 is not changed. The length of the second holes 21 is increased along the length and width direction of the metal plate 2, the width of the second holes 21 is widened, and the distance between two adjacent second holes 21 is increased and widened along the length and width direction of the metal plate 2, the length of the metal plate 2 is increased along the length direction of the metal plate 2, and the width of the metal plate 2 is widened along the width direction of the metal plate 2. However, the amount of change in the thickness direction of the metal plate 2 may be larger than the amount of change in the length and width directions. In this way, the porosity of the second pores 21 in the metal plate 2 is increased, so that the working fluid 5 can be rapidly diffused in the metal plate 2, and the temperature equalizing plate a has a good heat dissipation effect. In step 4, the order of the ironing process of the metal plate 2 and the hydrophilic process of the metal plate 2 may be interchanged.
And step 5, providing the upper plate 3 and the lower plate 4. The first groove 31 is concavely formed on the lower surface of the upper plate 3, and the first mounting portion 32 surrounds the first groove 31, the lower surface of the first mounting portion 32 is lower than the first inner surface 311 of the first groove 31, and the lower surface of the first mounting portion 32 is flush with the lower surface of the upper plate 3. A plurality of spaced projections 33 are downwardly projected from the first inner surface 311. Each of the bumps 33 has the abutment surface 331, and the abutment surface 331 is flush with the lower surface of the upper plate 3 (of course, the abutment surface 331 may be lower or higher than the lower surface of the upper plate 3 in other embodiments). The second groove 41 and the second mounting portion 42 surrounding the second groove 41 are recessed downward on the upper surface of the lower plate 4, and the size of the second groove 41 is equal to the size of the first groove 31 (of course, in other embodiments, the size of the second groove 41 may be greater than or less than the size of the first groove 31), and the upper surface of the second mounting portion 42 is flush with the upper surface of the lower plate 4. The metal plate 2 is placed in the second recess 41, and the upper surface of the metal plate 2 and the upper surface of the lower plate 4 are flush with each other (of course, in other embodiments, the upper surface of the metal plate 2 may be higher or lower than the upper surface of the lower plate 4).
Step 6, placing the upper plate 3 in a first mold (not shown, the same applies below), and exposing the lower surface of the first mounting portion 32 downward to the first mold. The lower plate 4 is placed in a second mold (not shown, the same applies below), and the upper surface of the second mounting portion 42 is exposed upward to the second mold. After that, the first mold is stacked above the second mold, such that the first groove 31 and the second groove 41 are aligned vertically and are communicated with each other to form the accommodating cavity 8, the lower surface of the first mounting portion 32 and the upper surface of the second mounting portion 42 abut against each other, and the abutting surface 331 of the protruding block 33 and the upper surface of the metal plate 2 abut against each other. After that, the first mold and the second mold stacked on each other are placed into a vacuum furnace to perform high-temperature press-fit, so that the first mounting portion 32 and the second mounting portion 42 are press-fit and sealed with each other, and an opening 7 is reserved in the press-fit process, so that the accommodating cavity 8 can be communicated with the outside through the opening 7.
And 7, pouring the working fluid 5 into the accommodating cavity 8 through the opening 7, wherein part of the working fluid 5 permeates into the metal plate 2, the gap 6 is further arranged between the upper surface of the working fluid 5 and the first inner surface 311, the gap 6 enables the working fluid 5 to be heated and evaporated into a gaseous state, and when the gaseous working fluid 5 is cooled, the gaseous working fluid 5 is condensed into liquid to be attached to the first inner surface 311. After that, the air in the accommodating chamber 8 is completely pumped out through the opening 7, so that the accommodating chamber 8 is vacuum.
And 8, sealing the opening 7 by welding, so that the metal plate 2 and the working fluid 5 are sealed in the accommodating cavity 8, and the metal plate 2, the working fluid 5, the upper plate 3 and the lower plate 4 jointly form a temperature equalizing plate A.
In summary, the manufacturing method of the temperature equalizing plate A has the following beneficial effects:
(1) The fiberboard 1 formed of fibrous tissue 11 has a plurality of the first apertures 12. First placing the metal powder in a plurality of the first apertures 12; the fiber board 1 with the metal powder is then sintered at a high temperature, so that all the fiber tissues 11 in the fiber board 1 are removed, and the space occupied by the sintered fiber tissues 11 forms a second pore 21, the metal powder forms the metal board 2, and the second pore 21 is located in the metal board 2. In this way, only the fibrous structure 11 needs to be completely sintered, the space occupied by the fibrous structure 11 forms the second pores 21, and the second pores 21 are located in the metal plate 2. Moreover, since the number and size of the fibrous structures 11 are already determined at the time of forming the fiberboard 1, the size of the space occupied by the fibrous structures 11 that are sintered away is also determined. Therefore, the number of the second voids 21 formed in the metal plate 2 and the size of the second voids 21 do not change with the change of the sintering temperature. In this way, the working fluid 5 in a liquid state can be stably diffused in the metal plate 2 having the second pores 21, so that the temperature equalizing plate a has good heat dissipation performance. And thereafter, the metal plate 2 having the second apertures 21 is subjected to a ironing process, and the aperture diameter of the second apertures 21 in the metal plate 2 is reduced during ironing, and the distance between two adjacent second apertures 21 is also reduced along the ironing direction. In this way, the pore density of the second pores 21 in the metal plate 2 is increased. This accelerates the diffusion speed of the liquid working fluid 5 in the metal plate 2, so that the liquid working fluid 5 can be uniformly distributed in the metal plate 2, thereby improving the heat dissipation performance of the temperature equalizing plate a.
(2) In the process of pressing the metal plate 2, the pressing force acting on the metal plate 2 is larger than the yield strength of the metal plate 2, and the thickness of the metal plate 2 is gradually thinned along the pressing direction, the pore diameters of the plurality of second pores 21 are gradually reduced, and the number of the plurality of second pores 21 is unchanged. This prevents the occurrence of a situation in which the pressing force acting on the metal plate 2 is excessively large, which results in breakage of the metal plate 2, and the pressing force is larger than the yield strength of the metal plate 2, which makes it possible to cause plastic deformation of the metal plate 2, which is irreversible, and when the pressing force acting on the metal plate 2 disappears, the metal plate 2 does not rebound back to the thickness of the metal plate 2 before uncompressed, which makes it possible to cause the metal plate 2 to have a high porosity, thereby enabling the working fluid 5 to rapidly diffuse within the metal plate 2.
(3) The bump 33 abuts against the metal plate 2, so that the plate material at the position of the upper plate 3 corresponding to the first groove 31 and the plate material at the position of the lower plate 4 corresponding to the second groove 41 are not bent upwards or downwards due to the air pressure difference between the air pressure in the accommodating cavity 8 and the external atmospheric pressure.
(4) The upper plate 3 and the lower plate 4 are placed in a vacuum furnace for high-temperature sealing, and due to the small size of the temperature equalizing plate a, if sealing is performed between the upper plate 3 and the lower plate 4 by welding, the sealing between the upper plate 3 and the lower plate 4 may be unstable. High temperature lamination is required to enable stable sealing between the upper plate 3 and the lower plate 4, but due to the high temperature during high temperature lamination, some substances in the upper plate 3 and the lower plate 4 are liable to react with air at high temperature, thereby affecting the service lives of the upper plate 3 and the lower plate 4. Therefore, the upper plate 3 and the lower plate 4 are placed in a vacuum furnace for high-temperature sealing, so that substances of the upper plate 3 and the lower plate 4 are prevented from easily reacting with air at high temperature, the service lives of the upper plate 3 and the lower plate 4 are prolonged, and the temperature equalizing plate A has good heat dissipation performance.
(5) The gap 6 is provided between the working fluid 5 and the upper surface of the accommodating cavity 8, the gap 6 may enable the working fluid 5 to be heated and evaporated into a gaseous state, and when the gaseous working fluid 5 is cooled, the gaseous working fluid is condensed into a liquid state and adheres to the first inner surface 311, so that the working fluid 5 can be recycled and reused, and the temperature equalizing plate a has a good heat dissipation function.
The above detailed description is merely illustrative of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, therefore, all changes that may be made in the equivalent technology using the present specification and illustrations are intended to be included in the scope of the invention.
Claims (9)
1. The manufacturing method of the temperature equalization plate is characterized by comprising the following steps of:
step 1, a fiber board formed by fiber tissue, wherein a plurality of first pores are formed on the fiber board;
before the step 2 after the step 1, firstly performing activation treatment on the fiber board to enable the surface of the fiber board to have catalytic activity;
step 2, placing metal powder in a plurality of first pores, specifically: firstly, carrying out chemical plating treatment on the fiber board with catalytic activity on the surface so that the fiber tissue and the metal powder are tightly combined, and then, placing the fiber board plated with the metal powder into electroplating solution for electroplating so that the metal powder is completely electroplated in the first pores;
step 3, sintering the fiber board with the metal powder at a high temperature, removing all fiber tissues in the fiber board, wherein the metal powder after high-temperature sintering forms a metal board, and the space occupied by the sintered fiber tissues forms a second pore, and the second pore is positioned in the metal board;
step 4, firstly carrying out hydrophilic treatment on the metal plate, and then carrying out thinning treatment on the metal plate to reduce the aperture of the second pore; or firstly, thinning the metal plate, reducing the aperture of the second pore, and then, carrying out hydrophilic treatment on the metal plate;
step 5, providing an upper plate and a lower plate, wherein a containing cavity is formed between the upper plate and the lower plate, and the metal plate is placed in the containing cavity;
step 6, correspondingly matching the upper plate with the lower plate, and reserving an opening to enable the accommodating cavity to be communicated with the outside through the opening;
step 7, filling the working fluid into the accommodating cavity through the opening, and enabling at least part of the working fluid to permeate into the second pores of the metal plate;
and 8, sealing the upper plate, the lower plate and the opening, so that the metal plate and the working fluid are sealed in the accommodating cavity, and the metal plate, the working fluid, the upper plate and the lower plate jointly form the temperature equalizing plate.
2. The method for manufacturing the temperature equalization plate according to claim 1, wherein: in step 3, the second pores are a plurality of, the second pores are communicated with each other, and at least two second pores with unequal pore diameters are arranged in the second pores.
3. The method for manufacturing the temperature equalization plate according to claim 2, wherein: in step 4, during the process of extruding the metal plate, the extrusion force acting on the metal plate is larger than the yield strength of the metal plate, the thickness of the metal plate is gradually thinned along the extrusion direction, the pore diameters of the plurality of second pores are gradually reduced, and the number of the plurality of second pores is unchanged.
4. The method for manufacturing the temperature equalization plate according to claim 2, wherein: in step 2, the metal powder fills up a plurality of the first voids, and in step 4, the distance between two adjacent second voids in the extrusion direction is gradually reduced during the extrusion of the metal plate.
5. The method for manufacturing the temperature equalization plate according to claim 2, wherein: in step 4, during the process of pressing the metal plate, the distance between two adjacent second apertures is gradually increased along the direction perpendicular to the pressing direction, and the length and width of the metal plate are also gradually increased.
6. The method for manufacturing the temperature equalization plate according to claim 1, wherein: in step 4, fifty g of sodium hydroxide (NaOH) and twenty g of potassium persulfate (K) are selected for the hydrophilic treatment of the metal plate 2 S 2 O 4 ) Mixing with one liter of water as an oxidizing agent, after which the oxidizing agent is heated to eighty degrees celsius, after which the metal sheet is put into the oxidizing agent at eighty degrees celsius, so that the metal sheet is blackened.
7. The method for manufacturing the temperature equalization plate according to claim 1, wherein: in step 5, a first groove is concavely formed on the lower surface of the upper plate, a plurality of protruding blocks are protruded downwards from the first inner surface of the first groove and are arranged at intervals, and in step 6, the protruding blocks are abutted against the metal plate.
8. The method for manufacturing the temperature equalization plate according to claim 1, wherein: in step 6, the upper plate is set in one mold, the lower plate is set in another mold, the molds with the upper plate are stacked above the molds with the lower plate, and after that, the two molds are placed in a high-temperature vacuum furnace for high-temperature press fit, so that the upper plate and the lower plate are sealed.
9. The method for manufacturing the temperature equalization plate according to claim 1, wherein: in step 7, a gap is formed between the working fluid and the upper surface of the accommodating cavity, and after step 7 and before step 8, the accommodating cavity is vacuumized through the opening.
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| EP0744586B1 (en) * | 1993-12-27 | 2004-03-17 | Hitachi Chemical Co., Ltd. | Method of manufacturing a heat transmitting device and a heat transmitting device |
| US5881353A (en) * | 1994-03-31 | 1999-03-09 | Hitachi Chemical Company, Ltd. | Method for producing porous bodies |
| CN100372808C (en) * | 2006-04-18 | 2008-03-05 | 中国建筑材料科学研究院大石桥镁砖厂 | Making process of zirconium-containing magnesia brick |
| CN101354221A (en) * | 2007-07-25 | 2009-01-28 | 贸晖科技股份有限公司 | Temperature equalization plate and capillary structure and method for manufacturing the same |
| CN102189680B (en) * | 2010-03-01 | 2013-05-29 | 王勤文 | Temperature equalization plate and edge sealing method thereof |
| CN102796905B (en) * | 2011-09-29 | 2014-05-07 | 温州智创科技有限公司 | Method for preparing medical porous titanium implant material |
| JP2014220328A (en) * | 2013-05-07 | 2014-11-20 | 住友電気工業株式会社 | Electrode for power storage device, power storage device, and method for manufacturing electrode for power storage device |
| CN108323137A (en) * | 2017-01-18 | 2018-07-24 | 台达电子工业股份有限公司 | Soaking plate |
| CN206556484U (en) * | 2017-01-26 | 2017-10-13 | 广州华钻电子科技有限公司 | A kind of new type superthin soaking plate |
| WO2019082424A1 (en) * | 2017-10-25 | 2019-05-02 | 富山住友電工株式会社 | Fuel cell and method for manufacturing metal porous body |
| CN110010569B (en) * | 2019-05-06 | 2023-11-21 | 扬州大学 | Gradient-scale pore sintering core soaking plate heat exchanger and preparation method thereof |
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