CN111755919B - Rocker type movable socket with double overload prevention functions - Google Patents
Rocker type movable socket with double overload prevention functions Download PDFInfo
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- CN111755919B CN111755919B CN202010769980.7A CN202010769980A CN111755919B CN 111755919 B CN111755919 B CN 111755919B CN 202010769980 A CN202010769980 A CN 202010769980A CN 111755919 B CN111755919 B CN 111755919B
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- 230000006870 function Effects 0.000 title claims abstract description 29
- 230000002265 prevention Effects 0.000 title claims abstract 12
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 190
- 229910052751 metal Inorganic materials 0.000 claims abstract description 79
- 239000002184 metal Substances 0.000 claims abstract description 79
- 235000014676 Phragmites communis Nutrition 0.000 claims abstract description 51
- 238000002360 preparation method Methods 0.000 claims description 60
- 229910045601 alloy Inorganic materials 0.000 claims description 51
- 239000000956 alloy Substances 0.000 claims description 51
- 238000000034 method Methods 0.000 claims description 43
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 30
- 238000005242 forging Methods 0.000 claims description 27
- 230000008569 process Effects 0.000 claims description 26
- 230000006698 induction Effects 0.000 claims description 24
- 238000012549 training Methods 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 15
- 239000012535 impurity Substances 0.000 claims description 15
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 239000002994 raw material Substances 0.000 claims description 15
- 239000010936 titanium Substances 0.000 claims description 15
- 229910052719 titanium Inorganic materials 0.000 claims description 15
- 230000009977 dual effect Effects 0.000 claims description 14
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 10
- 229910001257 Nb alloy Inorganic materials 0.000 claims description 10
- WCERXPKXJMFQNQ-UHFFFAOYSA-N [Ti].[Ni].[Cu] Chemical compound [Ti].[Ni].[Cu] WCERXPKXJMFQNQ-UHFFFAOYSA-N 0.000 claims description 10
- KHOFBPOVUAPBTF-UHFFFAOYSA-N [Ti].[Ni].[Nb] Chemical compound [Ti].[Ni].[Nb] KHOFBPOVUAPBTF-UHFFFAOYSA-N 0.000 claims description 10
- 229910001000 nickel titanium Inorganic materials 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 5
- 229910052758 niobium Inorganic materials 0.000 claims description 5
- 239000010955 niobium Substances 0.000 claims description 5
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 5
- 238000004804 winding Methods 0.000 claims description 2
- 238000003723 Smelting Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000005096 rolling process Methods 0.000 claims 3
- 238000005520 cutting process Methods 0.000 claims 1
- 230000004044 response Effects 0.000 abstract description 4
- 230000003068 static effect Effects 0.000 description 23
- 238000002844 melting Methods 0.000 description 21
- 230000008018 melting Effects 0.000 description 21
- 238000005485 electric heating Methods 0.000 description 14
- 229910000734 martensite Inorganic materials 0.000 description 7
- 238000002474 experimental method Methods 0.000 description 6
- 229910001566 austenite Inorganic materials 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000004026 adhesive bonding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 230000009466 transformation Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000013021 overheating Methods 0.000 description 3
- 239000005457 ice water Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 230000004936 stimulating effect Effects 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/70—Structural association with built-in electrical component with built-in switch
- H01R13/713—Structural association with built-in electrical component with built-in switch the switch being a safety switch
- H01R13/7137—Structural association with built-in electrical component with built-in switch the switch being a safety switch with thermal interrupter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/006—Thermally-actuated switches with different switches operated at substantially different temperatures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/32—Thermally-sensitive members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/70—Structural association with built-in electrical component with built-in switch
- H01R13/71—Contact members of coupling parts operating as switch, e.g. linear or rotational movement required after mechanical engagement of coupling part to establish electrical connection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Thermally Actuated Switches (AREA)
Abstract
Description
技术领域Technical Field
本发明属于电气元件领域，具体是一种具有双重防过载功能的翘板式移动插座。The invention belongs to the field of electrical components, in particular to a seesaw type mobile socket with a double overload protection function.
背景技术Background technique
随着家用电器的日渐增加，家庭用移动插座的电流负载越来越大。电流过大、电线短路、电器过热等均会引发电气火灾，为避免电气火灾的发生，防过载移动插座的使用得到广泛普及。With the increasing number of household appliances, the current load of household mobile sockets is getting larger and larger. Excessive current, short circuit of wires, overheating of appliances, etc. can all cause electrical fires. In order to avoid electrical fires, the use of overload-proof mobile sockets has become widely popular.
现有市售防过载移动插座多通过设置过载保护器来实现防过载的功能，但在发生单个插孔的电路过载时，无法实现断电保护，无法完全消除引发电气火灾的风险。专利CN109524857A公开了一种自动断电的防过热插座，通过设置导电柱和绝缘层，当插座发热情况较严重时，会使水银发生膨胀，从而使电路断开，起到过温保护的作用。但该发明结构复杂，且用到对人体有害的水银，不利于推广使用。基于此，有必要设计一种温度响应快、控温精度高、结构简单、可防护单个插孔的防过载移动插座，以解决现有防过载插座无法防护单个插孔、结构复杂难以推广的问题。Most of the existing commercially available anti-overload mobile sockets achieve the anti-overload function by setting an overload protector. However, when the circuit of a single socket is overloaded, power-off protection cannot be achieved, and the risk of causing an electrical fire cannot be completely eliminated. Patent CN109524857A discloses an anti-overheating socket with automatic power-off. By setting a conductive column and an insulating layer, when the socket is seriously heated, the mercury will expand, thereby disconnecting the circuit and playing a role in over-temperature protection. However, the invention has a complex structure and uses mercury that is harmful to the human body, which is not conducive to promotion and use. Based on this, it is necessary to design an anti-overload mobile socket with fast temperature response, high temperature control accuracy, simple structure, and protection of a single socket, so as to solve the problem that the existing anti-overload socket cannot protect a single socket and has a complex structure and is difficult to promote.
发明内容Summary of the invention
本发明为了解决现有防过载移动插座无法防护单个插孔、结构复杂难以推广的问题，提供了一种具有双重防过载功能的翘板式移动插座。In order to solve the problem that the existing anti-overload mobile socket cannot protect a single socket and has a complex structure and is difficult to promote, the present invention provides a seesaw type mobile socket with a dual anti-overload function.
本发明是采用如下技术方案实现的：The present invention is achieved by adopting the following technical solutions:
一种具有双重防过载功能的翘板式移动插座，包括插座壳体、供电电路、翘板开关和若干个金属簧片夹；供电电路与各个金属簧片夹均设置于插座壳体的内部；所述金属簧片夹呈Ω形，且其圆弧部的一侧固定连接有与其圆弧面贴合的第一形状记忆合金部件；A seesaw mobile socket with dual overload protection function, comprising a socket housing, a power supply circuit, a seesaw switch and a plurality of metal reed clips; the power supply circuit and each metal reed clip are arranged inside the socket housing; the metal reed clip is Ω-shaped, and one side of the arc portion thereof is fixedly connected with a first shape memory alloy component that fits with the arc surface thereof;
所述翘板开关包括开关壳体、翘板按钮和位于开关壳体内部且呈左高右低倾斜放置的导电翘板触片；开关壳体设置于插座壳体的内部，且其上壁与插座壳体的上壁衔接为一体；翘板按钮为下端面呈圆弧面的T型结构，且其上部贯穿凸设于开关壳体的上壁、中部铰接于开关壳体的上内壁；翘板按钮的下端部滑动接触于导电翘板触片的上表面；导电翘板触片的右端部与开关壳体固定连接；且其下表面左端一体设置有动触点；动触点的正下方设置有一个顶端带有静触点且与开关壳体固定连接的接线片；接线片、静触点、动触点、导电翘板触片依次串联连接于供电电路中；导电翘板触片的下表面与开关壳体的下内壁之间沿竖向设置有第二形状记忆合金部件。The rocker switch comprises a switch housing, a rocker button and a conductive rocker contact piece which is located inside the switch housing and is tilted with the left side higher and the right side lower; the switch housing is arranged inside the socket housing, and its upper wall is connected to the upper wall of the socket housing as a whole; the rocker button is a T-shaped structure with a circular arc surface at the lower end surface, and its upper part penetrates and protrudes on the upper wall of the switch housing, and the middle part is hinged to the upper inner wall of the switch housing; the lower end of the rocker button slides in contact with the upper surface of the conductive rocker contact piece; the right end of the conductive rocker contact piece is fixedly connected to the switch housing; and a moving contact is integrally arranged at the left end of its lower surface; a wiring piece with a static contact at the top and fixedly connected to the switch housing is arranged directly below the moving contact; the wiring piece, the static contact, the moving contact and the conductive rocker contact piece are connected in series in the power supply circuit in sequence; a second shape memory alloy component is vertically arranged between the lower surface of the conductive rocker contact piece and the lower inner wall of the switch housing.
第一形状记忆合金部件与第二形状记忆合金部件均由镍钛合金、镍钛铜合金或镍钛铌合金制成。The first shape memory alloy component and the second shape memory alloy component are both made of nickel-titanium alloy, nickel-titanium-copper alloy or nickel-titanium-niobium alloy.
所述镍钛合金是由如下质量百分比的原料组成的：钛43.93wt%-45.62wt%；不可避免的杂质0.01wt%-0.1wt%；余量为镍。The nickel-titanium alloy is composed of the following raw materials in percentage by mass: 43.93wt%-45.62wt% of titanium; 0.01wt%-0.1wt% of inevitable impurities; and the balance of nickel.
所述镍钛铜合金是由如下质量百分比的原料组成的：钛43.93wt%-45.62wt%；铜0.12wt%-34.88wt%；不可避免的杂质0.01wt%-0.1wt%；余量为镍。The nickel-titanium-copper alloy is composed of the following raw materials in percentage by mass: 43.93wt%-45.62wt% titanium; 0.12wt%-34.88wt% copper; 0.01wt%-0.1wt% inevitable impurities; and the balance is nickel.
所述镍钛铌合金是由如下质量百分比的原料组成的：钛43.93wt%-45.62wt%；铌0.17wt%-30.95wt%；不可避免的杂质0.01wt%-0.1wt%；余量为镍。The nickel-titanium-niobium alloy is composed of the following raw materials in percentage by mass: 43.93wt%-45.62wt% titanium; 0.17wt%-30.95wt% niobium; 0.01wt%-0.1wt% inevitable impurities; and the balance is nickel.
所述第二形状记忆合金部件呈弹簧形、U形、C形、N形或M形。The second shape memory alloy component is in a spring shape, a U shape, a C shape, an N shape or an M shape.
所述金属簧片夹由铜制成；金属簧片夹与第一形状记忆合金部件之间通过低温钎焊、胶接或铆接固定连接。The metal spring clip is made of copper; the metal spring clip is fixedly connected to the first shape memory alloy component by low-temperature brazing, adhesive bonding or riveting.
所述第一形状记忆合金部件的制备方法，是采用如下步骤实现的：The method for preparing the first shape memory alloy component is implemented by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在700℃-1000℃条件下保温0.5h-3h，而后锻造，锻造结束后在700℃-1000℃条件下保温0.5h-2h，然后轧制成直径为6mm-10mm的粗丝；S1: Preparation of thick wire: firstly, an alloy ingot is prepared by vacuum induction melting, and the alloy ingot is kept at 700℃-1000℃ for 0.5h-3h, and then forged. After forging, the alloy ingot is kept at 700℃-1000℃ for 0.5h-2h, and then rolled into a thick wire with a diameter of 6mm-10mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝在600℃-950℃条件下保温5min-30min，而后将该粗丝轧制成厚度为0.2mm-2mm的板材，并将该板材裁切后固定在Ω形模具上以400℃-600℃的条件保温5sec-60sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: the thick wire prepared in step S1 is kept at 600°C-950°C for 5min-30min, and then the thick wire is rolled into a plate with a thickness of 0.2mm-2mm, and the plate is cut and fixed on an Ω-shaped mold and kept at 400°C-600°C for 5sec-60sec, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至400℃-600℃，并在该温度条件下保温1min-60min，然后空冷，由此完成第一形状记忆合金部件的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 400°C-600°C, kept at this temperature for 1 min-60 min, and then air-cooled, thereby completing the preparation of the first shape memory alloy component.
所述弹簧形的第二形状记忆合金部件的制备方法，是采用如下步骤实现的：The preparation method of the spring-shaped second shape memory alloy component is achieved by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在700℃-1000℃条件下保温0.5h-3h，而后锻造，锻造结束后在700℃-1000℃条件下保温0.5h-2h，然后轧制成直径为6mm-10mm的粗丝；S1: Preparation of thick wire: firstly, an alloy ingot is prepared by vacuum induction melting, and the alloy ingot is kept at 700℃-1000℃ for 0.5h-3h, and then forged. After forging, the alloy ingot is kept at 700℃-1000℃ for 0.5h-2h, and then rolled into a thick wire with a diameter of 6mm-10mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝拉丝为直径为0.3mm-1.5mm的细丝，而后将该细丝绕制为弹簧，并将该弹簧加热至400℃-600℃，并在该温度条件保温5sec-60sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: the thick wire prepared in step S1 is drawn into a thin wire with a diameter of 0.3 mm-1.5 mm, and then the thin wire is wound into a spring, and the spring is heated to 400°C-600°C and kept at this temperature for 5 seconds-60 seconds, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至400℃-600℃，并在该温度条件下保温1min-60min，然后空冷、裁切，由此完成弹簧形的第二形状记忆合金部件的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 400°C-600°C, and kept at this temperature for 1min-60min, and then air-cooled and cut, thereby completing the preparation of the spring-shaped second shape memory alloy component.
所述U形、C形、N形或M形的第二形状记忆合金部件的制备方法，是采用如下步骤实现的：The method for preparing the U-shaped, C-shaped, N-shaped or M-shaped second shape memory alloy component is implemented by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在700℃-1000℃条件下保温0.5h-3h，而后锻造，锻造结束后在700℃-1000℃条件下保温0.5h-2h，然后轧制成直径为6mm-10mm的粗丝；S1: Preparation of thick wire: firstly, an alloy ingot is prepared by vacuum induction melting, and the alloy ingot is kept at 700℃-1000℃ for 0.5h-3h, and then forged. After forging, the alloy ingot is kept at 700℃-1000℃ for 0.5h-2h, and then rolled into a thick wire with a diameter of 6mm-10mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝在600℃-950℃条件下保温5min-30min，而后将该粗丝轧制成厚度为0.2mm-2mm的板材，并将该板材裁切后固定在形状对应的模具上以400℃-600℃的条件保温5sec-60sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: the thick wire prepared in step S1 is kept at 600℃-950℃ for 5min-30min, and then the thick wire is rolled into a plate with a thickness of 0.2mm-2mm, and the plate is cut and fixed on a mold corresponding to the shape and kept at 400℃-600℃ for 5sec-60sec, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至400℃-600℃，并在该温度条件下保温1min-60min，然后空冷，由此完成U形、C形、N形或M形的第二形状记忆合金部件的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 400°C-600°C, kept at this temperature for 1min-60min, and then air-cooled, thereby completing the preparation of a second shape memory alloy component in a U shape, a C shape, an N shape or an M shape.
当本移动插座上的单一电器电路过载造成局部导线过热时，金属簧片夹温度升高，第一形状记忆合金部件温度同步升高，激发其由柔软无弹性的马氏体相转变为超弹性的奥氏体相，恢复预设形状使其弧度发生改变，由此带动金属簧片夹发生变形，实现金属簧片夹与插头分离的目的，从而实现单一电器电路过载时的断电。当本移动插座上的电器总功率超过负载造成本移动插座导线过热时，翘板开关的内腔温度随之升高，第二形状记忆合金部件温度同步升高，激发其由柔软无弹性的马氏体相转变为超弹性的奥氏体相，恢复预设形状使其高度增加，使得导电翘板触片向上移动，由此带动静触点与动触点分离，从而实现电器总功率超过负载造成本移动插座导线过热时的断电。当排除电路过载因素后，翘板开关内第二形状记忆合金部件及金属簧片夹上的第一形状记忆合金部件温度降至相变温度之下，由具有超弹性高强度的奥氏体相转变为柔软的马氏体相，本移动插座可恢复正常供电。When a single electrical circuit on the mobile socket is overloaded and causes the local wire to overheat, the temperature of the metal reed clip increases, and the temperature of the first shape memory alloy component increases synchronously, stimulating its transformation from a soft and inelastic martensite phase to a superelastic austenite phase, restoring the preset shape to change its curvature, thereby driving the metal reed clip to deform, achieving the purpose of separating the metal reed clip from the plug, thereby achieving power failure when a single electrical circuit is overloaded. When the total power of the electrical appliances on the mobile socket exceeds the load and causes the wire of the mobile socket to overheat, the inner cavity temperature of the seesaw switch increases accordingly, and the temperature of the second shape memory alloy component increases synchronously, stimulating its transformation from a soft and inelastic martensite phase to a superelastic austenite phase, restoring the preset shape to increase its height, causing the conductive seesaw contact to move upward, thereby driving the static contact and the moving contact to separate, thereby achieving power failure when the total power of the electrical appliances exceeds the load and causes the wire of the mobile socket to overheat. When the circuit overload factor is eliminated, the temperature of the second shape memory alloy component in the rocker switch and the first shape memory alloy component on the metal reed clip drops below the phase transition temperature, and the austenite phase with super elasticity and high strength is transformed into a soft martensite phase, and the mobile socket can resume normal power supply.
本发明结构设计合理可靠，实现了翘板开关断电及插孔断电的双重防过载保护，而且形状记忆合金温度感知精确，动作响应迅速，可靠性高，稳定性高，同时能够实现温度降至安全工作温度之下后可恢复供电的功能，具有结构简单、响应灵敏、安全性高、成本低、适用范围广、易于推广的优点。The structural design of the present invention is reasonable and reliable, and the dual anti-overload protection of the rocker switch power off and the socket power off is realized. The shape memory alloy has accurate temperature perception, rapid action response, high reliability and high stability. At the same time, it can realize the function of restoring power supply after the temperature drops below the safe working temperature. It has the advantages of simple structure, sensitive response, high safety, low cost, wide application range and easy promotion.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1是本发明中翘板开关的结构示意图；FIG1 is a schematic diagram of the structure of a rocker switch in the present invention;
图2是本发明中金属簧片夹的结构示意图；FIG2 is a schematic diagram of the structure of the metal spring clip in the present invention;
图3是本发明实施例1中单一电器电路过载时金属簧片夹自动断开的状态参考图；FIG3 is a reference diagram of a state in which a metal spring clip is automatically disconnected when a single electrical circuit is overloaded in Embodiment 1 of the present invention;
图4是本发明实施例1中电器总功率超过负载时翘板开关自动断开的状态参考图。FIG. 4 is a reference diagram of a state in which the rocker switch is automatically disconnected when the total power of the electrical appliance exceeds the load in Embodiment 1 of the present invention.
图中，1-金属簧片夹，2-第一形状记忆合金部件，3-开关壳体，4-翘板按钮，5-导电翘板触片，6-动触点，7-静触点，8-接线片，9-第二形状记忆合金部件。In the figure, 1-metal spring clip, 2-first shape memory alloy component, 3-switch housing, 4-rocker button, 5-conductive rocker contact piece, 6-moving contact, 7-static contact, 8-connecting piece, 9-second shape memory alloy component.
具体实施方式Detailed ways
实施例1Example 1
一种具有双重防过载功能的翘板式移动插座，包括插座壳体、供电电路、翘板开关和若干个金属簧片夹1；供电电路与各个金属簧片夹1均设置于插座壳体的内部；所述金属簧片夹1呈Ω形，且其圆弧部的一侧固定连接有与其圆弧面贴合的第一形状记忆合金部件2；A seesaw mobile socket with dual overload protection function, comprising a socket housing, a power supply circuit, a seesaw switch and a plurality of metal reed clips 1; the power supply circuit and each metal reed clip 1 are arranged inside the socket housing; the metal reed clip 1 is Ω-shaped, and one side of the arc portion thereof is fixedly connected with a first shape memory alloy component 2 which fits the arc surface thereof;
所述翘板开关包括开关壳体3、翘板按钮4和位于开关壳体3内部且呈左高右低倾斜放置的导电翘板触片5；开关壳体3设置于插座壳体的内部，且其上壁与插座壳体的上壁衔接为一体；翘板按钮4为下端面呈圆弧面的T型结构，且其上部贯穿凸设于开关壳体3的上壁、中部铰接于开关壳体3的上内壁；翘板按钮4的下端部滑动接触于导电翘板触片5的上表面；导电翘板触片5的右端部与开关壳体3固定连接；且其下表面左端一体设置有动触点6；动触点6的正下方设置有一个顶端带有静触点7且与开关壳体3固定连接的接线片8；接线片8、静触点7、动触点6、导电翘板触片5依次串联连接于供电电路中；导电翘板触片5的下表面与开关壳体3的下内壁之间沿竖向设置有第二形状记忆合金部件9。The seesaw switch comprises a switch housing 3, a seesaw button 4 and a conductive seesaw contact piece 5 which is located inside the switch housing 3 and is tilted with the left side higher and the right side lower. The switch housing 3 is arranged inside the socket housing, and its upper wall is connected with the upper wall of the socket housing as a whole. The seesaw button 4 is a T-shaped structure with a circular arc surface at the lower end surface, and its upper part penetrates and protrudes on the upper wall of the switch housing 3, and the middle part is hinged to the upper inner wall of the switch housing 3. The lower end of the seesaw button 4 slides and contacts the upper surface of the conductive seesaw contact piece 5. The right end of the conductive seesaw contact piece 5 is fixedly connected to the switch housing 3; and a moving contact 6 is integrally arranged at the left end of its lower surface. A wiring piece 8 with a static contact 7 at the top and fixedly connected to the switch housing 3 is arranged directly below the moving contact 6. The wiring piece 8, the static contact 7, the moving contact 6 and the conductive seesaw contact piece 5 are connected in series in the power supply circuit in sequence. A second shape memory alloy component 9 is vertically arranged between the lower surface of the conductive seesaw contact piece 5 and the lower inner wall of the switch housing 3.
第一形状记忆合金部件2与第二形状记忆合金部件9均由镍钛合金制成。The first shape memory alloy component 2 and the second shape memory alloy component 9 are both made of nickel-titanium alloy.
所述镍钛合金是由如下质量百分比的原料组成的：钛44.525wt%；不可避免的杂质0. 05wt%；余量为镍。The nickel-titanium alloy is composed of the following raw materials in percentage by mass: 44.525 wt % titanium; 0.05 wt % unavoidable impurities; and the balance nickel.
所述第二形状记忆合金部件9呈弹簧形。The second shape memory alloy component 9 is in a spring shape.
所述金属簧片夹1由铜制成；金属簧片夹1与第一形状记忆合金部件2之间通过高强度瞬干胶胶接固定连接。The metal reed clip 1 is made of copper; the metal reed clip 1 and the first shape memory alloy component 2 are fixedly connected by gluing with high-strength instant adhesive.
所述第一形状记忆合金部件2的制备方法，是采用如下步骤实现的：The preparation method of the first shape memory alloy component 2 is achieved by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在800℃条件下保温2h，而后锻造为直径为60mm的圆棒，锻造结束后在800℃条件下保温1h，然后轧制成直径为6mm的粗丝；S1: Preparation of thick wire: First, an alloy ingot was prepared by vacuum induction melting, and the alloy ingot was kept at 800°C for 2 hours, and then forged into a round bar with a diameter of 60 mm. After forging, it was kept at 800°C for 1 hour, and then rolled into a thick wire with a diameter of 6 mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝截取1m放入800℃的高温热处理炉中保温30min，而后将该粗丝轧制成厚度为1.5mm的板材，并将该板材裁切成两个长12mm、宽5mm的小片固定在Ω形模具上，将固定好的组件放入540℃的热处理炉内保温15sec，然后取出立即投入冰水混合物中快速冷却以固定形状；S2: Shape memory alloy forming process: Cut 1m of the thick wire prepared in step S1 into a high-temperature heat treatment furnace at 800°C and keep it warm for 30 minutes, then roll the thick wire into a plate with a thickness of 1.5mm, and cut the plate into two small pieces with a length of 12mm and a width of 5mm and fix them on an Ω-shaped mold, put the fixed components into a heat treatment furnace at 540°C and keep it warm for 15 seconds, then take it out and immediately put it into an ice-water mixture for rapid cooling to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至460℃，并在该温度条件下保温30min，然后空冷，由此完成第一形状记忆合金部件2的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 460° C., kept at this temperature for 30 minutes, and then air-cooled, thereby completing the preparation of the first shape memory alloy component 2 .
第一形状记忆合金部件2的性能检测：将第一形状记忆合金部件2使用差示扫描量热仪进行检测，检测结果显示其奥氏体相转变结束温度Af点为55℃；将第一形状记忆合金部件2使用带有环境温度箱的万能拉伸试验机进行检测，检测结果表明第一形状记忆合金部件2由室温升温至60℃时的形变输出力为35N。Performance test of the first shape memory alloy component 2: The first shape memory alloy component 2 was tested using a differential scanning calorimeter, and the test results showed that its austenite phase transformation end temperature A f point was 55°C; the first shape memory alloy component 2 was tested using a universal tensile testing machine with an ambient temperature box, and the test results showed that the deformation output force of the first shape memory alloy component 2 when the temperature was raised from room temperature to 60°C was 35N.
所述弹簧形的第二形状记忆合金部件9的制备方法，是采用如下步骤实现的：The preparation method of the spring-shaped second shape memory alloy component 9 is implemented by the following steps:
S1：粗丝的制备：先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在800℃条件下保温2h，而后锻造为直径为60mm的圆棒，锻造结束后在800℃条件下保温1h，然后轧制成直径为6mm的粗丝；S1: Preparation of thick wire: firstly, an alloy ingot was prepared by vacuum induction melting, and the alloy ingot was kept at 800°C for 2h, and then forged into a round bar with a diameter of 60mm. After forging, the ingot was kept at 800°C for 1h, and then rolled into a thick wire with a diameter of 6mm.
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝截取20m经拉丝为直径为1.0mm的细丝，而后将该细丝经绕簧机绕制为外径为8mm、节距为2mm的弹簧，并将该弹簧放入540℃的热处理炉中保温15sec，然后取出立即投入冰水混合物中快速冷却以固定形状；S2: Forming process of shape memory alloy: 20m of the thick wire prepared in step S1 is cut into thin wires with a diameter of 1.0mm by wire drawing, and then the thin wire is wound into a spring with an outer diameter of 8mm and a pitch of 2mm by a spring winding machine, and the spring is placed in a heat treatment furnace at 540℃ for 15 seconds, and then taken out and immediately put into an ice-water mixture for rapid cooling to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至460℃，并在该温度条件下保温30min，然后空冷，在60℃环境下裁切至12mm，由此完成弹簧形的第二形状记忆合金部件9的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 460°C and kept at this temperature for 30 minutes, then air-cooled and cut to 12 mm at 60°C, thereby completing the preparation of the spring-shaped second shape memory alloy component 9.
第二形状记忆合金部件9的性能检测：将第二形状记忆合金部件9使用差示扫描量热仪进行检测，检测结果显示其奥氏体相转变结束温度Af点为56℃；将第二形状记忆合金部件9使用带有环境温度箱的万能拉伸试验机进行检测，检测结果表明第二形状记忆合金部件9由室温升温至60℃时的形变输出力为14N。Performance test of the second shape memory alloy component 9: The second shape memory alloy component 9 was tested using a differential scanning calorimeter, and the test results showed that its austenite phase transformation end temperature Af point was 56°C; the second shape memory alloy component 9 was tested using a universal tensile testing machine with an ambient temperature box, and the test results showed that the deformation output force of the second shape memory alloy component 9 when the temperature was raised from room temperature to 60°C was 14N.
所述开关壳体3的高为8mm、宽为10mm、长为15mm，经检测，将导电翘板触片5的动触点6与接线片8的静触点7分离所需力为10N；将金属簧片夹1的夹口张开所需力为20N；上述过程制备的第一形状记忆合金部件2与第二形状记忆合金部件9能够满足本实施例的设计要求。The switch housing 3 is 8 mm in height, 10 mm in width and 15 mm in length. After testing, the force required to separate the moving contact 6 of the conductive seesaw contact piece 5 from the static contact 7 of the terminal piece 8 is 10 N; the force required to open the clamping jaws of the metal spring clip 1 is 20 N; the first shape memory alloy component 2 and the second shape memory alloy component 9 prepared by the above process can meet the design requirements of this embodiment.
防过载功能验证实验一：Anti-overload function verification experiment 1:
将本移动插座配以额定电流为16A的RVV导线，电压为220V，可承载总功率为3520W，安全工作温度设定为不高于60℃（该温度根据符合国标要求的RVV聚氯乙烯绝缘聚氯乙烯护套软电缆使用温度范围制定，市售RVV电缆推荐安全使用温度范围为-30℃~70℃）；将本移动插座上接入一台额定功率为3000W的电加热炉，该电加热炉所配导线为额定电流为10A的RVV导线；实验过程中采用无接触红外测温仪监测本移动插座及导线温度。The mobile socket is equipped with an RVV wire with a rated current of 16A, a voltage of 220V, a total power carrying capacity of 3520W, and a safe working temperature set to no higher than 60°C (this temperature is determined according to the use temperature range of RVV polyvinyl chloride insulated polyvinyl chloride sheathed flexible cables that meet national standards. The recommended safe use temperature range of commercially available RVV cables is -30°C~70°C); the mobile socket is connected to an electric heating furnace with a rated power of 3000W, and the wire equipped with the electric heating furnace is an RVV wire with a rated current of 10A; during the experiment, a non-contact infrared thermometer is used to monitor the temperature of the mobile socket and the wire.
如图1所示，按下翘板按钮4，电路接通，电加热炉开始加热；此时第二形状记忆合金部件9处于马氏体相，与导电翘板触片5无接触，第一形状记忆合金部件2处于马氏体相，金属簧片夹1与插头紧密接触。通电4min后测量本移动插座导线温度为32℃，翘板开关温度33℃，电加热炉导线温度为49℃，插孔金属簧片夹1温度45℃。通电6min后金属簧片夹1自动张开与插头分离如图3所示，同时电加热炉停止工作，此时测量金属簧片夹1温度为57℃，电加热炉导线温度66℃，本移动插座导线温度34℃，翘板开关温度35℃。由于翘板开关温度未达到安全工作温度上限，因此翘板开关未自动断开。As shown in Figure 1, the seesaw button 4 is pressed, the circuit is connected, and the electric heating furnace starts to heat; at this time, the second shape memory alloy component 9 is in the martensite phase and has no contact with the conductive seesaw contact 5, the first shape memory alloy component 2 is in the martensite phase, and the metal reed clip 1 is in close contact with the plug. After 4 minutes of power-on, the temperature of the mobile socket wire is measured to be 32°C, the temperature of the seesaw switch is 33°C, the temperature of the electric heating furnace wire is 49°C, and the temperature of the jack metal reed clip 1 is 45°C. After 6 minutes of power-on, the metal reed clip 1 automatically opens and separates from the plug as shown in Figure 3, and the electric heating furnace stops working. At this time, the temperature of the metal reed clip 1 is measured to be 57°C, the temperature of the electric heating furnace wire is 66°C, the temperature of the mobile socket wire is 34°C, and the temperature of the seesaw switch is 35°C. Since the temperature of the seesaw switch does not reach the upper limit of the safe operating temperature, the seesaw switch does not automatically disconnect.
该实验代表了单一电器电路过载造成局部导线过热的情况，该条件下电器所接插孔金属簧片夹1先达到安全工作温度上限，自动断电，避免了电路的持续过载。将电加热炉移除后10min后本移动插座翘板开关及金属簧片夹1恢复至室温，本移动插座恢复供电功能。This experiment represents the situation where a single electrical circuit is overloaded and causes local wire overheating. Under this condition, the metal spring clip 1 of the socket connected to the electrical appliance first reaches the upper limit of the safe working temperature and automatically cuts off the power, avoiding continuous overload of the circuit. After the electric heating furnace is removed, the rocker switch and the metal spring clip 1 of the mobile socket return to room temperature 10 minutes later, and the mobile socket resumes power supply function.
防过载功能验证实验二：Anti-overload function verification experiment 2:
将本移动插座配以额定电流为10A的RVV导线，电压为220V，可承载总功率为2200W，安全工作温度设定为不高于60℃（该温度根据符合国标要求的RVV聚氯乙烯绝缘聚氯乙烯护套软电缆使用温度范围制定，市售RVV电缆推荐安全使用温度范围为-30℃~70℃）；将本移动插座上接入三台额定功率为1000W的电加热炉，该电加热炉所配导线为额定电流为10A的RVV导线；实验过程中采用无接触红外测温仪监测本移动插座及导线温度。The mobile socket is equipped with an RVV wire with a rated current of 10A, a voltage of 220V, a total power carrying capacity of 2200W, and a safe working temperature set to no higher than 60°C (this temperature is determined according to the use temperature range of RVV polyvinyl chloride insulated and polyvinyl chloride sheathed flexible cables that meet national standards. The recommended safe use temperature range of commercially available RVV cables is -30°C~70°C); three electric heating furnaces with a rated power of 1000W are connected to the mobile socket, and the wires equipped with the electric heating furnaces are RVV wires with a rated current of 10A; a non-contact infrared thermometer is used to monitor the temperature of the mobile socket and the wires during the experiment.
如图1所示，按下翘板按钮4，电路接通，三台电加热炉开始加热；此时第二形状记忆合金部件9处于马氏体相，与导电翘板触片5无接触，第一形状记忆合金部件2处于马氏体相，金属簧片夹1与插头紧密接触。通电4min后测量本移动插座导线温度为46℃，翘板开关温度48℃，三台电加热炉导线温度分别为31℃、32℃、30℃，插孔金属簧片夹1温度34℃。通电8min后翘板开关自动向另一方向压下，如图4所示，动触点6与静触点8分离，电路断开，本移动插座及电加热炉均停止工作，此时测量本移动插座导线温度为69℃，翘板开关温度61℃，3台电加热炉导线温度分别为32℃、33℃、31℃，插孔金属簧片夹1温度为36℃。由于金属簧片夹1温度未达到安全工作温度上限，因此金属簧片夹1未自动张开。As shown in Figure 1, press the seesaw button 4, the circuit is connected, and the three electric heating furnaces start heating; at this time, the second shape memory alloy component 9 is in the martensite phase, and has no contact with the conductive seesaw contact 5, the first shape memory alloy component 2 is in the martensite phase, and the metal spring clip 1 is in close contact with the plug. After 4 minutes of power-on, the temperature of the mobile socket wire is measured to be 46°C, the temperature of the seesaw switch is 48°C, the temperatures of the wires of the three electric heating furnaces are 31°C, 32°C, and 30°C, respectively, and the temperature of the jack metal spring clip 1 is 34°C. After 8 minutes of power-on, the seesaw switch automatically presses in the other direction, as shown in Figure 4, the moving contact 6 is separated from the static contact 8, the circuit is disconnected, and the mobile socket and the electric heating furnace stop working. At this time, the temperature of the mobile socket wire is measured to be 69°C, the temperature of the seesaw switch is 61°C, the temperatures of the wires of the three electric heating furnaces are 32°C, 33°C, and 31°C, respectively, and the temperature of the jack metal spring clip 1 is 36°C. Since the temperature of the metal reed clamp 1 does not reach the upper limit of the safe working temperature, the metal reed clamp 1 does not open automatically.
该实验代表了本移动插座上电器总功率超过负载造成本移动插座导线过热的情况，该情况下各分电器未发生单独过载，但是由于总功率过大造成本移动插座整体过载，本移动插座导线及翘板开关温度迅速上升，当达到安全工作温度时翘板开关自动断电，避免了导线温度的持续升高，从而对电路及电器起到了防过载保护作用。将电加热炉移除后10min后本移动插座翘板开关及金属簧片夹1恢复至室温，本移动插座恢复供电功能。This experiment represents the situation where the total power of the electrical appliances on the mobile socket exceeds the load, causing the mobile socket wire to overheat. In this case, each distributor is not overloaded individually, but the mobile socket is overloaded as a whole due to the excessive total power. The temperature of the mobile socket wire and the rocker switch rises rapidly. When the safe working temperature is reached, the rocker switch automatically cuts off the power, avoiding the continuous increase in the wire temperature, thereby playing an anti-overload protection role for the circuit and electrical appliances. After the electric heating furnace is removed, the mobile socket rocker switch and the metal reed clip 1 return to room temperature 10 minutes later, and the mobile socket resumes power supply function.
实施例2Example 2
一种具有双重防过载功能的翘板式移动插座，包括插座壳体、供电电路、翘板开关和若干个金属簧片夹1；供电电路与各个金属簧片夹1均设置于插座壳体的内部；所述金属簧片夹1呈Ω形，且其圆弧部的一侧固定连接有与其圆弧面贴合的第一形状记忆合金部件2；A seesaw mobile socket with dual overload protection function, comprising a socket housing, a power supply circuit, a seesaw switch and a plurality of metal reed clips 1; the power supply circuit and each metal reed clip 1 are arranged inside the socket housing; the metal reed clip 1 is Ω-shaped, and one side of the arc portion thereof is fixedly connected with a first shape memory alloy component 2 which fits the arc surface thereof;
所述翘板开关包括开关壳体3、翘板按钮4和位于开关壳体3内部且呈左高右低倾斜放置的导电翘板触片5；开关壳体3设置于插座壳体的内部，且其上壁与插座壳体的上壁衔接为一体；翘板按钮4为下端面呈圆弧面的T型结构，且其上部贯穿凸设于开关壳体3的上壁、中部铰接于开关壳体3的上内壁；翘板按钮4的下端部滑动接触于导电翘板触片5的上表面；导电翘板触片5的右端部与开关壳体3固定连接；且其下表面左端一体设置有动触点6；动触点6的正下方设置有一个顶端带有静触点7且与开关壳体3固定连接的接线片8；接线片8、静触点7、动触点6、导电翘板触片5依次串联连接于供电电路中；导电翘板触片5的下表面与开关壳体3的下内壁之间沿竖向设置有第二形状记忆合金部件9。The seesaw switch comprises a switch housing 3, a seesaw button 4 and a conductive seesaw contact piece 5 which is located inside the switch housing 3 and is tilted with the left side higher and the right side lower. The switch housing 3 is arranged inside the socket housing, and its upper wall is connected with the upper wall of the socket housing as a whole. The seesaw button 4 is a T-shaped structure with a circular arc surface at the lower end surface, and its upper part penetrates and protrudes on the upper wall of the switch housing 3, and the middle part is hinged to the upper inner wall of the switch housing 3. The lower end of the seesaw button 4 slides and contacts the upper surface of the conductive seesaw contact piece 5. The right end of the conductive seesaw contact piece 5 is fixedly connected to the switch housing 3; and a moving contact 6 is integrally arranged at the left end of its lower surface. A wiring piece 8 with a static contact 7 at the top and fixedly connected to the switch housing 3 is arranged directly below the moving contact 6. The wiring piece 8, the static contact 7, the moving contact 6 and the conductive seesaw contact piece 5 are connected in series in the power supply circuit in sequence. A second shape memory alloy component 9 is vertically arranged between the lower surface of the conductive seesaw contact piece 5 and the lower inner wall of the switch housing 3.
第一形状记忆合金部件2与第二形状记忆合金部件9均由镍钛合金制成。The first shape memory alloy component 2 and the second shape memory alloy component 9 are both made of nickel-titanium alloy.
所述镍钛合金是由如下质量百分比的原料组成的：钛43.93wt%；不可避免的杂质0.1wt%；余量为镍。The nickel-titanium alloy is composed of the following raw materials in percentage by mass: 43.93 wt % titanium; 0.1 wt % unavoidable impurities; and the balance nickel.
所述第二形状记忆合金部件9呈U形。The second shape memory alloy component 9 is U-shaped.
所述金属簧片夹1由铜制成；金属簧片夹1与第一形状记忆合金部件2之间通过低温钎焊固定连接。The metal spring clip 1 is made of copper; the metal spring clip 1 and the first shape memory alloy component 2 are fixedly connected by low temperature brazing.
所述第一形状记忆合金部件2的制备方法，是采用如下步骤实现的：The preparation method of the first shape memory alloy component 2 is achieved by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在700℃条件下保温0.5h，而后锻造，锻造结束后在900℃条件下保温0.5h，然后轧制成直径为7mm的粗丝；S1: Preparation of thick wire: firstly, an alloy ingot is prepared by vacuum induction melting, and the alloy ingot is kept at 700°C for 0.5h, and then forged. After forging, the ingot is kept at 900°C for 0.5h, and then rolled into a thick wire with a diameter of 7mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝在650℃条件下保温5min，而后将该粗丝轧制成厚度为1.0mm的板材，并将该板材裁切后固定在Ω形模具上以500℃的条件保温60sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: the thick wire prepared in step S1 is kept at 650°C for 5 minutes, and then the thick wire is rolled into a plate with a thickness of 1.0 mm, and the plate is cut and fixed on an Ω-shaped mold and kept at 500°C for 60 seconds, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至420℃，并在该温度条件下保温5min，然后空冷，由此完成第一形状记忆合金部件2的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 420° C., kept at this temperature for 5 minutes, and then air-cooled, thereby completing the preparation of the first shape memory alloy component 2 .
所述U形的第二形状记忆合金部件9的制备方法，是采用如下步骤实现的：The method for preparing the U-shaped second shape memory alloy component 9 is implemented by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在1000℃条件下保温1.8h，而后锻造，锻造结束后在700℃条件下保温1.0h，然后轧制成直径为10mm的粗丝；S1: Preparation of thick wire: firstly, an alloy ingot is prepared by vacuum induction melting, and the alloy ingot is kept at 1000°C for 1.8 hours, and then forged. After forging, the ingot is kept at 700°C for 1.0 hour, and then rolled into a thick wire with a diameter of 10 mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝在950℃条件下保温5min，而后将该粗丝轧制成厚度为1.0mm的板材，并将该板材裁切后固定在形状对应的模具上以400℃的条件保温30sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: the thick wire prepared in step S1 is kept at 950°C for 5 minutes, and then the thick wire is rolled into a plate with a thickness of 1.0 mm, and the plate is cut and fixed on a mold of corresponding shape and kept at 400°C for 30 seconds, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至400℃，并在该温度条件下保温28min，然后空冷，由此完成U形的第二形状记忆合金部件9的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 400° C., kept at this temperature for 28 minutes, and then air-cooled, thereby completing the preparation of the U-shaped second shape memory alloy component 9 .
实施例3Example 3
一种具有双重防过载功能的翘板式移动插座，包括插座壳体、供电电路、翘板开关和若干个金属簧片夹1；供电电路与各个金属簧片夹1均设置于插座壳体的内部；所述金属簧片夹1呈Ω形，且其圆弧部的一侧固定连接有与其圆弧面贴合的第一形状记忆合金部件2；A seesaw mobile socket with dual overload protection function, comprising a socket housing, a power supply circuit, a seesaw switch and a plurality of metal reed clips 1; the power supply circuit and each metal reed clip 1 are arranged inside the socket housing; the metal reed clip 1 is Ω-shaped, and one side of the arc portion thereof is fixedly connected with a first shape memory alloy component 2 which fits the arc surface thereof;
所述翘板开关包括开关壳体3、翘板按钮4和位于开关壳体3内部且呈左高右低倾斜放置的导电翘板触片5；开关壳体3设置于插座壳体的内部，且其上壁与插座壳体的上壁衔接为一体；翘板按钮4为下端面呈圆弧面的T型结构，且其上部贯穿凸设于开关壳体3的上壁、中部铰接于开关壳体3的上内壁；翘板按钮4的下端部滑动接触于导电翘板触片5的上表面；导电翘板触片5的右端部与开关壳体3固定连接；且其下表面左端一体设置有动触点6；动触点6的正下方设置有一个顶端带有静触点7且与开关壳体3固定连接的接线片8；接线片8、静触点7、动触点6、导电翘板触片5依次串联连接于供电电路中；导电翘板触片5的下表面与开关壳体3的下内壁之间沿竖向设置有第二形状记忆合金部件9。The seesaw switch comprises a switch housing 3, a seesaw button 4 and a conductive seesaw contact piece 5 which is located inside the switch housing 3 and is tilted with the left side higher and the right side lower. The switch housing 3 is arranged inside the socket housing, and its upper wall is connected with the upper wall of the socket housing as a whole. The seesaw button 4 is a T-shaped structure with a circular arc surface at the lower end surface, and its upper part penetrates and protrudes on the upper wall of the switch housing 3, and the middle part is hinged to the upper inner wall of the switch housing 3. The lower end of the seesaw button 4 slides and contacts the upper surface of the conductive seesaw contact piece 5. The right end of the conductive seesaw contact piece 5 is fixedly connected to the switch housing 3; and a moving contact 6 is integrally arranged at the left end of its lower surface. A wiring piece 8 with a static contact 7 at the top and fixedly connected to the switch housing 3 is arranged directly below the moving contact 6. The wiring piece 8, the static contact 7, the moving contact 6 and the conductive seesaw contact piece 5 are connected in series in the power supply circuit in sequence. A second shape memory alloy component 9 is vertically arranged between the lower surface of the conductive seesaw contact piece 5 and the lower inner wall of the switch housing 3.
第一形状记忆合金部件2与第二形状记忆合金部件9均由镍钛合金制成。The first shape memory alloy component 2 and the second shape memory alloy component 9 are both made of nickel-titanium alloy.
所述镍钛合金是由如下质量百分比的原料组成的：钛45.62wt%；不可避免的杂质0.01wt%；余量为镍。The nickel-titanium alloy is composed of the following raw materials in percentage by weight: 45.62 wt % titanium; 0.01 wt % unavoidable impurities; and the balance nickel.
所述第二形状记忆合金部件9呈C形。The second shape memory alloy component 9 is C-shaped.
所述金属簧片夹1由铜制成；金属簧片夹1与第一形状记忆合金部件2之间通过铆接固定连接。The metal spring clip 1 is made of copper; the metal spring clip 1 and the first shape memory alloy component 2 are fixedly connected by riveting.
所述第一形状记忆合金部件2的制备方法，是采用如下步骤实现的：The preparation method of the first shape memory alloy component 2 is achieved by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在710℃条件下保温2.5h，而后锻造，锻造结束后在860℃条件下保温0.8h，然后轧制成直径为9mm的粗丝；S1: Preparation of thick wire: First, an alloy ingot is prepared by vacuum induction melting, and the alloy ingot is kept at 710°C for 2.5 hours, and then forged. After forging, the ingot is kept at 860°C for 0.8 hours, and then rolled into a thick wire with a diameter of 9 mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝在700℃条件下保温18min，而后将该粗丝轧制成厚度为1.2mm的板材，并将该板材裁切后固定在Ω形模具上以560℃的条件保温8sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: the thick wire prepared in step S1 is kept at 700°C for 18 minutes, and then the thick wire is rolled into a plate with a thickness of 1.2 mm, and the plate is cut and fixed on an Ω-shaped mold and kept at 560°C for 8 seconds, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至480℃，并在该温度条件下保温35min，然后空冷，由此完成第一形状记忆合金部件2的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 480° C., kept at this temperature for 35 minutes, and then air-cooled, thereby completing the preparation of the first shape memory alloy component 2 .
所述C形的第二形状记忆合金部件9的制备方法，是采用如下步骤实现的：The method for preparing the C-shaped second shape memory alloy component 9 is implemented by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在850℃条件下保温3h，而后锻造，锻造结束后在1000℃条件下保温2h，然后轧制成直径为6mm的粗丝；S1: Preparation of thick wire: First, an alloy ingot is prepared by vacuum induction melting, and the alloy ingot is kept at 850°C for 3 hours, and then forged. After forging, the ingot is kept at 1000°C for 2 hours, and then rolled into a thick wire with a diameter of 6 mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝在810℃条件下保温30min，而后将该粗丝轧制成厚度为1.2mm的板材，并将该板材裁切后固定在形状对应的模具上以520℃的条件保温60sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: the thick wire prepared in step S1 is kept at 810°C for 30 minutes, and then the thick wire is rolled into a plate with a thickness of 1.2 mm, and the plate is cut and fixed on a mold corresponding to the shape and kept at 520°C for 60 seconds, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至600℃，并在该温度条件下保温60min，然后空冷，由此完成C形的第二形状记忆合金部件9的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 600° C., kept at this temperature for 60 minutes, and then air-cooled, thereby completing the preparation of the C-shaped second shape memory alloy component 9 .
实施例4Example 4
一种具有双重防过载功能的翘板式移动插座，包括插座壳体、供电电路、翘板开关和若干个金属簧片夹1；供电电路与各个金属簧片夹1均设置于插座壳体的内部；所述金属簧片夹1呈Ω形，且其圆弧部的一侧固定连接有与其圆弧面贴合的第一形状记忆合金部件2；A seesaw mobile socket with dual overload protection function, comprising a socket housing, a power supply circuit, a seesaw switch and a plurality of metal reed clips 1; the power supply circuit and each metal reed clip 1 are arranged inside the socket housing; the metal reed clip 1 is Ω-shaped, and one side of the arc portion thereof is fixedly connected with a first shape memory alloy component 2 which fits the arc surface thereof;
所述翘板开关包括开关壳体3、翘板按钮4和位于开关壳体3内部且呈左高右低倾斜放置的导电翘板触片5；开关壳体3设置于插座壳体的内部，且其上壁与插座壳体的上壁衔接为一体；翘板按钮4为下端面呈圆弧面的T型结构，且其上部贯穿凸设于开关壳体3的上壁、中部铰接于开关壳体3的上内壁；翘板按钮4的下端部滑动接触于导电翘板触片5的上表面；导电翘板触片5的右端部与开关壳体3固定连接；且其下表面左端一体设置有动触点6；动触点6的正下方设置有一个顶端带有静触点7且与开关壳体3固定连接的接线片8；接线片8、静触点7、动触点6、导电翘板触片5依次串联连接于供电电路中；导电翘板触片5的下表面与开关壳体3的下内壁之间沿竖向设置有第二形状记忆合金部件9。The seesaw switch comprises a switch housing 3, a seesaw button 4 and a conductive seesaw contact piece 5 which is located inside the switch housing 3 and is tilted with the left side higher and the right side lower. The switch housing 3 is arranged inside the socket housing, and its upper wall is connected with the upper wall of the socket housing as a whole. The seesaw button 4 is a T-shaped structure with a circular arc surface at the lower end surface, and its upper part penetrates and protrudes on the upper wall of the switch housing 3, and the middle part is hinged to the upper inner wall of the switch housing 3. The lower end of the seesaw button 4 slides and contacts the upper surface of the conductive seesaw contact piece 5. The right end of the conductive seesaw contact piece 5 is fixedly connected to the switch housing 3; and a moving contact 6 is integrally arranged at the left end of its lower surface. A wiring piece 8 with a static contact 7 at the top and fixedly connected to the switch housing 3 is arranged directly below the moving contact 6. The wiring piece 8, the static contact 7, the moving contact 6 and the conductive seesaw contact piece 5 are connected in series in the power supply circuit in sequence. A second shape memory alloy component 9 is vertically arranged between the lower surface of the conductive seesaw contact piece 5 and the lower inner wall of the switch housing 3.
第一形状记忆合金部件2与第二形状记忆合金部件9均由镍钛铜合金制成。The first shape memory alloy component 2 and the second shape memory alloy component 9 are both made of nickel-titanium-copper alloy.
所述镍钛铜合金是由如下质量百分比的原料组成的：钛43.93wt%；铜0.12wt%；不可避免的杂质0.01wt%；余量为镍。The nickel-titanium-copper alloy is composed of the following raw materials in percentage by mass: 43.93 wt % titanium; 0.12 wt % copper; 0.01 wt % unavoidable impurities; and the balance is nickel.
所述第二形状记忆合金部件9呈N形。The second shape memory alloy component 9 is N-shaped.
所述金属簧片夹1由铜制成；金属簧片夹1与第一形状记忆合金部件2之间通过低温钎焊固定连接。The metal spring clip 1 is made of copper; the metal spring clip 1 and the first shape memory alloy component 2 are fixedly connected by low temperature brazing.
所述第一形状记忆合金部件2的制备方法，是采用如下步骤实现的：The preparation method of the first shape memory alloy component 2 is achieved by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在900℃条件下保温2.8h，而后锻造，锻造结束后在700℃条件下保温1.7h，然后轧制成直径为8mm的粗丝；S1: Preparation of thick wire: First, an alloy ingot was prepared by vacuum induction melting, and the alloy ingot was kept at 900°C for 2.8 hours, and then forged. After forging, the ingot was kept at 700°C for 1.7 hours, and then rolled into a thick wire with a diameter of 8 mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝在730℃条件下保温15min，而后将该粗丝轧制成厚度为0.4mm的板材，并将该板材裁切后固定在Ω形模具上以400℃的条件保温56sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: the thick wire prepared in step S1 is kept at 730°C for 15 minutes, and then the thick wire is rolled into a plate with a thickness of 0.4 mm, and the plate is cut and fixed on an Ω-shaped mold and kept at 400°C for 56 seconds, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至500℃，并在该温度条件下保温60min，然后空冷，由此完成第一形状记忆合金部件2的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 500° C., kept at this temperature for 60 minutes, and then air-cooled, thereby completing the preparation of the first shape memory alloy component 2 .
所述N形的第二形状记忆合金部件9的制备方法，是采用如下步骤实现的：The method for preparing the N-shaped second shape memory alloy component 9 is implemented by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在700℃条件下保温1.0h，而后锻造，锻造结束后在910℃条件下保温0.5h，然后轧制成直径为8.5mm的粗丝；S1: Preparation of thick wire: First, an alloy ingot is prepared by vacuum induction melting, and the alloy ingot is kept at 700°C for 1.0h, and then forged. After forging, the ingot is kept at 910°C for 0.5h, and then rolled into a thick wire with a diameter of 8.5mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝在600℃条件下保温18min，而后将该粗丝轧制成厚度为2mm的板材，并将该板材裁切后固定在形状对应的模具上以600℃的条件保温5sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: the thick wire prepared in step S1 is kept at 600°C for 18 minutes, and then the thick wire is rolled into a plate with a thickness of 2 mm, and the plate is cut and fixed on a mold of corresponding shape and kept at 600°C for 5 seconds, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至510℃，并在该温度条件下保温1min，然后空冷，由此完N形的第二形状记忆合金部件9的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 510° C., kept at this temperature for 1 minute, and then air-cooled, thereby completing the preparation of the N-shaped second shape memory alloy component 9 .
实施例5Example 5
一种具有双重防过载功能的翘板式移动插座，包括插座壳体、供电电路、翘板开关和若干个金属簧片夹1；供电电路与各个金属簧片夹1均设置于插座壳体的内部；所述金属簧片夹1呈Ω形，且其圆弧部的一侧固定连接有与其圆弧面贴合的第一形状记忆合金部件2；A seesaw mobile socket with dual overload protection function, comprising a socket housing, a power supply circuit, a seesaw switch and a plurality of metal reed clips 1; the power supply circuit and each metal reed clip 1 are arranged inside the socket housing; the metal reed clip 1 is Ω-shaped, and one side of the arc portion thereof is fixedly connected with a first shape memory alloy component 2 which fits the arc surface thereof;
所述翘板开关包括开关壳体3、翘板按钮4和位于开关壳体3内部且呈左高右低倾斜放置的导电翘板触片5；开关壳体3设置于插座壳体的内部，且其上壁与插座壳体的上壁衔接为一体；翘板按钮4为下端面呈圆弧面的T型结构，且其上部贯穿凸设于开关壳体3的上壁、中部铰接于开关壳体3的上内壁；翘板按钮4的下端部滑动接触于导电翘板触片5的上表面；导电翘板触片5的右端部与开关壳体3固定连接；且其下表面左端一体设置有动触点6；动触点6的正下方设置有一个顶端带有静触点7且与开关壳体3固定连接的接线片8；接线片8、静触点7、动触点6、导电翘板触片5依次串联连接于供电电路中；导电翘板触片5的下表面与开关壳体3的下内壁之间沿竖向设置有第二形状记忆合金部件9。The seesaw switch comprises a switch housing 3, a seesaw button 4 and a conductive seesaw contact piece 5 which is located inside the switch housing 3 and is tilted with the left side higher and the right side lower. The switch housing 3 is arranged inside the socket housing, and its upper wall is connected with the upper wall of the socket housing as a whole. The seesaw button 4 is a T-shaped structure with a circular arc surface at the lower end surface, and its upper part penetrates and protrudes on the upper wall of the switch housing 3, and the middle part is hinged to the upper inner wall of the switch housing 3. The lower end of the seesaw button 4 slides and contacts the upper surface of the conductive seesaw contact piece 5. The right end of the conductive seesaw contact piece 5 is fixedly connected to the switch housing 3; and a moving contact 6 is integrally arranged at the left end of its lower surface. A wiring piece 8 with a static contact 7 at the top and fixedly connected to the switch housing 3 is arranged directly below the moving contact 6. The wiring piece 8, the static contact 7, the moving contact 6 and the conductive seesaw contact piece 5 are connected in series in the power supply circuit in sequence. A second shape memory alloy component 9 is vertically arranged between the lower surface of the conductive seesaw contact piece 5 and the lower inner wall of the switch housing 3.
第一形状记忆合金部件2与第二形状记忆合金部件9均由镍钛铜合金制成。The first shape memory alloy component 2 and the second shape memory alloy component 9 are both made of nickel-titanium-copper alloy.
所述镍钛铜合金是由如下质量百分比的原料组成的：钛45.06wt%；铜10.09wt%；不可避免的杂质0.036wt%；余量为镍。The nickel-titanium-copper alloy is composed of the following raw materials in percentage by mass: 45.06wt% titanium; 10.09wt% copper; 0.036wt% unavoidable impurities; and the balance is nickel.
所述第二形状记忆合金部件9呈M形。The second shape memory alloy component 9 is in an M shape.
所述金属簧片夹1由铜制成；金属簧片夹1与第一形状记忆合金部件2之间通过胶接固定连接。The metal spring clip 1 is made of copper; the metal spring clip 1 is fixedly connected to the first shape memory alloy component 2 by gluing.
所述第一形状记忆合金部件2的制备方法，是采用如下步骤实现的：The preparation method of the first shape memory alloy component 2 is achieved by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在1000℃条件下保温1.6h，而后锻造，锻造结束后在780℃条件下保温1.2h，然后轧制成直径为7.3mm的粗丝；S1: Preparation of thick wire: First, an alloy ingot was prepared by vacuum induction melting, and the alloy ingot was kept at 1000°C for 1.6 hours, and then forged. After forging, the ingot was kept at 780°C for 1.2 hours, and then rolled into a thick wire with a diameter of 7.3 mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝在600℃条件下保温8min，而后将该粗丝轧制成厚度为2mm的板材，并将该板材裁切后固定在Ω形模具上以550℃的条件保温30sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: the thick wire prepared in step S1 is kept at 600°C for 8 minutes, and then the thick wire is rolled into a plate with a thickness of 2 mm, and the plate is cut and fixed on an Ω-shaped mold and kept at 550°C for 30 seconds, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至600℃，并在该温度条件下保温8min，然后空冷，由此完成第一形状记忆合金部件2的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 600° C., kept at this temperature for 8 minutes, and then air-cooled, thereby completing the preparation of the first shape memory alloy component 2 .
所述M形的第二形状记忆合金部件9的制备方法，是采用如下步骤实现的：The method for preparing the M-shaped second shape memory alloy component 9 is implemented by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在910℃条件下保温0.5h，而后锻造，锻造结束后在820℃条件下保温1.4h，然后轧制成直径为9mm的粗丝；S1: Preparation of thick wire: First, an alloy ingot is prepared by vacuum induction melting, and the alloy ingot is kept at 910°C for 0.5h, and then forged. After forging, the ingot is kept at 820°C for 1.4h, and then rolled into a thick wire with a diameter of 9mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝在770℃条件下保温23min，而后将该粗丝轧制成厚度为0.2mm的板材，并将该板材裁切后固定在形状对应的模具上以550℃的条件保温33sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: the thick wire prepared in step S1 is kept at 770°C for 23 minutes, and then the thick wire is rolled into a plate with a thickness of 0.2 mm, and the plate is cut and fixed on a mold corresponding to the shape and kept at 550°C for 33 seconds, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至550℃，并在该温度条件下保温42min，然后空冷，由此完成M形的第二形状记忆合金部件9的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 550° C., kept at this temperature for 42 minutes, and then air-cooled, thereby completing the preparation of the M-shaped second shape memory alloy component 9.
实施例6Example 6
一种具有双重防过载功能的翘板式移动插座，包括插座壳体、供电电路、翘板开关和若干个金属簧片夹1；供电电路与各个金属簧片夹1均设置于插座壳体的内部；所述金属簧片夹1呈Ω形，且其圆弧部的一侧固定连接有与其圆弧面贴合的第一形状记忆合金部件2；A seesaw mobile socket with dual overload protection function, comprising a socket housing, a power supply circuit, a seesaw switch and a plurality of metal reed clips 1; the power supply circuit and each metal reed clip 1 are arranged inside the socket housing; the metal reed clip 1 is Ω-shaped, and one side of the arc portion thereof is fixedly connected with a first shape memory alloy component 2 which fits the arc surface thereof;
所述翘板开关包括开关壳体3、翘板按钮4和位于开关壳体3内部且呈左高右低倾斜放置的导电翘板触片5；开关壳体3设置于插座壳体的内部，且其上壁与插座壳体的上壁衔接为一体；翘板按钮4为下端面呈圆弧面的T型结构，且其上部贯穿凸设于开关壳体3的上壁、中部铰接于开关壳体3的上内壁；翘板按钮4的下端部滑动接触于导电翘板触片5的上表面；导电翘板触片5的右端部与开关壳体3固定连接；且其下表面左端一体设置有动触点6；动触点6的正下方设置有一个顶端带有静触点7且与开关壳体3固定连接的接线片8；接线片8、静触点7、动触点6、导电翘板触片5依次串联连接于供电电路中；导电翘板触片5的下表面与开关壳体3的下内壁之间沿竖向设置有第二形状记忆合金部件9。The seesaw switch comprises a switch housing 3, a seesaw button 4 and a conductive seesaw contact piece 5 which is located inside the switch housing 3 and is tilted with the left side higher and the right side lower. The switch housing 3 is arranged inside the socket housing, and its upper wall is connected with the upper wall of the socket housing as a whole. The seesaw button 4 is a T-shaped structure with a circular arc surface at the lower end surface, and its upper part penetrates and protrudes on the upper wall of the switch housing 3, and the middle part is hinged to the upper inner wall of the switch housing 3. The lower end of the seesaw button 4 slides and contacts the upper surface of the conductive seesaw contact piece 5. The right end of the conductive seesaw contact piece 5 is fixedly connected to the switch housing 3; and a moving contact 6 is integrally arranged at the left end of its lower surface. A wiring piece 8 with a static contact 7 at the top and fixedly connected to the switch housing 3 is arranged directly below the moving contact 6. The wiring piece 8, the static contact 7, the moving contact 6 and the conductive seesaw contact piece 5 are connected in series in the power supply circuit in sequence. A second shape memory alloy component 9 is vertically arranged between the lower surface of the conductive seesaw contact piece 5 and the lower inner wall of the switch housing 3.
第一形状记忆合金部件2与第二形状记忆合金部件9均由镍钛铜合金制成。The first shape memory alloy component 2 and the second shape memory alloy component 9 are both made of nickel-titanium-copper alloy.
所述镍钛铜合金是由如下质量百分比的原料组成的：钛45.62wt%；铜34.88wt%；不可避免的杂质0.1wt%；余量为镍。The nickel-titanium-copper alloy is composed of the following raw materials in percentage by mass: 45.62wt% titanium; 34.88wt% copper; 0.1wt% unavoidable impurities; and the balance is nickel.
所述第二形状记忆合金部件9呈弹簧形。The second shape memory alloy component 9 is in a spring shape.
所述金属簧片夹1由铜制成；金属簧片夹1与第一形状记忆合金部件2之间通过铆接固定连接。The metal spring clip 1 is made of copper; the metal spring clip 1 is fixedly connected to the first shape memory alloy component 2 by riveting.
所述第一形状记忆合金部件2的制备方法，是采用如下步骤实现的：The preparation method of the first shape memory alloy component 2 is achieved by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在780℃条件下保温3h，而后锻造，锻造结束后在910℃条件下保温2h，然后轧制成直径为8.1mm的粗丝；S1: Preparation of thick wire: First, an alloy ingot is prepared by vacuum induction melting, and the alloy ingot is kept at 780°C for 3 hours, and then forged. After forging, the ingot is kept at 910°C for 2 hours, and then rolled into a thick wire with a diameter of 8.1 mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝在950℃条件下保温20min，而后将该粗丝轧制成厚度为1.8mm的板材，并将该板材裁切后固定在Ω形模具上以600℃的条件保温40sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: The thick wire prepared in step S1 is kept at 950°C for 20 minutes, and then the thick wire is rolled into a plate with a thickness of 1.8 mm, and the plate is cut and fixed on an Ω-shaped mold and kept at 600°C for 40 seconds, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至550℃，并在该温度条件下保温1min，然后空冷，由此完成第一形状记忆合金部件2的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 550° C., kept at this temperature for 1 minute, and then air-cooled, thereby completing the preparation of the first shape memory alloy component 2 .
所述弹簧形的第二形状记忆合金部件9的制备方法，是采用如下步骤实现的：The preparation method of the spring-shaped second shape memory alloy component 9 is implemented by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在750℃条件下保温0.5h，而后锻造，锻造结束后在700℃条件下保温1.3h，然后轧制成直径为10mm的粗丝；S1: Preparation of thick wire: First, an alloy ingot is prepared by vacuum induction melting, and the alloy ingot is kept at 750°C for 0.5h, then forged, and after forging, kept at 700°C for 1.3h, and then rolled into a thick wire with a diameter of 10mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝拉丝为直径为1.5mm的细丝，而后将该细丝绕制为弹簧，并将该弹簧加热至400℃，并在该温度条件保温30sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: the thick wire prepared in step S1 is drawn into a thin wire with a diameter of 1.5 mm, and then the thin wire is wound into a spring, and the spring is heated to 400°C and kept at this temperature for 30 seconds, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至400℃，并在该温度条件下保温60min，然后空冷、裁切，由此完成弹簧形的第二形状记忆合金部件9的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 400° C. and kept at this temperature for 60 minutes, then air-cooled and cut, thereby completing the preparation of the spring-shaped second shape memory alloy component 9 .
实施例7Example 7
一种具有双重防过载功能的翘板式移动插座，包括插座壳体、供电电路、翘板开关和若干个金属簧片夹1；供电电路与各个金属簧片夹1均设置于插座壳体的内部；所述金属簧片夹1呈Ω形，且其圆弧部的一侧固定连接有与其圆弧面贴合的第一形状记忆合金部件2；A seesaw mobile socket with dual overload protection function, comprising a socket housing, a power supply circuit, a seesaw switch and a plurality of metal reed clips 1; the power supply circuit and each metal reed clip 1 are arranged inside the socket housing; the metal reed clip 1 is Ω-shaped, and one side of the arc portion thereof is fixedly connected with a first shape memory alloy component 2 which fits the arc surface thereof;
所述翘板开关包括开关壳体3、翘板按钮4和位于开关壳体3内部且呈左高右低倾斜放置的导电翘板触片5；开关壳体3设置于插座壳体的内部，且其上壁与插座壳体的上壁衔接为一体；翘板按钮4为下端面呈圆弧面的T型结构，且其上部贯穿凸设于开关壳体3的上壁、中部铰接于开关壳体3的上内壁；翘板按钮4的下端部滑动接触于导电翘板触片5的上表面；导电翘板触片5的右端部与开关壳体3固定连接；且其下表面左端一体设置有动触点6；动触点6的正下方设置有一个顶端带有静触点7且与开关壳体3固定连接的接线片8；接线片8、静触点7、动触点6、导电翘板触片5依次串联连接于供电电路中；导电翘板触片5的下表面与开关壳体3的下内壁之间沿竖向设置有第二形状记忆合金部件9。The seesaw switch comprises a switch housing 3, a seesaw button 4 and a conductive seesaw contact piece 5 which is located inside the switch housing 3 and is tilted with the left side higher and the right side lower. The switch housing 3 is arranged inside the socket housing, and its upper wall is connected with the upper wall of the socket housing as a whole. The seesaw button 4 is a T-shaped structure with a circular arc surface at the lower end surface, and its upper part penetrates and protrudes on the upper wall of the switch housing 3, and the middle part is hinged to the upper inner wall of the switch housing 3. The lower end of the seesaw button 4 slides and contacts the upper surface of the conductive seesaw contact piece 5. The right end of the conductive seesaw contact piece 5 is fixedly connected to the switch housing 3; and a moving contact 6 is integrally arranged at the left end of its lower surface. A wiring piece 8 with a static contact 7 at the top and fixedly connected to the switch housing 3 is arranged directly below the moving contact 6. The wiring piece 8, the static contact 7, the moving contact 6 and the conductive seesaw contact piece 5 are connected in series in the power supply circuit in sequence. A second shape memory alloy component 9 is vertically arranged between the lower surface of the conductive seesaw contact piece 5 and the lower inner wall of the switch housing 3.
第一形状记忆合金部件2与第二形状记忆合金部件9均由镍钛铌合金制成。The first shape memory alloy component 2 and the second shape memory alloy component 9 are both made of nickel-titanium-niobium alloy.
所述镍钛铌合金是由如下质量百分比的原料组成的：钛43.93wt%；铌0.17wt%；不可避免的杂质0.060wt%；余量为镍。The nickel-titanium-niobium alloy is composed of the following raw materials in percentage by mass: 43.93wt% titanium; 0.17wt% niobium; 0.060wt% unavoidable impurities; and the balance is nickel.
所述第二形状记忆合金部件9呈弹簧形。The second shape memory alloy component 9 is in a spring shape.
所述金属簧片夹1由铜制成；金属簧片夹1与第一形状记忆合金部件2之间通过低温钎焊固定连接。The metal spring clip 1 is made of copper; the metal spring clip 1 and the first shape memory alloy component 2 are fixedly connected by low temperature brazing.
所述第一形状记忆合金部件2的制备方法，是采用如下步骤实现的：The preparation method of the first shape memory alloy component 2 is achieved by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在960℃条件下保温1.5h，而后锻造，锻造结束后在1000℃条件下保温1.3h，然后轧制成直径为9.6mm的粗丝；S1: Preparation of thick wire: First, an alloy ingot is prepared by vacuum induction melting, and the alloy ingot is kept at 960°C for 1.5 hours, and then forged. After forging, the ingot is kept at 1000°C for 1.3 hours, and then rolled into a thick wire with a diameter of 9.6 mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝在930℃条件下保温22min，而后将该粗丝轧制成厚度为1.1mm的板材，并将该板材裁切后固定在Ω形模具上以490℃的条件保温5sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: the thick wire prepared in step S1 is kept at 930°C for 22 minutes, and then the thick wire is rolled into a plate with a thickness of 1.1 mm, and the plate is cut and fixed on an Ω-shaped mold and kept at 490°C for 5 seconds, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至580℃，并在该温度条件下保温55min，然后空冷，由此完成第一形状记忆合金部件2的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 580° C., kept at this temperature for 55 minutes, and then air-cooled, thereby completing the preparation of the first shape memory alloy component 2 .
所述弹簧形的第二形状记忆合金部件9的制备方法，是采用如下步骤实现的：The preparation method of the spring-shaped second shape memory alloy component 9 is implemented by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在1000℃条件下保温1.8h，而后锻造，锻造结束后在900℃条件下保温0.9h，然后轧制成直径为9mm的粗丝；S1: Preparation of thick wire: firstly, an alloy ingot is prepared by vacuum induction melting, and the alloy ingot is kept at 1000°C for 1.8 hours, and then forged. After forging, the ingot is kept at 900°C for 0.9 hours, and then rolled into a thick wire with a diameter of 9 mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝拉丝为直径为0.9mm的细丝，而后将该细丝绕制为弹簧，并将该弹簧加热至600℃，并在该温度条件保温60sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: the thick wire prepared in step S1 is drawn into a thin wire with a diameter of 0.9 mm, and then the thin wire is wound into a spring, and the spring is heated to 600°C and kept at this temperature for 60 seconds, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至600℃，并在该温度条件下保温29min，然后空冷、裁切，由此完成弹簧形的第二形状记忆合金部件9的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 600° C. and kept at this temperature for 29 minutes, then air-cooled and cut, thereby completing the preparation of the spring-shaped second shape memory alloy component 9.
实施例8Example 8
一种具有双重防过载功能的翘板式移动插座，包括插座壳体、供电电路、翘板开关和若干个金属簧片夹1；供电电路与各个金属簧片夹1均设置于插座壳体的内部；所述金属簧片夹1呈Ω形，且其圆弧部的一侧固定连接有与其圆弧面贴合的第一形状记忆合金部件2；A seesaw mobile socket with dual overload protection function, comprising a socket housing, a power supply circuit, a seesaw switch and a plurality of metal reed clips 1; the power supply circuit and each metal reed clip 1 are arranged inside the socket housing; the metal reed clip 1 is Ω-shaped, and one side of the arc portion thereof is fixedly connected with a first shape memory alloy component 2 which fits the arc surface thereof;
所述翘板开关包括开关壳体3、翘板按钮4和位于开关壳体3内部且呈左高右低倾斜放置的导电翘板触片5；开关壳体3设置于插座壳体的内部，且其上壁与插座壳体的上壁衔接为一体；翘板按钮4为下端面呈圆弧面的T型结构，且其上部贯穿凸设于开关壳体3的上壁、中部铰接于开关壳体3的上内壁；翘板按钮4的下端部滑动接触于导电翘板触片5的上表面；导电翘板触片5的右端部与开关壳体3固定连接；且其下表面左端一体设置有动触点6；动触点6的正下方设置有一个顶端带有静触点7且与开关壳体3固定连接的接线片8；接线片8、静触点7、动触点6、导电翘板触片5依次串联连接于供电电路中；导电翘板触片5的下表面与开关壳体3的下内壁之间沿竖向设置有第二形状记忆合金部件9。The seesaw switch comprises a switch housing 3, a seesaw button 4 and a conductive seesaw contact piece 5 which is located inside the switch housing 3 and is tilted with the left side higher and the right side lower. The switch housing 3 is arranged inside the socket housing, and its upper wall is connected with the upper wall of the socket housing as a whole. The seesaw button 4 is a T-shaped structure with a circular arc surface at the lower end surface, and its upper part penetrates and protrudes on the upper wall of the switch housing 3, and the middle part is hinged to the upper inner wall of the switch housing 3. The lower end of the seesaw button 4 slides and contacts the upper surface of the conductive seesaw contact piece 5. The right end of the conductive seesaw contact piece 5 is fixedly connected to the switch housing 3; and a moving contact 6 is integrally arranged at the left end of its lower surface. A wiring piece 8 with a static contact 7 at the top and fixedly connected to the switch housing 3 is arranged directly below the moving contact 6. The wiring piece 8, the static contact 7, the moving contact 6 and the conductive seesaw contact piece 5 are connected in series in the power supply circuit in sequence. A second shape memory alloy component 9 is vertically arranged between the lower surface of the conductive seesaw contact piece 5 and the lower inner wall of the switch housing 3.
第一形状记忆合金部件2与第二形状记忆合金部件9均由镍钛铌合金制成。The first shape memory alloy component 2 and the second shape memory alloy component 9 are both made of nickel-titanium-niobium alloy.
所述镍钛铌合金是由如下质量百分比的原料组成的：钛44.30wt%；铌23.16wt%；不可避免的杂质0.01wt%；余量为镍。The nickel-titanium-niobium alloy is composed of the following raw materials in percentage by mass: 44.30wt% titanium; 23.16wt% niobium; 0.01wt% unavoidable impurities; and the balance is nickel.
所述第二形状记忆合金部件9呈弹簧形。The second shape memory alloy component 9 is in a spring shape.
所述金属簧片夹1由铜制成；金属簧片夹1与第一形状记忆合金部件2之间通过胶接固定连接。The metal spring clip 1 is made of copper; the metal spring clip 1 is fixedly connected to the first shape memory alloy component 2 by gluing.
所述第一形状记忆合金部件2的制备方法，是采用如下步骤实现的：The preparation method of the first shape memory alloy component 2 is achieved by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在830℃条件下保温2.0h，而后锻造，锻造结束后在750℃条件下保温0.6h，然后轧制成直径为10mm的粗丝；S1: Preparation of thick wire: firstly, an alloy ingot is prepared by vacuum induction melting, and the alloy ingot is kept at 830°C for 2.0h, then forged, and after forging, kept at 750°C for 0.6h, and then rolled into a thick wire with a diameter of 10mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝在900℃条件下保温19min，而后将该粗丝轧制成厚度为0.2mm的板材，并将该板材裁切后固定在Ω形模具上以520℃的条件保温42sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: the thick wire prepared in step S1 is kept at 900°C for 19 minutes, and then the thick wire is rolled into a plate with a thickness of 0.2 mm, and the plate is cut and fixed on an Ω-shaped mold and kept at 520°C for 42 seconds, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至520℃，并在该温度条件下保温40min，然后空冷，由此完成第一形状记忆合金部件2的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 520° C., kept at this temperature for 40 minutes, and then air-cooled, thereby completing the preparation of the first shape memory alloy component 2 .
所述弹簧形的第二形状记忆合金部件9的制备方法，是采用如下步骤实现的：The preparation method of the spring-shaped second shape memory alloy component 9 is implemented by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在700℃条件下保温1.0h，而后锻造，锻造结束后在800℃条件下保温0.5h，然后轧制成直径为8mm的粗丝；S1: Preparation of thick wire: firstly, an alloy ingot is prepared by vacuum induction melting, and the alloy ingot is kept at 700°C for 1.0h, and then forged. After forging, the ingot is kept at 800°C for 0.5h, and then rolled into a thick wire with a diameter of 8mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝拉丝为直径为0.3mm的细丝，而后将该细丝绕制为弹簧，并将该弹簧加热至530℃，并在该温度条件保温5sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: the thick wire prepared in step S1 is drawn into a thin wire with a diameter of 0.3 mm, and then the thin wire is wound into a spring, and the spring is heated to 530°C and kept at this temperature for 5 seconds, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至490℃，并在该温度条件下保温1min，然后空冷、裁切，由此完成弹簧形的第二形状记忆合金部件9的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 490° C. and kept at this temperature for 1 minute, and then air-cooled and cut, thereby completing the preparation of the spring-shaped second shape memory alloy component 9.
实施例9Example 9
一种具有双重防过载功能的翘板式移动插座，包括插座壳体、供电电路、翘板开关和若干个金属簧片夹1；供电电路与各个金属簧片夹1均设置于插座壳体的内部；所述金属簧片夹1呈Ω形，且其圆弧部的一侧固定连接有与其圆弧面贴合的第一形状记忆合金部件2；A seesaw mobile socket with dual overload protection function, comprising a socket housing, a power supply circuit, a seesaw switch and a plurality of metal reed clips 1; the power supply circuit and each metal reed clip 1 are arranged inside the socket housing; the metal reed clip 1 is Ω-shaped, and one side of the arc portion thereof is fixedly connected with a first shape memory alloy component 2 which fits the arc surface thereof;
所述翘板开关包括开关壳体3、翘板按钮4和位于开关壳体3内部且呈左高右低倾斜放置的导电翘板触片5；开关壳体3设置于插座壳体的内部，且其上壁与插座壳体的上壁衔接为一体；翘板按钮4为下端面呈圆弧面的T型结构，且其上部贯穿凸设于开关壳体3的上壁、中部铰接于开关壳体3的上内壁；翘板按钮4的下端部滑动接触于导电翘板触片5的上表面；导电翘板触片5的右端部与开关壳体3固定连接；且其下表面左端一体设置有动触点6；动触点6的正下方设置有一个顶端带有静触点7且与开关壳体3固定连接的接线片8；接线片8、静触点7、动触点6、导电翘板触片5依次串联连接于供电电路中；导电翘板触片5的下表面与开关壳体3的下内壁之间沿竖向设置有第二形状记忆合金部件9。The seesaw switch comprises a switch housing 3, a seesaw button 4 and a conductive seesaw contact piece 5 which is located inside the switch housing 3 and is tilted with the left side higher and the right side lower. The switch housing 3 is arranged inside the socket housing, and its upper wall is connected with the upper wall of the socket housing as a whole. The seesaw button 4 is a T-shaped structure with a circular arc surface at the lower end surface, and its upper part penetrates and protrudes on the upper wall of the switch housing 3, and the middle part is hinged to the upper inner wall of the switch housing 3. The lower end of the seesaw button 4 slides and contacts the upper surface of the conductive seesaw contact piece 5. The right end of the conductive seesaw contact piece 5 is fixedly connected to the switch housing 3; and a moving contact 6 is integrally arranged at the left end of its lower surface. A wiring piece 8 with a static contact 7 at the top and fixedly connected to the switch housing 3 is arranged directly below the moving contact 6. The wiring piece 8, the static contact 7, the moving contact 6 and the conductive seesaw contact piece 5 are connected in series in the power supply circuit in sequence. A second shape memory alloy component 9 is vertically arranged between the lower surface of the conductive seesaw contact piece 5 and the lower inner wall of the switch housing 3.
第一形状记忆合金部件2与第二形状记忆合金部件9均由镍钛铌合金制成。The first shape memory alloy component 2 and the second shape memory alloy component 9 are both made of nickel-titanium-niobium alloy.
所述镍钛铌合金是由如下质量百分比的原料组成的：钛45.62wt%；铌30.95wt%；不可避免的杂质0.1wt%；余量为镍。The nickel-titanium-niobium alloy is composed of the following raw materials in percentage by weight: 45.62wt% titanium; 30.95wt% niobium; 0.1wt% unavoidable impurities; and the balance is nickel.
所述第二形状记忆合金部件9呈弹簧形。The second shape memory alloy component 9 is in a spring shape.
所述金属簧片夹1由铜制成；金属簧片夹1与第一形状记忆合金部件2之间通过铆接固定连接。The metal spring clip 1 is made of copper; the metal spring clip 1 is fixedly connected to the first shape memory alloy component 2 by riveting.
所述第一形状记忆合金部件2的制备方法，是采用如下步骤实现的：The preparation method of the first shape memory alloy component 2 is achieved by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在860℃条件下保温0.7h，而后锻造，锻造结束后在760℃条件下保温1.8h，然后轧制成直径为6.3mm的粗丝；S1: Preparation of thick wire: First, an alloy ingot is prepared by vacuum induction melting, and the alloy ingot is kept at 860°C for 0.7h, then forged, and after forging, kept at 760°C for 1.8h, and then rolled into a thick wire with a diameter of 6.3mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝在850℃条件下保温28min，而后将该粗丝轧制成厚度为0.9mm的板材，并将该板材裁切后固定在Ω形模具上以510℃的条件保温36sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: the thick wire prepared in step S1 is kept at 850°C for 28 minutes, and then the thick wire is rolled into a plate with a thickness of 0.9 mm, and the plate is cut and fixed on an Ω-shaped mold and kept at 510°C for 36 seconds, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至400℃，并在该温度条件下保温43min，然后空冷，由此完成第一形状记忆合金部件2的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 400° C., kept at this temperature for 43 minutes, and then air-cooled, thereby completing the preparation of the first shape memory alloy component 2 .
所述弹簧形的第二形状记忆合金部件9的制备方法，是采用如下步骤实现的：The preparation method of the spring-shaped second shape memory alloy component 9 is implemented by the following steps:
S1：粗丝的制备：首先用真空感应熔炼法制备合金铸锭，并将该合金铸锭在860℃条件下保温3h，而后锻造，锻造结束后在1000℃条件下保温2h，然后轧制成直径为7.3mm的粗丝；S1: Preparation of thick wire: First, an alloy ingot is prepared by vacuum induction melting, and the alloy ingot is kept at 860°C for 3 hours, and then forged. After forging, it is kept at 1000°C for 2 hours, and then rolled into a thick wire with a diameter of 7.3 mm;
S2：形状记忆合金的成型工艺：将步骤S1制备的粗丝拉丝为直径为0.6mm的细丝，而后将该细丝绕制为弹簧，并将该弹簧加热至480℃，并在该温度条件保温28sec，然后取出并快速冷却以固定形状；S2: Shape memory alloy forming process: the thick wire prepared in step S1 is drawn into a thin wire with a diameter of 0.6 mm, and then the thin wire is wound into a spring, and the spring is heated to 480°C and kept at this temperature for 28 seconds, and then taken out and quickly cooled to fix the shape;
S3：形状记忆训练：将步骤S2制备的形状记忆合金成型件加热至430℃，并在该温度条件下保温40min，然后空冷、裁切，由此完成弹簧形的第二形状记忆合金部件9的制备。S3: Shape memory training: The shape memory alloy molded part prepared in step S2 is heated to 430° C. and kept at this temperature for 40 minutes, then air-cooled and cut, thereby completing the preparation of the spring-shaped second shape memory alloy component 9 .
具体实施过程中，所述第一形状记忆合金部件2呈圆弧形，且设置于金属簧片夹1的外弧面，第二形状记忆合金部件9与导电翘板触片4之间留设有操作间隙；翘板按钮4的中部通过铰座铰接于开关壳体3的上内壁；接线片8与外接电源的火线端连接；导电翘板触片5的一端通过动触点串接于供电电路中，另一端通过固定于其下表面中部的接线片I串接于供电电路中，且接线片I滑动贯穿于开关壳体3的下壁；第一形状记忆合金部件2与第二形状记忆合金部件9均由单程记忆的形状记忆合金制成；导电翘板触片5的右端部通过一根竖向固定杆固定于开关壳体3的内底壁；接线片8与开关壳体3的底壁固定连接。During the specific implementation process, the first shape memory alloy component 2 is arc-shaped and is arranged on the outer arc surface of the metal spring clip 1, and an operating gap is left between the second shape memory alloy component 9 and the conductive seesaw contact piece 4; the middle part of the seesaw button 4 is hinged to the upper inner wall of the switch housing 3 through a hinge seat; the wiring piece 8 is connected to the live wire end of the external power supply; one end of the conductive seesaw contact piece 5 is connected in series to the power supply circuit through a moving contact, and the other end is connected in series to the power supply circuit through a wiring piece I fixed in the middle of its lower surface, and the wiring piece I slides through the lower wall of the switch housing 3; the first shape memory alloy component 2 and the second shape memory alloy component 9 are both made of one-way memory shape memory alloy; the right end of the conductive seesaw contact piece 5 is fixed to the inner bottom wall of the switch housing 3 through a vertical fixing rod; the wiring piece 8 is fixedly connected to the bottom wall of the switch housing 3.
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