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CN111748288B - Packaging material, related adhesive film, preparation method of related adhesive film and photovoltaic module - Google Patents

Packaging material, related adhesive film, preparation method of related adhesive film and photovoltaic module Download PDF

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Publication number
CN111748288B
CN111748288B CN201910803787.8A CN201910803787A CN111748288B CN 111748288 B CN111748288 B CN 111748288B CN 201910803787 A CN201910803787 A CN 201910803787A CN 111748288 B CN111748288 B CN 111748288B
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weight
group
adhesive film
ethylene
groups
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CN111748288A (en
Inventor
王龙
魏梦娟
唐国栋
陈培
侯宏兵
周光大
林建华
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Hangzhou First Applied Material Co Ltd
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Hangzhou First Applied Material Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
    • C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09J123/0853—Vinylacetate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/33—Applications of adhesives in processes or use of adhesives in the form of films or foils for batteries or fuel cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention relates to an encapsulating material comprising a base resin, a modifying resin, a catalyst, a light stabilizer and optionally an activator. The invention also relates to an encapsulation adhesive film formed by the encapsulation material, a preparation method thereof and a photovoltaic module containing the encapsulation adhesive film.

Description

Packaging material, related adhesive film, preparation method of related adhesive film and photovoltaic module
Technical Field
The invention belongs to the field of photovoltaic packaging materials, and relates to a packaging material, an adhesive film formed by the packaging material, a preparation method of the adhesive film and a photovoltaic module containing the adhesive film.
Background
With the emphasis on environmental protection and renewable energy, solar power generation has been rapidly developed as a new energy source. The packaging adhesive film is an important auxiliary material of the photovoltaic module, plays roles of insulation, weather resistance and isolation of external harmful substances, and is used as a binder for binding all parts of the module. With the development of photovoltaic technology, the demand on photovoltaic packaging adhesive films is higher and higher due to the continuous promotion of battery technology.
Important performances of the photovoltaic packaging adhesive film such as barrier property, mechanical property, creep resistance and the like are closely related to the crosslinking degree of the adhesive film. The latest version of the Chinese Association of photovoltaic industries Standard (GB/T29848-2018) states that the degree of crosslinking of ethylene/vinyl acetate copolymers (EVA) should be greater than 75% and the degree of crosslinking of polyolefin elastomers (POE) should be greater than 60%. To achieve this, a common method at present is to add a crosslinking agent and a co-crosslinking agent (bridging agent) to the adhesive film. After the adhesive film is heated, the crosslinking agent such as organic peroxide is decomposed to generate free radicals, and the crosslinking reaction between the matrix resin and the auxiliary crosslinking agent is initiated. Meanwhile, the free radical can also initiate the grafting reaction of the silane coupling agent and the packaging base material, so that the adhesive force of the adhesive film is improved. However, such a cross-linking system requires a long reaction time, which severely reduces the efficiency of the device fabrication and increases the cost of the device fabrication. Also organic peroxides tend to cause blistering problems in the assembly. The cross-linking assistant (bridging agent) is mainly a polar small molecular compound with multiple functional groups, has poor compatibility with EVA (ethylene vinyl acetate), particularly POE (polyolefin elastomer) resin, and can cause a series of problems of assistant precipitation, performance reduction and the like. In addition, in recent years, cadmium telluride, copper indium gallium selenide and other thin film batteries are rapidly developed, and the market share is gradually expanded. The free radicals generated by the thermal decomposition of the conventional packaging adhesive film can damage the structure of the thin film battery. Therefore, the thin film battery always adopts the non-crosslinked thermoplastic packaging adhesive film. Compared with a cross-linking type packaging adhesive film, the thermoplastic packaging adhesive film has obvious disadvantages in aspects of barrier property, mechanical property, creep resistance and the like. Therefore, the thin film battery assembly requires a ring of Polyisobutylene (PIB) glue around the assembly, which increases the cost of the assembly.
Therefore, a new rapid crosslinking mode is needed, the purpose of rapid and efficient crosslinking can be achieved without a free radical initiator and a bridging agent, the adhesive property of a packaging adhesive film is guaranteed, and the long-term and efficient work of the assembly is guaranteed.
Disclosure of Invention
The invention aims to provide an encapsulating material and a glue film formed by the same, which do not contain a free radical initiator and an auxiliary crosslinking agent, can be quickly and efficiently crosslinked by utilizing the reaction among the components, have excellent crosslinking performance and have higher peel strength to glass, a back plate and the like.
In one aspect, the present invention provides an encapsulant comprising (I)
0-80 wt% of a matrix resin;
19 to 99.5 weight percent of polymer which contains silane coupling group and does not contain active group F and is used as modified resin, wherein the structural formula of the silane coupling group is shown in the specification
Figure BDA0002183052280000021
Wherein R is (C)1-C6) -alkyl, X and Y are each independently hydrogen, R or-O-R,
x and Y may be the same or different; and
the active group F is amino, carboxyl, hydroxyl, sulfydryl, acid anhydride group, sulfonic group, epoxy group, cyano, isocyanate group or acyl chloride group;
0.01 to 80% by weight of an active agent comprising two or more reactive groups F and being free of silane coupling groups, the reactive groups F and silane coupling groups having the meaning as defined hereinbefore;
0.001 to 2 wt% of a catalyst; and
0 to 1% by weight of a light stabilizer;
the weight% of each component is based on the total weight of the encapsulant, and the sum of the weight% of each component is 100%;
or, (II) it comprises
0-80 wt% of a matrix resin;
19 to 99.99% by weight of a polymer containing a silane coupling group and a reactive group F as a modified resin,
wherein the reactive group F and the silane coupling group have the meanings defined hereinbefore;
0.001 to 2 wt% of a catalyst; and
0 to 1% by weight of a light stabilizer;
the weight% of each component is based on the total weight of the encapsulant, and the weight% of each component adds up to 100%.
On the other hand, the invention also provides a packaging adhesive film prepared from the packaging material.
In another aspect, the invention further provides a method for preparing the packaging adhesive film, wherein the method comprises the steps of fully mixing the packaging materials and then extruding to form a film, so as to obtain the packaging adhesive film.
On the other hand, the invention also provides a photovoltaic module comprising the packaging adhesive film, wherein the photovoltaic module comprises a front packaging layer, a rear packaging layer, a battery piece positioned between the front packaging layer and the rear packaging layer, and a packaging adhesive film positioned between the front packaging layer and the battery piece or/and between the battery piece and the rear packaging layer; when only one layer of packaging adhesive film exists in the photovoltaic module, the packaging adhesive film is the packaging adhesive film, and when the packaging adhesive film between the front packaging layer and the battery piece and the packaging adhesive film between the battery piece and the rear packaging layer exist in the photovoltaic module, at least one of the two layers of packaging adhesive films is the packaging adhesive film.
The packaging material of the invention ingeniously utilizes a crosslinking system of modified resin, optional activating agent and catalyst, thoroughly gets rid of the dependence of a packaging adhesive film on a free radical and bridging agent system, has a faster and efficient crosslinking effect, shortens the crosslinking time, improves the component manufacturing efficiency, can ensure the adhesive property of the adhesive film, has higher peel strength to glass, a back plate and the like, and is an ideal photovoltaic component packaging material.
Detailed Description
In the present invention, all operations are carried out at room temperature under normal pressure unless otherwise specified. Hereinafter, the present invention will be described in detail by way of examples. The embodiments are not limited to the following disclosure, and various inventive subjects may be modified without departing from the gist of the present invention.
In one embodiment, the present invention provides an encapsulant comprising (I)
0-80 wt% of a matrix resin;
19 to 99.5 weight percent of polymer which contains silane coupling group and does not contain active group F and is used as modified resin, wherein the structural formula of the silane coupling group is shown in the specification
Figure BDA0002183052280000041
Wherein R is (C)1-C6) -alkyl, X and Y are each independently hydrogen, R or-O-R,
x and Y may be the same or different; and
the active group F is amino, carboxyl, hydroxyl, sulfydryl, acid anhydride group, sulfonic group, epoxy group, cyano, isocyanate group or acyl chloride group;
0.01 to 80% by weight of an active agent comprising two or more reactive groups F and being free of silane coupling groups, the reactive groups F and silane coupling groups having the meaning as defined hereinbefore;
0.001 to 2 wt% of a catalyst; and
0 to 1% by weight of a light stabilizer;
the weight% of each component is based on the total weight of the encapsulant, and the sum of the weight% of each component is 100%;
or, (II) it comprises
0-80 wt% of a matrix resin;
19 to 99.99% by weight of a polymer containing a silane coupling group and a reactive group F as a modified resin,
wherein the reactive group F and the silane coupling group have the meanings defined hereinbefore;
0.001 to 2 wt% of a catalyst; and
0 to 1% by weight of a light stabilizer;
the weight% of each component is based on the total weight of the encapsulant, and the weight% of each component adds up to 100%.
Scheme (I)
In this embodiment, the ratio of the weight percent of the matrix resin to the weight percent of the modified resin is 0-4:1, preferably 0.1-2.4: 1; the sum of the weight percentages of the modifying resin and the active agent is from 20 wt% to 99.99 wt%, more preferably from 30 wt% to 95 wt%.
The matrix resin is one or more polymers selected from the group consisting of: ethylene and vinyl acetate, propylene, butene, pentene, hexene, octene, methyl acrylate, methyl methacrylate, butadiene, 1, 4-pentadiene, isoprene, ethylidene norbornene, dicyclopentadiene, binary or multicomponent copolymers of 1, 4-hexadiene, polyvinyl butyral, block copolymers of butadiene/isoprene and styrene, natural rubber and trans-polyisoprene rubber. The melt index of the matrix resin is 0.5 to 45g/10min, preferably 5 to 30g/10 min.
The content of the matrix resin is 0 to 80 wt%, preferably 4.5 to 70 wt%, based on the total weight of the encapsulating material.
The modified resin is a polymer which contains a silane coupling group and does not contain an active group F, and the structural formula of the silane coupling group is shown in the specification
Figure BDA0002183052280000051
Wherein R is (C)1-C6) -alkyl, preferably (C)1-C4) Alkyl radicals such as the methyl, ethyl, n-propyl, isopropyl, n-butyl, tert-butyl, sec-butyl, isobutyl radicals; x and Y are each independently hydrogen, R or-O-R, and X and Y may be the same or different; the silane coupling group is preferably a methoxysilyl group, a dimethoxysilyl group, a trimethoxysilyl group, an ethoxysilyl group, a diethoxysilyl group, a trimethoxysilyl group, a propoxysilyl group, or the like; and
the active group F is amino, carboxyl, hydroxyl, sulfydryl, acid anhydride group, sulfonic group, epoxy group, cyano, isocyanate group or acyl chloride group.
The modified resin is one or more polymers containing silane coupling groups and no reactive groups F selected from the group consisting of: binary or multicomponent copolymers of ethylene with vinyl acetate, propylene, butene, pentene, hexene, octene, methyl acrylate, methyl methacrylate, butadiene, 1, 4-pentadiene, isoprene, ethylidene norbornene, dicyclopentadiene, 1, 4-hexadiene; polyvinyl butyral; block copolymers of butadiene/isoprene with styrene; natural rubber; trans-polyisoprene rubber.
Preferably, the silane coupling group is introduced into the molecular chain of the modified resin by means of a monomer participating in copolymerization or a radical-initiated grafting reaction. The content of the silane coupling group is 0.05 to 15% by weight, preferably 0.2 to 10% by weight, more preferably 0.5 to 6.5% by weight, based on the weight of the modified resin.
The content of the modified resin is 19 to 99.5 wt% based on the total weight of the encapsulating material.
The active agent comprises two or more reactive groups F and is free of silane coupling groups, the reactive groups F and silane coupling groups having the meanings defined hereinbefore. The active agent may be either a small molecule or a large molecule, such as a polymer. The active agent may be ethylene glycol, oxalic acid, ethylenediamine, glycerol, 1, 2-butanediol, 1, 3-butanediol, 1, 4-butanediol, hexamethylenediamine, ethylene-pentene copolymers containing mercapto groups, ethylene-hexene copolymers containing acid chloride, hydroxyl, carboxyl or sulfonic groups, ethylene-butene copolymers containing isocyanate, anhydride or acid chloride groups.
The active agent is present in an amount of 0.01 to 80 wt.%, preferably 0.01 to 60 wt.%, based on the total weight of the encapsulating material.
The catalyst is one or more compounds selected from the group consisting of: dimethyl benzylamine, 1, 4-dimethyl piperazine, 1,8 diazabicyclo [5,4,0] undec-7-ene, dibutyltin dilaurate, stannous octoate, dioctyltin dithiolate, dibutyltin oxide, dibutyltin diacetate, dibutyltin didodecylthio, N-dimethyl cyclohexylamine, bis (2-dimethylaminoethyl) ether, triethylenediamine, N ', N', N-tetramethylalkylenediamine, N ', N' -pentamethyldiethylenetriamine, triethylamine, N ', N-dimethyl benzylamine, N', N-dimethylhexadecylamine, N ', N-dimethylbutylamine, triethylenediamine, N-ethylmorpholine, N-methylmorpholine, N', N-diethylpiperazine, N-dimethylbenzylamine, N ', N-dimethylbenzylamine, triethylenediamine, N-ethylmorpholine, N-methylmorpholine, N', N-diethylpiperazine, N-dimethylpiperazine, and mixtures thereof, N ', N-diethyl-2-methylpiperazine, N', N-bis- (α -hydroxypropyl) -2-methylpiperazine, N-2-hydroxypropyl dimethylmorpholine, triethanolamine, N ', N-dimethylethanolamine, pyridine, N', N-dimethylpyridine, potassium carboxylate, 2,4, 6-tris (dimethylaminomethyl) phenol, trimethyl-N-2-hydroxypropylhexanoic acid, 1,3, 5-tris (dimethylaminopropyl) -hexahydrotriazine, tetraethyl titanate, tetraisopropyl titanate, tetrapropyl titanate, tetrabutyl titanate, isopropyl zirconate, N-propyl zirconate, organobismuth, organolead and organomercury.
Preferably, the catalyst may be coated with a coating such as a low melting polymer or hydrophobic material. Aiming at a high-activity catalyst or a system with rapid self-crosslinking reaction, the catalyst is effectively coated, the catalyst and an auxiliary agent which has the self-crosslinking reaction are isolated at the early stage of the extrusion process, and the coating is removed at the middle and later stages of the extrusion process to expose the catalyst to play a role, so that the crosslinking is avoided in the extrusion process, the processing temperature window is increased, and the smooth production is ensured.
The melting point of the wrap is in the range of 40-120 ℃. Wraps include, but are not limited to, polyethylene wax, polypropylene, polyisobutylene, poly 1, 4-isoprene, polyethylene oxide, polystyrene, and polymethyl methacrylate.
The catalyst is present in an amount of 0.003 to 2 wt.%, preferably 0.005 to 1 wt.%, more preferably 0.005 to 0.3 wt.%, based on the total weight of the encapsulating material.
The light stabilizer is one or more compounds selected from the group consisting of: bis (2,2,6, 6-tetramethyl-4-piperidyl) sebacate, bis (1-octyloxy-2, 2,6, 6-tetramethyl-4-piperidyl) sebacate, a graft copolymer obtained by polymerizing 4- (meth) acryloyloxy-2, 2,6, 6-tetramethylpiperidine with an α -olefin monomer, 4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidinol, hexadecyl 3, 5-di-tert-butyl-4-hydroxy-benzoate, bis-2, 2,6, 6-tetramethylpiperidinol sebacate, and tris (1,2,2,6, 6-pentamethyl-4-piperidyl) phosphite.
The light stabilizer is present in an amount of 0 to 1% by weight, preferably 0.001 to 0.5% by weight, more preferably 0.001 to 0.1% by weight, based on the total weight of the encapsulating material.
Scheme (II)
In this embodiment, the ratio of the weight percent of the base resin to the weight percent of the modified resin is 0-4:1, preferably 0-2: 1.
The components used as the base resin, catalyst and light stabilizer and their treatment or modification are described in detail in the above-mentioned scheme (I).
The content of the matrix resin is 0 to 80 wt%, preferably 0 to 60 wt%, based on the total weight of the encapsulating material.
The catalyst is present in an amount of 0.001 to 2 wt.%, preferably 0.001 to 0.5 wt.%, based on the total weight of the encapsulating material.
The light stabilizers are present in an amount of from 0 to 1% by weight, preferably from 0.02 to 0.5% by weight, based on the total weight of the encapsulating material.
The modified resin is a polymer comprising a silane coupling group and a reactive group F, wherein the silane coupling group and the reactive group F have the meaning defined in scheme (I).
The modified resin is one or more polymers comprising a silane coupling group and a reactive group F selected from the group consisting of: binary or multicomponent copolymers of ethylene with vinyl acetate, propylene, butene, pentene, hexene, octene, methyl acrylate, methyl methacrylate, butadiene, 1, 4-pentadiene, isoprene, ethylidene norbornene, dicyclopentadiene, 1, 4-hexadiene; polyvinyl butyral; block copolymers of butadiene/isoprene with styrene; natural rubber; trans-polyisoprene rubber.
Preferably, the silane coupling group is introduced into the molecular chain of the modified resin by means of a monomer participating in copolymerization or a radical-initiated grafting reaction. The content of the silane coupling group is 0.05 to 15% by weight, preferably 0.2 to 10% by weight, more preferably 0.5 to 6.5% by weight, based on the weight of the modified resin.
The content of the modified resin is 19 to 99.99% by weight, preferably 40 to 99.5% by weight, based on the total weight of the encapsulating material.
In variant (II), the encapsulating material additionally comprises from 0 to 60% by weight, preferably from 0 to 40% by weight, of an active agent which contains two or more reactive groups F and is free of silane coupling groups, where the reactive groups F and silane coupling groups have the meaning defined in variant (I). The components used as the active agent are as described in scheme (I).
In addition, the encapsulating material according to the invention also comprises from 0 to 15% by weight, preferably from 0 to 10% by weight, of pigment, based on the total weight of the encapsulating material. The pigment may be one or more components selected from the group consisting of: titanium dioxide, zinc oxide, hollow glass beads, aluminum oxide, aluminum-doped zinc oxide, indium tin oxide, antimony oxide, calcium carbonate, barium sulfate, montmorillonite, kaolin, talcum powder, feldspar powder, carbon black, copper-chromium black, ultramarine blue, indigo and iron oxide red.
In one embodiment, the invention also provides a packaging adhesive film prepared from the packaging material.
The thickness of the packaging adhesive film is 0.01-1mm, preferably 0.2-0.6 mm.
In one embodiment, the invention also provides a method for preparing the packaging adhesive film, which comprises the steps of fully mixing the packaging materials and then extruding the mixture into a film, so as to obtain the packaging adhesive film.
Preferably, the components in the packaging material are fully mixed according to a certain proportion, then the mixture is added into an extruder, the mixture is precisely extruded by a screw, and a film is formed by casting through a T-shaped die head, so that the packaging adhesive film is obtained.
In one embodiment, the invention also provides a photovoltaic module comprising the above-mentioned packaging adhesive film, the photovoltaic module comprises a front packaging layer, a rear packaging layer, a cell sheet positioned between the front packaging layer and the rear packaging layer, and a packaging adhesive film positioned between the front packaging layer and the cell sheet or/and between the cell sheet and the rear packaging layer; when only one layer of packaging adhesive film exists in the photovoltaic module, the packaging adhesive film is the packaging adhesive film, and when the packaging adhesive film between the front packaging layer and the battery piece and the packaging adhesive film between the battery piece and the rear packaging layer exist in the photovoltaic module, at least one of the two layers of packaging adhesive films is the packaging adhesive film.
The front packaging layer can be glass or a transparent water-resistant film. The back packaging layer is glass or a back plate. The cell pieces used in the photovoltaic module can be crystalline silicon cells and can also be thin film cells such as cadmium telluride, copper indium gallium selenide, perovskite and the like. The photovoltaic module is generally prepared by conventional methods such as lamination.
In one embodiment, the photovoltaic module is subjected to DH (85 ℃, 85 RH%) aging testing according to IEC61215-2 standard. The photovoltaic module after aging is free of delamination, bubbles, and module power decay is less than 5%, preferably less than 4%, more preferably less than 3%, particularly preferably less than 2%, and most preferably less than 1%.
Examples
The present invention is further described with reference to specific examples, but the scope of the present invention is not limited to the examples.
Example 1
The packaging material of the present invention comprises the following components:
9.959% by weight of an ethylene-vinyl acetate copolymer having a melt index of 30g/10min,
90% by weight of an ethylene-vinyl acetate copolymer comprising 1.0% by weight of maleic anhydride and 0.5% by weight of trimethoxy silane coupling groups,
0.02% by weight of ethylene glycol,
0.001 wt% of dimethyl benzylamine, and
0.02% by weight of bis (2,2,6, 6-tetramethyl-4-piperidyl) sebacate.
The encapsulant is designated S-1.
Example 2
The packaging material of the present invention comprises the following components:
79.984 wt.% of a mixture of an ethylene-propylene copolymer and an ethylene-butene copolymer having a melt index of 22g/10min,
20 wt% of an ethylene-butene copolymer containing 2.0 wt% of a triethoxysilane coupling group,
0.01% by weight of oxalic acid,
0.005% by weight of 1, 4-dimethylpiperazine,
0.001% by weight of bis (1-octyloxy-2, 2,6, 6-tetramethyl-4-piperidyl) sebacate.
The packaging material is marked as S-2
Example 3
The packaging material of the present invention comprises the following components:
39.975 wt% of an ethylene-butene copolymer having a melt index of 14g/10min,
30% by weight of an ethylene-pentene copolymer comprising 4.0% by weight of tripropoxysilane coupling groups,
30% by weight of an ethylene-pentene copolymer containing 1.2% by weight of mercapto groups,
0.02% by weight of triethylenediamine, and
0.005% by weight of hexadecyl 3, 5-di-tert-butyl-4-hydroxy-benzoate.
The packaging material is marked as S-3.
Example 4
The packaging material of the present invention comprises the following components:
19.88% by weight of an ethylene-butene copolymer having a melt index of 5g/10min,
30% by weight of an ethylene-pentene copolymer comprising 4.0% by weight of trimethoxy silane coupling groups,
50% by weight of an ethylene-pentene copolymer comprising 1.2% by weight of mercapto groups,
0.02% by weight of triethylenediamine,
0.1% by weight of hexadecyl 3, 5-di-tert-butyl-4-hydroxy-benzoate.
The encapsulant is designated S-4.
Example 5
The packaging material of the present invention comprises the following components:
4.89 wt% of an ethylene-octene copolymer having a melt index of 8g/10min,
60% by weight of an ethylene-octene copolymer comprising 2.5% by weight of tripropoxysilane coupling groups and 2.0% of isocyanate groups,
35% by weight of an ethylene-pentene copolymer comprising 1.2% by weight of carboxyl groups,
0.01% by weight of tetrapropyl titanate,
0.1% by weight of hexadecyl 3, 5-di-tert-butyl-4-hydroxy-benzoate.
The encapsulant is designated S-5.
Example 6
The packaging material of the present invention comprises the following components:
8.6% by weight of an ethylene-butene copolymer having a melt index of 10g/10min,
90 wt.% of a composition comprising 3.4 wt.% of a triethoxysilane coupling group and 1.0 wt.%
% 2-vinylsuccinic anhydride group of an ethylene-octene copolymer,
1.0% by weight of ethylenediamine, based on the total weight of the composition,
0.1% by weight of triethanolamine,
0.3% by weight of hexadecyl 3, 5-di-tert-butyl-4-hydroxy-benzoate.
The packaging material is marked as S-6
Example 7
The packaging material of the present invention comprises the following components:
9.07 wt% of an ethylene-hexene copolymer having a melt index of 10g/10min,
30% by weight of an ethylene-hexene copolymer containing 6.5% by weight of trimethoxy silane coupling groups,
60% by weight of an ethylene-hexene copolymer containing 1.3% by weight of acid chloride groups,
0.8% by weight of glycerol, based on the total weight of the composition,
0.07% by weight of stannous octoate,
0.06% by weight of hexadecyl 3, 5-di-tert-butyl-4-hydroxy-benzoate.
The encapsulant is designated S-7.
Example 8
The packaging material of the present invention comprises the following components:
9.87% by weight of an ethylene-hexene copolymer having a melt index of 10g/10min,
30% by weight of an ethylene-hexene copolymer containing 6.5% by weight of a triethoxysilane coupling group,
30% by weight of an ethylene-hexene copolymer containing 1.3% by weight of acid chloride groups,
30% by weight of an ethylene-hexene copolymer containing 1.2% by weight of hydroxyl groups
0.07% by weight of stannous octoate,
0.06% by weight of hexadecyl 3, 5-di-tert-butyl-4-hydroxy-benzoate.
The encapsulant is designated S-8.
Example 9
The packaging material of the present invention comprises the following components:
9.83% by weight of an ethylene-hexene copolymer having a melt index of 10g/10min,
30% by weight of an ethylene-hexene copolymer containing 3.5% by weight of a triethoxysilane coupling group,
30% by weight of an ethylene-hexene copolymer containing 6.5% by weight of hydroxyl groups,
30% by weight of an ethylene-butene copolymer containing 1.6% by weight of isocyanate groups,
0.12% by weight of dibutyltin oxide,
0.05% by weight of 4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidinol.
The encapsulant is designated S-9.
Example 10
The packaging material of the present invention comprises the following components:
4.875 wt.% of an ethylene-methacrylic acid copolymer having a melt index of 18g/10min,
40 wt% of an ethylene-pentene copolymer comprising 4.0 wt% of a triethoxysilane coupling group,
30% by weight of an ethylene-hexene copolymer containing 6.5% by weight of carboxyl groups,
25% by weight of an ethylene-butene copolymer containing 1.6% by weight of 2-propenyl succinic anhydride groups,
0.12% by weight of dibutyltin dilauryl sulfide,
0.005% by weight of 4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidinol.
The encapsulant is designated S-10.
Example 11
The packaging material of the present invention comprises the following components:
4.875% by weight of polyvinyl butyral having a melt index of 18g/10min,
40 wt% of an ethylene-pentene copolymer comprising 4.0 wt% of a triethoxysilane coupling group,
30% by weight of an ethylene-hexene copolymer containing 6.5% by weight of carboxyl groups,
25% by weight of an ethylene-butene copolymer containing 1.6% by weight of acid chloride groups,
0.12% by weight of dibutyltin dilauryl sulfide,
0.005% by weight of 4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidinol.
The encapsulant is designated S-11.
Example 12
The packaging material of the present invention comprises the following components:
4.69 wt.% of an ethylene-methyl methacrylate copolymer having a melt index of 22g/10min,
42% by weight of an ethylene-pentene copolymer comprising 2.0% by weight of trimethoxy silane coupling groups,
25% by weight of an ethylene-hexene copolymer containing 4.5% by weight of sulfonic acid groups,
20% by weight of an ethylene-butene copolymer containing 1.6% by weight of isocyanate groups,
0.3% by weight of N-ethylmorpholine,
0.01% by weight of 4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidinol,
5% by weight of titanium dioxide, and
3% by weight of hollow glass beads.
The encapsulant is designated S-12.
Example 13
The packaging material of the present invention comprises the following components:
99.02 wt.% of a composition comprising 3.0 wt.% of a tripropoxysilane coupling group and 2.5 wt.%
Weight% of an ethylene-pentene copolymer of 2-isobutenylsuccinic anhydride groups,
0.2% by weight of 1, 4-butanediol,
0.25% by weight of tetraethyl titanate,
0.03% by weight of 4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidinol,
0.5% by weight of carbon black.
The encapsulant is designated S-13.
Example 14
The packaging material of the present invention comprises the following components:
89.32 wt.% of a composition comprising 3.0 wt.% of a tri-butoxysilane coupling group and 1.5
An ethylene-pentene copolymer having a weight% of isocyanate groups,
0.3% by weight of 1, 4-butanediol,
0.35% by weight of triethylenediamine,
0.03% by weight of 4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidinol,
5% by weight of barium sulfate, and
5% by weight of alumina.
The encapsulant is designated S-14.
Example 15
The packaging material of the present invention comprises the following components:
9.32% by weight of an ethylene-butadiene copolymer,
80 wt.% of a composition comprising 3.0 wt.% of a triisopropoxysilane coupling group and 1.5
An ethylene-methyl acrylate copolymer having a weight percent of isocyanate groups,
0.3% by weight of succinic acid,
0.35% by weight of an organic bismuth,
0.03% by weight of 4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidinol,
5% by weight of barium sulfate, and
5% by weight of alumina.
The encapsulant is designated S-15.
Example 16
The packaging material of the present invention comprises the following components:
89.35 wt% of an ethylene-methyl methacrylate terpolymer containing 2.5 wt% of tri-t-butoxysilane coupling groups and 1.5 wt% of isocyanate groups,
0.3% by weight of butanediol,
0.32% by weight of organic mercury,
0.03% by weight of 4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidinol,
5% by weight of barium sulfate, and
5% by weight of alumina.
The encapsulant is designated S-16.
Example 17
The packaging material of the present invention comprises the following components:
9.69 wt.% of a butadiene/isoprene and styrene block copolymer with a melt index of 20g/10min,
37 weight percent of an ethylene-pentene copolymer comprising 2.0 weight percent of tri-sec-butoxysilane coupling groups,
25% by weight of an ethylene-hexene copolymer containing 4.5% by weight of sulfonic acid groups,
20% by weight of an ethylene-butene copolymer containing 1.6% by weight of isocyanate groups,
0.3% by weight of an organolead,
0.01% by weight of 4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidinol,
5% by weight of titanium dioxide, and
3% by weight of hollow glass beads.
The encapsulant is designated S-17.
Example 18
The packaging material of the present invention comprises the following components:
9.959% by weight of an ethylene-vinyl acetate copolymer having a melt index of 30g/10min,
90% by weight of an ethylene-vinyl acetate copolymer comprising 2.0% by weight of isocyanate and 0.5% by weight of trimethoxy silane coupling groups,
0.02% by weight of ethylene glycol,
0.001% by weight of dibutyltin dilaurate coated with polystyrene,
0.02% by weight of bis (2,2,6, 6-tetramethyl-4-piperidyl) sebacate.
The encapsulant is designated S-18.
Example 19
The packaging material of the present invention comprises the following components
19.979 wt% of an ethylene-butene copolymer containing 5.0 wt% triethoxysilane,
80% by weight of an ethylene-butene copolymer comprising 2.0% by weight of isocyanate groups and 1.5% by weight of hydroxyl groups,
0.001% by weight of dibutyltin dilaurate coated with polystyrene,
0.02% by weight of bis (2,2,6, 6-tetramethyl-4-piperidyl) sebacate.
The encapsulant is designated S-19.
Example 20
The packaging material of the present invention comprises the following components
99.99% by weight of an ethylene-butene copolymer comprising 5.0% by weight of triethoxysilane and 2.0% by weight of hydroxyl groups
0.01% by weight of stannous octoate the encapsulating material is designated as S-20.
Example 21
The packaging material of the present invention comprises the following components
39.99% by weight of an ethylene-butene copolymer containing 5.0% by weight of triethoxysilane and 3.0% by weight of hydroxyl groups
60% by weight of an ethylene-butene copolymer containing 1.5% of isocyanate groups
0.01% by weight of stannous octoate
The encapsulant is designated S-21.
Example 22
The packaging material of the present invention comprises the following components
Ethylene-butene copolymer of 99.5 wt% triethoxysilane
0.49% butanediol
0.01% by weight of stannous octoate
The packaging material is marked as S-22
Example 23
The photovoltaic module comprises front glass, an S-1 adhesive film, a single crystal battery piece, a common packaging adhesive film, an S-1 adhesive film and a back plate. Carrying out DH (DH) aging on the photovoltaic module for 1000h, and recording as S-23
Example 24
The photovoltaic module comprises front glass, a common packaging adhesive film, a polycrystalline cell piece, an S-2 adhesive film and rear glass. Carrying out DH (DH) aging on the photovoltaic module for 1000h, and recording as S-24
Example 25
The photovoltaic module comprises front glass containing a cadmium telluride coating, an S-3 adhesive film and rear glass. Carrying out DH (DH) aging on the photovoltaic module for 1000h, and recording as S-25
Example 26
The photovoltaic module comprises front glass, an S-4 adhesive film, a copper indium gallium selenide thin-film battery, an S-4 adhesive film and rear glass. Carrying out DH (DH) aging on the photovoltaic module for 1000h, and recording as S-26
Example 27
The photovoltaic module comprises front glass, an S-5 adhesive film, a perovskite thin film battery, an S-5 adhesive film and rear glass. Carrying out DH (DH) aging on the photovoltaic module for 1000h, and recording as S-27
Comparative example 1
The packaging material comprises the following components:
9.6% by weight of an ethylene-butene copolymer having a melt index of 10g/10min,
90 wt% of an ethylene-octene copolymer comprising 3.4 wt% of a triethoxysilane coupling group and 1.0 wt% of a 2-vinylsuccinic anhydride group,
0.1% by weight of triethanolamine,
0.3% by weight of hexadecyl 3, 5-di-tert-butyl-4-hydroxy-benzoate.
The encapsulant is designated R-1.
Comparative example 2
The packaging material comprises the following components:
8.7% by weight of an ethylene-butene copolymer having a melt index of 10g/10min,
90% by weight of an ethylene-octene copolymer comprising 3.4% by weight of trimethoxy silane coupling groups and 1.0% by weight of 2-vinylsuccinic anhydride groups,
1.0% by weight of ethylenediamine,
0.3% by weight of hexadecyl 3, 5-di-tert-butyl-4-hydroxy-benzoate.
The encapsulant is designated R-2.
Comparative example 3
The packaging material comprises the following components:
8.6% by weight of an ethylene-butene copolymer having a melt index of 10g/10min,
90% by weight of an ethylene-octene copolymer comprising 1.0% by weight of trimethoxy anhydride groups,
1.0% by weight of ethylenediamine,
0.1% by weight of triethanolamine,
0.3% by weight of hexadecyl 3, 5-di-tert-butyl-4-hydroxy-benzoate.
The encapsulant is designated R-3.
Comparative example 4
The packaging material comprises the following components:
98.6% by weight of an ethylene-butene copolymer having a melt index of 10g/10min,
1.0% by weight of ethylenediamine,
0.1% by weight of triethanolamine,
0.3% by weight of hexadecyl 3, 5-di-tert-butyl-4-hydroxy-benzoate.
The encapsulant is designated R-4.
Preparing packaging adhesive film
The components of the packaging materials of the examples and the comparative examples are fully mixed according to a set proportion, added into an extruder, precisely extruded by a screw, and subjected to tape casting film forming by a T-shaped die head, so that the corresponding packaging adhesive film is obtained.
For comparison, the thickness of the obtained packaging adhesive film is 0.5 mm.
Evaluation of Performance
The encapsulating adhesive film obtained in the above embodiment was applied to encapsulation of a solar cell module, and evaluated by the following test method, and the evaluation results are listed in table 1:
1. degree of crosslinking of packaging adhesive film
The test method is referred to the standard GB/T29848 ethylene-vinyl acetate copolymer for photovoltaic module encapsulation (EV glue film).
2. Peel strength of packaging adhesive film and glass/back plate
The test method is referred to the standard GB/T29848 ethylene-vinyl acetate copolymer for photovoltaic module encapsulation (EV glue film).
The test results are shown in table 1 below.
TABLE 1 degree of crosslinking and peeling Strength of the adhesive packaging films obtained in the examples
Figure BDA0002183052280000201
Table 2 example component burn-in test results
Numbering Appearance of the Assembly Module power attenuation
S-23 No bubble and no delamination 0.9％
S-24 No bubble and no delamination 0.9％
S-25 No bubble and no delamination 1.0％
S-26 No bubble and no delamination 1.1％
S-27 No bubble and no delamination 0.9％
The test results in table 1 and table 2 show that the adhesive film prepared according to the present invention, although free of "radical" initiator and bridging agent, can be crosslinked rapidly after lamination, and maintain good reliability, and is an ideal polymer encapsulation material.
The above-described embodiments are intended to illustrate rather than to limit the invention, and any modifications and variations of the present invention are within the spirit of the invention and the scope of the appended claims.

Claims (8)

1. An encapsulating material, (I) comprising
0-80 wt% of a matrix resin;
19 to 99.5 weight percent of polymer which contains silane coupling group and does not contain active group F and is used as modified resin, wherein the structural formula of the silane coupling group is shown in the specification
Figure FDA0003545288900000011
Wherein R is C1-C6Alkyl, X and Y are each independently hydrogen, R or-O-R, and X and Y may be the same or different; and
the active group F is amino, carboxyl, hydroxyl, sulfydryl, acid anhydride group, sulfonic group, epoxy group, cyano, isocyanate group or acyl chloride group;
0.01 to 80% by weight of an active agent comprising two or more reactive groups F and being free of silane coupling groups, the reactive groups F and silane coupling groups having the meaning as defined hereinbefore;
0.001 to 2 wt% of a catalyst; and
0 to 1% by weight of a light stabilizer;
the weight% of each component is based on the total weight of the encapsulant, and the sum of the weight% of each component is 100%;
or, (II) it comprises
0-80 wt% of a matrix resin;
19 to 99.99% by weight of a polymer containing a silane coupling group and a reactive group F as a modified resin,
wherein the reactive group F and the silane coupling group have the meanings defined hereinbefore;
0.001 to 2 wt% of a catalyst; and
0 to 1% by weight of a light stabilizer;
the weight% of each component is based on the total weight of the encapsulant, and the sum of the weight% of each component is 100%;
characterized in that in the case of (I), the modified resin is one or more polymers comprising silane coupling groups and free of reactive groups F selected from: binary or multicomponent copolymers of ethylene with vinyl acetate, propylene, butene, pentene, hexene, octene, methyl acrylate, methyl methacrylate, butadiene, 1, 4-pentadiene, isoprene, ethylidene norbornene, dicyclopentadiene, 1, 4-hexadiene; polyvinyl butyral; block copolymers of butadiene/isoprene with styrene; natural rubber and trans-polyisoprene rubber; and
in the case of (II), the modified resin is one or more polymers comprising a silane coupling group and a reactive group F selected from the group consisting of: binary or multicomponent copolymers of ethylene with vinyl acetate, propylene, butene, pentene, hexene, octene, methyl acrylate, methyl methacrylate, butadiene, 1, 4-pentadiene, isoprene, ethylidene norbornene, dicyclopentadiene, 1, 4-hexadiene; polyvinyl butyral; block copolymers of butadiene/isoprene with styrene; natural rubber; trans-polyisoprene rubber; and is
In the case of (I) and (II), the encapsulating material does not contain a co-crosslinking agent.
2. The encapsulating material according to claim 1, characterized in that in the case of (II), the encapsulating material further comprises an active agent which contains two or more reactive groups F and which is free of silane coupling groups, the reactive groups F and the silane coupling groups having the meaning defined in claim 1.
3. Encapsulant according to claim 1 or 2, characterized in that the active agent is ethylene glycol, oxalic acid, ethylenediamine, glycerol, 1, 2-butanediol, 1, 3-butanediol, 1, 4-butanediol, hexamethylenediamine, ethylene-pentene copolymers containing mercapto groups, ethylene-hexene copolymers containing acid chloride, hydroxyl, carboxyl or sulfonic groups, ethylene-butene copolymers containing isocyanate, anhydride or acid chloride groups.
4. Encapsulating material according to claim 1 or 2, characterized in that the catalyst is one or more compounds selected from the group consisting of: dimethyl benzylamine, 1, 4-dimethyl piperazine, 1,8 diazabicyclo [5,4,0] undec-7-ene, dibutyltin dilaurate, stannous octoate, dioctyltin dithiolate, dibutyltin oxide, dibutyltin diacetate, dibutyltin didodecylthio, N-dimethyl cyclohexylamine, bis (2-dimethylaminoethyl) ether, triethylenediamine, N ', N', N-tetramethylalkylenediamine, N ', N' -pentamethyldiethylenetriamine, triethylamine, N ', N-dimethyl benzylamine, N', N-dimethylhexadecylamine, N ', N-dimethylbutylamine, triethylenediamine, N-ethylmorpholine, N-methylmorpholine, N', N-diethylpiperazine, N-dimethylbenzylamine, N ', N-dimethylbenzylamine, triethylenediamine, N-ethylmorpholine, N-methylmorpholine, N', N-diethylpiperazine, N-dimethylpiperazine, and mixtures thereof, N ', N-diethyl-2-methylpiperazine, N', N-bis- (α -hydroxypropyl) -2-methylpiperazine, N-2-hydroxypropyl dimethylmorpholine, triethanolamine, N ', N-dimethylethanolamine, pyridine, N', N-dimethylpyridine, potassium carboxylate, 2,4,6- (dimethylaminomethyl) phenol, trimethyl-N-2-hydroxypropylhexanoic acid, 1,3, 5-tris (dimethylaminopropyl) -hexahydrotriazine, tetraethyl titanate, tetraisopropyl titanate, tetrapropyl titanate, tetrabutyl titanate, isopropyl zirconate, N-propyl zirconate, organobismuth, organolead and organomercury.
5. Encapsulating material according to claim 1 or 2, characterized in that the catalyst can be coated with a low-melting polymer or a hydrophobic material.
6. An adhesive packaging film prepared from the packaging material of any one of claims 1 to 5.
7. A method for preparing the encapsulating adhesive film of claim 6, comprising mixing the encapsulating material of any one of claims 1 to 5 thoroughly, and then extruding into a film, thereby obtaining the encapsulating adhesive film.
8. A photovoltaic module comprising the encapsulant film of claim 6, the photovoltaic module comprising a front encapsulant layer, a back encapsulant layer, a cell sheet positioned between the front encapsulant layer and the back encapsulant layer, and an encapsulant film positioned between the front encapsulant layer and the cell sheet or/and between the cell sheet and the back encapsulant layer; when only one layer of packaging adhesive film exists in the photovoltaic module, the packaging adhesive film is the packaging adhesive film of claim 6, and when the packaging adhesive film between the front packaging layer and the battery piece and the packaging adhesive film between the battery piece and the rear packaging layer exist in the photovoltaic module, at least one layer of the two layers of packaging adhesive films is the packaging adhesive film of claim 6.
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CN110016170A (en) * 2018-01-10 2019-07-16 杭州福斯特应用材料股份有限公司 A kind of low water vapor transmittance polyolefin elastomer glue film and preparation method

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CN110016170A (en) * 2018-01-10 2019-07-16 杭州福斯特应用材料股份有限公司 A kind of low water vapor transmittance polyolefin elastomer glue film and preparation method

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