CN111725091A - Method and device for optimizing process flow, storage medium and semiconductor processing equipment - Google Patents
Method and device for optimizing process flow, storage medium and semiconductor processing equipment Download PDFInfo
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Abstract
The invention discloses a method and a device for optimizing a process flow, a storage medium and semiconductor processing equipment. The method comprises the following steps: step S110, judging whether the current process step is an ignition process step, if so, executing step S120; if not, executing step S130; step S120, judging whether the glow starting of the current process step is successful, if so, executing step S130; if not, go to step S140; step S130, sequentially executing the next process step; step S140, judging whether the starting failure times exceed an alarm threshold value, if so, executing step S150; if not, go to step S160; step S150, outputting a glow starting failure alarm signal; and step S160, subtracting 1 from the counter of the process step, changing the value of the glow influence factor of the current process step, repeatedly executing the current process step and returning to the step S110. When accidental glow starting failure occurs, a user does not need to intervene, so that the timeliness of the process flow is strong, the operability is improved, the process flow can be normally carried out, and the productivity is improved.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a method for optimizing a process flow, a device for optimizing the process flow, a computer-readable storage medium and semiconductor processing equipment.
Background
Physical Vapor Deposition (PVD) is a process of evaporating a target by using a low-voltage and large-current arc discharge technique under vacuum, ionizing and glowing both an evaporated substance and a gas, and depositing the evaporated substance and a reaction product thereof on a workpiece (generally, a wafer) under the acceleration action of an electric field. The technology has been widely applied to the fields of Integrated Circuits (ICs), Light-emitting diodes (LEDs), photovoltaics, flat panel displays, and the like.
Because of hardware abnormity or unstable chamber environment, glow failure can happen. The failure of glow starting needs the process engineer to re-execute the process, which affects the productivity, and even directly causes the thinning of the wafer process coating film for some sensitive processes, so the failure of glow starting also becomes the problem which must be looked upon in the PVD process.
In the related art, when the ignition failure occurs, the process is forced to be terminated, and the ignition process is re-performed by means of user recovery. Obviously, in this related art, when the glow failure occurs, user intervention is required, the timeliness and operability are poor, and for some special processes, the process may be affected even because recovery is not performed for a long time.
Disclosure of Invention
The present invention is directed to at least one of the technical problems of the prior art, and provides a method for optimizing a process flow, an apparatus for optimizing a process flow, a computer-readable storage medium, and a semiconductor processing apparatus.
In order to achieve the above object, in a first aspect of the present invention, there is provided a method of optimizing a process flow, the process flow comprising sequentially performing a plurality of process steps, the method comprising:
step S110, judging whether the current process step is an ignition process step, if so, executing step S120; if not, executing step S130;
step S120, judging whether the glow starting of the current process step is successful, if so, executing step S130; if not, go to step S140;
step S130, sequentially executing the next process step;
step S140, judging whether the starting failure times exceed an alarm threshold value, if so, executing step S150; if not, go to step S160;
step S150, outputting a glow starting failure alarm signal;
and step S160, subtracting 1 from the counter of the process step, changing the value of the glow influence factor of the current process step, repeatedly executing the current process step and returning to the step S110.
Optionally, the judging whether the current process step is an ignition process step specifically includes:
acquiring a current preset process parameter value of a current process step and a previous preset process parameter value of a previous process step;
and judging whether the current process step is an ignition process step or not according to the current preset process parameter value and the previous preset process parameter value.
Optionally, the process parameter is a sputtering power, and the determining, according to the current preset process parameter value and the previous preset process parameter value, whether the current process step is an ignition process step specifically includes:
and when the current preset sputtering power value is zero and the current preset sputtering power value meets the preset range, judging that the current process step is an ignition process step.
Optionally, the predetermined range is [200W, 1000W ].
Optionally, the determining whether the glow starting in the current process step is successful specifically includes:
loading sputtering power;
and after the preset time, acquiring the actual sputtering power value output by the current process step, and determining whether the glow starting of the current process step is successful according to the actual sputtering power value.
Optionally, when the actual sputtering power value is greater than 85% of the current preset sputtering power value, the glow starting is determined to be successful.
Optionally, the value of the glow influence factor of the current process step is changed, specifically, the flow value of the process gas of the current process step is increased.
In a second aspect of the present invention, there is provided an apparatus for optimizing a process flow, the process flow comprising sequentially performing a plurality of process steps, the apparatus comprising:
the first judgment module is used for judging whether the current process step is an ignition process step or not, and if so, sending an ignition signal; if not, sending a non-ignition signal;
the second judgment module is used for judging whether the glow starting of the current process step is successful or not when the ignition signal is received, and if so, sending a glow starting success signal; if not, sending a temporary glow starting failure signal;
the execution module is used for sequentially executing the next process step when the non-ignition signal or the glow starting success signal is received;
the third judgment module is used for judging whether the starting failure times exceed an alarm threshold value or not when the starting temporary failure signal is received, and if so, sending a starting permanent failure signal; if not, sending out a glow starting remediation signal;
the alarm module is used for outputting a glow starting failure alarm signal when receiving the glow starting permanent failure signal;
the parameter setting module is used for subtracting 1 from the counter of the process step when the starting remediation signal is received, changing the starting influence factor value of the current process step and then sending out a repeated execution signal;
the execution module is further used for repeatedly executing the current process step when the repeated execution signal is received.
Optionally, the first determining module includes:
the first obtaining submodule is used for obtaining a current preset process parameter value of a current process step and a previous preset process parameter value of a previous process step;
and the first judgment submodule is used for judging whether the current process step is an ignition process step or not according to the current preset process parameter value and the previous preset process parameter value.
Optionally, the process parameter is a sputtering power, and the first determining submodule is specifically configured to:
and when the current preset sputtering power value is zero and the current preset sputtering power value meets the preset range, judging that the current process step is an ignition process step.
Optionally, the predetermined range is [200W, 1000W ].
Optionally, the second determining module includes:
the loading submodule is used for loading sputtering power;
the second obtaining submodule is used for obtaining the actual sputtering power value output by the current process step after the preset time;
and the second judgment submodule is used for determining whether the glow starting in the current process step is successful according to the actual sputtering power value.
Optionally, the second determining sub-module is configured to determine that the glow starting is successful when the actual sputtering power value is greater than 85% of the current preset sputtering power value.
Optionally, the parameter setting module is configured to increase a process gas flow value of the current process step.
In a third aspect of the present invention, a computer-readable storage medium is provided, which stores a computer program, which when executed by a processor implements the method of optimizing a process flow as described above.
In a fourth aspect of the present invention, there is provided a semiconductor processing apparatus comprising the apparatus for optimizing a process flow as described above.
The invention discloses a method and a device for optimizing a process flow, a computer readable storage medium and semiconductor processing equipment. When judging whether the ignition of the current process step is successful, a mechanism for judging whether the number of times of failed ignition exceeds an alarm threshold value is introduced, and when the number of times of failed ignition exceeds the alarm threshold value, the ignition influence factor value of the current process step in the next ignition process step is automatically optimized, so that the ignition success probability of the next ignition process step is increased. Therefore, when accidental glow starting failure occurs, a user does not need to intervene, so that the timeliness of the process flow is stronger, the operability is improved, the process flow can be normally carried out, and the productivity is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a flow chart of a method for optimizing a process flow in a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of an apparatus for optimizing a process flow according to a second embodiment of the present invention.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
In a first aspect, the present invention relates to a method for optimizing a process flow, which comprises sequentially performing a plurality of process steps, for example, in a magnetron sputtering process, the process flow generally comprises five process steps, i.e., an air-intake process step, an ignition process step, a deposition process step, a cooling process step, and an end process step. Of course, the process flow can also be applied to other process flows, and all the process flows including the ignition process step can be applied to the method for optimizing the process flow provided by the invention. For convenience of illustration, the process flow referred to below is only described by taking the magnetron sputtering process as an example.
Referring to fig. 1, a method S100 for optimizing a process flow includes:
step S110, judging whether the current process step is an ignition process step, if so, executing step S120; if not, go to step S130.
Specifically, in the present step, for example, the auxiliary judgment may be performed by some process parameters of the current process step, for example, by a set value of the sputtering power supply of the current process step, and may also be performed in combination with the set value of the sputtering power supply in the previous process step. Of course, in addition to this, it can also be determined whether the current process step is the ignition process step in some other way.
Step S120, judging whether the glow starting of the current process step is successful, if so, executing step S130; if not, go to step S140.
Specifically, in this step, for example, the determination may be made by the sputtering power at the time of the completion of the ignition, and if the sputtering power value at the time of the completion of the ignition exceeds the set ignition threshold, the success of the ignition may be determined, whereas if not, the failure of the ignition may be determined. Besides, it can also be determined whether the current process step is successfully ignited by some other determination means, for example, it can also be determined whether the process step is successfully ignited by detecting the illumination intensity in the chamber, and so on.
Step S130, the next process step is performed in sequence.
Specifically, taking the magnetron sputtering process as an example, after the glow starting is successful, the deposition process step, the cooling process step, the ending process step, and the like may be sequentially performed.
Step S140, judging whether the starting failure times exceed an alarm threshold value, if so, executing step S150; if not, go to step S160.
Specifically, in this step, for example, the alarm threshold may be set to be three times, of course, the alarm threshold is not limited to three times, and a person skilled in the art may also determine a specific value of the expected alarm threshold according to actual needs. When the number of glow starting failures does not exceed three, the current glow starting failure is only a sporadic glow starting failure phenomenon, and user intervention is not needed. Conversely, when the number of glow failures exceeds three, it indicates that the current process step requires the user to perform appropriate intervention, e.g., the user may retry the ignition process step or directly terminate the process.
And step S150, outputting a glow starting failure alarm signal.
Specifically, in this step, the glow failure alarm signal may be visually presented to the user in the form of sound, text, image, or the like, so that the user may be reminded of the currently performed process flow, and the glow failure is not sporadic, so that the user may take a solution to terminate the process flow.
And step S160, subtracting 1 from the counter of the process step, changing the value of the glow influence factor of the current process step, repeatedly executing the current process step and returning to the step S110.
Specifically, in this step, the purpose of subtracting 1 from the process step counter is to allow the current process step to be repeatedly performed. When the number of times of glow starting failure does not exceed the alarm threshold, it indicates that the glow starting failure phenomenon of the current process step may be only an accidental glow starting failure phenomenon, so that the step does not need active intervention of a user, and the glow starting influence factor value of the current process step can be automatically changed, for example, the flow value of the introduced process gas can be properly increased so as to increase the success probability of the next glow starting.
In the method for optimizing the process flow, when judging whether the glow starting of the current process step is successful, a mechanism for judging whether the number of glow starting failure times exceeds the alarm threshold value is introduced, and when the number of glow starting failure times does not exceed the alarm threshold value, the glow starting influence factor value of the current step in the next ignition process step is automatically optimized, so that the success probability of the glow starting of the next ignition process step is increased. Therefore, the method for optimizing the process flow of the embodiment does not need the intervention of a user when the accidental glow starting failure phenomenon exists, so that the timeliness of the process flow is strong, the operability is improved, the process flow can be normally carried out, and the productivity is improved.
Specifically, judging whether the current process step is an ignition process step specifically comprises the following steps:
and acquiring a current preset process parameter value of the current process step and a previous preset process parameter value of the previous process step. And judging whether the current process step is an ignition process step or not according to the current preset process parameter value and the previous preset process parameter value.
According to the method for optimizing the process flow, whether the current process step is the ignition process step or not is judged through the current preset process parameter value of the current process step and the previous preset process parameter value of the previous process step, the accuracy of judging whether the current process step is the ignition process step or not can be improved, and therefore the process flow can be optimized better.
More specifically, the process parameter may be sputtering power, so that the previous preset sputtering power value of the current process step is zero and the current sputtering power value of the current process step is within a predetermined range (for example, the predetermined range may be [200W, 1000W ], although the predetermined range is not limited thereto, and a person skilled in the art may determine the value range according to actual needs), and then it may be determined that the current process step is an ignition process step.
In the method for optimizing the process flow in this embodiment, whether the current process step is the ignition process step is determined by whether the sputtering power value of the previous process step is zero or not and whether the sputtering power value of the current process step meets the predetermined range or not, the method is simple, and whether the current process step is the ignition process step can be effectively determined.
Specifically, judging whether the glow starting in the current process step is successful or not specifically comprises the following steps:
and loading sputtering power to the chamber, acquiring the actual sputtering power value output by the current process step after preset time, and determining whether the glow starting of the current process step is successful according to the actual sputtering power value. For example, when the actual sputtering power value is greater than 85% of the current preset sputtering power value or is a specified sputtering threshold value, the glow starting is determined to be successful.
The method for optimizing the process flow in the embodiment judges whether the glow starting is successful or not by means of the relative relationship between the actual sputtering power value and the current preset sputtering power value at the end of the glow starting in the current process step, is simple, and can effectively improve the productivity.
Specifically, changing the value of the ignition influencing factor of the current process step is to increase the value of the process gas flow of the current process step. Generally, the probability of successful glow starting can be increased when the process gas flow rate value is increased.
The method for optimizing the process flow of the present invention will be exemplarily described below, assuming that the process flow of the magnetron sputtering process is as shown in the following table 1:
TABLE 1 Process flow
| Parameter(s) | 1 | 2 | 3 | 4 | 5 |
| Process step | Intake air | Ignition | Deposition of | Cooling down | End up |
| Time of day | T1 | T2 | T3 | T4 | T5 |
| Sputtering power | 0W | 500W | 3000W | 0W | 0W |
| Flow rate of Ar | 20sccm | 20sccm | 20sccm | 20sccm | 0sccm |
| … | … | … | … | … | .. |
Specifically, if the sputtering power set value in step 1 (air intake process step) is obtained to be 0, step 1 is considered not to be an ignition step, step 1 is executed, after step 1 is completed, the sputtering power set value in step 2 (ignition process step) is obtained to be 500W, and the requirement of [200W, 1000W ] is met, step 2 is judged to be an ignition process step, step 2 is started to be executed, after the empirical action in step 2 is completed, time T2 is passed, the actual output power of the sputtering power supply is detected, if the actual output power meets power >500 × 0.85, the glow starting is considered to be successful, and the process in step 3 is continuously executed; if the actual output power meets power <500 x 0.85, the glow starting is considered to be failed, at this time, the counter-1 needs to be checked, the Ar flow is increased to 24sccm (increased by 20%), then the current process step is executed repeatedly, namely step 2, if the glow starting is successful, the process of step 3 (deposition process step) is executed, if the glow starting is still failed, the counter-1 is continued, meanwhile, the Ar flow is increased to 28sccm (increased by 17%), if the retry times reach the alarm threshold (3 times), the glow starting is considered to be failed, at this time, an alarm is thrown out, and a user is prompted to stop the process or independently select to execute step 2 again.
In a second aspect of the present invention, as shown in fig. 2, an apparatus 100 for optimizing a process flow is provided, the process flow includes a plurality of process steps that are sequentially performed, the apparatus 100 may be adapted to perform the method for optimizing a process flow described above, and specific contents may refer to the related descriptions above, which are not repeated herein. The apparatus 100 comprises:
the first judging module 110 is configured to judge whether the current process step is an ignition process step, and if so, send an ignition signal; if not, a non-ignition signal is sent out.
The second judging module 120 is configured to judge whether the glow starting in the current process step is successful when the ignition signal is received, and if so, send a glow starting success signal; if not, sending a temporary glow starting failure signal;
and the execution module 130 is used for sequentially executing the next process step when the non-ignition signal or the glow starting success signal is received.
A third determining module 140, configured to determine whether the number of glow starting failures exceeds an alarm threshold when the temporary glow starting failure signal is received, and if so, send a permanent glow starting failure signal; if not, sending out an ignition remediation signal.
And the alarm module 150 is used for outputting an ignition failure alarm signal when receiving the ignition permanent failure signal.
And the parameter setting module 160 is configured to decrement the counter of the process step by 1 when receiving the ignition remedy signal, change the ignition influence factor value of the current process step, and then send out a repeat execution signal.
The execution module 130 is further configured to repeatedly execute the current process step when receiving the repeat execution signal.
The device for optimizing the process flow introduces a mechanism for judging whether the glow starting failure times exceed the alarm threshold value when judging whether the glow starting of the current process step succeeds, and automatically optimizes the glow starting influence factor value of the current step in the next ignition process step when the glow starting failure times do not exceed the alarm threshold value, so that the glow starting success probability of the next ignition process step is increased. Therefore, the device for optimizing the process flow of the embodiment does not need to be interfered by a user when accidental glow starting failure occurs, so that the timeliness of the process flow is strong, the operability is improved, the process flow can be normally carried out, and the productivity is improved.
Specifically, as shown in fig. 2, the first determining module 110 includes:
a first obtaining submodule 111, configured to obtain a current preset process parameter value of a current process step and a previous preset process parameter value of a previous process step;
and a first judging submodule 112, configured to judge whether the current process step is an ignition process step according to the current preset process parameter value and a previous preset process parameter value.
The device for optimizing the process flow according to the embodiment determines whether the current process step is the ignition process step through the current preset process parameter value of the current process step and the previous preset process parameter value of the previous process step, so that the accuracy of determining whether the current process step is the ignition process step can be improved, and the process flow can be optimized better.
Specifically, the process parameter is the sputtering power, and the first determining submodule 112 is specifically configured to:
when the current preset sputtering power value is zero and the current preset sputtering power value meets a preset range (for example, the preset range may be [200W, 1000W ], although the preset range is not limited thereto, and a person skilled in the art may determine the value range thereof according to actual needs), it is determined that the current process step is an ignition process step.
The device for optimizing the process flow in the embodiment determines whether the current process step is the ignition process step by means of whether the sputtering power value of the previous process step is zero or not and whether the sputtering power value of the current process step meets the preset range or not, has a simple structure, and can effectively determine whether the current process step is the ignition process step or not.
As shown in fig. 2, the second determination module 120 includes:
a loading submodule 121 for loading sputtering power to the chamber;
the second obtaining submodule 122 is configured to obtain an actual sputtering power value output by the current process step after a preset time;
and the second judgment submodule 123 is configured to determine whether the glow starting in the current process step is successful according to the actual sputtering power value. For example, the second determination sub-module 123 may determine that the ignition is successful when the actual sputtering power value is greater than 85% of the current preset sputtering power value or is a prescribed sputtering threshold value.
The device for optimizing the process flow in the embodiment judges whether the glow starting is successful or not by means of the relative relationship between the actual sputtering power value and the current preset sputtering power value at the end of the glow starting in the current process step, has a simple structure, and can effectively improve the productivity.
Optionally, a parameter setting module 160 for increasing the process gas flow value for the current process step.
In a third aspect of the present invention, a computer-readable storage medium (not shown in the drawings) is provided, where the computer-readable storage medium stores a computer program, and the computer program, when executed by a processor, implements the method for optimizing a process flow as described above, which may specifically refer to the related descriptions above and is not repeated herein.
The computer readable storage medium of this embodiment, when being executed by a processor, may store a computer program capable of executing the method for optimizing a process flow described above, and when determining whether the ignition of the current process step is successful, the computer program introduces a mechanism for determining whether the number of times of failed ignition exceeds an alarm threshold, and when the number of times of failed ignition exceeds the alarm threshold, automatically optimizes the value of the ignition impact factor of the current process step at the next ignition process step, thereby increasing the probability of successful ignition of the next ignition process step. Therefore, when accidental glow starting failure occurs, a user does not need to intervene, so that the timeliness of the process flow is stronger, the operability is improved, the process flow can be normally carried out, and the productivity is improved.
In a fourth aspect of the present invention, a semiconductor processing apparatus (not shown in the drawings) is provided, which includes the apparatus 100 for optimizing a process flow described above, and reference may be made to the above description for details, which are not repeated herein.
The semiconductor processing apparatus of this embodiment has the above-mentioned apparatus for optimizing process flow, and introduces a mechanism for determining whether the number of times of failed starting is greater than the alarm threshold when determining whether the current process step is successful, and automatically optimizes the value of the starting influencing factor of the current step in the next ignition process step when the number of times of failed starting is not greater than the alarm threshold, thereby increasing the probability of successful starting in the next ignition process step. Therefore, when accidental glow starting failure occurs, a user does not need to intervene, so that the timeliness of the process flow is stronger, the operability is improved, the process flow can be normally carried out, and the productivity is improved.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (16)
1. A method of optimizing a process flow comprising sequentially performing a plurality of process steps, the method comprising:
step S110, judging whether the current process step is an ignition process step, if so, executing step S120; if not, executing step S130;
step S120, judging whether the glow starting of the current process step is successful, if so, executing step S130; if not, go to step S140;
step S130, sequentially executing the next process step;
step S140, judging whether the starting failure times exceed an alarm threshold value, if so, executing step S150; if not, go to step S160;
step S150, outputting a glow starting failure alarm signal;
and step S160, subtracting 1 from the counter of the process step, changing the value of the glow influence factor of the current process step, repeatedly executing the current process step and returning to the step S110.
2. The method for optimizing a process flow according to claim 1, wherein the determining whether the current process step is an ignition process step specifically comprises:
acquiring a current preset process parameter value of a current process step and a previous preset process parameter value of a previous process step;
and judging whether the current process step is an ignition process step or not according to the current preset process parameter value and the previous preset process parameter value.
3. The method for optimizing process flow according to claim 2, wherein the process parameter is sputtering power, and the determining whether the current process step is an ignition process step according to the current preset process parameter value and the previous preset process parameter value specifically comprises:
and when the current preset sputtering power value is zero and the current preset sputtering power value meets the preset range, judging that the current process step is an ignition process step.
4. The method of optimizing a process flow of claim 3, wherein the predetermined range is [200W, 1000W ].
5. The method for optimizing process flow according to any one of claims 1 to 4, wherein the determining whether the current process step is successfully started specifically comprises:
loading sputtering power;
and after the preset time, acquiring the actual sputtering power value output by the current process step, and determining whether the glow starting of the current process step is successful according to the actual sputtering power value.
6. The method for optimizing process flow according to claim 5, wherein the successful starting is determined when the actual sputtering power value is greater than 85% of the current preset sputtering power value.
7. The method for optimizing a process flow according to any one of claims 1 to 4, wherein the value of the ignition influencing factor of the current process step is changed, in particular the value of the process gas flow of the current process step is increased.
8. An apparatus for optimizing a process flow comprising sequentially performing a plurality of process steps, the apparatus comprising:
the first judgment module is used for judging whether the current process step is an ignition process step or not, and if so, sending an ignition signal; if not, sending a non-ignition signal;
the second judgment module is used for judging whether the glow starting of the current process step is successful or not when the ignition signal is received, and if so, sending a glow starting success signal; if not, sending a temporary glow starting failure signal;
the execution module is used for sequentially executing the next process step when the non-ignition signal or the glow starting success signal is received;
the third judgment module is used for judging whether the starting failure times exceed an alarm threshold value or not when the starting temporary failure signal is received, and if so, sending a starting permanent failure signal; if not, sending out a glow starting remediation signal;
the alarm module is used for outputting a glow starting failure alarm signal when receiving the glow starting permanent failure signal;
the parameter setting module is used for subtracting 1 from the counter of the process step when the starting remediation signal is received, changing the starting influence factor value of the current process step and then sending out a repeated execution signal;
the execution module is further used for repeatedly executing the current process step when the repeated execution signal is received.
9. The apparatus for optimizing a process flow of claim 8, wherein the first determining module comprises:
the first obtaining submodule is used for obtaining a current preset process parameter value of a current process step and a previous preset process parameter value of a previous process step;
and the first judgment submodule is used for judging whether the current process step is an ignition process step or not according to the current preset process parameter value and the previous preset process parameter value.
10. The apparatus for optimizing process flow according to claim 9, wherein the process parameter is sputtering power, and the first determining submodule is specifically configured to:
and when the current preset sputtering power value is zero and the current preset sputtering power value meets the preset range, judging that the current process step is an ignition process step.
11. The apparatus for optimizing a process flow of claim 10, wherein the predetermined range is [200W, 1000W ].
12. The apparatus for optimizing a process flow of any one of claims 8 to 11, wherein the second determining module comprises:
the loading submodule is used for loading sputtering power;
the second obtaining submodule is used for obtaining the actual sputtering power value output by the current process step after the preset time;
and the second judgment submodule is used for determining whether the glow starting in the current process step is successful according to the actual sputtering power value.
13. The apparatus for optimizing process flow of claim 12, wherein the second determining sub-module is configured to determine that the priming is successful when the actual sputtering power value is greater than 85% of the current preset sputtering power value.
14. The apparatus of any one of claims 8 to 11, wherein the parameter setting module is configured to increase the process gas flow value of the current process step.
15. A computer-readable storage medium, characterized in that it stores a computer program which, when executed by a processor, implements a method of optimizing a process flow according to any one of claims 1 to 7.
16. A semiconductor processing apparatus comprising the apparatus for optimizing a process flow of any one of claims 8 to 14.
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