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CN111710699A - Display panel and manufacturing method thereof - Google Patents

Display panel and manufacturing method thereof Download PDF

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Publication number
CN111710699A
CN111710699A CN202010541588.7A CN202010541588A CN111710699A CN 111710699 A CN111710699 A CN 111710699A CN 202010541588 A CN202010541588 A CN 202010541588A CN 111710699 A CN111710699 A CN 111710699A
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CN
China
Prior art keywords
layer
light
electrode
manufacturing
pit
Prior art date
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Pending
Application number
CN202010541588.7A
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Chinese (zh)
Inventor
徐乾坤
张晓星
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Application filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN202010541588.7A priority Critical patent/CN111710699A/en
Publication of CN111710699A publication Critical patent/CN111710699A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/38Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The application provides a display panel and a manufacturing method of the display panel, wherein the display panel comprises a substrate, a thin film transistor layer, a light-emitting layer and a cover plate layer, the light-emitting layer comprises a dam area and a pit area, and a light-emitting structure and a color filter layer arranged on the light-emitting structure are arranged in the pit area; the manufacturing method of the display panel comprises the step of manufacturing a color filter layer on the light-emitting structure in the pit area. This application is through directly setting up the color filter layer on the light emitting structure in the pit district, avoids appearing the not up to standard problem of color filter layer and light emitting structure counterpoint precision that exists among the prior art, has promoted display panel's quality.

Description

Display panel and manufacturing method thereof
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display panel and a method for manufacturing the display panel.
Background
Organic Light Emitting Diodes (OLEDs) are a new display technology, and compared with liquid crystal display technologies, the OLEDs have advantages of active light emission, real color, high contrast, low retardation, transparent display, flexible display, and the like, and have gradually become the mainstream of the display field. The OLED display device can be classified into a bottom emission type in which the light emitted from the OLED is emitted from the substrate side and a top emission type in which the light emitted from the OLED is emitted from the opposite side to the substrate side according to the emission pattern of light.
For a top emission type white OLED display device, a color filter layer needs to be disposed on an upper layer of a light emitting unit thereof to realize full color display of the display device. In the prior art, a method of manufacturing a color filter layer on a glass cover plate and then assembling the glass cover plate and an array substrate including light emitting units is adopted to complete the manufacture of a top emission type OLED display device. The OLED display device manufactured by the method is easy to have the problem that the alignment precision of the color filter layer and the light-emitting unit does not reach the standard, and the product yield is seriously influenced. In addition, the color filter layer manufactured on the glass cover plate comprises a plurality of filter units, and a black light shielding layer is required to be used for blocking among the filter units so as to prevent light rays passing through the filter units from influencing each other.
Disclosure of Invention
Based on the defects of the prior art, the application provides the display panel and the manufacturing method of the display panel, the color filter layer is directly manufactured on the upper layer of the light-emitting structure, the problem of the alignment precision of the color filter layer and the light-emitting structure is fundamentally solved, and meanwhile, the shading units are manufactured in the dam areas of the light-emitting layer, so that the structure and the manufacturing process of the display panel are simplified, and the manufacturing cost is reduced.
The application provides a display panel, including:
a substrate base plate;
the thin film transistor layer is arranged on the substrate and comprises a plurality of thin film transistors;
the light-emitting layer is arranged on the thin film transistor layer and is electrically connected with the thin film transistor layer, the light-emitting layer comprises a dam region and a pit region, a light-emitting structure and a color filter layer are arranged in the pit region, and the color filter layer is arranged on the light-emitting structure;
and the cover plate layer is arranged on the luminous layer.
According to an embodiment of the present application, the bank region is made of a black light-shielding material.
According to an embodiment of the present application, a black light-shielding layer is disposed on a top layer of the bank region.
According to an embodiment of the present application, the light emitting structure includes a first electrode, an organic functional layer disposed on the first electrode, and a second electrode disposed on the organic functional layer, and in the pit area, the first electrode, the organic functional layer, and the second electrode are in direct electrical contact.
According to an embodiment of the present application, the color filter layer includes color filter blocks of a plurality of colors, and one color filter block is disposed in each of the pit areas.
According to an embodiment of the application, each color filter block completely fills one of the pit areas, the color filter blocks protrude from the pit areas and extend to the periphery of the pit areas, and any two adjacent color filter blocks are not connected.
The application also provides a manufacturing method of the display panel, which comprises the following steps:
manufacturing a thin film transistor layer on a substrate;
manufacturing a light-emitting layer on the thin film transistor layer, wherein the light-emitting layer comprises a dam region and a pit region, and a light-emitting structure is arranged in the pit region;
manufacturing a color filter layer on the light-emitting structure in the pit area;
and installing a cover plate layer on the luminous layer.
According to an embodiment of the present application, a method of fabricating the light emitting layer includes the steps of:
manufacturing a first electrode on the thin film transistor layer;
manufacturing an original light shielding layer covering the thin film transistor layer and the first electrode by using a black light shielding material;
performing hole opening operation on the original shading layer, wherein the hole-opened area forms the pit area, the non-hole-opened area forms the dam area, and at least part of the first electrode is exposed through the pit area;
manufacturing an organic functional layer on the first electrode in the pit area;
and manufacturing a second electrode on the organic functional layer, wherein the second electrode at least covers the pit area, and the first electrode, the organic functional layer and the second electrode are directly and electrically contacted in the pit area to form the light-emitting structure.
According to an embodiment of the present application, a method of fabricating the light emitting layer includes the steps of:
manufacturing a first electrode on the thin film transistor layer;
manufacturing an original pixel layer covering the thin film transistor layer and the first electrode;
manufacturing an original light shielding layer on the original pixel layer by using a black light shielding material;
opening holes in the original pixel layer and the original shading layer together, wherein the hole areas form the pit areas, the non-hole areas form the dam areas, and at least part of the first electrodes are exposed through the pit areas;
manufacturing an organic functional layer on the first electrode in the pit area;
and manufacturing a second electrode on the organic functional layer, wherein the second electrode at least covers the pit area, and the first electrode, the organic functional layer and the second electrode are directly and electrically contacted in the pit area to form the light-emitting structure.
According to an embodiment of the present application, a method of fabricating the color filter layer includes:
and manufacturing a color filter block on the light-emitting structure in each pit area by adopting an ink-jet printing process, wherein all the color filter blocks form the color filter layer together.
The beneficial effect of this application is: according to the display panel and the manufacturing method of the display panel, the color filter layer is directly arranged on the light-emitting structure in the pit area, so that the problem that the alignment accuracy of the color filter layer and the light-emitting structure in the prior art does not reach the standard is solved, and the quality of the display panel is improved; in addition, the dam region is set to have a light shielding function or a light shielding layer is arranged on the top layer of the dam region, so that a light shielding layer structure arranged on a glass cover plate in the prior art is omitted, the structure of the display panel is simplified, and the production efficiency is improved.
Drawings
In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the application, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic plan view of a display panel provided in an embodiment of the present application;
FIG. 2 is a schematic cross-sectional view of an area B along A-A' in one embodiment of the display panel shown in FIG. 1;
FIG. 3 is a schematic cross-sectional view of an area B along A-A' in another embodiment of the display panel shown in FIG. 1;
FIG. 4 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a display panel manufacturing method according to an embodiment of the present disclosure after a planarization layer is manufactured;
fig. 6 is a schematic diagram illustrating a first light emitting layer structure after the first light emitting layer structure is manufactured in the display panel manufacturing method according to the embodiment of the present disclosure;
fig. 7 is a schematic diagram illustrating a second light emitting layer structure after the second light emitting layer structure is manufactured in the display panel manufacturing method according to the embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of a display panel finally manufactured by the display panel manufacturing method according to the embodiment of the present application.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings, which are included to illustrate specific embodiments that can be implemented by the application. Directional phrases used in this application, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], etc., refer only to the directions of the attached drawings. Accordingly, the directional terminology is used for purposes of illustration and understanding, and is in no way limiting. In the drawings, elements having similar structures are denoted by the same reference numerals.
The embodiment of the application provides a display panel, wherein a light emitting layer of the display panel comprises a dam region and a pit region, wherein a light emitting structure is arranged in the pit region, and a color filter layer is directly arranged on the light emitting structure in the pit region, so that the problem that the alignment precision of the color filter layer and the light emitting structure in the prior art is not up to standard is solved, and the quality of the display panel is improved; in addition, the dam region is set to have a light shielding function or a light shielding layer is arranged in the dam region, so that a light shielding layer structure arranged on a glass cover plate in the prior art is omitted, the structure of the display panel is simplified, and the production efficiency is improved.
As shown in fig. 1 and fig. 2, fig. 1 is a schematic plan structure diagram of a display panel provided in an embodiment of the present application, and fig. 2 is a schematic cross-sectional structure diagram of a region B along a-a' of one implementation manner in the display panel shown in fig. 1. The display panel 10 provided in the embodiment of the present application at least includes a display area AA, where the display area AA is an area of the display panel 10 where a display screen is displayed and is also a light emitting surface of the display panel 10. At least one side edge of the display area AA may further be provided with a non-display area NA, the non-display area NA does not display a picture, and other functional components, circuits, and control components of the display panel 10, such as a camera, a microphone, and a driving circuit board, may be disposed in the non-display area NA. It should be noted that a plurality of display units are arranged in the display area AA, a corresponding light emitting structure and a corresponding light adjusting structure are arranged in each display unit, and the plurality of display units jointly complete image display under the regulation and control of a plurality of control signals.
The display panel 10 has a layered structure at least in the display area AA, and the layered structure of the display panel 10 includes a substrate 11, a thin-film transistor layer 12 disposed on the substrate 11, a light-emitting layer 13 disposed on the thin-film transistor layer 12, and a cover plate layer 14 disposed on the light-emitting layer 13. The substrate 11 and the thin-film transistor layer 12, the thin-film transistor layer 12 and the light-emitting layer 13, and the light-emitting layer 13 and the cover plate layer 14 may be directly in contact with each other, or may be indirectly stacked via other intermediate structural layers.
Alternatively, the substrate 11 may be a hard substrate such as a glass substrate, or may be a flexible substrate such as a polyimide substrate. It should be understood that when the substrate 11 is a flexible substrate such as polyimide, the display panel 10 has a characteristic of flexible display.
Optionally, a buffer layer may be further disposed between the substrate 11 and the thin-film transistor layer 12, and the buffer layer may be made of a flexible organic material such as polyimide. The buffer layer is used to alleviate or eliminate the difference in expansion and contraction performance between the substrate base plate 11 and the thin-film transistor layer 12.
The thin film transistor layer 12 includes a plurality of thin film transistors 121 arranged in an array, and a data line array and a scan line array electrically connected to the thin film transistors 121. The data lines in the data line array are used for providing data signals to the display panel 10 through the thin film transistors 121 so as to control the display function of each display unit in the display panel 10; the scan lines in the scan line array are used to provide scan signals to the thin film transistor 121 to control the on or off state of the thin film transistor 121. It should be noted that the display panel 10 includes a plurality of display units, each of which includes at least one corresponding thin film transistor 121, and performs a display operation under the action of signals provided by the data lines and the scan lines.
Optionally, a flat layer 15 is further disposed between the thin-film transistor layer 12 and the light-emitting layer 13, where the flat layer 15 may be made of an organic material or an inorganic material, and is used to form a flat surface on the thin-film transistor layer 12, so as to facilitate the disposition of the light-emitting layer 13.
The light-emitting layer 13 is electrically connected to the thin film transistor 121 through the via holes on the planarization layer 15 and the thin film transistor layer 12. The light emitting layer 13 is a light emitting display unit in the display panel 10, a light emitting structure 133 for emitting light is disposed in the light emitting layer 13, and optionally, the light emitting structure 133 may be an organic light emitting diode light emitting device. The embodiment of the application provides two display panels with different light emitting layer structures, which are as follows:
according to an embodiment of the present disclosure, referring to fig. 1 and 2, the light emitting layer 13 includes bank regions 131 and pit regions 132, and the bank regions 131 and the pit regions 132 are alternately disposed on the planarization layer 15. The light emitting structures 133 are disposed in the pit regions 132, and two adjacent light emitting structures 133 are separated by the bank region 131.
Optionally, the light emitting structure 133 includes a first electrode 1331 disposed on the planarization layer 15, an organic functional layer 1332 disposed on the first electrode 1331, and a second electrode 1333 disposed on the organic functional layer 1332. In the pit regions 132, the first electrode 1331, the organic functional layer 1332 and the second electrode 1333 are in direct electrical contact with each other, so that the light emitting structure 133 is formed. Note that the first electrode 1331 and the second electrode 1333 are at least disposed in the pit region 132, in some embodiments, the first electrode 1331 may extend into the bank region 131, the second electrode 1333 may cover the bank region 131 and the pit region 133, and the light emitting structure 133 may be formed only at a position where the first electrode 1331, the organic functional layer 1332 and the second electrode 1333 are in direct contact.
Alternatively, the first electrode 1331 is an anode, the second electrode 1333 is a cathode, and the organic functional layer 1332 includes a hole injection layer, a hole transport layer, an electron-hole bonding layer, an electron transport layer, and an electron injection layer, which are sequentially disposed, and holes provided by the first electrode 1331 and electrons provided by the second electrode 1333 are combined in the electron-hole bonding layer to emit light, so that the light emitting function of the light emitting structure 133 is realized.
In the pit area 132, a color filter layer 134 is disposed on an upper layer of the light emitting structure 133. The color filter layer 134 may be directly disposed on the light emitting structure 133, or may be disposed on the light emitting structure 133 through another intermediate layer structure. It should be understood that, by directly disposing the color filter layer 134 in the pit area 132, the present application can ensure accurate alignment between the color filter layer 134 and the light emitting structure 133, and avoid display defects caused by alignment deviation therebetween.
Optionally, the color filter layer 134 includes color filter blocks of multiple colors, one color filter block is disposed in each of the pit areas 132, light emitted by the light emitting structure 133 passes through the color filter block and then is converted into monochromatic light of corresponding color, and the multiple monochromatic light is combined to form a color picture, thereby realizing color display of the display panel.
Further, each of the color filter blocks completely fills one of the pit areas 132, the color filter block protrudes out of the pit area 132 and extends around the pit area 132, and any two adjacent color filter blocks are not connected. It should be understood that, by extending the color filter block to the periphery of the pit area 132, the light emitted from the light emitting structure 133 through the pit area 132 is completely converted into monochromatic light by the color filter block, which is beneficial to improving the display contrast of the display panel.
Further, the color filter layer 134 includes a plurality of red filter blocks, a plurality of green filter blocks, and a plurality of blue filter blocks, and the red filter blocks, the green filter blocks, and the blue filter blocks are sequentially and alternately arranged in the pit area. One red filter block, one green filter block and one blue filter block which are adjacent to each other form a display group, and the formed display groups are distributed on the display panel 10 in an array manner.
Further, the bank 131 is made of a black light-shielding material, so that the bank 131 itself has a light-shielding effect. Light rays emitted by two adjacent light emitting structures 133 are separated by the bank region 131 without mutual interference, and the bank region 131 plays a role of a black light shielding layer in the prior art, so that the black light shielding layer does not need to be arranged on the cover plate layer in the embodiment, and the display panel structure is simplified.
According to another embodiment of the present application, refer to fig. 1 and fig. 3, wherein fig. 3 is a schematic cross-sectional structure of a region B along a-a' in another implementation of the display panel shown in fig. 1. The display panel embodiment shown in fig. 3 is different from the display panel embodiment shown in fig. 2 only in the structure of the light-emitting layer 13. In this embodiment, the light emitting layer 13 includes bank regions 131 and pit regions 132, and the bank regions 131 and the pit regions 132 are alternately arranged on the planarization layer 15. The light emitting structures 133 are disposed in the pit regions 132, and two adjacent light emitting structures 133 are separated by the bank region 131.
Optionally, the light emitting structure 133 includes a first electrode 1331 disposed on the planarization layer 15, an organic functional layer 1332 disposed on the first electrode 1331, and a second electrode 1333 disposed on the organic functional layer 1332. In the pit regions 132, the first electrode 1331, the organic functional layer 1332 and the second electrode 1333 are in direct electrical contact with each other, so that the light emitting structure 133 is formed. Note that the first electrode 1331 and the second electrode 1333 are at least disposed in the pit region 132, in some embodiments, the first electrode 1331 may extend into the bank region 131, the second electrode 1333 may cover the bank region 131 and the pit region 133, and the light emitting structure 133 may be formed only at a position where the first electrode 1331, the organic functional layer 1332 and the second electrode 1333 are in direct contact.
Alternatively, the first electrode 1331 is an anode, the second electrode 1333 is a cathode, and the organic functional layer 1332 includes a hole injection layer, a hole transport layer, an electron-hole bonding layer, an electron transport layer, and an electron injection layer, which are sequentially disposed, and holes provided by the first electrode 1331 and electrons provided by the second electrode 1333 are combined in the electron-hole bonding layer to emit light, so that the light emitting function of the light emitting structure 133 is realized.
In the pit area 132, a color filter layer 134 is disposed on an upper layer of the light emitting structure 133. The color filter layer 134 may be directly disposed on the light emitting structure 133, or may be disposed on the light emitting structure 133 through another intermediate layer structure. It should be understood that, by directly disposing the color filter layer 134 in the pit area 132, the present application can ensure accurate alignment between the color filter layer 134 and the light emitting structure 133, and avoid display defects caused by alignment deviation therebetween.
Optionally, the color filter layer 134 includes color filter blocks of multiple colors, one color filter block is disposed in each of the pit areas 132, light emitted by the light emitting structure 133 passes through the color filter block and then is converted into monochromatic light of corresponding color, and the multiple monochromatic light is combined to form a color picture, thereby realizing color display of the display panel.
Further, each of the color filter blocks completely fills one of the pit areas 132, the color filter block protrudes out of the pit area 132 and extends around the pit area 132, and any two adjacent color filter blocks are not connected. It should be understood that, by extending the color filter block to the periphery of the pit area 132, the light emitted from the light emitting structure 133 through the pit area 132 is completely converted into monochromatic light by the color filter block, which is beneficial to improving the display contrast of the display panel.
Further, the color filter layer 134 includes a plurality of red filter blocks, a plurality of green filter blocks, and a plurality of blue filter blocks, and the red filter blocks, the green filter blocks, and the blue filter blocks are sequentially and alternately arranged in the pit area. One red filter block, one green filter block and one blue filter block which are adjacent to each other form a display group, and the formed display groups are distributed on the display panel 10 in an array manner.
Further, the bank 131 is made of a conventional material, a black light-shielding layer 1311 is disposed on a top layer of the bank 131, and the black light-shielding layer 1311 is used to prevent light rays emitted by two adjacent light-emitting structures 133 from interfering with each other. It should be noted that the black light-shielding layer 1311 disposed on the top layer of the bank 131 plays a role of a black light-shielding layer disposed on a glass cover plate in the prior art, so that in this embodiment, the black light-shielding layer does not need to be disposed on the cover plate layer, the alignment problem of the black light-shielding layer is avoided, and the production yield is improved.
Further, the display panel 10 further includes a cover plate layer 14 disposed on the light emitting layer 13, in some embodiments, an intermediate layer 16 may also be present between the cover plate layer 14 and the light emitting layer 13, and the intermediate layer 16 may be a thin film encapsulation layer disposed on the light emitting layer 13, or may be a vacuum layer. The cover sheet layer 14 may be a glass cover sheet.
In summary, the light emitting layer of the display panel provided by the embodiment of the present application includes the bank area and the pit area, the light emitting structure is disposed in the pit area, and the color filter layer is directly disposed on the light emitting structure in the pit area, so that a problem that alignment accuracy of the color filter layer and the light emitting structure is not up to standard in the prior art is avoided, and quality of the display panel is improved; in addition, the dam region is set to have a light shielding function or a light shielding layer is arranged on the top layer of the dam region, so that a light shielding layer structure arranged on a glass cover plate in the prior art is omitted, the structure of the display panel is simplified, and the production efficiency is improved.
An embodiment of the present application further provides a manufacturing method of a display panel, as shown in fig. 4, the manufacturing method includes the following steps:
in step S101, referring to fig. 5, a thin-film transistor layer 12 is fabricated on a substrate 11.
Specifically, the thin film transistor layer 12 includes a plurality of thin film transistors 121 arranged in an array, and a data line array and a scan line array electrically connected to the thin film transistors 121.
Step S101 further includes an operation of fabricating a flat layer 15 on the thin-film transistor layer 12, where the flat layer 15 is used to form a flat surface on the thin-film transistor layer 12, so as to facilitate fabrication of a subsequent structure.
Step S102, referring to fig. 6 and 7, manufacturing a light-emitting layer 13 on the thin-film transistor layer 12, where the light-emitting layer 13 includes a bank region 131 and a pit region 132, and a light-emitting structure 133 is disposed in the pit region 132.
Optionally, the light emitting layer 13 is formed on the planarization layer 15.
Depending on the structural difference of the light emitting layer 13 to be manufactured, the step S102 may have the following two embodiments:
the first embodiment: as shown in fig. 6, a first electrode 1331 is formed on the planarization layer 15, and the first electrode 1331 is electrically connected to the thin film transistor 121 through the planarization layer 15 and the via hole on the thin film transistor layer 12; making an original light shielding layer covering the planarization layer 15 and the first electrode 1331 using a black light shielding material; performing a hole opening operation on the original light-shielding layer, wherein a hole-opened region forms the pit region 132, an un-opened region forms the bank region 131, and at least a part of the first electrode 1331 is exposed through the pit region; forming an organic functional layer 1332 on the first electrode 1331 in the pit region 132; a second electrode 1333 is formed on the organic functional layer 1332, the second electrode 1333 at least covers the pit region 132, and the first electrode 1331, the organic functional layer 1332 and the second electrode 1333 are in direct electrical contact in the pit region 132 to form the light emitting structure 133.
The second embodiment: as shown in fig. 7, a first electrode 1331 is formed on the planarization layer 15, and the first electrode 1331 is electrically connected to the thin film transistor 121 through the planarization layer 15 and the via hole on the thin film transistor layer 12; making an original pixel layer covering the planarization layer 15 and the first electrode 1331; manufacturing an original light shielding layer on the original pixel layer by using a black light shielding material; opening the original pixel layer and the original light-shielding layer together, wherein an opened region forms the pit region 132, an unopened region forms the bank region 131, and at least a part of the first electrode 1331 is exposed through the pit region 132; forming an organic functional layer 1332 on the first electrode 1331 in the pit region 132; a second electrode 1333 is formed on the organic functional layer 1332, the second electrode 1333 at least covers the pit region 132, and the first electrode 1331, the organic functional layer 1332 and the second electrode 1333 are in direct electrical contact in the pit region 132 to form the light emitting structure 133.
In step S103, referring to fig. 6 or fig. 7, a color filter layer 134 is formed on the light emitting structure 133 in the pit area 132.
Specifically, the method for manufacturing the color filter layer 134 is as follows: a color filter block is fabricated on the light emitting structure 133 in each of the pit areas 132 by an inkjet printing process, and all the color filter blocks together form the color filter layer 134. Optionally, the color filter layer 134 includes a plurality of red filter blocks, a plurality of green filter blocks, and a plurality of blue filter blocks, and the red filter blocks, the green filter blocks, and the blue filter blocks are sequentially and alternately arranged in the pit area 132.
Step S104, as shown in fig. 8, mounts the cover sheet layer 14 on the luminescent layer 13.
Specifically, an intermediate layer 16 may also be present between the cover plate layer 14 and the light-emitting layer 13, and the intermediate layer 16 may be a thin film encapsulation layer disposed on the light-emitting layer 13 or a vacuum layer. The cover sheet layer 14 may be a glass cover sheet.
In summary, the display panel manufacturing method provided by the embodiment of the application directly manufactures the color filter layer on the light emitting structure in the pit area, thereby avoiding the problem that the alignment accuracy of the color filter layer and the light emitting structure is not up to the standard in the prior art, and improving the quality of the display panel; in addition, when the dam area is manufactured, the dam area is set to have a light shielding function or a light shielding layer is arranged on the top layer of the dam area, so that a light shielding layer structure arranged on a glass cover plate in the prior art is omitted, the manufacturing process of the display panel is simplified, and the production efficiency is improved.
It should be noted that, although the present application has been described with reference to specific examples, the above-mentioned examples are not intended to limit the present application, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, so that the scope of the present application shall be limited by the appended claims.

Claims (10)

1. A display panel, comprising:
a substrate base plate;
the thin film transistor layer is arranged on the substrate and comprises a plurality of thin film transistors;
the light-emitting layer is arranged on the thin film transistor layer and is electrically connected with the thin film transistor layer, the light-emitting layer comprises a dam region and a pit region, a light-emitting structure and a color filter layer are arranged in the pit region, and the color filter layer is arranged on the light-emitting structure;
and the cover plate layer is arranged on the luminous layer.
2. The display panel according to claim 1, wherein the bank regions are made of a black light-shielding material.
3. The display panel according to claim 1, wherein a top layer of the bank region is provided with a black light-shielding layer.
4. The display panel according to claim 1, wherein the light emitting structure comprises a first electrode, an organic functional layer disposed on the first electrode, and a second electrode disposed on the organic functional layer, and wherein the first electrode, the organic functional layer, and the second electrode are in direct electrical contact with each other in the pit area.
5. The display panel of claim 1, wherein the color filter layer comprises a plurality of color filter blocks, and one color filter block is disposed in each of the recessed areas.
6. The display panel of claim 5, wherein each of the color filter blocks completely fills one of the pit areas, the color filter blocks protrude from the pit areas to extend around the pit areas, and any two adjacent color filter blocks are not connected.
7. A manufacturing method of a display panel is characterized by comprising the following steps:
manufacturing a thin film transistor layer on a substrate;
manufacturing a light-emitting layer on the thin film transistor layer, wherein the light-emitting layer comprises a dam region and a pit region, and a light-emitting structure is arranged in the pit region;
manufacturing a color filter layer on the light-emitting structure in the pit area;
and installing a cover plate layer on the luminous layer.
8. The method for manufacturing a display panel according to claim 7, wherein the method for manufacturing the light-emitting layer comprises the steps of:
manufacturing a first electrode on the thin film transistor layer;
manufacturing an original light shielding layer covering the thin film transistor layer and the first electrode by using a black light shielding material;
performing hole opening operation on the original shading layer, wherein the hole-opened area forms the pit area, the non-hole-opened area forms the dam area, and at least part of the first electrode is exposed through the pit area;
manufacturing an organic functional layer on the first electrode in the pit area;
and manufacturing a second electrode on the organic functional layer, wherein the second electrode at least covers the pit area, and the first electrode, the organic functional layer and the second electrode are directly and electrically contacted in the pit area to form the light-emitting structure.
9. The method for manufacturing a display panel according to claim 7, wherein the method for manufacturing the light-emitting layer comprises the steps of:
manufacturing a first electrode on the thin film transistor layer;
manufacturing an original pixel layer covering the thin film transistor layer and the first electrode;
manufacturing an original light shielding layer on the original pixel layer by using a black light shielding material;
opening holes in the original pixel layer and the original shading layer together, wherein the hole areas form the pit areas, the non-hole areas form the dam areas, and at least part of the first electrodes are exposed through the pit areas;
manufacturing an organic functional layer on the first electrode in the pit area;
and manufacturing a second electrode on the organic functional layer, wherein the second electrode at least covers the pit area, and the first electrode, the organic functional layer and the second electrode are directly and electrically contacted in the pit area to form the light-emitting structure.
10. The method for manufacturing a display panel according to claim 7, wherein the method for manufacturing the color filter layer comprises:
and manufacturing a color filter block on the light-emitting structure in each pit area by adopting an ink-jet printing process, wherein all the color filter blocks form the color filter layer together.
CN202010541588.7A 2020-06-15 2020-06-15 Display panel and manufacturing method thereof Pending CN111710699A (en)

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